Electronic device and parameter correction method
By integrating sensing circuits, strain sensing circuits and processors in electronic devices, establishing a linked database, and updating the external parameters of the sensing circuits in real time, the positioning error problem of electronic devices during structural elastic deformation is solved, thereby improving operational efficiency and accuracy.
Patent Information
- Application Number
- CN202411612864.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-24
- Filing Date
- 2024-11-13
- Publication Date
- 2025-10-24
AI Technical Summary
Existing technologies have difficulty in real-time calibration of external parameters between sensing circuits in electronic devices, especially when the structure undergoes elastic deformation, resulting in positioning errors and failing to meet the real-time calibration requirements of lightweight and thin electronic devices.
By combining multiple sensing circuits, strain sensing circuits, storage devices, and processors, a linked database is established to update external parameters between the sensing circuits in real time. Rapid correction is achieved by utilizing the correlation between strain sensing values and external parameters.
It achieves real-time updating of the external parameters of the sensing circuit, improves the operating efficiency and positioning accuracy of the electronic device, adapts to the needs of structural elastic deformation, and avoids the time consumption of traditional methods based on image analysis.
Smart Images
Figure CN120831085A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present disclosure relate to an electronic device and a parameter correction method. In particular, embodiments of the present disclosure relate to an electronic device with self-tracking function and a parameter correction method. BACKGROUND
[0002] In the future, the development trend of electronic devices such as head-mounted display devices will inevitably be towards the direction of thinness. In the structural design of electronic devices such as head-mounted display devices, the trend of using elastic design instead of rigid design will be more obvious. However, the opportunity for structural elastic deformation will also be greater. The sensing devices or sensing circuits provided on the electronic device will be separated from the fixed position due to the deformation of the electronic device. The relative position and relative rotation between the sensing devices or sensing circuits of the electronic device will no longer be a fixed value, and the correction of the relative position and relative rotation needs to be more real-time, faster and more flexible to maintain the operating performance of the electronic device.
[0003] Various methods have been proposed to calibrate external parameters, including the relative position and relative rotation between sensing devices or sensing circuits. However, these calibration methods must be performed by capturing images through cameras. Data collection and analysis based on captured images require a long time and are difficult to respond in real time.
[0004] Moreover, the above-mentioned methods can only correct the external parameters between cameras, and other non-image capturing devices such as depth sensors and gyroscopes cannot be corrected in real time, which can easily cause positioning errors.
[0005] Therefore, when the electronic device undergoes structural elastic deformation, how to calibrate the external parameters between the sensing devices or sensing circuits of the electronic device in real time is a problem to be solved. SUMMARY
[0006] Some embodiments of the present disclosure relate to an electronic device. The electronic device includes a plurality of sensing circuits, a plurality of strain sensing circuits, a storage device, and a processor. The plurality of sensing circuits are used to obtain a plurality of sensing values to locate the electronic device. The plurality of strain sensing circuits are used to obtain a plurality of strain sensing values corresponding to the deformation of the electronic device. The storage device is used to store a linkage database, wherein the linkage database includes a linkage relationship between a plurality of test strain sensing value groups and a plurality of corresponding test external parameter groups. The processor is coupled to the plurality of sensing circuits, the plurality of strain sensing circuits, and the storage device. The processor is used to update a plurality of external parameters between the plurality of sensing circuits according to the plurality of strain sensing values and the linkage database.
[0007] In some embodiments, the processor is further configured to: obtain a first test strain sensing value set from the plurality of test strain sensing value sets corresponding to the plurality of strain sensing values; obtain a first test external parameter set from the plurality of test external parameter sets corresponding to the first test strain sensing value set according to the linking database; and update the plurality of external parameters between the plurality of sensing circuits according to the first test external parameter set.
[0008] In some embodiments, the processor is further configured to: establish the linking database according to the plurality of test strain sensing value sets and the corresponding plurality of test external parameter sets based on a plurality of load conditions.
[0009] In some embodiments, the processor is further configured to: obtain a first test strain sensing value set from the plurality of strain sensing circuits based on a first load condition from the plurality of load conditions; obtain a first test external parameter set corresponding to the first load condition according to images captured by a plurality of cameras from the plurality of sensing circuits when the electronic device is deformed based on the first load condition; and establish the linking relationship between the first test strain sensing value set and the first test external parameter set based on the first load condition.
