Electroplating process anomaly detection method and device and computer equipment

Abstract

The invention relates to an electroplating process anomaly detection method and device and computer equipment. The method comprises the steps that when a workpiece to be electroplated passes through a target electroplating area of electroplating equipment, a target electrical deviation value corresponding to the target electroplating area is obtained, and the target electrical deviation value is used for representing the difference value between an actual electrical value corresponding to the target electroplating area and a preset electrical value; the target electroplating area is any electroplating area in a plurality of electroplating areas of the electroplating equipment; if the target electrical deviation value is larger than a preset electrical deviation value corresponding to the target electroplating area, first abnormal information is output, and the first abnormal information is used for representing that fragments exist in the target electroplating area. By adopting the method, the fineness of anomaly detection in the electroplating process can be improved.

Description

Technical Field

[0001] This application relates to the field of industrial automation control technology, and in particular to a method, apparatus and computer equipment for detecting abnormalities in an electroplating process. Background Technology

[0002] Electroplating is a surface treatment process used to form a thin film on a metal surface to improve its appearance, corrosion resistance, and other properties. However, problems such as lamination, blockage, or fragmentation often occur during the electroplating process, which can lead to decreased product quality or even damage to equipment.

[0003] In related technologies, abnormal detection of the electroplating process is generally determined by judging whether the electroplating process has blocked the plate based on the time when the workpiece enters the electroplating equipment and the time when it leaves the electroplating equipment.

[0004] However, the accuracy of the above-mentioned methods for detecting abnormalities in the electroplating process is poor. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, apparatus, and computer equipment for detecting anomalies in the electroplating process that can improve the accuracy of detection, in order to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides a method for detecting anomalies in an electroplating process, including:

[0007] When the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment, the target electrical deviation value corresponding to the target electroplating area is obtained. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment.

[0008] If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, the first abnormal information is output. The first abnormal information is used to characterize the presence of fragments in the target electroplating area.

[0009] In one embodiment, the actual electrical value includes the actual voltage value, the preset electrical value includes the preset voltage value, and the preset electrical deviation value includes the preset voltage deviation value;

[0010] The method also includes:

[0011] Obtain multiple experimental voltage values;

[0012] The preset voltage deviation value is obtained based on the average value of multiple experimental voltage values ​​and the preset voltage value.

[0013] In one embodiment, the actual electrical value includes the actual current value, the preset electrical value includes the preset current value, and the preset electrical deviation value includes the preset current deviation value.

[0014] The method also includes:

[0015] Obtain multiple experimental current values;

[0016] The preset current deviation value is obtained by averaging the values ​​of multiple experimental current values ​​and the preset current value.

[0017] In one embodiment, the method further includes:

[0018] Obtain the actual feeding time of the workpiece at the inlet position of the electroplating equipment;

[0019] If the actual feeding time is less than the feeding time of the workpiece to be plated according to its specifications, then the second abnormal information is output. The second abnormal information is used to indicate that the workpiece to be plated is fragmented during the feeding stage.

[0020] In one embodiment, the method further includes:

[0021] If the actual feeding time exceeds the upper limit of the feeding time, the third abnormal information will be output. The upper limit of the feeding time is determined based on the specification feeding time and the feeding deviation time. The third abnormal information is used to characterize the stacking of the workpiece to be plated during the feeding stage.

[0022] In one embodiment, the method further includes:

[0023] Obtain the actual discharge time of the workpiece at the exit position of the electroplating equipment;

[0024] If the actual discharge time is less than the discharge time of the workpiece to be plated, the fourth abnormal information is output. The fourth abnormal information is used to indicate that the workpiece to be plated is fragmented during the discharge stage.

[0025] In one embodiment, the method further includes:

[0026] If the actual discharge time exceeds the upper limit of discharge time, the fifth abnormal information will be output. The upper limit of discharge time is determined based on the specification discharge time and the discharge deviation time. The fifth abnormal information is used to characterize the stacking of workpieces during the discharge stage.

[0027] In one embodiment, the method further includes:

[0028] Obtain the material entry time corresponding to the inlet position of the workpiece to be plated when it enters the electroplating equipment;

[0029] Based on the material entry time and the preset throughput range, the detection equipment is used to check whether the electroplating equipment is stuck during the process of processing the workpiece to be plated. The throughput range is determined based on the throughput time and throughput deviation time of the corresponding specifications of the electroplating equipment.

[0030] In one embodiment, based on the material entry time and a preset throughput range, the detection of whether plate blockage occurs during the plating process of the workpiece to be plated includes:

[0031] The discharge time range is obtained based on the material entry time and the passage time range;

[0032] If no workpiece to be plated is detected at the outlet position of the electroplating equipment within the discharge time range, the sixth abnormal information is output. The sixth abnormal information is used to indicate that the electroplating equipment is stuck during the process of processing the workpiece to be plated.

[0033] Secondly, this application also provides an electroplating process anomaly detection device, comprising:

[0034] The electrical deviation acquisition module is used to acquire the target electrical deviation value corresponding to the target electroplating area when the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment.

[0035] The electroplating area judgment module is used to output first abnormal information if the target electrical deviation value is less than the preset electrical deviation value corresponding to the target electroplating area. The first abnormal information is used to indicate that there are fragments in the target electroplating area.

[0036] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0037] When the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment, the target electrical deviation value corresponding to the target electroplating area is obtained. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment.

