Heat dissipation structure and design method thereof

Abstract

The invention provides a heat dissipation structure and a design method thereof, the heat dissipation structure comprises a substrate, a first flow channel and a second flow channel, the first flow channel and the second flow channel are embedded in the substrate, are mutually stacked and are mutually staggered in the extension direction, and the structure parameters of a micro-flow channel grid formed by staggering the first flow channel and the second flow channel are adaptively adjusted. In this way, in the process that the low-temperature cooling working medium rotationally flows between the first flow channel and the second flow channel, the heat exchange area and the convective heat exchange coefficient of the cooling working medium in the heat dissipation structure are increased, and synchronous control over improvement of the heat dissipation efficiency and reduction of the flow resistance of the cooling working medium in the heat dissipation structure is achieved. The invention further provides a heat dissipation structure design method which is used for carrying out optimization design on the structure parameters of the micro-channel grid so as to rapidly and efficiently obtain the target micro-channel heat dissipation structure performance parameters and the corresponding structure parameters, and the design efficiency and the design result accuracy and reliability are improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of heat dissipation technology, in particular to a heat dissipation structure and a design method thereof. BACKGROUND

[0002] With the development of electronic device miniaturization and integration technology, the size of chip devices is becoming smaller and smaller, while the power density is increasing, thus the challenge of chip device heat dissipation is becoming greater and greater. If the chip heat dissipation effect is not good, it will seriously affect the working stability, safety reliability and service life of the chip and electronic device, electronic system, especially in the field of electronic device heat dissipation such as server, high power density problem has become one of the bottlenecks restricting the performance improvement of chip.

[0003] Embedded micro-channel heat dissipation technology is an innovative heat dissipation scheme, which forms an embedded micro-channel heat dissipation structure by etching directly on the surface (or back surface) of the chip, and fills the circulating cooling working medium in the micro-channel structure, so as to efficiently and quickly take away the heat generated by the chip, thereby greatly reducing the thermal resistance in the chip heat dissipation process. However, the existing embedded micro-channel heat dissipation structure cannot solve the problem of large flow resistance and large temperature rise of the cooling working medium in the internal cooling working medium. SUMMARY

[0004] The present disclosure provides a heat dissipation structure and an optimization method thereof, which includes a flow channel grid formed by the intersection of two layers of flow channels in the micro-flow heat dissipation channel structure, so that the cooling working medium can rotate back and forth between the flow channel grid, increase the contact area between the fluid and the flow channel, and enhance the fluid disturbance, so as to realize higher heat dissipation efficiency and lower flow resistance control of the chip and its corresponding packaging structure.

[0005] According to a first aspect of the present application, a heat dissipation structure is provided, comprising a substrate, and a micro-channel grid arranged in the substrate, the micro-channel grid comprising at least a first flow channel layer and a second flow channel layer arranged in a first direction; the first flow channel layer comprises a plurality of parallel first flow channels, the second flow channel layer comprises a plurality of parallel second flow channels, and the extension direction of the first flow channel intersects with the extension direction of the second flow channel in a plane perpendicular to the first direction; wherein the first direction is the thickness direction of the substrate.

[0006] According to a second aspect of the present application, a heat dissipation structure design method is provided, which is used for structure parameter optimization design of the heat dissipation structure of the first aspect, comprising:

[0007] determining the geometric structure of the heat dissipation structure to be designed, and the structure parameters of the geometric structure and the parameter variation range corresponding to the structure parameters;

[0008] determine a micro-channel heat dissipation structure performance parameter corresponding to each of the structure parameters in the parameter variation range, to obtain a micro-channel heat dissipation structure performance parameter set;

[0009] select a target micro-channel heat dissipation structure performance parameter meeting the design requirement from the micro-channel heat dissipation structure performance parameter set, to construct a heat dissipation structure according to the structure parameter corresponding to the target micro-channel heat dissipation structure performance parameter.

[0010] According to a third aspect of the present application, a packaging structure is provided, comprising:

[0011] a circuit board;

[0012] a substrate disposed on the circuit board;

[0013] a chip disposed on the substrate and electrically connected to the circuit board through the substrate; wherein the chip comprises the heat dissipation structure of the first aspect.

[0014] The heat dissipation structure provided by the present application comprises a substrate, and first flow channels and second flow channels which are stacked with each other and staggered in the extension direction. By adaptively adjusting the structure parameters of the micro-channel grid formed by the staggered first flow channels and second flow channels, the low-temperature cooling working medium can rotate and flow in the micro-channel grid with different structure parameters, thereby increasing the heat exchange area and the convective heat transfer coefficient of the cooling working medium in the heat dissipation structure, and realizing the synchronous control of the heat dissipation efficiency and the flow resistance of the cooling working medium in the heat dissipation structure.

[0015] The heat dissipation structure design method provided by the embodiments of the present application first obtains the micro-channel heat dissipation structure performance parameter set corresponding to different structure parameters of the geometric structure of the heat dissipation structure to be designed, and then selects the target micro-channel heat dissipation structure performance parameter meeting the design requirement from the micro-channel heat dissipation structure performance parameter set, and constructs the micro-channel heat dissipation structure according to the structure parameter corresponding to the target micro-channel heat dissipation structure performance parameter. Therefore, the present application can quickly and efficiently obtain the target micro-channel heat dissipation structure performance parameter and the structure parameter corresponding thereto, greatly shortens the design cycle of the structure parameter, saves a large amount of time and labor cost, reduces the dependence of the structure parameter on the design experience of the designer in the design, and at the same time reduces the possible human errors such as parameter design omission and misjudgment, and improves the accuracy and reliability of the design result.

[0016] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings of which:

[0018] Figure 1 A longitudinal sectional view of a heat dissipation structure provided by an embodiment of the present application;

[0019] Figure 2 A perspective view of a heat dissipation structure provided by an embodiment of the present application;

[0020] Figure 3 A transverse sectional view of a heat dissipation structure provided by an embodiment of the present application;

[0021] Figure 4 A flowchart of a heat dissipation structure design method provided by an embodiment of the present application;

[0022] Figure 5 A flowchart of another heat dissipation structure design method provided by an embodiment of the present application;

[0023] Figure 6 A flowchart of yet another heat dissipation structure design method provided by an embodiment of the present application;

[0024] Figure 7 A diagram showing the relationship between the temperature of an active structure and the channel pressure drop of a heat dissipation structure provided by an embodiment of the present application;

[0025] Figure 8 A diagram of a chip packaging structure provided by an embodiment of the present application;

[0026] Figure 9 A diagram of another chip packaging structure provided by an embodiment of the present application.

