Computer PCB welding operation device

Abstract

The invention discloses a computer PCB welding operation device, relates to the technical field of printed circuit board manufacturing equipment, and aims to provide a computer PCB welding operation device capable of completing feeding, welding, pin cutting and discharging at the same time, the computer PCB welding operation device is technically characterized by comprising a base, and a cam divider driven by a motor is arranged on the base; a cam divider is arranged on the base, a rotary disc is rotatably arranged on the cam divider, a vertical displacement assembly located on the upper portion of the rotary disc is arranged on the base, and four sets of independent material placing components are arranged on the outer side of the rotary disc, and the technical effects are that the rotary disc and the material placing components are arranged, and the four material placing components are arranged on the edge of the rotary disc and correspond to four stations of feeding, welding, foot cutting and discharging respectively; and meanwhile, the cam divider is used for driving, so that feeding, welding, corner cutting and discharging work can be carried out at the same time, compared with existing dip soldering equipment, the efficiency is higher, and the dip soldering efficiency of the circuit board can be greatly improved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing equipment technology, specifically to a computer PCB soldering device. Background Technology

[0002] Computer PCBs, also known as printed circuit boards, are one of the core components of computer hardware. They are used to carry and connect various electronic components such as chips, resistors, and capacitors to realize the transmission and processing of circuit signals. During production, these electronic components need to be soldered to the circuit board. Existing soldering methods include manual soldering, automatic dip soldering, automatic wave soldering, and reflow soldering. Reflow soldering can only be used for soldering surface mount components, while dip soldering or wave soldering is required for through-hole components. However, wave soldering equipment is expensive, and the workload of subsequent maintenance and upkeep is large, resulting in high production line setup costs.

[0003] Therefore, some companies choose dip soldering equipment that is inexpensive and easy to maintain. However, existing dip soldering equipment uses a translation cylinder in conjunction with a gripper to move the circuit board. The circuit board needs to go through the processes of feeding, soldering, cutting leads and unloading in sequence. Only after completing a set of processes can the subsequent circuit board soldering work be carried out. This method results in an excessively long soldering process and low soldering efficiency. Summary of the Invention

[0004] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a computer PCB welding device that can simultaneously perform loading, welding, lead cutting, and unloading operations.

[0005] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a computer PCB soldering device, comprising a base, a cam divider driven by a motor on the base, a turntable rotatably mounted on the cam divider, a vertical displacement assembly located on the upper part of the turntable on the base, four independent material placement components on the outer side of the turntable, and a double-rail feeding conveyor, a solder heating component, a lead cutting component, and a material unloading conveyor corresponding to the four material placement components respectively on the base; The vertical displacement assembly includes a stand that runs through the center of the turntable and connects to the base. An annular rail is provided under the stand. The position of the annular rail corresponding to the solder heating component is located in the recessed section, and there is a sloped section between the annular rail and the recessed section. The material placement component includes a fixed plate connected to the turntable. The fixed plate is provided with a vertical sliding component that slides with the bottom surface of the annular plate rail. A material placement plate connecting component is provided below the vertical sliding component. A material placement plate assembly for fixing the PCB board is provided below the material placement plate connecting component.

[0006] Preferably, the vertical sliding assembly includes a left slide rod and a right slide rod that penetrate the fixed plate, and both the left slide rod and the right slide rod are fitted with a first spring that is connected to the fixed plate; The material placement plate connecting assembly includes a connecting plate, the connecting plate is provided with an ear plate that is hinged to the left slide rod, the ear plate is provided with an elongated hole that slides with the right slide rod, the bottom end of the right slide rod is provided with a tension spring that connects to the ear plate, and the side of the connecting plate is provided with a sliding groove that cooperates with the material placement plate assembly. The top ends of the left and right slide rods are provided with ball rolling assemblies that fit against the bottom of the annular plate rail. The ball rolling assembly includes hollow seats respectively provided on the left and right slide rods. A steel ball is embedded in the hollow seat, and a hoop that restricts the radial movement of the steel ball is threaded to the top end of the hollow seat. The hollow seat is equipped with a second spring, and a piston plate is provided on the second spring. The bottom of the piston plate in the hollow seat is connected to the outside. The side of the hollow seat is provided with a lubricating oil injection port located on the upper part of the piston plate. The outer side of the steel ball is provided with a groove for storing lubricating oil.

