Non-contact dynamic measurement chip warping device and measurement method

Abstract

The invention relates to the technical field of electronic information and semiconductor manufacturing, in particular to a non-contact dynamic chip warping measurement device and method, the device comprises a heating module and a mobile measurement module, and the heating module and the mobile measurement module are movably connected and erected above the mobile measurement module; the heating module comprises a quartz heating tube, a cross-flow fan and a sample clamp, a sample is fixed in the clamp in the measuring process, and an XY double-axis moving platform in the measuring module is moved to drive a line laser measuring instrument to be responsible for scanning data and measuring warping; when in-situ measurement under the high-temperature condition needs to be carried out, the quartz heating pipes on the two sides carry out heating, the cross-flow fan carries out transverse air outlet, a thermal field is formed in a convection heating mode, the thermocouple around the clamp monitors the temperature in real time, and temperature regulation and control are achieved through a PID algorithm. Through a non-contact measurement mode, the defects of traditional contact measurement are overcome, and an important promotion effect is achieved on improvement of the technical level and the market competitiveness of the whole industry.

Description

Technical Field

[0001] This invention relates to the fields of electronic information and semiconductor manufacturing technology, specifically to a non-contact dynamic measurement device and method for chip warping. Background Technology

[0002] Traditional contact measurement techniques, due to their inherent limitations, can no longer meet the high standards and requirements of modern semiconductor manufacturing processes. Firstly, contact measurements cannot accurately measure warpage: during semiconductor packaging, differences in the thermal expansion coefficients of materials and the curing shrinkage of polymer materials can cause warping of chips, packaging substrates, and components. Accurate measurement of warpage is crucial for process optimization; however, contact measurements only provide local information at the contact point and cannot comprehensively reflect the warpage of the entire surface, leading to inaccurate measurement results. Secondly, contact measurements have large errors: contact surface profilometer probes are prone to scratching the surface of the object being measured, creating unreachable testing blind spots. Furthermore, the probes are easily deformed during measurement, typically resulting in errors exceeding 1 micrometer. While vernier calipers and micrometers offer precise measurements, they are affected by machining errors, temperature, and contact forces, resulting in errors typically exceeding 3 micrometers. These limitations fail to meet the high-precision measurement requirements of the automotive, electronics, and machinery manufacturing industries. Third, contact measurement can only measure the dimensions of simple structures: As integrated circuits develop towards high density and miniaturization, device structures are becoming increasingly complex. Traditional contact measurement methods are ill-suited to these complex geometries and cannot provide comprehensive dimensional information. Fourth, contact measurement cannot be performed under high-temperature conditions: In semiconductor manufacturing, many critical process steps require high-temperature environments, such as reflow soldering, wave soldering, curing, and aging. Contact measurement cannot achieve in-situ measurement under high-temperature conditions, resulting in the inability to monitor and adjust process parameters in real time, affecting product quality. Fifth, contact measurement is inefficient and cannot be adapted to automated production line inspection: Contact measurement requires manual operation, which is inefficient and difficult to integrate with automated production lines in fields such as electronics, automotive, and machinery manufacturing, thus hindering the improvement of inspection and production efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a non-contact dynamic measurement device and method for chip warping, which aims to solve the technical problems that traditional contact measurement cannot obtain accurate warping information and that the measurement error is large when using probes. Furthermore, it addresses the issues that contact measurement can only measure simple structures and that traditional contact measurement cannot be performed at high temperatures.

[0004] To achieve the above objectives, the present invention provides a non-contact dynamic measurement chip warping device, comprising a heating module and a moving measurement module, wherein the heating module is movably connected to the moving measurement module and is mounted above the moving measurement module;

[0005] The heating module includes a quartz heating tube, a cross-flow fan, and a frame. The frame is a rectangular skeleton covered with glass on the top, bottom, front, and back. A set of quartz heating tubes and a cross-flow fan are arranged on each of the left and right sides, and the cross-flow fan is located outside the quartz heating tube.

