Method and device for manufacturing granular epoxy molding compound

Abstract

The present invention relates to a method and an apparatus for manufacturing a granular epoxy molding compound, and more particularly, to a method and an apparatus for manufacturing a granular epoxy molding compound for changing the shape of an epoxy molding compound in a powder state into a granular epoxy molding compound so as to reduce the risk of gel formation and making the same into uniformly shaped particles. To this end, the present invention discloses an apparatus for manufacturing a granular epoxy molding compound, comprising a powder storage unit, a molding device unit, a powder supply unit, and a pressurizing device unit. Further, a method of manufacturing a granular epoxy molding compound comprising a first supply step, a second supply step, a first molding step and a second molding step is disclosed.

Description

Technical Field

[0001] The present invention relates to a method and apparatus for manufacturing granular epoxy molding compound, and more particularly, to a method and apparatus for manufacturing granular epoxy molding compound by changing the shape of epoxy molding compound in a powder state into granular epoxy molding compound to reduce the risk of gel formation and prepare the granular epoxy molding compound into particles of uniform shape. Background Art

[0002] Epoxy molding compound (EMC) is a molding material used in the final step of semiconductor packaging process.

[0003] Epoxy resin is a material that protects various types of semiconductor devices, such as integrated circuits (ICs), large-capacity integrated circuits (LSIs), transistors, diodes, etc. by sealing to improve the characteristics and reliability of semiconductor devices. Epoxy molding compound (EMC) is widely used.

[0004] In recent years, as the trend of miniaturization, lightweighting and high performance of electronic devices has accelerated the high integration of semiconductors, research on improving the performance of sealing materials for semiconductor devices is being carried out in many aspects.

[0005] In particular, as the size of semiconductor wafer chips increases and the thickness of semiconductor devices decreases, the thickness of the packaging material on semiconductor devices and the amount of packaging material used per device are gradually decreasing. The thickness of the packaging material on a semiconductor device refers to the thickness of the packaging material that seals the surface of the semiconductor device opposite the lead frame or circuit board mounting surface. When one or more semiconductor devices are stacked on a lead frame or circuit board, the thickness of the packaging material that seals the surface of the semiconductor device on the top surface opposite the lead frame or circuit board mounting surface is also the thickness of the packaging material.

[0006] Semiconductor element packaging methods primarily use transfer molding, which involves forming cylindrical tablets from a solid epoxy resin composition. However, in recent years, with the advancement of semiconductor miniaturization and integration technologies and the increasing market demand for cost reduction, compression molding has become widely used.

[0007] However, the shape of the existing tablet epoxy molding compound cannot be applied to the compression molding method, but powder or granular epoxy molding compound with uniform shape and size should be applied.

[0008] In particular, in order to maintain good molding properties, granular epoxy molding compounds with uniform thickness and shape are becoming increasingly popular.

[0009]

Prior art literature

[0010] (Patent Document 2) Korean Patent Publication No. 10-2016-0117316 (published on October 10, 2016).

[0011] (Patent Document 3) Korean Patent Publication No. 10-2017-0003379 (published on January 9, 2017).

[0012] (Patent Document 4) Korean Utility Model Registration No. 20-0303110 (registered on January 21, 2003). Summary of the Invention

[0013] Technical problems to be solved The present invention addresses these issues and aims to improve upon existing methods for preparing pelletized epoxy molding compounds by using molten epoxy molding compound at temperatures exceeding 100°C and then pelletizing it using methods such as centrifugal granulation. However, this method carries a high risk of gel formation due to the high temperature required, and the risk of gel forming defects during the molding process is also high.

[0014] Therefore, there is an urgent need to develop epoxy molding compounds with cylindrical particles that have stable and uniform shapes to reduce the risk of gel formation.

[0015] The present invention is proposed to solve the above-mentioned problems. The purpose of the present invention is to reduce the risk of gel formation during the processing of changing the shape of powdered epoxy molding material into granular (granular) type epoxy molding material, and to provide a method and device for manufacturing granular epoxy molding material for making it into granules with uniform shape.

[0016] Furthermore, the present invention provides a method and an apparatus for producing a granular epoxy molding compound which can be produced at relatively low temperatures without the risk of gel formation.

[0017] The subjects of the present invention are not limited to the above-mentioned subjects, and those skilled in the art will clearly understand other subjects not mentioned from the following description.

[0018] Technical Solution In order to achieve the above object, the present invention provides a device for manufacturing granular epoxy molding compound.

