Plating apparatus, and method of dividing a plating tank into an anode chamber and a cathode chamber

Abstract

The present invention aims to make maintenance of a diaphragm or the like in a plating device of a face-down type easy. A plating device includes a plating bath for holding a plating solution; a substrate holder for holding a substrate with a plating surface face down; and an anode holder assembly that is detachably installed in the plating bath in a horizontal direction via an opening of a side wall of the plating bath, and has an anode holder having one or more openings in a central portion, an anode installed in the anode holder, and a diaphragm installed in the anode holder above the anode. The anode holder assembly has one or more sealing surfaces that seal the inside of the plating bath from the outside, and one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers.

Description

Technical Field

[0001] The present invention relates to a plating apparatus and a method for dividing a plating tank into an anode chamber and a cathode chamber. Background Technology

[0002] As a plating apparatus capable of performing plating processing on a substrate, a so-called face-down or cup-type plating apparatus as described in International Publication No. 2023 / 079684 (Patent Document 1) is known. Such a plating apparatus includes: a plating tank for storing plating liquid and equipped with an anode; and a substrate holder (also called a plating head) positioned above the anode to hold the substrate, which serves as the cathode.

[0003] In such a downward-facing plating apparatus, the anode is located at the bottom of the plating tank. Therefore, during maintenance operations such as anode replacement, all the parts above the anode need to be removed. This series of operations is inefficient and time-consuming, and it also degrades the operating rate of the plating apparatus. To solve this problem, International Publication No. 2023 / 079684 (Patent Document 1) describes a structure that includes a pull-out unit that can be pulled out of the plating tank and places the anode in the pull-out unit.

[0004] Patent Document 1: International Publication No. 2023 / 079684

[0005] Furthermore, in plating tanks, sometimes a membrane (diaphragm) is placed in addition to the anode. This membrane is positioned above the anode, dividing the anode chamber on the anode side and the cathode chamber on the substrate side. The diaphragm seals the plating solution in each of the anode and cathode chambers, allowing metal ions in the plating solution to pass from the anode chamber to the cathode chamber, while preventing additives in the plating solution from passing from the cathode chamber to the anode chamber. Such a diaphragm is a consumable component that needs to be replaced periodically. However, it is positioned below components such as impedance elements and blades on the substrate holder side, and is installed in the plating tank with a sealed structure to divide and seal the chambers. Therefore, there is a problem that removal and installation during replacement require time. In addition, since the diaphragm is separate from the anode, there is a concern that the height dimension of the integrated unit will increase. Summary of the Invention

[0006] The present invention aims to solve at least some of the aforementioned problems. One object of the present invention is to facilitate the maintenance of diaphragms and the like in a downward-facing plating apparatus. Another object of the present invention is to facilitate the installation of diaphragms into the plating tank in a downward-facing plating apparatus. Furthermore, another object of the present invention is to facilitate the easy and reliable sealing of each chamber within the plating tank using diaphragms in a downward-facing plating apparatus.

[0007] According to one aspect of the present invention, a plating apparatus is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding a substrate with the plating surface facing downwards; and an anode holder assembly that is horizontally pullable and mountable to the plating tank via an opening in the side wall of the plating tank, and having an anode holder having one or more openings in the central portion, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode, the anode holder assembly having: one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers.

[0008] According to one aspect of the present invention, a method for dividing a plating tank into an anode chamber and a cathode chamber is provided, comprising the following steps: preparing an anode holder, the anode holder having an anode and a diaphragm mounted thereon, and having one or more sealing surfaces for sealing the interior of the plating tank relative to the outside, and one or more sealing surfaces for dividing the interior of the plating tank into upper and lower chambers; and installing the anode holder into the plating tank through an opening in the side wall of the plating tank, blocking the opening of the plating tank with the anode holder to seal the interior of the plating tank relative to the outside, and dividing the interior of the plating tank into the anode chamber and the cathode chamber above and below the diaphragm. Attached Figure Description

[0009] Figure 1 This is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0010] Figure 2 This is a top view showing the overall structure of a plating apparatus according to one embodiment.

[0011] Figure 3 This is a 3D view of the plating module taken from the front side and below.

[0012] Figure 4 This is a three-dimensional view of the longitudinal section of the plating module.

[0013] Figure 5 This is a three-dimensional view of the cross-section of the plating module.

[0014] Figure 6A This is an enlarged perspective view showing a part of the anode cage assembly.

[0015] Figure 6B This is an explanatory diagram illustrating the installation structure of the diaphragm and anode.

[0016] Figure 7 This is a three-dimensional view of the longitudinal section of the plating module at the cathode liquid inlet.

[0017] Figure 8This is a top view of the anode cage assembly.

[0018] Figure 9 This is a three-dimensional view observed from above the anode cage assembly.

[0019] Figure 10 This is a perspective view taken from below the anode cage assembly. Detailed Implementation

[0020] Hereinafter, the plating apparatus 1000 according to an embodiment of the present invention will be described with reference to the accompanying drawings. Furthermore, the drawings are schematic illustrations for ease of understanding of the characteristics of the object, and the dimensions and proportions of the constituent elements may not be the same as in reality. Additionally, in several of the drawings, orthogonal XYZ coordinates are illustrated for reference. In this orthogonal coordinate system, the Z direction corresponds to upward, and the -Z direction corresponds to downward (the direction of gravity).

[0021] Figure 1 This is a perspective view showing the overall structure of the plating apparatus 1000 of this embodiment. Figure 2 This is a top view showing the overall structure of the plating apparatus 1000 according to this embodiment. (As shown) Figure 1 and Figure 2 As shown, the plating apparatus 1000 includes a loading port 100, a handling robot 110, an alignment device 120, a pre-wetting module 200, a pre-immersion module 300, a plating module 400, a cleaning module 500, a rotary rinsing and drying device 600, a handling device 700, and a control module 800.

[0022] The loading port 100 is a module used to load substrates housed in a FOUP or similar box (not shown) into the plating apparatus 1000, or to remove substrates from the plating apparatus 1000 into the box. In this embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The handling robot 110 is a robot used to handle substrates, configured to transfer substrates between the loading ports 100, the alignment device 120, the pre-wetting module 200, and the rotary rinsing and drying device 600. When transferring substrates between the handling robot 110 and the handling device 700, the handling robot 110 and the handling device 700 can transfer the substrates via a temporary placement table (not shown).

[0023] Aligner 120 is a module used to align the orientation plane, notch, and other positions of the substrate with a predetermined direction. In this embodiment, two alignment devices 120 are arranged side by side in the horizontal direction, but the number and arrangement of alignment devices 120 are arbitrary. Pre-wetting module 200 uses a treatment liquid such as pure water or degassed water to wet the substrate surface to be plated before plating, thereby replacing the air inside the pattern formed on the substrate surface with the treatment liquid. Pre-wetting module 200 is configured to perform a pre-wetting process, which facilitates the supply of plating liquid into the pattern by replacing the treatment liquid inside the pattern with plating liquid during plating. In this embodiment, two pre-wetting modules 200 are arranged side by side in the vertical direction, but the number and arrangement of pre-wetting modules 200 are arbitrary.