[0006] The mobile measurement module includes a line laser measuring instrument, an XY dual-axis moving platform, a frame, and a base. The line laser measuring instrument, the XY dual-axis moving platform, and the base are all housed within the frame. The base is located at the bottom of the frame, the XY dual-axis moving platform is positioned above the base, and the line laser measuring instrument is mounted on the XY dual-axis moving platform.

[0007] The heating module also includes a sample clamp, which is located at the center of the frame and has thermocouples installed around it.

[0008] Among the glass covering the frame, the bottom surface is made of K9 optical glass, and the remaining parts are made of double-layer tempered glass;

[0009] The upper glass is connected to the side via hinges and is fitted with an aluminum alloy nylon handle at the top.

[0010] The frame has a metal blade fan in the middle of the rear glass, and an aluminum alloy buffer plate is also provided on the side near the metal blade fan.

[0011] The frame is made of European standard 2020 aluminum profile, the base is a marble base, and adjustable fixed feet are provided at the four corners of the base.

[0012] The XY dual-axis moving platform includes an X-axis moving axis and a Y-axis moving axis. The X-axis moving axis and the Y-axis moving axis are respectively driven by servo motors. The X-axis moving axis is set on the Y-axis moving axis, and the line laser measuring instrument is installed on the X-axis moving axis.

[0013] The line laser measuring instrument is the LJ-X8080 line laser measuring instrument.

[0014] This invention also proposes a non-contact dynamic measurement method, employing the aforementioned non-contact dynamic measurement chip warping device, comprising the following steps:

[0015] Step 1: System preparation and check;

[0016] Step 2: Sample placement;

[0017] Step 3: Determine whether to perform heating measurement. If heating measurement is required, proceed to the next step; otherwise, proceed to step 7.

[0018] Step 4: Set the temperature parameters and start heating;

[0019] Step 5: Temperature control and adjustment;

[0020] Step 6: Temperature standard assessment;

[0021] Step 7: Setting and measuring motion parameters;

[0022] Step 8: Data analysis and processing.

[0023] This invention provides a non-contact dynamic measurement device and method for chip warpage. The device includes a heating module and a moving measurement module, which are movably connected and mounted above the moving measurement module. The heating module includes a quartz heating tube, a cross-flow fan, and a sample fixture. During measurement, the sample is fixed in the fixture. The XY dual-axis moving platform in the moving measurement module drives a line laser measuring instrument to scan data and measure warpage. When in-situ measurement under high-temperature conditions is required, the quartz heating tubes on both sides heat the sample, and the cross-flow fan blows air laterally, creating a temperature field through convection heating. Thermocouples around the fixture monitor the temperature in real time, and temperature control is achieved through a PID algorithm. This invention overcomes the shortcomings of traditional contact measurement methods through a non-contact measurement approach, and plays a significant role in improving the technological level and market competitiveness of the entire industry. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a non-contact dynamic measurement chip warping device according to the present invention.

[0026] Figure 2 This is an external schematic diagram of the heating module according to an embodiment of the present invention.

[0027] Figure 3 This is a schematic diagram of the internal structure of the heating module according to an embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the internal structure of the mobile measurement module according to an embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram illustrating the specific steps of a non-contact dynamic measurement method according to the present invention.

[0030] 1-Heating module, 2-Moving measurement module, 11-Quartz heating tube, 12-Cross-flow fan, 13-Frame, 14-Sample clamp, 15-Aluminum alloy buffer plate, 21-Linear laser measuring instrument, 22-XY dual-axis moving platform, 221-X-direction moving axis, 222-Y-direction moving axis, 23-Frame, 24-Base. Detailed Implementation

[0031] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0032] This invention provides a non-contact dynamic measurement chip warping device, including a heating module 1 and a moving measurement module 2, wherein the heating module 1 is movably connected to the moving measurement module 2 and is mounted above the moving measurement module 2;

[0033] The heating module 1 includes a quartz heating tube 11, a cross-flow fan 12, and a frame 13. The frame 13 is arranged in the form of a cuboid skeleton, covered with glass on the top, bottom, front, and back. A set of quartz heating tubes 11 and cross-flow fans 12 are arranged on each of the left and right sides. The cross-flow fans 12 are located outside the quartz heating tubes 11.

