Automatic patching method and device for integrated circuit board processing

Abstract

The application relates to the field of integrated circuit board processing, in particular to an automatic patching method and device for integrated circuit board processing. The device comprises a base, a feeding assembly one, a feeding assembly two, a patching assembly and a supporting and limiting assembly. A moving frame is arranged on the base; the feeding assembly one is arranged on the front and back sides of the base; the feeding assembly two is arranged below the feeding assembly one; the patching assembly comprises a paste discharging piece and a patching piece; the patching piece picks up the sheet-shaped component on the feeding assembly one when facing forward and backward, cooperates with the correcting piece on the moving frame when facing upward, corrects the position of the sheet-shaped component, and the paste discharging piece discharges paste downward at this time; the patching piece pastes the sheet-shaped component on the PCB pad when facing downward; and the supporting and limiting assembly is arranged on the base. The sheet-shaped component and the PCB pad are synchronously fed, detected, corrected, supported, positioned and pasted, the coherence and precision of patching are improved, patching errors are reduced, and the quality of integrated circuit board patching is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit board processing, and particularly relates to an automatic patching method and device for integrated circuit board processing. BACKGROUND

[0002] The board body of an integrated circuit board is mainly made of silica gel material, so it usually presents a green appearance. Its processing process adopts advanced semiconductor technology. Specifically, a large number of transistors, resistors, capacitors and other electronic components are integrated on a relatively small single crystal silicon wafer through precise technology. These components are connected to each other through multi-layer wiring or tunnel wiring technology, and finally form a complete functional electronic circuit. In the processing of the integrated circuit board, patch processing is a key step, which involves accurately attaching other electronic components to the surface of the circuit board. However, in actual operation, this link faces the following challenges:

[0003] 1. Limitations of traditional patching methods: Traditional patching methods usually rely on manual glueing on the surface of the circuit board, and then the circuit board is sent to the patching device for the attachment of electronic components. This operation method is not only cumbersome, but also inefficient, and it is difficult to meet the needs of mass production.

[0004] 2. Positioning problem of existing patching devices: In the current integrated circuit board patching device, manual placement and positioning of the circuit board are often required during the patching process. This manual intervention method is easy to cause misplacement or deviation of the circuit board during the patching and pressing process, thereby affecting the accuracy of the patching and reducing the product quality. SUMMARY

[0005] In view of the problems in the background art, an automatic patching method and device for integrated circuit board processing are proposed, which improves the continuity and accuracy of patching by synchronously feeding, detecting, correcting, supporting, positioning and attaching the patch-shaped components and PCB pads, reduces patching errors, and effectively improves the quality of integrated circuit board patching.

[0006] The application provides an automatic patching method for integrated circuit board processing, which comprises the following steps: a worker places a strip of patch-shaped components on a feeding assembly one, places a PCB pad on a feeding assembly two, and synchronously moves the patch-shaped components and the PCB pad to a patching assembly position; the patching assembly moves and rotates to adsorb and fix the patch-shaped components and take them; a visual positioning system is used to visually position the patch-shaped components and the PCB pad from different angles; after detecting that the patch-shaped components have a positional deviation, the patch-shaped components are positionally corrected; a supporting and limiting assembly is raised to the bottom of the integrated PCB pad to correct, limit and support the position of the integrated PCB pad; after the PCB pad is positioned, automatic cream dispensing is performed; after the cream is heated and melted by the supporting and limiting assembly, the patch-shaped components are automatically pasted on the cream dispensing position.

[0007] The application further provides an automatic patching device for integrated circuit board processing, which comprises a base, a feeding assembly one, a feeding assembly two, a patching assembly and a supporting and limiting assembly. The left and right sides of the base are respectively provided with mounting frames; a moving frame moving forward and backward is arranged on the mounting frame; the feeding assembly one is arranged on the front and rear sides of the base to feed patch-shaped components in batches; the feeding assembly two is arranged below the feeding assembly one to feed PCB pads by limiting from the left and right sides and moving forward and backward; the patching assembly is arranged on the moving frame and can move left and right and rotate while moving forward and backward with the moving frame, and comprises a cream dispensing piece and a patching piece which switch workstations by rotating; the patching piece picks up the patch-shaped components on the feeding assembly one when facing forward and backward, cooperates with a correcting piece on the moving frame when facing upward to correct the position of the patch-shaped components, and the cream dispensing piece dispenses cream downward at this time; the patching piece pastes the patch-shaped components on the PCB pad when facing downward; the supporting and limiting assembly is located on the base and limits the PCB pad from the front and rear directions while supporting and melting the cream of the PCB pad from the bottom during patching.

