Inductive element and electronic device

Abstract

The application relates to the technical field of inductance elements, in particular to an inductance element and an electronic device. The inductance element comprises a blank body, at least one layer of inner electrodes, two embedded terminals and two external electrodes. The coil comprises at least one layer of inner electrodes, and the inner electrodes are arranged in the blank body. In the thickness direction of the inner electrodes, the blank body has oppositely arranged bottom and top surfaces, the two embedded terminals are arranged on the side of the bottom surface facing the top surface, each embedded terminal extends on the bottom surface, and each end of the coil is electrically connected with each embedded terminal. The two external electrodes are arranged on the side of the bottom surface away from the top surface. Each external electrode is connected with each embedded terminal in correspondence. The shortest distance between the layer of inner electrodes closest to the bottom surface and the embedded terminal on the bottom surface is D1, the height of the blank body is H, and 0.02*H<=D1<=0.82*H. The inductance element can simultaneously have a higher SRF value, a higher Q value and a larger inductance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inductive elements, and in particular to an inductive element and an electronic device. BACKGROUND

[0002] In electronic circuits, inductive elements are one of the indispensable elements, especially in radio frequency and microwave applications, the performance of inductive elements has an important influence on the working efficiency of the entire circuit. The poor performance of the current inductive elements mainly lies in the difficulty in simultaneously having a high self-resonant frequency (SRF) value, a high Q value and a large inductance. SUMMARY

[0003] Embodiments of the present application disclose an inductive element and an electronic device, which can simultaneously have a high SRF value, a high Q value and a large inductance.

[0004] To achieve the above object, in a first aspect, embodiments of the present application disclose an inductive element, comprising:

[0005] a blank body;

[0006] a coil comprising at least one layer of inner electrodes, the inner electrodes being arranged in the blank body; and

[0007] two embedded terminals, along the thickness direction of the inner electrodes, the blank body has oppositely arranged bottom and top surfaces, the two embedded terminals are arranged on one side of the bottom surface facing the top surface, and each embedded terminal extends on the bottom surface, and each end of the coil is electrically connected to each embedded terminal; and

[0008] two outer electrodes, the two outer electrodes are arranged on the other side of the bottom surface away from the top surface; on the bottom surface, each outer electrode is connected to each embedded terminal correspondingly;

[0009] wherein, along the thickness direction of the inner electrodes, the shortest distance between the layer of inner electrodes closest to the bottom surface and the embedded terminal on the bottom surface is D1, and the height of the blank body is H, satisfying the following relationship: 0.02*H≤D1≤0.82*H.

[0010] In a possible implementation manner of the first aspect, 40 microns≤D1≤160 microns; and / or,

[0011] the height H of the blank body is 150 microns~300 microns; and / or,

[0012] the number of layers of the inner electrodes is 5~25; and / or,

[0013] The thickness T of the inner electrode is 5-25 microns.

[0014] In a possible implementation of the first aspect, along the thickness direction of the inner electrode, the distance D2 between the top surface and the nearest layer of the inner electrode is greater than or equal to 25 microns.

[0015] In a possible implementation of the first aspect, D1-D2 is greater than or equal to 5 microns.

[0016] In a possible implementation of the first aspect, the number of the inner electrodes is multiple layers, the multiple layers of the inner electrodes are arranged in a stacked manner along the thickness direction of the inner electrode, an insulating layer is arranged between each adjacent two layers of the inner electrodes, one connecting part is arranged on each insulating layer, and each adjacent two layers of the inner electrodes are electrically connected by the connecting part therebetween to form the coil.

[0017] In a possible implementation of the first aspect, the connecting part is multiple, and the multiple connecting parts are sequentially arranged along the thickness direction of the inner electrode, and the orthographic projection of each connecting part on the bottom surface is symmetrically arranged with the orthographic projection of another connecting part on the bottom surface.

[0018] In a possible implementation of the first aspect, the blank body is a hexahedron, and along the spacing direction of the two inner embedded terminals, the blank body further has two oppositely arranged side surfaces, and one end of each of the two inner embedded terminals away from each other further extends to the inner side of the side surface, and one end of each of the two outer electrodes away from each other further extends to the outer side of the side surface.

[0019] In a possible implementation of the first aspect, on each side surface, each outer electrode is correspondingly connected with each inner embedded terminal.

