Surface-mounted component AB board mode surface changing process

Abstract

The invention discloses a surface-mounted component AB board mode surface changing process, and relates to the technical field of MLCC chip capacitor production, and the surface-mounted component AB board mode surface changing process comprises the steps: 1, preparing an A-specification JIG board and a B-specification JIG board; step 2, implanting the MLCC chip capacitor which is not immersed in the slurry into a board hole of the A-specification JIG board in a vibration mode; 3, carrying out first surface end dipping operation by using an A-specification JIG board with an MLCC chip capacitor to form a first surface end; 4, the end of the first face is dried; 5, when the second face end head dipping operation is carried out, the B specification JIG plate and the A specification JIG plate are aligned and coincide through the positioning pins; 6, tearing off the adhesive tape pasted on the JIG board of the specification A, and enabling the MLCC chip capacitor to fall into the board hole of the JIG board of the specification B; and step 7, carrying out second surface end dipping operation by using a JIG plate with the specification B with the MLCC chip capacitor, thereby solving the problem that the processed first surface end is easily scratched by the edge of the plate hole of the JIG bearing plate when the second surface end of the MLCC chip capacitor is processed, so that the product quality problem is caused.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of MLCC chip capacitor production, in particular to a patch component AB plate mode face changing process. BACKGROUND

[0002] In the production process of the MLCC chip capacitor, the two ends of the product need to be immersed in the paste to cover the end face by capillary action, and after baking, the two end heads are formed so as to be subsequently welded to the circuit board.

[0003] Please refer to Fig. 5-Fig. 9 At present, the manufacturing method of the two ends of the MLCC chip capacitor is as follows: a JIG bearing plate is used to paste a tape, and the MLCC chip capacitor not immersed in the paste is implanted into the plate hole of the JIG bearing plate by vibration, and the MLCC chip capacitor contacts the tape to be fixed. Subsequently, the JIG bearing plate with the MLCC chip capacitor is subjected to one end head immersion operation to form the first end head. After drying the first end head, a layer of tape is pasted on the first end head which has been processed, and the original tape is torn off, so that the other end head which has not been processed is exposed, and then the second end head immersion operation is performed.

[0004] However, in the existing production process, when the MLCC chip capacitor is processed for the second end head, after the original tape is torn off, when the product passes through the plate hole of the JIG bearing plate, there is a certain probability that the first end head which has been processed will scratch the edge of the plate hole of the JIG bearing plate, causing the first end head which has been processed to be scratched, and causing quality problems, thus not meeting the existing requirements. Therefore, we propose a patch component AB plate mode face changing process. SUMMARY

[0005] The purpose of the present application is to provide a patch component AB plate mode face changing process to solve the problem that the first end head which has been processed is easily scratched by the edge of the plate hole of the JIG bearing plate when the MLCC chip capacitor is processed for the second end head, resulting in product quality problems.

[0006] To achieve the above purpose, the present application provides the following technical scheme: a patch component AB plate mode face changing process, comprising the following steps: step one, preparing an A-specification JIG plate and a B-specification JIG plate, wherein the A-specification JIG plate is pasted with a tape, and the plate hole diameter is 0.1-0.2mm larger than the diagonal of the MLCC chip capacitor; the B-specification JIG plate is pasted with a tape, and the plate hole diameter is 0.2-0.3mm larger than the diagonal of the MLCC chip capacitor which has been processed and has an end head; Step two, implanting the MLCC chip capacitor not immersed in the paste into the plate hole of the A-specification JIG plate by vibration, and the MLCC chip capacitor contacts the tape on the A-specification JIG plate to be fixed; Step three, using A specification JIG plate with MLCC chip capacitor for the first face end dipping operation, forming the first face end; Step four, the first face end drying treatment; Step five, the second face end dipping operation, through the positioning pin with A specification JIG plate and B specification JIG plate alignment coincidence; Step six, tear off the tape on the A specification JIG plate, make MLCC chip capacitor fall into the B specification JIG plate hole; Step seven, using B specification JIG plate with MLCC chip capacitor for the second face end dipping operation.

[0007] Preferably, in step one, the tape is single-sided adhesive tape, used for fixing MLCC chip capacitor.

[0008] Preferably, in step two, the vibration frequency is set at 50-150Hz, the amplitude is controlled at 0.5-2mm, used for MLCC chip capacitor implanting A specification JIG plate hole.

[0009] Preferably, in step three, the slurry concentration of dipping operation is 30%-50%, the dipping time is 1-3s.

[0010] Preferably, in step four, the drying temperature is 120℃-180℃, the drying time is 10-20 minutes.

[0011] Preferably, in step five, the number of positioning pins is at least two.

[0012] Preferably, in step seven, the parameters of the second face end dipping operation are the same as the parameters of the first face end dipping operation.

[0013] Preferably, before step two, it also includes the steps of cleaning and checking A specification JIG plate and B specification JIG plate, ensuring that the hole is not blocked by impurities and the tape is firmly pasted.

[0014] Preferably, the material of A specification JIG plate and B specification JIG plate is corrosion-resistant, high-temperature-resistant engineering plastic.

