Chip packaging positioning jig

Abstract

The invention relates to the technical field of chip packaging and positioning, in particular to a chip packaging and positioning jig. A working groove is formed in one side wall of the positioning base; and a chip positioning mechanism is arranged in the working groove. The adjacent connecting magnetic columns are controlled to move towards the opposite sides, so that the elastic pieces are compressed, the elastic pieces are wavy, the width of the elastic pieces is increased in the compression process, and the elastic pieces extend out of the connecting grooves, so that the corresponding contact pieces can abut against the connecting points of the chip, the size of the outlet is reduced, and the chip is prevented from falling off; meanwhile, when the two groups of connecting magnetic columns move to the lower part of the detection cavity, a lifting magnetic plate is pushed through magnetism to drive a plurality of groups of detection probes to extend out of four groups of telescopic through grooves and abut against pins of the packaging substrate, so that functional detection when the chip is adhered to the packaging substrate is realized; the working stability of the positioning jig is improved, and meanwhile, the using effect of the positioning jig on chip packaging work is improved.

Description

[0001] The present application is a divisional application of the application with application number 2025104318435 and titled "Chip packaging positioning jig and using method thereof", which was filed on April 8, 2025. TECHNICAL FIELD

[0002] The application belongs to the technical field of chip packaging positioning, and particularly relates to a chip packaging positioning jig. BACKGROUND

[0003] Chip packaging is the basic level of integrated circuit packaging, which refers to the process of electrically connecting a single chip with a packaging substrate or a lead frame, physically protecting and forming external pins. During chip packaging, a positioning jig is usually used to position the chip and the packaging substrate.

[0004] In the prior art, a chip packaging positioning jig is disclosed in Chinese Patent No. CN114068378A, published on February 18, 2022. The jig includes a control base, a main machine table fixedly installed on the control base, a positioning table and a vertical plate fixedly installed on the main machine table, a positioning column fixedly installed on the positioning table, a positioning groove provided on the positioning table, a ventilation hole provided on the positioning groove, a through-hole hanging rope installed in the ventilation hole, an air inlet pipe fixedly connected to the control base, a main through pipe fixedly connected to the air inlet pipe, a shunt pipe connected to the main through pipe, and a positioning structure with segmented working function connected to the shunt pipe. The positioning structure is added around the positioning groove on the surface of the jig to position the chip placed in the positioning groove, ensuring the smooth progress of the chip packaging process. The chip packaging positioning method can standardize the operation process of the positioning jig, ensure the coordinated work of the positioning structure in the jig, and complete the stable packaging of the chip.

[0005] However, the positioning jig still has the following defects: The chip cannot be immediately detected for normal operation when it is pasted on the packaging substrate, and functional testing needs to be performed after chip packaging, thereby reducing the use effect of the positioning jig on chip packaging work. SUMMARY

[0006] To solve the above problems, the application provides a chip packaging positioning jig, which includes a positioning base, a work groove is formed in one side wall of the positioning base; a chip positioning mechanism is arranged in the work groove; a substrate positioning mechanism for calibrating and positioning a packaging substrate is arranged directly below the chip positioning mechanism. The chip positioning mechanism includes a plurality of auxiliary positioning assemblies. The auxiliary positioning assembly comprises a second mounting frame for calibrating the positioning chip; a plurality of connecting grooves are formed in the inner walls of the four sides of the second mounting frame; two groups of connecting magnetic columns are arranged in each of the connecting grooves; a group of elastic sheets are arranged between the corresponding two groups of connecting magnetic columns; the elastic sheets are of a wave shape, and a plurality of groups of connecting contact sheets capable of being connected with the chip are arranged on the side wall close to the second positioning plate at equal intervals; A plurality of groups of detection cavities are arranged in the second mounting frame; a group of lifting magnetic plates is slidably connected in the vertical direction in each of the detection cavities; a group of guide blocks is arranged on the top of each of the lifting magnetic plates; a plurality of groups of detection probes connected with the packaging substrate are arranged on the top of each of the guide blocks.