[0007] Preferably, the material placement plate assembly includes a fixed material placement plate disposed under the connecting plate and an adjustable material placement plate that cooperates with the slide groove. A first manual screw that is threadedly engaged with the adjustable material placement plate is rotatably disposed under the connecting plate. Both the fixed material placement plate and the adjustable material placement plate are provided with a support plate and a spring piece.

[0008] Preferably, the solder heating component includes a solder tank on a base, an electric heating tube inside the solder tank, dross tanks on both sides of the solder tank, and a short partition between the solder tank and the dross tank. The turntable is provided with an oxide layer scraping component whose rotation path sweeps across the solder bath. The oxide layer scraping component includes a connecting frame located under the turntable. The side of the connecting frame is provided with a pressure plate. A flexible metal plate is provided inside the pressure plate. The pressure plate is provided with clamping bolts that are fixed to the connecting frame.

[0009] Preferably, the pin cutting component includes a support plate on the base, a third motor is provided under the support plate, a cutting disc is connected to the third motor, and a protective baffle covering the cutting disc is provided on the outside of the base.

[0010] Preferably, the dual-track feeding and conveying component includes a fixed frame and a slide rail on the base, a sliding frame is slidably mounted on the slide rail, a support plate is mounted on both the fixed frame and the sliding frame, synchronous pulleys are rotatably mounted on both sides of the support plate, a synchronous belt is mounted between the synchronous pulleys, and a nylon bracket and a tensioning assembly for supporting the synchronous belt are mounted inside the support plate. The timing belt is equipped with a stop bar, and the outer side of the support plate is equipped with a double-rail drive assembly. The double-rail drive assembly is connected to the sliding key of the timing wheel, and a second manual screw is rotatably provided inside the support plate on the fixed frame, which is threadedly engaged with the other side support plate.

[0011] Preferably, the dual-track drive assembly includes a first motor connected to a support plate, the output end of the first motor is provided with a rotating shaft passing through the synchronous pulley, and the rotating shaft is provided with a keyway that slides linearly with the synchronous pulley.

[0012] Preferably, the unloading conveying component includes a conveyor belt frame mounted on a base, an unloading conveyor belt located below the material placement component inside the conveyor belt frame, a stop bar on the unloading conveyor belt, and a second motor that drives and cooperates with the unloading conveyor belt on the outer side of the conveyor belt frame.

[0013] Preferably, the support plate is provided with a pressing assembly near the material placement component. The pressing assembly includes a pin on the outside of the support plate, a movable frame hinged to the pin, a coil spring connected to the pin on the side of the movable frame, and a pressure roller rotatably mounted on the top of the movable frame, the pressure roller being attached to the timing belt.

[0014] Preferably, a flux spraying component is provided on the base at the end face of the dual-rail feeding and conveying component. The flux spraying component includes an electric pump, a flux tank is connected to the side of the electric pump, a nozzle is provided on the electric pump, and a waste hopper is sleeved on the outside of the nozzle.

[0015] (III) Beneficial Effects Compared with the prior art, the present invention provides a computer PCB soldering device, which has the following beneficial effects: 1. By setting up a turntable and material placement components, the turntable has four material placement components on its edge, corresponding to the four workstations of loading, welding, cutting, and unloading. At the same time, it is driven by a cam divider, so that loading, welding, cutting, and unloading can be performed simultaneously. Compared with existing dip soldering equipment, it is more efficient and can significantly improve the dip soldering efficiency of circuit boards.

[0016] 2. By setting up a vertical displacement component and a vertical sliding component, the vertical displacement component is mainly composed of an annular plate rail with a sinking section, and it is fixed on the base by a stand and does not rotate with the turntable. When the turntable drives the material placement component to rotate, the vertical sliding component inside the material placement component slides along the bottom of the annular plate rail. When the vertical sliding component slides through the inclined section to the sinking section position, the vertical sliding component will drive the bottom material placement plate connecting component and the material placement plate assembly to move downward, so that the circuit board in the material placement plate assembly enters the solder heating component to achieve the purpose of dip soldering. In addition, no cylinder or electric cylinder or other driving equipment is required in the process, relying entirely on the original rotational movement of the turntable, which simplifies the equipment cost.

