Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, and the display panel comprises an array substrate, an isolation structure, a light-emitting unit and a first packaging layer. The isolation structure encloses an isolation opening, at least part of the light-emitting unit is located in the isolation opening, and the light-emitting unit comprises a first light-emitting unit and a second light-emitting unit; the first packaging layer is located on the side, away from the array substrate, of the light emitting unit, the first packaging layer comprises a plurality of packaging units arranged at intervals, and the packaging units extend to the side, away from the array substrate, of the isolation structure from the side face of the isolation structure; the taper angle of the packaging unit corresponding to the first light-emitting unit is not equal to the taper angle of the packaging unit corresponding to the second light-emitting unit. According to the display panel, the second electrodes of the first light-emitting units and the second light-emitting units can be in effective lap joint with the corresponding isolation structures, and therefore the display effect of the display panel can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and an electronic device. BACKGROUND

[0002] Organic light emitting diode (OLED) and flat display devices based on light emitting diode (LED) technology have been widely applied to mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream in display panels.

[0003] However, there are still some problems in the display panel that need to be solved. SUMMARY

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, which comprises:

[0005] an array substrate;

[0006] an isolation structure located on one side of the array substrate, the isolation structure being enclosed to form an isolation opening;

[0007] a light emitting unit located at least partially in the isolation opening, the light emitting unit comprising a first light emitting unit and a second light emitting unit;

[0008] a first encapsulation layer located on a side of the light emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from a side surface of the isolation structure to a side of the isolation structure away from the array substrate, the side surface being a surface of the isolation structure facing the isolation opening; a taper angle being formed between a side of the encapsulation unit located on the side of the isolation structure away from the array substrate and a side of the encapsulation unit facing away from the isolation opening, the taper angle of the encapsulation unit corresponding to the first light emitting unit being different from the taper angle of the encapsulation unit corresponding to the second light emitting unit.

[0009] In some possible implementation manners, the taper angle of the encapsulation unit corresponding to the first light emitting unit ranges from 30° to 60°.

[0010] Preferably, the light emitting colors of the first light emitting unit and the second light emitting unit are different.

[0011] In some possible implementation manners, the taper angle of the encapsulation unit corresponding to the second light emitting unit ranges from 30° to 80°.

[0012] In some possible implementations, the display panel further includes a third light emitting unit, and the taper angle of the encapsulation unit corresponding to the third light emitting unit is different from the taper angle of the encapsulation units corresponding to the first light emitting unit and the second light emitting unit.

[0013] Preferably, the taper angle of the encapsulation unit corresponding to the third light emitting unit ranges from 80° to 90°.

[0014] Preferably, the light emitting colors of the first light emitting unit, the second light emitting unit and the third light emitting unit are all different.

[0015] In some possible implementations, adjacent encapsulation units are arranged apart from each other on a side of the isolation structure away from the array substrate.

[0016] Preferably, a gap is present between the portion of the encapsulation unit on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate.

[0017] Preferably, the material of the first encapsulation layer comprises an inorganic material.

[0018] In some possible implementations, the light emitting unit comprises, in sequence from a direction away from the array substrate, a first electrode layer, a light emitting functional layer and a second electrode layer.

[0019] In some possible implementations, the display panel further includes a pixel definition layer on a side of the first electrode layer away from the array substrate, and the isolation structure is on a side of the pixel definition layer away from the array substrate; the pixel definition layer comprises a pixel opening exposing at least part of the first electrode, and a normal projection of the isolation structure on the array substrate is between normal projections of two adjacent pixel openings on the array substrate.

[0020] Preferably, the normal projection of the pixel opening on the array substrate is within the normal projection of the isolation opening on the array substrate.

[0021] In some possible implementations, the isolation structure comprises, in sequence from a direction away from the array substrate, a first isolation portion and a second isolation portion, and a normal projection of the first isolation portion on the array substrate is within a normal projection of the second isolation portion on the array substrate.

[0022] In some possible embodiments, the second electrode of the light emitting unit is electrically connected with the first isolation portion; and / or the isolation structure further comprises a third isolation portion located on the side of the first isolation portion facing the array substrate, and the second electrode of the light emitting unit is electrically connected with the third isolation portion.

[0023] Preferably, the material of the third isolation portion comprises metal; and / or the material of the first isolation portion comprises metal; and / or the material of the second isolation portion comprises metal.

[0024] Preferably, the material of the third isolation portion comprises molybdenum metal; and / or the material of the first isolation portion comprises aluminum metal; and / or the material of the second isolation portion comprises titanium metal.

[0025] In some possible embodiments, the present application further provides another display panel, which comprises:

[0026] an array substrate;

[0027] an isolation structure located on the side of the array substrate, the isolation structure enclosing a separation opening;

[0028] a light emitting unit located at least partially in the separation opening;

[0029] a first encapsulation layer located on the side of the light emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from the side surface of the isolation structure to the side of the isolation structure away from the array substrate, the side surface of the isolation structure being the surface of the isolation structure facing the separation opening, and the side of the encapsulation unit located on the side of the isolation structure away from the array substrate between the side close to the isolation structure and the side facing away from the separation opening forming a tapering angle, the tapering angle being less than 90°.

[0030] In some possible embodiments, the light emitting unit comprises a first light emitting unit and a second light emitting unit, and the tapering angle of the encapsulation unit corresponding to the first light emitting unit ranges from 30° to 60°.

[0031] Preferably, the tapering angle of the encapsulation unit corresponding to the second light emitting unit ranges from 30° to 80°.

[0032] Preferably, the light emitting colors of the first light emitting unit and the second light emitting unit are different.

[0033] In some possible embodiments, the display panel further comprises a third light emitting unit, and the tapering angle of the encapsulation unit corresponding to the third light emitting unit is not equal to the tapering angle of the encapsulation unit corresponding to the first light emitting unit or the second light emitting unit.

[0034] Preferably, the conical angle of the packaging unit corresponding to the third light emitting unit ranges from 80° to 90°.

[0035] Preferably, the light emitting colors of the first light emitting unit, the second light emitting unit and the third light emitting unit are all different.

[0036] In some possible implementation manners, the adjacent packaging units are arranged apart from each other on the side of the isolation structure away from the array substrate.

[0037] Preferably, a gap is formed between the part of the packaging unit on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate.

[0038] Preferably, the material of the first packaging layer comprises an inorganic material.

[0039] In some possible implementation manners, the light emitting unit comprises a first electrode layer, a light emitting functional layer and a second electrode layer arranged in sequence in the direction away from the array substrate.

[0040] In some possible implementation manners, the display panel further comprises a pixel defining layer on the side of the first electrode layer away from the array substrate, and the isolation structure is on the side of the pixel defining layer away from the array substrate; the pixel defining layer comprises a pixel opening exposing at least part of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate.

[0041] Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0042] In some possible implementation manners, the isolation structure comprises a first isolation part and a second isolation part arranged in sequence in the direction away from the array substrate, and the orthographic projection of the first isolation part on the array substrate is located within the orthographic projection of the second isolation part on the array substrate.

[0043] In some possible implementation manners, the second electrode of the light emitting unit is electrically connected with the first isolation part; and / or the isolation structure further comprises a third isolation part on the side of the first isolation part facing the array substrate, and the second electrode of the light emitting unit is electrically connected with the third isolation part.

[0044] Preferably, the material of the third isolation part comprises metal; and / or the material of the first isolation part comprises metal; and / or the material of the second isolation part comprises metal.

[0045] Preferably, the third isolation portion is made of molybdenum metal; and / or the first isolation portion is made of aluminum metal; and / or the second isolation portion is made of titanium metal.

