Vapor chamber and electronic equipment

Abstract

The invention relates to heat dissipation equipment, and discloses a vapor chamber and electronic equipment, so as to improve the heat dissipation performance of the vapor chamber and further improve the working performance of the electronic equipment. The vapor chamber comprises a first cover plate, a second cover plate and a liquid absorption core body, the first cover plate and the second cover plate are fixedly connected and define a cavity, and the cavity comprises an evaporation cavity and a condensation cavity which are oppositely arranged; the liquid absorbing core body is arranged in the cavity and comprises a first surface and a second surface, the first surface is arranged towards the first cover plate, and the second surface is arranged towards the second cover plate; the liquid absorption core body is provided with micro holes, micro columns and micro grooves, the micro holes penetrate from the first surface to the second surface, the micro columns are arranged on the second surface, the micro grooves are at least formed in one of the first surface and the second surface, and the two ends of each micro groove are communicated with the evaporation cavity and the condensation cavity respectively; wherein the aperture of the micropores, the column diameter of the microcolumns and the groove width of the microgrooves are all larger than or equal to 10 microns and smaller than or equal to 500 microns.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a vapor chamber and an electronic device. BACKGROUND

[0002] With the development trend of high integration of the electronic industry, the performance of electronic devices is constantly improving, while the power consumption and heat generation of electronic devices also increase sharply. The vapor chamber (VC) is a heat dissipation component often used in electronic devices, which is a cavity structure with a capillary structure on the inner wall and filled with a working medium. Generally, it includes an evaporation cavity and a condensation cavity. The liquid phase working medium absorbs the heat conducted by the heat source electronic device in the evaporation cavity and is converted into vapor phase working medium. The vapor phase working medium is condensed and released in the condensation cavity and is converted into liquid phase working medium. The liquid phase working medium returns to the evaporation cavity through the capillary action of the capillary structure, and the cycle continues. In the related art, the capillary structure of the vapor chamber often cannot balance the strong capillary force and the high permeability, which limits the liquid return capacity of the capillary structure, and thus affects the heat dissipation capacity of the vapor chamber.

[0003] Therefore, how to improve the heat dissipation performance of the vapor chamber is a technical problem to be solved by those skilled in the art. SUMMARY

[0004] The present application provides a vapor chamber and an electronic device to improve the heat dissipation performance of the vapor chamber and thus improve the working performance of the electronic device.

[0005] In a first aspect, the present application provides a vapor chamber, which can include a first cover plate, a second cover plate and a wick. The first cover plate and the second cover plate can be fixedly connected and enclosed to form a cavity, which includes an evaporation cavity and a condensation cavity. The wick is arranged in the cavity. The wick includes a first surface and a second surface arranged oppositely. The first surface is arranged towards the first cover plate, and the second surface is arranged towards the second cover plate. The wick is provided with micropores, microcolumns and microgrooves. The micropores can penetrate from the first surface to the second surface of the wick. The microcolumns are arranged on the second surface of the wick. The microgrooves are arranged on at least one of the first surface or the second surface, and the two ends of the microgrooves are in communication with the evaporation cavity and the condensation cavity, respectively. The extension structure of the microgrooves has anisotropic properties, so as to provide a guiding effect for the return flow of the liquid phase working medium from the condensation cavity to the evaporation cavity in the vapor chamber, and improve the return flow rate of the liquid phase working medium to the evaporation cavity. The pore diameter of the micropores, the column diameter of the microcolumns and the groove width of the microgrooves can all be greater than or equal to 10 um and less than or equal to 500 um.

[0006] In the present application, the liquid absorbing core of the vapor chamber is provided with microstructures in the micron size order such as micro-holes, micro-columns and micro-slots, so that the capillary force and permeability of the liquid absorbing core are effectively improved, and the problem of limited return liquid capacity of the single type capillary structure is solved. In addition, the liquid absorbing core is designed in an integrated structure, which not only enhances the overall stiffness, but also avoids the defect of excessive thickness of the composite capillary structure. Therefore, the vapor chamber provided by the present application can improve the heat dissipation performance by improving the return liquid capacity of the liquid absorbing core on the premise of small size design, so as to meet the application requirements of thin and light electronic equipment and improve the working performance of the electronic equipment.

[0007] In some embodiments, the side surface of the second cover plate facing away from the cavity includes a heat source area, and a projection of the heat source area in the thickness direction of the vapor chamber is located within a projection range of the evaporation cavity in the thickness direction of the vapor chamber. The heat source area can be used to contact the heat source electronic device of the electronic equipment, and the heat generated by the heat source electronic device can be transmitted to the liquid-phase working medium in the evaporation cavity through the second cover plate, so that the heat source electronic device is cooled by heat dissipation, and the liquid-phase working medium in the evaporation cavity is converted into liquid working medium by heat absorption.

[0008] In some embodiments, the second surface of the liquid absorbing core includes a first area and a second area, the first area can be located in the evaporation cavity, and the second area can be at least partially located in the condensation cavity. The pore size of the micro-holes of the first area can be smaller than the pore size of the micro-holes of the second area, and the arrangement density of the micro-holes of the first area can be greater than the arrangement density of the micro-holes of the second area. By reducing the pore size of the micro-holes of the first area and increasing the arrangement density of the micro-holes, the liquid absorbing core can provide more evaporation sites and evaporation area in the part corresponding to the heat source area, thereby improving the evaporation efficiency of the liquid absorbing core in this part and providing reliable guarantee for the vapor chamber to support higher critical heat flux density. The pore size of the micro-holes of the second area can be relatively large, and the arrangement density can be relatively sparse, as long as the capillary return flow is ensured.

[0009] In some embodiments, the micro-holes of the first area can be formed by a laser etching process, which not only meets the processing requirements of small size and high density of the micro-holes of the first area, but also has high control precision, and can accurately control the pore size, position and arrangement density of the micro-holes of the first area. The micro-holes of the second area can be formed by a chemical etching process, which is simple and efficient in process, and has relatively low process cost. It can not only meet the processing requirements of the micro-holes of the second area, but also help to reduce the overall manufacturing cost of the liquid absorbing core.

[0010] In some embodiments, the second surface of the wick includes a first region and a second region, the first region can be located in the evaporation chamber, and the second region can be at least partially located in the condensation chamber. The micro-pillars in the first region have a smaller diameter than the micro-pillars in the second region, and the micro-pillars in the first region have a higher packing density than the micro-pillars in the second region. By reducing the diameter of the micro-pillars in the first region and increasing the packing density of the micro-pillars, the meniscus area of the liquid phase working fluid can be increased, and the wick can provide more evaporation area in the portion corresponding to the heat source, thereby improving the evaporation efficiency of the wick in this portion and enhancing the heat dissipation effect of the heat source electronic device. By increasing the diameter of the micro-pillars in the second region and reducing the packing density of the micro-pillars, the wick can have sufficient support strength, and the permeability of the wick can be increased, thereby reducing the backflow resistance of the working fluid.

[0011] In some embodiments, the micro-pillars in the first region and the micro-pillars in the second region can be formed by a chemical etching process. For example, the micro-pillars in the first region and the micro-pillars in the second region can be etched synchronously using different patterned masks to simplify the process flow of the wick and improve the processing efficiency of the wick.

[0012] In some embodiments, the chamber of the wick further includes an adiabatic chamber located between the evaporation chamber and the condensation chamber. The wick includes a first core, at least a portion of the first core can be located in the adiabatic chamber. Micro-slots are provided on the first core, so that after the working fluid is liquefied in the condensation chamber, the liquid phase working fluid can flow to the evaporation chamber under the directional guiding effect of the micro-slots, thereby accelerating the backflow rate of the liquid phase working fluid.

[0013] In some embodiments, the wick can further include a second core, the second core includes a first sub-core and a second sub-core, wherein at least a portion of the first sub-core is located in the evaporation chamber, and at least a portion of the second sub-core is located in the condensation chamber. Micro-pillars can be provided on at least the first sub-core and the second sub-core of the second core. The micro-pillars on the first sub-core and the second sub-core are distributed in a space-filling manner, so that the first sub-core and the second sub-core have isotropic properties. Therefore, the working fluid in the evaporation chamber and the condensation chamber can flow in all directions, thereby accelerating the evaporation or condensation rate of the working fluid and enabling the vapor chamber to achieve more efficient heat dissipation.

[0014] In some embodiments, the first sub-core is spaced apart from the second sub-core, and the first core is located between the first sub-core and the second sub-core. Along the backflow direction of the liquid phase working fluid, the first sub-core, the first core, and the second sub-core can be considered as being arranged in series. Most of the liquid phase working fluid liquefied in the condensation chamber can be transported to the evaporation chamber through the micro-slots of the first core, thereby further improving the backflow rate of the liquid phase working fluid.

[0015] In some embodiments, the second wick can further include a third sub-wick, at least a portion of the third sub-wick being located in the adiabatic cavity. The third sub-wick and the first wick can be arranged in parallel between the first sub-wick and the second sub-wick. In the direction of the return flow of the liquid-phase working medium, the portion of the liquid-phase working medium liquefied in the condensation cavity is transported to the evaporation cavity through the micro-channels of the first wick, and the portion of the liquid-phase working medium is transported to the evaporation cavity through the gaps between the micro-pillars of the third sub-wick. The return flow capacity of the wick is improved to a certain extent, and the processing cost is relatively low.

[0016] In some embodiments, the first sub-wick can include a first notch arranged towards the second sub-wick, and the second sub-wick can include a second notch arranged towards the first sub-wick. The first wick can include a fourth sub-wick, a fifth sub-wick and a sixth sub-wick, the fourth sub-wick being located between the first sub-wick and the second sub-wick, the fifth sub-wick being connected to one side of the fourth sub-wick towards the first sub-wick and located in the first notch, and the sixth sub-wick being connected to one side of the fourth sub-wick towards the second sub-wick and located in the second notch. In the direction of the return flow of the liquid-phase working medium, the first sub-wick, the fourth sub-wick and the second sub-wick can be arranged in series, the fifth sub-wick being arranged in parallel with part of the first sub-wick, and the sixth sub-wick being arranged in parallel with part of the second sub-wick. Since the coverage area of the micro-channels is relatively large, the return flow capacity of the wick can be effectively improved.

[0017] In some embodiments, all the micro-holes can be arranged in the second wick to simplify the processing technology of the wick and improve the processing efficiency of the wick on the premise of accelerating the return flow of the liquid-phase working medium. Alternatively, in some other embodiments, part of the micro-holes can be arranged in the second wick, and the other part of the micro-holes can be arranged in the first wick. In this way, the wick can not only improve the return flow rate of the liquid-phase working medium, but also reduce the risk of storing the liquid-phase working medium in the adiabatic cavity, so that the vapor chamber can reliably dissipate heat for the heat source electronic device.

[0018] In some embodiments, the first wick and the second wick can respectively include a first layer structure and a second layer structure, the second layer structure being arranged on one side of the first layer structure towards the first cover plate. The micro-pillars can form the second layer structure of the first wick and the second layer structure of the second wick, that is, the micro-pillars can be arranged on the entire second surface of the wick, so as to reliably support the entire wick and effectively improve the permeability of the wick.

[0019] In some embodiments, the micro-channels can be arranged on one side of the first layer structure of the first wick towards the first cover plate, that is, the micro-channels and the micro-pillars are arranged on opposite sides. After the working medium is liquefied in the condensation cavity, the liquid-phase working medium can flow into the evaporation cavity under the directional flow guiding action of the micro-channels, so as to accelerate the return flow rate of the liquid-phase working medium.

[0020] In some embodiments, the first layer structure of the first wick body and the first layer structure of the second wick body collectively form a second surface. Some of the microgrooves can be disposed on the side of the first layer structure of the first wick body facing the second cover plate, and some of the microgrooves can be disposed on the end surface of the micro-pillar of the first wick body, thereby increasing the coverage area of the microgrooves in the first wick body and accelerating the return rate of the liquid-phase working medium.

[0021] In some embodiments, the first wick body and the second wick body can respectively include a first layer structure and a second layer structure, and the second layer structure is disposed on the side of the first layer structure facing the second cover plate. The micro-pillar can form the second layer structure of the second wick body, and the microgroove can be disposed on the side of the second layer structure of the first wick body facing the second cover plate. In this embodiment, the micro-pillar and the microgroove are disposed on the same side, and the micro-pillar and the microgroove can be at least partially disposed on the same layer, thereby helping to reduce the thickness of the wick body and further helping to reduce the overall thickness of the vapor chamber.

[0022] In some embodiments, the wick body can include a thinned portion formed by a local recess on the first surface, and the thickness of the thinned portion is smaller than the thickness of the portion of the wick body other than the thinned portion. Since the thickness of the thinned portion is relatively small, the length of the micro-hole disposed on the thinned portion is also relatively short, which helps to accelerate the circulation efficiency of the working medium between the evaporation cavity and the condensation cavity, thereby improving the heat dissipation efficiency of the vapor chamber.

