An inverter flat-lay installation structure

Abstract

This invention discloses a flat-mount inverter structure, relating to the technical field of inverter mounting structures. It includes a substrate with positioning grooves fixed around its perimeter. In this flat-mount inverter structure, the DBC (Diverterless Circuit Board) is soldered onto the substrate. The positioning grooves around the substrate are used for DBC soldering positioning, and the mechanical limiting of the positioning grooves ensures the soldering position accuracy of the DBC. The MOSFET (Metal-Organic Module) is bonded to the DBC with thermally conductive adhesive, and the back pins of the MOSFET are soldered to the power board, thereby improving the alignment rate between the back pins of the MOSFET and the pads on the power board. The PCB is fixed to the power board by support pillars. This flat-mount inverter structure adopts a flat design, eliminating vertical stacking and achieving a height of only 36mm. The PCB's elevated layout with support pillars frees up wiring space, effectively improving power density. This solution comprehensively improves the reliability, power density, and production yield of the inverter module, and is particularly suitable for space-constrained high-frequency applications such as electric vehicles.

Description

Technical Field

[0001] This invention relates to the field of inverter mounting structure technology, specifically an inverter flat mounting structure. Background Technology

[0002] Vertical stacking is a classic layout for inverter modules. Its core feature is that multiple layers of components are stacked along the Z-axis. A typical structure includes a bottom metal substrate, a middle DBC ceramic substrate bonded to the metal substrate by solder or thermal adhesive, a top MOSFET / IGBT power device arranged in parallel or bridge circuits and connected to the copper layer on the DBC surface by wire bonding or solder, an encapsulation layer using silicone gel or epoxy resin to protect the internal circuitry, and a top plastic shell covering the module.

[0003] However, the vertical stacking layout results in a long heat conduction path, high thermal resistance at the interface between the MOSFET and the DBC substrate, uneven heat dissipation in the multi-layer structure, which can easily lead to local overheating. Moreover, the vertical stacking design requires reserved space for lead bending (typical height ≥ 50mm), and the layered arrangement of the power board and PCB leads to complex wiring and generally low power density. Summary of the Invention

[0004] The purpose of this invention is to provide a flat-mounted inverter structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an inverter flat-mount structure, including a substrate, a positioning groove fixed around the perimeter of the substrate, and a flange fixed on the inner wall of the positioning groove, a DBC welded and positioned inside the positioning groove, and a MOS bonded to the DBC by thermally conductive adhesive, a power board disposed on the MOS, and the power board bolted to the connecting posts around the perimeter of the substrate, a support post fixed to the end of the power board, and a PCB screwed onto the support post.

[0006] Furthermore, the MOS has leads extending from its back side, and the MOS is soldered to the power board via these leads.

[0007] Furthermore, the MOS has symmetrical notches on both sides, and the MOS is arranged side by side at the bottom of the heat sink bracket.

[0008] Furthermore, the heat dissipation bracket has end plates integrally fixed at both ends, and the edge of the end plate has a connecting slot, and the height of the connecting slot is higher than the top of the opening of the positioning slot.

[0009] Furthermore, the bottom end of the end plate is integrally connected with a mounting buckle, and the end plate is fixed to the flange of the positioning groove by the mounting buckle.

[0010] Furthermore, the two end plates are fixedly connected to a crossbeam on opposite sides, and a heat-conducting plate extends integrally from the back of the crossbeam. The heat-conducting plate has a relief groove on its inclined surface that corresponds to the pin on the back of the MOS, and the heat-conducting plate is attached to the power board and the bottom of the PCB to achieve heat conduction.

[0011] Furthermore, heat dissipation fins are arranged at equal intervals along the length of the top of the crossbeam, and the cavities between adjacent heat dissipation fins form convection channels.

[0012] Furthermore, the bottom of the crossbeam is provided with a pair of curved beams, and a locking block is fixed inside the curved beam. The curved beams lock the locking block into the notches on both sides of the MOS by the elastic deformation of their own material.