[0038] If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, the first abnormal information is output. The first abnormal information is used to characterize the presence of fragments in the target electroplating area.

[0039] The aforementioned electroplating process anomaly detection method, apparatus, and computer equipment acquire the target electrical deviation value corresponding to the target electroplating area when the electroplated workpiece passes through the target electroplating area of ​​the electroplating equipment. If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, the first anomaly information indicating the presence of fragments in the target electroplating area is output. In this way, by acquiring the corresponding target electrical deviation values ​​for multiple electroplating areas of the electroplating equipment and comparing the corresponding target electrical deviation values ​​with the preset electrical deviation values, it is possible to detect each electroplating area individually, determine the specific area where fragments occur during the electroplating process, and avoid the anomaly detection of the entire electroplating process based on the feeding and discharging times in related technologies. This approach can only identify whether the entire electroplating process has blocked the workpiece, but the occurrence of fragments during the electroplating process does not necessarily lead to blockage. Related technologies only detect whether the entire electroplating process has blocked the workpiece, resulting in low precision in anomaly detection. The aforementioned electroplating process anomaly detection method uses each electroplating area as the detection granularity and the target electrical deviation value corresponding to each electroplating area as the detection parameter, thereby improving the precision of anomaly detection during the electroplating process. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is an application environment diagram of an electroplating process anomaly detection method in one embodiment;

[0042] Figure 2 This is a flowchart illustrating an abnormality detection method for the electroplating process in one embodiment;

[0043] Figure 3 This is a flowchart illustrating an abnormality detection method for the electroplating process in another embodiment;

[0044] Figure 4 This is a flowchart illustrating an abnormality detection method for the electroplating process in another embodiment;

[0045] Figure 5 This is a flowchart illustrating an abnormality detection method for the electroplating process in another embodiment;

[0046] Figure 6 This is a flowchart illustrating an abnormality detection method for the electroplating process in another embodiment;

[0047] Figure 7 This is a structural block diagram of an electroplating process anomaly detection device in one embodiment;

[0048] Figure 8 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0050] The electroplating process anomaly detection method provided in this application embodiment can be applied to, for example... Figure 1 In the application scenario shown, the host computer 102 is connected to the electroplating equipment 104 and is used to acquire various working parameters of the electroplating equipment 104 during the working process, and to output corresponding control signals to control the electroplating equipment 104. The host computer 102 can be, but is not limited to, a terminal device such as a personal computer, laptop, smartphone, tablet, IoT device, and portable wearable device. The host computer 102 can also be a server, workstation, or other server-side device. For example, the electroplating equipment 104 can be, but is not limited to, various horizontal electroplating equipment, such as solar photovoltaic horizontal electroplating equipment or semiconductor wet horizontal electroplating equipment.

[0051] In one exemplary embodiment, such as Figure 2 As shown, a method for detecting anomalies in an electroplating process is provided, which can be applied to... Figure 1 Taking the host computer 102 as an example, the explanation includes the following steps 202 to 206. Wherein:

[0052] Step 202: When the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment, obtain the target electrical deviation value corresponding to the target electroplating area.

[0053] The target electroplating area is any one of the multiple electroplating areas in the electroplating equipment. In this embodiment, the electroplating area is used as the detection granularity. When the workpiece to be plated passes through each electroplating area in sequence, the target electrical deviation value corresponding to each electroplating area is obtained respectively.

[0054] For example, the workpiece to be plated can be a silicon wafer, such as a photovoltaic solar cell; or for example, the workpiece to be plated can be other metal sheets, such as copper sheets, nickel sheets, chromium sheets or zinc sheets, to provide a protective coating, increase corrosion resistance, improve appearance or increase conductivity.

[0055] The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The actual electrical value refers to the electrical data of the target electroplating area collected when the workpiece passes through it, while the preset electrical value refers to the electrical value set in advance according to the electroplating process requirements and control mode corresponding to the target electroplating area.

[0056] In one possible implementation, obtaining the target electrical deviation value corresponding to the target electroplating area includes: obtaining the actual electrical value corresponding to the target electroplating area, and obtaining the target electrical difference value based on the actual electrical value and a preset electrical value. The electrical value may include one or both of current and voltage values.

[0057] Step 204: If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, then output the first anomaly information. The first anomaly information is used to characterize the presence of debris in the target electroplating area.

[0058] The preset electrical deviation value refers to the voltage or current fluctuations that may occur in the electroplating tank of the electroplating equipment during normal operation. For example, the error between the collected electrical data value and the set value may be caused by the measurement error of the current sensor or voltage sensor, or the control error of the control circuit; or the deviation between the actual electrical value and the set value may be caused by changes in the concentration or temperature of the electrolyte solution.

[0059] Electroplating equipment typically includes multiple continuous electroplating tanks, each containing different electroplating liquids or pure water. The control mode (voltage control or current control) of each electroplating tank may also be different, resulting in different set voltages and / or set currents for each electroplating tank. Correspondingly, each electroplating tank corresponds to different preset electrical deviation values.

[0060] In one possible implementation, the preset electrical deviation value is pre-configured according to a certain proportion based on the specific magnitude of the electrical setting value.

[0061] In another possible implementation, the preset electrical deviation value is determined based on experimental data analysis. For example, the actual electrical value includes the actual voltage value; correspondingly, the preset electrical value includes the preset voltage value, and the preset electrical deviation value includes the preset voltage deviation value.

