An extendable heat dissipation device, a server and a heat dissipation method

Abstract

The application discloses an extensible heat dissipation device, a server and a heat dissipation method, relates to the technical field of server heat dissipation, and comprises a first heat dissipation mechanism, a second heat dissipation mechanism, a third heat dissipation mechanism and a control mechanism. Auxiliary cooling air flow can be provided through the arrangement of multiple first heat dissipation components and multiple third heat dissipation components. The air flow after heat exchange can be quickly discharged through the arrangement of multiple second heat dissipation components, so that the heat dissipation capacity can be reliably and effectively improved. Multiple heat dissipation channels are formed by at least one of the multiple first heat dissipation components, the multiple third heat dissipation components and the multiple second heat dissipation components, so that the heat dissipation of each monitoring position of the server can be accurately and effectively controlled, and the server can support high-power configuration upgrade.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, and in particular to an extensible heat dissipation device, a server and a heat dissipation method. BACKGROUND

[0002] With the increasingly wide application range of server products, the working environment is becoming more and more complex, and higher quality requirements are put forward for servers. The integration of existing servers is getting higher and higher, and the power consumption is also getting higher and higher, which puts higher and higher requirements on the heat dissipation capacity of the server.

[0003] In the related art, the air cooling heat dissipation of the server is realized by internal fans, and the improvement of the heat dissipation effect depends on the number adjustment and speed adjustment of the fans. In this case, the full-fan starting mode is usually adopted, and the partitioned heat dissipation for key components cannot be realized, which limits the performance upgrade of the server.

[0004] In summary, how to improve the heat dissipation effect while realizing the partitioned heat dissipation control is a technical problem to be solved by those skilled in the art. SUMMARY

[0005] The present application provides an extensible heat dissipation device, which can improve the heat dissipation effect and realize partitioned heat dissipation control, thereby facilitating the performance upgrade of the server. The present application also provides a server and a heat dissipation method comprising the above extensible heat dissipation device.

[0006] The present application provides an extensible heat dissipation device, comprising:

[0007] A first heat dissipation mechanism, comprising a first shell, a plurality of first heat dissipation components arranged in the first shell, and an inner cavity of the first shell for communication with a front window air inlet of a case;

[0008] A second heat dissipation mechanism, comprising a second shell, a plurality of second heat dissipation components arranged in the second shell, and an inner cavity of the second shell for communication with a rear window air outlet of the case;

[0009] A third heat dissipation mechanism located between the first heat dissipation mechanism and the second heat dissipation mechanism, the third heat dissipation mechanism comprising a third shell, a plurality of third heat dissipation components arranged in the third shell, and an inner cavity of the third shell for communication with an auxiliary air vent between the front window air inlet and the rear window air outlet;

[0010] At least one of the plurality of first heat dissipation components and the plurality of third heat dissipation components can be arranged correspondingly with the plurality of second heat dissipation components to form a plurality of heat dissipation paths, and the plurality of heat dissipation paths are used for heat dissipation corresponding to a plurality of monitoring positions in the case;

[0011] A control mechanism is signal connected with the first heat dissipation component, the second heat dissipation component and the third heat dissipation component, and is used for determining the heat dissipation passage to be operated and the corresponding operation information according to the temperature information of each monitoring position.

[0012] The application further provides a server comprising the extendable heat dissipation device according to any one of the preceding aspects.

[0013] The first heat dissipation mechanism and the third heat dissipation mechanism are located in the front window area of the case, and the second heat dissipation mechanism is located in the rear window area of the case.

[0014] A plurality of hard disks and a plurality of processors are arranged in the case, and each of the plurality of hard disks, the plurality of processors and the front window air inlet is a monitoring position.

[0015] A management controller is used for monitoring the temperature information of each monitoring position and is signal connected with the control mechanism.

[0016] The application further provides a heat dissipation method applied to the server according to any one of the preceding aspects, and the heat dissipation method comprises the following steps.

[0017] Temperature information of the plurality of monitoring positions is obtained based on the management controller.

[0018] Based on the plurality of groups of temperature information corresponding to the plurality of monitoring positions and preset mapping information, the heat dissipation passage to be operated and the corresponding operation information are determined, so that the plurality of heat dissipation passages can be operated as required.

[0019] The preset mapping information comprises a mapping relationship between the temperature information of each monitoring position and the operation information of the corresponding heat dissipation passage to be operated.

[0020] Through the application, the first shell cavity of the first heat dissipation mechanism is communicated with the front window air inlet of the case, and the airflow provided by the first heat dissipation assembly can enter the case through the front window air inlet from the first shell cavity to dissipate heat; the third shell cavity of the third heat dissipation mechanism is communicated with the auxiliary air inlet of the case, and the auxiliary cold airflow can be provided by the third heat dissipation assembly between the front window and the rear window of the case to dissipate heat; the inner cavity of the second shell of the second heat dissipation mechanism is communicated with the rear window air outlet of the case, and the airflow after heat exchange can be quickly extracted by the plurality of second heat dissipation assemblies; without modifying the server structure, the heat dissipation capacity can be reliably improved by the first heat dissipation mechanism, the second heat dissipation mechanism and the third heat dissipation mechanism, and the high-power configuration upgrade is supported; a plurality of heat dissipation paths are formed by at least one of the plurality of first heat dissipation assemblies, the plurality of third heat dissipation assemblies and the plurality of second heat dissipation assemblies, the plurality of heat dissipation paths correspond to the heat dissipation of the plurality of monitoring positions, and in actual use, the control mechanism determines the heat dissipation path to be operated and the corresponding operation information according to the temperature information of each monitoring position, so that the plurality of monitoring positions can be accurately and partitioned heat dissipated, the partitioned heat dissipation control is realized, unnecessary energy consumption is reduced, and noise is reduced.

