Wiring circuit board

Abstract

A wired circuit board (1) is provided with a metal layer (2), a first insulating layer (3), and a circuit pattern (4). The circuit pattern (4) has a terminal (41A) and a wiring (42A) connected to the terminal (41A). The first insulating layer (3) has a main body portion (31) disposed between the wiring (42A) and the metal layer (2), and a heat dissipation portion in contact with the terminal (41A) and the metal layer (2). The thickness (second thickness (T2)) of the heat dissipation part (32) is smaller than the thickness (first thickness (T1)) of the main body part (31).

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Previously, a wiring circuit board was known to include: a metal support layer; a circuit having pad portions; and a substrate insulating layer disposed between the metal support layer and the pad portions (for example, see Patent Document 1 below).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2019-212679 Summary of the Invention Problems to be solved by the invention In the wiring circuit board described in Patent Document 1, when molten solder is placed on the pad portion, there is a possibility that the heat of the solder may be transferred to the substrate insulating layer through the pad portion, causing damage to the substrate insulating layer.

[0004] If the damage to the substrate insulation layer is excessive, there is a possibility that the substrate insulation layer may be easily peeled off from the metal support layer.

[0005] The present invention provides a wiring circuit board capable of suppressing damage to the first insulating layer caused by heat transferred from the terminal to the first insulating layer.

[0006] Technical solutions for solving the problem The present invention [1] includes a wiring circuit board comprising: a metal layer; a circuit pattern having terminals and wiring connected to the terminals; and a first insulating layer disposed between the metal layer and the circuit pattern in the thickness direction of the metal layer, the first insulating layer having: a main body disposed between the wiring and the metal layer having a first thickness; and a heat dissipation portion having a second thickness thinner than the first thickness, contacting the terminals and contacting the metal layer.

[0007] According to this structure, the heat dissipation part that contacts the terminal and the metal layer is thinner than the main body part disposed between the wiring and the metal layer.

[0008] Therefore, when molten solder is placed on the terminal, the heat transferred to the heat sink via the terminal can be smoothly dissipated to the metal layer.

[0009] As a result, damage to the first insulating layer caused by heat transferred from the terminal to the first insulating layer can be suppressed.

[0010] The present invention [2] includes the wiring circuit board of [1] above, wherein the circuit pattern has a plurality of terminals and the heat dissipation portion is in contact with the plurality of terminals.

[0011] With this structure, the heat from multiple terminals is concentrated in the heat dissipation section.

[0012] In this regard, since the thickness of the heat dissipation section is thinner than that of the main body, even if the heat from multiple terminals is concentrated in the heat dissipation section, the heat transferred to the heat dissipation section can be smoothly dissipated to the metal layer.

[0013] As a result, even when the heat from multiple terminals is concentrated in the heat dissipation section, damage to the first insulation layer can be suppressed.

[0014] The present invention [3] includes the wiring circuit board of [1] above, wherein the heat dissipation part is in contact with one of the terminals.

[0015] This structure can suppress the heat concentration of multiple terminals in the heat dissipation part.

[0016] Therefore, it can further suppress damage to the first insulating layer.

[0017] The present invention [4] includes a wiring circuit board of any one of [1] to [3] above, wherein the heat dissipation portion is in full contact with the terminal.

[0018] The present invention [5] includes a wiring circuit board of any one of [1] to [3] above, wherein the heat dissipation portion is in contact with a portion of the terminal.

[0019] The present invention [6] includes the wiring circuit board of [5] above, wherein the portion of the terminal is the periphery of the terminal.

[0020] The present invention [7] includes the wiring circuit board of [5] above, wherein the portion of the terminal is the central portion of the terminal.

[0021] The present invention [8] includes a wiring circuit board of any one of [1] to [7] above, wherein the wiring circuit board further comprises a second insulating layer disposed on the first insulating layer and covering the wiring, and the terminal protrudes from the second insulating layer relative to the side of the first insulating layer facing the metal layer.

[0022] This structure ensures the thickness of the terminals.

[0023] Therefore, when the solder melts on the terminal, it is possible to suppress the heat transfer of the solder to the second insulating layer.

[0024] The present invention [9] includes a wiring circuit board of any one of [1] to [7] above, wherein the terminal has: a first conductor layer disposed on the first insulating layer; and a second conductor layer disposed on the first conductor layer.

