Inductor component

Abstract

The present invention provides an inductor component capable of suppressing a decrease in insulating properties of a wiring conductor and improving inductance acquisition efficiency. The inductor component includes: a base insulating layer having a base upper surface; the first wall part is arranged on the upper surface of the base part and extends around a rotating shaft in the vertical direction; the second wall part is arranged on the upper surface of the base part and extends in parallel with the first wall part around the rotating shaft; a wiring conductor located between the first wall portion and the second wall portion on the upper surface of the base portion and having a conductor upper surface which is a surface opposite to a surface in contact with the base portion insulating layer in the vertical direction; a covering insulating layer laminated on the upper surface of the conductor; and a magnetic body. The cover insulating layer has: a cover portion that overlaps the wiring conductor in plan view; and a protruding portion located on the opposite side of the covering portion with respect to the first wall portion in the radial direction with respect to the rotating shaft. The thickness of the protruding part is smaller than that of the covering part.

Description

Technical Field

[0001] This disclosure relates to inductor components. Background Technology

[0002] The coil component of Patent Document 1 includes a first magnetic component, a second magnetic component, and a third magnetic component; multiple conductor layers disposed between the first and second magnetic components; and multiple insulating resin layers disposed between the conductor layers. Each conductor layer comprises a helical pattern wound into a spiral shape. The third magnetic component is embedded in the inner diameter region of the helical pattern. Each insulating resin layer has protrusions extending into the inner diameter region.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-152043

[0004] In the coil component of Patent Document 1, there is still room for improvement in suppressing the reduction of insulation of the wiring conductor and improving the efficiency of inductance acquisition. Summary of the Invention

[0005] The purpose of this disclosure is to provide an inductor component that can suppress the reduction of insulation of the wiring conductor and improve the efficiency of inductance acquisition.

[0006] One aspect of the inductor component disclosed herein includes:

[0007] A base insulating layer having a base upper surface;

[0008] The first wall portion is provided on the upper surface of the base portion and extends about a rotation axis in the vertical direction intersecting the upper surface of the base portion;

[0009] The second wall portion is disposed on the upper surface of the base portion and extends parallel to the first wall portion around the rotation axis;

[0010] A wiring conductor has a base upper surface located between the first wall and the second wall, and has a conductor upper surface, wherein the conductor upper surface is the opposite side of the surface in contact with the base insulation layer in the vertical direction.

[0011] An insulating layer is laminated onto the upper surface of the conductor; and

[0012] A magnetic material covering the aforementioned base insulating layer, the aforementioned first wall portion, the aforementioned second wall portion, the aforementioned wiring conductor, and the aforementioned covering insulating layer.

[0013] The above-mentioned covering insulation layer has:

[0014] The covering portion overlaps with the wiring conductor when viewed from above in the aforementioned vertical direction; and

[0015] The protrusion, radially relative to the aforementioned axis of rotation, is located on the side opposite to the aforementioned covering portion relative to the aforementioned first wall portion.

[0016] The thickness of the protrusion in the vertical direction is less than the thickness of the covering portion.

[0017] The inductor component according to the above method can suppress the reduction of insulation of the wiring conductor and improve the inductance efficiency. Attached Figure Description

[0018] Figure 1 This is a top view showing an inductor component according to one embodiment of the present disclosure.

[0019] Figure 2 It is along Figure 1 A sectional view along line II-II.

[0020] Figure 3 It is used for Figure 1 A plan view illustrating the layers of the first and third inductor wiring of the inductor component.

[0021] Figure 4 It is used for Figure 1 A plan view illustrating the layers of the second and fourth inductor wiring of the inductor component.

[0022] Figure 5 It is magnification Figure 2 The cross-sectional view of region Z1 shown.

[0023] Figure 6 It is along Figure 1 A sectional view along line VI-VI.

[0024] Figure 7 It is magnification Figure 5 The cross-sectional view of region Z2 shown.

[0025] Figure 8 It is magnification Figure 5 The cross-sectional view of region Z3 shown.

[0026] Figure 9 It is magnification Figure 6 The cross-sectional view of region Z4 shown.

[0027] Figure 10 It means Figure 1 A cross-sectional view of a first modified example of an inductor component.

[0028] Figure 11 It means Figure 1 A cross-sectional view of a second modified example of an inductor component.

[0029] Figure 12 It is used for Figure 1 The first figure illustrates an example of a method for manufacturing an inductor component.

[0030] Figure 13 It is used for Figure 1 The second figure illustrates an example of a method for manufacturing an inductor component.

[0031] Figure 14 It is used for Figure 1 The third figure illustrates an example of a method for manufacturing an inductor component.

[0032] Figure 15 It is used for Figure 1 The fourth figure illustrates an example of a method for manufacturing an inductor component.

[0033] Figure 16 It is used for Figure 1 Figure 5 illustrates an example of a method for manufacturing an inductor component.

[0034] Figure 17 It is used for Figure 1 The sixth figure illustrates an example of a method for manufacturing an inductor component.

[0035] Figure 18 It is used for Figure 1 Figure 7 illustrates an example of a method for manufacturing an inductor component.

[0036] Figure 19 It is used for Figure 1 Figure 8 illustrates an example of a method for manufacturing an inductor component.

[0037] Figure 20 It is used for Figure 1 Figure 9 illustrates an example of a method for manufacturing an inductor component.

[0038] Figure 21 It is used for Figure 1 Figure 10 illustrates an example of a method for manufacturing an inductor component.

[0039] Description of Reference Numerals

[0040] 1…Inductor component; 2…Magnetic body; 202…Main surface; 51-54…Through-hole conductor; 51c…Through-hole conductor side; 61…Connecting wiring; 71…Base insulation layer; 71a…Base upper surface; 72…Covering insulation layer; 72a…Covering lower surface; 72b…Covering upper surface; 72c…Covering side; 721…Covering portion; 722…Protrusion; 722b…Protrusion side; 722c…First straight portion; 722d…Second straight portion; 722f…Curved portion; 722g…Lower end; 723…Middle portion; 73…First… 73a…inner wall surface; 73b…outer wall surface; 731…lower edge; 732…upper edge; 74…third wall; 75…upper covering insulation layer; 751…upper covering; 752…upper protrusion; 76…second wall; 761…lower edge; 762…upper edge; 77…fourth wall; 81…wiring conductor; 81a…upper surface of conductor; 818…pad portion; 82…upper wiring conductor; 82a…upper surface of upper conductor; 101-106…external terminals; A1…first rotating axis; A2…second rotating axis. Detailed Implementation

[0041] The various methods of this disclosure are described.

[0042] According to a first aspect of this disclosure, an inductor component is provided, comprising:

[0043] A base insulating layer having a base upper surface;

[0044] The first wall portion is provided on the upper surface of the base portion and extends about a rotation axis in the vertical direction intersecting the upper surface of the base portion;

[0045] The second wall portion is disposed on the upper surface of the base portion and extends parallel to the first wall portion around the rotation axis;

[0046] A wiring conductor has a base upper surface located between the first wall and the second wall, and has a conductor upper surface, wherein the conductor upper surface is the opposite side of the surface in contact with the base insulation layer in the vertical direction.

[0047] An insulating layer is laminated onto the upper surface of the conductor; and

[0048] A magnetic material covering the aforementioned base insulating layer, the aforementioned first wall portion, the aforementioned second wall portion, the aforementioned wiring conductor, and the aforementioned covering insulating layer.

[0049] The above-mentioned covering insulation layer has:

[0050] The covering portion overlaps with the wiring conductor when viewed from above in the aforementioned vertical direction; and

[0051] The protrusion, radially relative to the aforementioned axis of rotation, is located on the side opposite to the aforementioned covering portion relative to the aforementioned first wall portion.

[0052] The thickness of the protrusion in the vertical direction is less than the thickness of the covering portion.

[0053] According to a second aspect of this disclosure, in the inductor component described in the first aspect, the thickness of the first wall portion and the second wall portion is greater than the thickness of the wiring conductor.

[0054] According to the third aspect of this disclosure, an inductor component described in the first or second aspect is provided.

[0055] The first wall portion has an inner wall surface and an outer wall surface, wherein the inner wall surface is in contact with the wiring conductor, and the outer wall surface is the opposite side of the inner wall surface and is in contact with the magnetic body.

[0056] The aforementioned insulating layer has a covering side surface, which is a surface facing the aforementioned radial direction and is located closer to the aforementioned second wall portion in the aforementioned radial direction than the aforementioned outer wall surface.

[0057] According to the fourth aspect of this disclosure, in the inductor component described in the third aspect, the aforementioned covering side is located in the radial direction between the aforementioned outer wall surface and the aforementioned inner wall surface.

[0058] According to the fifth aspect of this disclosure, an inductor component described in any one of the first to third aspects is provided.

[0059] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0060] The aforementioned inductor component also includes:

[0061] The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis;

[0062] A fourth wall portion is disposed on the aforementioned upper surface of the cover and extends parallel to the aforementioned third wall portion around the aforementioned axis of rotation; and

[0063] The upper wiring conductor is located between the third wall portion and the fourth wall portion on the upper surface of the cover, and has an upper conductor upper surface that is the opposite side of the surface in contact with the cover insulation layer in the vertical direction.

[0064] The aforementioned insulating layer contains inorganic fillers.

[0065] The transparency of the aforementioned insulating layer is lower than that of the first wall portion and the second wall portion.

[0066] The thickness of the aforementioned covering portion is less than the thickness of the aforementioned first wall portion and the thickness of the aforementioned second wall portion.

[0067] According to the sixth aspect of this disclosure, an inductor component described in any one of the first to fifth aspects is provided.

[0068] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0069] The aforementioned inductor component also includes:

[0070] The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis;

[0071] The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis;

[0072] The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and

[0073] An insulating layer is layered on top of the upper conductor.