[0017] 3. By setting left and right slides, the left and right slides are connected together to form the material placement plate connecting assembly, but they work independently. When moving, the left slide will first contact the inclined section under the ring plate rail and move downward. At this time, the material placement plate connecting assembly at the bottom of the two will be in an inclined state. The purpose of this is to make the circuit board in the material placement plate assembly contact the solder at an inclined angle, so that the circuit board and the solder liquid surface can form a certain angle, which makes it easy for the solder to climb evenly along the surface of the circuit board, covering all the pins and pads of the components to be soldered, while avoiding the residue of air bubbles. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is a three-dimensional schematic diagram of the invention from another perspective; Figure 3 This is a schematic diagram showing the connection between the turntable and the material feeding component of the present invention; Figure 4 This is a schematic cross-sectional view of the material placement component of the present invention; Figure 5 This is a three-dimensional schematic diagram of the material placement plate assembly of the present invention; Figure 6 This is a three-dimensional schematic diagram of the solder heating component of the present invention; Figure 7 This is a three-dimensional schematic diagram of the oxide layer scraping component of the present invention; Figure 8 This is a three-dimensional schematic diagram of the vertical displacement component of the present invention; Figure 9 This is a schematic cross-sectional view of the sphere rolling assembly of the present invention; Figure 10 This is a three-dimensional schematic diagram of the dual-track feeding and conveying component of the present invention; Figure 11 For the present invention Figure 10 An enlarged schematic diagram of point A in the middle; Figure 12 This is a three-dimensional schematic diagram of the unloading and conveying component of the present invention; Figure 13 This is a three-dimensional schematic diagram of the pin driving component of the present invention; Figure 14 This is a cross-sectional schematic diagram of the flux spraying component of the present invention.

[0019] In the picture: 1. Base; 2. Turntable; 3. Vertical displacement assembly; 301. Frame; 302. Circular track; 303. Sinking section; 304. Inclined section; 4. Material placement component; 401. Fixing plate; 402. Vertical sliding assembly; 4021. Left slide bar; 4022. Right slide bar; 4023. First spring; 4024. Tension spring; 403. Material feeding plate connecting assembly; 4031. Connecting plate; 4032. Ear plate; 4033. Oblong hole; 4034. Slide groove; 404. Material placement plate assembly; 4041. Fixed material placement plate; 4042. Spring clip; 4043. Support plate; 4044. Adjustable material placement plate; 405. First manual screw; 406. Ball rolling assembly; 4061. Hollow seat; 4062. Hoop; 4063. Steel ball; 4064. Groove; 4065. Lubricating oil inlet; 4066. Piston plate; 4067. Second spring; 5. Double-track feeding conveyor components; 501. Fixed frame; 502. Slide rail; 503. Sliding frame; 504. Support plate; 505. Synchronous pulley; 506. Synchronous belt; 507. Stop bar; 508. Second manual screw; 509. Nylon bracket; 6. Flux spraying components; 601. Electric pump; 602. Spray nozzle; 603. Flux tank; 604. Waste hopper; 7. Solder heating components; 701. Solder bath; 702. Electric heating element; 703. Low partition; 704. Solder dross bath; 8. Pin cutting component; 801. Carrier plate; 802. Third motor; 803. Cutting disc; 804. Protective baffle; 9. Unloading and conveying components; 901. Conveyor belt frame; 902. Unloading conveyor belt; 903. Stop bar; 904. Second motor; 10. Oxide layer scraping assembly; 1001. Connecting frame; 1002. Pressure plate; 1003. Clamping bolt; 1004. Flexible metal plate; 11. Cam divider; 12. Dual-rail drive assembly; 1201. First motor; 1202. Rotary shaft; 1203. Keyway groove; 13. Pressing assembly; 1301. Pin; 1302. Coil spring; 1303. Movable frame; 1304. Pressure roller. Detailed Implementation

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Please see Figure 1-14 A computer PCB soldering device includes a base 1, a cam divider 11 driven by a motor on the base 1, a turntable 2 rotatably mounted on the cam divider 11, a vertical displacement assembly 3 located on the upper part of the turntable 2 on the base 1, four independent material placement components 4 on the outer side of the turntable 2, and a double-track feeding conveyor 5, a solder heating component 7, a lead cutting component 8, and a material unloading conveyor 9 respectively corresponding to the four sets of material placement components 4 on the base 1. like Figure 1 , Figure 2 and Figure 3 As shown, by setting up a turntable 2 and a material placement component 4, the edge of the turntable 2 is provided with four material placement components 4, which correspond to the four stations of loading, welding, cutting corners and unloading respectively. At the same time, the cam divider 11 is used for driving, so that loading, welding, cutting corners and unloading can be performed simultaneously. Compared with the existing dip soldering equipment, the efficiency is higher and the dip soldering efficiency of the circuit board can be greatly improved. In addition, the loading station and the unloading station are respectively provided with a double-track loading conveyor component 5 and an unloading conveyor component 9, which can realize a fully automatic processing flow.