[0020] In a possible implementation of the first aspect, the inner embedded terminal further extends on the side surface along the thickness direction of the inner electrode.

[0021] Along the spacing direction of the two inner embedded terminals, at least one inner electrode coincides with the orthographic projection of the inner embedded terminal on the side surface, and the inner electrode and the inner embedded terminal on the side surface have a gap therebetween, and the width of the gap is W, wherein 15 microns≤W≤100 microns.

[0022] In a possible implementation of the first aspect, the blank body further has a front surface and a back surface arranged oppositely.

[0023] In a possible implementation of the first aspect, the inner embedded terminal further extends on the side surface along the thickness direction of the inner electrode, and the orthographic projection of the inner embedded terminal on the front surface is L-shaped.

[0024] Alternatively, the orthographic projection of the inner embedded terminal on the front surface is a straight line.

[0025] In a possible implementation manner of the first aspect, a layer of the inner electrodes closest to the top surface in a thickness direction of the inner electrodes is a top layer inner electrode.

[0026] When the embedded terminal is L-shaped, the top layer inner electrode is projected on the side surface and overlaps the projection of the embedded terminal on the side surface.

[0027] In a second aspect, the embodiments of the present application disclose an electronic device comprising the inductor element as described in the first aspect.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] In the present application, the embedded terminal is arranged on the bottom surface, so that the inner electrodes can increase the distance from the embedded terminal on the bottom surface by moving away from the bottom surface, thereby effectively reducing the parasitic capacitance and improving the SRF value and Q value of the inductor element. Moreover, there is still sufficient space in the blank body for arranging the inner electrodes, so that the inductor element can increase the inductance by increasing the number of layers of the inner electrodes, specifically as follows:

[0030] In the present application, at least part of the embedded terminal is arranged on the side of the bottom surface facing the top surface, so that the inner electrodes can increase the distance from the embedded terminal on the bottom surface by moving away from the bottom surface, thereby reducing the parasitic capacitance and increasing the SRF value and Q value of the inductor element.

[0031] On this basis, the shortest distance between the layer of inner electrodes closest to the bottom surface and the embedded terminal on the bottom surface is D1, and the height of the blank body is H, and the following relationship is satisfied: 0.02*H≤D1≤0.82*H. Wherein, 0.02*H≤D1, the parasitic capacitance of the inner electrodes is significantly reduced, which is reflected in the significant improvement of the SRF value and Q value of the inductor element. Moreover, D1≤0.82*H, so as to leave sufficient space for arranging the inner electrodes, so that the inductor element can increase the inductance by increasing the number of layers of the inner electrodes. In this way, the inductor element can simultaneously have a higher SRF value, a higher Q value and a larger inductance. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0033] Figure 1 is a sectional view of an inductor element;

[0034] Figure 2 is a structural schematic diagram of an inductor element disclosed in the embodiments of the present application.

[0035] Figure 3 A relationship diagram of Q value and SRF of the inductance element disclosed in the embodiment of the present application and D1;

[0036] Figure 4 A schematic diagram of a deformation structure of the inductance element disclosed in the embodiment of the present application;

[0037] Figure 5 A relationship diagram of appearance defect ratio of the inductance element disclosed in the embodiment of the present application and D2;

[0038] Figure 6 An exploded view of the inductance element disclosed in the embodiment of the present application;

[0039] Figure 7 A schematic diagram of a front projection of the inner electrode and the connecting part on the bottom surface; Figure 6

[0040] A schematic diagram of a deformation structure of the embedded terminal disclosed in the embodiment of the present application; Figure 8

[0041] A schematic diagram of a deformation structure of the embedded terminal disclosed in the embodiment of the present application; Figure 9 A schematic diagram of a structure of the electronic device disclosed in the embodiment of the present application.

[0042] Explanation of reference signs:

[0043] 100, inductance element; 1, blank; 101, top surface; 102, bottom surface; 103, side surface; 104, front surface; M2, coil; 2, inner electrode; 2a, top layer inner electrode; 21, lead wire; 3, embedded terminal; 3a, C-shaped terminal; 5, external electrode; 4, insulation layer; 41, connecting part; G, gap; Z, thickness direction of the inner electrode; X, interval direction of two embedded terminals. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0045] In the present application, the terms "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0046] In addition, the above-mentioned terms can be used to represent other meanings in addition to the orientation or positional relationship, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances.

