Film binding force detection method, device and equipment and storage medium

Abstract

The embodiment of the invention discloses a film binding force detection method, device and equipment and a storage medium. The binding force detection method comprises the following steps: controlling indentation equipment to impact different positions on the surface of a to-be-detected film with a preset load to form at least two cracks; acquiring the crack radiuses of the at least two cracks; and determining the crack growth rate according to the at least two preset loads and the at least two crack radiuses, wherein the crack growth rate is in negative correlation with the binding force of the to-be-detected film. By adopting the technical scheme, the crack growth rate can be determined by utilizing the obtained multiple groups of data so as to improve the detection accuracy, errors caused by single detection are avoided, the binding force which is difficult to directly measure is represented through the crack growth rate, and the detection efficiency of the film binding force is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method, device, equipment and storage medium for detecting the bonding strength of a thin film. Background Art

[0002] Brittle films, especially submicron and nanometer films, are widely used in semiconductor materials and devices, such as passivation films (silicon oxide, silicon nitride, etc.), piezoelectric films (aluminum nitride, zinc oxide, lead zirconate titanate), transparent conductive films (indium tin oxide, zinc oxide, etc.), etc. The design basically involves growing or depositing a single or multi-layer hard film on a hard substrate to achieve special functions. The bonding strength of the brittle film layer is crucial in semiconductor devices because it directly affects the reliability, performance and life of the device. Insufficient bonding strength may cause the film to peel, crack or delaminate, leading to electrical failure, mechanical damage or environmental corrosion. In addition, with the development of advanced packaging technology, the research and development and application of hybrid bonding technology also require hot pressing interconnection between brittle films. The bonding strength of the bonded film layers is also a key factor in determining whether hybrid bonding technology can be applied in large-scale production.

[0003] In short, the adhesion of brittle film layers is a core parameter in semiconductor device design, requiring comprehensive control through material selection, interface engineering, and process optimization. Insufficient adhesion can lead to problems across the entire chain, from manufacturing yield to end-product failure, a particularly critical issue in emerging fields such as flexible electronics and power devices. However, existing adhesion testing methods are unable to determine and collect instantaneous data during interface cleavage, resulting in low detection efficiency and poor accuracy. Summary of the Invention

[0004] The embodiments of the present invention provide a method, device, equipment and storage medium for detecting the bonding strength of a thin film, thereby improving the efficiency and accuracy of detecting the bonding strength of the thin film.

[0005] In a first aspect, an embodiment of the present invention provides a method for detecting the bonding strength of a thin film, comprising:

[0006] Controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks;

[0007] Obtaining crack radii of at least two of the cracks;

[0008] The crack growth rate is determined according to at least two of the preset loads and at least two of the crack radii, and the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0009] Optionally, obtaining the crack radius of the crack includes:

[0010] obtaining the morphology of the crack;

[0011] Determining a reference point and at least one crack edge point of the crack on the surface of the film to be tested according to the morphology of the crack, wherein the reference point is a position where the distance between the crack and the surface of the film to be tested in the depth direction is the largest;

[0012] The crack radius is determined based on the reference point and at least one crack edge point.

[0013] Optionally, determining the crack radius according to the reference point and at least one crack edge point includes:

[0014] Obtaining a crack distance between the reference point and each crack edge point;

[0015] The crack radius is determined based on at least one of the crack distances.

[0016] Optionally, obtaining the morphology of the crack includes:

[0017] The film to be tested is scanned by a scanning electron microscope to determine the morphology of the crack.

[0018] Optionally, determining the crack growth rate according to at least two of the preset loads and at least two of the crack radii includes:

[0019] Determining the crack growth rate according to at least two of the preset loads, at least two of the crack radii, and a preset corresponding relationship;

[0020] The preset corresponding relationship is:

[0021] Y=a*X+b;

[0022] Wherein, X represents the preset load, Y represents the crack radius, a represents the crack growth rate, and b represents the internal stress parameter.

[0023] Optionally, determining the crack growth rate according to at least two of the preset loads, at least two of the crack radii, and a preset corresponding relationship includes:

[0024] Determining at least three reference crack growth rates and at least three reference internal stress parameters according to the at least three preset loads, the at least three crack radii, and the preset corresponding relationships;

[0025] The final crack growth rate is determined based on at least three of the reference crack growth rates, and the final internal stress parameter is determined based on at least three of the reference internal stress parameters.

