Chip flip soldering tooling and semiconductor production line

Abstract

The application provides a chip flip welding welding tool and a semiconductor production line, and belongs to the field of semiconductor processing. The chip flip welding welding tool comprises a centrifugal pad and a positioning mechanism. The centrifugal pad is rotatable around a vertical axis thereof and is arranged at a preset position. The positioning mechanism comprises a chip positioning plate and a substrate positioning plate, both of which are arranged on the centrifugal pad. The chip positioning plate and the substrate positioning plate are arranged in a stacked manner along a radial direction away from the axis of the centrifugal pad. The opposite inner sides of the chip positioning plate and the substrate positioning plate are respectively provided with a chip accommodating groove and a circuit board accommodating groove. The chip accommodating groove and the circuit board accommodating groove jointly form a welding space. With the rotation of the centrifugal pad, the welding material in the welding space is filled between the chip to be welded and the circuit board under the centrifugal action. Compared with the prior art, the welding tool between the chip and the substrate is improved, and the technical problem of insufficient filling of the welding material in the existing chip flip welding process is solved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of semiconductor processing, and more particularly to a flip chip soldering tool, and a semiconductor production line. BACKGROUND

[0002] With the development of IC integration circuit towards light weight, thin type, small size, increase of I / O terminal number and functional diversification, the traditional wire bonding technology has been unable to meet the packaging requirements of high density and high performance.

[0003] Flip Chip (FC) is an ideal chip bonding technology. As early as in the 1960s, IBM Corporation has developed and used this technology. But until recent years, Flip-Chip has become a packaging form often used in high-end devices and high-density packaging fields. At present, the application range of Flip-Chip packaging technology is increasingly wide, and the packaging form is more diversified, and the requirements for Flip-Chip packaging technology are also improved. At the same time, Flip-Chip also puts forward a series of new and severe challenges to the manufacturer, and provides reliable support for packaging, assembly and testing of this complex technology. The previous primary packaging technology is to face the active area of the chip upward, and the substrate and the post bonding are bonded, such as wire bonding and tape automated bonding (TAB). FC faces the active area of the chip to the substrate, and realizes the interconnection between the chip and the substrate through the solder bumps arranged in an array on the chip.

[0004] Generally, there are multiple metal films (UBR: Under Bump Metallurgy) between the chip and the substrate, including an adhesion layer, a diffusion barrier layer and a wetting solder layer. (1) The adhesion layer has good adhesion with the aluminum layer, small contact resistance between the aluminum layer, and close thermal expansion coefficient. The adhesion layer material is generally selected from Cr, Ti, Ti-W, V, etc. (2) The diffusion barrier layer can effectively prevent the bump solder material (including the wetting layer material) from diffusing into the layer, and is not dissolved by the bump solder material, so as to avoid the bump solder material entering the Al layer to form an unfavorable intermetallic compound. The diffusion barrier layer material is generally selected from Ti, Ni, Cu, Pd, Ti-W, etc. (3) The wetting solder layer can have good wetting with the bump solder material, has good weldability, will not form an unfavorable intermetallic compound for soldering, and can also protect the adhesion layer and the barrier layer metal from being oxidized and contaminated.

[0005] Before soldering, under capillary action on the chip surface, liquid solder fills the space between the chip and the substrate from around the chip, encapsulating the bumps mentioned above. After filling, the chip and substrate are placed in a baking apparatus for baking at 130°C to solidify and shape. However, because the solder fills the space between the chip and the substrate by capillary action, as the chip surface refinement increases, the solder requires a longer capillary action time to fill the space between the chip and the substrate. Furthermore, the specific filling quality also has an adverse effect on the yield of chip packaging, which urgently needs improvement. Summary of the Invention

[0006] The purpose of this invention is to provide a welding fixture for flip-chip bonding, so as to solve the technical problem that insufficient solder filling is easily encountered in the existing flip-chip bonding process.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a welding fixture for flip-chip bonding, comprising:

[0008] Centrifugal solder pad, which is rotatable about its own vertical axis and is located at a preset position;