[0008] Preferably, the moving frame comprises a frame body sliding along the mounting frame forward and backward; the frame body is provided with two groups of rotating frames forward and backward; a positional visual positioner is arranged on each group of rotating frames.

[0009] Preferably, the correcting piece is arranged between the two groups of rotating frames and comprises a correcting seat horizontally moving along the length direction of the rotating frame; a plurality of correcting frames which can slide and rotate are arranged on the outer periphery of the correcting seat, and a suction port is arranged at the center.

[0010] Preferably, the frame body is provided with a slide rod for horizontal movement of the patch assembly; the slide rod is located directly below the correcting member, and the two ends are moved up and down by cooperating with the lifting frame on the frame body; the patch assembly comprises a sliding sleeve slidingly arranged on the slide rod and a rotating sleeve driven to rotate around the slide rod by the sliding sleeve; the paste discharging member and the patch member are arranged radially on the rotating sleeve; the slide rod is a threaded rod, which is driven to rotate by the motor, and the two ends are provided with lifting blocks; the lifting frame is provided with electric sliding rails for driving the lifting blocks to move up and down; the sliding sleeve is connected with the threaded rod by screwing to realize horizontal movement, and is internally provided with a gear transmission structure to drive the rotating sleeve to rotate.

[0011] Preferably, the rotating sleeve is hollow and internally provided with a tin paste storage cavity; the paste discharging member is provided as a row of telescopic point paste heads arranged at equal intervals.

[0012] Preferably, the patch member is provided as a row of patch rods arranged at equal intervals, which are telescopic and have end adsorption covers.

[0013] Preferably, the center of the base is provided with a groove; the support limiting assembly comprises a support seat which is lifted in and out of the groove; the support seat is provided with a heating plate and a limiting member; the two groups of limiting members limit the PCB pads from front to back, and each group of limiting members comprises a horizontally movable limiting box; the opposite ends of the two groups of limiting boxes are open, and the open ends are provided with limiting plates which slide up and down.

[0014] Preferably, the limiting plates are provided with rotatable limiting wheels which contact the side walls of the integrated PCB pads and air outlets which blow air to the integrated circuit board.

[0015] Compared with the prior art, the present application has the following beneficial technical effects: the double-layer structure of the feeding assembly one and the feeding assembly two is arranged, which realizes synchronous feeding of the sheet-shaped component and the PCB pad, and is beneficial to improve the patch efficiency. The movable frame which can move forward and backward and up and down drives the patch assembly to move and rotate synchronously, which not only can pick up the sheet-shaped component on the upper layer, but also can use the position vision locator to visually position the sheet-shaped component and the PCB pad from different angles, detect the position deviation, and switch the positions of the point paste member and the patch member by rotating. When the point paste member faces downward and the patch member faces upward, the sheet-shaped component is corrected while the point paste is performed. When the point paste member faces upward and the patch member faces downward, the patch is performed. Before the patch is performed, the support seat is lifted to the bottom of the integrated PCB pad; the limiting box is moved from front to back to be close to the integrated PCB pad, and the position of the integrated PCB pad is corrected during the movement process, so that the integrated PCB pad is properly positioned; the limiting plate clamps and fixes the integrated PCB pad from both sides; the support seat supports the integrated PCB pad from the bottom; and the air outlet blows air to the integrated circuit board after the patch. Through synchronous detection, correction, support, positioning and lamination of the sheet-shaped component and the PCB pad, the continuity and accuracy of the patch are further improved, the patch error is reduced, and the quality of the integrated circuit board patch is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Structure diagram of automatic patching device for integrated circuit board processing (vision 1);