[0013] Furthermore, the front of the crossbeam is provided with a body, and the back of both ends of the body is fixedly connected with connecting buckles. Both the front and rear ends of the body are provided with openings, and the body is fastened and fixed to the connecting slots on the edge of the end plate by the connecting buckles at both ends.

[0014] Furthermore, the machine body has a built-in micro motor, and the power supply connector connected to the micro motor controller is electrically connected to the corresponding module of the power board, and an impeller is fixedly connected to the rotating end of the micro motor.

[0015] This invention provides a flat-mounted inverter structure, which has the following advantages;

[0016] 1. In this application, the DBC is soldered onto the substrate. The positioning grooves around the substrate are used for DBC soldering positioning. The mechanical limit of the positioning grooves ensures the soldering position accuracy of the DBC. The MOS is bonded to the DBC with thermally conductive adhesive, and the back pins of the MOS are soldered to the power board, thereby improving the alignment rate between the back pins of the MOS and the pads of the power board. The PCB is fixed on the power board by support columns. The inverter flat installation structure of this application adopts a flat design. After eliminating vertical stacking, the height is only 36mm. The PCB is laid out in a suspended manner by support columns to release wiring space, and the power density is effectively improved. This solution comprehensively improves the reliability, power density and production yield of the inverter module, and is especially suitable for high-frequency application scenarios with limited space, such as electric vehicles.

[0017] 2. When in use, this application uses a heat sink bracket in conjunction with the impeller for forced convection. At the same time, the heat dissipation surface is extended to the power board and PCB by the heat dissipation plate on the back of the heat sink bracket, forming a composite heat dissipation system of conduction and convection. This system combines the principle of multi-path heat dissipation design, which effectively solves the problem of high thermal resistance at the interface between MOS and DBC without affecting the overall height of the flat structure.

[0018] 3. In use, the MOS in this application is installed in the curved beams arranged in pairs at the bottom of the crossbeam, the heat sink bracket is installed in the positioning groove, and the heat sink body is installed on the front of the crossbeam. All of these are connected by snap-fit, which eliminates the need for screw fastening and greatly improves installation efficiency. At the same time, by limiting the installation position of the MOS and cooperating with the positioning groove to position the DBC for welding, the alignment accuracy between the MOS and the DBC is improved, as well as the alignment pass rate between the pins on the back of the MOS and the power board pads is also improved. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the device of the present invention;

[0020] Figure 2 This is a schematic diagram of the exploded structure of the device of the present invention;

[0021] Figure 3 This is a schematic diagram of part of the structure of the device of the present invention;

[0022] Figure 4 This is a schematic diagram of the overall structure of the heat dissipation bracket of the present invention;

[0023] Figure 5 This is a schematic diagram of the split structure of the heat dissipation bracket of the present invention;

[0024] Figure 6 This is a schematic diagram of the split structure of the heat dissipation bracket of the present invention.

[0025] In the diagram: 1. Substrate; 2. Positioning groove; 3. Flange; 4. DBC; 5. MOS; 6. Pin; 7. Notch; 8. Power board; 9. Support column; 10. PCB; 11. Heat sink bracket; 12. End plate; 13. Connecting slot; 14. Mounting clip; 15. Crossbeam; 16. Heat-conducting plate; 17. Clearance groove; 18. Heat sink fins; 19. Curved beam; 20. Locking block; 21. Body; 22. Connecting clip; 23. Micro motor; 24. Power connector; 25. Impeller. Detailed Implementation

[0026] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0027] Please see Figures 1 to 2The present invention provides a technical solution: an inverter flat installation structure, including a substrate 1, a positioning groove 2 fixed around the substrate 1, and a flange 3 fixed on the inner wall of the positioning groove 2. A DBC4 is welded and positioned inside the positioning groove 2, and a MOS5 is bonded to the DBC4 with thermally conductive adhesive. A power board 8 is disposed on the MOS5, and the power board 8 is bolted to the connecting posts around the substrate 1. A support post 9 is fixed to the end of the power board 8, and a PCB 10 is screwed onto the support post 9. A pin 6 extends from the back of the MOS5, and the MOS5 is welded and fixed to the power board 8 through the pin 6. Recesses 7 are symmetrically opened on both sides of the MOS5, and the MOS5 is arranged side by side at the bottom of the heat dissipation bracket 11.