[0027] 100 chip; 101 substrate; 110 active structure; 120 microfluidic channel grid; 121 first flow channel; 122 first fin; 123 second flow channel; 124 second fin; 200 base plate; 300 circuit board; 401 liquid supply conduit; 402 liquid return conduit; 403 first connecting water nozzle; 404 second connecting water nozzle; 405 first auxiliary heat dissipation flow channel; 406 second auxiliary heat dissipation flow channel. DETAILED DESCRIPTION

[0028] Embodiments of the present application are described in detail below with reference to the attached drawing figures, wherein the same or like reference numerals are used throughout the drawing figures to refer to the same or like elements or elements having the same or similar functionality. The embodiments described below are exemplary and are intended to be illustrative of the present application and are not to be construed as limiting thereof.

[0029] At present, the silicon-based micro-channel heat dissipation technology is an innovative heat dissipation scheme. The embedded micro-channel heat dissipation structure is formed by etching on the silicon substrate, and the circulating cooling medium is filled in the micro-channel heat dissipation structure, so that the heat generated by the chip can be quickly taken away, thereby greatly reducing the thermal resistance in the chip heat dissipation process. Since the embedded micro-channel heat dissipation structure is directly flowed through the micro-channel embedded in the chip by the cooling medium to take away the heat, there is no interface thermal resistance, so that the embedded micro-channel heat dissipation structure has higher heat dissipation efficiency and is suitable for heat dissipation of high-power-density chips. However, due to the small size of the embedded micro-channel heat dissipation structure, the existing embedded micro-channel heat dissipation structure has the disadvantages of large flow resistance and large temperature rise of the cooling medium.

[0030] Based on the above problems, the present application provides a heat dissipation structure and a design method thereof. By arranging the first flow channel and the second flow channel in the silicon substrate, the first flow channel and the second flow channel are stacked and staggered in the extension direction, and by adjusting the structure parameters of the micro-channel grid formed by the staggered first flow channel and second flow channel, the heat dissipation efficiency of the cooling medium in the flow channel grid is improved while the heat exchange area and the convective heat transfer coefficient of the cooling medium in the micro-channel grid are improved synchronously.

[0031] According to the first aspect of the present application, a heat dissipation structure is provided, as shown in Figures 1-3 The heat dissipation structure for the chip 100 includes a substrate 101 and a micro-channel grid 120 arranged in the substrate 101, and the micro-channel grid 120 is spaced apart from the active structure 110 of the chip 100 formed in the substrate 101 in the thickness direction. The liquid cooling medium with low temperature property flows in the micro-channel grid 120 to quickly absorb and export the heat generated and transferred by the active structure 110 as a heat source in the substrate 101 during operation, so that the maximum temperature of the chip 100 (active structure 110) can be kept within the preset temperature threshold range, thereby ensuring the working stability of the chip 100.

[0032] The substrate 101 material can include but is not limited to a wafer for conventional chip manufacturing, including but not limited to any one of the first-generation, second-generation or third-generation semiconductor substrate materials such as silicon, gallium arsenide, indium phosphide, silicon carbide, gallium nitride, etc. The substrate 101 includes a first surface and a second surface opposite to each other in the first direction, and the first direction is the thickness extension direction of the substrate 101, which is also the Z direction in the figure.

[0033] The first surface of the substrate 101 is usually used to form the active structure 110 through a series of processing procedures. The active structure 110 can include one or more types or parameters of transistors and the like. The second surface of the substrate 101 is usually thinned by cutting before the chip 100 is packaged. After the packaging is completed, a cooling device in the form of a cold plate or fin is installed on the side close to the second surface to dissipate heat for the normal operation of the active structure 110 on the first surface.

[0034] The cooling device in the form of a cold plate or fin is installed on the chip 100, and the active structure 110 is separated from the cooling device by two layers of thermal resistance of the substrate material and the packaging material, which generally reduces the heat dissipation efficiency of the cooling device in the form of a cold plate or fin, and it is difficult to maintain the temperature requirement of the normal operation of the chip 100. Therefore, the micro-channel grid 120 is formed in the substrate 101 between the active structure 110 and the second surface, and the flowing cooling medium is filled in the micro-channel grid 120, so that the flowing cooling medium can quickly absorb and export the heat transferred from the active structure 110 to the substrate 101 through the micro-channel grid 120.

[0035] Since the active structure 110 and the micro-channel grid 120 are arranged in the same substrate 101 and are spaced apart in the first direction, a cooling path is formed near the active structure 110, so that the thermal resistance between the active structure 110 and the micro-channel grid 120 is greatly reduced, thereby achieving the purpose of improving the heat dissipation efficiency of the micro-channel grid 120.

[0036] In addition, since the micro-channel grid 120 and the active structure 110 are spaced apart in the substrate 101, the flowing cooling medium in the heat dissipation structure does not affect the normal operation of the active structure 110.

[0037] The micro-channel grid at least includes a first flow channel layer and a second flow channel layer arranged in a stack along the first direction; the first flow channel layer includes a plurality of parallel first flow channels 121, the second flow channel layer includes a plurality of parallel second flow channels 123, and the extension directions of the first flow channels 121 and the second flow channels 123 are interlaced in a plane perpendicular to the first direction to form the micro-channel grid 120, so that the cooling medium can flow in the first flow channels 121 and the second flow channels 123 or between the first flow channels 121 and the second flow channels 123. In addition, the actual contact area between the cooling medium and the substrate 101 is also increased, the flow of the cooling medium in the substrate 101 is optimized, the convective circulation coefficient between the cooling medium and the substrate 101 is improved, and the heat transferred from the active structure 110 to the substrate 101 is continuously absorbed and exported to cool the active structure 110.

[0038] Since the first flow channel 121 is stacked on the second flow channel 123, and the first flow channel 121 and the second flow channel 123 have unequal structural parameters, the flow velocity, flow resistance, and flow direction of the cooling medium in the first flow channel 121 and the second flow channel 123 will be quite different, thereby causing the heat dissipation efficiency of the micro-flow channel grid 120 to the active structure 110 to also be significantly different.

[0039] According to the heat transfer calculation formula, that is, q = h · A · ΔT, where q is the heat transfer, h is the convective heat transfer coefficient, A is the heat transfer area, and ΔT is the temperature difference between the cooling medium and the substrate 101.

