Wafer jacking device and wafer processing equipment

Abstract

The invention provides a wafer jacking device and wafer processing equipment, the wafer jacking device comprises an air cylinder, a push plate, an ejector pin, a floating mechanism and a vacuum component, the floating mechanism comprises a connecting piece and a self-adaptive assembly, the connecting piece comprises a first butt joint part connected with the ejector pin, and the self-adaptive assembly comprises a second butt joint part connected with the ejector pin; the second butt joint part is arranged on the push plate, is in butt joint with the first butt joint part in a matched mode and can enable the ejector pin to deflect relative to the push plate, and the self-adaption assembly comprises a plurality of deviation rectifying parts connected with the first butt joint part. According to the invention, each ejector pin can accurately reach a vertical state, and the central axis of the ejector pin can be ensured to coincide with the central axis of the pipe cavity of the corrugated pipe, so that when a wafer is jacked, the wafer is prevented from inclining or deviating due to inconsistent heights of the ejector pins, and the repeated positioning accuracy of the ejection position of the wafer is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and in particular to a wafer lifting device and wafer processing equipment. Background Art

[0002] Wafer support pin components play an important role in multiple key equipment in semiconductor manufacturing, such as deposition equipment and plasma etching equipment.

[0003] In the prior art, the wafer to be processed is transferred to the reaction chamber by a robotic arm, the ejector pins rise to support the wafer to be processed, and then the ejector pins descend to place the wafer to be processed on the electrostatic chuck, ready for processing. The processed wafer is again lifted up by the ejector pins, and then transferred out of the reaction chamber by the robotic arm. In this process, 3 to 4 ejector pins are usually used to lift the wafer. However, in actual use, there is a height difference between the ejector pins. This height difference is caused by the deviation between the central axis connecting the ejector pins and the push plate, such as Figure 1 As shown, this causes the ejector pins to be non-parallel in the vertical direction, resulting in height differences between the pins. This height difference can cause the wafer to tilt or shift, resulting in low repeatability of the wafer ejection position. Furthermore, during the rise and fall of the ejector pins, friction occurs between the ejector pins and the inner hole of the bellows, causing damage to the ejector pins and the bellows. To address the above issues, the present invention proposes a wafer lifting device and wafer processing equipment. Summary of the Invention

[0004] To achieve the above-mentioned objectives, the present invention provides a wafer lifting device, which is specially used for the lifting operation of the wafer, the wafer lifting device includes a cylinder, a push plate, a pin, a floating mechanism, and a vacuum component, the driving end of the cylinder is connected to the push plate, the pin is inserted into the vacuum component, the pin is connected to the push plate through the floating mechanism, and the floating mechanism includes a connecting piece and an adaptive component, the connecting piece includes a first docking portion connected to the pin, and a second docking portion provided on the push plate and matched with the first docking portion and capable of causing the pin to deflect relative to the push plate, the adaptive component includes a plurality of correcting portions connected to the first docking portion, the plurality of correcting portions are arranged in an equidistant ring shape around the central axis of the first docking portion, and the plurality of correcting portions can provide a pushing force toward the central axis of the first docking portion, so as to adjust the posture of the pin through the first docking portion to make it reach a vertical state, and to maintain a safety gap between the pin and the vacuum component.

[0005] Optionally, the push plate is provided with a through mounting hole in the axial direction, the number of the mounting holes matches the number of the ejector pins, the hole wall of the mounting hole extends a step towards the central axis of the mounting hole, the step is arranged close to the cylinder, and the step has a ring structure.

[0006] Optionally, the second connecting part comprises a T-shaped rod, the T-shaped rod has a vertical segment and a horizontal segment connected with each other, the vertical segment of the T-shaped rod is provided with external threads and partially extends into the mounting hole, the horizontal segment of the T-shaped rod is arranged in the mounting hole and abuts against the step, the vertical segment of the T-shaped rod is provided with a nut, the nut abuts against the side of the push plate close to the T-shaped rod, and the side of the T-shaped rod close to the ejector pin is recessed with a swing groove towards the direction of the cylinder.

[0007] Optionally, the first connecting part comprises a central shaft and a swing ball, the central shaft is coaxially connected with the ejector pin, the central shaft is arranged at the end of the ejector pin close to the cylinder, and the central shaft is connected with the deviation correcting part, the swing ball is arranged at the end of the central shaft away from the ejector pin, and the swing ball is movably arranged in the swing groove.

[0008] Optionally, the cavity of the swing groove has a spherical structure, and the diameter of the swing ball is between 2 / 3 and 3 / 4 of the diameter of the cavity of the swing groove, so that the swing ball can swing in the swing groove.

[0009] Optionally, the center of the swing ball is arranged below the center of the cavity of the swing groove, and the opening size of the upper end of the swing groove is smaller than the diameter of the swing ball, so as to prevent the swing ball from being separated from the swing groove.

[0010] Optionally, the self-adapting assembly further comprises a first supporting tube, the first supporting tube is sleeved outside the central shaft, the tube cavity of the first supporting tube is coaxially arranged with the central shaft, the tube cavity of the first supporting tube is communicated with the mounting hole, the first supporting tube abuts against the side of the push plate close to the first supporting tube, the deviation correcting part is arranged in the first supporting tube in an inclined or horizontal manner, and the end of the deviation correcting part away from the central shaft is connected to the inner side wall of the central shaft.

[0011] Optionally, the self-adapting assembly further comprises an extension part, the extension part is arranged between the first supporting tube and the T-shaped rod, the first supporting tube and the T-shaped rod are connected through the extension part, and the extension part is integrally formed or fixedly connected with the first supporting tube and the T-shaped rod.

[0012] Optionally, the self-adapting assembly further comprises a support part, which is arranged between the deviation rectifying part and the central shaft, and the deviation rectifying part and the central shaft are connected through the support part, the support part is wrapped outside the central shaft, and the side of the support part and the central shaft close to each other is in sliding connection, so that the support part moves in the axial direction of the central shaft during the adjustment of the posture of the ejector pin to the vertical state.

[0013] Optionally, the support part is composed of a plurality of arc-shaped plates, and the plurality of arc-shaped plates are arranged in an equidistant ring around the central axis of the central shaft, and the number of the arc-shaped plates is consistent with the number of the deviation rectifying part, wherein the arc of the arc-shaped plate in the circumferential direction of the central shaft is consistent with the arc of the central shaft, so that the arc-shaped plate is closely attached to the central shaft.

[0014] Optionally, the support part is a second support tube, the second support tube comprises a convex section and two straight tube sections, and the two straight tube sections are respectively connected to the opposite ends of the convex section in the axial direction of the central shaft, wherein the cross section of the convex section is in a mountain peak structure, the peak top of the mountain peak rises along the radial direction of the central shaft towards the central axis of the central shaft, and the peak top of the mountain peak abuts against the end of the central shaft close to each other, and the straight tube section and the central shaft have a deviation cavity for the deviation of the central shaft.

[0015] Optionally, the vacuum part comprises a bellows, the ejector pin is arranged in the bellows, the ejector pin is deviated relative to the push plate through a floating mechanism and reaches the vertical state, and the central axis of the ejector pin coincides with the central axis of the lumen of the bellows.