[0046] In some possible embodiments, the present application further provides a method for manufacturing a display panel, the method comprising:

[0047] providing an array substrate;

[0048] forming an isolation structure on one side of the array substrate, the isolation structure enclosing an isolation opening;

[0049] forming at least part of a light emitting unit in the isolation opening, and forming a first encapsulation layer on a side of the light emitting unit away from the array substrate, the light emitting unit comprising a first light emitting unit and a second light emitting unit, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from a side of the isolation structure to a side of the isolation structure away from the array substrate, the side of the isolation structure being a side of the isolation structure facing the isolation opening; a tapering angle being formed between a side of the portion of the isolation structure away from the array substrate close to the side of the isolation structure and a side of the portion of the isolation structure away from the array substrate facing away from the isolation opening, the tapering angle of the encapsulation unit corresponding to the first light emitting unit being different from the tapering angle of the encapsulation unit corresponding to the second light emitting unit.

[0050] In some possible embodiments, the step of forming the isolation structure on one side of the array substrate comprises:

[0051] forming a first electrode layer on one side of the array substrate, the first electrode layer comprising a plurality of first electrodes arranged at intervals;

[0052] forming a pixel defining layer on a side of the first electrode layer away from the array substrate, the pixel defining layer comprising pixel openings exposing at least part of the first electrodes, a normal projection of the isolation structure on the array substrate being located between normal projections of two adjacent pixel openings on the array substrate; a normal projection of the pixel opening on the array substrate being located within a normal projection of the isolation opening on the array substrate;

[0053] forming the isolation structure on a side of the pixel defining layer away from the array substrate.

[0054] In some possible embodiments, the step of forming at least part of the light emitting unit in the isolation opening, and forming the first encapsulation layer on a side of the light emitting unit away from the array substrate comprises:

[0055] forming a light emitting functional layer of the first light emitting unit on a side of the isolation structure away from the array substrate.

[0056] a second electrode layer formed on a side of the light-emitting functional layer of the first light-emitting unit away from the array substrate;

[0057] a first encapsulation layer formed on a side of the second electrode layer away from the array substrate;

[0058] a first etching protection layer formed in the isolation opening corresponding to the first light-emitting unit;

[0059] removing, along a direction perpendicular to the array substrate, the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etching protection layer;

[0060] laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the second and third light-emitting units, and removing the first etching protection layer, to form a light-emitting part, a second electrode, and an encapsulation unit in the pixel opening corresponding to the first light-emitting unit, the second electrode extending to electrically connect to the isolation structure corresponding to the first light-emitting unit, and the encapsulation unit corresponding to the first light-emitting unit being formed between a side close to the isolation structure and a side facing away from the isolation opening on a portion of the isolation structure away from the array substrate, the tapering angle range being 30°-60°.

[0061] In some possible implementations, after the step of laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the second and third light-emitting units, and removing the first etching protection layer, the method further includes:

[0062] forming a light-emitting functional layer of the second light-emitting unit on a side of the isolation structure away from the array substrate, the light-emitting functional layer of the second light-emitting unit extending to a side of the encapsulation unit corresponding to the first light-emitting unit away from the array substrate;

[0063] a second electrode layer formed on a side of the light-emitting functional layer of the first light-emitting unit away from the array substrate;

[0064] a first encapsulation layer formed on a side of the second electrode layer away from the array substrate;

[0065] a second etching protection layer formed in the isolation opening corresponding to the second light-emitting unit;

[0066] removing, along a direction perpendicular to the array substrate, the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etching protection layer;

[0067] laterally removing the first encapsulation layer on the sidewall of the isolation structure corresponding to the third light emitting unit, and removing the second etching protection layer, to form a light emitting part, a second electrode and an encapsulation unit in the pixel opening corresponding to the second light emitting unit, the second electrode extending to electrically connect with the isolation structure corresponding to the third light emitting unit; the taper angle between the part of the encapsulation unit corresponding to the third light emitting unit on the side of the isolation structure away from the array substrate and the side facing away from the pixel opening is 30°-80°.

[0068] In some possible implementation manners, after the step of laterally removing the first encapsulation layer on the sidewall of the isolation structure corresponding to the third light emitting unit, and removing the second etching protection layer, the method further includes:

[0069] forming a light emitting functional layer of the third light emitting unit on the side of the isolation structure away from the array substrate, the light emitting functional layer of the third light emitting unit extending to the side of the encapsulation unit corresponding to the first light emitting unit and the second light emitting unit away from the array substrate;

[0070] forming a second electrode layer on the side of the light emitting functional layer of the third light emitting unit away from the array substrate;

[0071] forming a first encapsulation layer on the side of the second electrode layer away from the array substrate;

[0072] forming a third etching protection layer in the pixel opening corresponding to the third light emitting unit;

[0073] removing the first encapsulation layer, the light emitting functional layer and the second electrode layer of the third light emitting unit not covered by the third etching protection layer, and removing the third etching protection layer in a direction perpendicular to the array substrate, to form a light emitting part, a second electrode and an encapsulation unit in the pixel opening corresponding to the third light emitting unit, the second electrode extending to electrically connect with the isolation structure corresponding to the third light emitting unit; the taper angle between the part of the encapsulation unit corresponding to the third light emitting unit on the side of the isolation structure away from the array substrate and the side facing away from the pixel opening is 80°-90°.

[0074] In some possible implementation manners, the application further provides an electronic device, which includes the display panel described in the application or includes the display panel prepared by the preparation method of the display panel described in the application.

[0075] Compared with the prior art, the application has the following beneficial effects:

[0076] The display panel, the preparation method of the display panel and the electronic equipment provided by the application can make the taper angle of the encapsulation unit corresponding to the first light emitting unit and the taper angle of the encapsulation unit corresponding to the second light emitting unit not equal by side etching the first encapsulation layer remaining on the side wall of the isolation structure corresponding to the second light emitting unit, so that the second electrode of the first light emitting unit and the second electrode of the second light emitting unit can be effectively overlapped with the corresponding isolation structure, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0077] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0078] Figure 1 A cross-sectional schematic diagram of a display panel in the related technology provided by the embodiments of the application;

[0079] Figure 2 A cross-sectional schematic diagram of a display panel provided by the embodiments of the application;

[0080] Figure 3 A cross-sectional schematic diagram of a display panel provided by the embodiments of the application;

[0081] Figure 4 A cross-sectional schematic diagram of a display panel when the isolation structure provided by the embodiments of the application includes a three-layer structure;

[0082] Figure 5 A flowchart of a preparation method of a display panel provided by the embodiments of the application;

[0083] Figure 6 A cross-sectional schematic diagram of forming a first electrode layer on one side of an array substrate provided by the embodiments of the application;

[0084] Figure 7 A cross-sectional schematic diagram of forming a pixel definition layer on a side of the first electrode layer away from the array substrate provided by the embodiments of the application;

[0085] Figure 8 A cross-sectional schematic diagram of forming an isolation structure on a side of the pixel definition layer away from the array substrate provided by the embodiments of the application;

[0086] Figure 9 A cross-sectional schematic diagram of forming a light emitting functional layer of a first light emitting unit on a side of the isolation structure away from the array substrate provided by the embodiments of the application;

[0087] Figure 10 A cross-sectional schematic view of a second electrode layer formed on a side of a light-emitting functional layer of a first light-emitting unit away from an array substrate is provided for an embodiment of the present application;

[0088] Figure 11 A cross-sectional schematic view of a first encapsulation layer formed on a side of a second electrode layer away from an array substrate is provided for an embodiment of the present application;

[0089] Figure 12 A cross-sectional schematic view of a first etching protection layer formed in an isolation opening corresponding to a first light-emitting unit is provided for an embodiment of the present application;

[0090] Figure 13 A cross-sectional schematic view after removing, in a direction perpendicular to an array substrate, a first encapsulation layer, a light-emitting functional layer and a second electrode layer of a second light-emitting unit that are not covered by a first etching protection layer is provided for an embodiment of the present application;

