A water-cooling heat dissipation method, system and device based on modular design

Abstract

The application discloses a water-cooling heat dissipation method, system and device based on modular design, and belongs to the technical field of water-cooling heat dissipation, and comprises the following steps: analyzing the blockage coefficients of water-cooling heat dissipation modules, determining the blockage information of the water-cooling heat dissipation modules, determining the first blockage adjustment execution strategies of the water-cooling heat dissipation modules, recording corresponding water-cooling heat dissipation modules as first adjustment modules after the first blockage adjustment execution strategies are executed, determining the second blockage adjustment execution strategies of the first adjustment modules, recording corresponding modules as lag monitoring modules when the blockage information of the water-cooling heat dissipation modules is slight blockage or severe blockage, and determining the lag adjustment execution strategies of the lag monitoring modules. The application improves the heat dissipation efficiency and operation stability of the system, avoids heat accumulation and local overheating, prolongs the service life of equipment, and enhances the comprehensiveness and response speed of the heat dissipation system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of water-cooled heat dissipation, and in particular to a water-cooled heat dissipation method, system and device based on modular design. BACKGROUND

[0002] With the wide application of high-power semiconductor lasers (Laser Diode, LD) in laser processing, optical communication, medical irradiation, ultraviolet exposure and spectral detection, the heat power density per unit area continues to rise, and higher requirements are put forward for the structure design and heat control ability of the heat dissipation system. In order to effectively control the temperature of the laser chip, maintain the stability of the output wavelength of the laser, the power continuity and prolong the service life of the chip, the high performance and intelligence of the heat dissipation system has become a key link in system design.

[0003] At present, water-cooled heat dissipation modules are widely used in semiconductor laser array systems as a high-efficiency heat management means. Such modules usually use high-thermal-conductivity metal bases combined with micro-channel structures, and through the circulation of deionized water or special cooling liquid inside the module, a large amount of heat generated by the chip during operation is taken away, ensuring that it works stably within the safe temperature window. In terms of chip packaging structure, flip-chip soldering is usually used, and metalized ceramic heat-conducting sheets or heat sink structures are used to reduce thermal resistance and improve heat dissipation efficiency; in the optical path design, in order to adapt to the output requirements of high directivity and high power density, micro-lens arrays, collimating optical components and protective glasses are often used to form a complete laser emission structure; in terms of structure, the laser chip water-cooled module usually includes a metal heat-conducting base, a cooling flow channel structure, an inlet and outlet water interface, an adjustable pump or a water distributor, a power connection copper bar and a signal control interface. In order to realize multi-module integration, array light emission and partition management, the system can use modular combination, cooperate with the driving power supply and the upper computer control platform, and realize the power control, flow distribution, temperature feedback and fault adjustment of each module.

[0004] For example, the power semiconductor water-cooled packaging device and water-cooled control method disclosed in the Chinese patent with publication number CN119480823B include a substrate and a chip, the chip includes a first surface and a second surface opposite to the first surface, the first surface is mounted on the substrate, and further includes a heat dissipation member and a shell, the heat dissipation member includes an evaporation side, a liquid storage cavity and a condensation side, the liquid storage cavity is used to store a cooling medium, the cooling medium is configured to evaporate at the evaporation side under heating and condense at the condensation side under cooling, the condensation side includes a plurality of protrusions arranged at intervals, the protrusions extend to the outside of the condensation side, the inside of the protrusions is hollow and communicates with the liquid storage cavity, the shell is arranged at the outer periphery of the plurality of protrusions to enclose the plurality of protrusions, and the space enclosed by the plurality of protrusions and the shell forms a cooling cavity, the cooling cavity is used to store the water-cooled medium, at least one water inlet is arranged at the first end of the shell, and at least one water outlet is arranged at the second end of the shell.

[0005] For example, the Chinese invention patent with publication number CN118213338A discloses a multi-stage composite water cooling heat dissipation system, control method and control device. The system is used for dissipating heat of a load unit. The system includes a water cooling head, which includes a first heat exchange mechanism and a second heat exchange mechanism. The bottom of the first heat exchange mechanism is fixed on the load unit, and the bottom of the second heat exchange mechanism is fixed on the top of the first heat exchange mechanism, and the second heat exchange mechanism can dissipate heat of the fluid flowing therethrough.

[0006] The above technology at least has the following technical problems:

[0007] During long-term operation of the water cooling module, particles, bubbles or microorganisms may be mixed in the cooling liquid, which is easy to accumulate in the microchannels, causing local blockage or flow reduction. The heat dissipation capacity of the module will change with the use time, structure state or cooling efficiency. When the power of the chip suddenly rises, if the heat dissipation response is lagging, heat accumulation is easy to occur, which affects the system stability. At the same time, part of the blockage will reduce the heat exchange efficiency. When the chip thermal load increases, the cooling system is difficult to remove heat in time, thereby causing the temperature rise response to lag. SUMMARY

[0008] The first aspect of the present application provides a water cooling heat dissipation method based on modular design, comprising the following steps:

[0009] Collecting the blockage characteristic data of each water cooling heat dissipation module, analyzing the blockage coefficients of each water cooling heat dissipation module, thereby determining the blockage information of each water cooling heat dissipation module, and synchronously determining the first blockage adjustment execution strategy of each water cooling heat dissipation module.

[0010] After executing the first blockage adjustment execution strategy, the corresponding water cooling heat dissipation module is recorded as a first adjustment module, the blockage coefficients of each first adjustment module are reanalyzed, thereby determining the second blockage adjustment execution strategy of each first adjustment module.

[0011] When the blockage information of the water cooling heat dissipation module is mild blockage or severe blockage, the corresponding module is recorded as a lag monitoring module, and the thermal lag monitoring of each lag monitoring module is synchronously performed, the thermal lag coefficients of each lag monitoring module are analyzed, and the lag adjustment execution strategy of each lag monitoring module is determined.

[0012] The second aspect of the present application provides a water cooling heat dissipation system based on modular design, comprising:

[0013] The first blockage adjustment execution strategy determination module is used for collecting the blockage characteristic data of each water cooling heat dissipation module, analyzing the blockage coefficients of each water cooling heat dissipation module, thereby determining the blockage information of each water cooling heat dissipation module, and synchronously determining the first blockage adjustment execution strategy of each water cooling heat dissipation module.

[0014] A second blockage adjustment execution strategy determination module is configured to, after executing the first blockage adjustment execution strategy, record the water-cooled heat dissipation module as a first adjustment module, re-analyze the blockage coefficients of each first adjustment module, and determine the second blockage adjustment execution strategy of each first adjustment module.

[0015] A hysteresis adjustment execution strategy determination module is configured to, when the blockage information of the water-cooled heat dissipation module is mild blockage or severe blockage, record the corresponding module as a hysteresis monitoring module, synchronously perform thermal hysteresis monitoring of each hysteresis monitoring module, analyze the thermal hysteresis coefficients of each hysteresis monitoring module, and determine the hysteresis adjustment execution strategy of each hysteresis monitoring module.

[0016] The third aspect of the present application provides a water-cooled heat dissipation device based on modular design, comprising: a heat sink, a power supply, a sensor array and a controller.

[0017] The heat sink is composed of a water inlet pipe connector, a water outlet pipe connector, a water inlet, a water outlet, a water tank cavity, a sealing member, a heat dissipation plate and a sealing and fixing device.

