A wind deflector, heat dissipation device and electronic device

Abstract

The application discloses a wind deflector, a heat dissipation device and electronic equipment, and is applied to the field of electronic equipment structure design. The wind deflector comprises a wind deflector body provided with a first recessed cavity, and the first recessed cavity is used for detachably mounting a target heating element; a first airflow channel is formed between the bottom of the first recessed cavity and a mainboard, and a second heating element is located in the first airflow channel; and a ventilation opening is arranged on the front end face of the first recessed cavity along the airflow direction; and a wind blocking component is detachably mounted on the ventilation opening. The wind deflector disclosed by the application can guide the gas to the upper side of the second heating element, more reasonably allocates the heat dissipation resources, and can fully utilize the space; through the arrangement of the wind blocking component, the heat dissipation of the target heating element can be realized when the target heating element is arranged, and the heat dissipation of the second heating element will not be affected when the target heating element is not arranged, the application range of the wind deflector is improved, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic device structure design, and in particular to a wind guide cover, a heat dissipation device and an electronic device. BACKGROUND

[0002] High-performance electronic devices usually carry more powerful heat-generating components inside, resulting in high overall power consumption. Generally, cold plate heat dissipation is used for CPU (Central Processing Unit) cooling, and air cooling is used for cooling other heat-generating components.

[0003] In related technologies, in order to ensure the heat dissipation effect of air cooling, a wind guide cover is generally needed to be installed. Due to the more complex overall architecture and board design of electronic devices, the wind guide cover occupies a large space, and the signal lines and power lines for interconnection and transmission between components are also relatively numerous, making it difficult to arrange the lines inside the case of the electronic device, and prone to situations such as line crossing and entanglement. Moreover, the small amount of free space inside the case also causes poor airflow in the case, affecting the air cooling effect.

[0004] Therefore, how to fully utilize the space inside the case while ensuring the heat dissipation effect of the heat-generating components is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] The purpose of the present application is to provide a wind guide cover, a heat dissipation device and an electronic device, which can allocate heat dissipation resources for a wind-liquid mixed heat dissipation type electronic device, organize line routing, and improve the heat dissipation effect.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions.

[0007] The application discloses a wind deflector applied to a mainboard, wherein the mainboard is provided with a first heat generating element, a second heat generating element and a cold plate module, the cold plate module is in position correspondence with the first heat generating element; the wind deflector comprises a wind deflector body, which is used for being installed on the top of the mainboard along the height direction, the top of the wind deflector body is provided with a first recessed cavity, the first recessed cavity is used for detachably installing a target heat generating element, the bottom of the first recessed cavity and the mainboard form a first air flow channel, the second heat generating element is located in the first air flow channel, and the front end surface of the first recessed cavity along the air flow direction is provided with a ventilation opening, the air flow direction is from front to back; a wind blocking component is detachably installed on the ventilation opening, when the target heat generating element is installed in the first recessed cavity, the wind blocking component is separated from the ventilation opening, so that the gas flows into the first recessed cavity from the ventilation opening, and when the target heat generating element is not installed in the first recessed cavity, the wind blocking component is arranged on the ventilation opening, so as to block the gas.

[0008] The application further provides a heat dissipation device comprising the wind deflector.

[0009] The application further provides an electronic device comprising the heat dissipation device.

[0010] The wind deflector has the advantages that: the wind deflector body is installed on the mainboard, the first heat generating element with a large heat generation on the mainboard is matched with the cold plate module, that is, the cold plate module is installed on the first heat generating element and is used for liquid cooling the first heat generating element, the wind deflector body is used for guiding the gas to the second heat generating element and is used for air cooling the second heat generating element, so that the liquid cooling and air cooling of the heat generating elements on the mainboard are realized; further, the top of the wind deflector body is provided with the first recessed cavity, the first recessed cavity is used for detachably installing the target heat generating element, on one hand, the bottom of the first recessed cavity is closer to the mainboard, the bottom of the first recessed cavity and the second heat generating element form the first air flow channel extending along the air flow direction, the gas can pass through the surface of the mainboard more efficiently, and the air cooling efficiency is improved, on the other hand, the first recessed cavity is used for detachably installing the target heat generating element, the target heat generating element can be a hard disk module or the like, the internal space of the first recessed cavity can be fully utilized, and the layout is more reasonable. The wind deflector is applied to the heat dissipation mode of air and liquid mixing, can guide the gas to the top of the second heat generating element, and can more reasonably allocate the heat dissipation resources; meanwhile, the target heat generating element is installed in the first recessed cavity, the space can be fully utilized; and through the arrangement of the wind blocking component, the heat dissipation of the target heat generating element can be realized when the target heat generating element is arranged, and the heat dissipation of the second heat generating element is not affected when the target heat generating element is not arranged, the application range of the wind deflector is improved, and the cost is reduced.

[0011] In an embodiment, the front end surface of the first recessed cavity is inclined, and the inclined surface is inclined from front to back towards the bottom of the air deflector body; the size of the vent is smaller than the size of the front end surface of the first recessed cavity. In this way, when the target heat generating element is installed in the first recessed cavity, a part of the gas enters the first airflow channel under the flow guiding effect of the front end surface of the first recessed cavity, and another part of the gas enters the first recessed cavity through the vent, thereby simultaneously meeting the air cooling heat dissipation requirements of the target heat generating element and the second heat generating element.

[0012] In an embodiment, the top of the air deflector body is further provided with a second recessed cavity for installing a target electrical appliance element; the bottom of the first recessed cavity and the main plate form a second airflow channel, and the front end surface of the second recessed cavity is inclined, and the inclined surface is inclined from front to back towards the bottom of the air deflector body. The above arrangement forms a second airflow channel between the bottom of the first recessed cavity and the main plate, and the second airflow channel can also be provided with a second heat generating element, and the flow guiding effect of the front end surface of the second recessed cavity causes the gas to flow into the second airflow channel, thereby dissipating heat for the second heat generating element located in the second airflow channel.