[0009] The positioning mechanism includes a chip positioning plate and a substrate positioning plate, both disposed on the centrifugal pad. The chip positioning plate and the substrate positioning plate are stacked in a radial direction away from the axis of the centrifugal pad, and the chip positioning plate is slidably inserted into the substrate positioning plate in a first direction perpendicular to the radial line of the corresponding centrifugal pad. The chip positioning plate and the substrate positioning plate are respectively provided with a chip receiving groove and a circuit board receiving groove on their opposite inner surfaces. The chip receiving groove and the circuit board receiving groove together form a welding space. As the centrifugal pad rotates, the solder located in the welding space fills the space between the chip and the circuit board to be welded under centrifugal force.

[0010] In one feasible implementation, the chip flip-chip bonding fixture further includes a connecting mechanism, which includes a tension spring, a first limiting groove, and a second limiting groove. The first limiting groove extends along the radial line of the centrifugal pad and is located on the outer periphery of the centrifugal pad. The bottom surface of the second limiting groove is perpendicular to the radial line of the centrifugal pad. The lower surface of the substrate positioning plate is slidably adapted to the first limiting groove and the second limiting groove. The tension spring is located in the first limiting groove and extends along the radial line of the centrifugal pad. The two ends of the tension spring are respectively connected to the substrate positioning plate and the centrifugal pad.

[0011] The substrate positioning plate has a first state and a second state, in the first state, the substrate positioning plate is arranged at an acute angle with the horizontal plane, in the second state, the substrate positioning plate is arranged at a right angle with the horizontal plane, the tension spring is configured to have a pre-tightening force to make the substrate positioning plate in the first state, with the rotation of the centrifugal pad, the substrate positioning plate is changed from the first state to the second state.

[0012] In a feasible implementation, the substrate positioning plate is provided with a mounting slot extending along a first direction, and the outer side of the chip positioning plate is insertedly matched with the mounting slot.

[0013] In a feasible implementation, the substrate positioning plate is provided with a flow guide through hole, one end of the flow guide through hole is open to the upper surface of the substrate positioning plate, and the other end is communicated with the welding space.

[0014] In a feasible implementation, the welding tool for the chip flip-chip welding further comprises a driving motor, and a power output shaft of the driving motor is drivingly connected with the centrifugal pad.

[0015] In a feasible implementation, the welding tool for the chip flip-chip welding further comprises a support frame and a containing box arranged on the support frame, the driving motor is arranged on the support frame, and the centrifugal pad is arranged in the containing box.

[0016] In a feasible implementation, the containing box is filled with inert gas.

[0017] In a feasible implementation, in a direction away from the tension spring, the outer side of the substrate positioning plate is provided with a first sliding block and a second sliding block arranged in sequence and at intervals, the first sliding block is clamped in the first limiting groove and has a freedom of moving along the length direction of the first limiting groove, and the second sliding block is clamped in the second limiting groove and has a freedom of moving along the axis direction of the centrifugal pad.

[0018] In a feasible implementation, the connecting mechanism further comprises a guide rod, the guide rod is arranged in the first limiting groove and extends along the length direction of the first limiting groove, and the tension spring is sleeved on the outer periphery of the guide rod.

[0019] Compared with the prior art, the welding tool for the chip flip-chip welding provided by the present application has the following beneficial effects:

[0020] Firstly, the centrifugal pad is rotatable around the vertical axis, which provides a controllable centrifugal force source for the whole welding process; the chip positioning plate and the substrate positioning plate are arranged in a stack and are slidably inserted along the first direction (perpendicular to the radial line), and the chip positioning plate and the substrate positioning plate can be kept relatively static, and then the chip accommodating groove and the circuit board accommodating groove are arranged on the inner sides of the two, and a closed welding space is formed after the enclosure, and when the centrifugal pad rotates, the molten solder continuously and directionally flows and fills from the periphery to the central area of the welding space under the driving of the centrifugal force, which significantly improves the solder filling rate and uniformity, and fundamentally solves the technical problems of easy welding voids and poor connection reliability in high-density flip-chip welding due to insufficient solder filling.

