Automobile air conditioner speed regulating resistance module

Abstract

The application relates to a speed regulating resistance module of an automobile air conditioner, which comprises a base and a packaging shell, a through hole is formed in the base, an annular heat conduction piece is assembled on the inner wall of the through hole, an electric resistance chip electrically connected with a blower is assembled on the inner wall of the heat conduction piece, the packaging shell is assembled on the base, a heat dissipation piece is arranged on the packaging shell, a heat dissipation fin assembly capable of moving in the vertical direction is arranged on the heat dissipation piece, the lower end of the heat dissipation piece is attached to the upper surface of the electric resistance chip, a heat conduction transmission piece and a plurality of heat conduction rods are arranged in the heat conduction piece, the heat conduction rods are configured to conduct the heat of the electric resistance chip out of the packaging shell, the heat conduction transmission piece is configured to drive the heat conduction rods to drive the heat dissipation fin assembly to move away from the electric resistance chip and make the packaging shell communicate with the outside. By arranging the heat conduction rods capable of rising along with the rising of the liquid level of the heat conduction fluid, the heat conduction rods can drive the heat dissipation plate to rise to open the packaging shell, and the heat dissipation capacity of the device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of automobile air conditioner speed regulating resistors, in particular to an automobile air conditioner speed regulating resistor module. BACKGROUND

[0002] At present, an automobile air conditioner has become an important accessory in an automobile interior, and the working principle of an existing automobile air conditioner fan speed regulating module is that the automobile air conditioner fan speed regulating module is connected in series with a blower fan in the same circuit, the automobile air conditioner fan speed regulating module utilizes the voltage division function thereof to adjust the voltage at both ends of the blower fan, and the function of adjusting the rotation of the blower fan is realized.

[0003] In the related technology, a speed regulating device of an automobile air conditioner blower fan is disclosed, an electronic switch electrically connected with the blower fan is arranged, and the effect of voltage division and instantaneous current impact reduction on the blower fan is realized by utilizing the resistance value of the electronic switch.

[0004] In the above technology, when the automobile air conditioner normally works, the heat dissipation capacity is not improved, the heat accumulation is prone to occur, the resistance value of the resistance chip in the speed regulating resistor module continuously increases with the increase of the temperature, the adjustment precision of the automobile air conditioner blower fan is affected, and in severe cases, fire even occurs, and a safety hazard exists. SUMMARY

[0005] The application provides an automobile air conditioner speed regulating resistor module, which can solve the problem that the existing air conditioner speed regulating resistor module cannot adjust the heat dissipation performance thereof with the increase of the working temperature.

[0006] The technical scheme of the application is as follows: an automobile air conditioner speed regulating resistor module comprises:

[0007] a base, a through hole is formed in the base, an annular heat conduction member is arranged on the inner wall of the through hole, and a resistance chip electrically connected with a blower fan is arranged on the inner wall of the heat conduction member;

[0008] an encapsulation shell is arranged on the base, a heat dissipation member is arranged on the encapsulation shell, a heat dissipation fin assembly capable of moving in the vertical direction is arranged on the heat dissipation member, the lower end of the heat dissipation member is attached to the upper surface of the resistance chip, and a heat conduction transmission member and a plurality of heat conduction rods are arranged in the heat conduction member;

[0009] the heat conduction rods are configured to guide the heat of the resistance chip out of the encapsulation shell, and the heat conduction transmission member is configured to drive the heat conduction rods to drive the heat dissipation fin assembly away from the resistance chip and make the encapsulation shell communicate with the outside.

