Wafer-level chip packaging structure and manufacturing method thereof

Abstract

The invention relates to the field of chip packaging, in particular to a wafer-level chip packaging structure and a manufacturing method thereof.The wafer-level chip packaging structure comprises a wafer, the wafer is coated with a first insulating layer, a metal seed layer is sputtered on the first insulating layer, multiple redistribution layers are sequentially arranged on the metal seed layer, and a second insulating layer is arranged at the upper end of each redistribution layer; by arranging the metal seed layer and the multiple redistribution layers between the first insulating layer and the second insulating layer, wafer-level chip packaging is achieved, the stability of the chip is improved, and when cutting is carried out through an ultraviolet laser cutting device, the wafer-level chip can be cut through the metal seed layer and the multiple redistribution layers. The laser cutting pump source in the ultraviolet laser cutting device is subjected to efficient cooling treatment through the cooling device, all-directional uniform heat dissipation of the laser cutting pump source is achieved through the flowing direction change of the liquid cooling solution in the cooling process, the operation stability of the laser cutting pump source is improved, and then the chip cutting quality stability is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a wafer-level chip packaging structure and a manufacturing method thereof. Background Art

[0002] Wafer-level chip packaging is an advanced semiconductor packaging technology that completes the packaging process directly on the entire wafer (before it is cut into individual chips), including wiring, bonding, packaging material coating, testing, and other processes. The wafer is then cut into individual packaged chips. This technology breaks the traditional packaging model of cutting the chips first and then packaging them. It can retain the original chip size to the greatest extent possible and has the advantages of high integration, low signal transmission loss, excellent heat dissipation performance, and controllable costs. It is widely used in fields such as smartphones, the Internet of Things, and automotive electronics, which have strict requirements for miniaturization and high performance. In the prior art, laser cutting is often used for the slicing operation of wafer-level chip packaging structures after they are manufactured, in order to achieve high-precision size control. However, during the laser cutting operation, the pump source, the core component of the laser cutting, is susceptible to overheating. Common heat dissipation methods include liquid cooling plates and cooling fans. When the liquid cooling plate dissipates heat, the long-term unilateral water flow will cause the temperature of the rear section of the flow channel to be higher, resulting in uneven heat dissipation. The processing and manufacturing of the wafer-level chip packaging structure is stable. Summary of the Invention

[0003] The object of the present invention is to provide a wafer-level chip packaging structure and a manufacturing method thereof to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a wafer-level chip packaging structure and a manufacturing method thereof, comprising a wafer, a first insulating layer coated on the wafer, a metal seed layer sputtered on the first insulating layer, multiple layers of redistribution layers sequentially arranged on the metal seed layer, a second insulating layer provided on the upper end of the redistribution layer, and a wiring solder ball provided on the second insulating layer.

[0005] A method for manufacturing a wafer-level chip packaging structure comprises the following steps: Step 1: depositing a first insulating layer on a wafer that meets the requirements of packaging processing, then coating a layer of photoresist on the first insulating layer, and etching the first insulating layer after exposure and development; Step 2: Sputter a metal seed layer on the etched surface, apply a layer of photoresist on the metal seed layer, continue to expose and develop, and then perform electroplating after development to form a distribution layer. The redistribution layer is multi-layered to achieve the rearrangement of the chip circuit; Step 3: Remove excess photoresist and electroplated metal layers, then apply a second insulating layer, form wiring solder balls on the raised metal layer, and finally use ultraviolet laser cutting equipment to cut into independent chips.

[0006] Preferably, the ultraviolet laser cutting equipment includes a laser cutting pump source, and a cooling component is provided on the outside of the laser cutting pump source. The cooling component includes a link plate and two liquid cooling plates, and one side of the two liquid cooling plates is respectively in contact with the two side surfaces of the laser cutting pump source.

[0007] Preferably, a groove is provided on one side of the two liquid cooling plates, and sealing sleeves are provided on both sides of the groove. Two rotating connecting grooves are provided on both sides of the link plate, and the two sealing sleeves of the liquid cooling plate are respectively rotatably plugged into the two sides of the rotating connecting groove.

[0008] Preferably, a sealing groove is opened through the center of the sealing sleeve of the liquid cooling plate, and a switching sealing tube is inserted horizontally through the center of the two sealing grooves of the liquid cooling plate. Several sealing rings are provided on the inner and outer circumferences of the sealing sleeve inserted into the rotating connecting groove and the inner circumference of the switching sealing tube.

