Capacitance microswitch
Through the capacitive micro switch structure, the switch state is judged by the change of capacitance value, which solves the problems of insufficient response speed and operation flexibility of existing micro switches and realizes fast response and flexible control.
Patent Information
- Application Number
- CN202511091798.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2025-10-17
AI Technical Summary
The existing micro switch lacks an existing structure that uses a capacitor structure to achieve triggering, resulting in insufficient response speed and operational flexibility.
A capacitive micro switch structure is adopted. By changing the relative area between the emitter plate and the receiver plate, the change in capacitance value is monitored to determine the on/off state of the switch. The change in capacitance value is detected by a capacitance detection chip to realize switch control.
The capacitor structure can quickly respond to and flexibly control the on/off state of the micro switch, thereby improving the response speed and operational flexibility of the switch.
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Figure CN120811352A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of electronic products, and particularly relates to a capacitive microswitch. BACKGROUND
[0002] The microswitch is widely applied to various electronic products such as electric appliances, machinery, communication, digital video and audio, building automation, etc. due to its compact structure, flexible operation and fast response speed.
[0003] The microswitch in the prior art usually adopts a structure principle of triggering circuit on-off by mechanical force, and lacks an existing structure for triggering by using a capacitive structure. SUMMARY
[0004] The application aims at providing a capacitive microswitch.
[0005] A capacitive microswitch comprises a base and a shell, the base and the shell are connected to form a hollow cavity, and a spring plate, an emitter plate and a first receiver plate are arranged in the hollow cavity.
[0006] The spring plate is horizontally arranged, one end of the spring plate is a fixed end and the other end is a bent plate with a vertical structure, the fixed end is fixed in the hollow cavity, the spring plate has a pressure applying end, and the pressure applying end is located between the fixed end and the bent plate.
[0007] The bottom end of the emitter plate is connected to an external circuit as a power supply pin, and the top end of the emitter plate is connected to the spring plate, so that the spring plate is an extension of the emitter plate.
[0008] The bottom end of the first receiver plate is connected to an external circuit as a power supply pin, and the upper part of the first receiver plate is a first vertical part with a vertical structure, the first vertical part is located at the side of the bent plate, and the first vertical part and the bent plate form a first capacitive structure.
[0009] When a downward force is applied to the pressure applying end, the spring plate is driven to move downward, and the bent plate is also driven to move downward, the relative area between the bent plate and the first vertical part changes during the downward movement of the bent plate, the capacitance value of the first capacitive structure changes, and the starting state of the capacitive microswitch is determined by monitoring the capacitance value of the first capacitive structure.
[0010] Optionally, one of the base and the shell is provided with a buckle hole and the other is provided with a buckle protrusion, the base and the shell are connected by the buckle hole and the buckle protrusion.
[0011] Optionally, the emitter plate and the first receiving plate are both embedded in the base, and the first vertical part protrudes from the top surface of the base and is located at one side of the bending plate.
[0012] Optionally, a support plate is integrally formed at the top end of the emitter plate, and a support groove is arranged on the support plate, and the fixed end of the elastic sheet is embedded in the support groove.
[0013] Optionally, an abutting plate is integrally formed at the top end of the emitter plate, and an abutting groove is arranged on one side of the abutting plate.
[0014] A middle part of the elastic sheet is provided with an avoiding groove, and an elastic plate in a circular arc shape is arranged in the avoiding groove, one end of the elastic plate is integrally connected with the elastic sheet, and the other end of the elastic plate abuts in the abutting groove.
[0015] Optionally, the first vertical part and the bending plate are arranged in a staggered manner in the vertical direction.
[0016] Optionally, a second receiving plate is further arranged in the hollow cavity.
[0017] The bottom end of the second receiving plate is connected with an external circuit as a power supply pin, the upper part of the second receiving plate is a second vertical part in a vertical structure, the second vertical part and the first vertical part are respectively located at the two side edges of the bending plate, and a second capacitor structure is formed between the second vertical part and the bending plate.
[0018] When a downward force is applied to the pressure end, the elastic sheet is driven to move downward, and the bending plate is also driven to move downward, the relative area between the bending plate and the second vertical part changes during the downward movement of the bending plate, the capacitance value of the second capacitor structure changes, and the starting state of the capacitive microswitch is determined by monitoring the capacitance values of the first capacitor structure and the second capacitor structure.
