Wafer cleaning equipment for semiconductor production

Abstract

The invention discloses wafer cleaning equipment for semiconductor production, and relates to the field of wafer cleaning, and the wafer cleaning equipment comprises a cleaning pool, a cleaning equipment body is mounted in the cleaning pool, a base is fixedly arranged at the bottom of the cleaning equipment body, a swing driving mechanism is mounted on the base, and a swing table A is mounted on one side of the swing driving mechanism; the other side of the swing driving mechanism is provided with a swing table B, the interior of the swing table B is provided with a wafer positioning frame B, the interior of the swing table A is provided with a wafer positioning frame A, the interior of the wafer positioning frame A and the interior of the wafer positioning frame B are uniformly provided with a plurality of groups of wafers, and the end part of the wafer positioning frame A is fixedly provided with a connecting table. The invention discloses wafer cleaning equipment for semiconductor production. Slightly shaking generated by deflection can enhance the flowing speed and turbulence effect of the cleaning medium in the gaps of the wafer, accelerates the separation of stains from the surface of the wafer, and particularly cleans tightly attached particles, organic matter residues and the like more thoroughly.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning, specifically to a wafer cleaning device for semiconductor production. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. With the development of semiconductor technology, the demand for wafers is increasing, and the requirements for wafer cleanliness are also becoming more stringent. Typically, laser drilling of wafers produces slag, which adheres to the wafer surface, necessitating cleaning. Existing cleaning methods are inefficient and result in uneven cleaning, leaving liquid residue on the wafer surface after cleaning. This residue easily forms stains after natural drying, affecting the normal use of the wafer.

[0003] To address the aforementioned issues, a search revealed Chinese Patent CN113140485A, which discloses a wafer cleaning device. The device includes a fixed frame, a cleaning tank, a cleaning tray, a cleaning assembly, a first drive assembly, a second drive assembly, and a jet assembly. The cleaning tank is mounted on the fixed frame. The cleaning tray is rotatably mounted within the cleaning tank and is used to hold the wafer. The cleaning assembly is rotatably mounted on the fixed frame, and is capable of entering and exiting the cleaning tank and rotating to clean the wafer. The first drive assembly is connected to the cleaning tray to drive its rotation. The second drive assembly is connected to the cleaning assembly to drive its entry and exit from the cleaning tank and to clean the wafer.

[0004] Although the aforementioned device can mount the jet assembly on a fixed frame for spraying liquid into the cleaning tank to clean the wafer, and can also dry the wafer with sprayed gas after cleaning; the wafer cleaning equipment provided by this invention solves the problems of low wafer cleaning efficiency and difficulty in drying residual liquid on the surface in the prior art, in actual use, when the wafer is being cleaned inside the cleaning tank, the wafer is in a static state, and the removal of contaminants on the wafer surface (such as micron / nano-sized particles, organic films, metal ions, etc.) depends on the chemical dissolution, oxidation-reduction, or other methods of the cleaning solution (such as SC1 solution, ultrapure water, hydrofluoric acid, etc.). Physical stripping: In a static state, the flow of the cleaning solution on the wafer surface is almost stagnant, forming a diffusion boundary layer (i.e., the concentration and flow rate of the cleaning solution near the wafer surface are significantly lower than those of the bulk solution). At this time, contaminants need to enter the cleaning solution from the wafer surface through slow molecular diffusion. For particles with strong adhesion (such as particles adsorbed by van der Waals forces) or tiny particles (<0.1μm), diffusion alone is not enough to effectively remove them from the surface, resulting in a significant decrease in removal rate. Residual particles may cause defects (such as short circuits or open circuits) in subsequent photolithography and etching processes, while residual metal ions will affect the electrical performance of semiconductor devices (such as increased leakage current). Summary of the Invention

[0005] The purpose of this invention is to provide a wafer cleaning device for semiconductor production, so as to solve the defects mentioned in the background art.

[0006] To achieve the above objectives, a wafer cleaning device for semiconductor production is provided, comprising a cleaning tank, a cleaning device body installed inside the cleaning tank, a base fixedly disposed at the bottom of the cleaning device body, a swing drive mechanism mounted on the base, a swing stage A mounted on one side of the swing drive mechanism, a swing stage B mounted on the other side of the swing drive mechanism, a wafer positioning frame B mounted inside the swing stage B, a wafer positioning frame A mounted inside the swing stage A, multiple sets of wafers uniformly disposed inside the wafer positioning frames A and B, a connecting platform fixedly disposed at one end of the wafer positioning frame A, and a wafer positioning frame B fixedly disposed at the end of the connecting platform away from the wafer positioning frame A.