[0026] Optionally, controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks comprises:

[0027] The nanoindenter is controlled to impact different positions of the surface of the film to be tested with at least two different preset loads in a direction perpendicular to the surface of the film to be tested, thereby forming at least two cracks.

[0028] In a second aspect, an embodiment of the present invention further provides a device for detecting the bonding force of a thin film, comprising:

[0029] An indentation module is used to control the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks;

[0030] A scanning module, used for obtaining the crack radius of the crack;

[0031] A determination module is used to determine a crack growth rate according to at least two crack radii, wherein the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0032] In a third aspect, an embodiment of the present invention further provides a device for detecting the bonding strength of a thin film, comprising:

[0033] one or more processors;

[0034] a storage device for storing one or more programs,

[0035] When the one or more programs are executed by the one or more processors, the one or more processors implement the method for detecting the binding force of a thin film according to any embodiment of the present invention.

[0036] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method for detecting the binding force of a thin film according to any embodiment of the present invention.

[0037] This embodiment controls the indentation device to impact different locations on the surface of the film to be tested with a preset load, forming at least two cracks and obtaining the crack radii of the at least two cracks. The crack growth rate is then determined based on the at least two preset loads and the at least two crack radii. Using multiple sets of data to determine the crack growth rate improves detection accuracy and avoids errors caused by a single test. Furthermore, the crack growth rate is calculated using directly observed crack radii to characterize the bonding strength, which is difficult to measure directly. Based on the negative correlation between the crack growth rate and the bonding strength of the film to be tested, the bonding strength can be quantified, eliminating the need for complex and tedious calculations using finite element models, thereby improving the efficiency and reliability of film bonding strength testing.

[0038] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 This is a flow chart of a method for detecting the bonding strength of a thin film provided by an embodiment of the present invention;

[0041] Figure 2 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention;

[0042] Figure 3 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention;

[0043] Figure 4 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention;

[0044] Figure 5 1 is a schematic structural diagram of a device for detecting the bonding strength of a thin film provided in an embodiment of the present invention;

[0045] Figure 6 It is a structural schematic diagram of a film bonding force detection device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0048] Figure 1 This is a flow chart of a method for detecting the bonding strength of a film provided by an embodiment of the present invention. This embodiment is applicable to the case where the bonding strength of a film is detected, such as Figure 1 As shown, an embodiment of the present invention provides a method for detecting the bonding strength of a thin film, comprising:

[0049] S110, controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks.

[0050] Specifically, the indentation device is controlled to apply a preset load of known magnitude at at least two different locations in an area away from the edge of the film to be tested and without obvious defects, so that the indenter of the indentation device presses into the film to be tested, inducing at least two cracks around the indentation at different locations or in the radial direction, and recording the magnitude of the preset load. The preset load can be selected based on the film material, thickness, and expected bonding strength range. It must be able to reliably produce measurable cracks, but must also avoid being too large to cause complete failure of the film to be tested or severe deformation of the substrate that affects the crack morphology. On this basis, the at least two preset loads used to produce the at least two cracks can be different and should cover impacts from lower to higher intensities, so as to observe the response of the film to be tested under different preset loads, produce at least two cracks of different sizes and shapes, and more comprehensively reflect the overall bonding strength of the film to be tested, avoiding misjudgment due to local differences.

[0051] It should be noted that when selecting different positions on the surface of the film to be tested for impact, it is also necessary to ensure that after multiple cracks are formed, sufficient distance is maintained between each crack to avoid mutual interference, which may cause errors in the film bonding strength detection.

[0052] S120. Obtain crack radius of at least two cracks.

[0053] Specifically, the crack radius is a direct indicator for assessing the extent of crack propagation. By measuring the crack radius, the damage to the film under test when subjected to impact can be quantitatively assessed. The damage to the film under test when subjected to impact also, to a certain extent, characterizes the bonding strength of the film under test. After the indentation device impacts the film under test at different locations on the surface with a preset load, the radius of each crack is located and measured by observing the surface of the film under test. The radius of each crack and the corresponding preset load are recorded. By comparing the crack radii formed under different preset loads, the relationship between the preset load and crack propagation can be analyzed, providing data support for the subsequent assessment of the bonding strength of the film under test.

