A circuit board chip mounter and a dispensing mechanism

Abstract

The application relates to the field of circuit board processing automation equipment, and discloses a circuit board chip mounter and a glue dispensing mechanism, which comprise a support, the top of the support is provided with a positioner, the outside of the positioner is provided with a material taking device through screw mounting, the material taking device comprises a mounting table and a positioning plate, the top of the mounting table is provided with an air pressure pump, a conveying pipe connected with the output end of the air pressure pump is arranged in the mounting table, the bottom end of the conveying pipe is fixedly connected with a main shunt, the output end of the main shunt is fixedly connected with four secondary shunts, the output end of each secondary shunt is fixedly connected with a material taking head, and a plurality of material taking heads are arranged in the positioning plate, the material taking head comprises a fixed box fixedly arranged on the top of the positioning plate and a movable shell slidingly connected in the positioning plate. In the application, the glue can be dried synchronously while the chip mounting operation is completed, an additional drying station is not needed, and the stability of component mounting is avoided from being influenced by vibration and changes in temperature and humidity during the conveying process.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board processing automation equipment, and in particular to a circuit board chip mounter and a dispensing mechanism. BACKGROUND

[0002] The circuit board chip mounter is widely used in the field of electronic manufacturing, and is used for accurately mounting surface mount components on a circuit board in the production process of consumer electronics, automotive electronics, communication equipment and the like, and is the core equipment of a surface mount technology production line. With the rapid development of the electronic industry, higher requirements are put forward for the mounting accuracy, production efficiency and process integration degree of the circuit board chip mounter. In the mounting process, not only the accurate grabbing and mounting of components need to be realized, but also the glue in the dispensing area after mounting needs to be dried to ensure the production quality of the circuit board and the reliability of subsequent assembly.

[0003] The existing circuit board chip mounter usually uses vacuum adsorption or mechanical clamping to realize component grabbing in the material taking and mounting link. After completing the mounting action, the glue needs to be dried by relying on an additional drying station (such as an oven, a UV curing device, etc.). Taking a common vacuum adsorption type chip mounter as an example, the material taking head adsorbs components by negative pressure. After mounting, the circuit board needs to be transmitted to a separate drying area to solidify the glue by using heat radiation, ultraviolet irradiation, etc. However, in the transmission process of the circuit board from the mounting station to the drying station, the drying effect of the glue and the stability of the component mounting are easily affected by factors such as vibration, changes in environmental temperature and humidity, etc., which is difficult to meet the needs of the electronic manufacturing industry for efficient and accurate production.

[0004] Therefore, in view of the above problems, a circuit board chip mounter and a dispensing mechanism are proposed to solve the above problems. SUMMARY

[0005] In order to make up for the above shortcomings, the present application provides a circuit board chip mounter and a dispensing mechanism, which aims to improve the problem in the prior art that the drying effect of the glue and the stability of the component mounting are easily affected by factors such as vibration, changes in environmental temperature and humidity, etc. in the transmission process of the circuit board from the mounting station to the drying station.

[0006] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0007] A circuit board chip mounter, comprising a support, a positioner is installed on the top of the support, and a material taking device is installed on the outside of the positioner by screws;

[0008] The material taking device comprises a mounting table and a positioning plate, a gas pressure pump is arranged on the top of the mounting table, a conveying pipe is arranged in the mounting table and connected with the output end of the gas pressure pump, a main flow divider is fixedly connected to the bottom end of the conveying pipe, four secondary flow dividers are fixedly connected to the output end of the main flow divider, and four material taking heads are fixedly connected to the output end of the secondary flow dividers and arranged in the positioning plate.

[0009] The material taking head comprises a fixed box fixedly arranged on the top of the positioning plate and a movable shell slidingly connected to the inside of the positioning plate, the top of the movable shell is slidingly connected to the inside of the fixed box, light springs are arranged between the top of the movable shell and the inner wall of the bottom of the fixed box, a double-head piston is slidingly connected to the inside of the movable shell, and an inflatable suction cup is threadedly connected to the bottom of the movable shell.

[0010] As a further description of the above technical solution:

[0011] A flexible baffle is arranged on the bottom outlet of the movable shell, a plurality of gas injection channels are arranged in the inside of the movable shell, a sliding cylinder is slidingly arranged at one end of the gas injection channel, a return spring is arranged between the outside of the sliding cylinder and the inner wall of the gas injection channel, and a nozzle is arranged at the other end of the gas injection channel.

[0012] As a further description of the above technical solution:

[0013] A plurality of gas outlets are arranged on the outside of the sliding cylinder, a rubber head is arranged at one end of the sliding cylinder close to the gas channel in the inside of the movable shell, and the inner side of the rubber head is concave.

[0014] As a further description of the above technical solution:

[0015] The outer diameter of the piston at one end of the top of the double-head piston is greater than the outer diameter of the piston at the other end, a limiting ring is fixedly connected to the outside of the movable shell, and the limiting ring is slidingly connected to the inside of the positioning plate.

