Semi-embedded copper bar device and electronic equipment

Abstract

The invention discloses a semi-embedded copper bar device and electronic equipment, which can enable a power supply and a high-power chip to directly carry out current transmission through the semi-embedded copper bar device, omit a through-flow path on a circuit board, greatly reduce the demand of a power supply layer in the circuit board, and reduce the overall thickness of the circuit board. The semi-embedded copper bar device is installed on a circuit board and comprises a copper bar body, the copper bar body comprises a first copper bar and a second copper bar, the first copper bar and the second copper bar are stacked and connected in an inserted mode, one end of the copper bar body is used for being electrically connected with a power source, and the other end of the copper bar body is used for being electrically connected with a chip.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a semi-embedded copper busbar device and electronic equipment. Background Technology

[0002] With the rapid development of big data and cloud computing, users' demands for computing, storage, and network resources are increasing, and the computing power of data processing and computing chips such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units) is also gradually improving. This increase in computing power inevitably leads to an increase in chip power consumption. This increase in chip power results in an increase in electrical rail current. The high current demand necessitates that the PCB (Printed Circuit Board) have sufficient copper area and thickness to ensure current transmission, leading to an increase in the overall thickness of the PCB. Summary of the Invention

[0003] To address the aforementioned issues, this application provides a semi-embedded copper busbar device and electronic device that enables direct current transmission between the power supply and high-power chips via the semi-embedded copper busbar device. This eliminates the current path on the circuit board, significantly reducing the power layer requirements within the circuit board and thus decreasing the overall thickness of the circuit board.

[0004] An embodiment of this application provides a semi-embedded copper busbar device, mounted on a circuit board, including a copper busbar body. The copper busbar body includes a first copper busbar and a second copper busbar, which are stacked and plugged together. One end of the copper busbar body is used for electrical connection with a power module, and the other end is used for electrical connection with a chip.

[0005] In the above embodiments, the power module and chip can directly transmit current through a semi-embedded copper busbar device, eliminating the need for a current-carrying path (power layer) made of copper foil within the circuit board. This reduces the power layer requirements within the circuit board, thereby reducing the overall thickness of the circuit board. Furthermore, compared to the internal current-carrying structure of the circuit board, the external semi-embedded copper busbar device allows for flexible thickness adjustment, making it thicker than the traditional internal current-carrying layer thickness of the circuit board. This effectively reduces DC impedance, decreases transmission loss, and improves the overall operating efficiency of the electronic device. The first and second copper busbars are connected via a plug-in connection, resulting in a more compact and stable structure for the copper busbar body, facilitating assembly.

[0006] In one embodiment, the first copper busbar includes a first connecting plate and a second connecting plate arranged in a stepped manner, and the second copper busbar includes a third connecting plate and a fourth connecting plate arranged in a stepped manner. Along the thickness direction of the first copper busbar, the first connecting plate is opposite to the third connecting plate, and the second connecting plate is opposite to the fourth connecting plate. The circuit board has a groove, and at least part of the stepped copper busbar body (the first connecting plate and / or the third connecting plate) can be disposed in the groove. This allows the copper busbar body to be closer to the bottom of the chip, improving the current carrying capacity of the copper busbar body around the chip.

[0007] In one embodiment, the first copper busbar includes a first pin, a second pin, and a third pin. The first pin is located on the side of the first connecting plate opposite to the third connecting plate. The second pin is located on the side of the first connecting plate facing the third connecting plate. The third pin is located on the side of the second connecting plate facing the circuit board. The second pin is used to establish an electrical connection between the first copper busbar and the chip electrical rail pads, and the third pin is used to establish an electrical connection between the first copper busbar and the power supply pads.

[0008] In one embodiment, the second copper busbar includes a fourth pin, a fifth pin, and a sixth pin. The fourth pin is located on the side of the third connecting plate facing the first connecting plate, the fifth pin is located on the side of the third connecting plate away from the first connecting plate, and the sixth pin is located on the side of the fourth connecting plate facing the circuit board. The fifth pin is used to establish an electrical connection between the second copper busbar and the chip electrical rail pads, and the sixth pin is used to establish an electrical connection between the second copper busbar and the power supply pads.