[0040] It can be known that, under the condition that the temperature difference ΔT remains relatively constant, by adaptively adjusting the structural parameters between the first flow channel 121 and the second flow channel 123, the flow path of the cooling medium in the micro-flow channel grid 120 is constantly rotated between the first flow channel 121 and the second flow channel 123, not only can increase the contact area of the cooling medium with the substrate 101 between the first flow channel 121 and the second flow channel 123, but also can increase the disturbance of the cooling medium and improve the convective heat transfer coefficient h. Thus, under the condition that the heat transfer area A and the convective heat transfer coefficient h are increased synchronously, the heat transfer will also be further increased, thereby achieving the effect of improving the heat dissipation efficiency of the micro-flow channel heat dissipation structure.

[0041] In some embodiments, as shown in Figure 2 and Figure 3 The first flow channel layer further includes a plurality of first fins 122 extending in parallel, and the second flow channel layer further includes a plurality of second fins 124 extending in parallel. Among them, the first flow channel 121 is located between two adjacent first fins 122 extending in the same direction, so that the first fin 122 can provide top support for the micro-flow channel grid 120 embedded in the substrate 101, and similarly, the second flow channel 123 is located between two adjacent second fins 124 extending in the same direction, so that the second fin 124 can provide bottom support for the micro-flow channel grid 120 embedded in the substrate 101.

[0042] Among them, the angle between the extension direction of the first fin 122 and the first flow channel 121 and the second direction is the first deflection angle, and the angle between the extension direction of the second fin 124 and the second flow channel 123 and the second direction is the second deflection angle. Among them, the second direction is perpendicular to the first direction, which is also the Y direction in the figure.

[0043] Since any first flow channel 121 is spaced by two adjacent first fins 122, and any second flow channel 123 is spaced by two adjacent second fins 124, the cooling medium can continuously absorb and export the heat transferred from the active structure 110 to the substrate 101 by constantly contacting the first fins 122 and the second fins 124 during the rotation between the first flow channel 121 and the second flow channel 123.

[0044] By controlling the angle range of the first deflection angle and the second deflection angle, and making the included angle between the extension direction of the first fin 122 and the extension direction of the second fin 124 be the sum of the first deflection angle and the second deflection angle, the rotation of the cooling medium between the first flow channel 121 and the second flow channel 123 can be further increased, so as to increase the contact time of the cooling medium with the first fin 122 and the second fin 124, and further improve the heat dissipation efficiency of the chip 100. The angle range of the first deflection angle and / or the second deflection angle is between 30° and 60°.

[0045] Further, the first flow channel layer and the second flow channel layer of the micro flow channel grid 120 are arranged to have different structure parameters, which at least include the width of the first flow channel 121 and the second flow channel 123 in the third direction, the width of the first fin 122 and the second fin 124 in the third direction, and the height of the first fin 122 and the second fin 124 in the first direction, in addition to the angle of the first deflection angle and / or the second deflection angle. The third direction is perpendicular to the orthogonal plane of the first direction and the second direction, and is also the X direction in the figure.

[0046] The structure parameters of the micro flow channel grid 120 are closely related to the flow rate, fluid distribution, and flow resistance of the cooling medium during the flow between the first flow channel 121 and the second flow channel 123. By limiting the width of the first fin 122 and the first flow channel 121, the width of the second fin 124 and the second flow channel 123 in the third direction, and the height of the first flow channel 121 and the second flow channel 123 in the third direction, the flow distribution of the cooling medium in the micro flow channel grid 120 can be further optimized, which is equivalent to limiting the proportional distribution between the first flow channel 121 and the first fin 122, and between the second flow channel 123 and the second fin 124, thereby achieving the effect of effectively reducing the temperature of the active structure 110 and the flow resistance in the micro flow channel grid 120.

[0047] Further, to achieve the control effect of the flow resistance size inside the micro-channel grid 120, in the structural parameter design, the width of the first rib 122 along the third direction can be set to be greater than the width of the second rib 124 along the third direction, or the width of the first flow channel 121 along the third direction can be set to be greater than the width of the second flow channel 123 along the third direction, and at the same time, the depth of the first flow channel 121 and the second flow channel 123 is also precisely controlled.

[0048] Therefore, when the cooling working medium flows from the second flow channel 123 to the micro-channel grid 120, the narrower second flow channel 123 not only increases the flow rate of the cooling working medium, but also promotes the cooling working medium to form a more stable laminar flow state, reduces the boundary layer thickness between the cooling working medium and the first rib 122, and further increases the convective heat transfer coefficient, so as to more quickly take away the heat generated by the active structure 110 and significantly enhance the heat exchange effect. The first flow channel 121 is designed to have a large width and a reasonable depth, on the one hand, the increased depth can further expand the flow area of the cooling working medium without significantly increasing the boundary friction between the cooling working medium and the first rib 122, so that the cooling working medium can smoothly transition from the second flow channel 123 to the first flow channel 121, reducing the local resistance caused by the sudden change of the flow channel, thereby reducing the flow resistance of the micro-channel grid 120; on the other hand, the increased depth of the first flow channel 121 can also effectively increase the contact area between the first flow channel 121 and the cooling working medium, so as to maintain a high heat exchange efficiency at a low flow rate and ensure that the heat is fully taken away.

[0049] Since the first flow channel 121 is stacked on the second flow channel 123, the cooling working medium also flows from the second flow channel 123 to the first flow channel 121. During the process of flowing from the second flow channel 123 to the first flow channel 121, due to the small width of the second flow channel 123 and the second rib 124, the cooling working medium can form a disturbed flow in the first flow channel 121 by means of the flow rate difference when flowing into the first flow channel 121, thereby breaking the boundary layer of the fluid and further strengthening the heat exchange. At the same time, the wider and reasonably deep first flow channel 121 can also provide more sufficient flow space for the cooling working medium, reduce the flow resistance of the cooling working medium, and reduce the turbulent loss and friction resistance caused by the narrow flow channel, so that the overall flow of the cooling working medium in the micro-channel grid 120 is more smooth, thereby achieving the effect of reducing the flow resistance. The design of wide and narrow flow channels, differentiated rib widths, and precise control of flow channel depth can achieve multi-dimensional synergistic effect, that is, to enhance the heat exchange while effectively controlling the flow resistance, and to optimize the thermal management performance of the micro-channel grid 120.

[0050] As an example, the depth of the first flow channel 121 and the second flow channel 123, that is, the height of the first rib 122 and the second rib 124 in the first direction, has a parameter range of 50 μm to 100 μm.

[0051] Further, the heat dissipation structure described above further comprises at least an inlet flow channel and an outlet flow channel. The inlet flow channel is connected with the inlet end of the first flow channel 121, and the outlet flow channel is connected with the outlet end of the first flow channel 121 and / or the second flow channel 123.