[0062] In this example, the provided method for detecting anomalies in the electroplating process further includes: acquiring multiple experimental voltage values, and obtaining a preset voltage deviation value based on the average value of the multiple experimental voltage values ​​and a preset voltage value.

[0063] For example, the process of obtaining the preset voltage deviation value can be as shown in Formula 1:

[0064] , Formula 1

[0065] in, This indicates the preset voltage deviation value. It is the experimental voltage value corresponding to the i-th experiment in the previous n groups of experiments. This indicates the preset voltage value.

[0066] In this example, the target electrical deviation value refers to the target voltage deviation value. If the target voltage deviation value is greater than the preset voltage deviation value, it is considered that the actual voltage value corresponding to the target electroplating area exceeds the fluctuation range during normal operation and there is fragmentation. At this time, the first abnormal information indicating that there is fragmentation in the target electroplating area is output.

[0067] For example, the actual electrical value includes the actual current value, and correspondingly, the preset electrical value includes the preset current value, and the preset electrical deviation value includes the preset current deviation value. In this example, the provided electroplating process anomaly detection method further includes: acquiring multiple experimental current values, and obtaining the preset current deviation value based on the multiple experimental current values, the average value, and the preset current value.

[0068] For example, the process of obtaining the preset current deviation value can be shown in Formula 2:

[0069] , Formula 2

[0070] in, This indicates the preset current deviation value. It is the experimental current value corresponding to the i-th experiment in the previous n experiments. This indicates the preset current value.

[0071] In this example, the target electrical deviation value refers to the target current deviation value. If the target current deviation value is greater than the preset current deviation value, it is considered that the actual current value corresponding to the target electroplating area exceeds the range of normal operation and there is debris. At this time, the first abnormal information indicating that there is debris in the target electroplating area is output.

[0072] For example, the actual electrical values ​​include both actual current values ​​and actual voltage values. Correspondingly, the preset electrical values ​​include preset current values ​​and preset voltage values, the preset electrical deviation values ​​include preset current deviation values ​​and preset voltage deviation values, and the target electrical deviation values ​​include target current deviation values ​​and target voltage deviation values. If the target current deviation value is greater than the preset current deviation value, and / or the target voltage deviation value is greater than the preset voltage deviation value, then it is considered that there are fragments in the target electroplating area, and the first abnormal information is output.

[0073] In the above-mentioned electroplating process anomaly detection method, when the electroplated workpiece passes through the target electroplating area of ​​the electroplating equipment, the target electrical deviation value corresponding to the target electroplating area is obtained. If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, the first anomaly information indicating the presence of fragments in the target electroplating area is output. In this way, by obtaining the corresponding target electrical deviation values ​​for multiple electroplating areas of the electroplating equipment, and comparing the corresponding target electrical deviation values ​​with the preset electrical deviation values, it is possible to detect each electroplating area one by one, and determine the specific area where fragments occur during the electroplating process. This avoids the problem in related technologies where anomaly detection is performed on the entire electroplating process based on the feeding and discharging times. This approach can only identify whether the entire electroplating process has blocked the workpiece, but the occurrence of fragments during the electroplating process does not necessarily lead to blockage. Related technologies only detect whether the entire electroplating process has blocked the workpiece, resulting in low precision in anomaly detection. The electroplating process anomaly detection method provided in this embodiment uses each electroplating area as the detection granularity and the target electrical deviation value corresponding to each electroplating area as the detection parameter, thereby improving the precision of anomaly detection during the electroplating process.

[0074] Please refer to Figure 3 In one exemplary embodiment, based on Figure 2 The embodiment shown further includes steps 302 to 304 in the electroplating process anomaly detection method, wherein:

[0075] Step 302: Obtain the actual feeding time of the workpiece to be plated at the inlet position of the electroplating equipment.

[0076] The inlet of the electroplating equipment can also be referred to as the feed port. It should be noted that when the electroplating process is started in the embodiments of this application, that is, when the workpiece to be plated enters the inlet of the electroplating equipment, it is assumed that the electroplating tank has been prepared, and the temperature, liquid level and flow rate in the electroplating tank meet the requirements of the electroplating process.

[0077] The actual feeding time is the time required for the workpiece to pass through the feed inlet of the electroplating equipment. For example, a photoelectric sensor is installed at the inlet of the electroplating equipment. When the workpiece begins to pass through the feed inlet, the photoelectric sensor detects and triggers a rising edge, recording the corresponding feed rising edge timestamp. When the workpiece to be plated enters the electroplating tank, the photoelectric sensor detects and triggers a falling edge, recording the corresponding falling edge timestamp. According to the timestamp of the rising edge of the feed. and feed fall edge timestamp The actual feeding time was obtained. ,Right now .

[0078] Step 304: If the actual feeding time is less than the feeding time of the workpiece to be plated, then output the second abnormal information. The second abnormal information is used to indicate that the workpiece to be plated is fragmented during the feeding stage.

[0079] The feeding time for each workpiece is determined based on its specifications and the position at the entrance of the electroplating equipment. Different workpieces have different lengths, therefore the feeding time varies depending on their specifications.

[0080] In one possible implementation, the feed time for the workpiece to be plated is determined by: obtaining the length of the workpiece and the current electroplating line speed of the electroplating equipment; and obtaining the feed time for the workpiece based on the length and the electroplating speed. For example, the process of obtaining the feed time can be as shown in Formula 3:

[0081] ; Formula 3

[0082] in, This indicates the feeding time for the workpiece of the specified size. Indicates the length of the workpiece to be plated. This indicates the current electroplating line speed of the electroplating equipment.