[0091] Figure 14 A cross-sectional schematic view after laterally removing a first encapsulation layer located on a side wall of an isolation structure corresponding to a second light-emitting unit and a third light-emitting unit is provided for an embodiment of the present application;

[0092] Figure 15 A cross-sectional schematic view of a light-emitting functional layer of a second light-emitting unit formed on a side of an isolation structure away from an array substrate is provided for an embodiment of the present application;

[0093] Figure 16 A cross-sectional schematic view of a second electrode layer formed on a side of a light-emitting functional layer of a second light-emitting unit away from an array substrate is provided for an embodiment of the present application;

[0094] Figure 17 A cross-sectional schematic view of a first encapsulation layer formed on a side of a second electrode layer away from an array substrate is provided for an embodiment of the present application;

[0095] Figure 18 A cross-sectional schematic view of a second etching protection layer formed in an isolation opening corresponding to a second light-emitting unit is provided for an embodiment of the present application;

[0096] Figure 19 A cross-sectional schematic view after removing, in a direction perpendicular to an array substrate, a first encapsulation layer, a light-emitting functional layer and a second electrode layer of a second light-emitting unit that are not covered by a second etching protection layer is provided for an embodiment of the present application;

[0097] Figure 20 A cross-sectional schematic view after laterally removing a first encapsulation layer located on a side wall of an isolation structure corresponding to a third light-emitting unit is provided for an embodiment of the present application;

[0098] Figure 21A cross-sectional schematic view of forming a light-emitting functional layer of a third light-emitting unit on a side of an isolation structure away from an array substrate is provided for an embodiment of the present application;

[0099] Figure 22 A cross-sectional schematic view of forming a second electrode layer on a side of a light-emitting functional layer of a third light-emitting unit away from an array substrate is provided for an embodiment of the present application;

[0100] Figure 23 A cross-sectional schematic view of forming a first encapsulation layer on a side of a second electrode layer away from an array substrate is provided for an embodiment of the present application;

[0101] Figure 24 A cross-sectional schematic view of forming a third etching protection layer in a corresponding isolation opening of a third light-emitting unit is provided for an embodiment of the present application;

[0102] Figure 25 A cross-sectional schematic view of removing a first encapsulation layer, a light-emitting functional layer and a second electrode layer of a third light-emitting unit not covered by a third etching protection layer in a direction perpendicular to an array substrate is provided for an embodiment of the present application.

[0103] FIG. 1 shows a cross-sectional schematic view of an array substrate 1, a first electrode 2, a pixel definition layer 3, a pixel opening 31, a light-emitting part 4, a second electrode 5, an isolation opening 6, an isolation structure 7, a first isolation part 71, a second isolation part 72, a third isolation part 73, a light-emitting unit 8, a first encapsulation layer 9, an encapsulation unit 91, a first etching protection layer 10, a second etching protection layer 11 and a third etching protection layer 12. DETAILED DESCRIPTION

[0104] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0105] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art without creative work based on the embodiments in the present application are within the scope of protection of the present application.

[0106] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0107] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0108] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.

[0109] Please refer to Figure 1 The display panel in the related art includes an array substrate 1, an isolation structure 7 located on one side of the array substrate 1, a light emitting unit 8 located at least partially in an isolation opening 6 enclosed by the isolation structure 7, and a first encapsulation layer 9 located on a side of the light emitting unit 8 away from the array substrate 1. The light emitting unit 8 includes a first light emitting unit and a second light emitting unit. According to the manufacturing order of the first light emitting unit and the second light emitting unit, after the first light emitting unit is formed, part of the first encapsulation layer 9 will be left on the side wall of the isolation structure 7 corresponding to the second light emitting unit. After the second light emitting unit is formed, the second electrode 5 of the second light emitting unit is not easy to effectively lap with the side wall of the isolation structure 7 corresponding to the second light emitting unit, thereby affecting the display effect of the display panel.

[0110] Therefore, the present embodiment provides a scheme that can improve the display effect of the display panel. The scheme provided by the present embodiment is described in detail below.

[0111] Please refer to Figure 2 The present embodiment provides a display panel, which includes an array substrate 1, an isolation structure 7, a light emitting unit 8, and a first encapsulation layer 9.

[0112] The array substrate 1 can include a substrate and a plurality of driving units located on one side of the substrate. Each driving unit can include one or more semiconductor switching devices. The semiconductor switching device can be formed by a plurality of film layers in the array substrate 1, for example, the semiconductor switching device can be a thin film transistor formed by a plurality of film layers.

[0113] The isolation structure 7 is located on one side of the array substrate 1, and the isolation structure 7 encloses the isolation opening 6.

[0114] The composition, preparation, etc. of the isolation structure 7 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, 202311091555.7, for reference.

[0115] At least part of the light-emitting unit 8 is located in the isolation opening 6, and the light-emitting unit 8 includes a first light-emitting unit and a second light-emitting unit. The light-emitting colors of the first light-emitting unit and the second light-emitting unit are different, for example, the color of the first light-emitting unit can be red, and the color of the second light-emitting unit can be green.

[0116] The first encapsulation layer 9 is located on the side of the light-emitting unit 8 away from the array substrate 1, and the first encapsulation layer 9 includes a plurality of encapsulation units 91 arranged at intervals. The encapsulation unit 91 extends from the side of the isolation structure 7 to the side of the isolation structure 7 away from the array substrate 1, and the side of the isolation structure 7 is the side of the isolation structure 7 facing the isolation opening 6; the taper angle between the part of the encapsulation unit 91 located on the side of the isolation structure 7 away from the array substrate 1 and the side away from the isolation opening 6 is formed close to the side of the isolation structure 7. The taper angle β1 of the encapsulation unit 91 corresponding to the first light-emitting unit is not equal to the taper angle β2 of the encapsulation unit 91 corresponding to the second light-emitting unit.

[0117] According to the manufacturing sequence of the first light-emitting unit and the second light-emitting unit, after the first light-emitting unit is manufactured, the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light-emitting unit is etched away by side etching. When etching the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light-emitting unit, the part of the encapsulation unit 91 corresponding to the first light-emitting unit located on the side of the isolation structure 7 away from the array substrate 1 will be side etched.

[0118] Since no other light-emitting unit 8 is manufactured after the second light-emitting unit in this embodiment, after the second light-emitting unit is manufactured, the part of the encapsulation unit 91 corresponding to the second light-emitting unit located on the side of the isolation structure 7 away from the array substrate 1 does not need to be side etched. Therefore, the taper angle β1 formed between the part of the encapsulation unit 91 corresponding to the first light-emitting unit located on the side of the isolation structure 7 away from the array substrate 1 and the side away from the isolation opening 6 close to the side of the isolation structure 7 is not equal to the taper angle β2 formed between the part of the encapsulation unit 91 corresponding to the second light-emitting unit located on the side of the isolation structure 7 away from the array substrate 1 and the side away from the isolation opening 6 close to the side of the isolation structure 7.

[0119] Since the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit is etched before the second light emitting unit is manufactured, the second electrode 5 of the second light emitting unit can be effectively overlapped with the corresponding isolation structure 7, so that the display effect of the second light emitting unit can be improved, and the display effect of the display panel can be improved.

[0120] Based on the above design, in the embodiment, the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit is etched by side etching, so that the taper angle β1 of the encapsulation unit 91 corresponding to the first light emitting unit is not equal to the taper angle β2 of the encapsulation unit 91 corresponding to the second light emitting unit. Finally, the second electrode 5 of the first light emitting unit and the second light emitting unit can be effectively overlapped with the corresponding isolation structure 7, so that the display effect of the display panel can be improved.

[0121] In some possible implementation manners, referring to Figure 3 , the display panel further includes a third light emitting unit, and the taper angle of the encapsulation unit 91 corresponding to the third light emitting unit is not equal to the taper angle of the encapsulation unit 91 corresponding to the first light emitting unit and the second light emitting unit.