[0025] With this structure, terminals can be formed from the first conductor layer and the second conductor layer in a relatively thick manner.

[0026] As a result, when the solder melts on the terminal, it is possible to suppress the heat transfer of the solder to the second insulating layer.

[0027] Effects of the Invention According to the wiring circuit board of the present invention, damage to the first insulating layer caused by heat transferred from the terminal to the first insulating layer can be suppressed. Attached Figure Description

[0028] Figure 1 This is a top view of a wiring circuit board according to one embodiment of the present invention.

[0029] Figure 2 yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board.

[0030] Figures 3A to 3D express Figure 2 The manufacturing process of the wiring circuit board shown is as follows: Figure 3A This indicates the first insulating layer formation process. Figure 3B This indicates the process of forming the first conductor layer. Figure 3C This indicates the process of forming the second conductor layer. Figure 3D This indicates the process of forming the second insulating layer.

[0031] Figure 4 This is a cross-sectional view of the wiring circuit board of variant example (1).

[0032] Figure 5 This is a cross-sectional view of the wiring circuit board of variant example (2).

[0033] Figures 6A to 6C The wiring circuit board of modified example (3) is shown. Figure 6A This is a top view of the wiring circuit board of modified example (3). Figure 6B express Figure 6A The diagram shows a BB cross-sectional view of the wiring circuit board. Figure 6C express Figure 6A The shown is a CC cross-sectional view of the wiring circuit board.

[0034] Figures 7A to 7C The wiring circuit board of modified example (4) is shown. Figure 7A This is a top view of the wiring circuit board of modified example (4). Figure 7B express Figure 7A The diagram shows a DD cross-sectional view of the wiring circuit board. Figure 7C express Figure 7A The EE cross-sectional view of the wiring circuit board shown.

[0035] Figures 8A to 8C The wiring circuit board of modified example (5) is shown. Figure 8A This is a top view of the wiring circuit board of modified example (5). Figure 8B express Figure 8A The diagram shows the FF cross-sectional view of the wiring circuit board. Figure 8C express Figure 8A The diagram shows a GG cross-sectional view of the wiring circuit board.

[0036] Figures 9A to 9C The wiring circuit board of modified example (6) is shown. Figure 9A This is a top view of the wiring circuit board of modified example (6). Figure 9B express Figure 9A The HH cross-sectional view of the wiring circuit board shown is shown. Figure 9C express Figure 9A The diagram shows a cross-sectional view (II) of the wiring circuit board. Detailed Implementation

[0037] 1. Wiring circuit board like Figure 1 As shown, the wiring circuit board 1 extends along a first direction and a second direction. The second direction is orthogonal to the first direction. The shape of the wiring circuit board 1 is not limited. The wiring circuit board 1 can be a flexible wiring circuit board or a suspended board with circuitry.

[0038] like Figure 2 As shown, the wiring circuit board 1 has a metal layer 2, a first insulating layer 3, a circuit pattern 4, and a second insulating layer 5.

[0039] (1) Metal layer Metal layer 2 supports first insulating layer 3, circuit pattern 4, and second insulating layer 5. Materials for metal layer 2 include, for example, stainless steel and copper alloys. Metal layer 2 may also have multiple layers comprising different metals.

[0040] (2) First insulating layer A first insulating layer 3 is disposed on one side of the metal layer 2 in the thickness direction. The thickness direction is orthogonal to the first and second directions. The first insulating layer 3 is disposed on one surface of the metal layer 2 in the thickness direction. The first insulating layer 3 is disposed between the metal layer 2 and the circuit pattern 4 in the thickness direction. The first insulating layer 3 can insulate the metal layer 2 relative to the circuit pattern 4. The first insulating layer 3 includes a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 3 has a main body portion 31 and a heat dissipation portion 32.

[0041] The main body 31 is disposed in the thickness direction between the wiring 42A of the circuit pattern 4 and the metal layer 2. The wiring 42A will be explained later. The main body 31 can insulate the metal layer 2 relative to the wiring 42A. The main body 31 has a first thickness T1. The first thickness T1 is, for example, 5 μm to 30 μm.

