Image capturing module
By using the capacitance of the electrode pattern in the image capture module to measure the position of the photosensitive circuit board, optical anti-vibration of the photoreceptor shift is achieved, solving the problems of Hall effect components occupying space and increasing costs, and ensuring stable imaging.
Patent Information
- Application Number
- CN202511248940.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2025-10-21
AI Technical Summary
In existing image capture modules, the space occupied by the Hall effect components reduces the space available for other components and increases manufacturing costs. At the same time, the sensor shift optical image stabilization technology requires additional components, resulting in an increase in module size and cost.
By setting a conductive layer and a photosensitive circuit board in the image capture module, the real-time position of the photosensitive circuit board is detected by the capacitance measurement circuit between the electrode patterns. The photosensitive circuit board is moved by an anti-vibration brake to correct the imaging and avoid distortion, thus achieving optical anti-vibration with photoreceptor shift.
Sensor-shift optical image stabilization is achieved without the need for additional components, avoiding increased module space and volume, as well as rising costs, while ensuring image quality.
Smart Images
Figure CN120825633A_ABST
Abstract
Description
Technical Field
[0001] This case relates to optical imaging, and more particularly to an image capture module. Background Art
[0002] The image generated by the image capture module in an electronic device may be out of focus or unable to align with the target object due to external forces such as vibration or shaking (for example, hand shaking). Currently, this phenomenon can be solved by using sensor shift optical image stabilization (Sensor Shift OIS) technology. Specifically, the gyroscope in the electronic device measures the small angle rotation of the electronic device due to external forces to generate a measurement signal. The processor in the electronic device obtains the optical compensation position of the photosensitive element based on the measurement signal. A Hall element is provided in the image capture module, and the magnetic field effect is used to detect the real-time position of the photosensitive element. The processor determines whether the photosensitive element has reached the optical compensation position based on the real-time position. If the photosensitive element has not reached the optical compensation position, the processor sends a compensation signal to the brake to drive the photosensitive element to the optical compensation position, thereby correcting the imaging of the image capture module to avoid distortion.
[0003] However, Hall effect sensors occupy a certain volume, reducing the space available for other components in the image capture module. Furthermore, maintaining the space available for other components would likely increase the size of the image capture module. Furthermore, the addition of additional components to the image capture module also increases its manufacturing cost. Summary of the Invention
[0004] In view of the foregoing, this invention provides an image capture module. The image capture module includes a housing, an anti-vibration brake, a photosensitive circuit board, and a conductive layer. The anti-vibration brake is housed in the housing. The photosensitive circuit board is housed in the housing and coupled to the anti-vibration brake. The photosensitive circuit board includes a substrate, a photosensitive element, and a first electrode pattern. The substrate includes a first surface and a second surface facing each other. The photosensitive element is located on the first surface, and the first electrode pattern is located on the second surface. The conductive layer is located on the inner surface of the housing and has a second electrode pattern. The first and second electrode patterns face each other in a spaced relationship. The anti-vibration brake drives the photosensitive circuit board to move in response to an actuation signal from a control circuit. The control circuit outputs an actuation signal based on a capacitance measurement signal output by a capacitance measurement circuit coupled to the first and second electrode patterns.
[0005] In one embodiment of the above-mentioned image capture module, it further comprises at least one spacer disposed between the photosensitive circuit board and the conductive layer.
[0006] In one embodiment of the above-mentioned image capture module, the conductive layer has at least one protrusion to serve as the at least one spacer to abut against the second surface of the substrate of the photosensitive circuit board.
[0007] In one embodiment of the image capture module, the second electrode pattern is a single conductive region.
[0008] In one embodiment of the image capture module, the first electrode pattern includes a plurality of conductive islands, and each of the conductive islands at least partially overlaps with the conductive region of the second electrode pattern.
[0009] In an embodiment of the image capture module, a vertical projection of each of the conductive islands onto the conductive layer has an overlapping region and a remaining region, the overlapping region is located within the conductive region, and the remaining region is located outside the conductive region.