[0024] The pre-impregnation module 300 is configured to perform a pre-impregnation process, which involves, for example, etching away high-resistivity oxide films such as those on the seed layer surface of the substrate to be plated before plating with a treatment solution such as sulfuric acid or hydrochloric acid, and cleaning or activating the surface of the substrate to be plated. In this embodiment, two pre-impregnation modules 300 are arranged side-by-side in the vertical direction, but the number and arrangement of the pre-impregnation modules 300 are arbitrary. The plating module 400 performs the plating process on the substrate. In this embodiment, there are two sets of twelve plating modules 400, three arranged side-by-side in the vertical direction and four arranged side-by-side in the horizontal direction, for a total of twenty-four plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0025] The cleaning module 500 is configured to clean the substrate to remove residual plating solution or the like after plating. In this embodiment, two cleaning modules 500 are arranged side-by-side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The rotary rinsing and drying device 600 is a module for drying the cleaned substrate by rotating it at high speed. In this embodiment, two rotary rinsing and drying devices 600 are arranged side-by-side in the vertical direction, but the number and arrangement of the rotary rinsing and drying devices 600 are arbitrary. The conveying device 700 is a device for conveying the substrate between multiple modules within the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000, and can be configured, for example, by a general-purpose computer or a dedicated computer equipped with an input / output interface for the operator.

[0026] An example of a series of plating processes based on the plating apparatus 1000 will be described. First, a substrate housed in a cassette is moved into the loading port 100. Next, a transport robot 110 removes the substrate from the cassette in the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notches, and other positions of the substrate with a predetermined direction. The transport robot 110 then transfers the substrate, aligned by the aligner 120, to the pre-wetting module 200.

[0027] The pre-humidification module 200 performs a pre-humidification treatment on the substrate. The transport device 700 transports the pre-humidified substrate to the pre-impregnation module 300. The pre-impregnation module 300 performs a pre-impregnation treatment on the substrate. The transport device 700 transports the pre-impregnation treated substrate to the plating module 400. The plating module 400 performs a plating treatment on the substrate.

[0028] The transport device 700 transports the plated substrate to the cleaning module 500. The cleaning module 500 cleans the substrate. The transport device 700 then transports the cleaned substrate to the rotary rinsing and drying unit 600. The rotary rinsing and drying unit 600 dries the substrate. The transport robot 110 receives the substrate from the rotary rinsing and drying unit 600 and transports the dried substrate to a cassette in the loading port 100. Finally, the cassette containing the substrate is removed from the loading port 100.

[0029] also, Figure 1 , Figure 2 The structure of the plating apparatus 1000 described herein is merely an example, and the structure of the plating apparatus 1000 is not limited to this. Figure 1 , Figure 2 The structure.

[0030] [Platinum Module]

[0031] Next, the plating module 400 will be described. Furthermore, since the plating apparatus 1000 of this embodiment has multiple plating modules 400 with the same structure, only one plating module 400 will be described.

[0032] Figure 3 This is a 3D view of the plating module taken from the front side and below. Figure 4 This is a three-dimensional view of the longitudinal section of the plating module. Figure 5 This is a three-dimensional view of the cross-section of the plating module. Figure 6A This is an enlarged perspective view showing a part of the anode cage assembly. Figure 6B This is an explanatory diagram illustrating the installation structure of the diaphragm and anode. Figure 7 This is a three-dimensional view of the longitudinal section of the plating module at the cathode liquid inlet. Figure 8 This is a top view of the anode cage assembly. Figure 9This is a three-dimensional view observed from above the anode cage assembly. Figure 10 This is a perspective view taken from below the anode cage assembly. Furthermore, Figure 3 The direction indicated by the arrow Y in the figure represents the front-to-back direction of the plating module 400, with the front plate (cover) 640 side of the anode holder 610 designated as the front and the opposite side designated as the rear side.

[0033] like Figure 4 As shown, the plating apparatus 1000 of this embodiment is a plating apparatus of the type known as a face-down or cup-type, which horizontally holds the substrate Wf and performs plating. The plating module 400 of the plating apparatus 1000 of this embodiment mainly includes: a plating tank 10; a substrate holder 20, which holds the substrate Wf and is also called a plating head; a rotation mechanism, a tilting mechanism, and a lifting mechanism (not shown) for rotating, tilting, and lifting the substrate holder 20; a diaphragm 50 that divides the plating tank 10 into a cathode chamber Cc and an anode chamber Ca; and an anode 60, which is disposed below the substrate Wf and opposite to the substrate Wf. The tilting mechanism may be omitted.

[0034] The plating tank 10 according to this embodiment is a bottomed container with an opening at the top. The plating tank 10 according to this embodiment includes an upper tank 11 and a lower tank 12. The plating tank 10 forms a generally cylindrical internal space for storing the plating solution through the upper tank 11 and the lower tank 12. As the plating solution, any solution containing ions of the metal element constituting the plating film is acceptable, and there are no particular limitations on specific examples. In this embodiment, copper plating is used as an example of the plating process, and copper sulfate solution is used as an example of the plating solution. Furthermore, in this embodiment, the plating solution contains a specified additive. However, this structure is not limited to this; the plating solution may also be designed to not contain additives.

[0035] Inside the plating tank 10, a paddle 30 is disposed near the substrate Wf. The paddle 30 reciprocates in a direction substantially parallel to the plating surface of the substrate Wf, generating a strong flow of plating solution on the surface of the substrate Wf. This homogenizes the ions in the plating solution near the surface of the substrate Wf, improving the in-plane uniformity of the plating film formed on the surface of the substrate Wf.

[0036] Inside the plating tank 10, a porous impedance body 40 is disposed below the blade 30. Specifically, the impedance body 40 is composed of a porous plate component having multiple pores (micropores). Plating liquid below the impedance body 40 can flow to a position above the impedance body 40 through the impedance body 40. This impedance body 40 is a component provided to achieve uniformity of the electric field formed between the anode 60 and the substrate Wf. By arranging such an impedance body 40 in the plating tank 10, uniformity of the film thickness of the plating film (plating layer) formed on the substrate Wf can be easily achieved. Furthermore, the impedance body 40 is not a necessary structure in this embodiment, and this embodiment can also be configured without the impedance body 40.

[0037] In this embodiment, an anode retainer assembly 6 is disposed in the lower groove 12 of the plating tank 10. The anode retainer assembly 6 has a structure that includes a diaphragm 50, an anode 60, and a variable anode cover 650. That is, by inserting and installing the anode retainer assembly 6 into the plating tank 10, a structure is formed in which the diaphragm 50, the anode 60, and the variable anode cover 650 are disposed in the plating tank 10.

[0038] In this embodiment, the diaphragm 50 and the anode 60 are disposed inside the plating tank 10 below the variable anode cover 650. Figure 5 , Figure 6A In this embodiment, an anode 60 is disposed close to the diaphragm 50. The diaphragm 50 divides the interior of the plating tank 10 vertically into an anode chamber Ca (the chamber on the lower side of the diaphragm 50) and a cathode chamber Cc (the chamber on the upper side of the diaphragm 50). The diaphragm 50 is constructed, for example, by overlapping a neutral membrane or an ion exchange membrane. The structure of the diaphragm 50 is just one example, and other structures are possible. The diaphragm 50 is sealed at its outer periphery by a sealing pressing ring 51 pressed from below and fixed to the retainer body 620 (the annular portion 621) with the sealing member 704 clamped between the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610. Figure 6A , Figure 6B A sealing surface 704A is formed between the lower surface of the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610 and the upper surface of the outer periphery of the diaphragm 50. The seal 704 can be disposed, for example, in a sealing groove that is arranged in a ring around the entire circumference of the lower surface of the annular portion 621 of the retainer body 620 / anode retainer 610. Thus, in this embodiment, the anode retainer assembly 6 can be configured such that the plating tank 10 is divided vertically by the diaphragm 50. Therefore, if the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610 is sealed to the plating tank 10, the plating tank 10 becomes a structure divided into an anode chamber Ca and a cathode chamber Cc by the diaphragm 50.

