Liquid cooling plate and liquid cooling assembly for high-power chips

Abstract

The application relates to the technical field of heat management, in particular to a liquid cooling plate and a liquid cooling assembly for a high-power chip. The liquid cooling plate comprises a bottom plate, one end of the bottom plate is provided with a first inlet flow channel and a plurality of second inlet flow channels along the extension direction of the bottom plate, and the other end is provided with a first outlet flow channel and a plurality of second outlet flow channels. A plurality of shunt flow channels are further arranged on the bottom plate, the plurality of shunt flow channels have at least two different extension directions, and the plurality of shunt flow channels are in communication with each other. The first inlet flow channel, the second inlet flow channel, the first outlet flow channel and the second outlet flow channel are in communication with at least one shunt flow channel respectively. The liquid cooling plate improves the heat exchange efficiency and reduces the energy consumption by optimizing the flow channel structure, so that the heat dissipation demand of the high heat flux density chip can be met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thermal management, in particular to a liquid cooling plate and a liquid cooling assembly for high-power chips. BACKGROUND

[0002] With the continuous increase of demand for computing power of high-performance computing and artificial intelligence chips, the single-card power of chips continues to rise, which causes the temperature of the chips to continue to rise. However, the temperature rise of the chip will cause its reliability and working life to decrease dramatically.

[0003] At present, liquid cooling through a liquid cooling plate is the most commonly used and reliable heat dissipation technology. The liquid cooling plate usually includes a bottom plate and a cover plate, a flow channel is formed on the bottom plate, and the bottom plate is connected with the cover plate. Among them, the bottom plate is used to contact with the heat source, and the cover plate is used to seal the flow channel. Through the flow of the cooling medium in the flow channel, heat exchange occurs between the cooling medium and the wall surface of the flow channel, so that the heat generated by the heat source is quickly taken away.

[0004] The flow channel of the traditional liquid cooling plate is usually a straight flow channel, an S-shaped flow channel, a spiral flow channel or a tree-shaped flow channel designed according to experience. However, the above flow channels have the problems of low heat exchange efficiency, high energy consumption, and cannot adapt to the heat dissipation requirements of high heat flux density chips. SUMMARY

[0005] The embodiments of the present application provide a liquid cooling plate and a liquid cooling assembly for high-power chips, which improve the heat exchange efficiency and reduce the energy consumption by optimizing the flow channel structure, so as to adapt to the heat dissipation requirements of high heat flux density chips.

[0006] In a first aspect, the embodiments of the present application provide a liquid cooling plate for high-power chips, which comprises:

[0007] A bottom plate, along the extension direction of the bottom plate, one end of the bottom plate is provided with a first inlet flow channel and a plurality of second inlet flow channels, the other end is provided with a first outlet flow channel and a plurality of second outlet flow channels, and a plurality of shunt flow channels are further provided on the bottom plate, a plurality of the shunt flow channels have at least two different extension directions, and a plurality of the shunt flow channels are in communication with each other.

[0008] Among them, the first inlet flow channel, the second inlet flow channel, the first outlet flow channel and the second outlet flow channel are respectively communicated with at least one shunt flow channel.

[0009] The liquid cooling plate for high-power chips provided by the embodiment of the present application provides a support base for the flow channel through the bottom plate. One end of the bottom plate is provided with a first inlet flow channel and a plurality of second inlet flow channels for the cooling medium to flow in. The other end of the bottom plate is provided with a first outlet flow channel and a plurality of second outlet flow channels for the cooling medium to flow out. The bottom plate is further provided with a plurality of branch flow channels, and the first inlet flow channel, the second inlet flow channel, the first outlet flow channel and the second outlet flow channel are respectively communicated with at least one branch flow channel for the cooling medium to flow and exchange heat.

[0010] When the liquid cooling plate works, the cooling medium flows into the first inlet flow channel and the plurality of second inlet flow channels, and flows in through the plurality of inlets, so that the cooling medium is quickly and uniformly distributed to the branch flow channels. The cooling medium flows into the branch flow channels. The plurality of branch flow channels have at least two different extension directions, and the plurality of branch flow channels are communicated with each other. The cooling medium can flow in multiple directions in the branch flow channels according to the flow resistance distribution, thereby improving the uniformity of the cooling medium distribution and avoiding local overheating. The cooling medium flows out through the first outlet flow channel and the plurality of second outlet flow channels, and the plurality of outlets enable the liquid cooling plate to quickly leave the liquid cooling plate, thereby improving the heat exchange efficiency.

[0011] Therefore, the liquid cooling plate for high-power chips provided by the embodiment of the present application optimizes the structure of the flow channel, improves the heat exchange efficiency, reduces the energy consumption, and thus achieves the effect of adapting to the heat dissipation demand of high heat flux density chips.

[0012] In a possible implementation, at least one first inlet flow channel is arranged between the side edge of the bottom plate and the second inlet flow channel adjacent to the side edge of the bottom plate; at least one first outlet flow channel is arranged between the side edge of the bottom plate and the second outlet flow channel adjacent to the side edge of the bottom plate, and the at least one first outlet flow channel is arranged between the plurality of second outlet flow channels.

[0013] In a possible implementation, the plurality of second inlet flow channels, the first inlet flow channel, the plurality of second outlet flow channels, the first outlet flow channel and the plurality of branch flow channels are symmetrically arranged relative to the central axis of the bottom plate.

[0014] In a possible implementation, the branch flow channel includes a first branch flow channel, a second branch flow channel and a plurality of third branch flow channels.

[0015] Both ends of at least one first branch flow channel are respectively communicated with the first inlet flow channel and the first outlet flow channel; both ends of at least one second branch flow channel are respectively communicated with the first inlet flow channel and the plurality of second outlet flow channels.

[0016] The first branch flow channel and the second branch flow channel are communicated through the plurality of third branch flow channels.

[0017] In a possible implementation, the flow distribution channels further include a fourth flow distribution channel and a fifth flow distribution channel.

[0018] Two ends of the at least one fourth flow distribution channel are respectively in communication with the second inlet channel and the first outlet channel.

[0019] The second flow distribution channel and the fourth flow distribution channel are in communication through the plurality of fifth flow distribution channels.

[0020] In a possible implementation, in the first direction, the cross-sectional size of the first inlet channel is greater than the cross-sectional size of the second inlet channel; and the cross-sectional size of the first outlet channel is greater than the cross-sectional size of the second outlet channel.