[0074] The aforementioned upper covering insulation layer has:

[0075] The upper cover overlaps with the upper wiring conductor in the above top view; and

[0076] The upper protrusion, in the aforementioned radial direction, is located on the opposite side to the aforementioned upper covering portion relative to the aforementioned third wall portion.

[0077] The thickness of the upper protrusion is less than the thickness of the upper cover.

[0078] According to the seventh aspect of this disclosure, an inductor component described in any one of the first to sixth aspects is provided.

[0079] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0080] The aforementioned inductor component also includes:

[0081] The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis;

[0082] The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis;

[0083] The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and

[0084] A through-hole conductor penetrates the aforementioned insulating layer in the vertical direction, connecting the aforementioned wiring conductor and the aforementioned upper wiring conductor.

[0085] The aforementioned through-hole conductor has a tapered shape that tapers as it approaches the upper wiring conductor in the aforementioned vertical direction.

[0086] According to the eighth aspect of this disclosure, an inductor component described in the seventh aspect is provided.

[0087] The aforementioned through-hole conductor has a through-hole conductor side surface, wherein the aforementioned through-hole conductor side surface is in contact with the aforementioned covering insulating layer.

[0088] In a cross section intersecting the direction of the aforementioned wiring conductor, the inclination angle of the side of the aforementioned through-hole conductor relative to the aforementioned vertical direction is greater than 0 degrees and less than 35 degrees.

[0089] According to the ninth aspect of this disclosure, an inductor component described in any one of the first to eighth aspects is provided.

[0090] The aforementioned wiring conductor has a pad portion.

[0091] The thickness of the pad portion is greater than the thickness of the portion of the wiring conductor that is different from the pad portion.

[0092] According to the tenth aspect of this disclosure, an inductor component described in any one of the first to ninth aspects is provided.

[0093] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0094] The aforementioned inductor component also includes:

[0095] The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis;

[0096] The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis;

[0097] The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and

[0098] An insulating layer is layered on top of the upper conductor.

[0099] The thickness of the portion of the aforementioned covering insulating layer that is sandwiched between the first wall portion or the second wall portion and the third wall portion or the fourth wall portion in the aforementioned vertical direction is less than the thickness of the aforementioned covering portion.

[0100] According to the eleventh aspect of this disclosure, an inductor component as described in the tenth aspect is provided.

[0101] The first wall portion and the second wall portion each have a lower edge portion and an upper edge portion, wherein the lower edge portion contacts the upper surface of the base portion, and the upper edge portion is located on the opposite side to the lower edge portion in the vertical direction.

[0102] Each upper edge is positioned closer to the top than the aforementioned wiring conductor in the aforementioned vertical direction.

[0103] The clamped portion includes the portion of the covering insulation layer with the smallest thickness.

[0104] According to the twelfth aspect of this disclosure, an inductor component described in any one of the first to eleventh aspects is provided.

[0105] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0106] The upper surface of the cover is smoother than the lower surface of the cover.

[0107] According to the thirteenth aspect of this disclosure, an inductor component described in any one of the first to twelfth aspects is provided.

[0108] The aforementioned protrusion has a protrusion side, which faces the aforementioned radial direction.

[0109] The side of the aforementioned protrusion has a cross-section that intersects with the direction of extension of the aforementioned wiring conductor, and has multiple straight sections with different slopes.

[0110] According to the fourteenth aspect of this disclosure, an inductor component described in any one of the first to thirteenth aspects is provided.

[0111] The aforementioned protrusion has a lower surface, wherein the lower surface of the protrusion faces the base insulating layer in the aforementioned vertical direction.

[0112] The lower surface of the aforementioned protrusion has a curved section in the cross-section that intersects with the direction of extension of the aforementioned wiring conductor.

[0113] According to the fifteenth aspect of this disclosure, an inductor component described in the fourteenth aspect is provided.

[0114] The aforementioned first wall portion has a lower edge portion and an upper edge portion, wherein the lower edge portion contacts the upper surface of the base portion, and the upper edge portion is located on the opposite side to the lower edge portion in the vertical direction.

[0115] In the above cross-section, one end of the curved portion contacts the upper edge of the first wall portion.

[0116] According to the sixteenth aspect of this disclosure, an inductor component described in any one of the first to fifteenth aspects is provided.

[0117] The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface.

[0118] The aforementioned inductor component also includes:

[0119] The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis;

[0120] The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis;

[0121] The upper wiring conductor is located between the third wall and the fourth wall on the upper surface of the cover, and has an upper conductor upper surface, which is the opposite side of the surface in contact with the cover insulation layer in the vertical direction.

[0122] An insulating layer is stacked on the upper surface of the aforementioned upper conductor;

[0123] External terminals are disposed on the outer surface of the aforementioned magnetic body; and

[0124] A connecting wire, disposed on the aforementioned magnetic body, extends along the aforementioned vertical direction, connecting the aforementioned external terminal and the aforementioned upper wiring conductor.

[0125] The aforementioned upper covering insulation layer has:

[0126] The upper cover overlaps with the upper wiring conductor in the above top view; and

[0127] The upper protrusion, in the aforementioned radial direction, is located on the opposite side to the aforementioned upper covering portion relative to the aforementioned third wall portion.

[0128] The thickness of the aforementioned upper protrusion is less than the thickness of the aforementioned upper cover.

[0129] The thickness of the upper covering portion is greater than the thickness of the covering portion.

[0130] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. The following description is not intended to limit the scope of the present disclosure, but is merely illustrative and can be appropriately modified without departing from the spirit of the present disclosure. The drawings are schematic, and the proportions of the dimensions may not necessarily correspond to actual dimensions. In the following description, terms such as "about," "approximately," or "roughly" refer to values ​​or shapes following these terms that include a range of permissible errors as determined by those skilled in the art.

[0131] In the following description, terms indicating specific directions or positions (e.g., including the terms "up", "down", "right", and "left") are used as needed, but these terms are used to facilitate understanding of this disclosure with reference to the accompanying drawings, and the technical scope of this disclosure is not limited by the meaning of these terms.

[0132] In the following description, unless otherwise specified, "thickness" and "height" refer to the dimensions of the component in the vertical Z direction.

[0133] like Figure 1 and Figure 2 As shown, the inductor component 1 of this disclosure includes a base insulating layer 71, an insulating first wall portion 73 and a second wall portion 76, a first conductor layer 11, a first inductor wiring 21, and a covering insulating layer 72. Above the covering insulating layer 72, insulating third wall portions 74 and fourth wall portions 77, a second conductor layer 12, a second inductor wiring 22, and an upper covering insulating layer 75 are provided. The above components are located inside a magnetic body 2, which contains magnetic material.

[0134] In this embodiment, the magnetic body 2 is approximately cuboid in shape. The magnetic body 2 has, for example, a size of 1.2 × 2.1 × 0.55 mm. The magnetic body 2 has an outer surface that intersects (e.g., is orthogonal) the vertical direction, such as the Z direction. Hereinafter, this outer surface will be referred to as the main surface 202. Figure 1As shown, a plurality of external terminals 101 to 106 and an insulating layer 78 are provided on the main surface 202. The insulating layer 78 has a thickness of, for example, 10 μm. The external terminals 101 to 106 are, for example, composed of a Cu / Ni / Au (=5 / 5 / 0.1 μm) laminate.

[0135] The magnetic material 2 is formed, for example, from a composite of resin and inorganic filler (e.g., a composite of epoxy resin and FeSiCr). The resin, for example, includes epoxy resin, acrylic resin, liquid crystal polymer, phenolic resin, and combinations thereof, and provides the strength and good insulation of the magnetic material 2. The inorganic filler included in the magnetic material 2 includes, for example, metallic magnetic powder (e.g., materials containing Fe as a main component, such as Fe, FeSi-based, FeSiCr-based, and FeNi-based materials). In this case, the magnetic material 2 has high permeability and high magnetic saturation density. The inorganic filler need not be a single type of magnetic powder; it can be a combination of magnetic powders with different compositions and particle sizes. To ensure the coefficient of linear expansion and insulation, insulating fillers such as silica may also be included.

[0136] like Figure 2 As shown, the base insulating layer 71, the cover insulating layer 72, and the upper cover insulating layer 75 each have a generally plate shape intersecting the vertical direction Z. The cover insulating layer 72 is located closer to the top than the base insulating layer 71. The upper cover insulating layer 75 is located closer to the top than the cover insulating layer 72. Figure 5 As shown, the base insulating layer 71 has a base upper surface 71a opposite to the cover insulating layer 72. The cover insulating layer 72 has a cover lower surface 72a and a cover upper surface 72b, wherein the cover lower surface 72a is opposite to the base insulating layer 71, and the cover upper surface 72b is the opposite side relative to the cover lower surface 72a. The upper cover insulating layer 75 has an upper cover lower surface 75a and an upper cover upper surface 75b, wherein the upper cover lower surface 75a is opposite to the cover insulating layer 72, and the upper cover upper surface 75b is the opposite side relative to the upper cover lower surface 75a.

[0137] As an example, the upper surface 72b is smoother than the lower surface 72a. That is, the surface roughness of the upper surface 72b is smaller than that of the lower surface 72a. Similarly, the upper surface 75b is smoother than the lower surface 75a. That is, the surface roughness of the upper surface 75b is smaller than that of the lower surface 75a. Surface roughness is, for example, Line Edge Roughness (LER). The method for measuring LER will be described. An image of a cross-section of the inductor component 1 intersecting the extension direction of the wiring conductor 81 is obtained. In this image, edge points of the measurement surface (e.g., the lower surface 72a or the upper surface 72b) are detected. The deviation of each edge point from an approximate straight line based on the least squares method is calculated. The average value of the deviations is taken as the LER of the measurement surface.