[0052] The design of the inlet flow channel generally has a large cross-sectional area and a relatively smooth transition curve, which functions to enable the cooling working medium to flow into the first flow channel 121 at a low flow rate and in a stable state, avoiding additional resistance and energy loss caused by fluid impact at the inlet. At the same time, a reasonable layout of the inlet flow channel enables the working medium to be more evenly distributed to the first flow channel 121 and the second flow channel 123, ensuring the flow balance in each flow channel and fully exerting the heat dissipation advantages of different flow channels.

[0053] The outlet flow channel is responsible for efficiently discharging the cooling working medium after heat exchange. When the outlet flow channel is connected with the first flow channel 121 and the second flow channel 123 at the same time, its internal structure is often specially optimized, for example, a flow guide groove or a diffusion cone is arranged, so that the working medium from different flow channels, flow rates and pressures with different differences can smoothly converge, reducing the vortex phenomenon at the outlet. This design can effectively reduce the outlet back pressure, ensuring that the fluid flow in the micro-flow channel grid 120 remains smooth, further consolidating the overall flow resistance control effect.

[0054] Through the cooperation of the inlet flow channel and the outlet flow channel with the first and second flow channels 123, the heat dissipation structure provided by the present application realizes the complete circulation of the cooling working medium from stable inflow, efficient heat exchange to smooth discharge, and comprehensively improves the heat dissipation performance and flow resistance control ability.

[0055] According to the second aspect of the present application, a design method of a heat dissipation structure is also provided, which is used to design the heat dissipation structure described in any of the above embodiments. As shown in Figure 2 and Figure 4 , the method comprises the following steps:

[0056] Step S1, determining the geometric structure of the heat dissipation structure to be designed, and the structure parameters of the geometric structure and the parameter variation range corresponding to the structure parameters;

[0057] Among them, the heat dissipation structure to be designed refers to the heat dissipation structure that needs to be designed in structure parameters.

[0058] Among them, the geometric structure refers to the specific structure form of the heat dissipation structure, such as Figure 2As shown, specifically can be formed in the base 101 microfluidic channel grid 120, microfluidic channel grid 120 at least includes a first flow channel 121, 121, first rib 122, second flow channel 123 and second rib 124. Among them, the first flow channel 121 along arranged between two adjacent first rib 122, 123, second flow channel is arranged between two adjacent second rib 124.

[0059] Among them, the structure parameter refers to the corresponding geometric parameters of the first flow channel 121, the first rib 122, the second flow channel 123 and the second rib 124.

[0060] Among them, the parameter variation range corresponding to the structure parameter refers to the value range of the corresponding structure parameter of the first flow channel 121, the first rib 122, the second flow channel 123 and the second rib 124.

[0061] Step S2, determine the microfluidic heat dissipation structure performance parameter corresponding to different structure parameters in the parameter variation range, obtain the microfluidic heat dissipation structure performance parameter set.

[0062] Among them, the flow channel heat dissipation structure performance parameter refers to the coefficient that can reflect the heat dissipation capacity of the microfluidic heat dissipation structure to the active structure 110, and different structure parameters and microfluidic heat dissipation structure performance parameters correspond to each other.

[0063] Among them, the microfluidic heat dissipation structure performance parameter set refers to the parameter set composed of the microfluidic heat dissipation structure performance parameters corresponding to multiple different structure parameters in the parameter variation range.

[0064] Step S3, select the target microfluidic heat dissipation structure performance parameter meeting the design requirement from the microfluidic heat dissipation structure performance parameter set, so as to construct the microfluidic heat dissipation structure according to the structure parameter corresponding to the target microfluidic heat dissipation structure performance parameter.

[0065] Among them, the target microfluidic heat dissipation structure performance parameter meeting the design requirement refers to the microfluidic heat dissipation structure performance parameter in the microfluidic heat dissipation structure performance parameter set, which can simultaneously consider the heat dissipation efficiency of the active structure 110 and the overall pressure drop of the heat dissipation structure.

[0066] Among them, the overall pressure drop of the heat dissipation structure is used to characterize the flow resistance of the cooling working medium in the heat dissipation structure, and the greater the overall pressure drop of the heat dissipation structure, the greater the flow resistance of the cooling working medium in the heat dissipation structure.

[0067] The design method of the heat dissipation structure provided in this embodiment first obtains a corresponding set of microfluidic heat dissipation structure performance parameters by considering the geometric structure of the heat dissipation structure to be designed and according to the different structural parameters of the geometric structure. Then, the target microfluidic heat dissipation structure performance parameters that meet the design requirements are selected from the set of microfluidic heat dissipation structure performance parameters, and the microfluidic heat dissipation structure is constructed with its corresponding structural parameters. Therefore, the present application can achieve the rapid and efficient acquisition of the target microfluidic heat dissipation structure performance parameters and their corresponding structural parameters, greatly shortening the design cycle of the structural parameters, saving a lot of time and labor costs, reducing the dependence of the structural parameters on the design experience of the designer in the design, and at the same time reducing possible human errors such as parameter design omissions and misjudgments, thereby improving the accuracy and reliability of the design results.

[0068] It should be noted that the embodiments of the present disclosure may include multiple steps. For the convenience of description, these steps are numbered, but these numbers do not limit the execution time slots or execution order between the steps; these steps can be implemented in any order, and the embodiments of the present disclosure do not limit this.

[0069] In some embodiments, as Figure 2 As shown, the dimensions and angular parameters related to the first flow channel 121, the first rib 122, the second flow channel 123 and the second rib 124 may include the width l1 of the first rib 122, the width l2 of the second rib 124, the spacing t1 between adjacent first ribs 122 (also the width of the first flow channel 121), the spacing t2 between adjacent second ribs 124 (also the width of the second flow channel 123) and the width l2 of the second flow channel 123 in the third direction; as well as the height h1 of the first rib 122 (also the depth of the first flow channel 121) and the depth h2 of the second rib 124 (also the depth of the second flow channel 123) in the first direction, and the angle between the extension direction of the first rib 122 and the second direction (i.e., the first deflection angle) α1 and the angle between the extension direction of the second rib 124 and the second direction (i.e., the second deflection angle) α2.

[0070] Correspondingly, the parameter variation range corresponding to the structural parameters refers to the width l1 of the first rib 122, and the width l2 of the second rib 124 that maintains a fixed quantitative relationship with the width l1 of the first rib 122, the spacing t1 between adjacent first ribs 122, and the spacing t2 between adjacent second ribs 124 that maintains a fixed quantitative relationship with the spacing t1 between adjacent first ribs 122, the range of the height h1 of the first rib 122 and the height h2 of the second rib 124, and the range of the angle α1 between the extension direction of the first rib 122 and the second direction and the angle α2 between the extension direction of the second rib 124 and the second direction.

