A semiconductor panel level packaging press and control method

Abstract

The application relates to the technical field of semiconductor packaging, and discloses a semiconductor panel-level packaging press and a control method. In order to solve the problems of limited bearing capacity of a single screw rod and excessively high mold closing pressure, lifting screw rod assemblies are arranged at the four corner positions below a lower die holder, the four lifting screw rod assemblies synchronously provide power to the lower die holder, the uniform stress above the lower die holder is ensured, and the mold closing pressure is enhanced. Meanwhile, the mold closing pressure is detected by using the elastic pressure of a pressure measuring spring, when the mold closing pressure is excessively high, an upward switch pressure plate touches a stop switch, the stop switch is used to stop the whole machine from working, the problem of mold damage caused by excessively high mold closing pressure is avoided, and the effects of multi-point pressure application and overpressure mechanical protection are finally achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a semiconductor panel-level packaging press and control method. Background Technology

[0002] Semiconductor packaging presses are key pieces of equipment in the semiconductor packaging process, mainly used for pressing chips against substrates, chip encapsulation, and thermoforming. Their core function is to achieve a high-quality bond between the chip and the packaging material through precise pressure control, thereby ensuring the reliability, electrical performance, and heat dissipation performance of the package.

[0003] A search revealed that publication number CN119092442A discloses a novel press unit and its control method for chip substrate packaging, comprising: a mold clamping linkage assembly on the press unit, including a first linkage, a second linkage, and a third linkage. One end of the first linkage is hinged to the lower mold, one end of the second linkage is hinged to the base, and the other ends of the first and second linkages are hinged together. One end of the third linkage is hinged to the mold clamping nut, and the other end of the third linkage is hinged to the first linkage. In this embodiment, the first, second, and third linkages are symmetrically arranged about the mold clamping screw. Initially, the hinge points of the first and second linkages are located closer to the mold clamping screw. As the lower mold rises, the hinge points of the first and second linkages gradually move away from the mold clamping screw.

[0004] The above analysis reveals that current semiconductor chip molding processes primarily rely on the coordinated movement of a single ball screw and crank pin mechanism to bring the lower mold base closer to the upper mold base, thus completing the chip packaging process. However, in actual operation, this design has revealed some significant problems.

[0005] When the mold closing pressure reaches a certain level, relying solely on a single ball screw to provide the closing force becomes insufficient. Due to the limited load-bearing capacity of a single screw, it often struggles to maintain stable output under high pressure, potentially leading to insufficient closing force and consequently affecting packaging quality and efficiency. More importantly, this design also presents the risk of uneven force distribution. When a single screw moves up and down in conjunction with the crank-pin mechanism, the structural asymmetry and differences in mechanical properties can easily cause uneven forces on the mold during the closing process. This not only accelerates mold wear but may also potentially damage the chip.

[0006] In addition, current pressure detection mechanisms mainly rely on sensors to monitor the clamping force in real time. However, this detection method has significant limitations. Once the sensor malfunctions or is subject to external interference, the detection data may be distorted, leading to uncontrolled clamping force. In extreme cases, the clamping force may be excessive, far exceeding the tolerance of the mold and the chip. This can not only cause serious damage to the mold but also potentially cause devastating damage to the chip, and even lead to the failure of the entire packaging process. Summary of the Invention

[0007] This invention proposes a semiconductor panel-level packaging press and control method, which has the advantages of multi-point pressure application and overpressure mechanical protection, in order to solve the problems of limited single lead screw bearing capacity and abnormally high mold closing pressure mentioned in the background art.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor panel-level packaging press, comprising: a base, on which an upper mold base and a lower mold base are mounted via guide rods; a reducer box, the input end of which is connected to a mold-closing motor, and the output end of which is connected to a lifting screw assembly movably connected to the lower mold base; the mold-closing motor drives the lifting screw assembly via the reducer box to lift the lower mold base to achieve the mold-closing action; a pressure-sensing spring, the bottom end of which is mounted on the guide rod, and the top end which abuts against a pressure sensor, the pressure sensor being used to detect the mold-closing pressure; the pressure sensor determining whether the pressure-sensing spring can be used normally by measuring the pressure change before and after use.

[0009] Furthermore, it also includes: a stop switch, fixed to the bottom of the base; and a switch plate, fixed to the guide rod. The machine stops working when the switch plate contacts the stop switch.

[0010] Furthermore, it also includes: a limiting ring groove, which is formed on the side of the guide rod and located above the switch pressure plate; a detection rod, which is installed on the upper mold base and pressed into the limiting ring groove by the spring force of the detection spring; an adjusting arm, which is fastened to the detection rod by bolts and has an adjusting screw threaded to the bottom; and a wedge-shaped seat, which is installed on the lower mold base and located below the adjusting arm; when the lower mold base moves closer to the upper mold base, the wedge-shaped seat pushes the adjusting screw to disengage the detection rod from the limiting ring groove.

[0011] Furthermore, the detection rod is composed of a cylindrical rod and an elliptical rod connected by coaxial threads.

[0012] Furthermore, the side of the wedge-shaped base is shaped like a right-angled triangle.

[0013] Furthermore, a limit base is fixedly installed on the guide rod, and a support spring is provided between the limit base and the base.

[0014] Furthermore, there are two switch plates, which are located above and below the stop switch, respectively.

[0015] Furthermore, an adjusting spring is provided between the adjusting arm and the end of the detection rod.

[0016] A control method for a semiconductor panel-level packaging press includes the following steps:

[0017] S1. Place the chip to be packaged into the upper mold of the upper mold base, and inject the packaging resin into the lower mold of the lower mold base.

[0018] S2. Start the mold closing motor, which pushes the lower mold base upward through the relevant components; during normal mold closing, the wedge-shaped seat pushes the adjusting screw to disengage the detection rod from the limit ring groove.

[0019] During the mold closing process, the upper mold base and the lower mold base move upward. After the upper mold base contacts the top of the guide rod, the guide rod moves upward and drives the pressure measuring spring. The pressure sensor detects the mold closing strength, and the mold closing motor stops working after the required pressure is reached.