[0013] In an embodiment, the bottom of the air deflector body is provided with a wire harness accommodating cavity, the wire harness accommodating cavity extends along the airflow direction, the first recessed cavity and the wire harness accommodating cavity are arranged in a first direction, and the first direction is perpendicular to the airflow direction; further comprising: a wire arranging component above the cold plate, which is arranged in the wire harness accommodating cavity, and the wire arranging component above the cold plate is installed between the air deflector body and the cold plate module. The above arrangement adds the wire harness accommodating cavity, the wire harness space for the wire harness to penetrate along the airflow direction is formed in the wire harness accommodating cavity, the wire harness accommodating cavity is located between the first recessed cavity and the second recessed cavity, and the wire harness accommodating cavity is formed synchronously with the first recessed cavity and the second recessed cavity, the position of the wire harness accommodating cavity corresponds to the position of the cold plate module, the cold plate module is cooled by liquid cooling, and too much airflow is not needed. Through the arrangement of the wire harness accommodating cavity, on the one hand, the space above the cold plate module can be fully utilized, and on the other hand, after the wire harness is arranged in the wire harness accommodating cavity, the flow of the gas is blocked, so that more airflow flows into the first airflow channel or the second airflow channel.

[0014] In one embodiment, the device further includes a sidewall cable management component. The sidewall cable management component has a cable harness space within it for the cable harness to pass through along the airflow direction. The sidewall cable management component is used to mount on the sidewall of the electronic device's chassis. The end of the air guide shroud body along the first direction has a bent extension edge, which overlaps the top of the sidewall cable management component. With this configuration, the sidewall cable management component is detachably mounted on the sidewall of the chassis. The sidewall cable management component not only allows the cable harness to pass through, thereby organizing the cable harness and preventing tangling, but also provides support for the air guide shroud body, ensuring the positional stability of the air guide shroud body.

[0015] The heat dissipation device provided by the present invention is equipped with the above-mentioned air guide shroud. Since the air guide shroud has the above-mentioned technical effects, the heat dissipation device equipped with the air guide shroud should also have the corresponding technical effects.

[0016] The electronic device provided by the present invention is equipped with the above-mentioned heat dissipation device. Since the heat dissipation device has the above-mentioned technical effects, the electronic device equipped with the heat dissipation device should also have the corresponding technical effects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a specific embodiment of the air guide shroud provided by the present invention.

[0019] Figure 2 for Figure 1 The top view of the air guide cover shown.

[0020] Figure 3 for Figure 1 The front view of the air guide shield shown.

[0021] Figure 4 for Figure 1 A partial structural schematic diagram of the air guide shroud is shown.

[0022] Figure 5 for Figure 4 The top view of the air guide cover shown.

[0023] Figure 6 for Figure 4 The diagram shows the structure of the air guide shroud body.

[0024] Figure 7 forFigure 1 Structure diagram of cold plate module in the wind deflector.

[0025] Figure 8 As Figure 7 Top view of the cold plate module.

[0026] Figure 9 Structure diagram of the side wall wire arrangement box in the wind deflector from the closed state to the open state.

[0027] Figure 10 As Figure 9 Front view of the two states of the side wall wire arrangement box.

[0028] Figure 11 Structure diagram of the cold plate wire arrangement box in the wind deflector from the closed state to the open state.

[0029] Figure 12 As Figure 11 Front view of the two states of the cold plate wire arrangement box.

[0030] Figure 13 As Figure 11 Top view of the cold plate wire arrangement box in the open state.

[0031] Figure 14 As Figure 1 Structure diagram of the hard disk module in the wind deflector.

[0032] Figure 15 As Figure 14 Top view of the hard disk module.

[0033] Figure 16 As Figure 1 Structure diagram of the baffle in the wind deflector.

[0034] Figure 17 As Figure 16 Front view of the baffle.

[0035] Fig. 1: main plate; 2: air deflector; A: first recessed cavity; B: second recessed cavity; C: wire harness accommodating cavity; 3: cold plate module; 4: side wall wire management component; 5: cold plate upper wire management component; 6: target heat generating element; 7: target electrical element; 8: fastener; 9: buffer component; 10: wind blocking component; 20: air deflector body; 2-1: positioning hole; 2-2: fixing hole; 2-3: stop protrusion; 2-4: limiting notch; 2-5: wire harness limiting groove; 2-6: limiting notch; 2-7: air vent; 2-8: clasp; 3-1: cold plate wire management bracket; 3-2: screw; 3-3: cable tie; 3-4: bracket; 4-1: positioning pin; 4-2: hanging hole; 4-3: wire management fixing part; 4-4: wire management folding part; 5-1: first cold plate wire management box reinforcing rib; 5-2: cold plate wire management box protrusion; 5-3: second cold plate wire management box reinforcing rib; 5-4: cold plate wire management box locking hole; 5-5: cold plate wire management box positioning hole; 5-6: cold plate wire management box screw hole; 6-1: movable pin; 6-2: hard disk bracket; 6-3: hard disk body; 10-1: unlocking component; 10-2: locking protrusion; 10-2-1: locking surface; 10-2-2: guide surface. DETAILED DESCRIPTION

[0036] The core of the present application is to provide an air deflector, a heat dissipation device and an electronic device, which can make full use of space and have good heat dissipation effect.

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0038] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case similar to the described case, and the approximate case is within an acceptable deviation range, wherein the acceptable deviation range is determined by considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e. the limitation of the measurement system) by a person skilled in the art. For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, less than or equal to 5% of the difference between the two equalities. For a person skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0039] In order for those skilled in the art to better understand the technical scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0040] The air guide cover 2 can solve the problems of poor heat dissipation effect and messy wiring. The electronic device adopts a wind-liquid mixed heat dissipation strategy, and the CPU is cooled by liquid cooling, and other heat generating elements are cooled by air cooling. By increasing the air guide cover 2 above the cold plate module 3, the air flow of the fan is guided, and the utilization rate of the heat dissipation resource is maximized. At the same time, wiring components are installed below and on both sides of the air guide cover 2 to plan the wiring space and path and prevent messy wiring. The target electrical components 7 and the target heat generating elements 6 can be selected above the air guide cover 2 to make full use of the space and solve the problem of insufficient internal space of the electronic device. The electronic device can be a server.

[0041] Please refer to Figures 1 to 4In the embodiment, the air deflector 2 comprises an air deflector body 20 and a wind blocking component 10.

[0042] The air deflector 2 comprises an air deflector body 20 and a wind blocking component 10.

[0043] The air deflector body 20 is arranged on the top of the mainboard 1 in the height direction, and specifically, the air deflector body 20 is arranged at a distance from the mainboard 1, and the air deflector body 20 is arranged on the cold plate module 3 for convenience. Further, the air deflector body 20 is provided with a first recessed cavity A at the top, the first recessed cavity A is used for detachably mounting the target heating element 6, the bottom of the first recessed cavity A and the mainboard 1 form a first airflow channel, the first airflow channel extends parallel to the airflow direction, the second heating element is located in the first airflow channel, and the front end face of the first recessed cavity A in the airflow direction is provided with a ventilation opening 2-7, the airflow direction is from front to back. Specifically, the first recessed cavity A and the cold plate module 3 are arranged in a staggered manner in the first direction, the height direction, the first direction and the airflow direction are perpendicular to each other, that is, the position of the first recessed cavity A should avoid the cold plate module 3, that is, the position of the first recessed cavity A avoids the first heating element, and corresponds to the position of the second heating element.