[0039] In the anode chamber Ca, anolyte (plating solution) is supplied from the anolyte inlet 12C provided on the bottom wall of the plating tank 10, and discharged, for example, from the anolyte outlet (not shown) provided on the side wall of the plating tank 10. In the cathode chamber Cc, catholyte (plating solution) is supplied from the catholyte inlet 680 and discharged from the catholyte outlet (not shown). Plating solution (catholyte) containing additives such as accelerators is introduced into the cathode chamber Cc, and plating solution (anolyte) without additives or with low additive concentration is introduced into the anode chamber Ca. The diaphragm 50 allows metal ions in the plating solution to permeate from the anode chamber Ca to the cathode chamber Cc, and prevents additives in the plating solution from permeating from the cathode chamber Cc to the anode chamber Ca.

[0040] The anode 60 is disposed in close contact with the lower surface of the diaphragm 50. The specific type of anode 60 is not particularly limited; both dissolved anodes and insoluble anodes can be used. In this embodiment, an insoluble anode is used as the anode 60. The specific type of this insoluble anode is not particularly limited; platinum, iridium oxide, etc., can be used.

[0041] In this embodiment, a variable anode cover 650 is provided on the upper surface side (substrate Wf side) of the anode 60 and the diaphragm 50. The variable anode cover 650 is an electric field adjustment component, having an opening that exposes the anode 60 inside a blade 651. The range of anode 60 exposure is adjusted by the blade 651, thereby adjusting the electric field from the anode 60 toward the substrate Wf. Figure 5 As shown, the variable anode cover 650 of this embodiment has a plurality of blades 651, and the opening size of the opening that exposes the anode 60 is adjusted by means of a mechanism similar to the aperture of a camera.

[0042] <Anode Cage Assembly>

[0043] The details of the anode retainer assembly (also known as the pull-out unit) 6 will be described below. In this embodiment, the diaphragm 50, the anode 60, and the variable anode cover 650 are mounted on the anode retainer 610, and they are integrally configured as the anode retainer assembly 6. Figure 3 , Figure 4 In other embodiments, the variable anode cover 650 may be omitted or disposed separately from the anode retainer assembly 6. The anode retainer assembly 6 is pull-out mounted to the plating tank 10 (lower tank 12). Figure 3 and Figure 4 As shown, the anode retainer assembly 6 is inserted into the plating tank 10 through the opening 12B provided on the front side of the plating tank 10 and installed in the plating tank 10. The opening 12B of the plating tank 10 is closed by the front plate (cover) 640 of the anode retainer 610 and is liquid-tightly sealed by the seals 702 and 703 (described later).

[0044] The anode retainer assembly 6 includes: an anode retainer 610; and a diaphragm 50, an anode 60, and a variable anode cover 650 mounted on the anode retainer 610. In other embodiments, the variable anode cover 650 may be omitted or may be provided separately from the anode retainer assembly 6.

[0045] (Anode holder)

[0046] The anode holder 610 includes a holder body 620 and a front plate 640. The holder body 620 is a component that holds the diaphragm 50, the anode 60, and the variable anode cover 650. The front plate 640 is a component that blocks the opening 12B of the plating tank 10 and liquid-tightly seals the inside of the plating tank 10 relative to the outside. Since the holder body 620 is a component that constitutes the main part of the anode holder 610, the outer periphery of the anode holder 610 refers to the outer periphery of the holder body 620, and the outer periphery of the holder body 620 refers to the outer periphery of the anode holder 610.

[0047] cage body

[0048] The cage body 620 includes: an annular portion 621; a diaphragm support portion 622 integrally disposed inside the annular portion 621; and a flange 623 disposed on the upper surface of the annular portion 621. The annular portion 621 and the flange 623 constitute the outer periphery of the cage body 620 / anode cage 610. The annular portion 621 and the flange 623 can be collectively referred to as the outer periphery of the cage body 620 / anode cage 610, or they can be referred to separately as the outer periphery of the cage body 620 / anode cage 610.

[0049] like Figure 4 As shown, the annular portion 621 forms the lower part of the outer periphery of the retainer body 620 / anode retainer 610, and a diaphragm support portion 622 with multiple openings exposing the diaphragm 50 (the area corresponding to the anode 60) is disposed on its inner side. In other embodiments, the diaphragm support portion 622 may be omitted, and a portion of the diaphragm support portion 622 may be a single opening.

[0050] Diaphragm support 622 Figure 8 and Figure 9 The image shows a mesh section with multiple openings, such as... Figure 4 and Figure 5 The diagram shows a component that abuts against the upper surface of the diaphragm 50 and supports the diaphragm 50 from above. For example... Figure 4 and Figure 5As shown, the diaphragm support 622 includes: a honeycomb structure (inside the circumscribed circle Rm), with hexagonal beams 622A arranged in a honeycomb shape and having multiple honeycomb-shaped openings; and multiple beams 622B extending radially, connecting from the outermost apex of the honeycomb structure to an annular portion 621 of the retainer body 620 / anode retainer 610. Figure 8 In this context, Rm represents the circumcircle of the honeycomb structure, and the inner side of the circumcircle Rm roughly represents the honeycomb structure. The circumcircle Rm roughly corresponds to the outline (projected shape) of the substrate Wf. In this embodiment, as shown... Figure 8 As shown, the center of the honeycomb structure, i.e., the center Cm of the circumscribed circle Rm, is eccentrically located from the rotation center / rotation center axis Cw of the substrate holder 20 (substrate Wf). This structure prevents the coating film formed on the substrate Wf from picking up the pattern of the diaphragm support portion 622, thus suppressing or preventing a decrease in the uniformity of the coating film thickness. When the center Cm of the honeycomb structure is not eccentric (offset) from the rotation center Cw of the substrate Wf, even if the substrate Wf rotates, the likelihood of forming regions with a high ratio of electric field shielding by the beam 622A is higher.

[0051] The flange 623 forms the upper part of the outer periphery of the holder body 620 / anode holder 610 and constitutes a mounting part for the interior of the plating tank 10. For example... Figure 8 and Figure 9 As shown, flange 623 is an annular component with an opening in the center exposing diaphragm 50 (the area corresponding to anode 60). Flange 623 is securely and liquid-tightly fixed to the annular portion 621 of the retainer body 620 / anode retainer 610 by a fixing method based on fastening components, welding, joining, etc. Alternatively, a seal can be disposed between flange 623 and annular portion 621 to liquid-tightly fix them together. In this embodiment, flange 623 and annular portion 621 are provided separately, but if the variable anode cover 650 is not installed on the anode retainer 610, flange 623 and annular portion 621 can be integrally provided. An annular sealing groove is formed throughout the entire circumference of the upper surface of flange 623, and an annular seal 701 is disposed in the sealing groove. In this embodiment, as... Figure 4 As shown, a ring-shaped protrusion that is slightly higher than other parts is provided on the inner side of the upper surface of the flange 623, and a seal 701 is disposed on the ring-shaped protrusion.

[0052] ·Front panel

[0053] like Figure 3 and Figure 4 As shown, the front panel 640 includes a front panel body 641 and a frame member 642. The frame member 642 is movably fitted onto the outer peripheral surface of the front panel body 641 relative to the front panel body 641 in the front-rear direction. The front panel body 641 and the frame member 642 are fitted together with a strength that prevents them from falling off. Figure 4 As shown, an annular seal 703 is disposed around the entire outer circumference of the front panel body 641, for example, to provide a liquid-tight seal between the front panel body 641 and the frame member 642. The seal 703 may be disposed, for example, within a sealing groove that is annularly formed around the entire outer circumference of the front panel body 641. The seal 703 may also be disposed within a sealing groove that is annularly formed around the entire inner circumference of the frame member 642. A flange 12A protruding downwards and laterally is provided around the opening 12B of the lower groove 12 of the plating groove 10. An annular seal 702 is disposed around the opening 12B on the front surface of the flange 12A, sealing the flange 12A and the front panel 640 (frame member 642). For example, the seal 702 is disposed within an annular sealing groove that is provided around the opening 12B on the front surface of the flange 12A. The flange 12A forms part of the lower groove 12 and may be integrally disposed with the lower groove 12 or may be separately disposed from other parts of the lower groove 12 and liquid-tightly fixed to other parts by a fixing method based on fastening components, welding, joining, etc. Alternatively, the seal 702 may also be disposed within an annular sealing groove that is provided around the back surface of the frame member 642.