[0009] In one embodiment, the first connecting plate has a first through hole, and the fourth pin passes through the first through hole and is welded to the adapter plate, realizing a direct connection between the second copper busbar and the adapter plate with a shorter connection path. Furthermore, the fourth pin and the first through hole also enable the interlocking connection between the first and second copper busbars, making the copper busbar body structure compact and stable, and occupying less space.

[0010] In one embodiment, the third connecting plate has a second through hole, through which the second pin passes, enabling a direct connection between the first copper busbar and the circuit board, resulting in a shorter connection path. Furthermore, the second pin and the second through hole also facilitate the interlocking connection between the first and second copper busbars, making the copper busbar structure compact and stable, and occupying less space.

[0011] In one embodiment, the semi-embedded copper busbar device further includes an adapter board disposed on the side of the first connecting plate opposite to the third connecting plate. The first copper busbar and the second copper busbar are electrically connected to the adapter board, respectively. The adapter board transfers components that would otherwise need to be soldered to the circuit board to the side of the adapter board opposite to the circuit board, effectively solving the interference problem between the embedded copper busbar device and these components, and making efficient use of the limited space within the electronic device.

[0012] Embodiments of this application also provide an electronic device, which includes a circuit board, a power module, a chip, and the aforementioned semi-embedded copper busbar device. The power module and the chip are mounted on one side of the circuit board, and the semi-embedded copper busbar device is disposed on the side of the circuit board opposite to the chip. The power module and the chip can directly transmit current through the semi-embedded copper busbar device, eliminating the current path on the circuit board and thus reducing the overall thickness of the circuit board. Furthermore, the thickness of the semi-embedded copper busbar device can be flexibly adjusted to be greater than the thickness of the in-board current-carrying layer (copper foil) of a traditional circuit board, which can effectively reduce DC impedance, reduce transmission loss, and improve the overall operating efficiency of the electronic device.

[0013] In one embodiment, the circuit board has a recess, and at least a portion of the copper busbar body is disposed in the recess. The chip is disposed on the side of the circuit board opposite to the recess. A chip electrical rail pad is provided at the bottom of the recess, and the chip electrical rail pad is electrically connected to the chip. The circuit board in the recessed area is thinner, which allows the copper busbar body to be closer to the bottom of the chip on the back side of the recess, improving the current carrying capacity of the copper busbar body around the chip.

[0014] In one embodiment, a power pad is provided on the side of the groove. The power pad is electrically connected to the power module. The power pad includes a positive pad and a negative pad. The positive pad is electrically connected to the first copper busbar, and the negative pad is electrically connected to the second copper busbar. The first copper busbar can be a return copper busbar, and the second copper busbar can be a current-carrying copper busbar. The current transmission direction of the current-carrying copper busbar is from the power supply end to the chip end, and the current transmission direction of the return copper busbar is from the chip end to the power supply end, thereby realizing the closure of the power supply path. Attached Figure Description

[0015] Figure 1 A schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0016] Figure 2 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0017] Figure 3 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0018] Figure 4 An exploded view of the copper busbar body and circuit board provided in one embodiment of this application;

[0019] Figure 5 An exploded view of the copper busbar body and circuit board from another angle, provided for one embodiment of this application;

[0020] Figure 6 An assembly drawing of a semi-embedded copper busbar device provided for one embodiment of this application;

[0021] Figure 7 A structural diagram of the adapter board facing the first copper busbar according to one embodiment of this application;

[0022] Figure 8 A structural diagram of the adapter board on the side opposite to the first copper busbar, provided in one embodiment of this application;

[0023] Figure 9 An assembly diagram of a semi-embedded copper busbar device and heat dissipation structure provided for one embodiment of this application.

[0024] Figure label:

[0025] 10-Circuit board; 20-Power module; 201-Power pad; 30-Chip; 301-Chip electrical rail pad; 40-Semi-embedded copper busbar device; 41-First copper busbar; 42-Second copper busbar; 410-First connecting board; 411-Second connecting board; 420-Third connecting board; 421-Fourth connecting board; 11-Groove; 401-First pin; 402-Second pin; 403-Third pin; 404-Fourth pin; 405-Fifth pin; 406-Sixth pin; 43-Adapter board; 4101-First through hole; 4201-Second through hole; 4202-First edge; 4211-Second edge; 4111-Third edge; 4112-Boss; 430-First power positive pad; 431-First power negative pad; 432-Second power positive pad; 433-Second power negative pad; 50-Heat dissipation structure; Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of the application is provided in conjunction with the accompanying drawings and embodiments.