[0017] Figure 2 Structure diagram of automatic patching device for integrated circuit board processing (vision 2);

[0018] Figure 3 Device diagram after disassembly of feeding assembly 1;

[0019] Figure 4 Further disassembly diagram of Figure 3 ;

[0020] Figure 5 Structure diagram of feeding assembly 1;

[0021] Figure 6 Enlarged view of A in Figure 4 ;

[0022] Figure 7 Structure diagram of moving frame and patching assembly;

[0023] Figure 8 Enlarged view of B in Figure 7 ;

[0024] Figure 9 Structure diagram of patching assembly;

[0025] Figure 10 Structure diagram of support limiting assembly;

[0026] Figure 11 Enlarged view of C in Figure 4 .

[0027] Reference signs: 1, base; 101, groove; 2, mounting frame; 3, feeding assembly 1; 301, mounting seat; 302, drive roller; 303, rotating sleeve; 304, positioning belt; 305, positioning groove; 4, feeding assembly 2; 401, fixed seat; 402, lifting seat; 403, air cylinder; 404, feeding roller; 405, feeding frame; 5, support limiting assembly; 501, support seat; 502, heating plate; 503, limiting box; 504, limiting plate; 505, limiting wheel; 506, air outlet head; 6, moving frame; 601, frame body; 602, sliding block; 603, lead screw 1; 604, rotating frame; 605, visual positioner; 606, correction seat; 607, correction frame; 608, suction port; 609, sliding rod; 610, lifting frame; 7, patching assembly; 701, rotating sleeve; 702, sliding sleeve; 703, dotting head; 704, patching rod. DETAILED DESCRIPTION

[0028] Example 1: This example proposes an automatic chip mounting device for integrated circuit board processing, such as... Figures 1-4 As shown, it includes a base 1, a first feeding component 3, a second feeding component 4, a patch assembly 7, and a support and limiting component 5. Mounting brackets 2 are respectively installed on the left and right sides of the base 1; a movable frame 6 that moves back and forth is installed on the mounting bracket 2; feeding component 1 3 is located on the front and rear sides of the base 1 for batch feeding of chip components; feeding component 2 4 is located below feeding component 1 3 and feeds PCB pads through left and right side limiting and back and forth movement; placement component 7 is located on the movable frame 6 and can move left and right and rotate while moving back and forth with the movable frame 6, including a paste dispensing component and a placement component that switch positions by rotation; when the placement component is facing forward or backward, it picks up the chip components on feeding component 1 3; when the placement component is facing upward, it cooperates with the straightening component on the movable frame 6 to straighten the position of the chip components, at which time the paste dispensing component dispenses paste downward; when the placement component is facing downward, it places the chip components on the PCB pads; support and limiting component 5 is located on the base 1 and limits the PCB pads from the front and rear direction during placement, while supporting the PCB pads from the bottom and melting solder paste.

[0029] like Figure 5 As shown, the feeding assembly 3 includes a mounting base 301 mounted on the mounting frame 2; a front and a rear drive roller 302 are mounted on the mounting base 301; rotating sleeves 303 are fitted on the two sets of drive rollers 302; a positioning belt 304 is provided on the rotating sleeve 303 along the rotation direction; and a positioning groove 305 for fixing the sheet-like components is provided on the positioning belt 304.

[0030] It should be further explained that the mounting base 301 is detachable and has a snap-fit ​​notch that mates with the mounting bracket 2. During installation, the mounting base 301 is snapped onto the mounting bracket 2, and then the screw passes through the mounting bracket 2 and the mounting base 301, and the nut is screwed on to fix it.

[0031] It should be further explained that the positioning grooves 305 on adjacent positioning strips 304 are arranged in rows, and the positioning grooves 305 on each group of positioning strips 304 are arranged at equal intervals.

[0032] It should be further explained that the chip components are engaged and positioned within the positioning slot 305.