[0042] A heat dissipation portion 32 is disposed in the thickness direction between at least a portion of the terminal 41A of the circuit pattern 4 and the metal layer 2. The terminal 41A will be described later. In this embodiment, the heat dissipation portion 32 is disposed in the thickness direction between the entire terminal 41A and the metal layer 2. The heat dissipation portion 32 can insulate the metal layer 2 relative to the terminal 41A, and, when solder melts on the terminal 41A, can smoothly dissipate heat transferred to the heat dissipation portion 32 via the terminal 41A to the metal layer 2. The heat dissipation portion 32 has a second thickness T2. The second thickness T2 is thinner than the first thickness T1. The second thickness T2 is, for example, 1 μm to 25 μm. The heat dissipation portion 32 is in contact with the entire terminal 41A and with the metal layer 2. Specifically, as... Figure 1 As shown, the heat dissipation portion 32 extends along a first direction and a second direction. The heat dissipation portion 32 is in full contact with the terminal 41A in the first direction and in full contact with the terminal 41A in the second direction.

[0043] Furthermore, the heat dissipation section 32 is in contact with multiple terminals 41A and 41B. Therefore, the heat from terminals 41A and 41B is concentrated in the heat dissipation section 32. In this regard, since the thickness of the heat dissipation section 32 (second thickness T2) is thinner than the thickness of the main body section 31 (first thickness T1), even though the heat from terminals 41A and 41B is concentrated in the heat dissipation section 32, the heat transferred to the heat dissipation section 32 can be smoothly dissipated to the metal layer 2.

[0044] (3) Circuit diagram like Figure 2 As shown, circuit pattern 4 is disposed on one side of the first insulating layer 3 in the thickness direction. Circuit pattern 4 is disposed on one surface of the first insulating layer 3 in the thickness direction. Circuit pattern 4 is disposed on the opposite side of the metal layer 2 in the thickness direction relative to the first insulating layer 3.

[0045] like Figure 1 As shown, circuit pattern 4 has multiple terminals 41A, 41B and multiple wirings 42A, 42B.

[0046] At least a portion of terminal 41A is disposed on the heat dissipation portion 32 of the first insulating layer 3. In this embodiment, the entire terminal 41A is disposed on the heat dissipation portion 32. Figure 2 As shown, terminal 41A has a first conductor layer 411 and a second conductor layer 412.

[0047] The first conductor layer 411 is disposed on the first insulating layer 3 in the thickness direction. For example... Figure 1 As shown, the first conductor layer 411 extends along a first direction and a second direction. The first conductor layer 411 has a square pad shape. The first conductor layer 411 contains a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, the first conductor layer 411 preferably contains copper.

[0048] like Figure 2 As shown, the second conductor layer 412 is disposed on the first conductor layer 411 in the thickness direction. The second conductor layer 412 protrudes beyond the second insulating layer 5 in the thickness direction relative to the side of the first insulating layer 3 facing the metal layer 2 (i.e., the side in the thickness direction). In other words, the terminal 41A protrudes beyond the second insulating layer 5 in the thickness direction relative to the side of the first insulating layer 3 facing the metal layer 2. This ensures that the thickness of the terminal 41A is sufficient to suppress heat transfer of the solder to the second insulating layer 5 when the solder melts on the terminal 41A. In the thickness direction, one surface S1 of the terminal 41A is positioned further to one side than one surface S2 of the second insulating layer 5. Figure 1 As shown, the second conductor layer 412 extends along a first direction and a second direction. The second conductor layer 412 has a generally rectangular shape. The second conductor layer 412 contains the same metal as the first conductor layer 411.

[0049] Terminal 41B is arranged side-by-side with terminal 41A in a first direction. Terminal 41B is also arranged separately from terminal 41A in the first direction. At least a portion of terminal 41A is disposed on the heat dissipation portion 32 of the first insulating layer 3. In this embodiment, the entire terminal 41A is disposed on the heat dissipation portion 32. Terminal 41B, like terminal 41A, has a first conductor layer 411 and a second conductor layer 412.

[0050] The width W (dimension in the first direction) of each of terminals 41A and 41B is, for example, 10μm to 1000μm, preferably 50μm to 900μm.

[0051] The distance D between terminals 41A and 41B in the first direction is, for example, 10 μm to 500 μm, preferably 20 μm to 400 μm.