[0027] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0028] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0029] Increased chip power leads to increased current in the circuit rails. The demand for higher current necessitates an increase in the copper area and thickness of the PCB to ensure proper current transmission, resulting in an overall increase in PCB thickness. Furthermore, the number of signal vias, power vias, and ground vias on the circuit board beneath the chip also increases with the current, significantly reducing the integrity of the circuit board. Therefore, current flow control under and around the chip is a major challenge in circuit board design.

[0030] The current-carrying path on a circuit board refers to the physical channel through which current is conducted. Its core function is to carry power supply current or signal current to form a complete loop. The current-carrying path on a circuit board is made of copper foil, which is laminated onto the surface of an insulating substrate and etched to form a pre-defined circuit pattern, constituting the current channel for electronic components. Current flowing through the copper foil generates Joule heating; copper's excellent thermal conductivity helps dissipate heat and prevents localized overheating that could damage components. In related technologies, copper busbars are relatively large and prone to interference with other components on the circuit board or components surrounding chips. Therefore, they can only be fixed at the power supply end and in the current-carrying path of high-power chips to improve current-carrying capacity in localized areas. Existing copper busbar structures cannot meet the current-carrying requirements of the circuit board beneath and around chips.

[0031] In view of this, this application provides a semi-embedded copper busbar device and electronic device, which enables direct current transmission between the power supply and high-power chips through the semi-embedded copper busbar device, eliminating the current path on the circuit board, greatly reducing the requirement for the power layer (copper foil) on the circuit board, and thus reducing the overall thickness of the circuit board. Furthermore, it effectively solves the interference problem between the semi-embedded copper busbar device and other components on the circuit board, improving space utilization.

[0032] An embodiment of this application provides an electronic device. Figure 1 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application. Figure 1 As shown, the electronic device includes a circuit board 10, a power module 20, a chip 30, and a semi-embedded copper busbar device 40. The power module 20 and the chip 30 are mounted on one side of the circuit board 10, while the semi-embedded copper busbar device 40 is located on the side of the circuit board 10 opposite to the chip 30. The power module 20 and the chip 30 are electrically connected to the semi-embedded copper busbar device 40.

[0033] In the above embodiments, the electronic device can specifically be a server, and the chip 30 can be a high-power chip. Both the chip 30 and the power module 20 are disposed on the side of the circuit board 10 facing away from the semi-embedded copper busbar device 40. The power module 20 is electrically connected to the power pad 201, and the chip 30 is electrically connected to the chip rail pad 301. The semi-embedded copper busbar is soldered to the power pad 201 and the chip rail pad 301. The power pad 201 is disposed on the surface of the circuit board 10 facing the semi-embedded copper busbar device 40, and the chip rail pad 301 is the core rail pad after the power pins of the chip 30 are transferred through the circuit board 10. This chip rail pad 301 is also disposed on the surface of the circuit board 10 facing the semi-embedded copper busbar device 40. The power module 20 and the chip 30 can directly transmit current through the semi-embedded copper busbar device 40, eliminating the current path on the circuit board 10, reducing the power layer requirements within the circuit board 10, and thus reducing the overall thickness of the circuit board 10. Furthermore, compared to the in-board current-carrying layer of the circuit board 10, the semi-embedded copper busbar device 40 can flexibly adjust its thickness to be greater than the thickness of the in-board current-carrying layer of the traditional circuit board 10, which can effectively reduce DC impedance, reduce transmission loss, and improve the overall working efficiency of electronic equipment.