[0122] The light emitting colors of the first light emitting unit, the second light emitting unit and the third light emitting unit are all different, for example, the color of the first light emitting unit can be red, the color of the second light emitting unit can be green, and the color of the third light emitting unit can be blue.

[0123] According to the manufacturing sequence of the first light emitting unit, the second light emitting unit and the third light emitting unit, after the first light emitting unit is manufactured, the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit and the third light emitting unit is etched away by side etching. When the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit and the third light emitting unit is etched, the part of the encapsulation unit 91 corresponding to the first light emitting unit located on the side of the isolation structure 7 away from the array substrate 1 is etched by side.

[0124] After the second light emitting unit is manufactured, the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the third light emitting unit is etched away by side etching. When the first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the third light emitting unit is etched, the part of the encapsulation unit 91 corresponding to the second light emitting unit located on the side of the isolation structure 7 away from the array substrate 1 is etched by side.

[0125] Since no other light emitting units 8 are made after the third light emitting unit in the embodiment, after the third light emitting unit is made, the part of the packaging unit 91 corresponding to the third light emitting unit on the side of the isolation structure 7 away from the array substrate 1 can not need to be side-etched. Therefore, the taper angle β1 between the side of the part of the packaging unit 91 corresponding to the first light emitting unit on the side of the isolation structure 7 away from the array substrate 1 close to the isolation structure 7 and the side away from the isolation opening 6, the taper angle β2 between the side of the part of the packaging unit 91 corresponding to the second light emitting unit on the side of the isolation structure 7 away from the array substrate 1 close to the isolation structure 7 and the side away from the isolation opening 6, and the taper angle β3 between the side of the part of the packaging unit 91 corresponding to the third light emitting unit on the side of the isolation structure 7 away from the array substrate 1 close to the isolation structure 7 and the side away from the isolation opening 6 are all not equal.

[0126] Since the first packaging layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit is etched before the second light emitting unit is made, the second electrode 5 of the second light emitting unit can effectively lap the corresponding isolation structure 7. Since the first packaging layer 9 remaining on the side wall of the isolation structure 7 corresponding to the third light emitting unit is etched before the third light emitting unit is made, the second electrode 5 of the third light emitting unit can effectively lap the corresponding isolation structure 7, thereby improving the display effect of the second light emitting unit and the third light emitting unit, and further improving the display effect of the display panel.

[0127] In some possible implementation manners, referring again to Figure 3 , the taper angle β1 of the packaging unit 91 corresponding to the first light emitting unit ranges from 30° to 60°, for example, the taper angle β1 can be 30°, 35°, 45°, 50°, 55° or 60°, etc. Reasonably setting the taper angle β1 can make the first packaging unit 91 remaining on the side wall of the isolation structure 7 corresponding to the second light emitting unit be etched more cleanly, so that the second electrode 5 of the second light emitting unit can be more effectively lapped with the corresponding isolation structure 7.

[0128] In some possible implementation manners, referring again to Figure 3 , the taper angle β2 of the packaging unit 91 corresponding to the second light emitting unit ranges from 30° to 80°, for example, the taper angle β2 can be 30°, 35°, 45°, 55°, 65°, 75° or 80°, etc. Reasonably setting the taper angle β2 can make the first packaging unit 91 remaining on the side wall of the isolation structure 7 corresponding to the third light emitting unit be etched more cleanly, so that the second electrode 5 of the third light emitting unit can be more effectively lapped with the corresponding isolation structure 7.

[0129] Preferably, referring again to Figure 3The taper angle β3 of the encapsulation unit 91 corresponding to the third light emitting unit ranges from 80° to 90°, for example, the taper angle β3 can be 80°, 82°, 85°, 88° or 90°, etc. After the third light emitting unit is manufactured, the taper angle β3 is reasonably set, which can reduce the side etching step of the first encapsulation layer corresponding to the third light emitting unit, thereby reducing the manufacturing cost of the display panel.

[0130] Generally, since no other light emitting unit 8 is manufactured after the third light emitting unit in the embodiment, after the third light emitting unit is manufactured, the part of the encapsulation unit 91 corresponding to the third light emitting unit located on the side of the isolation structure 7 away from the array substrate 1 can not need to be side etched, therefore, the theoretical taper angle β3 of the encapsulation unit 91 corresponding to the third light emitting unit is 90°. Since there can be certain errors in the preparation process, the taper angle β3 of the encapsulation unit 91 corresponding to the third light emitting unit can range from 80° to 90°.

[0131] In some possible implementation manners, referring again to Figure 3 , the adjacent encapsulation units 91 are spaced apart on the side of the isolation structure 7 away from the array substrate 1; the part of the encapsulation unit 91 located on the side of the isolation structure 7 away from the array substrate 1 has a gap with the side of the isolation structure 7 away from the array substrate 1; and the material of the first encapsulation layer 9 includes an inorganic material.

[0132] When the first encapsulation layer 9 is formed, the first encapsulation layer 9 will be broken at the isolation structure 7 and form a plurality of spaced-apart encapsulation units 91, the encapsulation unit 91 can independently encapsulate the light emitting unit 8, thereby improving the display characteristics of the display panel.

[0133] In some possible implementation manners, referring again to Figure 3 , the light emitting unit 8 includes a first electrode layer, a light emitting functional layer and a second electrode layer which are sequentially stacked in the direction away from the array substrate 1, the display panel further includes a pixel defining layer 3 located on the side of the first electrode layer away from the array substrate 1, and the isolation structure 7 is located on the side of the pixel defining layer 3 away from the array substrate 1; the pixel defining layer 3 includes a pixel opening 31 exposing at least part of the first electrode 2, and the orthogonal projection of the isolation structure 7 on the array substrate 1 is located between the orthogonal projections of two adjacent pixel openings 31 on the array substrate 1; and the orthogonal projection of the pixel opening 31 on the array substrate 1 is located within the orthogonal projection of the isolation gap 6 on the array substrate 1.

[0134] When the light-emitting functional layer is formed, the light-emitting functional layer is cut by the isolation structure 7 to form a plurality of light-emitting parts 4 arranged at intervals; when the second electrode layer is formed, the second electrode layer is cut by the isolation structure 7 to form a plurality of second electrodes 5 arranged at intervals; the isolation structure 7 comprises a conductive material; the second electrode 5 is electrically connected with the isolation structure 7; one first electrode 2, one light-emitting part 4 and one second electrode 5 form one light-emitting unit 8. Among them, the first electrode 2 is an anode or a cathode, and the second electrode 5 is a cathode or an anode; when the first electrode 2 is an anode, the second electrode 5 is a cathode; when the first electrode 2 is a cathode, the second electrode 5 is an anode.

[0135] In some embodiments, the pixel defining layer 3 can further comprise a recess, and the isolation structure 7 is located in the recess.

[0136] In some possible implementation manners, referring back to Figure 3 , the isolation structure 7 comprises a first isolation part 71 and a second isolation part 72 which are sequentially stacked in a direction away from the array substrate 1, and a normal projection of the first isolation part 71 on the array substrate 1 is located in a normal projection of the second isolation part 72 on the array substrate 1.

[0137] Since the second isolation part 72 is located on a side of the first isolation part 71 away from the array substrate 1, and the lateral width of the second isolation part 72 is greater than the lateral width of the first isolation part 71, the second isolation part 72 can cut the light-emitting functional layer and the second electrode layer at the isolation structure 7. In this way, the isolation structure 7 formed by the first isolation part 71 and the second isolation part 72 can more easily encapsulate each light-emitting unit 8 independently.

