Nameplate processing device and method

Abstract

The invention relates to the technical field of nameplate machining, in particular to a nameplate machining device and method.The nameplate machining device comprises an etching machine used for surface pattern machining and further comprises an electrolysis assembly and a split runner. The uniformity bottleneck of a traditional fixed electrode is broken through, the electric field distribution and the metal recovery efficiency are optimized, dynamic homogenization treatment of waste liquid is achieved through the design of the spiral split flow channel and the sedimentation area, the local concentration gradient is eliminated, and the metal ion diffusion rate is increased. Self-cleaning of the cathode assembly and the metal elementary substance removing position is achieved through the piezoelectric ceramic particles and the vibration piece scraping mechanism, the metal adhesion rate is reduced, the downtime is shortened, the high-value metal resource recycling requirement in metal nameplate etching machining is met, and the sustainable development of the metal nameplate etching machining technology is improved.

Description

Technical Field

[0001] This invention relates to the field of nameplate processing technology, specifically to a nameplate processing apparatus and method. Background Technology

[0002] The forming and processing of metal nameplates typically includes key steps such as substrate pretreatment, pattern resist layer fabrication, chemical etching, cleaning, and post-processing. Among these, the etching process, by selectively corroding the metal substrate, precisely transforms the mask pattern into a surface texture, and is the core technology for achieving complex text, logos, and decorative textures. Traditional etching techniques rely on the directional dissolving capabilities of chemical etching solutions, enabling the processing of fine patterns with linewidths down to the micrometer level while preserving the mechanical properties of the substrate.

[0003] The treatment of waste liquid after electrochemical etching of metal nameplates is also very important. Electrochemical recovery of metal ions can improve the recycling efficiency of etching solution and reduce the overall resource consumption during the metal nameplate processing.

[0004] However, the recovery efficiency of metals (such as Fe, Cr, Ni) precipitated in the etching solution in traditional electrochemical metal recovery methods is limited by electrode design flaws, such as...

[0005] Fixed electrode structures hinder the optimization of electrolyte flow field, and metal particles deposit at the bottom of the tank to form "anodic mud," requiring additional filtration and extraction processes, which increases recycling costs.

[0006] Fixed electrode spacing design cannot adapt to changes in the conductivity of dynamic etching solution, resulting in deviations in metal deposition thickness.

[0007] In addition, the etching solution has a complex composition (containing Cl) - NO3 - (and organic matter), which can easily form a passivation film on the cathode, inhibiting metal deposition.

[0008] Existing solutions mostly use single parameter control (such as adjusting pH or current density or improving the structure of the electrolyzer), lacking coordinated optimization of electrode spacing, temperature, and electrolyte flow field, making it difficult to balance efficiency and cost.

[0009] These problems make it difficult for traditional electrochemical recycling technologies to meet the demand for high-value metal resource recovery, thus hindering the sustainable development of metal nameplate etching processes.

[0010] In view of this, the present invention proposes a processing apparatus and method for nameplates, which solves the above-mentioned technical problems. Summary of the Invention

[0011] To address the shortcomings of existing technologies, this invention provides a nameplate processing device; thereby solving the problem that traditional electrochemical recovery schemes often rely on single-parameter control (such as adjusting pH or current density or improving the electrolytic cell structure), lacking synergistic optimization of electrode spacing, temperature, and electrolyte flow field, making it difficult to balance efficiency and cost.

[0012] The technical solution adopted by the present invention to solve its technical problem is a nameplate processing device, including an etching machine for surface pattern processing, a number of etching pools are provided inside the etching machine, a recovery cylinder for receiving and recovering waste liquid in the etching pools is movably provided at the bottom of the etching machine, and also includes an electrolysis component and a split flow channel.

[0013] The electrolysis assembly is installed in the recovery cylinder and is used for the electrolytic recovery of metals from waste liquid.

[0014] The split flow channel is movably installed inside the recovery cylinder and is located on the periphery of the electrolysis assembly.

[0015] The electrolysis assembly includes a cathode assembly and an anode assembly.

[0016] A central shaft is rotatably mounted through the central axis of the recovery cylinder, and the cathode assembly is movably mounted on the upper end of the central shaft.

[0017] The inner side of the recovery cylinder is fixedly provided with a concentric ring for isolating the split flow channel, and the anode assembly is fixedly installed in the annular gap formed between the cathode assembly and the concentric ring.

[0018] On the other hand, the bottom of the concentric ring is provided with a rectangular groove that communicates with the inner cavity of the recovery cylinder. The upper middle part of the concentric ring and the side wall of the recovery cylinder form a closed circumference. The split flow channel is installed in the closed circumferential cavity in a spiral-encircling and settling manner.

