Sensor device

Abstract

The present disclosure relates to a sensor device. In the sensing device, an electromagnetic wave generator is accommodated in an accommodating container. The electromagnetic wave transmission component is accommodated in the accommodating container. The sensing element is arranged closer to the inner side of the accommodating container than the electromagnetic wave transmission part. The control board is arranged closer to the inner side of the accommodating container than the electromagnetic wave transmission part. The housing is provided between the electromagnetic wave transmission member and the sensing element and the control board, and constitutes a path that guides the electromagnetic wave transmitted through the electromagnetic wave transmission member to the sensing element. The fixing portion is configured as a separate member from the housing, and the fixing portion fixes the electromagnetic wave transmitting member to the housing. The electromagnetic wave generator generates heat during output of the electromagnetic wave, and the heat is transferred to the electromagnetic wave transmission member through the fixing portion.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a sensor device. For example, the present disclosure relates to a sensor device suitable for application as a vehicle-mounted sensor, for example, a camera installed in a vehicle. BACKGROUND

[0002] In the past, JP 2014-035370 A has proposed a camera in which an infrared irradiation unit is provided near a lens. The camera captures an image of an object appearing in the lens by controlling an imaging unit composed of an imager or the like and a near-infrared irradiation unit. In the camera, the infrared irradiation unit is controlled to achieve imaging in a dark field by simultaneously irradiating infrared light during imaging of the imaging unit. The lens and the near-infrared irradiation unit are attached to a lens attachment portion and a light attachment portion of a housing, respectively. When the infrared irradiation unit generates heat by irradiating infrared light, the heat is transferred to the lens, thereby removing lens fog.

[0003] In recent years, there is a demand for a camera that provides higher image clarity and a larger dark field visible range, i.e., is capable of high-definition sensing at a further distance.

[0004] However, the camera in JP 2014-035370 A is constructed so that heat generated by the infrared irradiation unit is transferred from the infrared irradiation unit directly to the housing. In addition, the structure is such that the imager and an imager board on which the imager is mounted are disposed on the side opposite the lens, there is a housing between the imager board and the lens, and heat generated by the imager and the imager board is also transferred to the housing. Therefore, with regard to the infrared irradiation unit, heat transfer of the imager and the imager board also needs to be taken into account.

[0005] In order to ensure the heat life of elements included in the imager and the imager board, the irradiation output of infrared light cannot be increased, and the dark field visible range becomes difficult to increase. Furthermore, along with higher pixel counts in the imager, the amount of heat generated increases. Therefore, the problem arises that both higher pixel counts and a larger dark field visible range cannot be obtained.

[0006] Here, the infrared irradiation unit is provided for imaging in a dark field, or to suppress lens fogging and de-icing of the lens. However, the above problem is not limited to the infrared irradiation unit, and similarly arises in the case of using other electromagnetic wave generators. In addition, here, the camera is given as an example of a sensor device. Higher pixel counts and larger dark field visible ranges are given as examples of the problem of obtaining both sensing performance and sensing range.

[0007] However, such a problem is not limited to the camera device, and similarly occurs in other sensor devices. For example, a millimeter wave radar can be given as a sensor device. Also in the millimeter wave radar, deicing can be performed by providing an electromagnetic wave generator. However, it is difficult to obtain both the sensing performance and the sensing range due to an increase in generated heat caused by enhanced functionality of the sensing performance and heat generation caused by the electromagnetic wave generator outputting electromagnetic waves.

[0008] Therefore, it is desirable to provide a sensor device capable of obtaining both the sensing performance and the sensing range. SUMMARY

[0009] An aspect of the present disclosure provides a sensor device including: a housing container; an electromagnetic wave generator housed in the housing container, outputting electromagnetic waves to the outside of the housing container, and generating heat accompanying generation of the electromagnetic waves; an electromagnetic wave transmission member housed in the housing container, constituting an electromagnetic wave reception opening that receives electromagnetic waves reflected by an object outside the housing container, and transmitting the electromagnetic waves, the electromagnetic wave reception opening; a sensing element disposed closer to the inside of the housing container than the electromagnetic wave transmission member; a control board disposed closer to the inside of the housing container than the electromagnetic wave transmission member, the control board controlling the sensing element and switching between the electromagnetic wave generator outputting the electromagnetic waves and the electromagnetic wave generator not outputting the electromagnetic waves; a housing provided between the electromagnetic wave transmission member and the sensing element and the control board, and constituting a path that guides the electromagnetic waves transmitted by the electromagnetic wave transmission member to the sensing element; and a fixing portion configured as a member separate from the housing, and fixing the electromagnetic wave transmission member to the housing. The electromagnetic wave generator generates heat during output of the electromagnetic waves, and the heat is transmitted to the electromagnetic wave transmission member through the fixing portion.

[0010] In this way, heat is generated by the electromagnetic wave generator outputting electromagnetic waves. Since heat is transmitted to the electromagnetic wave transmission member, defogging and deicing can be performed. At this time, the heat transmission path is such that heat is transmitted from the electromagnetic wave generator to the fixing portion, and then to the electromagnetic wave transmission member. In addition, the fixing portion is provided as a member separate from the housing, and is constructed so that heat is transmitted from the electromagnetic wave generator to the housing through the fixing portion. Therefore, in terms of heat transmission through a separate member, the thermal resistance becomes larger than the case where heat is directly transmitted from the electromagnetic wave generator to the housing, and heat is not easily transmitted. Therefore, excessive temperature rise of the sensing element and the control board can be suppressed. In addition, since the temperature rise of the sensing element and the control board is suppressed, the heat life of the elements and the sensing element provided on the control board can be more easily ensured. Therefore, greater output of electromagnetic waves from the electromagnetic wave generator and higher functionality of the sensing element can be obtained. Both the sensing performance and the sensing distance can be obtained.

[0011] Here, the reference numerals attached to the constituent elements and the like in parentheses indicate examples of the correspondence relationship between the constituent elements and the like described according to the embodiments described below and specific constituent elements and the like. BRIEF DESCRIPTION OF DRAWINGS

[0012] In the drawings:

[0013] Figure 1 is a perspective view of an imaging device according to the first embodiment of the present disclosure.

[0014] Figure 2 is a cross-sectional view of the imaging device shown in Figure 1 cut along line II-II in the Z-axis direction;

[0015] Figure 3 is an exploded view of the imaging device shown in Figure 1

[0016] Figure 4 is a partial enlarged view of the region R in Figure 2

[0017] Figure 5 is a view showing the relationship between the optical axis of the lens barrel of the imaging device, the optical axis of the infrared irradiation unit, and the imaging range;

[0018] Figure 6 is a view showing a vehicle in which the imaging device according to the second embodiment of the present disclosure is installed;

[0019] Figure 7 is a projection view of a side mirror showing a section of the imaging device;

[0020] Figure 8 is a partial projection view of a front mudguard showing a section of the imaging device;​​

[0021] Figure 9 is a perspective view of an imaging device according to a third embodiment of the present disclosure.

[0022] Figure 10 yes Figure 9 A cross-sectional view of the imaging device shown is taken on a YZ plane including the optical axis;

[0023] Figure 11 yes Figure 9 A cross-sectional view of the camera device shown is taken along line XI-XI in the Z-axis direction;

[0024] Figure 12 yes Figure 9 An exploded view of the camera assembly shown;

[0025] Figure 13 is a perspective view of a camera device according to another embodiment;

[0026] Figure 14 is a cross-sectional view of an example of a structure in which a gap is formed between a lens fixing portion and a lens barrel according to another embodiment; and

[0027] Figure 15 is a cross-sectional view of an imaging device according to another embodiment. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Here, parts identical or equivalent to each other according to the embodiments described below are described using the same reference numerals.

[0029] (First embodiment)

[0030] A first embodiment of the present disclosure will be described. According to this embodiment, an imaging device is described as an example of a sensor device. For example, the imaging device is installed in a vehicle and is used to capture an image to determine the state of the vehicle's surroundings.

