Vapor chamber

Abstract

The invention provides a vapor chamber. The vapor chamber comprises a first flexible glass cover plate, a second flexible glass cover plate matched with the first flexible glass cover plate to form a cavity, and an adsorption layer located in the cavity. The adsorption layer comprises an adsorption material and at least part of a heat-conducting medium existing in the adsorption material. The vapor chamber has excellent heat dissipation performance and foldability, the bending radius of the vapor chamber is smaller than or equal to 3 mm, and the number of times of bending resistance is not smaller than 150 thousand.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation structure, in particular to a vapor chamber. BACKGROUND

[0002] With the increasing functions and power of electronic products, the heat generated by the products is also increasing. The vapor chamber (VC) has a capillary structure and a cooling medium inside. When the cooling medium changes its phase, it absorbs or releases latent heat of phase change, thereby transporting heat from the heat source to a relatively low temperature location. The vapor chamber is an ideal solution to the heat dissipation problem of various electronic products.

[0003] Existing vapor chambers are mostly made of metal as a cover plate, which has the characteristics of rigidity, and cannot be bent or folded. However, electronic products are developing towards foldability and flexibility, such as foldable screen phones and curved electronic displays. For these foldable electronic devices, it is urgent to develop a foldable heat dissipation structure to solve the heat dissipation problem of these products. SUMMARY

[0004] The present application provides a vapor chamber, which uses a flexible glass cover plate as the upper and lower substrates, has excellent foldability, and has a bending radius of not more than 3 mm and a bending frequency of not less than 150,000 times.

[0005] In a first aspect, the present application provides a vapor chamber, comprising:

[0006] a first flexible glass cover plate;

[0007] a second flexible glass cover plate, cooperating with the first flexible glass cover plate to form a cavity;

[0008] an adsorption layer located in the cavity; the adsorption layer comprises an adsorption material and at least part of a heat-conducting medium existing in the adsorption material.

[0009] In a possible implementation, the thermal conductivity of the first flexible glass cover plate is 5-40 W / (m•k);

[0010] and / or, the thermal conductivity of the second flexible glass cover plate is 5-40 W / (m•k).

[0011] In a possible implementation, the first flexible glass cover plate comprises a flexible glass and a first doping material doped in the flexible glass, and the first doping material comprises at least one of a metal oxide, a nitride, a carbon-based material, metal particles, and ceramic particles;

[0012] And / or, the second flexible glass cover plate comprises a flexible glass, and a second doping material doped in the flexible glass, the second doping material comprising at least one of a metal oxide, a nitride, a carbon-based material, metal particles or ceramic particles.

[0013] In a possible implementation, the first flexible glass cover plate comprises, in terms of volume percentage, at least one of 1-6% metal oxide, 0.5-15% nitride, 0.1-15% carbon-based material, 0.5-10% metal particles, 2-10% ceramic particles.

[0014] And / or, the second flexible glass cover plate comprises, in terms of volume percentage, at least one of 1-6% metal oxide, 0.5-15% nitride, 0.1-15% carbon-based material, 0.5-10% metal particles, 2-10% ceramic particles.

[0015] In a possible implementation, the first doping material is a nanomaterial.

[0016] And / or, the second doping material is a nanomaterial.

[0017] In a possible implementation, a side surface of the second flexible glass cover plate facing the cavity contains a hydrophilic group.

[0018] And / or, a surface of the adsorption material contains a hydrophilic group.

[0019] In a possible implementation, the first flexible glass cover plate has a thickness of 0.02-0.3mm, preferably 0.03-0.1mm.

[0020] And / or, the second flexible glass cover plate has a thickness of 0.02-0.3mm, preferably 0.03-0.1mm.

[0021] In a possible implementation, the heat-conducting medium comprises a liquid phase change material; preferably, the liquid phase change material comprises water and / or an alcohol solvent.

[0022] In a possible implementation, the adsorption layer is bonded to the second flexible glass cover plate.

[0023] And / or, the cavity comprises a second recess defined by the second flexible glass cover plate, at least a partial region of the adsorption layer being located in the second recess.

[0024] And / or, the adsorption layer has a thickness of 0.01-0.1mm.

[0025] In a possible implementation, the vapor chamber comprises a support column located in the cavity, the support column being located between the first flexible glass cover plate and the adsorption layer.

[0026] In a possible implementation, one end of the support column is bonded to the first flexible glass cover plate, and the other end is in contact with the adsorption layer.

[0027] And / or, the ratio of the length of the support column to the thickness of the adsorption layer is (1.5-3)~1.

[0028] And / or, the vapor chamber comprises a plurality of support columns, preferably the spacing between any two adjacent support columns is 1.3~1.8mm.

[0029] In a possible implementation, the cavity comprises a first recess defined by the first flexible glass cover plate, and at least part of the support column is located in the first recess.

[0030] In a possible implementation, the cavity comprises a first recess defined by the first flexible glass cover plate and / or a second recess defined by the second flexible glass cover plate.

[0031] Preferably, the cavity comprises a first recess defined by the first flexible glass cover plate and a second recess defined by the second flexible glass cover plate.

[0032] Preferably, the cavity is a first recess defined by the first flexible glass cover plate.

[0033] In a possible implementation, the first flexible glass cover plate comprises a first body portion and a first extension portion connected to the first body portion.

[0034] The second flexible glass cover plate comprises a second body portion and a second extension portion connected to the second body portion.