[0021] In a possible implementation, in the first direction, the cross-sectional size of the first inlet channel is at least three times the cross-sectional size of the second inlet channel; and the cross-sectional size of the first outlet channel is at least three times the cross-sectional size of the second outlet channel.

[0022] In a possible implementation, a plurality of first outlet channels are provided, and at least one of the first outlet channels is provided with a turbulence column.

[0023] In a possible implementation, a cover plate is further provided, and the cover plate is arranged on the bottom plate.

[0024] The cover plate and the two ends of the bottom plate form a first cavity and a second cavity, respectively; the cover plate is provided with a liquid inlet in communication with the first cavity, and is provided with a liquid outlet in communication with the second cavity; the first cavity is in communication with the first inlet channel and the second inlet channel; and the second cavity is in communication with the first outlet channel and the second outlet channel.

[0025] In another aspect, the application provides a liquid cooling assembly, which includes the liquid cooling plate according to any one of the preceding aspects.

[0026] The liquid cooling assembly provided by the embodiments of the application has the same technical effects as the liquid cooling plate, i.e., the heat exchange efficiency is improved, the energy consumption is reduced, and the heat dissipation requirement of a high heat flux chip is met. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative labor.

[0028] Figure 1 A structural schematic diagram of a base plate provided for the present application is shown in the following figure.

[0029] Figure 2 A structural schematic diagram of a first inlet flow channel, a second inlet flow channel, a first outlet flow channel, a second outlet flow channel and a distribution flow channel provided for the present application is shown in the following figure.

[0030] Figure 3 A structural schematic diagram of a liquid cooling plate for high-power chips provided for the present application is shown in the following figure.

[0031] 100 - base plate; 110 - first inlet flow channel; 120 - second inlet flow channel; 130 - first outlet flow channel; 140 - second outlet flow channel; 150 - distribution flow channel; 151 - first distribution flow channel; 152 - second distribution flow channel; 153 - third distribution flow channel; 154 - fourth distribution flow channel; 155 - fifth distribution flow channel;

[0032] 200 - turbulence column;

[0033] 300 - cover plate; 310 - first cavity; 311 - liquid inlet; 320 - second cavity; 321 - liquid outlet;

[0034] X - first direction. DETAILED DESCRIPTION

[0035] In the description of the embodiments of the present application, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover a non-exclusive inclusion, for example, a process, a method, a display structure, a product or an apparatus including a step or a unit does not necessarily include only those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to the process, the method, the product or the apparatus.

[0036] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "electrical connection" and the like (if any) should be understood in a broad sense, for example, can be fixed electrical connection, can be indirect connection through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0037] The terms “left”, “right”, “top”, “bottom”, “inside”, “outside”, etc. (if any) in the description and claims of the present application indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0038] The terms “first”, “second”, “third”, “fourth”, etc. (if any) in the description and claims of the present application are used to distinguish similar objects, and do not necessarily describe a particular order or sequence.

[0039] In the embodiments of the present application, the words “exemplarily” or “for example” are used to represent an example, illustration or description. Any embodiment or design scheme described as “exemplarily” or “for example” in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words “exemplarily” or “for example” are intended to present the relevant concept in a specific manner.

[0040] With the rapid development of artificial intelligence (AI), high-performance computing (HPC) and 5G communication technology, the computing power demand of chips is growing exponentially. The exponential growth of the computing power demand of chips will continuously increase the single card power of the chips and continuously increase the temperature of the chips, thereby causing the reliability and working life of the chips to decrease dramatically.

[0041] According to a large amount of experimental data, the performance reliability of a chip will decrease by 10% for every 2℃ increase in the temperature of the chip. Among them, as high as 55% of electronic components fail due to temperature exceeding the specified value. Therefore, the heat dissipation of high-power chips has become a key bottleneck restricting the development of artificial intelligence and high-performance computing technology.

[0042] At present, liquid cooling technology is usually used to dissipate heat from the chip. Specifically, a liquid cooling plate is usually used to dissipate heat from the chip. The liquid cooling plate includes a bottom plate, a cover plate and a flow channel. The flow channel is provided on the bottom plate, and the cover plate is used to seal the bottom plate. The liquid cooling medium flows in the flow channel, exchanges heat with the heat source through the bottom plate, and achieves the effect of cooling.

[0043] The flow channel of the existing liquid cooling plate is usually a straight flow channel, an S-shaped flow channel or a tree-shaped flow channel designed according to experience.

[0044] However, the direct flow channel is prone to cause the cooling medium to flow through all areas, resulting in local overheating. The S-shaped flow channel can extend the flow path of the cooling medium, but significantly increases the pressure drop, requiring a high-power pump body to deliver the cooling medium, resulting in increased energy consumption. The tree-shaped flow channel designed according to experience is not optimized by fluid dynamics, and is prone to uneven distribution of the cooling medium.

[0045] Wherein, the pressure drop is also called pressure loss, which refers to the phenomenon that the pressure of fluid (such as cooling medium) gradually decreases when flowing through the flow channel due to factors such as friction and resistance.

[0046] In summary, the above flow channels have certain limitations. Therefore, how to meet the heat dissipation requirements of high heat flux chips is a technical problem that needs to be solved at present.

[0047] Therefore, the liquid cooling plate and liquid cooling assembly for high-power chips provided by the embodiments of the present application provide a support basis for the flow channel through the bottom plate 100. One end of the bottom plate 100 is provided with a first inlet flow channel 110 and a plurality of second inlet flow channels 120 for the cooling medium to flow in. The other end of the bottom plate 100 is provided with a first outlet flow channel 130 and a plurality of second outlet flow channels 140 for the cooling medium to flow out. The bottom plate 100 is also provided with a plurality of shunt flow channels 150, and the first inlet flow channel 110, the second inlet flow channel 120, the first outlet flow channel 130 and the second outlet flow channel 140 are respectively communicated with at least one shunt flow channel 150 for the cooling medium to flow and exchange heat. By optimizing the structure of the flow channel, the heat exchange efficiency is improved, and the energy consumption is reduced, so as to meet the heat dissipation requirements of high heat flux chips.

[0048] The liquid cooling plate and liquid cooling assembly for high-power chips provided by the embodiments of the present application are further described below in combination with the drawings and embodiments.

