Multi-dimensional cooperative feeding system of wafer chamfering equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing equipment, and discloses a multi-dimensional cooperative feeding system of wafer chamfering equipment. According to the multi-axis linkage air floating rotary table device, the base assembly is included, the multi-axis motion unit is installed on the upper surface of the base assembly, the real-time monitoring and feedback system is installed at the upper end of the multi-axis motion unit, complex curvilinear motion trail control is achieved through four-axis linkage of the X axis, the Y axis, the Z axis and the rotating shaft, diversified machining requirements are met, and the air floating rotary table unit is connected with the rotating shaft and a wafer; the wafer jumping is greatly reduced to guarantee the machining precision, precise positioning is achieved by means of a high-precision ball screw and a linear guide rail, the influence of vibration on the precision is remarkably reduced by combining a casting structure and an active vibration reduction algorithm, the visual detection module and the vibration monitoring module are deeply integrated, real-time monitoring and dynamic adjustment in the machining process are achieved, the yield is effectively increased, and the machining efficiency is improved. The overall design comprehensively improves the precision, stability and efficiency of wafer chamfering machining, and the high-precision machining requirement of large-size wafers is met.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, specifically a multi-dimensional collaborative feeding system for wafer chamfering equipment. Background Art

[0002] In semiconductor wafer fabrication, the chamfering process is a crucial step connecting wafer dicing and subsequent packaging. Its quality directly impacts the overall performance and yield of the wafer. After dicing, wafers often have sharp edges and microcracks. If these defects are not addressed promptly, they can easily lead to edge breakage during subsequent processes such as cleaning, coating, and photolithography due to external forces or thermal stress changes. This not only results in material loss but can also generate debris that contaminates other wafers, causing batch quality issues. Precise chamfering creates a smooth, curved surface or a bevel at a specific angle on the wafer edge. This eliminates stress concentration points, effectively preventing edge breakage, and optimizes the fit between the wafer and the packaging substrate, improving the sealing and stability of subsequent packaging processes. This provides a fundamental guarantee for the electrical performance and reliability of the chip.

[0003] For large-size wafers (such as 12 inches and above), the chamfering process is even more crucial. The manufacturing process for large-size wafers is complex and costly; even minute deviations in edge quality can render the entire wafer unusable, resulting in significant economic losses. Furthermore, as semiconductor devices evolve towards higher density and integration, stringent requirements are placed on parameters such as wafer edge flatness and angle accuracy. The precision of the chamfering process directly affects the edge alignment accuracy of subsequent photolithography patterns and the consistency of the device's electrical performance. Therefore, the chamfering process is not only a step in shaping the physical morphology of the wafer but also one of the core processes ensuring the quality and reliability of semiconductor devices. Its technical level directly reflects the precision machining capabilities of semiconductor manufacturing equipment.

[0004] In existing technologies, traditional wafer chamfering machine feed mechanisms typically only achieve single-dimensional or limited multi-dimensional motion control, which is insufficient to meet the increasingly demanding high-precision processing requirements of large-size wafers. Some machines use single-axis feed methods, making it impossible to achieve complex chamfering path planning. While some machines have multi-axis linkage capabilities, insufficient motion precision control leads to unstable edge quality of the processed wafers. Furthermore, existing equipment has deficiencies in vibration resistance design, real-time monitoring, and feedback control, resulting in reduced processing accuracy. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned deficiencies in vibration resistance design, real-time monitoring, and feedback control that lead to reduced processing accuracy, by providing a multi-dimensional collaborative feeding system for wafer chamfering equipment.

[0006] The technical solution adopted by the present invention is as follows: A multi-dimensional cooperative feeding system for a wafer chamfering device, including a base component, on the upper surface of which a multi-axis motion unit is installed. At the upper end of the multi-axis motion unit, a real-time monitoring and feedback system is installed. At the lower end of the multi-axis motion unit, an X-axis feeding unit is provided. At the upper end of the X-axis feeding unit, a Y-axis feeding unit is provided. At the upper end of the Y-axis feeding unit, a Z-axis feeding unit is installed. On one side of the Z-axis feeding unit, a rotating shaft unit is installed. At the upper end of the rotating shaft unit, an air-floating turntable unit is installed. On the upper surface of the air-floating turntable unit, a wafer is placed. At the upper end of the real-time monitoring and feedback system, a vision detection module is provided. On both sides of the lower end of the real-time monitoring and feedback system, vibration monitoring modules are provided.