[0010] In some embodiments, the processor is further configured to: perform a structural stress analysis on the electronic device to obtain a plurality of representative positions of the electronic device; wherein the plurality of strain sensing circuits are disposed at the plurality of representative positions.
[0011] In some embodiments, the processor is further configured to: update the plurality of external parameters according to the linking database when the deformation of the electronic device is within an elastic range; and re-establish the linking database when the deformation of the electronic device is not within the elastic range.
[0012] In some embodiments, the processor is further configured to: determine whether the deformation of the electronic device is within the elastic range according to the linking database.
[0013] Some embodiments of the present disclosure relate to a parameter calibration method. The parameter calibration method is applicable to an electronic device. The parameter calibration method comprises the following steps: obtaining, by a plurality of sensing circuits of the electronic device, a plurality of sensing values to locate the electronic device; obtaining, by a plurality of strain sensing circuits of the electronic device, a plurality of strain sensing values corresponding to a deformation of the electronic device; storing, by a storage device of the electronic device, a linkage database, wherein the linkage database comprises a linkage relationship between a plurality of test strain sensing value groups and a plurality of test external parameter groups corresponding thereto; and updating, by a processor of the electronic device, a plurality of external parameters between the plurality of sensing circuits according to the plurality of strain sensing values and the linkage database.
[0014] In some embodiments, further comprising: obtaining a first test strain sensing value group of the plurality of test strain sensing value groups corresponding to the plurality of strain sensing values; obtaining a first test external parameter group of the plurality of test external parameter groups corresponding to the first test strain sensing value group according to the linkage database; and updating the plurality of external parameters between the plurality of sensing circuits according to the first test external parameter group.
[0015] In some embodiments, further comprising: obtaining, by the plurality of strain sensing circuits, a first test strain sensing value group based on a first load case of a plurality of load cases; obtaining a first test external parameter group corresponding to the first load case according to a plurality of images captured by a plurality of cameras of the plurality of sensing circuits when the electronic device is deformed based on the first load case; and establishing the linkage relationship between the first test strain sensing value group and the first test external parameter group based on the first load case.
[0016] It should be noted that the above description and the following detailed description are exemplary of the claimed application and are intended to assist in understanding the claimed application. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more obvious and easy to understand, the following is a description of the accompanying drawings:
[0018] Figure 1 is a schematic diagram of an electronic device according to some embodiments of the present disclosure.
[0019] Figure 2 is a schematic diagram of a user operating an electronic device as shown in Figure 1 is a schematic diagram of a user operating an electronic device as shown in
[0020] Figure 3A is a schematic diagram of an electronic device before deformation according to some embodiments of the present disclosure.
[0021] Figure 3B is a deformed state of an electronic device according to some embodiments of the present disclosure.
[0022] Figure 4 is a flowchart of a parameter correction method according to some embodiments of the present disclosure.
[0023] Figure 5 is a flowchart of a parameter correction method according to some embodiments of the present disclosure. Figure 4 is a flowchart of one of the steps in
[0024] Figure 6 is a flowchart of one of the steps in Figure 4 is a flowchart of one of the steps in
[0025] Figure 7 is a flowchart of one of the steps in Figure 6 is a flowchart of one of the steps in
[0026] Figure 8 is a flowchart of one of the steps in Figure 6 is a flowchart of one of the steps in
[0027] Symbol explanation:
[0028] 100: electronic device
[0029] 110A, 110B, 110C: sensing circuit
[0030] 130A, 130B: strain sensing circuit
[0031] 150: processor
[0032] 170: storage device
[0033] 10: HMD device
[0034] 20: tracking device
[0035] U: user
[0036] M: environmental coordinate system
[0037] R: real space
[0038] X1, Y1, Z1: direction
[0039] D0: state
[0040] D1: deformed state
[0041] X2, Y2, Z2: direction
[0042] Xa, Ya: coordinate
[0043] Xb, Yb: coordinates
[0044] PB1a, PB2a, PB1b, PB2b: Location
[0045] PA1a, PA2a, PA3a, PA1b, PA2b, PA3b: Location
[0046] 400: Parameter correction method
[0047] S410, S430: Steps
[0048] S411, S413, S415, S417, S419: Steps
[0049] S431, S435, S437, S439: Steps
[0050] S437a, S437b, S437c: Steps
[0051] S439a, S439b: Steps DETAILED DESCRIPTION
[0052] The following disclosure provides many different embodiments or illustrations for implementing different features of the present disclosure. The components and configurations in the specific illustrations are used to simplify the present disclosure in the following discussion. Where appropriate, the same reference numerals are used between the drawings and in the corresponding text to represent the same or similar components.