[0047] In addition, the terms "provided with", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally configured; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two devices, elements or components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0048] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and configurations can be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0049] The terminals of the inductive element are mainly used to realize the electrical connection between the inner electrode and the external element. Referring to Figure 1 The terminal of the inductive element 100 in the related art is a C-shaped terminal 3a, which wraps one end of the blank body 1, causing the top surface 101, the side surface 103 and the bottom surface 102 of the blank body 1 to have metal terminals. Considering that the inner electrode 2 needs to be spaced apart from the metal terminal at a certain distance to effectively reduce the parasitic capacitance, when the top surface 101, the side surface 103 and the bottom surface 102 of the blank body 1 all have metal terminals, it is difficult for the inner electrode 2 to maintain a certain distance from the metal terminal. Specifically, when the distance between the inner electrode 2 and the metal terminal on the bottom surface 102 becomes far, the distance between the inner electrode 2 and the metal terminal on the top surface 101 becomes close, and vice versa. This design limitation makes it difficult for such an inductive element 100 to effectively reduce the parasitic capacitance between the inner electrode 2 and the C-shaped terminal 3a, making it difficult to improve the SRF value and the Q value. If the distance between the inner electrode 2 and the C-shaped terminal 3a is increased by reducing the number of layers of the inner electrode 2, the inductance of the inductive element 100 will decrease due to the decrease in the number of layers of the inner electrode 2.

[0050] In summary, the inductive element 100 in the related art is difficult to simultaneously have a high self-resonant frequency (SRF) value, a high Q value and a large inductance.

[0051] The technical solutions of the present application will be described below in conjunction with the embodiments and the drawings.

[0052] Referring toFigure 2 and Figure 3 The embodiment of the present application discloses an inductance element 100, comprising a blank body 1, at least one layer of inner electrode 2, two embedded terminals 3 and two external electrodes 5.

[0053] The coil M2 comprises at least one layer of inner electrode 2, which is arranged in the blank body 1. Along the thickness direction Z of the inner electrode, the blank body 1 has oppositely arranged bottom surface 102 and top surface 101, and the two embedded terminals 3 are arranged on the side of the bottom surface 102 facing the top surface 101, and each embedded terminal 3 extends on the bottom surface 102, and each end of the coil M2 is electrically connected with each embedded terminal 3.

[0054] The two external electrodes 5 are arranged on the side of the bottom surface 102 away from the top surface 101. On the bottom surface 102, each external electrode 5 is connected with each embedded terminal 3 correspondingly.

[0055] Wherein, along the thickness direction Z of the inner electrode, the shortest distance between the layer of inner electrode 2 closest to the bottom surface 102 and the embedded terminal 3 on the bottom surface 102 is D1, and the height of the blank body 1 is H, which satisfies the following relationship: 0.02×H≤D1≤0.82×H. Exemplarily, D1 can be 0.02H, 0.1H, 0.2H, 0.3H, 0.4H, 0.5H, 0.6H, 0.7H, 0.8H or 0.82H.

[0056] The embedded terminal 3 of the present application is arranged on the bottom surface 102, so that the inner electrode 2 can increase the distance from the embedded terminal 3 on the bottom surface 102 by moving away from the bottom surface 102, thereby effectively reducing the parasitic capacitance, and improving the SRF value and Q value of the inductance element 100. Moreover, there is still enough space in the blank body 1 to arrange the inner electrode 2, so that the inductance element 100 can increase its inductance by increasing the number of layers of inner electrode 2, as follows:

[0057] In the present application, at least part of the embedded terminal 3 is arranged on the side of the bottom surface 102 facing the top surface 101, so that the inner electrode 2 can increase the distance from the embedded terminal 3 on the bottom surface 102 by moving away from the bottom surface 102, thereby reducing the parasitic capacitance and increasing the SRF value and Q value of the inductance element 100.

