Electric lifting platform for wafer alignment assembly and use method thereof

Abstract

The invention discloses an electric lifting platform for wafer alignment assembly, which comprises a support frame, positioning baffles are arranged on two sides of the top of the support frame, an aging cover plate assembly is placed in the two positioning baffles, a hydraulic oil cylinder lifting frame is mounted in the support frame, and a wafer positioning plate is arranged on the top of the hydraulic oil cylinder lifting frame. By the adoption of the hydraulic oil cylinder lifting frame and the lifting controller, accurate lifting control over the wafer is achieved, it is ensured that the position of the wafer in the installation process is accurate, the assembling efficiency and precision are improved, through equipment structure modularization, parts such as the aging cover plate assembly and the wafer positioning plate can be conveniently disassembled and replaced, and the assembling efficiency is improved. According to the invention, the flexibility and the maintenance convenience of the equipment are improved, the assembling requirements of different types of wafers are met, the process is simple, and the problems that the wafers are easy to damage during installation and the subsequent test is inconvenient due to the limitation of related processes and technologies in the conventional wafer test installation are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer testing, in particular to an electric lifting platform for wafer alignment assembly and a method thereof. BACKGROUND

[0002] Wafer testing is an important process in semiconductor manufacturing, mainly used for high-precision detection of wafer performance parameters. With the continuous development of semiconductor technology, the size and integration of wafers are becoming higher and higher, and the precision and efficiency of wafer testing are also becoming higher and higher. Currently, wafer testing technology is widely used in chip manufacturing, packaging testing, optical device detection and other fields. However, the existing wafer testing technology still has some technical bottlenecks in practical application.

[0003] In the field of semiconductor manufacturing and precision detection, the precision and efficiency of wafer testing directly affect the quality and production cost of the final product. Traditional wafer testing methods rely on manual operation or simple mechanical device assembly, which has low efficiency, easy damage to wafer installation, unstable precision, complex operation and other problems. Especially under the demand of high precision and high efficiency production, the traditional wafer testing technology has been unable to meet the requirements of modern semiconductor manufacturing, therefore, we propose an electric lifting platform for wafer alignment assembly and a method thereof to solve the above problems. SUMMARY

[0004] The purpose of the present application is to overcome the problems of the traditional wafer testing method, which relies on manual operation or simple mechanical device assembly, has low efficiency, easy damage to wafer installation, unstable precision, complex operation and other problems. Especially under the demand of high precision and high efficiency production, the traditional wafer testing technology has been unable to meet the requirements of modern semiconductor manufacturing, therefore, we propose an electric lifting platform for wafer alignment assembly and a method thereof.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme: An electric lifting platform for wafer alignment assembly, comprising a support frame, the top of the support frame is provided with a positioning baffle on both sides, an aging cover plate assembly is placed in the inside of the two positioning baffles, a hydraulic cylinder lifting frame is installed in the support frame, a wafer positioning plate is provided on the top of the hydraulic cylinder lifting frame, a wafer to be tested is installed in the wafer positioning plate, the hydraulic cylinder lifting frame is correspondingly arranged at the bottom of the aging cover plate assembly, a lifting controller is provided on one side of the bottom of the support frame, the lifting controller is electrically connected with the hydraulic cylinder lifting frame, the aging cover plate assembly is placed on the top of the hydraulic cylinder lifting frame through the positioning baffle, the wafer to be tested is placed on the wafer positioning plate, the lifting of the hydraulic cylinder lifting frame is controlled by the lifting controller, and the wafer to be tested is installed in the aging cover plate assembly.

[0006] Preferably, the aging cover plate assembly is provided with a mounting plate, the middle of the mounting plate is provided with a mounting hole, the bottom of the mounting plate is provided with an aging plate lower heat conduction assembly, the aging plate lower heat conduction assembly is provided with a PC plate ceramic backing plate, the top of the mounting hole is connected with a wafer upper sealing plate, and the to-be-tested wafer is installed in the aging plate lower heat conduction assembly through a hydraulic oil cylinder lifting frame.

[0007] Preferably, the mounting plate is provided with a needle card reinforcing plate, the bottom of the needle card reinforcing plate is provided with a needle card fixing plate, the needle card fixing plate is provided with a decorative plate, the top of the decorative plate is provided with a needle card side plate which is slidably connected with a positioning baffle, the needle card side plate is connected with a test needle plate, and the to-be-tested wafer is electrically connected to the test needle plate.