[0023] In some embodiments, the wick body can include a thickened portion formed by a local protrusion on the second surface, and the distance between the thickened portion and the second cover plate can be smaller than the distance between the portion of the wick body other than the thickened portion and the second cover plate. Since the distance between the thickened portion and the second cover plate is relatively small, the capacity of the liquid-phase working medium is also reduced, so that the liquid-phase working medium can achieve a high evaporation rate under the condition that the power of the heat source electronic device is small, thereby achieving efficient heat dissipation of the heat source electronic device.

[0024] In some embodiments, the first surface of the wick body is locally recessed, the second surface of the wick body is locally protruded, and the recess and the protrusion are oppositely disposed along the thickness direction of the wick body. With this design, the liquid-phase working medium in the evaporation cavity can achieve a high evaporation rate, and the circulation efficiency of the working medium between the evaporation cavity and the condensation cavity can be accelerated.

[0025] In some embodiments, the second cover plate includes a first arching portion arching toward the inside of the cavity, and the side surface of the second cover plate away from the cavity can form a groove corresponding to the first arching portion, which can be used to accommodate the heat source electronic device to improve the heat dissipation effect of the heat source electronic device. The wick body includes a second arching portion arching toward the first cover plate, and the second arching portion is oppositely disposed with the first arching portion, thereby forming an avoidance for the second arching portion and reducing the risk of interference between the wick body and the second cover plate.

[0026] In some embodiments, the first cover plate has a plurality of bosses arranged at intervals on the side surface facing the cavity, and air channels are formed between adjacent bosses and communicate with the evaporation cavity and the condensation cavity respectively. The vapor-phase working medium vaporized in the evaporation cavity can flow to the condensation cavity through the air channels, so that the air channels provide a guiding effect for the vapor-phase working medium and improve the flow efficiency of the vapor-phase working medium.

[0027] In other embodiments, a plurality of wicks are arranged at intervals, and air channels are formed between adjacent wicks and communicate with the evaporation cavity and the condensation cavity respectively, so that the air channels provide a guiding effect for the vapor-phase working medium. In this scheme, the overall thickness of the vapor chamber is relatively small, so it is more suitable for application requirements in thin and light electronic devices.

[0028] In a second aspect, the present application also provides a vapor chamber, which can include a first cover plate, a second cover plate, and a wick. The first cover plate and the second cover plate can be fixedly connected and enclose a cavity, and the cavity includes an evaporation cavity and a condensation cavity. The wick is arranged in the cavity, and the wick includes a first surface and a second surface arranged oppositely, the first surface is arranged towards the first cover plate, and the second surface is arranged towards the second cover plate. The wick is provided with micropores and micropillars, the micropores can penetrate from the first surface to the second surface of the wick, and the micropillars are arranged on the second surface of the wick. The pore diameter of the micropores and the column diameter of the micropillars can both be greater than or equal to 10 um and less than or equal to 500 um. The second surface of the wick includes a first region and a second region, the first region can be located in the evaporation cavity, and the second region can be at least partially located in the condensation cavity. The pore diameter of the micropores in the first region can be smaller than the pore diameter of the micropores in the second region, and the arrangement density of the micropores in the first region can be greater than the arrangement density of the micropores in the second region.

[0029] In the present application, the wick of the vapor chamber is provided with microstructures such as micropores and micropillars in the micron size order, so that the capillary force and permeability of the wick are effectively improved. The wick is designed in an integrated structure, which not only enhances the overall stiffness, but also avoids the defect of excessive thickness of the composite capillary structure. Therefore, the vapor chamber provided in the present application can improve the heat dissipation performance by improving the liquid return capacity of the wick under the premise of small size design, so as to meet the application requirements of thin and light electronic equipment and improve the working performance of the electronic equipment. In addition, by reducing the pore diameter of the micropores in the first region and increasing the arrangement density of the micropores, the wick can provide more evaporation sites and evaporation area in the part corresponding to the heat source area, so as to improve the evaporation efficiency of the wick in this part and provide reliable guarantee for the vapor chamber to support higher critical heat flux density. The micropores in the second region only need to ensure normal capillary return, so the pore diameter of the micropores can be relatively large and the arrangement density can be relatively sparse to reduce the processing difficulty of the wick.

[0030] In some embodiments, the micropores in the first region can be formed by a laser etching process, which not only meets the small size and high density processing requirements of the micropores in the first region, but also has high control precision and can accurately control the pore diameter, position and arrangement density of the micropores in the first region. The micropores in the second region can be formed by a chemical etching process, which is simple and efficient in process and has relatively low process cost. It not only meets the processing requirements of the micropores in the second region, but also helps to reduce the overall manufacturing cost of the wick.

[0031] In some embodiments, the column diameter of the micropillars in the first region is smaller than the column diameter of the micropillars in the second region, and the arrangement density of the micropillars in the first region is greater than the arrangement density of the micropillars in the second region. By reducing the column diameter of the micropillars in the first region and increasing the arrangement density of the micropillars, the meniscus area of the liquid phase working medium can be increased, so that the wick can provide more evaporation area in the part corresponding to the heat source area, thereby improving the evaporation efficiency of the wick in this part and enhancing the heat dissipation effect of the heat source electronic device. By increasing the column diameter of the micropillars in the second region and reducing the arrangement density of the micropillars, the wick can be provided with sufficient support strength and increased permeability, thereby reducing the return resistance of the phase working medium.

[0032] In some embodiments, the wick can also be provided with a microgroove, the microgroove being arranged at least on one of the first face or the second face, and the two ends of the microgroove being in communication with the evaporation cavity and the condensation cavity, respectively. The groove width of the microgroove is greater than or equal to 10 um and less than or equal to 500 um. The extension structure of the microgroove has anisotropic characteristics, so it can guide the return of the liquid phase working medium from the condensation cavity to the evaporation cavity in the vapor chamber, thereby improving the return rate of the liquid phase working medium to the evaporation cavity.

[0033] In a third aspect, the application further provides a vapor chamber, which can include a first cover plate, a second cover plate, and a wick. The first cover plate and the second cover plate can be fixedly connected and enclose a cavity, which includes an evaporation cavity and a condensation cavity. The wick is arranged in the cavity and includes a first surface and a second surface arranged oppositely, the first surface is arranged towards the first cover plate, and the second surface is arranged towards the second cover plate. The wick is provided with micropores and micropillars, the micropores can pass through the first surface to the second surface of the wick, and the micropillars are arranged on the second surface of the wick. The pore diameter of the micropores and the column diameter of the micropillars can both be greater than or equal to 10 um and less than or equal to 500 um. The second surface of the wick includes a first region and a second region, the first region can be located in the evaporation cavity, and the second region can be at least partially located in the condensation cavity. The micropores of the first region and the micropores of the second region can be formed by different processes.

[0034] In the application, the wick of the vapor chamber is provided with micropores and micropillars of micron size, so that the capillary force and permeability of the wick are effectively improved. The wick is designed in an integrated structure, which not only enhances the overall stiffness, but also avoids the defect of excessive thickness of the composite capillary structure. Therefore, the vapor chamber provided by the application can improve the heat dissipation performance by improving the liquid return capacity of the wick on the premise of small size design, so as to meet the application requirements of thin and light electronic equipment and improve the working performance of the electronic equipment. In addition, by forming the micropores of the first region and the micropores of the second region by different processes, appropriate processing technology can be selected according to the required size of the micropores of the first region, and appropriate processing technology can be selected according to the required size of the micropores of the second region, so as to improve the processing precision of the micropores.

[0035] In some embodiments, the pore diameter of the micropores of the first region can be smaller than the pore diameter of the micropores of the second region, and the arrangement density of the micropores of the first region can be greater than the arrangement density of the micropores of the second region. By reducing the pore diameter of the micropores of the first region and increasing the arrangement density of the micropores, the wick can provide more evaporation sites and evaporation area in the part corresponding to the heat source area, so as to improve the evaporation efficiency of the wick in this part and provide reliable guarantee for the vapor chamber to support higher critical heat flux density. The pore diameter of the micropores of the second region can be relatively large, and the arrangement density of the micropores can be relatively sparse, as long as the capillary return is normal.

[0036] In some embodiments, the micropores in the first region can be formed by a laser etching process, which can not only meet the processing requirements of small size and high density of the micropores in the first region, but also have higher regulation accuracy, and can accurately control the pore size, position and arrangement density of the micropores in the first region. The micropores in the second region can be formed by a chemical etching process, which is relatively simple and efficient, and has relatively low process cost. The chemical etching process can not only meet the processing requirements of the micropores in the second region, but also help to reduce the overall manufacturing cost of the wick.

[0037] In some embodiments, the column diameter of the micropillars in the first region is smaller than the column diameter of the micropillars in the second region, and the arrangement density of the micropillars in the first region is greater than the arrangement density of the micropillars in the second region. By reducing the column diameter of the micropillars in the first region and increasing the arrangement density of the micropillars, the meniscus area of the liquid working medium can be increased, so that the wick can provide more evaporation area in the part corresponding to the heat source area, thereby improving the evaporation efficiency of the wick in this part and enhancing the heat dissipation effect of the heat source electronic device. By increasing the column diameter of the micropillars in the second region and reducing the arrangement density of the micropillars, the wick can provide sufficient support strength, and the permeability of the wick can be increased, thereby reducing the backflow resistance of the phase working medium.

[0038] In some embodiments, the wick can further be provided with a micro groove, the micro groove being arranged on at least one of the first surface and the second surface, and the two ends of the micro groove being in communication with the evaporation cavity and the condensation cavity, respectively. The groove width of the micro groove is greater than or equal to 10 um and less than or equal to 500 um. The extension structure of the micro groove has anisotropic properties, so that it can guide the backflow of the liquid working medium from the condensation cavity to the evaporation cavity in the vapor chamber, and improve the backflow rate of the liquid working medium to the evaporation cavity.

[0039] In a fourth aspect, the present application also provides an electronic device, which comprises a heat source electronic device and a vapor chamber according to any one of the first aspect to the third aspect. The heat source electronic device is in thermal contact with the second cover plate of the vapor chamber on the side surface away from the cavity. The orthogonal projection of the heat source area in the thickness direction of the vapor chamber is located in the range of the orthogonal projection of the evaporation cavity in the thickness direction of the vapor chamber. In the working process of the vapor chamber, the liquid phase working medium in the evaporation cavity is converted into the vapor phase working medium after absorbing the heat generated by the heat source electronic device, the vapor phase working medium flows to the condensation cavity, is converted into the liquid phase working medium after condensation and heat release in the condensation cavity, and flows back to the evaporation cavity through the gaps between the micropillars of the wick and the micro groove. The continuous heat dissipation of the heat source electronic device can be realized through the above-mentioned circulation. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0041] Figure 2 A schematic structural diagram of an electronic device provided in another embodiment of the present application;

[0042] Figure 3 A schematic structural diagram of an electronic device provided in another embodiment of the present application;

[0043] Figure 4 A schematic diagram of the planar structure of a temperature homogenizing plate provided in an embodiment of the present application;

[0044] Figure 5 for Figure 4 A schematic diagram of a cross-sectional structure of a temperature homogenizing plate at AA is shown in FIG.