[0022] The vertical displacement component 3 includes a stand 301 that passes through the center of the turntable 2 and is connected to the base 1. A ring rail 302 is provided under the stand 301. The position of the ring rail 302 corresponding to the solder heating component 7 is located in the sinking section 303, and there is a slope section 304 between the ring rail 302 and the sinking section 303. The material placement component 4 includes a fixed plate 401 connected to the turntable 2. A vertical sliding component 402 that slides with the bottom surface of the ring rail 302 is provided on the fixed plate 401. A material placement plate connecting component 403 is provided under the vertical sliding component 402. A material placement plate assembly 404 for fixing the PCB board is provided under the material placement plate connecting component 403.

[0023] like Figure 4 and Figure 8 As shown, by setting a vertical displacement component 3 and a vertical sliding component 402, the vertical displacement component 3 is mainly composed of an annular plate rail 302 with a sinking section 303, and it is fixed on the base 1 by a stand 301. It does not rotate with the turntable 2. When the turntable 2 drives the material placement component 4 to rotate, the vertical sliding component 402 inside the material placement component 4 slides along the bottom of the annular plate rail 302. When the vertical sliding component 402 slides through the inclined section 304 to the sinking section 303, the vertical sliding component 402 will drive the bottom material placement plate connecting component 403 and the material placement plate group 404 to move downward, so that the circuit board in the material placement plate group 404 enters the solder heating component 7 to achieve the purpose of dip soldering. In addition, no cylinder or electric cylinder or other driving equipment is required in the process. It relies entirely on the original rotational movement of the turntable 2, which simplifies the equipment cost and eliminates the need to lay air pipes or lines, saving the cost investment and maintenance work of slip rings.

[0024] The vertical sliding assembly 402 includes a left sliding rod 4021 and a right sliding rod 4022 that pass through the fixed plate 401. Both the left sliding rod 4021 and the right sliding rod 4022 are fitted with a first spring 4023 that is connected to the fixed plate 401. The material plate connecting assembly 403 includes a connecting plate 4031. The connecting plate 4031 is provided with an ear plate 4032 that is hinged to the left sliding rod 4021. An elongated hole 4033 that slides with the right sliding rod 4022 is opened in the ear plate 4032. A tension spring 4024 that is connected to the ear plate 4032 is provided at the bottom end of the right sliding rod 4022. The side of the connecting plate 4031 is provided with a groove 4034 that cooperates with the material plate assembly 404. like Figure 4 As shown, by setting the left slide bar 4021 and the right slide bar 4022, the left slide bar 4021 and the right slide bar 4022 are connected together to the material placement plate connecting assembly 403, but the two work independently. When moving, the left slide bar 4021 will first contact the inclined section 304 under the annular plate rail 302 and move downward. At this time, the material placement plate connecting assembly 403 located at the bottom of the two will be in an inclined state. The purpose of this is to make the circuit board located in the material placement plate assembly 404 contact the solder at an inclined angle, so that the circuit board and the solder liquid surface can form a certain angle, which makes it easy for the solder to climb evenly along the surface of the circuit board, covering all the pins and pads of the components to be soldered, while avoiding the residue of air bubbles. In addition, the inclined immersion method can destroy the surface tension of the solder liquid, avoiding the problem of short circuit caused by solder accumulation. In addition, the elongated hole 4033 and the tension spring 4024 on the ear plate 4032, which are connected to the right slide rod 4022, also play a crucial role. When the left slide rod 4021 moves the ear plate 4032 downward first, the distance between the bottom ends of the left slide rod 4021 and the right slide rod 4022 increases because the right slide rod 4022 does not move at this time. The elongated hole 4033 on the ear plate 4032 allows the right slide rod 4022 to slide inside it to compensate for the change in the distance between the bottom ends of the left slide rod 4021 and the right slide rod 4022, so that the material plate connecting assembly 403 can switch between horizontal and inclined states. The tension spring 4024 pulls the right slide rod 4022 to make it stably placed in the elongated hole 4033, preventing the right slide rod 4022 from shaking randomly without external force.