[0035] The first extension portion is bonded to the second extension portion.

[0036] In a possible implementation, the first flexible glass cover plate further comprises a first extension portion connected between the first body portion and the first extension portion, an included angle is formed between the first body portion and the first extension portion, one end of the first extension portion is connected to the first extension portion, and the other end extends outward in a direction away from the cavity.

[0037] And / or, the second flexible glass cover plate further comprises a second extension part connected between the second body part and the second extension part, an included angle is formed between the second extension part and the second body part, one end of the second extension part is connected with the second extension part, and the other end extends outward in a direction away from the cavity.

[0038] In a possible implementation, the vapor chamber comprises a liquid injection hole defined by the first extension part and the second extension part, and the liquid injection hole is in communication with the cavity.

[0039] In a possible implementation, the thickness of the vapor chamber is greater than or equal to 0.21 mm.

[0040] In a possible implementation, the bending radius of the vapor chamber is less than or equal to 3 mm.

[0041] And / or, the number of bending resistances of the vapor chamber is greater than or equal to 150,000 times.

[0042] In a second aspect, the embodiments of the present application provide an electronic device comprising the vapor chamber.

[0043] In a possible implementation, the electronic device is a foldable electronic device.

[0044] The vapor chamber provided by the embodiments of the present application comprises a first flexible glass cover plate and a second flexible glass cover plate, a cavity is formed between the first flexible glass cover plate and the second flexible glass cover plate, and the cavity comprises an adsorbent material and a heat-conducting medium in the adsorbent material. The use of the flexible glass cover plate makes the vapor chamber have excellent heat dissipation and bending properties, the bending radius of the vapor chamber is not higher than 3 mm, and the number of bending times of the vapor chamber is not less than 150,000 times. BRIEF DESCRIPTION OF DRAWINGS

[0045] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the application.

[0046] Figure 1 A longitudinal cross-sectional structure schematic diagram of the vapor chamber provided by an embodiment of the present application is shown in the figure.

[0047] Figure 2 A longitudinal cross-sectional structure schematic diagram of the vapor chamber provided by an embodiment of the present application is shown in the figure.

[0048] Figure 3 A longitudinal cross-sectional structure schematic diagram of the vapor chamber provided by an embodiment of the present application is shown in the figure.

[0049] Explanation of reference signs:

[0050] 1 - first flexible glass cover plate; 2 - support column; 3 - second flexible glass cover plate; 4 - adsorption layer; 5 - liquid injection hole; 6 - first body portion; 7 - first extension portion; 8 - first outer extension portion; 9 - second body portion; 10 - second extension portion; 11 - second outer extension portion.

[0051] The specific embodiments of the present application have been shown by way of example in the above figures, and will be described in more detail hereafter. These figures and this written description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate the inventive concept by reference to specific embodiments. DETAILED DESCRIPTION

[0052] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The description of the exemplary embodiments is intended to apply to all alternative embodiments, as would be understood by one skilled in the art. The following description is not intended to limit the scope of the application in any way.

[0053] The terms "first", "second", "third", etc. are used herein only to describe different ones of the embodiments and do not imply a relative importance or a specific order of the technical features they introduce. Thus, features defined with "first", "second" or "third" can include at least one of the features explicitly or implicitly. In the description of the application, the meaning of "a plurality" is at least two, for example, two, three, etc., unless otherwise specifically defined. All directional references, such as up, down, left, right, front, back, etc., are used with respect to the particular orientation of the figure under discussion. Such relative terms are used herein for clarity of description. The terms "include", "have", and the like, as used herein, are intended to be construed as inclusive or open ended (i.e., the processes, methods, articles, or apparatuses that include such terms exclude other non-enumerated items). Accordingly, such terms are used in the description of the exemplary embodiments to indicate that the described features are among the many possible features that can be included.

[0054] As used herein, "electronic device" includes, but is not limited to, devices that are configured to receive / send communication signals over a wired line (e.g., a telephone wire, a cable wire, and / or another wire; a digital user line (DSL); a digital cable; a direct cable connection, and / or another data connection / network) and / or over a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal that is configured to communicate over a wireless interface can be referred to as a "wireless communication terminal," a "wireless terminal," or a "mobile terminal." Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that can combine a cellular radiotelephone with data processing, facsimile, and data communications capabilities; PDA's that can include a wireless radiotelephone, a pager, Internet / intranet access, Web browser, organizer, calendar, and / or a global positioning system (GPS) receiver; and conventional laptop and / or palmtop receivers, or other electronic devices that include a wireless radiotelephone transceiver. A handset is an electronic device configured with a cellular communication module.

[0055] In the prior art, the heat plate has the technical problems of not being easy to bend and not being foldable.

[0056] The heat plate provided by the present application solves the technical problems of the heat plate not being foldable and difficult to dissipate heat by using flexible glass as the upper and lower cover plates of the heat plate.

[0057] The technical solutions of the present application and how the technical solutions solve the above technical problems will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described again in some embodiments. The embodiments of the present application will be described below with reference to the accompanying drawings.