[0009] Preferably, a transfer groove is provided in the center of the switching sealing tube, and discharge grooves are provided on both sides of the switching sealing tube passing through the liquid cooling plate, water supply docking holes are provided on both sides of the transfer groove close to the discharge groove, and water outlet docking holes are provided on one side of the discharge groove close to the transfer groove, the water supply docking hole and the water outlet docking hole are arranged on the same side, and a heat dissipation channel is continuously provided in the liquid cooling plate, and the two ends of the heat dissipation channel are respectively connected to the two sealing grooves of the liquid cooling plate.

[0010] Preferably, the diameter of the heat dissipation channel is equal to the diameter of the water supply docking hole and the water outlet docking hole. When one end of the connecting sealing groove of the heat dissipation channel is connected to the water outlet docking hole on one side of the switching sealing tube, one end of the heat dissipation channel connecting to the other sealing groove is in contact with the water supply docking hole on the other side of the switching sealing tube.

[0011] Preferably, a diversion groove is provided in the link plate, and a liquid cooling head is provided on one side of the diversion groove through a threaded connection. One side of the liquid cooling head is plugged into the diversion groove and is provided with a filter cover. Two rotating connecting grooves are respectively connected on both sides of the diversion groove and a transfer groove is provided. The switching sealing tube is located on one side of the transfer groove and is sleeved with a piston sleeve. The switching sealing tube is located on one side of the transfer groove and is provided with a strip groove passing through the piston sleeve.

[0012] Preferably, an electric telescopic rod is horizontally inserted on the side of the link plate away from the diversion groove, and two switching sealing tubes pass through one side of the liquid cooling plate and are jointly sleeved with a push-pull synchronization plate through a constraint ring. One side of the push-pull synchronization plate is connected to the electric telescopic rod, and the horizontal moving distance of the switching sealing tube is less than the length of the strip groove.

[0013] Preferably, the switching sealing tube passes through the liquid cooling plate and is provided with a constraint guide rod on the side away from the push-pull synchronization plate, and a constraint guide sleeve is provided on the side of the liquid cooling plate close to the constraint guide rod. One end of the constraint guide rod is movably inserted through the constraint guide sleeve, and a number of heat dissipation fins are provided on the side of the liquid cooling plate away from the laser cutting pump source.

[0014] Compared with the prior art, the present invention has the following beneficial effects: By setting a metal seed layer and a multi-layer redistribution layer between the first insulating layer and the second insulating layer, wafer-level chip packaging is achieved to improve the stability of the chip. Then, when cutting by an ultraviolet laser cutting device, the laser cutting pump source in the ultraviolet laser cutting device is efficiently cooled by a cooling device. During the cooling process, the flow direction of the liquid cooling solution changes to achieve all-round and uniform heat dissipation of the laser cutting pump source, thereby improving the operational stability of the laser cutting pump source and thereby improving the quality stability of chip cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the packaging structure of the present invention; Figure 2 This is a schematic diagram of the connection structure of the cooling component of the present invention; Figure 3 This is a schematic diagram of the expanded structure of the liquid cooling plate 8 of the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of part A; Figure 5 This is a schematic side cross-sectional view of the connection between the link plate 7 and the liquid cooling plate 8 of the present invention; Figure 6 For the present invention Figure 5 Schematic diagram of part B; Figure 7 For the present invention Figure 5 Schematic diagram of the C part; Figure 8 This is a schematic diagram of the connection between the switching sealing tube 12 and the liquid cooling plate 8 of the present invention; Figure 9 For the present invention Figure 8 Schematic diagram of the D part; Figure 10 It is a schematic diagram of the matching structure of the link plate 7 of the present invention.