[0021] Secondly, in the connecting mechanism, the first limiting groove extends in the radial direction and provides a radial movement track for the substrate positioning plate, and the bottom surface of the second limiting groove is perpendicular to the radial line to constrain the axial degree of freedom; the pre-tightening force of the substrate positioning plate towards the first state (acute angle with the horizontal plane) is given by cooperating with the tension spring, and as the rotation speed of the centrifugal pad increases, the centrifugal force overcomes the pre-tightening force of the tension spring, drives the substrate positioning plate to slide radially along the first limiting groove, and at the same time is limited by the second limiting groove, and stably changes from the inclined first state to the vertical second state. This dynamic adjustment process realizes the preliminary distribution of the solder in the inclined state at the beginning of welding, and then obtains the maximum centrifugal force in the vertical state to realize more sufficient filling, achieves the technical effects of self-adaptive optimization of the filling path and avoidance of solder splashing, thereby solving the problem of uneven distribution or overflow of the solder under a single angle.

[0022] In addition, the flow guide through hole arranged on the substrate positioning plate can utilize the effect of the centrifugal force to make the soldering liquid flow to the welding position of the substrate and the chip through the flow guide through hole, and at the same time, the flow guide through hole can also realize the exhaust of residual gas at the welding position during the fine welding process, prevent the welding position from appearing bubbles or welding holes due to problems such as gas accumulation and temperature rise, and improve the compactness of the welding points.

[0023] Another purpose of the present application is to provide a semiconductor production line comprising the chip flip-chip welding welding tool.

[0024] Compared with the prior art, the semiconductor production line has all the advantages of the chip flip-chip welding welding tool described above, and the foregoing chip flip-chip welding welding tool is integrated into the semiconductor production line to make it an automatic unit of the packaging link, realizes the flow line operation from chip picking, positioning, welding to final unloading, reduces the labor cost, guarantees the consistency of the welding quality of batch products, and solves the technical bottleneck of low efficiency and large yield fluctuation in the traditional semiconductor packaging field. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings. In the drawings:

[0026] Figure 1 The overall structure schematic diagram of the welding tooling for flip chip soldering provided by the present application;

[0027] Figure 2 The side view of the welding tooling for flip chip soldering provided by the present application;

[0028] Figure 3 The structure schematic diagram of the centrifugal disc in the welding tooling for flip chip soldering of the present application;

[0029] Figure 4 The structure schematic diagram of the positioning mechanism in the welding tooling for flip chip soldering of the present application;

[0030] Figure 5 The schematic diagram of the positional relationship between the positioning mechanism and the chip and the substrate in the welding tooling for flip chip soldering of the present application.

[0031] In the drawings:

[0032] 1, centrifugal pad;

[0033] 2, positioning mechanism; 21, chip positioning plate; 22, substrate positioning plate; 221, mounting groove; 222, flow guide through hole; 223, first sliding block; 224, second sliding block;

[0034] 3, connecting mechanism; 31, tension spring; 32, first limiting groove; 33, second limiting groove;

[0035] 4, support frame;

[0036] 5, containing box;

[0037] 6, driving motor. DETAILED DESCRIPTION

[0038] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0039] In the description of the present application, it should be noted that if the terms indicating the orientation or position relationship such as "upper", "lower", "inner", "back" and the like appear, they are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0040] In addition, in the description of the present application, unless otherwise explicitly limited, the terms "mounting", "connecting", "connection", "connector" should be broadly understood. For example, the connection can be a fixed connection, or a detachable connection, or an integral connection; can be a mechanical connection, or an electrical connection; can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in conjunction with the specific circumstances.