[0058] On this basis, the shortest distance between the inner electrode 2 closest to the bottom surface 102 and the embedded terminal 3 on the bottom surface 102 is D1, and the height of the blank 1 is H, satisfying the following relationship: 0.02*H≤D1≤0.82*H. Wherein, 0.02*H≤D1, the distance between the inner electrode 2 and the embedded terminal 3 on the bottom surface 102 is larger, the parasitic capacitance of the inner electrode 2 is significantly reduced, which is reflected in the SRF value and Q value of the inductance element 100. And D1≤0.82*H, in order to leave enough space to set the inner electrode 2, so that the inductance element 100 can increase its inductance by increasing the number of layers of the inner electrode 2. In this way, the inductance element 100 can simultaneously have higher SRF value, higher Q value and larger inductance.

[0059] It should be noted that the side of the embedded terminal 3 facing the top surface can be uneven, for example Figure 4 In (A) and (B) of the above, the side of the embedded terminal 3 facing the top surface is a slope, and for example Figure 4 In (C) of the above, the side of the embedded terminal 3 facing the top surface is a curved surface, and for example Figure 4 In (D) of the above, the side of the embedded terminal 3 facing the top surface is a wave shape. For the above shaped embedded terminal 3, the shortest distance D1 between the inner electrode 2 closest to the bottom surface 102 and the embedded terminal 3 on the bottom surface 102 is determined as indicated in Figure 4 .

[0060] Optionally, 40 microns≤D1≤160 microns. When D1 satisfies the above distance range, the inner electrode 2 and the embedded terminal 3 are spaced far enough to effectively reduce the parasitic capacitance, thereby improving the SRF value and Q value of the inductance element 100. And there is still enough space in the blank 1 to set the inner electrode 2, so that the inductance element 100 can increase its inductance by increasing the number of layers of the inner electrode 2.

[0061] Optionally, the height H of the blank 1 is 150 microns~300 microns. For example, it is 150 microns, 200 microns, 250 microns or 300 microns. When the height H of the blank 1 satisfies the above height range, the inductance element 100 using the blank 1 can meet the miniaturization requirement. And the height H of the blank 1 is also high enough, under the condition of satisfying D1, the remaining height of the blank 1 can set a large number of inner electrodes 2, so that the inductance element 100 has a higher inductance.

[0062] Optionally, the thickness T of the inner electrode 2 is 5 micrometers to 25 micrometers. For example, it can be 5 micrometers, 10 micrometers, 15 micrometers, 20 micrometers, or 25 micrometers. When the thickness T of the inner electrode 2 meets the above thickness range, the inner electrode 2 is thin enough to allow for a greater number of inner electrodes 2 to be placed in a limited space. Since the number of inner electrodes 2 is equivalent to the number of turns of the conductive coil M2, the inductance is directly proportional to the square of the number of turns of the conductive coil M2. In other words, when the number of inner electrodes 2 is greater, the inductance of the inductor element 100 is increased. Furthermore, the inner electrode 2 within this thickness range is not too thin, thus avoiding problems such as insufficient mechanical strength due to excessive thinness.

[0063] Optionally, the number of layers of the inner electrode 2 is 5 to 25, for example, 5, 10, 15, 20, or 25 layers. Since the inductance of the inductor element 100 is directly proportional to the number of layers of the inner electrode 2, when the inner electrode 2 meets the above-mentioned number of layers, the inductance of the inductor element 100 is relatively large. Furthermore, the number of layers of the inner electrode 2 should not be excessive, to avoid the bottom inner electrode 2 being overly embedded with the terminal 3, which would exacerbate parasitic capacitance.

[0064] Of course, the internal electrode 2 in this application can also be one, two, or three layers.

[0065] In some embodiments, referencing the back Figure 2 Along the thickness direction Z of the inner electrode, the distance D2 between the top surface 101 and the nearest inner electrode 2 is ≥25 micrometers, so that there is sufficient distance between the top surface 101 and the nearest inner electrode 2, avoiding defects and failures of the inner electrode 2 due to collisions, thereby reducing the appearance defects of the inductor 100 caused by collisions, effectively reducing the appearance defect rate of the inductor 100, and thus reducing the failure rate of the inductor 100.

[0066] like Figure 5 As shown, Figure 5 The horizontal axis represents the range of D2, and the vertical axis represents the appearance defect rate of inductor element 100. This appearance defect rate can be obtained through visual inspection. The appearance defect rate P is calculated as follows: P = N / M × 100%; where M is the total number of inductor element samples, and N is the number of samples with appearance defects. Figure 5 It can be seen that when D2 ≥ 25 micrometers, the appearance defect rate of inductor 100 is zero.