[0049] Reference Figure 1 and Figure 2 , the liquid cooling plate for high-power chips provided by the embodiments of the present application. The liquid cooling plate comprises a bottom plate 100. Along the extension direction of the bottom plate 100, one end of the bottom plate 100 is provided with a first inlet flow channel 110 and a plurality of second inlet flow channels 120, and the other end is provided with a first outlet flow channel 130 and a plurality of second outlet flow channels 140. The bottom plate 100 is also provided with a plurality of shunt flow channels 150, and the plurality of shunt flow channels 150 have at least two different extension directions, and the plurality of shunt flow channels 150 are communicated with each other.

[0050] Wherein, the first inlet flow channel 110, the second inlet flow channel 120, the first outlet flow channel 130 and the second outlet flow channel 140 are respectively communicated with at least one shunt flow channel 150.

[0051] When the liquid cooling plate is working, the cooling medium first flows into the first inlet flow channel 110 and the plurality of second inlet flow channels 120. Among them, the first inlet flow channel 110 can be responsible for conveying most of the cooling medium, and the plurality of second inlet flow channels 120 can supplement the cooling medium through different positions.

[0052] By providing the first inlet flow channel 110 and the plurality of second inlet flow channels 120 at one end of the bottom plate 100, while ensuring the flow of the cooling medium, the cooling medium can be more evenly distributed into the distribution flow channels 150.

[0053] The first inlet flow channel 110 and the second inlet flow channel 120 are respectively communicated with the distribution flow channels 150, and the cooling medium flows into the distribution flow channels 150. Since the bottom plate 100 is provided with a plurality of distribution flow channels 150, the plurality of distribution flow channels 150 have at least two different extension directions, and the plurality of distribution flow channels 150 are communicated with each other, so that the cooling medium flows in multiple directions.

[0054] Specifically, the cooling medium will select the flow direction according to the size of the flow resistance and diffuse in all directions, so as to flow through the bottom plate 100 to the greatest extent, and exchange heat with the heat source through the bottom plate 100, while ensuring the uniformity of the cooling medium flow, and increasing the heat exchange area.

[0055] The cooling medium that has completed heat exchange with the heat source will continue to flow. The first outlet flow channel 130 and the second outlet flow channel 140 are respectively communicated with the distribution flow channels 150, and the cooling medium finally flows into the first outlet flow channel and the second outlet flow channel.

[0056] Among them, the first outlet flow channel can be responsible for outputting most of the cooling medium, and the plurality of second outlet flow channels can output the cooling medium through multiple positions, which can avoid the retention of the cooling medium after heat exchange, causing the local temperature to be too high, so that the cooling medium is quickly and uniformly discharged, thereby improving the heat exchange efficiency of the liquid cooling plate.

[0057] Therefore, the liquid cooling plate for high-power chips provided by the embodiment of the present application provides a support basis for the flow channel through the bottom plate 100. One end of the bottom plate 100 is provided with the first inlet flow channel 110 and the plurality of second inlet flow channels 120 for the cooling medium to flow in. The other end of the bottom plate 100 is provided with the first outlet flow channel 130 and the plurality of second outlet flow channels 140 for the cooling medium to flow out. The bottom plate 100 is also provided with a plurality of distribution flow channels 150, and the first inlet flow channel 110, the second inlet flow channel 120, the first outlet flow channel 130, and the second outlet flow channel 140 are respectively communicated with at least one distribution flow channel 150 for the cooling medium to flow and exchange heat.

[0058] When the liquid cooling plate is working, the cooling medium flows into the first inlet flow channel 110 and the plurality of second inlet flow channels 120, and the multi-inlet flow makes the cooling medium quickly and uniformly distributed to the distribution flow channels 150. The cooling medium flows into the distribution flow channels 150. Among them, the plurality of distribution flow channels 150 have at least two different extension directions, and the plurality of distribution flow channels 150 are communicated with each other. The cooling medium can flow in multiple directions in the distribution flow channels 150 according to the flow resistance distribution, thereby improving the uniformity of the cooling medium distribution and avoiding local overheating. The cooling medium flows out through the first outlet flow channel 130 and the plurality of second outlet flow channels 140, and the plurality of outlets make the liquid cooling plate quickly leave the liquid cooling plate, thereby improving the heat exchange efficiency.

[0059] Therefore, the liquid cooling plate for high-power chips provided by the embodiments of the present application can improve the heat exchange efficiency and reduce the energy consumption by optimizing the flow channel structure, thereby meeting the heat dissipation requirements of high heat flux chips.

[0060] In some embodiments of the present application, in the first direction X, the cross-sectional size of the first inlet flow channel 110 is greater than that of the second inlet flow channel 120. The cross-sectional size of the first outlet flow channel 130 is greater than that of the second outlet flow channel 140.

[0061] It should be noted that the cross section refers to the cross section perpendicular to the flow direction of the cooling medium. The cross-sectional size refers to the length size of the cross section extending along the first direction X.

[0062] According to fluid mechanics, when the flow rate is constant, the larger the cross-sectional size of the flow channel, the slower the flow rate of the fluid, and the smaller the flow resistance.

[0063] The cross-sectional size of the first inlet flow channel 110 is greater than that of the second inlet flow channel 120, so that the cooling medium is more easily flowed into the first inlet flow channel 110. Similarly, the cross-sectional size of the first outlet flow channel 130 is greater than that of the second outlet flow channel 140, so that the cooling medium is more easily flowed out of the first outlet flow channel 130. Therefore, while improving the heat exchange efficiency, the power requirement of the pump body driving the cooling medium can be reduced, and the energy consumption can be reduced.

[0064] Because the number of the second inlet flow channels 120 and the second outlet flow channels 140 is large, the second inlet flow channels 120 and the second outlet flow channels 140 can distribute and collect the cooling medium to a wider area, thereby ensuring the uniformity of the temperature of the liquid cooling plate.

[0065] In some embodiments of the present application, in the first direction X, the cross-sectional size of the first inlet flow channel 110 is at least three times the cross-sectional size of the second inlet flow channel 120. The cross-sectional size of the first outlet flow channel 130 is at least three times the cross-sectional size of the second outlet flow channel 140. Therefore, the flow resistance can be effectively reduced, and the heat exchange efficiency can be improved.