[0044] The wind blocking component 10 is detachably arranged on the ventilation opening 2-7, and the wind blocking component 10 is in the form of a plate. When the target heating element 6 is arranged in the first recessed cavity A, the wind blocking component 10 is separated from the ventilation opening 2-7, so that the gas flows into the first recessed cavity A through the ventilation opening 2-7. When the target heating element 6 is not arranged in the first recessed cavity A, the wind blocking component 10 is arranged on the ventilation opening 2-7 to block the gas, so as to avoid the gas flowing into the first recessed cavity A, and as much as possible to flow into the first airflow channel, thereby efficiently cooling the second heating element. The wind blocking component 10 is used to open the ventilation opening 2-7 when it is detached, and close the ventilation opening 2-7 when it is arranged.

[0045] Specifically, the first heating element can be a component with relatively large heat dissipation, such as CPU, and the first heating element can be a component with relatively small heat dissipation, such as memory, network card, etc.

[0046] The air deflector 2, by the setting of the air deflector body 20, installs the air deflector body 20 on the mainboard 1, the first heat-generating element with greater heat emission on the mainboard 1 is adapted with the cold plate module 3, that is, the cold plate module 3 is installed on the first heat-generating element, for the liquid cooling cooling of the first heat-generating element, the air deflector body 20 is used to guide the gas to the second heat-generating element, for the air cooling cooling of the second heat-generating element, so as to meet that each heat-generating element on the mainboard 1 is respectively liquid cooling cooled and air cooling cooled;Further, the top of the air deflector body 20 is provided with the first recessed cavity A, the setting of the first recessed cavity A can make the bottom of the first recessed cavity A closer to the mainboard 1, the bottom of the first recessed cavity A and the second heat-generating element form the first airflow channel extending along the airflow direction, the airflow can pass through the surface of the mainboard 1 more efficiently, improve the air cooling efficiency, on the other hand, the first recessed cavity A is also used for detachably installing the target heat-generating element 6, the target heat-generating element 6 can be a hard disk module and the like, by setting the target heat-generating element 6 in the first recessed cavity A, the internal space of the first recessed cavity A can be fully utilized, and the layout is more reasonable;Further, the first recessed cavity A and the cold plate module 3 are arranged in the first direction, due to the fact that the cold plate module 3 can effectively cool the first heat-generating element, therefore, the air deflector body 20 does not need to guide the gas into the position of the cold plate module 3, but more effectively guides the gas into the position of the second heat-generating element, so as to ensure the cooling effect of the second heat-generating element.The air deflector 2 provided by the application is applied in the air-liquid mixed cooling mode, can guide the gas to the top of the second heat-generating element, more reasonably allocates the cooling resource;At the same time, the target heat-generating element 6 is installed in the first recessed cavity A, the space can be fully utilized;And, by the setting of the wind blocking part 10, when the target heat-generating element 6 is configured, the heat dissipation of the target heat-generating element 6 can be realized, and when the target heat-generating element 6 is not configured, the heat dissipation of the second heat-generating element is not affected, the application range of the air deflector 2 is improved, and the cost is reduced.

[0047] In some embodiments, the front end surface of the first recessed cavity A is inclined, and the inclined surface is inclined from front to back towards the bottom of the air duct body 20; the size of the ventilation opening 2-7 is smaller than the size of the front end surface of the first recessed cavity A, and the ventilation opening 2-7 is located at the middle of the front end surface of the first recessed cavity A along the first direction. In this way, when the target heat generating element 6 is installed in the first recessed cavity A, under the flow guiding effect of the front end surface of the first recessed cavity A, part of the gas enters the first airflow channel, and another part of the gas enters the first recessed cavity A through the ventilation opening 2-7, thereby simultaneously meeting the air cooling and heat dissipation requirements of the target heat generating element 6 and the second heat generating element. Of course, the size of the ventilation opening 2-7 can be set according to the power of the target heat generating element 6, for example, when the power of the target heat generating element 6 is large, the heat generation is large, and a ventilation opening 2-7 with a larger size can be appropriately designed to allow more gas to enter the first recessed cavity A, and when the power of the target heat generating element 6 is small, the heat generation is small, and a ventilation opening 2-7 with a smaller size can be appropriately designed to allow more gas to enter the first airflow channel; of course, a plurality of ventilation openings 2-7 can also be provided on the front end surface of the first recessed cavity A, and the number of wind blocking components 10 is also a plurality, which can be correspondingly disassembled according to the actual use requirements, for example, when the power of the target heat generating element 6 is large, the heat generation is large, and more wind blocking components 10 can be disassembled to allow more gas to enter the first recessed cavity A, and when the power of the target heat generating element 6 is small, the heat generation is small, and fewer wind blocking components 10 can be disassembled to allow more gas to enter the first airflow channel.

[0048] In some embodiments, please refer to Figure 16 and Figure 17 The wind blocking component 10 includes a baffle body and a locking protrusion 10-2, the locking protrusion 10-2 is located on the upper part of the first surface of the baffle body, the top of the locking protrusion 10-2 is provided with a locking surface 10-2-1, the locking surface 10-2-1 is perpendicular to the first surface, when the wind blocking component 10 is installed, the locking surface 10-2-1 is clamped with the ventilation opening 2-7, at this time, the bottom of the baffle body is in abutment with the bottom of the first recessed cavity A, and the locking protrusion 10-2 is clamped with the top of the ventilation opening 2-7, so as to prevent the wind blocking component 10 from falling off the front end surface of the first recessed cavity A; specifically, the upper wall surface of the ventilation opening 2-7 is perpendicular to the front end surface of the first recessed cavity A, since the baffle body is parallel to the front end surface of the first recessed cavity A, when the wind blocking component 10 is assembled, the locking surface 10-2-1 of the locking protrusion 10-2 is parallel to the upper wall surface of the ventilation opening 2-7, the locking surface 10-2-1 of the locking protrusion 10-2 can be inserted into the ventilation opening 2-7 in parallel, to ensure the clamping effect.