[0067] Furthermore, D1 - D2 ≥ 5 micrometers. When D1 and D2 satisfy the above relationship, D1 is at least 5 micrometers larger than D2, making D1 large enough to effectively reduce the parasitic capacitance of the internal electrode 2, so that the inductor 100 can simultaneously have a high SRF value and a high Q value.

[0068] In some embodiments, please refer to Figure 2 ,Figure 6 and Figure 7 The number of the inner electrodes 2 is multiple layers, the multiple layers of the inner electrodes 2 are arranged in a stacking manner along the thickness direction Z of the inner electrode, an insulating layer 4 is arranged between each two adjacent layers of the inner electrodes 2, one connecting part 41 is arranged on each insulating layer 4, and each two adjacent layers of the inner electrodes 2 are electrically connected by the connecting part 41 between the two layers to form a coil M2.

[0069] The connecting part 41 is multiple, the multiple connecting parts 41 are arranged in sequence along the thickness direction Z of the inner electrode, and the orthographic projection of each connecting part 41 on the bottom surface 102 is symmetrically arranged with the orthographic projection of another connecting part 41 on the bottom surface 102.

[0070] Please understand in combination with Figure 6 and Figure 7 From the direction of the top surface 101 to the bottom surface 102, Figure 6 the orthographic projection of the first connecting part 41 and the third connecting part 41 on the bottom surface 102 is symmetrically arranged relative to the symmetry axis AB, Figure 6 the orthographic projection of the second connecting part 41 and the fourth connecting part 41 on the bottom surface 102 is symmetrically arranged relative to the symmetry axis CD. That is, in some embodiments, the orthographic projection of the Nth connecting part 41 on the bottom surface 102 is symmetrically arranged with the orthographic projection of the N+2th connecting part 41 on the bottom surface 102.

[0071] When the connecting part 41 is symmetrically arranged, the connecting part 41 has less influence on the magnetic field, which is beneficial to improve the electromagnetic conversion efficiency of the inductance element 100.

[0072] In the present embodiment, the shape of the coil M2 is, for example, a spiral shape. The coil M2 is sequentially connected by the multiple layers of the inner electrodes 2, in other words, the inductance element 100 of the present application is a laminated inductance, which adopts a multiple layer stacking structure, and the volume is much smaller than that of a traditional wire-wound inductance, which is particularly suitable for the layout requirements of high-density circuit boards.

[0073] More specifically, the material of the insulating layer 4 is, for example, a ceramic material, an organic polymer material or a metal oxide material. The material of the inner electrode 2 is, for example, silver, silver alloy, copper, copper alloy, nickel or nickel alloy.

[0074] The present application forms a vertical electrical connection between different inner electrodes 2 by arranging the connecting part 41 on the insulating layer 4, which is also beneficial to winding the coil M2 between the multiple layers of the inner electrodes 2, increasing the inductance of the inductance element 100, and also beneficial to the insulation between the layers of the inner electrodes 2 to avoid short circuit.

[0075] More specifically, the connecting part 41 is formed in a through hole of the insulating layer 4, the through hole penetrates the insulating layer 4 along the thickness direction Z of the inner electrode, and the through hole is filled with a conductive material to form the connecting part 41, and the conductive material is, for example, a conductive metal such as silver, copper, tin, etc.

[0076] In some embodiments, referring back to Figure 2 The blank 1 is a hexahedron, and has two oppositely arranged side surfaces 103 along the interval direction X of the two embedded terminals.

[0077] The two embedded terminals 3 further extend to the inner side of the side surface 103 at the end away from each other, and the two external electrodes 5 further extend to the outer side of the side surface 103 at the end away from each other.

[0078] In each side surface 103, each external electrode 5 is connected to each embedded terminal 3 correspondingly.

[0079] In the present application, the embedded terminal 3 is partially exposed on the bottom surface 102 and partially exposed on the side surface 103, and the external electrode 5 can be electroplated on the outer surface of the blank 1 through the exposed surface of the embedded terminal 3, that is, the external electrode 5 is a metal plating layer. The external electrode 5 is used for soldering the inductor element 100 on the circuit board, and when the bottom surface 102 and the side surface 103 of the inductor element 100 both have the external electrode 5, the inductor element 100 can be fixed on the circuit board by means of the external electrode 5 on the bottom surface 102 and the side surface 103, thereby improving the fixing effect of the inductor element 100.