[0019] On the other hand, the split flow channel has several through-holes along its spiral direction, the axis of the settling holes is inclined, and a dense mesh is attached to the lower spiral surface of the split flow channel. A semi-open settling zone is formed between the bottom of the inclined position of the settling hole and the mesh surface of the dense mesh.

[0020] On the other hand, the side wall of the recovery cylinder and the concentric ring are provided with liquid-cooled cavities for coolant flow, and the upper end of the recovery cylinder is provided with a port for waste liquid to flow in, and the port is located at the top of the spiral winding direction of the split flow channel.

[0021] On the other hand, the anode components are arranged in multiple concentric circles, and each is equipped with a gradually changing voltage through an independent controllable power supply from the inside out.

[0022] On the other hand, a clamping ring is coupled to the upper end of the central shaft, and an "L"-shaped angled rod is installed in each of the four directions of the outer ring of the clamping ring in a sliding fit manner. A crescent plate is fixedly installed at the movable end of the angled rod, and one end of the cathode assembly is movably engaged with the lower bottom surface of the crescent plate.

[0023] On the other hand, the crescent plate is made of elastic material and has several expansion joints that adapt to changes in the curvature of the arc surface. A pair of bolts are symmetrically installed at both ends of the top surface of the crescent plate. An adjustable tension rope is installed on the bolt. A hydraulically controlled telescopic bladder is installed at the end of the angle rod, and the taut rope is centered against the outer wall of the telescopic bladder.

[0024] On the other hand, a number of piezoelectric ceramic particles are fixedly installed on the crescent plate, and the piezoelectric ceramic particles are arranged at intervals with the expansion joint.

[0025] On the other hand, a partition plate is fixedly installed at the upper end of the central shaft, a clamping ring is located above the partition plate and a tension spring is connected between the clamping ring and the partition plate, the bottom of the recycling cylinder is a downward-sloping conical structure, an outer sleeve is installed through the axis of the conical surface, the outer sleeve is sleeved on the outside of the central shaft and located below the partition plate, a chip inlet groove is opened circumferentially at the bottom of the outer sleeve, and a spiral ring is fixedly installed on the outer curved surface of the central shaft to rotate and fit against the inner wall of the outer sleeve.

[0026] On the other hand, an external drain valve is installed at the lower end of the outer sleeve, and the external drain valve is located below the recovery cylinder. The bottom of the central shaft rotates through the bottom of the outer sleeve, and a motor for driving the central shaft to rotate is fixedly installed below the recovery cylinder.

[0027] On the other hand, the upper end of the outer sleeve is provided with a tapered guide surface that gradually moves away from its axial direction and extends downward. The lower end of the partition plate is elastically connected to a vibrating plate by a compression spring. A gap is reserved between the vibrating plate and the guide surface, and the top of the spiral ring is located in this gap.

[0028] On the other hand, the vibrator is coupled to the central shaft, and a number of balls are installed on the bottom surface of the vibrator through a rotational engagement. The top of the spiral ring intermittently contacts the bottom surface of the vibrator and the balls during rotation.

[0029] On the other hand, multiple vertical cylinders are fixedly installed inside the recycling cylinder, and a retaining ring is fixedly installed at the upper end of the vertical cylinder. A semi-open single-element cylinder is detachably installed in the middle of the retaining ring. The outer sleeve penetrates the middle of the single-element cylinder, and the guide surface is located in the inner cavity of the single-element cylinder.

[0030] On the other hand, the single-element cylinder is composed of two double-layer semi-annular cylinders spliced ​​together. The middle and upper parts of the single-element cylinder are open structures. A clamp for locking the single-element cylinder is movably installed on the retaining ring. A semi-permeable membrane for solid-liquid separation is provided on the outer ring surface of the single-element cylinder. The position of the semi-permeable membrane is higher than the liquid level of the waste liquid in the recovery cylinder.

[0031] On the other hand, a pusher is slidably installed in the upper middle part of the vertical cylinder, the pusher is located below the angle rod, and a hydraulic component for controlling the extension and retraction of the pusher is fixedly installed at the bottom of the recovery cylinder.

[0032] Furthermore, the present invention also provides a method of using a nameplate processing apparatus, comprising the following steps:

[0033] S1. Placing the nameplate: The cut and exposed nameplates are placed in several etching pools in the etching machine by means of a robot or manual method. The metal plates are vertically suspended using PP material hangers or titanium alloy clamps with a spacing of ≥20mm to avoid contact between the plates.