[0031] For the sake of convenience, the X-axis, Y-axis, and Z-axis are shown in the accompanying drawings of this specification. Figure 1 As shown, a direction on the front surface of the imaging device 1 and a direction perpendicular thereto are referred to as the X-axis and the Y-axis, respectively. The direction perpendicular to both the X-axis and the Y-axis is referred to as the Z-axis. Furthermore, in the Z-axis direction, the end 2 on the side of the imaging device 1 where imaging is performed is referred to as the front end, and the end 3 on the side opposite to the front end is referred to as the rear end. Figure 2 Corresponding to the camera device 1 moving along the Z axis Figure 1 : is a cross-sectional view taken along line II-II in FIG, ie, along a line inclined at 45° with respect to both the X-axis and the Y-axis.

[0032] As shown in FIG. 1, the camera 1 includes a cover 10, a case 20, a head 30, a guide 40, a lens barrel 50, an imager 60, an imager board 70, a lens 80, a lens fixing portion 90, an optical member 100, an infrared irradiation unit 110, a light emitting diode (LED) board 120, a rubber pad 130, and the like. Figures 1 to 3 The cover 10 constitutes a part of the housing container of the camera 1, that is, a part of the housing container of the rear end 3 side which is located on the side opposite to the front end 2 side on which the guide 40 is provided. The cover 10 is formed in a bottomed, substantially quadrangular columnar shape having a quadrangular outer shape including both sides along the X axis and both sides along the Y axis when viewed from the Z axis direction and a hollow portion 11 inside which is formed beside one surface side of the case 20 side which is open. Although the cover 10 can include any material, for example, resin can be used. In a central portion of a bottom portion 12 of the cover 10, an opening portion 13 is formed. Further, inside the hollow portion 11, a shield portion 14 is provided along an inner wall surface of the cover 10. Further, the shield portion 14 and a terminal 15 are partially fitted into the opening portion 13, and the terminal 15 protrudes to the outside of the cover 10. Further, a connector 16 is formed to protrude to the outside of the camera 1 from the bottom portion 12 of the cover 10. Since the connector 16 is connected to another connector (not shown), power supply to the camera 1 and external output of image data captured by the camera 1 can be performed.

[0033] A part of the lens barrel 50, the imager 60, and the imager board 70 are housed inside the hollow portion 11 of the cover 10. The shield portion 14 surrounds the imager 60 and the imager board 70, and transmission of external noise to the imager 60 and the imager board 70 is suppressed.

[0034] The case 20 constitutes a part of the housing container of the camera 1. The case 20 is formed in a substantially quadrangular columnar shape having a quadrangular outer shape including both sides along the X axis and both sides along the Y axis when viewed from the Z axis direction and a hollow portion 21 passing therethrough along the Z axis. Although the case 20 can include any material, for example, resin can be used. The case 20 houses a part of the lens barrel 50 and a part of the optical member 100 inside the hollow portion 21. An annular groove 22 is formed on an inner wall of the case 20, and an O-ring 23 is fitted into the groove 22. The O-ring 23 is in contact with an outer wall surface of the lens barrel 50, thereby forming a seal between the case 20 and the lens barrel 50.

[0035] The case 20 constitutes a part of the housing container of the camera 1. The case 20 is formed in a substantially quadrangular columnar shape having a quadrangular outer shape including both sides along the X axis and both sides along the Y axis when viewed from the Z axis direction and a hollow portion 21 passing therethrough along the Z axis. Although the case 20 can include any material, for example, resin can be used. The case 20 houses a part of the lens barrel 50 and a part of the optical member 100 inside the hollow portion 21. An annular groove 22 is formed on an inner wall of the case 20, and an O-ring 23 is fitted into the groove 22. The O-ring 23 is in contact with an outer wall surface of the lens barrel 50, thereby forming a seal between the case 20 and the lens barrel 50.

[0036] In an end portion of the case 20 on the side of the cover 10, an engaging protrusion 24 is formed, which is slightly smaller in external dimensions than the other portions. The case 20 and the cover 10 are integrated by fitting the engaging protrusion 24 within the hollow portion 11 of the cover 10. The external shapes of the case 20 and the cover 10, i.e., the external dimensions of the substantially quadrangular shape, are uniform. The respective surfaces of the sides forming the substantially quadrangular shape constitute the same plane. In addition, since the boundary position between the case 20 and the cover 10 is welded, the case 20 and the cover 10 are coupled in a state of close contact. Here, the coupling can be obtained not only by welding but also by other means such as adhesion, press fitting, and the like.

[0037] In addition, an engaging protrusion 25 is also formed on an end portion of the case 20 on the side of the head portion 30. The case 20 and the head portion 30 are integrated and fixed by fitting the engaging protrusion 25 into an end portion of the head portion 30 on the side of the case 20 described below. The external shapes of the case 20 and the head portion 30, i.e., the external dimensions of the substantially quadrangular shape, are uniform. The respective surfaces of the sides forming the substantially quadrangular shape constitute the same plane. Thus, the surfaces of the cover 10, the case 20, and the head portion 30 constitute the same plane. The shape of the entire housing container of the imaging device 1 including the cover 10, the case 20, and the head portion 30 is a substantially rectangular shape.

[0038] Here, the case 20 and the head portion 30 are coupled by fitting together. However, the boundary position between the case 20 and the head portion 30 can also be welded. Of course, in addition to welding, other means such as adhesion and press fitting can also be used.

[0039] The head portion 30 constitutes a part of the housing container of the imaging device 1. The head portion 30 is formed in a substantially quadrangular columnar shape having an external shape of a quadrangle including both sides along the X axis and both sides along the Y axis when viewed from the Z axis direction and a hollow portion 31 through which the Z axis passes therethrough. Although the head portion 30 can contain an arbitrary material, for example, a metal can be used. The head portion 30 houses a part of the lens barrel 50, a part of the optical member 100, the lens 80, the infrared emission unit 110, the LED board 120, the lens fixing portion 90, the rubber pad 130, and the like in the hollow portion 31. An annular groove 32 is formed on the inner wall of the head portion 30, and an O-ring 33 is fitted in the groove 32. The O-ring 33 is in contact with the outer wall surface of the lens barrel 50, thereby forming a seal between the head portion 30 and the lens barrel 50. In addition, the guide 40 is provided in an end portion 2 of the head portion 30 on the front end side of the imaging device 1, for example, to be fitted into the hollow portion 31. Water penetration into the hollow portion 31 is suppressed by the guide 40, the lens 80, and the lens fixing portion 90 including the O-ring 96 described below.

[0040] The hollow portion 31 of the head portion 30 is formed in a shape having a plurality of steps from the front end 2 side toward the rear end 3 side in the Z-axis direction. Therefore, the size of the hollow portion 31, that is, the inner wall size of the head portion 30 is stepwise changed. Specifically, the size of the hollow portion 31 is such that the first portion 31a of the outermost front end side coincides with the outer size of the guide 40. Then, the inner wall size is reduced from the first portion 31a in the second portion 31b, which is closer to the rear end 3 side than the first portion 31a. Then, the guide 40 is fitted into the hollow portion 31 with the boundary portion between the first portion 31a and the second portion 31b as a seating surface and placed in close contact using an adhesive or the like. Further, the inner size of the hollow portion 31 is further reduced in the third portion 31c, which is closer to the rear end 3 side than the second portion 31b, and coincides with the outer shape of the lens barrel 50 and the lens fixing portion 90. In addition, the LED board 120, the infrared irradiation unit 110, and the rubber pad 130 are provided inside the hollow portion 31 with the boundary position between the second portion 31b and the third portion 31c as a mounting surface. Further, a part of the lens barrel 50, a part of the lens fixing portion 90, and a part of the optical member 100 are provided inside the third portion 31c.

[0041] The guide 40 is a plate-shaped member that protects the functional members of the camera 1 and contains glass, acrylic resin, or the like. The guide 40 has an outer shape of a quadrangle including both sides in the X-axis direction and both sides in the Y-axis direction. The guide 40 prevents water from penetrating into the camera 1 together with the lens 80 and the lens fixing portion 90 by being attached to the head portion 30. The center of the guide 40 is formed with an opening portion 41. A part of the lens 80 and the lens fixing portion 90 are exposed from the opening portion 41.

[0042] The lens barrel 50 corresponds to a housing that guides light received by the lens 80 to the imager 60. The lens barrel 50 is configured to have a cylindrical shape, or in this case, a substantially circular cylindrical shape, having a hollow portion 51 passing therethrough in the direction of the Z-axis. The lens barrel 50 can contain metal, for example. The optical axis of the lens barrel 50 extends in the direction of the Z-axis, or in this case, parallel to the Z-axis.