[0045] Figure 6a and Figure 6b A schematic diagram of the structure of the second surface of the absorbent core provided in an embodiment of the present application;

[0046] Figure 7a and Figure 7b A schematic diagram of the structure of the second surface of the absorbent core provided in an embodiment of the present application;

[0047] Figure 8 for Figure 4 A schematic diagram of a cross-sectional structure of a temperature homogenizing plate at position BB is shown in FIG;

[0048] Figure 9 for Figure 8 Schematic diagram of the cross-sectional structure of the liquid wick of the temperature equalizing plate shown in ;

[0049] Figure 10a for Figure 9 A schematic structural diagram of the absorbent core body shown in the second surface;

[0050] Figure 10b for Figure 10a A schematic structural diagram of the absorbent core body shown in FIG. 1 on the first side;

[0051] Figure 11 for Figure 9 Another structural schematic diagram of the absorbent core on the second side shown in FIG;

[0052] Figure 12a for Figure 9 Another structural schematic diagram of the absorbent core on the second side shown in FIG;

[0053] Figure 12b for Figure 12a A schematic structural diagram of the absorbent core body shown in FIG. 1 on the first side;

[0054] Figure 13 for Figure 9Another structural schematic view of the liquid absorbing core in the second surface shown in FIG. 8;

[0055] Figure 14a For Figure 9 Another structural schematic view of the liquid absorbing core in the second surface shown in FIG. 8;

[0056] Figure 14b For Figure 14a A structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0057] Figure 15 For Figure 9 Another structural schematic view of the liquid absorbing core in the second surface shown in FIG. 8;

[0058] Figure 16 For Figure 4 Another sectional structural schematic view of the vapor chamber at B-B shown in FIG. 8;

[0059] Figure 17 For Figure 16 A sectional structural schematic view of the liquid absorbing core of the vapor chamber shown in FIG. 8;

[0060] Figure 18 For Figure 17 A structural schematic view of the liquid absorbing core in the second surface shown in FIG. 8;

[0061] Figure 19 For Figure 4 Another sectional structural schematic view of the vapor chamber at B-B shown in FIG. 8;

[0062] Figure 20 For Figure 19 A sectional structural schematic view of the liquid absorbing core of the vapor chamber shown in FIG. 8;

[0063] Figure 21a For Figure 20 A structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0064] Figure 21b For Figure 20 Another structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0065] Figure 22a For Figure 20 Another structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0066] Figure 22b For Figure 20 Another structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0067] Figure 23a For Figure 20 Another structural schematic view of the liquid absorbing core in the first surface shown in FIG. 8;

[0068] Figure 23b For Figure 20 Another structural schematic view of the liquid absorption core in the first surface;

[0069] Figure 23b For Figure 20 to Figure 23b Another sectional structural schematic view of the vapor chamber at A-A shown in the figure;

[0070] Figure 6a For Figure 6b Another sectional structural schematic view of the vapor chamber at A-A shown in the figure;

[0071] Figure 7a For Figure 7b Another sectional structural schematic view of the vapor chamber at A-A shown in the figure;

[0072] Figure 24 A sectional structural schematic view of a vapor chamber provided by an embodiment of the present application;

[0073] Figure 4 A sectional structural schematic view of a vapor chamber provided by an embodiment of the present application.

[0074] Reference signs:

[0075] 1000 - electronic device; 100 - housing; 110 - first housing; 120 - second housing; 130 - rotating shaft; 200 - heat source electronic device;

[0076] 300 - vapor chamber; 3001 - first part; 3002 - second part; 3003 - third part; 310 - first cover plate; 311 - boss; 312 - air channel;

[0077] 320 - second cover plate; 321 - heat source area; 322 - first arch part; 323 - groove; 330 - liquid absorption core; 330a - first surface; 330b - second surface;

[0078] 330b1 - first area; 330b2 - second area; 331 - micropore; 332 - microcolumn; 333 - microgroove; 334 - first core;

[0079] 3341 - first layer structure of the first core; 3342 - second layer structure of the first core; 3343 - fourth sub-core; 3344 - fifth sub-core;

[0080] 3345 - sixth sub-core; 335 - second core; 3351 - first sub-core; 33511 - first notch; 3352 - second sub-core;

[0081] 33521 - second gap; 3353 - first layer structure of the second wick; 3354 - second layer structure of the second wick; 3355 - third sub-wick;

[0082] 336 - thinning portion; 3361 - recess; 337 - thickening portion; 3371 - protrusion; 338 - second arching portion; 339 - avoiding groove; 340 - cavity;

[0083] 341 - evaporation cavity; 342 - condensation cavity; 343 - adiabatic cavity. DETAILED DESCRIPTION

[0084] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will combine the drawings to make further detailed description of the embodiments of the present application. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments set forth herein. The same reference signs in the drawings represent the same or similar structures, and thus repeated description thereof will be omitted. The expressions of position and direction described in the embodiments of the present application are described with the drawings as an example, but can be changed as needed, and the changes made are included in the protection scope of the present application. The drawings of the embodiments of the present application are only used to show the relative position relationship and do not represent the real proportion.

[0085] It should be noted that specific details are set forth in the following description in order to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in various other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotations of the embodiments of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0086] The vapor chamber is a heat dissipation device often used in electronic equipment, which is a cavity 340 structure with a capillary structure (also called wick 330) inside and filled with working medium. The basic working principle of the vapor chamber is that the liquid phase working medium absorbs the heat conducted by the heat source electronic device in the evaporation cavity 341 of the cavity 340 and is converted into vapor phase working medium, the vapor phase working medium is condensed and heat is released in the condensation cavity 342 of the cavity 340 and is converted into liquid phase working medium, the liquid phase working medium is backflowed to the evaporation cavity 341 by the capillary action of the wick 330, and the cycle is repeated, thereby realizing continuous heat dissipation of the heat source electronic device.

[0087] The wicking core 330 is a key component that enables the heat spreader to achieve high heat dissipation performance. In related art, the wicking core 330 generally employs a wire mesh capillary structure, a powder sintered capillary structure, a grooved capillary structure, or a composite capillary structure of two or more of the above types. While wire mesh and powder sintered capillary structures have relatively strong capillary forces, they have relatively low permeabilities, resulting in relatively high resistance to transporting liquid phase fluids. Groove-type capillary structures have relatively good permeabilities and low transport resistance, but also relatively weak capillary forces. Therefore, a wicking core 330 employing a single capillary structure often struggles to achieve both strong capillary forces and high permeabilities, limiting the wicking core's 330 liquid return capacity. Composite capillary structures, such as a wire mesh and groove composite, or a powder sintered and groove composite, can achieve a certain balance between capillary forces and permeabilities, but are often too thick to meet the application requirements of thin and lightweight electronic devices.

[0088] In view of this, the embodiments of the present application provide a heat vapor chamber and an electronic device to improve the heat dissipation performance of the heat vapor chamber without increasing the thickness of the heat vapor chamber, thereby enhancing the operating performance of the electronic device. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0089] Figure 24 This is a structural diagram of an electronic device 1000 provided in an embodiment of the present application. Figure 25 As shown, in an embodiment of the present application, the electronic device 1000 can be a straight-type electronic device, such as a straight-type mobile phone or a tablet computer. The electronic device 1000 includes a housing 100 and a heat source electronic device 200 and a heat spreader 300 arranged in the housing 100. The heat source electronic device 200 includes but is not limited to a central processing unit (CPU), an artificial intelligence (AI) processor, a system on chip (SoC), a power management unit, or other devices that require heat dissipation. The heat spreader 300 can be a hard heat spreader 300, and the heat spreader 300 is in thermal contact with the heat source electronic device 200. The heat generated by the heat source electronic device 200 can be dispersed to a relatively low temperature area in the housing 100 through the heat spreader 300, so that the operating temperature of the heat source electronic device 200 can be controlled within an appropriate temperature range, thereby ensuring the reliable operation of the electronic device 1000.

[0090] Figure 4 and Figure 25 This is a schematic diagram of the structure of an electronic device 1000 provided in some other embodiments of the present application. In these embodiments, the electronic device 1000 is a foldable electronic device, for example, Figure 26 The large foldable phone shown in the Figure 4The foldable mobile phone shown in FIG. 1A can be a foldable mobile phone shown in FIG. 1B, or can be a foldable tablet, a foldable notebook computer, a foldable wearable device, etc. For reference Figure 26 and Figure 24 to Figure 26 The electronic device 1000 includes a first housing 110, a second housing 120, and a hinge 130. The first housing 110 and the second housing 120 are rotationally connected to two sides of the hinge 130, so that the electronic device 1000 can be folded or unfolded according to different use scenarios.

[0091] The heat source electronic device 200 of the electronic device can be disposed in the first housing 110. The vapor chamber 300 includes a first portion 3001, a second portion 3002, and a third portion 3003. The first portion 3001 is disposed in the first housing 110 and is in thermal contact with the heat source electronic device 200. The second portion 3002 is disposed in the second housing 120. The third portion 3003 is disposed in the hinge 130 and connects the first portion 3001 and the second portion 3002. The heat generated by the heat source electronic device 200 can be dispersed to a relatively low temperature area in the first housing 110 through the first portion 3001, or can be dispersed to the relatively low temperature second housing 120 through the third portion 3003 and the second portion 3002. Thus, the working temperature of the heat source electronic device 200 can be controlled within an appropriate temperature range, ensuring reliable operation of the electronic device 1000.

[0092] Figure 27 A planar structure schematic diagram of a vapor chamber 300 provided in an embodiment of the present application, Figure 27 for Figure 28 A cross-sectional structure schematic diagram of the vapor chamber 300 shown in FIG. 1A at A-A. For reference Figure 28 and Figure 26 As shown in FIG. 1C, in the embodiment, the vapor chamber 300 includes a first cover plate 310, a second cover plate 320, and a wick 330. The first cover plate 310 and the second cover plate 320 are fixedly connected and can enclose a cavity 340. The wick 330 is disposed in the cavity 340. In addition, the cavity 340 is filled with a working medium. The working medium can be converted between a vapor phase and a liquid phase with temperature changes. Exemplarily, the working medium can be, but is not limited to, at least one of pure water, ethylene glycol, alcohol, or ammonia.

[0093] In the cavity 340 of the temperature equalizing plate 300, the working medium can be transformed between the vapor phase and the liquid phase as the temperature changes. According to the phase state of the working medium, the cavity 340 of the temperature equalizing plate 300 can be roughly divided into an evaporation chamber 341, a condensation chamber 342 and an insulation chamber 343. In the embodiment of the present application, the liquid phase working medium is converted into a vapor phase working medium after absorbing heat by evaporation in the evaporation chamber 341, and the vapor phase working medium is converted into a liquid phase working medium after condensing and releasing heat in the condensation chamber 342, and then flows back to the evaporation chamber 341 through the capillary action of the liquid wick 330. The insulation chamber 343 is located between the evaporation chamber 341 and the condensation chamber 342. It can be considered that the working medium in the insulation chamber 343 basically does not exchange heat with the outside world. Among them, the essence of capillary action is a surface phenomenon related to surface flow and the equilibrium shape of the liquid surface caused by the existence of surface tension, such as the formation of droplets or curved liquid surfaces, the rise or fall of the liquid surface in the capillary pores, etc. When the balance between the surface tension and gravity of the liquid in the tiny pores of the capillary structure is broken, the liquid will overcome gravity and rise or move. The absorbent core 330 realizes the transportation of liquid working medium through this principle.

[0094] In one implementation, the planar shape of the temperature plate 300 can be Figure 6a to Figure 7b The rectangular shape shown in FIG. 3 shows a cavity 340 of the temperature-vaporizing plate 300, which includes an evaporation cavity 341, a condensation cavity 342, and an insulation cavity 343. This type of temperature-vaporizing plate 300 can be applied to Figure 11 In another implementation, the planar shape of the temperature plate 300 can also be a special shape, for example, Figure 18 The heat evaporating plate 300 in the foldable electronic device shown in the figure has a cavity 340 of the heat evaporating plate 300 including an evaporation cavity 341, two condensation cavities 342 and two insulation cavities 343, wherein the evaporation cavity 341, the condensation cavity 342 and the insulation cavity 343 are arranged in the first part 3001 of the heat evaporating plate 300, the other condensation cavity 342 is arranged in the second part 3002 of the heat evaporating plate 300, and the other insulation cavity 343 is arranged in the third part 3003 of the heat evaporating plate 300, and the local area of ​​the first part 3001 and the second part 3002 close to the third part 3003; for another example, applied to ​ The temperature averaging plate 300 in the foldable electronic device shown has a cavity 340 of the temperature averaging plate 300 including an evaporation cavity 341, a condensation cavity 342 and an insulation cavity 343, wherein the evaporation cavity 341 is arranged in the first part of the temperature averaging plate 300, the condensation cavity 342 is arranged in the second part of the temperature averaging plate 300, and the insulation cavity 343 is arranged in the third part of the temperature averaging plate 300, as well as a local area of ​​the first part 3001 and the second part 3002 close to the third part 3003.

[0095] In the embodiment, the first cover plate 310 and the wick 330 can be spaced apart, and a gap between the first cover plate 310 and the wick 330 can be used for the flow of the vapor-phase working medium. For example, the side surface of the first cover plate 310 facing the cavity 340 has a plurality of bosses 311 arranged at intervals, and a gas channel 312 can be formed between two adjacent bosses 311. The gas channel 312 is in communication with the evaporation cavity 341 and the condensation cavity 342, and the vapor-phase working medium vaporized in the evaporation cavity 341 can flow to the condensation cavity 342 through the gas channel 312, so that the gas channel 312 provides a guide for the vapor-phase working medium.

[0096] The side surface of the second cover plate 320 facing away from the cavity 340 includes a heat source area 321. The relative arrangement direction (i.e., the thickness direction of the vapor chamber 300) of the first cover plate 310 and the second cover plate 320 is defined as the first direction, and the projection of the evaporation cavity 341 in the first direction covers the projection of the heat source area 321 in the first direction. The heat source area 321 is used to be in thermal contact with the heat source electronic device, and the heat generated by the heat source electronic device can be transmitted to the liquid-phase working medium in the evaporation cavity 341 through the second cover plate 320. In this way, the heat source electronic device is cooled by heat dissipation, and the liquid-phase working medium in the evaporation cavity 341 is converted into a liquid-phase working medium by heat absorption.

