Glue supply method and device, electronic equipment and storage medium

Abstract

The invention discloses a glue supply method and device, electronic equipment and a storage medium. The method comprises the steps that when the amount of glue in a first glue supply tank is smaller than the preset amount of glue, the first glue supply tank is switched to a second glue supply tank to supply glue to the outside, and the first glue supply tank is supplemented with glue; glue in the first glue supply tank and the second glue supply tank is the same in type; the first glue supply tank is a glue supply tank which is supplying glue; and in response to the situation that the glue amount in the second glue supply tank is smaller than the preset glue amount, switching from the second glue supply tank to the first glue supply tank to supply glue to the outside, and supplementing glue to the second glue supply tank. By the adoption of the technical scheme, glue is supplied to the outside through circulation of the first glue supply tank and the second glue supply tank, the glue supply tank with a small amount of glue in the glue supply tanks is supplemented in the glue supply process, and therefore continuous glue supply to the outside is achieved, equipment using glue can work continuously, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of coating and adhesive application technology, and more particularly to an adhesive supply method, apparatus, electronic device, and storage medium. Background Technology

[0002] In many industries such as packaging, printing, and electronics, coating processes are used to evenly apply coating adhesive to the surface of a substrate, thereby forming a coating with protective and other functions.

[0003] Traditional coating equipment requires stopping the equipment and manually filling it during the glue supply process. However, this filling method is inefficient and can easily introduce too many impurities into the glue, affecting product quality. Some equipment uses dual glue tanks for alternating glue supply, but lacks switching control, making it difficult to achieve continuous operation. Summary of the Invention

[0004] This invention provides a glue supply method, apparatus, electronic device, and storage medium to solve the problems of inability to continuously supply glue or lack of switching control during alternating glue supply from two glue tanks.

[0005] According to one aspect of the present invention, a method for supplying adhesive is provided, the method comprising:

[0006] In response to the glue level in the first glue supply tank being less than the preset glue level, the glue supply is switched from the first glue supply tank to the second glue supply tank, and the first glue supply tank is replenished with glue. The first and second glue supply tanks contain the same type of glue. The first glue supply tank is the glue supply tank that is currently supplying glue.

[0007] If the amount of glue in the second glue supply tank is less than the preset amount of glue, the system switches from the second glue supply tank to the first glue supply tank to supply glue externally, and replenishes the glue in the second glue supply tank.

[0008] According to another aspect of the present invention, an adhesive supply device is provided, the device comprising:

[0009] The first glue supply switching module is used to switch from the first glue supply tank to the second glue supply tank to supply glue externally when the glue quantity in the first glue supply tank is less than the preset glue quantity, and to replenish the glue in the first glue supply tank; the first glue supply tank and the second glue supply tank contain the same type of glue; the first glue supply tank is the glue supply tank that is currently supplying glue.

[0010] The second glue supply switching module is used to switch from the second glue supply tank to the first glue supply tank to supply glue externally when the amount of glue in the second glue supply tank is less than the preset amount of glue, and to replenish the glue in the second glue supply tank.

[0011] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0012] At least one processor; and

[0013] A memory that is communicatively connected to at least one processor; wherein,

[0014] The memory stores a computer program that can be executed by at least one processor, such that the at least one processor is able to perform the glue supply method of any embodiment of the present invention.

[0015] According to another aspect of the present invention, a computer-readable storage medium is provided, which stores computer instructions for causing a processor to execute and implement the glue supply method of any embodiment of the present invention.

[0016] The technical solution of this invention, in response to the glue level in the first glue supply tank being less than a preset glue level, switches from the first glue supply tank to the second glue supply tank for external glue supply. This ensures uninterrupted glue supply during the external glue supply process, thereby guaranteeing continuous operation of the glue-using equipment and continuous product output. After switching from the first glue supply tank to the second glue supply tank, the first glue supply tank is replenished to ensure rapid replenishment. This ensures continuous glue supply when the first glue supply tank is used again, providing a basis for replenishing the second glue supply tank. Furthermore, by switching from the second glue supply tank to the first glue supply tank for external glue supply in response to the glue level in the second glue supply tank being less than a preset glue level, the uninterrupted glue supply during the external glue supply process ensures continuous operation of the glue-using equipment and continuous product output. After switching from the second glue supply tank to the first glue supply tank for external glue supply, the second glue supply tank is replenished to ensure that the glue in the second glue supply tank can be quickly replenished. This ensures that the second glue supply tank can continuously supply glue when used again in subsequent uses, providing a basis for replenishing the glue in the first glue supply tank. By adopting the above technical solution, glue is supplied externally through the circulation of the first and second glue supply tanks, and glue is replenished in the glue supply tank with low glue levels during the supply process, thereby achieving continuous glue supply. This allows the glue-using equipment to operate continuously, improving production efficiency.