[0021] The application has the beneficial effects that: the auxiliary cooling airflow can be provided by the plurality of first heat dissipation assemblies and the plurality of third heat dissipation assemblies, the airflow after heat exchange can be quickly discharged by the plurality of second heat dissipation assemblies, so that the heat dissipation capacity can be reliably and effectively improved; a plurality of heat dissipation paths are formed by the plurality of first heat dissipation assemblies, at least one of the plurality of third heat dissipation assemblies and the plurality of second heat dissipation assemblies, the plurality of heat dissipation paths correspond to the plurality of monitoring positions, the heat dissipation path to be operated and the corresponding operation information are determined according to the temperature information of the plurality of monitoring positions, so that the accurate heat dissipation of each monitoring position can be individually controlled, and the partitioned heat dissipation control is realized. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0023] Figure 1 An application schematic diagram of an expandable heat dissipation device provided by the embodiments of the application;

[0024] Figure 2 A rear view of Figure 1 ;

[0025] Figure 3 A partial schematic view of Figure 1 ;

[0026] Figure 4 A schematic view of a heat dissipation path provided by the embodiments of the application;

[0027] Figure 5 A flowchart of a heat dissipation method provided by the embodiments of the present application is shown.

[0028] In the above drawings, the following reference signs are used:

[0029] 01 - fan; 1 - first heat dissipation mechanism; 2 - second heat dissipation mechanism; 3 - third heat dissipation mechanism; 4 - fourth heat dissipation mechanism; 5 - case; 6 - auxiliary air vent; 7 - heat dissipation passage;

[0030] 11 - first housing; 12 - first heat dissipation assembly; 21 - second housing; 22 - second heat dissipation assembly; 31 - third housing; 32 - third heat dissipation assembly; 41 - fourth housing; 42 - fourth heat dissipation assembly; 311 - guide surface; 411 - guide area; 412 - connecting area. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0032] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0033] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0034] The embodiment of the present application provides a scalable heat dissipation device, which comprises a first heat dissipation mechanism 1, a second heat dissipation mechanism 2, a third heat dissipation mechanism 3, a control mechanism, please refer to Figure 1 、 Figure 2 .

[0035] The first heat dissipation mechanism 1 comprises a first shell 11 and a plurality of first heat dissipation components 12 arranged in the first shell 11. The inner cavity of the first shell 11 is used to communicate with the front window air inlet of the case 5. The plurality of first heat dissipation components 12 can introduce cold air flow into the case 5 through the front window area of the case 5, so as to cool each key component in the case 5.

[0036] Specifically, the inner cavity of the first shell 11 is communicated with the front window air inlet of the case 5, and the first shell 11 is specifically capable of being detachably connected with the case 5. Through the connection of the first shell 11 and the case 5, the cold air flow provided by the plurality of first heat dissipation components 12 can be sent to the case 5 through the inner cavity of the first shell 11. Specifically, the airflow direction formed by the plurality of first heat dissipation components 12 is consistent with the cooling airflow direction required by the case 5, such as the front window area pointing to the rear window area.

[0037] Specifically, in use, due to the detachable connection of the first shell 11 and the case 5, the plurality of first heat dissipation components 12 in the first shell 11 can actually be changed in model and number according to requirements, so as to meet different heat dissipation requirements.

[0038] The second heat dissipation mechanism 2 includes a second shell 21 and a plurality of second heat dissipation components 22 arranged in the second shell 21. The inner cavity of the second shell 21 is communicated with the rear window air outlet of the case 5, and is specifically used for sending the heat-exchanged air flow out of the machine. The second shell 21 is also detachably connected with the case 5, and the plurality of second heat dissipation components 22 in the second shell 21 can also be changed in model and number according to actual requirements, so as to meet different heat dissipation requirements.

[0039] The third heat dissipation mechanism 3 is arranged between the first heat dissipation mechanism 1 and the second heat dissipation mechanism 2, and can provide auxiliary cold air flow on the cold air flow passage formed by the first heat dissipation mechanism 1 and the second heat dissipation mechanism 2, so as to ensure the cooling effect of the key components in the case 5. Specifically, the third heat dissipation mechanism 3 includes a third shell 31 and a plurality of third heat dissipation components 32 arranged in the third shell 31. The inner cavity of the third shell 31 is communicated with the auxiliary air vent 6 between the front window air inlet and the rear window air outlet of the case 5. The cold air flow provided by the plurality of third heat dissipation components 32 can enter the case 5 through the auxiliary air vent 6, so as to assist the cooling operation of the key components in the case 5.

[0040] The third shell 31 is also specifically detachably connected with the case 5. The model and number of the third heat dissipation components 32 are limited by the structure of the third shell 31. The third heat dissipation components 32 can be replaced or increased according to actual heat dissipation requirements, so as to meet different heat dissipation requirements.

[0041] The first shell 11, the second shell 21 and the third shell 31 in the above process are detachably connected with the case 5. On the basis of the detachable connection, the sealing of the communication between the inner cavity of the shell and the case 5 needs to be ensured, so as to avoid the influence of air leakage on the cooling effect of the internal components of the case 5. The specific sealing measures are not limited, and can be realized by embedding a sealing element in the shell.

[0042] The first heat dissipation components 12, the third heat dissipation components 32 and the second heat dissipation components 22 are arranged correspondingly to form the heat dissipation paths 7. The heat dissipation paths 7 are used to dissipate heat from the monitoring positions in the server cabinet 5. Please refer to Figure 4 .

[0043] In one embodiment, the first heat dissipation components 12 and the second heat dissipation components 22 are arranged correspondingly to form the heat dissipation paths 7. In this case, one first heat dissipation component 12 can correspond to several second heat dissipation components 22 to form one heat dissipation path 7. The cold air provided by the first heat dissipation component 12 is sent into the server cabinet 5 and the heat-exchanged air is extracted by the second heat dissipation components 22 to complete the cooling of the internal components of the server cabinet 5.