[0058] Figure 1 A longitudinal sectional structure schematic diagram of the heat plate provided by an embodiment of the present application is shown in FIG. 1, which includes: Figure 1

[0059] a first flexible glass cover plate 1;

[0060] a second flexible glass cover plate 3, which cooperates with the first flexible glass cover plate 1 to form a cavity (not shown in the figure);

[0061] ​An adsorption layer 4 is located in the cavity and in contact with the second glass cover plate 3; the adsorption layer 4 comprises an adsorption material (not shown in the figure) and at least part of a heat-conducting medium (not shown in the figure) in the adsorption material. In some specific embodiments, part of the heat-conducting medium can also exist in the space between the support column 2, the adsorption layer 4 and the first flexible glass cover plate 1, and this part of the heat-conducting medium does not completely fill the space between the support column 2, the adsorption layer 4 and the first flexible glass cover plate 1.

[0062] The present application uses flexible glass as the upper and lower cover plates of the heat plate, and sets an adsorption layer comprising a heat-conducting medium in the cavity formed by the flexible glass cover plate, so that the obtained heat plate has excellent heat dissipation and heat equalization, and also has excellent flexibility. The obtained heat plate can be repeatedly bent during application, and the bending radius is less than or equal to 3 mm, and the number of bending resistance is greater than or equal to 150,000 times.

[0063] In order to make the heat plate have better heat conduction effect, the thermal conductivity of the first flexible glass cover plate 1 used is 5-40 W / (m•k), for example, 5 W / (m•k), 15 W / (m•k), 20 W / (m•k), 25 W / (m•k), 30 W / (m•k), 35 W / (m•k), 40 W / (m•k), etc. The thermal conductivity of the second flexible glass cover plate 3 used is 5-40 W / (m•k), for example, 5 W / (m•k), 15 W / (m•k), 20 W / (m•k), 25 W / (m•k), 30 W / (m•k), 35 W / (m•k), 40 W / (m•k), etc. The thermal conductivities of the first flexible glass cover plate 1 and the second flexible glass cover plate 3 can be the same or different.

[0064] Optionally, the first flexible glass cover plate 1 comprises flexible glass and a first doping material doped in the flexible glass. The second flexible glass cover plate 3 comprises flexible glass and a second doping material doped in the flexible glass. Specifically, the material of the flexible glass can be selected from aluminosilicate glass, borosilicate glass, etc. The first doping material in the first flexible glass cover plate 1 comprises at least one of metal oxide, nitride, carbon-based material, metal particles and ceramic particles, and the second doping material in the second flexible glass cover plate 3 also comprises at least one of metal oxide, nitride, carbon-based material, metal particles and ceramic particles, and the types of the first doping material and the second doping material can be the same or different.

[0065] The flexible glass is an amorphous solid, whose atoms are arranged in a disordered network structure, which results in the low thermal conductivity of the flexible glass. The metal oxide and ceramic particles can precipitate microcrystalline regions in the flexible glass to form an ordered crystal structure, obtaining a high thermal conductivity crystal phase. The nitride can form a continuous thermal conduction network in the flexible glass matrix by using its strong covalent bond. The carbon-based material can become a "super thermal conductor" in the flexible glass due to its ultra-high thermal conductivity. The metal particles introduce free electrons into the flexible glass, which transfers heat energy by constructing electron-phonon coupling. By adding the first and second doping materials, the thermal conductivity of the first and second flexible glass cover plates 1 and 3 is improved, achieving the purpose of enhancing the thermal conductivity of the vapor chamber.

[0066] Since the metal particles and ceramic particles in the flexible glass will form stress concentration points, the carbon-based material will make the flexible glass substrate brittle, and the nitride will increase the rigidity of the flexible glass substrate, which will all affect the bending performance of the flexible glass. In order to ensure the bending performance of the flexible glass, or even optimize its bending performance, the addition amount of the metal oxide is selected to be 1-6% by volume percentage, for example, 1%, 2%, 3%, 4%, 5%, 6%, etc.; the addition amount of the nitride is selected to be 0.5-15% by volume percentage, for example, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, etc.; the addition amount of the carbon-based material is selected to be 0.1-15% by volume percentage, for example, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 1.0%, 10%, 11%, 12%, 13%, 14%, 15%, etc.; the addition amount of the metal particles is selected to be 0.5-10% by volume percentage, for example, 0.5%, 1%, 1.5%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc.; the addition amount of the ceramic particles is selected to be 2-10% by volume percentage, for example, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc. It should be noted that the doping amount of the first and second doping materials in the flexible glass can be the same or different.

[0067] Considering the ultra-thin thickness of the flexible glass, and the mechanism of the first and second doping materials improving the thermal conductivity of the flexible glass, the first and / or second doping materials used are nanomaterials, and the particle size of the nanomaterials is 1-100 nm. Specifically, the metal oxide includes aluminum oxide nanoparticles, magnesium oxide nanoparticles, beryllium oxide nanoparticles, etc.; the nitride includes silicon nitride nanoparticles, aluminum nitride nanoparticles, boron nitride nanoparticles, etc.; the carbon-based material includes graphene quantum dots, carbon nanotubes, diamond nanoparticles, etc.; the metal particles include silver nanoparticles, copper nanoparticles, aluminum nanoparticles, etc.; the ceramic particles include silicon carbide nanoparticles, etc.

[0068] Further, in order to make the above-mentioned nanomaterials have better dispersibility in the flexible glass and reduce the influence of the nanomaterials on the mechanical properties of the flexible glass as much as possible, the particle size of the nanomaterials used in the present application is between 1-100 nm, and the particle size of the nanomaterials can be 1 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm or a range formed by any two of them.