[0034] S2. Etching Process: The etching solution uses a composite system of nitric acid (HNO3) and hydrochloric acid (HCl) (volume ratio 1:2) to achieve micron-level precision etching (error ≤0.1mm), which is suitable for etching complex patterns. At the same time, a composite corrosion inhibitor of benzotriazole (BTA) and potassium iodide (KI) (concentration 0.1%~0.3%) is introduced to selectively inhibit corrosion in non-target areas, reduce side etching, improve line clarity, and make the surface trademarks or attribute markings clearly visible.

[0035] S3. Nameplate Removal: After etching is completed, the nameplate is removed and cleaned. Then, its surface texture is dyed to produce the finished product.

[0036] S4. Wastewater Treatment: The etching wastewater is transported to the recovery tank by pressurization or pumping. Then, the metal ions in the wastewater are precipitated and collected using electrochemical technology, realizing the recycling of the etching solution. The residual wastewater continues to be discharged and the organic matter is further degraded by ozone oxidation and activated carbon adsorption to meet the recycling or discharge standards.

[0037] The beneficial effects of this invention are:

[0038] (1) Optimizing electric field distribution and metal recovery efficiency: This invention significantly improves the uniformity of the electric field in the electrolytic cell through the synergistic design of adjustable-spacing cathode components and multi-layer gradient voltage anodes. The cathode components can be radially slidably adjusted in spacing, and combined with the gradient voltage setting of the three-layer anodes, the differences in ohmic voltage drop and current density in different regions are compensated, thereby reducing the deviation in metal deposition thickness and improving current efficiency, breaking through the uniformity bottleneck of traditional fixed electrodes.

[0039] (2) Enhancing the continuity and stability of wastewater treatment, the spiral split flow channel and settling zone design achieves dynamic homogenization of wastewater. As the wastewater falls along the spiral flow channel, centrifugal force and gravity work together to even out the liquid flow, while the dense mesh intercepts solid waste particles. During electrolysis, the central shaft drives the cathode assembly to rotate, creating a vortex in the wastewater. Combined with the liquid cooling system, this eliminates local concentration gradients and improves the diffusion rate of metal ions. This design supports continuous operation and improves recovery efficiency compared to traditional intermittent recovery processes.

[0040] (3) Modular self-maintenance and improved ease of operation: The piezoelectric ceramic particles and the vibrating plate scraping mechanism enable self-cleaning of the cathode assembly and the metal element removal area, reducing metal adhesion rate. The crescent plate elastic adjustment and the telescopic bladder hydraulic control allow the cathode curvature to adapt to changes. The element cylinder (semi-permeable membrane solid-liquid separation) supports quick replacement, reducing downtime. The spiral ring (gradual pitch) and conical guide surface enable continuous compression and discharge of metal particles, improving the purity of the recovered metal while reducing the water content. Attached Figure Description

[0041] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0042] Figure 1 This is a schematic diagram of the first overall connection structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the second integral connection structure of the present invention;

[0044] Figure 3 This is a partial cross-sectional schematic diagram of the recovery cylinder in this invention;

[0045] Figure 4 This is a schematic diagram of the spiral winding state of the split flow channel in this invention;

[0046] Figure 5 This is a schematic diagram illustrating the arrangement of the settling holes and the dense mesh in this invention;

[0047] Figure 6 for Figure 4 Enlarged diagram of point A in the diagram;

[0048] Figure 7 This is a schematic diagram showing the layout of the electrolysis components in this invention;

[0049] Figure 8 This is a schematic diagram showing the positional relationship between the cathode assembly and the single-element cylinder in this invention;

[0050] Figure 9 for Figure 8 Enlarged diagram of point B in the diagram;

[0051] Figure 10 for Figure 8 Enlarged diagram of point C in the diagram;

[0052] Figure 11 for Figure 8 Enlarged diagram of point D in the diagram;

[0053] In the picture:

[0054] 1. Etching machine; 2. Recycling cylinder; 3. Electrolysis assembly; 4. Split flow channel; 31. Cathode assembly; 5. Central shaft; 32. Anode assembly; 6. Concentric ring; 61. Rectangular groove; 41. Settling hole; 42. Dense mesh; 43. Settling zone; 21. Port; 51. Clamping ring; 52. Angle bar; 53. Crescent plate; 531. Expansion joint; 532. Bolt rod; 533. Tie rope; 534. Telescopic bladder; 535. Piezoelectric ceramic particles; 54. Partition plate; 22. Outer sleeve; 221. Chip feed groove; 55. Spiral ring; 222. Guide surface; 541. Compression spring; 542. Vibrating plate; 543. Ball bearing; 23. Vertical cylinder; 231. Retaining ring; 232. Single-element cylinder; 233. Semi-permeable membrane; 234. Pusher; 24. Hydraulic assembly. Detailed Implementation

[0055] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0056] This invention provides a nameplate processing device, which solves the problem that existing electrochemical metal recovery schemes often use single parameter control (such as adjusting pH or current density or improving the structure of the electrolytic cell), lack synergistic optimization of electrode spacing, temperature, and electrolyte flow field, and are difficult to balance efficiency and cost.