[0019] Optionally, the second receiving plate is embedded in the base, and the second vertical part protrudes from the top surface of the base and is located at the other side of the bending plate.
[0020] Optionally, the second vertical part and the bending plate are arranged in a staggered manner in the vertical direction.
[0021] Optionally, the second vertical part, the bending plate and the first vertical part are arranged in a staggered manner in the vertical direction.
[0022] Optionally, the top end of the second vertical part, the top end of the bending plate and the top end of the first vertical part are arranged from high to low, and the bottom end of the second vertical part, the bottom end of the bending plate and the bottom end of the first vertical part are arranged from high to low.
[0023] When a downward force is applied to the pressure applying end, the elastic sheet is driven to move downward, and in turn, the bent plate is driven to move downward, the relative area between the bent plate and the first vertical part increases during the downward movement of the bent plate, the capacitance value of the first capacitance structure increases, at the same time, the relative area between the bent plate and the second vertical part decreases during the downward movement of the bent plate, the capacitance value of the second capacitance structure decreases, and the starting state of the capacitance microswitch is judged by monitoring the capacitance values of the first capacitance structure and the second capacitance structure.
[0024] Optionally, the top end of the second vertical part, the top end of the bent plate and the top end of the first vertical part are arranged from low to high, and the bottom end of the second vertical part, the bottom end of the bent plate and the bottom end of the first vertical part are arranged from low to high.
[0025] When a downward force is applied to the pressure applying end, the elastic sheet is driven to move downward, and in turn, the bent plate is driven to move downward, the relative area between the bent plate and the first vertical part decreases during the downward movement of the bent plate, the capacitance value of the first capacitance structure decreases, at the same time, the relative area between the bent plate and the second vertical part increases during the downward movement of the bent plate, the capacitance value of the second capacitance structure increases, and the starting state of the capacitance microswitch is judged by monitoring the capacitance values of the first capacitance structure and the second capacitance structure.
[0026] Optionally, the first vertical part and the second vertical part have a glue coating layer.
[0027] Beneficial effects: the application changes the relative area between the emitter plate and the receiver plate to monitor the capacitance value change of the capacitance structure composed of the emitter plate and the receiver plate, judges the pressure condition of the elastic sheet pressure applying end according to the capacitance value change, and realizes the control purpose of the opening and closing state of the capacitance microswitch through the capacitance structure. BRIEF DESCRIPTION OF DRAWINGS
[0028] Figure 1 It is a structural schematic diagram of embodiment 1 of the application;
[0029] Figure 2 It is an exploded view of Figure 1
[0030] Figure 3 It is a partial structural schematic diagram of Figure 1
[0031] Figure 4 It is an internal structural schematic diagram of Figure 3
[0032] Figure 5 It is an exploded view of embodiment 2 of the application;
[0033] Figure 6 It is an exploded view of Figure 5 a partial internal structure diagram of the device;
[0034] Figure 7 To Figure 6 an exploded view of the device. DETAILED DESCRIPTION
[0035] The preferred embodiments of the present application will be described in detail with reference to the drawings, so as to make the objects, features and advantages of the present application clear. It should be understood that the embodiments shown in the drawings are only used to illustrate the essential spirit of the present application, but not limit the scope of the present application.
[0036] In the following description, for the purpose of explaining various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. However, one skilled in the relevant arts will recognize that embodiments can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail in order to avoid obscuring aspects of the described embodiments.
[0037] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. In addition, the particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.
[0038] In the following description, for the purpose of clarity, directional terms such as "front", "back", "left", "right", "upper", "lower", "over", "under", "above", "below", etc. are used with reference to the orientation of the drawings. However, it is to be understood that the application can assume various alternative orientations and, accordingly, such terms are not to be understood as limiting.
[0039] Embodiment 1:
[0040] With reference to Figure 1 Figure 4 The present embodiment provides a capacitive microswitch to control the on-off state of a pressure component such as a key or a switch by a capacitive structure. The capacitive microswitch of the present embodiment comprises a base 10, a housing 20, a spring sheet 30, and a capacitive structure assembly comprising an emitter plate 50, a first receiver plate 60, and a second receiver plate 70.