[0138] A first conductor layer 11 is disposed on the upper surface 71a of the base. A second conductor layer 12 is disposed on the upper surface 72b of the cover. A first inductor wiring 21 is disposed on the first conductor layer 11. The first inductor wiring 21 is located between the first conductor layer 11 and the cover insulating layer 72 in the vertical direction Z. A second inductor wiring 22 is disposed on the second conductor layer 12. The second inductor wiring 22 is located on the opposite side of the cover insulating layer 72 from the first inductor wiring 21.

[0139] As an example, the first conductor layer 11 has a vertical dimension (Z) of less than 1.0 μm, i.e., a thickness. The thickness of the first conductor layer 11 is less than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 can also be configured in the same way as the first conductor layer 11. That is, the second conductor layer 12 can be configured to have a thickness of less than 1.0 μm and less than 1 / 100 of the thickness of the second inductor wiring 22.

[0140] As an example, the first conductor layer 11 and the second conductor layer 12 each comprise a single layer (Cu or Ag) or multiple layers stacked along the vertical direction Z (e.g., Ti / Cu).

[0141] The first conductor layer 11 and the first inductor wiring 21 constitute the "wiring conductor" in this disclosure. The second conductor layer 12 and the second inductor wiring 22 constitute the "upper wiring conductor" in this disclosure. In the following description, the first conductor layer 11 and the first inductor wiring 21 may be collectively referred to as wiring conductor 81, and the second conductor layer 12 and the second inductor wiring 22 may be collectively referred to as upper wiring conductor 82.

[0142] like Figure 3 As shown, the wiring conductor 81 extends about a first rotation axis A1 that intersects (e.g., is orthogonal) the upper surface 71a of the base. Figure 4As shown, the upper wiring conductor 82 extends around a second rotation axis A2 that intersects (e.g., orthogonally) the upper surface 72b.

[0143] like Figure 5 As shown, the wiring conductor 81 has a conductor upper surface 81a, which is the opposite side in the vertical direction Z to the surface in contact with the base insulation layer 71. A covering insulation layer 72 is laminated on the conductor upper surface 81a. That is, the conductor upper surface 81a is covered by the covering insulation layer 72. The upper wiring conductor 82 has an upper conductor upper surface 82a, which is the opposite side in the vertical direction Z to the surface in contact with the covering insulation layer 72. An upper covering insulation layer 75 is laminated on the upper conductor upper surface 82a. That is, the upper conductor upper surface 82a is covered by the upper covering insulation layer 75.

[0144] like Figure 2 and Figure 3 As shown, the first wall portion 73 and the second wall portion 76 are respectively disposed on both sides of the wiring conductor 81 in the radial direction of the first rotation axis A1. That is, the wiring conductor 81 is located between the first wall portion 73 and the second wall portion 76 on the upper surface 71a of its base. Figure 3 As shown, the first wall portion 73 and the second wall portion 76 extend along the wiring conductor 81 around the first rotation axis A1 on the upper surface 71a of the base. Furthermore, the radial direction of the first rotation axis A1 is, for example, a direction that intersects both the vertical direction Z and the direction in which the wiring conductor 81 extends. In other words, the radial direction of the first rotation axis A1 is either a direction that extends radially from the first rotation axis A1 when viewed along the first rotation axis A1, or a direction that converges towards the first rotation axis A1.

[0145] like Figure 5 As shown, a first wall portion 73 and a second wall portion 76 extend upward from the upper surface 71a of the base. The first wall portion 73 has an inner wall surface 73a and an outer wall surface 73b, wherein the inner wall surface 73a contacts the wiring conductor 81, and the outer wall surface 73b is the opposite side of the inner wall surface 73a and contacts the magnetic body 2. The second wall portion 76 is located on the opposite side of the first wall portion 73 in the radial direction relative to the wiring conductor 81. The second wall portion 76 may also contact the wiring conductor 81 on both radially oriented wall surfaces. Alternatively, the second wall portion 76 may contact the wiring conductor 81 on one of the two wall surfaces and contact the magnetic body 2 on the other.

[0146] The first wall portion 73 has a lower edge portion 731 and an upper edge portion 732, wherein the lower edge portion 731 contacts the upper surface 71a of the base, and the upper edge portion 732 is located on the opposite side of the lower edge portion 731 in the vertical direction Z. The first wall portion 73 has a thickness in the vertical direction Z between the lower edge portion 731 and the upper edge portion 732. The second wall portion 76 has a lower edge portion 761 and an upper edge portion 762, wherein the lower edge portion 761 contacts the upper surface 71a of the base, and the upper edge portion 762 is located on the opposite side of the lower edge portion 761 in the vertical direction Z. The second wall portion 76 has a thickness in the vertical direction Z between the lower edge portion 761 and the upper edge portion 762. In this configuration, each upper edge portion 732, 762 is located closer to the upper part than the wiring conductor 81.

[0147] like Figure 2 and Figure 4 As shown, the third wall portion 74 and the fourth wall portion 77 are respectively disposed on both sides of the upper wiring conductor 82 radially along the second rotation axis A2. That is, the upper wiring conductor 82 is located between the third wall portion 74 and the fourth wall portion 77 on the upper surface 72b. Figure 4 As shown, the third wall portion 74 and the fourth wall portion 77 extend around the second rotation axis A2 along the upper wiring conductor 82 covering the upper surface 72b. Furthermore, the radial direction of the second rotation axis A2 is, for example, a direction that intersects both the vertical direction Z and the direction in which the upper wiring conductor 82 extends. In other words, the radial direction of the second rotation axis A2 is either a direction that extends radially from the second rotation axis A2 when viewed along the second rotation axis A2, or a direction that converges towards the second rotation axis A2.

[0148] The third wall portion 74 and the fourth wall portion 77 extend upward from the covering upper surface 72b. For example... Figure 5 As shown, the third wall portion 74 has an upper inner wall surface 74a and an upper outer wall surface 74b, wherein the upper inner wall surface 74a contacts the upper wiring conductor 82, and the upper outer wall surface 74b is the opposite side of the upper inner wall surface 74a and contacts the magnetic body 2. The fourth wall portion 77 is located radially opposite to the upper wiring conductor 82 on the side opposite to the third wall portion 74. The fourth wall portion 77 may contact the upper wiring conductor 82 on both radially oriented wall surfaces. Alternatively, the fourth wall portion 77 may contact the upper wiring conductor 82 on one of the two wall surfaces and contact the magnetic body 2 on the other.

[0149] like Figure 3 and Figure 4As shown, the inductor component 1 includes a third conductor layer 13, a fourth conductor layer 14, a third inductor wiring 23 disposed on the third conductor layer 13, and a fourth inductor wiring 24 disposed on the fourth conductor layer 14. The third conductor layer 13 is disposed on the upper surface 71a of the base and is electrically independent of the first conductor layer 11. The fourth conductor layer 14 is disposed on the upper surface 72b of the cover and is electrically independent of the second conductor layer 12.

[0150] like Figure 3 As shown, when viewed along the vertical direction Z, the third conductor layer 13 is located symmetrically with respect to the first conductor layer 11 with respect to the first center line CL1 extending along the short side direction (e.g., the X direction) of the inductor component 1 on the upper surface 71a of the base, and has a shape symmetrical with respect to the first center line CL1 and the first conductor layer 11. The third inductor wiring 23 is located symmetrically with respect to the first center line CL1 and the first inductor wiring 21, and has a shape symmetrical with respect to the first center line CL1 and the first inductor wiring 21. The third inductor wiring 23 is arranged around a third rotation axis A3, which is located symmetrically with respect to the first center line CL1 and the first rotation axis A1.

[0151] like Figure 4 As shown, when viewed along the vertical direction Z, the fourth conductor layer 14 is located symmetrically with respect to the second conductor layer 12 with respect to the second center line CL2 extending along the short side direction X on the covering surface 72b, and has a shape symmetrical with respect to the second center line CL2 and the second conductor layer 12. The fourth inductor wiring 24 is located symmetrically with respect to the second center line CL2 and the second inductor wiring 22, and has a shape symmetrical with respect to the second center line CL2 and the second inductor wiring 22. The fourth inductor wiring 24 is arranged around a fourth rotation axis A4, which is located symmetrically with respect to the second center line CL2 and the second rotation axis A2.

[0152] As an example, the first rotation axis A1 and the second rotation axis A2 are located on the same straight line (see reference). Figure 2 The third rotation axis A3 and the fourth rotation axis A4 are located on the same straight line. When viewed along the vertical direction Z, the first center line CL1 and the second center line CL2 are located approximately at the center of the long side direction (e.g., the Y direction) of the inductor component 1.

[0153] like Figure 3 As shown, as an example, when viewed along the vertical direction Z, the wiring conductor 81 has a spiral shape. Two pad portions 818 are respectively provided at both ends of the wiring conductor 81 in the direction in which it extends. Figure 6As shown, for example, the thickness of the pad portion 818 is greater than the thickness of the portion of the wiring conductor 81 that differs from the pad portion 818 (e.g., the portion of the wiring conductor 81 other than the pad portion 818). In this embodiment, two through-hole conductors 51 and 52 are connected to the two pad portions 818 respectively. The first inductor wiring 21 is, for example, constructed from a stack of layers with L / S / t (=100 / 10 / 150um).

[0154] The wiring conductor 81 has a first part 811 to a seventh part 817.

[0155] The first portion 811 extends from the end located near the first rotating shaft A1 connected to the through-hole conductor 51 in the long side direction Y, away from the first center line CL1. As an example, the portion of the first portion 811 connected to the through-hole conductor 51 constitutes the first output portion.

