Heat dissipation type sound box and heat dissipation method
By driving the elastic waves through the thermal deformation plate to form a heat dissipation channel, and combining the fins to fan the air convection, the problem of the speaker's heat dissipation structure being unable to respond dynamically is solved, achieving efficient heat dissipation and improved sound quality.
Patent Information
- Application Number
- CN202510791322.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-13
- Publication Date
- 2025-10-17
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The heat dissipation structure of existing speakers cannot dynamically respond to temperature changes, resulting in high temperature accumulation in the voice coil assembly and magnetic field area, causing the voice coil resistance to increase and the driving force to decrease. Traditional heat dissipation solutions also destroy the acoustic sealing or increase structural complexity and energy consumption.
A thermally deformable plate is used to drive the elastic wave to form a heat dissipation channel, and the temperature-sensitive characteristics are used to achieve active response heat dissipation. Through a closed-loop system of thermal-mechanical energy conversion, elastic potential energy is used to assist the movement of the voice coil, and the fins are combined to fan in the heat dissipation channel to form a breathing-type heat dissipation.
It realizes the automatic opening and closing of the dynamic adjustment of the heat dissipation channel, improves the heat dissipation efficiency, enhances the driving force of the voice coil component, and improves the sound quality stability and low-frequency performance.
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Figure CN120812430A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of loudspeaker heat dissipation, in particular to a heat dissipation type loudspeaker and a heat dissipation method thereof. BACKGROUND
[0002] The present application belongs to the field of mechanical structure design of loudspeakers, and specifically relates to the heat dissipation technology of loudspeakers based on the H04R1 / 02 classification number. With the wide application of high-power and compact loudspeakers, the heat dissipation problem of the voice coil assembly and the magnetic circuit area is increasingly prominent. In the prior art, the heat dissipation structure of the loudspeaker is mostly dependent on passive design, such as metal heat conduction or fixed heat dissipation hole convection, but there are defects in heat dissipation efficiency:
[0003] That is, the heat dissipation hole or metal heat conduction structure of the traditional loudspeaker cannot dynamically respond to temperature changes, resulting in high temperature accumulation in the voice coil assembly and the magnetic field area, causing the voice coil resistance to increase, the driving force to decrease, and even the permanent magnet of the magnetic circuit assembly to demagnetize;
[0004] The existing heat dissipation schemes are mostly realized by external fans or fixed holes, which destroy the acoustic sealing of the loudspeaker, cause low-frequency sound wave leakage, and cause bass attenuation; and the active heat dissipation scheme relying on mechanical vibration increases the structural complexity and energy consumption, and is not suitable for portable devices.
[0005] For example, the fixed heat dissipation structure proposed in the comparative file with the application number "2022104462521" improves the convection efficiency, but sacrifices the sealing of the acoustic cavity, and the static heat dissipation channel cannot be adaptively adjusted with temperature fluctuations. When the loudspeaker is continuously working under high load, heat still accumulates in the magnetic field area, causing the voice coil resistance to rise, the driving force to decay, and the permanent magnet to demagnetize, ultimately affecting the sound quality stability and device life. SUMMARY
[0006] The present application provides a heat dissipation type loudspeaker and a heat dissipation method to solve the problems in the prior art, and the specific technical solutions are as follows:
[0007] On the one hand, the present application provides a heat dissipation type loudspeaker, which comprises a loudspeaker shell and at least one sound generating component installed in the loudspeaker shell, wherein the sound generating component comprises:
[0008] a floatable voice coil assembly comprising a voice coil skeleton and a coil wound on the surface of the voice coil skeleton, the coil being energized to drive the voice coil assembly to move;
[0009] and a spring wave, the spring wave being connected to the voice coil skeleton through a connection heat driven component;
[0010] The heat driving assembly comprises a plurality of heat deformation pieces arranged circumferentially around the voice coil skeleton, the heat deformation pieces are connected between the voice coil skeleton and the heat driving assembly, there is a gap between two adjacent heat deformation pieces, the heat deformation pieces have at least a normal temperature state and a heated state, and the heat deformation pieces change between the normal temperature state and the heated state when the temperature changes;
[0011] When the heat deformation pieces change from the normal temperature state to the heated state, the heat deformation pieces are deformed by heat to drive the outer expansion and protrusion of the inner ring of the spring wave, and the gap between two adjacent heat deformation pieces forms a heat dissipation channel;
[0012] When the heat deformation pieces change from the heated state to the normal temperature state, the heat deformation pieces reset and adhere to the surface of the voice coil skeleton, and the connection surface of the spring wave and the voice coil assembly is sealed.