[0010] In one embodiment of the above-mentioned image capture module, the multiple conductive islands include four first conductive islands, wherein two of the first conductive islands have vertical projections onto the conductive layer located on a first axis passing through the center of the conductive area, and the other two first conductive islands have vertical projections onto the conductive layer located on a second axis passing through the center of the conductive area, and the first axis and the second axis are orthogonal to each other.
[0011] In one embodiment of the above-mentioned image capture module, the plurality of first conductive islands have the same shape and size.
[0012] In an embodiment of the above-mentioned image capture module, the plurality of conductive islands further include two second conductive islands located on both sides of one of the plurality of first conductive islands.
[0013] In one embodiment of the above-mentioned image capture module, the plurality of second conductive islands have the same shape and size.
[0014] In one embodiment of the image capture module, the conductive region is a fourfold rotational symmetry pattern, and the plurality of conductive islands include four first conductive islands, which are respectively arranged corresponding to four symmetric points passing through the fourfold rotational symmetry pattern.
[0015] In an embodiment of the above-mentioned image capture module, the four-fold rotationally symmetrical figure is a square, and the four symmetric points are the four corners of the square.
[0016] In an embodiment of the above-mentioned image capture module, the four-fold rotationally symmetrical figure is a square, and the four symmetric points are located on four sides of the square.
[0017] In an embodiment of the above-mentioned image capture module, the plurality of conductive islands further include two second conductive islands located at asymmetric points of the four-fold rotationally symmetric pattern.
[0018] In summary, according to some embodiments, the present invention utilizes the capacitance between the first and second electrode patterns to detect the real-time position of the photosensitive circuit board (specifically, its photosensitive element). This anti-vibration brake then shifts the photosensitive circuit board (specifically, its photosensitive element) to correct the image captured by the image capture module, thereby preventing image distortion caused by external forces such as vibration or shaking (e.g., hand shaking). This allows the present invention to implement photoreceptor-shift optical anti-vibration technology without requiring additional components within the image capture module, thereby avoiding a reduction in the space available for other components within the image capture module, an increase in the size of the image capture module, and an increase in the manufacturing cost of the image capture module. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 Schematic diagram of a stereoscopic image capture module according to some embodiments of the present invention.
[0020] Figure 2 Schematic cross-sectional view of the image capture module of some embodiments of the present invention.
[0021] Figure 3 Schematic diagram of an exploded view of the image capture module in some embodiments of the present invention.
[0022] Figure 4 FIG. 2 is a partial block diagram of an image capture module according to some embodiments of the present invention.
[0023] Figure 5 Schematic top view of the photosensitive circuit board of some embodiments of the present invention.
[0024] Figure 6 Schematic bottom view of the photosensitive circuit board of some embodiments of the present invention.
[0025] Figure 7 Schematic diagram of the photosensitive circuit board, the conductive layer and the spacer according to some embodiments of the present invention.
[0026] Figure 8 Schematic diagram of the conductive layer in some embodiments of the present invention.
[0027] Figure 9 Schematic bottom view of the photosensitive circuit board of some embodiments of the present invention.
[0028] Figure 10 Schematic bottom view of the photosensitive circuit board of some embodiments of the present invention.