[0016] Optionally, it further comprises a deviation prevention mechanism arranged between the air cylinder and the push plate and used for connecting the air cylinder and the push plate, and a plurality of sensors arranged on the air cylinder, the sensing end of the sensor faces the push plate, a plurality of the sensors are arranged in an equidistant ring around the central axis of the driving end of the air cylinder, and the sensing ends of a plurality of the sensors are in the same plane in the radial direction of the driving end.

[0017] In order to achieve the above-mentioned purpose, the application further provides a wafer processing equipment, which comprises the wafer lifting device and further comprises an electrostatic chuck for mounting the bellows, and the electrostatic chuck is provided with a through hole in communication with the lumen of the bellows.

[0018] The beneficial effects of the application are as follows: The present invention effectively addresses the height discrepancy problem among ejector pins in conventional lifting devices through the adaptive adjustment function of the floating mechanism. Furthermore, the floating mechanism precisely maintains each ejector pin in a vertical position, ensuring that the pin's central axis coincides with the central axis of the vacuum component (i.e., the bellows) during wafer lifting. This prevents wafer tilt or offset due to inconsistent pin heights during wafer lifting, significantly improving the repeatability of wafer ejection. Furthermore, the precise vertical alignment and height consistency of the multiple ejector pins ensure greater wafer stability during lifting and placement, reducing wafer wobbling or jitter caused by inconsistent pin heights, and minimizing processing errors caused by positional deviations during wafer processing, further improving overall wafer processing accuracy. Furthermore, the precise vertical alignment and height consistency of the multiple ejector pins prevents damage to the equipment caused by friction with the bellows. The present invention's rationally designed floating mechanism automatically adjusts the ejector pins to a vertical position, eliminating the need for external manual or electric power source adjustments. This reduces the operational complexity of the device and effectively improves wafer processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 An example of an ejector pin, a push plate, a bellows, and a wafer in a conventional device, with a schematic diagram showing that one of the ejector pins is not in contact with the wafer due to deflection; Figure 2 Schematic diagram of the structure of the first embodiment of the wafer lifting device of the present invention; Figure 3 The wafer lifting device of the present invention Figure 2 A magnified schematic diagram of structure B in the middle; Figure 4 The wafer lifting device of the present invention Figure 3 Schematic diagram of the partial top view structure; Figure 5 The wafer lifting device of the present invention Figure 3 Schematic diagram of the three-dimensional structure of the central axis and the support ring; Figure 6 It is a schematic diagram of the cross-sectional structure of the prior art in which the central axis and the support ring are tilted; Figure 7 This is a schematic structural diagram of the wafer lifting device of the present invention, in which the central axis and the support ring are in a vertical state; Figure 8 The figure is a schematic structural diagram of the anti-deflection mechanism provided between the push plate and the cylinder in the wafer lifting device of the present invention.

[0020] Description of Reference Numerals 1. Cylinder; 2. Push plate; 21. Mounting hole; 22. Step; 3. Floating mechanism; 31. Connector; 311. T-bar; 312. Nut; 313. Swinging groove; 314. Swinging ball; 315. Center axis; 32. Adaptive component; 321. First support tube; 322. Correction part; 323. Support part; 3231. Straight pipe section; 3232. Raised section; 4. Ejector; 5. Vacuum component; 6. Electrostatic suction cup; 7. Deflection chamber; 12. Anti-deflection mechanism; 13. Sensor. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0024] In actual use, the height difference between the ejector pins 100 is due to the deviation between the central axis connecting the ejector pins 100 and the push plate 200, which causes the ejector pins 100 to be non-parallel in the vertical direction, thereby causing the height difference between the ejector pins 100 and causing some of the ejector pins 100 to not contact the wafer 300. Figure 1 shown; in Figure 1 In this example, the leftmost ejector pin 100 is tilted and out of contact with the wafer 300. This height difference not only causes the wafer to tilt or shift during lifting or placement, resulting in low repeatability of the wafer ejection position, but also causes friction between the ejector pin 100 and the inner bore of the bellows 400, causing damage to both. To address the above issues, the present invention provides the following embodiment. Specifically, the wafer lifting device includes a cylinder 1, a push plate 2, an ejector pin 4, a floating mechanism 3, and a vacuum component 5.

[0025] In one embodiment, if Figure 2As shown, the driving end of the cylinder 1 is connected with the push plate 2. In this embodiment, the cylinder 1 is arranged below the push plate 2. The driving end of the cylinder 1 is preferably connected at the center of the lower end surface of the push plate 2, but is not limited to be arranged at the center of the lower end surface of the push plate 2. The advantage of this arrangement is that when the driving end of the cylinder 1 is located at the center of the lower end surface of the push plate 2, the force of the cylinder 1 on the push plate 2 is evenly distributed, so that the push plate 2 maintains good balance and stability during movement, thereby ensuring that the probe 4 can move more accurately in the vertical direction, improving the precision and reliability of the wafer lifting. At the same time, this connection method also provides greater flexibility for the installation and debugging of the equipment, allowing the connection position of the cylinder 1 and the push plate 2 to be adjusted appropriately according to different equipment structures and process requirements in actual application, so as to achieve the best running effect.

[0026] In an embodiment, the push plate 2 is a disc structure, a rectangular structure or a square structure, but is not limited to be a disc structure, a rectangular structure or a square structure. The specific selection can be selected according to the needs of the actual processing process, which will not be described here.

[0027] In an embodiment, the cylinder 1 is installed in the process chamber, and the driving end thereof is connected with the push plate 2 for providing power for the lifting operation of the probe 4. This arrangement makes the entire lifting device integrated in the process chamber, which can effectively reduce the interference of the external environment on the lifting operation and improve the stability and reliability of the wafer processing process. At the same time, installing the cylinder 1 in the process chamber can also optimize the spatial layout of the equipment, making the equipment structure more compact and facilitating maintenance and management. In addition, this design also helps to maintain the cleanliness of the process chamber and avoid affecting the processing quality of the wafer due to external pollution. Of course, in other embodiments, the cylinder 1 is not limited to be installed only in the process chamber.

[0028] In an embodiment, as shown in FIG. 1, the cylinder 1 is arranged below the push plate 2, and the driving end of the cylinder 1 is connected at the center of the lower end surface of the push plate 2. Figure 2 and Figure 3As shown, the top pin 4 is arranged in the vacuum component 5, and the top pin 4 is connected to the push plate 2 through the floating mechanism 3. The vacuum component 5 includes a bellows, and the top pin 4 is arranged in the bellows. The top pin 4 is deflected relative to the push plate 2 through the floating mechanism 3 and reaches a vertical state, and the central axis of the top pin 4 coincides with the central axis of the lumen of the bellows. This design can effectively solve the problem of inconsistent height of the top pin 4 caused by deflection or installation error in the traditional jacking device. Through the self-adaptive adjustment function of the floating mechanism 3, each top pin 4 can accurately reach a vertical state, avoiding the inclination or deviation of the wafer caused by the height difference of the top pin 4 during the jacking process, thereby significantly improving the repeat positioning accuracy of the wafer ejection position. In addition, the coincidence of the central axis of the top pin 4 and the central axis of the bellows can also reduce the friction between the top pin 4 and the inner wall of the bellows during movement, reduce equipment wear, prolong the service life of the equipment, and further improve the overall accuracy and stability of wafer processing.