[0028] The specific operation is as follows: DBC4 is soldered onto substrate 1. The positioning grooves 2 around substrate 1 are used for DBC4 soldering positioning. The mechanical limit of the positioning grooves 2 ensures the soldering position accuracy of DBC4. MOS5 is bonded to DBC4 with thermally conductive adhesive, and the back pins 6 of MOS5 are soldered onto power board 8, thereby improving the alignment qualification rate between the back pins 6 of MOS5 and the pads of power board 8. PCB10 is fixed onto power board 8 by support columns 9. The inverter flat installation structure of this application adopts a flat design. After eliminating vertical stacking, the height is only 36mm. The PCB10 is suspended by support columns 9 to release wiring space, and the power density is effectively improved. This solution comprehensively improves the reliability, power density and production yield of inverter modules, and is especially suitable for high-frequency application scenarios with limited space, such as electric vehicles.

[0029] Please see Figures 3 to 6 The heat dissipation bracket 11 has end plates 12 integrally fixed at both ends, and the edge of the end plate 12 has a connecting slot 13, the height of which is higher than the top of the opening of the positioning groove 2. The bottom end of the end plate 12 is integrally connected with a mounting buckle 14, and the end plate 12 is fixed to the flange 3 of the inner wall of the positioning groove 2 by the mounting buckle 14. The opposite sides of the two end plates 12 are fixedly connected with crossbeams 15, and the back of the crossbeams 15 has an integrally extended heat-conducting plate 16. The inclined surface of the heat-conducting plate 16 has a corresponding M The OS5 has a relief groove 17 corresponding to the pin 6 on the back, and the heat conduction plate 16 is attached to the power board 8 and the PCB 10 below to achieve heat conduction. The top of the crossbeam 15 has heat dissipation fins 18 arranged at equal intervals along the length direction, and the cavity between adjacent heat dissipation fins 18 forms a convection channel. The bottom of the crossbeam 15 has a pair of curved beams 19, and the inner side of the curved beam 19 is fixed with a locking block 20. The curved beam 19 uses the elastic deformation of its own material to fasten the locking block 20 into the notches 7 on both sides of the MOS5 to achieve self-locking.

[0030] The specific operation is as follows: The heat dissipation bracket 11 of this application has an overall fishbone-shaped structure. The end plates 12 on both sides of the heat dissipation bracket 11 are fixed to the flanges 3 on the inner wall of the positioning groove 2 by mounting buckles 14. The front body 21 of the crossbeam 15 is fixed to the connecting grooves 13 on the edge of the end plate 12 by connecting buckles 22 at both ends. The bottom of the crossbeam 15 is provided with a pair of curved beams 19. When installing the MOS5, it is only necessary to push it in from the side. The curved beams 19 use the elastic deformation of their own material to fasten the clips 20 into the recesses 7 on both sides of the MOS5 to achieve self-locking. Thermal conductive adhesive is coated on the surface of the MOS5 to fix the device and increase heat dissipation. The hot area, while the cavity forms a convection channel to enhance the natural convection heat dissipation of the air. In this application, the MOS5 is installed in the curved beam 19 arranged in pairs at the bottom of the crossbeam 15, the heat sink bracket 11 is installed in the positioning groove 2, and the heat sink body 21 is installed on the front of the crossbeam 15. All of these are connected by snap-fit, which greatly improves the installation efficiency without the need for screw fastening. At the same time, by limiting the installation position of the MOS5 and cooperating with the positioning groove 2 to weld and position the DBC4, the alignment accuracy of the MOS5 and DBC4 is improved, and the alignment qualification rate of the pin 6 on the back of the MOS5 and the pad of the power board 8 is also improved.