[0029] The accompanying drawings illustrate:
[0030] 10: Image capture module
[0031] 20: Shell
[0032] 21: Cover
[0033] 211: Cover
[0034] 213:Framework
[0035] 215:Piercing
[0036] 23: Bottom plate
[0037] SF1: Surface
[0038] 30: Anti-vibration brake
[0039] 31: Actuator bracket
[0040] 40: Photosensitive circuit board
[0041] 41:Substrate
[0042] 411: first surface
[0043] 413: Second surface
[0044] 43: Photosensitive parts
[0045] 45: first electrode pattern
[0046] 451A~451D: first conductive island
[0047] 452A~452B: Second conductive island
[0048] OA: Overlap Area
[0049] RA: Remaining area
[0050] A1: First axis
[0051] A2: Second axis
[0052] C: Center
[0053] 50: conductive layer
[0054] 55: second electrode pattern
[0055] CA: Conductive Area
[0056] 60: Capacitance measurement circuit
[0057] 70: Control circuit
[0058] 80: Spacer
[0059] 81: First convex part
[0060] 100: Lens
[0061] 101: Lens actuator
[0062] 102: Flexible circuit board
[0063] 103: Filter
[0064] 104: substrate support DETAILED DESCRIPTION
[0065] Reference Figures 1 to 4 . Figure 1 2 is a schematic three-dimensional diagram of the image capture module 10 according to some embodiments of the present invention. Figure 2 Schematic cross-sectional view of the image capture module 10 according to some embodiments of the present invention. Figure 3 FIG. 1 is an exploded diagram of the image capture module 10 according to some embodiments of the present invention. Figure 4 This is a partial block diagram of an image capture module 10 according to some embodiments of the present invention. The image capture module 10 is suitable for being installed in an electronic device (not shown). The electronic device may include, but is not limited to, a smartphone, tablet computer, laptop computer, standalone camera, drone, or other device with image capture capabilities.
[0066] The image capture module 10 includes a housing 20, an anti-vibration brake 30, a photosensitive circuit board 40, and a conductive layer 50. The housing 20 is hollow and has a storage space. The anti-vibration brake 30 and the photosensitive circuit board 40 are accommodated in the storage space of the housing 20. In some embodiments, the housing 20 includes a cover 21 and a bottom plate 23. The cover 21 includes a cover plate 211 and a frame 213. The frame 213 is located between the cover plate 211 and the bottom plate 23 and surrounds the cover plate 211 and the bottom plate 23.
[0067] The photosensitive circuit board 40 is coupled to the anti-vibration brake 30. The anti-vibration brake 30 is, for example, a shape memory alloy (SMA) actuator or a motor actuator. The motor actuator can be implemented as a stepper motor or a voice coil motor. In some embodiments, an actuator bracket 31 is positioned between the photosensitive circuit board 40 and the anti-vibration brake 30 and is supported on the photosensitive circuit board 40. The anti-vibration brake 30 is mounted on the actuator bracket 31. Thus, the anti-vibration brake 30 is fixed to the photosensitive circuit board 40 via the actuator bracket 31 and can drive the photosensitive circuit board 40 to move.
[0068] Reference Figure 5 and Figure 6 . Figure 5 Schematic top view of the photosensitive circuit board 40 in some embodiments of the present invention. Figure 6 Schematic diagram of a bottom view of a photosensitive circuit board 40 in some embodiments of the present invention. The photosensitive circuit board 40 includes a substrate 41, a photosensitive element 43, and a first electrode pattern 45. The substrate 41 includes a first surface 411 and a second surface 413 opposite to each other. The photosensitive element 43 is located on the first surface 411. The first electrode pattern 45 is located on the second surface 413. In some embodiments, as Figure 2 and Figure 3 As shown, the first surface 411 faces the cover 21 of the housing 20 , and the second surface 413 faces the bottom plate 23 of the housing 20 .
[0069] like Figures 1 to 4 As shown, the conductive layer 50 is located on the inner surface of the housing 20. Specifically, the conductive layer 50 is located on the surface SF1 of the bottom plate 23 of the housing 20 that faces the cover plate 211. The conductive layer 50 has a second electrode pattern 55. The first electrode pattern 45 and the second electrode pattern 55 face each other separately. In other words, the first electrode pattern 45 and the second electrode pattern 55 are adjacent to each other and do not contact each other.
[0070] like Figure 4 As shown, a capacitance measurement circuit 60 is coupled to the first electrode pattern 45 and the second electrode pattern 55. The capacitance measurement circuit 60 is used to measure the change in capacitance between the first electrode pattern 45 and the second electrode pattern 55 to generate and output a capacitance measurement signal. The capacitance measurement circuit 60 can be implemented as a circuit composed of at least one of passive components (resistors, inductors, and capacitors) and active components (transistors). In some embodiments, the capacitance measurement circuit 60 is disposed in an electronic device. In other embodiments, the capacitance measurement circuit 60 is disposed in the image capture module 10, for example, the capacitance measurement circuit 60 is housed in the housing 20 of the image capture module 10.