[0053] It should be understood that in the description herein and the appended claims, although the terms "first," "second," etc. may be used to describe various elements, these elements should not be limited to the fact that these terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and, similarly, a second element may be referred to as a first element, without departing from the scope of the embodiments.
[0054] It should be understood that in the description herein and the appended claims, the terms "include," "comprise," "have," "contain," and similar terms should be interpreted as open ended, ie, meaning including but not limited to.
[0055] It should be understood that in this description and the claims that follow, "and / or" includes any and all combinations of one or more of the associated listed items.
[0056] See also Figure 1 . Figure 1 is a schematic diagram of an electronic device 100 according to some embodiments of the present disclosure. Figure 1As shown, the electronic device 100 includes a plurality of sensing circuits 110A to 110C, a plurality of strain sensing circuits 130A and 130B, a processor 150, and a storage device 170. The plurality of sensing circuits 110A to 110C, the plurality of strain sensing circuits 130A and 130B, and the storage device 170 are coupled to the processor 150.
[0057] It is to be noted that, Figure 1 The electronic device 100 in the above description is merely for illustrative purposes, and the present embodiment is not limited thereto.
[0058] The storage device 170 stores one or more programs and can be executed by the processor 150 to perform the parameter correction method.
[0059] In some embodiments, the electronic device 100 can be a head-mounted display (HMD) device, a tracking device, or any other device with self-tracking function.
[0060] In some embodiments, the storage device 170 stores a simultaneous localization and mapping (SLAM) module. The electronic device 100 can execute the SLAM module. The SLAM module includes functions such as image capturing, image feature extraction, and localization based on the extracted features. In some embodiments, the SLAM module includes a SLAM algorithm, wherein the processor 150 accesses and processes the SLAM module to localize the electronic device 100 based on images captured by the camera of the electronic device 100. Details of the SLAM system are not described herein.
[0061] Specifically, in some embodiments, the electronic device 100 can be applied in a virtual reality (VR) / mixed reality (MR) / augmented reality (AR) system. For example, the electronic device 100 can be implemented by a standalone head-mounted display device (HMD) or a VIVE HMD.
[0062] In some embodiments, the processor 150 can be implemented by one or more processing circuits, such as a central processing circuit and / or a micro-processing circuit, but is not limited thereto. In some embodiments, the storage device 170 includes one or more storage modules, each of which includes or collectively includes a computer-readable storage medium. The non-transitory computer-readable storage medium can include a read-only memory (ROM), a flash memory, a disk drive, a hard disk, an optical disk, a solid-state disk, a magnetic tape, a database accessible from a network, and / or any storage medium having the same function as can be conceived by those skilled in the art to which the present disclosure belongs.
[0063] In some embodiments, the sensing circuits 110A-C can be optical elements, depth sensors, gyroscopes, inertial measurement units, or any other circuits with sensing functions. In some embodiments, some of the sensing circuits 110A-C can be cameras with image capturing functions, while some other of the sensing circuits 110A-C can be depth sensors, gyroscopes, or inertial measurement units without image capturing functions.
[0064] In some embodiments, the strain sensing circuits 130A and 130B can be strain gauges or any other circuits with strain sensing functions.
[0065] In some embodiments, the electronic device 100 further includes display circuits, I / O circuits, and other circuits. In some embodiments, the display circuits cover the user's field of view and display virtual images at the user's field of view.
[0066] Please refer to Figure 2 . Figure 2 is a schematic diagram of a user U operating an electronic device 100 as shown in Figure 1 .