[0049] In some embodiments, the bottom of the ventilation opening 2-7 is provided with a limiting stopper, and the top of the ventilation opening 2-7 is provided with a limiting gap 2-4. The limiting stopper prevents the bottom of the baffle body from moving backward. The wind blocking component 10 can be a plastic piece or other structural piece with a certain hardness and elastic deformation. The bottom of the locking protrusion 10-2 is provided with a guide surface 10-2-2. The included angle between the guide surface 10-2-2 and the first surface is obtuse. When the wind blocking component 10 is pushed from the top of the front end face of the first recessed cavity A to the bottom, the baffle body moves to the front side of the limiting stopper. The guide surface 10-2-2 is in contact with the upper part of the ventilation opening 2-7 and pushes the baffle body to elastically deform. The locking protrusion 10-2 moves to the limiting gap 2-4. The baffle body resets so that the locking protrusion 10-2 is clamped with the limiting gap 2-4 and fixed.

[0050] In some embodiments, the second surface of the baffle body is further provided with an unlocking component 10-1, which is an unlocking protrusion. The unlocking component 10-1 is located on the upper part of the second surface and corresponds to the position of the locking protrusion 10-2. Of course, the setting height of the unlocking component 10-1 relative to the baffle body can be higher than the setting height of the locking protrusion 10-2 relative to the baffle body, so that when the unlocking component 10-1 is subjected to a backward external force, it can be more quickly transmitted to the locking protrusion 10-2, thereby promoting the separation of the locking protrusion 10-2 and the limiting gap 2-4.

[0051] In some embodiments, please refer to Figure 6 The bottom surface of the first recessed cavity A is further provided with a plurality of stop protrusions 2-3 for limiting the target heat generating element 6. The rear side of the first recessed cavity A is further provided with a fixing hole 2-2 for fixing the target heat generating element 6. The target heat generating element 6 can be a hard disk module, such as an M.2 hard disk module. Figure 14 and Figure 15 The hard disk module includes a hard disk body 6-3 and a hard disk support 6-2. The stop protrusions 2-3 function to fix and quickly position the hard disk support 6-2. Specifically, the target heat generating element 6 can be quickly disassembled, assembled and positioned by the stop protrusions 2-3.

[0052] In some embodiments, the target heat generating element 6 is a hard disk module, the stop protrusion 2-3 is a sliding groove protrusion or a limiting protrusion, the sliding groove protrusion is located at the rear side of the first recessed cavity A, the target heat generating element 6 is in sliding connection with the sliding groove protrusion, the limiting protrusion is located at the front side of the first recessed cavity A, and the limiting protrusion is used to abut against the front side of the target heat generating element 6 after the target heat generating element 6 is installed in place; the hard disk support 6-2 can slide from the rear side of the first recessed cavity A to the front, the sliding groove protrusion can limit the hard disk support 6-2 in the height direction, preventing the hard disk support 6-2 from moving in the height direction, and when the hard disk support 6-2 is moved in place, the limiting protrusion just abuts against the hard disk support 6-2, completing the installation of the hard disk module. Further, the target heat generating element 6 is further provided with a movable pin 6-1, which is pushed to move after the target heat generating element 6 is installed in place, and the movable pin 6-1 moves in the height direction until the movable pin 6-1 is locked with the fixed hole 2-2, avoiding the target heat generating element 6 from moving in the airflow direction, and ensuring the position stability of the target heat generating element 6.

[0053] In some embodiments, a buffer component 9 is further included, which is arranged at the top of the air deflector body 20, and the buffer component 9 and the wire harness accommodating cavity C are located at opposite positions of the air deflector body 20, that is, the buffer component 9 is arranged at the highest position of the air deflector body 20, and the buffer component 9 is used to fill the gap between the air deflector body 20 and the top plate of the case of the electronic equipment, avoiding the air deflector body 20 from moving upward in the height direction. Specifically, since the air deflector body 20 is not fixed in the case, and the bottom of the air deflector body 20 is the cold plate module 3, the air deflector body 20 will not move downward, but there is a risk of upward movement, and by arranging the buffer component 9, the shaking of the air deflector body 20 can be reduced, improving the reliability.

[0054] In some embodiments, the number of buffer components 9 is the same as the number of wire harness accommodating cavities C, and the positions are one-to-one corresponding, improving the buffering effect. Specifically, the buffer component 9 is a foam or a rubber pad, which is fixedly attached to the top of the air deflector body 20, facilitating installation and having good buffering effect.

[0055] In some embodiments, the top of the air deflector body 20 is also provided with a second recessed cavity B for mounting the target electrical element 7; the bottom of the first recessed cavity A and the main plate 1 form a second air flow channel, the front end face of the second recessed cavity B is inclined, and the front end face of the second recessed cavity B is inclined from front to back towards the bottom of the air deflector body 20. The above setting forms a second air flow channel between the bottom of the first recessed cavity A and the main plate 1, and a second heating element can also be arranged in the second air flow channel. The front end face of the second recessed cavity B has a flow guiding effect, so that the gas flows into the second air flow channel, thereby cooling the second heating element located in the second air flow channel. The number of second heating elements can be multiple, distributed on the main plate 1, and the number and position of the first recessed cavity A and the second recessed cavity B can be set according to the number and position of the second heating element. The first recessed cavity A and the second recessed cavity B are arranged along the first direction, providing space for the wire harness accommodating cavity C. Specifically, the first recessed cavity A is preferably arranged at the middle position of the air deflector body 20 along the first direction. Since the air flow is larger at the middle position of the air deflector body 20 along the first direction, arranging the first recessed cavity A at the middle position of the air deflector body 20 can ensure the cooling effect of the target heating element 6. The target electrical element 7 arranged in the first recessed cavity A can be a super capacitor or other components, which does not need to be cooled by opening a vent 2-7, but only needs to set the front end face of the second recessed cavity B as an inclined surface to guide the flow.

[0056] In some embodiments, a bracket is arranged in the second recessed cavity B, and the top of the bracket is inclined relative to the bottom surface of the second recessed cavity B in the first direction, so that the target electrical element 7 is inclined relative to the first direction. Specifically, since the width of the air deflector body 20 along the first direction is limited, the target electrical element 7 needs to be installed on the bracket of the air deflector body 20 at an angle, and is fixed by a fastener 8, which can adapt to target electrical elements 7 of different sizes while minimizing space occupation.