[0080] It can be understood that the embedded terminal 3 of the present application can extend on the bottom surface 102 or extend on the bottom surface 102 and the side surface 103, but does not extend to the top surface 101, so as to avoid the situation that when the embedded terminal 3 away from the embedded terminal 3 on the bottom surface 102, it faces the embedded terminal 3 close to the top surface 101.

[0081] Further, the embedded terminal 3 is partially extended on the side surface 103 along the thickness direction Z of the inner electrode. Along the interval direction X of the two embedded terminals, the orthographic projection of at least one inner electrode 2 on the side surface 103 coincides with the embedded terminal 3, and there is a gap G between the inner electrode 2 and the embedded terminal 3 on the side surface 103, and the width W of the gap G is 15 microns≤W≤100 microns. For example, W is 15 microns, 30 microns, 50 microns, 70 microns or 100 microns.

[0082] When the width W of the gap G meets the above distance range, the distance between the inner electrode 2 and the embedded terminal 3 on the side surface 103 is large enough to reduce the parasitic capacitance, thereby improving the SRF value and Q value of the inductor element 100. Moreover, the width W of the gap G is not too large, so that the inner electrode 2 has enough space to expand its area within the loop. Since the inductance of the inductor element 100 is positively correlated with the area within the loop of the inner electrode 2, when the area within the loop of the inner electrode 2 can be further expanded, the inductance of the inductor element 100 is also improved.

[0083] In the embodiments of the present application, the green body 1 also has a front surface 104 and a back surface arranged oppositely, and the inner terminal 3 has various embodiments in the orthographic projection shape on the front surface 104, which will be described below in conjunction with examples.

[0084] In one example, as shown in (A) of Figure 2 and Figure 8 , the inner terminal 3 also extends on the side surface 103 along the thickness direction Z of the inner electrode, and the orthographic projection of the inner terminal 3 on the front surface 104 is L-shaped.

[0085] The L-shaped inner terminal 3 extends a certain length on the side surface 103, which is conducive to plating a certain size of the external electrode 5 on the side surface 103 to enhance the fixing effect of the inductor element 100.

[0086] In the present application, the layer of the inner electrode 2 closest to the top surface 101 along the thickness direction of the inner electrode is the top layer of the inner electrode 2a. Referring to Figure 2 When the inner terminal 3 is L-shaped, the orthographic projection of the top layer of the inner electrode 2a on the side surface 103 coincides with the orthographic projection of the inner terminal 3 on the side surface 103. In this way, the top layer of the inner electrode 2a does not need to be electrically connected to the inner terminal 3 through the lead-out wire 21, which can reduce the risk of short circuit.

[0087] Of course, as shown in (A) of Figure 8 , the orthographic projection of the top layer of the inner electrode 2a on the side surface 103 can also be staggered with the orthographic projection of the inner terminal 3 on the side surface 103, in which case the top layer of the inner electrode 2a needs to be electrically connected to the inner terminal 3 through the lead-out wire 21.

[0088] In another example, referring to (B) of Figure 8 , the orthographic projection of the inner terminal 3 on the front surface 104 is straight-line-shaped. The straight-line-shaped inner terminal 3 has a relatively narrow area on the side surface 103, which is conducive to the expansion of the inner electrode 2 to the two side surfaces 103, and further conducive to the expansion of the area of the inner electrode 2 in the coil to improve the inductance of the inductor element 100.

[0089] Moreover, in (B) of Figure 8 , the orthographic projection of the top layer of the inner electrode 2a on the side surface 103 is staggered with the orthographic projection of the inner terminal 3 on the side surface 103, in which case the top layer of the inner electrode 2a also needs to be electrically connected to the inner terminal 3 through the lead-out wire 21.

[0090] Specifically, the orthographic projection of the straight-line-shaped inner terminal 3 on the front surface 104 is, for example, a rectangle, a right trapezoid, or the like.