[0083] In this embodiment, the feeding time can be dynamically adjusted in real time according to the specifications of the workpiece to be plated, thereby improving the flexibility and accuracy of the abnormal detection method in the electroplating process.

[0084] If the actual feeding time is less than the feeding time for the corresponding specification of the workpiece to be plated, it is considered that the workpiece to be plated has broken during the feeding stage, and the second abnormal information is output.

[0085] In one possible implementation, the electroplating process anomaly detection method provides a method that controls the electroplating equipment to stop feeding materials while outputting a second anomaly information.

[0086] In one possible implementation, please continue to refer to Figure 3 The provided electroplating process anomaly detection method may further include step 306, whereby if the actual feeding time exceeds the upper limit of the feeding time, a third anomaly information is output. This third anomaly information is used to characterize the stacking of workpieces during the feeding stage.

[0087] Among them, the upper limit of feeding time Feeding time based on specifications Feed deviation time Confirmed. For example, feed deviation time. It can be determined based on previous experiments. For example, the feed deviation time determined based on multiple previous experiments. Given a value in the range [300ms, 500ms], convert the specified feed time into a millisecond variable, add it to the feed deviation, and determine the upper limit of the feed time. .

[0088] Another example is the feed time deviation time. It can also be based on the feeding time of the specifications. Determined based on experience and proportions.

[0089] In this embodiment, when the actual feeding time exceeds the upper limit of the feeding time, it is considered that the time consumed by the workpiece to be plated in the feeding stage exceeds the time that can be accepted by normal feeding. That is, it is considered that the stacking occurs in the feeding stage, which delays the time when the falling edge should occur.

[0090] In one possible implementation, if the actual feeding time is greater than or equal to the specified feeding time, and less than or equal to the upper limit of the feeding time, the workpiece to be plated is considered to be fed normally during the feeding stage, and the electroplating equipment is controlled to continue to perform subsequent electroplating operations.

[0091] In one possible implementation, the electroplating process anomaly detection method provides a method that controls the electroplating equipment to stop feeding materials while outputting a third anomaly information.

[0092] In one possible implementation, it is different from Figure 3 In the embodiment shown in step 306, the electroplating process anomaly detection method provided in this embodiment outputs a third anomaly information if the ratio of the actual feeding time to the specified feeding time is greater than a preset ratio. The preset ratio ranges from 1.3 to 1.7, preferably 1.5. In this embodiment, when the ratio of the actual feeding time to the specified feeding time is greater than the preset ratio, it is considered that the workpiece to be plated overlaps with the next workpiece to be plated during the feeding stage, and the third anomaly information is output, controlling the electroplating equipment to stop feeding.

[0093] In the electroplating process anomaly detection method provided in the above embodiments, during the feeding stage of the workpiece to be plated, the actual feeding time is obtained to determine whether an anomaly occurs in the feeding stage. If an anomaly occurs, the corresponding anomaly information is output in a timely manner to issue an alarm, further improving the precision of anomaly detection in the electroplating process. At the same time, the corresponding feeding time is determined for different specifications of workpieces to be plated, realizing dynamic adjustment of the anomaly detection standard in the feeding stage, which has high flexibility and high accuracy.

[0094] Please refer to Figure 4 In one exemplary embodiment, based on Figure 2 The embodiment shown further includes steps 402 to 404 in the electroplating process anomaly detection method, wherein:

[0095] Step 402: Obtain the actual discharge time of the workpiece to be plated at the exit position of the electroplating equipment.

[0096] The outlet position of the electroplating equipment can also be referred to as the discharge port. The actual discharge time is the time required for the workpiece to pass through the discharge port of the electroplating equipment. For example, the outlet and position of the electroplating equipment are equipped with photoelectric sensors. When the workpiece exits the electroplating area and begins to enter the discharge port, the photoelectric sensor detects and triggers a rising edge, recording the corresponding discharge rising edge timestamp. When the workpiece to be plated has completely exited the outlet, the photoelectric sensor detects and triggers a falling edge, recording the corresponding falling edge timestamp. According to the timestamp of the rising edge of the discharge. and discharge fall edge timestamp To obtain the actual discharge time ,Right now .

[0097] Step 304: If the actual discharge time is less than the discharge time of the workpiece to be plated, then output the fourth abnormal information. The fourth abnormal information is used to indicate that the workpiece to be plated is fragmented during the discharge stage.

[0098] Similar to the feed time, the discharge time is determined based on the specifications of the workpiece according to its specifications, following its exit position from the electroplating equipment. Different workpieces have different lengths, therefore, different workpieces require different discharge times. Generally, for the same workpiece, the discharge time is the same as the feed time. For example, the provided electroplating process anomaly detection method performs fragment detection both in the feed and discharge stages, allowing the feed time to replace the discharge time. The determination of the discharge time is similar to that of the feed time and will not be repeated here. For ease of description, the discharge time is referred to as... .

[0099] In this embodiment, the material discharge time can be dynamically adjusted in real time according to the workpiece to be plated, thereby improving the flexibility and accuracy of the abnormal detection method in the electroplating process.

[0100] If the actual discharge time is less than the discharge time of the workpiece to be plated, it is considered that the workpiece to be plated has broken during the discharge stage, and the fourth abnormal information is output.