[0057] In some embodiments, a fastener 8 is further arranged for fixing the target electrical element 7 on the bracket, and the fastener 8 is detachably connected with the bracket. The bracket is provided with a fastening gap, and the fastener 8 penetrates through the fastening gap and surrounds the target electrical element 7. Specifically, the fastener 8 can be a binding strap 3-3 or a magic strap, which can fix the target electrical element 7 on the bracket, and the structure is convenient for fastening and dismounting.

[0058] In some embodiments, the front side of the second recessed cavity B is further provided with a wire harness limiting groove 2-5 for fixing the wire harness. In this way, the wire harness is combed and fixed in position, avoiding entanglement caused by the wire harness coming out of the wire harness limiting groove 2-5.

[0059] In some embodiments, the bottom of the air deflector body 20 is provided with a wire harness accommodating cavity C extending along the airflow direction, and the first recessed cavity A is arranged in the first direction away from the wire harness accommodating cavity C. The first direction, the height direction and the airflow direction are perpendicular to each other. Further, the first recessed cavity A is arranged in the first direction away from the cold plate module 3. Since the cold plate module 3 can effectively dissipate heat from the first heat generating element, the air deflector body 20 does not need to guide air to the position of the cold plate module 3, but more effectively guides air to the position of the second heat generating element, thereby ensuring the cooling effect of the second heat generating element.

[0060] In some embodiments, referring to Figure 11 and Figure 12 , the cold plate above wire arrangement component 5 is arranged in the wire harness accommodating cavity C, and the cold plate above wire arrangement component 5 is installed between the air deflector body 20 and the cold plate module 3. The cold plate above wire arrangement component 5 is located above the cold plate module 3, the top of the air deflector body 20 is away from the cold plate module 3, and the bottom of the air deflector body 20 is close to the cold plate module 3. The above arrangement forms a wire harness space in the wire harness accommodating cavity C for the wire harness to penetrate along the airflow direction. The wire harness accommodating cavity C is located between the first recessed cavity A and the second recessed cavity B, and is formed synchronously with the first recessed cavity A and the second recessed cavity B. The position of the wire harness accommodating cavity C corresponds to that of the cold plate module 3, and the cold plate module 3 is cooled by liquid cooling, so that less air flow is needed. Through the arrangement of the wire harness accommodating cavity C, on the one hand, the space above the cold plate module 3 can be fully utilized, and on the other hand, after the wire harness is arranged in the wire harness accommodating cavity C, the flow of air is blocked, so that more air flows into the first air flow channel or the second air flow channel.

[0061] In some embodiments, referring to Figure 7 and Figure 8 , the cold plate wire arrangement bracket 3-1 is used to carry the cold plate above wire arrangement component 5, and the cold plate wire arrangement bracket 3-1 can be detachably installed on the cold plate module 3. The cold plate wire arrangement bracket 3-1 is installed on the cold plate module 3, the cold plate above wire arrangement component 5 is installed on the cold plate wire arrangement bracket 3-1, and the air deflector body 20 is placed on the cold plate above wire arrangement component 5. The assembly is convenient and the disassembly efficiency is high.

[0062] In some embodiments, the air deflector body is integrally formed, and the number of wire harness accommodating cavities C is at least two, which are located on both sides of the first recessed cavity A in the first direction, and the air deflector body extends in the first direction in an S shape. The side wall of the wire harness accommodating cavity C and the side wall of the wire harness accommodating cavity C are located on two surfaces of the same side plate. Specifically, the air deflector body can be integrally stamped and processed as a whole plate, that is, when the first recessed cavity A is stamped out, the wire harness accommodating cavity C is formed at the bottom of the air deflector body at the same time.

[0063] In some embodiments, please refer to Figure 9 and Figure 10 , also includes: the side wall line arrangement component 4, the wire harness space is arranged in the side wall line arrangement component 4 for wire harness along the direction of airflow, the side wall line arrangement component 4 is used to install on the side wall of the electronic equipment cabinet, the baffle body 20 is provided with the bent extension edge along the end of the first direction, the bent extension edge is overlapped on the top of the side wall line arrangement component 4. The side wall line arrangement component 4 is located at least one end of the baffle body 20 along the first direction, specifically, to ensure the symmetry of the whole baffle 2 structure, stress uniformity, can be provided with side wall line arrangement component 4 at both ends of the baffle body 20 along the first direction. The above-mentioned setting, the side wall line arrangement component 4 is detachably mounted on the side wall of the cabinet, specifically, the side wall line arrangement component 4 can be provided with a hanging hole 4-2, the cabinet side wall can be provided with a hanging nail, through the cooperation of the hanging hole 4-2 and the hanging nail, the quick disassembly and assembly of the side wall line arrangement component 4 is realized; the hanging hole 4-2 can be a gourd hole, the gourd hole includes a large hole and a small hole, the large hole is located at the upper part of the small hole, the large hole is first matched with the hanging nail, then under the action of gravity, the side wall line arrangement component 4 is lowered, and the small hole is matched with the hanging nail to complete the assembly process; the side wall line arrangement component 4 not only can be provided with wire harness, so as to arrange the wire harness, avoid the wire harness winding, but also can support the baffle body 20, ensure the position stability of the baffle body 20.

[0064] In some embodiments, please refer to Figure 5 , the top of the side wall line arrangement component 4 is provided with a plurality of positioning column pins 4-1, the bent extension edge is provided with a plurality of positioning holes 2-1, the positioning hole 2-1 is connected with the positioning column pin 4-1 one by one, to position the baffle body 20, facilitate the quick positioning of the baffle body 20; it should be noted that the installation position of the side wall line arrangement component 4 should correspond to the position of the mainboard 1, so that the upper line arrangement component 5 of the cold plate is just entered into the wire harness containing cavity C of the baffle body 20 at the same time of the cooperation and connection of the positioning hole 2-1 and the positioning column pin 4-1.

[0065] In some embodiments, the bent extension edge is provided with a hook 2-8 along the first direction, the hook 2-8 is matched with the limiting groove of the cabinet side wall, to limit the hook 2-8 in the direction of airflow, specifically, the size of the hook 2-8 can be appropriately extended, when the baffle body 20 is installed, the hook 2-8 on one side of the baffle body 20 is installed on one side wall of the cabinet, and then the hook 2-8 on the other side of the baffle body 20 is installed on the other side wall of the cabinet, the design of the hook 2-8 can only hang the baffle body 20 on the cabinet, and the design size of the hook 2-8 has a certain redundancy, the positioning of the baffle body 20 is realized by the positioning hole 2-1 and the positioning column pin 4-1.