[0043] The lens barrel 50 holds the lens 80 and the other optical member 100 to obtain a desired positional relationship, i.e., a positional relationship in which light is condensed in a position in which the imager 60 is provided. Specifically, the plurality of optical members 100 are provided in the hollow portion 51 of the lens barrel 50 along the Z-axis, and are held on the inner wall surface of the lens barrel 50. In addition, a lens housing portion 52 is formed on the front end 2 side of the lens barrel 50. The lens housing portion 52 is recessed from the front end 2 side toward the rear end 3 side, and is formed so that the inner wall dimension of the lens barrel 50 increases with respect to the inner wall dimension in the portion in which the optical member 100 is provided. Since the lens 80 is provided inside the lens housing portion 52, the lens 80 is in contact with the front end of the lens barrel 50. Here, an O-ring 53 is provided in a portion of the lens housing portion 52 of the lens barrel 50 on the outer periphery of the lens 80, thereby forming a seal between the lens 80 and the lens barrel 50. In addition, positioning of the lens 80 in the XY plane direction is thereby performed.

[0044] Further, a recessed portion 54 in which the imager 60 is provided is formed on the rear end 3 side of the lens barrel 50, and further, the rear end 3 side of the lens barrel 50 is coupled to the imager board 70 with an adhesive material 55 therebetween. Thus, the positional relationship of the lens 80 and the optical member 100 with respect to the imager 60 is a desired positional relationship. Light received by the lens 80 is input to the imager 60 so that the focal point of the light is aligned.

[0045] In addition, since the lens barrel 50 and the imager board 70 are coupled, heat generated by the imager 60 and the imager board 70 is transferred to the lens barrel 50 side during use of the imaging device 1.

[0046] The imager 60 (or, in other words, an image sensor) is a sensing element, and is configured by a complementary metal-oxide semiconductor (CMOS), a charge-coupled device (CCD), or the like. The imager 60 is provided closer to the inner side of the housing container than the lens 80, and the imager 60 constitutes an imaging unit that receives light by the lens 80 and the optical member 100 and captures an image of an object that appears in the lens 80. In order to improve sensing performance, a high pixel count imager 60 is used.

[0047] The imager board 70 is a substrate on which an electronic control unit (ECU) is mounted, the electronic control unit (ECU) including electronic components such as various elements that drive the imager 60. In addition to the control of the imager 60, the imager board 70 also performs on / off control of the infrared irradiation unit 110, that is, switching between outputting infrared light and not outputting infrared light. The imager board 70 is disposed closer to the inner side of the accommodating container than the lens 80, together with the imager 60. The imager board 70 is a substrate formed in a substantially quadrangular plate shape having both sides along the X axis and both sides along the Y axis. The imager 60 is mounted on the front surface of the imager board 70, that is, on one surface on the front end 2 side. Since the lens barrel 50 and the imager board 70 are coupled, heat generated by the various elements provided on the imager board 70 and the imager 60 is transferred to the lens barrel 50 during use of the camera 1.

[0048] The imager board 70 also includes a temperature sensor 71. The temperature sensor 71 detects the temperature of the various elements provided on the imager board 70 and the imager 60. The temperature is used to adjust the emission timing of the infrared irradiation unit 110. Here, in the following description, the temperature detected by the temperature sensor 71 is referred to as a first temperature.

[0049] The terminal 15 is connected to the imager board 70 on the other surface side on the side opposite the imager 60. The terminal 15 realizes power supply to the various elements provided on the imager board 70 and the imager 60, and output of image data captured by the imager 60. Specifically, a terminal support member 15a is connected to the other surface side of the imager board 70, and the terminal 15 is fitted into the terminal support member 15a. Furthermore, the terminal 15 protrudes from the opening portion 13 in the cover 10 to the outside of the cover 10.

[0050] The lens 80 is composed of a convex lens whose center protrudes toward the front end 2 side with respect to the outer edge portion. The lens 80 is disposed in the front end of the lens barrel 50. The lens 80 can contain glass, for example, and can be a material having a lower heat transfer coefficient than the material of the lens barrel 50. The convex surface of the front side of the lens 80 is exposed from the opening portion 41 of the guide 40, and receives light from the outside of the camera 1 through the opening portion 41.

[0051] The lens fixing portion 90 is a member that fixes the lens 80 to the front end of the lens barrel 50. The lens fixing portion 90 contains a material that easily transfers heat to the lens 80. Here, the lens fixing portion 90 contains metal. As described above, the lens 80 contains a material having a lower heat transfer coefficient than the material of the lens barrel 50. Therefore, heat transfer from the lens 80 to the lens barrel 50 is further suppressed compared to heat transfer from the lens fixing portion 90 to the lens barrel 50.

[0052] The lens fixing portion 90 is configured to have a bottomed cylindrical shape, and is constructed so that a circular opening portion 92 is formed at the center of the bottom portion 91, and the outer periphery of the lens 80 is in contact with a portion of the bottom portion 91 located in the periphery of the opening portion 92. The portion of the bottom portion 91 located in the periphery of the opening portion 92 is an inner wall surface that is a curved surface that matches the shape of the lens 80 or has a conical shape, and presses the lens 80 toward the lens barrel 50 side when in close contact with the lens 80.

[0053] Specifically, an internal thread 94 is formed in the inner wall surface of the cylindrical portion 93 of the lens fixing portion 90. An external thread 56 is formed in the outer peripheral surface of the front end side of the lens barrel 50. When the lens fixing portion 90 is fitted into the front end of the lens barrel 50 (wherein the lens 80 is provided in the front end of the lens barrel 50) while rotating, the internal thread 94 and the external thread 56 engage, and the lens fixing portion 90 is fixed to the front end of the lens barrel 50 on the lens 80 side. Thus, the lens 80 is fixed so as to be sandwiched between the lens fixing portion 90 and the front end of the lens barrel 50, for example.

[0054] More specifically, the size of the cylindrical portion 93 of the lens fixing portion 90 in the Z-axis direction is such that the rear end 3 side of the cylindrical portion 93 is positioned closer to the imager board 70 side than the LED board 120 side. Therefore, the lens barrel 50 and the LED board 120 are not in direct contact with each other, with the cylindrical portion 93 of the lens fixing portion 90 interposed therebetween.

[0055] In addition, if Figure 4 As shown, a low thermal conductivity member 140 is provided in a portion located inside the LED board 120 in the area sandwiched between the lens fixing portion 90 and the lens barrel 50 (i.e., between the cylindrical portion 93 and the lens barrel 50). A low thermal conductivity member 140 is preferably also provided between the end portion of the cylindrical portion 93 on the rearmost 3 side and the lens barrel 50, but may not be provided. When a low thermal conductivity member 140 is not provided between the end portion of the cylindrical portion 93 on the rearmost 3 side and the lens barrel 50, a gap is preferably formed therebetween.

[0056] The low thermal conductivity member 140 includes a material having low thermal conductivity. The low thermal conductivity member 140 only needs to include a material that is less likely to transfer heat than when the lens fixing portion 90 is in direct contact with the lens barrel 50, but is preferably a material having a lower thermal conductivity. For example, the low thermal conductivity member 140 can be formed by applying a resin, such as a resin-based adhesive, to either the internal thread 94 or the external thread 56.

[0057] Here, an annular groove 95 is formed on one surface of the lens fixing portion 90 on the side of the guide 40, that is, the side that reacts with the guide 40. An O-ring 96 is fitted in the groove 95. Thus, a seal is formed between the opening portion 41 of the guide 40 and the outer peripheral side of the lens fixing portion 90, that is, the side on which the infrared irradiation unit 110 is provided. Waterproofness of the infrared irradiation unit 110 is obtained.

[0058] The optical member 100 is provided closer to the imager 60 side than the lens 80 within the hollow portion 51 of the lens barrel 50. According to the present embodiment, a plurality of optical members 100 are provided, and the plurality of optical members 100 include various types of lenses and the like. Due to the lens 80 and the optical member 100, the received light is collected and input to the imager 60. The arrangement, number, and size of the optical member 100 are arbitrary, but are provided so that the received light can be collected and input to the imager 60.