[0041] In order to make the technical problems to be solved by the present application, the technical solutions and beneficial effects more clear and explicit, the present application will be further described in detail below in conjunction with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0042] Please refer to Figures 1 to 5 , now the chip flip-chip soldering tool provided by the present application will be described. The chip flip-chip soldering tool comprises a centrifugal pad 1 and a positioning mechanism 2, wherein the centrifugal pad 1 is rotatably arranged at a predetermined position around its vertical axis; the positioning mechanism 2 comprises a chip positioning plate 21 and a substrate positioning plate 22, both of which are arranged on the centrifugal pad, the chip positioning plate 21 and the substrate positioning plate 22 are arranged in a stacked manner along the radial direction away from the axis of the centrifugal pad 1, and the chip positioning plate 21 is slidably inserted into the substrate positioning plate 22 along a first direction, the first direction being perpendicular to the radial line of the corresponding centrifugal pad 1, the opposite inner sides of the chip positioning plate 21 and the substrate positioning plate 22 are respectively provided with a chip accommodating groove and a circuit board accommodating groove, and the chip accommodating groove and the circuit board accommodating groove jointly form a soldering space, and with the rotation of the centrifugal pad 1, the solder in the soldering space is filled between the chip to be soldered and the circuit board under the action of centrifugal force.

[0043] In the implementation of the above embodiment, the centrifugal welding disc 1 is rotatable about its vertical axis to provide a controllable centrifugal force source for the whole welding process; the chip positioning plate 21 and the substrate positioning plate 22 are arranged in a stack and are slidably inserted in the first direction (perpendicular to the radial line), so that the chip positioning plate 21 and the substrate positioning plate 22 can be kept relatively static, and then the chip accommodating groove and the circuit board accommodating groove are arranged on the inner sides of the chip positioning plate 21 and the substrate positioning plate 22 to form a closed welding space after being closed. When the centrifugal welding disc 1 rotates, the molten solder continuously and directionally flows and fills from the periphery to the central area of the welding space under the driving of the centrifugal force, which significantly improves the solder filling rate and uniformity and fundamentally solves the technical problems of easy welding voids and poor connection reliability in high-density flip-chip welding due to insufficient solder filling.

[0044] In addition, the positioning mechanism 2 can be multiple and arranged uniformly around the axis of the centrifugal welding disc 1, and each positioning mechanism 2 can be used to fix the chip and the substrate, thereby improving the positioning and welding efficiency of the chip and the substrate.

[0045] Based on the above embodiment, a preferred implementation is proposed, and the welding tool for flip-chip welding further comprises a connecting mechanism 3, the connecting mechanism 3 comprises a tension spring 31, a first limiting groove 32 and a second limiting groove 33, the first limiting groove 32 extends along the radial line of the centrifugal welding disc 1, the limiting groove is arranged on the outer periphery of the centrifugal welding disc 1, and the bottom surface of the second limiting groove 33 is perpendicular to the radial line of the centrifugal welding disc 1, the lower plate surface of the substrate positioning plate 22 is slidably adapted to the first limiting groove 32 and the second limiting groove 33, the tension spring 31 is arranged in the first limiting groove 32 and extends along the radial line of the centrifugal welding disc 1, and the two ends of the tension spring 31 are connected to the substrate positioning plate 22 and the centrifugal welding disc 1, respectively; the substrate positioning plate 22 has a first state and a second state, in the first state, the substrate positioning plate 22 is arranged at an acute angle with the horizontal plane, in the second state, the substrate positioning plate 22 is arranged at a right angle with the horizontal plane, and the tension spring 31 is configured to have a pre-tightening force to make the substrate positioning plate 22 in the first state, and the substrate positioning plate 22 changes from the first state to the second state with the rotation of the centrifugal welding disc 1.