[0010] By adopting the above scheme, the heat dissipation capacity of the device for the resistance chip is improved by arranging the annular heat conduction member on the side of the resistance chip and matching the heat dissipation member. When the temperature of the resistance chip continuously rises, the heat on the side of the resistance chip can be timely conducted out of the packaging shell by the heat conduction rod. In addition, the heat conduction driving member can drive the heat conduction rod to further move out of the heat conduction member after being heated. During the upward movement of the heat conduction rod, the area of the heat conduction rod exposed to the external environment increases, so as to improve the heat dissipation capacity of the heat conduction rod. Meanwhile, the heat conduction rod can also drive the heat conduction rod to lift, so that the packaging shell is directly communicated with the outside through the heat dissipation member, and the heat dissipation capacity of the packaging shell is further improved. Therefore, the device can automatically adjust the heat dissipation capacity of the device without additional power input when the temperature of the resistance chip continuously rises.

[0011] In an embodiment of the present application, the heat conduction member is internally provided with a plurality of columnar channels arranged along the circumferential direction thereof, the plurality of columnar channels are internally provided with the heat conduction fluid, the plurality of columnar channels are connected in a head-to-tail manner, and the heat conduction rod is vertically arranged in the columnar channels, one end of the heat conduction rod extends into the heat conduction fluid, and a float is coaxially arranged on the one end of the heat conduction rod.

[0012] By adopting the above scheme, the heat conduction fluid rises more obviously after being heated and expanded, and the heat conduction rod can always float on the liquid surface and rise with the rising of the liquid surface by arranging the float on one end of the heat conduction rod, so as to improve the heat conduction capacity of the heat conduction rod itself. Meanwhile, the heat dissipation fin assembly of the heat dissipation member can be opened by the rising of the heat conduction rod, so as to further improve the heat dissipation capacity of the packaging shell.

[0013] In an embodiment of the present application, the heat conduction driving member comprises a bimetallic strip arranged on the inner wall of the heat conduction member close to the resistance chip, one end of the heat conduction rod extends into the heat conduction member, and a heat conduction metal block is coaxially arranged on the one end of the heat conduction rod. An inclined surface is arranged on the side of the heat conduction metal block close to the bimetallic strip. The bimetallic strip is deformed by heat, so as to abut against the inclined surface and drive the bimetallic strip to move upward.

[0014] By adopting the above scheme, the heat of the resistance chip is transferred to the bimetallic strip, the bimetallic strip is bent by heat and presses the inclined surface of the heat conduction metal block, so that the heat conduction metal block drives the heat conduction rod to move upward. When the heat conduction rod moves upward, the heat dissipation area of the heat conduction rod increases, and the heat dissipation fin assembly is opened, so as to further improve the heat dissipation capacity of the packaging shell.

[0015] In an embodiment of the present application, the heat dissipation member comprises:

[0016] The heat dissipation base is provided with a plurality of strip-shaped grooves arranged at intervals along the length direction of the heat dissipation base, and a strip-shaped opening is arranged on one side of the strip-shaped grooves close to the heat conduction rod.

[0017] The heat dissipation fin assembly comprises a plurality of heat dissipation plates which are slidably assembled in the strip-shaped grooves one by one, and a protruding portion is arranged on one side of the heat dissipation plate close to the heat conduction rod.

[0018] By adopting the above scheme, the protruding portion capable of being in contact with the heat conduction rod is arranged, so that the heat dissipation plate can dissipate heat without affecting the heat dissipation plate itself, and the heat conduction rod can lift the heat dissipation plate during movement, so that the heat dissipation plate is away from the bottom of the strip-shaped groove, the hot air in the packaging shell can enter the strip-shaped groove from the lower end of the strip-shaped opening and dissipate to the outside environment from the upper end of the strip-shaped opening, so that the packaging shell is directly connected with the outside, and the heat dissipation capacity of the device is improved.

[0019] In an embodiment of the present application, a rectangular opening is arranged in the packaging shell, the heat dissipation base is fixedly assembled in the rectangular opening, and a rectangular notch is arranged on one side of the inner wall of the rectangular opening close to the protruding portion.

[0020] By adopting the above scheme, the rectangular notch is arranged, so that when the heat dissipation rod descends, the protruding portion can enter the rectangular notch, so as to ensure that the heat dissipation plate can be inserted into the strip-shaped groove and ensure the sealing of the device as a whole.