[0067] As shown in Figure 2 , the user U wears an HMD device 10 on his head and holds a tracking device 20 in his hand. In some embodiments, Figure 2 , the HMD device 10 and the tracking device 20 represent Figure 1 , the electronic device 100.
[0068] In some embodiments, Figure 1 , the sensing circuits 110A-C obtain a plurality of sensing values corresponding to the real space R operated by the electronic device 100. The sensing values can be pictures, inertial measurement data, gravity sensing data, or any other data sensed by the sensing circuits 110A-C. In some embodiments, the processor 150 establishes an environment coordinate system M corresponding to the real space R based on the plurality of sensing values obtained by the sensing circuits 110A-C. In some embodiments, the processor 150 obtains a device pose of the electronic device 100 in the environment coordinate system M based on the sensing values, such as feature points in images captured by cameras. When the electronic device 100 moves in the real space R, the processor 150 tracks the device pose of the electronic device 100 in the environment coordinate system M. In some embodiments, Figure 1 , the processor 150 positions the electronic device in the environment coordinate system M established based on the real space R based on the sensing values.
[0069] In other embodiments, the environment coordinate system M may be a virtual reality environment coordinate system, an augmented reality environment coordinate system, or a mixed reality environment coordinate system. In some embodiments, the device posture of the electronic device 100 includes a position and a rotation angle.
[0070] When calculating the device posture of the electronic device 100 based on the sensing values obtained by the reference sensing circuits 110A to 110C, external parameters between the sensing circuits 110A to 110C must be considered. In some embodiments, the external parameters of the sensing circuits 110A to 110C include the relative posture and relative rotation between the sensing circuits 110A to 110C.
[0071] Please also refer to Figure 3A and Figure 3B . Figure 3A FIG. 1 is a schematic diagram of a state D0 of an electronic device 100 before deformation according to some embodiments of the present disclosure. Figure 3B This is a deformation state D1 of the electronic device 100 after deformation according to some embodiments of the present disclosure.
[0072] When the processor 150 is Figure 2 Tracking in the environment coordinate system M is shown as Figure 1 When the electronic device 100 is in the device posture shown, the external parameters between each two of the sensing circuits 110A to 110C are considered. Figures 3A-3B As shown, when the electronic device 100 is in operation, the relative positions and rotations of the sensing circuits 110A to 110C may change due to the elastic deformation of the structure of the electronic device 100, and the posture of the electronic device 100 in the environmental coordinate system M may become inaccurate. Therefore, a method for calibrating the external parameters of the sensing circuits 110A to 110C of the electronic device 100 is needed.
[0073] See also Figure 4 In order to better understand the present invention, please refer to the following Figure 4 The embodiment shown is used to illustrate Figure 1 Detailed steps of the electronic device 100 are shown. Figure 4 is a flow chart of a parameter correction method 400 according to some embodiments of the present disclosure. It is worth noting that the parameter correction method 400 can be applied to Figure 1 The electronic device 100 shown in FIG. 1 is a device having the same or similar structure as the electronic device 100 shown in FIG. Figure 1 The embodiment shown in FIG is used as an example to describe the parameter correction method 400 according to some embodiments of the present disclosure. However, the embodiments of the present disclosure will not be based on Figure 1 For restriction.
[0074] like Figure 4As shown, the parameter calibration method 400 includes steps S410 to S430.
[0075] In step S410 , a link database is initialized. In some embodiments, step S410 is performed during the manufacturing of the electronic device 100. The link database links the strain values sensed by the strain sensing circuits 130A and 130B and the external parameters of the sensing circuits 110A through 110C based on the structural deformation behavior of the electronic device 100 .
[0076] Please also refer to Figure 5 . Figure 5 According to some embodiments of the present disclosure Figure 4 Flowchart of step S410 in FIG. Figure 5 As shown, step S410 includes steps S411 to S419.
[0077] In step S411, a structural stress analysis is performed. In some embodiments, the structural analysis is performed to simulate various deformation states of the electronic device 100. Structural strain analysis is used to identify structural deformation behavior under any possible load conditions and to identify the most critical locations for mounting the strain gauge circuits 130A and 130B. In some embodiments, the structural stress analysis can be performed using methods such as the finite element method or a neural network algorithm.