[0069] It should be noted that the specific types and particle sizes of the first doping material and the second doping material can be the same or different, which is not limited herein.

[0070] Continuing to refer to Figure 1 , at least one of the first flexible glass cover plate 1 and the second flexible glass cover plate 3 is provided with a groove to form the cavity, that is, the cavity includes a first groove defined by the first flexible glass cover plate 1 and / or a second groove defined by the second flexible glass cover plate 3. As Figure 1 shown, in some specific embodiments, the cavity can include a first groove defined by the first flexible glass cover plate 1 and a second groove defined by the second flexible glass cover plate 3. In some other specific embodiments, the cavity can only include a first groove defined by the first flexible glass cover plate or a second groove defined by the second flexible glass cover plate, as Figure 3 shown, at this time, the cavity is a first groove defined by the first flexible glass cover plate 1, and the second flexible glass cover plate 3 is a flat structure.

[0071] In the cavity, the heat-conducting medium flows in the space between the support column 2, the adsorption layer 4 and the first flexible glass cover plate 1 after being vaporized by heat, so that the heat is quickly dissipated, thereby playing the effect of heat conduction and heat dissipation of the heat spreader. In order to ensure that the vaporization and liquefaction process of the heat-conducting medium is not affected by impurities and improve the heat dissipation effect of the heat spreader, the space between the adsorption layer 4 and the first flexible glass cover plate 1 is generally in a vacuum state, and the vacuum degree is less than 20 pa, and the vacuum degree can be 1 pa, 5 pa, 10 pa, 15 pa, 20 pa or a range formed by any two of them.

[0072] The heat-conducting medium in the adsorption layer 4 includes a phase change material, and the phase change material includes a liquid phase change material. When heated, the liquid phase change material can undergo gas-liquid phase change. When the heat spreader is heated, the liquid phase change material absorbs heat and vaporizes, taking away heat, and the high-temperature steam with heat diffuses to the cavity between the first flexible glass cover plate 1 and the second flexible glass cover plate 3, and releases heat and liquefies in a low-temperature area, releasing heat. The condensed liquid flows back to the adsorption layer 4 through the adsorption material in the adsorption layer 4, completing the heat conduction cycle.

[0073] If the condensation and return flow rate of the liquid phase change material is lower than the heated evaporation rate, the heat conduction of the vapor chamber will be weakened. In order to accelerate the condensation and return flow rate of the liquid phase change material, the second side surface of the second flexible glass cover plate 3 facing the cavity and / or the surface of the adsorption material can be subjected to hydrophilic treatment to contain hydrophilic groups such as hydroxyl, amino, carboxylic acid group, sulfonic acid group, phosphoric acid group, etc., so as to enhance the capillary performance in the cavity. Specifically, the hydrophilic treatment includes sol-gel coating, plasma polymerization, etc. The cavity containing the hydrophilic groups can promote the condensation of the vapor into a continuous liquid film, reduce the condensation thermal resistance; in the high heat flux density area, the hydrophilic surface can ensure that the condensed liquid quickly returns to cover the evaporation surface, which can not only avoid the temperature rise caused by the shortage of heat conduction medium, but also make the heat conduction medium more evenly distributed, reduce the temperature difference between the cold end and the hot end of the vapor chamber, and improve the temperature uniformity. Specifically, the adsorption material can include non-woven fabric such as polyester fiber, polypropylene fiber, etc.; the heat conduction medium can include water and / or alcohol solvent, and the alcohol solvent can include methanol, ethanol, isopropyl alcohol, ethylene glycol, etc.

[0074] Optionally, in order to obtain a vapor chamber with better bending performance, the thickness of the first flexible glass cover plate 1 and / or the second flexible glass cover plate 3 is selected to be 0.02-0.3mm, such as 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, etc., preferably 0.03-0.1mm.

[0075] Continuing to refer to Figure 1 , the adsorption layer 4 can be fixedly bonded to the second flexible glass cover plate 3, and the bonding position can be in the second groove defined by the second flexible glass cover plate 3. Specifically, the second groove is formed by bending the second flexible glass cover plate 3. In some specific embodiments, the space occupied by the adsorption layer 4 does not exceed the second groove, i.e. the thickness of the adsorption layer 4 is less than or equal to the depth of the second groove. It should be noted that the thickness direction of the adsorption layer 4 is parallel to the first direction in Figure 1 , and the depth direction of the second groove is parallel to the first direction in Figure 1 , and the thickness direction of the adsorption layer 4 and the depth direction of the second groove are parallel to the thickness direction of the vapor chamber.

[0076] Considering that the thickness of the adsorption layer 4 will affect the content of the heat conduction medium contained in the vapor chamber, the evaporation and condensation resistance of the heat conduction medium, and the structural reliability of the vapor chamber, in the vapor chamber provided by the present application, the thickness of the adsorption layer 4 can be selected to be 0.01-0.1mm, such as 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0077] With reference to Figure 1 , the hot plate further comprises a support column 2 in the cavity, which is located between the first flexible glass cover plate 1 and the adsorption layer 4. One end of the support column 2 is bonded to the first flexible glass cover plate 1, and the other end is connected to the adsorption layer 4. Specifically, the other end of the support column 2 can be in direct contact with the adsorption layer 4, so as to press and fix the adsorption layer 4 in the second groove formed by the second flexible glass cover plate 3.