[0007] Furthermore, the cleaning equipment body includes a wafer positioning frame A, a wafer positioning frame B, a swing stage A, a swing stage B, a swing drive mechanism, and a base. The wafer positioning frame A and the wafer positioning frame B have the same structure, the swing stage A and the swing stage B have the same structure, and the swing stage A and the swing stage B are fixedly connected by a bracket.

[0008] Furthermore, the wafer positioning frame A and the wafer positioning frame B are fixedly connected by a connecting platform, which is U-shaped. The wafer positioning frame B includes a cleaning station, positioning grooves, mounting bases, and mounting clips. The cleaning station has a C-shaped cross-section. Multiple sets of positioning grooves are evenly opened on the inner circumference of the cleaning station. The width of the positioning grooves is greater than the thickness of the wafer. The wafers are clamped inside the positioning grooves. The distance between two adjacent sets of wafers is 3-5 mm. Mounting bases are fixedly installed on both sides of the top of the cleaning station. Three sets of drainage holes are evenly opened at the bottom of the multiple sets of positioning grooves.

[0009] Furthermore, the swing table B includes a mounting frame, a mounting platform, a guide column, a guide frame, a reinforcing frame, and a support platform. A main shaft is installed at the bottom of the swing table B. The swing table B and the swing table A reciprocate around the main shaft via a swing drive mechanism.

[0010] Furthermore, the mounting frame is fixedly provided with fixing seats on both sides of the bottom, and a main shaft is fixedly provided between the two sets of fixing seats. The mounting frame has a "U" shaped cross section, and a mounting platform is fixedly provided at both ends of the mounting frame. A mounting space is provided at the top of the mounting platform, and a mounting clip is inserted inside the mounting space. A mounting seat is fixedly connected to the top of the mounting clip. The wafer positioning frame A, the swing stage A, the wafer positioning frame B, and the swing stage B are positioned and installed together by the mounting clip and the mounting platform.

[0011] Furthermore, a guide post is fixedly installed at the end of the mounting platform. The guide post is inserted into a guide rail opened inside the guide frame. The guide frame is arc-shaped. A reinforcing frame is fixedly connected to the bottom of the guide frame. A support platform is welded below the reinforcing frame. The bottom of the support platform is fixedly connected to the base.

[0012] Furthermore, the swing drive mechanism includes a main shaft, an interference stage, an interference channel, an eccentric column, an eccentric wheel, a bearing seat, a drive shaft, and a fixed base. The interference stage is fixedly installed in the middle of the main shaft, and the bottom of the bearing seat is fixedly connected to the base.

[0013] Furthermore, the interference stage has an interference channel inside, which is rectangular and matches the size of the eccentric column. The eccentric column is inserted into the interference channel, and an eccentric wheel is fixedly installed at the end of the eccentric column. A drive shaft is fixedly installed in the middle of the eccentric wheel. The drive shaft passes through a bearing seat and is fixed to the output shaft of the drive motor by passing through the side wall of the cleaning tank.

[0014] Furthermore, the eccentric wheel drives the eccentric column to rotate eccentrically. The eccentric column is inserted inside the interference channel and drives the main shaft to reciprocate through the interference stage. The main shaft drives the wafer positioning frame A, the swing stage A, the wafer positioning frame B, and the swing stage B to reciprocate.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This application uses an eccentric wheel to drive an eccentric column to rotate eccentrically. The eccentric column is inserted into the interference channel and drives the main shaft to reciprocate through the interference stage. The main shaft drives the wafer positioning frame A, the swing stage A, the wafer positioning frame B, and the swing stage B to reciprocate. The reciprocating deflection motion can cause the wafer to continuously change its posture in the cleaning tank, so that the contact angle between the wafer surface and the cleaning fluid continuously changes, avoiding local cleaning blind spots caused by the static state, such as the overlapping shadow area of ​​the wafer or the surface depression. The slight shaking generated by the deflection can enhance the flow speed and turbulence effect of the cleaning medium in the wafer gap, accelerate the removal of stains from the wafer surface, and clean more thoroughly, especially for tightly attached particles and organic residues.