[0029] In an embodiment, as shown in Figure 2 and Figure 3 The floating mechanism 3 includes a connecting piece 31 and a self-adaptive assembly 32. The connecting piece 31 includes a first interface (not numbered) connected to the top pin 4, and a second interface (not numbered) arranged on the push plate 2 and matched with the first interface, and capable of deflecting the top pin 4 relative to the push plate 2. The self-adaptive assembly 32 includes a plurality of correction parts 322 connected to the first interface. The plurality of correction parts 322 are arranged in an equidistant ring around the central axis of the first interface, and each of the plurality of correction parts 322 can provide a pushing force towards the central axis of the first interface, so as to adjust the posture of the top pin 4 through the first interface to reach a vertical state, and keep a safety gap between the top pin 4 and the vacuum component 5. This embodiment not only ensures the stability of the top pin 4 during wafer jacking, avoids wafer deviation or damage caused by the inclination of the top pin 4, but also keeps a safety gap between the top pin 4 and the vacuum component 5, reduces equipment wear, prolongs the service life, and significantly improves the accuracy and reliability of wafer processing.

[0030] In actual operation, when the top pin 4 has an initial inclination, the correction part 322 will push the first interface to deflect under the action of its own pushing force, and then drive the top pin 4 to deflect and adjust. In an example, when the initial inclination angle of the top pin 4 is 5° (see angle C in Figure 6 the example), the top pin 4 can be adjusted to a vertical state within 0.5 seconds through the adjustment of the correction part 322, and the inclination angle is finally adjusted to less than 0.001° (see angle D in Figure 7The angle D in the example, that is, the first docking part is adjusted to the vertical state. This process significantly improves the accuracy of wafer lifting, ensures that the central axis of the push pin 4 coincides with the central axis of the tube cavity of the bellows, and effectively solves the problem of height difference between the push pins 4.

[0031] In an embodiment, as shown in Figure 2 and Figure 3 The matching docking of the first docking part and the second docking part can cause the push pin 4 to be deflected relative to the push plate 2. In this device, part of the structure is arranged from top to bottom as the push pin 4, the first docking part and the second docking part. Of course, in other embodiments, the positions of the first docking part and the second docking part can be exchanged. In this embodiment, through the matching docking of the first docking part and the second docking part, the position and attitude of the push pin 4 can be flexibly adjusted, so that it can be deflected relative to the push plate 2, thereby realizing accurate positioning and attitude adjustment of the push pin 4, improving the accuracy and reliability of wafer lifting. At the same time, this adjustable position setting provides greater flexibility for the installation and debugging of the device, and adapts to different process requirements and device layouts.

[0032] In an embodiment, as shown in Figure 2 , a safety gap is maintained between the push pin 4 and the vacuum component 5. This safety gap can be understood as a certain distance maintained between the push pin 4 and the inner wall of the vacuum component 5 (such as the bellows) during movement. The purpose of setting this gap is to avoid direct contact or friction between the push pin 4 and the vacuum component 5 during lifting or lowering, thereby reducing equipment wear and extending the service life of the vacuum component 5 and the push pin 4. At the same time, the safety gap can also ensure that the push pin 4 has sufficient freedom when moving, so that it can smoothly reach the vertical state without being limited by the vacuum component 5. In addition, this gap can also prevent wafer tilting or deviation caused by accidental contact between the push pin 4 and the vacuum component 5, further improving the accuracy and reliability of wafer processing.

[0033] In an embodiment, as shown in Figure 2 and Figure 3 , a plurality of said correction parts 322 are arranged in an equidistant ring around the central axis of the first docking part, and a plurality of said correction parts 322 can provide a pushing force towards the central axis of the first docking part. This embodiment can ensure that the push pin 4 is uniformly stressed when adjusting the attitude, thereby realizing omnidirectional accurate adjustment, so that the push pin 4 can quickly and stably reach the vertical state. This not only significantly improves the repeatability of the wafer lifting position, reduces the wafer deviation or damage caused by the inclination of the push pin 4, but also reduces the friction between the push pin 4 and the vacuum component 5, prolongs the service life of the device, enhances the adaptability and flexibility of the device, and makes it better meet the requirements of high-precision wafer processing.

[0034] In one embodiment, if Figure 4 As shown, the number of the correcting portions 322 is set to 8. The 8 correcting portions 322 are arranged in a ring shape at equal distances around the central axis of the first docking portion. Of course, in other embodiments, the number of the correcting portions 322 is not limited to 8, and can also be set to 3, 4, 5, 6, 7, 9, or 10. Of course, it is not limited to only 3, 4, 5, 6, 7, 9, or 10, which will not be repeated here.

[0035] In one embodiment, the correction part 322 is a spring. The advantage of using a spring is that the spring can provide a stable and adjustable elastic force, which can be automatically adjusted according to the degree of deviation of the ejector pin 4, thereby achieving a precise correction function. The elastic characteristics of the spring enable the ejector pin 4 to smoothly return to a vertical state during movement, avoiding damage to the ejector pin 4 or the wafer due to sudden force. In addition, the spring has a simple structure, low cost, and is easy to maintain. It can maintain stable performance during long-term operation, reducing the maintenance cost and downtime of the equipment. At the same time, the elastic force of the spring can also absorb certain vibrations and shocks, further improving the stability and reliability of the equipment operation, and ensuring high precision and high quality of the wafer processing process.

[0036] Of course, in other embodiments, the correction part 322 is not limited to springs, and other components that can provide stable driving force or correction force can also be used, such as hydraulic cylinders, pneumatic cylinders, magnetic devices or electric push rods. These alternative components can be selected according to the specific process requirements and equipment operating environment to achieve more precise control, higher adjustment accuracy or faster response speed. For example, hydraulic cylinders and pneumatic cylinders can provide greater driving force, which is suitable for scenarios that require rapid adjustment or carrying heavier ejectors 4; magnetic devices can achieve correction without contact and reduce mechanical wear; and electric push rods can achieve precise electronic control, which is easy to integrate into automation systems. These diverse options provide greater flexibility for the design and optimization of equipment to meet the specific needs of different application scenarios.

[0037] In one embodiment, if Figure 2 and Figure 3 As shown, the push plate 2 is provided with an axially extending mounting hole 21. The number of mounting holes 21 matches the number of ejector pins 4. It can be understood that when the number of ejector pins 4 is three, four, or more, the number of mounting holes 21 is also three, four, or more. A step 22 extends from the wall of the mounting hole 21 toward the central axis of the mounting hole 21. The step 22 is located near the cylinder 1, and can be understood as being located near the lower edge of the mounting hole 21.

[0038] In one embodiment, the step 22 is an annular structure. Of course, this is not limited to an annular structure. For example, it can be a plurality of horizontally placed strip-shaped plate structures, which are arranged in an annular shape at equal distances around the central axis of the mounting hole 21. The plurality of strip-shaped plate structures form an annular structure, which will not be described in detail here.