[0101] In one possible implementation, the provided electroplating process anomaly detection method controls the electroplating equipment to stop feeding material while outputting the fourth anomaly information, so as to conduct an inspection and prevent the fragmentation situation in the discharge stage from affecting the quality of the subsequent electroplating process.

[0102] In one possible implementation, please continue to refer to Figure 4 The provided electroplating process anomaly detection method may further include step 406: if the actual unloading time exceeds the upper limit of the unloading time, then output the fifth anomaly information. The fifth anomaly information is used to characterize the stacking of workpieces during the unloading stage.

[0103] Among them, the upper limit of material discharge time Based on specifications and discharge time and discharge deviation time Confirmed. For example, similar to the feed deviation time, the discharge deviation time... It can also be determined based on previous experiments; the specific methods will not be elaborated here.

[0104] Another example is the time deviation from the feed sheet. Similarly, the time deviation of the discharge time It can also be based on the material output time according to specifications. Determined based on experience and proportions.

[0105] In this embodiment, when the actual unloading time exceeds the upper limit of the unloading time, it is considered that the time consumed by the workpiece to be plated in the unloading stage exceeds the time that can be accepted by normal unloading. That is, it is considered that the unloading stage is stacked, which delays the time when the falling edge should occur.

[0106] In one possible implementation, if the actual discharge time is greater than or equal to the specified discharge time, but less than or equal to the upper limit of the discharge time, the workpiece to be plated is considered to be discharged normally during the discharge stage, and the electroplating equipment is controlled to continue to perform subsequent electroplating operations.

[0107] In one possible implementation, the electroplating process anomaly detection method provides a method that controls the electroplating equipment to stop feeding materials while outputting the fifth anomaly information.

[0108] In one possible implementation, it is different from Figure 4 In the embodiment shown in step 406, the electroplating process anomaly detection method provided in this embodiment outputs a fifth anomaly message if the ratio of the actual discharge time to the specified discharge time is greater than a preset ratio. The preset ratio ranges from 1.3 to 1.7, preferably 1.5. In this embodiment, when the ratio of the actual discharge time to the specified discharge time is greater than the preset ratio, it is considered that the workpiece to be plated overlaps with the next workpiece to be plated during the discharge stage, and the fifth anomaly message is output, controlling the electroplating equipment to stop feeding.

[0109] In the electroplating process anomaly detection method provided in the above embodiments, during the unloading stage of the workpiece to be plated, the actual unloading time is obtained to determine whether an anomaly occurs in the unloading stage of the workpiece to be plated. If an anomaly occurs, the corresponding anomaly information is output in a timely manner to issue an alarm, so as to avoid affecting the unloading quality of subsequent workpieces to be plated and further improve the precision of anomaly detection in the electroplating process. At the same time, the corresponding unloading time is determined for different specifications of workpieces to be plated, so as to realize the dynamic adjustment of the anomaly detection standard in the unloading stage, which has high flexibility and high accuracy.

[0110] Please refer to Figure 5 In one exemplary embodiment, based on Figure 3 The embodiment shown further includes steps 502 to 504 in the electroplating process anomaly detection method, wherein:

[0111] Step 502: Obtain the feeding entry time corresponding to the inlet position of the workpiece to be plated when it enters the electroplating equipment.

[0112] For example, the feed entry time can be a timestamp of the feed rising edge detected and recorded by the feed sensor. .

[0113] Step 504: Based on the material entry time and the preset throughput range, detect whether the electroplating equipment is stuck during the process of processing the workpiece to be plated. The throughput range is determined based on the throughput time and throughput deviation time of the corresponding specifications of the electroplating equipment.

[0114] The specifications of the electroplating equipment are determined by the time duration t based on the distance s between the inlet and outlet positions and the current electroplating linear speed v of the equipment. For example, the distance s is defined as the distance between the inlet sensor located at the inlet and the outlet sensor located at the outlet. In this embodiment, the throughput range is dynamically determined based on the specifications of the electroplating equipment, which can adapt to electroplating equipment with different electroplating tank lengths, offering good flexibility and accuracy.

[0115] Among them, through deviation time This is related to the length of the electroplating zone and the electroplating linear speed v of the electroplating equipment. Generally, the longer the electroplating zone, the shorter the deviation time. The larger the area, the shorter the length of the electroplated region, and the shorter the deviation time. The smaller the value, the higher the electroplating line speed of the electroplating equipment, and the shorter the deviation time. The smaller the value, the lower the electroplating line speed and the shorter the deviation time. The larger the deviation, the better. For example, the corresponding throughput time for this electroplating equipment is determined based on multiple sets of experiments. For example, the throughput deviation time corresponding to the electroplating equipment is determined based on multiple sets of experiments. A mapping table between the electroplating equipment and the multiple electroplating line speeds it supports; when determining whether plate clogging occurs during the processing of the workpiece, the current electroplating line speed is obtained, and the corresponding throughput deviation time is determined from the mapping table. Therefore, the time range was determined. Optionally, by deviation time The value range is from 1000ms to 1500ms.

[0116] In one possible implementation, the process of detecting whether a plate blockage occurs in the electroplating equipment during the processing of the workpiece to be plated, based on the material entry time and a preset throughput range, includes: obtaining an exit time range based on the material entry time and throughput range; if no workpiece to be plated is detected at the exit position of the electroplating equipment within the exit time range, a sixth abnormality message is output, which indicates that a plate blockage has occurred in the electroplating equipment during the processing of the workpiece. For example, simultaneously with outputting the sixth abnormality message, the electroplating equipment is controlled to stop feeding material.