[0066] In some embodiments, the wire arranging component 5 above the cold plate and / or the wire arranging component 4 of the side wall is a wire arranging box, which comprises a wire arranging fixing part 4-3 and a wire arranging folding part 4-4. The wire arranging fixing part 4-3 is installed on the cold plate module 3 or the side wall of the case, and the wire arranging folding part 4-4 is connected with the wire arranging fixing part 4-3 through a lock buckle. The wire arranging folding part 4-4 can be folded relative to the wire arranging fixing part 4-3 to open or close the wire arranging box. Through the arrangement of the wire arranging fixing part 4-3 and the wire arranging folding part 4-4, the operation is convenient, and tool-free disassembly and assembly can be realized.

[0067] In some embodiments, the cold plate module 3 comprises a water inlet pipe, a water return pipe, a heat dissipation block, and a water pipe for two adjacent heat dissipation blocks. In order to avoid interference between the water pipe above the mainboard 1 and the electrical elements on the mainboard 1, a bracket 3-4 is designed on the cold plate, the height of the bracket 3-4 is higher than the height of the electrical elements on the mainboard 1, and the water pipe is fixed on the bracket 3-4, which can effectively avoid interference.

[0068] In some embodiments, the upper part of the air guide cover 2 body is further provided with a containing groove for placing the wind blocking part 10. The wind blocking part 10 is detachably arranged in the containing groove. When the target heat generating element 6 is arranged in the first recessed cavity A, the wind blocking part 10 needs to be taken off and placed in the containing groove. When the air guide cover is applied to different types of electronic devices, the target heat generating element 6 does not need to be installed in the first recessed cavity A, and then the wind blocking part 10 can be taken out of the containing groove and installed on the air vent 2-7 again. It can be applied to different application scenarios, and can also avoid the loss of the wind blocking part 10.

[0069] It should be noted that the air deflector 2 can be applied to the motherboard 1 in the server using a double-path liquid cooling module; the motherboard 1 is loaded with two CPU elements and a plurality of memory bars, and other heat generating elements, the target heat generating element 6 and the target electrical element 7 are optional components that can be installed on the air deflector body 20, fully utilizing the space, leaving more space for the motherboard 1 inside the server; the CPU cold plate module 3 is the core of liquid cooling heat dissipation, used to replace the traditional air cooling radiator, with a lower height and better effect, and the cold plate wire arrangement bracket 3-1 above it is used to install the wire arrangement component 5 above the cold plate; for combing the wiring; the side wall wire arrangement component 4 and the wire arrangement component 5 above the cold plate are the main structures for wire arrangement, both of which are two, made of wear-resistant nylon material, and do not require tools to open and close the wire arrangement component, making it very convenient to use and install; the target heat generating element 6 is installed on the upper part of the air deflector body 20, mainly considering two aspects, one is to save space inside the server, and the other is to provide a heat dissipation channel by disassembling the wind blocking component 10; the target electrical element 7 can be installed on the upper part of the air deflector body 20, one on the left and one on the right, and at most two. Due to the limited width of the air deflector body 20, the target electrical element 7 needs to be installed at an angle on the bracket on the air deflector body 20, and is fixed by fasteners 8; the buffer component 9 is attached to the top of the air deflector body 20, used to absorb the gap between the top of the air deflector body 20 and the server cover, making the air deflector body 20 more stable in the server, avoiding shaking; under the air-liquid mixed heat dissipation mode, the air deflector 2 and the wire arrangement component are designed to provide liquid cooling heat dissipation for the CPU while reasonably guiding the airflow and combing the cable wiring, achieving better heat dissipation effect and wire arrangement effect. In addition, the air deflector 2 is also designed with related features to carry two target electrical elements 7 and one target heat generating element 6, fully utilizing the space, making the server inside more densely.

[0070] Specifically, in a specific embodiment, the air deflector 2 can be implemented above the motherboard 1 in a 2U height server; of course, the height of the server can also be set as needed, and the cold plate module 3 is installed above the motherboard 1 to provide liquid cooling heat dissipation for the CPU on the motherboard 1; the air deflector 2 is installed above the cold plate to guide the airflow, here, Figure 2As shown, the airflow direction is indicated by the arrow. On both sides of the air guide body 20, there are side wall cable management components 4. The side wall cable management components 4 are fixed to the side wall of the chassis through the hanging holes 4-2. The positioning pins 4-1 above them can cooperate with the positioning holes 2-1 to provide guidance for the installation of the air guide body 20. The air guide body 20 is also equipped with an M.2 hard drive module, two supercapacitors, and fasteners 8 for fixing the supercapacitors. The air guide body 20 is also equipped with a buffer component 9 and a windproof component 10. The air guide body 20 is located at a higher height where the side wall cable management components 4 or the cable management components 5 above the cold plate are located. In order to leave space for the cable management components, the remaining area is lower in height, close to the second heat-generating element on the motherboard 1, and guides the airflow to dissipate heat from the second heat-generating element. The fixing hole 2-2 cooperates with the movable pin 6-1 of the hard drive module to limit and fix the hard drive module; the stop protrusion 2-3 provides lateral limit for the hard drive module during installation; the hole fastening notch is used to pass through the fastener 8; the wire harness limiting groove 2-5 is used to carry the power cable at the tail of the target electrical component 7; the limiting notch 2-4 and the vent 2-7 are designed to fix the windproof component 10. After removing the windproof component 10, the ventilation volume of the target heat-generating component 6 can be increased to improve the heat dissipation effect; the cold plate mold Each of the two heatsinks in group 3 has a cable management bracket 3-1 on top, with several nuts that engage with the cable management box screw holes 5-6 of the cable management component 5 on the cold plate to secure it. Screws 3-2 are used to secure the cold plate to the CPU on the motherboard 1. Since there are many electronic components on the motherboard 1, a bracket 3-4 is designed to avoid interference with the water pipes. The water pipes between the two heatsinks are supported on the bracket 3-4. The height of the bracket 3-4 is higher than the height of the electronic components on the motherboard 1 to avoid interference. To prevent interference, cable ties 3-3 are used to fix water pipes to brackets 3-4; the side wall cable management component 4 is fixed to the side wall of the chassis through hanging holes 4-2, and positioning pins 4-1 can be used to position the air guide cover body 20 during installation; the side wall cable management component 4 can accommodate 8 cables with a diameter of about 8mm; the first cold plate cable management box reinforcing ribs 5-1 and the second cold plate cable management box reinforcing ribs 5-3 can improve the strength of the cable management component 5 above the cold plate and prevent bending during plastic molding; the cold plate cable management box protrusion 5-2 and the cold plate cable management box positioning hole 5-5 The components work together to guide the cable management component 5 above the cold plate during the closing process. The locking hole 5-4 of the cable management box on the cold plate and the protrusion on the other side of the cable management component 5 above the cold plate cooperate to prevent the cable management component 5 above the cold plate from opening naturally after closing. The bottom of the hard drive module is a sheet metal hard drive bracket 6-2 with a movable pin 6-1 for fixing. Above it is the hard drive body 6-3. The hard drive bracket 6-2 can be pushed inward along the stop protrusion 2-3 on the air guide cover body 20. After it is in place, the movable pin 6-1 is pressed down to fix it.