[0016] As a further description of the above technical solution:

[0017] The main flow divider comprises a flow divider box, the top of the flow divider box is sealingly connected to the bottom of the conveying pipe, four flow divider channels are arranged on the outside of the flow divider box, four flow divider pipes corresponding to the flow divider channels are fixedly connected to the outside of the flow divider box, a rotating disc is rotatably connected to the inside of the flow divider box, a plurality of plugging heads are fixedly arranged on the outside of the rotating disc, an annular sliding groove is arranged on the inner side of the rotating disc, the plugging heads are slidingly connected to the inside of the annular sliding groove and have shapes matched with the shapes of the inner ends of the flow divider channels, the flow divider channels are sequentially divided into a pressurizing section, a stable section and an outer injection section from inside to outside, the inner diameter of the pressurizing section gradually decreases from inside to outside, the inner diameters of the stable section are the same, the inner diameter of the outer injection section gradually increases from inside to outside, and the secondary flow divider has the same structure as the main flow divider.

[0018] As a further description of the above technical solution:

[0019] The center position of the positioning plate is fixedly connected with a motor, the rotating disc inside the main shunt is fixedly installed at the output end of the motor, the output end of the motor is provided with a transmission device, and the rotating discs inside the four secondary shunts are driven by the transmission device;

[0020] As a further description of the above technical solution:

[0021] The inner side of the support is provided with a control box, the top of the support is provided with a conveying belt one, the outer side of the conveying belt one is provided with a partition plate, the inner side of the support is provided with a feeder, and the shapes of the inner sides of the two partition plates and the inner shape of the feeder are matched with the shape of the positioning plate;

[0022] As a further description of the above technical solution:

[0023] The positioner comprises a transverse guide rail, a longitudinal guide rail and a mounting plate, the transverse guide rail is arranged at the top of the support, the longitudinal guide rail is installed at the outer side of the output end of the transverse guide rail, and the mounting plate is installed at the output end of the longitudinal guide rail and connected with the mounting table;

[0024] A point glue mechanism of a circuit board chip mounter, applicable to any one of the circuit board chip mounters, comprises a bottom plate, the bottom plate is arranged at the top of the support, the top of the bottom plate is provided with a point glue device, the point glue device comprises a mounting frame, the outer side of the mounting frame is provided with a controller, the outer side of the mounting frame is provided with a positioning guide rail, the output end of the positioning guide rail is provided with a point glue head, and the top of the bottom plate is provided with a conveying belt two connected with the conveying belt one, the top of the conveying belt two is provided with a point glue jig, and the inner side of the point glue jig is provided with a PCB board placed on the top of the conveying belt one;

[0025] As a further description of the above technical solution:

[0026] The point glue jig comprises a base arranged on the conveying belt two, the outer side of the base is provided with a peripheral baffle, the inner side of the base is provided with an L-shaped partition baffle through screws, and the outer sides of the two ends of the L-shaped partition baffle are respectively slidably connected with a clamping plate one and a clamping plate two.

[0027] The present application has the following beneficial effects:

[0028] 1. In the present application, through the coordinated action of the air injection channel in the material taking head, the sliding cylinder and the inflatable suction cup, the drying of the glue and the pasting are synchronized. When the air pressure pump reverses the air suction, the double-head piston moves upward, the air pressure in the movable shell decreases, the sliding cylinder slides outward under the action of the return spring, and the air injection channel is connected with the air flow channel in the movable shell. The airflow is sprayed out through the air outlet of the air injection channel and the nozzle, and directly acts on the mounted components and the glue area. The glue is dried synchronously while the pasting operation is completed, without the need for additional drying station, avoiding the influence of vibration and temperature and humidity environment changes on the stability of component mounting during conveying.

[0029] 2. In the present application, through the cooperation of the rotating disc of the main shunt and the plugging head of the secondary shunt, the air charging distribution of the material taking head is accurately adjusted. The motor drives the rotating disc of the main shunt to rotate, and the plugging head slides in the annular sliding groove and combines with different shunt channels to control the air distribution to the specified secondary shunt, and then the secondary shunt accurately distributes to the corresponding material taking head. According to the demand of pasting, the air charging state of the material taking head can be freely switched, and different component grabbing positions can be flexibly adapted without replacing the material taking mechanism, thereby improving the adaptability of the equipment to various pasting tasks. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a three-dimensional schematic view of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0031] Figure 2 It is a structure schematic view of a positioner of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0032] Figure 3 It is a structure schematic view of a material taking device of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0033] Figure 4 It is a structure schematic view of a positioning plate of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0034] Figure 5 It is a structure schematic view of a main shunt of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0035] Figure 6 It is a structure schematic view of a material taking head of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0036] Figure 7 It is Figure 6 It is an enlarged view of A in the figure;

[0037] Figure 8 It is a structure schematic view of a dispensing device of a circuit board pasting machine and a dispensing mechanism proposed in the present application;

[0038] Figure 9 Figure 1 is a schematic diagram of a circuit board placement machine and a dispensing jig of a dispensing mechanism according to the present application.