[0071] As an example, the quantity relationship between the width l1 of the first rib 122 and the width l2 of the second rib 124 satisfies l1=N*l2, A refers to an arbitrary parameter greater than 1, for example, 2 or 3, etc., and thus, based on the actual value of the width l1 of the first rib 122, the width l2 of the second rib 124 can be correspondingly obtained.

[0072] The quantity relationship between the spacing t1 between adjacent first ribs 122 and the spacing t2 between adjacent second ribs 124 satisfies l1=M*l2, M refers to an arbitrary parameter greater than 1, for example, 2 or 3, etc. Thus, based on the actual value of the spacing t1 between adjacent first ribs 122, the spacing t2 between adjacent second ribs 124 can be correspondingly obtained.

[0073] As an example, the height h1 of the first rib 122 and the height h2 of the second rib 124 range from 50 μm to 100 μm.

[0074] As an example, the angle a1 between the extension direction of the first rib 122 and the second direction and the angle a2 between the extension direction of the second rib 124 and the second direction range from 30° to 60°.

[0075] In some embodiments, as shown in Figure 2 and Figure 5 The method for obtaining the performance parameter set of the micro-channel heat dissipation structure provided in step S2 further includes:

[0076] S21, sample sample points in the parameter variation range to obtain a sample point set.

[0077] The sample point sampling includes but is not limited to using the optimal Latin square sampling method to sample sample points in the parameter variation range to obtain a sample point set.

[0078] As an example, the structure parameters can specifically include the width l1 of the first rib 122, the spacing t1 between adjacent first ribs 122, the height h1 of the first rib 122, the height h2 of the second rib 124, the angle a1 between the extension direction of the first rib 122 and the second direction, and the angle a2 between the extension direction of the second rib 124 and the second direction. 6 independent variables, and the width l2 of the second rib 124 and the spacing t2 between adjacent first ribs 122 determined according to the quantity relationship; for these independent variables and their value ranges, the optimal Latin square sampling method is used, for example, 40 sample points are generated for each independent variable, that is, a 40 row & 6 column matrix sample point set is generated; if 50 samples are generated for each independent variable, a 50 row & 6 column matrix sample point set is generated, and so on.

[0079] S22, a first micro-channel heat dissipation structure model corresponding to a plurality of sample points in the sample point set is constructed, and model simulation is performed on the first micro-channel heat dissipation structure model to obtain micro-channel heat dissipation structure performance parameters corresponding to the plurality of sample points.

[0080] Wherein, the construction of the first micro-channel heat dissipation structure model corresponding to the plurality of sample points in the sample point set means that after confirming the software used for model construction, automatic modeling script is used to combine a plurality of samples in the sample point set to automatically model, so as to obtain the first micro-channel heat dissipation structure model corresponding to the plurality of sample points in a short time.

[0081] Wherein, the model simulation on the first micro-channel heat dissipation structure model means that after confirming the software used for model simulation, automatic simulation script is used to simulate the first micro-channel heat dissipation structure model corresponding to the plurality of sample points, so as to obtain the simulation result of the first micro-channel heat dissipation structure model corresponding to the plurality of sample points in a short time. Based on the simulation result of the first micro-channel heat dissipation structure model corresponding to the plurality of sample points, the micro-channel heat dissipation structure performance parameters corresponding to the plurality of sample points can be obtained.

[0082] Wherein, the micro-channel heat dissipation structure performance parameters corresponding to the plurality of sample points refer to the temperature of the active structure 110 and the overall pressure drop of the corresponding heat dissipation structure. Here, the temperature of the active structure 110 refers to the local maximum temperature of the active structure 110. In subsequent descriptions, the temperature of the active structure 110 represents the maximum temperature of the temperature of the active structure 110, and will not be specifically described.

[0083] Step S23, the micro-channel heat dissipation structure performance parameters corresponding to the plurality of sample points are taken as a sample set to train an initial performance prediction model to obtain a trained performance prediction model, so as to determine a micro-channel heat dissipation structure performance parameter set corresponding to different structure parameters in a parameter variation range according to the trained performance prediction model.

[0084] Wherein, the initial performance prediction model includes but is not limited to one selected from machine learning methods such as support vector machine (SVM), neural network (NN) and Gaussian process regression (GPR). Different initial performance prediction models are suitable for different scenarios. For example, support vector machine performs well in small sample and high-dimensional data scenarios, and can map data to high-dimensional space for classification and regression through kernel function; neural network is suitable for processing complex parameter-performance relationship due to its strong nonlinear fitting ability; Gaussian process regression can provide uncertainty estimation of prediction result, which is of great significance for evaluating prediction reliability.

[0085] In the process of training the initial performance prediction model, the input variables at least include the structural parameters of the heat dissipation structure; and the output variables at least include the temperature Tj of the active structure 110 and the overall pressure drop AP of the corresponding heat dissipation structure.

[0086] As an example, the initial performance prediction model adopts a neural network method to establish a training model. After confirming the initial performance prediction model, the number of layers, the number of nodes, and related factors of the micro-channel grid 120 are carefully adjusted as hyperparameters, and in the training process, cross-validation and other methods are used to evaluate the model, and the hyperparameters are continuously adjusted to minimize the prediction error of the trained performance prediction model on the validation set, thereby ensuring the accuracy of the trained performance prediction model.

[0087] After obtaining the trained performance prediction model, the dynamic expansion of the sample point set within the parameter variation range corresponding to the structural parameters can also be realized. Based on the dynamically expanded sample point set and the trained performance prediction model, the simulation results of the heat dissipation structure under any structural parameters can be quickly predicted, thereby obtaining the micro-channel heat dissipation structure performance parameter set within the structural variation range, thereby replacing a large number of actual CFD (Computational Fluid Dynamics, computational fluid dynamics) simulation calculations. This way effectively saves the design time and efficiency of the heat dissipation structure, greatly shortening the research and development cycle. For example, the traditional method may take several days to simulate a 100-sample point set, while the trained performance prediction model can complete it within several hours.