[0054] S130, determining a crack growth rate according to at least two preset loads and at least two crack radii, wherein the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0055] Specifically, the crack growth rate is determined based on at least two preset loads and at least two crack radii, where one preset load corresponds to one crack radius. By taking the ratio of the crack radius to its corresponding preset load, the crack radius increases by micrometers for each centinewton increase in the load acting on the film under test during the set of tests, i.e., the crack growth rate. Furthermore, at least two crack growth rates are determined based on the at least two sets of preset loads and corresponding crack radii. The final crack growth rate is calculated by averaging the at least two crack growth rates, thereby improving test accuracy.

[0056] Furthermore, the crack growth rate measures the ability of the film to resist crack expansion under a preset load. The crack growth rate is negatively correlated with the bonding strength of the film to be tested. The greater the crack growth rate, the greater the increase in the crack radius every time the load on the film to be tested increases by 1 centinewton, and the weaker the film's ability to resist crack growth. This corresponds to a poorer bonding strength of the film to be tested, and it cannot effectively restrain crack growth. Conversely, the smaller the crack growth rate, the smaller the increase in the crack radius every time the load on the film to be tested increases by 1 centinewton, and the stronger the film's ability to resist crack growth. This corresponds to a better bonding strength of the film to be tested, and it can more effectively hinder crack growth. Therefore, the bonding strength of the film to be tested can be evaluated by the crack growth rate, enabling the bonding strength of the film to be tested to be tested, thereby improving detection efficiency.

[0057] This embodiment controls the indentation device to impact different locations on the surface of the film to be tested with a preset load, forming at least two cracks and obtaining the crack radii of the at least two cracks. The crack growth rate is then determined based on the at least two preset loads and the at least two crack radii. Using multiple sets of data to determine the crack growth rate improves detection accuracy and avoids errors caused by a single test. Furthermore, the crack growth rate is calculated using directly observed crack radii to characterize the bonding strength, which is difficult to measure directly. Based on the negative correlation between the crack growth rate and the bonding strength of the film to be tested, the bonding strength can be quantified, eliminating the need for complex and tedious calculations using finite element models, thereby improving the efficiency and reliability of film bonding strength testing.

[0058] Based on the above embodiments, Figure 2 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention. Figure 2 The film bonding strength detection method shown in FIG further explains how to obtain the crack radius. Figure 2 As shown, the method for detecting the binding force of the film includes the following steps:

[0059] S210, controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks.

[0060] S220. Obtain the crack morphology.

[0061] Specifically, high-resolution imaging equipment is used to observe the surface of the film to be tested after impact, and each crack is photographed or scanned to obtain a three-dimensional image of the crack morphology. The three-dimensional image of the crack may include the shape of the crack and the characteristics of the crack edge. The morphology of the crack is obtained by the imaging equipment, which provides a basis for determining the crack radius.

[0062] Optionally, obtaining the crack morphology may include:

[0063] The crack morphology was determined by scanning the film under test using a scanning electron microscope.

[0064] Specifically, by scanning the film to be tested with a scanning electron microscope, the morphological characteristics of the crack can be obtained with high resolution. Specific technical means may include: fixing the film to be tested on the sample stage of the scanning electron microscope, adjusting the acceleration voltage, working distance and detection mode, and using secondary electron or backscattered electron imaging technology to observe the edge, bottom and microstructure of the crack and surrounding materials, and collecting two-dimensional or three-dimensional images. The advantage of this method is that the scanning electron microscope can provide nanometer-level resolution, clearly presenting the subtle features of the crack (such as edge roughness, bifurcation, etc.), and at the same time comprehensively analyzing the geometric morphology of the crack through multi-angle observation or three-dimensional reconstruction; in addition, the non-contact detection of the scanning electron microscope avoids additional damage to the sample, ensures the reliability of the data, and provides a basis for the subsequent accurate measurement of the crack radius and evaluation of the film bonding strength.

[0065] S230, determining a reference point and at least one crack edge point on the surface of the film to be measured according to the shape of the crack, wherein the reference point is a position point where the distance between the crack and the surface of the film to be measured in the depth direction is the largest.

[0066] Specifically, a reference point in the vertical direction and at least one crack edge point in the horizontal direction are determined based on the crack morphology obtained by the imaging device. The reference point is the position point where the crack is at the largest distance from the surface of the film to be tested in the depth direction, which is usually the deepest point where the crack is formed after the film to be tested is impacted. It can be determined by comparing the depths of various points in the crack morphology in the vertical direction; the at least one crack edge point can be any point at the junction of the crack and the undeformed surface of the film to be tested, that is, the boundary point where the crack propagates on the surface of the film to be tested when the surface of the film to be tested is impacted.