[0039] In one embodiment, if Figure 2 and Figure 3 As shown, the second docking portion includes a T-shaped rod 311, which has a vertical section and a horizontal section connected to each other. The vertical section of the T-shaped rod 311 is provided with an external thread and partially extends into the mounting hole 21. The horizontal section of the T-shaped rod 311 is provided in the mounting hole 21 and abuts against the step 22. The vertical section of the T-shaped rod 311 is externally threaded and provided with a nut 312, which abuts against the side close to the push plate 2, wherein the side of the T-shaped rod 311 close to the ejector pin 4 is recessed into a swing groove 313 toward the direction of the cylinder 1.

[0040] In this embodiment, the second docking portion utilizes a T-bar 311 design, wherein the vertical section of the T-bar 311 is provided with external threads and partially extends into the mounting hole 21, while the transverse section abuts against the step 22 within the mounting hole 21 and is secured to the push plate 2 via a nut 312. The design of the T-bar 311 provides a stable and adjustable connection method, ensuring the secure installation of the T-bar 311 on the push plate 2 while allowing the position of the T-bar 311 to be fine-tuned by tightening the nut 312, thereby achieving precise control of the position of the ejector pin 4. Furthermore, the swing groove 313 design of the T-bar 311 on the side of the ejector pin 4 provides the necessary swing space for the ejector pin 4, allowing the ejector pin 4 to be adjusted skewed under the action of the floating mechanism 3, ultimately reaching a vertical position. This structure not only improves the flexibility and precision of the adjustment of the ejector pin 4, but also enhances the overall stability and reliability of the equipment, providing a strong guarantee for the precise lifting of the wafer.

[0041] In operation, the outer threaded portion of the vertical segment of the T-shaped rod 311 extends into the mounting hole 21 of the push plate 2, and is abutted with the push plate 2 by screwing the nut 312, so as to realize the fixation of the T-shaped rod 311 on the push plate 2. This threaded connection mode not only provides stable mechanical connection, but also allows the position of the T-shaped rod 311 to be finely adjusted by adjusting the screwing degree of the nut 312, so as to realize the accurate control of the position of the ejector pin 4. The horizontal segment of the T-shaped rod 311 is abutted against the step 22 in the mounting hole 21, so as to further enhance the stability of the connection. In addition, the swing groove 313 on the side of the T-shaped rod 311 close to the ejector pin 4 provides the necessary swing space for the ejector pin 4. When the ejector pin 4 needs to be adjusted in posture, the deviation rectifying part 322 (such as a spring) in the floating mechanism 3 will exert a force to make the ejector pin 4 deviate through the swing groove 313 until it reaches the vertical state. This design enables the ejector pin 4 to flexibly adjust the posture under the action of the floating mechanism 3, while maintaining stable connection with the push plate 2, ensuring the stability and precision of the ejector pin 4 during the lifting of the wafer, and effectively avoiding the deviation or damage of the wafer due to the inclination of the ejector pin 4.

[0042] In an embodiment, as shown in Figure 2 and Figure 3 , the vertical segment and the horizontal segment of the T-shaped rod 311 can be fixed by welding or integrally formed. Of course, it is not limited to being fixed by welding or integrally formed. The vertical segment is vertically arranged, and the horizontal segment is horizontally arranged.

[0043] In an embodiment, the second abutting part can also be integrally formed with the push plate 2, which can be understood as that the T-shaped rod 311 is integrally formed with the push plate 2.

[0044] In an embodiment, as shown in Figure 2 , the horizontal segment of the T-shaped rod 311 is abutted against the side close to the mounting hole 21, which ensures the stability and positioning accuracy of the T-shaped rod 311 in the mounting hole 21. Through the close contact between the horizontal segment and the inner wall of the mounting hole 21, the T-shaped rod 311 can withstand the lateral force from the ejector pin 4 and the reaction force from the push plate 2, so as to maintain the stability of the structure during the posture adjustment and movement of the ejector pin 4. This close abutting relationship not only enhances the rigidity of the entire floating mechanism 3, but also reduces the vibration and error caused by looseness or gap, further improving the reliability and repeat positioning accuracy of the wafer lifting device.

[0045] In an embodiment, as shown in Figure 2As shown, the first interface part includes a central shaft 315 and a swing ball 314, the central shaft 315 is coaxially connected with the ejector pin 4, the central shaft 315 is arranged at one end of the ejector pin 4 close to the air cylinder 1, and the central shaft 315 is connected with the deviation rectifying part 322, the swing ball 314 is arranged at one end of the central shaft 315 away from the ejector pin 4, and the swing ball 314 is movably arranged in the swing groove 313.

[0046] The embodiment provides a flexible movement joint for the ejector pin 4, so that the ejector pin 4 can be adjusted in multiple directions under the action of the floating mechanism 3. The activity of the swing ball 314 in the swing groove 313 allows the ejector pin 4 to freely swing to a vertical state when subjected to the pushing force of the deviation rectifying part 322, thereby ensuring that the central axis of the ejector pin 4 is accurately coincided with the central axis of the lumen of the bellows. This design not only improves the flexibility and accuracy of the posture adjustment of the ejector pin 4, but also reduces the wafer offset or damage caused by the deflection of the ejector pin 4, significantly improving the reliability and repeat positioning accuracy of the wafer lifting device.

[0047] In an embodiment, as shown in Figure 2 and Figure 3 , the central shaft 315, the swing ball 314, the ejector pin 4 and the T-shaped rod 311 are coaxially arranged, which can be understood as that the central axis of the central shaft 315, the center of the swing ball 314, the central axis of the ejector pin 4 and the central axis of the T-shaped rod 311 are on the same vertical line. The arrangement of this embodiment can ensure that the ejector pin 4 always maintains accurate alignment with the central shaft 315 and the push plate 2 during movement. This coaxial design allows the ejector pin 4 to be uniformly adjusted in deflection under the action of the floating mechanism 3, thereby achieving precise vertical posture control. At the same time, the coaxial arrangement reduces vibration and stress concentration caused by eccentricity, improves the stability and reliability of the entire device, further ensures the accurate position and repeat positioning accuracy of the wafer during lifting, and reduces the risk of wafer damage caused by the deflection of the ejector pin 4.

[0048] In an embodiment, the swing ball 314 belongs to the first interface part, and the swing groove 313 belongs to the second interface part. The swing ball 314 is movably arranged in the swing groove 313 to achieve the deflection effect. Of course, in other embodiments, the swing ball 314 can belong to the second interface part, and the swing groove 313 can belong to the first interface part. The advantage of such arrangement is to provide flexibility in design and implementation, allowing engineers to choose the most suitable configuration method according to the specific equipment structure and process requirements. This flexibility not only simplifies the installation and debugging process, but also adapts to different mechanical layouts and movement requirements, ensuring that the ejector pin 4 can achieve accurate positioning and stable movement in various situations, thereby improving the adaptability and reliability of the entire wafer lifting device.