[0044] In one embodiment, the third heat dissipation components 32 and the second heat dissipation components 22 are arranged correspondingly to form the heat dissipation paths 7. In this case, one third heat dissipation component 32 can correspond to several second heat dissipation components 22 to form one heat dissipation path 7. The cold air provided by the third heat dissipation component 32 is sent into the server cabinet 5 and the heat-exchanged air is extracted by the corresponding second heat dissipation components 22 to complete the cooling of the internal components of the server cabinet 5.

[0045] In one embodiment, the first heat dissipation components 12, the third heat dissipation components 32 and the second heat dissipation components 22 are arranged correspondingly to form the heat dissipation paths 7. In this case, one first heat dissipation component 12 and one third heat dissipation component 32 can correspond to one second heat dissipation component 22 to form one heat dissipation path 7. The cold air provided by the first heat dissipation component 12 and the third heat dissipation component 32 is sent into the server cabinet 5 and the heat-exchanged air is extracted by the second heat dissipation components 22 to complete the cooling of the internal components of the server cabinet 5.

[0046] The control mechanism is connected to the first heat dissipation components 12, the second heat dissipation components 22 and the third heat dissipation components 32. The control mechanism determines the heat dissipation paths 7 to be operated and the corresponding operation information according to the temperature information of the monitoring positions in the server cabinet 5. The monitoring positions refer to the positions in the server cabinet 5 that need to be monitored and the positions that have over-temperature effect on the cooling of the internal components of the server cabinet 5, such as the positions of the processors and the positions of the air inlets.

[0047] If the temperature of the front window air inlet is high and in the first gradient, heat dissipation is performed through the heat dissipation passage 7 formed by the first heat dissipation assembly 12 and the second heat dissipation assembly 22; if the temperature of the front window air inlet is high and in the second gradient, heat dissipation is performed through the heat dissipation passage 7 formed by the first heat dissipation assembly 12, the third heat dissipation assembly 32 and the second heat dissipation assembly 22, so as to ensure the cooling and heat dissipation effect. In the above manner, the corresponding heat dissipation assembly of the corresponding heat dissipation passage 7 can be controlled according to different requirements, heat dissipation is performed in a targeted manner, and high energy consumption waste is avoided. The multi-stage gradient and the partition control heat dissipation manner can reduce energy consumption and reduce noise.

[0048] If the temperature of a processor at a certain position in the case 5 is high, the corresponding heat dissipation passage 7 is started to perform cooling and cooling operation. Here, corresponding refers to, for example, the processor on the left side of the case 5, and the corresponding heat dissipation passage 7 is the first heat dissipation assembly 12, the second heat dissipation assembly 22 and the third heat dissipation assembly 32 on the left side, and the heat dissipation assembly on the right side can be low-power operation or not operation. In this form, the key components can be cooled in a targeted manner, without starting all heat dissipation assemblies, avoiding energy waste and avoiding noise increase.

[0049] In the embodiment, the heat dissipation passage 7 to be operated and the operation information corresponding to the heat dissipation passage 7 are determined by the temperature information of each monitoring position of the case 5. The operation information is specifically, for example, working parameters such as fan 01 rotating speed.

[0050] On the basis of not changing the original heat dissipation structure of the server, through the setting of the first heat dissipation mechanism 1, the second heat dissipation mechanism 2 and the third heat dissipation mechanism 3, the heat dissipation capacity of the server can be enhanced, and targeted heat dissipation can be performed according to the temperature information of each key component in the case 5, so as to provide reliable heat dissipation capacity for high-function configuration of the server, support high-power configuration upgrade, and realize server performance upgrade.

[0051] In the embodiment, the server can be provided with an invasive heat dissipation structure. On the basis of not damaging the original heat dissipation structure, the heat dissipation capacity can be effectively improved through the setting of the external first heat dissipation mechanism 1, the second heat dissipation mechanism 2 and the third heat dissipation mechanism 3. The first heat dissipation mechanism 1, the second heat dissipation mechanism 2 and the third heat dissipation mechanism 3 all support self-expansion and independently form a module, so as to facilitate high-configuration power upgrade of the server.

[0052] On the basis of the above embodiment, please refer to Figure 1 , Figure 2Further comprising fourth heat dissipation mechanisms 4 located on both sides of the third heat dissipation mechanism 3, the fourth heat dissipation mechanisms 4 each comprise a fourth shell 41 and a plurality of fourth heat dissipation components 42 arranged in the fourth shell 41, and the inner cavity of the fourth shell 41 is used to communicate with the auxiliary air vents 6 on the side of the case 5, and the fourth heat dissipation components 42 corresponding to each fourth heat dissipation mechanism 4 can provide cold air flow to the heat dissipation passage 7 on the corresponding side.

[0053] The fourth heat dissipation mechanism 4 is specifically capable of providing auxiliary cold air flow in cooperation with the third heat dissipation mechanism 3, and the fourth heat dissipation mechanism 4 is located on both sides of the third heat dissipation mechanism 3, where the two sides refer to the two sides perpendicular to the air flow direction of the heat dissipation passage 7.

[0054] The fourth heat dissipation mechanism 4 comprises a fourth shell 41 and a plurality of fourth heat dissipation components 42 arranged in the fourth shell 41, and the plurality of fourth heat dissipation components 42 can be one, two or more. The fourth shell 41 can be detachably connected to the side of the case 5, and the specific detachable connection form is not limited, and the number of fourth heat dissipation components 42 can be increased or decreased according to the specific heat dissipation requirement, or the model of the fourth heat dissipation component 42 can be replaced.

