Quantitative automatic glue feeding device

Abstract

The invention provides a quantitative automatic glue feeding device which is applied to the technical field of gluing processing and comprises a workbench, a rack is fixed on the workbench, an air cylinder is installed at the top end of the rack, and a machine shaft of the air cylinder is downwards matched with a quantitative automatic glue feeding mechanism; the quantitative automatic glue feeding mechanism comprises a glue dispensing mechanism and a glue recycling mechanism, the glue dispensing mechanism is used for moving up and down to quantitatively feed glue to the electronic elements on the workbench, and the glue recycling mechanism rotates in a linkage mode along with the up-down movement of the glue dispensing mechanism and comprises a heating disc for heating glue and conducting negative pressure recycling; the visual identification positioning mechanism is used for identifying the electronic element right below the dispensing mechanism; the positioning table is arranged on the upper end face of the workbench in a sliding mode and located below the quantitative automatic glue feeding mechanism. The electronic product can be automatically identified for quantitative glue feeding, glue possibly remaining after glue dispensing can be heated and recycled, the subsequent glue dispensing effect can be guaranteed, and the overall using effect is good.

Description

Technical Field

[0001] This invention belongs to the field of adhesive processing technology, and specifically relates to a quantitative automatic adhesive dispensing device. Background Technology

[0002] In the manufacturing and assembly of electronic components, bonding is a critical process. Electronic components are typically small in size and require extremely high precision, such as the connection between chips and circuit boards, and the assembly of small sensors. The quality of bonding these components directly affects the performance, reliability, and lifespan of the entire electronic device.

[0003] Currently, in order to dispense glue to electronic components in a precise amount, a dispensing valve is generally used to avoid the problem of dispensing too much or too little glue to the electronic components, which would affect the production quality. However, existing dispensing valves are not convenient for automatically identifying the dispensing position of electronic products for automatic dispensing. In addition, after the dispensing is completed, glue residue is easy to remain at the bottom of the valve and solidify, which affects the subsequent quantitative dispensing effect and is inconvenient to use.

[0004] Therefore, the present invention proposes a quantitative automatic glue dispensing device to solve the above-mentioned technical problems. Summary of the Invention

[0005] In view of the above-mentioned problems in the prior art, the purpose of the present invention is to provide a quantitative automatic glue dispensing device that can not only automatically identify electronic products to dispense glue in a quantitative manner, but also heat and recover any glue residue that may remain after dispensing, which helps to ensure the subsequent dispensing effect.

[0006] An automatic dispensing device for metering adhesives includes:

[0007] A workbench is provided, on which a frame is fixed. A cylinder is installed at the top of the frame, and a metering automatic glue dispensing mechanism is engaged with the downward axis of the cylinder.

[0008] The quantitative automatic glue dispensing mechanism includes a dispensing mechanism for quantitatively dispensing glue to electronic components on the worktable by moving up and down, and a glue recycling mechanism that rotates in conjunction with the up and down movement of the dispensing mechanism. The glue recycling mechanism includes a heating plate for heating the glue and recycling it under negative pressure, and a visual recognition and positioning mechanism for identifying electronic components directly below the dispensing mechanism.

[0009] The positioning platform is slidably disposed on the upper surface of the worktable and located below the quantitative automatic dispensing mechanism, and the middle part of the positioning platform is provided with an adsorption fixing part for the negative pressure adsorption electronic component.

[0010] Preferably, the dispensing mechanism includes a fixing frame, which is fixed to the lower end of the cylinder shaft, and a vertically downward dispensing valve is fixed inside the fixing frame.

[0011] Preferably, the glue recycling mechanism includes a movable column rotatably mounted on the lower end face of the top of the frame. The movable column is vertically parallel to the fixed frame. The lower end of the movable column is fixed with a recycling seat that extends horizontally to directly below the dispensing valve. A horizontal guide column is fixed on the side of the fixed frame. A guide groove is provided on the side of the movable column. The end of the guide column slides down along the guide groove to drive the movable column to turn.

[0012] Preferably, a fixed seat is rotatably mounted on the top of the movable column, and the fixed seat is fixed to the lower top surface of the frame.