[0016] In the figure: wafer 1, first insulating layer 2, metal seed layer 3, redistribution layer 4, second insulating layer 5, wiring solder balls 6, link plate 7, liquid cooling plate 8, rotating connecting groove 9, sealing sleeve 10, heat dissipation channel 11, switching sealing tube 12, transfer groove 13, discharge groove 14, water supply docking hole 15, water outlet docking hole 16, diversion groove 17, liquid cooling head 18, filter cover 19, transfer groove 20, piston sleeve 21, strip groove 22, constraint guide sleeve 23, constraint guide rod 24, electric telescopic rod 25, push-pull synchronization plate 26, heat dissipation fin 27, laser cutting pump source 28. DETAILED DESCRIPTION

[0017] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figures 1-10 , the present invention provides the following technical solutions: A wafer-level chip packaging structure and a manufacturing method thereof include a wafer 1, a first insulating layer 2 coated on the wafer 1, a metal seed layer 3 sputtered on the first insulating layer 2, multiple layers of redistribution layers 4 sequentially arranged on the metal seed layer 3, a second insulating layer 5 provided on the upper end of the redistribution layer 4, and wiring solder balls 6 provided on the second insulating layer 5. The chip circuit is rearranged by the electroplated metal structure provided on the redistribution layer 4.

[0019] A method for manufacturing a wafer-level chip packaging structure comprises the following steps: Step 1: depositing a first insulating layer 2 on a wafer 1 that meets the requirements of packaging processing, then coating a layer of photoresist on the first insulating layer 2, and etching the first insulating layer 2 after exposure and development; Step 2: sputtering a metal seed layer 3 on the etched surface, coating a layer of photoresist on the metal seed layer 3, continuing to expose and develop, and then performing electroplating after the development is completed to form a distribution layer 4. The redistribution layer is multi-layered to achieve a rearrangement of the chip circuit; Step 3: Remove excess photoresist and electroplated metal layer, then apply a second insulating layer 5, form wiring solder balls 6 on the raised metal layer, and finally use ultraviolet laser cutting equipment to cut into independent chips.

[0020] The ultraviolet laser cutting equipment includes a laser cutting pump source 28, and a cooling component is provided on the outside of the laser cutting pump source 28. The cooling component includes a link plate 7 and two liquid cooling plates 8. One side of the two liquid cooling plates 8 is respectively in contact with the two side surfaces of the laser cutting pump source 28. A groove is provided on one side of each of the two liquid cooling plates 8, and sealing sleeves 10 are provided on both sides of the groove. Two rotating connecting grooves 9 are penetrated on both sides of the link plate 7. The two sealing sleeves 10 of the liquid cooling plate 8 are respectively rotated and plugged into the two sides of the rotating connecting groove 9. The two liquid cooling plates 8 can be rotated through the link plate 7. When the two liquid cooling plates 8 are in contact with the link plate 7, the two liquid cooling plates 8 can be stably clamped by bolts to achieve a stable heat exchange effect, and the laser cutting pump source 28 can be clamped and fixed at the same time.

[0021] The sealing sleeve 10 of the liquid cooling plate 8 is provided with a sealing groove in the center, and a switching sealing tube 12 is inserted horizontally through the center of the two sealing grooves of the liquid cooling plate 8. The inner and outer circumferential sides of the sealing sleeve 10 that is inserted into the rotating connecting groove 9 and the inner circumferential side of the switching sealing tube 12 are provided with a number of sealing rings. A transfer groove 13 is provided in the center of the switching sealing tube 12. The switching sealing tube 12 passes through both sides of the liquid cooling plate 8 and is provided with a discharge groove 14. Water supply docking holes 15 are provided on both sides of the transfer groove 13 near the discharge groove 14. Water outlet docking holes 16 are provided on one side of the discharge groove 14 near the transfer groove 13. The water supply docking holes 15 and the water outlet docking holes 16 are arranged on the same side. A heat dissipation channel 11 is continuously provided in the liquid cooling plate 8. The two ends of the heat dissipation channel 11 are respectively connected to the two sealing grooves of the liquid cooling plate 8. The diameter of the heat dissipation channel 11 is equal to the diameter of the water supply docking hole 15 and the water outlet docking hole 16. When the heat dissipation channel 11 is connected to the sealing groove When one end of the heat dissipation channel 11 is connected to the water outlet docking hole 16 on one side of the switching sealing tube 12, the heat dissipation channel 11 is connected to one end of the other sealed through groove and contacts the water supply docking hole 15 on the other side of the switching sealing tube 12. When the liquid cooling plate 8 rotates through the sealing shaft sleeve 10, the position of the connecting groove 9 is rotated under the action of the multi-sealing ring without leakage. Since the heat dissipation channel 11 is simultaneously connected to one of the water supply docking holes 15 and the water outlet docking holes 16, when there is liquid cooling solution in the switching sealing tube 12, the liquid cooling solution will flow into the heat dissipation channel 11 from one of the water supply docking holes 15, and then enter the discharge groove 14 from the water outlet docking hole 16 on the other side connected to the heat dissipation channel 11 and be discharged. Conversely, the liquid cooling solution is fed into the heat dissipation channel 11 on the side where the solution was originally discharged. In this way, the direction of the solution in and out of the heat dissipation channel 11 can be changed at will, which can avoid the problem of uneven heat dissipation of the laser cutting pump source 28. The filter cover 19 can also filter the solution fed in, thereby improving the heat dissipation stability.