[0039] Legend:

[0040] 1, support; 2, control box; 3, conveying belt one; 4, partition; 5, positioner; 501, transverse guide rail; 502, longitudinal guide rail; 503, mounting plate; 6, material taking device; 61, mounting table; 62, air pressure pump; 63, conveying pipe; 64, main flow divider; 641, flow divider box; 642, annular chute; 643, flow channel; 644, flow pipe; 645, rotating disc; 646, obturator; 65, secondary flow divider; 66, motor; 67, transmission; 68, material taking head; 681, fixed box; 682, movable shell; 683, double-head piston; 684, inflatable suction cup; 685, flexible baffle; 686, air jet channel; 687, sliding cylinder; 688, return spring; 689, spray head; 69, positioning plate; 7, feeder; 8, bottom plate; 9, dispenser; 91, mounting frame; 92, controller; 93, positioning guide rail; 94, dispensing head; 95, conveying belt two; 96, dispensing jig; 961, base; 962, peripheral baffle; 963, L-shaped partition baffle; 964, clamping plate one; 965, clamping plate two; 10, PCB. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0042] Reference Figures 1 to 7 An embodiment provided by the present application: a circuit board placement machine, comprising a support 1, the support 1 provides a stable mounting platform for each component of the device, ensuring the overall stability of the device during operation, and a positioner 5 is installed on the top of the support 1, the positioner 5 is used to accurately adjust the position of a material taking device 6, so that it can accurately move to the appropriate position to obtain electronic components and place the components to a PCB 10, and the material taking device 6 is installed on the outside of the positioner 5 through screws, the material taking device 6 is the core execution structure for completing the grabbing and transferring of electronic components, and the power source such as an air pressure pump 62 and the air path structure such as a conveying pipe 63 are integrated through a mounting table 61, the main flow divider 64 and the secondary flow divider 65 are used to realize the reasonable distribution of airflow, and the material taking head 68 is used to complete the grabbing of electronic components, so that the functions of each component are integrated to realize the connection of key actions from material taking to placement.

[0043] The material taking device 6 comprises a mounting table 61 and a positioning plate 69. The mounting table 61 is mainly used for mounting the air pressure pump 62 to provide a stable mounting position for the air pressure pump 62. An inner conveying pipe 63 connected with the output end of the air pressure pump 62 is arranged in the mounting table 61, which plays a role of bearing and preliminarily integrating the air circuit. The air pressure pump 62 is mounted at the top of the mounting table 61. The air pressure pump 62 serves as a power source during the whole material taking and patching process, generates air pressure, and provides air pressure power for the inflation adsorption, air jet drying and other actions of the material taking head 68. Different direction and pressure air flows are outputted to drive the material taking head 68 to complete a series of actions such as grabbing elements, releasing elements and drying glue. The conveying pipe 63 connected with the output end of the air pressure pump 62 is arranged in the mounting table 61. The conveying pipe 63 is used for transmitting the air flow generated by the air pressure pump 62, stably transmitting the air flow at the output end of the air pressure pump 62 to the main flow divider 64, and serving as a channel structure for air pressure transmission. The bottom end of the conveying pipe 63 is fixedly connected with the main flow divider 64. The main flow divider 64 performs first flow division on the air flow transmitted by the air pressure pump 62. According to the requirements of the patching operation, the air flow is reasonably distributed to four secondary flow dividers 65. Through the cooperation of the internal rotating disc 645 and the plugging head 646, precise control of air flow distribution is realized, so that the air flow can enter the corresponding secondary flow divider 65 according to the program setting. The output end of the main flow divider 64 is fixedly connected with the four secondary flow dividers 65. The secondary flow divider 65 performs second precise flow division on the air flow on the basis of the flow division of the main flow divider 64. The structure of the secondary flow divider 65 cooperates with that of the main flow divider 64 to further distribute the air flow to the corresponding material taking head 68, so that each material taking head 68 can obtain appropriate air pressure and air flow, ensure that different material taking heads 68 can complete grabbing or other actions according to requirements, improve the precision and flexibility of air flow distribution, and the output end of the secondary flow divider 65 is fixedly connected with the four material taking heads 68. The material taking head 68 directly contacts with the electronic element to complete the grabbing, transferring and placing actions of the electronic element. Through the inflation adsorption element, air jet auxiliary cleaning and glue drying actions, the operation on the element from material taking to patching is realized. A plurality of material taking heads 68 are mounted in the positioning plate 69. The positioning plate 69 provides a mounting position for the material taking head 68, positions and limits the material taking head 68, so that the plurality of material taking heads 68 can work in order within the preset space range, ensures the position stability of the material taking head 68 during the material taking and patching process, and facilitates the accurate alignment of the material taking head 68 with the patching position on the electronic element and the PCB board 10.

[0044] The material taking head 68 comprises a fixed box 681 fixedly installed at the top of the positioning plate 69, the fixed box 681 providing guidance and limiting structure for sliding of a movable shell 682, being in sliding connection with the top of the movable shell 682 inside, and assisting the reset of the movable shell 682 through the lightweight spring arranged between the top of the movable shell 682, so as to guarantee that the movable shell 682 can return to the initial position under the action of appropriate force after completing the downward grabbing action, and prepare for the next material taking action, and the movable shell 682 in sliding connection inside the positioning plate 69, the movable shell 682 being the main movable structure inside the material taking head 68, realizing the up-down movement of the material taking head 68 by sliding inside the positioning plate 69, its inside accommodating a double-head piston 683, arranging a gas jet channel 686 and other structures, and completing the downward grabbing element and upward reset and other actions under the action of gas pressure, and the outside of the movable shell 682 being fixedly connected with a limiting ring, the limiting ring limiting the sliding of the movable shell 682 inside the positioning plate 69, limiting the sliding range of the movable shell 682, so that the movable shell 682 can only slide in the preset track and range, guaranteeing the stability and accuracy of the movable shell 682 in the up-down movement process, avoiding affecting the material taking and patch precision due to the sliding deviation of the movable shell 682, and the outside of the limiting ring being in sliding connection inside the positioning plate 69. The top of the movable shell 682 is in sliding connection inside the fixed box 681, and the top of the movable shell 682 and the inner wall of the bottom of the fixed box 681 are provided with a lightweight spring arranged therebetween, the lightweight spring being installed between the top of the movable shell 682 and the inner wall of the bottom of the fixed box 681, when the movable shell 682 slides downward to complete the material taking action under the action of gas pressure, and when the gas pressure disappears or reverses, the movable shell 682 is pulled upward to reset by the elastic force of the lightweight spring, so that the movable shell 682 returns to the initial position, and prepares for the next material taking action, the inside of the movable shell 682 being in sliding connection with the double-head piston 683, the double-head piston 683 sliding inside the movable shell 682, and due to the fact that the outer diameter of the top one end of the piston is greater than the outer diameter of the bottom one end of the piston, different stress effects can be generated under the action of gas pressure, when moving downward, the gas pressure acting on the inside of the movable shell 682 can be increased, assisting the downward sliding of the movable shell 682 to realize the action of the grabbing element; when moving upward, the gas pressure environment inside the movable shell 682 is changed, creating conditions for the gas jet action of the gas jet channel 686.