[0049] In one embodiment, the swing ball 314 and the swing groove 313 are not the only applicable structures, as long as they can achieve the flexible adjustment of the probe 4 under the action of the floating mechanism 3 and ensure that the probe 4 can accurately reach the vertical state. For example, other shapes of matching structures can be used, such as an oval swing member and a corresponding oval groove, or a polygonal matching structure, as long as these structures can ensure the movement accuracy of the probe 4 while providing sufficient degrees of freedom to adapt to the attitude adjustment needs of the probe 4. In addition, magnetic or elastic materials can also be considered to achieve similar deflection effects, guiding the probe 4 to reach the vertical state through magnetic or elastic force. The flexibility of this design provides engineers with more options to meet specific needs in different application scenarios, while also helping to optimize the performance and cost-effectiveness of the equipment.

[0050] In one embodiment, as shown in Figure 2 and Figure 3 , the cavity of the swing groove 313 is in a spherical structure, and the diameter of the swing ball 314 is between 2 / 3 and 3 / 4 of the diameter of the cavity of the swing groove 313, so that the swing ball 314 can swing in the swing groove 313. The arrangement of this embodiment can ensure that the swing ball 314 has enough space to swing flexibly in the swing groove 313, while avoiding excessive shaking between the swing ball 314 and the groove wall. This design not only ensures that the probe 4 can be quickly and accurately adjusted to the vertical state under the action of the floating mechanism 3, but also reduces mechanical wear caused by friction between the swing ball 314 and the groove wall, thereby improving the stability and service life of the equipment, further ensuring the high precision and reliability of the wafer lifting process.

[0051] In one embodiment, as shown in Figure 3 , the center of the swing ball 314 is located below the center of the cavity of the swing groove 313, and the upper end opening size of the swing groove 313 is smaller than the diameter of the swing ball 314, to prevent the swing ball 314 from escaping from the swing groove 313. This embodiment limits the movement range of the swing ball 314 through physical structure, ensuring its stable movement in the swing groove 313, thereby ensuring the reliability and stability of the probe 4 during attitude adjustment under the action of the floating mechanism 3. At the same time, this structural design simplifies the locking mechanism of the device, without the need for additional fixing components to achieve stable constraint of the swing ball 314, improving the overall compactness and ease of operation of the device, further enhancing the stability and reliability of the wafer lifting device in practical applications.

[0052] In one embodiment, as shown in Figure 3As shown, the adaptive assembly 32 further comprises a first support tube 321, which is sleeved outside the central shaft 315 and has a lumen coaxially arranged with the central shaft 315, the lumen of the first support tube 321 communicates with the mounting hole 21, and the first support tube 321 abuts against the side close to the push plate 2. The deviation rectifying part 322 is obliquely or horizontally arranged in the first support tube 321, and the end away from the central shaft 315 is connected to the inner side wall of the central shaft 315.

[0053] This embodiment provides stable support and guidance for the deviation rectifying part 322 through the first support tube 321, ensuring that the deviation rectifying part 322 can accurately exert a pushing force, so that the stylus 4 can flexibly and stably adjust the posture. At the same time, this structure enhances the rigidity and stability of the entire floating mechanism 3, reduces the deviation caused by external force or vibration, and improves the reliability and repeat positioning accuracy of the wafer lifting device. In addition, the design of the first support tube 321 also facilitates the installation and maintenance of the deviation rectifying part 322, further improving the practicality and maintainability of the equipment.

[0054] In an embodiment, as shown in Figure 3 The central axis of the lumen of the first support tube 321 and the central axis of the hole cavity of the mounting hole 21 are arranged on the same vertical line, that is, the first support tube 321 is arranged directly above the mounting hole 21.

[0055] In an embodiment, the deviation rectifying part 322 is horizontally arranged, specifically, the deviation rectifying part 322 is arranged along the radial direction of the central shaft 315. The arrangement of this embodiment enables the deviation rectifying part 322 to directly act on the radial direction of the central shaft 315, so that when the stylus 4 needs to adjust the posture, the deviation rectifying force can be quickly and uniformly exerted, ensuring that the deviation of the stylus 4 in the horizontal direction is more accurate and stable. The radially arranged deviation rectifying part 322 can effectively reduce the wafer tilt or deviation caused by the stylus 4 deviation, significantly improve the repeat positioning accuracy and reliability of the wafer lifting device, and at the same time simplify the design of the floating mechanism 3, reduce the manufacturing cost and maintenance difficulty.

[0056] In an embodiment, as shown in Figure 3As shown, the deviation rectifying part 322 is inclined upward, specifically, the deviation rectifying part 322 is inclined upward from the inner side wall of the first support pipe 321 to the central shaft 315, which design makes the deviation rectifying part 322 not only provide radial deviation rectifying force, but also generate an upward component force in the vertical direction. This upward component force helps the ejector pin 4 reach the vertical state faster under the action of the floating mechanism 3, and also provides certain support when the ejector pin 4 is subjected to downward external force, reducing the sagging or deformation of the ejector pin 4. The inclined deviation rectifying part 322 not only improves the efficiency and accuracy of the posture adjustment of the ejector pin 4, but also enhances the stability and reliability of the entire floating mechanism 3, and is particularly suitable for wafer lifting operations that require fast response and high precision adjustment.

[0057] In an embodiment, the lumen of the first support pipe 321 is in a columnar structure, which design makes the internal space of the lumen uniform and regular, providing stable support and guidance for the deviation rectifying part 322. The columnar structure of the lumen can ensure that the deviation rectifying part 322 always remains on the predetermined track during movement, reducing movement errors caused by structural deformation or irregular inner walls. In addition, the columnar structure of the lumen also facilitates processing and manufacturing, which can ensure high processing precision and consistency, thereby improving the reliability and repeatability of the entire floating mechanism 3. This design not only simplifies the manufacturing process and reduces production costs, but also enhances the stability and durability of the equipment during long-term operation.

[0058] In an embodiment, as shown in Figure 3 The inner side wall of the first support pipe 321 is inclined, so that the inner cavity of the first support pipe 321 is in a trumpet structure, as shown in Figure 3 The inner side wall of the first support pipe 321 is perpendicular to the spring, which is designed to prevent damage to the equipment caused by shear force when inclined, and also to enable the spring to provide sufficient elastic force. Of course, the spring can also be arranged not perpendicular to the inner side wall of the first support pipe 321, as long as it can provide the ejector pin 4 with the ability to swing to the vertical state, which will not be described here.

[0059] In an embodiment, as shown in Figure 3 The adaptive assembly 32 further comprises an extension part, which is arranged between the first support pipe 321 and the T-shaped rod 311, and the first support pipe 321 and the T-shaped rod 311 are connected through the extension part, and the extension part is integrally formed or fixedly connected with the first support pipe 321 and the T-shaped rod 311.

[0060] In this embodiment, the extension part is used to connect the first support pipe 321 and the T-shaped rod 311, which enhances the structural stability of the entire floating mechanism 3 and ensures the firmness and reliability of the connection between the first support pipe 321 and the T-shaped rod 311. Through the connection of the extension part, stress can be effectively transmitted and dispersed, reducing structural damage caused by local stress concentration. In addition, the connection mode (whether through integral molding or fixed connection) of the extension part with the first support pipe 321 and the T-shaped rod 311 improves the assembly precision and stability of the entire device, simplifies the installation and maintenance process, and thus improves the overall performance and service life of the equipment.

