Sheet processing equipment and sheet production line

Abstract

The invention relates to the technical field of semiconductors and photovoltaics, in particular to sheet process equipment and a sheet production line, and solves the problems of low process efficiency and poor process effect when a sheet on a carrier in a reaction cavity is processed in related technologies. The sheet processing equipment is provided with at least one processing position and comprises a carrier and a processing assembly, the carrier is provided with a containing cavity, and the position, corresponding to the position between every two adjacent sheets, of the carrier is provided with a recess concaved towards the interior of the containing cavity; and each process assembly is provided with at least one process part, and at least part of the process part can extend into the corresponding recess, so that the process part penetrates through the carrier defining the recess part to act on the adjacent sheets. According to the sheet process equipment and the sheet production line, the process efficiency and the process effect of the sheets can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor and photovoltaic technology, and in particular, to a wafer process equipment and wafer production line. BACKGROUND

[0002] With the development of solar photovoltaic technology, solar cell wafers are widely used in various fields. In the preparation process of solar cell wafers, processes such as copper solidification, cross-section passivation, boron diffusion, annealing, oxidation, dry cleaning, phosphorus diffusion, plasma enhanced chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), and atmospheric pressure chemical vapor deposition (APCVD) are generally included. For example, when a copper solidification device is used to solidify copper on a silicon wafer, a carrier carrying the silicon wafer is generally transferred between different solidification furnaces. Taking the movement of the carrier to a heated solidification furnace as an example, a heating assembly is arranged on the solidification furnace. The heat generated by the heating assembly needs to be conducted through the furnace cavity of the solidification furnace to the carrier, and then conducted from the outside to the inside of the carrier to different positions of different wafers, resulting in a long time for the wafers on the carrier to be heated to the required temperature of the process, and poor temperature uniformity of different positions of the wafers, resulting in poor process effect. SUMMARY

[0003] Therefore, the present disclosure provides a wafer process equipment and wafer production line to solve the problems of low process efficiency and poor process effect in the related art.

[0004] In a first aspect, an embodiment of the present disclosure provides a wafer process equipment, comprising: a carrier having a containing cavity configured to contain a plurality of spaced-apart wafers, the carrier being provided with a recess inward of the containing cavity at a position corresponding to each adjacent two wafers; and at least one process assembly, each process assembly having at least one process piece, at least a part of the process piece extending into the corresponding recess, so that the process piece acts on the adjacent wafers.

[0005] In some embodiments, the carrier comprises: a main body provided with a recess and an opening in communication with the recess, the recess is configured to accommodate a plurality of sheets arranged at intervals along a first direction; a cover plate detachably connected to the main body, the cover plate covers the opening to form an accommodation chamber with the recess, a plurality of recesses are arranged on a side of the cover plate facing the recess, so that a plurality of protrusions arranged at intervals along the first direction are formed on the side of the cover plate facing the recess; wherein the main body is further provided with a plurality of groups of air inlet ports and air outlet ports arranged at intervals along the first direction, and the air inlet port and the air outlet port in each group correspond to each other in a second direction, the first direction and the second direction intersect, and when the carrier carries a plurality of sheets, the plurality of sheets divide the accommodation chamber into a plurality of sub-chambers along the first direction, each protrusion corresponds to a sub-chamber, each group of air inlet ports and air outlet ports communicates with a sub-chamber, and the direction from the air inlet port to the air outlet port is parallel to the extension direction of the sheet.

[0006] In some embodiments, the carrier further comprises: a plurality of first uniform flow devices respectively arranged at each air inlet port, the first uniform flow device is configured to uniformly flow the gas entering from the air inlet port into the sub-chamber; and / or a plurality of second uniform flow devices respectively arranged at each air outlet port, the second uniform flow device is configured to uniformly extract the gas in the sub-chamber from the air outlet port.

[0007] In some embodiments, the carrier further comprises: an inlet provided on the main body, the inlet is configured to communicate with the air inlet device; an air inlet flow channel provided on the side of the main body corresponding to the air inlet port, and the air inlet flow channel respectively communicates the inlet with the plurality of air inlet ports; an outlet provided on the main body, the outlet is configured to communicate with the air extraction device; and an air outlet flow channel provided on the side of the main body corresponding to the air outlet port, and the air outlet flow channel respectively communicates the outlet with the plurality of air outlet ports.

[0008] In some embodiments, the carrier further comprises: a plurality of groups of first support devices arranged on the main body, and the plurality of groups of first support devices are arranged on the side of the recess opposite to the cover plate, the plurality of groups of first support devices correspond to the plurality of protrusions one by one, and when the cover plate covers the opening of the main body, the first support device abuts against the corresponding protrusion to support the protrusion; and / or a plurality of groups of second support devices arranged on the main body, and the plurality of groups of second support devices are arranged on at least one side of the recess, the plurality of groups of second support devices are arranged at intervals along the first direction, and when the sheet is placed in the recess, each group of second support devices is configured to abut against a sheet to support the sheet.

[0009] In some embodiments, the cover plate is a metal piece.

[0010] In some embodiments, the sheet processing apparatus has at least one processing station, and the sheet processing apparatus further comprises: at least one driving assembly arranged one-to-one at the processing station, each processing assembly is connected to a driving assembly, when the carrier is placed at a processing station, the recess of the carrier faces the processing piece, and the processing piece and the recess are arranged one-to-one, and the driving assembly can drive the processing assembly to move, so that at least part of the processing piece extends into or out of the corresponding recess.

[0011] In some embodiments, at least one processing station is configured as a heating processing station, the processing assembly comprises a first heating assembly movably connected to the heating processing station, the first heating assembly comprises: a first connecting piece arranged at the heating processing station, the first connecting piece is connected to the driving assembly arranged at the heating processing station; at least one processing piece, the processing piece is a first heating piece, the first heating piece is arranged at the first connecting piece along a first direction, when the carrier is placed at the heating processing station, the first heating piece corresponds to the recess one-to-one, and the driving assembly can drive the first heating assembly to move so that at least part of the first heating piece extends into the corresponding recess; and / or, at least one processing station is configured as a cooling processing station, the processing assembly comprises a cooling assembly movably connected to the cooling processing station, the cooling assembly comprises: a second connecting piece arranged at the cooling processing station, the second connecting piece is connected to the driving assembly arranged at the cooling processing station; at least one processing piece, the processing piece is a cooling piece, the cooling piece is arranged at the second connecting piece along the first direction, when the carrier is placed at the cooling processing station, the cooling piece corresponds to the recess one-to-one, and the driving assembly can drive the cooling assembly to move so that at least part of the cooling piece extends into the corresponding recess.

[0012] In some embodiments, when at least one processing station is configured as a heating processing station, the number of first heating pieces includes a plurality, along the first direction, each adjacent one or more first heating pieces forms a group, and the first heating assembly further comprises: a control piece electrically connected to each group of first heating pieces respectively, when the first heating piece extends into the recess, the control piece is configured to control the heating temperature of each group of first heating pieces to be the same or different.