[0017] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of an adhesive supply method according to Embodiment 1 of the present invention;

[0020] Figure 2 This is a schematic diagram illustrating the connection relationship between the first glue supply tank and the second glue supply tank according to an embodiment of the present invention;

[0021] Figure 3 This is a flowchart of another adhesive supply method provided according to Embodiment 2 of the present invention;

[0022] Figure 4 This is a schematic diagram of the connections of various pipes in the glue supply tank according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of an adhesive supply device according to Embodiment 3 of the present invention;

[0024] Figure 6 This is a schematic diagram of the structure of an electronic device that implements the adhesive supply method of the present invention. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] Example 1

[0028] Figure 1 This invention provides a flowchart of a glue supply method according to Embodiment 1. This embodiment is applicable to situations where glue supply is interrupted during external supply. The method can be executed by a glue supply device, which can be implemented in hardware and / or software. This glue supply device can be configured in an electronic device with data processing capabilities. Figure 1 As shown, the method includes:

[0029] S110. In response to the glue quantity in the first glue supply tank being less than the preset glue quantity, the glue supply is switched from the first glue supply tank to the second glue supply tank, and the first glue supply tank is replenished with glue. The first glue supply tank and the second glue supply tank contain the same type of glue. The first glue supply tank is the glue supply tank that is currently supplying glue.

[0030] Both the first and second glue supply tanks are used for external glue supply. The first and second glue supply tanks can supply glue simultaneously and / or separately. The first and second glue supply tanks are independent; glue from the first supply tank does not flow into the second supply tank, and vice versa. The external glue supply ports of the first and second supply tanks are the same. The preset glue volume can be the minimum glue volume supplied in the current supply tank when switching supply tanks. The preset glue volume setting is greater than the minimum preset glue volume. The minimum preset glue volume is the product of the supply tank switching time and the flow rate of the glue supplied from the supply tank.

[0031] To avoid running out of glue in the glue supply tank and needing to stop for refilling, a first and second glue supply tank are set up to supply glue alternately. When the glue level in the first supply tank falls below the preset level, the system switches to the second supply tank for refilling. During the switching period, the first supply tank can continue supplying glue until the second supply tank begins supplying glue, at which point the first supply tank is shut down. After the first supply tank stops supplying glue, it is refilled.

[0032] In response to a lower than preset glue level in the first glue supply tank, the system switches to the second glue supply tank for external glue supply. This ensures uninterrupted glue supply, guaranteeing continuous operation of the equipment and thus continuous product output. After switching from the first to the second glue supply tank, the first tank is replenished to ensure rapid replenishment. This guarantees a continuous glue supply from the first tank for subsequent uses, providing a foundation for replenishing the second glue supply tank.

[0033] In one alternative approach, determining the amount of adhesive in the glue dispenser may include steps A1-A2:

[0034] Step A1: Determine the glue level in the glue supply tank.

[0035] Step A2: Determine the amount of glue in the glue supply tank based on the glue level in the supply tank, the volume of the supply tank, and the glue supply flow rate.

[0036] To determine the amount of glue in the glue supply tank, the proportion of glue volume to the total volume of the supply tank at any given moment can be calculated by considering the glue level and the tank's volume. Multiplying this proportion by the total volume of the supply tank gives the current amount of glue in the tank.

[0037] The glue volume in the glue supply tank at each time point is determined based on the glue supply flow rate and the glue volume in the glue supply tank at the current moment.

[0038] By determining the glue level in the glue supply tank and the volume of the glue supply tank, the amount of glue in the glue supply tank at the current moment can be accurately determined. Then, based on the amount of glue in the glue supply tank at the current moment and the glue supply flow rate of the glue supply tank, the amount of glue in the glue supply tank at each moment can be accurately determined.