[0078] The presence of the support column 2 defines the size of the space between the first flexible glass cover plate 1 and the adsorption layer 4, which will affect the flow mass transfer of the vaporized heat-conducting medium. Therefore, in order to obtain better heat conduction effect, the thickness ratio of the support column 2 to the adsorption layer 4 can be selected as (1.5-3):1, such as 1.5:1, 1.7:1, 1.8:1, 2.0:1, 2.2:1, 2.3:1, 2.5:1, 2.7:1, 2.8:1, 3.0:1, etc. In some specific embodiments, the volume of the space formed by the first flexible glass cover plate 1, the adsorption layer 4 and the support column 2 accounts for 4-35% of the total volume of the space between the first flexible glass cover plate 1 and the adsorption layer 4. It should be noted that the thickness of the support column 2 is its length, and the length direction of the support column 2 is parallel to the first direction in Figure 1 , and the length direction of the support column 2 and the thickness direction of the adsorption layer 4 are parallel to the thickness direction of the hot plate.

[0079] In order to avoid deformation of the first flexible glass cover plate 1 and the second flexible glass cover plate 3 when the cavity is vacuumized, the hot plate can comprise a plurality of support columns 2, and each individual support column 2 is arranged in a spaced manner to form a gap for the flow and heat transfer of the vaporized heat-conducting medium. Specifically, with reference to Figure 2 , the plurality of support columns 2 can be uniformly arranged, that is, the distance between any two support columns 2 is substantially equal to the distance between any other two support columns 2. Alternatively, the length direction of the plurality of support columns 2 is substantially parallel to the thickness direction of the hot plate. The sizes (such as length, cross-sectional area of the same plane in the second direction, etc.) and shapes of these support columns are substantially the same. At this time, the distance between any two adjacent support columns can be selected as 1.3-1.8mm, such as 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, etc.

[0080] In some specific embodiments, at least part of the support columns 2 are located in the first groove defined on the side of the first flexible glass cover plate 1 facing the second flexible glass cover plate 3.

[0081] With reference to Figure 1The first flexible glass cover plate 1 comprises a first body part 6 and a first extension part 8 connected with the first body part 6, and the second flexible glass cover plate 3 comprises a second body part 9 and a second extension part 11 connected with the second body part 9.

[0082] When the first flexible glass cover plate 1 is provided with the first groove, the first flexible glass cover plate 1 further comprises a first extension part 7, the first body part 6 and the first extension part 8 are connected through the first extension part 7, an included angle is formed between the first extension part 7 and the first body part 6, one end of the first extension part 8 is connected with the first extension part 7 and the other end extends outward in a direction away from the cavity. When the first flexible glass cover plate 1 is not provided with the first groove (i.e. a flat structure), the first body part 6 and the first extension part 8 are directly connected. When the second flexible glass cover plate 3 is provided with the second groove, the second flexible glass cover plate 3 further comprises a second extension part 10, the second body part 9 and the second extension part 11 are connected through the second extension part 10, an included angle is formed between the second extension part 10 and the second body part 9, one end of the second extension part 11 is connected with the second extension part 10 and the other end extends outward in a direction away from the cavity. When the second flexible glass cover plate 3 is not provided with the second groove (i.e. a flat structure), the second body part 9 and the second extension part 11 are directly connected.

[0083] In some specific embodiments, the first body part 6 and / or the second body part 9 are / is substantially perpendicular to the first extension part 7 and / or the second extension part 10, and the first body part 6 and / or the second body part 9 and the first extension part 7 and / or the second extension part 10 form the groove. Figure 1 In some specific embodiments, the first extension part 7 and / or the second extension part 10 can be substantially perpendicular to the corresponding first extension part 8 and / or second extension part 11, and the first body part 6 and / or the second body part 9 and the first extension part 7 and / or the second extension part 10 form the groove.

[0084] In some specific embodiments, the first flexible glass cover plate 1 and the second flexible glass cover plate 3 can be connected through the adhesion of the first extension part 8 and the second extension part 11.

[0085] In some specific embodiments, the first flexible glass cover plate 1 and the second flexible glass cover plate 3 can be connected through the adhesion of the first extension part 8 and the second extension part 11. Figure 1The wick plate further comprises a liquid injection hole 5 defined by the first epitaxial part 8 and the second epitaxial part 11, the liquid injection hole 5 being in communication with the cavity and being used for vacuumizing and inputting the heat-conducting medium, and an end of the liquid injection hole 5 away from the cavity being sealed to maintain the vacuum degree in the cavity. The liquid injection hole 5 comprises a micro-groove formed on one side of the first epitaxial part 8 facing the second epitaxial part 11 and / or a micro-groove formed on one side of the second epitaxial part 11 facing the first epitaxial part 8; when the liquid injection hole 5 comprises both the micro-groove of the first epitaxial part 8 and the micro-groove of the second epitaxial part 11, the micro-groove of the first epitaxial part 8 and the micro-groove of the second epitaxial part 11 are substantially the same in shape and size; when the liquid injection hole 5 comprises only the micro-groove of the first epitaxial part 8 or the micro-groove of the second epitaxial part 11, the micro-groove of the first epitaxial part 8 or the micro-groove of the second epitaxial part 11 can be the same or different in shape and size. In some specific embodiments, the micro-grooves constituting the liquid injection hole 5 can be formed on part of the surface of the first epitaxial part 8 and / or the second epitaxial part 11 by conventional means, such as etching, etc. The sealing of the liquid injection hole 5 can be achieved by a sealing member (not shown in the figure), or in other embodiments, the sealing can be achieved by extrusion of the first epitaxial part 8 and the second epitaxial part 11 without a sealing member, which is not specifically limited here.