[0019] A device for manufacturing granular epoxy molding compound, comprising: A powder storage section, in which the epoxy molding compound composition is stored in powder form and including a hopper at the bottom; a molding device section, including a port hole having a set diameter, a temperature control section for controlling the internal temperature of the port hole, and a nozzle section having a plurality of micro nozzles at the bottom of the port hole; a powder supply section, which receives powder from the hopper of the powder storage section and conveys the powder into the port hole by repeatedly moving to a first position and a second position; and a pressurizing device section, which applies a set pressure to the port filled with the powder using a plunger configured to be inserted into the port hole.

[0020] The plunger generates a pressure of 1-30 t. At this time, the internal temperature of the port hole and the nozzle mold is 50-95°C.

[0021] In this case, the powder supply unit includes a storage hole having an entrance size corresponding to the diameter of the hopper outlet. In this case, when the powder supply unit is moved along one side of the molding device unit to a first position where the hopper outlet and the entrance of the storage hole are opposite each other, the powder in the hopper moves to the storage hole by gravity.

[0022] In this case, the port hole has an inlet size corresponding to the outlet of the storage hole. In this case, when the powder supply portion is moved along one side of the molding device portion to a second position where the outlet of the storage hole and the inlet of the port hole are opposite each other, the powder disposed in the storage hole moves to the port hole by gravity.

[0023] The powder supply portion further includes a cooling device portion for maintaining or cooling the inner temperature of the storage hole to a set temperature.

[0024] Furthermore, a heat insulating material is included between the powder supply portion and the molding device portion to block heat transfer. The heat insulating material may be installed at the upper front portion of the molding device portion.

[0025] On the other hand, in the molding device section, the powder is melted at a set temperature and pressure and produces a continuous cylindrical extrudate when passing through the micro-nozzle of the nozzle section. In this case, the molding device section also includes a pulverizing section for pulverizing the cylindrical extrudate into particles of a predetermined length.

[0026] According to the present invention, a method for manufacturing a granular epoxy molding compound is disclosed.

[0027] A method for forming granular epoxy molding compound, comprising: a first supplying step for moving powder stored in a powder storage portion to a storage hole of a powder supply portion to supply the powder; a second supplying step for moving the powder filled in the storage hole of the powder supply portion to a port hole of a molding device portion for supply; a first molding step for heating the powder filled in the port hole to a set temperature and melting it using a temperature control portion, while applying a set pressure to the port hole using a plunger to mold it into a continuous cylindrical extrudate; and a second molding step for crushing the continuous cylindrical extrudate into granular epoxy molding compound having a predetermined length.

[0028] At this time, the first supply step includes: a moving process of the first powder storage part, which moves to a first position where the hopper side outlet of the powder storage part and the storage hole side inlet of the powder supply part face each other; and a storage hole filling process of the powder, wherein when in the first position, the powder is automatically transported into the storage hole by gravity.

[0029] At this time, the second supply step includes: a moving process of the second powder storage part, which will move to a second position where the storage hole side outlet of the powder supply part and the port hole side inlet of the molding device part face each other; and a port hole filling process of powder, when in the second position, the powder is automatically transported to the port hole by gravity.

[0030] At this time, the first molding step includes: a process of melting the powder in the port hole using the temperature control part of the molding device part; a molding pressurizing process of applying pressure by moving the plunger of the pressurizing device part and introducing the plunger into the port hole; and an extrudate production process of passing the molten powder through the micro-nozzle of the nozzle part, while producing continuous cylindrical extrudates according to the diameter of the micro-nozzle.

[0031] At this time, the second molding step includes: a natural cooling process in which the continuous cylindrical extrudate passing through the micro nozzle contacts with air and is cooled; and a granular production process in which the continuous cylindrical extrudate is crushed using a crusher to produce granular epoxy molding compound having a predetermined length.

[0032] On the other hand, the first molding step maintains the temperature of the port hole at a set temperature of 50 to 95° C. and applies a set pressure of 1 to 30 tons to the port hole. Preferably, a set pressure of 2-10 tons, more preferably 3-10 tons, can be applied.

[0033] In another aspect, the epoxy molding compound composition in powder form includes an epoxy resin, a curing agent, and a filler.

[0034] In addition, the epoxy molding compound composition may further include anhydride and silicone-epoxy hybrid resin.

[0035] On the other hand, the filler can use silicon dioxide, aluminum oxide or a mixture thereof, and in the case of a high thermal conductivity product, a high thermal conductivity filler such as boron nitride and a metal oxide can be used together. The filler can be 70 to 93 weight % based on the total weight of the epoxy molding compound composition.

[0036] Beneficial effects According to the above structure, the method and apparatus for manufacturing granular epoxy molding compound according to the present invention reduce the risk of gel formation during the process of transforming powdered epoxy molding compound into granular epoxy molding compound, and have the effect of manufacturing granules with uniform shape.

[0037] Furthermore, since the particles can be manufactured at relatively low temperatures without the risk of gel formation, it can not only reduce manufacturing costs but also lower the defective rate of compression mold (C-mold) products.