[0071] The air guide cover 2 provided by the application comprises the following steps during installation.

[0072] 1. Firstly, install from bottom to top during assembly, first install the cold plate module 3 above the CPU of the mainboard 1 through the screw 3-2, and the cold plate module 3 is the liquid cooling heat dissipation part in the scheme.

[0073] 2. After the cold plate module 3 is installed, lock the screw 3-2 to the cold plate wire arrangement support 3-1 through the cold plate wire arrangement box screw hole 5-6 of the wire arrangement part 5 above the cold plate.

[0074] 3. Open all the wire arrangement parts, including the side wall wire arrangement part 4 and the wire arrangement part 5 above the cold plate, and orderly install the cables into the wire arrangement part 5 above the cold plate and the side wall wire arrangement part 4, wherein the cables arranged in the side wall are installed in the side wall wire arrangement part 4, and the cables to be connected to the mainboard 1 are installed in the wire arrangement part 5 above the cold plate, and after the installation is completed, close all the wire arrangement parts.

[0075] 4. Install the air guide cover 2 from top to bottom, and other parts on the air guide cover body 20 can be installed on the air guide cover body 20 in advance or after the air guide cover body 20 is installed to the case.

[0076] 5. After the installation is completed, cover the upper cover of the electronic equipment, the buffer part 9 will be compressed by the upper cover, so that the gap between the upper cover and the air guide cover body 20 is filled by the buffer part 9, the installation of the air guide cover 2 is more compact, and the shaking of the air guide cover 2 is avoided.

[0077] 6. During the operation of the electronic equipment, the cold water flows into the cold plate from the fast connector at the front end of the cold plate, and then flows out from the fast connector after one cycle, during which the CPU above the mainboard 1 exchanges heat to reduce the temperature; the cold air flows into the air guide cover 2 from the front side with large opening, and due to the existence of the wire arrangement part 5 above the cold plate and the inclined setting of the front end face of each recessed cavity, the cold air will pass above the second heat generating element of the mainboard 1 more, so as to relieve the heat dissipation pressure of the second heat generating element; in the configuration matched with the target heat generating element 6, the air baffle part 10 is removed, and the air vent 2-7 on the air guide cover body 20 can guide the cold air to the target heat generating element 6.

[0078] The air guide cover 2 provided by the application is applied to a heat dissipation mode of air and liquid mixing, the air guide cover 2 can guide air flow to the top of a high-power heat generating element such as a memory, and more reasonably allocate heat dissipation resources by adding the air guide cover 2 above the cold plate module 3; the upper part and the side wall of the cold plate module 3 are provided with wire arrangement components to cope with the case of more cables in a high-performance server, and avoid messy wiring; the air guide cover 2 is provided with a target heat generating element 6 and two target electrical elements 7 above the air guide cover 2, these optional components can be installed on the air guide cover body 20, fully utilize the space, and leave more space for the motherboard 1 inside the server; the air guide cover 2 is designed with a wind blocking component 10 to cope with the two cases of having or not having a hard disk module, the air flow at the hard disk module is controlled by disassembling and assembling the wind blocking component 10, one air guide cover body 20 can be shared in different configurations, and the cost is reduced.

[0079] In addition to the air guide cover 2 described above, the application further provides a heat dissipation device comprising the cold plate module 3 and the air guide cover 2 described above, and other parts of the heat dissipation device are described in the related art, and will not be described here.

[0080] In addition to the heat dissipation device described above, the application further provides an electronic device comprising a case and the heat dissipation device described above, the heat dissipation device is installed in the case, and the electronic device further comprises a target heat generating element 6 and a target electrical element 7, and other parts of the electronic device are described in the related art, and will not be described here.

[0081] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0082] The air guide cover 2 provided by the application is described in detail above. The principle and implementation mode of the application are described by applying specific examples in this paper, and the description of the above embodiments is only used to help understand the method of the application and its core idea. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the application without departing from the principle of the application, and these improvements and modifications also fall within the protection scope of the application.

Claims

1. A fan shroud applied to a mainboard (1), wherein the mainboard (1) is provided with a first heat-generating element, a second heat-generating element and a cold plate module (3), the cold plate module (3) is in position correspondence with the first heat-generating element; characterized in that, The application relates to a heat dissipation device for a mainboard (1), which comprises the following parts: a wind deflector body (20) for being mounted on the top of the mainboard (1) along a height direction, the top of the wind deflector body (20) being provided with a first recessed cavity (A) for detachably mounting a target heat generating element (6); a first airflow channel being formed between the bottom of the first recessed cavity (A) and the mainboard (1), and the second heat generating element being located in the first airflow channel; and a vent (2-7) being arranged on the front end surface of the first recessed cavity (A) along an airflow direction, the airflow direction being from front to back; a wind blocking part (10) being detachably mounted on the vent (2-7), when the target heat generating element (6) is mounted in the first recessed cavity (A), the wind blocking part (10) is separated from the vent (2-7) to allow gas to flow into the first recessed cavity (A) through the vent (2-7), and when the target heat generating element (6) is not mounted in the first recessed cavity (A), the wind blocking part (10) is arranged on the vent (2-7) to block the gas; the bottom of the wind deflector body (20) is provided with a wire harness accommodating cavity (C), the wire harness accommodating cavity (C) extends along the airflow direction, the first recessed cavity (A) and the wire harness accommodating cavity (C) are arranged in a first direction, and the height direction, the first direction and the airflow direction are perpendicular to each other; the heat dissipation device further comprises an overhead wire arrangement part (5) arranged in the wire harness accommodating cavity (C), and the overhead wire arrangement part (5) is mounted between the wind deflector body (20) and the cold plate module (3).