[0039] Optionally, determine the glue level in the first glue supply tank, including:

[0040] The level of adhesive in the first adhesive supply tank is determined based on the liquid level sensor. The liquid level sensor is installed at a first position and a second position. The first position and the second position are located on the side of the adhesive supply tank. The first position is located at a first preset distance from the top of the adhesive supply tank. The second position is located at a first preset distance from the bottom of the adhesive supply tank.

[0041] A liquid level sensor can be a sensor used to detect changes in the height of a liquid level.

[0042] See Figure 2 A liquid level sensor is installed at a first position and a second position on the glue supply tank. The first position is located at a first preset distance from the top of the glue supply tank to determine the amount of glue in the tank during refilling. The second position is located at a second preset distance from the bottom of the glue supply tank to determine the amount of glue in the tank during glue supply. The first preset distance is used to determine whether the glue supply tank has finished refilling. The second preset distance is used to prevent the glue supply process from being interrupted by switching back after all the glue in the tank has been supplied.

[0043] S120. In response to the glue volume in the second glue supply tank being less than the preset glue volume, the glue supply is switched from the second glue supply tank to the first glue supply tank, and the glue in the second glue supply tank is replenished.

[0044] After switching from the first glue supply tank to the second glue supply tank, the first glue supply tank is replenished with glue. If the glue level in the second glue supply tank is lower than the preset level, the system switches back to the first glue supply tank, and glue supply resumes from the first tank. During the switching process, the second glue supply tank can continue to supply glue until the first glue supply tank begins supplying glue, at which point the second glue supply tank is shut off.

[0045] In response to a lower-than-preset glue level in the second glue supply tank, the system switches to supplying glue from the first tank. This uninterrupted glue supply ensures continuous operation of the equipment and guarantees consistent product output. After switching back to the first tank, the second tank is replenished to ensure rapid replenishment. This guarantees a continuous glue supply from the second tank for subsequent uses, providing a foundation for replenishing the first tank.

[0046] By adopting the technical solution of this application, in response to the glue level in the first glue supply tank being less than the preset glue level, the system switches from the first glue supply tank to the second glue supply tank for external glue supply. This ensures uninterrupted glue supply during the external glue supply process, thereby guaranteeing the continuous operation of the glue-using equipment and ensuring continuous product output. After switching from the first glue supply tank to the second glue supply tank, the first glue supply tank is replenished to ensure that the glue in the first glue supply tank can be quickly replenished. This ensures that the first glue supply tank can continuously supply glue when used again, providing a basis for replenishing the second glue supply tank. Similarly, by switching from the second glue supply tank to the first glue supply tank for external glue supply in response to the glue level in the second glue supply tank being less than the preset glue level, the system ensures uninterrupted glue supply during the external glue supply process, thereby guaranteeing the continuous operation of the glue-using equipment and ensuring continuous product output. After switching from the second glue supply tank to the first glue supply tank for external glue supply, the second glue supply tank is replenished to ensure that the glue in the second glue supply tank can be quickly replenished. This ensures that the second glue supply tank can continuously supply glue when used again in subsequent uses, providing a basis for replenishing the glue in the first glue supply tank. By adopting the above technical solution, glue is supplied externally through the circulation of the first and second glue supply tanks, and glue is replenished in the glue supply tank with low glue levels during the supply process, thereby achieving continuous glue supply. This allows the glue-using equipment to operate continuously, improving production efficiency.

[0047] Example 2

[0048] Figure 3This invention provides a flowchart of another glue supply method. This embodiment further optimizes the process after replenishing the second glue supply tank as described in the previous embodiments. This embodiment can be combined with various optional solutions from one or more of the above embodiments. Figure 3 As shown, the adhesive supply method of this embodiment may include the following steps:

[0049] S210. In response to the glue quantity in the first glue supply tank being less than the preset glue quantity, the glue supply is switched from the first glue supply tank to the second glue supply tank, and the first glue supply tank is replenished with glue. The first glue supply tank and the second glue supply tank contain the same type of glue. The first glue supply tank is the glue supply tank that is currently supplying glue.

[0050] S220. In response to the glue volume in the second glue supply tank being less than the preset glue volume, the glue supply is switched from the second glue supply tank to the first glue supply tank, and the glue in the second glue supply tank is replenished.

[0051] S230, in response to the glue change command, stop the glue supply from the first glue supply tank and the second glue supply tank, and open the third glue supply tank. The glue type of the second glue supply tank is different from that of the third glue supply tank.