[0020] S3. If the pressure sensor is abnormal, the lower mold base continues to push the upper mold base upward, and the guide rod drives the switch pressure plate to turn on the stop switch, stopping the whole machine from working and preventing excessive mold closing pressure.

[0021] S4. If the mold does not close properly or the mold closing height is abnormal, the detection rod will not disengage from the limit ring groove. When the lower mold base moves further upward, it will drive the guide rod to move directly upward, and the switch pressure plate will contact the stop switch, stopping the whole machine from working and avoiding damage to the mold.

[0022] S5. After the encapsulation is completed, the mold closing motor causes the lower mold base to move downward, and the upper mold base moves downward to the limit position under gravity, and the limit base presses on the support spring.

[0023] The upper mold base drives the detection rod downward to the limiting ring groove, the detection rod inserts into the limiting ring groove, and the device returns to the normal position.

[0024] If the detection rod is not properly inserted into the limit ring groove, the lower mold base will descend and compress the support spring, causing the guide rod to descend further. The switch plate will then contact the stop switch, thus detecting whether the device has been properly reset and ensuring that the equipment can proceed with the next encapsulation.

[0025] A control method for a semiconductor panel-level packaging press, further comprising a control method for adjusting the screw extension length, the steps of which are as follows:

[0026] S1. Loosen the bolts at the top of the adjusting arm, and the adjusting arm will adhere to the upper mold base under the action of the adjusting spring; at the same time, the detection rod will compress the detection spring and disengage from the limiting ring groove under the push of the adjusting spring.

[0027] S2. Start the mold closing motor, which drives the lower mold base to move upward through the lifting screw assembly until the upper mold base touches the top of the guide rod and moves upward synchronously. During this process, the guide rod compresses the pressure measuring spring, and the pressure sensor detects the mold closing pressure. After the required pressure is reached, the mold closing motor stops working and the lifting screw assembly maintains the original height.

[0028] S3. After the mold clamping motor stops, use a wrench to adjust the nut on the adjusting screw to change its extension length. Under the action of the adjusting spring, the adjusting screw always tends to move upward to the mold base. After contacting the inclined surface of the wedge seat, the bottom rests on the inclined surface. By extending or retracting the adjusting screw, it moves along the inclined surface of the wedge seat, thereby driving the adjusting arm to move left and right along the detection rod, adjusting the adjusting screw to the middle of the inclined surface of the wedge seat.

[0029] S4. Tighten the bolts at the top of the adjusted arm to determine the actual extension height of the adjusting screw.

[0030] The present invention has the following beneficial effects:

[0031] This invention provides a semiconductor panel-level packaging press and control method, which features lifting screw assemblies positioned at the four lower corners of the lower mold base. These four lifting screw assemblies do not operate independently but synchronously provide power to the lower mold base. This synchronous drive not only ensures uniform force distribution above the lower mold base, effectively preventing mold wear or chip damage caused by uneven force distribution, but also enhances the mold closing pressure, making the packaging process more stable and reliable.

[0032] Meanwhile, this invention utilizes the elastic pressure of a pressure-sensing spring to sense changes in the mold closing pressure in real time. The pressure-sensing spring is positioned along the pressure transmission path, and its elastic deformation directly reflects the magnitude of the mold closing pressure. When the mold closing pressure is within the normal range, the deformation of the pressure-sensing spring remains stable and will not trigger any protective action. However, if the mold closing pressure becomes abnormally high, the deformation of the pressure-sensing spring will exceed a preset safety threshold, at which point the upward-moving switch plate will touch the stop switch.

[0033] The stop switch, a key protective element of this invention, immediately cuts off the power supply or control signal to the entire machine upon triggering, causing the press to stop working. This rapid and effective mechanical protection mechanism can intervene in time when the mold closing pressure is too high, preventing the mold from being damaged by excessive pressure, thereby ensuring the smooth progress of the packaging process and the service life of the mold. Attached Figure Description

[0034] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0035] The invention will be more clearly understood with reference to the accompanying drawings and the following detailed description, wherein:

[0036] Figure 1 This is a schematic diagram of the overall external three-dimensional structure of the present invention;

[0037] Figure 2 This is a three-dimensional structural diagram of the overall bottom of the present invention and its reducer box;

[0038] Figure 3 This is a schematic diagram of the cross-sectional planar structure of the front part of the present invention;

[0039] Figure 4 for Figure 3 Enlarged structural diagram at point E in the middle;

[0040] Figure 5 for Figure 3 Enlarged structural diagram at point F;

[0041] Figure 6 A schematic diagram showing the position and three-dimensional structure of the detection rod and adjusting arm;

[0042] Figure 7 This is a schematic diagram showing the position and structure of each component on the wedge-shaped base;

[0043] Figure 8 A schematic diagram showing the installation location and three-dimensional structure of the limiting gear rack;

[0044] Figure 9 This is a schematic diagram showing the position and three-dimensional structure of each component on the lower mold base.

[0045] In the diagram: 1. Base; 2. Guide rod; 200. Limiting ring groove; 201. Switch plate; 3. Upper mold base; 4. Lower mold base; 5. Mold closing motor; 500. Reducer box; 6. Lifting screw assembly; 7. Pressure testing spring; 8. Stop switch; 9. Support spring; 10. Limiting base; 11. Wedge-shaped seat; 110. Guide groove; 12. Detection rod; 120. Detection spring; 13. Adjusting arm; 130. Adjusting spring; 14. Adjusting screw; 140. Adjusting ball; 15. Pressure sensor; 16. Adjusting frame; 17. Adjusting rod; 18. Lower mold core; 181. Mold core positioning pressure ring; 182. Limiting groove; 19. Limiting gear row; 191. Anti-reverse gear; 192. Anti-reverse push spring; 20. Electromagnet; 21. Spring push rod; 22. Positioning switch. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Example 1: The semiconductor panel-level packaging press proposed in this application mainly mounts chips, electronic devices, etc., onto a large carrier board (PCB / steel plate / glass) medium. Through molding, the components on the carrier board are encapsulated and protected. From... Figure 1 and Figure 2 As can be seen, the bottom of the base 1 is threaded with multiple screw support components, which can be used to adjust the base 1 to be stably placed in the required position, providing solid support for subsequent chip packaging.