[0054] Furthermore, if sufficient area can be ensured for the frame member 642 of the front plate 640 to abut against the side wall (front surface) of the lower groove 12, the flange 12A may be omitted.

[0055] like Figure 3 and Figure 4 As shown, the front plate 640 is fixed to the flange 12A of the lower groove 12 by a plurality of fastening members 802 passing through the frame member 642. The fastening members 802 can be bolts, screws, or other arbitrary fastening members. However, from the viewpoint of maintenance of the anode retainer assembly 6 (anode retainer 610), it is preferable to have easily removable members. The frame member 642 of the front plate 640 is fixed to the flange 12 of the plating tank 10 by the fastening members 802, thereby sealing the frame member 642 and the flange 12A by the seal 702. At this time, the frame member 642 can move relative to the front plate body 641 in the front-rear direction, so that the seal 702 can be appropriately elastically deformed and the sealing performance of the seal 702 can be fully utilized. As a result, when the anode retainer 610 (anode retainer assembly 6) is installed into the plating tank 10, the inside of the plating tank 10 is liquid-tightly sealed relative to the outside by the seal 702 between the front plate 640 of the anode retainer 610 and the flange 12A of the plating tank 10.

[0056] (Diaphragm)

[0057] like Figure 4 , Figure 6AAs shown, the outer periphery of the diaphragm 50 is mounted via a seal 704 on the lower surface of the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610. Figure 6A As shown, multiple fastening components 803 pass through the sealing pressing ring 51, the diaphragm 50, and the seal 704 and are screwed into the annular portion 621, thereby mounting the outer periphery of the diaphragm 50 to the outer periphery (annular portion 621) of the cage body 620 / anode cage 610 in a sealed state by the seal 704. The seal 704 can, for example, be disposed in a sealing groove formed in an annular shape throughout the lower surface of the annular portion 621. Figure 6A The multiple fastening components 803 can be bolts, screws, or other arbitrary fastening components, for example, evenly arranged around the entire circumference of the sealing pressure ring 51. The diaphragm support portion 622 and the annular portion 621 can also be collectively referred to as the diaphragm support portion.

[0058] (anode)

[0059] like Figure 6B As shown, the anode 60 is mounted on the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610 in a manner that is tightly against the lower surface of the diaphragm 50 via the anode fixing plate 62 and diaphragm pressing members 810. The anode 60 is supported from below and held in a predetermined position by a plurality of diaphragm pressing members 810, which penetrate the anode fixing plate 62 and abut against the lower surface of the anode 60, pressing the anode 60 against the diaphragm 50. At this time, although in Figure 6A and Figure 6B It is not shown in the text, but the upper surface of the diaphragm 50 is supported by the diaphragm support portion 622 of the retainer body 620 / anode retainer 610. Figure 5 The diaphragm 50 and anode 60 are held in place by the diaphragm support 622 above and the diaphragm clamping member 810 below. The anode fixing plate 62 is also referred to as the back plate.

[0060] The diaphragm clamp 810 can be configured as a bolt, a spacer, or other arbitrary support component. Furthermore, Figure 6B To emphasize the gap between the anode 60, which is formed by multiple diaphragm presses 810, and the anode fixing plate 62, it is shown in a schematic manner.

[0061] like Figure 6A As shown, the anode fixing plate 62 is located outside the sealing pressing ring 51, via multiple spacers 804A (in Figure 6A(Only one shown in the figure) is fixed to the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610. The anode fixing plate 62 is fixed to the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610 by a plurality of fastening members 804 that pass through the anode fixing plate 62 and the spacer 804A and are screwed into the annular portion 621. As a result, a gap is formed between the outer periphery of the retainer body 620 / anode retainer 610 and the anode fixing plate 62 (between the sealing pressing ring 51 and the anode fixing plate 62, and between the annular member 621 and the anode fixing plate 62). Gas (e.g., oxygen) generated at the anode 60 can move to the outside of the retainer body 620 / anode retainer 610 through the above-mentioned gap.

[0062] The multiple fastening components 804 can be bolts, screws, or other arbitrary fastening components, for example, evenly distributed around the entire circumference of the outer side of the sealing press ring 51.

[0063] like Figure 6B As shown, a predetermined gap is formed between the lower surface of the anode 60 and the anode fixing plate 62 via the front end side of the diaphragm pressure member 810. Furthermore, on the outer periphery of the anode 60, gaps are provided at one or more points in the circumferential direction between the sealing pressing ring 51 and the anode fixing plate 62, and between the annular member 621 and the anode fixing plate 62. Gas accumulated between the lower surface of the anode 60 and the anode fixing plate 62 is discharged outward through these gaps. The anode fixing plate (back panel) 62 has the function of adjusting the amount of gas accumulated on the lower surface of the anode 60 to a predetermined amount and suppressing the voltage fluctuation of the anode caused by a large amount of gas simultaneously escaping from the lower surface of the anode. This suppresses the reduction in the uniformity of the coated film thickness.

[0064] In this embodiment, the anode 60 is a plate-shaped component with a large number of through holes (not shown). The anode 60 can be configured as a porous (metal mesh) structure or other plate-shaped component with multiple through holes (see International Publication No. 2023 / 188371). Because the anode 60 has a large number of through holes, the upper surface of the anode 60 remains wet even during the electrode reaction due to the plating solution (anolyte) supplied from the through holes. Since the diaphragm 50 is an ion-permeable membrane that is permeable and wettable to the plating solution, the surface of the anode 60 on the substrate side (where the diaphragm 50 is in close contact or nearby) reacts with the plating solution, and cations (e.g., hydrogen ions H+) react with the plating solution. +The current is transferred to the cathode chamber Cc, i.e., the substrate side, through the diaphragm 50. Thus, an ion conduction path (current path) is formed from the substrate side surface of the anode 60 (where the diaphragm 50 is in close contact with it or its vicinity), through the interior of the diaphragm 50, to the substrate Wf. On the other hand, gas bubbles generated on the surface of the anode 60 cannot pass through the diaphragm 50, but move towards the back surface (lower surface) of the anode 60 through the numerous through-holes in the anode 60. After accumulating on the lower surface of the anode 60 (between the anode 60 and the back panel 62), the bubbles move towards the outside of the sealing ring 51 and are discharged to the outside of the plating tank 10 through the exhaust passage (not shown).

[0065] Since the upper surface of the anode 60 is in close contact with the lower surface of the diaphragm 50, it is possible to suppress or prevent the accumulation of gas generated from the anode 60 between the anode 60 and the diaphragm 50, and to suppress or prevent the gas from moving towards the cathode chamber. It is also possible to suppress or prevent the gas from affecting the electric field between the anode 60 and the substrate Wf, thereby reducing the uniformity of the coating thickness formed on the substrate Wf.