[0156] The second part 812 extends along the short side direction X from the ends of the first part 811 away from the first center line CL1 in the long side direction Y.

[0157] The third part 813 extends from the ends of the first part 811 in the short side direction X of the second part 812 away from the ends of the first part 811 in the long side direction Y towards the first center line CL1.

[0158] The fourth part 814 extends from the ends of the second part 812 away from the ends of the long side direction Y of the third part 813 in a direction close to the first part 811 along the short side direction X.

[0159] The fifth portion 815 extends from the ends of the third portion 813 in the short-side direction X of the fourth portion 814 in a direction away from the first centerline CL1 along the long-side direction Y. The fifth portion 815 is located further away from the first rotation axis A1 in the short-side direction X than the first portion 811, and a portion of the fifth portion 815 overlaps with the first portion 811 when viewed along the short-side direction X. The fifth portion 815 and the first portion 811 are insulated from each other by the second wall portion 76.

[0160] The sixth part 816 extends from the ends of the fifth part 815 in the long side direction Y, away from the ends of the fourth part 814, towards the third part 813 along the short side direction X. The sixth part 816 is located further away from the first rotation axis A1 in the long side direction Y than the second part 812, and a portion of the sixth part 816 overlaps with the second part 812 when viewed along the long side direction Y. The sixth part 816 and the second part 812 are insulated from each other by the second wall portion 76.

[0161] The seventh part 817 extends from the ends of the fifth part 815 in the short side direction X of the sixth part 816 towards the first center line CL1 along the long side direction Y. The seventh part 817 is located further away from the first rotation axis A1 than the third part 813 in the short side direction X, and a portion of the seventh part 817 overlaps with the third part 813 when viewed along the short side direction X. The seventh part 817 and the third part 813 are insulated from each other by the second wall portion 76. Through-hole conductors 52 are connected to the ends of the seventh part 817 near the first center line CL1 in the long side direction Y. As an example, the portion of the seventh part 817 connected to the through-hole conductors 52 constitutes the first input portion.

[0162] like Figure 3 As shown, the magnetic body 2 has a first region B1 and a second region B2 inside it, wherein the first region B1 is closer to the first rotation axis A1 than the wiring conductor 81, and the second region B2 is farther away from the first rotation axis A1 than the wiring conductor 81. In this configuration, when viewed along the vertical direction Z, the first region B1 is surrounded by a portion of the first portion 811 to the fourth portion 814 and a portion of the fifth portion 815 of the wiring conductor 81.

[0163] like Figure 4 As shown, the upper wiring conductor 82 is arranged around a second rotation axis A2 along the vertical direction Z. In this configuration, when viewed along the vertical direction Z, the upper wiring conductor 82 has a spiral shape that is wound in the opposite direction to the wiring conductor 81.

[0164] The upper wiring conductor 82 is, for example, constructed from a laminate with L / S / t (=100 / 10 / 150um). Two pad portions 828 are provided at both ends of the upper wiring conductor 82 in the direction of its extension. For example, the thickness of the pad portion 828 is greater than the thickness of the portion of the upper wiring conductor 82 that differs from the pad portion 828; for example, the thickness of the portion of the upper wiring conductor 82 other than the pad portion 828. In this embodiment, through-hole conductors 53 and 54 extending in the vertical direction Z are connected to the two pad portions 828. Figure 2 As shown, the through-hole conductor 53 connects the upper wiring conductor 82 and the connecting wiring 61. The connecting wiring 61 extends in the vertical direction Z within the magnetic body 2 and connects the upper wiring conductor 82 and the external terminal 101 via the through-hole conductor 53. An upper covering insulating layer 75 is located between the upper wiring conductor 82 and the connecting wiring 61 in the vertical direction Z. The upper covering insulating layer 75 has, for example, a thickness of 15 μm.

[0165] like Figure 4 As shown, the upper wiring conductor 82 has a first portion 821 to a seventh portion 827.

[0166] The first portion 821 extends from the end connected to the through-hole conductor 53, located near the first rotation axis A1, along the long side direction Y towards the second centerline CL2. As an example, the portion of the first portion 821 connected to the through-hole conductor 53 constitutes the second output portion. When viewed along the vertical direction Z, the through-hole conductor 51 and the through-hole conductor 53 are adjacent. That is, the first output portion and the second output portion are adjacent to each other. The phrase "the first output portion and the second output portion are adjacent to each other" means, for example, that when viewed along the vertical direction Z, the through-hole conductor 51 and the through-hole conductor 53 are located in a very narrow area (e.g., within 20 μm). In this embodiment, when viewed along the vertical direction Z, the through-hole conductor 51 and the through-hole conductor 53 are located at a distance of approximately 10 μm.

[0167] The second part 822 extends along the short side direction X from the ends of the second center line CL2 near the ends of the long side direction Y of the first part 821.

[0168] The third part 823 extends from the ends of the first part 821 in the short side direction X of the second part 822 away from the ends of the first part 821 in the long side direction Y in a direction away from the second center line CL2.

[0169] The fourth part 824 extends from the ends of the second part 822 away from the ends of the long side direction Y of the third part 823 in a direction close to the first part 821 along the short side direction X.

[0170] The fifth portion 825 extends from the ends of the fourth portion 824 in the short side direction X, away from the ends of the third portion 823, in the long side direction Y towards the second center line CL2. The fifth portion 825 is located further away from the second rotation axis A2 in the short side direction X than the first portion 821, and when viewed along the short side direction X, a portion of the fifth portion 825 overlaps with the first portion 821. The fifth portion 825 and the first portion 821 are insulated from each other by the fourth wall portion 77.

[0171] The sixth part 826 extends from the ends of the fifth part 825 in the long side direction Y, away from the ends of the fourth part 824, towards the third part 823 along the short side direction X. The sixth part 826 is located further away from the second rotation axis A2 in the long side direction Y than the second part 822, and when viewed along the long side direction Y, a portion of the sixth part 826 overlaps with the second part 822. The sixth part 826 and the second part 822 are insulated from each other by the fourth wall portion 77.

[0172] The seventh part 827 extends from the ends of the fifth part 825 in the short side direction X of the sixth part 826 in the direction away from the second center line CL2 along the long side direction Y. The seventh part 827 is located further away from the second rotation axis A2 in the short side direction X than the third part 823, and a portion of the seventh part 827 overlaps with the third part 823 when viewed along the short side direction X. The seventh part 827 and the third part 823 are insulated from each other by the fourth wall portion 77. Through-hole conductors 54 are connected to the ends of the seventh part 827 near the second center line CL2 in the long side direction Y (i.e., the pad portion 828). As an example, the portion of the seventh part 827 connected to the through-hole conductors 54 constitutes the second input portion. Figure 3 and Figure 4 As shown, when viewed along the vertical direction Z, the through-hole conductor 52 and the through-hole conductor 54 are positioned with a gap between them in the longitudinal direction Y. That is, the first input portion and the second input portion are separated in the longitudinal direction Y. When viewed along the vertical direction Z, the through-hole conductor 52 and the through-hole conductor 54 are separated by more than 200 μm (e.g., 500 μm), thereby enabling the first input portion and the second input portion to be separated.

[0173] like Figure 4 As shown, the magnetic body 2 has a first region C1 and a second region C2 inside it, wherein the first region C1 is closer to the second rotation axis A2 than the upper wiring conductor 82, and the second region C2 is farther away from the second rotation axis A2 than the upper wiring conductor 82. In this configuration, when viewed along the vertical direction Z, the first region C1 is surrounded by the first portion 821 to the fifth portion 825 of the upper wiring conductor 82.

[0174] like Figure 5 As shown, the insulating layer 72 is located across the upper surface 81a of the conductor, the upper edge 732 of the first wall portion 73, and the upper edge 762 of the second wall portion 76. For example, the transparency of the insulating layer 72 is lower than the transparency of the first wall portion 73 and the second wall portion 76. Transparency is, for example, visible light transmittance. The method for measuring visible light transmittance is described. In measuring visible light transmittance, a test object with a specified thickness (e.g., the insulating layer 72, the first wall portion 73, or the second wall portion 76) is used. The specified thickness is, for example, 20 μm. Visible light is irradiated onto one surface of the test object in the thickness direction. On the other surface of the test object in the thickness direction, a light receiver is used to measure the intensity of the transmitted light passing through the test object. The ratio of the intensity of the transmitted light to the intensity of the visible light irradiated onto the aforementioned surface is calculated. The value obtained by converting this ratio into a value per 20 μm thickness of the test object is taken as the visible light transmittance.

[0175] As an example, the cover insulation layer 72 and the upper cover insulation layer 75 are formed of an insulating material composed of epoxy and inorganic fillers, while the first to fourth wall portions 73, 76, 74, and 77 are formed of an acrylic resin-based insulating material. Inorganic fillers include, for example, silica, calcium carbonate, and titanium dioxide. The particle size (D50) of the inorganic filler included in the cover insulation layer 72 is preferably sufficiently small relative to the thickness of the cover portion 721 described later. For example, the particle size of the inorganic filler is less than 1 / 10 of the thickness of the cover portion 721 or less, or less than 1 μm. The first to fourth wall portions 73, 76, 74, and 77 may also not contain inorganic fillers. Since the first to fourth wall portions 73, 76, 74, and 77 do not contain inorganic fillers, the reduction in the molding accuracy of the first to fourth wall portions 73, 76, 74, and 77 can be suppressed.

[0176] like Figure 7 As shown, the insulating layer 72 has a covering portion 721, a protrusion 722, and a radial portion (in the direction of rotation) on the first rotation axis A1. Figure 7 The middle portion 723 is located between the cover portion 721 and the protrusion 722 in the X direction. The cover portion 721 is the portion that overlaps with the wiring conductor 81 when viewed from above in the vertical Z direction. The protrusion 722 is the portion located on the opposite side of the cover portion 721 in the radial direction relative to the first wall portion 73. The middle portion 723 is the portion located between the inner wall surface 73a and the outer wall surface 73b of the first wall portion 73 when viewed from above.