[0046] Compared with the prior art, in the specific implementation process of the embodiment, the first limiting groove 32 extends radially and provides a radial movement track for the substrate positioning plate 22, and the bottom surface of the second limiting groove 33 is perpendicular to the radial line to constrain the axial degree of freedom; in cooperation with the tension spring 31, the substrate positioning plate 22 is given a pre-tightening force towards the first state (an acute angle with the horizontal plane), and as the rotating speed of the centrifugal pad 1 increases, the centrifugal force overcomes the pre-tightening force of the tension spring 31, drives the substrate positioning plate 22 to slide radially along the first limiting groove 32, and at the same time is limited by the second limiting groove 33, and stably changes from the inclined first state to the vertical second state. This dynamic adjustment process realizes that the solder is preliminarily distributed in the inclined state at the beginning of welding, and then obtains the maximum centrifugal force in the vertical state to realize more sufficient filling, achieves the technical effects of adaptively optimizing the filling path and avoiding solder splashing, thereby solving the problem that the solder is easy to be unevenly distributed or overflowed at a single angle. Moreover, after the solder is filled, as the rotating speed of the centrifugal mechanism decreases, the substrate positioning plate 22 returns to the first state, and the positions of the chip positioning plate 21 and the substrate positioning plate 22 are relatively stable, so that the chip and the substrate in the stable state are solidified at a high temperature (130 DEG C) during the welding process.

[0047] Based on the above embodiment, a preferred implementation is proposed, the substrate positioning plate 22 is provided with a mounting groove 221 extending in the first direction, and the outer side of the chip positioning plate 21 is inserted and matched with the mounting groove 221. The above structure realizes accurate sliding and positioning of the chip positioning plate 21 on the fixed track, and ensures that the chip and the substrate always maintain alignment during folding and welding. This cooperation improves assembly accuracy, reduces human adjustment errors, and is beneficial to solving welding defects such as short circuit and bridging caused by alignment deviation.

[0048] Based on the above embodiment, a preferred implementation is proposed, the substrate positioning plate 22 is provided with a flow guide through hole 222, one end of the flow guide through hole 222 is open to the upper surface of the substrate positioning plate 22, and the other end is in communication with the welding space. It should be noted that the welding liquid enters the corresponding edge position of the chip and the substrate through the flow guide through hole 222, and under the centrifugal action of the centrifugal pad 1, the welding liquid flows to the welding position of the substrate and the chip through the flow guide through hole 222. At the same time, the flow guide through hole 222 can also realize the exhaust of residual gas at the welding position during the welding process of the chip, prevent the welding position from appearing bubbles or welding holes due to problems such as gas accumulation and temperature rise, and improve the compactness of the welding point.

[0049] Based on the above embodiment, a preferred implementation is proposed, the flip chip welding tool further comprises a driving motor 6, and a power output shaft of the driving motor 6 is drivingly connected with the centrifugal pad 1, so as to realize accurate control of the rotating speed of the centrifugal pad 1. This cooperation enables the welding process to be carried out under the optimal rotating speed curve, and achieves the technical effect that the centrifugal force size is accurately matched with the welding process requirement.

[0050] Based on the above embodiment, a preferred embodiment is proposed, the flip chip soldering tool further comprises a support frame 4 and a containing box 5 arranged on the support frame 4, the driving motor 6 is arranged on the support frame 4, and the centrifugal pad 1 is arranged in the containing box 5. In this embodiment, a stable foundation is provided by the support frame 4, the driving motor 6 is installed thereon, and the entire centrifugal pad 1 is encapsulated in the containing box 5, so that the structural rigidity, operation stability and process protection of the tool are realized. This arrangement achieves the technical effects of dust prevention, vibration reduction, easy integration and maintenance, and is beneficial to solve the problems that the precision welding process is easily disturbed by the environment and is difficult to be integrated into an automatic production line.

[0051] Based on the above embodiment, a preferred embodiment is proposed, the containing box 5 is filled with inert gas (such as nitrogen), and the temperature of the inert gas can be controlled at the welding temperature to provide a solidification temperature for the welding of the chip and the substrate; compared with the prior art, the embodiment provides an oxygen-free protective environment for the entire welding space. This measure effectively isolates oxygen during high-temperature centrifugal welding, prevents oxidation of the solder and the welding surface, achieves the technical effect of significantly improving the wettability and connection strength of the solder joint, and is beneficial to solve the long-term reliability problems such as false welding and poor solder joint strength caused by oxidation.