[0018] The power supply is used to provide stable direct current power for the water-cooled heat dissipation module and related electronic elements.

[0019] The sensor array is used to collect related parameters of the water-cooled heat dissipation module.

[0020] The controller is used to receive real-time monitoring data from the sensor, execute blockage coefficient and thermal hysteresis coefficient calculation of the water-cooled heat dissipation module, and generate an adjustment strategy.

[0021] The one or more technical solutions provided in the present application have at least the following technical effects or advantages:

[0022] 1. The water-cooled heat dissipation method based on modular design provided by the present application can realize real-time monitoring and accurate evaluation of the blockage state and thermal response characteristics of each water-cooled heat dissipation module, automatically adjust the cooling liquid flow rate and chip power output based on the quantified blockage coefficient and thermal hysteresis coefficient, coordinate the joint adjustment of the cooling side and the heat source side, improve the heat dissipation efficiency and operation stability of the system, avoid heat accumulation and local overheating, prolong the service life of the equipment, and enhance the comprehensiveness and response speed of the heat dissipation system.

[0023] 2. The present application can realize rapid response and hierarchical management of the module blockage state by determining the first blockage adjustment execution strategy of each water-cooled heat dissipation module, automatically match the corresponding adjustment scheme for different blockage degrees, alleviate the problem of cooling efficiency decline caused by flow passage blockage, improve the identification accuracy of the system to blockage risk, and can also take corresponding measures in time to prevent the blockage condition from deteriorating, ensure uniform distribution of cooling flow, improve the overall heat dissipation effect and equipment stability, and reduce the maintenance frequency.

[0024] 3、The present application can further accurately evaluate and optimize the control of the water-cooled heat dissipation module after preliminary adjustment by determining the second blockage adjustment execution strategy of each first adjustment module, implement joint supplementary adjustment or backflush adjustment for the unresolved blockage problem, improve the blockage removal efficiency and heat dissipation performance, prevent repeated blockage, prolong the service life of the module, and further ensure the stability and efficiency of the system operation.

[0025] 4、The present application can real-time identify and quantify the thermal response hysteresis condition of the module by determining the hysteresis adjustment execution strategy of each hysteresis monitoring module, dynamically adjust the thermal hysteresis definition standard combined with the blockage factor, and accurately determine whether the module has abnormal heat accumulation. Based on this strategy, the system can intelligently select and execute the joint adjustment or continuous monitoring of the cooling side and the heat source side, ensure the dynamic balance of the heat dissipation efficiency and the chip power, quickly respond to temperature fluctuations, effectively prevent local overheating and thermal damage, and improve the stability and reliability of the overall heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A water-cooled heat dissipation method flow chart based on modular design is provided for the embodiments of the present application.

[0027] Figure 2 A structure schematic diagram of a water-cooled heat dissipation system based on modular design is provided for the embodiments of the present application.

[0028] Figure 3 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 1 .

[0029] Figure 4 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 2 .

[0030] Figure 5 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 3 .

[0031] Figure 6 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 4 .

[0032] The drawings show that: 1, signal plate; 2, connecting copper bar; 3, water distributor; 4, driving plate; 5, array module; 6, communication serial port; 7, control serial port; 8, water inlet and outlet; 9, electrode copper bar +; 10, electrode copper bar-; 11, protective glass; 12, protective glass frame; 13, power supply; 14, chip lamp bead. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0034] Referring to Figure 1 The first aspect of the present application provides a water-cooling heat dissipation method based on modular design, comprising the following steps:

[0035] Collecting the blockage characterization data of each water-cooling heat dissipation module, analyzing the blockage coefficients of each water-cooling heat dissipation module, thereby determining the blockage information of each water-cooling heat dissipation module, and synchronously determining the first blockage adjustment execution strategy of each water-cooling heat dissipation module.

[0036] Further, the blockage information of each water-cooling heat dissipation module is determined, and the first blockage adjustment execution strategy of each water-cooling heat dissipation module is synchronously determined, and the specific analysis method is as follows:

[0037] The blockage characterization data of each water-cooling heat dissipation module includes the pressure difference, fluid flow and liquid flow rate of each water-cooling heat dissipation module.

[0038] The pressure difference refers to the pressure difference value between the water inlet and the water outlet of each water-cooling heat dissipation module. A micro pressure sensor is installed at the water inlet and the water outlet of each water-cooling heat dissipation module, and the pressure value is collected in real time through the sensor. The system determines the blockage degree of the module flow channel and the change of fluid resistance according to the change of the pressure difference.

[0039] The fluid flow is the cooling liquid volume flow rate through the water-cooling heat dissipation module inlet per unit time, usually in units of liters per minute (L / min) or milliliters per second (mL / s). The flow data is obtained through a micro flow sensor arranged at the module inlet. In specific embodiments, the flow sensor can adopt types such as thermal, turbine or ultrasonic, which can realize continuous and accurate flow monitoring.

[0040] The liquid flow rate refers to the linear velocity of the cooling liquid in the internal cooling channel of the module, usually expressed in meters per second (m / s), and the liquid flow rate data can be directly collected through a micro flow rate sensor.

[0041] The pressure difference, the fluid flow rate and the liquid flow rate are closely related. The pressure difference directly affects the fluid flow rate as the driving force. Generally, the increase of the pressure difference leads to the increase of the fluid flow rate and the liquid flow rate. The change of the fluid flow rate reflects the delivery amount of the cooling liquid per unit time. When the fluid flow rate increases, the liquid flow rate also increases under the fixed cross-sectional area of the channel. The change of the liquid flow rate affects the pressure loss in the pipeline, and then affects the size of the pressure difference. Therefore, the three parameters interact with each other to form a dynamic balance relationship. The change of any one parameter will cause the corresponding adjustment of the remaining parameters.

[0042] The reference pressure difference, the reference fluid flow rate and the reference liquid flow rate in the database are extracted.

[0043] The pressure difference measurement factor, the fluid flow rate measurement factor and the liquid flow rate measurement factor are extracted.

[0044] It should be noted that a plurality of mapping relationships are pre-established in the system database for the measurement factors of the parameters. These mapping relationships are stored in the form of a structured data table (such as a weight configuration table), and are combined with the monitoring data and experimental data of the water-cooled heat dissipation module through an associated query to build a complete water-cooled heat dissipation module blockage evaluation system. Based on the system, the measurement factors corresponding to the pressure difference, the fluid flow rate and the liquid flow rate can be directly obtained from the database. The measurement factor values are limited in the range of 0 to 1 and the sum is 1.

[0045] The blockage coefficients of the water-cooled heat dissipation modules are analyzed based on the blockage characterization data of the water-cooled heat dissipation modules.

[0046] The blockage coefficients of the water-cooled heat dissipation modules are quantitative indexes of the influence of the pressure difference, the fluid flow rate and the liquid flow rate of the water-cooled heat dissipation modules on the blockage degree of the water-cooled modules. The specific analysis process is as follows: the pressure difference between the outlet and the inlet is compared with the corresponding reference value, the reference values of the fluid flow rate and the liquid flow rate are compared with the corresponding fluid flow rate and liquid flow rate, and the results of the comparison are coupled with the corresponding measurement factors for weighted coupling processing, so as to obtain the blockage coefficients of the water-cooled heat dissipation modules.