[0034] Figure 2 A schematic diagram of the structure of an electronic device provided for another embodiment of this application, as shown below. Figure 2 As shown, in one embodiment, the semi-embedded copper busbar device includes a copper busbar body, which includes a first copper busbar 41 and a second copper busbar 42. The first copper busbar 41 and the second copper busbar 42 are stacked and interlocked along the thickness direction of the copper busbar body, making the structure of the copper busbar body compact and stable, and also facilitating assembly. One end of the copper busbar body is used to electrically connect to the power module 20 via the power pad 201, and the other end is used to electrically connect to the chip 30 via the chip rail pad 301. Specifically, the first copper busbar 41 can be a return copper busbar, and the second copper busbar 42 can be a current-carrying copper busbar. The current transmission direction of the current-carrying copper busbar is from the power supply end to the chip end, and the current transmission direction of the return copper busbar is from the chip end to the power supply end, thereby realizing the closure of the power supply path. The copper busbar body adopts a double-layer copper busbar interlocking design, which is compact and makes the semi-embedded copper busbar device occupy less space.

[0035] Figure 3 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. Figure 4 An exploded view of the copper busbar body and circuit board provided in one embodiment of this application, combined with Figure 3 and Figure 4In one embodiment, the first copper busbar 41 includes a first connecting plate 410 and a second connecting plate 411 arranged in a stepped manner, and the second copper busbar 42 includes a third connecting plate 420 and a fourth connecting plate 421 arranged in a stepped manner. Along the thickness direction of the copper busbar body, the first connecting plate 410 and the third connecting plate 420 are opposite to each other, and the second connecting plate 411 and the fourth connecting plate 421 are opposite to each other. The circuit board 10 is provided with a groove 11, and at least a portion of the copper busbar body is disposed in the groove 11. Specifically, the first connecting plate 410 and / or the third connecting plate 420 may be disposed in the groove 11, and the second connecting plate 411 and the fourth connecting plate 421 may be disposed outside the groove 11. The chip electrical rail pad 301 is disposed at the bottom of the groove 11, and the chip electrical rail pad 301 concentrates the power points that were originally scattered on the pins of the chip 30. The first connecting plate 410 and the third connecting plate 420 are electrically connected to the chip electrical rail pad 301 respectively. The second connecting plate 411 and the fourth connecting plate 421 are electrically connected to the power pad 201, respectively. The recessed area 11 of the circuit board 10 can be regarded as the chip end of the circuit board 10, and the area where the power pad 201 is located can be regarded as the power end of the electronic device. The stepped copper busbar body is partially embedded in the circuit board 10, which allows the copper busbar body to be closer to the bottom of the chip 30, thereby improving the current carrying capacity around the chip 30.

[0036] Figure 5 An exploded view of the copper busbar body and circuit board from another angle, provided as an embodiment of this application, in conjunction with... Figures 3 to 5 In one embodiment, the first copper busbar 41 includes a first pin 401, a second pin 402, and a third pin 403. The first pin 401 is disposed on the side of the first connecting plate 410 away from the third connecting plate 420 (the upper surface of the first copper busbar 41 in the figure), the second pin 402 is disposed on the side of the first connecting plate 410 facing the third connecting plate 420 (the lower surface of the first copper busbar 41 in the figure), and the third pin 403 is disposed on the side of the second connecting plate 411 facing the circuit board 10 (the lower surface of the first copper busbar 41 in the figure). The second copper busbar 42 includes a fourth pin 404, a fifth pin 405, and a sixth pin 406. The fourth pin 404 is located on the side of the third connecting plate 420 facing the first connecting plate 410 (the upper surface of the second copper busbar 42 in the figure). The fifth pin 405 is located on the side of the third connecting plate 420 away from the first connecting plate 410 (the lower surface of the second copper busbar 42 in the figure). The sixth pin 406 is located on the side of the fourth connecting plate 421 facing the circuit board 10 (the lower surface of the second copper busbar 42 in the figure). The second pin 402 is used to electrically connect the first copper busbar 41 to the chip electrical rail pad 301, and the third pin 403 is used to electrically connect the first copper busbar 41 to the power pad 201. The fifth pin 405 is used to electrically connect the second copper busbar 42 to the chip electrical rail pad 301, and the sixth pin 406 is used to electrically connect the second copper busbar 42 to the power pad 201.