[0052] Based on the above embodiment, a preferred embodiment is proposed, along the direction away from the tension spring 31, the outer side of the substrate positioning plate 22 is provided with a first sliding block 223 and a second sliding block 224 arranged in sequence and at intervals, the first sliding block 223 is clamped in the first limiting groove 32 and has a degree of freedom to move along the length direction of the first limiting groove 32, and the second sliding block 224 is clamped in the second limiting groove 33 and has a degree of freedom to move along the axis direction of the centrifugal pad 1. In the specific implementation process of the embodiment, the first sliding block 223 and the second sliding block 224 are clamped into the radial first limiting groove 32 and the axial second limiting groove 33 respectively, forming a double-degree-of-freedom constraint system. Under the action of centrifugal force, the first sliding block 223 slides along the radial groove to determine the inclination angle, and the second sliding block 224 moves in the axial groove to prevent the plate from producing uncontrollable displacement, and the two cooperate to realize stable and accurate posture conversion of the substrate positioning plate 22, achieving the technical effects of controllable motion trajectory and stable operation. The posture-adjusted substrate positioning plate 22 and the chip positioning plate 21 can better utilize the centrifugal force to complete the full filling of the soldering liquid.

[0053] Based on the above embodiment, a preferred embodiment is proposed, the connecting mechanism 3 further comprises a guide rod arranged in the first limiting groove 32 and extending along the length direction of the first limiting groove 32, and the tension spring 31 is sleeved on the outer periphery of the guide rod, the above structure provides rigid guide and support preventing lateral bending for the expansion and contraction movement of the tension spring 31. This cooperation realizes linear application and release of the pre-tightening force, and makes the state conversion process of the substrate positioning plate 22 more smooth and accurate, so that the technical effects of improving the mechanical response precision and durability of the system are achieved, and the control inaccuracy problem caused by disordered deformation of the spring is solved.

[0054] Based on the same inventive concept, another object of the present application is to provide a semiconductor production line comprising the chip flip-chip welding welding tool as above.

[0055] Compared with the prior art, the semiconductor production line in the present application has all the advantages of the chip flip-chip welding welding tool as above, which will not be repeated here, and the chip flip-chip welding tool as above is integrated into the semiconductor production line to become an automatic unit of the packaging link, realizing the flow line operation from chip picking, positioning, welding to final unloading, reducing labor cost, ensuring the consistency of the welding quality of batch products, and solving the technical bottleneck of low efficiency and large yield fluctuation in the traditional semiconductor packaging field.

[0056] In summary, compared with the prior art, the present chip flip-chip soldering tool generates controllable centrifugal force through the rotation of the centrifugal pad 1 around the vertical axis, in combination with the chip positioning plate 21 and the substrate positioning plate 22 which are arranged in layers and can be inserted and connected in the first direction, and the chip receiving groove and the circuit board receiving groove on the inner side of the two plates form a closed soldering space, so that the molten solder continuously flows from the periphery to the center under the action of centrifugal force, significantly improving the filling uniformity and efficiency, and fundamentally solving the problems of easy welding voids and unreliable connection in traditional processes. The connection mechanism 3 cooperates with the tension spring 31, the first limiting groove 32 and the second limiting groove 33, so that the substrate positioning plate 22 can be smoothly changed from the inclined first state to the vertical second state under the driving of the centrifugal force, and the solder flow path is self-adaptively optimized to avoid uneven distribution and splashing. The mounting groove 221 on the substrate positioning plate 22 is precisely inserted with the chip positioning plate 21, which ensures the accurate alignment of the chip and the substrate and reduces the risk of short circuit; the flow guide through hole 222 effectively discharges gas, eliminates bubbles and improves the density of the welding point. The driving motor 6 provides precise speed control, the support frame 4 and the containing box 5 enhance the structural stability and environmental protection, and the inert gas protection in the box effectively prevents the oxidation of the solder and improves the reliability of the welding. The double sliding block design on the outer side of the substrate positioning plate 22 and the guide rod guided tension spring 31 further ensure the smoothness of the movement and the control accuracy. After the tool is integrated into the semiconductor production line, high-precision, high-efficiency and automated chip soldering is realized, which greatly improves the production yield and consistency and solves the technical bottleneck of low packaging efficiency and large quality fluctuation of traditional packaging.