[0041] The base 10 and the housing 20 are connected to form a hollow cavity, and the spring sheet 30, the emitter plate 50, the first receiver plate 60, and the second receiver plate 70 are all arranged in the hollow cavity.
[0042] The elastic sheet 30 is horizontally arranged in the hollow cavity, that is, the length direction of the elastic sheet 30 is horizontal, and the elastic sheet 30 has elastic deformation and reset capabilities in the vertical direction. One end of the elastic sheet 30 is a fixed end 30a, and the other end is a vertically-structured bending plate 30b. In the specific implementation, the other end of the elastic sheet 30 can be bent downward by 90 degrees to form the bending plate 30b. The fixed end 30a is fixed in the hollow cavity, that is, the fixed end 30a is fixed, and the bending plate 30b can move with the elastic sheet 30. The elastic sheet 30 has a pressing end between the fixed end 30a and the bending plate 30b. The pressing component, such as the key 40, can exert a downward force on the pressing end or release the pressing end. Of course, other pressing components can be used to exert a downward force on the pressing end or release the pressing end.
[0043] When the pressing component is the key 40, the key 40 is limited in the hollow cavity, and the top end of the key 40 protrudes from the shell 20 to be externally pressed downward. The bottom end of the key 40 abuts against the pressing end of the elastic sheet 30. When the external top end of the key 40 is pressed downward, the elastic sheet 30 is driven to move downward, the fixed end 30a of the elastic sheet 30 is fixed, and the bending plate 30b moves downward. When the pressing force is removed, the bending plate 30b and the key 40 are reset to the initial position under the reset action of the elastic sheet 30.
[0044] Of course, the pressing component can also be other devices below the pressing end. At this time, the pressing component exerts a downward pulling force on the pressing end, drives the elastic sheet 30 to move downward, the fixed end 30a of the elastic sheet 30 is fixed, and the bending plate 30b moves downward. When the pulling force is removed, the bending plate 30b is reset to the initial position under the reset action of the elastic sheet 30.
[0045] The bottom end of the emitter plate 50 serves as a power supply pin to be connected to an external circuit for power supply. In the specific implementation, the power supply pin at the bottom end of the emitter plate 50 protrudes out of the hollow cavity to facilitate the connection to the external circuit. The top end of the emitter plate 50 is connected to the elastic sheet 30, so that the elastic sheet 30 serves as an extension of the emitter plate 50. At this time, the elastic sheet is a metal structure, so that the bending plate 30b and the first receiver plate 60 form a first capacitor structure, and the bending plate 30b and the second receiver plate 70 form a second capacitor structure after being powered.
[0046] The bottom end of the first receiver plate 60 serves as a power supply pin to be connected to an external circuit for power supply. Similarly, in the specific implementation, the power supply pin at the bottom end of the first receiver plate 60 protrudes out of the hollow cavity to facilitate the connection to the external circuit. The upper part of the first receiver plate 60 is a first vertical part 60a with a vertical structure, and the first vertical part 60a is located at the side of the bending plate 30b. The first vertical part 60a and the bending plate 30b form a first capacitor structure.
[0047] The bottom end of the second receiving plate 70 is connected to an external circuit as a power supply pin, and the power supply pin of the bottom end of the second receiving plate 70 extends out of the hollow cavity in the specific implementation, so as to facilitate the connection with the external circuit. The upper part of the second receiving plate 70 is a second vertical part 70a in a vertical structure, and the second vertical part 70a and the first vertical part 60a are located on the two side edges of the bending plate 30b, respectively. The second vertical part 70a and the bending plate 30b form a second capacitor structure.
[0048] When a downward force is applied to the pressing end, the elastic sheet 30 is driven to move downward, and the bending plate 30b is also driven to move downward. During the downward movement of the bending plate 30b, the relative area between the first vertical part 60a and the bending plate 30b changes, and the capacitance value of the first capacitor structure changes. At the same time, during the downward movement of the bending plate 30b, the relative area between the second vertical part 70a and the bending plate 30b changes, and the capacitance value of the second capacitor structure changes. The starting state of the capacitive microswitch is determined by monitoring the capacitance value of the first capacitor structure.
