High thermal conductivity stainless steel for chip carrier and method for manufacturing the same

By electroplating nickel and copper onto a stainless steel substrate and coating it with a high thermal conductivity coating, the problem of insufficient thermal conductivity and corrosion resistance of traditional copper alloy lead frames in high-performance chip environments has been solved, thus realizing a chip bracket material with high thermal conductivity and corrosion resistance.

CN120809584BActive Publication Date: 2026-01-16JIANGSU YONGJIN METAL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202511261822.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-05
Publication Date
2026-01-16
Estimated Expiration
2045-09-05

AI Technical Summary

Technical Problem

Traditional copper alloy lead frames are insufficient to meet the stable operation requirements of high-performance chips in high-temperature and strong electromagnetic interference environments, and existing stainless steel materials have insufficient thermal conductivity and corrosion resistance.

Method used

The stainless steel substrate is treated with electroplating nickel and electroplating copper to form a composite coating, and then coated with a high thermal conductivity coating. The coating is composed of polyepoxy epoxy resin, epoxy-modified carbon nanotubes and flake silver powder. Combined with specific process conditions, the thermal conductivity and corrosion resistance are improved.

Benefits of technology

It significantly improves the thermal conductivity and corrosion resistance of the chip substrate, ensuring stable operation in high temperature and strong electromagnetic interference environments. Furthermore, the compatibility and cross-linking density of the coating system enhance the flexibility and impact resistance of the coating.

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Abstract

The application discloses a high-thermal-conductivity stainless steel for a chip support and a preparation method thereof, and relates to the technical field of stainless steel plating. In the application, a nickel layer is first plated on the surface of a stainless steel base, then a copper layer is plated, and finally a high-thermal-conductivity coating is coated to obtain the high-thermal-conductivity stainless steel for the chip support; the nickel has high lattice matching with the stainless steel, the nickel layer has high bonding strength with the stainless steel base, the copper has a thermal conductivity much higher than that of the stainless steel, and the copper plating layer can significantly improve the thermal conductivity; the high-thermal-conductivity coating comprises a multi-epoxy-based epoxy resin, an epoxy-modified carbon nanotube, flaky silver powder, sodium stearate and a curing agent; the high-thermal-conductivity layer formed after the multi-epoxy-based epoxy resin is cured has high crosslinking density, good wear resistance and corrosion resistance, and many reaction sites, and can be quickly cured to improve the efficiency; the epoxy-modified carbon nanotube and the flaky silver powder have a synergistic effect to form a nearly comb-shaped dispersion, which is beneficial to heat dispersion and comprehensive improvement of the heat dissipation.
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