[0013] When the spring wave changes from the normal temperature state to the heated state, the spring wave deforms axially and stores elastic potential energy;
[0014] When the spring wave changes from the heated state to the normal temperature state, the spring wave resets and releases the elastic potential energy as a driving force with the same frequency as the voice coil assembly.
[0015] As a further technical solution of the present application, the heat deformation piece is made of a memory alloy, and changes from the normal temperature state to the heated state when the temperature reaches a preset threshold.
[0016] As a further technical solution of the present application, the heat deformation piece has a double-layer structure, comprising two metal sheets with different temperature coefficients and adhering to each other, and the temperature coefficient of the outer metal is smaller than that of the inner metal.
[0017] As a further technical solution of the present application, the side surface of the heat deformation piece has a tooth key to form a sawtooth structure.
[0018] As a further technical solution of the present application, fins are arranged between two adjacent heat deformation pieces, one end of the fin is connected with the voice coil skeleton, the other end is a free end, the fin is pressed and adheres to the surface of the voice coil skeleton in the normal temperature state, and the free end of the fin is raised and extends into the heat dissipation channel in the heated state, and the fin is stirred in the heat dissipation channel to form a breathing heat dissipation with the reciprocating movement of the voice coil assembly.
[0019] As a further technical solution of the present application, two adjacent fins are connected by a flexible connecting piece to form an array structure in the circumferential direction, and the flexible connecting piece is a silicone rubber-carbon fiber composite elastomer.
[0020] As a further technical solution of the present application, a ring groove is formed on the surface of the voice coil skeleton, in the normal temperature state, the fin and the heat deformation piece are embedded in the ring groove and form a smooth transition surface.
[0021] In another aspect, the application also provides a heat dissipation method for the heat dissipation loudspeaker, comprising the following steps:
[0022] S1, when the temperature of the voice coil assembly increases to a preset threshold, the thermal deformation piece of the thermal driving assembly is switched from a normal temperature state to a heated state, and thermal deformation occurs;
[0023] S2, the thermal deformation piece drives the radial expansion of the inner ring of the spring and the axial protrusion, so that the interval between adjacent thermal deformation pieces forms a heat dissipation channel connected with the magnetic field area, and the spring is deformed axially to store elastic potential energy;
[0024] S3, when the temperature of the voice coil assembly decreases, the thermal deformation piece is reset from the heated state to the normal temperature state, driving the inner ring of the spring to reset and close the heat dissipation channel, so that the spring and the voice coil assembly connection surface are sealed;
[0025] S4, the spring releases the stored elastic potential energy to generate an axial driving force with the same frequency as the movement of the voice coil assembly, assisting the movement of the voice coil assembly.
[0026] The beneficial effects of the application are as follows:
[0027] (1) Active heat response heat dissipation mechanism;
[0028] The sound generating components in the existing loudspeaker rely on passive structure heat dissipation, while the present application realizes the active response of "temperature-deformation-heat dissipation channel opening" through the temperature sensitive characteristics of the thermal deformation piece; when the temperature rises, the thermal deformation piece drives the spring to form a heat dissipation channel, which is automatically sealed when the temperature decreases, and the dynamic adjustment mechanism is used to realize the automatic opening and closing of the heat dissipation channel.
[0029] (2) Heat-mechanical energy conversion closed loop system;
[0030] The inherent defect of voice coil heating is converted into driving force; the thermal deformation piece is deformed by heat to drive the spring to open the heat dissipation channel and store elastic potential energy; when the temperature decreases, the spring releases energy to form "extra elastic potential energy" to actively assist the movement of the voice coil, so that the voice coil assembly 230 obtains greater axial driving force, accelerates the movement speed and displacement amplitude, and forms a closed loop of "thermal energy-mechanical energy-acoustic performance improvement".
[0031] (3) Breathing type heat dissipation structure:
[0032] The fins are arranged between the thermal deformation pieces, and the fins are fanned in the heat dissipation channel by the reciprocating movement of the voice coil assembly, forming active air convection, which significantly improves the heat dissipation efficiency; at the same time, the flexible connecting piece is used to ensure that the fin array fanned synchronously, avoiding air flow backwash. BRIEF DESCRIPTION OF DRAWINGS
[0033] Figure 1The overall structure schematic diagram of the heat dissipation speaker is shown.