[0015] Compared with the prior art, the beneficial effects of the present application are: 1、The present application can effectively avoid end scratching, improve product quality, in the existing process, in the process of changing the surface, the product passes through the JIG bearing plate hole, the first end of the processed surface is easy to scratch the edge of the plate hole, resulting in scratching. And the present application adopts AB plate surface changing process, the hole diameter of the B specification JIG plate is larger than the product with processed end, when the MLCC chip capacitor falls from the A specification JIG plate to the plate hole of the B specification JIG plate, the larger plate hole can provide sufficient space for the processed first end, avoid contact and scratch with the edge of the plate hole, thereby effectively preventing the scratching problem of the processed end, ensuring the appearance and performance of the product, improving the quality stability of the product.

[0016] 2、The present application improves the production qualified rate and reduces the production cost: because the processed end is avoided to be scratched, the number of product scrap caused by quality problems is reduced, the product qualified rate in the production process is significantly improved. This not only directly reduces the waste of raw materials and reduces the production cost, but also reduces the additional labor, material and time cost caused by rework, repair and other problems, and improves the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 is the schematic diagram of the drying process state of the present application; Fig. 2 is the schematic diagram of the AB plate coincidence surface changing state of the present application; Fig. 3 is the schematic diagram of the AB plate coincidence surface changing state of the present application; Fig. 4 is the schematic diagram of the MLCC chip capacitor surface changing completion structure of the present application; Fig. 5 is the schematic diagram of the existing technology before feeding; Fig. 6 is the schematic diagram of the existing technology single side dipping; Fig. 7 is the schematic diagram of the drying process state of the existing technology; Fig. 8 is the schematic diagram of the surface changing process of the existing technology; Fig. 9 is the schematic diagram of the surface changing process of the existing technology. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0019] Please refer to Fig. 1-Fig. 4The application provides a patch component AB plate mode face changing process, which comprises the following steps: step one, preparing an A-specification JIG plate and a B-specification JIG plate. The hole diameter of the A-specification JIG plate is 0.1-0.2 mm larger than the diagonal of an MLCC chip capacitor, and a single-sided adhesive tape is pasted on one side surface of the A-specification JIG plate, which can stably fix the MLCC chip capacitor and be easily torn off without damaging the product in the subsequent steps. The hole diameter of the B-specification JIG plate is 0.2-0.3 mm larger than the diagonal of the MLCC chip capacitor with a processed end, and the same single-sided adhesive tape as that of the A-specification JIG plate is pasted on one side surface of the B-specification JIG plate.

[0020] Meanwhile, the A-specification JIG plate and the B-specification JIG plate are cleaned and inspected, the plate surface and the plate hole are wiped with a dust-free cloth dipped in anhydrous ethanol, and it is ensured that the plate hole is not blocked by impurities, the tape is firmly pasted, free of bubbles and wrinkles, so as to ensure the smooth progress of the subsequent process. The A-specification JIG plate and the B-specification JIG plate are made of corrosion-resistant and high-temperature-resistant engineering plastic materials, which can resist the corrosion of the slurry in the slurry immersion process and the high-temperature environment in the drying process, and prolong the service life of the JIG plate. Step two, implanting the MLCC chip capacitor: the MLCC chip capacitor not immersed in the slurry is placed in the hopper of a vibrating device, the A-specification JIG plate is placed on the workbench of the vibrating device, the vibration frequency of the vibrating device is adjusted to 50-150 Hz, the amplitude is controlled to be 0.5-2 mm, the vibrating device is started, and the MLCC chip capacitor gradually enters the plate hole of the A-specification JIG plate under the action of vibration. Since the hole diameter of the plate hole matches the size of the MLCC chip capacitor, and the tape is adhesive, the MLCC chip capacitor is stably fixed in the plate hole after contacting the tape, it is ensured that one MLCC chip capacitor is implanted in each plate hole, and the posture of the capacitor is correct without tilting or inversion. Step three, first face end immersion: the end slurry with a slurry concentration of 30%-50% is configured, the A-specification JIG plate with the implanted MLCC chip capacitor is placed in the slurry tank with the tape on one side downward and the unprocessed end on the other side upward, one end of the MLCC chip capacitor is immersed in the slurry, and the immersion time is controlled to be 1-3 s. In this process, the slurry covers the end face of the MLCC chip capacitor through capillary action, and then the A-specification JIG plate is taken out of the slurry tank and left for a moment to make the excess slurry drip off. Step four, first face end drying: the A-specification JIG plate with the completed first face end immersion is placed in an oven, the temperature of the oven is set to be 120℃-180℃, and the drying time is 10-20 minutes. In the drying process, the ventilation in the oven is kept good to make the solvent in the slurry fully volatilize, so as to ensure that the first face end is solidified and formed into a firm end structure. After the drying is completed, the A-specification JIG plate is taken out of the oven and naturally cooled to room temperature. Step five, AB plate alignment: prepare at least two positioning pins, the diameter of the positioning pins matches the size of the positioning holes on the A-specification JIG plate and the B-specification JIG plate. At this time, the adhesive tape is placed with one side upward, the A-specification JIG plate is placed on the workbench, the positioning pins are inserted into the positioning holes of the A-specification JIG plate, and then the positioning holes of the B-specification JIG plate are aligned with the positioning pins. At this time, the adhesive tape is placed with one side downward, the B-specification JIG plate is slowly placed down, and the A-specification JIG plate and the B-specification JIG plate are aligned by the positioning pins. It is ensured that the plate holes of the two plates are one-to-one corresponding without misalignment. Step six, surface changing operation: hold one end of the adhesive tape, slowly tear off the adhesive tape above the A-specification JIG plate, and the MLCC chip capacitor falls from the plate hole of the A-specification JIG plate under the action of gravity. Since the A and B plates have been accurately aligned, the MLCC chip capacitor falls into the corresponding plate hole of the B-specification JIG plate and is fixed by the adhesive tape on the B-specification JIG plate. Because the plate hole diameter of the B-specification JIG plate is larger, the first surface end of the MLCC chip capacitor does not scratch the edge of the plate hole during the falling process, effectively protecting the first surface end. Step seven, second surface end dipping: remove the positioning pins, at this time, the adhesive tape is placed with one side downward, and the unprocessed end is placed with one side upward. The B-specification JIG plate is placed into the same slurry tank as the first surface end dipping. The second surface end dipping is performed according to the parameters of the first surface end dipping. After dipping, the B-specification JIG plate is taken out of the slurry tank, left for a while to allow excess slurry to drip, and then placed into an oven for drying treatment according to the same drying parameters as the first surface end to form the second surface end.