[0078] In step S413, strain sensing circuits are installed at representative locations of the electronic device based on the structural stress analysis. In some embodiments, in step S413, the results of the structural stress analysis include strain sensing values at any point on the electronic device 100 under different loads. Multiple representative locations of the electronic device 100 under all load conditions are obtained. Strain sensing circuits 130A and 130B are then installed at representative locations of the electronic device 100.
[0079] For the same model of electronic device, the structural stress analysis only needs to be performed once at the factory. After that, all electronic devices of the same model will have the same representative position when leaving the factory, and the connection database of each electronic device can be recalibrated individually.
[0080] In some embodiments, Figure 1 The strain sensing circuits 130A and 130B are arranged at representative positions of the electronic device 100 having the maximum test strain sensing value or the test strain sensing value being greater than the strain threshold. Figure 3A The coordinate system formed by the X2, Y2, and Z2 directions is a coordinate system constructed based on the electronic device 100 , and the origin of the coordinate system is located at a corner of the electronic device 100 .
[0081] like Figure 3AWhen the positions PB1a and PB2a are representative positions for structural stress analysis, the strain sensing circuits 130A and 130B are disposed at the positions PB1a and PB2a of the electronic device 100 .
[0082] In step S415 , multiple test strain sensing value sets corresponding to multiple load conditions are obtained. It should be noted that the test strain sensing value sets are obtained during factory testing of the electronic device. Each test strain sensing value set includes multiple test strain sensing values obtained by strain sensing circuits 130A and 130B.
[0083] See also Figure 3B .At Figure 3B In FIG, the electronic device 100 is deformed to the deformed state D1. Figure 3A and Figure 3B .At Figure 3A In FIG. 1 , the sensing circuits 110A, 110B, and 110C are located at positions PA1a, PA2a, and PA3a of the electronic device 100, respectively. Figure 3B In FIG, sensing circuits 110A, 110B, and 110C are respectively located at positions PA1b, PA2b, and PA3b of the electronic device 100. Strain sensing circuits 130A and 130B obtain test strain sensing values at representative positions of the electronic device 100 when the electronic device 100 is deformed to the deformation state D1.
[0084] In some embodiments, after deformation, the positions of the strain sensing circuits 130A and 130B can be changed from Figure 3A The positions PB1a and PB2a shown are moved to Figure 3B Positions PB1b and PB2b are shown.
[0085] In step S415 , a plurality of test strain sensing value sets are obtained based on different load conditions. For example, a first test strain sensing value set is obtained based on a first load condition, a second test strain sensing value set is obtained based on a second load condition, and so on.
[0086] In step S417, multiple sets of external parameters corresponding to multiple load conditions are obtained based on the multiple sets of images captured by the cameras of the sensing circuits. For example, when the electronic device 100 is deformed based on a first load condition, the sensing circuits 110A to 110C obtain a first set of images captured by the cameras of the sensing circuits 110A to 110C. Then, based on the images captured by the sensing circuits 110A to 110C when the electronic device 100 is deformed based on the first load condition, the processor 150 obtains a first set of test external parameters corresponding to the first load condition. The external parameters include the relative position and relative rotation between the sensing circuits 110A to 110C.
[0087] Similarly, when the electronic device 100 deforms based on the second load condition, the sensing circuits 110A-110C obtain a second set of images captured by the cameras of the sensing circuits 110A-110C. Then, the processor 150 obtains a second set of test external parameters corresponding to the second load condition according to the images captured by the sensing circuits 110A-110C when the electronic device 100 deforms based on the second load condition.
[0088] Thus, the electronic device 100 obtains a plurality of sets of test external parameters corresponding to a plurality of different load conditions according to a plurality of sets of images captured by the cameras of the sensing circuits.
[0089] In step S419, a linkage relationship between a plurality of sets of test strain sensing values and a plurality of sets of external parameters based on a plurality of load conditions is established. In some embodiments, the processor 150 establishes a linkage relationship between the test strain sensing values obtained in step S415 and the test external parameters obtained in step S417 based on the deformation state D1. Figure 1
[0090] In some embodiments, after the linkage database is initialized, a linkage relationship between a plurality of sets of test strain sensing values and a plurality of sets of test external parameters based on a plurality of load conditions is established.