[0055] As specifically applied, the size of the fourth shell 41 is limited by the height of the case 5, and the fourth heat dissipation component 42 can be provided with one or two in the direction perpendicular to the air flow direction of the heat dissipation passage 7, which is specifically determined in combination with the actual scene.

[0056] The inner cavity of the fourth shell 41 can be communicated with the auxiliary air vents 6 on the side of the case 5, so as to introduce auxiliary cold air flow from the side of the case 5 to the inside, and the inner cavity of the third shell 31 is communicated with the auxiliary air vents 6 on the top of the case 5, so as to provide cold air flow from multiple positions to the case 5, improve the heat dissipation capacity, and improve the scalability and cost performance of the server.

[0057] In this embodiment, the fourth heat dissipation components 42 corresponding to each fourth heat dissipation mechanism 4 on each side can provide cold air flow to the heat dissipation passage 7 on the corresponding side, where the corresponding side refers to the same side, such as the left side or the right side, and the left side and the right side are illustrated in the middle position. Figure 1

[0058] Specifically in application, in the case that the temperature of the processor on the left side is relatively high, in addition to starting the first heat dissipation component 12, the second heat dissipation component 22 and the third heat dissipation component 32 on the left side to form a targeted heat dissipation passage 7, the fourth heat dissipation component 42 corresponding to the fourth heat dissipation mechanism 4 on the left side can also be started at the same time, so as to ensure reliable heat dissipation capacity.

[0059] In the case that the temperature at the front window air inlet is relatively high, a plurality of heat dissipation passages 7 and fourth heat dissipation mechanisms 4 on both sides can be started at the same time to ensure the heat dissipation effect.​

[0060] Specifically in application, the correspondence between the temperature information at different key monitoring positions and the corresponding execution instructions can be preset. In actual use, the corresponding execution instructions can be directly called according to the detected temperature information and the preset correspondence. The execution instructions include the heat dissipation passage 7 to be operated and the corresponding operation information, so as to control and manage in a targeted manner, reduce unnecessary energy consumption, and reduce noise while ensuring reliable heat dissipation. If high-power configuration upgrade is required, the structure of the server case 5 does not need to be improved. The heat dissipation capacity can be effectively improved by expanding the modular structure of the first heat dissipation mechanism 1, the second heat dissipation mechanism 2, the third heat dissipation mechanism 3, and the fourth heat dissipation mechanism 4. Specifically, the heat dissipation components can be added or the operation parameters of the heat dissipation components can be changed according to specific needs.

[0061] In addition, due to the detachable connection feature, the first heat dissipation mechanism 1, the second heat dissipation mechanism 2, the third heat dissipation mechanism 3, and the fourth heat dissipation mechanism 4 can be split or combined for use according to different needs. For example, in the scenario of dense deployment of rack servers, only the first heat dissipation mechanism 1 and the second heat dissipation mechanism 2 are installed. For example, in the scenario of open upper part of rack servers, the first heat dissipation mechanism 1, the second heat dissipation mechanism 2, and the third heat dissipation mechanism 3 are installed. For example, in the scenario of independent servers, the first heat dissipation mechanism 1, the second heat dissipation mechanism 2, the third heat dissipation mechanism 3, and the fourth heat dissipation mechanism 4 are completely installed.

[0062] On the basis of any of the above embodiments, please refer to Figure 2 The inner cavity of the fourth shell 41 includes a connection area 412 and a guide area 411. The connection area 412 is provided with a plurality of fourth heat dissipation components 42. The guide area 411 is used to guide the cold air flow provided by the fourth heat dissipation components 42 to the auxiliary air vent 6.

[0063] Through the setting of the guide area 411, the air flow at the outlet position of the fourth heat dissipation component 42 can be reliably sent to the position of the auxiliary air vent 6 on the side of the case 5. After the air flow enters the case 5 through the auxiliary air vent 6, it can be mixed with the air flow formed by the first heat dissipation component 12 and the third heat dissipation component 32 and then transported to the rear window area, so as to achieve the effect of cooling the internal components of the case 5.

[0064] In addition, the guide area 411 can be reliably guided in the form of a slope. After the air flow at the outlet of the fourth heat dissipation component 42 is concentrated, it can be sent to the position of the auxiliary air vent 6 at a relatively fast speed. The relatively fast speed is based on the fact that the area of the guide area 411 is smaller than the area of the connection area 412. When the air flow passes through the guide area 411, the pressure is increased. Therefore, the air flow can enter the case 5 at a relatively fast speed, thereby ensuring the effect of reliably providing auxiliary cold air flow.

[0065] In the embodiment, the shapes of the specific guide area 411 and the connecting area 412 can be set according to actual conditions, and are not limited too much.

[0066] On the basis of any of the above embodiments, refer to Figure 2 , Figure 3 , Figure 4 The third shell 31 is provided with a guide surface 311 on the side away from the third heat dissipation assembly 32, the guide surface 311 is inclined and is used to send the airflow provided by the third heat dissipation assembly 32 to the position of the auxiliary air vent 6 on the top of the case 5.

[0067] The guide surface 311 here can also reliably guide the airflow to the auxiliary air vent 6 on the top of the case 5, so as to reliably send the auxiliary cold airflow provided by the third heat dissipation assembly 32 into the case 5, so as to assist the cooling operation of the components in the case 5. The flow direction of the airflow can be limited by the guide surface 311, and the reliability and effectiveness of the provided airflow can be ensured.

[0068] In the embodiment, the inclined arrangement of the guide surface 311 can provide guidance while also enabling the airflow to quickly pass through the auxiliary air vent 6, ensuring reliable heat dissipation effect. In addition to the arrangement of the guide surface 311, the operating parameters of the fourth heat dissipation assembly 42 can also be adjusted to ensure the heat dissipation effect.