[0013] Preferably, the recycling seat has a docking groove for the lower end of the dispensing valve to be inserted, the heating plate is installed in the docking groove, the heating plate has a negative pressure suction nozzle in the middle and is connected to a recycling tube, and the lower end of the recycling seat is fixed with the visual recognition positioning mechanism, which is a CCD camera and is located directly below the dispensing valve.

[0014] Preferably, the side of the docking groove is provided with a slot for the lower end of the dispensing valve to extend into, and the recovery pipe is used in conjunction with a negative pressure pump.

[0015] Preferably, the positioning platform is equipped with air pumps at both ends, and the adsorption fixing part is a plate structure with a number of adsorption air holes on its surface. The adsorption fixing part is fitted and fixed in the middle of the positioning platform and is connected to the air pump through an air channel opened in the positioning platform.

[0016] Preferably, the upper end face of the worktable has two parallel slide rails fixed symmetrically, and the lower end face of the positioning table has a groove for the slide rails to slide into.

[0017] Preferably, a handle is fixed to the outer edge of the positioning platform, and a pull ring is fitted inside the positioning platform on the inner side of the handle. A movable plate is fixed to one end of the pull ring that extends into the positioning platform. The movable plate is connected to the inner wall of the cavity inside the positioning platform by a spring. The two ends of the movable plate are movably connected to the positioning plate by rods. The positioning plate extends into the slide groove and is used to abut against the side of the slide rail to form a fixation.

[0018] Preferably, the positioning platform is slidably placed on the upper end face of the worktable, and a screw is rotatably installed in the middle of the upper end face of the worktable. The screw thread passes through the middle of the positioning platform, and a rocker arm is provided at one end of the screw.

[0019] The beneficial effects of this invention are:

[0020] This quantitative automatic glue dispensing device can use a visual recognition positioning mechanism to visually identify the electronic components to be glued, and use a cylinder to control the dispensing valve to descend to dispense glue in a quantitative manner. At the same time, the linkage movable column will rotate the visual recognition positioning mechanism to ensure the dispensing effect. When the dispensing valve rises and resets, it will also link the movable column to reset. The use of the docking groove for heating and negative pressure recovery can avoid residual glue from affecting subsequent dispensing.

[0021] Meanwhile, this device can also use the positioning platform that slides on the worktable to adsorb and fix electronic components, which not only has a good fixing effect, but also causes less wear and tear on the electronic components.

[0022] In summary, this invention can not only automatically identify electronic products to dispense glue in precise quantities, but also heat and recover any residual glue after dispensing, which helps to ensure the subsequent dispensing effect and results in good overall performance. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the automatic dispensing mechanism for quantitative glue application of the present invention;

[0026] Figure 3 This is a schematic diagram of the internal structure of the recycling station of the present invention;

[0027] Figure 4 This is a schematic diagram of the positioning stage of the present invention;

[0028] Figure 5 This is the present invention. Figure 1 Enlarged schematic diagram of the structure at point A;

[0029] Figure 6 This is a schematic diagram of the internal structure of the positioning stage of the present invention;

[0030] Figure 7 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0031] Figure 8 This is a schematic diagram of the positioning stage in Embodiment 2 of the present invention.

[0032] The diagram is marked as follows:

[0033] 1. Workbench; 101. Slide rail; 2. Chassis; 3. Frame; 4. Cylinder; 5. Quantitative automatic dispensing mechanism; 501. Fixing frame; 502. Dispensing valve; 503. Guide column; 504. Movable column; 505. Guide groove; 506. Fixing seat; 507. Recycling seat; 508. Docking groove; 509. Visual recognition positioning mechanism; 5010. Heating plate; 5011. Recycling pipe; 5012. Negative pressure pump; 6. Central control screen; 7. Positioning platform; 701. Slide groove; 702. Handle; 703. Pull ring; 704. Movable plate; 705. Spring; 706. Positioning plate; 707. Screw; 708. Rocker arm; 8. Adsorption fixing part; 9. Air pump. Detailed Implementation

[0034] Example 1:

[0035] like Figure 1 As shown, an automatic quantitative dispensing device includes a worktable 1, on which an inverted L-shaped frame 3 is fixed. A cylinder 4 is mounted on the top of the frame 3. The cylinder 4 is axially coupled to an automatic quantitative dispensing mechanism 5. The automatic quantitative dispensing mechanism 5 includes a dispensing mechanism for quantitative dispensing of glue to electronic components on the worktable 1 by moving up and down, and a glue recycling mechanism that rotates in conjunction with the up and down movement of the dispensing mechanism. The glue recycling mechanism includes a heating plate 5010 for heating the glue and recycling it under negative pressure, and a visual recognition and positioning mechanism 509 for identifying electronic components directly below the dispensing mechanism. A housing 2 is provided at the bottom of the worktable 1. The housing 2 contains a glue supply mechanism, such as a glue storage cylinder, and is used to connect the dispensing mechanism and the glue recycling mechanism.

[0036] like Figure 2 and Figure 3 As shown, the dispensing mechanism includes a mounting frame 501, which is fixed to the lower end of the shaft of the cylinder 4. A vertically downward dispensing valve 502 is fixed inside the mounting frame 501, and the dispensing valve 502 is connected to the adhesive supply mechanism inside the housing 2 via a pipe. In specific implementations, different types of housings 2 can be used for adhesives of different viscosities. For example, for low-viscosity adhesives, a time-pressure valve or diaphragm valve can be used, but is not limited to; for high-viscosity adhesives, a screw pump / plunger pump valve can be used; and for ultra-micro dispensing, a piezoelectric jet valve can be used, but is not limited to.

[0037] The glue recycling mechanism includes a movable column 504, the top of which is rotatably mounted on a fixed base 506. The fixed base 506 is fixed to the lower top surface of the frame 3. The movable column 504 is vertically parallel to the fixed frame 501. A recycling seat 507 for horizontally extending to directly below the dispensing valve 502 is fixed at the lower end of the movable column 504. A horizontal guide column 503 is fixed on the side of the fixed frame 501. A guide groove 505 is provided on the side of the movable column 504. The end of the guide column 503 slides down along the guide groove 505 to drive the movable column 504 to turn.

[0038] Specific coordination Figure 3 As shown, the recycling seat 507 has a docking groove 508 for the lower end of the dispensing valve 502 to be inserted. A heating plate 5010 is installed in the docking groove 508. The surface of the heating plate 5010 is provided with a heating resistance wire for heating, ensuring the fluidity of the adhesive at the lower end of the dispensing valve 502. A negative pressure suction nozzle is also provided in the middle of the heating plate 5010 and connected to a recycling pipe 5011. The recycling pipe 5011, in conjunction with a negative pressure pump 5012, can negatively suction away any residual adhesive at the lower end of the dispensing valve 502 to ensure subsequent quantitative dispensing. In this embodiment, the docking groove 508 has a slot on its side, allowing the lower end of the dispensing valve 502 to be accommodated in or moved out of the docking groove 508 during the rotation of the recycling seat 507 and the up-and-down movement of the dispensing valve 502.

[0039] In addition, a visual recognition positioning mechanism 509 is fixed to the lower end of the recycling seat 507. The visual recognition positioning mechanism 509 is located directly below the dispensing valve 502, and a central control screen 6 is installed on the frame 3 and electrically connected to the visual recognition positioning mechanism 509. The central control screen 6 is equipped with a PLC controller, which determines and controls the cylinder 4 and the dispensing valve 502 to perform the dispensing action by receiving visual recognition information from the visual recognition positioning mechanism 509. When the recycling seat 507 is located directly below the dispensing valve 502, the visual recognition positioning mechanism 509 can automatically determine to perform the dispensing action by recognizing electronic components. In specific implementations, the visual recognition positioning mechanism 509 can use, but is not limited to, existing integrated high-resolution CCD cameras or 3D vision systems to locate the position of electronic components through image recognition technology.

[0040] like Figure 4 , Figure 5 and Figure 6As shown, a positioning platform 7 is slidably disposed on the upper surface of the workbench 1. The positioning platform 7 is located below the quantitative automatic dispensing mechanism 5, and an adsorption fixing part 8 for a negative pressure adsorption electronic component is disposed in the middle of the positioning platform 7. In a specific implementation, air pumps 9 are installed at both ends of the positioning platform 7, and the adsorption fixing part 8 is a plate structure with a number of adsorption pores on its surface. The adsorption fixing part 8 is fitted and fixed in the middle of the positioning platform 7 and is connected to the air pump 9 through an air passage opened in the positioning platform 7. Therefore, the air pump 9 can be used to fix the air pores on the adsorption fixing part 8 by means of a negative pressure adsorption electronic component.