[0048] Guide rods 2 are movably mounted at the four corners of the base 1 surface, and all four guide rods 2 are arranged vertically. The upper mold base 3 and the lower mold base 4 are both mounted on the outside of the guide rods 2. The upper mold base 3 can be fixedly / movably mounted on the guide rods 2. In this embodiment, the upper mold base 3 is mainly fixed on the guide rods 2 and located above the lower mold base 4; the lower mold base 4 can move up and down below the upper mold base 3 according to the guidance of the guide rods 2. More specifically, refer to... Figure 1 and Figure 2 As can be seen, a reducer box 500 is fixedly installed at the bottom of the base 1. The reducer box 500 can be a sprocket, gear, or pulley reducer. The input end of the reducer box 500 is driven by the mold clamping motor 5 fixed on the base 1, and the output end is equipped with a lifting screw assembly 6. The lifting screw assembly 6 mainly consists of a screw and a threaded sleeve. Generally, the screw is fixed on the output shaft of the reducer box 500, and the threaded sleeve is fixed below the lower mold base 4. There are four such drive mechanisms in total, and the number can be increased or decreased according to the actual application requirements. The four lifting screw assemblies 6 are arranged at the four corners of the bottom of the lower mold base 4. The four mold clamping motors 5 are made to work synchronously by the program control, which ultimately ensures that the four reducer boxes 500 drive the four lifting screw assemblies 6 to drive the lower mold base 4 up and down simultaneously.

[0049] Since the upper mold is mainly installed at the bottom of the upper mold base 3 and the lower mold is mainly installed on the surface of the lower mold base 4, when the chip to be packaged is placed between the two, the mold closing motor 5 lifts the lower mold base 4 through the reducer box 500 using the lifting screw assembly 6, so that the lower mold on the lower mold base 4 is attached to the upper mold on the upper mold base 3, thus completing the mold closing work.

[0050] Regarding the control of mold closing force, from Figure 1 , Figure 3 and Figure 4 As can be seen, a pressure-measuring spring 7 is movably installed at the bottom of any one of the guide rods 2, according to... Figure 4 As can be seen, the bottom end of the pressure-sensing spring 7 abuts against the bottom of the guide rod 2, and the top end of the pressure-sensing spring 7 abuts against the ring sleeve fitted on the outside of the guide rod 2. A pressure sensor 15 is fixedly installed on the base 1, abutting against the ring sleeve. The upward force applied to the ring sleeve by the pressure sensor 15 is detected, thereby realizing the detection of the mold closing force. More specifically, the pressure sensor 15 is an FCRF series sensor with a range covering 2000kN–5000kN, and outputs a digital signal for system control.

[0051] In this embodiment, under normal conditions, the guide rod 2 is pushed downward by the elastic force of the pressure measuring spring 7, causing its outer side to abut against the surface of the base 1. Figure 4 As shown, the guide rod 2 has descended to its bottom limit position. Influenced by the elastic force of the pressure-sensing spring 7, the bottom of the guide rod 2 always tends to move downwards. Simultaneously, the top of the pressure-sensing spring 7 is always pressed against the pressure sensor 15 via the ring. Therefore, the pressure detected by the pressure sensor 15 under normal conditions is the initial constant pressure. This pressure can determine whether the pressure-sensing spring 7 and the pressure sensor 15 are damaged. Specifically, with prolonged use, the pressure-sensing spring 7 may experience fatigue, leading to a relative decrease in the strength of the pressure-sensing spring 7 pressing against the ring. By comparing the pressure detected by the pressure sensor 15 with the initial constant pressure, it can be determined whether the pressure-sensing spring 7 is functioning properly.

[0052] During normal operation, the chip to be packaged is placed in the upper mold of the upper mold base 3. Encapsulation resin is injected into the lower mold of the lower mold base 4. The mold closing motor 5, through the reducer box 500, causes the lifting screw assembly 6 to push the lower mold base 4 upward. Once the lower mold on the lower mold base 4 contacts the upper mold of the upper mold base 3, the two complete mold closing. As the lifting screw assembly 6 continues to push upward, the lower mold base 4 pushes the upper mold base 3 upward. At this time, the upper mold base 3 and the guide rod 2 are fixed, causing the guide rod 2 to move upward and further compress the pressure measuring spring 7. The compressed pressure measuring spring 7 can then feed the pressure back to the pressure sensor 15. Based on the pressure sensor 15, the mold closing pressure between the upper mold base 3 and the lower mold base 4 can be accurately determined until the pressure detected by the pressure sensor 15 reaches the required pressure. Thus, the control of the mold closing pressure is completed.

[0053] When used for extended periods, pressure sensor 15 malfunctions, leading to relative data distortion in the output. As described above, when the mold-closing pressure between the upper mold base 3 and the lower mold base 4 increases, the guide rod 2 rises and further compresses the pressure-sensing spring 7. When the data output by pressure sensor 15 is distorted, the actual mold-closing pressure between the lower mold base 4 and the upper mold base 3 may be greater than the detected mold-closing pressure, causing the guide rod 2 to move upwards to a certain extent. Based on this, from... Figure 2 and Figure 3 As can be seen, a stop switch 8 is fixedly installed at the bottom of the base 1, located on one side of the guide rod 2. The stop switch 8 is generally fastened with bolts, and the detachable nature of the bolts allows the actual installation height of the stop switch 8 to be adjusted. Correspondingly, a switch pressure plate 201 is fixedly installed at the bottom of the guide rod 2, located on one side of the stop switch 8. The switch pressure plate 201 is located below the stop switch 8. When the mold closing pressure between the upper mold base 3 and the lower mold base 4 is too high, the upper mold base 3 drives the guide rod 2 to move further upward until the switch pressure plate 201 contacts the stop switch 8 and generates an electrical signal, ultimately stopping the entire press and preventing damage to the mold caused by abnormally high mold closing pressure between the upper mold base 3 and the lower mold base 4.