[0007] By adopting the above technical solution, this design realizes the control of complex curve motion trajectories through the four-axis linkage of the X, Y, Z axes and the rotating shaft, meets diverse processing requirements. The air-floating turntable unit connects the rotating shaft and the wafer, significantly reducing the wafer jump to ensure processing accuracy. With the help of high-precision ball screws and linear guides, precise positioning is achieved. Combining the casting structure with the active vibration damping algorithm significantly reduces the impact of vibration on accuracy. The vision detection module and the vibration monitoring module are deeply integrated to realize real-time monitoring and dynamic adjustment during the processing, effectively improving the yield rate. The overall design comprehensively improves the accuracy, stability and efficiency of wafer chamfering processing, and adapts to the high-precision processing requirements of large-size wafers.

[0008] In a preferred embodiment, the base component is cast from gray cast iron material and has a "rice" - shaped rib plate structure inside.

[0009] By adopting the above technical solution, this design can effectively suppress the vibration generated during the processing, significantly enhancing the overall stability of the mechanism, providing a solid foundation for the precise operation of the multi-axis motion unit, thus reducing the interference of vibration on the accuracy of wafer chamfering processing, ensuring the stability and reliability of the processing process, and helping to meet the high-precision processing requirements of large-size wafers.

[0010] In a preferred embodiment, the rotating shaft unit is driven by a high-precision hollow rotary motor or a DD motor.

[0011] By adopting the above technical solution, it can achieve 360° rotation of the wafer, meeting the requirements for multi-angle adjustment of the wafer in complex chamfering paths. At the same time, its real-time adjustment function in cooperation with the vision detection module can timely correct the position deviation during rotation, further ensuring the accuracy of wafer chamfering processing, effectively improving the consistency of the quality of the wafer edge after processing, and adapting to the high-precision processing requirements of large-size wafers.

[0012] In a preferred embodiment, the air-bearing turntable unit is connected to the rotating shaft unit and the ceramic suction cup, and the wafer is adsorbed on the upper surface of the ceramic suction cup.

[0013] By adopting the above technical solution, the air flotation technology greatly reduces the movement of the wafer during the processing, effectively avoiding processing deviations caused by wafer shaking, thereby significantly improving the accuracy and stability of wafer chamfering, ensuring that the edge quality of the processed wafer meets high precision requirements, and providing a reliable guarantee for high-quality processing of large-size wafers.

[0014] In a preferred embodiment, the visual inspection module employs a high-precision camera and a deep learning algorithm to monitor the processing status of the wafer edge in real time.

[0015] By adopting the above technical solution, the processing status of the wafer edge can be monitored in real time, and the positional deviation that occurs during the processing can be dynamically corrected through real-time position compensation. This effectively ensures the processing accuracy of the wafer chamfer, reduces wafer edge quality problems caused by positional errors, improves the processing yield, and meets the requirements of high-precision processing for large-size wafers.

[0016] In a preferred embodiment, the vibration monitoring module comprises a plurality of acceleration sensors mounted on the surfaces of the base assembly and the multi-axis motion unit.

[0017] By adopting the above technical solution, vibration signals can be collected in real time, and the vibration generated during the working process can be effectively suppressed by the active vibration reduction algorithm. This can significantly reduce the adverse effects of vibration on the processing accuracy, thereby ensuring the accuracy of wafer chamfering, improving the stability of wafer edge quality after processing, and meeting the high-precision processing requirements of large-size wafers.

[0018] In a preferred embodiment, the motion unit in the multi-axis motion unit adopts a modular quick-release design.

[0019] By adopting the above technical solutions, the motion modules of the motion unit can be quickly disassembled and replaced, which can significantly reduce equipment maintenance time and improve equipment maintainability. At the same time, it supports the arrangement of multiple motion units, and can realize the dual-station, triple-station and multi-station design of the chamfering machine, effectively improving processing efficiency and thus increasing factory capacity.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0021] In this invention, complex curve motion trajectory control is achieved through four-axis linkage of X, Y, Z axes and rotation axis to meet diverse processing needs. The air-floating turntable unit connects the rotation axis and the wafer, significantly reducing wafer runout to ensure processing accuracy. High-precision ball screws and linear guides are used to achieve precise positioning. Combined with the casting structure and active vibration reduction algorithm, the impact of vibration on accuracy is significantly reduced. The vision inspection module and vibration monitoring module are deeply integrated to achieve real-time monitoring and dynamic adjustment of the processing process, effectively improving yield. The overall design comprehensively improves the accuracy, stability and efficiency of wafer chamfering, and is suitable for the high-precision processing needs of large-size wafers. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the multi-dimensional collaborative feeding mechanism in this invention;

[0023] Figure 2 This is a schematic diagram of the planar structure of the base assembly in this invention;

[0024] Figure 3 This is a schematic diagram of the planar structure of the multi-axis motion unit in this invention;

[0025] Figure 4 This is a schematic diagram of the planar structure of the real-time monitoring and feedback system in this invention.