[0022] A diversion groove 17 is provided in the link plate 7, and a liquid cooling head 18 is provided on one side of the diversion groove 17 through a threaded plug-in. A filter cover 19 is provided on one side of the liquid cooling head 18. The two sides of the diversion groove 17 are respectively connected to the two rotating connecting grooves 9 and a transfer groove 20 is provided. The switching sealing tube 12 is located on one side of the transfer groove 20 and is sleeved with a piston sleeve 21. The switching sealing tube 12 is located on one side of the transfer groove 20 and is provided with a strip groove 22 passing through the piston sleeve 21. An electric telescopic rod 25 is horizontally plugged into the side of the link plate 7 away from the diversion groove 17. The two switching sealing tubes 12 pass through one side of the liquid cooling plate 8 and are sleeved together with a push-pull synchronization plate 26 through a constraint ring. The push-pull synchronization plate 26 One side is connected to the electric telescopic rod 25, and the horizontal movement distance of the switching sealed tube 12 is less than the length of the strip groove 22. The liquid cooling head 18 is connected to the liquid cooling solution, and the liquid cooling solution can be connected to the two switching sealed tubes 12 at any time through the strip groove 22. At this time, the horizontal movement of the switching sealed tube 12 can realize the docking switching of the water supply docking hole 15 and the water outlet docking hole 16 with the heat dissipation flow channel 11, thereby realizing the change of the circulation direction of the liquid cooling solution in the heat dissipation flow channel 11. The position of the discharge groove 14 of the switching sealed tube 12 can be directly sealed and connected to the return liquid joint pipeline. The electric telescopic rod 25 is telescopically controlled by electric control to realize the position switching of the water supply docking hole 15 and the water outlet docking hole 16 of the switching sealed tube 12.

[0023] The switching sealing tube 12 passes through the liquid cooling plate 8 and is provided with a constraint guide rod 24 on the side away from the push-pull synchronization plate 26. The liquid cooling plate 8 is provided with a constraint guide sleeve 23 on the side close to the constraint guide rod 24. One end of the constraint guide rod 24 movably passes through the plug-in constraint guide sleeve 23, and a plurality of heat dissipation fins 27 are provided on the side of the liquid cooling plate 8 away from the laser cutting pump source 28. The switching sealing tube 12 can move horizontally along the direction of the rotating connecting groove 9. When the liquid cooling plate 8 needs to be rotated through the sealing shaft sleeve 10, the switching sealing tube 12 remains prohibited in the sealing shaft sleeve 10 and rotates together with the sealing shaft sleeve 10 to reduce sealing loss. The setting of the heat dissipation fins 27 can assist the external airflow to assist in cooling and dissipating the liquid cooling plate 8.

[0024] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer-level chip packaging structure and a method for manufacturing the same, characterized in that: The invention comprises a wafer (1), a first insulating layer (2) is coated on the wafer (1), a metal seed layer (3) is sputtered on the first insulating layer (2), a plurality of redistribution layers (4) are sequentially provided on the metal seed layer (3), a second insulating layer (5) is provided at the upper end of the redistribution layer (4), and a wiring solder ball (6) is provided on the second insulating layer (5).

2. A method for manufacturing a wafer-level chip packaging structure according to any one of claim 1, characterized in that: The following steps are involved: Step 1: depositing a first insulating layer (2) on a wafer (1) suitable for packaging processing, then coating a layer of photoresist on the first insulating layer (2), and etching the first insulating layer (2) after exposure and development; Step 2: sputtering a metal seed layer (3) on the etched surface, coating a layer of photoresist on the metal seed layer (3), continuing to perform exposure and development, and performing electroplating after the development is completed to form a distribution layer (4), and then the distribution layer is multi-layered to achieve the re-layout of the chip circuit; Step 3: Remove excess photoresist and electroplated metal layer, then apply a second insulating layer (5), form wiring solder balls (6) on the raised metal layer, and finally use ultraviolet laser cutting equipment to cut to form independent chips.