[0091] In an embodiment, the linkage database is as shown below.
[0092] Table 1
[0093] Load case Test strain sensing values Test external parameters Load case 1 First test strain sensing values set First test external parameters set Load case 2 Second test strain sensing values set Second test external parameters set … … …
[0094] In some embodiments, the processor 150 establishes the linkage database according to Table 1 by methods such as association rule mining, linear regression, or neural network algorithm. In some embodiments, the linkage database, such as Table 1 described above, is stored in the storage device 170 as shown in Figure 1 .
[0095] Please refer to Figure 4 again. In step S430, the external parameters are updated. In some embodiments, step S430 is performed when the electronic device 100 is shipped and a user U as shown in Figure 2 is operating the electronic device 100. Please refer to Figure 6 . Figure 6 is a flowchart of step S430 in Figure 4 according to some embodiments of the present disclosure. As shown in Figure 6 , step S430 includes steps S431-S439.
[0096] In step S431, a plurality of strain sensing values are obtained. In some embodiments, the plurality of strain sensing values are obtained when Figure 2 The user U shown is operating Figure 1 In the electronic device 100 shown in FIG. 1 , the electronic device 100 is deformed, and the strain sensing circuits 130A and 130B obtain a plurality of strain sensing values of the electronic device 100 .
[0097] In some embodiments, the strain sensing circuits 130A and 130B obtain and monitor multiple strain sensing values of the electronic device 100 in real time. In some embodiments, the strain sensing circuits 130A and 130B obtain multiple strain sensing values of the electronic device 100 at regular intervals. In some embodiments, the strain sensing values include strain values sensed by the strain sensing circuits 130A and 130B disposed on the electronic device 100 when the electronic device 100 is deformed.
[0098] In step S435, it is determined whether the deformation is outside the elastic range. In some embodiments, step S435 is performed as follows Figure 1 The processor 150 shown executes. Figure 1 When the deformation of the electronic device 100 shown exceeds the elastic range, step S439 is executed and the external parameters are updated by recalibrating the electronic device 100. Figure 1 When the deformation of the electronic device 100 is within the elastic range, step S437 is executed, and the external parameters are updated according to the link database stored in the storage device 170 .
[0099] In some embodiments, the processor 150 determines whether the deformation of the electronic device 100 exceeds the elastic range of the training sensed value. In some embodiments, when the processor 150 determines that the strain sensed value does not match any of the test strain sensed value sets shown in Table 1, the processor 150 determines that the deformation of the electronic device 100 exceeds the elastic range.
[0100] In some other embodiments, when at least one of the strain sensing values is greater than the elasticity threshold, the processor 150 determines that the deformation of the electronic device 100 exceeds the elastic range.
[0101] In some embodiments, the processor 150 determines whether the deformation of the electronic device exceeds the elastic range according to the test external parameter set corresponding to the test strain sensing value.
[0102] In step S437, the external parameters of the sensing circuit are updated according to the connection database. Figure 7 . Figure 7 According to some embodiments of the present disclosure Figure 6 Flowchart of step S437 in FIG. Figure 7 As shown, step S437 includes steps S437a to S437c.
[0103] In step S437a, the load condition corresponding to the strain sensing value is obtained. In some embodiments, Figure 1 The processor 150 shown determines the strain sensing value corresponding to the deformation state according to the linkage database stored in the storage device 170. Figure 1 The processor 150 shown determines the strain sensing value corresponding to the deformation state according to the linkage database stored in the storage device 170.
[0104] For example, in some embodiments, the processor 150 compares the strain sensing value with the plurality of sets of test strain sensing values in Table 1. When the strain sensing value is similar to the first set of test strain sensing values, the processor 150 determines that the strain sensing value corresponds to the first set of test strain sensing values and the first load condition. When the strain sensing value is similar to the second set of test strain sensing values, the processor 150 determines that the strain sensing value corresponds to the second set of test strain sensing values and the second load condition.
[0105] In some embodiments, when the difference between the strain sensing value and the first set of test strain sensing values is less than a difference threshold, the processor 150 determines that the strain sensing value corresponds to the first load condition. Similarly, when the difference between the strain sensing value and the second set of test strain sensing values is less than the difference threshold, the processor 150 determines that the strain sensing value corresponds to the second load condition.