[0021] In an embodiment of the present application, a heat dissipation fin is arranged on one side of the base away from the heat dissipation fin assembly, a second heat conduction pad is arranged on one side of the heat dissipation fin close to the resistance chip, and the second heat conduction pad is in contact with the resistance chip.

[0022] By adopting the above scheme, the heat dissipation fin is arranged on the lower surface of the resistance chip, which cooperates with the heat dissipation member and the heat conduction member, so as to cover the resistance chip in all directions, thereby improving the heat dissipation capacity of the resistance chip.

[0023] In an embodiment of the present application, a conductive interface is arranged on the packaging shell, the conductive interface is electrically connected with the resistance chip, a fuse is arranged on the side of the heat conduction member, the fuse is electrically connected with the resistance chip, strip-shaped heat dissipation grooves are arranged on both sides of the packaging shell, and the strip-shaped heat dissipation grooves comprise a plurality of heat dissipation unit grooves arranged at intervals along the length direction of the packaging shell.

[0024] By adopting the above scheme, by setting the fuse, when the device is overloaded, the temperature rises due to excessive current until the fuse acts to cut off the circuit, thereby protecting the blower and other electrical components in the circuit and the circuit itself, and at the same time, the strip-shaped heat dissipation grooves can further increase the heat dissipation area of the packaging shell to improve the heat dissipation performance.

[0025] In one embodiment of the present application, the base is further provided with an infrared flame sensor and a gas storage tank electrically connected to the infrared flame sensor, the gas storage tank is internally provided with carbon dioxide gas, one end of the gas storage tank is provided with a solenoid valve, and the solenoid valve is electrically connected to the infrared flame sensor.

[0026] The bottom end of the heat dissipation base is internally provided with a plurality of gas outlet channels extending along the width direction of the heat dissipation base, and the plurality of gas outlet channels are one-to-one correspondingly arranged below the strip-shaped grooves and communicated with the strip-shaped grooves through the communication holes.

[0027] By adopting the above scheme, when the circuit of the resistance chip is connected, the instantaneous current generated by the automobile air conditioner is generally large, which can easily cause electric sparks and flames, once the flame occurs, the infrared flame sensor senses the flame, controls the solenoid valve to open, the high-pressure carbon dioxide gas in the gas storage tank is sprayed out at this time, fills the inside of the packaging shell, and covers the ignition point to extinguish the flame, at the same time, the smoke and carbon dioxide can be sprayed out through the gas outlet channels, and the heat dissipation plates in the strip-shaped grooves are opened at the same time, and the high-temperature gas is discharged in time to avoid explosion.

[0028] When no flame occurs, the hot gas flow in the packaging shell can also flow out of the device to the outside through the gas outlet channels, thereby further improving the heat dissipation capacity of the device when the resistance chip continuously heats up.

[0029] In one embodiment of the present application, the heat conducting member is a ceramic member, an annular heat conducting pad is arranged between the heat conducting member and the resistance chip, a plurality of heat conducting protrusions are arranged on the inner wall of the heat conducting member along the circumferential direction, and a plurality of recesses are arranged on the outer side of the heat conducting pad and matched with the heat conducting protrusions.

[0030] By adopting the above scheme, the annular heat conducting pad is arranged on the inner wall of the heat conducting member, the heat conducting protrusions are arranged on the heat conducting member, and the recesses are correspondingly arranged on the outer side of the heat conducting pad, thereby increasing the heat conducting area of the annular heat conducting pad, and the heat of the resistance chip can be quickly conducted to the heat conducting member.

[0031] In summary, the present application has at least one of the following beneficial technical effects:

[0032] 1. By setting the heat conduction piece, the heat dissipation piece and the heat dissipation fin, and embedding the resistance chip on the base, the heat conduction piece is arranged on the side of the resistance chip, and the heat dissipation piece and the heat dissipation fin are arranged on the upper and lower surfaces of the resistance chip, so that the resistance chip can be subjected to all-round heat dissipation treatment, and the heat dissipation and heat conduction capacity of the resistance chip is improved.