[0031] Please see Figures 3 to 6 The front of the crossbeam 15 is provided with a body 21, and the back of both ends of the body 21 are fixedly connected with connecting buckles 22. Both the front and rear ends of the body 21 are provided with openings, and the body 21 is fastened and fixed to the connecting slots 13 on the edge of the end plate 12 by the connecting buckles 22 at both ends. The body 21 has a built-in micro motor 23, and the power supply connector 24 connected to the controller of the micro motor 23 is electrically connected to the corresponding module of the power board 8. The rotating end of the micro motor 23 is fixedly connected with an impeller 25.

[0032] The specific operation is as follows: The heat dissipation bracket 11 of this application consists of two end plates 12 and a middle crossbeam 15. The top of the crossbeam 15 is arranged with heat dissipation fins 18 at equal intervals along the length direction. The cavity between adjacent heat dissipation fins 18 forms a convection channel. The heat-conducting plate 16 extending from the back of the crossbeam 15 extends the heat dissipation surface to the power board 8 and PCB 10. An impeller 25 driven by a micro motor 23 is installed in the front body 21 of the crossbeam 15. This application uses the heat dissipation bracket 11 in conjunction with the forced convection of the impeller 25. At the same time, the heat-conducting plate 16 on the back of the heat dissipation bracket 11 extends the heat dissipation surface to the power board 8 and PCB 10, forming a composite heat dissipation system of conduction and convection. It complies with the multi-path heat dissipation design principle. While effectively solving the problem of high interface thermal resistance between MOS5 and DBC4, it does not affect the overall height of the flat structure.

[0033] In summary, when using this inverter in a flat installation structure:

[0034] First, the DBC4 is soldered onto the substrate 1. The positioning grooves 2 around the substrate 1 are used for the positioning of the DBC4 during soldering. The mechanical limit of the positioning grooves 2 ensures the soldering position accuracy of the DBC4. The MOS5 is bonded to the DBC4 with thermally conductive adhesive, and the back pins 6 of the MOS5 are soldered onto the power board 8, thereby improving the alignment rate between the back pins 6 of the MOS5 and the pads of the power board 8. The PCB10 is fixed onto the power board 8 by the support pillars 9. The inverter flat installation structure of this application adopts a flat design. After eliminating the vertical stacking, the height is only 36mm. The PCB10 is suspended by the support pillars 9 to release wiring space, and the power density is effectively improved. This solution comprehensively improves the reliability, power density and production yield of the inverter module, and is especially suitable for high-frequency application scenarios with limited space, such as electric vehicles.

[0035] Secondly, the heat dissipation bracket 11 of this application has a fishbone-shaped structure. The end plates 12 on both sides of the heat dissipation bracket 11 are fixed to the flanges 3 on the inner wall of the positioning groove 2 by mounting buckles 14. The front body 21 of the crossbeam 15 is fixed to the connecting grooves 13 on the edge of the end plate 12 by connecting buckles 22 at both ends. The bottom of the crossbeam 15 is provided with a pair of curved beams 19. When installing the MOS5, it is only necessary to push it in from the side. The curved beams 19 use the elastic deformation of their own material to fasten the clips 20 into the recesses 7 on both sides of the MOS5 to achieve self-locking. The surface of the MOS5 is coated with thermally conductive adhesive, which not only fixes the device but also increases the heat dissipation surface. The cavity forms a convection channel, which enhances the natural convection heat dissipation. In this application, the MOS5 is installed in the curved beam 19 arranged in pairs at the bottom of the crossbeam 15, the heat sink bracket 11 is installed in the positioning groove 2, and the heat sink body 21 is installed on the front of the crossbeam 15. All of these are connected by snap-fit, which greatly improves the installation efficiency without the need for screw fastening. At the same time, by limiting the installation position of the MOS5 and cooperating with the positioning groove 2 to weld and position the DBC4, the alignment accuracy of the MOS5 and DBC4 is improved, and the alignment qualification rate of the pin 6 on the back of the MOS5 and the pad of the power board 8 is also improved.