[0034] Figure 2 The structure schematic diagram of the sound production component is shown.
[0035] Figure 3 The structure schematic diagram of the voice coil assembly is shown.
[0036] Figure 4 The structure schematic diagram of the heat driving assembly is shown.
[0037] Figure 5 The structure schematic diagram of the heat dissipation speaker in the heat deformation sheet heated state is shown.
[0038] Figure 6 The structure schematic diagram of the tooth key is shown.
[0039] Figure 7 The structure schematic diagram of the fin is shown.
[0040] Figure 8 The structure schematic diagram of the flexible connecting piece is shown.
[0041] Figure 9 The structure schematic diagram of the ring groove is shown.
[0042] BRIEF DESCRIPTION OF DRAWINGS: 100, speaker shell; 200, sound production component; 210, magnetic circuit assembly; 211, magnetic field area; 220, spider; 230, voice coil assembly; 231, voice coil skeleton; 232, coil; 233, ring groove; 240, spring wave; 241, sealed space; 250, cone; 260, dust cap; 300, heat driving assembly; 310, heat deformation sheet; 311, tooth key; 320, heat dissipation channel; 330, fin; 331, flexible connecting piece. DETAILED DESCRIPTION
[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in combination with embodiments.
[0044] Figure 1 The overall structure schematic diagram of the heat dissipation speaker is shown. Figure 2 The structure schematic diagram of the sound production component 200 is shown. Figure 1 And Figure 2 In the heat dissipation speaker, the heat dissipation speaker comprises a speaker shell 100 and a sound production component 200 installed in the speaker shell, wherein the sound production component 200 comprises a magnetic circuit assembly 210, a spider 220, a voice coil assembly 230, a spring wave 240, a cone 250 and a dust cap 260, wherein:
[0045] The magnetic circuit assembly 210 is located at the bottom of the entire sound production component, and the top of the magnetic circuit assembly 210 has a magnetic field area 211; the magnetic circuit assembly 210 is composed of a permanent magnet and a T-shaped iron, and a magnetic field can be formed at the magnetic field area 211.
[0046] The yoke 220 is installed at the top of the magnetic circuit assembly 210 and has a flared structure as a whole, and is used to support the cone 250.
[0047] The voice coil assembly 230 is installed in the magnetic field area 211 in a floating manner and moves in the flared direction when energized.
[0048] The spider 240 has a ring structure as a whole, is connected between the yoke 220 and the voice coil assembly 230, is used to limit the axial movement of the voice coil assembly 230, and drives the voice coil assembly 230 to reset through self-recovery to form a reciprocating structure; the spider 240 cooperates with the voice coil assembly 230 and the yoke 220 to form a sealed space 241 communicating with the magnetic field area 211, and in actual use, heat is usually concentrated in the magnetic field area 211 and the sealed space 241.
[0049] The cone 250 is connected at the top of the voice coil assembly 230 and is connected at the inner wall of the yoke 220 in the flared end; the cone 250 vibrates with the movement of the voice coil assembly 230 to emit sound.
[0050] The dust cap 260 is installed in the inner ring of the cone 250 and blocks the top of the voice coil assembly 230 to prevent dust from entering the voice coil assembly 230.
[0051] Figure 3 A structural schematic view of the voice coil assembly 230 is shown; Figure 3 In the voice coil assembly 230, the voice coil assembly 230 includes a cylindrical voice coil former 231 and a coil 232 wound on the surface of the voice coil former 231; in actual use, the coil 232 is connected to form a loop and drives the voice coil assembly 230 to move axially in cooperation with the magnetic field at the magnetic field area 211.
[0052] Figure 4 A structural schematic view of the heat-driven assembly 300 is shown; Figure 5 A structural schematic view of the heat-driven assembly 300 in a heated state is shown; Figure 4 and Figure 5 In the voice coil assembly 230 and the spider 240, the heat-driven assembly 300 is connected between the voice coil former 231 and the heat-driven assembly 300, the heat-driven assembly 300 includes a plurality of heat deformation pieces 310 arranged circumferentially around the voice coil former 231, the heat deformation piece 310 is connected between the voice coil former 231 and the heat-driven assembly 300, there is a gap between adjacent two heat deformation pieces 310, the heat deformation piece 310 has at least a normal temperature state and a heated state, and the heat deformation piece 310 changes between the normal temperature state and the heated state when the temperature changes.