[0067] S240: Determine a crack radius based on a reference point and at least one crack edge point.

[0068] Specifically, since the actual center position of the impact may have a slight offset due to factors such as the deviation of the indenter alignment and the asymmetric deformation caused by local material heterogeneity, the radial cracks caused by the actual indentation are often not perfectly symmetrical radials. Therefore, in the same crack, the deepest point of the crack is used as the reference point, and the crack edge point at the junction of at least one crack edge and the film surface is combined to determine the crack radius, so as to achieve independent measurement of each crack. Regardless of whether its shape is regular or symmetrical, this method can determine the crack radius corresponding to each crack. It is suitable for various film materials and has good flexibility. It is not affected by the impact center positioning error, and can accurately measure the degree of crack expansion after the film to be tested is impacted by a preset load, thereby eliminating measurement errors and improving detection accuracy.

[0069] Optionally, determining the crack radius based on the reference point and at least one crack edge point may include:

[0070] Obtain the crack distance between the reference point and each crack edge point;

[0071] A crack radius is determined based on at least one crack distance.

[0072] Specifically, within the same crack, the distance between the reference point and each crack edge point, i.e., the crack distance, is determined, with the reference point as the center. The average of these multiple crack distances, or the maximum value among these multiple crack distances, is then used as the crack radius. This improves detection accuracy and avoids detection errors caused by a single measurement. The crack radius is then recorded along with the corresponding preset load as basic data for subsequent film adhesion analysis. This method of determining crack radius based on crack morphology and geometric characteristics conforms to the basic principles of fracture mechanics, ensuring the scientific and reliable nature of the test results while avoiding complex image processing or data analysis processes, thereby improving the efficiency of adhesion testing.

[0073] S250: Determine a crack growth rate according to at least two preset loads and at least two crack radii, wherein the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0074] This embodiment obtains the morphology of the crack, determines the reference point and at least one crack edge point on the surface of the film to be tested based on the crack morphology, and then determines the crack radius corresponding to each crack based on the reference point and at least one crack edge point, thereby improving the accuracy and flexibility of detection and avoiding detection errors caused by single measurement and actual impact operations.

[0075] Based on the above embodiments, Figure 3 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention. Figure 3 The film bonding strength detection method shown further illustrates how to determine the crack growth rate based on at least two preset loads and at least two crack radii. Figure 3 As shown, the method for detecting the binding force of the film includes the following steps:

[0076] S310, controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks.

[0077] S320: Obtain crack radius of at least two cracks.

[0078] S330: Determine a crack growth rate according to at least two preset loads, at least two crack radii, and a preset corresponding relationship.

[0079] Among them, the crack growth rate is negatively correlated with the bonding strength of the film to be tested, and the preset corresponding relationship is:

[0080] Y=a*X+b;

[0081] Where X represents the preset load, Y represents the crack radius, a represents the crack growth rate, and b represents the internal stress parameter.

[0082] Specifically, according to the theory of fracture mechanics, assuming that there is a linear relationship between the crack radius Y and the preset load X, a preset correspondence between the preset load and the crack radius is constructed: Y = a*X+b, where X represents the preset load, Y represents the crack radius, a represents the crack growth rate, reflecting the crack growth rate as the load increases, and b represents the internal stress parameter, which characterizes the influence of the internal stress of the film on the crack growth, ensuring the scientificity and accuracy of the crack growth rate calculation. An indentation test is performed by using an indentation device to impact different positions on the surface of the film to be tested to obtain at least two sets of data. Each set of data includes the preset load X and the corresponding crack radius Y. The least squares method is then used to perform linear fitting on multiple sets of (X, Y) data to solve the values ​​of a and b. The slope a obtained by fitting is the crack growth rate. The larger its value, the faster the crack growth rate as the load increases, and the weaker the bonding strength of the film to be tested. The internal stress parameter b is used to correct the influence of the internal stress of the film to be tested on the crack growth, so that the evaluation results are closer to the actual working conditions.

[0083] Optionally, determining the crack growth rate according to at least two preset loads, at least two crack radii, and a preset corresponding relationship may include:

[0084] Determining at least three reference crack growth rates and at least three reference internal stress parameters according to at least three preset loads, at least three crack radii, and preset corresponding relationships;

[0085] A final crack growth rate is determined based on at least three reference crack growth rates, and a final internal stress parameter is determined based on at least three reference internal stress parameters.