[0013] In some embodiments, when the at least one process station is configured as a heating process station, the at least one process station is configured as a preheating process station, the preheating process station is arranged at one side of the heating process station, the process assembly further comprises a second heating assembly movably connected to the preheating process station, the second heating assembly comprises: a third connecting member arranged at the preheating process station, the third connecting member is connected to the driving assembly arranged at the preheating process station; and at least one second heating member arranged at the third connecting member in the first direction, the second heating member corresponds to the recess one by one when the carrier is placed in the preheating process station, the driving assembly is capable of moving the second heating assembly to make at least part of the second heating member extend into the corresponding recess, and the heating temperature of the second heating member is lower than the heating temperature of the first heating member.

[0014] In some embodiments, the at least one heat preservation assembly is detachably connected to the outer side wall of the carrier at least when the carrier is located in the heating process station.

[0015] In some embodiments, when the carrier is placed in a process station, the carrier is arranged at one side of the process assembly in a third direction, the first direction, the second direction and the third direction intersect with each other, the process station is provided with a workbench, the carrier and the driving assembly are arranged on the workbench, and the driving assembly comprises: a guide rail arranged on the workbench, the guide rail extends in the third direction; a sliding block slidably connected to the guide rail, the process assembly is connected to the sliding block; and a driving member arranged on the workbench, the driving member is connected to the sliding block, and the driving member is configured to drive the sliding block to reciprocate in the third direction relative to the guide rail.

[0016] In some embodiments, the number of process stations comprises a plurality, and the sheet process equipment further comprises: a first flow member extending in the second direction, the plurality of process stations are arranged at least one side of the first flow member in the third direction, and the first flow member is configured to flow the carrier carrying the sheet to a position corresponding to a process station; and a second flow member arranged at one side of the first flow member, the second flow member is configured to flow the carrier carrying the sheet between different process stations, and is configured to flow the carrier carrying the sheet between the first flow member and the process station.

[0017] In a second aspect, the embodiments of the present disclosure further provide a sheet production line, comprising the sheet process equipment described above, the sheet process equipment is configured to process the sheet carried on the carrier; and an up-down loading assembly arranged at least one side of the sheet process equipment, the up-down loading assembly is configured to load the carrier carrying the sheet to the sheet process equipment or unload the carrier from the sheet process equipment.

[0018] The wafer process equipment and wafer production line provided by the embodiments of the present disclosure are characterized in that: at least one recess is arranged on the outside of the carrier and in the inner recess of the carrier, and in the case that a plurality of silicon wafers are carried in the carrier, each recess is arranged at a position between two adjacent silicon wafers, and at least part of each process component in the process assembly can be inserted into each recess one by one, so that the process component can perform a process on the adjacent silicon wafers in the accommodation cavity outside the carrier. In this way, the process field formed by each process component during the process is closer to each silicon wafer, so that the process component can act on each silicon wafer more uniformly and quickly, thereby improving the process efficiency and process effect.

[0019] In addition, the plurality of silicon wafers are arranged in the closed accommodation cavity, and the process component arranged on the outside of the carrier is inserted into the recess on the carrier to perform a process on the silicon wafers, so that the oxygen content in the accommodation cavity during the process is reduced, and the process efficiency and process effect of the silicon wafers in the carrier are further improved.

[0020] In addition, compared with the conventional scheme of placing the carrier carrying the silicon wafers in the reaction cavity in the process furnace to perform a process, the wafer process equipment provided by the embodiments of the present disclosure directly uses the accommodation cavity of the carrier as the reaction cavity, arranges the process assembly in an atmospheric environment, and performs a process on the silicon wafers in the accommodation cavity of the carrier by the process component in the atmospheric environment. On the one hand, the equipment assembly difficulty and cost are reduced, and maintenance and replacement are facilitated. On the other hand, the silicon wafer occupancy ratio in the accommodation cavity is also improved, and the process efficiency can be further improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. The drawings provided in the specification and the embodiments of the present disclosure constitute a part of the specification and are used to explain the present disclosure together with the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings, the same reference numerals generally represent the same components or steps.

[0022] Figure 1 FIG. 1 shows a schematic diagram of a wafer production line provided by an embodiment of the present disclosure.

[0023] Figure 2 FIG. 2 shows a schematic diagram of a wafer process equipment provided by an embodiment of the present disclosure.

[0024] Figure 3 FIG. 3 shows a schematic diagram of a wafer production line provided by another embodiment of the present disclosure.

[0025] Figure 4 FIG. 4 shows a schematic diagram of a wafer production line provided by another embodiment of the present disclosure.

[0026] Figure 5 FIG. 5 shows a schematic diagram of a wafer production line provided by another embodiment of the present disclosure.Figure 4 A schematic view of a sheet process equipment in a sheet production line.

[0027] Figure 6 A schematic view of a sheet process equipment in a sheet production line. Figure 5 A partial enlarged view of part A of the sheet process equipment.

[0028] Figure 7 An exploded view of a carrier and a process assembly in cooperation according to an embodiment of the present disclosure.

[0029] Figure 8 A front view of a carrier and a process assembly in cooperation according to an embodiment of the present disclosure.

[0030] Figure 9 A partial enlarged view of part A of the sheet process equipment. Figure 8 A partial enlarged view of part C-C of the carrier and the process assembly in cooperation.

[0031] Figure 10 A partial enlarged view of part A of the sheet process equipment. Figure 8 A partial enlarged view of part C-C of the carrier and the process assembly in cooperation.

[0032] Figure 11 A partial enlarged view of part A of the sheet process equipment.

[0033] Figure 12 A partial enlarged view of part A of the sheet process equipment.

[0034] Figure 13 A partial enlarged view of part A of the sheet process equipment.

[0035] Figure 14 A partial enlarged view of part A of the sheet process equipment.

[0036] Reference signs:

[0037] 100, sheet production line; 10, sheet process equipment; 10a, process site group; 101a, process site; a1, preheating process site; a2, heating process site; a3, cooling process site; a4, buffer process site; 1, carrier; 1a, accommodating chamber; 1b, air inlet pipeline; 1c, air outlet pipeline; 1d, sub-chamber; 11, main body; 11a, inlet; 11b, outlet; 11c, valve; 111, air inlet; 112, air outlet; 113, air inlet flow channel; 114, air outlet flow channel; 115, second flow uniformizing member; 1151, flow uniformizing air inlet hole; 12, cover plate; 121, protrusion; 121a, recess; 13, first support member; 131, support plate; 132, clamping groove; 14, second support member; 141, support protrusion; 2, process assembly; 21, second heating assembly; 22, first heating assembly; 221, first connecting member; 222, first heating member; 2221, heating plate; 2222, electrode group; 2223, insulating member; 23, cooling assembly; 231, circulating pipeline; 231a, water inlet pipe; 231b, water outlet pipe; 232, cooling member; 3, driving assembly; 31, guide rail; 32, sliding block; 33, driving member; 4, workbench; 5, first flow transfer member; 6, second flow transfer member; 7, heat preservation assembly; 8, silicon wafer; 20, loading and unloading assembly; 30, sheet conveying assembly; X, second direction; Y, third direction; Z, first direction. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present disclosure.