[0086] In order to obtain a wick plate with better heat spreading and anti-deformation ability, considering the amount of heat-conducting medium in the cavity of the wick plate, the evaporation flow pressure, the capillary structure and the like, the thickness of the wick plate is not less than 0.21 mm, for example, 0.21 mm, 0.22 mm, 0.25 mm, 0.30 mm, 0.35 mm, 0.40 mm, 0.45 mm, 0.50 mm, etc. If the wick plate is too thin, the heat-conducting medium is prone to block the gas-liquid interface during heat transfer circulation, and the heat transfer circulation system is prone to collapse. Moreover, as the wick plate becomes thinner, the cavity volume becomes smaller, and the vapor flow pressure drop of the heat-conducting medium increases, so that the vapor cannot flow quickly from the evaporation end to the condensation end, resulting in failure of the heat spreading function of the wick plate.

[0087] The wick plate in the embodiments of the present application is made of flexible glass to form the shell of the wick plate, and an adsorption layer comprising the heat-conducting medium is arranged between the flexible glass. When heat is conducted from the heat source to the wick plate, the heat-conducting medium in the cavity begins to vaporize after being heated in the vacuum environment, absorbs heat and flows to the cold end, condenses and releases heat after being cooled, and then returns to the heat source end through the adsorption material, thereby achieving the effects of heat spreading and heat dissipation. The wick plate provided in the embodiments of the present application has the characteristics of high structural flexibility and good heat spreading and heat dissipation effects. When the wick plate is bent, the bending radius is not higher than 3 mm, and the bending resistance is not less than 150,000 times, thereby having a long bending resistance life.

[0088] Further, the embodiments of the present application further provide an electronic device, which can comprise a display screen, a shell, a control circuit board and the above-mentioned wick plate. The electronic device has good heat dissipation and foldability.

[0089] Furthermore, the electronic device may be a foldable electronic device, such as a foldable mobile phone, a foldable tablet computer, a foldable wearable device, etc. These foldable electronic devices have a long bending life and good heat dissipation.

[0090] The present invention is described in more detail below through specific examples.

[0091] Example 1

[0092] like Figure 1 As shown, a heat spreader includes a first flexible glass cover plate 1 and a second flexible glass cover plate 3. The first body portion 6 of the first flexible glass cover plate 1 and the first extension portions 7 on both sides form a first groove. The second body portion 9 of the second flexible glass cover plate 3 and the second extension portions 10 on both sides form a second groove. Figure 1 The first extension 8 on the left side of the first flexible glass cover plate 1 and the second extension 11 on the left side of the second flexible glass cover plate 3 are sealed and bonded with glass glue, so that the first groove and the second groove form a cavity. Among them, the surface of the second flexible glass cover plate 3 facing the cavity has hydroxyl groups. At the same time, an injection hole 5 is formed between the first extension 8 on the right side of the first flexible glass cover plate 1 and the second extension 11 on the right side of the second flexible glass cover plate 3 by bonding and extrusion of glass glue, and ultrapure water of liquid phase change material is injected into the cavity through the injection hole 5, and vacuum is drawn through the injection hole 5. When the vacuum degree is less than 20Pa, the injection hole 5 is sealed. The cavity includes several support columns 2 bonded to the first flexible glass cover plate 1 and arranged evenly, an adsorption layer 4 bonded to the second flexible glass cover plate 3, and ultrapure water not shown in the figure.

[0093] Among them, the distance between any two adjacent support columns 2 is 1.5 mm, and the length of each support column 2 is the same, the length of the support column 2 is 0.15 mm, the thickness of the adsorption layer 4 is 0.05 mm (the ratio of the two is 3:1), and the adsorption material of the adsorption layer 4 is a non-woven fabric that has been hydrophilically treated.

[0094] The first flexible glass cover plate 1 and the second flexible glass cover plate 3 are made of the same material, both using aluminosilicate glass as the base material, to which 5% volume fraction of diamond nanoparticles (particle size 80nm) and 15% volume fraction of boron nitride nanosheets (thickness 5nm) are added. The thermal conductivity coefficient of the obtained first flexible glass cover plate 1 and the second flexible glass cover plate 3 are both 40W / (m•K), and the thickness is both 0.03mm.

[0095] Example 2

[0096] A vapor chamber with the same structure as that of Embodiment 1, except that 10% by volume of boron nitride nanosheets (3 nm in thickness) and 1% by volume of graphene quantum dots are added to the first flexible glass cover plate 1 and the second flexible glass cover plate 3. The thermal conductivity of the obtained first flexible glass cover plate 1 and the second flexible glass cover plate 3 is 38 W / (m•k).

[0097] Embodiment 3

[0098] A vapor chamber with the same structure as that of Embodiment 1, except that 10% by volume of diamond nanoparticles (80 nm in particle size) are added to the first flexible glass cover plate 1 and the second flexible glass cover plate 3. At this time, the thermal conductivity of the first flexible glass cover plate 1 and the second flexible glass cover plate 3 is 5 W / (m•k).