[0049] In the specific implementation, the first vertical part 60a is arranged on one side edge of the bending plate 30b. In the initial state or the reset state of the bending plate 30b, there can be no relative area (spatial overlapping area or directly facing area) between the first vertical part 60a and the bending plate 30b. However, during the movement of the bending plate 30b, the relative area between the first vertical part 60a and the bending plate 30b should change, so as to determine the starting state of the capacitive microswitch by monitoring the capacitance value change of the first capacitor structure.
[0050] Similarly, in the specific implementation, the second vertical part 70a is arranged on the other side edge of the bending plate 30b. In the initial state or the reset state of the bending plate 30b, there can be no relative area (orthographic projection area or directly facing area) between the second vertical part 70a and the bending plate 30b. However, during the movement of the bending plate 30b, the relative area between the second vertical part 70a and the bending plate 30b should change, so as to determine the starting state of the capacitive microswitch by monitoring the capacitance value change of the second capacitor structure.
[0051] The working principle of the embodiment is as follows:
[0052] A power supply emitter plate and a corresponding power supply receiver plate are arranged to form a capacitor structure, and the opening and closing state of the capacitive microswitch is determined by changing the capacitance value of the capacitor structure.
[0053] The specific operation is: the capacitance value of the capacitance structure is monitored by a capacitance detection chip, which directly uses a capacitance detection chip for detecting the capacitance value between two electrode plates in the prior art. When the capacitance detection chip detects that the capacitance value of the capacitance structure increases / decreases to a set threshold, the capacitance detection chip determines that the capacitance microswitch is in an activated state, and provides a switch activation signal to the microswitch using device. After the microswitch using device receives the switch activation signal, the circuit of the microswitch using device is connected, and the microswitch using device is activated. When it is turned off, the principle is similar. When used on a computer host and a mouse, it can also be automatically turned off by the computer system or a default time length of inaction.
[0054] The change factors of the above-mentioned capacitance structure include the facing area between the emitter plate and the receiver plate, the distance between the two plates, and the dielectric constant between the emitter plate and the receiver plate (i.e. the conductive effect of the substance between the emitter plate and the receiver plate). The specific calculation formula is as follows:
[0055]
[0056] Wherein, C represents the capacitance value, ε represents the dielectric constant between the two plates, S represents the effective area of the two plates facing each other, D represents the distance between the two plates, and K represents the electrostatic force constant (the value is about 8.99x109N·m 2 / C 2 )
[0057] As can be seen from the above formula, the larger the effective area facing each other, the larger the capacitance value of the capacitance structure; the smaller the distance between the two plates, the larger the capacitance value of the capacitance structure; the larger the dielectric constant, the larger the capacitance value of the capacitance structure.
[0058] If other parameters remain unchanged, the effective area of the opposite changes, the capacitance value of the capacitor structure also changes. In the embodiment, the capacitor detection chip is connected to the emitter plate 50, the first receiving plate 60 and the second receiving plate 70 respectively. The capacitor detection chip detects the first capacitance value between the emitter plate 50 and the first receiving plate 60, and the capacitor detection chip detects the second capacitance value between the emitter plate 50 and the second receiving plate 70. When the effective area (relative area) of the opposite between the emitter plate 50 and the first receiving plate 60 or the second receiving plate 70 changes, the capacitance value of the first capacitance structure or the capacitance value of the second capacitance structure also changes. When the first capacitance value increases / decreases to the first set threshold value, it is considered that the capacitance microswitch is in the starting state. In order to avoid misjudgment, the detection accuracy is improved by detecting the second capacitance value, that is, at the same time, when the second capacitance value decreases / increases to the second set threshold value, it is finally considered that the capacitance microswitch is in the starting state. When the first capacitance value returns to the first initial threshold value, it is considered that the capacitance microswitch is in the closing state, and for the same reason, at the same time, when the second capacitance value returns to the second initial threshold value, it is finally considered that the capacitance microswitch is in the closing state.
[0059] The above-mentioned first set threshold value, second set threshold value, first initial threshold value and second initial threshold value can be a set value or a set threshold range.
[0060] In an embodiment, one of the base 10 and the shell 20 is provided with a buckle hole and the other is provided with a buckle protrusion, and the buckle hole is connected with the buckle protrusion to achieve the clamping connection of the base 10 and the shell 20.