[0053] When the thermal deformation sheet 310 is converted from the normal temperature state to the heated state, the thermal deformation sheet 310 is deformed by heat to drive the inner ring of the spring wave 240 to expand outward and protrude, the space between the two adjacent thermal deformation sheets 310 forms a heat dissipation channel 320, and the spring wave 240 is axially deformed and stores elastic potential energy;
[0054] When the thermal deformation sheet 310 is converted from the heated state to the normal temperature state, the thermal deformation sheet 310 resets and adheres to the surface of the voice coil skeleton 231, the spring wave 240 and the connection surface of the voice coil assembly 230 are sealed, and the spring wave 240 resets and releases the elastic potential energy as a driving force with the same frequency as the voice coil assembly 230.
[0055] That is, the thermal deformation of the thermal deformation sheet 310 itself is used as a driving force, which can cause a change in form when the temperature reaches a threshold value and drive the inner ring of the spring wave 240 to displace, the inner ring of the spring wave 240 is displaced in both the radial direction and the axial direction, that is, the inner ring expands outward and protrudes upward, where upward means away from the side of the coil 232, and at the same time, the space between the two adjacent thermal deformation sheets 310 forms a heat dissipation channel 320 that communicates with the magnetic field region 211 to discharge heat, solving the problem of increased resistance and decreased driving force caused by overheating of the voice coil assembly 230 and the magnetic field region 211; avoid demagnetization of the magnetic circuit assembly 210 due to high temperature, maintain stable magnetic field strength; and automatically respond based on the thermal deformation mechanism of the thermal deformation sheet 310, dissipate heat in time, and prevent the internal temperature from continuously rising.
[0056] It is worth emphasizing that the thermal deformation sheet 310 has special thermal deformation characteristics, which force the spring wave 240 to elastically deform, thereby storing elastic potential energy, which is different from the deformation energy stored by the spring wave 240 due to the normal movement of the voice coil assembly 230, and is an "extra elastic potential energy" under the thermal drive of the thermal deformation sheet 310;
[0057] Once the temperature decreases, the extra elastic potential energy stored in the spring wave 240 begins to release, generating a downward restoring force. This restoring force acts on the voice coil assembly 230 and "superimposes" with the axial movement force of the voice coil assembly 230 due to electromagnetic force. Since the elastic restoring force of the spring wave 240 is in the same direction as the axial movement direction of the voice coil assembly 230, it can assist in pushing the voice coil assembly 230, allowing the voice coil assembly 230 to obtain greater axial driving force and accelerate its movement speed and displacement amplitude;
[0058] On the one hand, the production of low-frequency sound relies on the large amplitude and low frequency vibration of the diaphragm. The extra axial driving force helps the voice coil assembly 230 to achieve greater amplitude of low-frequency vibration, making up for the insufficient driving of electromagnetic force at low frequency, making the bass sound more robust and deep, and avoiding the situation of insufficient low frequency and muffled sound;
[0059] On the other hand, the greater axial driving force enables the voice coil assembly 230 to vibrate more quickly and greatly, so that the sound strength contrast is more obvious and the sound explosion force is stronger when processing large dynamic audio signals, thus bringing a more shocking auditory experience.
[0060] It should be noted that the temperature threshold at which the thermal deformation sheet 310 changes its shape is not specifically limited and can be set as needed.
[0061] In one embodiment, the thermal deformation sheet 310 is a memory metal, for example, made of nickel-titanium memory alloy, which can switch between two preset shapes when the temperature changes. It is suitable for frequent use scenarios and can still function stably after multiple temperature cycles, ensuring the stability and consistency of sound quality during long-term use.
[0062] In another embodiment, the thermal deformation sheet 310 has a double-layer structure, including two metal sheets with different temperature coefficients and adhered to each other, and the temperature coefficient of the outer metal is smaller than that of the inner metal. In actual use, the metal layer with a high expansion coefficient has a larger elongation and will bend to the side of the metal layer with a low expansion coefficient. For example, the inner layer is made of brass and the outer layer is made of steel. When heated, the inner brass layer wants to elongate, but is restricted by the outer steel layer, and the overall structure will bend to the side of the outer layer with a low expansion coefficient, that is, curl outward.