[0057] like Figures 1 to 4 ,as well as Figure 7 As shown, a preferred embodiment of the present invention provides a nameplate processing apparatus, including an etching machine 1 for surface pattern processing, an etching machine 1 having a plurality of etching pools inside, a recovery cylinder 2 for receiving and recovering waste liquid in the etching pools being movably arranged at the bottom of the etching machine 1, and further including an electrolysis component 3 and a split flow channel 4.

[0058] Etching machine 1 is used for the pattern formation process of metal nameplates after forming. It uses chemical etching solution to develop the preset pattern on the metal nameplate, which facilitates the subsequent coloring process. The recycling cylinder 2 is installed in a drawer-type movable position below the etching machine 1. During the etching process, the recycling cylinder 2 is stored below the etching machine 1 to prepare to receive the outflow of etching waste liquid. After etching is completed, during the process of taking out the metal nameplate, the etching solution in the etching pool flows out into the recycling cylinder 2 at the same time. The electrolysis component 3 is used to precipitate the metal ions in the waste liquid, which facilitates the subsequent extraction and recycling.

[0059] The electrolysis assembly 3 is installed in the recovery cylinder 2 and is used for the electrolytic recovery of metals in the waste liquid.

[0060] The split flow channel 4 is movably installed inside the recovery cylinder 2, and the split flow channel 4 is located on the periphery of the electrolysis assembly 3.

[0061] The electrolysis assembly 3 includes a cathode assembly 31 and an anode assembly 32.

[0062] A central shaft 5 is rotatably mounted through the central axis of the recovery cylinder 2. The cathode assembly 31 is movably mounted on the upper end of the central shaft 5. A concentric ring 6 for isolating the split flow channel 4 is fixedly provided on the inner side of the recovery cylinder 2. The anode assembly 32 is fixedly installed in the annular gap formed between the cathode assembly 31 and the concentric ring 6.

[0063] Further, such as Figure 3 and Figure 7 As shown, multiple cathode components 31 are arranged in a ring and placed in the recovery cylinder 2 near the central axis 5, and are immersed in the etching waste liquid. The anode components 32 are arranged in multiple layers in a concentric circle, and a gradient voltage is applied from the inside to the outside. The recommended values ​​for the voltage gradient of the three anode layers are as follows:

[0064]

[0065]

[0066] By setting a gradient voltage, the overall electric field strength inside the recovery cylinder 2 is balanced, thereby improving the recovery efficiency of metal ions in the waste liquid.

[0067] Further, such as Figure 3 and Figure 4 As shown, the side wall of the recovery cylinder 2 and the concentric ring 6 are both provided with liquid-cooled cavities for coolant flow. The upper end of the recovery cylinder 2 is provided with a port 21 for waste liquid to flow in, and the port 21 is located at the top of the spiral winding direction of the split flow channel 4. The bottom of the concentric ring 6 is provided with a rectangular groove 61 that communicates with the inner cavity of the recovery cylinder 2. The middle and upper part of the concentric ring 6 and the side wall of the recovery cylinder 2 form a closed circumference. The split flow channel 4 is movably installed in the closed circumferential cavity in a spiral winding and sinking manner.

[0068] The liquid-cooled cavity (temperature controlled ±0.5℃) is designed to allow coolant to flow into it when necessary, thereby balancing the reaction heat during the metal electrochemical recovery process. When the waste liquid flows in from port 21, it flows along the surrounding sedimentation direction of the split flow channel 4. The spiral flow increases the length of the waste liquid's falling path. At the same time, the gravity and centrifugal force during rotation make the flowing waste liquid spread evenly, ensuring full contact with the surface of the split flow channel 4. In addition, when the waste liquid flowing in a spiral flow reaches the bottom of the closed circumference and flows into the inner cavity of the recovery cylinder 2 where the electrolysis component 3 is located through the rectangular groove 61, it exhibits fluidity and forms a mixture during the flow, thereby improving the uniformity of the composition and density of the waste liquid in each area during the subsequent electrochemical reaction and improving the reaction efficiency.