[0066] Exemplarily, the cross-sectional dimension of the first inlet flow channel 110 can be three times, four times, five times, or six times, etc. of the cross-sectional dimension of the second inlet flow channel 120. Similarly, the cross-sectional dimension of the first outlet flow channel 130 can be three times, four times, five times, or six times, etc. of the cross-sectional dimension of the second outlet flow channel 140.

[0067] In the present application, the cross-sectional dimension of the first inlet flow channel 110 is a multiple of the cross-sectional dimension of the second inlet flow channel 120, and the cross-sectional dimension of the first outlet flow channel 130 is a multiple of the cross-sectional dimension of the second outlet flow channel 140, which is not further limited in the present application, as long as the flow resistance and heat exchange efficiency requirements of the liquid cooling plate are met.

[0068] In some embodiments of the present application, at least one first inlet flow channel 110 is provided between the side edge of the bottom plate 100 and the second inlet flow channel 120 adjacent to the side edge of the bottom plate 100.

[0069] Exemplarily, along the first direction X, the bottom plate 100 is sequentially provided with a first inlet flow channel 110 adjacent to one side edge of the bottom plate 100, a plurality of second inlet flow channels 120, and a first inlet flow channel 110 adjacent to the other side edge of the bottom plate 100.

[0070] The two first inlet flow channels 110 adjacent to the two side edges of the bottom plate 100 can be responsible for delivering most of the cooling medium, and the cooling medium in the first inlet flow channel 110 mainly flows into the edge region of the bottom plate 100, so that the edge region of the bottom plate 100 is allocated with sufficient cooling medium. A plurality of second inlet flow channels 120 are provided between the two first inlet flow channels 110. The cooling medium in the plurality of second inlet flow channels 120 mainly flows into the middle region of the bottom plate 100.

[0071] Through the cooperation of the first inlet flow channel 110 and the second inlet flow channel 120, the edge region and the middle region of the bottom plate 100 can be covered by the cooling medium, avoiding uneven flow of the cooling medium and local overheating.

[0072] At least one first outlet flow channel 130 is provided between the side edge of the bottom plate 100 and the second outlet flow channel 140 adjacent to the side edge of the bottom plate 100, and the at least one first outlet flow channel 130 is arranged between the plurality of second outlet flow channels 140.

[0073] Exemplarily, along the first direction X, the other end of the bottom plate 100 is sequentially provided with a first outlet flow channel 130 adjacent to one side edge of the bottom plate 100, a plurality of second outlet flow channels 140, a first outlet flow channel 130, a plurality of second outlet flow channels 140, and a first outlet flow channel 130 adjacent to the other side edge of the bottom plate 100.

[0074] The two first outlet flow channels 130 adjacent to the two side edges of the base plate 100 can be responsible for transporting most of the cooling medium, preventing the cooling medium from stagnating in the edge area, causing local overheating. Since the area with the most heat generation is usually in the middle area, the presence of a first outlet flow channel 130 between multiple second outlet flow channels 140 can allow the cooling medium in the middle area to be quickly discharged, thereby improving heat dissipation efficiency. The second outlet flow channel 140 assists in discharging the cooling medium after heat exchange is completed.

[0075] Through the cooperation of multiple first outlet flow channels 130 and second outlet flow channels 140, the cooling medium has more optional output paths, further reducing the flow resistance of the liquid cooling plate, so that a pump body with smaller power can be used to transport the cooling medium, achieving the effect of reducing energy consumption.

[0076] In some embodiments of the present application, the multiple second inlet flow channels 120, the first inlet flow channel 110, the multiple second outlet flow channels 140, the first outlet flow channel 130, and the multiple distribution flow channels 150 are symmetrically arranged relative to the central axis of the base plate 100.

[0077] For example, the base plate 100 is provided with two first inlet flow channels 110, four second inlet flow channels 120, three first outlet flow channels 130, and fourteen second outlet flow channels 140. Among them, one first outlet flow channel 130 is located on the central axis of the base plate 100, and the remaining two first inlet flow channels 110, four second inlet flow channels 120, two first outlet flow channels 130, fourteen second outlet flow channels 140, and multiple distribution flow channels 150 are symmetrically arranged relative to the central axis of the base plate 100.

[0078] The cooling medium flows in through the symmetrically arranged first inlet flow channel 110 and second inlet flow channel 120 on both sides. Due to the symmetry, the flow and pressure distribution on both sides of the central axis are balanced, ensuring the balance of the cooling medium flow.

[0079] After the cooling medium flows into the four second inlet flow channels 120, it is diffused in various directions through the distribution flow channels 150. Among them, the first outlet flow channel 130 located on the central axis of the base plate 100 can be opposite to the four second inlet flow channels 120. The first outlet flow channel 130 has low flow resistance, so the cooling medium will converge and flow towards the first outlet flow channel 130. The cooling medium after heat exchange can be quickly discharged by the first outlet flow channel 130, thereby achieving the effect of improving heat exchange efficiency.

[0080] In addition, the hottest part of the heat source is usually in the middle area of the liquid cooling plate, so a large amount of cooling medium is directly transported to the middle area for efficient heat exchange.

[0081] In some embodiments of the present application, the distribution flow channel 150 includes a first distribution flow channel 151, a second distribution flow channel 152, and a plurality of third distribution flow channels 153. Both ends of at least one first distribution flow channel 151 are in communication with the first inlet flow channel 110 and the first outlet flow channel 130, respectively. Both ends of at least one second distribution flow channel 152 are in communication with the first inlet flow channel 110 and the plurality of second outlet flow channels 140, respectively. The first distribution flow channel 151 and the second distribution flow channel 152 are in communication through the plurality of third distribution flow channels 153.

[0082] Exemplarily, the cross-sectional size of the first inlet flow channel 110 is larger than that of the second inlet flow channel 120, and the cross-sectional size of the first outlet flow channel 130 is larger than that of the second outlet flow channel 140.

[0083] After the cooling medium flows into the first inlet flow channel 110, part of it flows into the first distribution flow channel 151 and is discharged through the first outlet flow channel 130. Since the cross-sectional size of the first inlet flow channel 110 and the first outlet flow channel 130 is large, the flow resistance of this cooling medium flow path is small, more cooling medium flows in, and the heat exchange efficiency can be improved. Moreover, small flow resistance means that a smaller power pump body can be used to drive the cooling medium, thereby achieving the effect of reducing energy consumption.