[0088] In addition, in order to ensure the accuracy of the trained performance prediction model in predicting the micro-channel heat dissipation structure performance parameters, in addition to optimizing the above-mentioned hyperparameters in the training process, an active learning strategy can also be adopted to preferentially select sample points with high prediction uncertainty of the trained performance prediction model for actual simulation, and the micro-channel heat dissipation structure performance parameters corresponding to the actual simulation results are added to the micro-channel heat dissipation structure performance parameter set to retrain the model, continuously improving the accuracy of the trained performance prediction model in predicting the micro-channel heat dissipation structure performance parameters. At the same time, the trained performance prediction model can also be periodically verified, and the prediction results are compared with the actual simulation results. When the error exceeds the preset threshold, the model is adjusted or retrained in a timely manner. Through the above measures, the trained performance prediction model can accurately and efficiently determine the micro-channel heat dissipation structure performance parameters corresponding to different structural parameters within the parameter variation range, and provide reliable data support for the effectiveness of the heat dissipation structure design results.

[0089] In some embodiments, as Figure 2 and Figure 6As shown, the step of selecting target microchannel heat dissipation structure performance parameters that meet the design requirements from the microchannel heat dissipation structure performance parameter set in step S3 specifically includes:

[0090] Step S31 : selecting preselected micro-channel heat dissipation structure performance parameters that meet the design requirements from a set of micro-channel heat dissipation structure performance parameters.

[0091] The method for selecting preselected microfluidic heat dissipation structure performance parameters that meet the design requirements includes searching a set of microfluidic heat dissipation structure performance parameters predicted by a trained performance prediction model using a multi-objective optimization algorithm. The multi-objective optimization algorithm includes, but is not limited to, a genetic algorithm or a particle swarm optimization algorithm. The optimization objectives can be two output objectives in the set of microfluidic heat dissipation structure performance parameters: the temperature of the active structure 110 and the overall pressure drop of the heat dissipation structure. The optimization process will output a Pareto curve reflecting the correlation between the maximum temperature Tj of the active structure 110 and the overall pressure drop ΔP of the heat dissipation structure. Based on the Pareto curve, the microfluidic heat dissipation structure performance parameters corresponding to the maximum temperature Tj of the active structure 110 and the overall pressure drop ΔP of the heat dissipation structure that both meet the design requirements are selected as the preselected microfluidic heat dissipation structure performance parameters.

[0092] As an example, when a chip performs the above steps to design a heat dissipation structure, the Pareto curve output by the trained performance prediction model is as follows: Figure 7 As shown. Figure 7 It can be seen that the maximum temperature Tj of the active structure 110 and the overall pressure drop ΔP of the heat dissipation structure change in opposite directions. The lower the temperature of the active structure, the higher the flow resistance of the coolant in the corresponding microchannel heat dissipation structure. Therefore, during the design process of this GPU chip, the microchannel heat dissipation structure performance parameters corresponding to a maximum temperature of 75°C and an overall pressure drop of 50 kPa can be selected as pre-selected microchannel heat dissipation structure performance parameters, thereby achieving a quick and efficient design solution that selects appropriate flow channel structure parameters based on heat dissipation and flow resistance requirements.

[0093] Step S32: construct a second microchannel heat dissipation structure model corresponding to the preselected microchannel heat dissipation structure performance parameters, and perform model simulation on the second microchannel heat dissipation structure model to obtain the microchannel heat dissipation structure performance parameters corresponding to the second microchannel heat dissipation structure model.

[0094] Since the pre-selected microfluidic heat dissipation structure performance parameters are the prediction results of the trained performance prediction model for the microfluidic heat dissipation structure performance parameters, in order to further verify the accuracy of the trained performance prediction model in predicting the microfluidic heat dissipation structure performance parameters, the structural parameters corresponding to the pre-selected microfluidic heat dissipation structure performance parameters are selected for actual modeling and simulation, that is, a second microfluidic heat dissipation structure model is constructed, and the second microfluidic heat dissipation structure model is simulated, thereby obtaining the microfluidic heat dissipation structure performance parameters corresponding to the second microfluidic heat dissipation structure model.

[0095] Then, the parameter error between the microfluidic heat dissipation structure performance parameters corresponding to the second microfluidic heat dissipation structure model and the pre-selected microfluidic heat dissipation structure performance parameters is compared with the parameter error threshold. If the parameter error is greater than the parameter error threshold, the trained performance prediction model is adjusted, or the microfluidic heat dissipation structure performance parameters corresponding to the actual simulation results are added to the microfluidic heat dissipation structure performance parameter set, and the model is retrained using the updated microfluidic heat dissipation structure performance parameter set to continuously improve the accuracy of the trained performance prediction model in predicting the microfluidic heat dissipation structure performance parameters.

[0096] Finally, step S31 to step S32 are executed again until the parameter error is no greater than the parameter error threshold, and the target microchannel heat dissipation structure performance parameters are obtained.

[0097] Through the above method, the trained performance prediction model can be further enabled to accurately and efficiently determine the performance parameters of the microchannel heat dissipation structure corresponding to different structural parameters within the parameter variation range, providing reliable data support for the effectiveness of the heat dissipation structure design results.

[0098] According to the third embodiment of the present application, a chip is also provided, such as Figure 8 and Figure 9 As shown, the chip 100 includes the heat dissipation structure described in the first embodiment, and adopts the heat dissipation structure design method described in the second embodiment to perform structural parameter design.

[0099] According to the fourth embodiment of the present application, a packaging structure is also provided, such as Figure 8 and Figure 9 As shown, the packaging structure includes the chip 100 described in the third embodiment above, and also includes a substrate 200 and a circuit board 300. The chip 100 is arranged on the substrate 200 and is electrically connected to the circuit board 300 through the substrate 200.

[0100] In some embodiments, the packaging structure further includes a liquid supply pipe 401 and a liquid return pipe 402 connected to the chip 100 , and a low-temperature cooling device connected to the chip 100 through the liquid supply pipe 401 and the liquid return pipe 402 .

[0101] Since the liquid supply pipe 401 is connected to the inlet end of the heat dissipation structure, the low-temperature cooling medium output by the low-temperature cooling device can be input into the heat dissipation structure through the liquid supply pipe 401, and the heat generated by the operation of the chip 100 is absorbed by the low-temperature cooling medium and the rotation process between the first flow channel 121 and the second flow channel 123.

[0102] Similarly, since the return liquid pipe 402 is connected to the outlet end of the heat dissipation structure, the heat dissipation structure can output the cooling medium with heat to the low-temperature cooling device through the return liquid pipe 402, and re-cool it in the low-temperature cooling device to form a low-temperature cooling medium, thereby realizing the circulation of the cooling medium between the low-temperature cooling device and the chip 100, achieving the effect of continuously cooling the chip 100.