[0069] Further, such as Figures 3 to 5 As shown, the split flow channel 4 has several through-holes 41 along its spiral direction. The axis of the settling holes 41 is inclined. A dense mesh 42 (pore diameter ≤ 50 μm) is attached to the lower spiral surface of the split flow channel 4. A semi-open settling zone 43 is formed between the bottom of the inclined position of the settling holes 41 and the mesh surface of the dense mesh 42.

[0070] The settling zone 43 is recessed to trap any solid impurities that may be present in the waste liquid, preventing the presence of solid waste particles from affecting the electrochemical recovery reaction process. The fine-mesh mesh 42 can be maintained or replaced by periodically tearing it off. The split flow channel 4 has an unfixed top. When the waste liquid flows in and impacts the top of the split flow channel 4, the split flow channel 4 can undergo slight deformation through its own spiral toughness, thereby offsetting or buffering the impact of the waste liquid during the inflow process, improving the uniformity of the waste liquid flow rate, and making it more conducive to trapping solid waste impurities in the waste liquid.

[0071] Further, such as Figure 7 , Figure 8 and Figure 10 As shown, a clamping ring 51 is coupled and installed at the upper end of the central shaft 5. An "L"-shaped angled rod 52 is installed on the outer ring of the clamping ring 51 in a sliding fit. A crescent plate 53 is fixedly installed at the movable end of the angled rod 52. One end of the cathode assembly 31 is movably engaged with the lower bottom surface of the crescent plate 53.

[0072] When the concentration of the waste liquid changes during the continuous electrochemical reaction, in addition to setting a gradient voltage to balance the electric field strength and improve the recovery efficiency, the installation length of the angled rod 52 can be adjusted to allow it to slide radially on the clamping ring 51, thereby driving the cathode assembly 31 to move synchronously. The cathode assembly 31 can be radially slidable to adjust the spacing (20-50mm), thereby adjusting the distance between the cathode assembly 31 and the anode assembly 32, achieving the following functions.

[0073] Current density optimization: Reducing the spacing can decrease electrolyte resistance and improve current efficiency.

[0074] Mass transfer control: Appropriate spacing, such as 20-50mm, ensures uniform diffusion of metal ions, avoids concentration polarization, and improves deposition uniformity with a deviation of <5%.

[0075] Side reaction suppression: Appropriate spacing reduces bubble buildup (such as H2), preventing loose metal deposition. This improves the recovery rate of metal ions while reducing energy consumption.

[0076] Further, such as Figure 8 and Figure 10 As shown, the crescent plate 53 is made of elastic material. Several expansion joints 531 are provided on the crescent plate 53 to adapt to changes in the curvature of the arc surface. A pair of bolts 532 are symmetrically installed at both ends of the upper top surface of the crescent plate 53. An adjustable tension rope 533 is installed on the bolt 532. A hydraulically controlled telescopic bladder 534 is installed at the end of the angle rod 52, and the taut rope 533 rests against the outer wall of the telescopic bladder 534 at the centered position.

[0077] To improve the precision of the spacing adjustment between the cathode assembly 31 and the anode assembly 32, the crescent plate 53 can adaptively stretch its curvature under the tension of the rope 533, thereby adapting to the changes in its outer arc surface at different radial positions and maintaining an appropriate spacing with the outer anode assembly 32. During the adjustment process, when the radial distance of the cathode assembly 31 changes, some hydraulic oil is simultaneously introduced or discharged into the telescopic bladder 534, causing the outer contour of the telescopic bladder 534 to expand and contract. The tension strength of the crescent plate 53 is increased by changing the straightening shape of the rope 533, thereby changing the curvature of the crescent plate 53 and the cathode assembly 31. In addition, in the middle stage of the electrochemical reaction, if the deposited metal adheres to the surface of the cathode assembly 31, the adhered metal can be detached by briefly or slightly changing the curvature of the cathode assembly 31 in conjunction with the control of the current intensity. This improves the cleanliness of the cathode assembly 31 surface and enhances the metal deposition efficiency at its location during the continuous electrochemical reaction.

[0078] Further, such as Figure 10 As shown, a plurality of piezoelectric ceramic particles 535 are fixedly installed on the crescent plate 53, and the piezoelectric ceramic particles 535 are arranged at intervals with the expansion joint 531.

[0079] The piezoelectric ceramic particles 535 can generate high-frequency vibrations after being energized. After the waste liquid is treated, the vibration of the piezoelectric ceramic particles 535 causes the cathode assembly 31 to vibrate synchronously, thereby accelerating the shedding of the metal elements on its surface and realizing the self-cleaning and maintenance function of the cathode assembly.