[0008] Preferably, the aging plate lower heat conduction assembly is provided with a protection frame, the protection frame is provided with a heat conduction main plate, the heat conduction main plate is provided with a wafer positioning plate, the to-be-tested wafer is installed on the wafer positioning plate, the surface of the protection frame is provided with a plurality of wafer cavity sealing assemblies, the aging plate lower heat conduction assembly is connected with connecting pins around, and the aging plate lower heat conduction assembly is fixed to the bottom of the mounting plate through the connecting pins.

[0009] Preferably, one side of the hydraulic oil cylinder lifting frame is provided with a hydraulic oil cylinder, one side of the hydraulic oil cylinder is provided with an adjusting knob, the bottom of the hydraulic oil cylinder lifting frame is provided with a base, the top of the base is fixedly connected with a limiting lower clamping plate, the limiting lower clamping plate is foldably connected with a supporting rod, the top of the supporting rod is connected with a lifting plate, the bottom of the lifting plate is provided with a limiting upper clamping plate corresponding to the supporting rod, the top of the supporting rod is connected to the limiting upper clamping plate, and the hydraulic oil cylinder lifting frame is controlled by a lifting controller or the adjusting knob to provide power for the hydraulic oil cylinder, so that the supporting rod is controlled to ascend and descend on the surface of the base, and then the lifting plate at the top is driven to ascend and descend.

[0010] A use method of the electric lifting table applied to the wafer alignment assembly of any one of claims 1-5. In the first step, the mounting plate of the aging cover plate assembly is placed to the top of the support frame through the positioning baffle, and the wafer upper sealing plate and the PC plate ceramic backing plate on the aging cover plate assembly are removed, and the mounting hole is exposed. In the second step, the to-be-tested wafer is placed on the wafer positioning plate of the heat conduction main plate, and then the protection frame at the bottom of the heat conduction main plate is placed on the lifting plate at the top of the hydraulic oil cylinder lifting frame. In the third step, the hydraulic oil cylinder lifting frame is controlled to descend by the lifting controller, the hydraulic oil cylinder lifting frame is pushed into the bottom of the installed aging cover plate assembly, and the center point of the mounting hole and the center point of the protection frame are in the same vertical position. In the fourth step, the hydraulic oil cylinder lifting frame is controlled to preliminarily ascend by the lifting controller, and the aging plate lower heat conduction assembly is sent into the bottom of the aging cover plate assembly. Fifth step, by adjusting the knob, manually rising twice, the wafer to be tested is loaded into the decorative plate of the aging cover plate assembly, and the test needle plate is in safe contact with the wafer to be tested; Sixth step, the needle card fixing plate, PC plate ceramic base plate are sequentially placed on the top of the test needle plate, and then the wafer upper cover plate is installed on the top of the mounting hole through the bolt, and the installation of the wafer to be tested in the aging cover plate assembly is completed; Seventh step, the installed aging cover plate assembly is taken off from the support frame, and then placed into the wafer test equipment to perform aging test.

[0011] Compared with the prior art, the beneficial effects of the present application are: 1. By adopting the hydraulic cylinder lifting frame and the lifting controller, the accurate lifting control of the wafer is realized, the position of the wafer in the installation process is ensured to be accurate and correct, and the assembly efficiency and precision are improved; 2. By the modularization of the equipment structure, such as the aging cover plate assembly and the wafer positioning plate, the components can be conveniently disassembled and replaced, the flexibility and maintenance convenience of the equipment are improved, and the assembly requirements of different models of wafers are adapted; 3. By the structure design of the limiting lower clamping plate, the supporting rod and the lifting plate, the stability in the lifting process is effectively controlled, the wafer is prevented from being mechanically damaged in the installation process, and the product safety is ensured; 4. The overall installation process is completed by mechanical automation, manual operation is reduced, production efficiency is improved, production cost is reduced, and the modern production demand of high efficiency is adapted; In summary, the present application can realize the accurate lifting control of the wafer by adopting the hydraulic cylinder lifting frame and the lifting controller, ensure the position of the wafer in the installation process to be accurate and correct, improve the assembly efficiency and precision, realize the modularization of the equipment structure, such as the aging cover plate assembly and the wafer positioning plate, conveniently disassemble and replace the components, improve the flexibility and maintenance convenience of the equipment, adapt to the assembly requirements of different models of wafers, have the advantage of simple process, avoid the problem that the wafer installation is easily damaged due to the limitation of related process technology in the existing wafer test installation, and facilitate subsequent testing. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is an overall schematic view of the electric lifting platform for wafer alignment assembly and the use method thereof proposed in the present application; Figure 2 It is a side view of the electric lifting platform for wafer alignment assembly and the use method thereof proposed in the present application; Figure 3 It is an assembly schematic view of the hydraulic cylinder lifting frame of the electric lifting platform for wafer alignment assembly and the use method thereof proposed in the present application; Figure 4A schematic diagram of a wafer upper sealing plate and connecting components of a wafer alignment assembly electric lift platform and its use method is provided in the present application; Figure 5 A schematic diagram of a mounting plate of a wafer alignment assembly electric lift platform and its use method is provided in the present application; Figure 6 A schematic diagram of a wafer upper sealing plate assembly of a wafer alignment assembly electric lift platform and its use method is provided in the present application; Figure 7 A schematic diagram of a lower heat conduction assembly of an aging plate of a wafer alignment assembly electric lift platform and its use method is provided in the present application; Figure 8 A schematic diagram of a lower heat conduction assembly assembly of an aging plate of a wafer alignment assembly electric lift platform and its use method is provided in the present application.