[0117] If the workpiece to be plated is detected at the outlet of the electroplating equipment within the discharge time range, it is considered that no blockage occurred in the electroplating equipment during the processing of the workpiece, and the electroplating process is normal.

[0118] For example, if the workpiece to be plated is not detected at the outlet position of the electroplating equipment within the discharge time range, it can be determined by whether a discharge rising edge timestamp is received within the discharge time range.

[0119] In one possible implementation, the process of detecting whether the electroplating equipment is experiencing plate blockage during the processing of the workpiece to be plated, based on the material entry time and a preset throughput range, includes: obtaining the upper limit of the discharge time based on the material entry time and throughput range; obtaining the material entry time; comparing the material entry time with the upper limit of the discharge time; if the material entry time is less than or equal to the upper limit of the discharge time, it is determined that no plate blockage has occurred during the processing of the workpiece to be plated by the electroplating equipment; if the material entry time is greater than the upper limit of the discharge time, it is determined that plate blockage has occurred during the processing of the workpiece to be plated by the electroplating equipment.

[0120] In one exemplary embodiment, such as Figure 6 As shown, a method for detecting anomalies in an electroplating process is provided, which can be applied to... Figure 1 Taking the host computer 102 as an example, the explanation includes the following steps 602 to 634. Wherein:

[0121] Step 602: Obtain the material entry time and material completion time of the workpiece to be plated at the inlet position of the electroplating equipment. The material entry time can be the rising edge timestamp of the material entry obtained by the inlet position sensor, and the material completion time can be the falling edge timestamp of the material entry obtained by the inlet position sensor.

[0122] Step 604: Obtain the actual feeding time based on the feeding entry time and feeding completion time.

[0123] Step 606: Determine whether the actual feeding time is less than the feeding time corresponding to the specifications of the workpiece to be plated.

[0124] Step 608: If the actual feeding time is less than the feeding time of the workpiece to be plated, then output the second abnormal information. The second abnormal information is used to characterize the workpiece to be plated breaking during the feeding stage.

[0125] Step 610: If the actual feeding time is greater than or equal to the feeding time of the workpiece to be plated, then determine whether the actual feeding time is greater than the upper limit of the feeding time; wherein, the upper limit of the feeding time is determined based on the feeding time of the specification and the feeding deviation time.

[0126] Step 612: If the actual feeding time exceeds the upper limit of the feeding time, the third abnormal information is output. The third abnormal information is used to characterize that the workpiece to be plated is stacked during the feeding stage.

[0127] Step 614: If the actual feeding time is less than or equal to the upper limit of the feeding time, when the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment, the target electrical deviation value corresponding to the target electroplating area is obtained. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment.

[0128] Step 616: Determine whether the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area.

[0129] Optionally, the actual electrical value includes at least one of the actual voltage value and the actual current value; correspondingly, the preset electrical value includes at least one of the preset voltage value and the preset current value; and the preset electrical deviation value includes at least one of the preset voltage deviation value and the preset current deviation value. The preset voltage deviation value is obtained through the following steps: obtaining multiple experimental voltage values, and obtaining the preset voltage deviation value based on the average of the multiple experimental voltage values ​​and the preset voltage value. The preset current deviation value is obtained through the following steps: obtaining multiple experimental current values, and obtaining the preset current deviation value based on the average of the multiple experimental current values ​​and the preset current value.

[0130] Step 618: If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, then output the first abnormal information, wherein the first abnormal information is used to characterize the presence of fragments in the target electroplating area.

[0131] Step 620: If the target electrical deviation value is less than or equal to the preset electrical deviation value corresponding to the target electroplating area, the discharge time range is obtained based on the material entry time and the preset throughput time range.

[0132] Step 622: Determine whether the workpiece to be plated is detected at the outlet position of the electroplating equipment within the discharge time range.

[0133] Step 624: If no workpiece to be plated is detected at the outlet position of the electroplating equipment within the discharge time range, the sixth abnormal information is output. The sixth abnormal information is used to indicate that the electroplating equipment is blocked during the process of processing the workpiece to be plated.

[0134] Step 626: If the workpiece to be plated is detected at the outlet position of the electroplating equipment within the discharge time range, then obtain the actual discharge time corresponding to the outlet position of the electroplating equipment for the workpiece to be plated.

[0135] Step 628: Determine whether the actual material output time is less than the material output time corresponding to the specifications of the workpiece to be plated.

[0136] Step 630: If the actual discharge time is less than the discharge time of the workpiece to be plated, then output the fourth abnormal information. The fourth abnormal information is used to characterize the workpiece to be plated breaking during the discharge stage.

[0137] Step 632: If the actual output time is greater than or equal to the output time of the corresponding specification of the workpiece to be plated, then determine whether the actual output time is greater than the upper limit of the output time.

[0138] Step 634: If the actual discharge time exceeds the upper limit of the discharge time, output the fifth abnormal information. The upper limit of the discharge time is determined based on the specification discharge time and the discharge deviation time. The fifth abnormal information is used to characterize the stacking of the workpiece to be plated during the discharge stage.

[0139] If the actual discharge time is less than or equal to the upper limit of the discharge time, it is considered that there are no abnormalities in the entire electroplating process of the workpiece to be plated, including the feeding, electroplating, and discharge stages, and the abnormality detection process for the workpiece to be plated ends. For example, the electroplating equipment is controlled to continue to operate normally.