[0036] Finally, the heat dissipation bracket 11 of this application consists of two end plates 12 and a central crossbeam 15. The top of the crossbeam 15 has heat dissipation fins 18 arranged at equal intervals along its length. The cavity between adjacent heat dissipation fins 18 forms a convection channel. The heat-conducting plate 16 extending from the back of the crossbeam 15 extends the heat dissipation surface to the power board 8 and PCB 10. An impeller 25 driven by a micro motor 23 is installed inside the front body 21 of the crossbeam 15. This application uses the heat dissipation bracket 11 in conjunction with the forced convection of the impeller 25. At the same time, the heat-conducting plate 16 on the back of the heat dissipation bracket 11 extends the heat dissipation surface to the power board 8 and PCB 10, forming a composite heat dissipation system of conduction and convection. This system combines the principle of multi-path heat dissipation design and effectively solves the problem of high thermal resistance at the interface between MOS5 and DBC4 without affecting the overall height of the flat structure.

[0037] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, and the existence of an infinite number of specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A flat-mount structure for an inverter, comprising a substrate (1), characterized in that, The substrate (1) is fixed with positioning grooves (2) around its perimeter, and a flange (3) is fixed to the inner wall of the positioning grooves (2). A DBC (4) is welded and positioned inside the positioning grooves (2), and a MOS (5) is bonded to the DBC (4) with thermally conductive adhesive. A power board (8) is set on the MOS (5), and the power board (8) is bolted to the connecting posts around the substrate (1). A support post (9) is fixed to the end of the power board (8), and a PCB (10) is screwed onto the support post (9). A pin (6) extends from the back of the MOS (5), and the MOS (5) is welded and fixed to the power board (8) through the pin (6). The MOS (5) has symmetrical openings on both sides. A notch (7) is provided, and MOS (5) is arranged side by side at the bottom of the heat sink bracket (11). The heat sink bracket (11) is integrally fixed with end plates (12) at both ends, and the edge of the end plate (12) is provided with a connecting slot (13). The height of the connecting slot (13) is higher than the top of the opening of the positioning slot (2). A crossbeam (15) is fixedly connected to the opposite side of the end plates (12) on both sides, and a heat-conducting plate (16) is integrally extended on the back of the crossbeam (15). The inclined surface of the heat-conducting plate (16) is provided with a relief groove (17) corresponding to the back pin (6) of the corresponding MOS (5). The heat-conducting plate (16) is attached to the power board (8) and the PCB (10) to achieve heat conduction.

2. The inverter flat-lay installation structure according to claim 1, characterized in that, The end plate (12) is integrally connected to the bottom end with a mounting buckle (14), and the end plate (12) is fixed to the flange (3) of the inner wall of the positioning groove (2) by the mounting buckle (14).

3. The inverter flat-lay installation structure according to claim 2, characterized in that, The top of the crossbeam (15) is provided with heat dissipation fins (18) arranged at equal intervals along the length direction, and the cavity between adjacent heat dissipation fins (18) forms a convection channel.

4. The inverter flat-lay installation structure according to claim 3, characterized in that, The bottom of the crossbeam (15) is provided with a pair of curved beams (19), and a locking block (20) is fixed inside the curved beam (19). The curved beam (19) locks the locking block (20) into the notches (7) on both sides of the MOS (5) by the elastic deformation of its own material.

5. The inverter flat-lay installation structure according to claim 4, characterized in that, The front of the crossbeam (15) is provided with an organism (21), and the back of both ends of the organism (21) is fixedly connected with connecting buckles (22). Both the front and rear ends of the organism (21) are provided with openings, and the organism (21) is fastened and fixed to the edge of the end plate (12) by the connecting buckles (22) at both ends and the connecting slots (13).

6. The inverter flat-lay installation structure according to claim 5, characterized in that, The body (21) has a built-in micro motor (23), and the power supply connector (24) connected to the micro motor (23) controller is electrically connected to the corresponding module of the power board (8), and the rotating end of the micro motor (23) is fixedly connected to an impeller (25).

Images