[0021] The following table is a comparison test data table of the existing technology processing end and the processing end of the present application: Test index Prior art The present application Difference explanation Test sample quantity 5000 pieces 5000 pieces The same number of MLCC chip capacitors is selected to ensure consistent test base and reduce the influence of sample quantity difference on the result Product qualification rate 82.3% 98.7% The qualification rate of the present application is increased by 16.4 percentage points, mainly due to the reduction of quality problems such as end scratching End scratching rate 15.6% 0.8% The scratching rate of the present application is reduced by 14.8 percentage points, reflecting the protection effect of the AB plate surface changing process on the processed end End thickness uniformity (qualified proportion) 79.5% 97.2% The uniformity of the present application is increased by 17.7 percentage points, because the surface changing process is stable and the influence of end deformation is reduced End adhesion (qualified proportion) 81.2% 96.5% The qualified proportion of the adhesion of the present application is increased by 15.3 percentage points, because the process is stable and secondary damage to the end is avoided It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the present application should be defined by the appended claims rather than the above description, and it is intended to encompass all changes falling within the meaning and scope of equivalents of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A surface-changing process for patch components in an AB-type manner, characterized by: The following steps are involved: Step 1: Prepare A-size JIG boards and B-size JIG boards. The A-size JIG board is affixed with tape, and its hole diameter is 0.1-0.2mm larger than the diagonal diameter of the MLCC chip capacitor; the B-size JIG board is affixed with tape, and its hole diameter is 0.2-0.3mm larger than the diagonal diameter of the processed MLCC chip capacitor with terminals. Step 2: Implant the MLCC chip capacitors that are not immersed in the slurry into the holes of the A-size JIG board by vibration. The MLCC chip capacitors are fixed by contacting the tape on the A-size JIG board. Step 3: Use A-specification JIG board and MLCC chip capacitors to perform the first-side terminal slurry dipping operation to form the first-side terminal; Step 4: Drying the first end; Step 5: When performing the second side end slurry dipping operation, align the B specification JIG plate with the A specification JIG plate through the positioning pins; Step 6. Tear off the tape on the A-size JIG board and drop the MLCC chip capacitor into the hole of the B-size JIG board. Step 7: Use B-size JIG board with MLCC chip capacitors to perform the second-side end dipping operation.

2. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step 1, the adhesive tape is a single-sided adhesive tape used to fix MLCC chip capacitors.

3. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step 2, the vibration frequency of the vibration mode is set at 50-150 Hz, and the amplitude is controlled at 0.5-2 mm, which is used to implant the MLCC chip capacitor into the board hole of the A-specification JIG board.

4. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step three, the slurry concentration of the immersion operation is 30%-50%, and the immersion time is 1-3s.

5. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step 4, the drying temperature is 120° C.-180° C., and the drying time is 10-20 minutes.

6. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step five, the number of the positioning pins is at least two.

7. The AB board method surface replacement process for patch components according to claim 1, characterized in that: In step seven, the parameters of the second surface end dipping operation are the same as the parameters of the first surface end dipping operation.

8. The AB board method surface replacement process for patch components according to claim 1, characterized in that: Before step 2, the steps of cleaning and inspecting the A-specification JIG plate and the B-specification JIG plate are also included to ensure that the plate holes are not blocked by impurities and that the tape is firmly attached.

9. The AB board method surface replacement process for patch components according to claim 1, characterized in that: The material of the A-specification JIG plate and the B-specification JIG plate is corrosion-resistant and high-temperature-resistant engineering plastic.

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