[0066] (Variable anode cover)

[0067] like Figure 4 As shown, the variable anode cover 650 is mounted on the annular portion 621 of the retainer body 620 / anode retainer 610 to the diaphragm support portion 622. Figure 5 (etc.) at a slightly higher position. The variable anode cover 650 includes: a plurality of blades 651; and an annular drive unit 652, on which the plurality of blades 651 are mounted, adjusting the aperture (aperture diameter) based on the aforementioned blades 651. The drive unit 652 is equipped with... Figure 3 , Figure 5 The drive shaft 670, as shown, moves in the front-to-back direction via an actuator (not shown), thereby driving the component 652 to rotate and adjusting the aperture (opening diameter) based on multiple blades 651. In one example, the structure can be configured such that an actuator (not shown) is disposed on the side surface of the lower groove 12 of the plating tank 10 adjacent to the front plate 640 (opening 12B of the lower groove 12) of the anode holder 610. The shaft of the actuator extends parallel to the drive shaft 670, and the shaft of the actuator and the drive shaft 670 are connected at their front ends via a connecting member 671 (see International Publication No. 2023 / 079684 (Patent Document 1)). The drive shaft 670 and the front plate 640 (front plate body 641) are sealed by a suitable seal (not shown, see, for example, Patent Document 1). The actuator can be constructed from a known linear actuator (e.g., a motor, ball screw).

[0068] (First sealing surface)

[0069] like Figure 9As shown, the flange 623 of the cage body 620 / anode cage 610 is an annular component with a central opening exposing the diaphragm 50 (the area corresponding to the anode 60). Figure 4 , Figure 5 , Figure 8 and Figure 9 As shown, a seal 701 is arranged around the entire circumference of the upper surface of the flange 623. This seal 701 seals the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 with the lower surface of the flange 12D of the plating tank 10. A sealing surface 701A (see reference) is formed between the upper surface of the outer periphery (flange 623) of the retainer body 620 / anode retainer 610, which holds the seal 701, and the lower surface of the flange 12D of the plating tank 10, to seal the outer periphery of the retainer body 620 / anode retainer 610 with the plating tank 10. Figure 4 ).like Figure 4 , Figure 5 As shown, the system is configured such that when multiple fastening members 801, which pass through the flange 11A of the upper groove 11 and the flange 12D of the lower groove 12 of the plating tank 10, are fastened to the flange 623 of the retainer body 620 / anode retainer 610, and the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 is fixed to the flange 12D of the plating tank 10, the seal 701 performs a sealing function by elastically deforming under appropriate pressure. The multiple fastening members 801 are arranged, for example, evenly distributed throughout the circumference. The fastening members 801 can be bolts, screws, or other arbitrary fastening members.

[0070] (Second sealing surface)

[0071] like Figure 4 As shown, an annular seal 702 is arranged around the opening 12B on the front surface of the flange 12A of the lower groove 12 of the plating tank 10. This seal 702 seals the flange 12A of the plating tank 10 with the frame member 642 of the front plate 640. In other words, it liquid-tightly seals the opening 12B of the plating tank 10. Between the front surface of the flange 12A of the plating tank 10, which holds the seal 702, and the back surface of the frame member 642 of the front plate 640, a sealing surface 702A is formed to seal the front plate 640 with the plating tank 10 (see reference). Figure 4 ).like Figure 3 , Figure 4As shown, the configuration is such that if the front plate 640 of the anode holder 610 is fixed to the flange 12A of the plating tank 10 by a plurality of fastening members 802, the seal 702 elastically deforms under appropriate pressure and performs a sealing function. At this time, the frame member 642 of the front plate 640 can move relative to the front plate body 641 in the front-rear direction, thus allowing the frame member 642 to move relative to the front plate body 641, so that the frame member 642 elastically deforms the seal 702 under appropriate pressure according to the tightness of the plurality of fastening members 802. Figure 4 As shown, multiple fastening components 802 can be evenly distributed throughout the circumference, for example.

[0072] Here, when the flange 623 of the retainer body 620 / anodine retainer 610 is fixed to the flange 12D of the plating tank 10 using the fastening member 801, that is, when the seal 701 is elastically deformed, the flange 12D of the plating tank 10 is subjected to a vertical force due to the fastening member 801. Therefore, the seal 702 disposed on the flange 12A of the plating tank 10 is subjected to a vertical force, which may prevent it from achieving a proper seal between the flange 12A and the frame member 642. Therefore, in this embodiment, the frame member 642 is allowed to move in the front-to-back direction relative to the front plate body 641 in the front plate 640, and the frame member 642 is pressed against the flange 12A independently of the front plate body 641 by the fastening member 802. As a result, the seal 703 is appropriately compressed and elastically deformed, thereby achieving a proper seal. For example, by changing the tightness of the upper and lower fastening components 802, the seal 702 can be elastically deformed at the upper and lower parts with appropriate pressing pressure.

[0073] (Third sealing surface)

[0074] Furthermore, in the front panel 640, the front panel body 641 and the frame member 642 are sealed by an annular seal 703. A sealing surface 703A is formed between the outer peripheral surface of the front panel body 641, which holds the seal 703 and is positioned opposite each other, and the inner peripheral surface of the frame member 642, to seal the front panel body 641 and the frame member 642 (see reference). Figure 4 As a result, the plating tank 10 is properly sealed relative to the outside. The frame member 642 is fitted and mounted to the front panel body 641 with strength that prevents it from detaching from the front panel body 641. The seal 703 is, for example, disposed in an annular sealing groove that is provided all around the outer circumference of the front panel body 641. Alternatively, the seal 703 may be disposed in an annular sealing groove that is provided all around the inner circumference of the frame member 642.

[0075] (Cathode liquid path)

[0076] like Figure 7 and Figure 10As shown, in the anode retainer 610, a cathodic liquid passage 681 communicating with the cathodic liquid inlet 680 of the front plate 640 is provided in the lower part of the retainer body 620 / anode retainer 610. The cathodic liquid passage 681 has a portion of its thickness removed from the lower part of the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610, and is divided by the lower surface of the thin-walled portion of the annular portion 621 of the retainer body 620 / anode retainer 610, the front plate body 641, the bottom wall 613, and the side walls 614-617. The side walls 614 are arranged in a shape that follows the outer periphery of the diaphragm support portion 622. Figure 7 , Figure 10 One or more notches 614a are provided on the upper part of the side wall 614. Figure 7 The notch 614a forms the outlet of the catholyte passage 681. That is, the catholyte passage 681 has an inlet communicating with the catholyte inlet 680 and an outlet (notch 614a) opening above the diaphragm 50. The catholyte flowing in from the catholyte inlet 680 is supplied through the catholyte passage 681 and from the notch 614a to the area above the diaphragm support 622 (i.e., the cathode chamber Cc above the diaphragm 50).

[0077] like Figure 7 As shown, the catholyte inlet 680 is located at the bottom of the cathode chamber Cc, below the holder body 620 / anode holder 610, thus minimizing the amount of residual catholyte in the cathode chamber Cc. The bottom surface (bottom wall 613) of the catholyte passage 681 is also located below the anode fixing plate 62 and at the bottom of the cathode chamber Cc.

[0078] (Busbar)

[0079] A busbar 660 is disposed near the center in the width direction of the front panel 640 (front panel body 641). Figure 3 , Figure 5 ).like Figure 10 As shown, the busbar 660 extends rearward from the front plate 640 (front plate body 641) to near the center of the lower surface of the anode 60, for example, via a fastening member 805, which is electrically and mechanically connected to the boss 60A (terminal portion) near the center of the lower surface of the anode 60 and protrudes downward. The busbar 660 and the front plate 640 (front plate body 641) are sealed by a suitable seal (illustration omitted, see, for example, Patent Document 1). The fastening member 805 can be a bolt, screw, or any other arbitrary fastening member.

[0080] According to the above implementation method, the following effects are achieved.

[0081] (1) In the anode holder 610, the outer periphery of the diaphragm 50 can be properly sealed with the outer periphery of the holder body 620 / anode holder 610 by means of the seal 704.

[0082] (2) The outer periphery of the anode holder 610 can be properly sealed with the interior of the plating tank 10 by means of the sealing element 701, so that the interior of the plating tank 10 is divided into upper and lower chambers (anode chamber and cathode chamber).