[0007] Further, the top of the working groove is of an open structure; the chip positioning mechanism and the substrate positioning mechanism are in transmission connection; a circulation motor is arranged on the side wall of the positioning base; the output end of the circulation motor is in transmission connection with the chip positioning mechanism; an installation through groove is formed in the side wall of the positioning base; an auxiliary blanking mechanism is movably penetrated in the installation through groove; two groups of limiting magnets are symmetrically arranged on the top of the two side edges of the installation through groove.

[0008] Further, a first working groove is formed in the side wall of the positioning base; a gas guide cavity is formed in the side wall of the installation through groove; a plurality of groups of first electric push rods are arranged on the side wall of the gas guide cavity away from the auxiliary blanking mechanism; a gas guide plate is in transmission connection with the output end of the plurality of groups of first electric push rods; a plurality of groups of limiting connection pipes are arranged on the side wall of the gas guide plate close to the auxiliary blanking mechanism at equal intervals; one end of each of the limiting connection pipes away from the gas guide plate is movably penetrated into the auxiliary blanking mechanism; a refrigeration device is arranged on the side wall of the gas guide cavity away from the auxiliary blanking mechanism.

[0009] Further, the chip positioning mechanism further comprises a rotating shaft; a plurality of groups of mounting blocks are arranged on the outer wall of the rotating shaft in a ring array; a plurality of groups of chip positioning grooves are formed in the side wall of each of the mounting blocks away from the rotating shaft at equal intervals; each of the auxiliary positioning assemblies is mounted in a corresponding group of chip positioning grooves; a group of telescopic suction cups is arranged in each of the chip positioning grooves.

[0010] Further, the substrate positioning mechanism comprises a rotating column; a plurality of groups of substrate positioning grooves are formed on the outer wall of the rotating column in a ring array; a group of first positioning plates capable of calibrating and positioning the packaging substrate is arranged on the inner wall of each of the substrate positioning grooves on the four sides; a group of adsorption holes is formed in the inner wall of each of the substrate positioning grooves close to the axis of the rotating column; an adsorption cavity is arranged in the rotating column; the adsorption cavity is in communication with the plurality of groups of adsorption holes; a closed magnetic plate is arranged in the adsorption cavity.

[0011] Furthermore, the auxiliary unloading mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; a cooling groove and a second working groove are respectively provided on the inner walls on both sides of the first mounting frame; the second working groove is connected to the first working groove.

[0012] Furthermore, a plurality of groups of air guide holes are provided at equal intervals on a side wall of the cooling tank away from the second working tank; each group of the limiting connecting tubes is movable through a corresponding group of air guide holes; a plurality of groups of second electric push rods are symmetrically provided on the inner walls on both sides of the first mounting frame; a group of guide plates are transmission-connected to the output ends of the plurality of groups of the second electric push rods on the same side; a plurality of groups of guide rollers are respectively provided at equal intervals on the side walls opposite to each other of the two groups of guide plates.

[0013] Furthermore, the second mounting frame is in the shape of a U-shaped character; a group of second positioning plates are respectively provided on the inner walls of the four sides of the bottom of the second mounting frame; a group of telescopic slots are respectively provided on the edges of the four sides of the top of the second mounting frame; each group of the detection cavities is connected to a corresponding group of telescopic slots.

[0014] Furthermore, several groups of reset springs are symmetrically provided on the top of each group of lifting magnetic plates; the top of each group of reset springs is connected to the top of a corresponding group of detection cavities; the top of each group of lifting magnetic plates is provided with a group of guide blocks; the top of each group of guide blocks is damped and slidingly connected with several groups of detection probes; each group of detection probes is electrically connected to a corresponding group of connecting contacts.

[0015] A method for using a chip packaging positioning fixture, the method comprising: Placing several groups of chips in a chip positioning mechanism; placing a plurality of groups of package substrates in a substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate; Controlling two adjacent groups of connecting magnetic columns to move toward opposite sides, compressing the elastic sheet, so that several groups of connecting contact sheets are connected to the chip; The two adjacent groups of connecting magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect to the packaging substrate; Controlling the chip positioning mechanism to stick the chip on the packaging substrate; Complete chip packaging positioning work.