[0052] Wiring 42A is disposed in the main body 31 of the first insulating layer 3 (see reference). Figure 2Wiring 42A extends along a second direction. One end of wiring 42A in the second direction is connected to terminal 41A. One end of wiring 42A in the second direction may also be disposed together with terminal 41A on the heat dissipation portion 32 of the first insulating layer 3. Specifically, wiring 42A is connected to the first conductor layer 411 of terminal 41A. Wiring 42A contains the same metal as the first conductor layer 411 of terminal 41A. Wiring 42A may also be bent towards the first direction.

[0053] Wiring 42B is parallel to wiring 42A in the first direction. Wiring 42B is also separately configured from wiring 42A in the first direction. The description of wiring 42B is the same as that of wiring 42A, and therefore is omitted.

[0054] (4) Second insulating layer The second insulating layer 5 is disposed on one side of the first insulating layer 3 in the thickness direction. The second insulating layer 5 is disposed on one surface of the first insulating layer 3 in the thickness direction. The second insulating layer 5 covers wirings 42A and 42B. The second insulating layer 5 does not cover terminals 41A and 41B. The second insulating layer 5 comprises resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0055] 2. Manufacturing method of wiring circuit board Next, the manufacturing method of the wiring circuit board 1 will be described.

[0056] The manufacturing method of the wiring circuit board 1 includes a first insulating layer formation process (see reference). Figure 3A ), the first conductor layer formation process (refer to) Figure 3B ), the second conductor layer formation process (refer to) Figure 3C ) and the second insulating layer formation process (refer to Figure 3D ).

[0057] (1) First insulating layer formation process like Figure 3A As shown, in the first insulating layer forming process, a first insulating layer 3 is formed on the metal layer 2. In the first insulating layer forming process, a main body portion 31 and a heat dissipation portion 32 are formed in the first insulating layer 3 by grayscale exposure.

[0058] In detail, firstly, a solution of photosensitive resin (varnish) is applied onto the metal layer 2 and allowed to dry to form a photosensitive resin coating.

[0059] Next, the photosensitive resin coating is subjected to grayscale exposure using a photomask having a light-shielding portion, a fully transparent portion, and a semi-transparent portion. The light-shielding portion is opposite to the portion of the photosensitive resin coating where the first insulating layer 3 is not formed. The fully transparent portion is opposite to the portion of the photosensitive resin coating where the main body portion 31 is formed. The semi-transparent portion is opposite to the portion of the photosensitive resin coating where the heat dissipation portion 32 is formed.

[0060] Next, the exposed coating is developed. The portion of the coating opposite the semi-transparent portion is developed thinner than the portion opposite the fully transparent portion. Thus, the first insulating layer 3 is formed on the metal layer 2 in the above pattern.

[0061] (2) Forming process of the first conductor layer Next, as Figure 3B As shown, in the first conductor layer forming process, a first conductor layer 411 with terminals 41A and 41B and wiring 42A and 42B are formed on the first insulating layer 3.

[0062] In detail, during the first conductor layer formation process, a seed layer is first formed on one side of the first insulating layer 3 and one side of the metal layer 2 in the thickness direction. The seed layer is formed, for example, by sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0063] Next, an anti-plating agent is adhered to one side of the metal layer 2 in the thickness direction. The anti-plating agent covers the first insulating layer 3.

[0064] Next, the resist is exposed and developed. Thus, the resist in the portions forming the first conductor layer 411 and the wirings 42A and 42B is removed, and the seed layer is exposed in the portions forming the first conductor layer 411 and the wirings 42A and 42B. On the other hand, the resist in the portions where the first conductor layer 411 and the wirings 42A and 42B are not formed is retained.

[0065] Next, on the exposed seed layer, a first conductor layer 411 and wirings 42A and 42B are formed by electroplating. After the electroplating is completed, the resist is stripped off.

[0066] (3) Second conductor layer formation process Next, as Figure 3C As shown, in the second conductor layer forming process, a second conductor layer 412 is formed on the first conductor layer 411 to form terminals 41A and 41B.

[0067] In detail, during the second conductor layer formation process, an anti-plating agent is adhered to one side of the metal layer 2 in the thickness direction. The anti-plating agent covers the first insulating layer 3, the first conductor layer 411, and the wirings 42A and 42B.