[0177] The protrusion 722 has a lower surface 722a and a side surface 722b, wherein the lower surface 722a is the surface facing the base insulating layer 71 in the vertical direction Z (see reference). Figure 5 The side surface 722b of the protrusion is a surface that connects the lower surface 722a of the protrusion and covers the upper surface 72b and faces radially.

[0178] The thickness of the protrusion 722 is less than the thickness of the cover 721. The thickness of the protrusion 722 is the dimension along the vertical direction Z between the height position of the upper surface 72b of the cover and the height position of the lower surface 722a of the protrusion. However, in the cross-section of the wiring conductor 81, in the case where the lower surface 722a of the protrusion is not flat, the height position of the straight line parallel to the main surface 202 and whose difference from the actual lower surface 722a of the protrusion is minimized by the least square method is regarded as the height position of the lower surface 722a of the protrusion. Furthermore, the so-called cross-section of the wiring conductor 81 is a cross-section that intersects (e.g., orthogonally) with respect to the direction in which the wiring conductor 81 extends.

[0179] The thickness of the cover 721 is the dimension along the vertical direction Z between the height position of the upper cover surface 72b and the height position of the lower cover surface 72a (e.g., the height position of the upper surface 81a of the conductor). However, in the cross-section of the wiring conductor 81, in the case where the lower cover surface 72a is not flat (see reference...). Figure 7 The height position of the lower cover surface 72a is considered as the height position of the straight line V1, which is parallel to the main surface 202 and whose difference from the actual lower cover surface 72a is minimized by the least square method. Figure 7 In the example shown, the lower surface 72a of the cover is curved to protrude upwards. In one example, the thickness of the cover 721 is less than the thickness of the first wall portion 73 and the second wall portion 76. In this embodiment, the thickness of the cover 721 is 15 μm, and the thicknesses of the first wall portion 73 and the second wall portion 76 are 165 μm. Furthermore, in Figure 2 , Figure 5 , Figure 6 as well as Figures 14-21 In this text, the depiction of the curved shape of the upper surface 81a of the conductor is omitted, and the upper surface 81a of the conductor is shown as a plane. Figure 2 , Figure 5 , Figure 6 as well as Figures 14-21 In the cross-section shown, the upper surfaces 81a of the conductors can have the same shape or different shapes. Similarly, the upper surfaces 82a of the upper conductors in the above cross-section can have the same shape or different shapes.

[0180] In this embodiment, the intermediate portion 723 is also the portion sandwiched between the first wall portion 73 and the third wall portion 74 in the vertical direction Z. For example, the intermediate portion 723 includes the portion of the covering insulating layer 72 with the smallest thickness. That is, the thickness of the intermediate portion 723 is less than the thickness of the covering portion 721.

[0181] like Figure 5 As shown, the upper insulating layer 75 is located across the upper surface 82a of the upper conductor, the third wall portion 74, and the fourth wall portion 77. Figure 8 As shown, the upper covering insulating layer 75 has an upper covering portion 751, an upper protrusion 752, and a radial portion relative to the second rotation axis A2 (in Figure 8 The middle portion 753 is located between the upper cover portion 751 and the upper protrusion portion 752 in the X direction. The upper cover portion 751 is the portion that overlaps with the upper wiring conductor 82 when viewed from above. The upper protrusion portion 752 is the portion located on the opposite side of the upper cover portion 751 in the radial direction relative to the third wall portion 74. The upper protrusion portion 752 has a lower surface 752a, which faces the base insulation layer 71 in the vertical direction Z.

[0182] The thickness of the upper protrusion 752 is less than the thickness of the upper cover 751. The thickness of the upper protrusion 752 is the dimension between the height position of the upper surface 75b of the upper cover and the height position of the lower surface 752a of the upper protrusion. Furthermore, in the cross-section of the upper wiring conductor 82, in the case where the lower surface 752a of the upper protrusion is not flat, the height position of the straight line parallel to the main surface 202 and whose difference from the actual lower surface 752a of the upper protrusion is minimized by the least square method is regarded as the height position of the lower surface 752a of the upper protrusion.

[0183] The thickness of the upper cover 751 is the dimension between the height position of the upper surface 75b and the height position of the lower surface 75a (e.g., the height position of the upper surface 82a of the upper conductor). However, in the cross-section of the upper wiring conductor 82, in the case where the lower surface 75a of the upper cover is not flat (see reference...). Figure 8 The height position of the upper cover lower surface 75a is taken as the height position of the straight line that is parallel to the main surface 202 and whose difference from the actual upper cover lower surface 75a is minimized by the least square method.

[0184] In this embodiment, the thickness of the upper cover 751 is greater than that of the cover 721 (see reference). Figure 7 The thickness of ).

[0185] In this embodiment, the middle portion 753 is the part that overlaps with the third wall portion 74 when viewed from above. For example, the middle portion 753 includes the portion of the upper covering insulating layer 75 with the smallest thickness. That is, the thickness of the middle portion 753 is less than the thickness of the upper covering portion 751.

[0186] like Figure 6 As shown, a through-hole conductor 51 is provided in the covering insulating layer 72. This through-hole conductor 51 penetrates the covering insulating layer 72 in the vertical direction Z and connects the pad portion 818 of the wiring conductor 81 and the upper wiring conductor 82. Figure 9 As shown, the through-hole conductor 51 has a tapered shape that tapers as it approaches the upper wiring conductor 82 in the vertical direction Z. That is, the contact surface 51a of the through-hole conductor 51 with the wiring conductor 81 is larger than the contact surface 51b of the through-hole conductor 51 with the upper wiring conductor 82. The through-hole conductor 51 has a through-hole conductor side 51c that contacts the covering insulation layer 72 radially. In the cross-section of the wiring conductor 81, the inclination angle of the through-hole conductor side 51c relative to the vertical direction Z is, for example, greater than 0 degrees and less than 35 degrees.

[0187] like Figure 6As shown, the thickness of the wiring conductor 81 is greater in the pad portion 818 than in the portion other than the pad portion 818. For example, the thickness of the pad portion 818 is greater than the thickness of the portion of the wiring conductor 81 excluding the pad portion 818.

[0188] like Figure 9 As shown, the cover portion 721 has a first portion 724 that contacts the pad portion 818 and a second portion 725 that contacts a portion of the wiring conductor 81 that is different from the pad portion 818. The thickness of the first portion 724 is less than the thickness of the second portion 725.

[0189] like Figure 9 As shown, the covering insulating layer 72 has a covering side 72c, which is a radially oriented surface located radially closer to the second wall portion 76 than the outer wall surface 73b. As an example, the covering side 72c is located radially between the outer wall surface 73b and the inner wall surface 73a. The covering side 72c is located in the portion of the covering insulating layer 72 excluding the protrusion 722.

[0190] A modified example of the protrusion 722 will be described. Figure 10 In the modified example shown, in the cross-section of the wiring conductor 81, the protruding side 722b has multiple straight sections with different slopes. Figure 10 In the example shown, the protruding side 722b is composed of a first straight portion 722c extending upward from the lower surface 722a of the protrusion and a second straight portion 722d extending downward from the upper surface 72b. The second straight portion 722d extends along the vertical direction Z in the cross-section of the wiring conductor 81. On the other hand, the first straight portion 722c is inclined such that it approaches the first wall portion 73 radially downward.

[0191] exist Figure 11 In the variant shown, the protruding side 722b is inclined such that, in the cross-section of the wiring conductor 81, it approaches the first wall portion 73 radially downwards. The protruding side 722b is, for example, a straight line in this cross-section.

[0192] The lower surface 722a of the protrusion has a curved portion 722f in this cross-section. Figure 11 In the modified example shown, the lower surface 722a of the protrusion, extending along its entire length in this cross-section, is formed by a curved portion 722f. The lower end portion 722g of the curved portion 722f contacts the upper edge portion 732 of the first wall portion 73. Alternatively, the curved portion 722f may only constitute a portion of the lower surface 722a of the protrusion in the aforementioned cross-section. Figure 11 In the cross-section shown, the thickness of the protrusion 722 is the dimension along the vertical Z direction between the height position covering the upper surface 72b and the straight line V2. The straight line V2 is perpendicular to the main surface 202 (see reference). Figure 2A straight line that is parallel to and has the smallest difference from the actual protrusion's lower surface 722a by the least square method.

[0193] In addition, Figure 11 In the variant shown, the upper surface 81a of the conductor is bent to protrude downwards.

[0194] Reference Figures 12-21 An example of a method for manufacturing inductor component 1 will be described below. In the following description, the description of the third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 will be omitted. Figures 12-21 Is along Figure 1 The attached figure corresponds to the cross section of line II-II. Figures 12-21 The manufacturing method shown, for example, uses a manufacturing apparatus for inductor component 1 to automatically perform some or all of the processes.

[0195] like Figure 12 and Figure 13 As shown, after a base insulating layer 71 is formed in the first laminate 1001, which is formed by stacking an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000, a patterned seed 1300 and a permanent resist 1400 are formed covering the base insulating layer 71 and the seed layer 1200, forming a second laminate 1002. The patterned seed 1300 constitutes the first conductor layer 11. The base insulating layer 71 is formed, for example, by a process including lamination of the insulating layer, photolithography (optical planar etching), and curing. The patterned seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the first wall portion 73.