[0061] In one embodiment, as shown in Figure 3 the extension part is a tubular structure, and the upper end of the tubular structure is connected with the first support pipe 321, and the lower end is connected with the upper end of the T-shaped rod 311. In this embodiment, the lumen of the extension part and the lumen of the first support pipe 321 are in communication with each other.

[0062] In one embodiment, the extension part is a plurality of vertical plates, and the plurality of vertical plates are arranged in a ring around the central axis of the lumen of the first support pipe 321 at equal distances. The upper end of the vertical plate is connected to the lower end surface of the first support pipe 321, and the lower end of the vertical plate is fixedly connected to the upper end of the T-shaped rod 311. For example, the number of vertical plates can be 3, 4, 5, 6, 7, or 8, but not limited to 3, 4, 5, 6, 7, or 8. Here, it is not repeated.

[0063] In one embodiment, as shown in Figure 3 and Figure 5 the adaptive assembly 32 further includes a support part 323, which is arranged between the deviation correcting part 322 and the central shaft 315, and the deviation correcting part 322 and the central shaft 315 are connected through the support part 323. The support part 323 is wrapped outside the central shaft 315, and the side close to each other of the support part 323 and the central shaft 315 is slidingly connected, so as to make the support part 323 move in the axial direction of the central shaft 315 in the process of adjusting the posture of the top pin 4 to the vertical state.

[0064] In this embodiment, the adaptive component 32 cleverly connects the correction portion 322 and the central axis 315 by introducing a support portion 323, and the support portion 323 is wrapped around the outside of the central axis 315, while forming a sliding connection with the central axis 315. This design not only provides a stable intermediate support for the posture adjustment of the ejector pin 4, ensuring that the ejector pin 4 can accurately reach a vertical state under the action of the floating mechanism 3, but also allows the ejector pin 4 to flexibly move in the axial direction of the central axis 315 to adapt to different offset conditions. This integrated adaptive component 32 significantly improves the flexibility and accuracy of the adjustment of the ejector pin 4, enhances the stability and reliability of the entire floating mechanism 3, and ensures the high precision and high reliability of the wafer lifting device in actual applications, thereby effectively avoiding the offset or damage of the wafer due to the incorrect posture of the ejector pin 4 during the lifting process, thereby improving the overall quality and efficiency of wafer processing.

[0065] In one embodiment, if Figure 3 As shown, the support portion 323 is composed of a plurality of arc-shaped plates, and the plurality of arc-shaped plates are arranged in an equidistant ring around the central axis of the central shaft 315, and the number of the arc-shaped plates is consistent with the number of the correcting portions 322, wherein the curvature of the arc-shaped plates in the circumferential direction of the central shaft 315 is consistent with the circumferential curvature of the central shaft 315, so that the arc-shaped plates are tightly fitted to the central shaft 315.

[0066] This embodiment ensures that ejector pin 4 is evenly stressed during posture adjustment. Each curved plate effectively transmits the propulsion force from the deflection-correcting unit 322, enabling ejector pin 4 to quickly and accurately achieve a vertical position. This structural design also enhances the stability and reliability of the entire floating mechanism 3, reducing mechanical wear caused by localized stress concentration and extending the device's service life. Furthermore, the equally spaced, annular curved plates provide all-around support for ejector pin 4, further improving its stability and precision during movement and ensuring reliable operation of the wafer lifting device under high-precision requirements.

[0067] In one embodiment, the curved plate has a fan-shaped structure, and its circumferential curvature matches the axial curvature of the central shaft 315. This design allows the curved plate to more closely conform to the outer surface of the central shaft 315. Because the fan-shaped curved plate's circumferential curvature matches that of the central shaft 315, it better adapts to the circular contour of the central shaft 315, providing more uniform and stable support for the ejector pin 4 during position adjustment. This close fit not only improves the stability and precision of the ejector pin 4 during movement, but also reduces vibration and error caused by structural clearance, further enhancing the reliability and repeatability of the entire floating mechanism 3.

[0068] Further, each arc-shaped plate is in surface-to-surface fitting with the central shaft 315, which not only increases the contact area and disperses the stress, but also, through the uniform force of each spring, enables the central shaft 315 to obtain symmetrical and stable restoring force when it is offset in any direction, so as to recover to the vertical state more quickly and accurately, and improve the self-adaptive centering accuracy and reliability of the ejector pin 4.

[0069] In an embodiment, as shown in Figure 5 , Figure 6 and Figure 7 , the support part 323 is a second support tube, which comprises a convex section 3232 and two straight tube sections 3231 connected to opposite ends of the convex section 3232 in the axial direction of the central shaft 315, wherein the cross section of the convex section 3232 is in the shape of a mountain peak, the peak top of the mountain peak protrudes in the radial direction of the central shaft 315 towards the central axis of the central shaft 315, and the peak top of the mountain peak is in abutment with one end of the central shaft 315 close to each other, and the straight tube section 3231 and the central shaft 315 have a deflection cavity 7 for the deflection of the central shaft 315.

[0070] In this embodiment, the support part 323 is in the overall tubular structure: the middle section is the convex section 3232 in the shape of a mountain peak, the peak top of which protrudes in the radial direction towards the central shaft 315; the upper and lower ends are straight tube sections 3231, and the straight tube section 3231 and the central shaft 315 leave a deflection cavity 7. This design not only provides sufficient swing margin for the central shaft 315, but also forms point and line contact support with the peak top, so that the central shaft 315 can obtain stable and low-friction restoring force in any direction, thereby ensuring that the ejector pin 4 quickly and reliably recovers to the vertical state.

[0071] In an embodiment, the mountain peak is in the ring structure, and the peak top of the mountain peak is in the round head structure, and the peak top of the mountain peak is in abutment with the central shaft 315. The purpose of this arrangement is to provide more convenient support force for the swing of the central shaft 315, and at the same time, to avoid excessive wear at the contact between the ejector pin 4 and the mountain peak during the swing, thereby prolonging the service life of the equipment.

[0072] In an embodiment, as shown in Figure 8 , the wafer lifting device further comprises a deflection prevention mechanism 12 arranged between the air cylinder 1 and the push plate 2 and used for connecting the air cylinder 1 and the push plate 2, and a plurality of sensors 13 arranged on the air cylinder 1, the sensing end of each sensor 13 facing the push plate 2, the plurality of sensors 13 being arranged in an equidistant ring around the central axis of the driving end of the air cylinder 1, and the sensing ends of the plurality of sensors 13 being in the same plane in the radial direction of the driving end.

[0073] In this embodiment, the wafer lifting device realizes accurate control and adjustment of the posture of the ejector pin 4 by setting the anti-deviation mechanism 12 between the air cylinder 1 and the push plate 2 and setting a plurality of sensors 13 on the air cylinder 1. The anti-deviation mechanism 12 ensures the coaxial connection between the air cylinder 1 and the push plate 2, thereby reducing the deviation of the ejector pin 4 caused by the deviation between the air cylinder 1 and the push plate 2. The equidistant ring-shaped arrangement of the sensors 13 can monitor the position and posture of the ejector pin 4 in real time and provide accurate feedback signals to timely adjust the position of the ejector pin 4 and ensure that it always remains in a vertical state. This design significantly improves the repeatability and reliability of the wafer lifting device, reduces wafer damage caused by the deviation of the ejector pin 4, prolongs the service life of the equipment, and improves the overall quality and efficiency of wafer processing.