[0069] As Figure 2 The third heat dissipation mechanism 3 is arranged on the top of the case 5, and the two fourth heat dissipation mechanisms 4 are arranged on the side of the case 5, so as to improve the heat dissipation capacity in a combined form. The heat dissipation assemblies corresponding to the third heat dissipation mechanism 3 and the fourth heat dissipation mechanism 4 can be flexibly changed according to specific needs, have expandability, and can ensure the heat dissipation reliability of the server under high-power configuration requirements.

[0070] In order to ensure that the guide surface 311 of the third shell 31 can correspond to the plurality of auxiliary air vents 6, a shunt plate can be added in the third shell 31, the shunt plate is connected to the guide surface 311 to form a shunt area, each shunt area corresponds to an auxiliary air vent 6, each shunt area corresponds to a third heat dissipation assembly 32, and the area of each shunt area gradually decreases in the direction close to the auxiliary air vent 6, so as to accurately send the airflow corresponding to each third heat dissipation assembly 32 to the position of the corresponding auxiliary air vent 6 at a faster speed, ensuring the reliability of the provided auxiliary cold airflow.

[0071] On the basis of any of the above embodiments, refer to Figure 2In the third shell 31, a plurality of third heat dissipation assemblies 32 are arranged along a first direction and / or a second direction; the first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the airflow direction of the heat dissipation passage 7. Wherein, the first direction is the x direction, and the second direction is the y direction, as shown in Figure 2

[0072] The single third heat dissipation mechanism 3 is independently formed as a module. Since the third shell 31 can be detachable relative to the case 5, a plurality of third heat dissipation assemblies 32 can be assembled in the third shell 31 according to actual heat dissipation requirements, and then installed relative to the case 5. The number of third heat dissipation assemblies 32 can be determined according to actual heat dissipation requirements, so as to meet the demand of improving heat dissipation capacity.

[0073] On the basis of any of the above embodiments, it is referred to Figure 1 In the first shell 11, a plurality of first heat dissipation assemblies 12 are arranged along a first direction and a second direction; in the second shell 21, a plurality of second heat dissipation assemblies 22 are arranged along the first direction and the second direction.

[0074] The first direction and the second direction are the x direction and the y direction as shown in Figure 1 The first heat dissipation assembly 12 and the second heat dissipation assembly 22 correspond to the front window air inlet and the rear window air outlet. According to the heat dissipation requirement, the arrangement and the number of the first heat dissipation assembly 12 and the second heat dissipation assembly 22 can be set without changing the server structure, so as to be applicable to high heat dissipation requirement, to improve the server heat dissipation capacity and the server expandability.

[0075] On the basis of any of the above embodiments, the first heat dissipation assembly 12, the second heat dissipation assembly 22, the third heat dissipation assembly 32 and the fourth heat dissipation assembly 42 each include at least one fan 01. In combination with the above, the external design of the heat dissipation assembly relative to the server can support flexible expansion of the number and specifications of the fan 01.

[0076] For the specific application of the first heat dissipation assembly 12, the second heat dissipation assembly 22, the third heat dissipation assembly 32 and the fourth heat dissipation assembly 42, if the specifications of the fan 01 used are the same, the number of the corresponding fan 01 of the first heat dissipation assembly 12, the second heat dissipation assembly 22 and the third heat dissipation assembly 32 can be consistent, so as to form a heat dissipation passage 7. If the corresponding fan 01 of the first heat dissipation assembly 12, the second heat dissipation assembly 22 and the third heat dissipation assembly 32 are both two, then the first heat dissipation assembly 12, the second heat dissipation assembly 22 and the third heat dissipation assembly 32 arranged in the third direction in sequence each include two fans 01. Here, the third direction is the z direction as shown in Figure 2 , Figure 4 ​The z direction in the figure, that is, the air flow direction. The six fans 01 and the corresponding fans 01 of the fourth heat dissipation assembly 42 on the corresponding side can simultaneously reliably dissipate heat for the components to be cooled in the case 5, such as the processor. Figure 4 The solid line, dotted line, and dashed line correspond to different heat dissipation channels 7, and each side includes three heat dissipation channels 7, corresponding to different monitoring positions for heat dissipation. Here, one monitoring position corresponds to multiple or single heat dissipation channels 7, and the number of corresponding positions is not limited.

[0077] The control mechanism is connected to the fan 01 to control the speed of the multiple fans 01 corresponding to each heat dissipation channel 7 according to the temperature information. For example, based on the temperature information, if the temperature is high and needs to be adjusted, the speed of the multiple fans 01 on the corresponding heat dissipation channel 7 can be adjusted to accurately control the heat dissipation process. The speed can be adjusted according to the corresponding relationship between the temperature and the speed to achieve stepless speed regulation. The speed can be calculated based on the corresponding relationship and the obtained temperature, and then adjusted.

[0078] It should be noted that the installation direction of the fan 01 corresponding to the first heat dissipation assembly 12 and the second heat dissipation assembly 22 is consistent with the air flow direction of the front window area of the case 5 pointing to the rear window area.

[0079] In addition to the above-mentioned expandable heat dissipation device, the application also provides a server comprising the expandable heat dissipation device of any of the above-mentioned embodiments, and further comprising a case 5 and a management controller.

[0080] The first heat dissipation mechanism 1 and the third heat dissipation mechanism 3 are located in the front window area of the case 5, and the second heat dissipation mechanism 2 is located in the rear window area of the case 5. The first heat dissipation mechanism 1 and the third heat dissipation mechanism 3 can jointly provide cold air flow to ensure reliable heat dissipation effect of the hard disks and processors in the case 5. Alternatively, the first heat dissipation mechanism 1 provides cold air flow, and the second heat dissipation mechanism 2 extracts the heat-exchanged air flow. The specific heat dissipation mode is determined according to the actual heat dissipation demand.