[0054] Example 2 is a further improvement on Example 1. When the molds on the upper mold base 3 and lower mold base 4 are normally closed, the upper and lower molds should be fitted together, meaning their actual closing height is relatively fixed. However, in actual application, when the upper mold has overlapping material or is not properly installed, this can cause the mold to directly clamp the chip / substrate during the closing process. As the closing strength increases, the chip / substrate can be crushed between the two molds, potentially leading to mold deformation. To prevent such problems, from... Figures 3-6 As can be seen, unlike in Embodiment 1, the upper mold base 3 can move up and down within a certain range outside the guide rod 2, such as... Figure 3 In the indicated state, the upper mold base 3 descends to its bottom limit and is blocked by the outer convex ring of the guide rod 2, preventing it from continuing to descend. Simultaneously, a limiting ring groove 200 is formed on the side of the guide rod 2 located on the side of the stop switch 8, and a detection rod 12, movably arranged using a mounting flange, is located on the outer side of the upper mold base 3. A detection spring 120 is provided between the detection rod 12 and the upper mold base 3. Pushed by the elastic force of the detection spring 120, the top of the detection rod 12 abuts against the limiting ring groove 200; conversely, when the detection rod 12 moves away from the limiting ring groove 200, it retracts into the upper mold base 3 and moves relatively away from the limiting ring groove 200, thereby releasing the restriction on the limiting ring groove 200. Figure 5As can be seen, the upper mold base 3 is provided with a stepped hole. When the detection rod 12 moves to the right and disengages from the limiting ring groove 200, the right end of the detection rod 12 will abut against the stepped hole, preventing the detection rod 12 from moving excessively to the right (the end of the mounting flange can also be inserted into the hole for mounting the detection rod 12 to limit the movement of the detection rod 12 to the right; the actual application can be arranged according to the requirements). Regarding the structural arrangement of the detection rod 12, a cylindrical and elliptical rod are connected by threads. The cylindrical rod serves as the end and abuts against the limiting ring groove 200, while the elliptical rod is fitted onto the mounting flange, thus limiting the detection rod 12 to move only left and right along the radial direction of the guide rod 2.

[0055] The outer side of the elliptical rod of the detection rod 12 has an adjusting arm 13 that is fastened by bolts. Figure 6 As can be seen, the end of the adjusting arm 13 is provided with an elliptical groove. After the adjusting arm 13 is inserted into the detection rod 12, the elliptical groove is tightened by bolts, so that the adjusting arm 13 can be firmly clamped onto the detection rod 12. An adjusting screw 14 is threadedly connected to the bottom of the adjusting arm 13, and an adjusting nut is provided at the bottom of the adjusting screw 14. By turning the nut with a wrench, the adjusting screw 14 can move up and down along the threaded groove at the bottom of the adjusting arm 13. Correspondingly, from... Figure 1 and Figure 3 As can be seen, the lower mold base 4 has a wedge-shaped seat 11 fastened to the outside by bolts. The side of the wedge-shaped seat 11 is a right-angled triangle. When the lower mold base 4 moves closer to the upper mold base 3, the inclined surface of the wedge-shaped seat 11 pushes the adjusting screw 14 away from the guide rod 2, eventually causing the detection rod 12 to disengage from the limiting ring groove 200. However, it should be noted that when the upper mold base 3 and the lower mold base 4 are just closed, since the normal mold closing height will not change, the extension length of the adjusting screw 14 is adjusted to ensure that after the mold is just closed, the inclined surface on the wedge-shaped seat 11 pushes the adjusting screw 14 and moves the detection rod 12 away from the limiting ring groove 200. This ensures that the detection rod 12 separates from the limiting ring groove 200 when the mold is just closed.

[0056] The advantage of this design is that when the lower mold base 4 drives the lower mold to move upward:

[0057] If the mold closes normally, the wedge seat 11 will push the adjusting screw 14 to move to the right, with the direction referenced. Figure 5 The adjusting screw 14 drives the detection rod 12 to move synchronously to the right according to the adjusting arm 13 until the detection rod 12 and the limiting ring groove 200 are completely disengaged.

[0058] When the lower mold base 4 continues to push upward after the mold is closed, both the upper mold base 3 and the lower mold base 4 will move upward along the outer side of the guide rod 2. When the top of the upper mold base 3 contacts the top of the guide rod 2, the top of the guide rod 2 will block the upward movement of the upper mold base 3. By applying pressure to the top of the guide rod 2, the upper mold base 3 compresses the pressure measuring spring 7 due to the upward driving force of the guide rod 2. The pressure measuring spring 7 not only provides shock absorption and buffering for the direct contact between the two, but also increases in compressive strength as the guide rod 2 moves upward and continuously applies pressure to the pressure measuring spring 7, causing the pressure sensor 15 to detect an increase in the mold closing strength.

[0059] Under normal conditions, when the pressure sensor 15 detects the required mold closing pressure, the mold closing motor 5 stops working and maintains the mold closing pressure; however, if the pressure sensor 15 malfunctions, it will cause the lower mold base 4 to push the upper mold base 3 to move further upward. After the guide rod 2 drives the switch pressure plate 201 to move abnormally upward, it will turn on the stop switch 8 and stop the whole machine from working, thereby avoiding excessive mold closing pressure between the lower mold base 4 and the upper mold base 3.

[0060] If material stacking or positioning misalignment occurs between the molds, it will lead to improper mold closing. When the lower mold base 4 moves upward, the mold closing height is relatively higher than the normal height. Therefore, the inclined surface on the wedge seat 11 will not disengage the detection rod 12 from the limit ring groove 200 through the adjusting screw 14. When the lifting screw assembly 6 pushes the lower mold base 4 to move further upward, the lower mold base 4 drives the guide rod 2 on the side of the stop switch 8 to move directly upward through the detection rod 12. When the switch pressure plate 201 moves upward and contacts the stop switch 8, it will directly stop the entire machine from working, avoiding the problem of excessive pressure being applied to the mold when the molds are not properly closed, which could cause damage to the mold.