[0025] The top ends of the left slide rod 4021 and the right slide rod 4022 are provided with ball rolling assembly 406 that fits against the bottom of the annular plate rail 302. The ball rolling assembly 406 includes a hollow seat 4061 respectively provided on the left slide rod 4021 and the right slide rod 4022. A steel ball 4063 is embedded in the hollow seat 4061. The top end of the hollow seat 4061 is threaded with a hoop 4062 that restricts the radial movement of the steel ball 4063. like Figure 9As shown, by setting steel ball 4063 and hoop 4062, hoop 4062 can roll on hollow seat 4061 and move under the annular plate rail 302 by rolling, reducing the friction when the two slide, making the movement of vertical sliding component 402 smoother, and preventing excessive mechanical wear. Hoop 4062 is connected to hollow seat 4061 by thread, so it can be disassembled. After hoop 4062 is disassembled, steel ball 4063 will also lose radial fixation, which facilitates the replacement and maintenance of steel ball 4063.

[0026] A second spring 4067 is provided inside the hollow seat 4061, and a piston plate 4066 is provided on the second spring 4067. The position of the hollow seat 4061 at the bottom of the piston plate 4066 is connected to the outside. A lubricating oil inlet 4065 is provided on the side of the hollow seat 4061 at the top of the piston plate 4066. A groove 4064 for storing lubricating oil is provided on the outer side of the steel ball 4063.

[0027] like Figure 9 As shown, by setting the groove 4064 and piston plate 4066, the steel ball 4063 can store lubricating oil through the groove 4064 on its surface when rotating. The lubricating oil makes its rotation and sliding with the annular plate rail 302 smoother, further reducing mechanical wear and friction noise. In addition, a second spring 4067 and piston plate 4066 are provided in the hollow seat 4061, so that the pre-stored lubricating oil can be pushed upward by the second spring 4067 and piston plate 4066, so that the lubricating oil can be closely connected with the steel ball 4063 spring, achieving the purpose of automatic replenishment.

[0028] The material placement plate assembly 404 includes a fixed material placement plate 4041 disposed under the connecting plate 4031 and an adjustable material placement plate 4044 that cooperates with the slide 4034. A first manual screw 405 is rotatably disposed under the connecting plate 4031 and threadedly engaged with the adjustable material placement plate 4044. Both the fixed material placement plate 4041 and the adjustable material placement plate 4044 are provided with a support plate 4043 and a spring piece 4042.

[0029] like Figure 4 and Figure 5As shown, by setting up a spring sheet 4042 and a support plate 4043, the support plate 4043 is placed under the fixed support plate 4041 and the adjustable support plate 4044, which can support the circuit board from below. It is made of metal and can withstand the high temperature of solder. In addition, a plating layer can be added to the surface of the support plate 4043 to prevent solder from sticking. During the operation, the distance between the fixed support plate 4041 and the adjustable support plate 4044 is slightly larger than the size of the circuit board. No horizontal clamping force is applied to the circuit board. The spring sheet 4042 uses its own elasticity to apply vertical pressure to the circuit board, so that the circuit board is tightly attached to the support plate 4043. In this way, the circuit board can be stably fixed while preventing the problem of the circuit board bending easily when the circuit board is horizontally clamped, thus ensuring the stability and reliability of the dip soldering process. In addition, the first manual screw 405 can rotate to move the adjustable material plate 4044, so that the spacing can be adjusted according to the size of the circuit board.

[0030] The solder heating component 7 includes a solder tank 701 mounted on a base 1, an electric heating tube 702 inside the solder tank 701, dross tanks 704 on both sides of the solder tank 701, and a short partition 703 directly between the solder tank 701 and the dross tank 704. like Figure 6 As shown, by setting the solder dross tank 704 and the short partition 703, the short partition 703 can limit the volume of solder liquid in the solder tank 701, that is, the solder liquid can only be kept at the same height as the short partition 703. This height is consistent with the soldering position of the circuit board, avoiding the problem of ineffective soldering due to the solder liquid being too low or too high. At the same time, the short partition 703 also facilitates the scraping off of the oxide layer of the solder liquid, so that the scraped oxide layer falls into the solder dross tank 704.

[0031] The turntable 2 is provided with an oxide layer scraping component 10 whose rotation path passes over the solder bath 701. The oxide layer scraping component 10 includes a connecting frame 1001 provided under the turntable 2. A pressure plate 1002 is provided on the side of the connecting frame 1001. A flexible metal plate 1004 is provided inside the pressure plate 1002. A clamping bolt 1003 is provided on the pressure plate 1002 to fix it to the connecting frame 1001.