[0059] The infrared irradiation unit 110 is an electromagnetic wave generator, and outputs infrared light, which is an electromagnetic wave, to the outside of the accommodation container. For example, the infrared irradiation unit 110 can be configured by a semiconductor light source such as an infrared LED, a vertical cavity surface emitting laser (VCSEL), or a photonic crystal surface emitting laser (PCSEL). Here, the infrared irradiation unit 110 is configured by an infrared LED. The infrared LED has a substantially hemispherical shape in which the side that irradiates infrared light is spherical and the opposite side is flat. A wiring or a pad (not shown) is formed on the flat side. In addition, the flat side of the infrared LED is directly mounted on the surface of the LED board 120. Here, the infrared irradiation unit 110 is configured by an infrared LED. However, in the case where the infrared irradiation unit 110 is also configured by a VCSEL or a PCSEL, the configuration can be such that the VCSEL or the PCSEL is directly mounted on the surface of the LED board 120.

[0060] The infrared irradiation unit 110 is provided adjacent to the lens 80, and irradiates infrared light, which is an electromagnetic wave, to the outside of the imaging device 1. Thus, in the case where the vicinity of the imaging device 1 is dark, dark field visibility can be obtained by the infrared light irradiated to the outside of the imaging device 1 and the reflected light of the infrared light received by the lens 80 as a receiving unit. In addition, the infrared irradiation unit 110 generates heat by generating light. The heat is transmitted to the lens fixing portion 90 directly or through the LED board 120, and is further transmitted to the lens 80. Thus, when the lens 80 is fogged or frozen, defogging and deicing of the lens 80 can be performed by the infrared irradiation unit 110 generating light, regardless of whether the vicinity of the imaging device 1 is dark.

[0061] The infrared irradiation units 110 are provided in each of the four corners of the camera 1 having a quadrangular shape when viewed in the Z-axis direction. The optical axis of each infrared irradiation unit 110 is arbitrary as long as infrared light can be irradiated within the imaging range of the camera 1. However, the optical axis of each infrared irradiation unit 110 is preferably inclined with respect to the optical axis of the lens barrel 50 (i.e., the straight line C1 indicated by the single-dot chain line in FIG. 10 according to the present embodiment) because reflected light of infrared light can be suppressed from being incident on the lens 80 with excessively high intensity. When the imaging range assumed for the camera 1 is a predetermined range centered on the straight line C1 serving as the optical axis of the lens barrel 50, the optical axis L of the infrared irradiation unit 110 is inclined with respect to the straight line C1. Figure 2

[0062] Alternatively, among the four infrared irradiation units 110, the optical axes of the infrared irradiation units 110 provided on the diagonal lines are inclined with respect to the straight line C1 in directions opposite to each other. When the assumed imaging range is equal to or greater than 100° centered on the straight line C1, the optical axes of the infrared irradiation units 110 are inclined such that the total irradiation range that can be covered by the adjacent infrared irradiation units 110 is equal to or greater than 100°. As shown in FIG. 11, when the infrared irradiation units 110 are oriented at 60°, the 60° irradiation range of one infrared irradiation unit 110 overlaps the 60° irradiation range of the other infrared irradiation unit 110 such that the total irradiation range is 100°. Thereby, infrared light can be irradiated over a wider range, and imaging can be performed over a wider range. Figure 5

[0063] The power supply wiring 110a for energizing the infrared irradiation unit 110 is electrically connected to the imager board 70 through a through-hole 111 formed in the lens barrel 50 or the like. Although not shown, the power supply wiring 110a is covered by a resin or the like and insulated from the lens barrel 50. The ECU provided on the imager board 70 controls the energization of the infrared irradiation unit 110 through the power supply wiring 110a.

[0064] In addition, a temperature sensor 112 is provided adjacent to the infrared irradiation unit 110 or on the side surface of the infrared irradiation unit 110. The temperature sensor 112 detects the temperature of the infrared irradiation unit 110 and transmits the detection result to the imager board 70. Then, the detected temperature is used for adjusting the light generation timing of the infrared irradiation unit 110. Here, the temperature detected by the temperature sensor 112 is referred to as a second temperature in the following description.

[0065] The LED board 120 is a mounting board that serves as a mounting portion on which the infrared irradiation unit 110 is held. According to the present embodiment, the infrared irradiation unit 110 is directly mounted into the LED board 120. As shown in FIG. 12, the LED board 120 is provided with a plurality of through-holes 121 for the infrared irradiation unit 110 to be inserted thereinto. The LED board 120 is provided with a plurality of through-holes 122 for the infrared irradiation unit 110 to be inserted thereinto. The LED board 120 is provided with a plurality of through-holes 123 for the infrared irradiation unit 110 to be inserted thereinto. Figure 3 ​​As shown, the LED board 120 has a quadrangular frame shape, and a central portion is a circular opening portion 121. The diameter of the opening portion 121 is the same size as the outer diameter of the lens fixing portion 90, and the lens fixing portion 90 is inserted into the opening portion 121.

[0066] As described above, heat generated by the infrared irradiation unit 110 is transmitted from the LED board 120 to the lens 80 through the lens fixing portion 90. In order to enable heat transmission to be advantageously performed, as Figure 4 As shown, a high thermal conductivity member 150 is provided between the LED board 120 and the lens fixing portion 90.

[0067] The high thermal conductivity member 150 contains a material having a high thermal conductivity, which is at least a material having a higher thermal conductivity than the low thermal conductivity member 140. The high thermal conductivity member 150 only needs to contain a material that more easily transmits heat than the case where the lens fixing portion 90 is in direct contact with the lens barrel 50, but preferably is a material having a higher thermal conductivity. For example, the LED board 120 can be connected to the lens fixing portion 90 by a high thermal conductivity adhesive or the like, and the high thermal conductivity member 150 can contain a high thermal conductivity adhesive. As the high thermal conductivity member 150, either of a non-conductive member and a conductive member can be applied. However, a non-conductive member is preferably used because electric leakage can be suppressed.

[0068] The rubber gasket 130 is a member sandwiched between the guide 40 and the head 30, and suppresses penetration of water between the guide 40 and the head 30. The rubber gasket 130 is formed to have a quadrangular frame shape having a hollow portion 131. Four corners of the hollow portion 131 are circular holes 131a having a substantially circular shape formed by rounding the corners to conform to the shape of the infrared irradiation unit 110. The outer dimension of the rubber gasket 130 is larger than the inner dimension of the head 30. The dimension of the hollow portion 131 is smaller than the outer dimension of the guide 40. Thereby, a gap between the guide 40 and the head 30 is covered and sealed. The imaging device 1 according to the present embodiment is configured in the above-described manner.

[0069] (Operation of the Imaging Device)

[0070] Next, the operation of the imaging device 1 configured as described above will be described. When the imaging device 1 is to be used, for example, installed in a vehicle, the imaging device 1 is applied to capture an image to determine the state of the surroundings of the vehicle. For example, the operation timing of the imaging device 1 can be during travel of the vehicle or during parking assistance of the vehicle. The imager 60 captures an image during these periods.

[0071] Specifically, the ECU provided on the imager board 70 controls image capturing by the imager 60, and image data captured by the camera 1 is output to the outside through the terminal 15. Then, the ECU provided on the imager board 70 or the ECU outside the camera 1 analyzes the image data.

[0072] At this time, in a state where the vicinity of the camera 1 is bright, for example, during the daytime, the image data has sufficient brightness. Therefore, the imager 60 captures an image without the infrared irradiation unit 110 generating light. However, it can be assumed that the lens 80 is fogged or frozen through analysis of the image data. In this case, the infrared irradiation unit 110 generates heat by generating light. Thereby, the heat generated by the infrared irradiation unit 110 is transmitted to the lens fixing portion 90 directly or through the LED board 120, and is further transmitted to the lens 80. Therefore, when the lens 80 is fogged or frozen, defogging or deicing of the lens 80 can be performed by the infrared irradiation unit 110 generating light even if the vicinity of the camera 1 is bright.

[0073] In addition, in a state where the vicinity of the camera 1 is dark, for example, during the nighttime, the image data does not have sufficient brightness. Therefore, the imager 60 captures an image by the infrared irradiation unit 110 generating light and reflected light of the infrared light from an object existing in the vicinity of the camera 1 being received. Thereby, it is possible to acquire defined image data even at night.