[0063] Figure 6 A structural diagram of the tooth key 311 is shown; Figure 6 In this embodiment, the side surface of the thermal deformation sheet 310 has a tooth key 311 to form a sawtooth structure. The concave-convex structure formed by the sawtooth can disturb the air flow, break the stagnation boundary layer close to the surface, and promote the turbulent flow of air, so that heat is carried away more quickly, thereby effectively reducing the temperature inside the sound generating component and avoiding performance degradation and shortened life caused by overheating.
[0064] Figure 7 A structural diagram of the fin 330 is shown; Figure 7In the middle, two adjacent thermal deformation sheet 310 between the fins 330, fin 330 one end with the voice coil former 231 connected, the other end as a free end, fin 330 normal temperature state by the elastic wave 240 suppression fit voice coil former 231 surface, fin 330 in the heated state free end and stretch into the heat dissipation channel 320, and with the voice coil assembly 230 reciprocating motion in the heat dissipation channel 320 in the form of breathing to form a respiratory heat dissipation; fin 330 in the heated state free end and stretch into the heat dissipation channel 320, with the voice coil assembly 230 reciprocating motion in the heat dissipation channel 320 in the form of a passive fan; voice coil assembly 230 movement, fin 330 of the agitation will actively disturb the air in the heat dissipation channel 320, accelerate the air convection. Compared with simply rely on natural convection cooling, this kind of active disturbance can more quickly from the sound emitting component inside the key heat area of heat, significantly improve the heat dissipation efficiency.
[0065] Figure 8 The structure diagram of the flexible connecting piece 331 is shown; Figure 8 In the middle, two adjacent fins 330 are connected by flexible connecting piece 331 to form an array structure in the circumferential direction, and the flexible connecting piece 331 is a silicone rubber-carbon fiber composite elastomer; the flexible connecting piece 331 is in a relaxed state when the fins 330 are static, without affecting the initial fitting; when the fins 330 swing, the flexible connecting piece 331 is stretched, and adjacent fins 330 are moved in the same direction by the elastic force; when the fins 330 swing in the opposite direction, the flexible connecting piece 331 is compressed, ensuring that all fins 330 are synchronized to decelerate, avoiding air flow backflow.
[0066] Figure 9 The structure diagram of the ring groove 233 is shown; the surface of the voice coil former 231 is provided with a ring groove 233; in the normal temperature state, the fins 330 and the thermal deformation sheet 310 are embedded in the ring groove 233 and form a smooth transition surface; the smooth transition surface eliminates the step difference between the components, so that the fins 330, the thermal deformation sheet 310 and the surface of the voice coil former 231 form a unified whole, avoiding friction resistance caused by protrusions during movement, and improving the smoothness of the system movement.
[0067] The heat dissipation method of the heat dissipation type loudspeaker box comprises the following steps:
[0068] S1, when the temperature of the voice coil assembly 230 rises to a preset threshold, the thermal deformation sheet 310 of the thermal driving assembly 300 is switched from a normal temperature state to a heated state, and thermal deformation occurs;
[0069] S2, the thermal deformation sheet 310 drives the inner circle of the elastic wave 240 to expand radially and protrude axially, so that the space between the adjacent thermal deformation sheets 310 forms a heat dissipation channel 320 connected to the magnetic field area 211, and the elastic wave 240 is axially deformed to store elastic potential energy;
[0070] S3, when the voice coil assembly 230 temperature decreases, the thermal deformation sheet 310 is reset from the heated state to the normal temperature state, the inner ring of the spring wave 240 is reset to close the heat dissipation channel 320, so that the spring wave 240 and the voice coil assembly 230 connection surface are sealed;
[0071] S4, the spring wave 240 releases the stored elastic potential energy, generates an axial driving force with the same frequency as the voice coil assembly 230 movement, and assists in driving the voice coil assembly 230 movement.
[0072] The above examples are only used to illustrate the technical solutions of the present application, and not to limit them.