[0016] The beneficial effects of the present invention are: 1. By controlling the adjacent connecting magnetic columns to move toward the opposite side, the elastic sheet is compressed. Since the elastic sheet is wavy, its width increases during the compression process and extends out of the connecting slot, so that the corresponding contact piece can contact the connection point of the chip and reduce the outlet size to prevent the chip from falling. At the same time, when the two groups of connecting magnetic columns move to the bottom of the detection cavity, the magnetic lifting magnetic plate drives several groups of detection probes to extend from the four groups of telescopic slots and contact the pins of the packaging substrate, realizing functional detection when the chip and the packaging substrate are pasted, while improving the working stability of the positioning fixture and the use effect of the positioning fixture on the chip packaging work.

[0017] 2. Since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips are rotated to face the cooling groove, cold air is introduced through the corresponding groups of air guide holes to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they are rotated to the bottom, avoiding the need for static cooling. At the same time, the guide plates on both sides are controlled to drive several groups of guide rollers to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, so that the unloading positions of several groups of packaging substrates and chips remain consistent, thereby improving the unloading efficiency and quality of the positioning fixture.

[0018] 3. By controlling the circulating motor to drive the rotating shaft to rotate, the rotating shaft will drive the rotating column to rotate at the same time, exposing the corresponding groups of substrate positioning grooves in the first working groove, and then placing the corresponding groups of packaging substrates in the corresponding substrate positioning grooves for calibration and positioning. When the corresponding groups of chips rotate to the bottom of the rotating shaft, the corresponding groups of packaging substrates rotate to the top of the rotating column. Since the corresponding groups of chips and the packaging substrates are correctly aligned at this time, the corresponding telescopic suction cups stick the chips to the packaging substrates, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture.

[0019] 4. When the auxiliary unloading mechanism needs to be disassembled, several groups of first electric push rods can be controlled to drive the air guide plate to move toward the side away from the auxiliary unloading mechanism, so that several groups of limiting connecting pipes are disengaged from the corresponding groups of air guide holes. Then the first mounting frame can be directly pulled out from the side of the mounting groove to carry out corresponding repairs or maintenance work, thereby ensuring the cooling efficiency and improving the maintenance efficiency of the positioning fixture.

[0020] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0022] Figure 1 A structural schematic diagram of a positioning jig according to an embodiment of the present application is shown; Figure 2 A sectional view schematic diagram of a positioning jig according to an embodiment of the present application is shown; Figure 3 A structural schematic diagram of a chip positioning mechanism according to an embodiment of the present application is shown; Figure 4 A structural schematic diagram of an auxiliary positioning assembly according to an embodiment of the present application is shown; Figure 5 A sectional view schematic diagram of an auxiliary positioning assembly according to an embodiment of the present application is shown; Figure 6 A structural schematic diagram of an elastic sheet according to an embodiment of the present application is shown; Figure 7 A structural schematic diagram of a substrate positioning mechanism according to an embodiment of the present application is shown; Figure 8 A sectional view schematic diagram of a substrate positioning mechanism according to an embodiment of the present application is shown; Figure 9 A structural schematic diagram of an auxiliary blanking mechanism according to an embodiment of the present application is shown.

[0023] In the figure: 1, positioning base; 2, working groove; 3, chip positioning mechanism; 4, substrate positioning mechanism; 5, circulating motor; 6, mounting slot; 7, auxiliary blanking mechanism; 8, limiting magnet; 9, first working groove; 10, air guide cavity; 11, first electric push rod; 12, air guide plate; 13, limiting connecting pipe; 14, refrigerator; 301, rotating shaft; 302, mounting block; 303, chip positioning groove; 304, auxiliary positioning assembly; 305, telescopic suction cup; 401, rotating column; 402, substrate positioning groove; 403, first positioning plate; 404, suction hole; 405, suction cavity; 406, closed magnetic plate; 701, first mounting frame; 702, conveying belt; 703, cooling groove; 704, second working groove; 705, air guide hole; 706, second electric push rod; 707, guide plate; 708, guide roller; 30401, second mounting frame; 30402, second positioning plate; 30403, telescopic slot; 30404, power cavity; 30405, third electric push rod; 30406, screw rod; 30407, transmission block; 30408, connecting slot; 30409, connecting magnetic column; 30410, elastic sheet; 30411, detection cavity; 30412, lifting magnetic plate; 30413, return spring; 30414, guide block; 30415, detection probe; 30416, connecting contact piece. DETAILED DESCRIPTION