[0097] The first cover plate 310 and the second cover plate 320 can be welded or sealed and connected by a sealing glue or the like. The first cover plate 310 and the second cover plate 320 can be made of a rigid material, and the vapor chamber 300 using the cover plate of this material can be applied to a straight plate electronic device. Alternatively, the first cover plate 310 and the second cover plate 320 can also be made of a flexible material, and the vapor chamber 300 using the cover plate of this material can be applied to a foldable electronic device to adapt to the repeated folding and unfolding of the foldable electronic device by using the bendable characteristics of the flexible material.

[0098] For example, in some embodiments, the first cover plate 310 and the second cover plate 320 can be made of a single-layer metal material, which can include but is not limited to copper, copper alloy, aluminum, aluminum alloy, steel, stainless steel, titanium, titanium alloy, aluminum-magnesium alloy, amorphous alloy, shape memory alloy (SMA), high-entropy alloy (HEAs), or metal ceramic composite material (i.e., a composite material formed by doping ceramic particles such as silicon carbide in a metal material matrix, wherein the ceramic particles are used to improve the performance of the material, such as improving the stiffness and strength, etc.), and the like.

[0099] In some other embodiments, the first cover plate 310 and the second cover plate 320 can also be made of a composite material. The composite material refers to a layered composite material formed by one or more materials of a single metal type and a single non-metal type through calendering, electroplating or other means, such as a composite material of different metals, a composite material of metal and ceramic, a composite material of metal and polymer, etc.

[0100] The wick 330 can be made of a metal material with excellent heat conduction performance, such as C1020 oxygen-free copper. The wick 330 includes a first surface 330a and a second surface 330b arranged oppositely. The first surface 330a of the wick 330 faces the first cover plate 310, and the second surface 330b of the wick 330 faces the second cover plate 320.

[0101] In the embodiment, the wick 330 can be provided with micropores 331, which can pass through from the first surface 330a to the second surface 330b of the wick 330. In addition, the wick 330 can also be provided with micro columns 332, which are arranged on the second surface 330b of the wick 330. The micro columns 332 are in contact with the second cover plate 320 on one side end surface thereof, so that the micro columns 332 can support the entire wick 330. For example, the micro columns 332 can be located at positions on the second surface 330b where the micropores 331 are not arranged, so as to avoid plugging the micropores 331. Further, the wick 330 can also be provided with micro grooves 333, which can be arranged on at least one of the first surface 330a or the second surface 330b, for example ​ In the embodiment, the micro grooves 333 are arranged on the first surface 330a, i.e., the micro grooves 333 and the micro columns 332 are arranged on opposite sides.

[0102] The micropores 331, the micro columns 332 and the micro grooves 333 can be understood as microstructures with relatively small sizes in the order of microns. In a specific implementation, the micropores 331, the micro columns 332 and the micro grooves 333 can all be multiple. The multiple microstructures with sizes in the order of microns can make the wick 330 have a stronger capillary force and improve the liquid return capacity of the wick 330. The micropores 331 can be circular holes or hole structures similar to circular holes, the micro columns 332 can be cylindrical structures or column structures similar to cylinders, and the micro grooves 333 are generally groove structures with equal groove widths, so as to reduce the processing difficulty of the micropores 331, the micro columns 332 and the micro grooves 333. Here, the groove width of the micro grooves 333 at a position can be considered as the size in the direction orthogonal to the extension direction of the position.

[0103] The pore diameter of the micropore 331, the column diameter of the microcolumn 332, and the slot width of the microslot 333 can all be greater than or equal to 10 um and less than or equal to 500 um. Exemplarily, the pore diameter of the micropore 331 can be 100 um, 95 um, 80 um, 72 um, 65 um, etc.; the column diameter of the microcolumn 332 can be 200 um, 180 um, 165 um, 153 um, 130 um, etc.; and the slot width of the microslot 333 can be 100 um, 80 um, 68 um, 40 um, 35 um, etc.

[0104] Since the micropore 331, the microcolumn 332, and the microslot 333 are relatively microscopic and not easy to observe with the naked eye, in the drawings of the embodiments of the present application, a schematic drawing method is used to highlight the design features, and the number, shape, and size of the micropore 331, the microcolumn 332, and the microslot 333 in the drawings are not limited to the actual structure. ​ and are not used to represent the actual structure.

[0105] In the embodiments of the present application, the two ends of the microslot 333 are in communication with the evaporation cavity 341 and the condensation cavity 342, that is, the microslot 333 extends between the evaporation cavity 341 and the condensation cavity 342. The extension structure of the microslot 333 has anisotropic characteristics, and thus can provide a guiding effect for the return flow of the liquid-phase working medium from the condensation cavity 342 to the evaporation cavity 341, thereby improving the return flow rate of the liquid-phase working medium to the evaporation cavity 341.

[0106] In one implementation, the microslot 333 can extend in a straight line, for example, the extension direction of the microslot 333 can be the relative arrangement direction of the evaporation cavity 341 and the condensation cavity 342, so that the microslot 333 has a relatively short extension length, thereby further helping to accelerate the return flow rate of the liquid-phase working medium. In another implementation, the extension direction of the microslot 333 can also be curved or zigzag. The present application does not make specific limitations on the extension shape of the microslot 333, as long as the evaporation cavity 341 and the condensation cavity 342 are in communication.

[0107] The microslot 333 can be formed by a laser etching process, for example, using a femtosecond laser device (femtosecond laser is a laser that emits in the form of pulses, with a duration of only a few femtoseconds, one femtosecond is equal to one trillionth of a second) or a picosecond laser device (picosecond laser has a duration of picoseconds, one picosecond is equal to one hundred billionth of a second) or other ultrafast laser devices. By laser etching to form the microslot 333, the slot width and slot depth of the microslot 333 can be accurately controlled to meet the small size processing requirements of the microslot 333. In addition, laser etching can form a hydrophilic micro-nano structure on the slot wall of the microslot 333, so that the liquid absorbing core 330 can provide stronger capillary force to accelerate the return flow of the liquid-phase working medium.

[0108] In the working process of the vapor chamber 300, the liquid-phase working medium in the evaporation cavity 341 absorbs heat generated by the heat source electronic device and is converted into vapor-phase working medium. The vapor-phase working medium flows to the air channel 312 between the first cover plate 310 and the first surface 330a of the wick body 330 through the micropores 331 of the wick body 330, and flows to the condensation cavity 342 through the air channel 312. The vapor-phase working medium is converted into liquid-phase working medium after heat release in the condensation cavity 342. The liquid-phase working medium returns to the evaporation cavity 341 through the gaps between the micropillars 332 and the microgrooves 333 of the wick body 330. Thus, the continuous heat dissipation of the heat source electronic device can be achieved.

[0109] In the embodiment, the wick body 330 of the vapor chamber 300 is provided with the micropores 331, the micropillars 332 and the microgrooves 333, so that the capillary force and the permeability of the wick body 330 are effectively improved, and the problem of limited return liquid capacity of the single type of capillary structure is solved. In addition, the wick body 330 is designed in an integrated structure, which not only enhances the overall stiffness, but also avoids the defect of excessive thickness of the composite capillary structure. Therefore, the vapor chamber 300 provided in the embodiment can improve the heat dissipation performance by improving the return liquid capacity of the wick body 330 on the premise of small size design, so as to meet the application requirements of the thin and light electronic equipment and improve the working performance of the electronic equipment.

[0110] ​ and ​ The structure diagram of the second surface 330b of the wick body 330 provided in the embodiment is shown for clearly showing the design of the micropore 331, ​ and ​ The micropillar 332 and the microgroove 333 are omitted in the above description. ​ and ​ As shown in the above description, in the embodiment, the second surface 330b of the wick body 330 includes a first region 330b1 and a second region 330b2. The first region 330b1 is located in the evaporation cavity 341, and at least part of the second region 330b2 is located in the condensation cavity 342. For example, in the embodiment shown in ​ , the orthogonal projection of the first region 330b1 in the first direction is substantially coincident with the orthogonal projection of the heat source region 321 in the first direction, and the orthogonal projection of the second region 330b2 in the first direction covers the orthogonal projection of the condensation cavity 342, the adiabatic cavity 343 and part of the evaporation cavity 341 in the first direction; or, in the embodiment shown in ​ , the orthogonal projection of the first region 330b1 in the first direction is substantially coincident with the orthogonal projection of the evaporation cavity 341 in the first direction, and the orthogonal projection of the second region 330b2 in the first direction is substantially coincident with the orthogonal projection of the condensation cavity 342 and the adiabatic cavity 343 in the first direction.

[0111] In some embodiments, the pore size of the micropores 331 in the first region 330b1 can be smaller than the pore size of the micropores 331 in the second region 330b2, and the arrangement density of the micropores 331 in the first region 330b1 can be greater than the arrangement density of the micropores 331 in the second region 330b2, or in other words, the center-to-center distance of the micropores 331 in the first region 330b1 is smaller than the center-to-center distance of the micropores 331 in the second region 330b2. By reducing the pore size and the center-to-center distance of the micropores 331 in the first region 330b1, the wick 330 can provide more evaporation sites and evaporation area in the portion corresponding to the heat source region 321, thereby improving the evaporation efficiency of the wick 330 in this portion, providing a reliable guarantee for the critical heat flux (CHF) that the vapor chamber 300 can support, and meeting the heat dissipation needs of the highly integrated and high-performance heat source electronic device 200.

[0112] The pore size of each micropore 331 in the first region 330b1 can be the same, and the center-to-center distance of any two micropores 331 in the first region 330b1 can also be the same. Similarly, the pore size of each micropore 331 in the second region 330b2 can be the same, and the center-to-center distance of any two micropores 331 in the second region 330b2 can also be the same, so as to further reduce the processing difficulty of the wick 330. In addition, the same size defined in the embodiments of the present application is not limited to absolute complete consistency, and small range deviations caused by processing errors are allowed.

[0113] Based on the design difference in the size of the micropores 331 in the first region 330b1 and the micropores 331 in the second region 330b2, the micropores 331 in the first region 330b1 and the micropores 331 in the second region 330b2 can be formed by different processes, so as to reduce the overall manufacturing process difficulty of the wick 330 as much as possible under the premise of meeting the size requirements of the micropores 331 in different regions.

[0114] For example, in an embodiment, the micropores 331 in the first region 330b1 can be formed by a laser etching process, such as etching formed by using a femtosecond laser device or a picosecond laser device, etc. By laser etching to form the micropores 331, not only the small size and high density processing requirements of the micropores 331 in the first region 330b1 can be met, but also the micropores 331 in the first region 330b1 have higher control precision, and the pore size, position, and center-to-center distance, etc. of the micropores 331 in the first region 330b1 can be accurately controlled.

[0115] The micropores 331 of the second area 330b2 can be formed by a chemical etching process, such as wet etching or dry etching. Chemical etching is a technique that removes specific parts of the surface by chemical reaction. In this embodiment, the parts of the second area 330b2 where the micropores 331 are to be formed can be removed by chemical reaction, thereby obtaining the desired porous structure. The process of chemical etching is relatively simple and efficient, and the process cost is relatively low. The chemical etching process can meet the processing requirements of the micropores 331 of the second area 330b2, and also helps to reduce the overall manufacturing cost of the wick body 330.

[0116] ​ and ​ The structure of the wick body 330 provided in this embodiment is shown in the structure diagram of the second surface 330b, for the purpose of clearly showing the design of the micropillars 332, ​ and ​ The micropores 331 and the microgrooves 333 are omitted in the above. ​ and ​ As shown in the above, in this embodiment, the second surface 330b of the wick body 330 can also be divided into a first area 330b1 and a second area 330b2. The specific positions of the first area 330b1 and the second area 330b2 can be referred to the description of the foregoing embodiments, which will not be repeated here.

[0117] In this embodiment, the diameter of the micropillars 332 of the first area 330b1 is smaller than the diameter of the micropillars 332 of the second area 330b2, and the arrangement density of the micropillars 332 of the first area 330b1 is greater than the arrangement density of the micropillars 332 of the second area 330b2, or in other words, the center-to-center distance of the micropillars 332 of the first area 330b1 is smaller than the center-to-center distance of the micropillars 332 of the second area 330b2. By reducing the diameter and the center-to-center distance of the micropillars 332 of the first area 330b1, the meniscus area of the liquid working medium can be increased, so that the wick body 330 can provide more evaporation area in the part corresponding to the heat source area 321, thereby improving the evaporation efficiency of the wick body 330 in this part and enhancing the heat dissipation effect of the heat source electronic device 200. For the micropillars 332 located in the condensation cavity 342 and the heat insulation cavity 343, the larger diameter can provide sufficient support strength for the wick body 330, and the larger center-to-center distance can increase the permeability of the wick body 330 and reduce the backflow resistance of the liquid working medium, thereby enhancing the heat dissipation efficiency of the wick body 330.