2. The wind deflector of claim 1, wherein The front end surface of the first recessed cavity (A) is a slope, the slope is inclined towards the bottom of the wind deflector body (20) from front to back; and the size of the vent (2-7) is smaller than the size of the front end surface of the first recessed cavity (A).

3. The wind deflector of claim 2, wherein, The wind blocking part (10) comprises a baffle body and a locking protrusion (10-2), the locking protrusion (10-2) is located on the upper part of a first surface of the baffle body, the top of the locking protrusion (10-2) is provided with a locking surface (10-2-1), the locking surface (10-2-1) is perpendicular to the first surface, and when the wind blocking part (10) is mounted, the locking surface (10-2-1) is clamped with the vent (2-7).

4. The wind deflector of claim 3, wherein The bottom of the air vent (2-7) is provided with a limiting block, and the top of the air vent (2-7) is provided with a limiting gap (2-4); the bottom of the locking protrusion (10-2) is provided with a guide surface (10-2-2), and the included angle between the guide surface (10-2-2) and the first surface is obtuse; when the wind shielding component (10) is pushed from the top of the front end face of the first recessed cavity (A) to the bottom, the baffle body moves to the front side of the limiting block, the guide surface (10-2-2) is attached to the upper part of the air vent (2-7) and pushes the baffle body to elastically deform, the locking protrusion (10-2) moves to the limiting gap (2-4), and the baffle body resets, so that the locking protrusion (10-2) is clamped with the limiting gap (2-4).

5. The wind deflector of claim 4, wherein, The second surface of the baffle body is further provided with an unlocking component (10-1), the unlocking component (10-1) is an unlocking protrusion, the unlocking component (10-1) is located on the upper part of the second surface, and the unlocking component (10-1) corresponds to the position of the locking protrusion (10-2).

6. The wind deflector of claim 1, wherein The bottom surface of the first recessed cavity (A) is further provided with a plurality of stop protrusions (2-3), the stop protrusions (2-3) are used for limiting the target heat generating element (6), and the rear side of the first recessed cavity (A) is further provided with a fixing hole (2-2) for fixing the target heat generating element (6).

7. The wind deflector of claim 6, wherein The target heat generating element (6) is a hard disk module, the stop protrusions (2-3) are sliding groove protrusions or limiting protrusions, the sliding groove protrusions are located on the rear side of the first recessed cavity (A), the target heat generating element (6) is in sliding connection with the sliding groove protrusions, the limiting protrusions are located on the front side of the first recessed cavity (A), and the limiting protrusions are used for abutting against the front side of the target heat generating element (6) after the target heat generating element (6) is installed in place; the target heat generating element (6) is further provided with a movable column pin (6-1), and the movable column pin (6-1) can be locked with the fixing hole (2-2) after the target heat generating element (6) is installed in place.

8. The wind cone of claim 1, wherein, Further comprising a buffer component (9), the buffer component (9) is arranged on the top of the air deflector body (20), and the buffer component (9) is used for filling the gap between the air deflector body (20) and the top plate of the cabinet of the electronic equipment.

9. A wind scoop according to any one of claims 1 to 8, wherein, The top of the air deflector body (20) is further provided with a second recessed cavity (B), the second recessed cavity (B) is used for installing a target electrical element (7); the bottom of the first recessed cavity (A) and the mainboard (1) form a second airflow channel, the front end face of the second recessed cavity (B) is inclined, and the front end face of the second recessed cavity (B) is inclined from front to back towards the bottom of the air deflector body (20); the first recessed cavity (A) and the second recessed cavity (B) are arranged in a first direction, and the height direction, the first direction and the airflow direction are perpendicular to each other.

10. The wind deflector of claim 9, wherein, The second recessed cavity (B) is provided with a support, and a top of the support is arranged to be inclined relative to a bottom surface of the second recessed cavity (B) in the first direction, so that the target electrical appliance element (7) is inclined relative to the first direction.

11. The wind deflector of claim 10, wherein, Further comprising a fastener (8) for fixing the target electrical appliance element (7) on the support, and the fastener (8) is detachably connected with the support; the support is provided with a fastening gap, and the fastener (8) penetrates through the fastening gap and is arranged around the target electrical appliance element (7).

12. The wind deflector of claim 9, wherein, The front side of the second recessed cavity (B) is further provided with a wire harness limiting groove (2-5) for fixing the wire harness.

13. The wind cone of claim 1, wherein, Further comprising a cold plate wire arrangement support (3-1) for bearing the wire arrangement component (5) above the cold plate, and the cold plate wire arrangement support (3-1) can be detachably mounted on the cold plate module (3).

14. The wind cone of claim 1, wherein, The air deflector body (20) is integrally formed, and the number of wire harness accommodating cavities (C) is at least two, which are respectively located on both sides of the first recessed cavity (A) along the first direction, and the air deflector body (20) extends in an S shape in the first direction.

15. A wind scoop according to any one of claims 1 to 8, wherein Further comprising: A side wall wire arrangement component (4) is provided with a wire harness space for the wire harness to penetrate through in the airflow direction, and the side wall wire arrangement component (4) is used for mounting on the side wall of the case of the electronic equipment, and the end of the air deflector body (20) along the first direction is provided with a bent extension edge which is overlapped on the top of the side wall wire arrangement component (4); the height direction, the first direction and the airflow direction are perpendicular to each other.

16. The wind deflector of claim 15, wherein, The top of the side wall wire arrangement component (4) is provided with a plurality of positioning column pins (4-1), and the bent extension edge is provided with a plurality of positioning holes (2-1), and the positioning holes (2-1) and the positioning column pins (4-1) are connected one by one to position the air deflector body (20); And / or, the bent extension edge is provided with a hook (2-8) extending along the first direction, and the hook (2-8) is matched with the limiting groove of the case side wall to limit the hook (2-8) in the airflow direction.

17. The wind deflector of claim 15, wherein, The side wall wire arrangement component (4) is a wire arrangement box, which comprises a wire arrangement fixing part (4-3) and a wire arrangement folding part (4-4), the wire arrangement fixing part (4-3) is mounted on the cold plate module (3) or the case side wall, and the wire arrangement folding part (4-4) is connected with the wire arrangement fixing part (4-3) through a lock buckle, and the wire arrangement folding part (4-4) can be folded relative to the wire arrangement fixing part (4-3) to open or close the wire arrangement box.

18. A heat dissipating device characterized by comprising: The cooling device comprises a cold plate module (3) and an air deflector as claimed in any one of claims 1 to 17.

19. An electronic device, comprising: The cooling device comprises a case and an air deflector as claimed in claim 18 arranged in the case.

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