[0039] The embodiments of the present disclosure provide a sheet process equipment, such as Figures 1 to 7 The sheet process equipment 10 is used in the sheet production line 100, and is configured to process sheets. Specifically, the sheet process equipment 10 comprises a carrier 1 and at least one process assembly 2. The carrier 1 has an accommodating chamber 1a configured to accommodate a plurality of sheets arranged at intervals. The carrier 1 is provided with a recess 121a inwardly recessed into the accommodating chamber 1a at a position corresponding to each adjacent two sheets. Each process assembly 2 has at least one process member, at least a part of the process member extending into the corresponding recess 121a, so that the process member can act on the adjacent sheets through the carrier 1 surrounding part of the recess 121a.

[0040] Optionally, the sheet material can be a semiconductor or photovoltaic material for preparing solar cell sheets, which are collectively referred to as "silicon sheets" in the disclosure, and the silicon sheets 8 are finally used as solar cell sheets after being cut, diffused, coated, copper solidified, cleaned, and subjected to different processes. The shape of the silicon sheets 8 includes square, circular, etc., and the specific size can be adaptively adjusted according to actual needs, which is not specifically limited. The silicon sheets 8 provided in the embodiments of the disclosure are square silicon sheets 8, but are not limited thereto.

[0041] It can be understood that the process of the silicon sheets 8 can specifically include a copper solidification process, a cross-section passivation process, a boron diffusion process, an annealing process, an oxidation process, a dry cleaning process, a phosphorus diffusion process, a PECVD process, an LPCVD process, and an APCVD process, etc., and the sheet material process equipment 10 corresponding to the corresponding process includes a copper solidification device, a cross-section passivation device, a boron diffusion device, an annealing device, an oxidation device, a dry cleaning device, a phosphorus diffusion device, a PECVD device, an LPCVD device, and an APCVD device, etc., and the corresponding sheet material process equipment 10 can be selected according to actual process needs, which is not specifically limited.

[0042] The sheet material process equipment 10 provided in the embodiments of the disclosure is provided with at least one recess 121a on the outside of the carrier 1 to the inner recess of the carrier 1, and in the case that a plurality of silicon sheets 8 are carried in the carrier 1, each recess 121a is arranged at a position between two adjacent silicon sheets 8, and at least part of each process component in the process assembly 2 can be inserted into each recess 121a one by one, so that the process component can process the adjacent silicon sheets 8 in the accommodation chamber 1a outside the carrier 1. In this way, the process field formed by each process component during the process is closer to each silicon sheet 8, so that the process component can act more uniformly and quickly on each silicon sheet 8, thereby improving the process efficiency and process effect.

[0043] In addition, the plurality of silicon sheets 8 are arranged in the closed accommodation chamber 1a, and the process component arranged outside the carrier 1 is inserted into the recess 121a on the carrier 1 to process the silicon sheets 8, so that the oxygen content in the accommodation chamber 1a during the process is reduced, further improving the process efficiency and process effect of the silicon sheets 8 in the carrier 1.

[0044] In addition, compared with the conventional scheme of placing the carrier 1 carrying the silicon sheets 8 in the reaction cavity in the process furnace for processing, the sheet material process equipment 10 provided in the embodiments of the disclosure directly uses the accommodation chamber 1a of the carrier 1 as the reaction cavity, arranges the process assembly 2 in an atmospheric environment, and processes the silicon sheets 8 in the accommodation chamber 1a of the carrier 1 through the process component in the atmospheric environment. On the one hand, this reduces the equipment assembly difficulty and cost, and is convenient for maintenance and replacement; on the other hand, it also improves the space occupation ratio of the silicon sheets 8 in the accommodation chamber 1a, which can further improve the process efficiency.

[0045] It can be understood that the sheet process equipment 10 has at least one process site 101a, which can be used to place at least one of the process assembly 2 and the carrier 1. In the case of a process site 101a for placing the process assembly 2 and the carrier 1, the process assembly 2 and the carrier 1 can be assembled together in advance (i.e. the process pieces of the process assembly 2 are inserted into the recesses of the carrier 1 one by one) and then placed as a whole in the corresponding process site 101a, or the process assembly 2 and the carrier 1 can be assembled after being placed in the process site 101a, which can be adjusted according to actual needs. In the embodiment of the present disclosure, the process assembly 2 and the carrier 1 are assembled after being placed in the process site 101a, the process assembly 2 can be provided in multiple, and the multiple process assemblies 2 are respectively arranged in multiple process sites 101a, and the carrier 1 can be circulated between different process sites 101a to cooperate with different process assemblies 2.

[0046] It should be emphasized that the process site 101a can be understood as a space occupied for processing the silicon wafer 8, and the process site 101a can be provided as one or multiple, and in the case of multiple process sites 101a, the multiple process sites 101a can be divided into one or more process site groups 10a, the number of process sites 101a in each process site group 10a and the process equipment placed therein are the same, and can be adjusted according to the specific process steps required for processing the silicon wafer 8. For example, when performing a film plating process on the silicon wafer 8, only one film plating process step can be included, at which time the process site 101a can be provided as one, i.e. a film plating process site, and the process assembly 2 arranged in the film plating process site is a film plating assembly; for example, when performing a copper solidification or annealing process on the silicon wafer 8, at least one process site group 10a can be included, and at least two process sites 101a, i.e. a heating process site a2 and a cooling process site a3, are arranged in each process site group 10a, the process assembly 2 arranged in the heating process site a2 is a heating assembly, the process assembly 2 arranged in the cooling process site a3 is a cooling assembly 23, and according to requirements, the heating process site a2 can include at least two. In addition, in the case of multiple process sites 101a, the positional relationship between the multiple process sites 101a can be adjusted according to actual needs, and is not specifically limited.

[0047] As Figures 1 to 5, the sheet process equipment 10 can further comprise a first flow transfer member 5 extending along the second direction X, and at least one process site group 10a is arranged at one side of the first flow transfer member 5 in the third direction Y, the first flow transfer member 5 is configured to flow the carrier 1 carrying the silicon wafer 8 to a position corresponding to a process site 101a; and a second flow transfer member 6 is arranged at one side of the first flow transfer member 5, the second flow transfer member 6 is configured to flow the carrier 1 carrying the silicon wafer 8 between different process sites 101a, and is configured to flow the carrier 1 carrying the silicon wafer 8 between the first flow transfer member 5 and the corresponding process site 101a.

[0048] Optionally, as Figure 1 and Figure 2 , the first flow transfer member 5 can be arranged as a conveyor belt structure extending along the second direction X, and a group of process site groups 10a is arranged at one side of the conveyor belt in the third direction Y, the conveyor belt can reciprocate the carried carrier 1 in a first movement direction m, the first movement direction m is parallel to the second direction X, so that the carrier 1 can move to a position corresponding to different process sites 101a in the process site group 10a. The second flow transfer member 6 can be arranged as a gantry robot structure, the gantry robot structure has a grabbing part above the process site group 10a and the first flow transfer member 5, the grabbing part can grab the carrier 1 and reciprocate the carrier 1 along a second movement direction V (parallel to the first movement direction m) and a third movement direction n (parallel to the third direction Y), so as to flow the carrier 1 between the conveyor belt and the process site 101a or flow the carrier 1 between different process sites 101a in the process site group 10a according to requirements.