[0071] like Figure 4As shown, the control circuit 70 is coupled to the anti-vibration brake 30 and the capacitance measurement circuit 60. The control circuit 70 is, for example, a computing circuit such as a microprocessor or a specific integrated circuit. In some embodiments, the control circuit 70 is disposed in an electronic device. In other embodiments, the control circuit 70 is disposed in the image capture module 10, for example, within the housing 20 of the image capture module 10. The control circuit 70 outputs an actuation signal to the anti-vibration brake 30 based on the capacitance measurement signal, thereby driving the anti-vibration brake 30 to cause the photosensitive circuit board 40 to move. Specifically, the anti-vibration brake 30, in response to the actuation signal from the control circuit 70, causes the photosensitive circuit board 40 (specifically, its photosensitive element 43) to move. As the photosensitive circuit board 40 moves, the capacitance between the first electrode pattern 45 and the second electrode pattern 55 changes. The control circuit 70 obtains the capacitance change from the capacitance measurement signal and, based on the capacitance change and Gauss's law, determines the displacement of the photosensitive circuit board 40. In this way, the control circuit 70 can detect position changes of the photosensitive circuit board 40, that is, can detect the real-time position of the photosensitive circuit board 40. Based on the detected real-time position of the photosensitive circuit board 40 and the optically compensated position of the photosensitive circuit board 40 (for example, based on the vector difference between the real-time position and the optically compensated position), the control circuit 70 generates an actuation signal, thereby driving the anti-vibration brake 30 to move the photosensitive circuit board 40 precisely to the optically compensated position, thereby correcting the image produced by the image capture module 10 to avoid distortion.
[0072] In this way, the present invention can implement the optical anti-shake technology of photosensitive shift without setting up additional position detection components (such as Hall elements) in the image capture module 10, thereby avoiding the reduction of the space available for accommodating other components in the image capture module 10, the increase of the volume of the image capture module 10, and the increase of the manufacturing cost of the image capture module 10.
[0073] Reference Figure 7 , schematically illustrating a photosensitive circuit board 40, a conductive layer 50, and a spacer 80 in some embodiments of the present invention. In some embodiments, the image capture module 10 further includes at least one spacer 80. The spacer 80 is interposed between the photosensitive circuit board 40 and the conductive layer 50 to maintain a distance between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50. This ensures that the first electrode pattern 45 and the second electrode pattern 55 do not contact each other and are spaced a specific distance apart, thereby enabling the first electrode pattern 45 and the second electrode pattern 55 to form a capacitive effect and generate capacitance. In some embodiments, the spacer 80 does not contact at least one of the first electrode pattern 45 and the second electrode pattern 55.
[0074] Reference Figure 7 and Figure 8 . Figure 8Schematic diagram of the conductive layer 50 in some embodiments of the present invention. In some embodiments, the conductive layer 50 has at least one protrusion (hereinafter referred to as the first protrusion 81). Figure 8 Four first protrusions 81 are shown, but the present invention is not limited thereto. The number of first protrusions 81 can be adjusted based on user needs. The first protrusions 81 serve as spacers 80 and abut against the second surface 413 of the substrate 41 of the photosensitive circuit board 40 to maintain the spacing between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50, thereby ensuring that the first electrode pattern 45 and the second electrode pattern 55 can form a capacitive effect to generate capacitance. In some embodiments, the first protrusions 81 are dispersed around the conductive layer 50, for example, the first protrusions 81 are dispersed around a single surface of the conductive layer 50. In some embodiments, the first protrusions 81 and the second electrode pattern 55 are located on the same surface of the conductive layer 50. In other embodiments, the first protrusions 81 and the second electrode pattern 55 are located on opposite surfaces of the conductive layer 50. The surface of the conductive layer 50 where the first protrusions 81 are located faces the photosensitive circuit board 40, while the surface of the conductive layer 50 where the second electrode pattern 55 is located faces the bottom plate 23 of the housing 20.