[0061] Referring to Figure 2 , the buckle protrusions 11 at both ends of the base 10 are matched with the buckle holes 21 at both ends of the shell 20 to achieve the connection between the base 10 and the shell 20.
[0062] In an embodiment, referring to Figure 2 , the shell 20 is provided with a pressure hole 22 communicating between the upper and lower parts, and the top end of the pressure component such as the key 40 extends out of the pressure hole 22.
[0063] In an embodiment, the emitter plate 50, the first receiving plate 60 and the second receiving plate 70 are all embedded in the base 10, the top surface of the first vertical part 60a extends out of the top surface of the base 10 and is located at one side of the side edge of the bending plate 30b, and the second vertical part 70a extends out of the top surface of the base 10 and is located at the other side of the side edge of the bending plate 30b.
[0064] In an embodiment, referring to Figures 3-4The top end of the emitter plate 50 is integrally provided with a support plate 51, the support plate 51 is provided with a support groove 52, and the fixed end 30a of the elastic sheet 30 is embedded in the support groove 52. The design of the support plate 51 can not only fix the fixed end 30a, but also ensure that the elastic sheet 30 remains connected to the emitter plate 50.
[0065] In an embodiment, referring to Figures 3-4 The top end of the emitter plate 50 is integrally provided with an abutment plate 53, and one side of the abutment plate 53 is provided with an abutment groove 54.
[0066] The middle part of the elastic sheet 30 is provided with an avoidance groove, and the avoidance groove is provided with an elastic plate 31 in a circular arc shape. One end of the elastic plate 31 is integrally connected with the elastic sheet 30, and the other end of the elastic plate 31 abuts in the abutment groove 54, so that the bending plate 30b of the elastic sheet 30 has a preset height difference between the first vertical part 60a and the second vertical part 70a in a normal state (i.e. initial state or after reset).
[0067] In specific implementation, the middle part of the elastic sheet 30 can be cut in a U-shaped form, and the avoidance groove and the elastic plate 31 integrally connected with the elastic sheet 30 are cut out. Then, the other end of the elastic plate 31 is abutted in the abutment groove 54 after being bent downward. That is, the abutment groove 54 is preferably located in or below the avoidance groove.
[0068] The design of the abutment plate 53 can also ensure that the elastic sheet 30 remains connected to the emitter plate 50.
[0069] When the pressing end of the elastic sheet 30 is pressed by a downward force, the bending plate 30b of the elastic sheet 30 will move downward, and the elastic plate 31 will be squeezed. After the downward force is removed, the bending plate 30b of the elastic sheet 30 returns to its original position under the elastic action of the elastic plate 31, and waits for the next pressing operation.
[0070] In an embodiment, the elastic sheet 30 has an abutting surface between the fixed end 30a and the bending plate 30b, which is used as a pressing end to abut with a pressing component. In addition to the abutting surface, one or more elastic sheet through grooves that are in communication with each other in the vertical direction can be provided between the fixed end 30a and the bending plate 30b of the elastic sheet 30, so as to increase the elastic deformation capacity of the elastic sheet 30.
[0071] Of course, the avoidance groove also serves as one of the elastic sheet through grooves.
[0072] In an embodiment, the first vertical part 60a and the bending plate 30b are arranged in a staggered manner in the vertical direction. The second vertical part 70a and the bending plate 30b are arranged in a staggered manner in the vertical direction.
[0073] Alternatively, the second vertical part 70a, the bending plate 30b and the first vertical part 60a are arranged in a staggered manner two by two in the vertical direction.
[0074] By the staggered arrangement, the first capacitance structure formed by the first vertical part 60a and the second capacitance structure formed by the second vertical part 70a can be changed during the downward movement of the bent plate 30b.