[0047] In specific embodiments, the blockage coefficients of the water-cooled heat dissipation modules are specifically represented as:

[0048] ;

[0049] Wherein, A i is the blockage coefficient of the i-th water-cooled heat dissipation module, a i is the pressure difference of the i-th water-cooled heat dissipation module, b i is the fluid flow rate of the i-th water-cooled heat dissipation module, c iis the liquid flow rate of the ith water-cooled heat dissipation module, a0 is a reference pressure difference, b0 is a reference fluid flow, c0 is a reference liquid flow rate, x1 is a pressure difference measurement factor, x2 is a fluid flow measurement factor, x3 is a liquid flow speed measurement factor, i is the number of the water-cooled heat dissipation module, i = 1, 2, …, n, n is the number of the water-cooled heat dissipation modules.

[0050] It needs to be understood that if the pressure difference between the inlet and outlet increases significantly, it often indicates that the resistance of the intermediate channel increases, and factors such as deposition of particulate matter, bubble blockage, or microbial membrane may cause local flow passage contraction or blockage. The greater the pressure difference, the greater the degree of blockage. Under normal conditions, the water pump provides stable pressure. If the flow of a certain water-cooled heat dissipation module abnormally decreases, it indicates that the channel resistance increases or the effective channel area decreases, i.e., there is blockage. Under the condition that the structural size is fixed, the decrease in flow rate also reflects the decrease in channel smoothness, especially at the chip microchannel and bending structure, blockage will more directly lead to a decrease in flow rate.

[0051] The first threshold value of the blockage coefficient and the second threshold value of the blockage coefficient in the database are extracted.

[0052] It needs to be supplemented that the first threshold value of the blockage coefficient is less than the second threshold value of the blockage coefficient.

[0053] If the blockage coefficient of a certain water-cooled heat dissipation module is less than the first threshold value of the blockage coefficient, the blockage information of the water-cooled heat dissipation module is marked as normal, and the first blockage adjustment execution strategy of the water-cooled heat dissipation module is simultaneously marked as continuous monitoring.

[0054] It needs to be supplemented that the blockage information of the water-cooled heat dissipation module includes normal state, slight blockage, and severe blockage.

[0055] In this embodiment, when the blockage coefficient of a certain water-cooled heat dissipation module is lower than the first threshold value, it indicates that the flow passage of the module is unobstructed, the cooling liquid flows smoothly, the pressure loss and flow resistance are within a reasonable range, and the module heat dissipation performance is normal and stable. At this time, the system does not need to perform additional adjustment, and only maintains the continuous monitoring state, ensuring real-time feedback of the module operating state, timely discovery of abnormal changes, and protection of the stability and high-efficiency heat dissipation effect of the entire water-cooled system.

[0056] If the blockage coefficient of a certain water-cooled heat dissipation module is greater than or equal to the first threshold value of the blockage coefficient and less than or equal to the second threshold value of the blockage coefficient, the blockage information of the water-cooled heat dissipation module is marked as slight blockage, and the first blockage adjustment execution strategy of the water-cooled heat dissipation module is simultaneously marked as executing water pump power adjustment.

[0057] When the blockage coefficient of a certain water-cooled heat dissipation module is greater than or equal to the first threshold value and less than or equal to the second threshold value, it indicates that there is a certain degree of blockage or flow channel abnormality inside the module, which causes the fluid flow to be blocked, the pressure difference to increase, and the heat dissipation efficiency to possibly decrease slightly. In order to avoid the blockage from further intensifying and affecting the overall cooling performance of the system, the system will automatically adjust the water pump power, increase the flow and flow rate, enhance the circulation of the cooling liquid, and improve the module heat dissipation condition, thereby effectively delaying the development of the blockage and improving the reliability and service life of the module and the system.

[0058] Further, the water pump power adjustment is performed, and the specific analysis process is as follows:

[0059] Each water-cooled heat dissipation module is traversed to obtain each slightly blocked water-cooled heat dissipation module.

[0060] Based on the blockage coefficient of each water-cooled heat dissipation module, the blockage coefficient of each slightly blocked water-cooled heat dissipation module is extracted.

[0061] The blockage coefficient of each slightly blocked water-cooled heat dissipation module is subjected to deviation processing with the blockage coefficient first threshold value to obtain the blockage coefficient deviation factor of each slightly blocked water-cooled heat dissipation module.

[0062] Based on the blockage coefficient deviation factor of each slightly blocked water-cooled heat dissipation module, the water pump power supplement value of each slightly blocked water-cooled heat dissipation module is matched.

[0063] In this embodiment, the mapping relationship between the blockage coefficient deviation factor and the corresponding water pump power supplement value is pre-stored in the database, and the mapping relationship is managed through a structured mapping table (such as a power adjustment mapping table). In the matching process, first, the blockage coefficient deviation factor of each slightly blocked water-cooled heat dissipation module is extracted, and then the deviation factor is used as a key value to query the corresponding water pump power supplement value in the mapping table, so as to realize fast and accurate acquisition of the power adjustment parameter. The mapping table is pre-set according to actual operation data and an experience model, and the values can be dynamically adjusted to ensure accurate and efficient adjustment effect.

[0064] The blockage coefficients of each slightly blocked water-cooled heat dissipation module are arranged in descending order, and the arrangement order is used as the adjustment order of the corresponding slightly blocked water-cooled heat dissipation module.

[0065] In this embodiment, the blockage coefficients of each slightly blocked water-cooled heat dissipation module are arranged in descending order, and the arrangement order is used to determine the priority of adjustment, which can ensure that the system preferentially adjusts the power supplement of the modules with higher blockage degree among the slightly blocked modules, so as to more effectively alleviate the blockage condition and prevent it from further deteriorating. This ordering adjustment strategy based on the severity of blockage helps to achieve accurate management of the slightly blocked modules and improve the heat dissipation efficiency and stability of the overall water-cooled system under limited adjustment resources.

[0066] The water pump power adjustment is performed according to the water pump power supplement value of each light blockage water-cooled heat dissipation module in the light blockage water-cooled heat dissipation module adjustment order, specifically: the system sets the water pump power supplement value of each module according to the light blockage water-cooled heat dissipation module adjustment order. First, the power supplement value of the corresponding module in the mapping table is read, and then the corresponding water pump output power is adjusted by controlling the driving unit.

[0067] If the blockage coefficient of a water-cooled heat dissipation module is greater than the second threshold value of the blockage coefficient, the blockage information of the water-cooled heat dissipation module is marked as heavy blockage, and the first blockage adjustment execution strategy of the water-cooled heat dissipation module is marked as joint adjustment.

[0068] When the blockage coefficient of a water-cooled heat dissipation module exceeds the second threshold value, it means that the module is severely blocked, the fluid flow resistance increases significantly, the cooling effect decreases significantly, and there is a risk of heat accumulation and local overheating. To address this situation, the system will execute a joint adjustment strategy, which will not only increase the water pump power to increase the flow rate, but also enable acoustic descaling to quickly remove blockages, restore flow passage, stabilize module temperature, prevent equipment failure due to insufficient heat dissipation, and improve the self-healing ability and safety of the system.