[0196] like Figure 14 As shown, after the manufacturing apparatus simultaneously forms the first inductor wiring 21 and the sacrificial copper 1500 on the second laminate 1002, a covering insulating layer 72 is formed on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electric field plating (e.g., electric field copper plating). At this time, by allowing the plating to grow in a portion of the pad portion 818 with a current greater than that in the portion other than the pad portion 818, a thicker pad portion 818 can be formed. Alternatively, additives can be used to promote plating growth in the pad portion 818. The covering insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, during the photolithography process, the magnetic circuit opening 1501 and the via conductors 51 and 52 are formed simultaneously. The via conductor 51 has a tapered shape (see reference). Figure 9 For example, it can be formed by adjusting the focus position in photolithography or laser processing. Figure 10 and Figure 11 The shape of the protruding side 722b shown can be achieved, for example, by forming a covering insulating layer 72 using multiple dry film resists. In this case, multiple dry film resists with different light absorption frequency bands can also be used.

[0197] like Figure 15 As shown, the manufacturing apparatus forms a patterned seed 1600 and a permanent resist 1700 on the covering insulating layer 72 in the third laminate 1003, forming a fourth laminate 1004. The patterned seed 1600 constitutes the second conductor layer 12. The patterned seed 1600 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1700 constitutes the third wall portion 74.

[0198] The seed pattern 1600 can be formed from the same material as the seed pattern 1300 of the second laminate 1002, or from a different material. The seed patterns 1300 and 1600 are formed from the optimal material selected for each layer. For example, by forming the first seed pattern 1300 from a conductive material containing Ti, the adhesion to the base insulating layer 71 and the seed layer 1200 can be improved. By forming the second seed pattern 1600 from the same conductive material as the second inductor wiring 22 (e.g., only Cu), the connectivity with the via conductors 53 and 54 can be improved.

[0199] like Figure 16 As shown, after the manufacturing apparatus simultaneously forms the second inductor wiring 22 and the sacrificial copper 1800 in the fourth laminate 1004, an upper cover insulating layer 75 is formed on the second inductor wiring 22, and a connecting wiring 61 is formed on the upper cover insulating layer 75, thus forming the fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electric field plating (e.g., electric field copper plating). The upper cover insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, during the photolithography process, the magnetic circuit opening 1801 and the via conductors 53 and 54 are formed simultaneously. The connecting wiring 61 is formed, for example, by a process including sputtering (overall seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0200] like Figure 17As shown, after forming a protective layer 1900 on the interconnect wiring 61 in the fifth layer stack 1005, the manufacturing apparatus removes sacrificial copper 1500 and 1800 to form magnetic vias 2000, thus forming the sixth layer stack 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The removal of sacrificial copper 1500 and 1800 is performed, for example, by etching. In the case where the first patterned seed layer 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0201] like Figure 18 As shown, after removing the protective layer 1900 of the sixth laminate 1006, the manufacturing apparatus forms a magnetic layer 2100, and then forms a solder resist (insulating layer) 2200 on the magnetic layer 2100, thus forming a seventh laminate 1007. The removal of the protective layer 1900 is performed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material stamping, curing, and grinding. Grinding exposes the connection wiring 61 to the outside. The magnetic layer 2100 constitutes part of the magnetic material. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and curing. An opening 2201 is formed in the solder resist 2200 to expose the connection wiring 61 to the outside. The solder resist 2200 constitutes an insulating layer 78.

[0202] like Figure 19 As shown, the manufacturing apparatus removes the substrate 1000, adhesive layer 1100, and seed layer 1200 from the seventh laminate 1007 to create the eighth laminate 1008. The removal of the substrate 1000 and adhesive layer 1100 is performed, for example, by mechanically peeling off the adhesive layer 1100. The removal of the seed layer 1200 is performed, for example, by wet etching or grinding. In the case of removing the seed layer 1200 by wet etching, a portion of the metallic magnetic powder of the magnetic layer 2100 is etched, resulting in a rough surface and thus improved adhesion to the magnetic layer 2300 formed in the next process.

[0203] like Figure 20 As shown, the manufacturing apparatus forms a magnetic layer 2300 in the eighth laminate 1008 and a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including stamping, curing, and grinding of the magnetic material. Grinding is performed to adjust the thickness of the magnetic body 2. Alternatively, grinding may be omitted, and the thickness of the magnetic body 2 can be adjusted by changing the amount of stamping during the formation of the magnetic layer 2300. The magnetic layer 2300 constitutes a part of the magnetic material.

[0204] like Figure 21 As shown, after the manufacturing apparatus forms the external terminal 101 on the ninth laminate 1009 and forms the tenth laminate 1010, it monolithizes the tenth laminate 1010 to form... Figure 2The inductor component 1 shown. External terminals 101 are formed, for example, by processes including sputtering (Cu seed), resist lamination, photolithography, electroplating, resist stripping, and seed etching. Monolithization, for example, along... Figure 21 The dashed lines shown are used for this purpose.

[0205] Alternatively, instead of forming the external terminal 101, the exposed connection wiring 61 can be used as the external terminal. In this manner, if the external terminal 101 is formed in the opening 2201 of the solder resist 2200 and connected to the connection wiring 61, the area of ​​the external terminal 101 can be increased, thus improving the fixing force of the inductor component 1 to other devices. Furthermore, since the external terminal 101 can be formed in any shape, such as a convex shape, the degree of freedom during installation of the inductor component 1 is increased.

[0206] Alternatively, the external terminal 101 can be formed without forming the solder resist 2200. The external terminal 101 can also be formed, for example, with a full seed layer, similar to the connection wiring 61, and formed by electrolytic plating. In this case, the external terminal 101 has a structure similar to a Cu bump.

[0207] Inductor component 1 can achieve the following effects.

[0208] The inductor component 1 includes a base insulating layer 71 having a base upper surface 71a, a first wall portion 73, a second wall portion 76, a wiring conductor 81, a covering insulating layer 72, and a magnetic body 2. The first wall portion 73 is disposed on the base upper surface 71a and extends about a first rotation axis A1 along the vertical direction Z. The second wall portion 76 is disposed on the base upper surface 71a and extends parallel to the first wall portion 73 about the first rotation axis A1. The wiring conductor 81 is located on the base upper surface 71a between the first wall portion 73 and the second wall portion 76, and has a conductor upper surface 81a, which is the opposite side in the vertical direction Z to the surface in contact with the base insulating layer 71. The covering insulating layer 72 is stacked on the conductor upper surface 81a. The magnetic body 2 covers the base insulating layer 71, the first wall portion 73, the second wall portion 76, the wiring conductor 81, and the covering insulating layer 72. The insulating cover 72 has a cover portion 721 and a protrusion 722, wherein the cover portion 721 overlaps with the wiring conductor 81 when viewed from above, and the protrusion 722 is located radially on the side opposite to the cover portion 721 relative to the first wall portion 73. The thickness of the protrusion 722 is less than the thickness of the cover portion 721. According to this structure, since the insulating cover 72 has the protrusion 722, even if the insulating cover 72 is misaligned during the manufacturing process of the inductor component 1, it is difficult for gaps to be generated between the insulating cover 72 and the first wall portion 73. Therefore, since the upper surface 81a of the conductor can be covered more reliably, the reduction of insulation of the wiring conductor 81 can be suppressed. Since the thickness of the protrusion 722 is less than the thickness of the cover portion 721, the volume of the insulating cover 72 disposed around the wiring conductor 81 (e.g., the first region B1 and the second region B2) is reduced compared to a structure where the thickness of the protrusion 722 is greater than the thickness of the cover portion 721. This allows the volume of the magnetic body 2 to increase by an amount corresponding to the decrease in the volume of the covering insulating layer 72. Consequently, the magnetic reluctance around the wiring conductor 81 decreases, and the inductance efficiency is improved. Therefore, it is possible to suppress the reduction of insulation of the wiring conductor and improve the inductance efficiency.

[0209] Furthermore, due to the protrusion 722, the covering insulation layer 72 is formed to be embedded in the magnetic body 2 in a direction radially away from the wiring conductor 81. As a result, the adhesion between the covering insulation layer 72 and the wiring conductor 81 in contact with the covering insulation layer 72 and the magnetic body 2 can be improved.

[0210] The thickness of the first wall portion 73 and the second wall portion 76 is greater than the thickness of the wiring conductor 81. According to this structure, since the upper surface 81a of the conductor is located lower than the upper edge portions 732 and 762, it can be more reliably covered by the first wall portion 73, the second wall portion 76, and the covering insulation layer 72. Furthermore, compared to a structure where the thickness of the first wall portion 73 and the second wall portion 76 is less than the thickness of the wiring conductor 81, the thickness of the covering portion 721 can be increased, thereby improving the insulation between the wiring conductor 81 and the upper wiring conductor 82. Therefore, the reduction in the insulation of the wiring conductor 81 can be further suppressed.

[0211] The insulating cover 72 has a covering side 72c, which is a radially oriented surface located radially closer to the second wall portion 76 than the outer wall surface 73b. According to this structure, the volume of the insulating cover 72 disposed around the wiring conductor 81 (e.g., in the first region B1 and the second region B2) can be reduced at a different location than the protrusion 722. This allows the volume of the magnetic body 2 to increase by an amount corresponding to the reduction in the volume of the insulating cover 72. Consequently, the magnetic reluctance around the wiring conductor 81 is reduced, and the inductance efficiency is further improved.

[0212] The covering side 72c is located radially between the outer wall surface 73b and the inner wall surface 73a. According to this structure, compared to a structure where the covering side 72c is located closer to the second wall portion 76 than the inner wall surface 73a, the upper surface 81a of the conductor can be covered more reliably. Therefore, the reduction in insulation of the wiring conductor 81 can be further suppressed, and the inductance acquisition efficiency can be improved.