[0075] In an embodiment, referring to Figure 4 , the staggered arrangement of the second vertical part 70a, the bent plate 30b and the first vertical part 60a in the vertical direction is as follows:
[0076] The top end of the second vertical part 70a, the top end of the bent plate 30b and the top end of the first vertical part 60a are arranged from high to low, and the bottom end of the second vertical part 70a, the bottom end of the bent plate 30b and the bottom end of the first vertical part 60a are arranged from high to low. When a downward force is applied to the pressure applying end, the elastic sheet 30 is driven to move downward, and in turn, the bent plate 30b is driven to move downward. During the downward movement of the bent plate 30b, the relative area between the bent plate 30b and the first vertical part 60a increases, and the capacitance value of the first capacitance structure increases. At the same time, during the downward movement of the bent plate 30b, the relative area between the bent plate 30b and the second vertical part 70a decreases, and the capacitance value of the second capacitance structure decreases. The starting state of the capacitance microswitch can be determined by monitoring the capacitance values of the first capacitance structure and the second capacitance structure.
[0077] Of course, in the above arrangement, the positional relationship between the second vertical part 70a and the first vertical part 60a can be interchanged, that is, another arrangement of the staggered arrangement of the second vertical part 70a, the bent plate 30b and the first vertical part 60a in the vertical direction is as follows:
[0078] The top end of the second vertical part 70a, the top end of the bent plate 30b and the top end of the first vertical part 60a are arranged from low to high, and the bottom end of the second vertical part 70a, the bottom end of the bent plate 30b and the bottom end of the first vertical part 60a are arranged from low to high. At this time, when a downward force is applied to the pressure applying end, the elastic sheet 30 is driven to move downward, and in turn, the bent plate 30b is driven to move downward. During the downward movement of the bent plate 30b, the relative area between the bent plate 30b and the first vertical part 60a decreases, and the capacitance value of the first capacitance structure decreases. At the same time, during the downward movement of the bent plate 30b, the relative area between the bent plate 30b and the second vertical part 70a increases, and the capacitance value of the second capacitance structure increases. The starting state of the capacitance microswitch can be determined by monitoring the capacitance values of the first capacitance structure and the second capacitance structure.
[0079] In an embodiment, the first vertical part 60a and the second vertical part 70a have a glue layer on the outer periphery.
[0080] In the capacitor structure, the emitter plate and the receiver plate need to avoid direct contact, such as contact cannot form a capacitor structure. Therefore, the bending plate 30b of the spring sheet 30 needs to avoid direct contact with the first receiver plate 60 and the second receiver plate 70. The present embodiment avoids the direct contact problem by setting the encapsulating layer on the outer periphery of the first vertical part 60a and the encapsulating layer on the outer periphery of the second vertical part 70a.
[0081] In the capacitor structure of the above embodiment 1, the positional relationship between the emitter plate and the receiver plate can be interchanged, which does not affect the formation of the capacitor structure.
[0082] Embodiment 2:
[0083] Referring to Figures 5-7 , the present embodiment provides a capacitor micro switch, which is the same as embodiment 1 except for the following differences, and the rest of the structure is the same, which will not be repeated here.
[0084] The present embodiment does not provide the second receiver plate 70, but only forms the first capacitor structure between the bending plate 30b of the emitter plate 50 and the first vertical part 60a of the first receiver plate 60, and judges the starting state of the capacitor micro switch through the first capacitor structure. The present embodiment has one less receiver plate in structure, which is more simple.
[0085] The preferred embodiments of the present application have been described in detail above, but it should be understood that those skilled in the art can make various changes or modifications to the present application after reading the above teaching of the present application. These equivalent forms also fall within the scope defined by the appended claims of the present application.
Claims
1. A capacitive micro switch, characterized in that: The device comprises a base and a shell, wherein the base and the shell are connected to form a hollow cavity, and the hollow cavity is provided with: A spring piece, the spring piece is horizontally arranged, one end of the spring piece is a fixed end and the other end is a bent plate of a vertical structure, the fixed end is fixed in the hollow cavity, and the spring piece has a pressure end, and the pressure end is located between the fixed end and the bent plate; An emitter plate, wherein the bottom end of the emitter plate serves as a power pin connected to an external circuit for power supply, and the top end of the emitter plate is connected to the spring piece, so that the spring piece serves as an extension of the emitter plate; a first receiving plate, wherein the bottom end of the first receiving plate serves as a power pin connected to an external circuit for power supply, the upper portion of the first receiving plate is a first vertical portion of a vertical structure, the first vertical portion is located on a side of the bent plate, and a first capacitor structure is formed between the first vertical portion and the bent plate; When a downward force is applied to the pressure end, the spring moves downward, and then the bending plate moves downward. During the downward movement of the bending plate, the relative area between the bending plate and the first vertical portion changes, and the capacitance value of the first capacitor structure changes. The starting state of the capacitive microswitch is determined by monitoring the capacitance value of the first capacitor structure.