Claims
1. A heat dissipation speaker, comprising a speaker housing (100) and at least one sound-generating component (200) mounted in the speaker housing (100), wherein the sound-generating component (200) comprises: A floating voice coil assembly (230) includes a voice coil frame (231) and a coil (232) wound on the surface of the voice coil frame (231), wherein the coil (232) drives the voice coil assembly (230) to move when energized; and a damper (240), wherein the damper (240) is connected to the voice coil frame (231) via a connecting thermal drive component (300); The thermal drive assembly (300) is characterized in that the thermal deformation sheet (310) comprises a plurality of groups of thermal deformation sheets (310) arranged circumferentially around the voice coil frame (231), the thermal deformation sheets (310) are connected between the voice coil frame (231) and the thermal drive assembly (300), a gap is provided between two adjacent thermal deformation sheets (310), the thermal deformation sheets (310) have at least a normal temperature state and a heated state, and the thermal deformation sheets (310) switch between the normal temperature state and the heated state when the temperature changes; When the thermal deformation piece (310) is transformed from a normal temperature state to a heated state, the thermal deformation piece (310) undergoes thermal deformation to drive the inner circle of the elastic wave (240) to expand outward and bulge, and the interval between two adjacent thermal deformation pieces (310) forms a heat dissipation channel (320); When the thermal deformation piece (310) is converted from a heated state to a normal temperature state, the thermal deformation piece (310) is reset and adheres to the surface of the voice coil frame (231), and the connection surface between the elastic wave (240) and the voice coil assembly (230) is sealed.
2. The heat dissipation speaker according to claim 1, characterized in that: The elastic wave (240) is axially deformed and stores elastic potential energy when it is transformed from a normal temperature state to a heated state; When the elastic wave (240) switches from a heated state to a normal temperature state, it resets and releases elastic potential energy to serve as a driving force with the same frequency as the voice coil assembly (230).
3. The heat dissipation speaker according to claim 2, characterized in that: The thermal deformation piece (310) is made of a memory alloy and switches from a normal temperature state to a heated state when the temperature reaches a preset threshold.
4. The heat dissipation speaker according to claim 2, characterized in that: The thermal deformation sheet (310) has a double-layer structure, comprising two metal sheets with different temperature coefficients and bonded to each other, wherein the temperature coefficient of the outer metal layer is smaller than that of the inner metal layer.
5. The heat dissipation speaker according to claim 3, characterized in that: The side surface of the thermal deformation plate (310) has teeth (311) to form a sawtooth structure.
6. The heat dissipation speaker according to claim 5, characterized in that: A fin (330) is provided between two adjacent thermal deformation sheets (310), one end of the fin (330) is connected to the voice coil frame (231), and the other end serves as a free end. The fin (330) is pressed by the elastic wave (240) to fit the surface of the voice coil frame (231) under normal temperature. The free end of the fin (330) is tilted and extends into the heat dissipation channel (320) under the heating state, and is fanned in the heat dissipation channel (320) as the voice coil assembly (230) reciprocates to form a breathing heat dissipation.
7. The heat dissipation speaker according to claim 6, characterized in that: Two adjacent fins (330) are connected via a flexible connector (331) to form a circumferential array structure, wherein the flexible connector (331) is a silicone rubber-carbon fiber composite elastomer.
8. The heat dissipation speaker according to claim 6, characterized in that: The surface of the voice coil frame (231) is provided with an annular groove (233). Under normal temperature conditions, the fins (330) and the thermal deformation sheet (310) are both embedded in the annular groove (233) to form a smooth transition surface.
9. The heat dissipation method of a heat dissipation type speaker according to any one of claims 1 to 8, characterized in that: The steps include: S1, when the temperature of the voice coil assembly (230) rises to a preset threshold, the thermal deformation piece (310) of the thermal drive assembly (300) switches from a normal temperature state to a heated state, and thermal deformation occurs; S2, the thermal deformation piece (310) drives the inner ring of the elastic wave (240) to expand radially outward and bulge axially, so that the intervals between adjacent thermal deformation pieces (310) form a heat dissipation channel (320) connected to the magnetic field region (211), and at the same time, the elastic wave (240) deforms axially to store elastic potential energy; S3, when the temperature of the voice coil assembly (230) decreases, the thermal deformation plate (310) returns from the heated state to the normal temperature state, driving the inner ring of the elastic wave (240) to return to the closed heat dissipation channel (320), so that the connection surface between the elastic wave (240) and the voice coil assembly (230) is sealed; S4, the elastic wave (240) releases the stored elastic potential energy to generate an axial driving force with the same frequency as the movement of the voice coil assembly (230), thereby assisting in driving the movement of the voice coil assembly (230).