[0038] In addition, the powder received from the powder storage part is automatically supplied to the port of the molding device part by gravity through the movement of the powder supply part, so the structure is simple and there is an effect of easily manufacturing the granular epoxy molding compound by plunger pressurization.

[0039] In addition, the powdered epoxy molding compound product manufactured by the existing method can be changed into particles at a temperature with a low risk of gelation, and the shape of the manufactured particles is very uniform, with the effect of high productivity.

[0040] The effects of the present invention are not limited to the above-described effects, and should be understood to include all effects that can be inferred from the configuration of the present invention described in the detailed description of the present invention or the scope of claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 FIG. 1 is a schematic diagram illustrating an apparatus for manufacturing a granular epoxy molding compound according to an embodiment of the present invention.

[0042] Figures 2 to 4 It is shown in sequence using Figure 1 Schematic diagram of a process for manufacturing granular epoxy molding compound using a granular epoxy molding compound manufacturing apparatus.

[0043] Figure 5 FIG. 4 is a schematic flow chart illustrating a method for manufacturing a granular epoxy molding compound according to another embodiment of the present invention.

[0044] Figure 6 More specifically, Figure 5 Flowchart of the first supply step.

[0045] Figure 7 More specifically, Figure 5Flowchart of the second supply step.

[0046] Figure 8 More specifically, Figure 5 Flowchart of the first forming step.

[0047] Figure 9 More specifically, Figure 5 Flowchart of the second forming step.

[0048] In the picture: 1: Granular epoxy molding compound manufacturing device; 100: powder storage part; 110: hopper; 200: molding device; 210: port hole; 300: Powder supply department; 310: storage hole; 400: pressurizing device; 410: plunger; P: powder; P1: molten powder; PP: continuous cylindrical extrudate. DETAILED DESCRIPTION

[0049] Below, embodiments of the present invention will be described in detail with reference to the accompanying drawings to facilitate implementation by those skilled in the art. The present invention can be implemented in a variety of different forms and is not limited to the embodiments described herein. To clearly illustrate the present invention, parts not relevant to the description are omitted from the accompanying drawings, and the same reference numerals are attached to the same or similar parts throughout the specification.

[0050] The words and terms used in this specification and claims are not limited to the conventional or dictionary meanings, but are interpreted according to the principle that the inventor can define terms and concepts to best explain his invention. They must be interpreted as meanings and concepts that are consistent with the technical ideas of the present invention.

[0051] Therefore, the embodiments described in this specification and the configurations shown in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention, so when applying the present invention, the configuration may have various equivalents and modified examples.

[0052] In this specification, the terms "including" or "having" are intended to describe the existence of features, numbers, steps, actions, components, parts or their combinations listed in the specification, and should be understood as not excluding the possibility of the existence or addition of one or more other features, numbers, steps, actions, components, parts or their combinations.

[0053] When a component is “in front of,” “behind,” “above,” or “below” another component, it includes not only the case where the component is directly connected to the other component and is placed in front of, behind, above, or below the other component unless otherwise specified, but also the case where the other component is placed between the two components. Furthermore, when one component is “connected to” another component, it includes not only direct connection but also indirect connection, unless otherwise specified.

[0054] Furthermore, when describing the present invention, detailed descriptions of related disclosed functions or configurations will be omitted in order to avoid obscuring the main points of the present invention.

[0055] Hereinafter, a method and apparatus for manufacturing granular epoxy molding compound according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0056] Figure 1 is a schematic diagram showing an apparatus for manufacturing granular epoxy molding compound according to one embodiment of the present invention, Figures 2 to 4 is used Figure 1 Schematic diagram of the granular epoxy molding compound manufacturing apparatus and the granular epoxy molding compound manufacturing process.

[0057] As shown in the figures, the granular epoxy molding compound manufacturing apparatus 1 according to one embodiment of the present invention reduces the risk of gel formation at a relatively low temperature and mass-produces granular epoxy molding compound with uniform shape.

[0058] To this end, the granular epoxy molding compound manufacturing device 1 according to an embodiment of the present invention mainly includes a powder storage unit 100 , a molding device unit 200 , a powder supply unit 300 and a pressurizing device unit 400 .

[0059] First, the powder storage part 100 stores the epoxy molding compound composition in a powder form. To this end, the powder storage part 100 has an internal space provided and includes a structure of a hopper 110 for discharging the powder, preferably at one side, the bottom.

[0060] In the case of conventional epoxy molding compounds, epoxy molding compounds provided in powder form for producing granular epoxy molding compounds can be used without restriction.

[0061] Furthermore, as needed, the epoxy molding compound in a powder form may be produced from an epoxy molding compound manufacturing composition (also referred to as an epoxy molding compound composition) containing an epoxy resin, a multifunctional curing agent, and a filler.