[0033] 2. By setting the bimetallic strip inside the heat conduction piece, using the bending characteristics of the bimetallic strip under heat, the bimetallic strip converts the heat energy of the resistance chip into mechanical energy without additional power output, so as to drive the heat conduction rod to move upwards, so as to improve the heat conduction capacity of the heat conduction rod, and at the same time, the heat dissipation plate in the heat dissipation piece is opened, and the overall heat dissipation capacity of the device is further improved.

[0034] 2. By setting the heat conduction fluid inside the heat conduction piece, the heat conduction fluid can absorb the heat emitted by the resistance chip during continuous heating, and directly guide the heat out of the device through the heat conduction rod, and at the same time, by using the expansion characteristics of the heat conduction fluid after absorbing heat, a float is arranged at one end of the heat conduction rod, so that the heat conduction rod can rise with the liquid level of the heat conduction fluid, and the area of the heat conduction rod exposed to the outside is further increased, so as to improve the heat conduction capacity of the heat conduction rod, and at the same time, the heat conduction rod can also lift the heat dissipation plate in the heat dissipation piece, so that the packaging shell can be directly connected with the external environment, and the heat dissipation capacity of the device is further improved.

[0035] 3. By setting the gas tank on the base plate, when the device occurs flame, the carbon dioxide gas in the gas tank can be released under the control of the infrared flame sensor, and the flame inside the device can be extinguished in time, so as to avoid causing secondary loss, and at the same time, the gas outlet channel is arranged in the heat dissipation base, so that the smoke and carbon dioxide can be discharged out of the device through the gas outlet channel, in addition, the gas outlet channel can also guide the hot gas in the packaging shell out when the heat dissipation plate is lifted, so that the device can improve its own heat dissipation capacity when there is no flame. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a front view of an automobile air conditioner speed regulating resistance module provided by the first embodiment of the application;

[0037] Figure 2 is a front view of an automobile air conditioner speed regulating resistance module provided by the first embodiment of the application;

[0038] Figure 3 is a front view of an automobile air conditioner speed regulating resistance module provided by the first embodiment of the application;

[0039] Figure 4 is a front view of an automobile air conditioner speed regulating resistance module provided by the first embodiment of the application;

[0040] Figure 5 is a front view of a heat dissipation piece of a speed regulating resistor module of an automobile air conditioner according to the first embodiment of the present application;

[0041] Figure 6 is a side view of a columnar channel of a speed regulating resistor module of an automobile air conditioner according to the first embodiment of the present application;

[0042] Figure 7 is a side view of a bimetallic strip of a speed regulating resistor module of an automobile air conditioner according to the second embodiment of the present application;

[0043] Figure 8 is a front view of an air outlet channel of a speed regulating resistor module of an automobile air conditioner according to the first embodiment of the present application;

[0044] Figure 9 is a top view of a gas storage tank of a speed regulating resistor module of an automobile air conditioner according to the first embodiment of the present application;

[0045] Figure 10 is a front exploded view of an annular heat conduction pad of a speed regulating resistor module of an automobile air conditioner according to the third embodiment of the present application.

[0046] BRIEF DESCRIPTION OF THE DRAWINGS 1, base; 11, heat conduction piece; 110, heat conduction transmission piece; 111, heat conduction fluid; 112, heat conduction rod; 1121, contact piece; 1122, floating body; 1123, heat conduction metal block; 113, columnar channel; 114, heat conduction protrusion; 115, bimetallic strip; 12, resistor chip; 13, heat dissipation fin; 131, second heat conduction pad; 14, infrared flame sensor; 15, gas storage tank; 151, carbon dioxide gas; 152, electromagnetic valve; 16, annular heat conduction pad; 161, recess; 2, packaging shell; 21, heat dissipation piece; 211, heat dissipation fin assembly; 2111, heat dissipation plate; 2112, protruding part; 212, heat dissipation base; 2121, strip-shaped slot; 2122, strip-shaped opening; 2123, air outlet channel; 2124, communication hole; 213, first heat conduction pad; 22, rectangular opening; 23, rectangular notch; 24, conductive interface; 25, fuse; 26, strip-shaped heat dissipation slot; 261, heat dissipation unit slot. DETAILED DESCRIPTION

[0047] The following will be described in detail with reference to the accompanying drawings. Figures 1-10 A speed regulating resistor module of an automobile air conditioner according to the present application will be described in further detail.