2. The capacitive micro switch according to claim 1, wherein: One of the base and the shell is provided with a snap hole and the other is provided with a snap protrusion, and the snap connection between the base and the shell is achieved by snapping the snap protrusion with the snap hole.
3. The capacitive micro switch according to claim 1, wherein: The emitter plate and the first receiving plate are both embedded in the base, and the first vertical portion extends out of the top surface of the base and is located on one side of the bent plate.
4. The capacitive micro switch according to claim 1, wherein: A support plate is integrally formed on the top of the emitter plate, a support groove is provided on the support plate, and the fixed end of the spring is embedded in the support groove.
5. The capacitive micro switch according to claim 1, wherein: The top of the emitter plate is integrally formed with an abutment plate, and one side of the abutment plate is provided with an abutment groove; An avoidance groove is provided in the middle of the elastic sheet, an arc-shaped elastic plate is provided in the avoidance groove, one end of the elastic plate is integrally connected to the elastic sheet, and the other end of the elastic plate abuts against the abutment groove.
6. The capacitive micro switch according to claim 1, wherein: The first vertical portion and the bent plate are staggered in the vertical direction.
7. The capacitive micro switch according to any one of claims 1 to 6, wherein: Also provided in the hollow cavity are: a second receiving plate, wherein the bottom end of the second receiving plate serves as a power pin connected to an external circuit for power supply, the upper portion of the second receiving plate is a second vertical portion of a vertical structure, the second vertical portion and the first vertical portion are respectively located on both sides of the bent plate, and a second capacitor structure is formed between the second vertical portion and the bent plate; When a downward force is applied to the pressure end, the spring moves downward, and then the bending plate moves downward. During the downward movement of the bending plate, the relative area between the bending plate and the second vertical portion changes, and the capacitance value of the second capacitor structure changes. The start-up state of the capacitive microswitch is determined by monitoring the capacitance values of the first capacitor structure and the second capacitor structure.
8. The capacitive micro switch according to claim 7, wherein: The second receiving electrode plate is embedded in the base, and the second vertical portion extends out of the top surface of the base and is located at the other side of the bent plate.
9. The capacitive micro switch according to claim 7, wherein: The second vertical portion and the bent plate are staggered in the vertical direction; Preferably, the second vertical portion, the bent plate and the first vertical portion are staggered in pairs in the vertical direction; More preferably, the top end of the second vertical portion, the top end of the bent plate, and the top end of the first vertical portion are arranged from high to low, and the bottom end of the second vertical portion, the bottom end of the bent plate, and the bottom end of the first vertical portion are arranged from high to low; when a downward force is applied to the pressure-applying end, the spring is driven to move downward, thereby driving the bent plate downward, and during the downward movement of the bent plate, the relative area between the bent plate and the first vertical portion increases, and the capacitance value of the first capacitor structure increases; at the same time, during the downward movement of the bent plate, the relative area between the bent plate and the second vertical portion decreases, and the capacitance value of the second capacitor structure decreases, and the activation state of the capacitive microswitch is determined by monitoring the capacitance values of the first capacitor structure and the second capacitor structure; Or, the top of the second vertical portion, the top of the bending plate and the top of the first vertical portion are arranged from low to high, and the bottom of the second vertical portion, the bottom of the bending plate and the bottom of the first vertical portion are arranged from low to high; when a downward force is applied to the pressure end, the spring is driven to move downward, and then the bending plate is driven to move downward. During the downward movement of the bending plate, the relative area between the bending plate and the first vertical portion decreases, and the capacitance value of the first capacitor structure decreases. At the same time, during the downward movement of the bending plate, the relative area between the bending plate and the second vertical portion increases, and the capacitance value of the second capacitor structure increases. The start-up state of the capacitive microswitch is judged by monitoring the capacitance values of the first capacitor structure and the second capacitor structure.
10. The capacitive micro switch according to claim 7, wherein: The outer peripheries of the first vertical portion and the second vertical portion are provided with a rubber coating.