[0103] In one embodiment, Figure 8 As shown, the packaging structure also includes a first connecting water nozzle 403 and a second connecting water nozzle 404. The first connecting water nozzle 403 passes through the packaging material on the side of the chip 100 close to the inlet end of the heat dissipation structure and is connected to the inlet end of the heat dissipation structure, so that the low-temperature cooling medium can flow into the heat dissipation structure through the liquid supply pipe 401 and the first connecting water nozzle 403 in sequence; the second connecting water nozzle 404 passes through the packaging material on the side of the chip 100 close to the outlet end of the heat dissipation structure and is connected to the outlet end of the heat dissipation structure, so that the cooling medium with heat can flow out through the second connecting water nozzle 404 and the return liquid pipe 402 in sequence.

[0104] In another embodiment, Figure 9 As shown, a first auxiliary heat dissipation channel 405 is embedded in and passes through the circuit board 300 on the side of the circuit board 300 near the inlet end of the heat dissipation structure, and a second auxiliary heat dissipation channel 406 is embedded in and passes through the circuit board 300 on the side of the circuit board 300 near the outlet end of the heat dissipation structure. The inlet end of the first auxiliary heat dissipation channel 405 is connected to the liquid supply pipe 401, and the outlet end of the first auxiliary heat dissipation channel 405 is connected to the side of the first connecting nozzle 403 away from the inlet end of the heat dissipation structure. This allows the low-temperature cooling medium to flow into the heat dissipation structure through the liquid supply pipe 401, the first auxiliary heat dissipation channel 405, and the first connecting nozzle 403 in sequence, thereby continuously cooling not only the chip 100 but also the electronic components arranged on the side of the circuit board 300 near the first auxiliary heat dissipation channel 405.

[0105] Similarly, the inlet end of the second auxiliary heat dissipation flow channel 406 is connected to the side of the second connecting water nozzle 404 away from the outlet end of the heat dissipation structure, and the outlet end of the second auxiliary heat dissipation flow channel 406 is connected to the liquid return pipeline 402, so that the cooling working medium output by the heat dissipation structure can flow out through the second connecting water nozzle 404, the second auxiliary heat dissipation flow channel 406 and the liquid return pipeline 402 in turn, and can also cool the electronic devices arranged on the circuit board 300 near the side of the second auxiliary heat dissipation flow channel 406 to a certain extent.

[0106] As an example, a plurality of first chips are also arranged on the circuit board 300, and the arrangement position of the first chip on the circuit board corresponds to the arrangement position of the first auxiliary heat dissipation flow channel 405 or the second auxiliary heat dissipation flow channel 406, for example, in the direction perpendicular to the surface of the circuit board, the projection of the first chip on the circuit board overlaps the projection of the first auxiliary heat dissipation flow channel 405 or the second auxiliary heat dissipation flow channel 406 on the circuit board, so that the heat generated by the operation of the first chip can also be conducted out through the cooling working medium flowing in the first auxiliary heat dissipation flow channel 405 or the second auxiliary heat dissipation flow channel 406, thereby further guaranteeing the operation stability of the first chip.

[0107] It should be noted that the pipe material and size of the liquid supply pipeline 401 and the liquid return pipeline 402, the first auxiliary heat dissipation flow channel 405 and the second auxiliary heat dissipation flow channel 406 can not be specifically limited. As an example, the liquid supply pipeline 401 and the liquid return pipeline 402 include but are not limited to conventional plastic hoses or plastic cold pipes with an outer diameter size of not greater than 1 mm, and the first auxiliary heat dissipation flow channel 405 and the second auxiliary heat dissipation flow channel 406 include but are not limited to metal pipes with certain structural strength and easy heat dissipation, for example, metal copper pipes, and the cross-sectional shape thereof can include but is not limited to a circular pipe or an elliptical pipe with an outer diameter size of not greater than 1 mm, or a rectangular square pipe with an outer size of not greater than 1*1 mm.

[0108] In summary, the heat dissipation structure provided by the present application includes a substrate, and a first flow channel and a second flow channel embedded in the substrate and stacked with each other and staggered in the extension direction. By adaptively adjusting the structural parameters of the micro-channel grid 120 formed by the staggered first flow channel and second flow channel, the heat exchange area and the convective heat transfer coefficient of the cooling working medium in the heat dissipation structure can be improved during the rotating flow of the cooling working medium in the micro-channel grid 120 with different structural parameters, and the simultaneous control of the heat dissipation efficiency and the flow resistance of the cooling working medium in the heat dissipation structure can be realized.

[0109] The heat dissipation structure design method provided in the application first obtains a corresponding micro-channel heat dissipation structure performance parameter set according to different structure parameters of the geometric structure of the heat dissipation structure to be designed, and then selects target micro-channel heat dissipation structure performance parameters meeting the design requirements from the micro-channel heat dissipation structure performance parameter set, and constructs a micro-channel heat dissipation structure with the corresponding structure parameters. Therefore, the application can quickly and efficiently obtain the target micro-channel heat dissipation structure performance parameters and the corresponding structure parameters, greatly shorten the design cycle of the structure parameters, save a lot of time and labor cost, reduce the dependence of the structure parameters on the design experience of the designers in the design, and at the same time, reduce the possible human errors such as parameter design omission and misjudgment, improve the accuracy and reliability of the design result acquisition.

[0110] In the foregoing embodiment descriptions, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0111] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

Claims

1. A heat dissipation structure, characterized in that: It includes a substrate and a microchannel grid arranged in the substrate; the microchannel grid includes at least a first channel layer and a second channel layer stacked along a first direction; the first channel layer includes a plurality of first channels extending in parallel, the second channel layer includes a plurality of second channels extending in parallel, and the extension direction of the first channel intersects with the extension direction of the second channel on a plane perpendicular to the first direction; wherein the first direction is the thickness direction of the substrate.

2. The heat dissipation structure according to claim 1, characterized in that: The first flow channel layer further includes a plurality of first fins extending in parallel, and the second flow channel layer further includes a plurality of second fins extending in parallel. The first flow channel is located between adjacent first fins extending in the same direction, and the second flow channel is located between adjacent second fins extending in the same direction.

3. The heat dissipation structure according to claim 2, characterized in that: The angle between the extension direction of the first rib and the second direction is the first deflection angle, and the angle between the extension direction of the second rib and the second direction is the second deflection angle. The first deflection angle and the second deflection angle are respectively smaller than the angle between the extension direction of the first rib and the extension direction of the second rib; wherein the second direction is a direction perpendicular to the first direction.