[0118] The micropillars 332 of the first area 330b1 and the micropillars 332 of the second area 330b2 can be formed by a chemical etching process. In a specific implementation, the micropillars 332 of the first area 330b1 and the micropillars 332 of the second area 330b2 can be formed by synchronous etching using different patterned mask plates, so as to simplify the process flow of the wick body 330 and improve the processing efficiency of the wick body 330.

[0119] ​ For ​ A cross-sectional structure schematic diagram of the uniform temperature plate 300 at B-B is shown in FIG. 3B, ​ An example of the micro-pillars 332 and the micro-grooves 333 being disposed on the same side is shown. Referring to FIG. 3C, in the embodiments of the present application, the wick 330 includes a first wick 334, at least a portion of the first wick 334 being located in the adiabatic cavity 343. For example, the first wick 334 can be entirely located in the adiabatic cavity 343; or, along the length direction of the uniform temperature plate 300 (i.e., the relative arrangement direction of the evaporation cavity 341 and the condensation cavity 342), one end of the first wick 334 extends into the evaporation cavity 341 or the condensation cavity 342, or both ends of the first wick 334 extend into the evaporation cavity 341 and the condensation cavity 342, respectively. ​

[0120] In an embodiment, the plurality of micro-grooves 333 are disposed in the first wick 334, so that after the working medium is liquefied in the condensation cavity 342, the liquid-phase working medium can flow to the evaporation cavity 341 under the directional flow guiding effect of the plurality of micro-grooves 333, thereby accelerating the return flow rate of the liquid-phase working medium.

[0121] Continuing to refer to ​ , the wick 330 can further include a second wick 335, the second wick 335 including a first sub-wick 3351 and a second sub-wick 3352, wherein at least a portion of the first sub-wick 3351 is located in the evaporation cavity 341, and at least a portion of the second sub-wick 3352 is located in the condensation cavity 342. For example, the first sub-wick 3351 can be entirely located in the evaporation cavity 341, and the second sub-wick 3352 can be entirely located in the evaporation cavity 341; or, along the length direction of the uniform temperature plate 300, one end of the first wick 334 can extend into the adiabatic cavity 343, and one end of the second sub-wick 3352 can also extend into the adiabatic cavity 343.

[0122] The plurality of micro-pillars 332 can be disposed in at least the second wick 335, wherein part of the micro-pillars 332 are disposed in the first sub-wick 3351, and part of the micro-pillars 332 are disposed in the second sub-wick 3352. The micro-pillars 332 that are spaced apart on the first sub-wick 3351 and the second sub-wick 3352 have isotropic properties, so that the working medium in the evaporation cavity 341 and the condensation cavity 342 can flow in various directions, thereby accelerating the evaporation or condensation rate of the working medium, and enabling the uniform temperature plate 300 to achieve more efficient heat dissipation.

[0123] ​ For ​ A cross-sectional structure schematic diagram of the wick 330 of the uniform temperature plate 300 is shown in FIG. 3D. Referring to FIGS. 3D and 3E, ​ and ​ ​As shown, in some embodiments, the first core 334 and the second core 335 include a first layer structure and a second layer structure, respectively. The second layer structures of both cores are disposed on the side of their first layer structures facing the second cover plate 320. A plurality of micropillars 332 can be formed as the second layer structure 3354 of the second core 335. The side of the first layer structure 3353 of the second core 335 facing the second cover plate 320 can be considered as part of the second surface 330b of the absorbent core 330, while the other portion of the second surface 330b of the absorbent core 330 is formed by the side of the second layer structure 3342 of the first core 334 facing the second cover plate 320. In other words, the second surface 330b of the absorbent core 330 is in the form of a stepped surface. The plurality of microgrooves 333 are disposed on the side of the second layer structure of the first core 334 facing the second cover plate 320. Therefore, in this embodiment, the microcolumns 332 and the microgrooves 333 are not only arranged on the same side of the liquid absorbent core 330, but the microcolumns 332 and the microgrooves 333 can also be at least partially arranged in the same layer, which helps to reduce the thickness of the liquid absorbent core 330 and further reduce the overall thickness of the temperature equalizing plate 300.

[0124] ​ for ​ The absorbent core 330 shown in FIG is a schematic structural diagram on the second side. ​ As shown, in the embodiment of the present application, the first sub-core 3351 and the second sub-core 3352 can be spaced apart along the length of the vapor chamber 300, with the first core 334 located between the first sub-core 3351 and the second sub-core 3352. In this design, along the reflux direction of the liquid-phase working medium, the first sub-core 3351, the first core 334, and the second sub-core 3352 can be considered to be arranged in series. Most of the liquid-phase working medium liquefied in the condensation chamber can be transported to the evaporation chamber through the microgrooves 333 of the first core 334, thereby further increasing the reflux rate of the liquid-phase working medium.

[0125] ​ for ​ The structure diagram of the absorbent core 330 on the first side is shown in FIG. ​ and ​ As shown, in this embodiment, all of the plurality of micropores 331 can be disposed in the second core 335, with some of the micropores 331 disposed in the first sub-core 3351 and some of the micropores 331 disposed in the second sub-core 3352. The first core 334 is not provided with micropores 331. This simplifies the processing of the liquid-phase working medium 330 while accelerating the reflux of the liquid-phase working medium, thereby improving the processing efficiency of the liquid-phase working medium 330.

[0126] For reference ​ and ​In the embodiment, the micro-column 332 forms the second layer structure 3354 of the second wick 335, and the micro-hole 331 is arranged through the first layer structure of the second wick 335, so the height of the micro-column 332 is the thickness of the second layer structure 3354 of the second wick 335, and the depth of the micro-hole 331 is the thickness of the first layer structure 3353 of the second wick 335. In a specific implementation, the thickness of the first layer structure 3351 of the second wick 335 can be less than or equal to the thickness of the second layer structure 3354 of the second wick 335, that is, the layer thickness occupied by the micro-hole 331 is less than or equal to the layer thickness occupied by the micro-column 332, so that the capillary force of the first wick 334 can be improved, and the risk of dry-out due to insufficient return of the working medium in the vapor chamber 300 can be reduced.

[0127] ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300.

[0128] As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300.

[0129] ​ As shown in FIG. 13, the wick 330 shown in FIG. 12 can be arranged on the second surface of the vapor chamber 300. ​Another structural schematic view of the second face of the wick 330 shown in FIG. 3. Referring to FIG. 4, the wick 330 includes a first sub-wick 3351, a second sub-wick 3352, and a third sub-wick 3355. The first sub-wick 3351 and the second sub-wick 3352 are arranged along the length direction of the vapor chamber 300, and the third sub-wick 3355 is arranged along the width direction of the vapor chamber 300. ​ In the embodiment of the present application, the second wick 335 can further include a third sub-wick 3355, at least part of the third sub-wick 3355 being located in the adiabatic cavity. For example, the third sub-wick 3355 can be entirely located in the adiabatic cavity 343; or, along the length direction of the vapor chamber 300, one end of the third sub-wick 3355 extends into the evaporation cavity 341 or the condensation cavity 342, or both ends of the third sub-wick 3355 extend into the evaporation cavity 341 and the condensation cavity 342, respectively.

[0130] The third sub-wick 3355 and the first wick 334 are arranged along the width direction of the vapor chamber 300, that is, the third sub-wick 3355 and the first wick 334 are arranged side by side between the first sub-wick 3351 and the second sub-wick 3352. In one implementation, the third sub-wick 3355 and the first wick 334 can each be one, and then one third sub-wick 3355 and one first wick 334 are arranged side by side; in another implementation, the third sub-wick 3355 can be two and the first wick 334 can be one, and then the first wick 334 is arranged between the two third sub-wicks 3355; in yet another implementation, the third sub-wick 3355 can be one and the first wick 334 can be two, and then the third sub-wick 3355 is arranged between the two first wicks 334; in yet another implementation, the third sub-wick 3355 and the first wick 334 can each be a plurality, and then the plurality of third sub-wicks 3355 and the plurality of first wicks 334 are arranged alternately. ​ The example shown in FIG. 5 is one case in which the first wick 334 is arranged between the two third sub-wicks 3355.

[0131] In this design, along the return direction of the liquid-phase working medium, the third sub-wick 3355 and the first wick 334 are arranged in parallel, and as a whole, the third sub-wick 3355 and the first wick 334 are arranged in series between the first sub-wick 3351 and the second sub-wick 3352. Part of the liquid-phase working medium liquefied in the condensation cavity is transported to the evaporation cavity through the micro-grooves 333 of the first wick 334, and part of the liquid-phase working medium is transported to the evaporation cavity through the gaps between the micro-pillars 332 of the third sub-wick 3355. The return capacity of the wick 330 is improved to a certain extent, and the processing cost is relatively low.

[0132] ​ For ​ The structural schematic view of the first face of the wick 330 shown in FIG. 6. Referring to FIG. 6 and FIG. 4, the wick 330 includes a first sub-wick 3351, a second sub-wick 3352, and a third sub-wick 3355. The first sub-wick 3351 and the second sub-wick 3352 are arranged along the length direction of the vapor chamber 300, and the third sub-wick 3355 is arranged along the width direction of the vapor chamber 300. ​ and ​As shown, in this embodiment, the plurality of micropores 331 can be disposed entirely in the first sub-core 3351, the second sub-core 3352, and the third sub-core 3355 of the second core 335, while the first core 334 is not provided with micropores 331. This simplifies the processing of the absorbent core 330 while accelerating the reflux of the liquid working medium, thereby improving the processing efficiency of the absorbent core 330.

[0133] ​ for ​ Another structural diagram of the absorbent core 330 on the second side is shown in FIG. ​ As shown, in this embodiment, the micropores 331 can be provided not only in each sub-core of the second core 335, but also in the first core 334. Therefore, the first core 334 is provided with both microgrooves 333 and micropores 331. Through this design, the liquid wicking core 330 can not only increase the reflux rate of the liquid working medium, but also reduce the risk of the liquid working medium being stored in the insulating cavity 343, thereby enabling the temperature vapor chamber 300 to reliably dissipate heat for the heat source electronic device 200.

[0134] ​ for ​ Another structural diagram of the absorbent core 330 on the second side is shown in FIG. ​ As shown, in the embodiment of the present application, the first sub-core 3351 includes a first notch 33511 disposed toward the second sub-core 3352, and the second sub-core 3352 includes a second notch 33521 disposed toward the first sub-core 3351. The first core 334 includes a fourth sub-core 3343, a fifth sub-core 3344, and a sixth sub-core 3345. The fourth sub-core 3343 is located between the first sub-core 3351 and the second sub-core 3352. The fifth sub-core 3344 is connected to a side of the fourth sub-core 3343 facing the first sub-core 3351, and the fifth sub-core 3344 is located within the first notch 33511. The sixth sub-core 3345 is connected to a side of the fourth sub-core 3343 facing the second sub-core 3352, and the sixth sub-core 3345 is located within the second notch 33521.

[0135] In this design, along the reflux direction of the liquid working medium, the first sub-core 3351, the fourth sub-core 3343, and the second sub-core 3352 can be considered to be arranged in series, the fifth sub-core 3344 is arranged in parallel with a portion of the first sub-core 3351, and the sixth sub-core 3345 is arranged in parallel with a portion of the second sub-core 3352. Because the microgrooves 333 cover a relatively large area, the reflux capacity of the liquid wicking core 330 can be effectively improved.

[0136] ​ for ​The structure diagram of the absorbent core 330 on the first side is shown in FIG. ​ and ​ As shown, in this embodiment, multiple micropores 331 can be set in the first sub-core 3351 and the second sub-core 3352 of the second core 335, while the first core 334 is not provided with micropores 331, so as to simplify the processing technology of the liquid-absorbing core 330 and improve the processing efficiency of the liquid-absorbing core 330 while accelerating the reflux of the liquid-phase working medium.

[0137] ​ for ​ Another structural diagram of the absorbent core 330 on the second side is shown in FIG. ​ As shown, in this embodiment, the micropores 331 can be provided in each sub-core of the second core 335 or in each sub-core of the first core 334. Therefore, each sub-core of the first core 334 is provided with both microgrooves 333 and micropores 331. Through this design, the liquid wicking core 330 can not only increase the reflux rate of the liquid working medium, but also reduce the risk of the liquid working medium being stored in the insulating cavity 343, thereby enabling the temperature vapor chamber 300 to reliably dissipate heat for the heat source electronic device 200.

[0138] In addition, ​ In the embodiment shown, the pore diameter and pore center distance of the micropores 331 of the absorbent core 330 can also refer to ​ and ​ The embodiment shown in the figure is described in a differentiated design. The column diameter and column center distance of the micro column 332 can also refer to ​ and ​ The description of the illustrated embodiments is differentiated in design, and the details will not be repeated here.