3. The method for manufacturing a wafer-level chip packaging structure according to claim 2, wherein: The ultraviolet laser cutting equipment includes a laser cutting pump source (28), and a cooling component is provided on the outside of the laser cutting pump source (28). The cooling component includes a link plate (7) and two liquid cooling plates (8), and one side of the two liquid cooling plates (8) is respectively in contact with the two side surfaces of the laser cutting pump source (28).

4. The method for manufacturing a wafer-level chip packaging structure according to claim 3, wherein: A groove is provided on one side of each of the two liquid cooling plates (8), and sealing sleeves (10) are provided on both sides of the groove. Two rotating connection grooves (9) are provided on both sides of the link plate (7), and the two sealing sleeves (10) of the liquid cooling plate (8) are respectively rotatably plugged into the two sides of the rotating connection groove (9).

5. The method for manufacturing a wafer-level chip packaging structure according to claim 4, wherein: A sealing groove is provided through the center of the sealing sleeve (10) of the liquid cooling plate (8), and a switching sealing tube (12) is provided through the center of the two sealing grooves of the liquid cooling plate (8) horizontally. A plurality of sealing rings are provided on the inner and outer peripheral sides of the sealing sleeve (10) plugged into the rotating connecting groove (9) and on the inner peripheral side of the switching sealing tube (12).

6. The method for manufacturing a wafer-level chip packaging structure according to claim 5, wherein: A transfer groove (13) is provided in the center of the switching sealing tube (12), and discharge grooves (14) are provided on both sides of the switching sealing tube (12) passing through the liquid cooling plate (8). Water supply docking holes (15) are provided on both sides of the transfer groove (13) close to the discharge groove (14), and a water outlet docking hole (16) is provided on one side of the discharge groove (14) close to the transfer groove (13). The water supply docking hole (15) and the water outlet docking hole (16) are provided on the same side. A heat dissipation channel (11) is continuously provided in the liquid cooling plate (8), and both ends of the heat dissipation channel (11) are respectively connected to the two sealing through grooves of the liquid cooling plate (8).

7. The method for manufacturing a wafer-level chip packaging structure according to claim 6, wherein: The diameter of the heat dissipation channel (11) is equal to the diameters of the water supply docking hole (15) and the water outlet docking hole (16). When one end of the heat dissipation channel (11) communicating with the sealing groove is connected to the water outlet docking hole (16) on one side of the switching sealing tube (12), one end of the heat dissipation channel (11) communicating with the other sealing groove is in contact with the water supply docking hole (15) on the other side of the switching sealing tube (12).

8. The method for manufacturing a wafer-level chip packaging structure according to claim 7, wherein: A diversion groove (17) is provided in the link plate (7), and a liquid cooling head (18) is provided on one side of the diversion groove (17) through a threaded connection. One side of the liquid cooling head (18) is plugged into the diversion groove (17) and provided with a filter cover (19). Two sides of the diversion groove (17) are respectively connected to the two rotating connection grooves (9) and provided with a transfer groove (20). A switching sealing tube (12) is located on one side of the transfer groove (20) and is sleeved with a piston sleeve (21). A strip groove (22) is provided on the one side of the switching sealing tube (12) that passes through the piston sleeve (21) and is provided with.

9. The method for manufacturing a wafer-level chip packaging structure according to claim 8, wherein: An electric telescopic rod (25) is horizontally inserted on one side of the link plate (7) away from the diversion groove (17), and two switching sealing tubes (12) pass through one side of the liquid cooling plate (8) and are sleeved together with a push-pull synchronization plate (26) through a constraint ring. One side of the push-pull synchronization plate (26) is connected to the electric telescopic rod (25), and the horizontal movable distance of the switching sealing tube (12) is less than the length of the strip groove (22).

10. The method for manufacturing a wafer-level chip packaging structure according to claim 9, wherein: The switching sealing tube (12) passes through the liquid cooling plate (8) and is provided with a restraining guide rod (24) on a side away from the push-pull synchronization plate (26); a restraining guide sleeve (23) is provided on a side of the liquid cooling plate (8) close to the restraining guide rod (24); one end of the restraining guide rod (24) is movably inserted into the restraining guide sleeve (23); and a plurality of heat dissipation fins (27) are provided on a side of the liquid cooling plate (8) away from the laser cutting pump source (28).

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