4. The heat dissipation structure according to claim 3, characterized in that: The first deflection angle ranges from 30° to 60°; And / or, the second deflection angle ranges from 30° to 60°.

5. The heat dissipation structure according to claim 3, characterized in that: The structural parameters of the first flow channel layer and the second flow channel layer are different; the structural parameters include at least the width of the first flow channel and the second flow channel in the third direction, the width of the first rib and the second rib in the third direction, and the height of the first rib and the second rib in the first direction; wherein the third direction is a direction perpendicular to the orthogonal plane of the first direction and the second direction.

6. The heat dissipation structure according to claim 5, characterized in that: A width of the first rib along the third direction is greater than a width of the second rib along the third direction.

7. The heat dissipation structure according to claim 5, characterized in that: A width of the first flow channel along the third direction is greater than a width of the second flow channel along the third direction.

8. The heat dissipation structure according to claim 5, characterized in that: The height of the first fin in the first direction ranges from 50 μm to 100 μm; And / or, a height of the second fins in the first direction ranges from 50 μm to 100 μm.

9. The heat dissipation structure according to claim 1, characterized in that: It also includes at least one inlet flow channel and one outlet flow channel, wherein the inlet flow channel is connected to the inlet end of the first flow channel, and the outlet flow channel is connected to the outlet end of the first flow channel and / or the second flow channel.

10. The heat dissipation structure according to claim 1, characterized in that: The substrate includes at least one of a silicon substrate, a gallium arsenide substrate, an indium phosphide substrate, a silicon carbide substrate, and a gallium nitride substrate.

11. A method for designing a heat dissipation structure, used for designing the heat dissipation structure according to any one of claims 1 to 10, characterized in that: include: Determining the geometric structure of the heat dissipation structure to be designed, as well as structural parameters of the geometric structure and parameter variation ranges corresponding to the structural parameters; Determine the microfluidic heat dissipation structure performance parameters corresponding to different structural parameters within the parameter variation range, and obtain a microfluidic heat dissipation structure performance parameter set; Target microfluidic heat dissipation structure performance parameters that meet the design requirements are selected from the microfluidic heat dissipation structure performance parameter set, so as to construct a heat dissipation structure according to the structural parameters corresponding to the target microfluidic heat dissipation structure performance parameters.

12. The method according to claim 11, characterized in that Determining the microchannel heat dissipation structure performance parameters corresponding to different structural parameters within the parameter variation range to obtain a set of microchannel heat dissipation structure performance parameters includes: Sampling sample points within the parameter variation range to obtain a sample point set; A first microfluidic channel heat dissipation structure model corresponding to a plurality of sample points in the sample point set is constructed, and a model simulation is performed on the first microfluidic channel heat dissipation structure model to obtain microfluidic channel heat dissipation structure performance parameters corresponding to the plurality of sample points.

13. The method according to claim 12, characterized in that After obtaining the microchannel heat dissipation structure performance parameters corresponding to the plurality of sample points, the method further includes: The performance parameters of the microfluidic heat dissipation structure corresponding to the multiple sample points are used as a sample set to train the initial performance prediction model to obtain a trained performance prediction model, so as to determine the set of microfluidic heat dissipation structure performance parameters corresponding to different structural parameters within the parameter variation range based on the trained performance prediction model.

14. The method according to claim 11, characterized in that The selecting of target microchannel heat dissipation structure performance parameters that meet the design requirements from the microchannel heat dissipation structure performance parameter set includes: Selecting preselected microfluidic channel heat dissipation structure performance parameters that meet the design requirements from the microfluidic channel heat dissipation structure performance parameter set; Constructing a second microfluidic channel heat dissipation structure model corresponding to the preselected microfluidic channel heat dissipation structure performance parameters, and performing model simulation on the second microfluidic channel heat dissipation structure model to obtain the microfluidic channel heat dissipation structure performance parameters corresponding to the second microfluidic channel heat dissipation structure model; If the parameter error between the microfluidic heat dissipation structure performance parameters corresponding to the second microfluidic heat dissipation structure model and the preselected microfluidic heat dissipation structure performance parameters is greater than the parameter error threshold, the microfluidic heat dissipation structure performance parameter set is acquired again until the parameter error is no greater than the parameter error threshold, and the target microfluidic heat dissipation structure performance parameters are obtained.

15. The method according to claim 14, characterized in that The microchannel heat dissipation structure performance parameters include the temperature of the active structure and the channel pressure drop of the heat dissipation structure. The preselected microchannel heat dissipation structure performance parameters that meet the design requirements are selected from the microchannel heat dissipation structure performance parameter set, including: Determining a correlation between the temperature of the active structure and the channel pressure drop of the heat dissipation structure according to the set of performance parameters of the microchannel heat dissipation structure; According to the association relationship, the preselected micro-channel heat dissipation structure performance parameters that meet the design requirements are selected from the micro-channel heat dissipation structure performance parameter set.

16. A packaging structure, characterized in that: include: circuit boards; a substrate, disposed on the circuit board; A chip is arranged on the substrate and electrically connected to the circuit board through the substrate; wherein the chip includes the heat dissipation structure according to any one of claims 1 to 10.

17. The packaging structure according to claim 16, wherein: It also includes a liquid supply pipe and a liquid return pipe, wherein the liquid supply pipe is connected to the inlet end of the heat dissipation structure, and the liquid return pipe is connected to the outlet end of the heat dissipation structure.

18. The packaging structure according to claim 17, wherein: It also includes a first auxiliary heat dissipation channel and a second auxiliary heat dissipation channel embedded in and passing through the circuit board, a first connecting water nozzle connecting the inlet end of the heat dissipation structure and the first auxiliary heat dissipation channel, and a second connecting water nozzle connecting the outlet end of the heat dissipation structure and the second auxiliary heat dissipation channel. The liquid supply pipe is connected to the inlet end of the heat dissipation structure in turn through the first auxiliary heat dissipation channel and the first connecting water nozzle, and the return liquid pipe is connected to the outlet end of the heat dissipation structure in turn through the second auxiliary heat dissipation channel and the second connecting water nozzle.

19. The packaging structure according to claim 18, wherein: It also includes at least one first chip, which is arranged on the circuit board, and the vertical projection of the first chip on the circuit board overlaps with the vertical projection of the first auxiliary heat dissipation channel or the second auxiliary heat dissipation channel on the circuit board.

20. The packaging structure according to claim 18, wherein: The first auxiliary heat dissipation channel and / or the second auxiliary heat dissipation channel are formed by metal tubes, and the cross-sectional shape of the metal tubes is one of rectangular, circular or elliptical.

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