[0084] Another part of the cooling medium flows into the second distribution flow channel 152 and is discharged through the plurality of second outlet flow channels 140. The cooling medium is dispersed to more areas of the bottom plate 100, ensuring that the cooling medium covers the bottom plate 100, avoiding local overheating due to the presence of areas where the cooling medium cannot flow, thereby improving the uniformity of the temperature.

[0085] The first distribution flow channel 151 and the second distribution flow channel 152 are in communication through the third distribution flow channel 153. The temperature at different positions on the bottom plate 100 can be different, and the cooling medium can dynamically adjust the flow between the first distribution flow channel 151 and the second distribution flow channel 152 through the third distribution flow channel 153, ensuring the balance of the cooling medium.

[0086] Moreover, at the connection of the third distribution flow channel 153, cooling media from different paths and different temperatures can be mixed with each other, further promoting the uniformity of the temperature of the entire liquid cooling plate.

[0087] Therefore, through the above connection mode, the heat dissipation efficiency is improved while ensuring that the cooling medium is distributed to the entire bottom plate 100, ensuring the temperature uniformity of the liquid cooling plate and preventing local overheating.

[0088] Exemplarily, the first inlet flow channel 110, the first outlet flow channel 130, the second outlet flow channel 140, the first branch flow channel 151, the second branch flow channel 152, and the third branch flow channel 153 can be designed in a topological bionic structure. By drawing on the fractal structure or vein texture in nature, the flow resistance is reduced and the heat exchange uniformity is improved without increasing the power of the pump body, thereby improving the heat dissipation performance of the liquid cooling plate and reducing the energy consumption.

[0089] For example, the first inlet flow channel 110, the first outlet flow channel 130, the second outlet flow channel 140, and the first branch flow channel 151, the second branch flow channel 152, and the third branch flow channel 153 can be distributed in a tree structure on the bottom plate 100, so that the cooling medium is quickly and uniformly distributed to the entire area that needs to be cooled.

[0090] The cross-sectional size of the first branch flow channel 151 and the second branch flow channel 152 can be different, for example, the cross-sectional size of the first branch flow channel 151 can be smaller than that of the second branch flow channel 152. The cross-sectional size of the third branch flow channel 153 can be smaller than that of the first branch flow channel 151 and the second branch flow channel 152.

[0091] In some embodiments of the present application, the branch flow channel 150 further includes a fourth branch flow channel 154 and a fifth branch flow channel 155. Both ends of at least one fourth branch flow channel 154 are in communication with the second inlet flow channel 120 and the first outlet flow channel 130, respectively. The second branch flow channel 152 and the fourth branch flow channel 154 are in communication through a plurality of fifth branch flow channels 155.

[0092] Exemplarily, the cooling medium flows into a plurality of second inlet flow channels 120, part of the cooling medium can be discharged by the first outlet flow channel 130 through the fourth branch flow channel 154, and another part of the cooling medium can flow into the second branch flow channel 152 through the fifth branch flow channel 155 and be discharged through the second outlet flow channel 140.

[0093] Since the cross-sectional size of the first outlet flow channel 130 is larger than that of the second outlet flow channel 140, the flow resistance of the first outlet flow channel 130 is smaller than that of the second outlet flow channel 140. The cooling medium will tend to flow to the first outlet flow channel 130, and the first outlet flow channel 130 allows the cooling medium to flow out quickly, achieving the unity of heat dissipation efficiency, temperature uniformity, and low flow resistance.

[0094] Exemplarily, the second inlet flow channel 120, the fourth branch flow channel 154, the fifth branch flow channel 155, and the first outlet flow channel 130 can also be designed in a topological bionic structure.

[0095] The distribution of the second inlet flow channel 120, the fourth branch flow channel 154, the fifth branch flow channel 155 and the first outlet flow channel 130 on the bottom plate 100 can also be a tree structure. The tree structure is opposite to the direction of the tree structure formed by the first inlet flow channel 110, the first outlet flow channel 130, the second outlet flow channel 140 and the first branch flow channel 151, the second branch flow channel 152 and the third branch flow channel 153 on the bottom plate 100.

[0096] Exemplarily, the first inlet flow channel 110, the first outlet flow channel 130, the second outlet flow channel 140 and the first branch flow channel 151, the second branch flow channel 152 and the third branch flow channel 153 on the bottom plate 100 can be a branch tree structure.

[0097] The branch tree structure refers to a tree structure in which the cooling medium flowing in through a single inlet is distributed to multiple outlets.

[0098] Specifically, part of the cooling medium flows into a first branch flow channel 151 through a first inlet flow channel 110 and then flows out through a first outlet flow channel 130, so that the cooling medium can flow quickly and the heat exchange efficiency is improved.

[0099] Part of the cooling medium flows into a second branch flow channel 152 through the same first inlet flow channel 110 and then flows out through multiple second outlet flow channels 140. Moreover, the first branch flow channel 151 and the second branch flow channel 152 are connected through multiple third branch flow channels 153. The cooling medium is dispersed to more areas of the bottom plate 100 through the multiple second outlet flow channels 140 and the multiple third branch flow channels 153, so as to avoid local overheating and improve the heat exchange uniformity.

[0100] The second inlet flow channel 120, the fourth branch flow channel 154, the fifth branch flow channel 155 and the first outlet flow channel 130 on the bottom plate 100 can be a confluence tree structure.

[0101] The confluence tree structure refers to a tree structure in which the cooling medium flowing in through multiple inlets is converged to one outlet.

[0102] Specifically, the cooling medium flows into a fourth branch flow channel 154 through four second inlet flow channels 120 and then flows out through a first outlet flow channel 130. The four second inlet flow channels 120 disperse the cooling medium to more areas of the bottom plate 100, which can improve the heat exchange uniformity of the liquid cooling plate. The first outlet flow channel 130 allows the cooling medium to be quickly discharged, thereby improving the heat exchange efficiency.

[0103] The second branch flow channel 152 and the fourth branch flow channel 154 are communicated through a plurality of fifth branch flow channels 155, that is, the branch tree structure and the confluence tree structure are communicated through the plurality of fifth branch flow channels 155, further ensuring the uniformity of the dispersion of the cooling medium, thereby improving the heat exchange uniformity of the liquid cooling plate.