[0061] Based on the above content, combined with Figure 3 As can be seen, a limiting base 10 is fixedly installed on the guide rod 2 located on one side of the stop switch 8, above the switch plate 201, and the limiting base 10 can move up and down synchronously with the guide rod 2. A support spring 9 located on the outer side of the guide rod 2 is movably installed on the surface of the base 1, and the support spring 9 is located below the limiting base 10. Under normal conditions, the detection rod 12 abuts against the limiting ring groove 200. When the upper mold base 3 reaches its lower limit, it will also prevent the guide rod 2 on the switch plate 201 from moving down. Finally, the limiting base 10 is positioned above the support spring 9.

[0062] When the mold base 4 moves upward to close the mold, the process is the same as described above, and will not be repeated here.

[0063] After encapsulation, the mold clamping motor 5 moves the lower mold base 4 downward via the lifting screw assembly 6. Once the lower mold base 4 releases its upward pushing force on the upper mold base 3, the upper mold base 3 moves downward under gravity until it reaches its downward limit and abuts against the guide rod 2. Simultaneously, the limiting base 10 presses against the support spring 9. At this point, the support spring 9 is not compressed, and its obstruction keeps the guide rod 2 on the limiting base 10 in its normal downward position. When the upper mold base 3 has reached its bottom limit, it will drive the detection rod 12 to move synchronously to the limiting ring groove 200. Pushed by the elastic force of the detection spring 120, the detection rod 12 abuts against the limiting ring groove 200. As the lower mold base 4 continues to descend, it will eventually press against the limiting base 10, pushing the limiting base 10 towards a downward movement. Since the detection rod 12 is inserted into the limiting ring groove 200, when the limiting base 10 drives the guide rod 2 downward, it is restricted by the detection rod 12 and cannot move downward. At the same time, the detection rod 12 also tends to move downward by driving the upper mold base 3, but the upper mold base 3 has already been pressed down to its limit. Therefore, it is blocked by the guide rod 2 on the pressure measuring spring 7, preventing the upper mold base 3 from moving further downward. It can be seen that when the detection rod 12 is inserted into the limiting ring groove 200, the entire device can be restored to its normal position. Furthermore, since the detection rod 12 drives the upper mold base 3 to press the guide rod 2 down to the bottom, when the top of the pressure measuring spring 7 is pressed against the pressure sensor 15 by the ring sleeve, the pressure sensor 15 can detect the spring force of the pressure measuring spring 7 under normal conditions, thereby determining whether the pressure measuring spring 7 is fatigued.

[0064] Similarly, if the detection rod 12 fails to be properly inserted into the limiting ring groove 200, the downward-moving lower mold base 4 will compress the limiting base 10, causing the limiting base 10 to further compress the support spring 9, which in turn will cause the guide rod 2 on the switch plate 201 to move further downward. Figure 3 It can be clearly seen that there are two switch plates 201, which are located above and below the stop switch 8. When the guide rod 2 drives the switch plate 201 to move downward, it eventually contacts the stop switch 8. Therefore, by moving the lower mold base 4 downward, it is possible to detect whether the device has been reset normally, thereby ensuring that the equipment is ready for the next chip packaging.

[0065] In summary, this embodiment 2 utilizes four guide rods 2 to alternately guide and limit the mold base during the upward movement of the lower mold base 4, achieving mold closing between the lower mold base 4 and the upper mold base 3. It also detects whether normal mold closing occurs between the lower mold base 4 and the upper mold base 3, and quickly cuts off the power source in case of abnormal mold closing, preventing extrusion damage to the mold. When the lower mold base 4 moves downward, it detects whether the entire device has performed a normal reset, thereby determining whether the equipment is ready for resealing.

[0066] Example 3 supplements Example 2. Example 2 mentions that "when the mold is just closed, the detection rod 12 separates from the limiting ring groove 200." Since the closing heights of different molds installed on the upper mold base 3 and lower mold base 4 are not consistent, to ensure that the detection rod 12 separates from the limiting ring groove 200 when the mold is just closed, this application proposes a method for determining the length of the adjusting screw 14. Specifically, from... Figure 5 and Figure 6 As can be seen, an adjusting spring 130 is provided between the ends of the adjusting arm 13 and the detection rod 12. The adjusting spring 130 causes the adjusting arm 13 to always tend to move upward towards the mold base 3. When the bolt on the adjusting arm 13 is loosened, the adjusting arm 13 can move along the elliptical rod of the detection rod 12 and abut against the upper mold base 3 under the elastic force of the adjusting spring 130. Moreover, the elastic strength of the adjusting spring 130 is relatively greater than that of the detection spring 120. Therefore, when the adjusting arm 13 abuts against the upper mold base 3, it is restricted by the upper mold base 3 and cannot move. Under the elastic force of the adjusting spring 130, the detection rod 12 compresses the detection spring 120 and finally disengages from the limiting ring groove 200.

[0067] During the specific adjustment, the bolts are loosened from the top of the adjusting arm 13, so that the adjusting arm 13 is attached to the upper mold base 3, and the detection rod 12 is moved away from the limiting ring groove 200.

[0068] Subsequently, the mold closing motor 5 moves the lower mold base 4 upward according to the lifting screw assembly 6. Since the detection rod 12 is no longer inserted into the limiting ring groove 200 at this time, after the mold closing is completed, the lower mold base 4 will continue to push the upper mold base 3 upward until the upper mold base 3 reaches the top of the guide rod 2, and simultaneously drive the guide rod 2 upward. The upward guide rod 2 compresses the pressure measuring spring 7, and the pressure sensor 15 detects the mold closing pressure. When the required mold closing pressure is reached, the mold closing motor 5 stops working and the lifting screw assembly 6 maintains its original height.

[0069] Meanwhile, the nut on the adjusting screw 14 is adjusted using a wrench to adjust the extension length of the adjusting screw 14. As can be seen from the above, since the bolt on the adjusting arm 13 has been loosened, the adjusting screw 14 is forced to move upwards towards the mold base 3 under the force of the adjusting spring 130. Therefore, when the adjusting screw 14 contacts the inclined surface of the wedge-shaped seat 11, the force exerted by the adjusting screw 14 in the upward direction of the mold base 3 will cause the bottom of the adjusting screw 14 to always rest against the inclined surface of the wedge-shaped seat 11. Extending / retracting the adjusting screw 14 will cause it to move along the inclined surface of the wedge-shaped seat 11, which will also cause the adjusting arm 13 to move left and right along the detection rod 12. Generally, adjusting the adjusting screw 14 to the middle of the inclined surface of the wedge-shaped seat 11 is optimal. Finally, the bolt at the top of the adjusted arm 13 is tightened, thus completing the determination of the actual extension height of the adjusting screw 14.