[0069] Further, the joint adjustment is executed, and the specific process is as follows:

[0070] Each water-cooled heat dissipation module is traversed to obtain each heavy blockage water-cooled heat dissipation module, and the blockage coefficient of each heavy blockage water-cooled heat dissipation module is extracted based on the blockage coefficient of each water-cooled heat dissipation module.

[0071] An acoustic descaling start instruction is generated.

[0072] The blockage coefficient deviation factor of each heavy blockage water-cooled heat dissipation module is obtained, that is, the blockage coefficient of each water-cooled heat dissipation module is subtracted from the second threshold value of the blockage coefficient.

[0073] The joint adjustment execution parameters are matched based on the blockage coefficient deviation factor of each heavy blockage water-cooled heat dissipation module, and the joint adjustment of each heavy blockage water-cooled heat dissipation module is executed.

[0074] The joint adjustment execution parameters include the water pump power supplement value and the acoustic descaling execution time length.

[0075] In this embodiment, a severe blockage parameter mapping table is pre-established in the database, which stores the mapping relationship between the blockage coefficient deviation factor and the corresponding joint adjustment execution parameter. The mapping relationship is constructed through historical experimental data, simulation results or expert experience, with clear parameter interval division and adjustment response logic. The system first extracts the blockage coefficient deviation factor of each severe blockage water-cooled heat dissipation module as an index item, and then queries the joint adjustment execution parameter group corresponding to the deviation factor in the database, i.e., the corresponding water pump power supplement value (used to increase the flow to enhance the channel flushing effect), and the corresponding sound wave descaling execution time (used for the working time of the sound wave excitation device to achieve the stripping or breaking of the blockage).

[0076] It should be noted that in this embodiment, the matching logic uses interval matching (setting the deviation factor to fall within a certain range to correspond to a certain parameter group).

[0077] After matching, the joint adjustment is executed according to the following steps: the power supplement value obtained by matching is sent to the corresponding water pump through the control unit to increase the flow rate and impact force of the target module; the sound wave descaling device is started simultaneously, and the action time is set according to the matching parameter to make the sound wave produce micro-vibration or cavitation effect inside the flow channel, destroy the blockage structure and promote the sediment to fall off.

[0078] After executing the first blockage adjustment execution strategy, the corresponding water-cooled heat dissipation module is recorded as the first adjustment module, and the blockage coefficient of each first adjustment module is reanalyzed to determine the second blockage adjustment execution strategy of each first adjustment module.

[0079] Further, the second blockage adjustment execution strategy of each first adjustment module is determined, and the specific analysis process is as follows:

[0080] The blockage coefficient of each first adjustment module is reanalyzed.

[0081] Based on the blockage coefficient of each water-cooled heat dissipation module, the blockage coefficient of each first adjustment module is extracted, recorded as the prior blockage coefficient of each first adjustment module, and the blockage correction factor of each first adjustment module is extracted from the corresponding mapping table.

[0082] The blockage coefficient correction value of each first adjustment module is obtained by the blockage coefficient of each first adjustment module and the blockage correction factor of each first adjustment module, i.e., the blockage coefficient of each first adjustment module is multiplied by the corresponding blockage correction factor of the first adjustment module.

[0083] It should be noted that the introduction of the blockage correction factor is to quantitatively correct the change trend of the blockage state of the first adjustment module after the adjustment is executed, so as to improve the accuracy of subsequent strategy judgment. Since the initial adjustment may not completely eliminate the blockage inside the module or there is an adjustment delay effect, directly using the blockage coefficient after adjustment may underestimate the actual blockage risk. Therefore, by multiplying the preset blockage correction factor, the real blockage degree of the current module can be more reasonably reflected, and a more representative blockage coefficient correction value is generated. The correction value provides a more accurate numerical basis for subsequent judgment of whether to continue adjustment and execution of which adjustment strategy, enhancing the system's perception ability and adjustment accuracy of the blockage trend change.

[0084] The blockage coefficient correction value of each first adjustment module is subtracted from the blockage coefficient first threshold value to obtain the blockage coefficient deviation value of each first adjustment module. If the corresponding first adjustment module has not executed the joint adjustment strategy, the blockage coefficient deviation value of the first adjustment module is recorded as the blockage coefficient first deviation value. If the corresponding first adjustment module has executed the joint adjustment strategy, the blockage coefficient deviation value of the first adjustment module is recorded as the blockage coefficient second deviation value.

[0085] If the blockage coefficient correction value of a certain first adjustment module is between the blockage coefficient first threshold value and the blockage coefficient second threshold value, if the first adjustment module has not executed the joint adjustment strategy, the second blockage adjustment execution strategy of the first adjustment module is recorded as executing joint supplemental adjustment, a sonic washing instruction is generated, the blockage coefficient first deviation value of the first adjustment module is obtained, and the sonic washing time length is extracted from the self-mapping table based on this, so as to execute the joint supplemental adjustment.

[0086] If the blockage coefficient correction value of a certain first adjustment module is between the blockage coefficient first threshold value and the blockage coefficient second threshold value, if the first adjustment module has executed the joint adjustment strategy, the second blockage adjustment execution strategy of the first adjustment module is recorded as executing the backflushing adjustment, a prompt information is generated, a backflushing pump start instruction is generated, the blockage coefficient second deviation value of the first adjustment module is obtained, the backflushing pump execution pressure and the backflushing pump execution time length are matched, and the backflushing adjustment is executed.

[0087] If the blockage coefficient correction value of a certain first adjustment module is between the blockage coefficient first threshold value and the blockage coefficient second threshold value, it means that the first adjustment module has not completely recovered to the normal range after executing the initial adjustment (such as water pump power supplement or sonic descaling), so further strategy supplement or enhancement needs to be taken according to its historical adjustment record.

[0088] If the module has not previously used the composite adjustment means, only power adjustment has been carried out, and there is still a slight risk of blockage, the system will mark the module as joint supplementary adjustment, supplement the cleaning by adding a sonic cleaning operation, and according to the first deviation value of the blockage coefficient of the module at present, extract the corresponding sonic cleaning time from the database to realize more targeted secondary adjustment.

[0089] If the first adjustment module has already executed the joint adjustment strategy at this time, the module has not returned to the normal range even after joint adjustment (both water pump power improvement and acoustic descaling), there is a possibility of adjustment response lag, deep blockage or local structural defects. At this time, the system will mark the module as performing backflush adjustment to further clean the residual blockage by reverse water flow. The system will match the appropriate backflush execution pressure and time according to the second deviation value of the blockage coefficient of the module to ensure that the intensity and effect of backflush adjustment are controllable, and generate prompt information at the same time.

[0090] If the blockage coefficient correction value of a first adjustment module is less than the first threshold value of the blockage coefficient, the second blockage adjustment execution strategy of the first adjustment module is recorded as continuous monitoring, and an adjustment completion signal is generated.

[0091] If the blockage coefficient correction value of a first adjustment module is less than the first threshold value of the blockage coefficient, the module has basically returned to the normal operating state after initial adjustment, and the blockage effect has been effectively alleviated. At this time, there is no need for further intervention, the system will mark it as a continuous monitoring state, and generate an adjustment completion signal to prompt that the module does not need to participate in the adjustment process at present, and only the subsequent monitoring mechanism needs to be retained to prevent the recurrence of blockage.