[0138] In some possible implementation manners, referring back to Figure 3 , the second electrode 5 of the light-emitting unit 8 is electrically connected with the first isolation part 71; referring back to Figure 4 , and / or the isolation structure 7 further comprises a third isolation part 73 located on a side of the first isolation part 71 facing the array substrate 1, and the second electrode 5 of the light-emitting unit 8 is electrically connected with the third isolation part 73; the material of the third isolation part 73 comprises metal, such as molybdenum; and / or the material of the first isolation part 71 comprises metal, such as aluminum; and / or the material of the second isolation part 72 comprises metal, such as titanium. In this way, when the isolation structure 7 cuts the second electrode layer into the second electrode 5, the second electrode 5 is more easily electrically connected with the first isolation part 71 and / or the third isolation part 73.

[0139] In some possible implementation manners, the present application further provides another display panel, which comprises an array substrate 1, an isolation structure 7, a light-emitting unit 8 and a first encapsulation layer 9.

[0140] The isolation structure 7 is located on one side of the array substrate 1, and the isolation structure 7 encloses the isolation opening 6.

[0141] At least part of the light emitting unit 8 is located in the isolation opening 6, and the first encapsulation layer 9 is located on the side of the light emitting unit 8 away from the array substrate 1. The first encapsulation layer 9 includes a plurality of encapsulation units 91 arranged at intervals. The encapsulation unit 91 extends from the side of the isolation structure 7 to the side of the isolation structure 7 away from the array substrate 1. The side of the isolation structure 7 is the side of the isolation structure 7 facing the isolation opening 6. The part of the encapsulation unit 91 located between the side of the isolation structure 7 close to the isolation structure 7 and the side of the isolation structure 7 away from the isolation opening 6 forms a taper angle, and the taper angle is less than 90°.

[0142] In the process of manufacturing the light emitting unit 8, the first encapsulation layer 9 remaining on the side wall of the corresponding isolation structure 7 of the light emitting unit 8 is side-etched to etch away the remaining first encapsulation layer 9. At the same time of etching the remaining first encapsulation layer 9, the part of the corresponding encapsulation unit 91 of the light emitting unit 8 located on the side of the isolation structure 7 away from the array substrate 1 is side-etched, so that the taper angle of the encapsulation unit 91 corresponding to the light emitting unit is less than 90°.

[0143] Since the first encapsulation layer 9 remaining on the side wall of the corresponding isolation structure 7 of the light emitting unit 8 is etched away, the second electrode 5 of the light emitting unit 8 can be effectively overlapped with the corresponding isolation structure 7, thereby improving the display effect of the display panel.

[0144] In some possible embodiments, the light emitting unit 8 includes a first light emitting unit and a second light emitting unit. The taper angle β1 of the encapsulation unit 91 corresponding to the first light emitting unit ranges from 30° to 60°, for example, the taper angle β1 can be 30°, 35°, 45°, 50°, 55° or 60°, etc. The taper angle β2 of the encapsulation unit 91 corresponding to the second light emitting unit ranges from 30° to 80°, for example, the taper angle β2 can be 30°, 35°, 45°, 55°, 65°, 75° or 80°, etc. The light emitting colors of the first light emitting unit and the second light emitting unit are different.

[0145] Reasonable setting of the taper angle β1 can etch the first encapsulation unit 91 remaining on the side wall of the corresponding isolation structure 7 of the second light emitting unit more cleanly, so that the second electrode 5 of the second light emitting unit can be more effectively overlapped with the corresponding isolation structure 7.

[0146] Reasonable setting of the taper angle β2 can etch the first encapsulation unit 91 remaining on the side wall of the corresponding isolation structure 7 of the light emitting unit (such as a third light emitting unit) in the subsequent process more cleanly, so that the second electrode 5 of the light emitting unit in the subsequent process can be more effectively overlapped with the corresponding isolation structure 7.

[0147] Another structure of the display panel provided in the embodiment is the same as the structure of the display panel provided in the foregoing embodiment, and will not be described herein.

[0148] In conclusion, by side-etching the first encapsulation layer 9 remaining on the sidewall of the isolation structure 7 corresponding to the second light emitting unit, the taper angle β1 of the encapsulation unit 91 corresponding to the first light emitting unit is made not equal to the taper angle β2 of the encapsulation unit 91 corresponding to the second light emitting unit, so that the second electrode 5 of the first light emitting unit and the second light emitting unit can be effectively overlapped with the corresponding isolation structure 7, thereby improving the display effect of the display panel.

[0149] In some possible implementation manners, referring to Figure 5 The application further provides a preparation method of a display panel, the method comprising:

[0150] S10: providing an array substrate 1.

[0151] The array substrate 1 can include a substrate and a plurality of driving units located on one side of the substrate, and each driving unit can include one or more semiconductor switching devices. The semiconductor switching device can be formed by cooperation of a plurality of film layers in the array substrate 1, for example, the semiconductor switching device can be a thin film transistor formed by cooperation of a plurality of film layers.

[0152] S11: forming an isolation structure 7 on one side of the array substrate 1, and the isolation structure 7 forms an isolation opening 6.

[0153] Referring to Figure 6 a first electrode layer is formed on one side of the array substrate 1, and the first electrode layer includes a plurality of first electrodes 2 arranged at intervals.

[0154] Referring to Figure 7 a pixel defining layer 3 is formed on the side of the first electrode layer away from the array substrate 1, the pixel defining layer 3 includes a pixel opening 31 exposing at least part of the first electrode 2, and the orthographic projection of the isolation structure 7 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 31 on the array substrate 1; the orthographic projection of the pixel opening 31 on the array substrate 1 is located within the orthographic projection of the isolation opening 6 on the array substrate 1.

[0155] Referring to Figure 8 the isolation structure 7 is formed on the side of the pixel defining layer 3 away from the array substrate 1.

[0156] S12: Forming at least part of the light emitting unit 8 in the isolation opening 6, and forming the first encapsulation layer 9 on the side of the light emitting unit 8 away from the array substrate 1, the light emitting unit 8 includes the first light emitting unit and the second light emitting unit, the first encapsulation layer 9 includes a plurality of encapsulation units 91 arranged at intervals, the encapsulation unit 91 extends from the side of the isolation structure 7 to the side of the isolation structure 7 away from the array substrate 1, the side of the isolation structure 7 is the side of the isolation structure 7 facing the isolation opening 6; the part of the encapsulation unit 91 on the side of the isolation structure 7 away from the array substrate 1 between the side close to the isolation structure 7 and the side away from the isolation opening 6 forms a taper angle, the taper angle of the encapsulation unit 91 corresponding to the first light emitting unit is not equal to the taper angle of the encapsulation unit 91 corresponding to the second light emitting unit.

[0157] Please refer to Figure 9 The light emitting functional layer of the first light emitting unit is formed on the side of the isolation structure 7 away from the array substrate 1.

[0158] The light emitting functional layer is disconnected at the isolation structure 7, so that at least part of the light emitting functional layer is located in the isolation opening 6 to form the light emitting part 4, and by controlling the evaporation angle, the light emitting part 4 can be made not to contact the isolation structure 7.

[0159] Please refer to Figure 10 The second electrode layer is formed on the side of the light emitting functional layer of the first light emitting unit away from the array substrate 1.

[0160] The second electrode layer is disconnected at the isolation structure 7, so that at least part of the second electrode layer is located in the isolation opening 6 to form the second electrode 5, and by controlling the evaporation angle, the second electrode 5 can be made to extend from the isolation opening 6 to be in electrical contact with the isolation structure 7, so as to connect adjacent second electrodes 5 or connect the second electrode 5 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0161] Please refer to Figure 11 The first encapsulation layer 9 is formed on the side of the second electrode layer away from the array substrate 1.

[0162] Please refer to Figure 12 The first etching protection layer 10 is formed in the isolation opening 6 corresponding to the first light emitting unit.

[0163] The first etching protection layer 10 can protect the corresponding light emitting functional layer, second electrode layer and first encapsulation layer 9 of the first light emitting unit.

[0164] Please refer to Figure 13 In the direction perpendicular to the array substrate 1, the first encapsulation layer 9, the light emitting functional layer and the second electrode layer not covered by the first etching protection layer 10 are removed.