[0139] ​ for ​ Another cross-sectional structural diagram of the temperature homogenizing plate 300 at position BB is shown in FIG. ​ for ​ The cross-sectional structure diagram of the liquid wick 330 of the temperature equalizing plate 300 is shown in FIG. ​ and ​ An example of micro-pillars 332 and micro-grooves 333 being arranged on the same side is also shown. ​ and ​ As shown, in the embodiment of the present application, the division of the first core 334 and the second core 335 in the absorbent core 330 can refer to the aforementioned ​The first core 334 and the second core 335 respectively include a first layer structure and a second layer structure, and the second layer structure of the two cores is arranged on the side of the first layer structure facing the second cover plate 320. The side of the first layer structure 3341 of the first core 334 facing the first cover plate 310 and the side of the first layer structure 3353 of the second core 335 facing the first cover plate 310 jointly form the first side 330a of the liquid absorption core 330, and the side of the first layer structure 3341 of the first core 334 facing the second cover plate 320 and the side of the first layer structure 3353 of the second core 335 facing the second cover plate 320 jointly form the second side 330b of the liquid absorption core 330.

[0140] The plurality of micro columns 332 are arranged in the first core 334 and the second core 335, and the plurality of micro columns 332 can be formed as the second layer structure 3342 of the first core 334 and the second layer structure 3354 of the second core 335. That is, the second side 330b of the liquid absorption core 330 can be arranged with micro columns 332 on the whole, thereby reliably supporting the liquid absorption core 330 as a whole and effectively improving the permeability of the liquid absorption core 330.

[0141] ​ For ​ A structural schematic view of the liquid absorption core 330 shown in FIG. 3B on the second side. Referring to FIGS. 3B and 3C together, ​ and ​ In the embodiment of the present application, the micro groove 333 can be arranged not only on the side of the first layer structure of the first core 334 facing the second cover plate 320, but also on the end surface of the micro column 332 of the first core 334, thereby increasing the coverage area of the micro groove 333 in the first core 334 and accelerating the return flow rate of the liquid-phase working medium.

[0142] In a specific implementation, the micro groove 333 of the first layer structure of the first core 334 and the micro groove 333 of the end surface of the micro column 332 of the first core 334 can be formed synchronously by a laser etching process, thereby improving the processing efficiency of the liquid absorption core 330.

[0143] Of course, in some other embodiments, the micro groove 333 can be arranged not only in the first core 334 but also in the second core 335, for example, on the surface of the first layer structure of the second core 335 facing the second cover plate 320 and on the end surface of the micro column 332 of the second core 335, to further accelerate the return flow rate of the liquid-phase working medium.

[0144] In addition, in the embodiment, the plurality of micro holes 331 can be arranged not only in the first core 334 but also in the second core 335, thereby increasing the coverage area of the micro holes 331 in the liquid absorption core 330 and improving the capillary force of the liquid absorption core 330.

[0145] Combine ​ and ​ As shown, in the second core 335, the micropillars 332 form the second layer structure 3354 of the second core 335, and the micropores 331 penetrate the first layer structure 3353 of the second core 335. Therefore, the height of the micropillars 332 is equal to the thickness of the second layer structure 3354 of the second core 335, and the depth of the micropores 331 is equal to the thickness of the first layer structure 3353 of the second core 335. The thickness of the first layer structure 3353 of the second core 335 can be less than or equal to the thickness of the second layer structure 3354 of the second core 335, that is, the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the micropillars 332. In the first core 334, the overall thickness of the first layer 3341 of the first core 334 is defined as d2, and the depth of the microgrooves 333 is defined as d1'. Therefore, the depth of the micropores 331 of the first core 334 is at least d2-d1'. Specifically, d2-d1'≤d1', meaning that the thickness of the layer occupied by the micropores 331 is less than or equal to the thickness of the layer occupied by the microgrooves 333. By increasing the height of the micropillars 332 of the second core 335 and the depth of the microgrooves 333 of the first core 334, the capillary force and permeability of the absorbent core 330 can be effectively improved, thereby enhancing the liquid return capability of the absorbent core 330.

[0146] In addition, ​ and ​ In the embodiment shown, the pore diameter and pore center distance of the micropores 331 of the absorbent core 330 can also refer to ​ and ​ The embodiment shown in the figure is described in a differentiated design. The column diameter and column center distance of the micro column 332 can also refer to ​ and ​ The description of the illustrated embodiments is differentiated in design, and the details will not be repeated here.

[0147] ​ for ​ Another cross-sectional structural diagram of the temperature homogenizing plate 300 at position BB is shown in FIG. ​ An example of micro-pillars 332 and micro-grooves 333 being arranged on opposite sides is shown. ​As shown in the present embodiment, the wick 330 includes a first wick 334 and a second wick 335, at least part of the first wick 334 is located in the adiabatic cavity 343, and the second wick 335 includes a first sub-wick 3351 and a second sub-wick 3352, wherein at least part of the first sub-wick 3351 is located in the evaporation cavity 341, and at least part of the second sub-wick 3352 is located in the condensation cavity 342. A plurality of micro-grooves 333 are arranged on the side of the first layer structure of the first wick 334 facing the first cover plate 310, so that the liquid-phase working medium can flow into the evaporation cavity 341 under the directional flow guiding effect of the plurality of micro-grooves 333 after being liquefied in the condensation cavity 342, thereby accelerating the return flow rate of the liquid-phase working medium.

[0148] ​ As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in ​ As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in ​ and ​ As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in

[0149] A plurality of micro-pillars 332 are arranged on the first wick 334 and the second wick 335, and the plurality of micro-pillars 332 can be formed on the second layer structure of the first wick 334 and the second layer structure of the second wick 335. That is, the second surface 330b of the wick 330 can be arranged with micro-pillars 332 on the entire surface to effectively improve the capillary force of the wick 330.

[0150] ​ As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in ​ As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in As shown in the cross-sectional structure of the wick of the vapor chamber 300 shown in

[0151] In addition, in the present embodiment, part of the plurality of micro-holes 331 are arranged in the second wick 335, and the other part of the micro-holes 331 can be arranged in the first wick 334, for example, the other part of the micro-holes 331 can be arranged in the partial region of the first wick 334 close to the first sub-wick 3351 and the partial region of the first wick 334 close to the second sub-wick 3352. By arranging the micro-grooves 333 and the micro-holes 331 on both ends of the first sub-wick 3351, the processing technology of the wick 330 can be simplified to a certain extent under the premise of improving the capillary force of the wick 330.

[0152] Of course, in other embodiments, the micro-holes 331 can also be arranged in the first sub-wick 3351 and the second sub-wick 3352, and the first wick 334 does not arrange the micro-holes 331, which can further simplify the processing technology of the wick 330 and improve the processing efficiency of the wick 330.

[0153] ​ FIG. 4 is another structural schematic view of the wick 330 shown in FIG. 3 in the first surface. As shown in FIG. 4, in the present embodiment, the micro-holes 331 can be arranged in the second wick 335 or the first wick 334, and in the first wick 334, the micro-holes 331 can be distributed in the entire region of the first wick 334 to effectively improve the capillary force of the wick 330. ​ ​

[0154] ​ ​ FIG. 5 is another structural schematic view of the wick 330 shown in FIG. 3 in the first surface. As shown in FIG. 5, in the present embodiment, the second wick 335 can further include a third sub-wick 3355, at least part of the third sub-wick 3355 is located in the heat insulation cavity 343 (see FIG. 6). The third sub-wick 3355 and the first wick 334 are arranged in parallel between the first sub-wick 3351 and the second sub-wick 3352. Along the return flow direction of the liquid-phase working medium, the third sub-wick 3355 and the first wick 334 are arranged in parallel, and as a whole, they are arranged in series between the first sub-wick 3351 and the second sub-wick 3352. The return flow capacity of the wick 330 is improved to a certain extent, and the processing cost is relatively low. ​ ​

[0155] ​​​​​In addition, in the embodiment, the first wick 334 can be provided with the micro-holes 331 at the local area close to the first sub-wick 3351 and the local area close to the second sub-wick 3352, so as to simplify the processing technology of the liquid absorbing wick 330 under the premise of improving the capillary force of the liquid absorbing wick 330 to a certain extent.

[0156] ​ FIG. 6 is a schematic view of another structure of the liquid absorbing wick 330 at the first face, according to the embodiment of the present application. ​ FIG. 6 is a schematic view of another structure of the liquid absorbing wick 330 at the first face, according to the embodiment of the present application. ​ As shown in FIG. 6, in the embodiment of the present application, the second wick 335 is provided with the micro-holes 331, the first wick 334 is provided with the micro-holes 331 and the micro-grooves 333, and the micro-holes 331 and the micro-grooves 333 can be distributed in the whole area of the first wick 334, so as to effectively improve the capillary force of the liquid absorbing wick 330.

[0157] ​ FIG. 6 is a schematic view of another structure of the liquid absorbing wick 330 at the first face, according to the embodiment of the present application. ​ FIG. 6 is a schematic view of another structure of the liquid absorbing wick 330 at the first face, according to the embodiment of the present application. ​ As shown in FIG. 6, in the embodiment of the present application, the first sub-wick 3351 comprises a first notch 33511 arranged towards the second sub-wick 3352, and the second sub-wick 3352 comprises a second notch 33521 arranged towards the first sub-wick 3351. The first wick 334 comprises a fourth sub-wick 3343, a fifth sub-wick 3344 and a sixth sub-wick 3345. The fourth sub-wick 3343 is located between the first sub-wick 3351 and the second sub-wick 3352. The fifth sub-wick 3344 is connected to one side of the fourth sub-wick 3343 towards the first sub-wick 3351, and the fifth sub-wick 3344 is located in the first notch 33511. The sixth sub-wick 3345 is connected to one side of the fourth sub-wick 3343 towards the second sub-wick 3352, and the sixth sub-wick 3345 is located in the second notch 33521.

[0158] In the direction of the return flow of the liquid phase working medium, the first sub-wick 3351, the fourth sub-wick 3343 and the second sub-wick 3352 can be regarded as being arranged in series, the fifth sub-wick 3344 is arranged in parallel with part of the first sub-wick 3351, and the sixth sub-wick 3345 is arranged in parallel with part of the second sub-wick 3352. Since the covering area of the micro-grooves 333 is relatively large, the return flow capacity of the liquid absorbing wick 330 can be effectively improved.

[0159] In addition, in this embodiment, in addition to the second core 335 being provided with micropores 331, the local area of ​​the fourth sub-core 3343 close to the first sub-core 3351, the local area of ​​the fourth sub-core 3343 close to the second sub-core 3352, the local area of ​​the fifth sub-core 3344 located in the first notch 33511, and the local area of ​​the sixth sub-core 3345 located in the second notch 33521 can all be provided with micropores 331 to simplify the processing technology of the absorbent core 330 while improving the capillary force of the absorbent core 330 to a certain extent.

[0160] ​ for ​ Another structural diagram of the absorbent core 330 on the first side is shown in FIG. ​ As shown, in the embodiment of the present application, the entire area of ​​the fifth sub-core 3344 and the sixth sub-core 3345 of the first core 334 is provided with micropores 331 and microgrooves 333. The local area of ​​the fourth sub-core 3343 near the first sub-core 3351 and the local area of ​​the fourth sub-core 3343 near the second sub-core 3352 are also provided with micropores 331 and microgrooves 333. By increasing the area of ​​the micropores 331, the capillary force of the liquid-wicking core 330 can be effectively improved.

[0161] Of course, in some other embodiments, the fourth sub-core 3343 may also be provided with micropores 331 and microgrooves 333 in the entire area to further enhance the capillary force of the absorbent core 330 .

[0162] exist ​ In the illustrated embodiments, in the second core 335, the micropillars 332 may form a second layer structure 3354 of the second core 335, and the micropores 331 may extend through the first layer structure 3353 of the second core 335. Therefore, the height of the micropillars 332 is equal to the thickness of the second layer structure 3354 of the second core 335, and the depth of the micropores 331 is equal to the thickness of the first layer structure 3353 of the second core 335. The thickness of the first layer structure 3353 of the second core 335 may be less than or equal to the thickness of the second layer structure 3354 of the second core 335, that is, the thickness of the layer occupied by the micropores 331 is less than or equal to the thickness of the layer occupied by the micropillars 332. In the first core 334, the overall thickness of the first layer structure 3341 of the first core 334 is defined as d2', and the depth of the microgrooves 333 is defined as d1". Therefore, the depth of the micropores 331 of the first core 334 is at least d2'-d1". In specific implementation, d2'-d1"≤d1", that is, the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the microgrooves 333. By increasing the height of the micropillars 332 of the second core 335 and the depth of the microgrooves 333 of the first core 334, the capillary force of the absorbent core 330 can be effectively improved, thereby enhancing the liquid return capability of the absorbent core 330.