[0099] Embodiment 4

[0100] A vapor chamber with the same structure as that of Embodiment 1, except that 15% by volume of graphene quantum dots are added to the first flexible glass cover plate 1 and the second flexible glass cover plate 3. At this time, the thermal conductivity of the two flexible glass cover plates is 6 W / (m•k).

[0101] Embodiment 5

[0102] A vapor chamber with the same structure as that of Embodiment 1, except that the thickness of the first flexible glass cover plate 1 and the second flexible glass cover plate 3 is 0.1 mm.

[0103] Embodiment 6

[0104] A vapor chamber with the same structure as that of Embodiment 1, except that the thickness of the adsorption layer 4 is 0.1 mm. At this time, the length of the support column 2 is 0.3 mm.

[0105] Embodiment 7

[0106] A vapor chamber with the same structure as that of Embodiment 1, except that the ratio of the length of the support column 2 to the thickness of the adsorption layer 4 is 2:1. At this time, the length of the support column 2 is 0.1 mm, and the thickness of the adsorption layer 4 is 0.05 mm.

[0107] Embodiment 8

[0108] A vapor chamber with the same structure as that of Embodiment 1, except that the ratio of the length of the support column 2 to the thickness of the adsorption layer 4 is 1.5:1. At this time, the length of the support column 2 is 0.15 mm, and the thickness of the adsorption layer 4 is 0.1 mm.

[0109] Embodiment 9

[0110] A vapor chamber having the same structure as that of Example 1, except that the distance between any two adjacent support columns 2 is 1.3 mm.

[0111] Example 10

[0112] A vapor chamber having the same structure as that of Example 1, except that the distance between any two adjacent support columns 2 is 1.8 mm.

[0113] Comparative Example 1

[0114] A vapor chamber having the same structure as that of Example 1, except that the aluminosilicate glass substrate of the first flexible glass cover plate 1 is replaced by a non-flexible glass substrate, quartz glass.

[0115] The bending test and the thermal conductivity test were performed on the above-mentioned Examples 1-10 and Comparative Example 1, and the test structure is shown in Table 1:

[0116] Table 1

[0117]

[0118] As can be seen from the data in Table 1, the vapor chamber provided by the present application has excellent thermal conductivity and flexibility, and the bending radius thereof is less than or equal to 3 mm, and the bending resistance thereof can reach 150,000 times or more.

[0119] Compared with Examples 2, 3 and 4, the vapor chamber obtained in Example 1 has better thermal conductivity and bending resistance. The reason is that although reducing the addition amount of nanoparticles in the flexible glass cover plate helps to improve the flexibility of the vapor chamber and obtain a smaller bending radius, the reduction of nanoparticles also correspondingly reduces the thermal conductivity of the vapor chamber. In addition, the smaller the bending radius, the greater the surface bending stress on the flexible glass cover plate, and micro cracks or defects will appear inside, thereby reducing the bending resistance of the obtained vapor chamber, i.e. the bending resistance becomes worse.

[0120] Compared with Example 5, Example 1 has better thermal conductivity and bending resistance. The reason is that the flexible glass cover plate in Example 1 has a smaller thickness and a greater distribution density of nanoparticles, and the formed thermal conduction network has a better effect. Moreover, the smaller the thickness of the flexible glass cover plate, the smaller the stress on the flexible glass cover plate under the same bending radius, and the better the bending resistance.

[0121] Compared with Example 6, Example 1 has better thermal conductivity and bending resistance. Analyzing the reason, the thickness of the cavity where the support column and the adsorption layer are located in Example 1 is smaller, the reflux path of the heat conducting medium from the condensation end to the evaporation end is shorter, and the reflux capillary resistance is smaller, so the thermal conductivity of the heat spreader obtained is better. Moreover, the overall thickness of the heat spreader of Example 1 is smaller, and under the same bending radius, the internal stress is smaller, and the bending resistance is better.

[0122] Compared with Example 7 and Example 8, Example 1 has better thermal conductivity. Analyzing the reason, the ratio of the length of the support column to the thickness of the adsorption layer in Example 1 is larger, and the adsorbed heat conducting medium of the adsorption layer with the corresponding thickness has sufficient space for evaporation and reflux, thereby improving the thermal conductivity of the heat spreader.

[0123] Compared with Example 9 and Example 10, Example 1 has better thermal conductivity. Analyzing the reason, in the structure size of the heat spreader provided in Example 1, the space provided by the interval between adjacent support columns for the evaporation and reflux of the heat conducting medium is more appropriate. Too large an interval provides too much space, the reflux speed of the heat conducting medium slows down, and the heat conduction effect is poor; too small an interval provides insufficient space, the evaporation resistance of the heat conducting medium is greater; and the heat conduction effect is also poor. It can be seen that selecting an appropriate structure size can obtain a heat spreader with better thermal conductivity.

[0124] Compared with Comparative Example 1, Example 1 has better thermal conductivity and better bending resistance. It can be seen that selecting a flexible glass substrate as the material of the cover plate of the heat spreader can obtain a heat spreader that is easier to bend and has better thermal conductivity.

[0125] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit.

[0126] Finally, it should be noted that: after considering the specification and practicing the application disclosed herein, those skilled in the art will easily think of other embodiments of the present application. The present application is intended to cover any variations, uses or adaptations of the present application that follow the general principles of the present application and include common knowledge or conventional technical means in the art that are not disclosed in the present application, and is not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present application is only limited by the appended claims.