[0032] like Figure 7As shown, by setting a connecting frame 1001 and a flexible metal plate 1004, the connecting frame 1001 is located at the bottom of the turntable 2 and can rotate with the turntable 2, so that no additional driving equipment is needed when scraping off the oxide layer of the molten solder, which further reduces the cost of the equipment. The flexible metal plate 1004 itself has a certain degree of plasticity and can withstand the temperature of the molten solder, so that it can pass over the low partition 703 to scrape off the oxide layer on the surface of the molten solder under the drive of the connecting frame 1001. In addition, the flexible metal plate 1004 is preferably made of perforated, nickel-plated or chromium-plated material, which can prevent solder from sticking on the one hand, and allow the molten solder without oxidation to flow out through the holes on the other hand, preventing excessive scraping of waste.

[0033] The pin cutting component 8 includes a support plate 801 on the base 1, a third motor 802 under the support plate 801, a cutting disc 803 connected to the third motor 802, and a protective baffle 804 covering the cutting disc 803 on the outside of the base 1.

[0034] like Figure 13 As shown, by setting a cutting disc 803 and a protective baffle 804, the height of the cutting disc 803 is lower than that of the circuit board, and it can rotate at high speed using a third motor 802. When the turntable 2 drives the soldered circuit board through the material placement component 4, the high-speed rotating cutting disc 803 will cut off the excessively long pins at the bottom of the circuit board, avoiding the need for further processing with additional equipment, thus further improving the efficiency of circuit board manufacturing. The protective baffle 804 prevents the cut pins from splashing and also prevents the danger of accidentally touching the cutting disc 803.

[0035] The dual-track feeding and conveying component 5 includes a fixed frame 501 and a slide rail 502 mounted on the base 1. A sliding frame 503 is slidably mounted on the slide rail 502. Both the fixed frame 501 and the sliding frame 503 are equipped with support plates 504. Synchronous pulleys 505 are rotatably mounted on both sides of the support plate 504. A synchronous belt 506 is mounted between the synchronous pulleys 505. A nylon bracket 509 supporting the synchronous belt 506 and a tensioning assembly are mounted inside the support plate 504. A stop bar 507 is mounted on the synchronous belt 506. A dual-track drive assembly 12 is mounted on the outside of the support plate 504. The dual-track drive assembly 12 is slidably connected to the synchronous pulleys 505. A second manual screw 508, which is threadedly engaged with the other support plate 504, is rotatably mounted inside the support plate 504 on the fixed frame 501.

[0036] like Figure 10 As shown, by setting the second manual screw 508 and the slide rail 502, the double-rail feeding conveyor 5 can adjust the spacing using the internal second manual screw 508, so that it can be used for circuit boards of different sizes. In addition, it should be further explained that the helix angle of the first manual screw 405 and the second manual screw 508 is smaller than the friction angle with the threaded material, and has a self-locking effect when it is not rotating. Additionally, a stop bar 507 is provided on the timing belt 506. The stop bar 507 can hold the circuit board in place and push the circuit board by the movement of the timing belt 506, so that the circuit board can squeeze out the spring 4042 and be clamped on the tray 4043.

[0037] The dual-track drive assembly 12 includes a first motor 1201 connected to the support plate 504. The output end of the first motor 1201 is provided with a rotating shaft 1202 that passes through the synchronous pulley 505. The rotating shaft 1202 is provided with a keyway 1203 that slides linearly with the synchronous pulley 505.

[0038] like Figure 10 As shown, by setting a rotating shaft 1202 and a keyway 1203, the rotating shaft 1202 is linearly slidingly engaged with the synchronous pulley 505 through the keyway 1203, so that the synchronous pulley 505 can rotate under the drive of the rotating shaft 1202, and at the same time, the synchronous pulley 505 can also slide horizontally along the keyway 1203, so that it does not affect the adjustment of the spacing of the synchronous belts 506 on both sides while transmitting power.

[0039] The unloading conveying component 9 includes a conveyor belt frame 901 mounted on the base 1. The conveyor belt frame 901 contains an unloading conveyor belt 902 located below the material placement component 4. The unloading conveyor belt 902 is equipped with a stop bar 903. A second motor 904 that drives and cooperates with the unloading conveyor belt 902 is mounted on the outside of the conveyor belt frame 901.