[0104] The liquid cooling plate includes one confluence tree structure and two branch tree structures. The confluence tree structure is symmetrically arranged relative to the central axis of the bottom plate 100. Specifically, the first outlet flow channel 130 in the confluence tree structure is located on the central axis of the bottom plate 100. Two second inlet flow channels 120 are symmetrically arranged on both sides of the central axis of the bottom plate 100. The fourth branch flow channel 154 and the fifth branch flow channel 155 are also symmetrically arranged relative to the central axis of the bottom plate 100.

[0105] The two branch tree structures are symmetrically arranged relative to the central axis of the bottom plate 100 on both sides of the confluence tree structure.

[0106] By simultaneously having the branch tree structure and the confluence tree structure in the liquid cooling plate, and symmetrically distributing the branch tree structure and the confluence tree structure on the bottom plate 100, the flow and pressure distribution of the liquid cooling medium in the liquid cooling plate is more balanced. While ensuring to improve the heat exchange efficiency, the heat exchange uniformity of the liquid cooling plate is improved, the energy consumption is reduced, and the effect of adapting to the heat dissipation demand of the high heat flux chip is achieved.

[0107] In some embodiments of the present application, a plurality of first outlet flow channels 130 are provided, and at least one first outlet flow channel 130 is provided with a turbulence column 200.

[0108] The turbulence column 200 is used to change the flow direction of the cooling medium. When the cooling medium flows through the first outlet flow channel 130, the cooling medium encounters the turbulence column 200. The cooling medium is forced to change the flow direction, break the boundary layer thermal resistance, enhance the turbulent effect, so that the originally stable cooling medium becomes unstable, and new cooling medium is constantly added, thereby improving the heat exchange efficiency.

[0109] The boundary layer thermal resistance refers to the physical phenomenon that due to the slowing down of the flow rate of the fluid near the surface of the solid, a relatively static boundary is formed, thereby hindering the efficient transfer of heat from the surface of the solid to the core of the fluid.

[0110] Referring to Figure 3 In some embodiments of the present application, the liquid cooling plate further includes a cover plate 300 arranged on the bottom plate 100.

[0111] The cover plate 300 and the two ends of the bottom plate 100 form a first cavity 310 and a second cavity 320, respectively. The cover plate 300 is provided with a liquid inlet 311 communicating with the first cavity 310, and the cover plate 300 is provided with a liquid outlet 321 communicating with the second cavity 320. The first cavity 310 communicates with the first inlet flow channel 110 and the second inlet flow channel 120. The second cavity 320 communicates with the first outlet flow channel 130 and the second outlet flow channel 140.

[0112] Exemplarily, the cover plate 300 covers the bottom plate 100 with the first inlet flow channel 110, the second inlet flow channel 120, the first outlet flow channel 130 and the second outlet. On the side of the first inlet flow channel 110 and the second inlet flow channel 120 away from the shunt flow channel 150, the cover plate 300 and the bottom plate 100 jointly form a cavity, which is the first cavity 310. The first cavity 310 is connected with the liquid inlet 311 on the cover plate 300, and at the same time communicates with the first inlet flow channel 110 and the second inlet flow channel 120 below.

[0113] Similarly, on the side of the first outlet flow channel 130 and the second outlet away from the shunt flow channel 150, the cover plate 300 and the bottom plate 100 jointly form another cavity, which is the second cavity 320. The second cavity 320 is connected with the liquid outlet 321 on the cover plate 300, and at the same time communicates with the first outlet flow channel 130 and the second outlet flow channel 140 below.

[0114] The cooling medium enters the first cavity 310 through the liquid inlet 311 on the cover plate 300. In the first cavity 310, the kinetic energy of the cooling medium is converted into pressure energy. Under the action of pressure, the cooling medium flows uniformly and stably into the first inlet flow channel 110 and the second inlet flow channel 120 connected therewith, respectively, to avoid uneven distribution of the cooling medium.

[0115] The cooling medium flows into the shunt flow channel 150 through the first inlet flow channel 110 and the second inlet flow channel 120, and exchanges heat with the heat source.

[0116] After heat exchange, the cooling medium flows out through the first outlet flow channel 130 and the second outlet flow channel 140, and enters the second cavity 320. Finally, it is discharged from the liquid cooling plate through the liquid outlet 321 on the cover plate 300.

[0117] The first cavity 310 and the second cavity 320 of the cover plate 300 can make the cooling medium flow in and out more smoothly, so that the cooling medium is more evenly distributed. And the liquid inlet 311 and the liquid outlet 321 can be connected with the external system through the pipeline, which greatly simplifies the sealing difficulty of the liquid cooling plate.

[0118] Exemplarily, the cover plate 300 and the bottom plate 100 can be made of copper alloy material, so as to have high thermal conductivity and improve the heat exchange efficiency.

[0119] Exemplarily, the cover plate 300 and the bottom plate 100 can be welded and assembled by brazing or friction stir welding.

[0120] In the present application, the materials and connection methods of the cover plate 300 and the bottom plate 100 are not further limited, and only need to meet the liquid cooling requirements and sealing requirements of the liquid cooling plate.

[0121] The following provides a comparative example, by comparing the liquid cooling plate provided in the present application with the conventional liquid cooling plate, the beneficial effects brought by the liquid cooling plate provided in the present application are further described.

[0122] Comparative Example

[0123] It should be noted that the liquid cooling plate for high-power chips provided in the embodiments of the present application includes a bottom plate 100 and a cover plate 300. Along the extension direction of the bottom plate 100, two first inlet flow channels 110 and four second inlet flow channels 120 are arranged at one end of the bottom plate 100. Three first outlet flow channels 130 and fourteen second outlet flow channels 140 are arranged at the other end of the bottom plate 100. A plurality of shunt flow channels 150 are further arranged on the bottom plate 100, the plurality of shunt flow channels 150 have at least two different extension directions, and the plurality of shunt flow channels 150 are in communication with each other. The first inlet flow channel 110, the second inlet flow channel 120, the first outlet flow channel 130, and the second outlet flow channel 140 are respectively in communication with at least one shunt flow channel 150.

[0124] Among them, one first outlet flow channel 130 is located on the central axis of the bottom plate 100, and the other two first inlet flow channels 110, four second inlet flow channels 120, two first outlet flow channels 130, fourteen second outlet flow channels 140, and a plurality of shunt flow channels 150 are symmetrically arranged with respect to the central axis of the bottom plate 100.