[0024] To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] The embodiments of the present application provide a chip packaging positioning jig, which comprises a positioning base 1. Figure 1 and Figure 2As shown, the side wall of the positioning base 1 is provided with a working groove 2; the top of the working groove 2 is of an open structure; the working groove 2 is provided with a chip positioning mechanism 3; the lower side of the chip positioning mechanism 3 is provided with a substrate positioning mechanism 4; the chip positioning mechanism 3 and the substrate positioning mechanism 4 are drivingly connected; the side wall of the positioning base 1 is provided with a circulating motor 5; the output end of the circulating motor 5 is drivingly connected with the chip positioning mechanism 3; the side wall of the positioning base 1 is provided with a mounting through groove 6; the mounting through groove 6 is movably penetrated by an auxiliary discharging mechanism 7; the top of the mounting through groove 6 is symmetrically provided with two groups of limiting magnets 8; the side wall of the positioning base 1 is provided with a first working groove 9; the side wall of the mounting through groove 6 is provided with a gas guide cavity 10; the side wall of the gas guide cavity 10 away from the auxiliary discharging mechanism 7 is provided with a plurality of groups of first electric push rods 11; the output end of each group of the first electric push rods 11 is drivingly connected with a gas guide plate 12; the side wall of the gas guide plate 12 close to the auxiliary discharging mechanism 7 is provided with a plurality of groups of limiting connecting pipes 13 at equal intervals; the end of each group of the limiting connecting pipes 13 away from the gas guide plate 12 is movably penetrated into the auxiliary discharging mechanism 7; the side wall of the gas guide cavity 10 away from the auxiliary discharging mechanism 7 is provided with a refrigeration device 14.

[0026] When performing the chip packaging positioning work, a plurality of groups of chips and packaging substrates are respectively placed in the chip positioning mechanism 3 and the substrate positioning mechanism 4 for positioning, then the chip positioning mechanism 3 is controlled to paste the chips on the packaging substrate, and then the substrate positioning mechanism 4 is controlled to drive the packaging substrate and the chips to perform the discharging work, thereby facilitating the subsequent protective shell injection work.

[0027] As shown in the figure, Figure 3 As shown, the chip positioning mechanism 3 comprises a rotating shaft 301; the outer wall of the rotating shaft 301 is provided with a plurality of groups of mounting blocks 302 in an annular array; the side wall of each group of the mounting blocks 302 away from the rotating shaft 301 is provided with a plurality of groups of chip positioning grooves 303 at equal intervals; each group of the chip positioning grooves 303 is provided with a group of auxiliary positioning assemblies 304; each group of the chip positioning grooves 303 is provided with a group of telescopic suction cups 305; As shown in the figure, Figure 4 and Figure 5As shown, the substrate positioning mechanism 4 comprises a rotating column 401; the rotating column 401 is in transmission connection with the rotating shaft 301; a plurality of groups of substrate positioning grooves 402 are arranged in an annular array on the outer wall of the rotating column 401; a group of first positioning plates 403 are arranged on the inner walls of the four sides of each group of substrate positioning grooves 402; a group of adsorption holes 404 are arranged on the inner wall of one side of each group of substrate positioning grooves 402 close to the axis of the rotating column 401; an adsorption cavity 405 is arranged in the rotating column 401; the adsorption cavity 405 is in communication with the plurality of groups of adsorption holes 404; a closed magnetic plate 406 is arranged in the adsorption cavity 405.