[0140] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps. For example, the process corresponding to steps 614 to 618 is executed sequentially for each area to be plated. It can be understood that in this embodiment, if all electroplating areas work normally without fragmentation, the number of times steps 614 to 618 are executed is the same as the number of electroplating areas.

[0141] Understandably, since the length of the electroplating area is generally much greater than the length of the workpiece to be plated, and the operation of the electroplating equipment is continuous, while performing anomaly detection on the target electroplating area for the first workpiece to be plated, anomaly detection in the feeding stage for the second workpiece to be plated may begin simultaneously. It should be noted that steps 602 to 634 above refer to the entire execution process for a single workpiece to be plated. The start and end points in the flowchart refer to the start and end times of the electroplating equipment processing a single workpiece, and should not be taken as the start and end points of the detection of the entire electroplating equipment's operation process.

[0142] In one possible implementation, a buffer of feed rise edge timestamp and discharge rise edge timestamp data can be established to facilitate the reading of the feed rise edge timestamp of the corresponding workpiece to be plated during the discharge stage, so as to determine whether a blockage has occurred during the electroplating process. For example, the feed rise edge timestamp and discharge rise edge timestamp are stored in the form of a structure array. During the initialization phase of this detection process, the structure array is cleared, and the feed rise edge timestamp corresponding to the first workpiece to be plated is stored in the array element with the number 0. In subsequent detection processes, the array elements are shifted sequentially, that is, the latest obtained feed rise edge timestamp is stored in the array element with the number 0, and the numbers of the other array elements are incremented by 1. For example, when determining whether there is a blockage in the electroplating process, the corresponding feed rise edge timestamp is read from the array element with the largest number, and the discharge rise edge timestamp is stored in the data element. Afterwards, the array element can be deleted from the structure array. For another example, when determining whether there is a blockage in the electroplating process, the data is traversed, and the array element with the largest number is read from the array element with the discharge rise edge timestamp being null to obtain the corresponding feed rise edge timestamp in order to determine whether there is a blockage in the electroplating process.

[0143] It is understood that the term "based on" as used in this application is used to describe one or more factors that influence the determination, but does not exclude other factors that may influence the determination. For example, the phrase "determine A based on B" means that the determination of A can be based entirely or at least partially on factor B. That is, B is a factor that influences the determination of A, but does not exclude the fact that the determination of A is also based on C.

[0144] Based on the same inventive concept, this application also provides an electroplating process anomaly detection device for implementing the electroplating process anomaly detection method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the electroplating process anomaly detection device provided below can be found in the limitations of the electroplating process anomaly detection method described above, and will not be repeated here.

[0145] In one exemplary embodiment, such as Figure 7 As shown, an electroplating process anomaly detection device is provided, including: an electrical deviation acquisition module 702 and an electroplating area judgment module 704, wherein:

[0146] The electrical deviation acquisition module 702 is used to acquire the target electrical deviation value corresponding to the target electroplating area when the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment.

[0147] The electroplating area judgment module 704 is used to output first abnormal information if the target electrical deviation value is less than the preset electrical deviation value corresponding to the target electroplating area. The first abnormal information is used to indicate that there are fragments in the target electroplating area.

[0148] In an exemplary embodiment, the actual electrical value includes the actual voltage value, the preset electrical value includes the preset voltage value, and the preset electrical deviation value includes the preset voltage deviation value; wherein, the device further includes a preset value acquisition module, used to acquire multiple experimental voltage values, and obtain the preset voltage deviation value based on the average value of the multiple experimental voltage values ​​and the preset voltage value.

[0149] In an exemplary embodiment, the actual electrical value includes the actual current value, the preset electrical value includes the preset current value, and the preset electrical deviation value includes the preset current deviation value; wherein, the preset value acquisition module is used to acquire multiple experimental current values, and obtain the preset current deviation value based on the average value of the multiple experimental current values ​​and the preset current value.

[0150] In an exemplary embodiment, the device further includes a feeding time acquisition module and a feeding stage determination module, wherein:

[0151] The feeding time acquisition module is used to acquire the actual feeding time of the workpiece to be plated at the inlet position of the electroplating equipment.

[0152] The feeding stage judgment module is used to output a second abnormal information if the actual feeding time is less than the feeding time of the workpiece to be plated. The second abnormal information is used to indicate that the workpiece to be plated has broken during the feeding stage.

[0153] In an exemplary embodiment, the feeding stage judgment module is used to output third abnormal information if the actual feeding time is greater than the upper limit of the feeding time. The upper limit of the feeding time is determined based on the specification feeding time and the feeding deviation time. The third abnormal information is used to characterize that the workpiece to be plated is stacked during the feeding stage.

[0154] In an exemplary embodiment, the device further includes a discharge time acquisition module and a discharge stage determination module, wherein:

[0155] The discharge time acquisition module is used to obtain the actual discharge time of the workpiece to be plated at the exit position of the electroplating equipment.

[0156] The material discharge stage judgment module is used to output the fourth abnormal information if the actual material discharge time is less than the material discharge time corresponding to the specifications of the workpiece to be plated. The fourth abnormal information is used to indicate that the workpiece to be plated has broken during the material discharge stage.

[0157] In an exemplary embodiment, the material discharge stage judgment module is used to output a fifth abnormality information if the actual material discharge time exceeds the upper limit of the material discharge time. The upper limit of the material discharge time is determined based on the specification material discharge time and the material discharge deviation time. The fifth abnormality information is used to characterize that the workpiece to be plated is stacked during the material discharge stage.