[0034] The mobile measurement module 2 includes a line laser measuring instrument 21, an XY dual-axis moving platform 22, a frame 23, and a base 24. The line laser measuring instrument 21, the XY dual-axis moving platform 22, and the base 24 are all disposed within the frame 23. The base 24 is located at the bottom of the frame 23, the XY dual-axis moving platform 22 is placed above the base 24, and the line laser measuring instrument 21 is mounted on the XY dual-axis moving platform 22.

[0035] The heating module 1 also includes a sample clamp 14, which is located at the center of the frame 13. An aluminum alloy buffer plate 15 is provided on the side near the metal blade fan and is fixedly connected to the front and rear ends of the frame 13. Thermocouples are installed around the sample clamp 14.

[0036] The bottom surface of the glass encased by the frame 13 is made of K9 optical glass, while the remaining parts are made of double-layered tempered glass.

[0037] The upper glass is connected to the side via hinges and is fitted with an aluminum alloy nylon handle at the top.

[0038] A metal blade fan is installed in the middle of the rear glass of the frame 13.

[0039] The frame 23 is made of European standard 2020 aluminum profile, the base 24 is a marble base, and adjustable fixed feet are provided at the four corners of the base 24.

[0040] The XY dual-axis moving platform 22 includes an X-direction moving axis 221 and a Y-direction moving axis 222. The X-direction moving axis 221 and the Y-direction moving axis 222 are respectively equipped with servo motor drives. The X-direction moving axis 221 is mounted on the Y-direction moving axis 222, and the line laser measuring instrument 21 is mounted on the X-direction moving axis 221.

[0041] The line laser measuring instrument 21 is an LJ-X8080 line laser measuring instrument.

[0042] In this embodiment, a quartz heating tube 11 is installed on each of the left and right sides of the heating module 1, mainly for constant temperature heating. A cross-flow fan 12 is installed on the outside of the quartz heating tube 11, mainly for delivering a stable working airflow. The two are connected by a sheet metal part. In addition, double-layer tempered glass is arranged at the front and rear ends for heat insulation and heat preservation. The upper glass is designed as a flip-top with a hinge for easy observation and sample replacement. The lower glass uses K9 optical glass, the main purpose of which is to reduce optical errors. Then, a metal blade fan is installed at the rear end of the entire module, mainly for air circulation with the outside.

[0043] Heating process as follows Figure 2 As shown, during heating, the motor drives the cross-flow fan 12 to blow air horizontally, and at the same time the quartz heating tube 11 is energized and begins to heat up, forming a temperature field by using convection heating. Thermocouples are installed around the fixture to monitor the temperature in real time, and temperature control is achieved through PID algorithm.

[0044] The internal structure of heating module 1 is as follows Figure 3 As shown, the sample clamp 14 is used to fix the sample during convection heating. The bottom layer is made of optical glass to reduce optical errors when the line laser measuring instrument 21 scans. The aluminum alloy buffer plate 15 is to prevent high-temperature airflow from being directly discharged and damaging the metal blade fan of the exhaust system.

[0045] The moving measurement module 2 mainly consists of two moving axes in the X and Y directions, an LJ-X8080 line laser measuring instrument, and a marble base. The two moving axes drive the line laser measuring instrument 21 to move in the X and Y directions. The line laser measuring instrument 21 is responsible for scanning data to measure warpage, and the marble base provides support. The structure of the moving measurement module 2 is as follows: Figure 4 As shown, a connector is set up to connect the LJ-X8080 line laser measuring instrument and the X-axis motion axis. Two servo motors are responsible for driving the two moving axes, and fixed feet are used to adjust the level of the base.