[0213] The cover insulating layer 72 has a lower cover surface 72a and an upper cover surface 72b, wherein the lower cover surface 72a faces the base insulating layer 71 in the vertical direction Z, and the upper cover surface 72b is the opposite side of the lower cover surface 72a. The inductor component 1 also includes a third wall portion 74, a fourth wall portion 77, and an upper wiring conductor 82, wherein the third wall portion 74 is disposed on the upper cover surface 72b and extends about a second rotation axis A2, and the fourth wall portion 77 is disposed on the upper cover surface 72b and extends parallel to the third wall portion 74 about the second rotation axis A2. The upper wiring conductor 82 is located on the upper cover surface 72b between the third wall portion 74 and the fourth wall portion 77, and has an upper conductor upper surface 82a, which is the opposite side in the vertical direction Z of the surface in contact with the cover insulating layer 72. The cover insulating layer 72 contains inorganic filler. The transparency of the covering insulating layer 72 is lower than that of the first wall portion 73 and the second wall portion 76. The thickness of the covering portion 721 is less than that of the first wall portion 73 and the second wall portion 76. According to this structure, since the upper wiring conductor 82 is also included, the coil length of the inductor component 1 is extended, and the inductance efficiency is improved. Since the covering insulating layer 72 contains inorganic filler, the insulation resistance and mechanical strength of the covering insulating layer 72 are improved. Therefore, compared to a structure where the covering insulating layer 72 does not contain inorganic filler, the reduction in the insulation of the wiring conductor 81 and the reduction in the mechanical strength of the covering insulating layer 72 can be suppressed, and the thickness of the covering insulating layer 72 can be reduced. Furthermore, since the thickness of the covering insulating layer 72 is less than the thickness of the first wall portion 73 and the second wall portion 76, compared to a structure where the thickness of the covering insulating layer 72 is greater than the thickness of the first wall portion 73 and the second wall portion 76, the volume occupied by the covering insulating layer 72 in the inductor component 1 is reduced. The volume of the magnetic body 2 can be increased by an amount corresponding to the reduction in the volume of the covering insulating layer 72. As a result, the magnetic resistance around the wiring conductor 81 is reduced, and the inductance efficiency is improved. Since the transparency of the covering insulation layer 72 is lower than that of the first wall portion 73 and the second wall portion 76, the wiring conductor 81 covered by the covering insulation layer 72 is not easily visible from the outside of the inductor component 1. As a result, it is possible to suppress the decrease in yield caused by appearance defects such as different degrees of oxidation of the wiring conductor 81, which are unlikely to affect the performance of the inductor component 1.

[0214] The inductor component 1 also includes an upper cover insulating layer 75, which is stacked on the upper surface 82a of the upper conductor. The upper cover insulating layer 75 has an upper cover portion 751 and an upper protrusion 752, wherein the upper cover portion 751 overlaps with the upper wiring conductor 82 when viewed from above, and the upper protrusion 752 is located radially on the side opposite to the upper cover portion 751 relative to the third wall portion 74. The thickness of the upper protrusion 752 is less than the thickness of the upper cover portion 751. When the upper wiring conductor 82 is provided, compared with the structure without the upper wiring conductor 82, the thickness of the magnetic body 2 increases, and the mechanical strength of the inductor component 1 is easily reduced. According to this structure, both the protrusion 722 and the upper protrusion 752 are provided, and are respectively formed to embed the magnetic body 2 radially. Therefore, the mechanical strength of the inductor component 1 is improved because the adhesion between the covering insulation layer 72, the wiring conductor 81, the upper covering insulation layer 75, and the upper wiring conductor 82 and the magnetic body 2 can be improved. In the structure where the external terminal 101 is provided on the side of the magnetic body 2, rounded corners are required. On the other hand, according to the above structure, the external terminal 101 is provided on the main surface 202, and the external terminal 101 and the upper wiring conductor 82 are connected by connecting wires 61. Therefore, rounded corners are not required, and the number of components that can be arranged on the magnetic body 2 is increased. In other words, the mounting density of the inductor component 1 is increased.

[0215] The inductor component 1 also includes a through-hole conductor 51 that penetrates the covering insulation layer 72 in the vertical direction Z, connecting the wiring conductor 81 and the upper wiring conductor 82. The through-hole conductor 51 has a tapered shape that tapers as it approaches the upper wiring conductor 82 in the vertical direction Z. According to this structure, the contact surface 51a of the through-hole conductor 51 with the wiring conductor 81 is larger than the contact surface 51b of the through-hole conductor 51 with the upper wiring conductor 82. Compared to a structure where the contact surface 51a of the through-hole conductor 51 with the wiring conductor 81 is smaller than the contact surface 51b with the upper wiring conductor 82, the contact area between the through-hole conductor 51 and the wiring conductor 81 is wider. This allows for a more reliable connection between the wiring conductor 81 and the upper wiring conductor 82. Furthermore, because the through-hole conductor 51 has a tapered shape, it is difficult for the through-hole conductor 51 to move upwards relative to the covering insulation layer 72. Therefore, it is possible to suppress poor connection between the wiring conductor 81 and the upper wiring conductor 82 caused by the movement of the through-hole conductor 51.

[0216] The through-hole conductor 51 has a through-hole conductor side 51c that contacts the covering insulating layer 72. In the cross-section of the wiring conductor 81, the inclination angle of the through-hole conductor side 51c relative to the vertical direction Z is greater than 0 degrees and less than 35 degrees. According to this structure, since the inclination angle is less than 35 degrees, the reduction of the contact area between the through-hole conductor 51 and the wiring conductor 82 can be suppressed while keeping the contact area between the through-hole conductor 51 and the upper wiring conductor 82 constant. As a result, the wiring conductor 81 and the upper wiring conductor 82 can be connected more reliably.

[0217] The thickness of the end (e.g., pad portion 818) of the wiring conductor 81 when viewed from above is greater than the thickness of the portion of the wiring conductor 81 that differs from the end. The thickness of the protrusion 722 is greater than the thickness of the end of the wiring conductor. According to this structure, since the pad portion 818 is thicker, the thickness of the cover portion 721 (the first portion 724 of the cover portion 721) located above the pad portion 818 is relatively reduced. When a via conductor 51 connected to the pad portion 818 is provided in the first portion 724, the thickness of the via conductor 51 is reduced compared to a structure with a thinner pad portion 818, resulting in reduced mechanical stress on the via conductor 51. This suppresses malfunction of the inductor component 1 caused by breakage of the via conductor 51. Because the thickness of the via conductor 51 is reduced, the amount of residue generated during the formation of the via conductor 51 is decreased, and the connection strength of the via conductor 51 is improved.

[0218] The thickness of the portion of the covering insulating layer 72 sandwiched between the first wall portion 73 or the second wall portion 76 and the third wall portion 74 or the fourth wall portion 77 in the vertical direction Z (e.g., the intermediate portion 723) is less than the thickness of the covering portion 721. For example, the intermediate portion 723 includes the portion of the covering insulating layer 72 with the smallest thickness. The portion of the covering insulating layer 72 sandwiched between two walls 73, 76, 74, and 77 has high insulation. In such a portion, by further reducing the thickness of the covering insulating layer 72, the reduction in the insulation of the wiring conductor 81 can be suppressed, and the volume of the covering insulating layer 72 can be reduced. The volume of the magnetic body 2 can be increased by an amount corresponding to the reduction in the volume of the covering insulating layer 72. As a result, the magnetic reluctance around the wiring conductor 81 is reduced, and the inductance efficiency is improved. Therefore, the reduction in the insulation of the wiring conductor can be suppressed, and the inductance efficiency can be improved.

[0219] The upper surface 72b is smoother than the lower surface 72a. Based on this structure, compared to a structure where the upper surface 72b is coarser than the lower surface 72a, it is easier to form connecting wires, upper wiring conductors 82, etc., that connect to the upper surface 72b.

[0220] The protrusion 722 has a radially oriented protrusion side 722b. In one example, the protrusion side 722b has multiple straight sections 722c and 722d with different slopes on the cross-section of the wiring conductor 81. According to this structure, compared with a structure in which the protrusion side 722b is composed of a single straight section on the cross-section, the contact area between the protrusion 722 and the magnetic body 2 is increased, and the tightness of the protrusion 722 and the magnetic body 2 is improved.

[0221] The protrusion 722 has a lower surface 722a that faces the base insulating layer 71 in the vertical direction Z. In one example, the lower surface 722a has a curved portion 722f in the cross-section of the wiring conductor 81. According to this structure, compared with a structure in which the lower surface 722a is composed of a straight portion in the cross-section, the contact area between the protrusion 722 and the magnetic body 2 is increased, and the tightness of the protrusion 722 and the magnetic body 2 is improved.

[0222] In the cross-section of the wiring conductor 81, the lower end portion 722g of the curved portion 722f contacts the upper edge portion 732 of the first wall portion 73. According to this structure, compared to a structure where the lower end portion 722g is radially closer to the second wall portion 76 than the first wall portion 73, the upper surface 81a of the conductor can be covered more reliably, thus suppressing the reduction in insulation of the wiring conductor 81. On the other hand, compared to a structure where the lower end portion 722g is radially farther from the second wall portion 76 than the first wall portion 73, the volume of the covering insulation layer 72 can be reduced, and the inductance efficiency is improved. Therefore, the reduction in insulation of the wiring conductor can be suppressed, and the inductance efficiency can be further improved.

[0223] The thickness of the upper protrusion 752 is less than the thickness of the upper cover 751. The thickness of the upper cover 751 is greater than the thickness of the cover 721. The vertical Z-direction deformation generated on the wiring conductor 81 and the covering insulation layer 72 located below the upper wiring conductor 82 is reflected in the upper wiring conductor 82. Therefore, there is a tendency for the upper wiring conductor 82 to experience greater deformation than the wiring conductor 81. According to the above structure, since the thickness of the upper cover 751 is greater than the thickness of the cover 721, the upper wiring conductor 82, which tends to increase in deformation, can be more reliably covered by the upper covering insulation layer 75. As a result, the reduction in the insulation of the upper wiring conductor 82 can be suppressed.