[0040] like Figure 12 As shown, by setting the baffle 903, the unloading conveyor belt 902 is located at the lower part of the material placement component 4. When the material placement component 4 moves the processed circuit board onto the unloading conveyor belt 902, the unloading conveyor belt 902 will drive the baffle 903 to move. The baffle 903 pushes the circuit board from the rear, causing the circuit board to separate from the support plate 4043 and the spring piece 4042, and fall onto the unloading conveyor belt 902 to flow out, thus achieving the purpose of automatic unloading.

[0041] A pressing assembly 13 is provided on the support plate 504 near the material placement component 4. The pressing assembly 13 includes a pin 1301 located on the outside of the support plate 504. A movable frame 1303 is hinged to the pin 1301. A coil spring 1302 connected to the pin 1301 is provided on the side of the movable frame 1303. A pressure roller 1304 is rotatably provided on the top of the movable frame 1303. The pressure roller 1304 is attached to the synchronous belt 506.

[0042] like Figure 11 As shown, by setting the pressure roller 1304, the pressure roller 1304 can be tightly attached to the circuit board under the drive of the movable frame 1303 and the coil spring 1302, and apply downward pressure to the circuit board to prevent the circuit board from tilting when the synchronous belt 506 is conveying the circuit board, and ensure that the gap between the circuit board and the support plate 4043 and the spring 4042 is aligned.

[0043] A flux spraying component 6 is provided on the base 1 at the end face of the double-track feeding and conveying component 5. The flux spraying component 6 includes an electric pump 601, a flux tank 603 is connected to the side of the electric pump 601, a nozzle 602 is provided on the electric pump 601, and a waste hopper 604 is sleeved on the outside of the nozzle 602.

[0044] like Figure 14 As shown, by setting up an electric pump 601 and a waste hopper 604, the electric pump 601 can draw flux from the flux tank 603 and spray it onto the circuit board through the nozzle 602, thereby achieving the purpose of automatically spraying flux onto the circuit board to be soldered. The waste hopper 604 can collect excess flux, preventing flux from flowing randomly and causing pollution.

[0045] Working principle: During operation, the dual-track feeding conveyor 5 feeds the circuit board into the placement component 4, while the flux spraying component 6 sprays flux onto the bottom of the circuit board. Then, the cam divider 11 drives the placement component 4 to rotate via the turntable 2, causing the placement component 4 to move onto the soldering heating component. During the movement, the vertical displacement component 3 presses down the vertical sliding component 402 in the placement component 4, immersing the circuit board in the molten solder. Then, as the turntable 2 continues to rotate, the lead cutting component 8 on the path cuts off the excess leads of the circuit board. Finally, the processed circuit board is sent out by the unloading conveyor belt 902.

[0046] The above are merely specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on the present invention to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of the present invention.

Claims

1. A computer PCB soldering device, comprising a base (1), characterized in that: The base (1) is provided with a cam divider (11) driven by a motor. A turntable (2) is rotatably provided on the cam divider (11). A vertical displacement assembly (3) located on the upper part of the turntable (2) is provided on the base (1). Four independent material placement components (4) are provided on the outer side of the turntable (2). A double-rail feeding conveyor (5), a solder heating component (7), a lead cutting component (8), and a material unloading conveyor (9) are provided on the base (1) respectively corresponding to the four sets of material placement components (4). The vertical displacement component (3) includes a stand (301) that connects the center of the turntable (2) to the base (1). The stand (301) is provided with an annular rail (302). The position of the annular rail (302) corresponding to the solder heating component (7) is located in the recessed section (303), and there is a sloped section (304) between the annular rail (302) and the recessed section (303). The material placement component (4) includes a fixed plate (401) connected to the turntable (2). The fixed plate (401) is provided with a vertical sliding component (402) that slides with the bottom surface of the annular rail (302). The vertical sliding component (402) is provided with a material placement plate connecting component (403) below it. The material placement plate connecting component (403) is provided with a material placement plate group (404) for fixing the PCB board below it.