[0045] The bottom of the movable shell 682 is threadedly connected with an inflatable suction cup 684, which is in direct contact with the electronic component, inflates and expands under the action of air pressure, and uses the adsorption force generated by the air pressure difference to grab the electronic component. It is a direct structure to realize the grabbing of the electronic component, and the size and stability of the adsorption force directly affect the grabbing effect of the electronic component, ensuring that the electronic component can be reliably grabbed and released. The bottom outlet of the movable shell 682 is provided with a flexible baffle 685, which can be pushed open by the inflatable suction cup 684 when the inflatable suction cup 684 inflates and pushes outward, facilitating the contact of the inflatable suction cup 684 with the electronic component; when the inflatable suction cup 684 retracts, it can play a certain shielding role to prevent dust and other impurities from entering the interior of the inflatable suction cup 684, thereby protecting the inflatable suction cup 684 and ensuring the cleanliness and normal adsorption function of the inflatable suction cup 684. A plurality of air injection channels 686 are formed in the interior of the movable shell 682. The air injection channel 686 is a gas path structure for realizing the air injection function of the material taking head 68, and is used for transmitting airflow so that the airflow can be injected from the interior of the movable shell 682 through the sliding cylinder 687, the nozzle 689 and other structures. After the pasting is completed, the airflow can be injected to blow dry the glue, and the electronic component and the PCB 10 can be cleaned before and after taking the material, thereby providing a clean environment for the pasting operation and improving the pasting quality. One end of the air injection channel 686 is slidably provided with a sliding cylinder 687. The sliding cylinder 687 slides in the air injection channel 686. A plurality of air outlets are formed on the outside of the sliding cylinder 687 and can be connected or disconnected with the airflow channel in the interior of the movable shell 682 during the sliding process, thereby realizing the control of the air injection function of the air injection channel 686. Through cooperation with the return spring 688, the position of the sliding cylinder 687 can be changed under different air pressure environments, thereby controlling whether the airflow is injected and the timing of the injection. A plurality of air outlets are formed on the outside of the sliding cylinder 687, and a rubber head is arranged at one end of the sliding cylinder 687 close to the gas channel in the interior of the movable shell 682. The rubber head can better adhere to or separate from the gas channel in the interior of the movable shell 682 during the sliding process of the sliding cylinder 687, thereby playing a role in auxiliary sealing and controlling the opening and closing of the airflow channel, ensuring that the airflow can smoothly pass through when air injection is needed, and effectively blocking the airflow when air injection is not needed, thereby improving the accuracy of airflow control of the air injection channel 686. The inner side of the rubber head is concave.The outer side of the sliding cylinder 687 is provided with a reset spring 688 between the inner side wall of the air jet channel 686, which plays a reset role on the sliding cylinder 687. When the air pressure in the movable shell 682 changes, the sliding cylinder 687 can be pushed or pulled back to the initial position, ensuring that the air jet channel 686 can accurately realize the on-off control of the air flow in different working states, so that the air jet action can be performed according to the timing and duration set by the program. The other end of the air jet channel 686 is provided with a nozzle 689, which sprays the air flow in the air jet channel 686 in a specific direction and form, and can accurately act on the surface of the electronic component or the glue area of the PCB 10, realizing the functions of auxiliary cleaning and glue drying. It is the terminal structure of the air jet channel 686 to realize the function, and the direction and range of the jet flow directly affect the cleaning and drying effect.

[0046] The main flow divider 64 includes a flow divider box 641, which is the main structure of the main flow divider 64, provides installation space for structures such as the rotating disc 645 and the flow channel 643, and is sealed and connected to the conveying pipe 63 at the top to ensure that the air flow can stably enter the inside of the main flow divider 64 and is the basic carrier for the main flow divider 64 to realize the air flow distribution function. The top of the flow divider box 641 is sealingly connected to the bottom of the conveying pipe 63, and four flow channels 643 are provided on the outside of the flow divider box 641. The flow channel 643 is a channel structure for the main flow divider 64 to realize air flow distribution, and through the structures of different inner diameters of the booster section, the stable section and the outer jet section arranged from inside to outside, the air flow is boosted and stabilized, so that the air flow can maintain appropriate pressure and flow rate when distributed to the secondary flow divider 65, ensuring the stability and accuracy of the subsequent material taking head 68. In addition, four flow divider pipes 644 corresponding to the flow channels 643 are fixedly connected to the outside of the flow divider box 641. The flow divider pipe 644 is connected with the flow channel 643 corresponding to the flow channel 643, stably transmits the air flow distributed by the flow channel 643 to the secondary flow divider 65, and plays a role of connecting the flow channel 643 and the secondary flow divider 65, ensuring that the air flow can smoothly enter the secondary flow divider 65 from the main flow divider 64, realizing the orderly transmission of the air flow between the main flow divider 64 and the secondary flow divider 65.