[0041] In this embodiment, two parallel slide rails 101 are symmetrically fixed on the upper end face of the workbench 1, and a groove 701 is provided on the lower end face of the positioning platform 7 for the slide rails 101 to slide into. A handle 702 is fixed on the outer edge of the positioning platform 7, and a pull ring 703 inserted into the positioning platform 7 is fitted on the inner side of the handle 702. A movable plate 704 is fixed to one end of the pull ring 703 that extends into the positioning platform 7. The movable plate 704 is connected to the inner wall of the cavity of the positioning platform 7 by a spring 705. The two ends of the movable plate 704 are movably connected to a positioning plate 706 by a rod. The positioning plate 706 extends into the groove 701 and is used to abut against the side of the slide rail 101 to form a fixation. Therefore, by holding the handle 702 and simultaneously pulling the pull ring 703 outward, the movable plate 704 can move the positioning plate 706 through the rods at both ends, separating it from the inner wall of the slide rail 101, so that the positioning table 7 can be easily moved on the worktable 1 to adjust the position of electronic components. When the pull ring 703 is released, the spring 705 will drive the movable plate 704 to return to its original position, so that the positioning plate 706 abuts against the side wall of the slide rail 101, increasing the friction and thus fixing the position.

[0042] Working principle: In use, this automatic quantitative dispensing device places the electronic components to be bonded on the upper surface of the positioning table 7. The air vents on the adsorption fixing part 8, in conjunction with the air pump 9, create a negative pressure adsorption and fixing effect, resulting in good fixation and minimal wear on the electronic components. Subsequently, the sliding positioning table 7 moves the fixed electronic components until the visual recognition positioning mechanism 509 identifies and detects the dispensing position of the electronic components. This information is then fed back to the central control screen 6, which controls the cylinder 4 to lower the dispensing valve 502 to dispense a precise amount of adhesive to the electronic components.

[0043] During this process, when the fixing frame 501 and the dispensing valve 502 descend, the guide column 503 slides down along the guide groove 505, thereby driving the movable column 504 to turn and causing the recovery seat 507 to be offset from the lower end of the dispensing valve 502, so that the dispensing valve 502 can dispense glue to the electronic components.

[0044] After the dispensing action is completed, cylinder 4 drives the fixing bracket 501 and dispensing valve 502 to rise and reset. Then, the guide column 503 slides upward along the guide groove 505, which drives the movable column 504 to turn and reset again, moving the recovery seat 507 back below the dispensing valve 502. At this time, the heating plate 5010 in the docking groove 508 can heat the lower end of the dispensing valve 502 to a certain extent to prevent residual glue from solidifying. In conjunction with the recovery pipe 5011 and the negative pressure pump 5012, the negative pressure suction nozzle in the middle of the heating plate 5010 is used to suck away and recover the residual glue, which can prevent residual glue from affecting subsequent dispensing.

[0045] In summary, this invention can not only automatically identify electronic products to dispense glue in precise quantities, but also heat and recover any residual glue after dispensing, which helps to ensure the subsequent dispensing effect and results in good overall performance.

[0046] Example 2:

[0047] like Figure 7 and Figure 8 As shown, the structure of this second embodiment is basically the same as that of the first embodiment described above, except that:

[0048] The positioning stage 7 is slidably placed on the upper surface of the worktable 1, and a screw 707 is rotatably mounted on the middle of the upper surface of the worktable 1. The screw 707 is threaded through the middle of the positioning stage 7, and a rocker arm 708 is provided at one end of the screw 707. Therefore, the displacement of the positioning stage 7 on the upper surface of the worktable 1 can be controlled by rotating the screw 707, thereby adjusting the position of the electronic components adsorbed and fixed on the adsorption and fixing part 8.