[0125] Along the first direction X, one first inlet flow channel 110 adjacent to one side of the bottom plate 100, four second inlet flow channels 120, and one first inlet flow channel 110 adjacent to the other side of the bottom plate 100 are sequentially arranged at one end of the bottom plate 100.

[0126] Along the first direction X, one first outlet flow channel 130 adjacent to one side of the bottom plate 100, seven second outlet flow channels 140, one first outlet flow channel 130 located on the central axis of the bottom plate 100, seven second outlet flow channels 140, and one first outlet flow channel 130 adjacent to the other side of the bottom plate 100 are sequentially arranged at the other end of the bottom plate 100.

[0127] On one side of the central axis of the bottom plate 100, the first inlet flow channel 110 adjacent to the side edge of the bottom plate 100 is communicated with the first outlet flow channel 130 adjacent to the side edge of the bottom plate 100 through a first branch flow channel 151. The first inlet flow channel 110 is also communicated with the seven second outlet flow channels 140 through a second branch flow channel 152. The first branch flow channel 151 and the second branch flow channel 152 are communicated through a plurality of third branch flow channels 153.

[0128] Similarly, the other side of the central axis of the bottom plate 100 is communicated in the same way, which will not be described here.

[0129] In the first direction X, the four second inlet flow channels 120 between the two first inlet flow channels 110 are communicated with the first outlet flow channel 130 on the central axis of the bottom plate 100 through a fourth branch flow channel 154. The second branch flow channel 152 and the fourth branch flow channel 154 are communicated through a plurality of fifth branch flow channels 155.

[0130] In addition, the cross-sectional size of the first inlet flow channel 110 is three times the cross-sectional size of the second inlet flow channel 120. The cross-sectional size of the first outlet flow channel 130 is three times the cross-sectional size of the second outlet flow channel 140.

[0131] The two first outlet flow channels 130 adjacent to the two side edges of the bottom plate 100 are respectively provided with a turbulence column 200.

[0132] The cover plate 300 is connected with the bottom plate 100 by brazing. On the side of the first inlet flow channel 110 and the second inlet flow channel 120 away from the branch flow channel 150, the cover plate 300 and the bottom plate 100 jointly form a cavity, which is a first cavity 310. The first cavity 310 is connected with the liquid inlet 311 on the cover plate 300 and simultaneously communicated with the first inlet flow channel 110 and the second inlet flow channel 120 below.

[0133] On the side of the first outlet flow channel 130 and the second outlet away from the branch flow channel 150, the cover plate 300 and the bottom plate 100 jointly form another cavity, which is a second cavity 320. The second cavity 320 is connected with the liquid outlet 321 on the cover plate 300 and simultaneously communicated with the first outlet flow channel 130 and the second outlet flow channel 140 below.

[0134] The cooling medium enters the first cavity 310 through the liquid inlet 311 on the cover plate 300, then flows through the first inlet flow channel 110, the second inlet flow channel 120, the branch flow channel 150, the first outlet flow channel 130 and the second outlet flow channel 140, and is discharged to the second cavity 320, and finally discharged through the liquid outlet 321.

[0135] The bottom plate 100 and the cover plate 300 are made of copper alloy material, and the first inlet flow channel 110, the plurality of second inlet flow channels 120, the first outlet flow channel 130, the plurality of second outlet flow channels 140, and the plurality of branch flow channels 150 are made of copper alloy material.

[0136] The conventional liquid cooling plate includes a bottom plate and a cover plate. Along the extension direction of the bottom plate, one end of the bottom plate is provided with an inlet flow channel, and the other end is provided with an outlet flow channel. The inlet flow channel and the outlet flow channel are communicated through a plurality of straight flow channels formed by fin structures. The cover plate, the bottom plate, and the fin structures are made of copper alloy material. The connection mode of the cover plate and the bottom plate is the same as that of the embodiments provided in the present application, and will not be described here.

[0137] In the embodiments provided in the present application, the height of the first inlet flow channel 110, the plurality of second inlet flow channels 120, the first outlet flow channel 130, the plurality of second outlet flow channels 140, and the plurality of branch flow channels 150, and the height of the inlet flow channel, the outlet flow channel, and the straight flow channel of the conventional liquid cooling plate are all 5 mm.

[0138] Next, the test of the heat dissipation function of the liquid cooling plate provided in the present application will be briefly described.

[0139] Step 1, the chip is attached to the liquid cooling plate provided in the present application. The power of the chip is 1600W.

[0140] Step 2, under the condition of indoor environment temperature of 30℃, 40℃ propylene glycol aqueous solution (propylene glycol 25%, PG25) with a mass fraction of 25% is injected into the liquid inlet 311. The PG25 flows through the first inlet flow channel 110, the plurality of second inlet flow channels 120, the plurality of branch flow channels 150, the first outlet flow channel 130, and the plurality of second outlet flow channels 140, and is then discharged from the liquid outlet 321. The PG25 keeps circulating flow in the liquid cooling plate, and maintains this state for 30 minutes.

[0141] The flow rate of the liquid inlet 311 is maintained at 4LPM.

[0142] Step 3, the pressure drop is calculated to be 17329Pa.

[0143] Step 4, the temperature sensor detects that the temperature of the center region of the chip is 84.3℃, and the temperature of the edge region is 62.8℃. The temperature difference between the center region and the edge region of the chip is calculated to be 21.5℃.

[0144] In the test of the heat dissipation function of the conventional liquid cooling plate, the PG25 flows through the inlet flow channel, the outlet flow channel and the straight flow channel of the conventional liquid cooling plate. The pressure drop is 25014 Pa obtained by detection and calculation. The temperature sensor detects that the temperature of the chip center region is 113℃, and the temperature of the edge region is 85.7℃, and the temperature difference between the chip center region and the edge region is 27.3℃ obtained by calculation.

[0145] The remaining steps are the same as the test of the heat dissipation function of the liquid cooling plate provided in the present application, and will not be repeated here.

[0146] It should be noted that the pressure drop and the flow resistance are in a proportional relationship, and when the pressure drop is reduced, it means that the flow resistance is reduced.

[0147] Table 1 is a comparison of the flow resistance performance of the conventional liquid cooling plate and the liquid cooling plate of the present application, and Table 2 is a comparison of the thermal uniformity of the conventional liquid cooling plate and the liquid cooling plate of the present application.