[0047] The inside of the flow divider box 641 is rotatably connected with a rotating disc 645, which is installed inside the flow divider box 641 and can rotate under the driving of the motor 66. The externally fixed and distributed plugging heads 646 cooperate with the flow distribution channels 643, and the correspondence between the plugging heads 646 and the flow distribution channels 643 is changed by rotation, so as to realize accurate control of air flow distribution, determine which flow distribution channel 643 the air flow enters, and further control the air flow distribution to the corresponding secondary flow divider 65. It is the key rotating structure for realizing accurate distribution of the primary flow divider 64. The rotating disc 645 has a plurality of plugging heads 646 fixed and distributed on the outside thereof. The plugging heads 646 are fixed and distributed on the outside of the rotating disc 645 and slide in the annular sliding groove 642 when the rotating disc 645 rotates. The shape of the plugging heads 646 is adapted to the shape of the inner end of the flow distribution channel 643. By cooperating with different flow distribution channels 643, the flow distribution channel 643 is opened or closed, so as to control whether the air flow enters the corresponding flow distribution channel 643, which is the execution structure of the primary flow divider 64 for realizing accurate air flow distribution. The inside of the rotating plate is provided with an annular sliding groove 642, which provides a track and a limit for the sliding of the plugging head 646, so that the plugging head 646 can stably slide along the annular sliding groove 642 during the rotation of the rotating disc 645, ensuring that the plugging head 646 can accurately cooperate with the flow distribution channel 643 to realize accurate control of air flow distribution, improve the accuracy and stability of the primary flow divider 64, and the shape of the plugging head 646 is adapted to the shape of the inner end of the flow distribution channel 643. The flow distribution channel 643 is sequentially divided into a pressurizing section, a stable section and an outer spraying section from inside to outside. The inner diameter of the pressurizing section gradually decreases from inside to outside, the inner diameter of the stable section is the same, and the inner diameter of the outer spraying section gradually increases from inside to outside. The secondary flow divider 65 has the same structure as the primary flow divider 64.

[0048] The motor 66 is fixedly connected to the center position of the positioning plate 69 and provides power for the rotation of the rotating disc 645. The motor 66 drives the rotating disc 645 to rotate at a programmed angle and speed, so that the plugging head 646 can accurately reach the position for cooperating with the flow distribution channel 643, realize accurate control of air flow distribution, and is the power source for realizing automatic and accurate distribution of the primary flow divider 64. The rotating disc 645 inside the primary flow divider 64 is fixedly installed on the output end of the motor 66. The output end of the motor 66 is provided with a transmission device 67, which is installed on the output end of the motor 66 to transmit the power of the motor 66 to the rotating disc 645 inside the secondary flow divider 65, so that the rotating disc 645 of the secondary flow divider 65 can rotate cooperatively with the rotating disc 645 of the primary flow divider 64, ensuring the synchronization and coordination of the primary flow divider 64 and the secondary flow divider 65 during air flow distribution, improving the working efficiency and accuracy of the entire flow distribution system, and the rotating discs 645 inside the four secondary flow dividers 65 are driven by the transmission device 67.

[0049] The inner side of the support 1 is provided with a control box 2, and the control box 2 is internally integrated with a control circuit and a control system, which is used for coordinating the work of each component of the circuit board chip mounter, sending program setting and instructions, controlling the start and stop of the air pressure pump 62, the air flow direction and the pressure, controlling the position adjustment of the positioner 5, controlling the material taking and chip mounting actions of the material taker 6, etc., and is the control core of the whole equipment. The top of the support 1 is provided with a conveying belt one 3, which is the main structure for conveying the PCB board 10 and is used for conveying the PCB board 10 to be mounted to a specified position in the equipment, so that the PCB board 10 can pass through the material taking, glue dispensing and chip mounting stations in sequence, realizes the automatic transmission of the PCB board 10 in the equipment, provides material conveying guarantee for continuous and large-scale mounting operation. The outer side of the conveying belt one 3 is provided with a partition plate 4, which is installed outside the conveying belt one 3 and plays a limiting role on the PCB board 10 on the conveying belt, prevents the PCB board 10 from deviating during the conveying process, guarantees that the PCB board 10 can move along the preset path on the conveying belt one 3, so that the PCB board 10 can accurately reach the specified position of material taking and chip mounting, and improves the position accuracy of the mounting operation. The inner side of the support 1 is provided with a feeder 7, and the inner shape of the feeder 7 is matched with the shape of the positioning plate 69, which is used for placing electronic components to be mounted, arranges the electronic components in order in the feeder 7 according to the mounting requirements of the PCB board 10, provides a stable material taking source for the taking head 68 of the material taker 6, so that the taking head 68 can accurately obtain the electronic components, and is an important material storage and supply structure for realizing automatic material taking. The inner shape of the two partition plates 4 and the inner shape of the feeder 7 are matched with the shape of the positioning plate 69. The positioner 5 includes a horizontal guide rail 501, a vertical guide rail 502 and a mounting plate 503. The horizontal guide rail 501 is installed at the top of the support 1, provides a track and power for the vertical movement of the positioner 5, so that the positioner 5 can move in the horizontal direction along the horizontal guide rail 501, adjusts the horizontal position of the material taker 6 on the horizontal plane, guarantees that the material taker 6 can accurately move to the horizontal coordinate position of material taking and chip mounting. The vertical guide rail 502 is installed outside the output end of the horizontal guide rail 501, cooperates with the horizontal guide rail 501, provides a track and power for the vertical movement of the positioner 5, so that the positioner 5 can move in the horizontal direction along the vertical guide rail 502, adjusts the vertical position of the material taker 6 on the horizontal plane, cooperates with the horizontal guide rail 501 to realize accurate positioning of the material taker 6 on the horizontal plane, guarantees the accuracy of the material taking and chip mounting position. The mounting plate 503 is installed at the output end of the vertical guide rail 502 and is connected with the mounting table 61. The mounting plate 503 plays a role of connecting the positioner 5 and the material taker 6, transmits the position adjustment function of the positioner 5 to the material taker 6, so that the material taker 6 can accurately move with the movement of the positioner 5, guarantees the position accuracy of the material taker 6 during the material taking and chip mounting process.