[0092] If the blockage coefficient correction value of a first adjustment module is greater than the second threshold value of the blockage coefficient, the second blockage adjustment execution strategy of the first adjustment module is recorded as generating a warning prompt information.

[0093] If the blockage coefficient correction value of a first adjustment module is greater than the second threshold value of the blockage coefficient, even after preliminary adjustment, the blockage of the module is still abnormally serious, which has exceeded the range that can be recovered by conventional adjustment, and there is a significant risk of operation. Generate a warning prompt information to prompt that immediate evaluation of whether to take more advanced repair measures (such as long-term backflush, shutdown maintenance, replacement of parts, etc.) is needed to ensure the operation safety and thermal management stability of the entire water cooling system.

[0094] When the blockage information of the water cooling heat dissipation module is mild blockage or severe blockage, the corresponding module is marked as a lag monitoring module, and the thermal lag monitoring of each lag monitoring module is carried out at the same time. The thermal lag coefficient of each lag monitoring module is analyzed to determine the lag adjustment execution strategy of each lag monitoring module.

[0095] Further, the thermal hysteresis coefficients of each hysteresis monitoring module are analyzed, and the specific analysis process is as follows:

[0096] The thermal hysteresis monitoring data of each hysteresis monitoring module is collected, including the chip temperature rise rate, temperature lag duration and temperature rise time constant of each hysteresis monitoring module.

[0097] The chip temperature rise rate refers to the temperature rise speed per unit time of the chip after power-on heating, which is used to reflect the response ability of the chip to heat input. Its value can be calculated based on the slope of the temperature change curve in the initial time period after the power of the chip suddenly changes, usually extracted and quantized by a thermal sensor in cooperation with sampling software.

[0098] The temperature lag duration refers to the delay time of the temperature of the chip or the temperature-sensitive area after the power input suddenly changes, which is used to represent the degree of thermal response delay of the module. This parameter can be extracted by comparing the power change signal with the temperature curve trend, and the starting time when the temperature first enters the rapid rising interval is extracted, and the time difference between the power mutation time and the starting time is calculated.

[0099] The temperature rise time constant refers to the time required for the temperature of the chip to reach 63.2% of the final steady-state temperature under the heating condition, which is used to evaluate the overall thermal inertia and response speed of the module. This parameter can be obtained by collecting the temperature change curve of the chip, calculating the final temperature value, and determining the time point when the curve first reaches 63.2% of the value. The time interval is taken as the temperature rise time constant.

[0100] The chip temperature rise rate, temperature lag duration and temperature rise time constant show a certain coupling trend: when the temperature lag duration is long, it indicates that there is a delay in the thermal contact interface or the thermal resistance of the cooling path is large, which may cause the temperature rise rate to decrease; and the decrease in temperature rise rate will prolong the temperature rise time constant, causing the thermal response efficiency of the whole system to decrease. Therefore, when evaluating whether the module has a thermal hysteresis problem, the cooperative variation characteristics of the three parameters should be analyzed comprehensively. A single parameter may not accurately reflect the real thermal state of the module, and joint judgment can improve the identification accuracy and adjustment pertinence.

[0101] The preset chip temperature rise rate, temperature lag duration and temperature rise time constant are extracted from the database.

[0102] The chip temperature rise rate characteristic measurement coefficient, temperature lag duration characteristic measurement coefficient and temperature rise time constant characteristic measurement coefficient stored in the database are extracted.

[0103] The feature metric coefficients are extracted from the database to quantify the influence degree of the proportion coefficient between the preset defined chip temperature rise rate and the chip temperature rise rate in the database, the proportion coefficient between the preset defined temperature lag duration and the temperature lag duration in the database, and the proportion coefficient between the preset defined temperature rise time constant and the temperature rise time constant in the database on the thermal hysteresis response of the hysteresis monitoring module. The influence degrees are collected to obtain the thermal hysteresis coefficient of the hysteresis monitoring module.

[0104] It should be noted that a plurality of mapping relationships are pre-established in the database for associating the feature metric coefficients of the parameters. The mapping relationships are stored in the form of a structured data table (such as a weight configuration table), and are combined with the monitoring data and experimental data of the hysteresis monitoring module through an associated query to construct a complete hysteresis evaluation system of the hysteresis monitoring module. Based on the system, the feature metric coefficients corresponding to the chip temperature rise rate, the temperature lag duration, and the temperature rise time constant can be directly obtained from the database, and the numerical range of the feature metric coefficients is limited to 0 to 1 and the sum is 1.

[0105] The thermal hysteresis coefficients of the hysteresis monitoring modules are obtained by traversing the hysteresis monitoring modules.

[0106] The thermal hysteresis coefficients of the hysteresis monitoring modules are the quantitative representation of the influence of the chip temperature rise rate, the temperature lag duration, and the temperature rise time constant of each hysteresis monitoring module on the thermal hysteresis response of the corresponding hysteresis monitoring module.

[0107] In specific embodiments, the thermal hysteresis coefficient of each hysteresis monitoring module is specifically represented as:

[0108] ;

[0109] wherein B j is the thermal hysteresis coefficient of the jth hysteresis monitoring module, d j is the chip temperature rise rate of the jth hysteresis monitoring module, f j is the temperature lag duration of the jth hysteresis monitoring module, g j is the temperature rise time constant of the jth hysteresis monitoring module, d0 is the defined chip temperature rise rate, f0 is the defined temperature lag duration, g0 is the defined temperature rise time constant, y1 is the chip temperature rise rate feature metric coefficient, y2 is the temperature lag duration feature metric coefficient, y3 is the temperature rise time constant feature metric coefficient, j is the number of the hysteresis monitoring module, j = 1, 2, …, m, and m is the number of the hysteresis monitoring module.

[0110] Further, the hysteresis adjustment execution strategy of each hysteresis monitoring module is determined, and the specific analysis process is as follows:

[0111] The preset thermal hysteresis defining coefficient in the database is extracted.

[0112] extracting the clogging coefficient of each hysteresis monitoring module, thereby correcting the thermal hysteresis boundary coefficient of each hysteresis monitoring module, to obtain the thermal hysteresis boundary correction coefficient of each hysteresis monitoring module.

[0113] It should be noted that the database stores a corresponding mapping set of the clogging coefficient of the hysteresis monitoring module and the thermal hysteresis boundary correction factor of the hysteresis monitoring module. When used, the clogging coefficient of each hysteresis monitoring module is input into the mapping set, and the thermal hysteresis boundary correction factor of each hysteresis monitoring module can be extracted.

[0114] The product of the thermal hysteresis boundary correction factor and the thermal hysteresis boundary coefficient of each hysteresis monitoring module is taken as the thermal hysteresis boundary correction coefficient of each hysteresis monitoring module.

[0115] It should be noted that since the clogging of the module significantly affects its heat conduction and heat dissipation efficiency, the clogging coefficient is introduced to correct the original thermal hysteresis boundary coefficient when judging the thermal hysteresis adjustment strategy, which can more accurately reflect the true thermal response capability of the current module under the coupled working condition. By taking the clogging coefficient as the adjustment factor to generate the thermal hysteresis boundary correction coefficient, it is helpful to avoid misjudgment caused by clogging interference, thereby improving the robustness and effectiveness of the thermal hysteresis adjustment judgment.