[0074] Further, when the infrared irradiation unit 110 generates light, the temperature sensor 71 senses a first temperature, and the temperature sensor 112 senses a second temperature. Based on the first temperature and the second temperature, the ECU provided on the imager board 70 automatically adjusts the light generation timing of the infrared irradiation unit 110.

[0075] For example, a period in which the amount of input light is small and the vicinity of the camera 1 is dark or the lens 80 is assumed to be fogged or frozen based on the image data is a period in which light generation is required. Therefore, taking this period as a period in which light generation is required, the infrared irradiation unit 110 generates light during the period in which light generation is required. During the period in which light generation is required, the light generation is not limited and the infrared irradiation unit 110 continuously generates light without interruption in time until the first temperature and the second temperature exceed a predetermined threshold value respectively. Then, when either the first temperature or the second temperature or both the first temperature and the second temperature exceed the predetermined threshold value, the light generation of the infrared irradiation unit 110 is limited as compared to before the predetermined threshold value is exceeded. For example, during the period in which light generation is required, an intermittent operation in which the infrared irradiation unit 110 intermittently generates light or a selective operation in which the infrared irradiation unit 110 selectively generates light is performed.

[0076] In the intermittent operation, although all the infrared irradiation units 110 simultaneously irradiate infrared light, the irradiation is performed intermittently, the time interval between the image acquisition is lengthened, and the number of frames is reduced. In the selective operation, only a part of the plurality of infrared irradiation units 110, for example, two of the four infrared irradiation units 110, irradiate light. The infrared irradiation units 110 that generate light are preferably changed periodically. Since the light generation of the infrared irradiation units 110 is restricted in this way, it is possible to suppress the overheating of the imager board 70 due to the heat transfer from the infrared irradiation units 110. Either one of the intermittent operation and the selective operation can be performed, or the intermittent operation and the selective operation can be performed in combination. For example, the intermittent operation and the selective operation can be performed in combination by intermittently performing the operation in which two of the four infrared irradiation units 110 irradiate infrared light.

[0077] (Working manner and effects of the imaging device 1)

[0078] In the imaging device 1 of the present disclosure described above, the infrared irradiation units 110 generate heat by generating light, and the heat is transferred to the lens 80. Thereby, the defogging and the deicing of the lens 80 can be performed. At this time, the heat transfer path is such that the heat is transferred from the infrared irradiation units 110 to the lens fixing portion 90 directly or through the LED board 120, and then to the lens 80. In addition, the heat is transferred from the infrared irradiation units 110 to the lens barrel 50 connected to the imager board 70 via the lens fixing portion 90, rather than directly or through the LED board 120.

[0079] In this way, the structure is such that the lens fixing portion 90 that fixes the lens 80 to the lens barrel 50 is provided as a member separate from the lens barrel 50, and the heat is transferred from the infrared irradiation units 110 to the lens barrel 50 through the lens fixing portion 90. Therefore, in terms of performing the heat transfer through a separate member, the thermal resistance becomes larger than the case where the heat is transferred directly from the infrared irradiation units 110 or through the LED board 120 to the lens barrel 50, and the heat is not easily transferred. Therefore, it is possible to suppress the excessive temperature rise of the imager 60 and the imager board 70. In addition, since the temperature rise of the imager 60 and the imager board 70 is suppressed, it is possible to more easily ensure the thermal life of the elements provided on the imager board 70 and the imager 60. Therefore, it is possible to obtain a larger irradiation output of the infrared irradiation units 110 and a higher pixel count of the imager 60. It is possible to obtain both a higher pixel count and a larger dark field visibility range, that is, sensing performance and sensing distance. Furthermore, since the life of the electronic components can be lengthened, the reliability of the imaging device 1 can be enhanced.

[0080] Furthermore, the following effects can also be obtained by the imaging device 1 of the present disclosure.

[0081] (1) The first and second temperatures are sensed, and the light generation of the infrared irradiation unit 110 during the light generation required period is automatically adjusted based on the temperatures. For example, the heat generation of the infrared irradiation unit 110 can be suppressed by intermittently operating or selectively operating the infrared irradiation unit 110 during the light generation required period. Thereby, the excessive temperature rise of the imager 60 and the imager board 70 can be suppressed. Both a higher pixel count and a larger dark field visibility range can also be obtained.

[0082] In addition, the ECU provided on the imager board 70 can acquire vehicle speed information and control the operation of the infrared irradiation unit 110 based on the vehicle speed. The ECU provided in the imager board 70 can calculate the vehicle speed by analyzing the image data or acquire the vehicle speed information from another external ECU or the like.

[0083] As the vehicle speed increases, the amount of time before the vehicle collides with an object existing ahead in the traveling direction becomes shorter. Therefore, during high-speed travel, a longer visible distance and a shorter image acquisition time interval are required. Meanwhile, during low-speed travel in which the amount of time before collision with an object is relatively long, there is some time margin before the driving assistance system that provides safety assistance for the vehicle performs an operation to avoid danger. Therefore, the driving assistance system is affected much less during low-speed travel than during high-speed travel, even if the output of the infrared irradiation unit 110 is relatively reduced. Therefore, for example, during low-speed travel in which the wind speed of the traveling air current (wind) is low and the heat dissipation effect is reduced, the infrared irradiation unit 110 is preferably intermittently operated or selectively operated. For example, a predetermined vehicle speed threshold value can be set. When the vehicle speed is equal to or less than the vehicle speed threshold value, the proportion of light generation per unit time of the infrared irradiation unit 110 can be reduced by intermittent operation or selective operation compared to the case in which the vehicle speed is higher than the vehicle speed threshold value.

[0084] (2) The infrared irradiation unit 110 is directly mounted on the LED board 120. Therefore, the heat transfer efficiency is improved compared to the case in which some member is interposed between the infrared irradiation unit 110 and the LED board 120. Therefore, a higher pixel count can be obtained in the imager 60 because heat is more easily transferred to the lens 80 and the amount of light required to defog and deice the lens 80 generated by the infrared irradiation unit 110 can be reduced.

[0085] Furthermore, a high thermal conductivity member 150 is provided between the LED board 120 and the lens fixing portion 90. Therefore, the heat transfer efficiency from the LED board 120 to the lens fixing portion 90 is improved, and the effects described above are also obtained.

[0086] (3) A low-thermal-conductivity member 140 is provided between the lens barrel 50 and the lens fixing portion 90. Therefore, heat is not easily transferred from the lens fixing portion 90 to the lens barrel 50. Consequently, an excessive temperature rise of the imager 60 and the imager board 70 is further suppressed, and both a higher pixel count and a larger dark field visibility range can be obtained.

[0087] (4) The optical axis of the infrared irradiation unit 110 is inclined relative to the optical axis of the lens barrel 50. Therefore, it is possible to suppress the reflected light of the infrared light from being incident on the lens 80 with excessive intensity. In addition, infrared light can be irradiated in a wider range, and imaging can be performed in a wider range.

[0088] (Second embodiment)

[0089] A second embodiment of the present disclosure will be described. According to this embodiment, a preferred application example of the imaging device 1 will be described. The structure of the imaging device 1 itself is similar to that according to the first embodiment. Therefore, only the application example of the imaging device 1 will be described.

[0090] According to this embodiment, Figure 6 As shown, the camera device 1 is applied to a vehicle. The camera device 1 is installed in a vehicle 4 at a total of four locations, on the left and right sides of the vehicle 4, in two types of locations. Specifically, the camera device 1a is installed below the side mirror 5 of the vehicle 4, and the camera device 1b is installed in the front fender 60 at the rear relative to the front wheel. Figure 7 and Figure 8 A projection diagram of a position where the camera 1 is attached and a cross-sectional view of the camera 1 are shown as viewed from above. However, in the cross-sectional view of the camera 1, the camera 1 is shown as being attached to the camera 1. Figure 2 In a similar way, Figure 1 The X-axis and Y-axis are cut on a plane extending along the Z-axis at a 45° angle. In addition, for convenience, the position of the side mirror 5 is Figure 7 Indicated by the dotted line.

