Hydrogen peroxide etching solution

Abstract

The invention relates to the technical field of etching solutions, in particular to a hydrogen peroxide etching solution which comprises the following components in percentage by mass: 1-20% of hydrogen peroxide, 1-20% of acid and salt thereof, 1-10% of an alcoholic hydroxyl group-containing stabilizer, 10-40% of an ether bond-containing wetting agent, 0.005-2% of an azole additive and the balance of deionized water. Compared with the prior art, the stable etching solution provided by the invention can effectively stabilize hydrogen peroxide in etching, maintain etching performance and effectively reduce the risk of metal residue, does not generate foam, and has better application in the field of semiconductor packaging.

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