[0116] If the thermal hysteresis coefficient of a certain hysteresis monitoring module is greater than or equal to the thermal hysteresis boundary correction coefficient of the corresponding hysteresis monitoring module, the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as the joint adjustment of the cooling side and the heat source measurement.

[0117] In this embodiment, if the thermal hysteresis coefficient of a certain hysteresis monitoring module is greater than or equal to the thermal hysteresis boundary correction coefficient of the corresponding hysteresis monitoring module, it indicates that the module has obvious thermal response hysteresis phenomenon, and its thermal hysteresis behavior still exceeds the normal response range after considering the clogging factor, which has a potential impact on the system heat dissipation efficiency. At this time, it is necessary to simultaneously adjust the cooling path and the heat source input, simultaneously from both the cold source and the heat source, to enhance the adjustment strength and effect, and avoid local thermal damage to the structure caused by heat accumulation.

[0118] Further, the joint adjustment of the cooling side and the heat source measurement is performed, and the specific analysis steps are as follows:

[0119] Extracting the thermal hysteresis deviation coefficient of each hysteresis monitoring module, matching the cooling side adjustment parameter and the heat source side adjustment parameter of each hysteresis monitoring module.

[0120] It should be noted that the thermal hysteresis deviation coefficient of each hysteresis monitoring module is the value obtained by subtracting the thermal hysteresis boundary correction coefficient of the corresponding hysteresis monitoring module from the thermal hysteresis coefficient of each hysteresis monitoring module.

[0121] The cooling side adjustment parameter is a cooling liquid flow rate supplement value.

[0122] The heat source side adjustment parameter is a PWM duty cycle reduction value.

[0123] It should be added that the system presets a set of adjustment strategy mapping relationship table, which configures the corresponding combination of the joint adjustment parameters of the cooling side and the heat source side according to the different level heat hysteresis deviation coefficient intervals. The greater the heat hysteresis deviation coefficient is, the higher the matching adjustment intensity is, until the highest threshold is triggered and the highest threshold is executed. The mapping relationship table can be stored in the form of a structured database table. The system automatically calls the table before adjustment execution and completes parameter table lookup matching according to the heat hysteresis deviation coefficient interval. After the matching is completed, the corresponding flow rate supplement value and PWM duty cycle reduction value are respectively sent to the cooling side and the heat source side, so as to realize the synchronous adjustment of the cooling side and the heat source side.

[0124] The cooling side and the heat source are jointly adjusted based on the cooling side adjustment parameter and the heat source side adjustment parameter of each hysteresis monitoring module.

[0125] Firstly, according to the matched cooling liquid flow rate supplement value, a flow increasing instruction is sent to dynamically improve the cooling liquid flow rate of the loop where the hysteresis monitoring module is located, to enhance the local heat exchange capacity and reduce the heat hysteresis accumulation effect. At the same time, according to the matched PWM duty cycle reduction value, the PWM signal duty cycle of the chip power supply is regulated, which realizes the accurate reduction of the heat source power by adjusting the lower limit of the duty cycle parameter, so as to reduce the heat load of the chip per unit time, keep the module heat response speed and the heat dissipation capacity matched, and inhibit the instantaneous overheating phenomenon.

[0126] It should be added that the above-mentioned joint adjustment process of the cooling side and the heat source side is uniformly coordinated by the main control platform, so as to ensure that the flow rate adjustment and the power adjustment are completed in the same scheduling period. After the adjustment, the heat hysteresis coefficient of the corresponding hysteresis monitoring module is reanalyzed. If it is still greater than or equal to the heat hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, a warning information is generated.

[0127] If the heat hysteresis coefficient of a hysteresis monitoring module is less than the heat hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as continuous monitoring.

[0128] In this embodiment, if the heat hysteresis coefficient of a hysteresis monitoring module is less than the heat hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, it indicates that the heat response capability of the module after considering the blockage effect is still in an acceptable range, and its hysteresis behavior has not constituted a system operation abnormality, so it is not necessary to forcibly execute additional adjustment. At this time, the module only needs to be marked as a continuous monitoring state, and dynamic tracking is maintained through subsequent data acquisition, so as to ensure that the heat response characteristics do not appear a deterioration trend, and to realize the optimization of resource reasonable allocation and adjustment strategy.

[0129] Referring toFigure 2 The second aspect of the present application provides a water-cooled heat dissipation system based on modular design, comprising:

[0130] The first blockage adjustment execution strategy determination module is configured to collect blockage characterization data of each water-cooled heat dissipation module, analyze the blockage coefficients of each water-cooled heat dissipation module, determine the blockage information of each water-cooled heat dissipation module, and synchronously determine the first blockage adjustment execution strategy of each water-cooled heat dissipation module.

[0131] The second blockage adjustment execution strategy determination module is configured to, after executing the first blockage adjustment execution strategy, mark the corresponding water-cooled heat dissipation module as a first adjustment module, re-analyze the blockage coefficients of each first adjustment module, and determine the second blockage adjustment execution strategy of each first adjustment module.

[0132] The hysteresis adjustment execution strategy determination module is configured to, when the blockage information of the water-cooled heat dissipation module is mild blockage or severe blockage, mark the corresponding module as a hysteresis monitoring module, synchronously perform thermal hysteresis monitoring of each hysteresis monitoring module, analyze the thermal hysteresis coefficients of each hysteresis monitoring module, and determine the hysteresis adjustment execution strategy of each hysteresis monitoring module.

[0133] The third aspect of the present application provides a water-cooled heat dissipation device based on modular design, comprising a heat sink, a power supply, a sensor array, and a controller.

[0134] The heat sink is composed of a water inlet pipe connector, a water outlet pipe connector, a water inlet, a water outlet, a water tank accommodating cavity, a sealing member, a heat dissipation plate, and a sealing and fixing device.

[0135] The power supply is configured to provide stable direct current power for the water-cooled heat dissipation module and related electronic elements.

[0136] The sensor array is configured to collect water-cooled heat dissipation module related parameters.

[0137] The controller is configured to receive real-time monitoring data from the sensors, perform blockage coefficient and thermal hysteresis coefficient calculation of the water-cooled heat dissipation module, and generate adjustment strategies.

[0138] It is also necessary to supplement that the water inlet pipe connector and the water outlet pipe connector of the heat sink adopt a quick assembly and disassembly interface design to ensure the assembly and splicing application of the unit module water-cooled heat sink. The water tank accommodating cavity is not limited to cavity, fin, and heat dissipation column array structures, and a mechanical interface (such as a screw hole, a clamping groove, and a pin position) is provided on the application device (such as a light source lampshade) outside the accommodating cavity. The sealing member material is not limited to silicone, rubber, polytetrafluoroethylene, fluorine rubber, fluorosilicone, perfluoroether, rubber or plastic, low-melting-point metal (not limited to tin), and soft metal. The heat dissipation plate is not limited to a flat plate or a grooved plate.

[0139] Reference is made to Figure 3 , Figure 4 ,Figure 5 and Figure 6 The water-cooled heat dissipation module main structure involved in the embodiment of the present application is shown in FIG. 1. Figure 1 The water-cooled heat dissipation module main structure involved in the embodiment of the present application is shown in FIG. 1. Figure 2 The water-cooled heat dissipation module main structure involved in the embodiment of the present application is shown in FIG. 1. Figure 3 The water-cooled heat dissipation module main structure involved in the embodiment of the present application is shown in FIG. 1. Figure 4 .