[0033] Before feeding, the operator removes the mounting base 301 and places the surface-mount components one by one into the positioning slot 305. Then, the mounting base 301 is installed onto the mounting frame 2. Initially, one side of the feeding assembly 3 is used; when one side is low on material, the other side's feeding assembly 3 is used. The operator can then remove the unloaded feeding assembly 3 to load the components. Spray feeding eliminates the need to stop the machine when materials are low, improving the device's surface-mounting efficiency.

[0034] like Figure 6As shown, the feeding assembly two 4 includes a feeding frame 405 fixed on the base 1 and located on both sides of the supporting limiting assembly 5; the feeding frame 405 is provided with fixed seats 401 and lifting seats 402 which are opposite and parallel; the opposite ends of the fixed seats 401 and the lifting seats 402 are provided with feeding rollers 404; the feeding space for the PCB pads to move is left between the upper and lower feeding rollers 404.

[0035] It needs to be further explained that the lifting seat 402 is controlled by the air cylinder 403 and slides up and down on the feeding frame 405.

[0036] When feeding, the staff puts the PCB pads into the feeding space. The size of the feeding space can be adjusted by the up and down movement of the lifting seat 402. The left and right sides of the PCB pads are clamped by the fixed seat 401 and the lifting seat 402 respectively, and are moved to the position of the patch component 7 by the rotation of the feeding roller 404.

[0037] As shown in the figure, Figure 7 The moving frame 6 includes a frame body 601 which slides forward and backward along the mounting frame 2; the frame body 601 is a U-shaped structure with the opening facing downward, and the two sides are provided with sliding blocks 602; the mounting frame 2 is provided with a lead screw one 603 which is driven to rotate by a motor one; the sliding blocks 602 are connected with the lead screw one 603 through threads to realize the forward and backward sliding on the mounting frame 2.

[0038] It needs to be further explained that the frame body 601 is provided with two groups of rotating frames 604 in front and back; each group of rotating frames 604 is provided with a position visual positioner 605.

[0039] It needs to be further explained that the rotating frame 604 is provided in a cylindrical shape and rotates forward and backward by the motor two; the visual positioner 605 is provided in multiple groups along the length direction of the rotating frame 604.

[0040] The forward and backward movement of the frame body 601 can drive the patch component 7 to move forward and backward, and the rotation of the rotating frame 604 can realize the visual positioning of the lower sheet-shaped component from different angles by the position visual positioner 605, so as to ensure the accuracy of the subsequent patching. Since the angle of the position visual positioner 605 can be adjusted, the position of the lower PCB pad can also be detected.

[0041] As shown in the figure, Figure 8 The correcting member is provided between the two groups of rotating frames 604 and includes a correcting seat 606 which moves horizontally along the length direction of the rotating frame 604; the correcting seat 606 is provided with multiple groups of correcting frames 607 which can slide and rotate on the outer periphery, and is provided with a suction port 608 in the center.

[0042] It needs to be further explained that the frame body 601 is provided with an electric sliding rail; the top of the correcting frame 607 is provided with a rotatable mounting table; the mounting table extends into the electric sliding rail and slides with it.

[0043] It needs to be further explained that the correction seat 606 is provided with guide grooves arranged radially around the suction port 608; a screw rod two is arranged in the guide groove and is driven to rotate by a motor three.

[0044] It needs to be further explained that a dust screen is arranged on the suction port 608, and air is sucked by the air pump one.

[0045] When correction is performed, the position visual locator 605 visually locates the sheet-shaped components below from different angles. After detecting that a certain sheet-shaped component has a position deviation, the correction seat 606 moves to the position, the correction frame 607 moves and the correction seat 606 rotates, and the sheet-shaped components on the patch component are corrected in position. At this time, the suction port 608 can clean the sheet-shaped components by suction.