[0081] The multiple hard disks and multiple processors in the case 5 are arranged in the left-right direction, that is, the y direction in the figure. Figure 4 The front window air inlet position, each hard disk position, and each processor position need to be monitored for temperature. The temperature detection element can be used for temperature monitoring. The temperature detection element feeds back to the control mechanism through the management controller, so that the control mechanism can obtain temperature information and determine the running information of the corresponding heat dissipation channel 7 based on the temperature information to perform targeted heat dissipation.

[0082] Specifically, if there are two processors, each processor has its own control logic, and each control logic corresponds to a heat dissipation path 7 and operating information. During heat dissipation, if a single processor needs cooling, the heat dissipation path 7 corresponding to the other processor may not be activated, or it may be activated with low power consumption, so as to achieve targeted heat dissipation, reduce unnecessary energy consumption, and realize partitioned heat dissipation control for the two processors.

[0083] Based on any of the above embodiments, multiple hard drives and multiple processors are arranged along an airflow direction parallel to the surface of the chassis 5 and perpendicular to the heat dissipation passage 7, wherein the airflow direction of the heat dissipation passage 7 is... Figure 4 The z-direction, specifically the arrangement direction here is... Figure 4 The y-direction in the middle.

[0084] Each hard drive and each processor has its own corresponding heat dissipation path 7, allowing multiple hard drives and multiple processors to be cooled in separate areas. If a local area overheats, the local area can be cooled by increasing the airflow, thus achieving precise heat dissipation control.

[0085] If both processors overheat, the corresponding heat dissipation paths 7 for both processors will be activated, and the two fourth heat dissipation mechanisms 4 will be used to enhance the airflow to ensure reliable heat dissipation for both processors.

[0086] Similarly, if multiple hard drives overheat, the corresponding heat dissipation channels 7 for each hard drive will be activated, along with the activation of the fourth heat dissipation mechanisms 4 on both sides to enhance airflow and ensure reliable heat dissipation for all hard drives.

[0087] In addition to the aforementioned server, this application also provides a heat dissipation method for the aforementioned server; please refer to [reference needed]. Figure 5 The heat dissipation method includes: acquiring temperature information from multiple monitoring locations based on the management controller; determining the heat dissipation path 7 to be operated and its corresponding operating information based on multiple sets of temperature information corresponding to multiple monitoring locations and preset mapping information, so that multiple heat dissipation paths 7 can be operated as needed; wherein, the preset mapping information includes the mapping relationship between the temperature information at each monitoring location and the operating information of the corresponding heat dissipation path 7 to be operated.

[0088] Based on the mapping relationship between monitoring location and heat dissipation path 7, regionalized heat dissipation measures are formed for each monitoring location. Specific heat dissipation measures include the number of fans 01 corresponding to the heat dissipation components, the location of the activated heat dissipation components, and the speed of the fans 01. Taking one specific implementation as an example, if the temperature at the processor location is too high, the mapping relationship is used to determine the heat dissipation path 7 corresponding to this processor, the start / stop information of the fans 01 corresponding to the heat dissipation path 7, and the speed of each fan 01.

[0089] In the embodiment, the plurality of heat dissipation passages 7 are operated as required, where the operation as required refers to operation according to heat dissipation requirements determined based on temperature information, and specifically, one heat dissipation passage 7 can be operated, or a plurality of heat dissipation passages 7 can be operated, without excessive limitation.

[0090] On the basis of any of the above embodiments, the preset mapping information further includes temperature information at each monitoring position and a rotation speed distribution relationship of the plurality of fans 01 corresponding to the heat dissipation passage 7 corresponding to the temperature information.

[0091] Specifically, on the basis of two processors, if the temperature of one of the processors exceeds the threshold value, the rotation speed of the corresponding fan 01 of the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 on the corresponding side can be set to 80%N, 80%N, 60%N, and 100%N in sequence, and the rotation speed of the fan 01 corresponding to the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 on the other side is adjusted to 0 or 20%N. N is the maximum rotation speed of the fan 01. Similarly, when the temperature of the other processor exceeds the threshold value, the rotation speed of the fan 01 on the corresponding side of the other processor is adjusted according to the above, and the rotation speed of the remaining fans 01 is adjusted to 0 or 20%N.

[0092] The temperature information of each monitoring position, the heat dissipation passage 7 corresponding to the temperature information, and the operation information and rotation speed distribution relationship of the heat dissipation passage 7 can form targeted partition temperature regulation and avoid unnecessary energy consumption.

[0093] On the basis of any of the above embodiments, based on the plurality of sets of temperature information corresponding to the plurality of monitoring positions and the preset mapping information, the heat dissipation passage 7 to be operated and the corresponding operation information are determined, including: based on the temperature gradient of the plurality of sets of temperature information corresponding to the plurality of monitoring positions and the mapping relationship of the preset mapping information, determining the heat dissipation passage 7 to be operated and the rotation speed distribution relationship of the plurality of fans 01 corresponding to the heat dissipation passage 7.

[0094] Specifically, after obtaining the plurality of sets of temperature information, the temperature gradient of each temperature is determined, and different rotation speed distributions are allocated to each temperature gradient, so that the heat dissipation can be more accurate.

[0095] For example, the first level threshold of the processor is 80°C, and the second level threshold is 90°C. If the temperature at the processor is between 80°C and 90°C, the rotation speeds of the fans 01 corresponding to the first heat dissipation assembly 12, the second heat dissipation assembly 22, the third heat dissipation assembly 32, and the fourth heat dissipation assembly 42 on the side corresponding to the processor are 60%N, 60%N, 50%N, and 70%N, respectively. If the temperature at the processor exceeds 90°C, the rotation speeds of the fans 01 corresponding to the first heat dissipation assembly 12, the second heat dissipation assembly 22, the third heat dissipation assembly 32, and the fourth heat dissipation assembly 42 on the side corresponding to the processor are 80%N, 80%N, 70%N, and 100%N, respectively. The rotation speed distribution relationship of the multiple fans 01 can be determined according to actual conditions, and is not limited to this embodiment.