[0140] The signal plate 1 is connected with the driving plate 4 through signal lines with shielding layer, and the driving plate 4 is connected with the electrode copper bar on the array module 5 through the connecting copper bar 2. The array module 5 is placed on the water distributor 3, the water distributor 3 is provided with water distribution grooves according to the number of the array module 5, so that each array module 5 can be distributed with water channels, and the number of the array module 5 can be added according to actual use requirements. The driving plate 4 is also placed on the water distributor 3, so that the water distributor 3 can cool the array module 5 and the related heat generating devices of the driving plate 4 at the same time, thereby prolonging the service life. The electrode copper bar +9 is connected with the electrode copper bar -10 through a metal wire and is placed on the array module 5. The protection glass 11 is below the array module 5, and the protection glass frame 12 is arranged below the protection glass 11. The water-cooled heat dissipation module is also provided with a communication serial port 6 and a control serial port 7. The communication serial port 6 is connected with the upper computer, so that the upper computer is convenient to debug. The control serial port 7 is provided to control the array module 5. The power supply 13 is provided to realize power supply. The chip lamp bead 14 is placed on the protection glass frame 12.

[0141] The water inlets and outlets 8 of the water-cooled heat dissipation modules are connected in sequence, that is, the water outlet of the i-th water-cooled heat dissipation module is the water inlet of the (i+1)-th water-cooled heat dissipation module, i is the number of the water-cooled heat dissipation module, i = 1, 2, …, n, and n is the number of the water-cooled heat dissipation modules.

[0142] It should be noted that the high-thermal-conductivity material is etched with square grids of the size of the chip, the metal ceramic sheet is placed according to the square grid, the chip is fixed by using a fixing material, and then the chip is packaged on the metal ceramic sheet. The array lens is used on the chip to form an independent flip-chip array module 5.

[0143] It should be noted that the water-cooled heat dissipation module in the embodiment adopts a unit modular design. After the water-cooled heat dissipation modules are closely and linearly arranged one by one, water-cooled heat dissipation modules of different sizes can be realized, different applications can be met, and after the water-cooled heat dissipation modules are arranged and combined, all the water inlets and outlets are connected after assembly, cold water enters the total water inlet and then flows into the independent unit module heat dissipation module, small unit independent cooling is realized, hot water flows out through the unit water outlet and then is collected to the total water outlet, thereby avoiding the problem of different temperatures at the front end and the end of the integrated large-size conventional water-cooled heat dissipation module.

[0144] In the embodiment, the water pump is arranged on the upstream end of the total water inlet pipe as the main water supply device of the multiple modules, and the water inlet flow is controlled by the water pump and the water distributor 3. The ceramic sheet is attached to the outer wall of the water distribution tank to realize coupling excitation. The chip is a flip chip, the cooling side refers to the cooling liquid flow part in the water cooling heat dissipation module, and the heat source side refers to the heating part of the chip, which is connected with the electrode copper bar and the power supply 14.

[0145] Those skilled in the art will appreciate that embodiments of the application can be provided as methods, systems, or computer program products. Accordingly, the application can be embodied in the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the application can be embodied in the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk memory, CD-ROMs, optical memory, etc.) having computer usable program code embodied therein.

[0146] The present application is described with reference to the flowcharts and / or block diagrams of the methods, apparatus (systems), and computer program products according to the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, as well as combinations of flows and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing apparatus to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing apparatus generate a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flowchart

[0147] These computer program instructions can also be stored in a computer-readable memory that can direct the computer or other programmable data processing apparatus to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including instruction means, which implements the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flowchart

[0148] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus, so that a series of operation steps are performed on the computer or other programmable data processing apparatus to produce a computer-implemented process, so that the instructions executed on the computer or other programmable data processing apparatus provide a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flowchart

[0149] While the preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the present disclosure without departing from the spirit and scope of the application. Accordingly, it is intended that the appended claims include all such modifications and variations as fall within the scope of the present application.

[0150] It is apparent that those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. It is therefore intended that the present application cover all such changes and modifications that are within its scope.

Claims

1. A water-cooling heat dissipation method based on modular design, characterized in that, Includes the following steps: Blockage characterization data of each water-cooled heat dissipation module is collected, including pressure difference, fluid flow rate, and liquid velocity of each water-cooled heat dissipation module. Based on the blockage characterization data of each water-cooled heat dissipation module, the blockage coefficient of each water-cooled heat dissipation module is analyzed. The blockage coefficient of each water-cooled heat dissipation module is a quantitative index of the combined influence of pressure difference, fluid flow rate, and liquid velocity on the blockage degree of each water-cooled heat dissipation module. The specific analysis process is as follows: the pressure difference between the outlet and the inlet is compared with the corresponding reference value, the reference values ​​of fluid flow rate and liquid velocity are compared with the corresponding fluid flow rate and liquid velocity, and the results of each comparison are combined with the corresponding measurement factors for weighted coupling processing to obtain the blockage coefficient of each water-cooled heat dissipation module. This determines the blockage information of each water-cooling heat dissipation module, and simultaneously determines the first blockage adjustment execution strategy for each water-cooling heat dissipation module, specifically: extracting the preset first threshold and second threshold of the blockage coefficient from the database; If the blockage coefficient of a certain water cooling heat dissipation module is less than the first threshold of the blockage coefficient, the blockage information of the water cooling heat dissipation module is marked as normal, and the first blockage adjustment execution strategy of the water cooling heat dissipation module is marked as continuous monitoring. If the blockage coefficient of a certain water cooling heat dissipation module is greater than or equal to the first threshold of the blockage coefficient and less than or equal to the second threshold of the blockage coefficient, then the blockage information of the water cooling heat dissipation module is marked as mild blockage, and the first blockage adjustment execution strategy of the water cooling heat dissipation module is recorded as executing water pump power adjustment. If the blockage coefficient of a certain water cooling module is greater than the second threshold of the blockage coefficient, the blockage information of the water cooling module is marked as severely blocked, and the first blockage adjustment execution strategy of the water cooling module is simultaneously recorded as joint adjustment. After executing the first blockage adjustment strategy, the corresponding water-cooled heat dissipation module is designated as the first adjustment module. The blockage coefficient of each first adjustment module is re-analyzed to determine the second blockage adjustment strategy for each first adjustment module. Specifically, the blockage coefficient of each first adjustment module is re-analyzed. Based on the blockage coefficient of each water-cooling heat dissipation module, the blockage coefficient of each first adjustment module is extracted and recorded as the prior blockage coefficient of each first adjustment module. Then, the blockage correction factor of each first adjustment module is extracted from the corresponding mapping table. The blockage coefficient correction value of each first regulation module is obtained by using the blockage coefficient of each first regulation module and the blockage correction factor of each first regulation module. If the blockage coefficient correction value of a certain first regulating module is between the first threshold and the second threshold of the blockage coefficient, and if the first regulating module has not executed the joint regulating strategy, then the second blockage regulating execution strategy of the first regulating module is recorded as executing the joint supplementary regulation, generating an acoustic flushing command, obtaining the first deviation value of the blockage coefficient of the first regulating module, extracting the acoustic flushing duration based on this from the self-mapping table, and executing the joint supplementary regulation accordingly. If the first regulating module has already executed the joint regulating strategy, then the second blockage regulating execution strategy of the first regulating module is recorded as executing the backflushing regulation, generating a prompt message, generating a backflushing pump start command, obtaining the second deviation value of the blockage coefficient of the first regulating module, matching the backflushing pump execution pressure and the backflushing pump execution duration, and executing the backflushing regulation. If the blockage coefficient correction value of a certain first adjustment module is less than the first threshold of the blockage coefficient, then the second blockage adjustment execution strategy of the first adjustment module is recorded as continuous monitoring, and an adjustment completion signal is generated. If the blockage coefficient correction value of a certain first adjustment module is greater than the second threshold of the blockage coefficient, then the second blockage adjustment execution strategy of the first adjustment module is recorded as generating early warning information; When the blockage information of the water cooling heat dissipation module is mild or severe, the corresponding module is marked as a hysteresis monitoring module. Simultaneously, thermal hysteresis monitoring of each hysteresis monitoring module is performed, the thermal hysteresis coefficient of each hysteresis monitoring module is analyzed, and the hysteresis adjustment execution strategy of each hysteresis monitoring module is determined. The analysis of the thermal hysteresis coefficient of each hysteresis monitoring module is as follows: Collect thermal hysteresis monitoring data from each hysteresis monitoring module, including the chip temperature rise rate, temperature lag time, and temperature rise time constant of each hysteresis monitoring module; The feature measurement coefficients are extracted from the database to quantify the influence of the ratio coefficient between the predefined chip temperature rise rate and the chip temperature rise rate, the ratio coefficient between the temperature lag time and the predefined temperature lag time in the database, and the ratio coefficient between the temperature rise time constant and the predefined temperature rise time constant in the database on the thermal hysteresis response of the hysteresis monitoring module. The influence of each degree is summarized to obtain the thermal hysteresis coefficient of the hysteresis monitoring module. By iterating through each hysteresis monitoring module, the thermal hysteresis coefficient of each hysteresis monitoring module is obtained; The thermal hysteresis coefficient of each hysteresis monitoring module is a quantitative representation of the degree of thermal hysteresis response of the corresponding hysteresis monitoring module, which is jointly characterized by the chip temperature rise rate, temperature lag time, and temperature rise time constant of each hysteresis monitoring module.