[0048] A speed regulating resistor module of an automobile air conditioner according to the present application includes a base 1 and a packaging shell 2.

[0049] Embodiment 1, please refer to Figure 1 , Figure 2 andFigure 3 The base 1 is internally provided with a through hole, and a ring-shaped heat conducting member 11 is assembled on the inner wall of the through hole. The inner wall of the heat conducting member 11 is assembled with an electric resistance chip 12 electrically connected with a blower. The packaging shell 2 is assembled on the base 1. The packaging shell 2 is provided with a heat radiating member 21. The heat radiating member 21 is provided with a heat radiating fin assembly 211 capable of moving in a vertical direction. The lower end of the heat radiating member 21 is attached to the upper surface of the electric resistance chip 12. The heat conducting member 11 is internally provided with a heat conducting transmission member 110 and a plurality of heat conducting rods 112. The heat conducting rods 112 are configured to conduct the heat of the electric resistance chip 12 out of the packaging shell 2. The heat conducting transmission member 110 is configured to drive the heat conducting rods 112 to drive the heat radiating fin assembly 211 away from the electric resistance chip 12 and make the packaging shell 2 communicate with the outside. By arranging the heat conducting member 11 and the heat conducting rods 112 capable of absorbing heat and conducting out in the heat conducting member 11, and lifting the heat conducting rods 112 by the heat conducting transmission member 110, the packaging shell 2 is directly communicated with the outside through the heat radiating member 21, and the heat radiating capacity of the packaging shell 2 is improved.

[0050] Please refer to Figure 5 and Figure 6 The heat conducting transmission member 110 includes a heat conducting fluid 111. The heat conducting member 11 is internally provided with a plurality of columnar channels 113 arranged along the circumferential direction of the heat conducting member 11. The heat conducting fluid 111 is arranged in the columnar channels 113. The heat conducting rods 112 are arranged in the columnar channels 113 in a vertical direction. One end of the heat conducting rods 112 extends into the heat conducting fluid 111 and is coaxially sleeved with a float 1122. The other end of the heat conducting rods 112 extends to the outside of the heat conducting member 11.

[0051] In the embodiment, the heat conducting fluid 111 can be a perfluoropolyether oil. The heat conducting rods 112 can be red copper members. The heat radiating fin assembly 211 is a heat conducting metal member, which can be a copper or copper alloy member.

[0052] The diameter d of the columnar channel 113 satisfies 1mm≤d≤5mm.

[0053] The float 1122 can be a polyurethane foam plastic.

[0054] Please refer to Figure 4The heat dissipation piece 21 comprises a heat dissipation base 212, a plurality of strip-shaped grooves 2121 are arranged at intervals along the length direction of the heat dissipation base 212, a strip-shaped opening 2122 is arranged on one side of the strip-shaped groove 2121 close to the heat conduction rod 112, a first heat conduction pad 213 is arranged between the lower end of the heat dissipation base 212 and the resistance chip 12, the heat dissipation fin assembly 211 comprises a plurality of heat dissipation plates 2111, the heat dissipation plates 2111 are slidably assembled in the strip-shaped grooves 2121 one by one, wherein the heat dissipation plates 2111 slide in the vertical direction in the strip-shaped grooves 2121, the heat dissipation plates 2111 are provided with protruding parts 2112 on one side close to the heat conduction rod 112, the other end of the heat conduction rod 112 penetrates through the protruding parts 2112 and is coaxially connected and fixed with a contact part 1121, the protruding parts 2112 can be in contact with the heat conduction rod 112, so that the heat conduction rod 112 can drive the protruding parts 2112 to move upwards, the hot air in the packaging shell 2 can enter the strip-shaped grooves 2121 from the lower end of the strip-shaped opening 2122 and be dissipated to the external environment from the upper end of the strip-shaped opening 2122, and the heat dissipation capacity of the device is improved.