[0096] In this embodiment, the different rotation speed distribution relationships corresponding to the multiple level thresholds can further ensure accurate and effective heat dissipation of the components at the monitoring positions.

[0097] Based on the management controller, the temperature information of the multiple monitoring positions is obtained, including the temperature information of the front window air inlet, the hard disk positions, and the processor positions arranged in sequence from the front window region to the rear window region.

[0098] If it is determined based on the temperature information corresponding to the front window air inlet that the temperature at the front window air inlet is in the first gradient, the multiple first heat dissipation assemblies 12 and the multiple second heat dissipation assemblies 22 are controlled to start the multiple heat dissipation channels 7. Specifically, the first heat dissipation mechanism 1 and the second heat dissipation mechanism 2 cooperate to perform heat dissipation work, and the multiple heat dissipation channels 7 correspond to the multiple fans 01 starting. In the first gradient, the multiple fans 01 adjust the rotation speed according to the rotation speed distribution to ensure accurate heat dissipation.

[0099] If it is determined based on the temperature information corresponding to the front window air inlet that the temperature at the front window air inlet is in the second gradient, the multiple first heat dissipation assemblies 12, the multiple third heat dissipation assemblies 32, and the multiple second heat dissipation assemblies 22 are controlled to start the multiple heat dissipation channels 7, and the multiple fourth heat dissipation assemblies 42 corresponding to the fourth heat dissipation mechanism 4 are controlled to start to cooperate with the multiple heat dissipation channels 7. Specifically, the multiple heat dissipation channels 7 are all started to quickly reduce the temperature at the front window air inlet, and the fourth heat dissipation assemblies 42 of the fourth heat dissipation mechanism 4 can provide auxiliary cold air flow to the heat dissipation channels 7 to improve the heat dissipation capacity.

[0100] On the basis of any of the above embodiments, after obtaining the temperature information of the front window air inlet, each hard disk position, and each processor position arranged in sequence from the front window area to the rear window area, the method further comprises: determining whether the temperature is too high based on the temperature information of the processor and a preset temperature value of the processor, and if the temperature is too high, starting the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 corresponding to the side of the processor. The side corresponding to the processor specifically refers to that each processor has a corresponding side heat dissipation passage 7, and the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 included in the heat dissipation passage 7 are all started to accurately and reliably dissipate heat for the processor. At the same time, the heat dissipation components on the side different from the processor are not started to reduce energy consumption and noise.

[0101] The speed distribution relationship between the plurality of fans 01 corresponding to the heat dissipation passage 7 corresponding to the side of the processor is determined based on the gradient information of the temperature of the processor to accurately and effectively control the heat dissipation process.

[0102] On the basis of any of the above embodiments, after obtaining the temperature information of the front window air inlet, each hard disk position, and each processor position arranged in sequence from the front window area to the rear window area, the method further comprises: determining whether the temperature is too high based on the temperature information of the hard disk and a preset temperature value of the hard disk, and if the temperature is too high, starting the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 corresponding to the side of the hard disk.

[0103] If the temperature of the hard disk is too high, the information of the corresponding heat dissipation passage 7 is determined based on the preset mapping information, the first heat dissipation component 12, the second heat dissipation component 22, the third heat dissipation component 32, and the fourth heat dissipation component 42 corresponding to the heat dissipation passage 7 are started, and the remaining heat dissipation components are not started to reduce energy consumption and noise.

[0104] By continuously monitoring the temperature of the monitoring position corresponding to the hard disk, if the temperature is higher than a threshold value, the fan 01 of the corresponding heat dissipation passage 7 is started; if the temperature is lower than the threshold value, the fan 01 of the corresponding heat dissipation passage 7 is stopped.

[0105] The above provides a detailed introduction to the expandable heat dissipation device, the server, and the heat dissipation method. The principles and implementation modes of the present application are described by applying specific examples, and the above examples are only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary technical personnel in the technical field, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. An expandable heat dissipation device, characterized in that, include: The first heat dissipation mechanism (1) includes a first housing (11) and a plurality of first heat dissipation components (12) disposed in the first housing (11). The inner cavity of the first housing (11) is used to connect to the front window air inlet of the chassis (5). The second heat dissipation mechanism (2) includes a second housing (21) and a plurality of second heat dissipation components (22) disposed in the second housing (21). The inner cavity of the second housing (21) is used to communicate with the rear window air outlet of the chassis (5). The third heat dissipation mechanism (3) is located between the first heat dissipation mechanism (1) and the second heat dissipation mechanism (2). The third heat dissipation mechanism (3) includes a third housing (31) and a plurality of third heat dissipation components (32) disposed in the third housing (31). The inner cavity of the third housing (31) is used to connect the auxiliary ventilation port (6) between the front window air inlet and the rear window air outlet. At least one of the plurality of first heat dissipation components (12) and the plurality of third heat dissipation components (32) can be configured to correspond to the plurality of second heat dissipation components (22) to form a plurality of heat dissipation paths (7), the plurality of heat dissipation paths (7) being used to dissipate heat at a plurality of monitoring locations within the chassis (5); The control mechanism is connected to the first heat dissipation component (12), the second heat dissipation component (22), and the third heat dissipation component (32). The control mechanism is used to determine the heat dissipation path (7) to be operated and the corresponding operation information based on the temperature information of each monitoring position.

2. The expandable heat dissipation device according to claim 1, characterized in that, It also includes a fourth heat dissipation mechanism (4) located on both sides of the third heat dissipation mechanism (3). The fourth heat dissipation mechanism (4) includes a fourth housing (41) and at least one fourth heat dissipation component (42) disposed in the fourth housing (41). The inner cavity of the fourth housing (41) is used to connect to the auxiliary ventilation port (6) located on the side of the chassis (5). At least one fourth heat dissipation component (42) corresponding to the fourth heat dissipation mechanism (4) on each side can provide cold airflow to the heat dissipation passage (7) on its corresponding side.