[0080] Further, such as Figures 8 to 11 As shown, a partition plate 54 is fixedly installed at the upper end of the central shaft 5. A clamping ring 51 is located above the partition plate 54, and a tension spring connects the clamping ring 51 and the partition plate 54. The bottom of the recycling cylinder 2 is a downward-sloping conical structure. An outer sleeve 22 is installed through the axis of the conical surface. The outer sleeve 22 is sleeved on the outside of the central shaft 5 and is located below the partition plate 54. A chip inlet groove 221 is circumferentially opened at the bottom of the outer sleeve 22. A spiral ring 55 is fixedly installed on the outer curved surface of the central shaft 5 and rotates and fits against the inner wall of the outer sleeve 22. An external discharge valve is installed at the lower end of the outer sleeve 22 and is located below the recycling cylinder 2. The bottom of the central shaft 5 rotates through the bottom of the outer sleeve 22. A motor for driving the rotation of the central shaft 5 is fixedly installed below the recycling cylinder 2.

[0081] To further improve the efficiency of waste liquid treatment, during the electrochemical recovery process, a motor drives the central shaft 5 to rotate, which in turn drives the clamping ring 51 to rotate synchronously, thereby driving the cathode assembly 31 to rotate (5-20 rpm). The cathode assembly 31 drives the waste liquid to flow during rotation, thereby improving the regional density uniformity of the waste liquid in the recovery cylinder 2 and improving the metal recovery efficiency. In addition, with the rotational flow of the waste liquid, the precipitated and formed metal elements, along with the rotation of the waste liquid and the conical structure at the bottom of the recovery cylinder 2, gradually converge towards the bottom of the outer sleeve 22 and pass through the chip inlet trough 221 to reach the position of the spiral ring 55. At this time, the spiral ring 55 rotates synchronously with the central shaft 5, and through the spiral lifting action, lifts the metal elements gathered here upwards. The pitch of the spiral ring 55 can be set to gradually decrease from bottom to top, thereby gradually compressing the metal elements during the extraction process, discharging the waste liquid, achieving a preliminary solid-liquid separation effect, and improving the cleanliness of the recovered metal elements.

[0082] Further, such as Figure 6 , Figure 8 and Figure 9 As shown, the upper end of the outer sleeve 22 is provided with a tapered guide surface 222 that gradually moves away from its axial direction and extends downward. The lower end of the partition plate 54 is elastically connected to and installed with a vibrating plate 542 via a compression spring 541. A gap is reserved between the vibrating plate 542 and the guide surface 222, and the top end of the spiral ring 55 is located in this gap. The vibrating plate 542 is coupled to the central shaft 5. A number of balls 543 are installed on the lower bottom surface of the vibrating plate 542 by means of rotational engagement. The top end of the spiral ring 55 intermittently contacts the lower bottom surface of the vibrating plate 542 and the balls 543 during rotation.

[0083] When the metallic element is lifted to this position by the spiral ring 55, it slides down along the side wall of the guide surface 222 and is discharged from the inner gap of the outer sleeve 22. During the continuous rotation of the spiral ring 55, the cut-off position at its top end intermittently contacts and scrapes against the ball 543. Combined with the elastic force of the compression spring 541, the vibrator 542 reciprocates. At this time, if there is a situation where the metallic element adheres to the spiral ring 55 and is not easy to fall off, the reciprocating vibration and scraping action of the vibrator 542 can further increase the falling rate of the metallic element, so that the amount of metallic element precipitation is consistent with the amount of recovery, and the ineffective loss is reduced.

[0084] Further, such as Figure 8 and Figure 9 As shown, multiple vertical cylinders 23 are fixedly installed on the inner side of the recovery cylinder 2. A retaining ring 231 is fixedly installed on the upper end of the vertical cylinder 23. A semi-open single-element cylinder 232 is detachably installed in the middle of the retaining ring 231. The outer sleeve 22 penetrates the middle of the single-element cylinder 232, and the guide surface 222 is located in the inner cavity of the single-element cylinder 232. The single-element cylinder 232 is composed of two double-layer semi-annular cylinders spliced ​​together. The middle and upper ends of the single-element cylinder 232 are open structures. A clamp for locking the single-element cylinder 232 is movably installed on the retaining ring 231. A semi-permeable membrane 233 for solid-liquid separation is provided on the outer ring surface of the single-element cylinder 232. The position of the semi-permeable membrane 233 is higher than the height of the waste liquid in the recovery cylinder 2.

[0085] The elemental cylinder 232 is installed by clamps and is used to receive the elemental metal that slides down from the guide surface 222. After the elemental metal and some waste liquid fall into the inner cavity of the elemental cylinder 232, the semi-permeable membrane 233 can realize the autonomous discharge of waste liquid, achieving a secondary solid-liquid separation effect. The elemental cylinder 232 can be removed and replaced after loading a predetermined volume of elemental metal, thereby realizing continuous operation in the electrochemical recovery process and improving the recovery and treatment efficiency of elemental metal.