[0050] Referring to Figure 1 , Figure 8 andFigure 9 In yet another embodiment, the present application provides a dispensing mechanism of a circuit board chip mounter, which is applicable to the circuit board chip mounter described above, and comprises a bottom plate 8, which provides a mounting basis for the dispensing mechanism and is arranged at the top of the support 1 to bear components of the dispensing mechanism such as the dispenser 9 and the conveying belt 95, so as to ensure that each component of the dispensing mechanism can be stably mounted and worked at a preset position and provide a stable platform for dispensing operation. The bottom plate 8 is arranged at the top of the support 1, and the dispenser 9 is arranged at the top of the bottom plate 8. The dispenser 9 is the core structure of the dispensing mechanism and is used to realize dispensing operation on the PCB 10. The dispensing head 94 is driven to move by the positioning guide rail 93 according to the position and parameters set by the program, so as to accurately dispense glue at the specified position of the PCB 10, provide a glue basis for subsequent chip mounting operation, and ensure that the electronic component can be stably pasted on the PCB 10 through the glue. The dispenser 9 comprises a mounting frame 91, which provides mounting positions for each component of the dispenser 9, such as the controller 92 and the positioning guide rail 93, integrates the components of the dispenser 9, ensures that each component of the dispenser 9 can be orderly mounted and worked at a preset position, and ensures the stability and reliability of the overall structure of the dispenser 9. The controller 92 is arranged outside the mounting frame 91 and is used to control the working of the dispenser 9, set dispensing parameters such as dispensing amount, dispensing position, dispensing speed, control the movement of the positioning guide rail 93 and the dispensing action of the dispensing head 94, and make the dispenser 9 automatically and accurately complete dispensing operation according to the preset program, which is the control core of the dispenser 9. The positioning guide rail 93 is arranged outside the mounting frame 91 and provides a track and power for the movement of the dispensing head 94, drives the dispensing head 94 to move in the plane above the PCB 10, makes the dispensing head 94 accurately reach each dispensing position on the PCB 10, realizes accurate dispensing on the PCB 10, and ensures the accuracy of the dispensing position and the automation of the dispensing operation.

[0051] The output end of the positioning guide rail 93 is mounted and arranged with a dispensing head 94, which directly contacts the PCB board 10 to dispense glue at the designated position of the PCB board 10. The structure and function of the dispensing head 94 ensure that the glue can be dispensed in a suitable form and dosage on the PCB board 10, and it is the direct execution structure of the dispensing operation. The performance and precision of the dispensing head 94 directly affect the dispensing quality. The top of the bottom plate 8 is provided with a conveying belt two 95 connected with the conveying belt one 3. The conveying belt two 95 cooperates with the conveying belt one 3 to convey the PCB board 10 after the dispensing is completed, so that the PCB board 10 can be smoothly moved from the dispensing station to the patching station, realizing the automatic transmission of the PCB board 10 between the dispensing and patching stations, ensuring that the patching operation can be continuously and orderly carried out. The top of the conveying belt two 95 is provided with a dispensing jig 96, which is used to fix and position the PCB board 10, so that the PCB board 10 can maintain a stable position during the dispensing and patching processes, ensuring that the dispensing head 94 can accurately dispense glue at the designated position of the PCB board 10, and ensuring that the pick-and-place device 6 can accurately patch at the designated position of the PCB board 10, improving the positional precision of dispensing and patching. The inner side of the dispensing jig 96 is placed with the PCB board 10 on the top of the conveying belt one 3;