[0086] Specifically, through at least three preset loads and corresponding at least three crack radii, any two preset loads and their corresponding crack radii form a set of preset corresponding relationship Y=aX+b solutions, so as to obtain at least three reference crack growth rates and reference internal stress parameters by fitting and calculating using the least squares method. Subsequently, the multiple reference crack growth rates are averaged or weighted to determine the final crack growth rate, and the multiple reference internal stress parameters are averaged or weighted to determine the final internal stress parameters. The advantages of this method are: by increasing the number of data points (at least three), the fitting accuracy is improved and the deviation caused by local measurement errors is reduced; the averaging or weighting of multiple groups of reference values ​​further reduces the influence of accidental errors, making the results more stable and reliable; at the same time, the evaluation based on more experimental data can more comprehensively reflect the actual mechanical behavior of the film and provide a more accurate quantitative basis for bonding strength detection.

[0087] This embodiment determines the crack growth rate based on at least two preset loads, at least two crack radii, and a preset corresponding relationship: Y = a*X + b, where X represents the preset load, Y represents the crack radius, a represents the crack growth rate, and b represents the internal stress parameter. This linear fitting allows for rapid determination of the crack growth rate without the need for complex calculations or experimental procedures, improving the efficiency of film adhesion testing.

[0088] Based on the above embodiments, Figure 4 This is a flow chart of another method for detecting the bonding strength of a thin film provided by an embodiment of the present invention. Figure 4 The film bonding strength detection method shown further explains how to control the indentation device to impact different positions of the surface of the film to be tested with a preset load to form at least two cracks. Figure 4 As shown, the method for detecting the binding force of the film includes the following steps:

[0089] S410 , controlling the nanoindenter to impact different positions on the surface of the film to be tested with at least two different preset loads in a direction perpendicular to the surface of the film to be tested, so as to form at least two cracks.

[0090] Specifically, a nanoindenter is used as the indentation device, and its core component is a diamond indenter, which can apply a preset load with high precision. The diamond indenter of the nanoindenter is controlled to apply a load in a direction perpendicular to the surface of the film to be tested to simulate the vertical pressure that the film to be tested may bear in actual use, so as to avoid excessive dispersion of the preset load in the horizontal direction of the film to be tested due to the tilt of the diamond indenter direction, and the generation of cracks on the film to be tested that do not correspond to the preset load. The effect is not corresponding, thereby improving the reliability of the preset load loading. According to the thickness, material properties and expected bonding force range of the film to be tested, at least two different preset loads are set. Under the current preset load, the diamond indenter vertically impacts the surface of the film to be tested, applies the current preset load and maintains it for a certain time before unloading to form the current crack; then the diamond indenter is moved to different positions on the surface of the film to be tested, and the next preset load is applied to the surface of the film to be tested and maintained for a certain time before unloading to form the next crack, so as to form at least two cracks on the surface of the film to be tested.

[0091] S420: Obtain crack radius of at least two cracks.

[0092] S430: Determine a crack growth rate according to at least two preset loads and at least two crack radii.

[0093] Among them, the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0094] This embodiment controls the nanoindenter to impact different locations on the surface of the film under test with at least two different preset loads perpendicular to the surface, thereby forming at least two cracks and improving the reliability of the preset load application. Using the nanoindenter to impact different locations on the surface of the film under test avoids repeated loading at the same location, which can lead to material hardening or accumulated damage and thus cause errors in bonding strength testing, thus ensuring the independence of each test and the accuracy of the data.

[0095] Based on the same inventive concept, Figure 5 FIG. 1 is a schematic structural diagram of a device for detecting the bonding strength of a thin film provided by an embodiment of the present invention. Figure 5 As shown, the film bonding force detection device includes:

[0096] An indentation module 510 is used to control the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks;

[0097] Scanning module 520, used to obtain the crack radius of the crack;

[0098] The determination module 530 is configured to determine a crack growth rate according to at least two crack radii, wherein the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

[0099] The film bonding strength detection device provided in the embodiment of the present invention can execute the film bonding strength detection method provided in any embodiment of the present invention, and has corresponding functional modules and beneficial effects of the execution method, which will not be described in detail here.