[0055] In the embodiment, the first heat conduction pad 213 can be a heat conduction silica gel pad.

[0056] Please refer to Figure 2 and Figure 3 , the packaging shell 2 is provided with a rectangular opening 22 inside, the heat dissipation base 212 is fixedly assembled in the rectangular opening 22, the packaging shell 2 is provided with a rectangular notch 23 on the inner wall of the rectangular opening 22 close to the protruding parts 2112, the rectangular notch 23 is arranged, so that when the heat conduction rod 112 does not lift the protruding parts 2112, the lower end of the heat dissipation plate 2111 can be inserted into the strip-shaped groove 2121 and abut against the side wall of the rectangular notch 23 of the packaging shell 2, and the sealing property of the device is ensured.

[0057] Please continue to refer to Figure 1 , Figure 2 and Figure 3 , the base 1 is provided with a heat dissipation fin 13 on one side away from the heat dissipation fin assembly 211, the heat dissipation fin 13 is provided with a second heat conduction pad 131 on one side close to the resistance chip 12, the second heat conduction pad 131 abuts against the resistance chip 12, the heat dissipation fin 13 is arranged on the lower surface of the resistance chip 12, cooperates with the heat dissipation piece 21 and the heat conduction piece 11, and thus the heat dissipation capacity of the resistance chip 12 can be improved comprehensively.

[0058] In the embodiment, the second heat conduction pad 131 is a heat conduction silica gel pad.

[0059] Please refer to Figure 1The conductive interface 24 is electrically connected with the resistance chip 12, the fuse 25 is arranged on the side of the heat conduction piece 11 and is electrically connected with the resistance chip 12, the fuse 25 is arranged to actively cut off the circuit when the device is overloaded, so as to protect the circuit, the strip-shaped heat dissipation grooves 26 are arranged on both sides of the packaging shell 2, the strip-shaped heat dissipation grooves 26 include a plurality of heat dissipation unit grooves 261 which are arranged at intervals along the length direction of the packaging shell 2, the strip-shaped heat dissipation grooves 26 are arranged on both sides of the packaging shell 2, the heat dissipation performance of the packaging shell 2 is improved, meanwhile, the friction between the packaging shell 2 and the user's hand is increased, so that the packaging shell 2 is conveniently disassembled and assembled.

[0060] Please refer to Figure 1 , Figure 8 and Figure 9 The base 1 is further provided with an infrared flame sensor 14 and a gas storage tank 15 which is electrically connected with the infrared flame sensor 14, the gas storage tank 15 is internally provided with carbon dioxide gas 151, one end of the gas storage tank 15 is provided with an electromagnetic valve 152 which is electrically connected with the infrared flame sensor 14, a plurality of gas outlet channels 2123 which extend along the width direction of the heat dissipation base 212 are arranged in the bottom end of the heat dissipation base 212, the plurality of gas outlet channels 2123 are one-to-one correspondingly arranged below the strip-shaped grooves 2121 and are communicated with the strip-shaped grooves 2121 through the communication holes 2124, the gas outlet channels 2123 which are communicated with the strip-shaped grooves 2121 are arranged to make the high-pressure carbon dioxide gas 151 in the gas storage tank 15 be sprayed out when the device produces flame due to electric spark, the smoke and the carbon dioxide can be sprayed out through the gas outlet channels 2123, so that explosion is avoided.

[0061] In addition, during normal work, the hot air flow in the packaging shell 2 can also flow out of the device through the gas outlet channels 2123, so that the heat dissipation capacity of the device itself is further improved.