[0052] The dispensing jig 96 comprises a base 961 arranged on the conveying belt 95, which serves as the basic structure of the dispensing jig 96 and provides mounting platforms for components such as the L-shaped partition plate 963, the clamping plate one 964, the clamping plate two 965, etc., so that these components can be installed and work at the preset positions, enabling the dispensing jig 96 to stably limit and fix the PCB board 10. The outer side of the base 961 is provided with a peripheral baffle 962, which is mounted on the outer side of the base 961 and serves as a peripheral limiting function for the PCB board 10, preventing the PCB board 10 from escaping from the side during dispensing and patching, ensuring the positional stability of the PCB board 10 in the dispensing jig 96 and providing a stable foundation condition for dispensing and patching operations. The inner side of the base 961 is provided with the L-shaped partition plate 963 mounted by screws, which is mounted on the inner side of the base 961 by screws and cooperates with the clamping plate one 964 and the clamping plate two 965 to limit the side edges of the PCB board 10. By utilizing its shape characteristics, the L-shaped partition plate 963 positions the PCB board 10 from two adjacent edges, ensuring the positional accuracy of the PCB board 10 in the dispensing jig 96, so that the PCB board 10 can accurately reach the designated position for dispensing and patching. The outer sides of the two ends of the L-shaped partition plate 963 are respectively connected with the clamping plate one 964 and the clamping plate two 965 through sliding connection. The clamping plate one 964 is connected with the outer side of one end of the L-shaped partition plate 963 through sliding connection and can slide within a certain range. According to the size of the PCB board 10, the distance between the L-shaped partition plate 963, the clamping plate two 965 and the clamping plate one 964 is adjusted to clamp and fix the side edges of the PCB board 10, adapt to the limiting requirements of PCB boards 10 of different sizes, improve the universality and adaptability of the dispensing jig 96, and the clamping plate two 965 is connected with the outer side of the other end of the L-shaped partition plate 963 through sliding connection and cooperates with the clamping plate one 964 to clamp and fix the PCB board 10 from the other side edge. Together with the clamping plate one 964, the clamping plate two 965 realizes self-adaptive clamping of PCB boards 10 of different sizes and ensures the positional stability of the PCB board 10 during dispensing and patching.

[0053] Working principle: First, place the PCB board 10 on the base 961, then move the clamping plate one 964 and the clamping plate two 965 to self-adaptively clamp the PCB board 10, and then open the dispensing mechanism. The positioning guide rail 93 of the dispenser 9 drives the dispensing head 94 to move, and according to the program setting, the dispensing head 94 dispenses at the designated position of the PCB board 10 on the dispensing jig 96.

[0054] Subsequently, the circuit board patch machine starts, the support 1 as the foundation support, the control box 2 starts to coordinate the operation of each component. The conveyor belt one 3 transports the PCB board 10 to be pasted, the PCB board 10 is transported to the designated position of the conveyor belt one 3, the feeder 7 starts to top up the patch raw material upward, at the same time, the positioner 5 starts to work, the horizontal guide rail 501, the vertical guide rail 502 drive the mounting plate 503 to move, and then the material taking device 6 moves to the appropriate material taking position. Then the air pressure pump 62 on the top of the mounting table 61 starts, the generated airflow is transmitted to the main flow divider 64 through the conveying pipe 63. Inside the main flow divider 64, the rotating disc 645 rotates by the motor 66 driving, the obturator 646 on the rotating disc 645 slides in the annular sliding groove 642, according to the program control, a plurality of obturators 646 cooperate with the corresponding flow divider channel 643, the opening state of the flow divider channel 643 is freely combined, and the shape of the flow divider channel 643 makes the gas increase in pressure to a certain extent during the process of passing through the flow divider, so as to ensure that the gas pressure will not be excessively lost, so as to adapt to different material taking requirements, and the airflow is distributed to the corresponding secondary flow divider 65 through the main flow divider 64. The secondary flow divider 65 is the same structure as the main flow divider 64, which further accurately divides the airflow, so that the airflow is finally transmitted to the material taking head 68.

[0055] At the material taking head 68, the airflow enters the fixed box 681, and acts on the double-head piston 683 in the movable shell 682. Since the outer diameter of the top end of the double-head piston 683 is larger than that of the bottom end, the double-head piston 683 is further pressurized during downward movement, and under the action of air pressure, the inflatable suction cup 684 inflates and pushes the flexible baffle 685 outward, and after the inflatable suction cup 684 completes inflation, the movable shell 682 slides downward against the elastic force of the light spring, and the inflatable suction cup 684 at the bottom of the movable shell 682 approaches and contacts the electronic component to be taken, so as to adsorb the electronic component required for pasting. When the adsorption is completed, the patch raw material is transported to the patching area by the positioner 5, and is positioned under the limiting of the partition plate 4. At the same time, since the feeder 7 is specially made according to the PCB board 10 as a template, the raw material placement position is the position of the PCB board 10 to be pasted, and there is no need for repositioning. At this time, the air pressure pump 62 reverses to perform air extraction, so that the double-head piston 683 moves upward, and the inflatable suction cup 684 retracts into the flexible baffle 685 to prevent dust interference with subsequent adsorption effect, and because the air pressure at the bottom of the double-head piston 683 decreases, the sliding cylinder 687 in the air jet channel 686 of the movable shell 682 slides outward to make the air outlet hole communicate with the airflow passage inside the movable shell 682, so that the airflow enters the air jet channel 686 and is sprayed out by the air jet head 689, so as to blow dry the glue on the patching surface after the patching is completed, and at the same time, the surface of the component is cleaned.