[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A quantitative automatic glue dispensing device, characterized in that, include: A workbench (1) is fixed on the workbench (1), and a cylinder (4) is installed at the top of the cylinder (3). The cylinder (4) is coupled with a metering automatic glue dispensing mechanism (5) in the downward direction. The quantitative automatic glue dispensing mechanism (5) includes a dispensing mechanism for dispensing glue quantitatively to electronic components on the workbench (1) by moving up and down, and a glue recycling mechanism that rotates in conjunction with the dispensing mechanism as it moves up and down. The glue recycling mechanism includes a heating plate (5010) for heating glue and recycling it under negative pressure, and a visual recognition and positioning mechanism (509) for identifying electronic components directly below the dispensing mechanism. The positioning stage (7) is slidably disposed on the upper surface of the worktable (1) and located below the quantitative automatic dispensing mechanism (5), and the positioning stage (7) is provided with a negative pressure adsorption electronic component adsorption fixing part (8) in the middle.

2. The automatic dispensing device for quantitative dispensing according to claim 1, characterized in that, The dispensing mechanism includes a fixing frame (501), which is fixed to the lower end of the shaft of the cylinder (4), and a vertically downward dispensing valve (502) is fixed inside the fixing frame (501).

3. The automatic dispensing device for quantitative dispensing according to claim 2, characterized in that, The glue recycling mechanism includes a movable column (504) rotatably mounted on the lower top surface of the frame (3). The movable column (504) is vertically parallel to the fixed frame (501). The lower end of the movable column (504) is fixed with a recycling seat (507) for horizontally extending to directly below the dispensing valve (502). A horizontal guide column (503) is fixed on the side of the fixed frame (501). A guide groove (505) is provided on the side of the movable column (504). The end of the guide column (503) slides down along the guide groove (505) to drive the movable column (504) to turn.

4. The automatic dispensing device for quantitative dispensing according to claim 3, characterized in that, A fixed seat (506) is rotatably mounted on the top of the movable column (504), and the fixed seat (506) is fixed to the lower top surface of the frame (3).

5. The automatic dispensing device for quantitative dispensing according to claim 3, characterized in that, The recycling seat (507) has a docking groove (508) for the lower end of the dispensing valve (502) to be inserted. The heating plate (5010) is installed in the docking groove (508). A negative pressure suction nozzle is provided in the middle of the heating plate (5010) and connected to the recycling tube (5011). The visual recognition positioning mechanism (509) is fixed at the lower end of the recycling seat (507). The visual recognition positioning mechanism (509) is a CCD camera and is located directly below the dispensing valve (502).

6. The automatic dispensing device for quantitative dispensing according to claim 5, characterized in that, The side of the docking groove (508) is provided with a slot for the lower end of the dispensing valve (502) to extend into, and the recovery pipe (5011) is matched with the negative pressure pump (5012).

7. The automatic dispensing device for quantitative dispensing according to claim 1, characterized in that, The positioning platform (7) is equipped with air pumps (9) at both ends, and the adsorption fixing part (8) is a plate structure with a number of adsorption air holes on the surface. The adsorption fixing part (8) is fitted and fixed in the middle of the positioning platform (7) and communicates with the air pump (9) through the air passage opened in the positioning platform (7).

8. The automatic dispensing device for quantitative dispensing according to claim 1, characterized in that, The upper end face of the workbench (1) has two parallel slide rails (101) fixed symmetrically, and the lower end face of the positioning table (7) has a slide groove (701) for the slide rails (101) to slide into.

9. The automatic dispensing device for quantitative dispensing according to claim 8, characterized in that, A handle (702) is fixed to the outer edge of the positioning platform (7). A pull ring (703) is inserted into the positioning platform (7) on the inner side of the handle (702). A movable plate (704) is fixed to one end of the pull ring (703) that extends into the positioning platform (7). The movable plate (704) is connected to the inner wall of the cavity of the positioning platform (7) by a spring (705). The two ends of the movable plate (704) are movably connected to the positioning plate (706) by a rod. The positioning plate (706) extends into the slide groove (701) and is used to abut against the side of the slide rail (101) to form a fixation.

10. The automatic dispensing device for quantitative dispensing according to claim 1, characterized in that, The positioning platform (7) is slidably placed on the upper end face of the worktable (1). A screw (707) is rotatably installed in the middle of the upper end face of the worktable (1). The screw (707) is threaded through the middle of the positioning platform (7), and a rocker arm (708) is provided at one end of the screw (707).

Images