[0062] Meanwhile, in one embodiment, the filler may be one of silica or alumina, and may include 70 to 93 wt % based on the total weight of the epoxy molding compound composition.

[0063] When the filler content of the composition used to produce the epoxy molding compound is high, the production of the granular epoxy molding compound can be carried out at a higher temperature.

[0064] Meanwhile, the powder storage unit 100 is used to store the epoxy molding compound in powder form and provide the powder as needed.

[0065] The hopper 110 is provided at the bottom of the powder storage portion 100 , and includes a hopper outlet 111 for supplying powder P.

[0066] At the same time, the molding device part 200 applies set temperature and pressure to the supplied powder P to melt the powder (soft to the extent of clay).

[0067] To this end, the molding device section 200 has a port hole 210 having a diameter configured for supplying powder P. A temperature controller (not shown) may also be included on one side for controlling the internal temperature of the port hole 210. Depending on the needs, this temperature control unit may be a heat exchanger or a heating device such as a heater. Of course, various shapes of temperature control units may be applicable as long as the temperature can be controlled according to the configuration.

[0068] Meanwhile, the molding device 200 includes a nozzle unit 220, which is provided with a plurality of micro-nozzles 221 at the bottom of the port hole 210. The nozzle unit 220 can be detachable as needed to surround the port outlet 212 of the port hole 210. A detachable nozzle unit facilitates mold replacement or continuous product production.

[0069] The port hole 210 may be made of a superhard alloy to ensure wear resistance, and the rest of the molding device portion 200 may be made of a cast metal material as a support for the pressure applied to the port.

[0070] Meanwhile, the micro nozzles 221 can have a set micro diameter, preferably 0.4 to 1.8 mm. The molten epoxy molding compound passes through these micro nozzles 221 and produces a continuous cylindrical ejection in the subsequent process. The above-mentioned micro nozzles can be installed in an amount of 50 or more, preferably 100 or more.

[0071] Meanwhile, the internal temperature of the port hole 210 of the molding device portion 200 is preferably 50 to 95°C, more preferably less than 55 to 95°C, and more preferably 55 to 85°C. When the temperature is lower than 50°C, the powder P does not melt and is not in a molten state (soft like clay), so it is not easy to manufacture a granular epoxy molding compound even if pressure is applied. When the temperature exceeds 95°C, the powder P may be excessively melted or molten, and there is a risk of gel formation due to the high temperature.

[0072] As the applied pressure increases, the internal temperature of the port hole 210 may decrease.

[0073] The powder supply part 300 receives the powder P from the hopper 110 of the powder storage part 100 by repeatedly moving to the first position and the second position, and delivers the powder P to fill the port hole 210 of the molding device part 200 .

[0074] To this end, the powder supply unit 300 has a structure that can slide left and right along the upper surface of the molding device unit 200 using hydraulic or pneumatic means and a separate moving device (not shown) as needed (see Figures 2 to 4 ).

[0075] Meanwhile, the powder supply part 300 has a storage hole 310 having an inlet 311 having a size corresponding to a diameter of the outlet 111 of the hopper 110 side of the powder storage part 100 .

[0076] At this time, the first position is a position where the outlet 111 of the hopper 110 and the inlet 311 of the storage hole 310 face each other when the powder supply part 300 moves along one side of the molding device part 200 (see FIG. Figure 1 and Figure 2 ).

[0077] At the first position, the powder P set in the powder storage part 100 through the hopper 110 passes through the hopper 110 and moves to the storage hole ( 310 ) of the powder supply part 300 by gravity and is filled.

[0078] Meanwhile, the port hole 210 of the molding device part 200 has a size of the inlet 211 corresponding to the outlet 312 of the storage hole 310 .

[0079] At this time, the second position is a position where the powder supply part 300 moves along one side of the molding device part 200 to form a position where the outlet 312 of the storage hole 310 and the inlet 211 of the port hole 210 face each other (see FIG. Figure 1 and Figure 3 ).

[0080] In the second position, the powder P filled in the storage hole 310 may move to the port hole 210 by gravity and be filled.

[0081] Preferably, the volume of the storage hole 310 may be formed to be the same as the volume of the port hole 210. Alternatively, the volume of the storage hole 310 may be formed to be smaller than the volume of the port hole 210.

[0082] Thus, when the powder supply portion 300 repeatedly moves to the first position and the second position (see Figure 1 ), and the powder P is supplied to the port hole 210 , a predetermined amount of the powder P can always be stably supplied to the port hole 210 .

[0083] Powder supply unit 300 may also include a separate cooling device (not shown) to maintain or cool the interior temperature of storage hole 310 to a set temperature. Preferably, the temperature within storage hole 310 is maintained between 0 and 20°C to maintain the powder P. This temperature control allows powder P to remain in a powdery state without clumping.