[0049] In some optional embodiments, as Figure 3 , the process site group 10a can be arranged as multiple groups along the second direction X, and all arranged at the same side of the conveyor belt in the third direction Y, and the cooperation of the first flow transfer member 5 and the second flow transfer member 6 can flow multiple carriers 1 into multiple process sites 101a corresponding to the process site groups 10a respectively, so as to improve the production capacity.

[0050] Optionally, the conveyor belt can further be provided with a buffer process site a4 at the other side in the third direction Y, and the buffer process site a4 is different from multiple process sites 101a in the process site group 10a arranged at the opposite side in that the buffer process site a4 is not provided with a process assembly 2. The buffer process site a4 is used to store the carrier 1 after being processed in the process site group 10a, that is, after the carrier 1 enters the process site group 10a and is processed by multiple process assemblies 2 of the multiple process sites 101a, the second flow transfer member 6 can grab the carrier 1 after being processed and place it in the buffer process site a4, and then wait for the second flow transfer member 6 to grab the carrier 1 after being processed and place it on the conveyor belt, and the conveyor belt can convey the carrier 1 after being processed out.

[0051] Optionally, as Figure 1 、 Figure 2 and Figure 4 , when the sheet process equipment 10 is used in the sheet production line 100, the sheet production line 100 can further include a loading and unloading assembly 20 and a sheet conveying assembly 30, the sheet conveying assembly 30 is arranged on one side of the loading and unloading assembly 20, the sheet conveying assembly 30 is used to input or output the silicon wafer 8, and the loading and unloading assembly 20 is used to load the silicon wafer 8 conveyed by the sheet conveying assembly 30 into the accommodating cavity 1a of the empty carrier 1 carried on the conveying belt and unload the silicon wafer 8 in the carrier 1 conveyed out after the process to the sheet conveying assembly 30. It can be understood that the loading and unloading assembly 20 can be arranged as a mechanical hand capable of rotating by a certain angle, and the mechanical hand can complete the flow between the sheet conveying assembly 30 and the conveying belt by rotating the carrier 1 by a preset clamping angle a. The specific implementation of the mechanical hand loading and unloading the silicon wafer 8 in the accommodating cavity 1a of the carrier 1 is not described in detail.

[0052] Further, as Figure 4 and Figure 5 , the conveying belt can be arranged as a plurality of conveying belts spaced apart along the third direction Y, and a plurality of process position groups 10a and a plurality of buffer process positions a4 are arranged on both sides of each conveying belt. At this time, the second flow transfer member 6 can be arranged as one or a plurality of members to further improve the production capacity.

[0053] In some embodiments, as Figure 6 , the sheet process equipment 10 further includes at least one driving assembly 3 arranged one-to-one in the process position 101a, each process assembly 2 is connected to a driving assembly 3, in the case that the carrier 1 is placed in a process position 101a, the recess 121a of the carrier 1 faces the process member, and the process member and the recess 121a are arranged one-to-one, the driving assembly 3 can drive the process assembly 2 to move, so that at least part of the process member extends into or out of the corresponding recess 121a.

[0054] Optionally, in the case that the carrier 1 is placed in any process position 101a of the process position group 10a, the process position 101a can be provided with a workbench 4, the carrier 1 can be placed on the workbench 4, the driving assembly is arranged on the workbench 4 and connected to the process assembly 2, and the carrier 1 and the process assembly 2 are arranged along the third direction Y.

[0055] Among them, the driving assembly 3 includes a guide rail 31, a sliding block 32 and a driving member 33, the guide rail 31 is arranged on the workbench 4, the guide rail 31 extends along the third direction Y, the sliding block 32 is slidingly connected to the guide rail 31, the process assembly 2 is connected to the sliding block 32, the driving member 33 is arranged on the workbench 4, the driving member 33 is connected with the sliding block 32, and the driving member 33 is configured to drive the sliding block 32 to reciprocate along the fourth movement direction s (also the third direction Y) relative to the guide rail 31.

[0056] Optionally, the driving assembly 3 can also be provided as a pneumatic cylinder, which is mounted on the workbench 4, and the top rod of the pneumatic cylinder extends along the third direction Y and is connected to the process assembly 2, so as to drive the process assembly 2 to reciprocate along the third direction Y. No specific limitation is made.

[0057] In some optional embodiments, the driving assembly 3 can also not be provided on the workbench 4. After the carrier 1 is placed on the workbench 4, the position of the carrier 1 or the process assembly 2 can be manually adjusted by a person to extend or retract the process piece into or out of the recess 121a. No specific limitation is made.

[0058] In some embodiments, as Figures 7 to 12 , the carrier 1 is provided with an inlet 11a and an outlet 11b which are in communication with the accommodation chamber 1a. The inlet 11a is used to communicate with a gas inlet device, and the outlet 11b is used to communicate with a gas extraction device. By communicating the inlet 11a and the outlet 11b with the gas inlet device and the gas extraction device, after the silicon wafer 8 is placed in the accommodation chamber 1a, the accommodation chamber 1a can be vacuumized, and nitrogen or other reaction gas can be introduced into the accommodation chamber 1a through the inlet 11a, so that the oxygen content in the accommodation chamber 1a is reduced, and at the same time, due to the high space occupancy of the silicon wafer 8 in the accommodation chamber 1a, the amount of nitrogen or other reaction gas introduced is reduced, and the gas extraction rate is improved, thereby reducing the cost.

[0059] Optionally, the specific positions of the inlet 11a and the outlet 11b provided on the carrier 1 can be adaptively adjusted according to actual needs. It is emphasized that the inlet 11a can be connected to one or more gas inlet devices through one or more gas inlet pipes 1b, and each gas inlet pipe 1b can be provided with an openable and closable valve 11c to introduce the required type of gas according to the needs; the outlet 11b can be connected to the gas extraction device through the gas outlet pipe 1c, and the gas outlet pipe 1c can be provided with an openable and closable valve 11c to extract gas according to the needs. No detailed description is made.

[0060] As Figure 7 and Figure 9 , the carrier 1 includes a main body 11 and a cover plate 12. The main body 11 is provided with a recess and an opening in communication with the recess. The recess is configured to accommodate a plurality of silicon wafers 8 arranged at intervals. The cover plate 12 is detachably connected to the main body 11 and covers the opening to form the accommodation chamber 1a with the recess. The carrier 1 can be specifically provided as a detachable square box body (as the main body 11) and a cover plate 12 covering the opening of the box body, which is used to take and place the silicon wafers 8.

[0061] Optionally, the opening of the box body can be arranged on the top wall, and after the cover plate 12 is opened, the plurality of silicon wafers 8 can be inserted into the recess in the form of vertical insertion, and at this time, the plurality of silicon wafers 8 are arranged in a certain direction in the horizontal plane. Alternatively, the opening of the box body can be arranged on a side wall, and after the cover plate 12 is opened, the plurality of silicon wafers 8 can be inserted into the recess in the form of horizontal insertion, and at this time, the plurality of silicon wafers 8 are arranged in the vertical direction. In the embodiment of the present disclosure, the horizontal insertion and removal of the silicon wafers into the recess of the box body is taken as an example to describe the specific structure of the carrier 1 in detail.

[0062] Optionally, in the case where the plurality of silicon wafers 8 are inserted into the recess, the plurality of silicon wafers 8 are arranged in the first direction Z, and the first direction Z is also the vertical direction, which will not be emphasized separately in the subsequent description.