[0046] As shown in Figure 7 , 9 , the frame body 601 is provided with a sliding rod 609 for horizontal movement of the patch assembly 7; the sliding rod 609 is located directly below the correction member, and the two ends are driven to move up and down by cooperating with the lifting frame 610 on the frame body 601; the patch assembly 7 includes a sliding sleeve 702 slidingly arranged on the sliding rod 609 and a rotating sleeve 701 driven to rotate around the sliding rod 609 by the sliding sleeve 702; the paste output member and the patch member are arranged radially on the rotating sleeve 701; the sliding rod 609 is a threaded rod driven to rotate by a motor four, and the two ends are provided with lifting blocks; the lifting frame 610 is arranged as an electric sliding rail driving the lifting blocks to move up and down. The sliding sleeve 702 is connected to the threaded rod by threads to realize horizontal movement, and is internally provided with a gear transmission structure to drive the rotating sleeve 701 to rotate; the rotating sleeve 701 realizes up and down movement, horizontal movement and rotation around the sliding rod 609 by the above structure to meet the position requirements of paste dispensing, correction and patching.

[0047] It needs to be further explained that the rotating sleeve 701 is hollow and internally provided with a tin paste storage cavity; the paste output member is arranged as a row of stretchable paste dispensing heads 703 arranged at equal intervals.

[0048] It needs to be further explained that the paste dispensing heads 703 control the amount of paste output by stretching to make the thickness of the tin paste 0.2-0.3mm.

[0049] After the PCB pad is in place, the position of the paste dispensing is adjusted by moving and rotating the rotating sleeve 701, and then automatic paste dispensing is performed.

[0050] It needs to be further explained that the patch member is arranged as a row of stretchable patch rods 704 arranged at equal intervals and provided with end suction covers at the ends. The suction cover is suctioned by the air pump two; when feeding, correcting and patching are performed, the sheet-shaped components are suctioned and fixed by the vacuum suction cover.

[0051] As shown in Figures 10-11 The center of the base 1 is provided with a groove 101; the support limiting component 5 includes a support seat 501 which is lifted in and out of the groove 101; the support seat 501 is provided with a heating plate 502 and a limiting piece; two groups of limiting pieces limit the PCB pad from front to back, and each group includes a horizontally moving limiting box 503; the opposite ends of the two groups of limiting boxes 503 are provided with a vertically sliding limiting plate 504; the bottom of the support seat 501 is provided with a cylinder which drives it to lift; the support seat 501 is provided with a lead screw three which is driven to rotate by a motor five; the bottom of the limiting box 503 is connected with the lead screw three by threads to move forward and backward along the support seat 501; the limiting plate 504 is connected with a lead screw four which is driven to rotate by a motor six by threads to move up and down along the limiting box 503; the PCB pad moves to the groove 101 with the feeding roller 404.

[0052] It needs to be further explained that the temperature of the heating plate 502 is set to 180-250℃, and the temperature in the partition area is 10-15℃ higher than that in the surrounding area.

[0053] It needs to be further explained that after the heating plate 502 contacts the bottom of the PCB pad, the tin paste is reflowed to form circuit interconnection under the condition of 200-250℃ and 0.5-1.0MPa.

[0054] The support seat 501 rises to the bottom of the integrated PCB pad. The limiting box 503 moves from front to back to be close to the integrated PCB pad, and the position of the integrated PCB pad is corrected during the moving process to make it straight. The limiting plate 504 moves up and down to adjust the position to match the thickness of the integrated circuit board. Finally, the limiting plate 504 clamps and fixes the integrated PCB pad from both sides, and the support seat 501 supports the integrated PCB pad from the bottom. In addition, the heating plate 502 heats the integrated PCB pad to promote the melting of the tin paste.

[0055] It needs to be further explained that the limiting plate 504 is provided with a rotatable limiting wheel 505 which contacts the side wall of the integrated PCB pad and an air outlet head 506 which blows air to the integrated circuit board; the air outlet head 506 is communicated with a fan; the limiting wheel 505 is driven to rotate by a motor six; the limiting wheel 505 moves to contact the integrated PCB pad, and rotates by being electrified to realize the horizontal movement of the integrated PCB pad and further adjust its position. The air outlet head 506 blows air to the integrated circuit board after the patching to accelerate the solidification of the tin paste.

[0056] It needs to be further explained that the dynamic correction of the limiting wheel 505 makes the PCB pad offset ≤0.1mm.