[0013] In the figure: 10, aging cover plate assembly; 11, wafer upper sealing plate; 12, PC plate ceramic base plate; 13, mounting hole; 14, mounting plate; 141, needle card fixing plate; 142, needle card reinforcing plate; 143, decorative plate; 144, test needle plate; 145, needle card side plate; 15, lower heat conduction assembly of aging plate; 151, wafer cavity sealing assembly; 152, wafer to be tested; 153, wafer positioning plate; 154, heat conduction main plate; 155, protection frame; 156, connecting pin; 20, lift controller; 30, support frame; 40, positioning baffle; 50, hydraulic oil cylinder lifting frame; 51, adjusting knob; 52, hydraulic oil cylinder; 53, lifting plate; 54, upper limiting clamping plate; 55, support rod; 56, lower limiting clamping plate; 57, base. DETAILED DESCRIPTION

[0014] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below.

[0015] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be practiced in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the concept of the present application, therefore the present application is not limited to the specific embodiments disclosed below.

[0016] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. "In one embodiment" appearing in different places in the specification does not mean the same embodiment, nor is it an embodiment that is separate or alternative to other embodiments.

[0017] Unless otherwise specified, the raw materials used in the examples were purchased commercially.

[0018] like Figures 1-4 As shown, the present application discloses an electric lifting platform for wafer alignment assembly, including a support frame 30, with positioning baffles 40 on both sides of the top of the support frame 30, an aging cover assembly 10 is placed inside the two fixed baffles, a hydraulic cylinder lifting frame 50 is installed in the support frame 30, a wafer positioning plate 153 is provided on the top of the hydraulic cylinder lifting frame 50, a wafer to be tested 152 is installed in the wafer positioning plate 153, the hydraulic cylinder lifting frame 50 is correspondingly arranged at the bottom of the aging cover assembly 10, a lifting controller 20 is provided on one side of the bottom of the support frame 30, the lifting controller 20 is electrically connected to the hydraulic cylinder lifting frame 50, the aging cover assembly 10 is placed on the top of the hydraulic cylinder lifting frame 50 through the positioning baffle 40, the wafer to be tested 152 is placed on the wafer positioning plate 153, the hydraulic cylinder lifting frame 50 is controlled to rise and fall by the lifting controller 20, and the wafer to be tested 152 is installed in the aging cover assembly 10.

[0019] In the above embodiment, a hydraulic cylinder 52 is provided on one side of the hydraulic cylinder lifting frame 50, and an adjusting knob 51 is provided on one side of the hydraulic cylinder 52. A base 57 is provided at the bottom of the hydraulic cylinder lifting frame 50, and the top of the base 57 is fixedly connected to a limited lower clamping plate 56. A support rod 55 is folded and connected to the limited lower clamping plate 56. The top of the support rod 55 is connected to a lifting plate 53. A limited upper clamping plate 54 is provided at the bottom of the lifting plate 53 corresponding to the support rod 55, and the top of the support rod 55 is connected to the limited upper clamping plate 54. The hydraulic cylinder lifting frame 50 controls the hydraulic cylinder 52 to provide power through the lifting controller 20 or the adjusting knob 51, controls the support rod 55 to rise and fall on the surface of the base 57, and then drives the lifting plate 53 on the top to rise and fall.

[0020] Among them, the aging cover plate assembly 10 is provided with a mounting plate 14, a mounting hole 13 is provided in the middle of the mounting plate 14, an aging plate lower heat-conducting assembly 15 is provided at the bottom of the mounting plate 14, a PC board ceramic pad 12 is installed on the aging plate lower heat-conducting assembly 15, and the top of the mounting hole 13 is connected to the wafer upper sealing plate 11. The wafer 152 to be tested is installed in the aging plate lower heat-conducting assembly 15 through a hydraulic cylinder lifting frame 50.