[0063] Further, as Figure 9 and Figure 12 The plurality of recesses 121a arranged on the carrier 1 can be arranged on the cover plate 12, so that the side of the cover plate 12 facing the recess forms a plurality of protrusions 121 arranged in the first direction Z. After the plurality of silicon wafers 8 are sequentially inserted into the recess in the first direction Z, the plurality of protrusions 121 are inserted into the gap position between the adjacent silicon wafers 8 correspondingly during the process of covering the opening of the cover plate 12, so that the silicon wafers 8 and the protrusions 121 are arranged alternately in the first direction Z. In the process, as long as the process piece is inserted into the recess 121a correspondingly outside the accommodation chamber 1a, the process piece can be used to process the adjacent silicon wafers 8 respectively, the process distance is shortened, and the plurality of silicon wafers 8 can be processed at the same time, thereby improving the process efficiency and process effect.

[0064] Optionally, the specific size of the recess 121a in the protrusion 121 extending into the gap between the adjacent silicon wafers 8 and communicating with the external environment can be adaptively adjusted according to actual needs. For example, in the case where the silicon wafers 8 are loaded into the carrier 1, the projection of the recess 121a on the silicon wafers 8 in the first direction Z covers at least part of the silicon wafers 8. In the embodiment of the present disclosure, the projection of the recess 121a on the silicon wafers 8 in the first direction Z can substantially cover or completely cover the silicon wafers 8, so that the process piece can extend into the recess 121a more, thereby further improving the process efficiency and process effect. For another example, in the case where the silicon wafers 8 are loaded into the carrier 1, the distance between the two side walls of the recess 121a in the first direction Z is greater than or equal to one-half of the distance between the two adjacent silicon wafers 8, and the thickness of the bottom wall and the side wall enclosed by the recess 121a is as thin as possible, so that the process piece can better pass through the carrier 1 to act on the silicon wafers 8.

[0065] It can be understood that the materials of the main body 11 and the cover plate 12 in the carrier 1 can be set as insulating ceramics, or can be set as metal pieces with electrically conductive and thermally conductive capabilities, and appropriate materials can be selected according to specific processes, which are not specifically limited. In the embodiments of the present disclosure, taking the carrier 1 used in the copper solidification process as an example, the main body 11 can be made of insulating materials such as ceramics, and the cover plate 12 can be made of metal materials. By setting the cover plate 12 as a metal piece, the metal piece surrounding the recess 121a can quickly conduct heat (cold) to the adjacent silicon wafer 8 when the silicon wafer 8 is heated (cooled), thereby further improving the process efficiency.

[0066] Optionally, a sealing piece can be arranged at the matching position of the opening of the main body 11 and the cover plate 12, so as to further improve the sealing effect of the accommodation chamber 1a, and enable the accommodation chamber 1a to always maintain a vacuum state or a working state filled with one or more gases according to requirements.

[0067] The specific structure of the carrier 1 will be described in detail below taking the sheet process equipment 10 in Figure 2 and Figure 5 as an example of a copper solidification equipment used in a copper solidification process.

[0068] It can be understood that in the copper solidification equipment, one or more groups of process site groups 10a can be arranged according to requirements. One group of process site groups 10a can specifically include a preheating process site a1, a heating process site a2, and a cooling process site a3, and can further include a buffer process site a4. The carrier 1 can be arranged as multiple carriers 1. The first flow transfer piece 5 and the second flow transfer piece 6 can enable the multiple carriers 1 to be respectively transferred to different process site groups 10a for processes, and enable the carriers 1 to sequentially pass through the preheating process site a1, the heating process site a2, and the cooling process site a3 to complete solidification in each group of process site groups 10a through the transfer of the second flow transfer piece 6, and then be transferred to the buffer process site a4 for buffering.

[0069] In some embodiments, as Figure 10The main body 11 is further provided with a plurality of groups of air inlet ports 111 and air outlet ports 112 arranged at intervals along the first direction Z, and the air inlet ports 111 and the air outlet ports 112 in each group correspond to each other in the second direction X. The first direction Z and the second direction X intersect. In the case where the carrier 1 carries a plurality of silicon wafers 8, the plurality of silicon wafers 8 divide the accommodation chamber 1a into a plurality of sub-chambers 1d along the first direction Z. Each protrusion 121 corresponds to a sub-chamber 1d into which it extends. Each group of air inlet ports 111 and air outlet ports 112 communicates with a sub-chamber 1d, and the direction from the air inlet port 111 to the air outlet port 112 is parallel to the extension direction of the silicon wafer 8. By providing the air inlet ports 111 and the air outlet ports 112 above each silicon wafer 8 to form a convection, in the one-way circulation process of opening the air inlet device and / or the air exhaust device to continuously introduce gas from the air inlet port 111 and / or exhaust gas from the air exhaust port, the gas introduced from the air inlet port 111 can quickly and uniformly spread the heat (cold gas) carried by the process to the gas position on the surface of the silicon wafer 8, or under the action of the suction force of the air outlet port 112, improve the flowability of the gas in the sub-chamber 1d, so that the gas carries heat (cold gas) to spread to each position of the silicon wafer 8, so that each position of the silicon wafer 8 can be quickly and uniformly heated (cooled), thereby improving the solidification rate and solidification uniformity.

[0070] Specifically, the carrier 1 can further include an air inlet flow channel 113 and an air outlet flow channel 114 arranged on the main body 11. The air inlet flow channel 113 is arranged on the side corresponding to the air inlet port 111, and the air inlet flow channel 113 communicates the inlet 11a with the plurality of air inlet ports 111, respectively. The air outlet flow channel 114 is arranged on the side of the main body 11 corresponding to the air outlet port 112, and the air outlet flow channel 114 communicates the outlet 11b with the plurality of air outlet ports 112, respectively. When the air inlet device and the air exhaust device are opened to introduce nitrogen from the inlet 11a and exhaust nitrogen from the outlet 11b, the nitrogen introduced from the air inlet port 111 can be swept over the surface of the silicon wafer 8 and then exhausted from the air outlet port 112 (as shown by the arrow in the middle of the figure, the direction of gas flow), avoiding the attachment of impurities on the surface of the silicon wafer 8 and affecting the subsequent process. Figure 10

[0071] ​It can be understood that the inlet 11a and the outlet 11b can be arranged at the top of the main body 11, and the gas inlet device and the gas outlet device can be fixedly arranged above the process site 101a. When the carrier 1 is placed on the corresponding process site 101a, the gas inlet device and the gas outlet device can be connected to the inlet 11a and the outlet 11b through the gas inlet pipe 1b and the gas outlet pipe 1c. When it is necessary to move the carrier 1 from the process site 101a, the gas inlet pipe 1b and the gas outlet pipe 1c are disconnected from the inlet 11a and the outlet 11b, and the inlet 11a and the outlet 11b can be kept in a vacuum state by the closed valve 11c, so as to facilitate the movement of the carrier 1 between different process sites 101a. In other examples, the inlet 11a and the outlet 11b can also be arranged at other positions of the carrier 1, and can be adaptively adjusted according to actual needs, without specific limitation.