[0084] At the same time, it is preferable to block heat transfer between the powder supply unit 300 and the molding device unit 200 by including the heat insulating material 10. That is, the heat of the molding device unit 200 is not transferred to the powder supply unit 300, and the cooling temperature of the powder supply unit 300 does not affect the molding device unit 200. The heat insulating material 10 can be installed at the upper front portion of the molding device unit.

[0085] Next, refer to Figures 1 to 4 The granular epoxy molding compound manufacturing device 1 according to the embodiment of the present invention includes a pressurizing device part 400 .

[0086] The pressurizing device portion 400 includes a plunger 410 that can be inserted into the port hole 210. The plunger 410 can be used to apply a set pressure to the port hole 210 filled with the powder P. The plunger 410 preferably performs an up and down vertical movement (see Figure 1 ). Preferably, the pressure generated by the plunger 410 is 1 to 30 tons, preferably 2 to 10 tons, and more preferably 3 to 10 tons. When the pressure is less than 1 ton, the pressure is too low to produce a continuous cylindrical extrudate. When the pressure exceeds 30 tons, there is a possibility of exceeding the specification or causing stress on the die.

[0087] The diameter of the plunger 410 of the present invention is preferably smaller than the port diameter by about 100 to 300 μm. When the diameter of the plunger 410 is the same as above, the pressure of the pressurizing device can be well transmitted to the epoxy molding compound, thereby producing a cylindrical extrudate PP for making pellets.

[0088] The plunger 410 may reduce the gap between the plunger 410 and the port by including one or more polytetrafluoroethylene rings on the outer wall.

[0089] Meanwhile, in the granular epoxy molding compound manufacturing apparatus 1 according to one embodiment of the present invention, the powder P is melted in the molding apparatus section 200 to become a molten state (soft state like clay) powder (P1, Figure 4 That is, a continuous cylindrical extrudate (PP, Figure 4 ).

[0090] Furthermore, in the manufacturing apparatus 1 of the present invention, the molding unit 200 is provided with a pulverizing unit (not shown) at its lower portion for pulverizing the continuous cylindrical extrudate PP into pellets of a predetermined length. This pulverizing unit uses blades below the nozzle unit 220 to form pellets of uniform diameter and length.

[0091] Since various structures and configurations in the publication can be applied to the structures and configurations of these crushing parts, detailed descriptions will be omitted in order to avoid obscuring the main points of the present invention.

[0092] Figure 5 is a schematic flow chart showing a method for manufacturing a granular epoxy molding compound according to another embodiment of the present invention, Figure 6 More specifically, Figure 5 Flowchart of the first supply step, Figure 7 More specifically, Figure 5 Flowchart of the second supply step. In addition, Figure 8 More specifically, Figure 5 Flowchart of the first molding step, Figure 9 More specifically, Figure 5 Flowchart of the second molding step.

[0093] Reference Figures 5 to 9 The method for manufacturing granular epoxy molding compound using the granular epoxy molding compound manufacturing apparatus 1 according to one embodiment of the present invention is described in more detail as follows.

[0094] As described above, the granular epoxy molding compound manufacturing device 1 according to an embodiment of the present invention mainly includes a powder storage unit 100 , a molding unit 200 , a powder supply unit 300 , and a pressurizing unit 400 .

[0095] The method for manufacturing granular epoxy molding compound using the granular epoxy molding compound manufacturing apparatus 1 of the present invention mainly includes a first supplying step S10 , a second supplying step S20 , a first molding step S30 , and a second molding step S40 .

[0096] The epoxy molding compound in powder form of the present invention can be prepared from an epoxy molding compound manufacturing composition comprising an epoxy resin, a curing agent, and a filler.

[0097] As an example, the filler can be silicon dioxide, aluminum oxide, or a mixture thereof. In the case of a high thermal conductivity product, a high thermal conductivity filler such as boron nitride and a metal oxide can be used together. The filler can comprise 70 to 93 wt % based on the total weight of the epoxy molding compound composition.

[0098] The epoxy resin is preferably one or more compounds selected from biphenyl epoxy resin, cresol novolac resin, dicyclopentadienyl epoxy resin, bisphenol epoxy resin, terpene epoxy resin, aralkyl epoxy resin, multifunctional epoxy resin, naphthalene epoxy resin, xylose resin, polyaromatic epoxy resin, modified epoxy resin and silicon epoxy hybrid resin.

[0099] The content of the epoxy resin may preferably be 3-18 wt % based on the total weight of the composition.