[0021] In the above embodiment, the mounting plate 14 is provided with a needle card reinforcing plate 142, the bottom of the needle card reinforcing plate 142 is provided with a needle card fixing plate 141, the needle card fixing plate 141 is provided with a decorative plate 143, the top of the decorative plate 143 is provided with a needle card side plate 145 which is slidably connected with a positioning baffle 40, the needle card side plate 145 is connected with a test needle plate 144, the to-be-tested wafer 152 is electrically connected to the test needle plate 144, the aging plate lower heat conduction assembly 15 is provided with a protection frame 155, the protection frame 155 is provided with a heat conduction main plate 154, the heat conduction main plate 154 is provided with a wafer positioning plate 153, the to-be-tested wafer 152 is mounted on the wafer positioning plate 153, the surface of the protection frame 155 is provided with a plurality of wafer cavity sealing assemblies 151, the aging plate lower heat conduction assembly 15 is connected with a connecting pin 156, and the aging plate lower heat conduction assembly 15 is fixed to the bottom of the mounting plate 14 through the connecting pin 156.

[0022] A use method of the electric lifting platform for wafer alignment and assembly according to any one of claims 1-5, characterized in that, In the first step, the mounting plate 14 of the aging cover plate assembly 10 is placed on the top of the support frame 30 through the positioning baffle 40, and the wafer upper sealing plate 11 and the PC plate ceramic pad plate 12 on the aging cover plate assembly 10 are removed to expose the mounting hole 13; In the second step, the to-be-tested wafer 152 is placed on the wafer positioning plate 153 of the heat conduction main plate 154, and then the protection frame 155 at the bottom of the heat conduction main plate 154 is placed on the lifting plate 53 at the top of the hydraulic oil cylinder lifting frame 50; In the third step, the hydraulic oil cylinder lifting frame 50 is pushed into the bottom of the installed aging cover plate assembly 10 by controlling the hydraulic oil cylinder lifting frame 50 to descend through the lifting controller 20, and the center points of the mounting hole 13 and the protection frame 155 are in the same vertical position; In the fourth step, the aging plate lower heat conduction assembly 15 is sent into the bottom of the aging cover plate assembly 10 by controlling the hydraulic oil cylinder lifting frame 50 to preliminarily rise through the lifting controller 20; In the fifth step, the to-be-tested wafer 152 is loaded into the decorative plate 143 of the aging cover plate assembly 10 by manual secondary rising through the adjusting knob 51, and the test needle plate 144 is in safe contact with the to-be-tested wafer 152; In the sixth step, the needle card fixing plate 141 and the PC plate ceramic pad plate 12 are sequentially placed on the top of the test needle plate 144, and then the wafer upper sealing plate 11 is installed on the top of the mounting hole 13 through the bolt, and the installation of the to-be-tested wafer 152 in the aging cover plate assembly 10 is completed; In the seventh step, the installed aging cover plate assembly 10 is taken off from the support frame 30, and then is placed into the wafer test equipment for aging test.

[0023] It should be noted that the above has shown and described the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A motorized lift table for wafer alignment assembly comprising a support frame (30), characterized in that, The support frame (30) is provided with positioning baffle (40) on both sides of the top, the inside of the two positioning baffle is placed with aging cover plate assembly (10), the support frame (30) is installed with hydraulic oil cylinder lifting frame (50), the top of the hydraulic oil cylinder lifting frame (50) is provided with wafer positioning plate (153), the wafer positioning plate (153) is installed with the wafer to be measured (152), the hydraulic oil cylinder lifting frame (50) is correspondingly arranged at the bottom of aging cover plate assembly (10), the bottom side of the support frame (30) is provided with lifting controller (20), the lifting controller (20) is electrically connected with the hydraulic oil cylinder lifting frame (50), the aging cover plate assembly (10) is placed on the top of the hydraulic oil cylinder lifting frame (50) through the positioning baffle (40), the wafer to be measured (152) is placed on the wafer positioning plate (153), the wafer to be measured (152) is installed into the aging cover plate assembly (10) by controlling the hydraulic oil cylinder lifting frame (50) lifting through the lifting controller (20).