[0057] In example two, based on the automatic patching method and device for integrated circuit board processing in example one, an automatic patching method for integrated circuit board is proposed, and the steps are as follows:

[0058] S1, the worker removes the mounting seat 301, and places the strip-shaped component with the tape in the positioning groove 305 one by one, and then installs the mounting seat 301 on the mounting frame 2; as the rotating sleeve 303 rotates, the single-sided strip-shaped component moves to the position of the patch assembly 7;

[0059] S2, the worker puts the PCB pad into the feeding space, and the left and right sides of the PCB pad are clamped by the fixing seat 401 and the lifting seat 402 respectively, and then moves to the position of the patch assembly 7 as the feeding roller 404 rotates;

[0060] S3, the front and back and the upper and lower of the frame body 601 move to drive the patch assembly 7 to move synchronously; the rotating sleeve 701 rotates to move the suction cover forward to adsorb and fix the strip-shaped component and take it;

[0061] S4, when the patch component is upward and the dotting component is downward: the patch rod 704 carrying the strip-shaped component is upward, the position vision positioner 605 positions the strip-shaped component below from different angles, and after detecting that a certain strip-shaped component has a position deviation, the correction seat 606 moves to the position, the correction frame 607 moves and the correction seat 606 rotates to correct the position of the strip-shaped component on the patch component, and the suction port 608 can clean the strip-shaped component by suction at this time;

[0062] S5, at this time, the supporting seat 501 below rises to the bottom of the integrated PCB pad; the limiting box 503 moves from the front and back to be close to the integrated PCB pad, and corrects the position of the integrated PCB pad during the movement to make it straight; the limiting plate 504 moves up and down to adjust the position to match the thickness of the integrated circuit board; finally, the limiting plate 504 clamps and fixes the integrated PCB pad from both sides, and the supporting seat 501 supports the integrated PCB pad from the bottom;

[0063] S6, since the angle of the position vision positioner 605 is adjustable, the position of the PCB pad below can also be detected, the limiting wheel 505 moves to contact the integrated PCB pad based on the detection result, rotates by electrification to move the integrated PCB pad horizontally, and further adjusts the position; the dotting head 703 below automatically dots the paste after the PCB pad is in place; the heating plate 502 heats to melt the solder paste;

[0064] S7, when the patch component is downward and the dotting component is upward: the corrected patch rod 704 is downward to paste the strip-shaped component on the dotting position; the air outlet head 506 blows air to the integrated circuit board after pasting; after the solder paste solidifies, the integrated circuit board is automatically moved out;

[0065] S8, after the single-sided strip-shaped component is used, the other side is fed.

[0066] The embodiments of the present application are described in detail above with reference to the accompanying drawings, but the present application is not limited to the embodiments, and various changes can be made by those skilled in the art within the scope of knowledge acquired from the present disclosure, without departing from the spirit of the present application.

Claims

1. An automatic chip mounting device for integrated circuit board processing, characterized in that, The utility model relates to a PCB patching device, including: Base (1), the left and right sides of base (1) are equipped with mounting frame (2) respectively;Mounting frame (2) is equipped with mobile frame (6) that moves forward and backward; Patch assembly (7) is arranged on mobile frame (6), and when moving forward and backward with mobile frame (6), it can move left and right and rotate, including the paste component and the paste component that are switched by rotating the paste component;The patch component picks up the sheet-shaped component on the feeding assembly (3) when moving forward and backward, and the patch component cooperates with the correcting component on the mobile frame (6) when moving upward, and the position of the sheet-shaped component is corrected, and the paste component is downward at this time; And support limiting assembly (5) is located on base (1), and the PCB pad is limited from front to back when pasting, and the PCB pad is supported and melted solder paste from the bottom; Patch assembly (7) includes sliding sleeve (702) slidingly arranged on slide rod (609) and rotating sleeve (701) driven to rotate around slide rod (609) by sliding sleeve (702).