[0100] In one embodiment, the curing agent can be a phenolic curing agent or an anhydride curing agent. Specifically, the curing agent can be a phenolic curing agent such as phenolic, biphenyl, polyfunctional, or polyaromatic phenolic curing agents, or a mixture of two or more anhydride curing agents such as tetrahydrophthalic anhydride (THPA) and methylhexahydrophthalic anhydride (MHHPA). The curing agent content is preferably 2-9% by weight of the total weight of the composition.

[0101] In this case, the epoxy molding compound composition may further contain anhydrides and / or silicone-epoxy hybrid resins.

[0102] The powder epoxy molding compound of the present invention is not limited, but can be prepared at 90-120° C. using the epoxy molding compound composition.

[0103] The first supplying step S10 is a step of moving the powder P stored in the powder storage portion 100 to the storage hole 310 of the powder supply portion 300 and supplying the powder P (see Figure 2 ).

[0104] In the first supplying step S10 , first, the powder storage unit moves to a first movement process S11 at a first position where the outlet 111 of the hopper 110 of the powder storage unit 100 and the inlet 311 of the storage hole 310 of the powder supply unit 300 face each other.

[0105] And, when in the first position, the powder storage hole filling process S12 of automatically conveying the powder P to the storage hole 310 by gravity is continuously performed. Through these first supplying steps S10 , the powder P is filled in the storage hole 310 of the powder supply part 300 .

[0106] The second supplying step S20 is a step of moving the powder P filled in the storage hole 310 of the powder supplying part 300 to the port hole 210 of the molding device part 200 and supplying the powder P (see Figure 3 ).

[0107] In the second supplying step S20 , first, a second powder storage moving process S21 is performed to move to a second position where the outlet 312 of the storage hole 310 side of the powder supplying part 300 and the inlet 211 of the port hole 210 side of the molding device part 200 face each other.

[0108] Also, when in the second position, the port hole filling process S22 of the powder P being automatically conveyed to the port hole 210 by gravity is continuously performed.

[0109] Through this second supply step S20 , the powder P is filled into the port hole 210 of the molding device part 200 .

[0110] Next, the first forming step S30 is continuously performed.

[0111] The first molding step S30 is a step of heating the powder P filled in the port hole 210 to a set temperature and melting it by using a temperature control unit (not shown) provided in the molding device section 200, while applying a set pressure to the port hole 210 using the plunger 410 of the pressurizing device 400. As a result, the molten powder P1 passing through the port hole 210 is formed into a continuous cylindrical extrudate. The molten powder P1 is formed into the shape of a continuous cylindrical extrudate by passing through the micro nozzle 221 of the nozzle section 220 provided at the lower portion of the port hole 210 of the molding device section 200 (see Figure 4 ).

[0112] Specifically, the first molding step S30 includes a process S31 of melting the powder in the port hole using the temperature control part of the molding device part 200, a molding pressurization process S32 of moving the plunger 410 of the pressurizing device part 400 and introducing it into the port hole 210, and an extrudate production process S33 of passing the molten powder P1 through the micro-nozzle 221 of the nozzle part 220 and producing a continuous cylindrical extrudate PP according to the diameter of the micro-nozzle 221.

[0113] Meanwhile, in the first molding step S30 , it is preferred that the temperature of the port hole 210 be maintained at a set temperature of 50° C. to 95° C., and a set pressure of 1 to 30 t be applied to the port hole 210 .

[0114] Next, the second forming step S40 is continuously performed.

[0115] The second molding step S40 is a step for finally producing the granular epoxy molding compound, in which the continuous cylindrical extrudate produced by the first molding step S30 is crushed to produce granular epoxy molding compound having a predetermined length.

[0116] Meanwhile, the continuous cylindrical extrudate produced through the nozzle portion 220 descends to the side of a grinder (not shown) for pulverization and comes into contact with air and is naturally cooled.

[0117] Specifically, the second molding step S40 includes a natural cooling process S41 in which the continuous cylindrical extrudate PP passes through the micro nozzle 221 and contacts the air and is cooled, and a granular epoxy molding compound production process S42 in which the continuous cylindrical extrudate PP is crushed into granular epoxy molding compounds having a predetermined length using a crusher.

[0118] The average particle size of the granular epoxy molding compound of the present invention may be 500 to 2,000 μm or 500 to 1,500 μm. If the average particle size of the granular epoxy molding compound is the same as above, it can be used to mold semiconductor devices by a compression molding method.

[0119] Hereinafter, in one embodiment of the present invention, the preparation of the granular epoxy molding compound of the present invention is described as an example. Unless otherwise clearly indicated to the contrary, various embodiments of the present invention can be combined with any other embodiments.