[0057] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A flip chip soldering tool, characterized by, The chip flip-chip welding welding tool comprises a centrifugal pad (1) rotatable around a vertical axis thereof and arranged at a preset position; a positioning mechanism (2) comprising a chip positioning plate (21) and a substrate positioning plate (22) arranged at the centrifugal pad (1) and stacked along a radial direction away from the axis of the centrifugal pad (1), the chip positioning plate (21) being slidably inserted into the substrate positioning plate (22) along a first direction perpendicular to a radial line corresponding to the centrifugal pad (1), the inner side surfaces of the chip positioning plate (21) and the substrate positioning plate (22) being respectively provided with a chip accommodating groove and a circuit board accommodating groove, the chip accommodating groove and the circuit board accommodating groove forming a welding space, and the solder in the welding space being filled between a chip to be welded and a circuit board under the action of centrifugal force with the rotation of the centrifugal pad (1); and a connecting mechanism (3) comprising a tension spring (31), a first limiting groove (32) and a second limiting groove (33), the first limiting groove (32) extending along a radial line of the centrifugal pad (1), the limiting groove being arranged at an outer periphery of the centrifugal pad (1), the bottom surface of the second limiting groove (33) being perpendicular to the radial line of the centrifugal pad (1), the lower plate surface of the substrate positioning plate (22) being slidably fitted with the first limiting groove (32) and the second limiting groove (33), and the tension spring (31) being arranged in the first limiting groove (32) and extending along the radial line of the centrifugal pad (1), the two ends of the tension spring (31) being connected with the substrate positioning plate (22) and the centrifugal pad (1) respectively. The substrate positioning plate (22) has a first state and a second state, in the first state, the substrate positioning plate (22) is arranged at an acute angle with a horizontal plane, in the second state, the substrate positioning plate (22) is arranged at a right angle with the horizontal plane, and the tension spring (31) is configured to have a pre-tightening force to make the substrate positioning plate (22) in the first state, and the substrate positioning plate (22) is changed from the first state to the second state with the rotation of the centrifugal pad (1). The substrate positioning plate (22) is provided with a mounting groove (221) extending along the first direction, and the outer side edge of the chip positioning plate (21) is slidably fitted with the mounting groove (221). The substrate positioning plate (22) is provided with a flow guide through hole (222) opening to the upper surface of the substrate positioning plate (22) at one end and communicating with the welding space at the other end. The chip flip-chip welding welding tool further comprises a driving motor (6), and a power output shaft of the driving motor (6) is drivingly connected with the centrifugal pad (1).

2. The flip chip bonding tooling of claim 1, wherein, The chip flip-chip welding welding tool further comprises a support frame (4) and an accommodating box (5) arranged at the support frame (4), the driving motor (6) is arranged at the support frame (4), and the centrifugal pad (1) is arranged in the accommodating box (5).

3. The flip chip bonding tooling of claim 2, wherein, The accommodating box (5) is filled with an inert gas.

4. The flip chip bonding tooling of claim 1, wherein, ​ 5. The flip chip bonding tooling of claim 4, wherein, ​ 6. The flip chip bonding tooling of claim 5, wherein, ​ 7. The flip chip bonding tooling of claim 1 wherein, In a direction away from the tension spring (31), an outer side of the substrate positioning plate (22) is provided with a first sliding block (223) and a second sliding block (224) arranged in sequence and at intervals, the first sliding block (223) is clamped in the first limiting groove (32) and has a freedom of movement in a length direction of the first limiting groove (32), and the second sliding block (224) is clamped in the second limiting groove (33) and has a freedom of movement in an axis direction of the centrifugal pad (1).

8. The flip chip bonding tooling of claim 7, wherein, The connecting mechanism (3) further comprises a guide rod arranged in the first limiting groove (32) and extending in a length direction of the first limiting groove (32), and the tension spring (31) is sleeved on an outer periphery of the guide rod.

9. A semiconductor production line, characterized by, A soldering tool comprising the flip chip soldering as claimed in any one of claims 1 to 8.

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