[0028] When performing chip packaging positioning work, a plurality of groups of chips are placed in the chip positioning grooves 303, and the corresponding plurality of groups of auxiliary positioning assemblies 304 are controlled to calibrate and position the chips, then the rotating shaft 301 is driven to rotate by the circulating motor 5, and at the same time the rotating shaft 301 drives the rotating column 401 to rotate, thereby exposing the corresponding plurality of groups of substrate positioning grooves 402 in the first working groove 9, then a plurality of groups of packaging substrates are placed in the corresponding substrate positioning grooves 402, the adsorption holes 404 first generate a slight adsorption force on the packaging substrates to prevent them from falling, then the four groups of first positioning plates 403 in each group of substrate positioning grooves 402 calibrate and position the corresponding packaging substrates, when the corresponding plurality of groups of chips are rotated to be directly below the rotating shaft 301, the corresponding plurality of groups of packaging substrates are rotated to be directly above the rotating column 401, and since the corresponding plurality of groups of chips and packaging substrates are correctly aligned at this time, the auxiliary positioning assembly 304 is controlled to release the restriction on the chips, and the chips are pasted on the packaging substrates by the corresponding telescopic suction cups 305, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning jig. The closed magnetic plate 406 is always kept at the bottom of the adsorption cavity 405 under the magnetic action of the two groups of limiting magnets 8, when the corresponding plurality of groups of packaging substrates and chips are rotated to be directly below the rotating column 401, the closed magnetic plate 406 will close the corresponding plurality of groups of adsorption holes 404, so that the corresponding packaging substrates and chips will fall into the auxiliary blanking mechanism 7 for blanking work.

[0029] For example, Figure 6As shown, the auxiliary blanking mechanism 7 comprises a first mounting frame 701; the first mounting frame 701 is in the shape of U; a conveyor belt 702 is arranged on the inner wall of the bottom of the first mounting frame 701; a cooling groove 703 and a second working groove 704 are respectively arranged on the inner walls of the two sides of the first mounting frame 701; the second working groove 704 is communicated with the first working groove 9; a plurality of groups of air guide holes 705 are arranged on the side wall of the cooling groove 703 away from the second working groove 704 at equal intervals; each group of the limiting connecting pipes 13 is movably penetrated into the corresponding group of air guide holes 705; a plurality of groups of second electric push rods 706 are symmetrically arranged on the inner walls of the two sides of the first mounting frame 701; a group of guide plates 707 is drivingly connected to the output ends of the same side of the plurality of groups of second electric push rods 706; a plurality of groups of guide rollers 708 are respectively arranged on the opposite side walls of the two groups of guide plates 707 at equal intervals.

[0030] When the chip packaging positioning work is performed, since the chip is usually heated when being pasted on the packaging substrate, when the corresponding plurality of groups of packaging substrates and chips are rotated to face the cooling groove 703, the cold air is introduced into the cooling groove 703 through the corresponding plurality of groups of air guide holes 705 to cool and cool the packaging substrate and the chip, so that the packaging substrate and the chip can be directly blanked when being rotated to the lower side, avoiding the need for static cooling work, and at the same time, the guide plates 707 on the two sides drive the plurality of groups of guide rollers 708 to slowly reciprocate, which can correct the position of the packaging substrate and the chip, so that the blanking positions of the plurality of groups of packaging substrates and chips are consistent, and the blanking efficiency and quality of the positioning jig are improved. When the auxiliary blanking mechanism 7 needs to be disassembled, the first electric push rods 11 can be controlled to drive the air guide plates 12 to move away from the side of the auxiliary blanking mechanism 7, so that the plurality of groups of limiting connecting pipes 13 are separated from the corresponding plurality of groups of air guide holes 705, and then the first mounting frame 701 can be directly pulled out from the side of the mounting groove 6 for corresponding repair or maintenance work, which improves the maintenance efficiency of the positioning jig while ensuring the refrigeration efficiency.