[0068] Next, the resist is exposed and developed. Thus, the resist in the portion forming the second conductor layer 412 is removed, exposing the first conductor layer 411 in the portion forming the second conductor layer 412. On the other hand, the resist in the portion where the second conductor layer 412 is not formed is retained.

[0069] Next, a second conductor layer 412 is formed on the exposed first conductor layer 411 by electroplating. After the electroplating is completed, the resist is stripped off.

[0070] Then, the seed layer exposed due to the stripping of the anti-plating agent is removed by etching.

[0071] (4) Second insulation layer formation process Next, as Figure 3D As shown, in the second insulating layer forming process, a second insulating layer 5 is formed on top of the first insulating layer 3.

[0072] In detail, in the second insulating layer forming process, firstly, a solution of photosensitive resin (varnish) is applied to the circuit pattern 4, the first insulating layer 3 and the metal layer 2 and then dried to form a photosensitive resin coating.

[0073] Next, the photosensitive resin coating is exposed and developed. As a result, a second insulating layer 5 is formed on the first insulating layer 3 with the above-described pattern.

[0074] 3. Effects (1) According to the wiring circuit board 1, such as Figure 2 As shown, the heat dissipation portion 32, which contacts the terminal 41A and the metal layer 2, is thinner than the main body portion 31 disposed between the wiring 42A and the metal layer 2.

[0075] Therefore, when molten solder is placed on terminal 41A, the heat transferred to heat dissipation section 32 via terminal 41A can be smoothly dissipated to metal layer 2.

[0076] As a result, damage to the first insulating layer 3 caused by heat transferred from terminal 41A to the first insulating layer 3 can be suppressed.

[0077] (2) According to the wiring circuit board 1, such as Figure 1 As shown, circuit pattern 4 has multiple terminals 41A and 41B. Heat sink 32 is in contact with the multiple terminals 41A and 41B.

[0078] Therefore, the heat from the multiple terminals 41A and 41B is concentrated in the heat dissipation section 32.

[0079] Regarding this point, such as Figure 2As shown, since the thickness of the heat dissipation part 32 (second thickness T2) is thinner than the thickness of the main body part 31 (first thickness T1), even if the heat of multiple terminals 41A and 41B is concentrated in the heat dissipation part 32, the heat transferred to the heat dissipation part 32 can be smoothly dissipated to the metal layer 2.

[0080] As a result, even when the heat from multiple terminals 41A and 41B is concentrated in the heat dissipation section 32, damage to the first insulating layer 3 can be suppressed.

[0081] (3) According to the wiring circuit board 1, such as Figure 2 As shown, terminal 41A protrudes from the second insulating layer 5 on the opposite side of the first insulating layer 3 toward the metal layer 2.

[0082] Therefore, the thickness of terminal 41A can be ensured.

[0083] As a result, when the solder melts on terminal 41A, the heat transfer of the solder to the second insulating layer 5 can be suppressed.

[0084] (4) According to the wiring circuit board 1, such as Figure 2 As shown, terminal 41A has a first conductor layer 411 and a second conductor layer 412.

[0085] Therefore, the terminal 41A can be formed relatively thickly from the first conductor layer 411 and the second conductor layer 412.

[0086] As a result, when the solder melts on terminal 41A, the heat transfer of the solder to the second insulating layer 5 can be suppressed.

[0087] 4. Variations The following describes a variation. In the variation, the same symbols are used to mark the same components as in the above-described embodiment, and the description is omitted.

[0088] (1) such as Figure 4 As shown, terminal 41A may also not have a second conductor layer 412. Terminal 41A may also be composed of a first conductor layer 411.

[0089] (2) such as Figure 5As shown, the second insulating layer 5 may also cover the peripheral portion E of the first conductor layer 411 of terminal 41A. The peripheral portion E is one end of the first conductor layer 411 in a first direction, the other end of the first conductor layer 411 in a first direction, one end of the first conductor layer 411 in a second direction, and the other end of the first conductor layer 411 in a second direction. That is, the second insulating layer 5 may also cover one end of the first conductor layer 411 in a first direction, the other end of the first conductor layer 411 in a first direction, one end of the first conductor layer 411 in a second direction, and the other end of the first conductor layer 411 in a second direction. The second insulating layer 5 does not cover the second conductor layer 412 of terminal 41A.