[0017] 2. By replacing different eccentric wheels, this application can flexibly control the deflection angle and frequency of the spindle: for example, if the eccentricity of the eccentric column on the eccentric wheel is smaller, the device can perform small-angle high-frequency deflection, which is suitable for fine cleaning and avoids collisions between wafers; larger-angle deflection can enhance the flow of media, which is suitable for cleaning stubborn stains; the adjustability allows the equipment to adapt to wafer cleaning scenarios of different sizes, materials or contamination levels, making it more versatile.

[0018] 3. This application utilizes the fluidity of the cleaning solution and the reciprocating deflection of the oscillating stage to create "dynamic convection": the 3-5mm wafer pitch provides space for the cleaning solution to flow, while the reciprocating deflection of the oscillating stage further intensifies the turbulence effect of the cleaning solution in the wafer gap; under the oscillation action, SC1 and SC2 in the RCA cleaning solution can penetrate the wafer gap more efficiently. Combined with the emulsifying effect of the alkaline environment of SC1 on organic matter and the complexing effect of the acidic environment of SC2 on metal ions, rapid removal of contaminants is achieved; during the reciprocating deflection of the nanobubble cleaning solution, the bubbles periodically collide and break on the wafer surface with the liquid flow, and the generated local high-pressure micro-jet can specifically remove particles attached to the "dead corners" such as wafer trenches and edges, solving the blind spot problem of traditional static cleaning. Attached Figure Description

[0019] Figure 1 This is a three-dimensional diagram of the wafer cleaning equipment of the present invention;

[0020] Figure 2 This is a bottom view of the wafer cleaning equipment of the present invention;

[0021] Figure 3 This is a schematic diagram of the main structure of the cleaning equipment of the present invention;

[0022] Figure 4 This is a top view of the main body of the cleaning device of the present invention;

[0023] Figure 5 This is a bottom view of the main body of the cleaning device of the present invention;

[0024] Figure 6 This is a cross-sectional view of the main body of the cleaning device of the present invention;

[0025] Figure 7 The structure of this invention Figure 6 Rear view;

[0026] Figure 8 The structure of this invention Figure 6 Exploded view;

[0027] Figure 9 This is a cross-sectional view of the wafer positioning frame B of the present invention.

[0028] Figure Labels

[0029] 100. Cleaning equipment body; 200. Cleaning tank; 1. Wafer positioning frame A; 2. Wafer positioning frame B; 20. Cleaning table; 21. Connecting table; 22. Positioning groove; 221. Drain hole; 23. Assembly seat; 24. Assembly clip; 3. Swinging table A; 4. Swinging table B; 40. Mounting frame; 41. Assembly table; 42. Guide column; 43. Guide frame; 44. Reinforcing frame; 45. Support table; 5. Swinging drive mechanism; 50. Main shaft; 51. Interference table; 52. Interference channel; 53. Eccentric column; 531. Eccentric wheel; 54. Bearing seat; 55. Drive shaft; 551. Fixed seat; 6. Wafer; 7. Base. Detailed Implementation

[0030] Detailed implementation method one: Please refer to Figures 1-9 The present invention provides a technical solution: a wafer cleaning device for semiconductor production, including a cleaning tank 200, a cleaning device body 100 installed inside the cleaning tank 200, a base 7 fixedly installed at the bottom of the cleaning device body 100, a swing drive mechanism 5 installed on the base 7, a swing stage A3 installed on one side of the swing drive mechanism 5, a swing stage B4 installed on the other side of the swing drive mechanism 5, a wafer positioning frame B2 installed inside the swing stage B4, a wafer positioning frame A1 installed inside the swing stage A3, multiple sets of wafers 6 evenly arranged inside the wafer positioning frames A1 and B2, a connecting platform 21 fixedly installed at the end of the wafer positioning frame A1, and a wafer positioning frame B2 fixedly installed at the end of the connecting platform 21 away from the wafer positioning frame A1.

[0031] Specific Implementation Method 2: This implementation method is a further limitation of Specific Implementation Method 1. The cleaning equipment body 100 includes a wafer positioning frame A1, a wafer positioning frame B2, a swing stage A3, a swing stage B4, a swing drive mechanism 5, and a base 7. The wafer positioning frame A1 and the wafer positioning frame B2 have the same structure, and the swing stage A3 and the swing stage B4 have the same structure. The swing stage A3 and the swing stage B4 are fixedly connected by a bracket.