[0091] like Figure 7 As shown, the camera device 1 provided below the side mirror 5 is arranged so that a straight line C1 serving as the optical axis of the lens barrel 50 is inclined at a predetermined angle θ, for example, equal to or greater than 15°, relative to a straight line C2 along the longitudinal (front / rear) direction of the vehicle 4, so as to capture an image obliquely in front of the vehicle 4. Here, the straight line C1 serving as the optical axis of the lens barrel 50 is parallel to the horizontal plane, but may be inclined relative to the horizontal plane.

[0092] In addition, if Figure 8As shown, the imaging device 1 is provided in the front fender 6 so that a straight line C1 serving as an optical axis is inclined at a predetermined angle θ, for example, equal to or greater than 15°, relative to a straight line C2 to capture an image obliquely behind the vehicle 4. Here, the straight line C1 serving as the optical axis of the lens barrel 50 of the imaging device 1b is also parallel to the horizontal plane, but may be inclined relative to the horizontal plane.

[0093] The predetermined angle θ herein may be arbitrary, but is preferably, for example, equal to or greater than 15° and equal to or less than 90°. That is, when the optical axis of the lens barrel 50 is tilted relative to the longitudinal direction of the vehicle 4, the guide member 40 of the camera device 1 is also tilted relative to the longitudinal direction of the vehicle 4. Therefore, as Figure 7 and Figure 8 As shown, for example, the traveling airflow 7 from the front of the vehicle 4 flows along the surface of the guide member 40 toward the lens 80 and, after passing through the opening 41 of the guide member 40 and contacting the lens fixing portion 90, may come into contact with the lens 80. In this manner, the lens fixing portion 90 is located upstream of the flow of the traveling airflow 7, while the lens 80 is located downstream of the flow of the traveling airflow 7. As a result, the lens fixing portion 90 can be easily cooled, while the lens 80, receiving air already heated by the lens fixing portion 90, is not easily cooled. Consequently, fogging or freezing of the lens 80 can be suppressed.

[0094] (Third embodiment)

[0095] A third embodiment of the present disclosure will be described. According to this embodiment, the structure of the container and the like are modified relative to the structure according to the first embodiment. The other structures are similar to those according to the first embodiment. Therefore, only the parts that are different from those according to the first embodiment will be described.

[0096] like Figures 9 to 12 As shown, according to this embodiment, the head portion 30 has a heat dissipation structure. Furthermore, the head portion 30 is made of a metal that easily transfers heat. Specifically, heat dissipation fins 34 are provided on the outer wall surface of the head portion 30. The heat dissipation fins 34 are circular in shape and widen radially around the lens barrel 50. The heat dissipation fins 34 are formed by a plurality of recessed portions 35 formed on the outer wall surface of the head portion 30 and recessed inward in the radial direction.

[0097] In addition, the outer peripheral wall of the chassis 20 is more recessed in the Z-axis direction than the inner peripheral wall, making it possible to widen the area in which the heat dissipation fins 34 are provided. In addition, the outer peripheral wall of the head 30 protrudes more along the straight line C1 than the inner peripheral wall, and the head 30 is inserted into the recessed portion of the chassis 20.

[0098] Since the head 30 is provided with a heat dissipation structure in this manner, the lens barrel 50 can be cooled. Consequently, a temperature rise in the imager 60 and the imager board 70 can be suppressed, and the thermal life of the components provided on the imager board 70 and the imager 60 can be more easily ensured. Furthermore, both sensing performance and sensing range can be achieved.

[0099] Furthermore, according to this embodiment, the head 30 has a bracket-integrated structure. Specifically, when viewed from the Z-axis direction, the head 30 has a quadrilateral exterior shape, and brackets 36 protrude from two surfaces forming the quadrilateral along the Y-axis direction in the X-axis direction. Bracket 36 is a component used to attach the camera device 1 to the vehicle body of the vehicle 4, serving as an accessory member. For example, the camera device 1 can be attached to the vehicle body by inserting screws (not shown) into holes 36a provided in bracket 36.

[0100] The head 30 can have a support-integrated structure in this way. In this case, as shown by Figure 10 As indicated by the arrows in FIG, heat transferred from the infrared irradiation unit 110 to the head 30 is transferred to the attachment member via the bracket 36. Consequently, the LED board 120 can be cooled. In particular, when the head 30 is made of a metal that easily conducts heat, the LED board 120 can be cooled more easily. By configuring the bracket 36 in this manner, for example, it is possible to suppress temperature increases in the imager 60 and imager board 70, and it is possible to easily ensure the lifespan of the components provided on the imager board 70 and the imager 60. Consequently, both sensing performance and sensing range can be achieved.

[0101] The heat dissipation fins 34 and the brackets 36 may be separate components from the head 30 and configured to be fixed to the periphery of the head 30. However, since the head 30, the heat dissipation fins 34, and the brackets 36 are formed as a single component as in the present embodiment, assembly can be improved, heat resistance can be reduced, and heat dissipation in the LED board 120 can be achieved more favorably.

[0102] Here, if Figures 10 to 12 As shown, a grounding spring 160 made of metal is provided at a boundary position between the cover 10 and the chassis 20. The grounding spring 160 can suppress the swinging of the lens barrel 50 relative to the chassis 20 and suppress the transmission of external noise to the imager 60 and the imager board 70. In addition, the guide 40 is divided into two components and is constructed by a first guide portion 42 that covers the infrared irradiation unit 110 and a second guide portion 43 that covers the surface of the first guide portion 42. Due to a configuration such as this, the first guide portion 42 and the second guide portion 43 can be used for different purposes, for example, the first guide portion 42 is made of a material suitable for guiding light, while the second guide portion 43 is made of a highly durable material.

[0103] (Other embodiments)

[0104] Although the present disclosure has been described with reference to the embodiments described above, it should be understood that the present invention is not limited to these embodiments. The present disclosure is intended to cover various modifications and equivalent modifications. In addition, various combinations and configurations, as well as other combinations and configurations further including more, less, or only a single element, are also within the spirit and scope of the present disclosure.

[0105] (1) For example, the infrared irradiation unit 110 may be attached to the head 30 with the LED board 120 therebetween. However, the LED board 120 may not be provided. In this case, for example, a portion of the LED board 120 may be configured and integrated with the lens fixing portion 90. Alternatively, the structure may be such that the infrared irradiation unit 110 is directly attached to the head 30.

[0106] (2) According to the third embodiment, both the heat dissipation fins 34 and the brackets 36 are provided as the heat dissipation structure. However, the structure may be such that only one of them is provided, for example, as shown in FIG. Figure 13 As shown, only the cooling fins 34 are provided in the head 30 .

[0107] (3) According to the embodiment described above, the low thermal conductivity member 140 is provided between the external thread 56 of the lens barrel 50 and the internal thread 94 of the lens fixing portion 90. However, the structure may be such that the low thermal conductivity member 140 is not provided. In addition, in the case where the lens barrel 50 and the lens fixing portion 90 are fixed by the thread structure, a gap is preferably provided between the external thread 56 and the internal thread 94. Figure 14 As shown, when viewed in cross section, the threads of the external thread 56 and the threads of the internal thread 94 are each formed into a shape in which a triangle repeats. In this case, of the two pairs of adjacent sides forming the triangle of the threads, one pair of sides contacts, while the other pair of sides separates. A gap 170 is formed between the separated pair of sides. In this way, since the gap 170 is formed between the external thread 56 and the internal thread 94, heat resistance can be further improved, and heat will not be easily transferred from the lens fixing portion 90 to the lens barrel 50.

[0108] (4) According to the embodiment described above, the lens 80 is defogged and de-iced due to the heat generated by the infrared irradiation unit 110. In addition, as Figure 15As shown, the configuration can be such that the lens heater 180 is provided on the rear surface of the lens 80 and the lens 80 is defrosted and deiced by being heated by the lens heater 180. That is, in the configuration in which the lens 80 is defrosted and deiced based on heat generated by the infrared irradiation unit 110, the lens heater 180 can or can not be provided. Of course, if the lens heater 180 is used in combination, heat generation by the infrared irradiation unit 110 and heat generation by the lens heater 180 can be selectively used. Thus, the lens 80 can be more effectively defrosted and deiced.