3. The expandable heat dissipation device according to claim 2, characterized in that, The inner cavity of the fourth housing (41) includes a connecting area (412) and a guiding area (411). At least one of the fourth heat dissipation components (42) is provided in the connecting area (412), and the guiding area (411) is used to guide the cold airflow provided by the fourth heat dissipation component (42) to the auxiliary vent (6).

4. The expandable heat dissipation device according to claim 3, characterized in that, The third housing (31) has a guide surface (311) on the side away from the third heat dissipation component (32). The guide surface (311) is inclined and is used to deliver the airflow provided by at least one of the third heat dissipation components (32) to the auxiliary vent (6) located at the top of the chassis (5).

5. The expandable heat dissipation device according to claim 4, characterized in that, Inside the third housing (31), a plurality of the third heat dissipation components (32) are arranged along a first direction and / or a second direction; the first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the airflow direction of the heat dissipation passage (7).

6. The expandable heat dissipation device according to claim 5, characterized in that, Within the first housing (11), a plurality of the first heat dissipation components (12) are arranged along the first direction and the second direction; Inside the second housing (21), a plurality of second heat dissipation components (22) are arranged along the first direction and the second direction.

7. The expandable heat dissipation device according to claim 6, characterized in that, The first heat dissipation component (12), the second heat dissipation component (22), the third heat dissipation component (32), and the fourth heat dissipation component (42) each include at least one fan (01). The control mechanism is connected to the fan (01) to control the speed of the multiple fans (01) corresponding to each heat dissipation path (7) according to the temperature information.

8. A server, characterized in that, include: An expandable heat dissipation device as claimed in any one of claims 1 to 7; The chassis (5) has the first heat dissipation mechanism (1) and the third heat dissipation mechanism (3) located in the front window area of ​​the chassis (5), and the second heat dissipation mechanism (2) located in the rear window area of ​​the chassis (5). The chassis (5) is equipped with multiple hard drives and multiple processors. The locations of the multiple hard drives, the multiple processors, and the front air intake are all monitoring locations. A management controller is used to monitor the temperature information at each of the monitoring locations and is connected to the control mechanism via a signal.

9. The server according to claim 8, characterized in that, The multiple hard drives and the multiple processors are arranged along the airflow direction parallel to the surface of the chassis (5) and perpendicular to the heat dissipation path (7), and each hard drive and each processor has its corresponding heat dissipation path (7).

10. A heat dissipation method, characterized in that, Applied to the server of claim 8 or 9, the heat dissipation method includes: The management controller acquires temperature information from multiple monitoring locations. Based on multiple sets of temperature information corresponding to multiple monitoring locations and preset mapping information, the heat dissipation path (7) to be run and its corresponding running information are determined so that multiple heat dissipation paths (7) can be run as needed. The preset mapping information includes the mapping relationship between the temperature information at each monitoring location and the operation information of the corresponding heat dissipation path (7) that needs to be run.

11. The heat dissipation method according to claim 10, characterized in that, The preset mapping information also includes the temperature information at each monitoring location and the speed distribution relationship of the multiple fans (01) corresponding to the heat dissipation path (7).

12. The heat dissipation method according to claim 11, characterized in that, Based on multiple sets of temperature information corresponding to multiple monitoring locations and preset mapping information, the heat dissipation path (7) to be operated and its corresponding operating information are determined, including: Based on the temperature gradient of the multiple sets of temperature information corresponding to the multiple monitoring locations and the mapping relationship of the preset mapping information, the heat dissipation path (7) to be run and the speed distribution relationship of the corresponding multiple fans (01) are determined.

13. The heat dissipation method according to claim 12, characterized in that, Based on the management controller, temperature information is obtained from multiple monitoring locations, including: obtaining temperature information at the front window air inlet, each of the hard disk locations, and each of the processor locations arranged sequentially from the front window area to the rear window area; If the temperature at the front window air inlet is determined to be at the first gradient based on the temperature information corresponding to the front window air inlet, then the multiple heat dissipation paths (7) formed by the multiple first heat dissipation components (12) and the multiple second heat dissipation components (22) are activated. If the temperature at the front window air inlet is determined to be at the second gradient based on the temperature information corresponding to the front window air inlet, then the multiple heat dissipation paths (7) formed by the multiple first heat dissipation components (12), the multiple third heat dissipation components (32), and the multiple second heat dissipation components (22) are activated, and at least one fourth heat dissipation component (42) corresponding to the fourth heat dissipation mechanism (4) is activated to cooperate with the multiple heat dissipation paths (7).

14. The heat dissipation method according to claim 13, characterized in that, After obtaining the temperature information at the front window air inlet, each of the hard drive locations, and each of the processor locations arranged sequentially from the front window area to the rear window area, the method further includes: Based on the temperature information of the processor and the preset temperature value of the processor, an over-temperature situation is determined. If an over-temperature situation occurs, the first heat dissipation component (12), the second heat dissipation component (22), the third heat dissipation component (32), and the fourth heat dissipation component (42) on the corresponding side of the processor are activated.

15. The heat dissipation method according to claim 14, characterized in that, After obtaining the temperature information at the front window air inlet, each of the hard drive locations, and each of the processor locations arranged sequentially from the front window area to the rear window area, the method further includes: Based on the temperature information of the hard drive and the preset temperature value of the hard drive, an overheating situation is determined. If an overheating situation occurs, the first heat dissipation component (12), the second heat dissipation component (22), the third heat dissipation component (32), and the fourth heat dissipation component (42) on the corresponding side of the hard drive are activated.

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