[0165] After removing the first encapsulation layer 9, the light-emitting functional layer and the second electrode layer which are not covered by the first etching protection layer 10 in the direction perpendicular to the array substrate 1, part of the first encapsulation layer 9 will remain on the side wall of the isolation structure 7 corresponding to the second light-emitting unit and the third light-emitting unit. The first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light-emitting unit and the third light-emitting unit will affect the lapping effect of the second electrode 5 of the second light-emitting unit and the third light-emitting unit and the corresponding isolation structure 7.

[0166] Please refer to Figure 14 , the first encapsulation layer 9 on the side wall of the isolation structure 7 corresponding to the second light-emitting unit and the third light-emitting unit is removed laterally, and the first etching protection layer 10 is removed to form the light-emitting part 4, the second electrode 5 and the encapsulation unit 91 in the pixel opening 31 corresponding to the first light-emitting unit. The second electrode 5 extends to electrically connect with the isolation structure 7 corresponding to the first light-emitting unit. The encapsulation unit 91 corresponding to the first light-emitting unit is located between the side of the isolation structure 7 close to the array substrate 1 and the side away from the isolation opening 6, and the taper angle β1 formed between them is 30°-60°.

[0167] After removing the first encapsulation layer 9, the light-emitting functional layer and the second electrode layer which are not covered by the first etching protection layer 10, the first electrode 2, the light-emitting part 4 of the first light-emitting unit and the second electrode 5 form the first light-emitting unit. The first light-emitting unit is completely covered by the encapsulation unit 91, so as to reduce the risk of the evaporation material entering the evaporation equipment after being exposed to the air, causing equipment pollution and film layer disconnection.

[0168] In this way, the light-emitting part 4, the second electrode 5 and the encapsulation unit 91 can be formed in the pixel opening 31 corresponding to the first light-emitting unit without the need for a precision mask, and the second electrode 5 can be electrically connected with the isolation structure 7, so as to form the first light-emitting unit in the pixel opening 31 corresponding to the first light-emitting unit at a lower cost.

[0169] The first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the second light-emitting unit and the third light-emitting unit can be removed by lateral etching, and at the same time, the taper angle β1 formed between the part of the encapsulation unit 91 corresponding to the first light-emitting unit located on the side of the isolation structure 7 away from the array substrate 1 and the side away from the isolation opening 6 is 30°-60°, for example, the taper angle β1 can be 30°, 35°, 45°, 50°, 55° or 60°, etc.

[0170] Please refer to Figure 15 , the light-emitting functional layer of the second light-emitting unit is formed on the side of the isolation structure 7 away from the array substrate 1, and the light-emitting functional layer of the second light-emitting unit extends to the side of the encapsulation unit 91 corresponding to the first light-emitting unit away from the array substrate 1.

[0171] On the basis of forming the first light-emitting unit, the light-emitting functional layer of the second light-emitting unit is continuously formed, which will cover the encapsulation unit 91 corresponding to the first light-emitting unit, and meanwhile, the light-emitting part 4 of the second light-emitting unit will be formed in the pixel opening 31 corresponding to the second light-emitting unit.

[0172] Please refer to Figure 16 The second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the array substrate 1. Meanwhile, the second electrode 5 of the second light-emitting unit will be formed in the pixel opening 31 corresponding to the second light-emitting unit, and the second electrode 5 of the second light-emitting unit is electrically connected to the corresponding isolation structure 7.

[0173] Please refer to Figure 17 The first encapsulation layer 9 is formed on the side of the second electrode layer away from the array substrate 1.

[0174] Please refer to Figure 18 The second etching protection layer 11 is formed in the isolation opening 6 corresponding to the second light-emitting unit.

[0175] The second etching protection layer 11 can protect the corresponding light-emitting layer, the second electrode layer and the first encapsulation layer 9 of the second light-emitting unit.

[0176] Please refer to Figure 19 In the direction perpendicular to the array substrate 1, the first encapsulation layer 9, the light-emitting functional layer and the second electrode layer of the second light-emitting unit which are not covered by the second etching protection layer 11 are removed.

[0177] After removing the first encapsulation layer 9, the light-emitting functional layer and the second electrode layer which are not covered by the second etching protection layer 11 in the direction perpendicular to the array substrate 1, part of the first encapsulation layer 9 will be left on the side wall of the isolation structure 7 corresponding to the third light-emitting unit, which will affect the lap joint effect of the second electrode 5 of the third light-emitting unit and the corresponding isolation structure 7.

[0178] Please refer to Figure 20 The first encapsulation layer 9 on the side wall of the isolation structure 7 corresponding to the third light-emitting unit is removed laterally, and the second etching protection layer 11 is removed, so as to form the light-emitting part 4, the second electrode 5 and the encapsulation unit 91 in the pixel opening 31 corresponding to the second light-emitting unit, the second electrode 5 extends to electrically connect to the isolation structure 7 corresponding to the second light-emitting unit; the part of the encapsulation unit 91 corresponding to the second light-emitting unit located between the side of the isolation structure 7 away from the array substrate 1 and the side away from the isolation opening 6 forms a taper angle β2 in the range of 30°-80°.

[0179] Since the first encapsulation layer 9 on the side wall of the isolation structure 7 corresponding to the second light emitting unit is removed before the second light emitting unit is formed, the second electrode 5 of the second light emitting unit can extend to effectively electrically connect with the isolation structure 7 corresponding to the second light emitting unit.

[0180] After the first encapsulation layer 9, the light emitting functional layer and the second electrode layer not covered by the second etching protection layer 11 are removed, the first electrode 2, the light emitting part 4 of the first light emitting unit and the second electrode 5 form the second light emitting unit, and the second light emitting unit is completely covered by the encapsulation unit 91, so that the risk of the evaporation material entering the evaporation equipment after being exposed to air, causing equipment pollution and film layer disconnection, can be reduced.

[0181] In this way, the light emitting part 4, the second electrode 5 and the encapsulation unit 91 can be formed in the pixel opening 31 corresponding to the second light emitting unit without the need for a precision mask, and the second electrode 5 can be electrically connected with the isolation structure 7, so that the second light emitting unit can be formed in the pixel opening 31 corresponding to the second light emitting unit at a lower cost.

[0182] The first encapsulation layer 9 remaining on the side wall of the isolation structure 7 corresponding to the third light emitting unit can be removed by side etching, and at the same time, the part of the encapsulation unit 91 corresponding to the second light emitting unit located on the side of the isolation structure 7 away from the array substrate 1 is formed between the side close to the isolation structure 7 and the side away from the isolation opening 6, and the taper angle β2 formed between the two sides is in the range of 30°-80°, for example, the taper angle β2 can be 30°, 35°, 45°, 55°, 65°, 75° or 80°, etc.

[0183] Please refer to Figure 21 The light emitting functional layer of the third light emitting unit is formed on the side of the isolation structure 7 away from the array substrate 1, and the light emitting functional layer of the third light emitting unit extends to the side of the encapsulation unit 91 corresponding to the first light emitting unit and the second light emitting unit away from the array substrate 1.

[0184] On the basis of forming the first light emitting unit and the second light emitting unit, the light emitting functional layer of the third light emitting unit is continuously formed, which covers the encapsulation unit 91 corresponding to the first light emitting unit and the second light emitting unit, and at the same time, the light emitting part 4 of the third light emitting unit is formed in the pixel opening 31 corresponding to the third light emitting unit.

[0185] Please refer to Figure 22 The second electrode layer is formed on the side of the light emitting functional layer of the third light emitting unit away from the array substrate 1, and at the same time, the second electrode 5 of the third light emitting unit is formed in the pixel opening 31 corresponding to the third light emitting unit, and the second electrode 5 of the third light emitting unit is electrically connected with the isolation structure 7.

[0186] Please refer to Figure 23The first encapsulation layer 9 is formed on the side of the second electrode layer away from the array substrate 1.