[0062] In the embodiment, the carbon dioxide gas 151 is filled in the gas storage tank 15 through compression, wherein the gas pressure a in the gas storage tank 15 satisfies: 0.3MPa≤a≤0.5MPa, the gas outlet pipe can also be arranged on the gas storage tank 15 and the electromagnetic valve 152 is arranged on the gas outlet pipe, the gas outlet direction of the gas outlet pipe is towards the connection position of the resistance chip 12 and the fuse 25, the high-pressure carbon dioxide gas flow can be generated when the electromagnetic valve 152 is opened.

[0063] Embodiment 2, the structure of embodiment 2 is basically the same as that of embodiment 1, the difference lies in that:

[0064] Please refer to Figure 7The heat-conducting driving member 110 includes a bimetallic strip 115 arranged on the inner wall of the heat-conducting member 11 close to the resistance chip 12, and the heat-conducting rod 112 extends into the heat-conducting member 11 and is coaxially sleeved with a heat-conducting metal block 1123, and the heat-conducting metal block 1123 is provided with an inclined surface close to the bimetallic strip 115. The bimetallic strip 115 is deformed by heat to abut against the inclined surface to drive the bimetallic strip 115 to move upward. By arranging the bimetallic strip 115 and utilizing the bending characteristic of the bimetallic strip 115, the heat-conducting metal block 1123 moves upward under the bending extrusion of the bimetallic strip 115. When the heat-conducting rod 112 moves upward, the heat dissipation capacity of the heat-conducting rod 112 and the packaging shell 2 is improved.

[0065] Embodiment 3 is basically the same as Embodiment 1, and the difference is that:

[0066] Please refer to Figure 10 The heat-conducting member 11 is a ceramic member, and the annular heat-conducting pad 16 is arranged between the heat-conducting member 11 and the resistance chip 12. A plurality of heat-conducting protrusions 114 are arranged on the inner wall of the heat-conducting member 11 along the ring direction. The annular heat-conducting pad 16 is provided with a plurality of recesses 161 matched with the shapes of the heat-conducting protrusions 114. By arranging the annular heat-conducting pad 16 and the heat-conducting protrusions 114, the heat-conducting area of the annular heat-conducting pad 16 is increased, so that the heat of the resistance chip 12 can be quickly conducted to the heat-conducting member 11.

[0067] In this embodiment, the annular heat-conducting pad 16 is a ring-shaped heat-conducting silica gel ring.

[0068] In summary, when the resistance chip 12 is connected to the circuit and the temperature gradually rises, the heat-conducting fluid 111 in the heat-conducting member 11 absorbs heat to realize omnidirectional heat conduction of the resistance chip 12 in cooperation with the heat-dissipating fins 13 and the heat-dissipating member 21. After the heat-conducting fluid 111 absorbs heat, the heat-conducting fluid 111 expands in the columnar channel 113, and the change in liquid level caused by the expansion drives the heat-conducting rod 112 to rise. As the heat-conducting rod 112 rises, the area of the heat-conducting rod 112 extending out of the heat-conducting member 11 increases, improving the heat dissipation capacity of the heat-conducting rod 112. At the same time, the heat-conducting rod 112 can drive the entire heat-dissipating plate 2111 to rise, thereby opening the packaging shell 2 to communicate with the external environment, facilitating rapid heat dissipation of the packaging shell 2.

[0069] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application. Any equivalent changes made according to the structure, shape, and principle of the present application should be covered by the protection scope of the present application.