[0158] In an exemplary embodiment, the feeding time acquisition module is further used to acquire the feeding entry time corresponding to the entry position of the workpiece to be plated when it enters the electroplating equipment; wherein, the device further includes an electroplating blockage judgment module, used to detect whether the electroplating equipment has blockage during the process of processing the workpiece to be plated according to the feeding entry time and a preset throughput time range, wherein the throughput time range is determined based on the throughput time and throughput deviation time of the corresponding specifications of the electroplating equipment.

[0159] In one exemplary embodiment, the electroplating blockage determination module is used to obtain the discharge time range based on the material entry time and the range of the passage time;

[0160] If no workpiece to be plated is detected at the outlet position of the electroplating equipment within the discharge time range, the sixth abnormal information is output. The sixth abnormal information is used to indicate that the electroplating equipment is stuck during the process of processing the workpiece to be plated.

[0161] Each module in the aforementioned electroplating process anomaly detection device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0162] In one exemplary embodiment, a computer device is provided, which may be a host computer device, and its internal structure diagram may be as follows. Figure 8 As shown, this computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operating system and computer programs stored in the non-volatile storage media. The database stores data that needs to be stored and retrieved when executing the electroplating process anomaly detection method. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communicating with external terminals via a network connection. When the computer program is executed by the processor, it implements an electroplating process anomaly detection method.

[0163] Those skilled in the art will understand that Figure 8 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0164] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0165] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0166] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0167] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0168] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0169] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0170] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for detecting anomalies in an electroplating process, characterized in that, The method includes: When the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment, the target electrical deviation value corresponding to the target electroplating area is obtained. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment. If the target electrical deviation value is greater than the preset electrical deviation value corresponding to the target electroplating area, then the first abnormal information is output, which is used to indicate that there are fragments in the target electroplating area.

2. The method according to claim 1, characterized in that, The actual electrical value includes the actual voltage value, the preset electrical value includes the preset voltage value, and the preset electrical deviation value includes the preset voltage deviation value; The method further includes: Obtain multiple experimental voltage values; The preset voltage deviation value is obtained based on the average value of the multiple experimental voltage values ​​and the preset voltage value.

3. The method according to claim 1, characterized in that, The actual electrical value includes the actual current value, the preset electrical value includes the preset current value, and the preset electrical deviation value includes the preset current deviation value; The method further includes: Obtain multiple experimental current values; The preset current deviation value is obtained based on the average value of the multiple experimental current values ​​and the preset current value.

4. The method according to claim 1, characterized in that, The method further includes: Obtain the actual feeding time of the workpiece to be plated at the inlet position of the electroplating equipment; If the actual feeding time is less than the feeding time corresponding to the specification of the workpiece to be plated, then a second abnormal information is output. The second abnormal information is used to indicate that the workpiece to be plated has broken during the feeding stage.

5. The method according to claim 4, characterized in that, The method further includes: If the actual feeding time exceeds the upper limit of the feeding time, a third abnormal information is output. The upper limit of the feeding time is determined based on the specified feeding time and the feeding deviation time. The third abnormal information is used to characterize that the workpiece to be plated is stacked during the feeding stage.

6. The method according to claim 1, characterized in that, The method further includes: Obtain the actual discharge time of the workpiece to be plated at the outlet position of the electroplating equipment; If the actual discharge time is less than the discharge time corresponding to the specification of the workpiece to be plated, then a fourth abnormality information is output. The fourth abnormality information is used to indicate that the workpiece to be plated is fragmented during the discharge stage.

7. The method according to claim 6, characterized in that, The method further includes: If the actual discharge time exceeds the upper limit of the discharge time, the fifth abnormal information is output. The upper limit of the discharge time is determined based on the specified discharge time and the discharge deviation time. The fifth abnormal information is used to characterize that the workpiece to be plated is stacked during the discharge stage.

8. The method according to claim 4, characterized in that, The method further includes: Obtain the feeding entry time corresponding to the inlet position of the workpiece to be plated when it enters the electroplating equipment; Based on the material entry time and the preset throughput range, the electroplating equipment is used to detect whether a plate blockage occurs during the processing of the workpiece to be plated. The throughput range is determined based on the throughput time and throughput deviation time corresponding to the specifications of the electroplating equipment.

9. The method according to claim 8, characterized in that, The step of detecting whether the electroplating equipment experiences plate blockage during the processing of the workpiece to be plated, based on the material entry time and a preset throughput range, includes: Based on the material entry time and the passage time range, the discharge time range is obtained; If the workpiece to be plated is not detected at the outlet position of the electroplating equipment within the discharge time range, a sixth abnormality information is output. The sixth abnormality information is used to indicate that the electroplating equipment is blocked during the processing of the workpiece to be plated.

10. An electroplating process abnormality detection device, characterized in that, The device includes: The electrical deviation acquisition module is used to acquire the target electrical deviation value corresponding to the target electroplating area when the workpiece to be plated passes through the target electroplating area of ​​the electroplating equipment. The target electrical deviation value is used to characterize the difference between the actual electrical value and the preset electrical value corresponding to the target electroplating area. The target electroplating area is any one of the multiple electroplating areas of the electroplating equipment. The electroplating area determination module is used to output first abnormal information if the target electrical deviation value is less than the preset electrical deviation value corresponding to the target electroplating area. The first abnormal information is used to indicate that there are fragments in the target electroplating area.

11. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 9.

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