[0083] (3) According to the above structures (1) and (2), by installing the anode holder 610 on the plating tank 10, the interior of the plating tank 10 can be divided and sealed into a cathode chamber and an anode chamber above and below the diaphragm 50.

[0084] (4) The front plate 640 of the anode holder 610 can be properly sealed with the periphery of the opening 12B of the plating tank 10 by means of the seal 702. At this time, the seal 702 can be appropriately elastically deformed by moving the frame member 642 of the front plate 640 in the front-rear direction.

[0085] (5) The frame component 642 of the front panel 640 and the front panel body 641 can be properly sealed by the seal 703.

[0086] (6) According to the structure of (4) and (5) above, the plating tank 10 can be properly sealed relative to the outside by installing the anode holder 610 on the plating tank 10.

[0087] (Other implementation methods)

[0088] (1) If the sealing element 704 can be used to liquidally seal the inside of the plating tank 10 relative to the outside by designing the structure of the sealing element 704 between the front panel 640 and the plating tank 10, the front panel body 641 and the frame member 642 can be integrated into the front panel 640 and the sealing element 703 can be omitted.

[0089] (2) In the above embodiment, a back panel 62 for adjusting the amount of gas accumulation is provided on the lower surface side of the anode 60. However, instead of the back panel 62, a bubble buffer ring provided in a manner that surrounds the anode 60 may be provided. The amount of bubbles generated from the anode and accumulated on the lower surface is adjusted by the height of the bubble buffer ring (International Publication No. 2023 / 188371).

[0090] At least the following methods can be grasped from the above implementation methods.

[0091] [1] According to one embodiment, a plating apparatus is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding a substrate with the plating surface facing downwards; and an anode holder assembly that is horizontally pullable and installable in the plating tank via an opening in the side wall of the plating tank, and having an anode holder having one or more openings in the center, an anode installed in the anode holder, and a diaphragm installed above the anode on the anode holder, the anode holder assembly having: one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers. For ease of explanation, the one or more sealing surfaces that seal the plating tank relative to the outside are sometimes referred to as sealing surfaces for sealing the plating tank, and the one or more sealing surfaces that divide the plating tank into upper and lower chambers are referred to as sealing surfaces for dividing the plating tank.

[0092] According to this method, in a downward-facing plating apparatus, the diaphragm and anode, which require regular maintenance, can be integrated with a freely retractable anode holder, thereby facilitating the maintenance of the diaphragm and anode. Specifically, the anode holder assembly, which holds the anode and diaphragm located at the bottom of the plating tank, can be removed from the plating tank, allowing for the replacement of the anode and diaphragm (including replacing the entire anode holder assembly) outside the plating tank.

[0093] According to this method, by installing the anode retainer assembly (anode retainer) into the plating tank, the interior of the plating tank can be sealed relative to the outside, and the interior of the plating tank can be divided into upper and lower chambers (anode chamber and cathode chamber). That is, the interior of the plating tank can be sealed relative to the outside through one or more sealing surfaces for sealing the plating tank, and the interior of the plating tank can be divided into upper and lower chambers (anode chamber and cathode chamber) through other one or more sealing surfaces for dividing the interior of the plating tank.

[0094] In addition, by installing the anode holder into the plating tank, the diaphragm is also installed into the plating tank, thus making the installation of the diaphragm into the plating tank easier.

[0095] [2] According to one method, one or more sealing surfaces that divide the plating tank into upper and lower chambers have: a first sealing surface that seals between the diaphragm and the anode holder; and a second sealing surface that seals between the outer periphery of the anode holder and the plating tank.

[0096] According to this method, before the anode retainer assembly is installed in the plating tank, the diaphragm is installed in a sealed state on the anode retainer. Therefore, when the anode retainer assembly is installed in the plating tank, if the outer periphery of the anode retainer is sealed with the plating tank, the plating tank can be divided into upper and lower chambers.

[0097] [3] In one embodiment, the diaphragm is mounted on the outer periphery of the anode holder via a first sealing member, and the first sealing surface is formed between the outer periphery of the diaphragm and the outer periphery of the anode holder.

[0098] According to this method, the diaphragm and the anode holder can be sealed with a simple structure.

[0099] [4] According to one method, the plating tank has a first flange having a lower surface exposed in the space inside the plating tank, and the anode holder has a second flange disposed on the upper part of the outer periphery. The anode holder is mounted on the lower surface of the first flange of the plating tank via an annular second sealing member on the upper surface of the second flange, and the second sealing surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating tank.

[0100] According to this method, the anode holder and the plating tank can be reliably sealed throughout the entire circumference via the vertically opposing surfaces of the anode holder and the plating tank. Thus, regardless of the sealing surface blocking the openings in the sidewalls of the plating tank, a reliable seal can be maintained throughout the entire circumference between the anode holder and the plating tank.

[0101] [5] In one embodiment, the second flange of the anode holder is mounted to the first flange of the plating tank by one or more fastening members, and the second sealing member is configured to elastically deform between the first flange and the second flange by fastening the fastening members.

[0102] According to this method, the outer periphery of the anode holder can be fixed in a predetermined position within the plating tank by one or more fastening components, and the second sealing component can be elastically deformed to reliably seal the outer periphery of the anode holder with the plating tank.

[0103] [6] In one manner, one or more sealing surfaces in the plating tank that are sealed to the outside have a third sealing surface that seals the anode holder around the opening of the plating tank.

[0104] According to this method, the inside of the plating tank can be sealed relative to the outside around the opening in the side wall of the plating tank for inserting the anode retainer assembly.

[0105] [7] According to one embodiment, the anode holder has a front plate disposed at one end and sealing the opening of the plating tank. The front plate has: a front plate body; and a frame member slidably fitted around the front plate body. The frame member is mounted via a third seal to a side wall surrounding the opening of the plating tank or to a third flange disposed around the opening of the plating tank. A third sealing surface is formed between the frame member and the side wall surrounding the opening of the plating tank or the third flange disposed around the opening of the plating tank. The frame member is fitted to the front plate body via a fourth seal, and a fourth sealing surface is formed between the inner circumferential surface of the frame member and the outer circumferential surface of the front plate body. When the third flange is provided, the third flange becomes part of the plating tank.

[0106] According to this method, even if the third sealing member shifts due to vertical force, the frame member can still be pressed against the sidewall / third flange of the plating tank in the front-rear direction, and the third sealing member can reliably perform a sealing function by appropriately elastically deforming between the plating tank and the frame member. Thus, the plating tank and the frame member can be reliably sealed by the third sealing member. Furthermore, the front panel body and the frame member can be sealed by the fourth sealing member. As a result, the inside of the plating tank can be reliably sealed relative to the outside.

[0107] [8] In one embodiment, the frame member is mounted to the sidewall surrounding the opening of the plating tank or to the third flange provided around the opening of the plating tank by one or more fastening members, and the third sealing member is configured to elastically deform between the frame member and the sidewall or the third flange by fastening the fastening members.

[0108] According to this method, the front plate can be mounted to the side wall of the plating tank by one or more fastening components, and the third sealing component can be deformed to reliably seal the opening of the plating tank with the front plate.

[0109] [9] In one embodiment, the fourth sealing member is configured to elastically deform between the frame member and the front panel body by fitting the frame member into the front panel body.

[0110] According to this method, by fitting the frame component into the front panel body, the fourth sealing component can be elastically deformed to reliably seal the frame component and the front panel body.

[0111]

[10] According to one embodiment, the anode holder has: an outer peripheral portion; and a diaphragm support portion having a plurality of openings on the inner side of the outer peripheral portion to support the upper surface of the diaphragm.

[0112] According to this method, the upper surface of the diaphragm can be properly pressed by the diaphragm support of the anode holder, which can suppress the diaphragm from bending upward.