[0086] Further, such as Figure 8 and Figure 10 As shown, a pusher 234 is slidably installed on the upper middle part of the vertical cylinder 23. The pusher 234 is located below the angle rod 52. A hydraulic component 24 for controlling the extension and retraction of the pusher 234 is fixedly installed at the bottom of the recovery cylinder 2.

[0087] During maintenance and repair operations, the jacking mechanism 234 can extend upwards under hydraulic pressure. During the extension process, it contacts the angled rod 52 and drives it to move upwards synchronously. Through the jacking action, the cathode assembly 31 is raised above the liquid level, which facilitates the maintenance or replacement of the cathode assembly 31 by the operators. The cathode assembly 31 can be directly and clearly observed, providing a data basis for subsequent electrochemical reaction control.

[0088] Furthermore, the present invention also provides a method for processing a nameplate, applicable to the aforementioned nameplate processing apparatus, comprising the following steps:

[0089] S1. Placing the nameplate: The cut and exposed nameplates are placed in several etching pools in etching machine 1 by means of a robot or manual method. The metal plates are vertically suspended using PP material hangers or titanium alloy clamps with a spacing of ≥20mm to avoid contact between the plates.

[0090] S2. Etching Process: The etching solution uses a composite system of nitric acid (HNO3) and hydrochloric acid (HCl) (volume ratio 1:2) to achieve micron-level precision etching (error ≤0.1mm), which is suitable for etching complex patterns. At the same time, a composite corrosion inhibitor of benzotriazole (BTA) and potassium iodide (KI) (concentration 0.1%~0.3%) is introduced to selectively inhibit corrosion in non-target areas, reduce side etching, improve line clarity, and make the surface trademarks or attribute markings clearly visible.

[0091] S3. Nameplate Removal: After etching is completed, the nameplate is removed and cleaned. Then, its surface texture is dyed to produce the finished product.

[0092] S4. Waste liquid treatment: The etching waste liquid is transported to the recovery cylinder 2 by pressurization or pumping. Then, the metal ions in the waste liquid are precipitated and collected by electrochemical technology to realize the recycling of the etching liquid. The residual waste liquid continues to be discharged and the organic matter is further degraded by ozone oxidation and activated carbon adsorption to meet the recycling or discharge standards.

[0093] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A nameplate processing apparatus, characterized in that, The system includes an etching machine (1) for surface pattern processing, which contains several etching pools. A recovery cylinder (2) is movably installed at the bottom of the etching machine (1) to collect and recover waste liquid from the etching pools. Additionally, it includes... Electrolysis assembly (3), which is installed in the recovery cylinder (2) for the electrolytic recovery of metals in waste liquid; The split flow channel (4) is movably installed inside the recovery cylinder (2) and is located on the periphery of the electrolysis assembly (3); The electrolysis assembly (3) includes The cathode assembly (31) is rotatably mounted on a central shaft (5) at the central axis position of the recovery cylinder (2), and the cathode assembly (31) is movably mounted on the upper end of the central shaft (5). The anode assembly (32) is fixedly installed in the annular gap formed between the cathode assembly (31) and the concentric ring (6) for isolating the split flow channel (4) on the inner side of the recovery cylinder (2).

2. The nameplate processing apparatus according to claim 1, characterized in that: The concentric ring (6) has a rectangular groove (61) at its bottom circumferentially connected to the inner cavity of the recovery cylinder (2). The upper middle part of the concentric ring (6) and the side wall of the recovery cylinder (2) form a closed circumference. The split flow channel (4) is installed in the closed circumferential cavity in a spiral-encircling and settling manner.

3. The nameplate processing apparatus according to claim 1, characterized in that: The split flow channel (4) has several through-holes (41) along its spiral direction. The axis of the settling holes (41) is inclined. A dense mesh (42) is attached to the lower spiral surface of the split flow channel (4). A semi-open settling zone (43) is formed between the bottom of the inclined position of the settling hole (41) and the mesh surface of the dense mesh (42).

4. The nameplate processing apparatus according to claim 1, characterized in that: The anode components (32) are arranged in multiple concentric circles, and each is equipped with a gradually changing voltage through an independent controllable power supply from the inside to the outside.