[0072] Optionally, the size, shape and dimension of the gas inlet 111 and the gas outlet 112 can be the same or different, and can be adaptively adjusted according to actual conditions, without specific limitation. In the embodiment of the present disclosure, the size of the gas inlet 111 and the gas outlet 112 is the same, and both are arranged as a rectangular opening structure. In addition, the specific positions of the gas inlet 111 and the gas outlet 112 in the sub-chamber 1d can be adaptively adjusted according to actual needs. For example, the distance from the gas inlet 111 to the silicon wafer 8 in the first direction Z can be slightly greater than or equal to the distance from the protrusion 121 to the silicon wafer 8 in the vertical direction, so that the orthogonal projection of the gas inlet 111 to the protrusion 121 in the second direction X is located on the protrusion 121. In this way, the gas entering from the gas inlet 111 can be directed to the protrusion 121 after hitting the protrusion 121, so as to carry heat (cold gas) to the silicon wafer 8, thereby further improving the diffusion rate of the hot gas (cold gas) and enabling the silicon wafer 8 to quickly reach the required temperature.

[0073] In some optional embodiments, as Figure 11 The carrier 1 can further include a plurality of first flow uniformizing members (not shown in the figure) and a plurality of second flow uniformizing members 115. The plurality of first flow uniformizing members are respectively arranged at each gas inlet 111, and the first flow uniformizing members are configured to uniformly flow the gas entering from the gas inlet 111 into the sub-chamber 1d. The plurality of second flow uniformizing members 115 are respectively arranged at each gas outlet 112, and the second flow uniformizing members 115 are configured to uniformly extract the gas in the sub-chamber 1d from the gas outlet 112.

[0074] Optionally, the first flow uniformizing member can have a first flow uniformizing cavity, and the first flow uniformizing member is provided with an air inlet hole and a plurality of flow uniformizing air outlet holes on two sides in the second direction X, the air inlet hole is in communication with the air inlet 111, and the plurality of flow uniformizing air outlet holes are uniformly arranged on the side facing the sub-chamber 1d, so that the gas entering from the air inlet 111 is uniformly diffused into the sub-chamber 1d from the plurality of flow uniformizing air outlet holes after being buffered in the first flow uniformizing cavity; the second flow uniformizing member 115 can have a second flow uniformizing cavity, and the second flow uniformizing member 115 is provided with a plurality of flow uniformizing air inlet holes 1151 and an air outlet hole on two sides in the second direction X, the air outlet hole is in communication with the air outlet 112, and the plurality of flow uniformizing air inlet holes 1151 are uniformly arranged on the side facing the sub-chamber 1d, so that the gas in the sub-chamber 1d close to the second flow uniformizing member 115 can be uniformly sucked into the second flow uniformizing cavity by the plurality of flow uniformizing air inlet holes 1151 under the action of the suction force, and then be sucked out from the air outlet 112. The first flow uniformizing member and the second flow uniformizing member 115 are arranged to improve the uniformity and stability of the diffusion of the gas in the sub-chamber 1d, thereby improving the temperature rise (temperature drop) rate and temperature uniformity of each silicon wafer 8 in the carrier 1.

[0075] It can be understood that the first flow uniformizing member and the second flow uniformizing member 115 can also be directly arranged as a flow uniformizing plate structure provided with a plurality of dispersed flow uniformizing holes, without specific limitation.

[0076] In some optional embodiments, as Figure 11 The carrier 1 can further include a plurality of sets of first supporting members 13, the first supporting members 13 are arranged on the main body 11, and the plurality of sets of first supporting members 13 are arranged on the side of the recess opposite to the cover plate 12, the plurality of sets of first supporting members 13 correspond to the plurality of protrusions 121 one by one, and in the case that the cover plate 12 is covered on the opening of the main body 11, the first supporting member 13 and the corresponding protrusion 121 abut to support the protrusion 121.

[0077] For example, the bottom wall of the recess of the main body 11 can be detachably connected with a supporting plate 131, and the supporting plate 131 can be provided with a plurality of clamping grooves 132 arranged along the first direction Z, each clamping groove 132 serving as a first supporting member 13, so that when the cover plate 12 is covered on the opening, the protrusions 121 extend into the accommodating chamber 1a and the edges of the plurality of protrusions 121 are clamped in the corresponding clamping grooves 132, thereby improving the structural stability of the carrier 1. It can be understood that the size and shape of the clamping groove 132 can be matched with the shape and size of the edge of the protrusion 121, without specific limitation.

[0078] Optionally, in addition to the position where the protrusion 121 is clamped in the clamping groove 132, the protrusion 121 has no contact with other parts of the main body 11 and the silicon wafer 8.

[0079] In some optional embodiments, as Figure 10 and Figure 11The carrier 1 can further comprise a plurality of second support members 14 disposed on the main body 11, and the plurality of second support members 14 are disposed on at least one side of the groove, and the plurality of second support members 14 are arranged at intervals along the first direction Z, and each of the plurality of second support members 14 is configured to abut against a silicon wafer 8 to support the silicon wafer 8 when the silicon wafer 8 is placed in the groove.

[0080] Exemplarily, each of the plurality of second support members 14 can comprise a plurality of support protrusions 141 disposed on the bottom wall and the two side walls of the groove, respectively, so that the plurality of support protrusions 141 enclose a plane parallel to the second direction X, and thus the extension direction of the silicon wafer 8 is perpendicular to the vertical direction when the silicon wafer 8 is placed on the plurality of support protrusions 141. It can be understood that the support protrusions 141 can be configured as a structure integrally formed with the main body 11, and the support protrusions 141 can be configured as a square column structure with a cross-sectional area gradually decreasing, and can be adaptively adjusted according to actual needs, without specific limitation. In addition, the number and specific arrangement position of the support protrusions 141 in each of the plurality of second support members 14 can be adaptively adjusted according to the actual specifications of the silicon wafer 8 carried, without specific limitation.

[0081] The specific structure of the process assembly 2 will be introduced below.

[0082] It can be understood that the process assembly 2 can comprise one process member or a plurality of process members arranged at intervals, without specific limitation. For the convenience of understanding, the process assembly 2 will be described below as comprising a plurality of process members arranged at intervals, but is not limited thereto.

[0083] When the carrier 1 carrying the silicon wafer 8 is placed in the heating process station a2, the process assembly 2 located in the heating process station a2 is specifically as follows.

[0084] As shown in Figure 6 , Figure 9 and Figure 13 , the process assembly 2 comprises a first heating assembly 22 movably connected to the heating process station a2, the first heating assembly 22 comprises a first connecting member 221 and a plurality of process members, the process members are first heating members 222, the first connecting member 221 is disposed on the heating process station a2, the first connecting member 221 is connected with the driving assembly 3 disposed on the heating process station a2, and the plurality of first heating members 222 are arranged at intervals along the first direction Z on the first connecting member 221, and the first heating members 222 correspond one-to-one to the recesses 121a when the carrier 1 is placed in the heating process station a2, and the driving assembly 3 can drive the first heating assembly 22 to move so that at least part of the first heating members 222 extend into the corresponding recesses 121a.

[0085] It can be understood that the first heating member 222 can be provided as a heating plate 2221 which can generate heat through a heating wire arranged thereon, or can generate heat through an electrode group 2222 electrically connected, and the adjacent heating plates 2221 are insulated and connected through an insulating member 2223. The specific structure and implementation mode of the first heating member 222 can be adaptively adjusted according to actual needs, and is not specifically limited.