[0026] The diagram is labeled as follows: 1. Base assembly; 2. Multi-axis motion unit; 3. Real-time monitoring and feedback system; 4. Wafer; 201. X-axis feed unit; 202. Y-axis feed unit; 203. Z-axis feed unit; 204. Rotary axis unit; 205. Air-bearing turntable unit; 301. Vision inspection module; 302. Vibration monitoring module. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Reference Figure 1-4A multi-dimensional collaborative feeding system for a wafer chamfering apparatus includes a base assembly 1. A multi-axis motion unit 2 is mounted on the upper surface of the base assembly 1. A real-time monitoring and feedback system 3 is mounted on the upper end of the multi-axis motion unit 2. An X-axis feed unit 201 is located at the lower end of the multi-axis motion unit 2. A Y-axis feed unit 202 is located above the X-axis feed unit 201. A Z-axis feed unit 203 is mounted above the Y-axis feed unit 202. A rotary axis unit 204 is mounted on one side of the Z-axis feed unit 203. An air-bearing turntable unit 205 is mounted on the upper end of the rotary axis unit 204. A wafer 4 is placed on the upper surface of the air-bearing turntable unit 205. A vision inspection module 301 is located on the upper end of the real-time monitoring and feedback system 3. Vibration monitoring modules 302 are installed on both sides of the lower end of the measurement and feedback system 3. This design achieves complex curve motion trajectory control through four-axis linkage of X, Y, Z axes and rotary axis to meet diverse processing needs. The air-floating turntable unit 205 connects the rotary axis and the wafer, greatly reducing wafer runout to ensure processing accuracy. High-precision ball screws and linear guides are used to achieve precise positioning. Combined with the casting structure and active vibration reduction algorithm, the impact of vibration on accuracy is significantly reduced. The vision inspection module 301 and the vibration monitoring module 302 are deeply integrated to realize real-time monitoring and dynamic adjustment of the processing process, effectively improving the yield. The overall design comprehensively improves the accuracy, stability and efficiency of wafer 4 chamfering, and is suitable for the high-precision processing needs of large-size wafer 4.

[0029] Reference Figure 1-2 The base assembly 1 is made of gray cast iron and has an internal "rice" shaped rib structure. This design can effectively suppress the vibration generated during the processing, significantly enhance the overall stability of the mechanism, and provide a solid foundation for the precise operation of the multi-axis motion unit 2. This reduces the interference of vibration on the chamfering accuracy of the wafer 4, ensures the stability and reliability of the processing process, and helps to achieve the high-precision processing requirements of large-size wafer 4.

[0030] Reference Figure 3 The rotating axis unit 204 is driven by a high-precision hollow rotary motor or DD motor, which can achieve 360° rotation of the wafer, meeting the needs of multi-angle adjustment of the wafer 4 for complex chamfering paths. At the same time, its real-time adjustment function, in conjunction with the vision inspection module 301, can correct the positional deviation that occurs during the rotation in a timely manner, further ensuring the accuracy of the wafer 4 chamfering process, effectively improving the consistency of the edge quality of the wafer 4 after processing, and adapting to the high-precision processing requirements of large-size wafer 4.

[0031] Reference Figure 3The air-floating turntable unit 205 connects the rotating shaft unit and the ceramic chuck. The wafer 4 is adsorbed on the upper surface of the ceramic chuck. The air-floating technology greatly reduces the jitter of the wafer 4 during the processing, effectively avoiding processing deviations caused by the wobbling of the wafer 4. This significantly improves the accuracy and stability of the chamfering process of the wafer 4, ensuring that the edge quality of the processed wafer 4 meets the high-precision requirements, and providing a reliable guarantee for the high-quality processing of large-size wafers 4.

[0032] Reference Figure 4 The vision inspection module 301 uses a high-precision camera and deep learning algorithm to monitor the processing status of the wafer 4 edge in real time. It can monitor the processing status of the wafer edge in real time and dynamically correct the position deviation that occurs during the processing by real-time position compensation. This effectively ensures the processing accuracy of the wafer 4 chamfer, reduces wafer 4 edge quality problems caused by position errors, improves the processing yield, and meets the high-precision processing requirements of large-size wafers 4.

[0033] Reference Figure 4 The vibration monitoring module 302 consists of multiple acceleration sensors. The acceleration sensors are installed on the surfaces of the base assembly 1 and the multi-axis motion unit 2. It can collect vibration signals in real time and effectively suppress the vibration generated during operation by means of an active vibration reduction algorithm. This can significantly reduce the adverse effects of vibration on the processing accuracy, thereby ensuring the accuracy of the chamfering of wafer 4, improving the stability of the edge quality of wafer 4 after processing, and meeting the high-precision processing requirements of large-size wafer 4.