[0031] For example, Figure 7 , Figure 8 and Figure 9As shown, the auxiliary positioning assembly 304 comprises a second mounting frame 30401; the second mounting frame 30401 is a back-shaped type; a group of second positioning plates 30402 are respectively arranged on the inner walls of the four sides of the bottom of the second mounting frame 30401; a group of telescopic through grooves 30403 are respectively arranged at the four side edges of the top of the second mounting frame 30401; four groups of power cavities 30404 are arranged in the second mounting frame 30401; a plurality of groups of third electric push rods 30405 are arranged on the inner wall of one side of each group of the power cavities 30404 close to the second positioning plates 30402; the output ends of each group of the third electric push rods 30405 are in transmission connection with a corresponding group of the second positioning plates 30402; two groups of lead screws 30406 are arranged in each group of the power cavities 30404; one end of each of the corresponding two groups of the lead screws 30406 is fixedly connected, and the other end is rotatably connected to the two side inner walls of a corresponding group of the power cavities 30404; the screw directions of the corresponding two groups of the lead screws 30406 are opposite, and the central axes are on the same straight line; two groups of transmission blocks 30407 are slidably connected to the top inner walls of each group of the power cavities 30404; each group of the transmission blocks 30407 is in threaded connection with a corresponding group of the lead screws 30406; a group of connecting grooves 30408 is respectively arranged on the four side inner walls of the second mounting frame 30401; one end of each group of the transmission blocks 30407 extends into a corresponding group of the connecting grooves 30408 and is in transmission connection with a group of connecting magnetic columns 30409; a group of elastic sheets 30410 is arranged between the corresponding two groups of the connecting magnetic columns 30409; the elastic sheets 30410 are wave-shaped, and a plurality of groups of connecting contact sheets 30416 are equidistantly arranged on the side walls close to the second positioning plates 30402; four groups of detection cavities 30411 are arranged in the second mounting frame 30401; each group of the detection cavities 30411 is in communication with a corresponding group of the telescopic through grooves 30403; a group of lifting magnetic plates 30412 is slidably connected in the vertical direction in each group of the detection cavities 30411; a plurality of groups of return springs 30413 are symmetrically arranged on the top of each group of the lifting magnetic plates 30412; the top of each group of the return springs 30413 is connected to the top of a corresponding group of the detection cavities 30411; a group of guide blocks 30414 is arranged on the top of each group of the lifting magnetic plates 30412; a plurality of groups of detection probes 30415 are dampingly and slidably connected to the top of each group of the guide blocks 30414; each group of the detection probes 30415 is in electrical connection with a corresponding group of the connecting contact sheets 30416.

[0032] In the chip packaging positioning work, a plurality of groups of chips are placed in the second mounting frame 30401, and the four groups of second positioning plates 30402 are driven by a plurality of groups of third electric push rods 30405 to calibrate and position the chips. Then, when the plurality of groups of chips rotate to the directly below, the control of the screw rod 30406 rotation is realized under the threaded connection relationship between the screw rod 30406 and the transmission block 30407, so that the adjacent two groups of transmission blocks 30407 can drive the adjacent connecting magnetic columns 30409 to move towards the opposite side, so that the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is in a wave shape, the width is increased and the connecting groove 30408 is extended during the compression process, so that the corresponding contact sheet can be abutted on the connecting point of the chip. At the same time, when the two groups of connecting magnetic columns 30409 move to the below of the detection cavity 30411, the plurality of groups of detection probes 30415 are extended from the four groups of telescopic grooves 30403 and abutted on the pins of the packaging substrate by the magnetic push-lift magnetic plate 30412. Not only the functional detection when the chip is pasted on the packaging substrate is realized, but also the elastic sheet 30410 is extended to reduce the outlet size to avoid the chip from falling during the transfer. The working stability of the positioning fixture is improved, and the use effect of the positioning fixture on the chip packaging work is improved.

[0033] By controlling the adjacent connecting magnetic columns 30409 to move towards the opposite side, the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is in a wave shape, the width is increased and the connecting groove 30408 is extended during the compression process, so that the corresponding contact sheet can be abutted on the connecting point of the chip. At the same time, when the two groups of connecting magnetic columns 30409 move to the below of the detection cavity 30411, the plurality of groups of detection probes 30415 are extended from the four groups of telescopic grooves 30403 and abutted on the pins of the packaging substrate by the magnetic push-lift magnetic plate 30412. Not only the functional detection when the chip is pasted on the packaging substrate is realized, but also the elastic sheet 30410 is extended to reduce the outlet size to avoid the chip from falling during the transfer. The working stability of the positioning fixture is improved, and the use effect of the positioning fixture on the chip packaging work is improved.