[0046] Furthermore, the present invention also proposes a non-contact dynamic measurement method, employing the aforementioned non-contact dynamic measurement chip warping device, comprising the following steps:

[0047] Step 1: System preparation and check;

[0048] Step 2: Sample placement;

[0049] Step 3: Determine whether to perform heating measurement. If heating measurement is required, proceed to the next step; otherwise, proceed to step 7.

[0050] Step 4: Set the temperature parameters and start heating;

[0051] Step 5: Temperature control and adjustment;

[0052] Step 6: Temperature standard assessment;

[0053] Step 7: Setting and measuring motion parameters;

[0054] Step 8: Data analysis and processing.

[0055] The specific testing implementation process is as follows: Figure 5 As shown, the following provides further explanation in conjunction with the specific implementation steps:

[0056] Step 1: System Preparation and Check

[0057] Turn on the measurement system and check whether each hardware module (heating unit, temperature control system, motion measurement platform) is in normal standby mode, and confirm that the software interface is connected normally.

[0058] Step 2: Sample Placement

[0059] Open the glass protective door and use the clamp to accurately fix the chip sample to be tested in the center of the measurement area of ​​the heating module, ensuring that the sample surface is flat and the positioning is stable.

[0060] Step 3: Determine whether to perform heating measurement

[0061] Determine whether the measurement needs to be performed under heating conditions based on the experimental requirements: If heating is required: continue to the next step; if heating is not required: skip to step 7 to set the measurement parameters.

[0062] Step 4: Set the temperature parameters and start heating.

[0063] Close the glass door, enter the desired target temperature value, and start the heating program.

[0064] Step 5: Temperature Control and Adjustment

[0065] The system monitors the cavity temperature in real time and adjusts the heating power and airflow through a PID control algorithm to dynamically correct temperature deviations and ensure that the temperature field gradually approaches the set value.

[0066] Step 6: Temperature Standard Verification

[0067] Once the monitoring system confirms that the cavity temperature has stabilized and reached the set value, it automatically enters the measurement preparation state.

[0068] Step 7: Setting motion parameters and starting measurement

[0069] Close the glass door again (if it was not closed before), set the motion module parameters (such as scanning path, speed, resolution, etc.), and start the non-contact measurement program.

[0070] Step 8: Data processing and analysis, generating a report.

[0071] After the system completes the scanning data acquisition of the sample surface, it automatically performs data analysis and warpage calculation, compiles the analysis results into a report, and outputs measurement data such as sample warpage amount and the effect of temperature change, providing a basis for subsequent research or process optimization.

[0072] Temperature control principle: The PID algorithm (Proportional-Integral-Derivative control algorithm) aims to maintain the temperature at a set value by controlling the operating state of heating or cooling equipment. It maintains the stability of the system output (such as temperature) by adjusting the system input (such as heating power, flow rate, etc.). The working principle of the PID algorithm can be divided into three parts: proportional (P), integral (I), and derivative (D), each playing a different role. In a temperature control system, the PID algorithm adjusts the heater's output power through continuous feedback. For example, assuming the current temperature is lower than the set temperature, the PID algorithm will increase the heater's power. As the temperature gradually approaches the set value, the PID adjustment will reduce the heating power to avoid temperature overshoot or over-shoot. Ultimately, the system will stabilize near the set temperature, ensuring that temperature fluctuations are within the allowable range.

[0073] The working principle of the line laser measuring instrument in this invention is as follows: A cylindrical objective lens diffuses the laser light into a line laser, which is then projected onto the surface of the target object to form diffuse reflection. The reflected light is then imaged on a CMOS sensor, and displacement and shape are measured by detecting changes in position and shape.

[0074] In summary, the present invention has the following advantages:

[0075] First, non-contact measurement can accurately measure the actual warpage. Through optical methods, non-contact measurement can obtain detailed data on the entire surface, accurately reflecting the amount of warpage, thus providing reliable data support for process optimization.