[0106] In other embodiments, the processor 150 determines the load condition corresponding to the strain sensing value by association rule mining, linear regression, or neural network algorithm.
[0107] In step S437b, the test external parameter set corresponding to the load condition is obtained according to the linkage database. In some embodiments, the processor 150 determines the test external parameter set corresponding to the load condition according to the linkage database, such as Table 1 mentioned above.
[0108] In other embodiments, the processor 150 determines the test external parameter set corresponding to the strain sensing value according to the linkage database, such as Table 1 mentioned above. For example, based on the first set of test strain sensing values, the first test external parameter set corresponding to the first set of test strain sensing values is obtained.
[0109] In step S437c, the external parameter is updated. For example, in step S437b, the first external parameter set is determined to correspond to the strain sensing value, Figure 1 The processor 150 shown updates the external parameter between the sensing circuits 110A to 110C according to the first external parameter set.
[0110] In other embodiments, when the association rule between the test external parameter and the test strain sensing value is established, the processor 150 can obtain the test external parameter set corresponding to the strain sensing value by association rule mining method.
[0111] Through steps S437a through S437c, the external parameters of the sensing circuits 110A through 110C can be updated based on the linked database without having to activate the cameras of the sensing circuits 110A through 110C. Therefore, the processor 150 does not need to analyze the external parameters based on images captured by the sensing circuits 110A through 110C. This is faster than conventional methods, and the external parameters can be updated in real time, improving the operating efficiency of the electronic device 100. Furthermore, when the sensing circuits 110A through 110C do not include camera circuits, the external parameters of the sensing circuits 110A through 110C can be updated based on the linked database.
[0112] In step S439, the external parameters are updated by recalibrating the electronic device. Figure 8 . Figure 8 According to some embodiments of the present disclosure Figure 6 Flowchart of step S439 in FIG. Figure 8 As shown, step S439 includes steps S439a to S439b.
[0113] In step S439a, the strain sensing value at the current time point is obtained and used as the initial state of the electronic device. In some embodiments, the strain sensing circuits 130A and 130B obtain the strain sensing value at the current time point, and the processor 150 uses the strain sensing value at the current time point as the initial state of the electronic device 100.
[0114] In step S439b, the image-based operation is performed to re-establish the link database. Figure 5 Steps S415, S417 and S419 are shown to be similar.
[0115] The embodiments of the present invention provide an electronic device and a parameter calibration method. When the electronic device is deformed, the external parameters between the sensing circuits of the electronic device can be recalibrated. When the deformation of the electronic device is within the elastic range of the electronic device, the external parameters between the sensing circuits can be updated based on a linked database without turning on the camera of the sensing circuit. Therefore, the processor does not need to analyze the external parameters based on the image captured by the sensing circuit, which is faster than traditional methods and can update the external parameters in real time, improving the operating efficiency of the electronic device. In addition, when the sensing circuit does not include a camera circuit, the external parameters of the sensing circuit can be updated based on the linked database.
[0116] On the other hand, when the deformation of the electronic device exceeds the elastic range, the external parameters between the sensing circuits can be updated according to the images taken by the cameras of the sensing circuits, which is time-consuming. However, since the deformation of the electronic device 100 exceeds the elastic range, the linking database stored in the storage device 170 is no longer applicable. By performing the recalibration step using the cameras of the sensing circuits 110A to 110C, the external parameters between the sensing circuits 110A to 110C can be updated.
[0117] It should be noted that in the steps of the above parameter correction method 400, there is no specific order unless otherwise specified. In addition, the steps can also be executed simultaneously, or the execution time can at least partially overlap.
[0118] Further, according to various embodiments of the present disclosure, steps of the parameter correction method 400 can be appropriately added, replaced, and / or eliminated.
[0119] Various functional components or blocks have been described herein. As those skilled in the art will appreciate, the functional blocks will preferably be implemented by circuitry (whether special-purpose or general-purpose circuitry running under control of coded instructions), typically including transistors or other circuit elements configured to control the circuitry according to the functions and steps described herein.