[0074] It is worth noting that the structural design of the present application is reasonable and can be applied to adjustment in different situations. Specifically, when the air cylinder 1 and the push plate 2 are perpendicular to each other and there is a deviation between the center shaft 315 and the push plate 2, the ejector pin 4 can be adjusted to a vertical state through the floating mechanism 3; when the center shaft 315 and the push plate 2 are perpendicular to each other and there is a deviation between the air cylinder 1 and the push plate 2, the ejector pin 4 can be adjusted to a vertical state through the anti-deviation mechanism 12; when there is a deviation between the air cylinder 1 and the push plate 2 and there is also a deviation between the center shaft 315 and the push plate 2, the ejector pin 4 can be adjusted to a vertical state through the cooperation of the floating mechanism 3 and the anti-deviation mechanism 12.

[0075] Specifically, as shown in Figure 8 the anti-deviation mechanism 12 is used for the connection of the air cylinder 1 and the push plate 2, three sensors 13 are arranged on the upper end surface of the air cylinder 1, the three sensors 13 are arranged in an equidistant ring shape around the central axis of the driving end of the air cylinder 1, the sensing end of the sensor 13 is arranged towards the push plate 2, and the sensing ends of the three sensors 13 are on the same horizontal plane. The sensor 13 adopts a high-precision photoelectric sensor, and its detection accuracy is 0.01 mm, which can send a feedback signal within 0.1 seconds after detecting the position deviation. In other examples, the number of sensors 13 is not limited to three.

[0076] In actual operation, the sensor 13 can monitor the positional relationship between the air cylinder 1 and the push plate 2 in real time. When it is detected that the position of the push plate 2 relative to the driving end of the air cylinder 1 is deviated, the anti-deviation mechanism 12 will be started to adjust the push plate 2 so that the push plate 2 is in a vertical state with the driving end of the air cylinder 1, and preferably, the push plate 2 is adjusted to a horizontal state.

[0077] In one embodiment, the anti-deviation mechanism 12 can adopt an electric gimbal structure (not shown). Specifically, the electric gimbal is composed of two mutually perpendicular joints, each of which allows the push plate 2 to swing in two directions; the two joints of the electric gimbal allow the push plate 2 to swing in the horizontal and vertical directions, respectively. When the driving end of the cylinder 1 moves, the gimbal can automatically adjust the position of the push plate 2 so that it always remains perpendicular to the driving end of the cylinder 1. Of course, the anti-deviation mechanism 12 is not limited to the gimbal structure, and any electric or mechanical device, apparatus or structure that can adjust the push plate 2 when it is not perpendicular to the driving end of the cylinder 1 so that the push plate 2 remains perpendicular to the driving end of the cylinder 1 is included in the scope of the anti-deviation mechanism 12.

[0078] In addition, the anti-deviation mechanism 12 is also equipped with a fine adjustment device (not shown) for initial position calibration before the device is started. The fine adjustment device adopts a manual adjustment mode, and by rotating the adjustment nut 312, the connection position of the cylinder 1 and the push plate 2 can be fine adjusted within the range of 0.5mm-2mm. This design ensures that the driving end of the cylinder 1 and the push plate 2 are in a vertical position state at each start of the device, further improving the reliability and repeat positioning accuracy of the device.

[0079] Of course, in other embodiments, sensing devices other than the inductor 13 (not shown) can also be used. For example, an optical anti-deviation mechanism can be used instead of the inductor 13. Specifically, a laser alignment device can be installed between the cylinder 1 and the push plate 2, and the coaxial connection of the cylinder 1 and the push plate 2 is ensured by the alignment of the laser beam. The accuracy of the laser alignment device can reach 0.005mm, which can further improve the operation accuracy of the device. This optical anti-deviation method is particularly suitable for wafer processing equipment with very high precision requirements.

[0080] It is worth noting that the adjustment of the position of the needle 4 can be adjusted separately for the floating mechanism 3 or the anti-deviation mechanism 12; or it can be adjusted in cooperation with the floating mechanism 3 and the anti-deviation mechanism 12. In the process of adjusting the floating mechanism 3 and the anti-deviation mechanism 12 in cooperation, the adjustment process can be made more accurate, and the needle 4 can always be in a vertical state.

[0081] In one embodiment, the present application also provides a wafer processing device, such as Figure 1 and Figure 8As shown, the wafer lifting device includes the wafer lifting device, and further includes an electrostatic chuck 6 for mounting the bellows, wherein the electrostatic chuck 6 is provided with through holes communicating with the lumen of the bellows. This embodiment shows the application value of the device in the actual production environment by integrating the wafer lifting device into the wafer processing equipment. Through the self-adaptive adjustment function, the locking and anti-moving function, the anti-deviation mechanism 12 and the dynamic balance adjustment function, the device significantly improves the precision and stability of wafer processing, reduces the damage to the wafer caused by the position deviation of the ejector pin 4, and prolongs the service life of the equipment. At the same time, the maintenance and optimization measures of the equipment further ensure its long-term stable operation. The wafer processing equipment of the present application has wide application prospect and significant practical value in the field of high-precision wafer processing.

[0082] It is worth noting that the wafer processing equipment includes deposition equipment and plasma etching equipment containing the ejector pin assembly inside. Therefore, the wafer lifting device in the present application can also be applied to the deposition equipment and the plasma etching equipment, specifically: An example, in the deposition equipment such as chemical vapor deposition equipment, the wafer needs to be accurately placed at a specific position in the reaction chamber to ensure uniform film deposition. For example, in a tungsten chemical vapor deposition equipment, the deposition quality of tungsten film is crucial to the final performance of the wafer, and any slight tilt or deviation may cause uneven film thickness, which in turn affects the performance of the device. The lifting device of the present application can automatically adjust the ejector pin 4 to the vertical state through its self-adaptive adjustment function, ensuring that the central axis of the ejector pin 4 coincides with the central axis of the lumen of the bellows, thereby avoiding the tilt or deviation of the wafer caused by the inconsistent height of the ejector pin 4, ensuring the position accuracy of the wafer in the reaction chamber to reach the micron level, and improving the uniformity of film deposition. At the same time, the design of the device reduces the friction between the ejector pin 4 and the inner hole of the bellows, prolongs the service life of the equipment, and reduces the maintenance cost, which is particularly important for deposition equipment that needs to operate stably for a long time.

[0083] An example, in the plasma etching equipment, the wafer needs to be accurately fixed at a specific position in the etching chamber to ensure the precision and consistency of the etching pattern. During the etching process, any tilt or deviation of the wafer may cause deviation of the etching pattern, which in turn affects the performance and yield of the chip. The lifting device of the present application can ensure that the wafer always maintains a vertical state during lifting and placement, avoiding the tilt or deviation of the wafer caused by the inconsistent height of the ejector pin 4, and its self-adaptive adjustment function can ensure the placement accuracy of the wafer to reach the sub-micron level, thereby ensuring the precision of the etching pattern. In addition, the device can also reduce the friction between the ejector pin 4 and the inner hole of the bellows, avoid the damage to the wafer caused by friction, and further improve the stability and reliability of the etching process.