[0037] Figure 6 An assembly drawing of a semi-embedded copper busbar device provided for one embodiment of this application, in conjunction with... Figures 3 to 6 In one embodiment, the semi-embedded copper busbar device further includes an adapter plate 43, which is disposed on the side of the first connecting plate 410 opposite to the third connecting plate 420. The first copper busbar 41 and the second copper busbar 42 are electrically connected to the adapter plate 43, respectively. Specifically, the first pin 401 of the first copper busbar 41 is electrically connected to the adapter plate 43, and the fourth pin 404 of the second copper busbar 42 is electrically connected to the adapter plate 43. The adapter plate 43 is used for soldering to other devices disposed around the chip 30, thereby enabling other devices to be electrically connected to the chip 30 through the semi-embedded copper busbar device. The semi-embedded copper busbar device of this application can transfer devices that originally need to be soldered to the circuit board 10 to the side of the adapter plate opposite to the circuit board, effectively solving the interference problem between the embedded copper busbar device and these devices, and effectively utilizing the limited space within the electronic device.

[0038] In one embodiment, the first connecting plate 410 has a first through hole 4101, through which a fourth pin 404 passes and is soldered to the adapter plate 43, thus achieving a direct connection between the second copper busbar 42 and the adapter plate 43. The third connecting plate 420 has a second through hole 4201, through which a second pin 402 passes and is soldered to the chip rail pad 301, thus achieving a direct connection between the first copper busbar 41 and the circuit board 10. Therefore, the pin and the through hole not only enable the first copper busbar 41 and the second copper busbar 42 to interlock, but also allow the pin to be directly connected to the adapter plate 43 or the chip rail pad 301, resulting in a shorter connection path and less space required.

[0039] This application does not impose specific restrictions on the number, size, and shape of the first pin 401, second pin 402, third pin 403, fourth pin 404, fifth pin 405, and sixth pin 406 mentioned above, and they can be set as needed.

[0040] In one embodiment, the first copper busbar 41 includes a plurality of second pins 402, which are spaced apart along a first direction X to form pin groups. Along a second direction Y, the pin groups are also spaced apart. In this embodiment, the first copper busbar 41 specifically includes eight pin groups. Along the second direction Y, these are sequentially arranged as a first pin group, a second pin group, a third pin group, a fourth pin group, a fifth pin group, a sixth pin group, a seventh pin group, and an eighth pin group. Simultaneously, the first copper busbar 41 is provided with a plurality of first through holes 4101, which can be strip-shaped holes extending along the first direction X. A first through hole 4101 is provided between the first pin group and the second pin group, between the third pin group and the fourth pin group, between the fifth pin group and the sixth pin group, and between the seventh pin group and the eighth pin group.

[0041] The first copper busbar 41 includes a plurality of first pins 401, each pin 401 being strip-shaped and extending in a first direction X. The first pins 401 are spaced apart along a second direction Y. In this embodiment, the first pins 401 are spaced apart from the first through holes 4101.

[0042] The second copper busbar 42 may include a plurality of fourth pins 404, the positions of which correspond to the positions of the first through holes 4101 on the first copper busbar 41, and their shapes and sizes also match those of the first through holes 4101. In this embodiment, the fourth pins 404 are strip-shaped, and the first through holes 4101 are also strip-shaped. The second copper busbar 42 is provided with a plurality of second through holes 4201, the positions of which correspond to the positions of the plurality of second pins 402 on the first copper busbar 41, and their shapes and sizes also match those of the second pins 402.

[0043] The second copper busbar 42 includes multiple fifth pins 405, such as Figure 5 Multiple fifth pins 405 are arranged at intervals along the first direction X to form pin groups, and multiple pin groups are arranged at intervals along the second direction Y. A column of second through holes 4201 is provided between adjacent pin groups.

[0044] In one embodiment, the edge of the third connecting plate 420 away from the fourth connecting plate 421 is the first edge 4202, and the aforementioned plurality of second through holes 4201 can be located on the first edge 4202, so that the second through holes 4201 located on the first edge 4202 are semi-enclosed structures, thereby making the first edge 4202 serrated.

[0045] In one embodiment, the first pin 401 of the first copper busbar 41 can be replaced by a solder pad. The length of the second pin 402 is the same as the thickness of the third connecting plate 420, and the length of the fourth pin 404 is the same as the thickness of the first connecting plate 410. This ensures that after the first copper busbar 41 and the second copper busbar 42 are connected, the two opposing surfaces of the first connecting plate 410 and the third connecting plate 420 are relatively flat, that is, there are no protruding structures on the upper and lower surfaces of the copper busbar body. This reduces the thickness of the copper busbar body and makes the electronic device smaller.