[0163] In addition, in the above embodiments, the pore diameter and the center-to-center distance of the micropores 331 of the wick 330 can also be designed differently according to the descriptions of the embodiments shown in ​ and ​ The column diameter and the center-to-center distance of the micro-pillars 332 can also be designed differently according to the descriptions of the embodiments shown in ​ and ​ The specific details are not described here.

[0164] ​ Another cross-sectional structure schematic view of the vapor chamber 300 shown in ​ Reference is made to the description of the embodiments shown in ​ In the embodiments of the present application, the wick 330 includes a thinned portion 336 formed by a partial recess 3361 of the first surface 330a of the wick 330, and the thickness of the thinned portion 336 is smaller than the thickness of the part of the wick 330 other than the thinned portion 336. Exemplarily, the thinned portion 336 can be located in the evaporation cavity 341.

[0165] In the evaporation cavity 341, the liquid-phase working medium between the wick 330 and the second cover plate 320 is evaporated into vapor-phase working medium, and at least part of the vapor-phase working medium flows through the micropores 331 in the thinned portion 336 into the air channel 312 between the wick 330 and the first cover plate 310. Since the thickness of the thinned portion 336 is relatively small, the length of the micropores 331 in the thinned portion 336 is also relatively short, so that the flow resistance of the vapor-phase working medium flowing to the air channel 312 is reduced, which helps to speed up the circulation efficiency of the working medium between the evaporation cavity 341 and the condensation cavity 342, and thus the heat dissipation efficiency of the vapor chamber 300 can be improved.

[0166] ​ Another cross-sectional structure schematic view of the vapor chamber 300 shown in ​ Reference is made to the description of the embodiments shown in ​ In the embodiments of the present application, the wick 330 includes a thickened portion 337 formed by a partial protrusion 3371 of the second surface 330b of the wick 330, and the distance between the thickened portion 337 and the second cover plate 320 is smaller than the distance between the part of the wick 330 other than the thickened portion 337 and the second cover plate 320. Exemplarily, the thickened portion 337 can be located in the evaporation cavity 341.

[0167] In the evaporation cavity 341, since the distance between the thickened portion 337 and the second cover plate 320 is relatively small, the capacity of the liquid-phase working medium in the evaporation cavity 341 is also reduced accordingly, so that in the case that the power of the heat source electronic device is small (the heat generated by the heat source electronic device is small), the liquid-phase working medium can also achieve a high evaporation rate, thereby achieving efficient heat dissipation of the heat source electronic device.

[0168] In addition, in the condensing chamber 342 and the insulating chamber 343, the distance between the liquid absorption core 330 and the second cover plate 320 is relatively large, so more liquid phase working fluid can be accommodated in the condensing chamber 342 and the insulating chamber 343, which helps the temperature equalizing plate 300 to support a higher critical heat flux density.

[0169] ​ for ​ Another cross-sectional structural diagram of the temperature distribution plate 300 at AA is shown in FIG. ​ As shown, in the embodiment of the present application, a depression 3361 is partially provided on the first surface 330a of the wicking core 330, and a protrusion 3371 is partially provided on the second surface 330b of the wicking core 330. Both the depression 3361 and the protrusion 3371 are located within the evaporation chamber 341, and are arranged opposite each other along the thickness direction of the wicking core 330. In a specific implementation, the depth of the depression 3361 can be greater than, equal to, or less than the height of the protrusion 3371. This design not only enables a higher evaporation rate of the liquid-phase working medium within the evaporation chamber 341, but also does not increase the flow resistance of the evaporated vapor-phase working medium to the air channel 312, thereby effectively improving the heat dissipation performance of the heat spreader 300.

[0170] exist ​ In the illustrated embodiment, the micro-pillars 332 and the micro-grooves 333 can be arranged on the same side or on different sides, which will not be further illustrated here.

[0171] ​ This is a schematic diagram of the cross-sectional structure of a temperature homogenizing plate 300 provided in an embodiment of the present application. ​ As shown, in the embodiment of the present application, the second cover plate 320 includes a first arched portion 322 arranged toward the interior of the cavity 340, so as to form a groove 323 on the surface of the second cover plate 320 on the side facing away from the cavity 340. For example, the groove 323 can be located in the heat source area of ​​the second cover plate 320. When the temperature vapor chamber 300 is assembled in an electronic device, the heat source electronic device of the electronic device can be at least partially accommodated in the groove 323. This can improve the fit and contact area between the heat source electronic device and the temperature vapor chamber 300, thereby improving the heat dissipation effect on the heat source electronic device. On the other hand, it can also reduce the overall thickness of the heat source electronic device and the temperature vapor chamber 300 after assembly, thereby helping to reduce the thickness of the electronic device.

[0172] The liquid absorption core 330 comprises a second arching portion 338 opposite to the first arching portion 322, the second arching portion 338 arches towards the first cover plate 310, so that an avoiding groove 339 can be formed on the second surface 330b of the liquid absorption core 330, the avoiding groove 339 can avoid the first arching portion 322 of the second cover plate 320, so as to avoid the interference between the liquid absorption core 330 and the second cover plate 320, and improve the structural practicability of the vapor chamber 300.

[0173] ​ A cross-sectional structure schematic diagram of a vapor chamber 300 provided by the embodiment of the present application is shown in the figure. ​ In the embodiment of the present application, the vapor chamber 300 can comprise a plurality of liquid absorption cores 330, and the plurality of liquid absorption cores 330 are sequentially and spacedly arranged. For example, the plurality of liquid absorption cores 330 can be arranged along the width direction of the vapor chamber 300. Each of the liquid absorption cores 330 can adopt the design in the foregoing embodiment, which will not be repeated here.

[0174] The first surface 330a of the liquid absorption core 330 is in contact with the first cover plate 310, and the micro column 332 of the second surface 330b of the liquid absorption core 330 is in contact with the second cover plate 320. In this way, a gas channel 312 can be formed between two adjacent liquid absorption cores 330, the gas channel 312 is connected to the evaporation cavity and the condensation cavity, and the vapor phase working medium vaporized in the evaporation cavity can flow to the condensation cavity through the gas channel 312, so as to provide a guiding effect for the vapor phase working medium by the gas channel 312. In this design, the overall thickness of the vapor chamber 300 is relatively small, so it is more suitable for application in thin and light electronic equipment.

[0175] The manufacturing method of the vapor chamber 300 shown in the figure will be described below. ​ The manufacturing method of the vapor chamber 300 comprises the following steps:

[0176] Step one, forming the first cover plate 310 and the second cover plate 320 by stamping or etching, and setting a liquid injection port on the first cover plate 310 or the second cover plate 320. The first cover plate 310 and the second cover plate 320 are made of flexible composite layer material, so that the manufactured vapor chamber 300 can be applied to foldable electronic equipment. For example, the first cover plate 310 and the second cover plate 320 each comprise a first copper layer, a polyimide layer and a second copper layer which are sequentially stacked, and the thicknesses of the first copper layer, the polyimide layer and the second copper layer are respectively 12um, so the thicknesses of the first cover plate 310 and the second cover plate 320 are respectively 0.036mm.

[0177] Step 2: Chemically etch the first surface 330a of the wick 330 to form a depression 3361. Also, a protrusion 3371 is formed on the second surface 330b of the wick 330 in the area corresponding to the depression 3361. The depth of the depression 3361 is approximately 0.02 mm, and the height of the protrusion 3371 is also approximately 0.02 mm. The wick 330 can be made of C1020 oxygen-free copper with a thickness of 0.05 mm.

[0178] Step 3: Form micropillars 332 and part of micropores 331 on the second surface 330b of the wick 330 by chemical etching. ​ As shown, the micropillars 332 disposed in the first region 330b1 have a diameter of approximately 100 μm, a center-to-center distance of approximately 250 μm, and a height of approximately 20 μm. The micropillars 332 disposed in the second region 330b2 have a diameter of approximately 200 μm, a center-to-center distance of approximately 500 μm, and a height of approximately 40 μm. Some micropores 331 are located within the second region 330b2, each having a diameter of approximately 80 μm and a center-to-center distance of approximately 100 μm.

[0179] Step 4: Combine ​ As shown, microgrooves 333 and additional micropores 331 are formed on the first core 334 of the wick 330 by laser etching. A plurality of microgrooves 333 are arranged on the second side 330b of the wick 330, that is, a plurality of microgrooves 333 and a plurality of micropillars 332 are arranged on the same side. The groove depth of the microgrooves 333 is roughly 40 μm, the groove width is roughly 30 μm, and the groove spacing is roughly 50 μm. The additional micropores 331 are located in the first area 330b1 of the second side 330b of the wick 330, and the pore diameter is roughly 20 μm and the hole center distance is roughly 40 μm.

[0180] Step 5: After cleaning the first cover plate 310 , the second cover plate 320 and the wick 330 , the ends of the micro-pillars 332 on the second surface 330 b of the wick 330 are fixedly connected to the second cover plate 320 by diffusion welding.

[0181] Step 6: Diffusely connect the edge area of ​​the first cover plate 310 and the edge area of ​​the second cover plate 320 to enclose and form a cavity 340 , so as to seal the absorbent core 330 in the cavity 340 .

[0182] Step 7: Extract the air in the cavity 340 through the liquid injection port. After the cavity 340 is evacuated to a vacuum state, inject the working medium into the cavity 340 through the liquid injection tube. Then, seal the liquid injection port and remove the liquid injection tube.

[0183] The heat spreader 300 manufactured using the manufacturing method provided in the embodiment of the present application has the following advantages:

[0184] Firstly, the micro-pillar 332 in the first area 330b1 has a relatively small diameter and a relatively small center-to-center distance, which can increase the meniscus area of the liquid-phase working medium, so that the wick 330 can provide more evaporation area in the part corresponding to the heat source area 321; the micro-pillar 332 in the second area 330b2 has a relatively large diameter and a relatively large center-to-center distance, which can provide sufficient support strength for the wick 330 and increase the permeability of the wick 330, thereby reducing the backflow resistance of the liquid-phase working medium.

[0185] Secondly, the micro-hole 331 in the first area 330b1 has a relatively small diameter and a relatively small center-to-center distance, which can enable the wick 330 to provide more evaporation sites and evaporation area in the part corresponding to the heat source area 321, thereby improving the evaporation efficiency of the wick 330 in this part; the micro-hole 331 in the second area 330b2 has a relatively large diameter and a relatively large center-to-center distance, which can reduce the difficulty of the manufacturing process under the premise of ensuring normal capillary backflow.

[0186] Thirdly, by sinking the local area of the wick 330, the evaporation rate of the liquid-phase working medium at the corresponding position in the cavity 340 can be improved, and in addition, the capacity of the liquid-phase working medium at the remaining positions in the cavity 340 can also be improved, which helps the heat spreader 300 to support a higher critical heat flux density.

[0187] Fourthly, the plurality of micro-grooves 333 are arranged on the first wick 334, and after the working medium is liquefied in the condensation cavity 342, the liquid-phase working medium can flow into the evaporation cavity 341 under the directional flow guiding effect of the plurality of micro-grooves 333, thereby accelerating the backflow rate of the liquid-phase working medium.

[0188] The following will take the heat spreader 300 shown in FIG. 1 as an example to describe the manufacturing method of the heat spreader 300 in which the micro-pillar 332 and the micro-groove 333 are arranged on the same side. ​ The manufacturing method of the heat spreader 300 includes the following steps:

[0189] Step one, the first cover plate 310 and the second cover plate 320 are formed by stamping, the side surface of the first cover plate 310 is formed with a plurality of bosses 311, the second cover plate 320 is formed with a first arching portion 322, and a liquid injection port is arranged on the first cover plate 310 or the second cover plate 320. The first cover plate 310 and the second cover plate 320 are made of rigid material, for example, a steel-copper composite material, and the thickness is 0.15 mm.

[0190] Step two, the wick 330 is formed with a second arching portion 338 by stamping. The wick 330 can be made of C1020 oxygen-free copper, and the thickness is 0.04 mm.

[0191] Step three, the first cover plate 310 and the second cover plate 320 are combined. ​As shown, the micro-column 332 is formed on the second surface 330b of the wick 330 by chemical etching, and the micro-hole 331 is formed in the area avoiding the micro-column 332, so that the micro-hole 331 is arranged around each micro-column 332. The diameter of the micro-column 332 is about 200 um, the center distance is about 500 um, and the height is about 20 um; the diameter of the micro-hole 331 is about 80 um, and the center distance is about 100 um.

[0192] Step four, the micro-slot 333 is formed on the second surface 330b of the wick 330 and the end surface of the micro-column 332 by laser etching. The depth of the micro-slot 333 is between 10 um and 15 um, the width is about 30 um, and the interval is about 50 um.

