An angle detection device and a method for detecting the angle of an optical chip in a 400G silicon photonics module.

Abstract

This invention relates to an angle detection device. A ball bearing is disposed below a housing, with its outer ring fixed to the housing. A probe is fixed to the inner ring of the ball bearing. The upper and lower ends of the probe are located inside and outside the housing, respectively. The lower end face of the probe is horizontal. A horizontally distributed tray is fixed inside the housing above the probe. Four probes, arranged around the probe and fixed to the housing, are disposed inside the housing above the tray. Each probe contacts the tray and is used to detect changes in tray displacement. A method for detecting the angle of an optical chip in a 400G silicon photonics module is also provided, using this angle detection device to detect the angle of the optical chip in the 400G silicon photonics module. The advantages are: this detection device can effectively determine the angle of the optical chip without worrying about the fiber optic array obstructing the optical chip, and it does not have the defects inherent in optical solutions. It also offers fast detection speed and high accuracy.

Description

Technical Field

[0001] This invention relates to the field of optical module manufacturing technology, specifically to an angle detection device and a method for detecting the angle of optical chips in a 400G silicon photonics module. Background Technology

[0002] During the coupling process of 400G silicon photonics modules, it is necessary to monitor the angles of materials, such as the angle of the fiber optic array and the angle of the optical chip mounted on the ceramic substrate (which is mounted on a PCB). A common approach is to use an optical solution, which involves taking an image with a camera and using image processing technology to determine the angle. However, this solution can only monitor the angle of the fiber optic array. Since the optical chip is blocked by the fiber optic array, it is impossible to monitor the angle of the optical chip. Furthermore, the optical chip is too small for the camera to capture. In addition, the optical solution measures by light reflection, which has the following drawbacks: 1) Some require a reflector; 2) It has high requirements for material reflection and is very unstable. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an angle detection device and a method for detecting the angle of optical chips in a 400G silicon photonics module, so as to overcome the shortcomings of the prior art.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows:

[0005] An angle detection device includes: a housing and a probe. A ball bearing is disposed below the housing, the outer ring of the ball bearing is fixed to the housing, the middle of the probe is fixed to the inner ring of the ball bearing, the upper and lower ends of the probe are located inside and outside the housing, respectively, and the lower end face of the probe is horizontal. A horizontally distributed tray is fixed inside the housing at the upper end of the probe. Four probes are disposed above the tray inside the housing, arranged around the probe and fixed to the housing. The probe of each probe is in contact with the tray, and each probe is used to detect the displacement change of the tray.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, all probes are distributed at equal angles around the probe.

[0008] Furthermore, the probe is an electromagnetic induction probe.

[0009] Furthermore, a bracket is fixed to the outer shell.

[0010] Furthermore, the bracket includes: a fixing rod and a cover plate, an open upper end of the outer shell, the cover plate covering the open upper end of the outer shell, the fixing rod being located outside the outer shell and fixed to the cover plate, and the tail end of the probe being fixed to the cover plate.

[0011] Furthermore, the probe is made of ceramic.

[0012] Based on the above technical solution, the present invention also provides a method for detecting the angle of an optical chip in a 400G silicon photonics module, which uses the above-mentioned angle detection device and includes the following steps:

[0013] S10. Install the angle detection device on the XYZ axis electric guide rail. First, control the angle detection device to move in the XY axis direction. After moving to the target position, control the angle detection device to move along the Z axis. If the surface of the ceramic substrate on the PCB used to install the optical chip is in a horizontal state, when the lower end face of the probe is flat with the surface, the probe does not deflect around the ball bearing, the tray remains horizontal, and all probes do not respond, then the detection is qualified and ends.

[0014] If the surface on the ceramic substrate of the PCB used to mount the optical chip is not horizontal, when the lower end face of the probe is brought into contact with the surface, since the lower end face of the probe is horizontal and the surface is not horizontal, the probe will deflect around the ball bearing 3 and become tilted, so as to make the lower end face of the probe flat with the surface. After the probe deflects, the tray at the upper end of the probe will also deflect from the horizontal state to the tilted state, so that the probe in contact with the tray will undergo displacement change. All probes send the displacement change to the signal processing terminal and enter S20.