[0076] Secondly, non-contact measurement is unaffected by manufacturing errors in the measuring equipment, enabling high-precision measurements. Optical measurement technology utilizes the wavelength of light and the principle of interference to achieve sub-micron level high-precision measurements, avoiding errors caused by probe deformation and contact force in contact measurements.

[0077] Furthermore, non-contact measurement enables in-situ measurements under high-temperature conditions. This is particularly important for temperature field analysis in semiconductor manufacturing processes, allowing for real-time monitoring of material deformation and stress changes at high temperatures, optimization of process parameters, and improved product reliability. By combining optimization theory and control technology, non-contact measurement systems can perform error compensation during data processing, providing more accurate measurement results. The measurement process and results can also be visualized in real-time, enhancing user experience and ease of operation.

[0078] Finally, non-contact measurement enables rapid batch measurement with a high level of automation and significantly improved measurement efficiency. The combination of optical measurement technology and modern automation technology allows for the rapid and batch acquisition of high-precision measurement data without damaging the object being measured, greatly improving production efficiency and quality control.

[0079] The above description discloses only one or more preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A non-contact dynamic measurement chip warping device, characterized in that, It includes a heating module and a moving measurement module, wherein the heating module is movably connected to the moving measurement module and is mounted above the moving measurement module; The heating module includes a quartz heating tube, a cross-flow fan, and a frame. The frame is a rectangular skeleton covered with glass on the top, bottom, front, and back. A set of quartz heating tubes and a cross-flow fan are arranged on each of the left and right sides, and the cross-flow fan is located outside the quartz heating tube. The mobile measurement module includes a line laser measuring instrument, an XY dual-axis moving platform, a frame, and a base. The line laser measuring instrument, the XY dual-axis moving platform, and the base are all housed within the frame. The base is located at the bottom of the frame, the XY dual-axis moving platform is positioned above the base, and the line laser measuring instrument is mounted on the XY dual-axis moving platform.

2. The non-contact dynamic measurement chip warping device as described in claim 1, characterized in that, The heating module also includes a sample clamp, which is located at the center of the frame and has thermocouples installed around it.

3. The non-contact dynamic measurement chip warping device as described in claim 2, characterized in that, The bottom surface of the glass covering the frame is made of K9 optical glass, while the rest is made of double-layered tempered glass. The upper glass is connected to the side via hinges and is fitted with an aluminum alloy nylon handle at the top.

4. The non-contact dynamic measurement chip warping device as described in claim 3, characterized in that, A metal blade fan is installed in the middle of the rear glass of the frame, and an aluminum alloy buffer plate is also installed on the side near the metal blade fan.

5. The non-contact dynamic measurement chip warping device as described in claim 4, characterized in that, The frame is made of European standard 2020 aluminum profile, the base is a marble base, and adjustable fixed feet are provided at the four corners of the base.

6. The non-contact dynamic measurement chip warping device as described in claim 5, characterized in that, The XY dual-axis moving platform includes an X-axis moving axis and a Y-axis moving axis. The X-axis moving axis and the Y-axis moving axis are respectively driven by servo motors. The X-axis moving axis is mounted on the Y-axis moving axis, and the line laser measuring instrument is mounted on the X-axis moving axis.

7. The non-contact dynamic measurement chip warping device as described in claim 6, characterized in that, The line laser measuring instrument is the LJ-X8080 line laser measuring instrument.

8. A non-contact dynamic measurement method, employing the non-contact dynamic measurement chip warping device as described in any one of claims 1 to 7, characterized in that, Includes the following steps: Step 1: System preparation and check; Step 2: Sample placement; Step 3: Determine whether to perform heating measurement. If heating measurement is required, proceed to the next step; otherwise, proceed to step 7. Step 4: Set the temperature parameters and start heating; Step 5: Temperature control and adjustment; Step 6: Temperature standard assessment; Step 7: Setting and measuring motion parameters; Step 8: Data analysis and processing.

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