[0224] The inductor component 1 can also be configured to have wiring conductor layers located on three or more imaginary planes that are parallel to each other. In this case, three or more insulating layers can also be provided. On the other hand, the inductor component 1 can also be configured without the third wall portion 74, the fourth wall portion 77, the upper wiring conductor 82, and the upper covering insulating layer 75.

[0225] Alternatively, one or more conductor layers may be provided on the upper surface 71a of the base and the upper surface 72b of the cover.

[0226] The shape and size of each part constituting the inductor component 1 are not limited to the above-described manner, and can be arbitrarily set according to the design of the inductor component 1, etc. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0227] When viewed along the vertical Z-axis, the wiring of each inductor can have a spiral shape. For example, the wiring of each inductor can be a curve with more than one turn, or a curve with less than one turn. The wiring of each inductor can also have a straight shape in part.

[0228] In the above embodiments, the upper wiring conductor 82 constitutes the "upper wiring conductor" in this disclosure, but is not limited thereto. For example, the upper wiring conductor 82 may also be an example of the "wiring conductor" in this disclosure. In this case, the third wall portion 74 corresponds to the "first wall portion" in this disclosure, and the fourth wall portion 77 corresponds to the "second wall portion" in this disclosure. The covering insulation layer 72 corresponds to the "base insulation layer" in this disclosure, and the upper covering insulation layer 75 corresponds to the "covering insulation layer" in this disclosure.

[0229] The embodiments and modifications of this disclosure can be combined with each other, or with each other, or with each other. Features included in the embodiments and modifications of this disclosure can also be combined with each other.

[0230] The content of this disclosure may vary in structural details, and the combination and order of elements in various embodiments may be changed, which may be implemented outside the scope and ideas of the claimed disclosure.

[0231] According to this disclosure, it is useful for various inductor components because it can suppress the reduction of insulation of wiring conductors and improve inductance acquisition efficiency.

Claims

1. An inductor component comprising: A base insulating layer having a base upper surface; The first wall portion is provided on the upper surface of the base portion and extends about a rotation axis in the vertical direction intersecting the upper surface of the base portion; The second wall portion is disposed on the upper surface of the base portion and extends around the rotation axis and parallel to the first wall portion. A wiring conductor has a base upper surface located between the first wall and the second wall, and has a conductor upper surface, wherein the conductor upper surface is the opposite side of the surface in contact with the base insulation layer in the vertical direction. An insulating layer is laminated onto the upper surface of the conductor; and A magnetic material covering the aforementioned base insulating layer, the aforementioned first wall portion, the aforementioned second wall portion, the aforementioned wiring conductor, and the aforementioned covering insulating layer. The above-mentioned covering insulation layer has: The covering portion overlaps with the wiring conductor when viewed from above in the aforementioned vertical direction; and The protrusion, radially relative to the aforementioned axis of rotation, is located on the side opposite to the aforementioned covering portion relative to the aforementioned first wall portion. The thickness of the protrusion in the vertical direction is less than the thickness of the covering portion.

2. The inductor component according to claim 1, wherein, The thickness of the first wall portion and the second wall portion is greater than the thickness of the wiring conductor.

3. The inductor component according to claim 1 or 2, wherein, The first wall portion has an inner wall surface and an outer wall surface, wherein the inner wall surface is in contact with the wiring conductor, and the outer wall surface is the opposite side of the inner wall surface, and the outer wall surface is in contact with the magnetic material. The aforementioned insulating layer has a covering side surface, which is a surface facing the aforementioned radial direction and is located closer to the aforementioned second wall portion in the aforementioned radial direction than the aforementioned outer wall surface.

4. The inductor component according to claim 3, wherein, The aforementioned covering side is located in the aforementioned radial direction between the aforementioned outer wall surface and the aforementioned inner wall surface.

5. The inductor component according to any one of claims 1 to 3, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The aforementioned inductor component also includes: The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis; A fourth wall portion is disposed on the aforementioned upper surface of the cover and extends parallel to the aforementioned third wall portion around the aforementioned axis of rotation; and The upper wiring conductor is located between the third wall portion and the fourth wall portion on the upper surface of the cover, and has an upper conductor upper surface that is the opposite side of the surface in contact with the cover insulation layer in the vertical direction. The aforementioned insulating layer contains inorganic fillers. The transparency of the aforementioned insulating layer is lower than that of the first wall portion and the second wall portion. The thickness of the aforementioned covering portion is less than the thickness of the aforementioned first wall portion and the thickness of the aforementioned second wall portion.

6. The inductor component according to any one of claims 1 to 5, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The aforementioned inductor component also includes: The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis; The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis; The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and An insulating layer is layered on top of the upper conductor. The aforementioned upper covering insulation layer has: The upper cover overlaps with the upper wiring conductor in the above top view; and The upper protrusion, in the aforementioned radial direction, is located on the opposite side to the aforementioned upper covering portion relative to the aforementioned third wall portion. The thickness of the upper protrusion is less than the thickness of the upper cover.

7. The inductor component according to any one of claims 1 to 6, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The aforementioned inductor component also includes: The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis; The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis; The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and A through-hole conductor penetrates the aforementioned insulating layer in the vertical direction, connecting the aforementioned wiring conductor and the aforementioned upper wiring conductor. The aforementioned through-hole conductor has a tapered shape that tapers as it approaches the upper wiring conductor in the aforementioned vertical direction.

8. The inductor component according to claim 7, wherein, The aforementioned through-hole conductor has a through-hole conductor side surface, wherein the aforementioned through-hole conductor side surface is in contact with the aforementioned covering insulating layer. In a cross section intersecting the direction of the aforementioned wiring conductor, the inclination angle of the side of the aforementioned through-hole conductor relative to the aforementioned vertical direction is greater than 0 degrees and less than 35 degrees.

9. The inductor component according to any one of claims 1 to 8, wherein, The aforementioned wiring conductor has a pad portion. The thickness of the pad portion is greater than the thickness of the portion of the wiring conductor that is different from the pad portion.

10. The inductor component according to any one of claims 1 to 9, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The aforementioned inductor component also includes: The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis; The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis; The upper wiring conductor, located between the third and fourth walls on the aforementioned upper surface of the cover, has an upper conductor upper surface that is the opposite side in the vertical direction to the surface in contact with the aforementioned covering insulation layer; and An insulating layer is layered on top of the upper conductor. The thickness of the portion of the aforementioned covering insulating layer that is sandwiched between the first wall portion or the second wall portion and the third wall portion or the fourth wall portion in the aforementioned vertical direction is less than the thickness of the aforementioned covering portion.

11. The inductor component according to claim 10, wherein, The first wall portion and the second wall portion each have a lower edge portion and an upper edge portion, wherein the lower edge portion contacts the upper surface of the base portion, and the upper edge portion is located on the opposite side to the lower edge portion in the vertical direction. Each upper edge is positioned closer to the top than the aforementioned wiring conductor in the aforementioned vertical direction. The clamped portion includes the portion of the covering insulation layer with the smallest thickness.

12. The inductor component according to any one of claims 1 to 11, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The upper surface of the cover is smoother than the lower surface of the cover.

13. The inductor component according to any one of claims 1 to 12, wherein, The aforementioned protrusion has a protrusion side, which faces the aforementioned radial direction. The side of the aforementioned protrusion has a cross-section that intersects with the direction of extension of the aforementioned wiring conductor, and has multiple straight sections with different slopes.

14. The inductor component according to any one of claims 1 to 13, wherein, The aforementioned protrusion has a lower surface, wherein the lower surface of the protrusion faces the base insulating layer in the aforementioned vertical direction. The lower surface of the aforementioned protrusion has a curved section in the cross-section that intersects with the direction of extension of the aforementioned wiring conductor.

15. The inductor component according to claim 14, wherein, The aforementioned first wall portion has a lower edge portion and an upper edge portion, wherein the lower edge portion contacts the upper surface of the base portion, and the upper edge portion is located on the opposite side to the lower edge portion in the vertical direction. In the above cross-section, one end of the curved portion contacts the upper edge of the first wall portion.

16. The inductor component according to any one of claims 1 to 15, wherein, The aforementioned covering insulating layer has a lower covering surface and a higher covering surface, wherein the lower covering surface faces the base insulating layer in the vertical direction, and the higher covering surface is the opposite surface to the lower covering surface. The aforementioned inductor component also includes: The third wall portion is provided on the aforementioned upper surface of the cover and extends around the aforementioned rotation axis; The fourth wall portion is disposed on the above-mentioned upper surface of the cover and extends parallel to the third wall portion around the above-mentioned rotation axis; The upper wiring conductor is located between the third wall and the fourth wall on the upper surface of the cover, and has an upper conductor upper surface, which is the opposite side of the surface in contact with the cover insulation layer in the vertical direction. An insulating layer is stacked on the upper surface of the aforementioned upper conductor; External terminals are disposed on the outer surface of the aforementioned magnetic body; and A connecting wire, disposed on the aforementioned magnetic body, extends along the aforementioned vertical direction, connecting the aforementioned external terminal and the aforementioned upper wiring conductor. The aforementioned upper covering insulation layer has: The upper cover overlaps with the upper wiring conductor in the above top view; and The upper protrusion, in the aforementioned radial direction, is located on the opposite side to the aforementioned upper covering portion relative to the aforementioned third wall portion. The thickness of the aforementioned upper protrusion is less than the thickness of the aforementioned upper cover. The thickness of the upper covering portion is greater than the thickness of the covering portion.

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