[0109] (5) According to the above-described embodiment, the infrared irradiation unit 110 can be directly mounted to the lens fixing portion 90 without having the LED board 120 therebetween. In this case, the LED board 120 can be provided in a portion of the lens fixing portion 90 in which the infrared irradiation unit 110 is not provided.

[0110] (6) According to the above-described embodiment, the imaging device 1 in which the infrared irradiation unit 110 is an electromagnetic wave generator is given as an example of a sensor device. In addition, the lens 80 functions as an electromagnetic wave transmission member constituting an electromagnetic wave reception opening, the lens fixing portion 90 functions as a fixing portion of the electromagnetic wave transmission member, the lens barrel 50 functions as a housing, the imager 60 functions as an electromagnetic wave reception element, the imager board 70 functions as a control board on which various elements that drive the electromagnetic wave reception element and the electromagnetic wave reception element are provided, and the LED board 120 functions as a mounting board on which the infrared irradiation unit 110 is mounted. These are merely examples, and the present disclosure can be applied to a sensor device that uses other electromagnetic waves.

[0111] For example, the present disclosure can be applied to a sensor device such as a millimeter wave radar in which millimeter waves are output as electromagnetic waves and the relative distance to an object is measured by receiving the millimeter waves by a millimeter wave reception element. In the case of the millimeter wave radar, the electromagnetic wave transmission member is a cover glass or the like that covers the surface of the radar. The member that constitutes the path through which the millimeter waves pass is the housing.

[0112] (7) According to the above-described embodiment, the imaging device 1 mounted to a vehicle is given as an example as the imaging device 1 corresponding to the sensor device. However, the sensor device is not limited to the sensor device mounted to the vehicle. However, since the distance between the members is short in response to the demand for compactness of the in-vehicle sensor device, there is a problem in that heat easily transfers from the electromagnetic wave generator to the board on which various elements that drive the electromagnetic wave reception element and the electromagnetic wave reception element are mounted. Thus, the present disclosure is particularly useful when applied to an in-vehicle sensor device that has become compact.

[0113] Further, according to the present embodiment, an example in which the rear end 3 side of the lens barrel 50 is coupled with the imager board 70 by an adhesive material 55 is described. However, the method for coupling the imager board 70 and the lens barrel 50 is not limited. For example, the imager board 70 and the lens barrel 50 can be coupled by brazing. Alternatively, the configuration can be such that the imager board 70 is coupled with the cover 10 or the chassis 20 by a screw or the like, and heat is transferred to the lens barrel 50 through the cover 10 or the chassis 20. This structure is particularly useful for a sensor device in which the lens barrel 50 serves as a path of heat. The number of substrates within the sensor element is not limited to two, i.e., the imager board 70 and the LED board 120 in the present disclosure. Three or more substrates can be provided, for example, by configuring the imager board 70 from a plurality of substrates.

[0114] (8) The above-described embodiments are not irrelevant to each other, and can be appropriately combined, unless the combination is explicitly impossible. Further, according to the above-described embodiments, it is needless to say that the elements constituting the embodiments are not necessarily essential conditions, unless particularly designated as essential conditions, explicitly considered as essential conditions in principle, or the like. Furthermore, according to the above-described embodiments, in the case where a numerical value, such as a number, a numerical value, an amount, or a range, of a constituting element according to the embodiments is stated, the present disclosure is not limited to the specific number, unless particularly designated as an essential condition, explicitly limited to the specific number in principle, or the like. Furthermore, according to the above-described embodiments, when the shape, positional relationship, or the like of a constituting element or the like is referred to, the present disclosure is not limited to the shape, positional relationship, or the like, except for the case where the shape, direction, positional relationship, or the like is explicitly described as particularly an essential condition, explicitly limited to a specific shape, positional relationship, or the like in principle, or the like.

[0115] (Aspects of the Present Disclosure)

[0116] For example, the present disclosure described above can be understood according to the following aspects.

[0117] [First Aspect]

[0118] A sensor device includes: a housing container (10 to 30); an electromagnetic wave generator (110) housed in the housing container, outputting electromagnetic waves to the outside of the housing container, and generating heat accompanying generation of the electromagnetic waves; an electromagnetic wave transmission member (80) housed in the housing container, constituting an electromagnetic wave reception opening that receives electromagnetic waves reflected by an object outside the housing container, and transmitting the electromagnetic waves; a sensing element (60) disposed closer to the inside of the housing container than the electromagnetic wave transmission member; a control board (70) disposed closer to the inside of the housing container than the electromagnetic wave transmission member, the control board (70) controlling the sensing element and switching between outputting electromagnetic waves by the electromagnetic wave generator and not outputting electromagnetic waves by the electromagnetic wave generator; a casing (50) disposed between the electromagnetic wave transmission member and the sensing element and the control board, and constituting a path that guides electromagnetic waves transmitted by the electromagnetic wave transmission member to the sensing element; and a fixing portion (90) configured as a member separate from the casing, and the fixing portion (90) fixing the electromagnetic wave transmission member to the casing, wherein the electromagnetic wave generator generates heat during output of the electromagnetic waves, and the heat is transmitted to the electromagnetic wave transmission member through the fixing portion.

[0119] [Second Aspect]

[0120] The sensor device according to the second aspect, wherein the control board detects at least either a first temperature that is a temperature of the sensing element or a second temperature that is a temperature of the electromagnetic wave generator, and automatically switches between outputting electromagnetic waves by the electromagnetic wave generator and not outputting electromagnetic waves by the electromagnetic wave generator based on the first temperature, the second temperature, and a sensing result of the sensing element with respect to the electromagnetic waves.

[0121] [Third Aspect]

[0122] The sensor device according to the second aspect, wherein, in a case where a detection result indicates that the first temperature or the second temperature is a high temperature, the control board reduces a generation ratio of the electromagnetic waves per unit time compared to a case where the first temperature and the second temperature are not the high temperature, by performing either an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic waves, or a selective operation in which only a part of a plurality of electromagnetic wave generators outputs the electromagnetic waves in a case where the plurality of electromagnetic wave generators are provided.

[0123] [Fourth Aspect]

[0124] The sensor device according to any one of the first aspect to the third aspect, wherein the electromagnetic wave generator is directly mounted to the fixing portion.

[0125] [Fifth Aspect]

[0126] The sensor device according to any one of the first to third aspects, further comprising: a mounting plate (120) on which the electromagnetic wave generator is mounted, wherein the electromagnetic wave generator is connected to the fixed portion through the mounting plate.

[0127] [Sixth aspect]

[0128] The sensor device according to the fifth aspect, wherein the mounting plate is connected to the fixed portion through a high thermal conductivity member (150) that is more thermally conductive than if the mounting plate and the fixed portion were in direct contact.

[0129] [Seventh aspect]

[0130] The sensor device according to any one of the first to sixth aspects, wherein a low thermal conductivity member (140) is provided between the housing and the fixed portion that is less thermally conductive than if the housing and the fixed portion were in direct contact.

[0131] [Eighth aspect]

[0132] The sensor device according to any one of the first to sixth aspects, wherein an external thread (56) is formed in the housing, and an internal thread (94) is formed in the fixed portion; the fixed portion is fixed to a front end of the housing on the electromagnetic wave transmission member side by engaging the external thread and the internal thread; and a gap (170) is formed between the thread of the external thread and the thread of the internal thread.

[0133] [Ninth aspect]

[0134] The sensor device according to any one of the first to eighth aspects, wherein the accommodation container includes a head portion (30) that accommodates the electromagnetic wave generator, the electromagnetic wave transmission member, and the fixed portion; the head portion has a structure integrated with a bracket (36) that is attached to an attachment member (4) to which the sensor device is attached; and heat generated by the electromagnetic wave generator is transferred to the head portion, and is further transferred to the attachment member through the bracket.

[0135] [Tenth aspect]

[0136] The sensor device according to any one of the first to ninth aspects, wherein the sensor device is a vehicle-mounted camera attached to a vehicle (4).

[0137] [Eleventh aspect]

[0138] The sensor device according to the tenth aspect, wherein the electromagnetic wave generator is an infrared irradiation unit (110) constituted by a semiconductor light source that outputs infrared light as an electromagnetic wave, including any one of an infrared light emitting diode, a vertical cavity surface emitting laser, and a photonic crystal surface emitting laser; the sensing element is an imager (60) that captures an image outside the sensor device; the control board is an imager board (70) that performs control of the imager; the electromagnetic wave transmission member is a reflection light receiving lens (80) that receives reflected light of the infrared light output from the infrared irradiation unit; and the housing is a lens barrel (50) that guides the reflected light of the infrared light received by the lens to the imager.