[0084] It is important to note that the construction and arrangement of the application shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review the present disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter described herein. For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be reversed or otherwise varied, and the nature or number of elements or positions can be altered or varied. Accordingly, all such variations are intended to be included within the scope of the present application. The order or sequence of any process or method steps can be varied or re-sequenced without materially affecting the application. Any reference to claims in the singular sense should be read to include the plural unless in the context it is clear otherwise. The use of any of the following terms "including", "including but not limited to", "consisting of", "consisting essentially of", "having", "including", "comprising", or "involving", and the like shall not be construed as necessarily limiting the described application to the recited items or steps. Any and all permutations of the recited items or steps can be resorted to without departing from the scope of the application. Other substitutions, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the application.

[0085] Also, to provide a concise description of the exemplary embodiments, not all features of an actual implementation can be described (that is, those related to the best mode for carrying out the present application, or those which are not necessary for an understanding of the present application).

[0086] It is to be understood that the development of the exemplary embodiments of this application can not be limited to the precise constructional arrangements shown in the drawings, and that various modifications and alterations can be made thereto without departing from the scope of the present application. It will be apparent to those skilled in the art that substantial equivalents can be prepared without departing from the scope of the present application. Accordingly, the scope of the present application should be given to the appended claims.

[0087] It should be noted that the above examples are intended to be illustrative only and not limiting of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those with ordinary skill in the art will appreciate that various modifications can be made without departing from the spirit and scope of the present application.

Claims

1. A wafer lifting device, characterized in that: The lifting device is specially used for wafer lifting operations. The wafer lifting device includes a cylinder, a push plate, a pin, a floating mechanism, and a vacuum component. The driving end of the cylinder is connected to the push plate, the pin is inserted into the vacuum component, the pin is connected to the push plate through a floating mechanism, and the floating mechanism includes a connecting piece and an adaptive component. The connecting piece includes a first docking portion connected to the pin, and a second docking portion provided on the push plate and matched with the first docking portion and capable of causing the pin to deflect relative to the push plate. The adaptive component includes a plurality of correcting portions connected to the first docking portion, and the plurality of correcting portions are arranged in an equidistant ring shape around the central axis of the first docking portion, and the plurality of correcting portions can provide a pushing force toward the central axis of the first docking portion, so as to adjust the posture of the pin through the first docking portion to make it reach a vertical state, and to maintain a safety gap between the pin and the vacuum component.

2. The wafer lifting device according to claim 1, characterized in that: The push plate is provided with a through mounting hole in the axial direction, the number of the mounting holes matches the number of the ejector pins, the hole wall of the mounting hole extends a step toward the central axis of the mounting hole, the step is arranged close to the cylinder, and the step is annular.

3. The wafer lifting device according to claim 2, characterized in that: The second docking portion includes a T-shaped rod, which has a vertical section and a horizontal section connected to each other. The vertical section of the T-shaped rod is provided with an external thread and partially extends into the mounting hole. The horizontal section of the T-shaped rod is arranged in the mounting hole and abuts against the step. The vertical section of the T-shaped rod is externally threaded and provided with a nut, which abuts against the side close to the push plate, wherein the side of the T-shaped rod close to the ejector pin is recessed into a swing groove toward the direction of the cylinder.

4. The wafer lifting device according to claim 3, characterized in that: The first docking portion includes a central shaft and a swinging ball. The central shaft is coaxially connected to the ejector pin. The central shaft is arranged at one end of the ejector pin close to the cylinder and is connected to the correction portion. The swinging ball is arranged at one end of the central shaft away from the ejector pin and is movably arranged in the swinging groove.

5. The wafer lifting device according to claim 4, characterized in that: The groove cavity of the swing groove is a spherical structure, and the diameter of the swing ball is between 2 / 3 and 3 / 4 of the diameter of the groove cavity of the swing groove, so that the swing ball can swing in the swing groove.

6. The wafer lifting device according to claim 5, characterized in that: The center of the swing ball is arranged below the center of the groove cavity of the swing groove, and the upper end opening size of the swing groove is smaller than the diameter of the swing ball to prevent the swing ball from escaping from the swing groove.

7. The wafer lifting device according to claim 4, characterized in that: The adaptive component also includes a first support tube, which is sleeved outside the central axis, and the tube cavity of the first support tube is coaxially arranged with the central axis, the tube cavity of the first support tube is connected with the mounting hole, the first support tube abuts against the side close to the push plate, the correcting part is inclined or horizontally arranged in the first support tube, and the end of the correcting part away from the central axis is connected to the inner wall of the central axis.

8. The wafer lifting device according to claim 7, characterized in that: The adaptive component also includes an extension portion, which is arranged between the first support tube and the T-shaped rod. The first support tube and the T-shaped rod are connected through the extension portion, and the extension portion, the first support tube and the T-shaped rod are integrally formed or fixedly connected.

9. The wafer lifting device according to claim 7, characterized in that: The adaptive component also includes a support portion, which is arranged between the correcting portion and the central axis. The correcting portion and the central axis are connected through the support portion. The support portion is wrapped around the outside of the central axis, and the support portion is slidingly connected to the side of the central axis that is close to each other, so that the support portion moves in the axial direction of the central axis during the process of adjusting the posture of the ejector pin to a vertical state.

10. The wafer lifting device according to claim 9, characterized in that: The support portion is composed of a plurality of arc-shaped plates, and the plurality of arc-shaped plates are arranged in an equidistant ring around the central axis of the central shaft. The number of the arc-shaped plates is consistent with the number of the correction portions, wherein the curvature of the arc-shaped plates in the circumferential direction of the central shaft is consistent with the circumferential curvature of the central shaft, so that the arc-shaped plates are tightly fitted to the central shaft.

11. The wafer lifting device according to claim 9, wherein: The supporting portion is a second supporting tube, which includes a raised section and two straight tube sections, wherein the two straight tube sections are respectively connected to the opposite ends of the raised section in the axial direction of the central axis, wherein the cross-section of the raised section is a peak-shaped structure, and the peak of the peak bulges along the radial direction of the central axis toward the central axis of the central axis, and the peak of the peak abuts against one end of the central axis that is close to each other, and a deflection cavity for the deflection of the central axis is provided between the straight tube section and the central axis.

12. The wafer lifting device according to claim 1, wherein: The vacuum component includes a bellows, the ejector pin is inserted into the bellows, the ejector pin is deflected relative to the push plate by a floating mechanism and reaches a vertical state, and the central axis of the ejector pin coincides with the central axis of the tube cavity of the bellows.

13. The wafer lifting device according to claim 1, wherein: It also includes an anti-deflection mechanism arranged between the cylinder and the push plate and used to connect the cylinder and the push plate, and a plurality of sensors arranged on the cylinder, the sensing ends of the sensors facing the push plate, the plurality of sensors are arranged in an equidistant ring around the central axis of the cylinder driving end, and the sensing ends of the plurality of sensors are on the same radial plane of the driving end.

14. A wafer processing device, characterized in that: The wafer lifting device comprises the wafer lifting device according to any one of claims 1 to 13, further comprising an electrostatic chuck for mounting the bellows, wherein the electrostatic chuck is provided with a through hole communicating with the lumen of the bellows.

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