5. The nameplate processing apparatus according to claim 1, characterized in that: A clamping ring (51) is coupled to the upper end of the central shaft (5). An "L"-shaped bend rod (52) is installed on the outer ring of the clamping ring (51). A crescent plate (53) is fixedly installed at the movable end of the bend rod (52). One end of the cathode assembly (31) is movably engaged with the lower bottom surface of the crescent plate (53).

6. The nameplate processing apparatus according to claim 5, characterized in that: The crescent plate (53) is made of elastic material. Several expansion joints (531) are provided on the crescent plate (53) to adapt to the curvature of the arc surface. A pair of bolts (532) are symmetrically installed at both ends of the top surface of the crescent plate (53). An adjustable tension rope (533) is installed on the bolt (532). A hydraulically controlled telescopic bladder (534) is installed at the end of the angle rod (52), and the taut rope (533) is centered and abuts against the outer wall of the telescopic bladder (534).

7. The nameplate processing apparatus according to claim 5, characterized in that: A number of piezoelectric ceramic particles (535) are fixedly installed on the crescent plate (53), and the piezoelectric ceramic particles (535) are arranged at intervals with the expansion joint (531).

8. The nameplate processing apparatus according to claim 1, characterized in that: A partition plate (54) is fixedly installed at the upper end of the central shaft (5). The bottom of the recycling cylinder (2) is a downward-sloping conical structure. An outer sleeve (22) is installed through the axis of the conical surface. The outer sleeve (22) is sleeved on the outside of the central shaft (5). A chip inlet groove (221) is opened circumferentially at the bottom of the outer sleeve (22). A spiral ring (55) is fixedly installed on the outer curved surface of the central shaft (5) and rotates and fits against the inner wall of the outer sleeve (22).

9. The nameplate processing apparatus according to claim 8, characterized in that: An external discharge valve is installed at the lower end of the outer sleeve (22), and the external discharge valve is located below the recovery cylinder (2). The bottom of the central shaft (5) rotates through the bottom of the outer sleeve (22). A motor for driving the central shaft (5) to rotate is fixedly installed below the recovery cylinder (2).

10. The nameplate processing apparatus according to claim 8, characterized in that: The upper end of the outer sleeve (22) is provided with a tapered guide surface (222) that gradually moves away from its axis and extends downward. The lower end of the partition plate (54) is elastically connected to a vibrating plate (542) by a compression spring (541). A gap is reserved between the vibrating plate (542) and the guide surface (222), and the top end of the spiral ring (55) is located in this gap.

11. The nameplate processing apparatus according to claim 10, characterized in that: The vibrating plate (542) is coupled to the central shaft (5). A number of balls (543) are installed on the bottom surface of the vibrating plate (542) by means of rotational engagement. The top of the spiral ring (55) intermittently contacts the bottom surface of the vibrating plate (542) and the balls (543) during rotation.

12. The nameplate processing apparatus according to claim 10, characterized in that: Multiple vertical cylinders (23) are fixedly installed on the inner side of the recovery cylinder (2). A retaining ring (231) is fixedly installed at the upper end of the vertical cylinder (23). A semi-open single-element cylinder (232) is detachably installed in the middle of the retaining ring (231). The guide surface (222) is located in the inner cavity of the single-element cylinder (232). A semi-permeable membrane (233) for solid-liquid separation is provided on the outer ring surface of the single-element cylinder (232).

13. A method for processing a nameplate, the method being applicable to the nameplate processing apparatus described in any one of claims 1-12, characterized in that, Includes the following steps: S1. Placing the nameplate: The cut and exposed nameplates are placed in several etching pools in the etching machine (1) by means of a robot or manual method. The metal plates are vertically suspended using PP material hangers or titanium alloy clamps with a spacing of ≥20mm to avoid contact between the plates. S2. Etching Process: The etching solution uses a composite system of nitric acid (HNO3) and hydrochloric acid (HCl) (volume ratio 1:2) to achieve micron-level precision etching (error ≤0.1mm), which is suitable for etching complex patterns. At the same time, a composite corrosion inhibitor of benzotriazole (BTA) and potassium iodide (KI) (concentration 0.1%~0.3%) is introduced to selectively inhibit corrosion in non-target areas, reduce side etching, improve line clarity, and make the surface trademarks or attribute markings clearly visible. S3. Nameplate Removal: After etching is completed, the nameplate is removed and cleaned. Then, its surface texture is dyed to produce the finished product. S4. Waste liquid treatment: The etching waste liquid is transported to the recycling cylinder (2) by pressurization or pumping. Then, the metal ions in the waste liquid are precipitated and collected by electrochemical technology to realize the recycling of the etching liquid. The residual waste liquid continues to be discharged and the organic matter is further degraded by ozone oxidation and activated carbon adsorption to meet the recycling or discharge standards.

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