[0032] The wafer positioning frame A1 and the wafer positioning frame B2 are fixedly connected by a connecting platform 21, which is U-shaped. The wafer positioning frame B2 includes a cleaning platform 20, positioning grooves 22, mounting bases 23, and mounting clips 24. The cleaning platform 20 has a C-shaped cross-section. Multiple sets of positioning grooves 22 are evenly opened on the inner circumference of the cleaning platform 20. The width of the positioning grooves 22 is greater than the thickness of the wafer 6. The wafer 6 is snapped into the inside of the positioning grooves 22. The distance between two adjacent sets of wafers 6 is 3-5 mm. Mounting bases 23 are fixedly installed on both sides of the top of the cleaning platform 20. Three sets of drainage holes 221 are evenly opened at the bottom of the multiple sets of positioning grooves 22.

[0033] The swing table B4 includes a mounting frame 40, a mounting platform 41, a guide column 42, a guide frame 43, a reinforcing frame 44, and a support platform 45. A main shaft 50 is installed at the bottom of the swing table B4. The swing table B4 and the swing table A3 reciprocate around the main shaft 50 via the swing drive mechanism 5.

[0034] The mounting frame 40 has fixed mounting bases 551 on both sides of its bottom. A main shaft 50 is fixed between the two sets of fixed mounting bases 551. The mounting frame 40 has a U-shaped cross section. The mounting platform 41 is fixed at both ends of the mounting frame 40. The top of the mounting platform 41 has a mounting space. The mounting space is filled with mounting clips 24. The top of the mounting clips 24 is fixedly connected to a mounting base 23. The wafer positioning frame A1, the swing stage A3, the wafer positioning frame B2, and the swing stage B4 are positioned and installed together by the mounting clips 24 and the mounting platform 41.

[0035] A guide post 42 is fixedly installed at the end of the mounting platform 41. The guide post 42 is inserted into the guide rail opened inside the guide frame 43. The guide frame 43 is arc-shaped. A reinforcing frame 44 is fixedly connected to the bottom of the guide frame 43. A support platform 45 is welded below the reinforcing frame 44. The bottom of the support platform 45 is fixedly connected to the base 7.

[0036] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9As shown: After the wafer positioning frame A1, the oscillating stage A3, the wafer positioning frame B2, and the oscillating stage B4 are positioned and installed using the mounting clip 24 and the mounting stage 41, the eccentric wheel 531 drives the eccentric column 53 to rotate eccentrically. The eccentric column 53 is inserted into the interference channel 52 and drives the main shaft 50 to reciprocate through the interference stage 51. The main shaft 50 drives the wafer positioning frame A1, the oscillating stage A3, the wafer positioning frame B2, and the oscillating stage B4 to reciprocate. The reciprocating motion can cause the wafer 6 to continuously change its posture in the cleaning tank 200, so that the contact angle between the wafer surface and the cleaning solution continuously changes, avoiding local cleaning blind spots caused by a static state, such as wafer overlapping shadow areas and surface depressions; the slight shaking generated by the deflection can enhance the cleaning. The flow velocity and turbulence effect of the medium within the wafer gap accelerate the removal of contaminants from the wafer surface, especially for tightly adhered particles and organic residues, resulting in more thorough cleaning. The eccentric wheel 531 drives the main shaft 50 through the cooperation of the eccentric column 53 and the interference channel 52. Its motion trajectory is a predictable reciprocating deflection, rather than random swaying, ensuring uniform force on the wafer within the positioning slot 22 and preventing wafer collisions, breakage, or surface scratches caused by severe impacts. The positioning structure of the mounting strip 24 and the mounting stage 41 further restricts the relative displacement between the positioning frame and the swing stage, ensuring that the deflection motion only occurs around the main shaft 50, guaranteeing that the wafer moves within a controllable range and reducing the risk of damage. The transmission combination of the eccentric wheel 531, eccentric column 53, and interference stage 51 is a mechanical hard connection. With low force loss, it efficiently converts the rotational motion of the motor into the reciprocating deflection motion of the spindle 50, offering fast response and suitability for high-frequency, small-amplitude deflection requirements. Compared to hydraulic or pneumatic drives, the mechanical transmission structure is more compact, has lower maintenance costs, is less susceptible to media corrosion, and exhibits stronger long-term operational stability. By replacing different eccentric wheels 531, the deflection angle and frequency of the spindle 50 can be flexibly controlled: for example, a smaller eccentricity of the eccentric column 53 on the eccentric wheel 531 allows for small-angle, high-frequency deflection, suitable for fine cleaning and preventing wafer-to-wafer collisions; a larger deflection angle enhances media flow, suitable for cleaning stubborn stains. Adjustability allows the equipment to adapt to wafer cleaning scenarios of different sizes, materials, or contamination levels, making it more versatile. The spindle 50 simultaneously drives... The wafer positioning frame A1 and the oscillating stage A3, as well as the wafer positioning frame B2 and the oscillating stage B4, reciprocate synchronously, ensuring that the movement of the two sets of wafers is completely consistent. This guarantees that the cleaning conditions for wafers in the same batch are identical, reducing differences in cleaning effects within batches and improving product consistency. During the reciprocating deflection, the relative positions between the wafers 6 undergo periodic minor changes. Cleaning waste liquid or air bubbles that might have been "stuck" in the gaps due to stillness are promptly discharged, allowing fresh cleaning media to fill the gaps more efficiently and further optimizing the cleaning uniformity of each wafer. Stable and controllable reciprocating deflection is achieved through mechanical transmission, demonstrating excellent performance in enhancing cleaning effects, ensuring wafer safety, and improving equipment versatility and consistency. It is very suitable for the industrial needs of large-scale wafer cleaning.