[0086] Optionally, in the case that the heating plate 2221 extends into the recess 121a, the heating plate 2221 can be gap-fitted with the bottom wall and the side wall surrounding the recess 121a respectively, and the heating plate 2221 is not in contact with the cover plate 12.

[0087] Optionally, the process assembly 2 can further include a control member electrically connected with the first heating member 222 respectively, so that after the driving assembly 3 drives the first heating member 222 to extend into the recess 121a of the cover plate 12, the control member can control the first heating member 222 to generate heat, so that the formed heat field is closer to the silicon wafer 8, and it is beneficial for the multiple silicon wafers 8 to be uniformly and quickly heated to the required temperature.

[0088] In some optional embodiments, the control member can control the heating temperatures of the electrically connected first heating members 222 to be the same. Alternatively, the control member can also control the heating temperatures of the electrically connected first heating members 222 to be different. For example, the multiple first heating members 222 can be grouped, each adjacent one or more first heating members 222 serving as a group, the control member is electrically connected with the first heating members 222 of each group respectively, and in the case that the first heating members 222 extend into the recess 121a, the control member is configured to control the heating temperatures of the first heating members 222 of each group to be different, so that the heating temperature of the first heating members 222 in the middle group is lower than that of the first heating members 222 in the two side groups, and finally the temperatures of the silicon wafers 8 in the carrier 1 are consistent.

[0089] In some optional embodiments, the carrier 1 can further include a heat preservation assembly 7 which is detachably connected to the outer side wall of the main body 11 and / or the outer side wall of at least part of the cover plate 12 of the carrier 1, so as to reduce the heat diffusion. It can be understood that the heat preservation assembly 7 is detachably connected to the outer side wall of the main body 11 through an automatic equipment, so that the carrier 1 covers the heat preservation assembly 7 on the outer side wall of the main body 11 at least when the heating process site a2, and the heat preservation assembly 7 can be separated from the carrier 1 at other process sites 101a.

[0090] Optionally, the heat preservation assembly 7 can also be movably connected to the workbench 4 of the heating process station a2, so that when the heat preservation is needed for the carrier 1 placed on the workbench 4, the heat preservation assembly 7 can move towards the carrier 1 to contact the carrier 1; when the heat preservation is not needed for the carrier 1, the heat preservation assembly 7 can move away from the carrier 1 to be out of contact with the carrier 1. The specific setting position and specific implementation mode of the heat preservation assembly 7 can be adaptively adjusted according to actual needs, and are not specifically limited.

[0091] When the carrier 1 carrying the silicon wafer 8 is placed on the preheating process station a1, the process assembly 2 located at the preheating process station a1 is specifically as follows.

[0092] The preheating process station a1 is arranged on one side of the heating process station a2, and the process assembly 2 includes a second heating assembly 21 movably connected to the preheating process station a1. The second heating assembly 21 includes a third connecting piece and a plurality of second heating pieces. The third connecting piece is arranged at the preheating process station a1, and the third connecting piece is connected with the driving assembly 3. The plurality of second heating pieces are arranged at the third connecting piece in the first direction Z and correspond to the recesses 121a one by one when the carrier 1 is placed on the preheating process station a1. The driving assembly 3 can drive the second heating assembly 21 to move so that at least part of the second heating pieces extend into the corresponding recesses 121a.

[0093] It can be understood that the specific structure of the second heating assembly 21 located at the preheating process station a1 is the same as that of the first heating assembly 22, and specific reference can be made to the related description of the first heating assembly 22 in the heating process station a2. The only difference is that the heating temperature of the second heating piece is lower than that of the first heating piece 222, and details are not repeated.

[0094] When the carrier 1 carrying the silicon wafer 8 is placed on the cooling process station a3, the process assembly 2 located at the cooling process station a3 is specifically as follows.

[0095] As shown in Figure 6 , Figure 9 and Figure 14 , the process assembly 2 includes a cooling assembly 23 movably connected to the cooling process station a3. The cooling assembly 23 includes a second connecting piece and a plurality of process pieces. The process pieces are cooling pieces 232. The second connecting piece is arranged at the cooling process station a3, and the second connecting piece is connected with the driving assembly 3. The plurality of cooling pieces 232 are arranged at the second connecting piece in the first direction Z and correspond to the recesses 121a one by one when the carrier 1 is placed on the cooling process station a3. The driving assembly 3 can drive the cooling assembly 23 to move so that at least part of the cooling pieces 232 extend into the corresponding recesses 121a.

[0096] It can be understood that the cooling member 232 can be provided as a cooling plate, and the circulation pipeline 231 can be arranged on the cooling plate. The circulation pipelines 231 on the plurality of cooling plates are communicated and share one water inlet pipe 231a and one water outlet pipe 231b. The water inlet pipe 231a is used to communicate with an external water inlet device, and the water outlet pipe 231b is used to communicate with an external water outlet device, so as to realize water cooling by circulating water.

[0097] Optionally, in the case of extending the cooling plate into the recess 121a, the cooling plate can be gap-fitted with the bottom wall and the side wall surrounding the recess 121a, respectively.

[0098] The embodiments of the present disclosure also provide a sheet production line, such as Figure 1 、 Figure 3 and Figure 4 The sheet production line 100 comprises a sheet process device 10 and a loading and unloading assembly 20. The sheet process device 10 is configured to perform a process on a silicon wafer 8 carried on a carrier 1. The loading and unloading assembly 20 is arranged on at least one side of the sheet process device 10. The loading and unloading assembly 20 is configured to load the carrier 1 carrying the silicon wafer 8 into the sheet process device 10 or unload the carrier 1 from the sheet process device 10.

[0099] Optionally, the specific structure of the sheet process device 10 and the cooperation between the sheet process device 10 and the loading and unloading assembly 20 can refer to the related description of the above-mentioned embodiments, and will not be described here.

[0100] In the embodiments of the present disclosure, if not specifically limited, the form of connection can be detachable connection in the form of bolts and nuts, screws, buckles, magnetic attraction, etc. In some connections, if there is no special requirement for the form of detachable cooperation, it can be connected in a non-detachable manner by welding, bonding, etc.

[0101] The basic principles of the present disclosure are described above in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects, etc. mentioned in the present disclosure are only examples and not limitations, and these advantages, advantages, effects, etc. cannot be considered as the must-have of each embodiment of the present disclosure. In addition, the above specific details are only for the purpose of example and for the purpose of understanding, and are not limited to the above specific details. The present disclosure can be implemented without the above specific details.

[0102] The block diagrams of the devices, devices, equipment, and systems involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0103] It should also be noted that in the apparatus, device, and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.

[0104] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0105] The above description has been provided for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A sheet material processing equipment, characterized in that, include: A carrier having a receiving chamber configured to receive a plurality of spaced sheets, wherein the carrier is provided with a depression concave into the receiving chamber at a position corresponding to a position between each two adjacent sheets; At least one process component is provided, and each process component has at least one process piece, at least a portion of the process piece extends into the corresponding recess, so that the process piece acts on the adjacent sheet.