[0139] [The twelfth aspect]

[0140] The sensor device according to the eleventh aspect, wherein an optical axis (L) of the infrared irradiation unit is inclined with respect to an optical axis (C1) of the lens barrel.

[0141] [The thirteenth aspect]

[0142] The sensor device according to the eleventh aspect or the twelfth aspect, wherein the electromagnetic wave transmission member contains a material having a lower thermal conductivity than a material of the housing.

[0143] [The fourteenth aspect]

[0144] The sensor device according to any one of the eleventh aspect to the thirteenth aspect, wherein an optical axis of the lens barrel is inclined at an angle equal to or greater than 15° with respect to a straight line (C2) in a longitudinal direction of the vehicle, and is disposed so that a running airflow (7) of the vehicle flows to the electromagnetic wave transmission member side after coming into contact with the fixed portion.

[0145] [The fifteenth aspect]

[0146] The sensor device according to the first aspect, wherein the sensor device is a vehicle-mounted camera installed in a vehicle (4); the electromagnetic wave generator is an infrared irradiation unit (110) constituted by a semiconductor light source that outputs infrared light as an electromagnetic wave, including any one of an infrared light-emitting diode, a vertical cavity surface emitting laser, and a photonic crystal surface emitting laser; the sensing element is an imager (60) that captures an image outside the camera; the control board is an imager board (70) that performs control of the imager; the electromagnetic wave transmission member is a lens (80) that receives reflected light of the infrared light output from the infrared irradiation unit; and the housing is a lens barrel (50) that guides the reflected light of the infrared light received by the lens to the imager; and the imager board acquires vehicle speed information, and in a case where a vehicle speed indicated by the vehicle speed information is equal to or less than a predetermined vehicle speed threshold value, reduces a production ratio of the electromagnetic wave per unit time compared to a case where the vehicle speed is greater than the vehicle speed threshold value, by performing any one of an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic wave, and a selective operation in which, in a case where a plurality of electromagnetic wave generators are provided, only a part of the plurality of electromagnetic wave generators outputs the electromagnetic wave.

Claims

1. A sensor device comprising: an accommodation container; an electromagnetic wave generator accommodated in the accommodation container, outputting electromagnetic waves to the outside of the accommodation container, and generating heat accompanying generation of electromagnetic waves; an electromagnetic wave transmission member accommodated in the accommodation container, constituting an electromagnetic wave reception opening that receives electromagnetic waves reflected by an object outside the accommodation container, and transmitting the electromagnetic waves; a sensing element disposed closer to the inside of the accommodation container than the electromagnetic wave transmission member; a control board disposed closer to the inside of the accommodation container than the electromagnetic wave transmission member, controlling the sensing element and switching between outputting electromagnetic waves by the electromagnetic wave generator and not outputting electromagnetic waves by the electromagnetic wave generator; a housing provided between the electromagnetic wave transmission member and the sensing element and the control board, and constituting a path that guides the electromagnetic waves transmitted by the electromagnetic wave transmission member to the sensing element; and a fixing portion configured as a member separate from the housing, and fixing the electromagnetic wave transmission member to the housing, wherein the electromagnetic wave generator generates heat during output of electromagnetic waves, and the heat is transmitted to the electromagnetic wave transmission member through the fixing portion. 2.The sensor device according to claim 1, wherein: the control board detects at least either a first temperature that is a temperature of the sensing element or a second temperature that is a temperature of the electromagnetic wave generator, and automatically switches between outputting electromagnetic waves by the electromagnetic wave generator and not outputting electromagnetic waves by the electromagnetic wave generator based on the first temperature, the second temperature, and a sensing result of the electromagnetic waves from the sensing element. 3.The sensor device according to claim 2, wherein: in a case where a detection result indicates that the first temperature or the second temperature is a high temperature, the control board reduces a proportion of generation of electromagnetic waves per unit time compared to a case where the first temperature and the second temperature are not high temperatures, by performing either an intermittent operation in which the electromagnetic wave generator intermittently outputs electromagnetic waves, and a selective operation in which only a part of a plurality of electromagnetic wave generators outputs electromagnetic waves in a case where the plurality of electromagnetic wave generators are provided. 4.The sensor device according to any one of claims 1 to 3, wherein: the electromagnetic wave generator is directly mounted to the fixing portion. 5.The sensor device according to any one of claims 1 to 3, further comprising: a mounting board on which the electromagnetic wave generator is mounted, wherein the electromagnetic wave generator is connected to the fixing portion through the mounting board. 6.The sensor device according to claim 5, wherein: the mounting board is connected to the fixing portion through a high thermal conductivity member that more easily transmits heat than a case where the mounting board and the fixing portion are in direct contact. ​ 7. The sensor apparatus according to claim 1, wherein: a low thermal conductive member is provided between the housing and the fixed portion, which is less likely to transfer heat than when the housing and the fixed portion are in direct contact.

8. The sensor apparatus according to claim 1, wherein: an external thread is formed in the housing, and an internal thread is formed in the fixed portion; the fixed portion is fixed to a front end of the housing on the electromagnetic wave transmission member side by engaging the external thread and the internal thread; and a gap is formed between a thread of the external thread and a thread of the internal thread.

9. The sensor apparatus according to claim 1, wherein: the accommodation container includes a head portion that accommodates the electromagnetic wave generator, the electromagnetic wave transmission member, and the fixed portion; the head portion has a structure integrated with a bracket that is attached to an attachment member to which the sensor apparatus is attached; and heat generated by the electromagnetic wave generator is transferred to the head portion and further transferred to the attachment member through the bracket.

10. The sensor apparatus according to claim 1, wherein: the sensor apparatus is a vehicle-mounted camera attached to a vehicle.

11. The sensor apparatus according to claim 10, wherein: the electromagnetic wave generator is an infrared irradiation unit constituted by a semiconductor light source that outputs infrared light as electromagnetic waves, including any one of an infrared light emitting diode, a vertical cavity surface emitting laser, and a photonic crystal surface emitting laser; the sensing element is an imager that captures an image outside the sensor apparatus; the control board is an imager board that performs control of the imager; the electromagnetic wave transmission member is a lens that receives reflected light of the infrared light output from the infrared irradiation unit; and the housing is a lens barrel that guides the reflected light of the infrared light received by the lens to the imager.

12. The sensor apparatus according to claim 11, wherein: an optical axis of the infrared irradiation unit is inclined with respect to an optical axis of the lens barrel.

13. The sensor apparatus according to claim 11, wherein: the electromagnetic wave transmission member contains a material having a lower thermal conductivity than a material of the housing.

14. The sensor apparatus according to any one of claims 11 to 13, wherein: an optical axis of the lens barrel is inclined at an angle equal to or greater than 15° with respect to a straight line in a longitudinal direction of the vehicle, and is disposed so that a traveling airflow of the vehicle flows to the electromagnetic wave transmission member side after contacting the fixed portion.

15. The sensor apparatus according to claim 1, wherein: the sensor apparatus is a vehicle-mounted camera installed in a vehicle; the electromagnetic wave generator is an infrared irradiation unit constituted by a semiconductor light source that outputs infrared light as electromagnetic waves, including any one of an infrared light emitting diode, a vertical cavity surface emitting laser, and a photonic crystal surface emitting laser; the sensing element is an imager that captures an image outside the camera; The control board is an imager board that performs control of the imager; The electromagnetic wave transmission member is a lens that receives reflected light of the infrared light output from the infrared irradiation unit; and The housing is a lens barrel that guides the reflected light of the infrared light received by the lens to the imager; And The imager board acquires vehicle speed information, and in a case where a vehicle speed indicated by the vehicle speed information is equal to or less than a predetermined vehicle speed threshold value, reduces a production ratio of electromagnetic waves per unit time by performing any one of an intermittent operation in which the electromagnetic wave generator intermittently outputs electromagnetic waves and a selective operation in which only a part of a plurality of electromagnetic wave generators outputs electromagnetic waves in a case where the plurality of electromagnetic wave generators are provided.

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