Claims

1. A heat sink, characterized in that: include: a first flexible glass cover; a second flexible glass cover plate, cooperating with the first flexible glass cover plate to form a cavity; an adsorption layer, located in the cavity; The adsorption layer includes an adsorption material and at least a portion of a heat-conducting medium present in the adsorption material.

2. The vapor chamber according to claim 1, wherein: The thermal conductivity of the first flexible glass cover is 5-40 W / (m·K); And / or, the thermal conductivity of the second flexible glass cover is 5-40 W / (m·K).

3. The vapor chamber according to claim 1 or 2, wherein: The first flexible glass cover comprises flexible glass and a first doping material doped in the flexible glass, wherein the first doping material comprises at least one of metal oxides, nitrides, carbon-based materials, metal particles, or ceramic particles; And / or, the second flexible glass cover includes flexible glass and a second doping material doped in the flexible glass, wherein the second doping material includes at least one of metal oxides, nitrides, carbon-based materials, metal particles or ceramic particles.

4. The vapor chamber according to claim 3, wherein: The first flexible glass cover comprises, by volume percentage, at least one of 1-6% of metal oxide, 0.5-15% of nitride, 0.1-15% of carbon-based material, 0.5-10% of metal particles, and 2-10% of ceramic particles; And / or, the second flexible glass cover comprises, by volume percentage, at least one of 1-6% metal oxide, 0.5-15% nitride, 0.1-15% carbon-based material, 0.5-10% metal particles, and 2-10% ceramic particles.

5. The vapor chamber according to any one of claims 1 to 4, characterized in that: The first doping material is a nanomaterial; And / or, the second doping material is a nanomaterial.

6. The vapor chamber according to any one of claims 1 to 5, characterized in that: A surface of the second flexible glass cover facing the cavity contains a hydrophilic group; And / or, the surface of the adsorption material contains hydrophilic groups.

7. The vapor chamber according to any one of claims 1 to 6, wherein: The thickness of the first flexible glass cover is 0.02-0.3 mm, preferably 0.03-0.1 mm; And / or, the thickness of the second flexible glass cover is 0.02-0.3 mm, preferably 0.03-0.1 mm.

8. The vapor chamber according to any one of claims 1 to 7, wherein: The heat-conducting medium includes a liquid phase-change material; preferably, the liquid phase-change material includes water and / or an alcohol solvent.

9. The vapor chamber according to any one of claims 1 to 8, wherein: The adsorption layer is bonded to the second flexible glass cover; And / or, the cavity includes a second groove defined by the second flexible glass cover plate, and at least a portion of the adsorption layer is located in the second groove; And / or, the adsorption layer has a thickness of 0.01-0.1 mm.

10. The vapor chamber according to any one of claims 1 to 9, characterized in that: The vapor chamber includes a support column located in the cavity, and the support column is located between the first flexible glass cover and the adsorption layer.

11. The vapor chamber according to claim 10, wherein: One end of the support column is bonded to the first flexible glass cover plate, and the other end is in contact with the adsorption layer; and / or, the ratio of the length of the support column to the thickness of the adsorption layer is (1.5-3):1; And / or, the vapor chamber includes a plurality of support columns, and preferably, a distance between any two adjacent support columns is 1.3-1.8 mm.

12. The vapor chamber according to claim 10 or 11, wherein: The cavity includes a first groove defined by the first flexible glass cover plate, and at least a portion of the support column is located in the first groove.

13. The vapor chamber according to any one of claims 1 to 12, wherein: The cavity includes a first groove defined by the first flexible glass cover plate and / or a second groove defined by the second flexible glass cover plate; Preferably, the cavity comprises a first groove defined by the first flexible glass cover plate and a second groove defined by the second flexible glass cover plate; Preferably, the cavity is a first groove defined by the second flexible glass cover plate.

14. The vapor chamber according to any one of claims 1 to 13, wherein: The first flexible glass cover includes a first main body portion and a first extension portion connected to the first main body portion; The second flexible glass cover includes a second main body portion and a second extension portion connected to the second main body portion; The first extension portion is bonded to the second extension portion.

15. The vapor chamber according to claim 14, wherein: The first flexible glass cover further includes a first extension portion connected between the first main body portion and the first extension portion, wherein the first extension portion forms an angle with the first main body portion, and one end of the first extension portion is connected to the first extension portion, and the other end of the first extension portion extends outward in a direction away from the cavity; And / or, the second flexible glass cover further includes a second extension portion connected between the second main body portion and the second extension portion, the second extension portion and the second main body portion form an angle, one end of the second extension portion is connected to the second extension portion, and the other end extends outward in a direction away from the cavity.

16. The vapor chamber according to claim 14 or 15, wherein: The vapor chamber includes a liquid injection hole defined by the first extension portion and the second extension portion, and the liquid injection hole is communicated with the cavity.

17. The vapor chamber according to any one of claims 1 to 16, wherein: The thickness of the heat sink is greater than or equal to 0.21 mm.

18. The vapor chamber according to any one of claims 1 to 17, wherein: The bending radius of the heat sink is less than or equal to 3 mm; And / or, the heat spreader has a bending resistance greater than or equal to 150,000 times.

19. An electronic device, characterized in that: The heat sink according to any one of claims 1 to 18 is included.

20. The electronic device according to claim 19, wherein The electronic device is a foldable electronic device.

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