[0015] S20. The signal processing end determines the changed coordinate values ​​based on the displacement changes of the four probes, and then calculates the angle of the probe and the tray. This angle corresponds to the tilt angle of the surface on the ceramic substrate on the PCB used to mount the optical chip, and finally determines the tilt angle of the optical chip.

[0016] Furthermore, in S20, the angle is calculated using the dot product formula based on the coordinate values ​​of the four probes after their changes.

[0017] Furthermore, suppose the signal processing end defines the coordinate values ​​of the four probes after the changes as follows:

[0018] ;

[0019] Calculate the direction vector:

[0020] vector ;

[0021] vector ;

[0022] Angle formula: ;

[0023] ;

[0024] Length ;

[0025] Length ;

[0026] ;

[0027] , The range is .

[0028] Furthermore, a computer is used for signal processing.

[0029] The advantages of this invention are: compared with optical solutions, this detection device can effectively determine the angle of the optical chip, without worrying about the optical fiber array blocking the optical chip, and it does not have the defects of optical solutions. In comparison, it has a faster detection speed and higher accuracy. Attached Figure Description

[0030] Figure 1 This is a structural diagram of the angle detection device in this invention;

[0031] Figure 2 This is a front view of the angle detection device in this invention;

[0032] Figure 3 This is a cross-sectional view of the angle detection device in this invention;

[0033] Figure 4 This is a structural diagram of the angle detection device after the outer shell is removed in this invention;

[0034] Figure 5 This is an application diagram of the angle detection device in this invention.

[0035] The attached diagram lists the components represented by each number as follows:

[0036] 1. Outer shell, 2. Probe, 3. Joint ball bearing, 4. Tray, 5. Probe, 6. Bracket, 610. Fixing rod, 620. Cover plate. Detailed Implementation

[0037] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0038] Example 1

[0039] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, an angle detection device includes: a housing 1, a probe 2, a ball bearing 3, a tray 4, and a probe 5. A ball bearing 3 is disposed below the housing 1, and its outer ring is fixed to the housing 1. Specifically, a mounting hole is formed in the bottom plate of the housing 1, and the ball bearing 3 is embedded in the mounting hole in the bottom plate of the housing 1. (This is merely an example.) The middle of the probe 2 is fixed to the inner ring of the ball bearing 3. The upper end of the probe 2 is inside the housing 1, while the lower end is outside the housing 1. The lower end face of the probe 2 is horizontal. A horizontally distributed tray is fixed inside the housing 1 above the probe 2. 4. The inner cavity of the outer shell 1 is such that when the tray 4 deflects within it, it does not affect the deflection of the tray 4. The fixing method can be that a hole is opened through the middle of the tray 4, and the upper end of the probe 2 is interference-fitted with the hole on the tray 4, or the inner wall of the hole is opened with internal threads, and the upper end of the probe 2 is opened with external threads, and the two are connected by threads. Of course, this is just an exemplary description. Four probes 5 are arranged around the probe 2 and fixed to the outer shell 1 inside the tray 4. The probe of each probe 5 is in contact with the tray 4. When the tray 4, which is originally horizontally distributed, deflects, the probe 5 will be triggered to respond. Each probe 5 is used to detect the displacement change of the tray 4.

[0040] The working principle is as follows:

[0041] Install the angle detection device on the XYZ axis electric guide rail. First, control the angle detection device to move in the XY axis direction. After moving to the target position, control the angle detection device to move along the Z axis. If the surface of the ceramic substrate on the PCB used to install the optical chip is in a horizontal state, when the lower end face of the probe 2 is flat with the surface, the probe 2 does not deflect around the ball bearing 3, the tray 4 remains in a horizontal state, and all probes 5 do not respond. Then the detection is qualified and ends.