[0090] (3) such as Figures 6A to 6C As shown, the heat sink 32 can also contact one terminal 41A. Alternatively, the heat sink 32 can contact all terminals 41A.

[0091] In this case, it is possible to suppress the heat concentration of multiple terminals in the heat dissipation section 32.

[0092] Therefore, it can further suppress damage to the first insulating layer 3.

[0093] (4) The heat dissipation part 32 may also contact a portion of the terminal 41A. For example... Figures 7A to 7C As shown, a portion of terminal 41A can also be a portion 410 of terminal 41A in the second direction (e.g., one side half). In this variation, the heat dissipation portion 32 does not contact the other side half of terminal 41A in the second direction.

[0094] In both the first and second directions, when the area of ​​terminal 41A is set to 100%, the area of ​​a portion of terminal 41A is, for example, 50% or more, preferably 75% or more.

[0095] (5) such as Figures 8A to 8C As shown, a portion of terminal 41A can also be the peripheral portion E of terminal 41A. That is, the heat dissipation portion 32 can also contact one end of the first conductor layer 411 in the first direction, the other end of the first conductor layer 411 in the first direction, one end of the first conductor layer 411 in the second direction, and the other end of the first conductor layer 411 in the second direction. In this modified example, the heat dissipation portion 32 does not contact the central portion of the first conductor layer 411 in the first direction or the central portion of the first conductor layer 411 in the second direction.

[0096] (6) For example Figures 9A to 9CAs shown, a portion of terminal 41A can also be the central portion C of terminal 41A. The central portion C is the central portion of the first conductor layer 411 in the first direction and the central portion of the first conductor layer 411 in the second direction. That is, the heat dissipation portion 32 can also contact the central portions of the first conductor layer 411 in the first direction and the central portions of the first conductor layer 411 in the second direction. In this variation, the heat dissipation portion 32 does not contact one end of the first conductor layer 411 in the first direction, the other end of the first conductor layer 411 in the first direction, one end of the first conductor layer 411 in the second direction, or the other end of the first conductor layer 411 in the second direction.

[0097] (7) Even in variations (1) to (6), the same effect as the above-described embodiments can be obtained.

[0098] (8) The above-described embodiments and variations (1) to (6) can be combined.

[0099] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that are obvious to those skilled in the art are included within the scope of protection of the technical solutions described below.

[0100] Industrial availability The wiring circuit board of the present invention can be used for the connection of electronic components.

[0101] Symbol Explanation 1: Wiring circuit board 2: Metal layer 3: First insulating layer 4: Circuit diagram 5: Second insulation layer 31: Main body 32: Heat dissipation section 41A: Terminal 41B: Terminal 42A: Wiring 42B: Wiring 410: Part 411: First conductor layer 412: Second conductor layer C: Central Department E: Periphery.

Claims

1. A wiring circuit board, comprising: Metal layer; A circuit pattern having terminals and wiring connected to the terminals; and A first insulating layer is disposed between the metal layer and the circuit pattern in the thickness direction of the metal layer. The first insulating layer has: A main body portion, disposed between the wiring and the metal layer, having a first thickness; and The heat dissipation section has a second thickness that is thinner than the first thickness, and is in contact with the terminal and the metal layer.

2. The wiring circuit board according to claim 1, wherein, The circuit pattern has multiple terminals. The heat dissipation section is in contact with the plurality of terminals.

3. The wiring circuit board according to claim 1, wherein, The heat dissipation part is in contact with one of the terminals.

4. The wiring circuit board according to claim 1, wherein, The heat dissipation part makes full contact with the terminal.

5. The wiring circuit board according to claim 1, wherein, The heat dissipation part is in contact with a portion of the terminal.

6. The wiring circuit board according to claim 5, wherein, The portion of the terminal is the periphery of the terminal.

7. The wiring circuit board according to claim 5, wherein, The portion of the terminal is the central portion of the terminal.

8. The wiring circuit board according to any one of claims 1 to 7, wherein, The wiring circuit board further includes a second insulating layer, which is disposed on the first insulating layer and covers the wiring. The terminal protrudes from the second insulating layer on the opposite side of the first insulating layer toward the metal layer.

9. The wiring circuit board according to any one of claims 1 to 7, wherein, The terminal has: A first conductor layer disposed on the first insulating layer; and A second conductor layer is disposed on the first conductor layer.

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