[0113]

[11] According to one method, the plurality of openings of the diaphragm support portion have: a plurality of first-shaped openings; and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, wherein the center of the circumcircle of the plurality of first-shaped openings is eccentric from the rotation center of the substrate holder.

[0114] According to this method, the center of the pattern of the diaphragm support is off-center from the rotation center / rotation center axis of the substrate, thus suppressing the shape of the pattern of the diaphragm support transferred by the coated film and improving the uniformity of the film thickness of the coated film.

[0115]

[12] According to one method, the structure consisting of the above-mentioned plurality of openings of the first shape is a honeycomb structure.

[0116] According to this method, the diaphragm support portion can provide sufficient strength to support the central portion of the diaphragm, where the likelihood of increased bending is high, and ensure a larger opening area. That is, it can suppress diaphragm bending and suppress the influence on the electric field between the substrate and the anode.

[0117]

[13] In one manner, the plurality of second-shaped openings are formed between a plurality of beams that extend radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

[0118] According to this method, the required support strength can be ensured in the area near the outer periphery of the diaphragm where the possibility of bending and enlargement is low, and a larger opening area can be ensured.

[0119]

[14] According to one method, the anode is a plate-shaped component having a plurality of through holes and is disposed close to the lower surface of the diaphragm. The plating apparatus further includes a back panel spaced a predetermined distance below the anode, and the amount of gas generated from the anode remaining on the lower surface of the anode is adjusted by the back panel.

[0120] According to this method, the anode and diaphragm are in close contact with each other, thus suppressing the height dimension of the anode retainer assembly that integrates the anode and diaphragm, and compactly forming the anode retainer assembly.

[0121] This method, with the anode tightly attached to the diaphragm, suppresses or prevents the accumulation of gas volume between the diaphragm and the anode, thus suppressing or preventing the electric field between the anode and the substrate from being affected by the gas and impacting the uniformity of the deposited film thickness. Furthermore, the amount of gas trapped on the lower surface through the multiple through-holes of the anode can be adjusted using the back panel, suppressing or preventing large amounts of gas from simultaneously escaping from the lower surface of the anode and causing fluctuations in the anode voltage. Therefore, it is possible to suppress or prevent a decrease in the uniformity of the deposited film thickness.

[0122]

[15] In one embodiment, the anode holder has a cathode liquid inlet for supplying a plating solution, which is a cathode liquid, to the cathode chamber.

[0123] According to this method, the catholyte inlet is located in the anode holder, thus enabling a more compact structure for the plating tank.

[0124]

[16] In one embodiment, the cathode liquid inlet is positioned below the diaphragm, and a cathode liquid passage is provided in the anode holder, the cathode liquid passage having an inlet communicating with the cathode liquid inlet positioned below the diaphragm and an outlet opening above the diaphragm.

[0125] According to this method, the catholyte inlet is located below the diaphragm and at the bottom of the cathode chamber, thus minimizing the residual catholyte in the cathode chamber. Furthermore, by introducing the catholyte from the bottom of the anode holder and supplying it to the top of the diaphragm (cathode chamber), a sealing surface for the plating tank can be easily formed on the upper part of the outer periphery of the anode holder. This structure allows for a simple formation of the sealing surface between the outer periphery of the anode holder and the plating tank, easily ensuring sufficient volume of the anode chamber.

[0126]

[17] In one embodiment, the plating apparatus further comprises a variable anode cover disposed above the diaphragm.

[0127] According to this method, the variable anode cover can also be integrated with the pull-out anode holder, making the maintenance of the variable anode cover easier.

[0128]

[18] According to one approach, a method is provided for dividing a plating tank into an anode chamber and a cathode chamber, comprising the steps of: preparing an anode holder, the anode holder having an anode and a diaphragm mounted thereon, and having one or more sealing surfaces for sealing the plating tank relative to the outside, and one or more sealing surfaces for dividing the plating tank into upper and lower chambers; and installing the anode holder in the plating tank through an opening in the side wall of the plating tank, blocking the opening of the plating tank with the anode holder to seal the plating tank relative to the outside, and dividing the plating tank into the anode chamber and the cathode chamber above and below the diaphragm.

[0129] [A1] According to one method, a plating apparatus is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding a substrate with the plating surface facing down; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support portion that presses against the upper surface of the diaphragm, having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, wherein the center of the circumcircle including the plurality of first-shaped openings is eccentric from the rotation center of the substrate holder.

[0130] According to this method, the center of the pattern of the diaphragm support is off-center from the rotation center / rotation center axis of the substrate, thus suppressing the shape of the pattern of the diaphragm support transferred by the coated film and improving the uniformity of the film thickness.

[0131] [A2] According to one method, the structure consisting of the above-mentioned multiple openings of the first shape is a honeycomb structure.

[0132] According to this method, the diaphragm support portion can provide sufficient strength to support the central portion of the diaphragm, where the likelihood of increased bending is high, and ensure a larger opening area. That is, it can suppress diaphragm bending and suppress the influence on the electric field between the substrate and the anode.

[0133] [A3] In one manner, the aforementioned plurality of second-shaped openings are formed between a plurality of beams that extend radially from the apex of the outermost periphery of the aforementioned honeycomb structure to the outer periphery.

[0134] According to this method, the required support strength can be ensured in the area near the outer periphery of the diaphragm where the possibility of bending and enlargement is low, and a larger opening area can be ensured.

[0135] [A4] According to one method, the anode is a plate-shaped component having a plurality of through holes and is disposed close to the lower surface of the diaphragm. The plating apparatus further includes a back panel spaced a predetermined distance below the anode, through which the amount of gas generated from the anode is retained on the lower surface of the anode is adjusted.

[0136] According to this method, the anode and diaphragm are in close contact with each other, thus suppressing the height dimension of the anode retainer assembly that integrates the anode and diaphragm, and compactly forming the anode retainer assembly.

[0137] This method involves a structure where the anode is tightly attached to the diaphragm. Therefore, it can suppress or prevent the accumulation of gas volume generated at the anode between the diaphragm and the anode, and can suppress or prevent the electric field between the anode and the substrate from being affected by the gas, thus ensuring the uniformity of the deposited film thickness. Furthermore, the amount of gas trapped on the lower surface through the multiple through-holes of the anode can be adjusted via the back panel, suppressing or preventing a large amount of gas from simultaneously escaping from the lower surface of the anode and causing fluctuations in the anode voltage. Thus, it is possible to suppress or prevent a decrease in the uniformity of the deposited film thickness.

[0138] [A5] In one embodiment, the plating apparatus further comprises a variable anode cover disposed above the diaphragm.

[0139] According to this method, the exposed area of ​​the anode can be adjusted by using a variable anode cover, thereby improving the uniformity of the coating thickness.

[0140] [A6] A plating method is provided, which is a plating method for plating a substrate with the plating surface facing down, comprising the following steps: preparing a plating tank having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, and a diaphragm support portion having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings; and rotating the substrate and plating the substrate in a state where the rotation center of the substrate is eccentric from the center of the circumcircle of the plurality of first-shaped openings including the diaphragm support portion.

[0141] According to this method, the center of the pattern of the diaphragm support is off-center from the rotation center / rotation center axis of the substrate, thus suppressing the shape of the pattern of the diaphragm support transferred by the coated film and improving the uniformity of the film thickness.

[0142] The embodiments of the present invention have been described above. However, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be modified and improved without departing from its spirit, and the present invention naturally includes its equivalents. Furthermore, within the scope of solving at least a portion of the above-described problems or achieving at least a portion of the effects, any combination of embodiments and modifications is possible, and any combination or omission of the constituent elements described in the claims and specification is possible.