[0042] If the surface on the ceramic substrate of the PCB used to mount the optical chip is not horizontal, when the lower end face of probe 2 is brought into contact with this surface, since the lower end face of probe 2 is horizontal while the surface is not horizontal, probe 2 will deflect around the ball bearing 3, that is, the angle changes and it becomes tilted, so that the lower end face of probe 2 can be brought into contact with the surface. After probe 2 deflects, the tray 4 at the upper end of probe 2 will also deflect from a horizontal state to a tilted state, so that the probe 5 in contact with the tray 4 will undergo a displacement change (during this process, the outer shell 1 and probe 5 are always in a vertical state). All probes 5 send the changed displacement signal to the signal processing terminal. The signal processing terminal determines the changed coordinate value based on the displacement signals of the four probes 5, and then calculates the angle of probe 2 and tray 4. This angle corresponds to the tilt angle of the surface on the ceramic substrate of the PCB used to mount the optical chip, and finally determines the tilt angle of the optical chip.

[0043] In practical applications, it is not ruled out that angle detection devices may be installed on multi-degree-of-freedom robots; this is just an example.

[0044] The method for determining the changed coordinate values ​​based on the displacement signals of the four probes 5 is as follows: When the tray 4 is in a horizontal state, the spatial coordinates (x, y, z) of each probe 5 are first defined. When the tray 4 changes from a horizontal state to an inclined state, each probe 5 is displaced in the Z-axis direction, thus changing the z value (since the outer shell 1 and the probes 5 are always in a vertical state, the x and y values ​​remain unchanged). Based on the amount of displacement change, the spatial coordinates of each probe 5 can be redefined.

[0045] Example 2

[0046] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0047] All probes 5 are distributed at equal angles around probe 2. Since there are four probes 5, and the four probes 5 are distributed in a 360° circle around probe 2, the angle between two adjacent probes 5 is 90°. Probes 5 are preferably electromagnetic induction probes with an accuracy of 1μm. The specific model can be CSM8PB-R2*10 or LVDT displacement sensor. The size of probe 2 is about 2mm.

[0048] Example 3

[0049] like Figure 1 , Figure 2 , Figure 3 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0050] A bracket 6 is fixed on the outer casing 1. The bracket 6 includes a fixing rod 610 and a cover plate 620. The upper end of the outer casing 1 is open. The cover plate 620 covers the upper end of the outer casing 1. The fixing rod 610 is outside the outer casing 1 and is fixed to the cover plate 620. The tail end of the probe 5 is fixed to the cover plate 620.

[0051] Example 4

[0052] like Figure 1 , Figure 2 , Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below:

[0053] The probe 2 is preferably made of ceramic rod. This is just an example, and other materials may be used in actual applications.

[0054] Example 5

[0055] like Figure 5 As shown, a method for detecting the angle of an optical chip in a 400G silicon photonics module, using the angle detection device as described in any of Examples 1 to 4, includes the following steps:

[0056] S10. Install the angle detection device on the XYZ axis electric guide rail. First, control the angle detection device to move in the XY axis direction. After moving to the target position, control the angle detection device to move along the Z axis. If the surface of the ceramic substrate on the PCB used to install the optical chip is in a horizontal state, when the lower end face of the probe 2 is flat with the surface, the probe 2 does not deflect around the ball bearing 3, the tray 4 remains in a horizontal state, and all probes 5 do not respond. Then the detection is qualified and the process ends.

[0057] If the surface on the ceramic substrate of the PCB used to mount the optical chip is not horizontal, when the lower end face of probe 2 is brought into contact with this surface, since the lower end face of probe 2 is horizontal while this surface is not horizontal, probe 2 will deflect around the ball bearing 3, that is, the angle changes and it becomes tilted, so as to make the lower end face of probe 2 flat with this surface. After probe 2 deflects, the tray 4 at the upper end of probe 2 will also deflect from the horizontal state to the tilted state, so that the probe 5 in contact with the tray 4 will undergo a displacement change (during this process, the outer shell 1 and probe 5 are always in a vertical state). All probes 5 send the displacement change to the signal processing terminal and enter S20.

[0058] S20. The signal processing end determines the changed coordinate values ​​based on the displacement changes of the four probes 5, and then calculates the angle of probe 2 and tray 4. This angle corresponds to the tilt angle of the surface of the ceramic substrate on the PCB used to mount the optical chip, and finally determines the tilt angle of the optical chip.

[0059] When the tray 4 is in a horizontal state, the spatial coordinates (x, y, z) of each probe 5 are first defined. When the tray 4 changes from a horizontal state to an inclined state, each probe 5 is displaced in the Z-axis direction, thus changing the z value (since the outer shell 1 and probe 5 are always in a vertical state, the x and y values ​​remain unchanged). Based on the amount of displacement change, the spatial coordinates of each probe 5 can be redefined.