[0091] Referring to Figure 9The application further discloses an electronic device comprising the inductive element 100. The inductive element 100 is arranged on a circuit board of the electronic device.

[0092] It can be understood that the inductive element 100 has a high SRF value, can still maintain inductance characteristics at a higher frequency, and thus improves multiple performances of the electronic device in a high-frequency scenario. In addition, the inductive element 100 has a high Q value, and the energy loss of the inductive element 100 with the high Q value is low, which can reduce signal attenuation of the electronic device and improve impedance matching accuracy.

[0093] For example, the electronic device can be a mobile phone, a caller, a locator, a wireless router or a Bluetooth earphone.

[0094] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, but not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application.

Claims

1. An inductor element, characterized in that, include: blank; A coil, comprising at least one inner electrode layer disposed within the blank; Two embedded terminals are provided. Along the thickness direction of the inner electrode, the blank has a bottom surface and a top surface disposed opposite to each other. The two embedded terminals are spaced apart on the side of the bottom surface facing the top surface, and each embedded terminal extends on the bottom surface but does not extend to the top surface. Each end of the coil is electrically connected to each of the embedded terminals. Two external electrodes are spaced apart and disposed on the bottom surface away from the top surface; on the bottom surface, each external electrode is respectively connected to each of the embedded terminals. Wherein, along the thickness direction of the inner electrode, the shortest distance between the inner electrode closest to the bottom surface and the embedded terminal on the bottom surface is D1, and the height of the blank is H, satisfying the following relationship: 0.02×H≤D1≤0.82×H.

2. The inductor element according to claim 1, characterized in that, 40 micrometers ≤ D1 ≤ 160 micrometers; and / or, The height H of the blank is 150 micrometers to 300 micrometers; and / or, The number of layers of the internal electrodes is 5 to 25; and / or, The thickness T of the internal electrode is 5 micrometers to 25 micrometers.

3. The inductor element according to claim 1, characterized in that, Along the thickness direction of the inner electrode, the distance D2 between the top surface and the nearest inner electrode layer is ≥25 micrometers.

4. The inductor element according to claim 3, characterized in that, D1-D2≥5 micrometers.

5. The inductor element according to claim 1, characterized in that, The number of inner electrodes is multiple, and the multiple inner electrodes are stacked along the thickness direction of the inner electrodes. An insulating layer is provided between each two adjacent inner electrodes, and a connecting part is provided on each insulating layer. The two adjacent inner electrodes are electrically connected through the connecting part between them to form the coil. The connection part is a plurality of such connection parts, which are arranged sequentially along the thickness direction of the inner electrode, and the orthographic projection of each connection part on the bottom surface is symmetrically arranged with the orthographic projection of another connection part on the bottom surface.

6. The inductor element according to any one of claims 1 to 5, characterized in that, The blank is a hexahedron, and along the spacing direction of the two embedded terminals, the blank also has two oppositely arranged side surfaces. The ends of the two embedded terminals away from each other extend to the inside of the side surfaces, and the ends of the two external electrodes away from each other extend to the outside of the side surfaces. On each of the aforementioned sides, each of the external electrodes is connected to a corresponding embedded terminal.

7. The inductor element according to claim 6, characterized in that, A portion of the embedded terminal also extends along the thickness direction of the inner electrode on the side surface; Along the spacing direction of the two embedded terminals, at least one of the inner electrodes coincides with the orthographic projection of the embedded terminal on the side surface, and there is a gap between the inner electrode and the embedded terminal on the side surface, the width of the gap being W, wherein 15 micrometers ≤ W ≤ 100 micrometers.

8. The inductor element according to claim 6, characterized in that, The blank also has a front side and a back side that are arranged opposite to each other; The embedded terminal also extends along the thickness direction of the inner electrode on the side surface, and the orthographic projection of the embedded terminal on the front surface is L-shaped. Alternatively, the orthographic projection of the embedded terminal on the front side is a straight line.

9. The inductor element according to claim 8, characterized in that, Along the thickness direction of the inner electrodes, the inner electrode layer closest to the top surface is the top inner electrode; When the embedded terminal is L-shaped, the orthographic projection of the top inner electrode on the side surface coincides with the orthographic projection of the embedded terminal on the side surface.

10. An electronic device, characterized in that, Including the inductor element as described in any one of claims 1 to 9.

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