[0143] The entire disclosures, including the description, claims, drawings and abstracts of International Publication No. 2023 / 079684 (Patent Document 1) and International Publication No. 2023 / 188371, are incorporated herein by reference.

[0144] Explanation of reference numerals in the attached figures

[0145] 6...Anode retainer assembly; 10...Plating tank; 11...Upper tank; 12...Lower tank; 12A...Flange; 12B...Opening; 12C...Anode liquid inlet; 12D...Flange; 20...Substrate retainer; 30...Blade; 40...Impeding body; 50...Diaphragm; 51...Sealing pressing ring; 60...Anode; 60A...Boss; 62...Anode fixing plate; 400...Plating module; 610...Anode retainer; 613...Bottom wall; 614~617...Side walls; 614a...Notch; 620...Retainer body; 621...Annular part; 622...Diaphragm support part; 622A...Beam; 622B... 623...Flange; 640...Front plate; 641...Front plate body; 642...Frame component; 650...Variable anode cover; 651...Blade; 652...Drive component; 660...Busbar; 670...Drive shaft; 671...Connecting component; 680...Cathode liquid inlet; 681...Cathode liquid passage; 701~704...Seal; 701A~704A...Sealing surface; 801~805...Fastening component; 804A...Isolator; 810...Diaphragm pressing component; 1000...Plating device; Rm...Circumscribed circle; Cm...Center of circumscribed circle; Cw...Rotation center (rotation center axis); Wf...Substrate.

Claims

1. A plating apparatus, wherein, have: A plating tank is used to hold the plating solution. A substrate holder holds the substrate with the plated surface facing down. as well as An anode holder assembly is horizontally pullable and mounted in the plating tank via an opening in the side wall of the plating tank, and includes an anode holder with one or more openings in the center, an anode mounted on the anode holder, and a diaphragm mounted above the anode on the anode holder. The anode retainer assembly includes: one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers. One or more sealing surfaces that divide the plating tank into upper and lower chambers have: a first sealing surface that seals between the diaphragm and the anode holder; and a second sealing surface that seals between the outer periphery of the anode holder and the plating tank.

2. The plating apparatus according to claim 1, wherein, The diaphragm is mounted on the outer periphery of the anode holder via a first sealing member at the outer periphery of the diaphragm, and a first sealing surface is formed between the outer periphery of the diaphragm and the outer periphery of the anode holder.

3. The plating apparatus according to claim 1, wherein, The plating tank has a first flange, and the first flange has a lower surface exposed within the space of the plating tank. The anode holder has a second flange located on the upper part of the outer periphery. The anode holder is mounted on the upper surface of the second flange to the lower surface of the first flange of the plating tank via an annular second sealing member. A second sealing surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating tank.

4. The plating apparatus according to claim 3, wherein, The second flange of the anode holder is mounted to the first flange of the plating tank by one or more fastening components, and the second sealing component is configured to elastically deform between the first flange and the second flange by fastening the fastening components.

5. The plating apparatus according to any one of claims 1 to 4, wherein, The anode holder has: an outer periphery; and a diaphragm support portion disposed on the inner side of the outer periphery, having a plurality of openings, and supporting the upper surface of the diaphragm.

6. The plating apparatus according to claim 5, wherein, The plurality of openings in the diaphragm support portion have: a plurality of openings of a first shape; and a plurality of openings of a second shape, disposed outside the plurality of openings of the first shape. The center of the circumscribed circle containing the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

7. The plating apparatus according to claim 6, wherein, The structure formed by the plurality of openings of the first shape is a honeycomb structure.

8. The plating apparatus according to claim 7, wherein, The plurality of second-shaped openings are formed between a plurality of beams that extend radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

9. The plating apparatus according to claim 5, wherein, The anode is a plate-shaped component with multiple through holes and is disposed in close contact with the lower surface of the diaphragm. The plating apparatus further includes a back panel spaced at a predetermined distance below the anode. The amount of gas generated from the anode that remains on the lower surface of the anode is adjusted by the back panel.

10. The plating apparatus according to any one of claims 1 to 4, wherein, The anode holder has a cathodic liquid inlet for supplying the plating liquid, which is a cathodic liquid, to the cathode chamber of the plating tank.

11. The plating apparatus according to claim 10, wherein, The cathode liquid inlet is located below the diaphragm. The anode holder is provided with a catholyte passage having an inlet communicating with the catholyte inlet located below the diaphragm, and an outlet opening above the diaphragm.

12. The plating apparatus according to any one of claims 1 to 4, wherein, The plating apparatus further includes a variable anode cover disposed above the diaphragm.

13. A plating apparatus, wherein, have: A plating tank is used to hold the plating solution. A substrate holder holds the substrate with the plated surface facing down. as well as An anode holder assembly is horizontally pullable and mounted in the plating tank via an opening in the side wall of the plating tank, and includes an anode holder with one or more openings in the center, an anode mounted on the anode holder, and a diaphragm mounted above the anode on the anode holder. The anode retainer assembly includes: one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers. One or more sealing surfaces within the plating tank, relative to the external seal, have a third sealing surface that seals the anode holder around the opening of the plating tank. The anode holder has a front plate disposed at one end and sealing the opening of the plating tank. The front plate has: a front plate body; and a frame member that slides freely around the front plate body. The frame component is mounted to the sidewall surrounding the opening of the plating tank or to a third flange disposed around the opening of the plating tank via a third sealing component. A third sealing surface is formed between the frame component and the sidewall surrounding the opening of the plating tank or the third flange disposed around the opening of the plating tank. The frame component is fitted into the front panel body via a fourth sealing component, and a fourth sealing surface is formed between the inner peripheral surface of the frame component and the outer peripheral surface of the front panel body.

14. The plating apparatus according to claim 13, wherein, The frame component is mounted to the sidewall surrounding the opening of the plating tank or to the third flange disposed around the opening of the plating tank by one or more fastening components, and the third sealing component is configured to elastically deform between the frame component and the sidewall or the third flange by fastening the fastening components.

15. The plating apparatus according to claim 13, wherein, The fourth sealing member is configured to elastically deform between the frame member and the front panel body by fitting the frame member into the front panel body.

16. The plating apparatus according to any one of claims 13 to 15, wherein, The anode holder has: an outer periphery; and a diaphragm support portion disposed on the inner side of the outer periphery, having a plurality of openings, and supporting the upper surface of the diaphragm.

17. The plating apparatus according to claim 16, wherein, The plurality of openings in the diaphragm support portion have: a plurality of openings of a first shape; and a plurality of openings of a second shape, disposed outside the plurality of openings of the first shape. The center of the circumscribed circle containing the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

18. The plating apparatus according to claim 17, wherein, The structure formed by the plurality of openings of the first shape is a honeycomb structure.

19. The plating apparatus according to claim 18, wherein, The plurality of second-shaped openings are formed between a plurality of beams that extend radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

20. The plating apparatus according to claim 16, wherein, The anode is a plate-shaped component with multiple through holes and is disposed in close contact with the lower surface of the diaphragm. The plating apparatus further includes a back panel spaced at a predetermined distance below the anode. The amount of gas generated from the anode that remains on the lower surface of the anode is adjusted by the back panel.

21. The plating apparatus according to any one of claims 13 to 15, wherein, The anode holder has a cathodic liquid inlet for supplying the plating liquid, which is a cathodic liquid, to the cathode chamber of the plating tank.

22. The plating apparatus according to claim 21, wherein, The cathode liquid inlet is located below the diaphragm. The anode holder is provided with a catholyte passage having an inlet communicating with the catholyte inlet located below the diaphragm, and an outlet opening above the diaphragm.

23. The plating apparatus according to any one of claims 13 to 15, wherein, The plating apparatus further includes a variable anode cover disposed above the diaphragm.

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