[0037] Specific Implementation Method 3: This implementation method is a further limitation of Specific Implementation Method 1. The swing drive mechanism 5 includes a main shaft 50, an interference stage 51, an interference channel 52, an eccentric column 53, an eccentric wheel 531, a bearing seat 54, a drive shaft 55, and a fixed seat 551. The interference stage 51 is fixedly installed in the middle of the main shaft 50, and the bottom of the bearing seat 54 is fixedly connected to the base 7.

[0038] An interference channel 52 is provided inside the interference stage 51. The interference channel 52 is rectangular and its size is adapted to that of the eccentric column 53. The eccentric column 53 is inserted into the interference channel 52. An eccentric wheel 531 is fixedly provided at the end of the eccentric column 53. A drive shaft 55 is fixedly provided in the middle of the eccentric wheel 531. The drive shaft 55 is set through the bearing seat 54 via a bearing. The drive shaft 55 is fixed to the output shaft of the drive motor by passing through the side wall of the cleaning tank 200 via a bearing.

[0039] The eccentric wheel 531 drives the eccentric column 53 to rotate eccentrically. The eccentric column 53 is inserted into the interference channel 52 and drives the main shaft 50 to reciprocate through the interference stage 51. The main shaft 50 drives the wafer positioning frame A1, the swing stage A3, the wafer positioning frame B2, and the swing stage B4 to reciprocate.

[0040] like Figure 7 , Figure 8 and Figure 9 As shown: When cleaning the wafers 6 inside the cleaning equipment body 100, the cleaning tank 200 is filled with a modified RCA cleaning solution. The RCA cleaning solution consists of SC1 and SC2, which is a classic cleaning solution in the semiconductor industry. The concentration can be adjusted according to needs. SC1 includes ammonia, hydrogen peroxide, and deionized water to remove organic matter and particles; SC2 includes hydrochloric acid, hydrogen peroxide, and deionized water to remove metal ions. The RCA cleaning solution, combined with the structural features of the cleaning equipment, has the following innovative advantages:

[0041] 1. In conjunction with dynamic equipment cleaning, it improves pollutant removal efficiency:

[0042] The fluidity of the cleaning solution and the reciprocating deflection of the oscillating stage create "dynamic convection": the 3-5mm wafer pitch provides space for the cleaning solution to flow, while the reciprocating deflection of the oscillating stage further intensifies the turbulence effect of the cleaning solution in the wafer gap; under the oscillation action, SC1 and SC2 in the RCA cleaning solution can penetrate the wafer gap more efficiently. Combined with the emulsifying effect of the alkaline environment of SC1 on organic matter and the complexing effect of the acidic environment of SC2 on metal ions, the rapid removal of contaminants is achieved; during the reciprocating deflection of the nanobubble cleaning solution, the bubbles collide and break periodically on the wafer surface with the liquid flow, and the generated local high-pressure micro-jet can specifically remove particles attached to the "dead corners" such as wafer trenches and edges, solving the blind spot problem of traditional static cleaning;

[0043] 2. Targeted removal of pollutants to reduce secondary pollution:

[0044] The improved RCA cleaning solution reduces the proportion of ammonia and hydrochloric acid by adjusting the concentration, which reduces excessive etching of the wafer surface while ensuring removal efficiency, especially for brittle materials such as compound semiconductors such as GaN and SiC, thus reducing the risk of damage.