[0187] Referring to Figure 24 The third etching protection layer 12 is formed in the isolation opening 6 corresponding to the third light emitting unit.

[0188] The third etching protection layer 12 can protect the corresponding light emitting layer, the second electrode layer and the first encapsulation layer 9 of the third light emitting unit.

[0189] Referring to Figure 25 In the direction perpendicular to the array substrate 1, the first encapsulation layer 9, the light emitting functional layer and the second electrode layer of the third light emitting unit not covered by the third etching protection layer 12 are removed, and the third etching protection layer 12 is removed, so as to form the light emitting part 4, the second electrode 5 and the encapsulation unit 91 in the pixel opening 31 corresponding to the third light emitting unit, the second electrode 5 extending to the isolation structure 7 corresponding to the third light emitting unit to electrically connect; the encapsulation unit 91 corresponding to the third light emitting unit is located between the side of the isolation structure 7 away from the array substrate 1 and the side facing away from the isolation opening 6, and the taper angle β3 formed between the two sides is 80°-90°.

[0190] Since the first encapsulation layer 9 on the side wall of the isolation structure 7 corresponding to the third light emitting unit is removed before the third light emitting unit is formed, the second electrode 5 of the third light emitting unit can extend to the isolation structure 7 corresponding to the second light emitting unit to effectively electrically connect.

[0191] After removing the first encapsulation layer 9, the light emitting functional layer and the second electrode layer not covered by the third etching protection layer 12, the first electrode 2, the light emitting part 4 of the first light emitting unit and the second electrode 5 form the third light emitting unit, and the third light emitting unit is completely covered by the encapsulation unit 91, so as to reduce the risk of the evaporation material exposed to the air entering the evaporation equipment, causing equipment pollution and film layer disconnection.

[0192] In this way, the light emitting part 4, the second electrode 5 and the encapsulation unit 91 can be formed in the pixel opening 31 corresponding to the third light emitting unit without the need for a precision mask, and the second electrode 5 can be electrically connected to the isolation structure 7, so as to form the third light emitting unit in the pixel opening 31 corresponding to the third light emitting unit at a lower cost.

[0193] Since no other light emitting units 8 are made after the third light emitting unit in the embodiment, after the third light emitting unit is made, the part of the packaging unit 91 corresponding to the third light emitting unit on the side of the isolation structure 7 away from the array substrate 1 can not need to be side-etched, and thus the theoretical taper angle β3 of the packaging unit 91 corresponding to the third light emitting unit is 90°. Since there can be some errors in the preparation process, the taper angle β3 of the packaging unit 91 corresponding to the third light emitting unit can range from 80° to 90°, for example, the taper angle β3 can be 80°, 82°, 85°, 88° or 90°, etc. In this way, the step of side-etching the part of the packaging unit 91 corresponding to the third light emitting unit on the side of the isolation structure 7 away from the array substrate 1 can be reduced, and thus the cost of manufacturing the display panel can be reduced.

[0194] In summary, the display panel manufactured by the method of the present application can make the second electrode 5 of the light emitting unit 8 more effectively lap joint with the corresponding isolation structure 7, and thus the display effect of the display panel can be improved. Meanwhile, according to the manufacturing order of the first light emitting unit, the second light emitting unit and the third light emitting unit, the part of the packaging unit 91 corresponding to the third light emitting unit on the side of the isolation structure 7 away from the array substrate 1 does not need to be side-etched, and thus the cost of manufacturing the display panel can be reduced. The light emitting colors of the first light emitting unit, the second light emitting unit and the third light emitting unit are all different, for example, the color of the first light emitting unit can be red, the color of the second light emitting unit can be green, and the color of the third light emitting unit can be blue.

[0195] In some possible implementation manners, the present application further provides an electronic device, which includes the display panel in the present application, or includes the display panel manufactured by the manufacturing method of the display panel in the present application. The electronic device can include a device with image processing capability, for example, a server, a personal computer, a notebook computer, etc. Since the electronic device includes the display panel in the present application, the display effect of the electronic device is better.

[0196] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they shall be considered as the scope of the present application.

[0197] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it shall not be understood as a limitation on the patent scope of the present application. It should be pointed out that for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these shall be within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A display panel, characterized by, The display panel comprises: an array substrate; an isolation structure located on one side of the array substrate, the isolation structure being enclosed to form an isolation opening; a light-emitting unit located at least partially in the isolation opening, the light-emitting unit comprising a first light-emitting unit and a second light-emitting unit; a first encapsulation layer located on a side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from a side of the isolation structure to a side of the isolation structure away from the array substrate, the side of the isolation structure being a side of the isolation structure facing the isolation opening, a tapering angle being formed between a side of the part of the encapsulation unit located on the side of the isolation structure away from the array substrate close to the isolation structure and a side of the part of the encapsulation unit located on the side of the isolation structure away from the array substrate away from the isolation opening, the tapering angle of the encapsulation unit corresponding to the first light-emitting unit being different from the tapering angle of the encapsulation unit corresponding to the second light-emitting unit.

2. The display panel of claim 1, wherein, The tapering angle of the encapsulation unit corresponding to the first light-emitting unit ranges from 30° to 60°. Preferably, the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different.

3. The display panel of claim 1, wherein, The tapering angle of the encapsulation unit corresponding to the second light-emitting unit ranges from 30° to 80°. Preferably, the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different.

4. The display panel of claim 1, wherein, The display panel further comprises a third light-emitting unit, the tapering angle of the encapsulation unit corresponding to the third light-emitting unit being different from the tapering angles of the encapsulation units corresponding to the first light-emitting unit and the second light-emitting unit.

5. The display panel of claim 4, wherein, The tapering angle of the encapsulation unit corresponding to the third light-emitting unit ranges from 80° to 90°. Preferably, the light-emitting colors of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are all different.

6. The display panel according to any one of claims 1-5, wherein, The adjacent encapsulation units are arranged at intervals on the side of the isolation structure away from the array substrate. Preferably, a gap is present between the part of the encapsulation unit located on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate. Preferably, the material of the first encapsulation layer comprises an inorganic material.

7. The display panel according to any one of claims 1-5, wherein, The light-emitting unit comprises a first electrode layer, a light-emitting functional layer and a second electrode layer arranged in sequence in a direction away from the array substrate.

8. The display panel of claim 7, wherein, The display panel further comprises a pixel definition layer located on a side of the first electrode layer away from the array substrate, the isolation structure being located on a side of the pixel definition layer away from the array substrate; the pixel definition layer comprises a pixel opening exposing at least part of the first electrode, and a normal projection of the isolation structure on the array substrate is located between normal projections of two adjacent pixel openings on the array substrate.

9. The display panel of claim 8, wherein, The normal projection of the pixel opening on the array substrate is located within the normal projection of the isolation opening on the array substrate.

10. The display panel according to any one of claims 1-5, wherein, The isolation structure comprises a first isolation portion and a second isolation portion arranged in sequence in a direction away from the array substrate, and a normal projection of the first isolation portion on the array substrate is located within a normal projection of the second isolation portion on the array substrate.

11. The display panel of claim 10, wherein, The second electrode of the light-emitting unit is electrically connected with the first isolation part; and / or the isolation structure further comprises a third isolation part located on the side of the first isolation part facing the array substrate, and the second electrode of the light-emitting unit is electrically connected with the third isolation part.

12. The display panel of claim 11, wherein, The material of the third isolation part comprises metal; and / or the material of the first isolation part comprises metal; and / or the material of the second isolation part comprises metal. Preferably, the material of the third isolation part comprises molybdenum metal; and / or the material of the first isolation part comprises aluminum metal; and / or the material of the second isolation part comprises titanium metal.