[0034] Reference Figure 1 The motion unit in the multi-axis motion unit 2 adopts a modular quick-release design, and each motion module of the motion unit can be quickly disassembled and replaced, which can significantly reduce equipment maintenance time and improve equipment maintainability. At the same time, it supports the arrangement of multiple motion units, which can realize the chamfering machine dual-station, triple-station and multi-station design, effectively improve processing efficiency, and thus increase factory capacity.

[0035] The implementation principle of the multi-dimensional collaborative feeding system for a wafer chamfering device according to the present invention is as follows:

[0036] This invention utilizes a multi-axis linkage collaborative feed mechanism to precisely adjust the position and angle of wafer 4. It combines sensor feedback for real-time compensation and an active vibration reduction algorithm to suppress processing vibrations in real time, thereby ensuring edge chamfering accuracy and surface quality during high-speed chamfering of wafer 4. During operation, the vision inspection module 301 identifies the notch position, and the X and Y feed units are adjusted to align the center of wafer 4 with the processing coordinate system. Based on the material and chamfering requirements of wafer 4, parameters such as position path, feed speed of each axis, and rotational speed are input into the control system. By controlling the Z-axis height to the grinding wheel groove height, the air-bearing turntable unit 205 supplies air, and the rotary axis unit drives the wafer 4 to rotate. Simultaneously, the X and Y axes move along a set path to achieve wafer 4 chamfering. During the chamfering process, the vision inspection module 301 detects the chamfering process, and the control system adjusts the feed parameters in real time based on the detection results. Vibration monitoring is also used to control the process. The real-time feedback data from the measurement module 302 enables the active vibration reduction system to dynamically suppress vibration. In addition, the real-time monitoring and feedback system 3 can predict vibration characteristics in advance based on historical processing data and process parameters, generate an inverse compensation signal, and drive the servo motor of the feed mechanism to perform micro-displacement compensation. For example, when the wafer 4 is radially fed, a small displacement opposite to the vibration is superimposed. Through the PID adaptive algorithm, the vibration compensation amount is calculated in real time, and the actuator, such as the piezoelectric ceramic driver or servo motor, is controlled to add torque to generate a force or displacement opposite to the original vibration, thus offsetting the vibration effect. The control system in this design uses a PLC and motion control card, integrating multi-axis motion algorithms, which can perform complex multi-axis linkage control and realize complex curved motion trajectory control. At the same time, based on visual detection and vibration monitoring data, the feed parameters are dynamically adjusted to achieve more precise position control, speed control, and torque control, ensuring the accuracy of chamfering.

[0037] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-dimensional collaborative feeding system for a wafer chamfering apparatus, comprising a base assembly (1), characterized in that: The upper surface of the base component (1) is equipped with a multi-axis motion unit (2). The upper end of the multi-axis motion unit (2) is equipped with a real-time monitoring and feedback system (3). The lower end of the multi-axis motion unit (2) is provided with an X-axis feeding unit (201). The upper end of the X-axis feeding unit (201) is provided with a Y-axis feeding unit (202). The upper end of the Y-axis feeding unit (202) is equipped with a Z-axis feeding unit (203). One side of the Z-axis feeding unit (203) is equipped with a rotating shaft unit (204). The upper end of the rotating shaft unit (204) is equipped with an air-floating turntable unit (205). A wafer (4) is placed on the upper surface of the air-floating turntable unit (205). The upper end of the real-time monitoring and feedback system (3) is provided with a vision detection module (301). On both sides of the lower end of the real-time monitoring and feedback system (3), vibration monitoring modules (302) are provided.

2. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The base component (1) is cast from gray cast iron material and has a "rice" - shaped ribbed plate structure inside.

3. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The rotating shaft unit (204) is driven by a high-precision hollow rotary motor or a DD motor.

4. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The air-floating turntable unit (205) connects the rotating shaft unit and a ceramic suction cup, and the wafer (4) is adsorbed on the upper surface of the ceramic suction cup.

5. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The vision detection module (301) uses a high-precision camera and a deep learning algorithm to monitor the processing state of the edge of the wafer (4) in real time.

6. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The vibration monitoring module (302) consists of multiple acceleration sensors, and the acceleration sensors are installed on the surfaces of the base component (1) and the multi-axis motion unit (2).

7. The multi-dimensional collaborative feeding system for a wafer chamfering apparatus as described in claim 1, characterized in that: The motion units in the multi-axis motion unit (2) adopt a modular quick-release design.

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