[0075] In some embodiments, the photosensitive circuit board 40 further includes at least one protrusion (hereinafter referred to as a second protrusion) (not shown). The second protrusion serves as a spacer 80 and abuts the conductive layer 50 (specifically, the surface of the conductive layer 50 facing the photosensitive circuit board 40) to maintain the spacing between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50, thereby ensuring that the first electrode pattern 45 and the second electrode pattern 55 can form a capacitive effect to generate capacitance. In some embodiments, the second protrusion is dispersed around the substrate 41 of the photosensitive circuit board 40. For example, the second protrusion is dispersed around a single surface of the substrate 41 of the photosensitive circuit board 40. In some embodiments, the second protrusion is located on the second surface 413 of the substrate 41 of the photosensitive circuit board 40.
[0076] In some embodiments, the second electrode pattern 55 is a single integral conductive area CA. Figure 8 As shown, in one example, the conductive layer 50 can be implemented by a single conductor (e.g., a single metal body), and since the entire conductor is the conductive area CA, the entire conductor can be regarded as the second electrode pattern 55. In another example, the conductive layer 50 can be implemented by the substrate 41, and the second electrode pattern 55 is the conductive area CA that is formed as a whole on the surface of the substrate 41 of the conductive layer 50.
[0077] Reference Figure 9, is a bottom-up schematic diagram of a photosensitive circuit board 40 according to some embodiments of the present invention. The first electrode pattern 45 includes a plurality of conductive islands (e.g., first conductive islands 451A-451D and second conductive islands 452A-452B). Each conductive island at least partially overlaps with the conductive area CA of the second electrode pattern 55. The overlap between the conductive islands and the conductive area CA of the second electrode pattern 55 creates a capacitive effect, generating capacitance.
[0078] like Figure 9 As shown, in some embodiments, the vertical projection of each conductive island onto the conductive layer 50 has an overlapping area OA and a residual area RA. The overlapping area OA is located within the conductive area CA of the second electrode pattern 55, and the residual area RA is located outside the conductive area CA of the second electrode pattern 55. During the displacement of the photosensitive circuit board 40, the area of the overlapping area OA will change. When the area of the overlapping area OA changes, the capacitance between the first electrode pattern 45 and the second electrode pattern 55 will also change accordingly and have a corresponding capacitance change. In this way, the displacement of the photosensitive circuit board 40 (that is, the position change) can be known by the capacitance change and Gauss's law. In other words, the real-time position of the photosensitive circuit board 40 can be known. In some embodiments, the area of the overlapping area OA is negatively correlated with the area of the residual area RA. Specifically, the area of the overlapping area OA and the residual area RA are complementary to each other. In some embodiments, the overlapping area OA and the residual area RA of each conductive island are connected to each other.
[0079] like Figure 9 As shown, in some embodiments, the plurality of conductive islands include four first conductive islands 451A to 451D. The vertical projections of two first conductive islands (such as the first conductive islands 451A and 451C) onto the conductive layer 50 are located on the first axis A1 passing through the center C of the conductive area CA of the second electrode pattern 55. The vertical projections of the other two first conductive islands (such as the first conductive islands 451B and 451D) onto the conductive layer 50 are located on the second axis A2 passing through the center C of the conductive area CA of the second electrode pattern 55. The first axis A1 and the second axis A2 are orthogonal to each other. Thus, as shown in Table 1, the capacitance change corresponding to the translation (i.e., displacement on the X-axis and / or Y-axis) of the photosensitive circuit board 40 during the displacement process can be measured by the area change of the overlapping area OA of the plurality of first conductive islands 451A to 451D, and the translation amount of the photosensitive circuit board 40 can be determined by the capacitance change and Gauss's law. In some embodiments, the multiple first conductive islands 451A~451D have the same shape and size, so that the corresponding capacitance change of the photosensitive circuit board 40 can be accurately measured by the area change of the overlapping region OA of the multiple first conductive islands 451A~451D.