[0193] Step five, after the first cover plate 310, the second cover plate 320 and the wick 330 are cleaned, the end of the micro-column 332 of the second surface 330b of the wick 330 is fixedly connected with the second cover plate 320 by diffusion welding.

[0194] Step six, the edge area of the first cover plate 310 and the edge area of the second cover plate 320 are diffusion connected and enclosed to form the cavity 340, so as to enclose the wick 330 in the cavity 340.

[0195] Step seven, the air in the cavity 340 is extracted through the liquid injection port, and after the cavity 340 is extracted to a vacuum state, the working medium is injected into the cavity 340 through the liquid injection pipe, and then the liquid injection port is sealed and the liquid injection pipe is removed.

[0196] The uniform temperature plate 300 made by the manufacturing method provided in the embodiment has the following advantages:

[0197] Firstly, the uniform temperature plate 300 can accommodate the heat source electronic device 200 through the groove 323 of the second cover plate 320, so as to not only improve the adhesion and contact area of the heat source electronic device 200 and the uniform temperature plate 300, and strengthen the heat dissipation of the heat source electronic device 200, but also can reduce the overall thickness of the heat source electronic device 200 and the uniform temperature plate 300 after assembly, and further help to reduce the thickness of the electronic equipment.

[0198] Secondly, the small-size micro-slot 333 formed by laser etching can improve the capillary force of the wick 330 and enhance the directional flow guiding ability of the wick 330, so as to accelerate the reflux rate of the liquid working medium to the evaporation cavity 341.

[0199] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A vapor chamber (300), characterized by, The device comprises a first cover plate (310), a second cover plate (320) and a liquid absorption core (330), the first cover plate (310) is fixedly connected with the second cover plate (320) and encloses a cavity (340), the cavity (340) comprises an evaporation cavity (341) and a condensation cavity (342); The liquid absorption core (330) is arranged in the cavity (340), the liquid absorption core (330) comprises a first surface (330a) and a second surface (330b), the first surface (330a) is arranged towards the first cover plate (310), and the second surface (330b) is arranged towards the second cover plate (320); the liquid absorption core (330) is provided with micropores (331), microcolumns (332) and microgrooves (333), the micropores (331) pass through the first surface (330a) to the second surface (330b), the microcolumns (332) are arranged on the second surface (330b), and the microgrooves (333) are arranged on at least one of the first surface (330a) or the second surface (330b), and two ends of the microgrooves (333) are in communication with the evaporation cavity (341) and the condensation cavity (342) respectively; The pore diameter of the micropores (331), the column diameter of the microcolumns (332) and the groove width of the microgrooves (333) are all greater than or equal to 10 um and less than or equal to 500 um.

2. The vapor chamber (300) as claimed in claim 1, characterized in that, The second surface (330b) comprises a first region (330b1) and a second region (330b2), the first region (330b1) is located in the evaporation cavity (341), and the second region (330b2) is at least partially located in the condensation cavity (342); The pore diameter of the micropores (331) in the first region (330b1) is smaller than the pore diameter of the micropores (331) in the second region (330b2), and the arrangement density of the micropores (331) in the first region (330b1) is greater than the arrangement density of the micropores (331) in the second region (330b2).

3. The vapor chamber (300) of claim 2, wherein, The micropores (331) in the first region (330b1) are formed by a laser etching process, and the micropores (331) in the second region (330b2) are formed by a chemical etching process.

4. The vapor chamber (300) according to any one of claims 1 to 3, characterized in that The second surface (330b) comprises a first region (330b1) and a second region (330b2), the first region (330b1) is located in the evaporation cavity (341), and the second region (330b2) is at least partially located in the condensation cavity (342); The column diameter of the microcolumns (332) in the first region (330b1) is smaller than the column diameter of the microcolumns (332) in the second region (330b2), and the arrangement density of the microcolumns (332) in the first region (330b1) is greater than the arrangement density of the microcolumns (332) in the second region (330b2).

5. The vapor chamber (300) according to any one of claims 1 to 4, characterized in that The cavity (340) further comprises an adiabatic cavity (343) between the evaporation cavity (341) and the condensation cavity (342); the liquid-absorbing core (330) comprises a first core (334), at least part of the first core (334) is located in the adiabatic cavity (343); The micro-grooves (333) are arranged in the first core (334).

6. The vapor chamber (300) as claimed in claim 5, characterized in that The liquid-absorbing core (330) further comprises a second core (335), the second core (335) comprises a first sub-core (3351) and a second sub-core (3352), at least part of the first sub-core (3351) is located in the evaporation cavity (341), and at least part of the second sub-core (3352) is located in the condensation cavity (342); The micro-pillars (332) are arranged at least in the second core (335).

7. The vapor chamber (300) as claimed in claim 6, characterized in that The first sub-core (3351) and the second sub-core (3352) are spaced apart, and the first core (334) is located between the first sub-core (3351) and the second sub-core (3352).

8. The vapor chamber (300) as claimed in claim 6, characterized in that, The second core (335) further comprises a third sub-core (3355), at least part of the third sub-core (3355) is located in the adiabatic cavity (343); The third sub-core (3355) and the first core (334) are arranged side by side between the first sub-core (3351) and the second sub-core (3352).

9. The vapor chamber (300) as claimed in claim 6, characterized in that, The first sub-core (3351) comprises a first notch (33511) arranged towards the second sub-core (3352), and the second sub-core (3352) comprises a second notch (33521) arranged towards the first sub-core (3351); The first core (334) comprises a fourth sub-core (3343), a fifth sub-core (3344), and a sixth sub-core (3345), the fourth sub-core (3343) is located between the first sub-core (3351) and the second sub-core (3352), the fifth sub-core (3344) is connected to one side of the fourth sub-core (3343) towards the first sub-core (3351), and the fifth sub-core (3344) is located in the first notch (33511), and the sixth sub-core (3345) is connected to one side of the fourth sub-core (3343) towards the second sub-core (3352), and the sixth sub-core (3345) is located in the second notch (33521).

10. The vapor chamber (300) according to any one of claims 6-9, characterized in that All of the micro-holes (331) are arranged in the second core (335); or, Part of the micro-holes (331) are arranged in the second core (335), and the other part of the micro-holes (331) are arranged in the first core (334).

11. The vapor chamber (300) according to any one of claims 6-10, characterized in that The first core (334) and the second core (335) respectively comprise a first layer structure and a second layer structure, and the second layer structure is arranged on one side of the first layer structure towards the second cover plate (320); The micro-column (332) forms the second layer structure (3342) of the first core (334) and the second layer structure (3354) of the second core (335).

12. The vapor chamber (300) as claimed in claim 11, characterized in that, The micro-groove (333) is arranged on one side of the first layer structure of the first core (334) facing the first cover plate (310).

13. The vapor chamber (300) as claimed in claim 11, characterized in that, One side of the first layer structure (3341) of the first core (334) facing the second cover plate (320) and one side of the first layer structure (3353) of the second core (335) facing the second cover plate (320) form the second surface (330b). Part of the micro-groove (333) is arranged on one side of the first layer structure (3341) of the first core (334) facing the second cover plate (320), and the other part of the micro-groove (333) is arranged on the end surface of the micro-column (332) of the first core (334).

14. The vapor chamber (300) according to any one of claims 6-10, characterized in that, The first core (334) and the second core (335) respectively include a first layer structure and a second layer structure, and the second layer structure is arranged on one side of the first layer structure facing the second cover plate (320). The micro-column (332) forms the second layer structure (3354) of the second core (335). The micro-groove (333) is arranged on one side of the second layer structure (3342) of the first core (334) facing the second cover plate (320).

15. The vapor chamber (300) according to any one of claims 1-14, characterized in that, The liquid-absorbing core (330) includes a thinning portion (336) formed by partial recessing of the first surface (330a), and the thickness of the thinning portion (336) is smaller than the thickness of the part of the liquid-absorbing core (330) except the thinning portion (336).

16. The vapor chamber (300) according to any one of claims 1-15, wherein, The liquid-absorbing core (330) includes a thickening portion (337) formed by partial protruding of the second surface (330b), and the distance between the thickening portion (337) and the second cover plate (320) is smaller than the distance between the part of the liquid-absorbing core (330) except the thickening portion (337) and the second cover plate (320).

17. The vapor chamber (300) according to any one of claims 1-16, wherein, The second cover plate (320) includes a first arching portion (322) arching towards the inside of the cavity (340), and a groove (323) is formed on the side surface of the second cover plate (320) corresponding to the position of the first arching portion (322). The liquid-absorbing core (330) includes a second arching portion (338) arching towards the first cover plate (310), and the second arching portion (338) is arranged opposite to the first arching portion (322).

18. The vapor chamber (300) according to any one of claims 1-17, wherein, The side surface of the first cover plate (310) facing the cavity (340) has a plurality of bosses (311) arranged at intervals, and the air channels (312) are formed between adjacent bosses (311), and the air channels (312) respectively communicate with the evaporation cavity (341) and the condensation cavity (342).

19. The vapor chamber (300) according to any one of claims 1-17, wherein, The liquid absorbing core (330) is multiple, and the multiple liquid absorbing cores (330) are sequentially and spacedly arranged, air channels (312) are formed between adjacent liquid absorbing cores (330), and the air channels (312) respectively communicate with the evaporation cavity (341) and the condensation cavity (342).

20. A vapor chamber (300), characterized by The liquid absorbing core (330) is multiple, and the multiple liquid absorbing cores (330) are sequentially and spacedly arranged, air channels (312) are formed between adjacent liquid absorbing cores (330), and the air channels (312) respectively communicate with the evaporation cavity (341) and the condensation cavity (342). The liquid absorbing core (330) is provided with micro grooves (333), the micro grooves (333) are arranged at least on one of the first face (330a) and the second face (330b), and two ends of the micro grooves (333) respectively communicate with the evaporation cavity (341) and the condensation cavity (342); The micro grooves (333) have a groove width greater than or equal to 10 um and less than or equal to 500 um.

21. The vapor chamber (300) as claimed in claim 20, characterized in that, The micro grooves (333) have a groove width greater than or equal to 10 um and less than or equal to 500 um.

22. The vapor chamber (300) according to claim 20 or 21, characterized in that ​ 23. The vapor chamber (300) according to any one of claims 20-22, characterized in that, ​ ​ 24. A vapor chamber (300), characterized by The liquid absorption core (330) is arranged in the cavity (340), the liquid absorption core (330) comprises a first surface (330a) and a second surface (330b), the first surface (330a) is arranged towards the first cover plate (310), and the second surface (330b) is arranged towards the second cover plate (320); the liquid absorption core (330) is provided with micropores (331) and micropillars (332), the micropores (331) pass through the first surface (330a) to the second surface (330b), and the micropillars (332) are arranged on the second surface (330b); the pore diameter of the micropores (331) and the column diameter of the micropillars (332) are greater than or equal to 10 um and less than or equal to 500 um. The second surface (330b) comprises a first area (330b1) and a second area (330b2), the first area (330b1) is located in the evaporation cavity (341), and the second area (330b2) is at least partially located in the condensation cavity (342); the micropores (331) in the first area (330b1) and the micropores (331) in the second area (330b2) are formed by different processes. The pore diameter of the micropores (331) in the first area (330b1) is smaller than the pore diameter of the micropores (331) in the second area (330b2), and the arrangement density of the micropores (331) in the first area (330b1) is greater than the arrangement density of the micropores (331) in the second area (330b2).

25. The vapor chamber (300) as claimed in claim 24, characterized in that, The micropores (331) in the first area (330b1) are formed by a laser etching process, and the micropores (331) in the second area (330b2) are formed by a chemical etching process.

26. The uniform heat spreader (300) of claim 24 or 25, characterized in that The column diameter of the micropillars (332) in the first area (330b1) is smaller than the column diameter of the micropillars (332) in the second area (330b2), and the arrangement density of the micropillars (332) in the first area (330b1) is greater than the arrangement density of the micropillars (332) in the second area (330b2).

27. The vapor chamber (300) according to any one of claims 24-26, wherein, The liquid absorption core (330) is provided with a micro groove (333), the micro groove (333) is arranged on one of the first surface (330a) and the second surface (330b), and two ends of the micro groove (333) are in communication with the evaporation cavity (341) and the condensation cavity (342) respectively; 28. The vapor chamber (300) according to any one of claims 24-27, wherein, The groove width of the micro groove (333) is greater than or equal to 10 um and less than or equal to 500 um. ​ 29. An electronic device (1000), characterized by: A heat source electronic device (200) and a vapor chamber (300) as claimed in any one of claims 1-28, the heat source electronic device (200) being in thermally conductive contact with a side surface of the second cover plate (320) of the vapor chamber (300) facing away from the cavity (340).

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