[0045] Supercritical CO2 cleaning solution has extremely strong penetrability and solubility, which can dissolve photoresist residue and organic contaminants. After cleaning, CO2 evaporates directly without liquid residue, avoiding the "watermark" or ion residue caused by drying in traditional cleaning solutions and reducing secondary pollution. Ozone water has selective oxidation, preferentially decomposing organic matter and has low corrosivity to metal layers. It is suitable for the "post-metal wiring cleaning" scenario in wafer fabrication, balancing cleanliness and metal layer protection.

[0046] Working principle: A large number of wafers 6 are inserted into the positioning slots 22, with a spacing of 3-5mm between wafers 6. Since wafer positioning frames A1 and B2 are fixed together by a connecting platform 21, a robotic arm is used to lift wafer positioning frames A1 and B2 by holding the connecting platform 21. The lifted frames are then moved above the swing platforms A3 and B4, and lowered so that wafer positioning frame A1 engages inside the swing platform A3, and wafer positioning frame B2 engages inside the swing platform B4. Inside the 4, the wafer positioning frames A1 and B2 are equipped with numerous positioning slots 22, allowing for the simultaneous cleaning of a large number of wafers 6 within the cleaning tank 200. By simultaneously inserting multiple wafers 6 into the numerous positioning slots 22, maintaining a reasonable spacing of 3-5mm between them, large-scale wafer cleaning can be completed in one go, significantly improving cleaning efficiency and reducing the time cost per process. The wafer positioning frames A1 and B2 are fixed by a connecting platform 21, ensuring a stable overall structure. During descent, they are respectively engaged within the swing platforms A3 and B4, providing multiple... Positioning ensures wafer stability during cleaning, preventing collisions or displacement caused by shaking; the 3-5mm spacing between wafers provides ample space for cleaning fluid flow; combined with the oscillating motion of the oscillating table, it ensures that all surfaces of each wafer fully contact the cleaning medium, improving cleaning uniformity; the combination of positioning frame and oscillating table structure allows for the centralized storage of a large number of wafers within the 200mm cleaning tank, eliminating the need for a distributed layout, saving overall space in the cleaning equipment, and improving the utilization rate of unit space; from insertion and hoisting to clamping, the wafers remain in a fixed position throughout the entire process. The protection of the slot 22 and the positioning frame reduces direct contact with external hard objects; stable operation and reasonable spacing design reduce the risk of damage such as scratches and breakage caused by collisions and friction on the wafer, protecting the integrity of the wafer; it takes into account efficiency, stability, uniformity and safety, and is very suitable for the cleaning process in large-scale wafer production; the bottom of the positioning slot 22 is evenly provided with three sets of drainage holes 221, so that when the wafer positioning frame A1 and the wafer positioning frame B2 are moved out of the cleaning tank 200, water will not accumulate inside the wafer positioning frame A1 and the wafer positioning frame B2.

Claims

1. A wafer cleaning apparatus for semiconductor manufacturing, comprising a cleaning tank (200), characterized in that: The cleaning tank (200) is equipped with a cleaning equipment body (100). A base (7) is fixedly installed at the bottom of the cleaning equipment body (100). A swing drive mechanism (5) is installed on the base (7). A swing table A (3) is installed on one side of the swing drive mechanism (5). A swing table B (4) is installed on the other side of the swing drive mechanism (5). A wafer positioning frame B (2) is installed inside the swing table B (4). A wafer positioning frame A (1) is installed inside the swing table A (3). Multiple sets of wafers (6) are evenly arranged inside the wafer positioning frames A (1) and B (2). A connecting platform (21) is fixedly installed at the end of the wafer positioning frame A (1). A wafer positioning frame B (2) is fixedly installed at the end of the connecting platform (21) away from the wafer positioning frame A (1).