2. The automatic taping apparatus for processing of an integrated circuit board according to claim 1, wherein Mobile frame (6) includes frame body (601) sliding along mounting frame (2); Frame body (601) is provided with two groups of rotating frames (604) in front and back;Each group of rotating frames (604) is provided with a position visual positioner (605).

3. The automatic taping apparatus for processing of an integrated circuit board according to claim 2, wherein The correcting component is arranged between the two groups of rotating frames (604), including a correcting seat (606) horizontally moving along the length direction of the rotating frame (604);The outer periphery of the correcting seat (606) is provided with a plurality of groups of correcting frames (607) that can slide and rotate, and a suction port (608) is arranged at the center.

4. The automatic taping apparatus for processing of an integrated circuit board according to claim 3, wherein Frame body (601) is provided with a slide rod (609) for horizontal movement of patch assembly (7);Slide rod (609) is located directly below the correcting component, and the two ends are moved up and down by cooperating with lifting frame (610) on frame body (601); Paste component and patch component are arranged radially on rotating sleeve (701); Slide rod (609) is a threaded rod, driven to rotate by motor four, and lifting blocks are arranged at both ends;Lifting frame (610) is arranged as an electric sliding rail for driving lifting blocks to move up and down; Sliding sleeve (702) is connected with the threaded rod to realize horizontal movement, and is internally provided with a gear transmission structure to drive rotating sleeve (701) to rotate.

5. The automatic taping apparatus for processing of an integrated circuit board according to claim 4, wherein Rotating sleeve (701) is hollow, and a tin paste storage cavity is arranged in the rotating sleeve (701);The paste component is arranged as a plurality of equally spaced retractable point paste heads (703); The point paste head (703) controls the paste amount by stretching and retracting, so that the thickness of the tin paste is 0.2-0.3mm.

6. The automatic taping apparatus for processing of an integrated circuit board according to claim 4, wherein The patch component is arranged as a plurality of equally spaced retractable patch rods (704) with end suction covers.

7. The automatic taping apparatus for processing of an integrated circuit board according to claim 1, wherein The center of base (1) is provided with a groove (101);Support limiting assembly (5) includes support seat (501) that enters and exits groove (101) by lifting;Support seat (501) is provided with a heating plate (502) and a limiting component. Two groups of limit members limit the PCB pads from front to back direction, and each includes a horizontally moving limit box (503); the opposite ends of the two groups of limit boxes (503) are open, and a limit plate (504) sliding up and down is arranged on the opening; The temperature of the heating plate (502) is set to 180-250℃, and the temperature of the patch area is 10-15℃ higher than that of the surrounding area.

8. The automatic taping apparatus for processing of an integrated circuit board according to claim 7, wherein After the heating plate (502) contacts the bottom of the PCB pad, the tin paste is reflowed to form a circuit interconnection under the condition of 200-250℃ and 0.5-1.0MPa.

9. The automatic taping apparatus for processing of an integrated circuit board according to claim 7, wherein A rotatable limit wheel (505) contacting the side wall of the integrated PCB pad and an air outlet head (506) blowing air to the integrated circuit board are arranged on the limit plate (504); The limit wheel (505) dynamically corrects the PCB pad offset of ≤0.1mm.

10. An automatic chip mounting method for integrated circuit board processing, characterized in that, The automatic patching device for integrated circuit board processing is applied to the integrated circuit board processing device of claim 1, and the steps include: the worker codes the patch-shaped component on the feeding assembly one (3), places the PCB pad on the feeding assembly two (4), and synchronously moves the patch-shaped component and the PCB pad to the patching assembly (7) position; the patching assembly (7) absorbs and fixes, takes the patch-shaped component by moving and rotating; the visual positioning system visually positions the patch-shaped component and the PCB pad from different angles; after detecting that the patch-shaped component has a position deviation, the patch-shaped component is position corrected; the supporting and limiting assembly (5) rises to the bottom of the integrated PCB pad, and corrects, limits and supports the position of the integrated PCB pad; after the PCB pad is in place, the tin paste is automatically dispensed; after the tin paste is heated and melted, the supporting and limiting assembly (5) automatically pastes the patch-shaped component on the tin paste dispensing position.

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