[0080] like Figure 9As shown, in some embodiments, the plurality of conductive islands further include two second conductive islands 452A-452B. The plurality of second conductive islands 452A-452B are located on both sides of one of the plurality of first conductive islands 451A-451D. For example, the second conductive island 452A is located on the left side of the first conductive island 451A, and the second conductive island 452B is located on the right side of the first conductive island 451A. Thus, as shown in Table 1, the capacitance change corresponding to the rotation of the photosensitive circuit board 40 during the displacement process (i.e., the displacement along the Z axis, where the Z axis is the lens axis or the photosensitive element axis) can be measured by the area change of the overlapping region OA of the plurality of second conductive islands 452A-452B, and the rotation amount of the photosensitive circuit board 40 can be known by the capacitance change and Gauss's law. In some embodiments, the plurality of second conductive islands 452A-452B have the same shape and size, so that the capacitance change corresponding to the rotation of the photosensitive circuit board 40 can be accurately measured by the area change of the overlapping region OA of the plurality of second conductive islands 452A-452B.
[0081] [Table 1]
[0082]
[0083]
[0084] Reference Figure 9 and Figure 10 . Figure 10 Schematic diagram of a bottom view of the photosensitive circuit board 40 of some embodiments of the present case. In some embodiments, the conductive area CA of the second electrode pattern 55 is a fourfold rotational symmetry pattern, such as a square, a windmill pattern composed of four sectors, a cross, a four-petal flower pattern, etc. The multiple first conductive islands 451A to 451D of the first electrode pattern 45 respectively correspond to the four symmetry points of the fourfold rotational symmetry pattern. The multiple symmetry points are points on the same symmetry orbit of the fourfold rotational symmetry pattern, which belong to the same set of rotational equivalence classes (equivalence class under rotation), also known as cyclic symmetry points. In one example, as Figure 9 As shown in FIG, the four-fold rotationally symmetrical figure is a square, and the four symmetry points are located on the four sides of the square. In another example, as Figure 10 As shown, the four-fold rotational symmetry figure is a square, and the four symmetry points are the four corners of the square. Figure 9 As shown, the plurality of second conductive islands 452A-452B of the first electrode pattern 45 are located at asymmetric points of the four-fold rotationally symmetric figure. The asymmetric points do not belong to the same rotationally equivalent class and are not located on the same symmetric orbit.
[0085] In some embodiments, in addition to determining the translation amount of the photosensitive circuit board 40 by the area change of the overlapping region OA of the plurality of first conductive islands 451A-451D, the rotation amount of the photosensitive circuit board 40 can also be determined by the area change of the overlapping region OA of the plurality of first conductive islands 451A-451D. Specifically, Figure 10 As shown in Table 2, the capacitance change corresponding to the translation and rotation of the photosensitive circuit board 40 during the displacement process can be measured by the area change of the overlapping region OA of the multiple first conductive islands 451A~451D, and the translation and rotation of the photosensitive circuit board 40 can be determined by the capacitance change and Gauss's law.
[0086] [Table 2]
[0087]
[0088]
[0089] Reference Figures 1 to 3 . In some embodiments, the image capture module 10 further includes multiple other components, such as a lens 100, a lens actuator 101, a flexible circuit board 102, a filter 103, and a substrate support 104. The cover plate 211 of the housing 20 has a through-hole 215. The lens 100 is located in the through-hole 215 to be embedded in the housing 20. The lens actuator 101 is coupled to the lens 100 to compensate the lens 100 to a corresponding optical compensation position. In some embodiments, the lens actuator 101 and the anti-vibration brake 30 can be integrated into a single actuator. The flexible circuit board 102 is coupled to the photosensitive circuit board 40 and an external electronic device (not shown) of the image capture module 10 to transmit signals between the photosensitive circuit board 40 and the external electronic device. The substrate support 104 stands on the photosensitive circuit board 40, and the filter 103 is mounted on the substrate support 104. Thus, the filter 103 is fixed to the photosensitive element 43 of the photosensitive circuit board 40 via the substrate bracket 104. Specifically, the filter 103 overlaps the photosensitive element 43 and is aligned with the lens 100. In some embodiments, the filter 103 and the photosensitive element 43 are substantially the same size.