2. The wafer cleaning equipment for semiconductor production according to claim 1, characterized in that: The main body (100) of the cleaning equipment includes a wafer positioning frame A (1), a wafer positioning frame B (2), a swing stage A (3), a swing stage B (4), a swing drive mechanism (5), and a base (7). The wafer positioning frame A (1) and the wafer positioning frame B (2) have the same structure, and the swing stage A (3) and the swing stage B (4) have the same structure. The swing stage A (3) and the swing stage B (4) are fixedly connected by a bracket.

3. A wafer cleaning device for semiconductor production according to claim 2, characterized in that: The wafer positioning frame A (1) and wafer positioning frame B (2) are fixedly connected by a connecting platform (21). The connecting platform (21) is U-shaped. The wafer positioning frame B (2) includes a cleaning platform (20), positioning grooves (22), mounting bases (23) and mounting clips (24). The cleaning platform (20) has a C-shaped cross-section. Multiple sets of positioning grooves (22) are evenly opened on the inner circumference of the cleaning platform (20). The width of the positioning grooves (22) is greater than the thickness of the wafer (6). The wafer (6) is snapped into the inside of the positioning grooves (22). The distance between two adjacent sets of wafers (6) is 3-5 mm. Mounting bases (23) are fixedly installed on both sides of the top of the cleaning platform (20). Three sets of drain holes (221) are evenly opened at the bottom of the multiple sets of positioning grooves (22).

4. A wafer cleaning device for semiconductor production according to claim 2, characterized in that: The swing table B (4) includes a mounting frame (40), a mounting platform (41), a guide column (42), a guide frame (43), a reinforcing frame (44), and a support platform (45). A main shaft (50) is installed at the bottom of the swing table B (4). The swing table B (4) and the swing table A (3) reciprocate around the main shaft (50) via a swing drive mechanism (5).

5. A wafer cleaning device for semiconductor production according to claim 4, characterized in that: The mounting frame (40) has fixed bases (551) on both sides of its bottom. A main shaft (50) is fixed between the two sets of fixed bases (551). The mounting frame (40) has a U-shaped cross section. Mounting platforms (41) are fixed at both ends of the mounting frame (40). Mounting space is provided at the top of the mounting platform (41). Mounting clips (24) are inserted inside the mounting space. Mounting bases (23) are fixedly connected to the top of the mounting clips (24). The wafer positioning frame A (1), the swing stage A (3), the wafer positioning frame B (2), and the swing stage B (4) are positioned and installed by the mounting clips (24) and the mounting platform (41).

6. A wafer cleaning device for semiconductor production according to claim 5, characterized in that: The mounting platform (41) is fixedly provided with a guide post (42) at its end. The guide post (42) is inserted into the guide rail opened inside the guide frame (43). The guide frame (43) is arc-shaped. A reinforcing frame (44) is fixedly connected to the bottom of the guide frame (43). A support platform (45) is welded below the reinforcing frame (44). The bottom of the support platform (45) is fixedly connected to the base (7).

7. A wafer cleaning device for semiconductor production according to claim 4, characterized in that: The swing drive mechanism (5) includes a main shaft (50), an interference stage (51), an interference channel (52), an eccentric column (53), an eccentric wheel (531), a bearing seat (54), a drive shaft (55), and a fixed seat (551). The interference stage (51) is fixedly installed in the middle of the main shaft (50), and the bottom of the bearing seat (54) is fixedly connected to the base (7).

8. A wafer cleaning apparatus for semiconductor production according to claim 7, characterized in that: The interference stage (51) has an interference channel (52) inside. The interference channel (52) is rectangular and its size is matched with that of the eccentric column (53). The eccentric column (53) is inserted into the interference channel (52). An eccentric wheel (531) is fixedly installed at the end of the eccentric column (53). A drive shaft (55) is fixedly installed in the middle of the eccentric wheel (531). The drive shaft (55) passes through the bearing seat (54) through the bearing and is fixed to the output shaft of the drive motor through the side wall of the cleaning tank (200) through the bearing.

9. A wafer cleaning device for semiconductor production according to claim 8, characterized in that: The eccentric wheel (531) drives the eccentric column (53) to rotate eccentrically. The eccentric column (53) is inserted into the interior of the interference channel (52) and drives the main shaft (50) to reciprocate through the interference stage (51). The main shaft (50) drives the wafer positioning frame A (1), the swing stage A (3), the wafer positioning frame B (2), and the swing stage B (4) to reciprocate.

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