[0100] Figure 6 The structural diagram of the bonding force detection device 80 of the film that can be used to implement an embodiment of the present invention is shown. The bonding force detection device of the film is intended to represent various forms of digital computers, such as, laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers and other suitable computers. The bonding force detection device of the film can also represent various forms of mobile devices, such as, personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0101] like Figure 6As shown, the film bonding force detection device 80 includes at least one processor 81 and a memory connected to the at least one processor 81, such as a read-only memory (ROM) 82, a random access memory (RAM) 83, etc., wherein the memory stores a computer program that can be executed by the at least one processor, and the processor 81 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 82 or the computer program loaded from the storage unit 88 into the random access memory (RAM) 83. Various programs and data required for the operation of the film bonding force detection device 80 can also be stored in the RAM 83. The processor 81, ROM 82, and RAM 83 are connected to each other via a bus 84. An input / output (I / O) interface 85 is also connected to the bus 84.

[0102] Multiple components in the film bonding force detection device 80 are connected to an I / O interface 85, including an input unit 86, such as a keyboard and mouse; an output unit 87, such as various types of displays and speakers; a storage unit 88, such as a magnetic disk and optical disk; and a communication unit 89, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 89 allows the film bonding force detection device 80 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0103] The processor 81 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 81 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 81 executes the various methods and processes described above, such as the vehicle runaway detection method.

[0104] In some embodiments, the method for detecting the binding force of a thin film can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 88. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 80 via the ROM 82 and / or the communication unit 89. When the computer program is loaded into the RAM 83 and executed by the processor 81, one or more steps of the method for detecting the binding force of a thin film described above can be performed. Alternatively, in other embodiments, the processor 81 can be configured to execute the method for detecting the binding force of a thin film by any other appropriate means (e.g., by means of firmware).

[0105] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0106] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0107] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0108] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0109] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0110] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0111] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0112] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for detecting the bonding strength of a film, characterized in that: include: Controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks; Obtaining crack radii of at least two of the cracks; The crack growth rate is determined according to at least two of the preset loads and at least two of the crack radii, and the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

2. The method for detecting the bonding strength of a film according to claim 1, wherein: Obtaining the crack radius of the crack includes: obtaining the morphology of the crack; Determining a reference point and at least one crack edge point of the crack on the surface of the film to be tested according to the morphology of the crack, wherein the reference point is a position where the distance between the crack and the surface of the film to be tested in the depth direction is the largest; The crack radius is determined based on the reference point and at least one crack edge point.

3. The method for detecting the bonding strength of a film according to claim 2, wherein: Determining the crack radius according to the reference point and at least one crack edge point comprises: Obtaining a crack distance between the reference point and each crack edge point; The crack radius is determined based on at least one of the crack distances.

4. The method for detecting the bonding strength of a film according to claim 2, wherein: Obtaining the morphology of the crack, comprising: The film to be tested is scanned by a scanning electron microscope to determine the morphology of the crack.

5. The method for detecting the bonding strength of a film according to claim 1, wherein: Determining a crack growth rate according to at least two of the preset loads and at least two of the crack radii comprises: Determining the crack growth rate according to at least two of the preset loads, at least two of the crack radii, and a preset corresponding relationship; The preset corresponding relationship is: Y=a*X+b; Wherein, X represents the preset load, Y represents the crack radius, a represents the crack growth rate, and b represents the internal stress parameter.

6. The method for detecting the bonding strength of a film according to claim 5, wherein: Determining the crack growth rate according to at least two of the preset loads, at least two of the crack radii, and a preset corresponding relationship includes: Determining at least three reference crack growth rates and at least three reference internal stress parameters according to the at least three preset loads, the at least three crack radii, and the preset corresponding relationships; The final crack growth rate is determined based on at least three of the reference crack growth rates, and the final internal stress parameter is determined based on at least three of the reference internal stress parameters.

7. The method for detecting the bonding strength of a film according to claim 1, wherein: Controlling the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks, including: The nanoindenter is controlled to impact different positions of the surface of the film to be tested with at least two different preset loads in a direction perpendicular to the surface of the film to be tested, thereby forming at least two cracks.

8. A device for detecting the bonding strength of a film, characterized in that: include: An indentation module is used to control the indentation device to impact different positions on the surface of the film to be tested with a preset load to form at least two cracks; A scanning module, used for obtaining the crack radius of the crack; A determination module is used to determine a crack growth rate according to at least two crack radii, wherein the crack growth rate is negatively correlated with the bonding strength of the film to be tested.

9. A device for detecting the bonding strength of a film, characterized in that: include: one or more processors; a storage device for storing one or more programs, When the one or more programs are executed by the one or more processors, the one or more processors implement the method for detecting the binding force of a thin film according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method for detecting the bonding force of a thin film as claimed in any one of claims 1 to 7 is implemented.

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