Hyperfine circuit film stripping liquid and preparation method thereof
CN120844092AActive Publication Date: 2025-10-28SHENZHEN TIANXI SCI DEV CO LTD
Patent Information
- Application Number
- CN202510977489.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-16
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2045-07-16
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Abstract
The invention discloses a hyperfine circuit film stripping liquid and a preparation method thereof, and belongs to a printed circuit board. The hyperfine line film stripping liquid is characterized by comprising composite alkali, a corrosion inhibitor, an auxiliary agent, a surfactant and a solvent. The invention also provides a preparation method of the composition. Compared with the prior art, the superfine circuit stripping liquid prepared by the invention has the advantages that the efficient bond breaking capability provided by the compound alkali, the metal protection synergy of the corrosion inhibitor, the permeation and stripping assistance provided by the surfactant and the auxiliary agent and the safety and environmental protection advantages brought by a green solvent system are utilized; and rapid, complete and selective stripping of a high-density fine circuit film layer is realized.
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Citation Information
Patent Citations
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