[0070] It can be seen that in this embodiment, the actual extension length of the adjusting screw 14 is determined by the actual mold closing height, which ensures that the detection rod 12 and the limiting ring groove 200 are just separated when the mold is closed.

[0071] Example 4 is a further optimization based on Example 3, from... Figures 7-9 It is clearly visible that a guide groove 110 is provided on the inclined surface of the wedge-shaped base 11. Correspondingly, an adjusting ball 140 is provided at the bottom of the adjusting screw 14. When the upper mold base 3 and the lower mold base 4 are closed, the adjusting ball 140 can enter the guide groove 110 and move along the inclined surface of the wedge-shaped base 11. Unlike embodiment three, in this embodiment four, the wedge-shaped base 11 can move up and down within a certain range along the outer side of the lower mold base 4 using a guide rail frame. Moreover, the wedge-shaped base 11 has an adjusting frame 16 that is bolted to the side, and the adjusting frame 16 always follows the wedge-shaped base 11 in its up-and-down reciprocating movement.

[0072] More detailed, from Figure 8 As can be seen, a limiting gear row 19, guided by a round rod, is located inside the wedge-shaped seat 11 and in the guide groove 110. An anti-reverse push spring 192, located on the outer side of the round rod, is fixedly installed between the limiting gear row 19 and the wedge-shaped seat 11. Driven by the elastic force of the anti-reverse push spring 192, the limiting gear row 19 is forced to always tend to move towards the center of the guide groove 110. Furthermore, an anti-reverse tooth 191 is fixedly provided on the side of the limiting gear row 19 facing the guide groove 110. The shape of the anti-reverse tooth 191 is preferably a right-angled triangle. The advantage of this design is that when the adjusting ball 140 is inserted into the guide groove 110, the elastic force of the anti-reverse push spring 192 forces the anti-reverse tooth 191 to restrict the adjusting ball 140 within the guide groove 110. Combined with the shape of the anti-reverse tooth 191, it has a unidirectional limiting effect. (Direction reference...) Figure 8As shown, when the adjusting ball 140 moves downward along the inclined plane, the extended anti-reverse tooth 191 restricts its downward movement; similarly, when the adjusting ball 140 moves upward along the inclined plane, the inclined plane on the anti-reverse tooth 191 does not affect its upward movement. An electromagnet 20 is fixedly installed in the wedge-shaped seat 11. After the electromagnet 20 is energized and generates magnetism, it will pull the limiting tooth row 19 according to the magnetic force and compress the anti-reverse push spring 192. At this time, the anti-reverse tooth 191 moves in a direction relatively away from the guide groove 110.

[0073] Regarding the arrangement of the lower mold base 4, from Figure 9 As can be seen, the lower mold base 4 has a lower mold core 18 bolted to its surface and a mold core positioning ring 181 movably fitted onto the outer side of the lower mold core 18. The inner side of the mold core positioning ring 181 has grooves for positioning the chip / substrate to be packaged. When the mold core positioning ring 181 is higher than the lower mold core 18, the chip / substrate will also be positioned above the lower mold core 18, facilitating loading and unloading. An adjusting rod 17 is fixedly mounted on the outer side of the mold core positioning ring 181, located above the adjusting frame 16. When the adjusting frame 16 moves upward, it can push the adjusting rod 17 upward synchronously. Furthermore, combined with… Figure 9 It can also be seen that a spring push rod 21 is fixedly installed on the outer side of the lower mold core 18. The spring push rod 21 mainly includes a push rod and a spring. The push rod is pushed by the spring to move to the outer side of the lower mold core 18. Correspondingly, the mold core positioning pressure ring 181 has limit grooves 182 on both the upper and lower sides. Specifically, when the spring push rod 21 abuts against the lower limit groove 182, it can make a certain distance between the chip / substrate and the lower mold core 18, which is convenient for picking up and removing materials; when the spring push rod 21 abuts against the upper limit groove 182, the chip / substrate can be attached to the lower mold core 18, ensuring that the chip / substrate can be properly packaged in the future.

[0074] In practical application of this embodiment four, under normal conditions, the spring push rod 21 abuts against the lower limiting groove 182, forcing the groove on the mold core positioning pressure ring 181 to be positioned above the lower mold core 18, facilitating the loading and positioning of the chip / substrate. When the electromagnet 20 is energized, it generates magnetism on the limiting tooth row 19, forcing the limiting tooth row 19 to pull the anti-reverse tooth 191 relatively away from the guide groove 110.

[0075] If the lower mold core 18 is placed normally, when the lower mold base 4 and the upper mold base 3 are closed, the upper mold base 3 will press the mold core positioning ring 181 downwards, and finally cause the spring push rod 21 to abut in the upper limiting groove 182, placing the chip / substrate on top of the lower mold core 18. Figure 9As can be seen, when the mold core positioning ring 181 moves downward and the spring push rod 21 abuts against the upper limiting groove 182, the bottom of the mold core positioning ring 181 abuts against the positioning switch 22 fixed on the lower mold base 4. After the positioning switch 22 is turned on, it will cut off the power supply to the electromagnet 20. The electromagnet 20 will no longer generate magnetism when de-energized, and the limiting tooth row 19 will be pushed towards the guide groove 110 under the elastic force of the anti-reverse push spring 192. However, at this time, since the upper mold base 3 and the lower mold base 4 are normally closed, the adjusting ball 140 will also abut against the guide groove 110. When the adjusting ball 140 moves along the wedge seat 11, it pulls the detection rod 12 to separate from the limiting ring groove 200 on the guide pull rod 2. After that, according to the description in Embodiment 2, the chip packaging work is completed.