[0090] In summary, according to some embodiments, the present invention utilizes the capacitance between the first and second electrode patterns to detect the real-time position of the photosensitive circuit board (specifically, its photosensitive element). This anti-vibration brake then shifts the photosensitive circuit board (specifically, its photosensitive element) to correct the image captured by the image capture module, thereby preventing image distortion caused by external forces such as vibration or shaking (e.g., hand shaking). This allows the present invention to implement photoreceptor-shift optical anti-vibration technology without requiring additional components within the image capture module, thereby avoiding a reduction in the space available for other components within the image capture module, an increase in the size of the image capture module, and an increase in the manufacturing cost of the image capture module.
Claims
1. An image capture module, characterized in that: Include: case; an anti-vibration brake housed in the housing; A photosensitive circuit board is housed in the housing, coupled to the anti-vibration brake, and includes a substrate, a photosensitive element, and a first electrode pattern. The substrate includes a first surface and a second surface opposite to each other. The photosensitive element is located on the first surface, and the first electrode pattern is located on the second surface. and a conductive layer located on an inner surface of the housing and having a second electrode pattern, wherein the first electrode pattern and the second electrode pattern face each other separately; The anti-vibration brake responds to an actuation signal from a control circuit to drive the photosensitive circuit board to move. The control circuit outputs the actuation signal according to a capacitance measurement signal output by a capacitance measurement circuit coupled to the first electrode pattern and the second electrode pattern.
2. The image capture module according to claim 1, wherein: The invention also comprises at least one spacer located between the photosensitive circuit board and the conductive layer.
3. The image capture module according to claim 2, wherein: The conductive layer has at least one protrusion serving as the at least one spacer to abut against the second surface of the substrate of the photosensitive circuit board.
4. The image capture module according to claim 1, wherein: The second electrode pattern is a single integral conductive area.
5. The image capture module according to claim 4, wherein: The first electrode pattern includes a plurality of conductive islands, and each of the conductive islands at least partially overlaps with the conductive region of the second electrode pattern.
6. The image capture module according to claim 5, wherein: A vertical projection of each of the conductive islands onto the conductive layer comprises an overlapping region and a remaining region, wherein the overlapping region is located within the conductive region, and the remaining region is located outside the conductive region.
7. The image capture module according to claim 5, wherein: The multiple conductive islands include four first conductive islands, wherein the vertical projections of two of the first conductive islands onto the conductive layer are located on a first axis passing through the center of the conductive area, and the vertical projections of the other two first conductive islands onto the conductive layer are located on a second axis passing through the center of the conductive area, and the first axis and the second axis are orthogonal to each other.
8. The image capture module according to claim 7, wherein: The plurality of first conductive islands have the same shape and size.
9. The image capture module according to claim 7, wherein: The plurality of conductive islands further include two second conductive islands located on both sides of one of the plurality of first conductive islands.
10. The image capture module according to claim 9, wherein: The plurality of second conductive islands have the same shape and size.
11. The image capture module according to claim 5, wherein: The conductive region is a fourfold rotational symmetry pattern, and the plurality of conductive islands include four first conductive islands, which are respectively arranged corresponding to four symmetric points passing through the fourfold rotational symmetry pattern.
12. The image capture module according to claim 11, wherein: The four-fold rotationally symmetrical figure is a square, and the four symmetric points are the four corners of the square.
13. The image capture module according to claim 11, wherein: The four-fold rotationally symmetrical figure is a square, and the four symmetry points are located on the four sides of the square.
14. The image capture module according to claim 11, wherein: The plurality of conductive islands further include two second conductive islands located at asymmetric points of the four-fold rotationally symmetric pattern.