2. The sheet material processing equipment according to claim 1, characterized in that: The carrier includes: a main body, having a groove and an opening communicating with the groove, wherein the groove is configured to accommodate a plurality of sheets spaced apart along a first direction; a cover plate detachably connected to the main body, the cover plate covering the opening to enclose the groove to form the accommodating chamber, a plurality of recesses being provided on the cover plate such that a plurality of protrusions spaced apart along a first direction are formed on a side of the cover plate facing the groove; In which, the main body is also provided with a plurality of groups of air inlets and air outlets arranged at intervals along the first direction, and the air inlets and the air outlets in each group correspond one to one in the second direction, the first direction and the second direction intersect, and when the carrier carries a plurality of the sheets, the plurality of the sheets divide the accommodating chamber into a plurality of sub-chambers along the first direction, each of the protrusions extends into a corresponding sub-chamber, each group of the air inlets and the air outlets is connected to a sub-chamber, and the direction from the air inlet to the air outlet is parallel to the extension direction of the sheet.

3. The sheet material processing equipment according to claim 2, characterized in that: The vehicle further comprises: a plurality of first flow-uniform members, each provided at each of the air inlets, wherein the first flow-uniform members are configured to uniformly flow the gas entering from the air inlets before entering the sub-chamber; and / or, A plurality of second flow-uniform members are respectively provided at each of the gas outlets, and the second flow-uniform members are configured to allow the gas in the sub-chamber to be uniformly drawn out from the gas outlet.

4. The sheet material processing equipment according to claim 2, characterized in that: The vehicle further comprises: an inlet, disposed on the main body, the inlet being configured to communicate with an air intake device; an intake air duct, provided on a side of the main body corresponding to the air inlet, and connecting the inlet to the plurality of air inlets; an outlet, disposed on the main body, the outlet being configured to communicate with an air extraction device; The outlet flow channel is provided on a side of the main body corresponding to the air outlet, and the outlet flow channel connects the outlet with the plurality of air outlets respectively.

5. The sheet material processing equipment according to claim 2, characterized in that: The vehicle further comprises: multiple groups of first support members are provided on the main body, and the multiple groups of first support members are provided on the side of the groove opposite to the cover plate, the multiple groups of first support members correspond one-to-one to the multiple protrusions, and when the cover plate covers the opening of the main body, the first support members abut against the corresponding protrusions to support the protrusions; and / or, Multiple groups of second support members are arranged on the main body, and multiple groups of second support members are arranged on at least one side of the groove. Multiple groups of second support members are arranged at intervals along the first direction. When the sheet is placed in the groove, each group of second support members is configured to abut against one of the sheets to support the sheet.

6. The sheet material processing equipment according to claim 2, characterized in that: The cover plate is configured as a metal part.

7. The sheet material processing equipment according to any one of claims 1 to 6, characterized in that: The sheet material processing equipment has at least one processing station, and the sheet material processing equipment further comprises: At least one driving component is arranged in a one-to-one correspondence at the process position, and each process component is connected to a driving component. When the carrier is placed at a process position, the recess of the carrier faces the process part, and the process part and the recess are arranged in a one-to-one correspondence. The driving component can drive the process component to move so that at least part of the process part extends into the corresponding recess or extends from the corresponding recess.

8. The sheet material processing equipment according to claim 7, characterized in that: At least one of the process stations is configured as a heating process station, and the process assembly includes a first heating assembly movably connected to the heating process station, wherein the first heating assembly includes: a first connecting member, disposed at the heating process position, the first connecting member being connected to the driving assembly disposed at the heating process position; at least one of the process components, wherein the process component is a first heating component, the first heating components are spaced apart from each other along the first direction on the first connecting component, when the carrier is placed in the heating process position, the first heating components correspond one-to-one with the recesses, and the driving component is capable of driving the first heating component to move so that at least a portion of the first heating component extends into the corresponding recess; and / or, At least one of the process positions is configured as a cooling process position, and the process component includes a cooling component movably connected to the cooling process position, and the cooling component includes: a second connecting member, disposed at the cooling process position, the second connecting member being connected to the driving assembly disposed at the cooling process position; At least one of the process parts is a cooling part, and the cooling part is arranged at intervals on the second connecting part along the first direction. When the carrier is placed in the cooling process position, the cooling part corresponds to the recess one by one, and the driving component can drive the cooling component to move so that at least part of the cooling part extends into the corresponding recess.

9. The sheet material processing equipment according to claim 8, characterized in that: In the case where at least one of the process positions is configured as the heating process position, the number of the first heating elements includes a plurality, and along the first direction, each adjacent one or more first heating elements are grouped as a group, and the first heating assembly further includes: A control member is electrically connected to each group of the first heating members. When the first heating members extend into the recess, the control member is configured to control the heating temperatures of the first heating members of each group to be the same or different.

10. The sheet material processing equipment according to claim 8, characterized in that: In the case where at least one of the process positions is configured as a heating process position, at least one of the process positions is configured as a preheating process position, the preheating process position is arranged on one side of the heating process position, and the process component includes a second heating component movably connected to the preheating process position, and the second heating component includes: a third connecting member, disposed at the preheating process position, wherein the third connecting member is connected to the driving assembly disposed at the preheating process position; At least one second heating element is arranged at intervals on the third connecting member along the first direction. When the carrier is placed in the preheating process position, the second heating element corresponds to the recess one by one. The driving component can drive the second heating component to move so that at least a portion of the second heating element extends into the corresponding recess. The heating temperature of the second heating element is lower than the heating temperature of the first heating element.

11. The sheet material processing equipment according to claim 8, characterized in that: Also includes: At least one heat preservation component is detachably connected to the outer side wall of the carrier at least when the carrier is located in the heating process position.

12. The sheet material processing equipment according to claim 7, characterized in that: When the carrier is placed in one of the process stations, the carrier is arranged on one side of the process component in the third direction, the first direction, the second direction and the third direction intersect each other, the process station is provided with a workbench, the carrier and the drive assembly are located on the workbench, and the drive assembly includes: a guide rail, disposed on the workbench, the guide rail extending along the third direction; A slider, slidably connected to the guide rail, and the process component is connected to the slider; A driving member is provided on the workbench, the driving member is connected to the slider, and the driving member is configured to drive the slider to reciprocate along the third direction relative to the guide rail.

13. The sheet material processing equipment according to claim 7, characterized in that: The number of the process stations includes a plurality, and the sheet material processing equipment further includes: a first transfer member extending along the second direction, the plurality of process stations being disposed on at least one side of the first transfer member in the third direction, the first transfer member being configured to transfer the carrier carrying the sheet to a position corresponding to one of the process stations; The second transfer member is arranged on one side of the first transfer member, and the second transfer member is configured to transfer the carrier carrying the sheet material between different process positions, and is configured to transfer the carrier carrying the sheet material between the first transfer member and the corresponding process position.

14. A sheet production line, characterized in that: include: The sheet material processing equipment according to any one of claims 1 to 13, wherein the sheet material processing equipment is configured to process a sheet material carried on a carrier; A loading and unloading assembly is provided on at least one side of the sheet material processing equipment, and is configured to load the carrier carrying the sheet material to the sheet material processing equipment or unload the sheet material from the sheet material processing equipment.

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