2. The computer PCB soldering apparatus according to claim 1, characterized in that: The vertical sliding assembly (402) includes a left slide rod (4021) and a right slide rod (4022) that pass through the fixed plate (401), and a first spring (4023) connected to the fixed plate (401) is sleeved on both the left slide rod (4021) and the right slide rod (4022). The material placement plate connecting assembly (403) includes a connecting plate (4031), on which an ear plate (4032) is hinged to the left slide rod (4021). An elongated hole (4033) is opened in the ear plate (4032) to slide with the right slide rod (4022). A tension spring (4024) is provided at the bottom end of the right slide rod (4022) to connect with the ear plate (4032). A sliding groove (4034) is provided on the side of the connecting plate (4031) to cooperate with the material placement plate assembly (404). The top ends of the left slide bar (4021) and the right slide bar (4022) are provided with ball rolling components (406) that fit against the bottom of the annular rail (302).

3. The computer PCB soldering apparatus according to claim 2, characterized in that: The material placement plate assembly (404) includes a fixed material placement plate (4041) disposed under the connecting plate (4031) and an adjustable material placement plate (4044) that cooperates with the slide groove (4034). A first manual screw (405) that is threadedly engaged with the adjustable material placement plate (4044) is rotatably disposed under the connecting plate (4031). A support plate (4043) and a spring piece (4042) are provided under both the fixed material placement plate (4041) and the adjustable material placement plate (4044).

4. The computer PCB soldering apparatus according to claim 1, characterized in that: The solder heating component (7) includes a solder tank (701) on a base (1), an electric heating tube (702) is provided in the solder tank (701), tin dross tanks (704) are provided on both sides of the solder tank (701), and a short partition (703) is provided directly between the solder tank (701) and the tin dross tank (704). The turntable (2) is provided with an oxide layer scraping component (10) whose rotation path sweeps across the solder bath (701).

5. The computer PCB soldering apparatus according to claim 1, characterized in that: The pin cutting component (8) includes a support plate (801) on the base (1), a third motor (802) is provided under the support plate (801), a cutting disc (803) is connected to the third motor (802), and a protective baffle (804) covering the cutting disc (803) is provided on the outside of the base (1).

6. The computer PCB soldering apparatus according to claim 1, characterized in that: The dual-track feeding and conveying component (5) includes a fixed frame (501) and a slide rail (502) mounted on a base (1). A sliding frame (503) is slidably mounted on the slide rail (502). A support plate (504) is mounted on both the fixed frame (501) and the sliding frame (503). Synchronous pulleys (505) are rotatably mounted on both sides of the support plate (504). A synchronous belt (506) is mounted between the synchronous pulleys (505). A nylon bracket (509) for supporting the synchronous belt (506) and a tensioning assembly are mounted inside the support plate (504). The timing belt (506) is provided with a stop bar (507), and the outer side of the support plate (504) is provided with a double rail drive assembly (12). The double rail drive assembly (12) is connected to the timing wheel (505) by a sliding key, and a second manual screw (508) is rotatably provided in the support plate (504) on the fixed frame (501) and threadedly engaged with the other side support plate (504).

7. A computer PCB soldering apparatus according to claim 6, characterized in that: The dual-track drive assembly (12) includes a first motor (1201) connected to a support plate (504). The output end of the first motor (1201) is provided with a rotating shaft (1202) that passes through a synchronous pulley (505). The rotating shaft (1202) is provided with a keyway (1203) that slides linearly with the synchronous pulley (505).

8. A computer PCB soldering apparatus according to claim 1, characterized in that: The unloading conveying component (9) includes a conveyor belt frame (901) on the base (1), an unloading conveyor belt (902) located below the material placement component (4) inside the conveyor belt frame (901), a stop bar (903) on the unloading conveyor belt (902), and a second motor (904) that drives and cooperates with the unloading conveyor belt (902) on the outside of the conveyor belt frame (901).

9. A computer PCB soldering apparatus according to claim 6, characterized in that: The support plate (504) is provided with a pressing assembly (13) near the material placement component (4). The pressing assembly (13) includes a pin (1301) located on the outside of the support plate (504). A movable frame (1303) is hinged to the pin (1301). A coil spring (1302) connected to the pin (1301) is provided on the side of the movable frame (1303). A pressure roller (1304) is rotatably provided at the top of the movable frame (1303). The pressure roller (1304) is attached to the synchronous belt (506).

10. A computer PCB soldering apparatus according to claim 1, characterized in that: A flux spraying component (6) is provided on the base (1) at the end face of the double-track feeding and conveying component (5). The flux spraying component (6) includes an electric pump (601), a flux tank (603) is connected to the side of the electric pump (601), a nozzle (602) is provided on the electric pump (601), and a waste hopper (604) is sleeved on the outside of the nozzle (602).

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