[0148] Table 1 Comparison of flow resistance performance of conventional liquid cooling plate and liquid cooling plate of the present application

[0149]

[0150] Table 2 Comparison of thermal uniformity of conventional liquid cooling plate and liquid cooling plate of the present application

[0151]

[0152] From Table 1 and Table 2, it can be seen that the liquid cooling plate provided in the present application has a pressure drop reduced by 30.7% compared with the conventional liquid cooling plate, and the thermal uniformity is improved by 21.2%.

[0153] Therefore, the liquid cooling plate provided in the present application can reduce the flow resistance and improve the heat exchange uniformity without increasing the power of the pump body, thereby improving the heat dissipation performance of the liquid cooling plate and reducing the energy consumption.

[0154] In addition, the liquid cooling plate provided in the present application can be made by 3D printing by laser equipment. Through 3D printing, high-precision manufacturing of complex flow channels can be realized, and the limitation of traditional process on the geometry of the flow channel is broken through.

[0155] Exemplarily, the metal powder can be red copper, that is, the material of the first inlet flow channel 110, the plurality of second inlet flow channels 120, the first outlet flow channel 130, the plurality of second outlet flow channels 140 and the plurality of distribution flow channels 150 is red copper.

[0156] Exemplarily, the height of the first inlet flow channel 110, the plurality of second inlet flow channels 120, the first outlet flow channel 130, the plurality of second outlet flow channels 140 and the plurality of distribution flow channels 150 can be 1mm-10mm, for example, 1mm, 2mm, 3.5mm, 5.5mm, 6mm, 7.5mm, 8mm, 10mm, etc.

[0157] It should be noted that the material and height of the first inlet flow channel 110, the plurality of second inlet flow channels 120, the first outlet flow channel 130, the plurality of second outlet flow channels 140 and the plurality of branch flow channels 150 are not limited in the present application, and only need to meet the heat exchange requirements of the liquid cooling plate.

[0158] The present application provides a liquid cooling assembly, which comprises the liquid cooling plate provided in any of the above embodiments.

[0159] The liquid cooling assembly provided in the embodiments of the present application has the same technical effects as the liquid cooling plate described in any of the above embodiments, i.e., can improve the heat exchange efficiency, reduce the energy consumption, and thus achieve the effect of adapting to the heat dissipation requirements of high heat flux chips.

[0160] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent substitutions for part or all of the technical features; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cold plate for a high power chip, characterized by, The application relates to a bottom plate (100) provided with a first inlet flow channel (110), a plurality of second inlet flow channels (120), a first outlet flow channel (130) and a plurality of second outlet flow channels (140) at two ends of the bottom plate (100) along the extension direction of the bottom plate (100), and a plurality of shunt flow channels (150) on the bottom plate (100), wherein the plurality of shunt flow channels (150) have at least two different extension directions and are interconnected. In the first direction, the cross-sectional size of the first inlet flow channel (110) is greater than that of the second inlet flow channel (120), and the cross-sectional size of the first outlet flow channel (130) is greater than that of the second outlet flow channel (140). In the first direction, the cross-sectional size of the first inlet flow channel (110) is at least three times that of the second inlet flow channel (120), and the cross-sectional size of the first outlet flow channel (130) is at least three times that of the second outlet flow channel (140). The first inlet flow channel (110), the second inlet flow channel (120), the first outlet flow channel (130) and the second outlet flow channel (140) are respectively connected with at least one shunt flow channel (150). The plurality of second inlet flow channels (120), the first inlet flow channel (110), the plurality of second outlet flow channels (140), the first outlet flow channel (130) and the plurality of shunt flow channels (150) are symmetrically arranged relative to the central axis of the bottom plate (100). The shunt flow channel (150) comprises a first shunt flow channel (151), a second shunt flow channel (152) and a plurality of third shunt flow channels (153). Both ends of at least one first shunt flow channel (151) are respectively connected with the first inlet flow channel (110) and the first outlet flow channel (130), and both ends of at least one second shunt flow channel (152) are respectively connected with the first inlet flow channel (110) and the plurality of second outlet flow channels (140). The first shunt flow channel (151) and the second shunt flow channel (152) are connected through the plurality of third shunt flow channels (153). The first inlet flow channel (110), the first outlet flow channel (130), the second outlet flow channel (140), the first shunt flow channel (151), the second shunt flow channel (152) and the third shunt flow channel (153) form a shunt tree structure on the bottom plate (100). The shunt flow channel (150) further comprises a fourth shunt flow channel (154) and a fifth shunt flow channel (155). Both ends of at least one fourth shunt flow channel (154) are respectively connected with the second inlet flow channel (120) and the first outlet flow channel (130). The second shunt flow channel (152) and the fourth shunt flow channel (154) are connected through the plurality of fifth shunt flow channels (155). ​ The second inlet flow channel (120), the fourth branch flow channel (154), the fifth branch flow channel (155) and the first outlet flow channel (130) are in a confluence tree structure on the bottom plate (100).

2. The liquid cold plate of claim 1, wherein, At least one first inlet flow channel (110) is arranged between the side edge of the bottom plate (100) and the second inlet flow channel (120) adjacent to the side edge of the bottom plate (100); at least one first outlet flow channel (130) is arranged between the side edge of the bottom plate (100) and the second outlet flow channel (140) adjacent to the side edge of the bottom plate (100), and the at least one first outlet flow channel (130) is arranged between the plurality of second outlet flow channels (140).

3. The liquid cold plate of claim 1, wherein, The first outlet flow channel (130) is provided with a plurality of flow disturbance columns (200).

4. The liquid cold plate of claim 1, wherein, Further comprising a cover plate (300) arranged on the bottom plate (100). The cover plate (300) and the two ends of the bottom plate (100) form a first cavity (310) and a second cavity (320) respectively; the cover plate (300) is provided with a liquid inlet (311) communicating with the first cavity (310), and the cover plate (300) is provided with a liquid outlet (321) communicating with the second cavity (320); the first cavity (310) communicates with the first inlet flow channel (110) and the second inlet flow channel (120); the second cavity (320) communicates with the first outlet flow channel (130) and the second outlet flow channel (140).

5. A liquid-cooled assembly, comprising: The liquid cooling plate comprises the liquid cooling plate according to any one of claims 1-4. The liquid cooling plate comprises the liquid cooling plate according to any one of claims 1-4.

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