[0034] Since the chip pasted on the packaging substrate usually needs to be heated, when the corresponding plurality of groups of packaging substrates and chips rotate to the cooling groove 703, the cold air is introduced into the packaging substrate and the chip through the corresponding plurality of groups of air guide holes 705 to cool and cool the packaging substrate and the chip. When the packaging substrate and the chip rotate to the below, the blanking work can be directly performed, avoiding the need for static cooling work. At the same time, the control of the guide plates 707 on both sides drives a plurality of groups of guide rollers 708 to do slow reciprocating motion, which can correct the position of the packaging substrate and the chip, so that the blanking positions of the plurality of groups of packaging substrates and chips remain consistent, improving the blanking efficiency and quality of the positioning fixture.

[0035] By controlling the rotating shaft 301 to rotate by the control cycle motor 5, the rotating shaft 301 will drive the rotating column 401 to rotate, and the corresponding several groups of substrate positioning grooves 402 are exposed in the first working groove 9, and then several groups of packaging substrates are placed in the corresponding substrate positioning grooves 402 for calibration positioning, when the corresponding several groups of chips rotate to the position directly below the rotating shaft 301, the corresponding several groups of packaging substrates rotate to the position directly above the rotating column 401, and since the corresponding several groups of chips and packaging substrates are correctly aligned at this time, the chip is pasted on the packaging substrate by the corresponding telescopic suction cup 305, so that the continuous chip packaging positioning work is realized, and the working efficiency of the positioning jig is improved.

[0036] When it is necessary to disassemble the auxiliary blanking mechanism 7, the several groups of first electric push rods 11 can be controlled to drive the air guide plate 12 to move away from the side of the auxiliary blanking mechanism 7, so that the several groups of limiting connecting pipes 13 are separated from the corresponding several groups of air guide holes 705, and then the first mounting frame 701 can be directly pulled out from the side of the mounting groove 6 for corresponding repair or maintenance work, which improves the maintenance efficiency of the positioning jig while ensuring the refrigeration efficiency.

[0037] On the basis of the above-mentioned chip packaging positioning jig, the embodiments of the present application also propose a use method for the chip packaging positioning jig, and the use method comprises the following steps: Placing several groups of chips in the chip positioning mechanism; Placing several groups of packaging substrates in the substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the position directly above the packaging substrate; Controlling the two adjacent groups of connecting magnetic columns to move towards the opposite side, compressing the elastic sheet, so that the several groups of connecting contact pieces are connected with the chip; The two adjacent groups of connecting magnetic columns are moved to the position directly below the corresponding lifting magnetic plate, and the lifting magnetic plate is driven by magnetic force to drive the several groups of detection probes to extend and be connected with the packaging substrate; Controlling the chip positioning mechanism to paste the chip on the packaging substrate; Completing the chip packaging positioning work.

[0038] Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip packaging positioning fixture, comprising a positioning base, characterized in that: A working groove is provided on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; and a substrate positioning mechanism for calibrating and positioning the packaging substrate is provided directly below the chip positioning mechanism. The chip positioning mechanism includes several groups of auxiliary positioning components; The auxiliary positioning assembly includes a second mounting frame for calibrating the positioning chip; a group of connecting grooves are respectively formed on the inner walls of the four sides of the second mounting frame; each group of the connecting grooves is provided with two groups of connecting magnetic pillars; a group of elastic sheets are provided between the two corresponding groups of connecting magnetic pillars; the elastic sheets are wavy, and a plurality of groups of connecting contact sheets capable of connecting to the chip are evenly spaced on a side wall close to the second positioning plate; Four groups of detection chambers are provided in the second mounting frame; a group of lifting magnetic plates is vertically slidably connected to each group of detection chambers; a group of guide blocks is provided on the top of each group of lifting magnetic plates; a plurality of groups of detection probes connected to the packaging substrate are provided on the top of each group of guide blocks; each group of detection probes is electrically connected to a corresponding group of connection contacts; Several groups of reset springs are symmetrically arranged on the top of each group of lifting magnetic plates; the top of each group of reset springs is connected to the top of the corresponding group of detection cavities; The adjacent connecting magnetic pillars move toward the opposite side, causing the elastic sheet to be compressed. Since the elastic sheet is wavy, its width increases during the compression process and extends out of the connecting slot, so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars move to the bottom of the detection cavity, the magnetic lifting magnetic plate drives several groups of detection probes to extend from the four groups of telescopic slots and contact the pins of the packaging substrate.