[0076] If the lower mold core 18 is not properly placed and the stacking or improper installation occurs as described in Embodiment 3, when the lower mold base 4 moves upward, the mold core positioning ring 181 and the chip / substrate above it will contact the upper mold base 3 first. When the mold core positioning ring 181 and the chip / substrate are blocked by the upper mold base 3 and move downward, the positioning switch 22 will be activated first. However, at this time, the upper mold base 3 and the lower mold base 4 have not reached the normal mold closing height. The adjusting ball 140 has been inserted into the guide groove 110, but the detection rod 12 cannot be disengaged from the limiting ring groove 200. When the electromagnet 20 is de-energized, the anti-reverse push spring 192 pushes the limiting gear 19 against the adjusting screw 14. More specifically, the shaft on the adjusting screw 14 abuts against the anti-reverse gear 191, and the adjusting ball 140 is located below the anti-reverse gear 191. Restricted by the unidirectional movement of the anti-reverse gear 191, when the lower mold base 4 drives the wedge seat 11 to move upward, the anti-reverse gear 191 prevents the adjusting screw 14 from moving outward, thus maintaining the tendency of the detection rod 12 to always lock the limiting ring groove 200. Finally, as the lower mold base 4 pushes the guide rod 2 upward, the switch plate 201 on the guide rod 2 will compress the stop switch 8, stopping the entire machine from working. This demonstrates that, compared to Embodiment 2, the optimized detection function ensures that the chip / substrate is properly installed even under relatively small clamping forces. Furthermore, in the event of an anomaly, the components on the wedge-shaped base 11 and adjusting screw 14 complete the locking process, preventing over-clamping of the upper mold base 3 and lower mold base 4. This is because the upper mold base 3 itself has a certain weight. The method described in Embodiment 2 only applies to scenarios where the upper mold base 3 is relatively light. However, as production dimensions increase, the size of the upper mold base 3 also increases accordingly, resulting in a greater inherent weight. Therefore, even with a larger and heavier upper mold base 3, the chip / substrate can still be easily damaged.

[0077] Finally, after the chip / substrate is packaged, the lower mold base 4 moves downward. Since the adjusting ball 140 is still below the limiting gear 19, it will pull the adjusting screw 14 downward synchronously according to the obstruction of the limiting gear 19, ensuring that the upper mold base 3 has a certain downward strength to complete the reset action. Afterward, when the detection rod 12 moves to the vicinity of the limiting ring groove 200, the upper mold base 3 can no longer move downward. As the lower mold base 4 continues to move downward, the obstruction of the adjusting ball 140 will cause the limiting gear 19 to drive the wedge seat 11 to also be unable to follow the lower mold base 4 downward. When the wedge seat 11 drives the adjusting frame 16 to move upward relative to the lower mold base 4, the adjusting frame 16 and the adjusting rod 17 contact and push the mold core positioning pressure ring 181 to tend to move upward. When the mold core positioning ring 181 moves upward, it moves away from the stop switch 22. At this time, the stop switch 22 is disconnected, and the electromagnet 20 is delayed and closed by program control (such as a programmable controller). This ensures that when the lower mold base 4 moves upward, the mold core positioning ring 181 moves upward relative to the lower mold core 18 until the spring push rod 21 abuts against the lower limit groove 182. At this time, the mold core positioning ring 181 has reached its limit. When the lower mold base 4 continues to move downward, the mold core positioning ring 181 restricts the movement of the adjustment frame 16 by adjusting rod 17, forcing the adjustment frame 16 to stop moving upward relative to the lower mold core 181. As the lower mold base 4 drives the wedge seat 11 downward, the pressure of the limiting toothed rack 19 pressing on the top of the adjustment ball 140 will further increase. Since the limiting toothed rack 19 is a sphere with an arc surface on its outer side, when the contact pressure between the two increases, the limiting toothed rack 19 will move along its outer arc surface until the limiting toothed rack 19 and the adjustment ball 140 disengage. The lower mold base 4 eventually descends to the bottom, and then the chip / substrate on the mold core positioning ring 181 is removed, thus completing the packaging work.

[0078] In summary, it can be seen that in practical application, the components between the wedge-shaped base 11 and the adjusting screw 14 in this embodiment can detect the pressure on the chip / substrate and the mold closing height, ensuring that the chip / substrate on the mold core positioning ring 181 can be detected to ensure that the chip / substrate is properly placed under low pressure. After packaging, the components between the wedge-shaped base 11 and the adjusting screw 14 make it easy to pick up and drop the chip / substrate on the mold core positioning ring 181, thereby avoiding continuous chip / substrate packaging work.

Claims

1. A semiconductor panel level packaging press, characterized by, The utility model relates to a mould closing device for injection molding machine, including: Base (1), the surface is installed with upper die holder (3) and lower die holder (4) through guide pull rod (2); Reducer box (500), input end is connected with clamping motor (5), and the output end connected lifting screw rod assembly (6) is movably connected with lower die holder (4);Clamping motor (5) drives lifting screw rod assembly (6) through reducer box (500) to lower die holder (4) is lifted to realize the clamping action of the mould closing device; Lifting screw rod assembly (6) has four, four lifting screw rod assembly (6) is arranged in the bottom four corners of lower die holder (4) correspondingly, and program control makes four clamping motors (5) synchronous work, guarantees four reducer boxes (500) make four lifting screw rod assembly (6) simultaneously drive lower die holder (4) up and down; Pressure measuring spring (7), bottom end is installed on guide pull rod (2), top end is resisted to pressure sensor (15), and pressure sensor (15) is used to detect the clamping pressure; Pressure sensor (15) judges whether pressure measuring spring (7) can normally use through the pressure change of pressure measuring spring (7) before and after use; Stop switch (8), fixed in base (1) bottom; Switch pressure plate (201), fixed on guide pull rod (2); When pressure sensor (15) is abnormal, upper die holder (3) drives guide pull rod (2) to go up and makes switch pressure plate (201) contact stop switch (8) to realize the stop working of the whole machine; Limit ring groove (200), open in guide pull rod (2) side and be located above switch pressure plate (201); Detection rod (12), install in upper die holder (3) and be resisted to in limit ring groove (200) by detection spring (120) elastic force; Adjusting arm (13), bolt fastening in detection rod (12), bottom screw thread connection has adjusting screw rod (14); Gou-shaped seat (11), install in lower die holder (4) and be located below adjusting arm (13); When lower die holder (4) is close to upper die holder (3), gou-shaped seat (11) pushes adjusting screw rod (14) to realize detection rod (12) from limit ring groove (200) dissociation.