Claims

1. A car air conditioning speed control resistor module, characterized in that, include: A base (1) has a through hole inside, and an annular heat-conducting component (11) is mounted on the inner wall of the through hole. A resistor chip (12) electrically connected to a blower is mounted on the inner wall of the heat-conducting component (11). A package shell (2) is mounted on the base (1). A heat sink (21) is provided on the package shell (2). A heat sink assembly (211) that can move in the vertical direction is provided on the heat sink (21). The lower end of the heat sink (21) is attached to the upper surface of the resistor chip (12). A heat-conducting transmission component (110) and multiple heat-conducting rods (112) are provided inside the heat-conducting component (11). The heat-conducting rod (112) is configured to conduct heat from the resistor chip (12) to the outside of the package housing (2), and the heat-conducting transmission member (110) is configured to drive the heat-conducting rod (112) to move the heat sink assembly (211) away from the resistor chip (12) and make the package housing (2) communicate with the outside. The heat sink (21) includes: a heat sink base (212), on which a plurality of strip grooves (2121) are spaced apart along their own length direction, and a strip opening (2122) is provided on the side of the strip groove (2121) near the heat conducting rod (112), and a first heat conducting pad (213) is provided between the lower end of the heat sink base (212) and the resistor chip (12); the heat sink assembly (211) includes a plurality of heat sink plates (2111), and the heat sink plates (2111) are slidably assembled in the strip grooves (2121) one by one, and a protrusion (2112) is provided on the side of the heat sink plate (2111) near the heat conducting rod (112), and the other end of the heat conducting rod (112) passes through the protrusion (2112) and is coaxially connected and fixed with an abutment (1121); The encapsulation shell (2) has a rectangular opening (22) inside, and the heat dissipation base (212) is fixedly assembled inside the rectangular opening (22). The encapsulation shell (2) has a rectangular notch (23) on the inner wall of the rectangular opening (22) near the protrusion (2112).

2. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The heat-conducting transmission component (110) includes a heat-conducting fluid (111). The heat-conducting component (11) has multiple columnar channels (113) arranged along its circumference inside. The heat-conducting fluid (111) is disposed inside the columnar channels (113). The heat-conducting rods (112) are arranged vertically at intervals inside the columnar channels (113), with one end extending into the heat-conducting fluid (111) and coaxially fitted with a float (1122), and the other end extending to the outside of the heat-conducting component (11).

3. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The heat-conducting transmission component (110) includes a bimetallic strip (115), which is disposed on the inner wall of the heat-conducting component (11) near the resistor chip (12). One end of the heat-conducting rod (112) extends into the interior of the heat-conducting component (11) and is coaxially sleeved with a heat-conducting metal block (1123). The heat-conducting metal block (1123) has an inclined surface on the side near the bimetallic strip (115). The bimetallic strip (115) deforms when heated, so as to resist the inclined surface and drive the bimetallic strip (115) to move upward.

4. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The base (1) has a heat dissipation fin (13) on the side away from the heat sink assembly (211). The heat dissipation fin (13) has a second thermal pad (131) on the side close to the resistor chip (12). The second thermal pad (131) is in contact with the resistor chip (12).

5. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The encapsulation shell (2) is provided with a conductive interface (24), which is electrically connected to the resistor chip (12). A fuse (25) is provided on the side of the heat-conducting component (11), which is electrically connected to the resistor chip (12). A strip-shaped heat dissipation groove (26) is provided on both sides of the encapsulation shell (2), which includes a plurality of heat dissipation unit grooves (261) spaced apart along the length of the encapsulation shell (2).

6. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The base (1) is also provided with an infrared flame sensor (14) and a gas storage tank (15) electrically connected to the infrared flame sensor (14). The gas storage tank (15) contains carbon dioxide gas (151). One end of the gas storage tank (15) is provided with a solenoid valve (152). The solenoid valve (152) is electrically connected to the infrared flame sensor (14). The bottom end of the heat dissipation base (212) is provided with a plurality of air outlet channels (2123) extending along the width direction of the heat dissipation base (212). The plurality of air outlet channels (2123) are arranged one-to-one below the strip groove (2121) and are connected to the strip groove (2121) through a connecting hole (2124).

7. The automotive air conditioning speed control resistor module according to claim 1, characterized in that: The heat-conducting component (11) is a ceramic component. An annular heat-conducting pad (16) is provided between the heat-conducting component (11) and the resistor chip (12). Multiple heat-conducting protrusions (114) are provided on the inner wall of the heat-conducting component (11) along its own circumferential direction. Multiple recesses (161) that are adapted to the shape of the heat-conducting protrusions (114) are provided on the outside of the annular heat-conducting pad (16).

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