[0120] <Example 1> Production of epoxy molding compound particles containing 90wt% silica In the above example, 3 wt% of biphenyl-based epoxy resin YX-4000HK and 2 wt% of polyaromatic NC-3000L were used. 1.8 wt% of MEH-7851SS and 1.8 wt% of MEH-7800SS were used as curing agents. 85 wt% of spherical silica NQ5090F and 5 wt% of microsilica SC-2500SQ were used as fillers. A powdered epoxy molding compound was prepared by adding small amounts of coupling agents, catalysts, and additives.

[0121] Using the granular epoxy molding compound manufacturing apparatus of the present invention, powder was heated at 60-85° C. at intervals of 5° C. to prepare granular epoxy molding compound. The pellets were prepared by adjusting the pressure of the pressurizing device to 1 to 3 t.

[0122] The pellets can be produced at 60° C. and 3 t pressure, or at 85° C. and 1 t pressure. In order to adjust the production conditions, a pressurizing device 400 can be used to adjust the pressure and speed.

[0123] <Example 2> Preparation of epoxy molding compound particles containing 85wt% silica In the above example, 4.1 wt% of biphenyl-based epoxy resin YX-4000HK and 3.1 wt% of o-cresol epoxy resin YDCN-500-4P were used. 2.7 wt% of multifunctional MEH-7500-3S and 0.8 wt% of MEH-7851SS were used as curing agents. 80 wt% of spherical silica NQ5090F and 5 wt% of microsilica SC-2500SQ were used as fillers. A powdered epoxy molding compound was prepared by adding small amounts of coupling agents, catalysts, and additives.

[0124] The granular epoxy molding compound production apparatus of the present invention was used to prepare granular epoxy molding compound at intervals of 5° C. between 50° C. and 85° C. The granules were prepared by adjusting the pressure of the pressurizing device to 1 to 3 t.

[0125] At 50°C, pellets can be produced at a pressure of 3t, and at 85°C, pellets can be produced at a pressure of 1t. To adjust production conditions, a pressurizing device 400 can be used to adjust pressure and speed. Under these conditions, pellets can be produced without a separate cooling device.

[0126] <Example 3>.

[0127] Preparation of epoxy molding compound particles containing 80wt% silica In the above example, 7 wt% of biphenyl-based epoxy resin YX-4000HK and 4 wt% of o-cresol Novolak-based YDCN-500-5P were used. Furthermore, 4.7 wt% of multifunctional MEH-7500-3S and 1.1 wt% of MEH-7851SS were used as curing agents. 75 wt% of spherical silica NQ5090F and 5 wt% of microsilica SC-2500SQ were used as fillers. A powdered epoxy molding compound was prepared by adding small amounts of coupling agents, catalysts, and additives.

[0128] The granular epoxy molding compound production apparatus of the present invention was used to prepare granular epoxy molding compound at intervals of 5° C. between 50° C. and 85° C. The pellets were prepared by adjusting the pressure of the pressurizing device to 1 to 3 t.

[0129] The granular epoxy molding compound production apparatus of the present invention was used to prepare granular epoxy molding compound at intervals of 5° C. between 50° C. and 85° C. The granules were prepared by adjusting the pressure of the pressurizing device to 1 to 3 t.

[0130] Pellets can be produced at 50°C and 3t pressure, or at 85°C and 1t pressure. To adjust production conditions, a pressurizing device 400 can be used to adjust pressure and speed. Under these conditions, pellets can be produced without a separate cooling device.

[0131] As described above, the method and apparatus for manufacturing granular epoxy molding compound according to one embodiment of the present invention reduces the risk of gel formation during the process of transforming powdered epoxy molding compound into granular epoxy molding compound, and can prepare granules with uniform shapes.

[0132] Furthermore, since the particles can be manufactured at relatively low temperatures without the risk of gel formation, not only can manufacturing costs be reduced but production speed can also be increased.

[0133] In addition, gel formation is reduced, which can lead to increased yield.

[0134] In addition, the powder P supplied from the powder storage unit 100 is automatically supplied to the port hole 210 of the molding device unit 200 by gravity through the movement of the powder supply unit 300. Therefore, the structure is simple and granular epoxy molding compound can be easily manufactured by pressurizing using the plunger 410 of the pressurizing device unit 400.

[0135] Furthermore, any existing epoxy molding compound powder can be transformed into granules at temperatures with low gel risk, and the granules produced are very uniform in shape and in high yield.

[0136] Although the embodiments of the present invention have been described, the concept of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the concept of the present invention can easily add, change, delete, add, etc. within the scope of the same concept, but this also falls within the scope of the concept of the present invention.

Claims

1. A device for manufacturing granular epoxy molding compound, wherein: include: a powder storage portion that stores the epoxy molding compound in powder form and includes a hopper at the bottom; a molding device portion comprising a port hole having a set diameter, a temperature control portion for controlling an internal temperature of the port hole, and a nozzle portion having a plurality of micro nozzles at a bottom of the port hole; a powder supply portion that receives powder from a hopper of the powder storage portion and delivers the powder to a port hole by repeatedly moving to a first position and a second position; and A pressurizing device applies a set pressure to the port filled with the powder using a plunger provided to be insertable into the port hole.