2. The semiconductor panel level package press of claim 1, wherein, Detection rod (12) is composed of coaxial screw thread connection of cylinder and oval rod.

3. The semiconductor panel level package press of claim 1, wherein, The side of gou-shaped seat (11) is in the shape of a right triangle.

4. The semiconductor panel level package press of claim 1, wherein, Limiting base (10) is fixedly installed on guide pull rod (2), and supporting spring (9) is arranged between limiting base (10) and base (1).

5. The semiconductor panel level packaging press of any of claims 1 or 4, wherein, The number of switch pressure plate (201) is two, and the two switch pressure plates (201) are located at the upper and lower positions of stop switch (8) respectively.

6. The semiconductor panel level package press of claim 4, wherein, Adjusting spring (130) is arranged between the end of adjusting arm (13) and detection rod (12).

7. The semiconductor panel level package press of claim 4, wherein, A guide groove (110) is formed on the inclined surface of gou-shaped seat (11), and the gou-shaped seat (11) can move up and down along the lower die holder (4) by using the guide rail frame, and an adjusting frame (16) is fastened to the side of the gou-shaped seat (11). An adjusting ball (140) is arranged at the bottom of the adjusting screw rod (14). A limiting gear row (19) is movably installed on the inner side of the gou-shaped seat (11), a reverse preventing spring (192) is fixedly installed between the limiting gear row (19) and the gou-shaped seat (11), and a reverse preventing gear (191) is arranged on the side of the limiting gear row (19). The wedge-shaped seat (11) is fixedly installed with an electromagnet (20), and the magnetic force generated by the electrification of the electromagnet (20) pulls the limit gear rack (19) and compresses the anti-reverse spring (192); The lower mold base (4) is fixedly installed with a lower mold core (18) and a mold core positioning compression ring (181) movably sleeved outside the lower mold core (18), the outer side of the mold core positioning compression ring (181) is fixedly installed with an adjusting rod (17) located above the adjusting frame (16), the outer side of the lower mold core (18) is fixedly installed with a spring top rod (21), the inner side of the mold core positioning compression ring (181) is provided with a limiting groove (182) upward and downward, and the spring top rod (21) increases the disengagement resistance between the spring top rod (21) and the limiting groove (182) when the spring top rod (21) abuts against the limiting groove (182); The lower mold base (4) is fixedly installed with a position switch (22) located below the mold core positioning compression ring (181), so that the on-off of the electromagnet (20) is controlled.

8. A method of controlling a semiconductor panel level packaging press according to claim 6, characterized in that, The method comprises the following steps: S1, placing the chip to be packaged into the upper mold of the upper mold base, and injecting the packaging resin into the lower mold of the lower mold base; S2, starting the mold closing motor to drive the lower mold base to move upward through the related components; when the mold is normally closed, the wedge-shaped seat drives the adjusting screw rod to make the detection rod and the limiting ring groove disengage; During the mold closing process, the upper mold base and the lower mold base move upward, after the upper mold base contacts the top of the guide pull rod, the upward driving force of the guide pull rod compresses the pressure measuring spring, the pressure sensor detects the mold closing pressure, and the mold closing motor stops working when the required pressure is reached; S3, if the pressure sensor is abnormal, the lower mold base continues to drive the upper mold base to move upward, the guide pull rod drives the switch pressing plate to make the stop switch be turned on, and the whole machine stops working to prevent the mold closing pressure from being too large; S4, if the mold is not normally closed and the mold closing height is abnormal, the detection rod will not disengage from the limiting ring groove; when the lower mold base further moves upward, the guide pull rod directly moves upward, the switch pressing plate contacts the stop switch, and the whole machine stops working to avoid damage to the mold; S5, after the packaging is completed, the mold closing motor drives the lower mold base to move downward, the upper mold base moves downward to the limit position under the action of gravity, and the limiting base is pressed on the supporting spring; The upper mold base drives the detection rod to move downward to the limiting ring groove, the detection rod is inserted into the limiting ring groove, and the device returns to the normal position; If the detection rod does not normally insert into the limiting ring groove, the lower mold base moves downward to compress the supporting spring, the guide pull rod further moves downward, the switch pressing plate contacts the stop switch, so as to detect whether the device is normally reset, and ensure that the equipment can be used for the next packaging.

9. The method of claim 8, wherein the method further comprises: The method also comprises a control method for the length of the adjusting screw rod (14) being screwed out, and the steps are as follows: S1, the fastening of the adjusting arm top bolt is released, the adjusting arm is attached to the upper mold base under the action of the adjusting spring force; at the same time, the detection rod compresses the detection spring and disengages from the limiting ring groove under the action of the adjusting spring force; S2, the mold closing motor is started, the lower mold base is driven to move upward through the lifting screw assembly, and the upper mold base abuts against the top of the guide pull rod and synchronously drives the guide pull rod to move upward; During the process, the guide pull rod compresses the pressure measuring spring, the mold closing pressure is detected by using the pressure sensor; when the required pressure is reached, the mold closing motor stops working and the lifting screw assembly maintains the original height; S3, after the mold motor stops, adjust the nut on the adjusting screw with a wrench to change its extension length; the adjusting screw always has a tendency to move upward to the mold base under the action of the adjusting spring, and after contacting the inclined surface of the wedge-shaped seat, the bottom is rested on the inclined surface; by adjusting the extension or retraction of the adjusting screw, it moves along the inclined surface of the wedge-shaped seat, and then drives the adjusting arm to move left and right along the detection rod, and adjusts the adjusting screw to the middle of the inclined surface of the wedge-shaped seat; S4, tighten the bolt at the top of the adjusting arm after adjustment to determine the actual extension height of the adjusting screw.

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