2. The electric lift table for wafer alignment assembly according to claim 1, wherein, The aging cover plate assembly (10) is provided with mounting plate (14), the mounting plate (14) is provided with mounting hole (13) in the middle, the bottom of the mounting plate (14) is provided with aging plate lower heat conduction assembly (15), the PC board ceramic backing plate (12) is installed on the aging plate lower heat conduction assembly (15), the wafer upper sealing plate (11) is connected on the top of the mounting hole (13), the wafer to be measured (152) is installed in the aging plate lower heat conduction assembly (15) through the hydraulic oil cylinder lifting frame (50).

3. The electric lift table for wafer alignment assembly according to claim 2, wherein, The mounting plate (14) is provided with needle card reinforcing plate (142), the bottom of the needle card reinforcing plate (142) is provided with needle card fixed plate (141), the needle card fixed plate (141) is provided with decorative plate (143), the top of the decorative plate (143) is provided with needle card side plate (145) that is slidably connected with the positioning baffle (40), the test needle plate (144) is connected on the needle card side plate (145), the wafer to be measured (152) is electrically connected on the test needle plate (144).

4. The electric lift table for wafer alignment assembly according to claim 2, wherein, The aging plate lower heat conduction assembly (15) is provided with protection frame (155), the protection frame (155) is provided with heat conduction main plate (154) in it, the heat conduction main plate (154) is provided with wafer positioning plate (153) in it, the wafer to be measured (152) is installed on the wafer positioning plate (153), the surface of the protection frame (155) is provided with a plurality of wafer cavity sealing assemblies (151), the aging plate lower heat conduction assembly (15) is connected with connecting pin (156) around, the aging plate lower heat conduction assembly (15) is fixed on the bottom of the mounting plate (14) through the connecting pin (156).

5. The electric lift table for wafer alignment assembly according to claim 1, wherein, The hydraulic oil cylinder lifting frame (50) is provided with a hydraulic oil cylinder (52) on one side, the hydraulic oil cylinder (52) is provided with an adjusting knob (51) on one side, the bottom of the hydraulic oil cylinder lifting frame (50) is provided with a base (57), the top of the base (57) is fixedly connected with a limiting lower clamping plate (56), the limiting lower clamping plate (56) is foldably connected with a supporting rod (55), the top of the supporting rod (55) is connected with a lifting plate (53), the bottom of the lifting plate (53) is provided with a limiting upper clamping plate (54) corresponding to the supporting rod (55), the top of the supporting rod (55) is connected to the limiting upper clamping plate (54), the hydraulic oil cylinder lifting frame (50) is controlled by the lifting controller (20) or the adjusting knob (51) to control the hydraulic oil cylinder (52) to provide power, and the supporting rod (55) is controlled to ascend and descend on the surface of the base (57), so as to drive the lifting plate (53) on the top to ascend and descend.

6. A method for using an electric lifting platform for wafer alignment assembly, characterized in that: Firstly, the mounting plate (14) of the aging cover plate assembly (10) is placed on the top of the support frame (30) through the positioning baffle (40), and the wafer upper sealing plate (11) and the PC plate ceramic pad (12) on the aging cover plate assembly (10) are removed to expose the mounting hole (13); Secondly, the wafer to be tested (152) is placed on the wafer positioning plate (153) of the heat-conducting main plate (154), and then the protection frame (155) at the bottom of the heat-conducting main plate (154) is placed on the lifting plate (53) at the top of the hydraulic oil cylinder lifting frame (50); Thirdly, the hydraulic oil cylinder lifting frame (50) is controlled to descend by the lifting controller (20), the hydraulic oil cylinder lifting frame (50) is pushed into the bottom of the installed aging cover plate assembly (10), and the center points of the mounting hole (13) and the protection frame (155) are in the same vertical position; Fourthly, the hydraulic oil cylinder lifting frame (50) is controlled to preliminarily ascend by the lifting controller (20), and the aging plate lower heat-conducting assembly (15) is sent into the bottom of the aging cover plate assembly (10); Fifthly, the wafer to be tested (152) is loaded into the decorative plate (143) of the aging cover plate assembly (10) by manual secondary ascent through the adjusting knob (51), and the test needle plate (144) is in safe contact with the wafer to be tested (152); Sixthly, the needle card fixing plate (141) and the PC plate ceramic pad (12) are sequentially placed on the top of the test needle plate (144), and then the wafer upper sealing plate (11) is installed on the top of the mounting hole (13) through bolts, and the installation of the wafer to be tested (152) in the aging cover plate assembly (10) is completed; Seventhly, the installed aging cover plate assembly (10) is taken off from the support frame (30), and then is placed into the wafer test equipment for aging test.

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