13. A display panel, characterized by The display panel comprises: an array substrate; an isolation structure located on the side of the array substrate, the isolation structure enclosing a separation opening; a light-emitting unit located at least partially in the separation opening; a first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from the side of the isolation structure to the side of the isolation structure away from the array substrate, the side of the isolation structure being the side of the isolation structure facing the separation opening; the tapering angle between the side of the encapsulation unit located on the side of the isolation structure away from the array substrate and the side of the encapsulation unit facing away from the separation opening is less than 90°.

14. The display panel of claim 13, wherein, The light-emitting unit comprises a first light-emitting unit and a second light-emitting unit, and the tapering angle of the encapsulation unit corresponding to the first light-emitting unit ranges from 30° to 60°; Preferably, the tapering angle of the encapsulation unit corresponding to the second light-emitting unit ranges from 30° to 80°; Preferably, the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different; Preferably, the display panel further comprises a third light-emitting unit, and the tapering angle of the encapsulation unit corresponding to the third light-emitting unit is different from the tapering angles of the encapsulation units corresponding to the first light-emitting unit and the second light-emitting unit; Preferably, the tapering angle of the encapsulation unit corresponding to the third light-emitting unit ranges from 80° to 90°; Preferably, the light-emitting colors of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are all different Preferably, adjacent encapsulation units are arranged at intervals on the side of the isolation structure away from the array substrate; Preferably, the encapsulation unit has a gap between the part of the encapsulation unit located on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate; Preferably, the material of the first encapsulation layer comprises inorganic material; Preferably, the light-emitting unit comprises a first electrode layer, a light-emitting functional layer and a second electrode layer arranged in sequence in the direction away from the array substrate. Preferably, the display panel further comprises a pixel defining layer located on a side of the first electrode layer away from the array substrate, and the isolation structure is located on a side of the pixel defining layer away from the array substrate; the pixel defining layer comprises pixel openings exposing at least part of the first electrodes, and a projection of the isolation structure on the array substrate is located between projections of two adjacent pixel openings on the array substrate; Preferably, a projection of the pixel opening on the array substrate is located within a projection of the isolation opening on the array substrate; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the array substrate, and a projection of the first isolation portion on the array substrate is located within a projection of the second isolation portion on the array substrate; Preferably, the second electrode of the light emitting unit is electrically connected to the first isolation portion, and / or the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the array substrate, and the second electrode of the light emitting unit is electrically connected to the third isolation portion; Preferably, the third isolation portion comprises a metal; and / or the first isolation portion comprises a metal; and / or the second isolation portion comprises a metal; Preferably, the third isolation portion comprises molybdenum metal; and / or the first isolation portion comprises aluminum metal; and / or the second isolation portion comprises titanium metal.

15. A method for manufacturing a display panel, characterized by, The method comprises: providing an array substrate; forming an isolation structure on a side of the array substrate, the isolation structure enclosing an isolation opening; forming at least part of a light emitting unit in the isolation opening, and forming a first encapsulation layer on a side of the light emitting unit away from the array substrate, the light emitting unit comprising a first light emitting unit and a second light emitting unit, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units extending from a side of the isolation structure to a side of the isolation structure away from the array substrate, the side of the isolation structure being a side of the isolation structure facing the isolation opening; a tapering angle is formed between a side of the part of the encapsulation unit located on the side of the isolation structure away from the array substrate and a side of the part of the encapsulation unit facing away from the isolation opening, and the tapering angle of the encapsulation unit corresponding to the first light emitting unit is not equal to the tapering angle of the encapsulation unit corresponding to the second light emitting unit.

16. The method of producing a display panel according to claim 15, wherein The step of forming an isolation structure on a side of the array substrate comprises: forming a first electrode layer on a side of the array substrate, the first electrode layer comprising a plurality of first electrodes arranged at intervals; forming a pixel defining layer on a side of the first electrode layer away from the array substrate, the pixel defining layer comprising pixel openings exposing at least part of the first electrodes, and a projection of the isolation structure on the array substrate is located between projections of two adjacent pixel openings on the array substrate; a projection of the pixel opening on the array substrate is located within a projection of the isolation opening on the array substrate; An isolation structure is formed on a side of the pixel defining layer away from the array substrate.

17. The method of producing a display panel according to claim 16, wherein The step of forming at least part of a light emitting unit in the isolation opening and forming a first encapsulation layer on a side of the light emitting unit away from the array substrate comprises: forming a light emitting functional layer of a first light emitting unit on a side of the isolation structure away from the array substrate; forming a second electrode layer on a side of the light emitting functional layer of the first light emitting unit away from the array substrate; forming a first encapsulation layer on a side of the second electrode layer away from the array substrate; forming a first etching protection layer in the isolation opening corresponding to the first light emitting unit; removing the first encapsulation layer, the light emitting functional layer and the second electrode layer not covered by the first etching protection layer in a direction perpendicular to the array substrate; laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the second and third light emitting units and removing the first etching protection layer to form a light emitting part, a second electrode and an encapsulation unit in the pixel opening corresponding to the first light emitting unit, the second electrode extending to electrically connect with the isolation structure corresponding to the first light emitting unit, and the encapsulation unit corresponding to the second light emitting unit being located between the side of the part of the isolation structure away from the array substrate close to the isolation structure and the side away from the isolation opening forming a taper angle range of 30°-60°.

18. The method of producing a display panel according to claim 17, wherein After the step of laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the second and third light emitting units and removing the first etching protection layer, the method further comprises: forming a light emitting functional layer of a second light emitting unit on a side of the isolation structure away from the array substrate, the light emitting functional layer of the second light emitting unit extending to a side of the encapsulation unit corresponding to the first light emitting unit away from the array substrate; forming a second electrode layer on a side of the light emitting functional layer of the second light emitting unit away from the array substrate; forming a first encapsulation layer on a side of the second electrode layer away from the array substrate; forming a second etching protection layer in the isolation opening corresponding to the second light emitting unit; removing the first encapsulation layer, the light emitting functional layer and the second electrode layer of the second light emitting unit not covered by the second etching protection layer in a direction perpendicular to the array substrate; laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the third light emitting unit and removing the second etching protection layer to form a light emitting part, a second electrode and an encapsulation unit in the pixel opening corresponding to the second light emitting unit, the second electrode extending to electrically connect with the isolation structure corresponding to the second light emitting unit, and the encapsulation unit corresponding to the second light emitting unit being located between the side of the part of the isolation structure away from the array substrate close to the isolation structure and the side away from the isolation opening forming a taper angle range of 30°-80°.

19. The method of producing a display panel according to claim 18, wherein After the step of laterally removing the first encapsulation layer on the side wall of the isolation structure corresponding to the third light emitting unit and removing the second etching protection layer, the method further comprises: forming a light-emitting functional layer of a third light-emitting unit on a side of the isolation structure away from the array substrate, the light-emitting functional layer of the third light-emitting unit extending to a side of the encapsulation unit corresponding to the first light-emitting unit and the second light-emitting unit away from the array substrate; forming a second electrode layer on a side of the light-emitting functional layer of the third light-emitting unit away from the array substrate; forming a first encapsulation layer on a side of the second electrode layer away from the array substrate; forming a third etching protection layer in the isolation opening corresponding to the third light-emitting unit; in a direction perpendicular to the array substrate, removing the first encapsulation layer, the light-emitting functional layer and the second electrode layer of the third light-emitting unit not covered by the third etching protection layer, and removing the third etching protection layer, to form a light-emitting part, a second electrode and an encapsulation unit in the pixel opening corresponding to the third light-emitting unit, the second electrode extending to the isolation structure corresponding to the third light-emitting unit to electrically connect; the tapering angle range between the side of the encapsulation unit corresponding to the third light-emitting unit located on the part of the isolation structure away from the array substrate and the side away from the isolation opening is 80°-90°.

20. An electronic device, comprising: The electronic device comprises the display panel of any one of claims 1-14, or the display panel prepared by the preparation method of any one of claims 15-19.

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