[0120] Although the embodiments of the present application have been described in considerable detail, other embodiments are possible. Therefore, the scope of the appended claims should not be limited to the description contained in this disclosure.
[0121] Although the present application has been disclosed in connection with the embodiments above, it should be noted that other embodiments are possible. Therefore, the scope of the appended claims should not be limited to the description contained in this disclosure.
Claims
1. An electronic device, characterized by comprising: The method comprises: obtaining a plurality of sensing values by a plurality of sensing circuits to locate the electronic device; obtaining a plurality of strain sensing values corresponding to a deformation of the electronic device by a plurality of strain sensing circuits; storing a linkage database by a storage device, wherein the linkage database comprises a linkage relationship between a plurality of test strain sensing value sets and a plurality of test external parameter sets corresponding thereto; updating a plurality of external parameters between the plurality of sensing circuits according to the plurality of strain sensing values and the linkage database by a processor coupled to the plurality of sensing circuits, the plurality of strain sensing circuits and the storage device. The method further comprises: obtaining a first test strain sensing value set from the plurality of test strain sensing value sets corresponding to the plurality of strain sensing values by the processor; 2.The electronic device of claim 1, wherein, obtaining a first test external parameter set from the plurality of test external parameter sets corresponding to the first test strain sensing value set according to the linkage database by the processor; and updating the plurality of external parameters between the plurality of sensing circuits according to the first test external parameter set by the processor. The method further comprises: establishing the linkage database according to the plurality of test strain sensing value sets and the plurality of test external parameter sets corresponding thereto based on a plurality of load conditions by the processor. The method further comprises: 3.The electronic device of claim 1, wherein, obtaining a first test strain sensing value set from the plurality of strain sensing circuits based on a first load condition from the plurality of load conditions by the processor; obtaining a first test external parameter set corresponding to the first load condition according to a plurality of images captured by a plurality of cameras from the plurality of sensing circuits when the electronic device deforms based on the first load condition by the processor; and 4.The electronic device of claim 3, wherein, establishing the linkage relationship between the first test strain sensing value set and the first test external parameter set based on the first load condition by the processor. The method further comprises: performing a structural stress analysis on the electronic device to obtain a plurality of representative positions of the electronic device by the processor; wherein the plurality of strain sensing circuits are disposed at the plurality of representative positions. The method further comprises: 5.The electronic device of claim 1, wherein, updating the plurality of external parameters according to the linkage database when the deformation of the electronic device is within an elastic range; and re-establishing the linkage database when the deformation of the electronic device is not within the elastic range. The method further comprises: 6.The electronic device of claim 1, wherein, determining whether the deformation of the electronic device is within the elastic range according to the linkage database by the processor. The method comprises: obtaining a plurality of sensing values by a plurality of sensing circuits to locate the electronic device; 7.The electronic device of claim 6, wherein the processor is further configured to: obtaining a plurality of strain sensing values corresponding to a deformation of the electronic device by a plurality of strain sensing circuits; storing a linkage database by a storage device, wherein the linkage database comprises a linkage relationship between a plurality of test strain sensing value sets and a plurality of test external parameter sets corresponding thereto; 8. A parameter correction method, applicable to an electronic device, characterized in that, updating a plurality of external parameters between the plurality of sensing circuits according to the plurality of strain sensing values and the linkage database by a processor coupled to the plurality of sensing circuits, the plurality of strain sensing circuits and the storage device. The method further comprises: 9. The parameter correction method of claim 8, wherein, obtaining a first test strain sensing value set corresponding to the plurality of test strain sensing value sets of the plurality of strain sensing values; obtaining a first test external parameter set corresponding to the first test strain sensing value set from the linking database; and updating the plurality of external parameters between the plurality of sensing circuits according to the first test external parameter set.
10. The parameter correction method of claim 8, wherein, Further comprising: obtaining a first test strain sensing value set from the plurality of strain sensing circuits based on a first load case of a plurality of load cases; obtaining a first test external parameter set corresponding to the first load case from the electronic device based on images captured by a plurality of cameras of the plurality of sensing circuits when the electronic device is deformed based on the first load case; and establishing the linking relationship between the first test strain sensing value set and the first test external parameter set based on the first load case.