[0046] In one embodiment, the first copper busbar 41 and the second copper busbar 42 can be the same size. The specific thickness can be flexibly adjusted according to the current. For high currents, the thickness of the first copper busbar 41 and the second copper busbar 42 can be made larger, which can achieve a current carrying capacity of over kiloamperes for the semi-embedded copper busbar device.

[0047] In one embodiment, the surfaces of the first copper busbar 41 and the second copper busbar 42 are provided with an insulating layer, which may be made of resin material. The insulating layer enables the first copper busbar 41 and the second copper busbar 42 to insulate each other, preventing short circuits in the copper busbar bodies.

[0048] Continue to refer to Figure 3 In one embodiment, the electrical rail pads are disposed outside the groove 11. The electrical rail pads include a positive pad and a negative pad. The positive pad is electrically connected to the first copper busbar 41, and the negative pad is electrically connected to the second copper busbar 42. The third pin 403 is soldered to the positive pad, and the sixth pin 406 is soldered to the negative pad.

[0049] In one embodiment, the second copper busbar 42 includes a plurality of sixth pins 406, which are spaced apart along a second direction Y. Specifically, the second copper busbar 42 also includes a second edge 4211, which is located opposite to the first edge 4202, and the plurality of sixth pins 406 are disposed on the second edge 4211.

[0050] The first copper busbar 41 includes a plurality of third pins 403, which are spaced apart along a second direction Y. Specifically, the first copper busbar 41 includes a third edge 4111, which is located on the side of the second connecting plate 411 away from the first connecting plate 410. The plurality of third pins 403 are disposed on the third edge 4111.

[0051] In one embodiment, the third edge 4111 is located on the side of the second connecting plate 411 away from the first connecting plate 410, and the third edge 4111 is provided with a boss 4112, on which a plurality of third pins 403 are disposed. After the copper busbar body is assembled to the circuit board 10, the distance between the third pins 403 and the groove 11 is greater than that between the second pins 402 and the groove 11.

[0052] Figure 7 A structural diagram of the adapter board facing the first copper busbar is provided for one embodiment of this application, as shown below. Figure 7 As shown, in one embodiment, the adapter plate 43 has a first positive power pad 430 and a first negative power pad 431 on the side facing the first connecting plate 410. The first pin 401 is connected to the first positive power pad 430, and the fourth pin 404 is connected to the first negative power pad 431. In this embodiment, the shape of the first positive power pad 430 matches that of the first pin 401, and both the first positive power pad 430 and the first negative power pad 431 can be set as strips. In other embodiments, the first positive power pad 430 can also be set as a strip, and the first negative power pad 431 can be set as a square, matching the shape of the fourth pin 404.

[0053] In other embodiments, the first pin 401 and the fourth pin 404 may have the same shape, and may both be block-shaped.

[0054] Figure 8 A structural diagram of the adapter board on the side opposite to the first copper busbar, as provided in one embodiment of this application, is shown below. Figure 8 As shown, the adapter board 43 has a second power positive pad 432 and a second power negative pad 433 on the side opposite to the first connecting board 410. These second power positive pads 432 and 433 can be used to connect surface-mount devices, such as resistors and capacitors, especially the large number of filter capacitors needed to stabilize the voltage of chip 30, thereby achieving electrical connection between the resistors, capacitors, and other components around chip 30 and the copper busbar body. The dimensions of the second power positive pad 432 and 433 can be set based on the dimensions of small resistors and small capacitors. The adapter board 43 integrates traditionally scattered power points into an integrated power area, achieving a centralized layout of the same power supply.

[0055] Figure 9 An assembly drawing of a semi-embedded copper busbar device and heat dissipation structure provided for one embodiment of this application is shown below. Figure 9 As shown, in one embodiment, the copper busbar body may be provided with a heat dissipation structure 50. Specifically, the second connecting plate 411 has multiple heat dissipation fins on the side opposite to the fourth connecting plate 421, which can improve the heat dissipation efficiency of the electronic device. In other embodiments, a heat pipe may also be embedded in the second connecting plate 411, extending outwards from the semi-embedded copper busbar device. The extension direction can be set according to the layout of the components inside the electronic device to minimize interference. The end of the heat pipe away from the second connecting plate 411 may also be connected to a fin assembly to improve heat dissipation efficiency.