[0060] Furthermore: In S20, the angle is calculated using the dot product formula based on the coordinate values ​​of the four probes 5 after their changes.

[0061] Assume the signal processing end defines the coordinate values ​​of the four probes 5 after the changes as follows:

[0062] ;

[0063] Calculate the direction vector:

[0064] vector ;

[0065] vector ;

[0066] Angle formula: ;

[0067] ;

[0068] Length ;

[0069] Length ;

[0070] Substituting the above values ​​into the formula for the included angle, we obtain:

[0071] ;

[0072] Based on the inverse cosine function, we know that:

[0073] , The range is .

[0074] A computer is preferred for signal processing. Of course, other devices may be used in actual applications; these are just examples of commonly used devices.

[0075] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for detecting the angle of an optical chip in a 400G silicon photonics module, characterized in that, Includes the following steps: S10. The angle detection device is installed on the XYZ axis electric guide rail. The angle detection device includes: a housing (1) and a probe (2). A ball bearing (3) is arranged below the housing (1). The outer ring of the ball bearing (3) is fixed to the housing (1). The middle of the probe (2) is fixed to the inner ring of the ball bearing (3). The upper and lower ends of the probe (2) are located inside and outside the housing (1) respectively. The lower end face of the probe (2) is horizontal. A horizontally distributed tray (4) is fixed inside the housing (1) at the upper end of the probe (2). Four probes (5) are arranged around the probe (2) and fixed to the housing (1) above the tray (4). The probe of each probe (5) is in contact with the tray (4). Each probe (5) is used to detect the displacement change of the tray (4). First, control the angle detection device to move in the XY axis direction. After moving to the target position, control the angle detection device to move along the Z axis. If the surface of the ceramic substrate on the PCB used to install the optical chip is in a horizontal state, when the lower end face of the probe (2) is flat with the surface, the probe (2) does not deflect around the ball bearing (3), the tray (4) remains in a horizontal state, and all probes (5) do not respond. Then the detection is qualified and ends. If the surface of the ceramic substrate on the PCB used to mount the optical chip is not horizontal, when the lower end face of the probe (2) is made to be flush with the surface, since the lower end face of the probe (2) is horizontal and the surface is not horizontal, the probe (2) will deflect around the ball bearing 3 and become tilted, so as to make the lower end face of the probe (2) flush with the surface. After the probe (2) deflects, the tray (4) at the upper end of the probe (2) will follow and deflect from the horizontal state to the tilted state, so that the probe (5) in contact with the tray (4) will undergo displacement change. All probes (5) send the displacement change to the signal processing end and enter S20. S20. The signal processing end determines the changed coordinate value based on the displacement change of the four probes (5), and then calculates the angle of the probe (2) and the tray (4). This angle corresponds to the tilt angle of the surface of the ceramic substrate on the PCB used to install the optical chip, and finally determines the tilt angle of the optical chip.

2. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 1, characterized in that, All probes (5) are distributed at equal angles around probe (2).

3. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 1 or 2, characterized in that, The probe (5) is an electromagnetic induction probe.

4. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 1, characterized in that, A bracket (6) is fixed on the outer shell (1).

5. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 4, characterized in that, The bracket (6) includes a fixing rod (610) and a cover plate (620). The upper end of the outer shell (1) is open, and the cover plate (620) covers the upper end of the outer shell (1). The fixing rod (610) is located outside the outer shell (1) and is fixed to the cover plate (620). The tail end of the probe (5) is fixed to the cover plate (620).

6. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 1, characterized in that, The probe (2) is a ceramic rod.

7. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 1, characterized in that, In S20, the angle is calculated using the dot product formula based on the coordinate values ​​of the four probes (5) after their changes.

8. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 7, characterized in that, Assume the signal processing end defines four probes (5) with the following coordinate values ​​after the changes: ； Calculate the direction vector: vector ; vector ; Angle formula: ; ； Length ; Length ; ； , The range is .

9. The method for detecting the angle of an optical chip in a 400G silicon photonics module according to claim 7, characterized in that, The signal processing is handled by a computer.

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