[0056] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board placement machine, comprising a support (1), characterized in that: A positioner (5) is installed on the top of the bracket (1), and a feeder (6) is installed on the outside of the positioner (5) by screws. The feeder (6) includes a mounting platform (61) and a positioning plate (69). A pneumatic pump (62) is installed on the top of the mounting platform (61), and a conveying pipe (63) connected to the output end of the pneumatic pump (62) is provided inside the mounting platform (61). A main distributor (64) is fixedly connected to the bottom end of the conveying pipe (63). Four secondary distributors (65) are fixedly connected to the output end of the main distributor (64). Four feed heads (68) are fixedly connected to the output end of the secondary distributors (65). Multiple feed heads (68) are installed inside the positioning plate (69). The material handling head (68) includes a fixed box (681) fixedly installed on the top of the positioning plate (69) and a movable shell (682) slidably connected inside the positioning plate (69). The top of the movable shell (682) is slidably connected inside the fixed box (681), and a light spring is provided between the top of the movable shell (682) and the bottom inner wall of the fixed box (681). A double-headed piston (683) is slidably connected inside the movable shell (682), and an inflatable suction cup (684) is threadedly connected to the bottom of the movable shell (682). The bottom outlet of the movable shell (682) is equipped with a flexible baffle (685). The interior of the movable shell (682) is provided with multiple jet channels (686). A sliding cylinder (687) is slidably provided at one end of the jet channel (686). A return spring (688) is provided between the outer side of the sliding cylinder (687) and the inner sidewall of the jet channel (686). A nozzle (689) is provided at the other end of the jet channel (686). The exterior of the sliding cylinder (687) is provided with multiple air outlets. A rubber head is provided at one end of the sliding cylinder (687) near the gas channel inside the movable shell (682). The inner side of the rubber head is concave. The outer diameter of the piston at the top end of the double-ended piston (683) is larger than that at the bottom end, and a limiting ring is fixedly connected to the outside of the movable shell (682), with the outer side of the limiting ring slidably connected to the inside of the positioning plate (69).

2. The circuit board placement machine according to claim 1, characterized in that: The main distributor (64) includes a distributor box (641), the top of which is sealed to the bottom of the delivery pipe (63). Four distribution channels (643) are opened on the outside of the distributor box (641), and four distribution pipes (644) corresponding to the distribution channels (643) are fixedly connected to the outside of the distributor box (641). A rotating disk (645) is rotatably connected inside the distributor box (641), and multiple sealing heads are fixedly distributed on the outside of the rotating disk (645). 646), and an annular groove (642) is provided on the inner side of the rotating plate. The outer side of the sealing head (646) is slidably connected to the inside of the annular groove (642) and its shape is adapted to the inner end shape of the diversion channel (643). The diversion channel (643) is divided into a pressurization section, a stable section and an external spray section from the inside to the outside. The inner diameter of the pressurization section gradually decreases from the inside to the outside, the inner diameter of the stable section is the same, and the inner diameter of the external spray section gradually increases from the inside to the outside. The secondary diverter (65) has the same structure as the main diverter (64).

3. A circuit board placement machine according to claim 2, characterized in that: The center of the positioning plate (69) is fixedly connected to a motor (66), and the rotating disk (645) inside the main distributor (64) is fixedly installed at the output end of the motor (66). The output end of the motor (66) is provided with a transmission device (67), and the rotating disk (645) inside the four secondary distributors (65) is driven by the transmission device (67).

4. A circuit board placement machine according to claim 1, characterized in that: A control box (2) is installed on the inner side of the bracket (1), a conveyor belt (3) is installed on the top of the bracket (1), a partition (4) is installed on the outer side of the conveyor belt (3), and a feeder (7) is installed on the inner side of the bracket (1). The inner shape of the two partitions (4) and the inner shape of the feeder (7) are adapted to the shape of the positioning plate (69).

5. A circuit board placement machine according to claim 1, characterized in that: The positioner (5) includes a transverse guide rail (501), a longitudinal guide rail (502) and a mounting plate (503). The transverse guide rail (501) is set on the top of the bracket (1), the longitudinal guide rail (502) is installed outside the output end of the transverse guide rail (501), and the mounting plate (503) is installed at the output end of the longitudinal guide rail (502) and connected to the mounting platform (61).

6. A dispensing mechanism for a circuit board placement machine, applicable to any one of the circuit board placement machines described in claims 1-5, comprising a base plate (8), characterized in that: The base plate (8) is set on the top of the bracket (1). A dispensing device (9) is installed on the top of the base plate (8). The dispensing device (9) includes a mounting frame (91). A controller (92) is installed on the outside of the mounting frame (91). A positioning guide rail (93) is installed on the outside of the mounting frame (91). A dispensing head (94) is installed at the output end of the positioning guide rail (93). A second conveyor belt (95) connected to the first conveyor belt (3) is set on the top of the base plate (8). A dispensing fixture (96) is set on the top of the second conveyor belt (95). A PCB board (10) is placed on the inner side of the dispensing fixture (96) and the top of the first conveyor belt (3).

7. The dispensing mechanism of a circuit board placement machine according to claim 6, characterized in that: The dispensing fixture (96) includes a base (961) set on the second conveyor belt (95), an outer baffle (962) is provided on the outer side of the base (961), and an L-shaped baffle (963) is installed on the inner side of the base (961) by screws. The two ends of the L-shaped baffle (963) are respectively slidably connected to a clamping plate (964) and a clamping plate (965).

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