[0056] The electronic device of this application adopts a scheme in which the power supply terminal and the high-power chip are directly connected using a semi-embedded copper busbar device, which optimizes the current transmission path, reduces the design requirements of the circuit board, and also has the following advantages:

[0057] The semi-embedded copper busbar device of this application improves current carrying capacity, allowing electronic devices to support hundreds of amperes of current transmission without relying on a 10-layer or multi-layer copper plating scheme on the circuit board. Furthermore, it reduces the copper foil thickness requirement in the circuit board 10, thereby significantly reducing the manufacturing difficulty and cost of the circuit board 10.

[0058] In related technologies, heat needs to be transferred through multiple layers of copper foil and dielectric layers of the circuit board 10. Since the copper busbar body of this application is made of copper, which has good thermal conductivity, the semi-embedded copper busbar device of this application directly connects the power supply and the chip 30, resulting in a shorter heat dissipation path. Heat can be quickly dissipated through the copper busbar device, avoiding heat accumulation inside the circuit board 10 and improving the heat dissipation efficiency of electronic devices.

[0059] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A semi-embedded copper busbar device, mounted on a circuit board, characterized in that, The system includes a copper busbar body, which includes a first copper busbar and a second copper busbar. The first copper busbar and the second copper busbar are stacked and plugged together. One end of the copper busbar body is used for electrical connection with the power module, and the other end is used for electrical connection with the chip.

2. The semi-embedded copper busbar device according to claim 1, characterized in that, The first copper busbar includes a first connecting plate and a second connecting plate arranged in a stepped manner, and the second copper busbar includes a third connecting plate and a fourth connecting plate arranged in a stepped manner. Along the thickness direction of the first copper busbar, the first connecting plate is opposite to the third connecting plate, and the second connecting plate is opposite to the fourth connecting plate.

3. The semi-embedded copper busbar device according to claim 2, characterized in that, The first copper busbar includes a first pin, a second pin, and a third pin. The first pin is located on the side of the first connecting plate away from the third connecting plate. The second pin is located on the side of the first connecting plate facing the third connecting plate. The third pin is located on the side of the second connecting plate facing the circuit board.

4. The semi-embedded copper busbar device according to claim 2, characterized in that, The second copper busbar includes a fourth pin, a fifth pin, and a sixth pin. The fourth pin is located on the side of the third connecting plate facing the first connecting plate, the fifth pin is located on the side of the third connecting plate away from the first connecting plate, and the sixth pin is located on the side of the fourth connecting plate facing the circuit board.

5. The semi-embedded copper busbar device according to claim 4, characterized in that, The first connecting plate has a first through hole, and the fourth pin passes through the first through hole.

6. The semi-embedded copper busbar device according to claim 3, characterized in that, The third connecting plate has a second through hole, and the second pin passes through the second through hole.

7. The semi-embedded copper busbar device according to claim 2, characterized in that, It also includes an adapter plate, which is disposed on the side of the first connecting plate away from the third connecting plate, and the first copper busbar and the second copper busbar are electrically connected to the adapter plate respectively.

8. An electronic device, characterized in that, The device includes a circuit board, a power module, a chip, and a semi-embedded copper busbar device as described in any one of claims 1 to 7, wherein the power module and the chip are mounted on one side of the circuit board, the semi-embedded copper busbar device is disposed on the side of the circuit board opposite to the chip, and the semi-embedded copper busbar device is electrically connected to the power module and the chip.

9. The electronic device according to claim 8, characterized in that, The circuit board has a groove, at least a portion of the copper busbar body is disposed in the groove, the chip is disposed on the side of the circuit board away from the groove, the bottom of the groove is provided with chip electrical rail pads, and the chip electrical rail pads are electrically connected to the chip.

10. The electronic device according to claim 9, characterized in that, The groove side is provided with a power pad, which is electrically connected to the power module. The power pad includes a positive pad and a negative pad. The positive pad is electrically connected to the first copper busbar, and the negative pad is electrically connected to the second copper busbar.

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