2. The chip packaging positioning jig according to claim 1, characterized in that: The top of the working tank is an open structure; the chip positioning mechanism and the substrate positioning mechanism are transmission connected; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is transmission connected to the chip positioning mechanism; a mounting slot is provided on one side wall of the positioning base; an auxiliary unloading mechanism is movably inserted into the mounting slot; two sets of limiting magnets are symmetrically provided at the two side edges of the top of the mounting slot.

3. The chip packaging positioning jig according to claim 2, characterized in that: A first working groove is provided on one side wall of the positioning base; an air guide cavity is provided on an inner wall of one side of the mounting groove; a plurality of groups of first electric push rods are provided on an inner wall of the air guide cavity away from the auxiliary unloading mechanism; an air guide plate is transmission-connected to the output ends of the plurality of first electric push rods; a plurality of groups of limiting connecting tubes are provided at equal intervals on a side wall of the air guide plate close to the auxiliary unloading mechanism; an end of each group of limiting connecting tubes away from the air guide plate is movable and passes through the auxiliary unloading mechanism; a refrigerator is provided on an inner wall of the air guide cavity away from the auxiliary unloading mechanism.

4. The chip packaging positioning jig according to claim 1, characterized in that: The chip positioning mechanism also includes a rotating shaft; a plurality of groups of mounting blocks are distributed in a circular array on the outer wall of the rotating shaft; a plurality of groups of chip positioning grooves are evenly spaced on a side wall of each group of mounting blocks away from the rotating shaft; each group of auxiliary positioning components is installed in a corresponding group of chip positioning grooves; and a group of telescopic suction cups is provided in each group of chip positioning grooves.

5. The chip packaging positioning jig according to claim 1, characterized in that: The substrate positioning mechanism includes a rotating column; a number of groups of substrate positioning grooves are arranged in an annular array on the outer wall of the rotating column; a group of first positioning plates capable of calibrating and positioning the packaging substrate are provided on the inner walls of the four sides of each group of substrate positioning grooves; a group of adsorption holes are opened on the inner wall of each group of substrate positioning grooves close to the axis of the rotating column; an adsorption cavity is arranged inside the rotating column; the adsorption cavity is communicated with a number of groups of adsorption holes; and a closed magnetic plate is arranged in the adsorption cavity.

6. The chip packaging positioning jig according to claim 3, characterized in that: The auxiliary blanking mechanism includes a first installation frame; the first installation frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first installation frame; cooling grooves and second working grooves are respectively opened on the inner walls of the two sides of the first installation frame; and the second working groove is communicated with the first working groove.

7. The chip packaging positioning jig according to claim 6, characterized in that: A number of groups of air guide holes are equidistantly opened on one side wall of the cooling groove far away from the second working groove; each group of limit connecting pipes movably penetrates through a corresponding group of air guide holes; a number of groups of second electric push rods are symmetrically arranged on the inner walls of the two sides of the first installation frame; a group of guide plates are传动连接 with the output ends of a number of groups of second electric push rods on the same side; and a number of groups of guide rollers are respectively equidistantly arranged on the opposite side walls of the two guide plates.

8. The chip packaging positioning jig according to claim 1, characterized in that: The second installation frame is in a double-square shape; a group of second positioning plates are respectively arranged on the inner walls of the four sides of the bottom of the second installation frame; a group of telescopic through grooves are respectively arranged at the edges of the four sides of the top of the second installation frame; and each group of detection cavities is communicated with a corresponding group of telescopic through grooves.

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