2. The water-cooling heat dissipation method based on modular design as described in claim 1, characterized in that: The specific analysis process for adjusting the water pump power is as follows: By iterating through each water-cooling module, we identified the water-cooling modules that were slightly blocked. The blockage coefficient of each slightly blocked water cooling module is extracted based on the blockage coefficient of each water cooling module. The blockage coefficient of each slightly blocked water cooling module is deviated from the first threshold of the blockage coefficient to obtain the blockage coefficient deviation factor of each slightly blocked water cooling module. Based on the blockage coefficient deviation factor of each slightly blocked water cooling heat dissipation module, the water pump power supplement value of each slightly blocked water cooling heat dissipation module is matched. Arrange the blockage coefficients of each slightly blocked water cooling module in descending order, and use the order of arrangement as the adjustment order for the corresponding slightly blocked water cooling module. Based on the supplementary water pump power value for each slightly clogged water cooling module, the water pump power is adjusted according to the adjustment order of the corresponding slightly clogged water cooling modules.

3. The water-cooling heat dissipation method based on modular design as described in claim 1, characterized in that: The specific process of performing joint regulation is as follows: Iterate through each water cooling module to obtain each severely blocked water cooling module, and extract the blockage coefficient of each severely blocked water cooling module based on the blockage coefficient of each water cooling module. Generate a command to activate the acoustic descaling process; Obtain the blockage coefficient deviation factor for each severely blocked water-cooled heat dissipation module; Based on the blockage coefficient deviation factor matching of each severely blocked water cooling heat dissipation module, the execution parameters are jointly adjusted, and the joint adjustment of each severely blocked water cooling heat dissipation module is performed. The joint adjustment execution parameters include the water pump power supplement value and the execution time of the acoustic descaling.

4. The water-cooling heat dissipation method based on modular design as described in claim 1, characterized in that: The specific analysis process for determining the hysteresis adjustment execution strategy for each hysteresis monitoring module is as follows: Extract the preset thermal hysteresis boundary coefficient from the database; Extract the blockage coefficient of each hysteresis monitoring module, and then correct the thermal hysteresis definition coefficient of each hysteresis monitoring module to obtain the thermal hysteresis definition correction coefficient of each hysteresis monitoring module. If the thermal hysteresis coefficient of a certain hysteresis monitoring module is greater than or equal to the thermal hysteresis definition correction coefficient of the corresponding hysteresis monitoring module, then the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as the joint adjustment of the cooling side and the heat source. If the thermal hysteresis coefficient of a certain hysteresis monitoring module is less than the thermal hysteresis definition correction coefficient of the corresponding hysteresis monitoring module, then the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as continuous monitoring.

5. The water-cooling heat dissipation method based on modular design as described in claim 4, characterized in that: The specific analysis steps for the joint adjustment of the cooling side and the heat source are as follows: Extract the thermal hysteresis deviation coefficient of each hysteresis monitoring module, and match the cooling-side adjustment parameters and heat source-side adjustment parameters of each hysteresis monitoring module; The cooling-side adjustment parameter is a supplementary value for the coolant flow rate. The heat source-side adjustment parameter is the PWM duty cycle reduction value; The cooling-side and heat-source-side adjustment parameters of each hysteresis monitoring module are used to perform joint adjustment of the cooling-side and heat-source-side parameters.

6. A system applying the water-cooling heat dissipation method based on modular design as described in any one of claims 1-5, characterized in that, include: The first blockage regulation execution strategy determination module is used to collect blockage characterization data of each water cooling heat dissipation module, analyze the blockage coefficient of each water cooling heat dissipation module, thereby determining the blockage information of each water cooling heat dissipation module, and simultaneously determining the first blockage regulation execution strategy of each water cooling heat dissipation module. The second blockage regulation execution strategy determination module is used to, after executing the first blockage regulation execution strategy, record the corresponding water cooling heat dissipation module as the first regulation module, re-analyze the blockage coefficient of each first regulation module, and thereby determine the second blockage regulation execution strategy of each first regulation module. The hysteresis regulation execution strategy determination module is used to identify the corresponding module as a hysteresis monitoring module when the blockage information of the water cooling heat dissipation module is mild or severe. It synchronously performs thermal hysteresis monitoring of each hysteresis monitoring module, analyzes the thermal hysteresis coefficient of each hysteresis monitoring module, and determines the hysteresis regulation execution strategy of each hysteresis monitoring module.

7. An apparatus for applying the water-cooling heat dissipation method based on modular design as described in any one of claims 1-5, characterized in that: include: Heat sink, power supply, sensor array, and controller; The radiator consists of an inlet pipe connector, an outlet pipe connector, an inlet, an outlet, a water tank cavity, a sealing component, a heat dissipation plate, and a sealing and fixing device. The power supply is used to provide stable DC power to the water-cooled heat dissipation module and related electronic components. The sensor array is used to collect relevant parameters of the water-cooled heat dissipation module; The controller is used to receive real-time monitoring data from sensors, calculate the blockage coefficient and thermal hysteresis coefficient of the water-cooled heat dissipation module, and generate adjustment strategies.

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