2. The granular epoxy molding compound manufacturing device according to claim 1, wherein: The plunger generates a pressure of 1 to 30 tons.

3. The granular epoxy molding compound manufacturing device according to claim 1, wherein: The internal temperature of the port hole was 50-95°C.

4. The granular epoxy molding compound manufacturing device according to claim 1, wherein: The powder supply portion includes a storage hole having an inlet size corresponding to an outlet diameter of the hopper, When the powder supply portion moves along one side of the molding device portion to a first position where the outlet of the hopper and the inlet of the storage hole are opposite to each other, the powder in the hopper moves to the storage hole by gravity.

5. The granular epoxy molding compound manufacturing device according to claim 4, wherein: The port hole has an entrance size corresponding to the outlet of the storage hole, and when the powder supply part moves along one side of the molding device part to a second position relative to the outlet of the storage hole and the entrance of the port hole, the powder set in the storage hole moves to the port hole by gravity.

6. The granular epoxy molding compound manufacturing device according to claim 1, wherein: The powder supply unit further includes a cooling device for maintaining or cooling the internal temperature of the storage hole to a set temperature. A heat insulating material is included between the powder supply portion and the molding device portion to block heat transfer.

7. The granular epoxy molding compound manufacturing device according to claim 1, wherein: In the molding device part, the powder is melted at a set temperature and pressure, and produces a continuous cylindrical extrudate when passing through the micro nozzle of the nozzle part. The molding device section further includes a pulverizing section for pulverizing the cylindrical extrudate into pellets having a predetermined length.

8. A method for producing a granular epoxy molding compound, the method comprising: using the granular epoxy molding compound production apparatus according to any one of claims 1 to 7; include: a first supplying step for moving the powder stored in the powder storage portion into the storage hole of the powder supply portion to supply the powder; a second supplying step of moving the powder filled in the storage hole of the powder supplying portion to a port hole of the molding device portion for supply; a first molding step of heating the powder filled in the port hole to a set temperature and melting it by a temperature control unit, and simultaneously applying a set pressure to the port hole by a plunger to mold it into a continuous cylindrical extrudate; as well as, In the second molding step, the continuous cylindrical extrudate is crushed into granular epoxy molding compound with a predetermined length.

9. The method for producing a granular epoxy molding compound according to claim 8, wherein: The first supplying step includes: During the movement of the first powder storage portion, the first powder storage portion is moved to a first position where the hopper-side outlet of the powder storage portion and the storage hole-side inlet of the powder supply portion face each other; and A powder storage hole filling process, wherein when in a first position, the powder is automatically transported into the storage hole by gravity.

10. The method for producing a granular epoxy molding compound according to claim 8, wherein: The second supplying step includes: The second powder storage portion is moved to a second position in which the storage hole side outlet of the powder supply portion and the port hole side inlet of the molding device portion face each other; and During the filling process of the port hole of powder, when in the second position, the powder is automatically transported into the port hole by gravity.

11. The method for producing a granular epoxy molding compound according to claim 8, wherein: The first forming step comprises: a process of melting powder within the port hole using a temperature control portion of the molding device portion; A molding pressurizing process of applying pressure by moving a plunger of the pressurizing device portion and introducing the plunger into the port hole; and The extrudate production process is to pass the melted powder through a micro nozzle of a nozzle portion, and simultaneously produce continuous cylindrical extrudates according to the diameter of the micro nozzle.

12. The method for producing a granular epoxy molding compound according to claim 8, wherein: The second molding step includes: A natural cooling process in which the continuous cylindrical extrudate passing through the micro nozzle is exposed to air and cooled; and A granular production process in which a continuous cylindrical extrudate is pulverized using a pulverizer to produce granular epoxy molding compounds having a predetermined length.

13. The method for producing a granular epoxy molding compound according to claim 8, wherein: The first molding step maintains the port hole at a set temperature of 50 to 95° C. and applies a set pressure of 1 to 30 tons to the port hole.

14. The method for producing a granular epoxy molding compound according to claim 8, wherein: The epoxy molding compound composition in powder form includes an epoxy resin, a curing agent and a filler.

15. The method for producing a granular epoxy molding compound according to claim 14, wherein: The epoxy molding compound composition further comprises anhydride and / or silicone-epoxy hybrid resin.

16. The method for producing a granular epoxy molding compound according to claim 14, wherein: The filler is selected from one or more of silicon dioxide, aluminum oxide, boron nitride and metal oxides, and accounts for 70 to 93 weight % based on the total weight of the epoxy molding compound composition.

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