[0052] S240. In response to the fact that the amount of glue in the third glue supply tank is less than the preset amount of glue, the system switches from the third glue supply tank to the fourth glue supply tank and replenishes the glue in the third glue supply tank; the type of glue in the third glue supply tank and the fourth glue supply tank is the same.

[0053] S250, In response to the glue quantity in the fourth glue supply tank being less than the preset glue quantity, the glue supply is switched from the fourth glue supply tank to the third glue supply tank, and the glue in the fourth glue supply tank is replenished.

[0054] The glue change command can be used to change the type of glue supplied externally. The glue change command can be set with a change time. The third glue supply tank is used for external glue supply, and the type of glue supplied by the third glue supply tank is different from the types supplied by the second and first glue supply tanks. Both the third and fourth glue supply tanks are used for external glue supply. The third and fourth glue supply tanks can supply glue simultaneously and / or separately. The third and fourth glue supply tanks are independent; glue from the third glue supply tank does not flow into the fourth glue supply tank, and vice versa. The external glue supply port of the third glue supply tank is the same as that of the fourth glue supply tank.

[0055] In response to a glue change command, the first and second glue supply tanks are shut down, and the third and / or fourth glue supply tanks are switched to supply glue externally. To avoid running out of glue in the supply tanks and needing to stop for replenishment, the third and fourth glue supply tanks are configured to supply glue externally alternately. When the glue level in the third glue supply tank falls below the preset level, the system switches to the fourth glue supply tank for external glue supply. During the switching period, the third glue supply tank can continue supplying glue externally until the fourth glue supply tank begins supplying glue, at which point the third glue supply tank is shut down. After the third glue supply tank stops supplying glue externally, it is replenished with glue.

[0056] In response to a lower-than-preset glue level in the third glue supply tank, the system switches to the fourth glue supply tank for external glue supply. This ensures uninterrupted glue supply, guaranteeing continuous operation of the glue-using equipment and thus continuous product output. After switching from the third to the fourth glue supply tank, the third glue supply tank is replenished to ensure rapid replenishment. This guarantees a continuous glue supply from the third supply tank for subsequent uses, providing a foundation for replenishing the fourth glue supply tank.

[0057] After switching from the third to the fourth glue supply tank, the third glue supply tank is replenished with glue. If the glue level in the fourth glue supply tank is lower than the preset level, the system switches back to the third glue supply tank to resume glue supply. During the switching process, the fourth glue supply tank can continue to supply glue until the third glue supply tank begins supplying glue, at which point the fourth glue supply tank is shut down.

[0058] In response to a lower-than-preset glue level in the fourth glue supply tank, the system switches to the third glue supply tank for external glue supply. This ensures uninterrupted glue supply, guaranteeing continuous operation of the glue-using equipment and thus continuous product output. After switching from the fourth to the third glue supply tank, the fourth glue supply tank is replenished to ensure rapid replenishment. This guarantees a continuous glue supply from the fourth supply tank for subsequent uses, providing a foundation for replenishing the third glue supply tank.

[0059] In one alternative approach, replenishing the adhesive supply tank includes:

[0060] Open the first and second pipes corresponding to the glue supply tank to be repaired, and keep the third pipe closed; the first pipe is connected to the first interface of the glue supply tank to be repaired, and the first interface is located at the top of the glue supply tank to be repaired; the second pipe enters the glue supply tank to be repaired from the second interface, and the second interface is located at the top of the glue supply tank to be repaired; the third pipe is connected to the third interface, and the third interface is located at the bottom of the glue supply tank to be repaired; the second pipe is used to supply glue to the glue supply tank to be repaired; the first pipe is used to discharge the gas inside the glue supply tank to be repaired when the first pipe supplies glue to the glue supply tank to be repaired; the third pipe is the pipe for supplying glue from the glue supply tank to the outside; the glue supply tank to be repaired is the first glue supply tank and / or the second glue supply tank and / or the third glue supply tank and / or the fourth glue supply tank.

[0061] See Figure 4 When replenishing glue to the glue supply tank, open the second pipe of the glue supply tank to replenish the glue. During the glue replenishment process, keep the third pipe closed to prevent glue from flowing out of the glue supply tank. When replenishing glue to the glue supply tank, glue may be driven into the glue supply tank by gas or other means, and there is also gas in the glue supply tank. Therefore, open the first pipe to expel the gas in the glue supply tank during the glue replenishment process. The first port is located at the top of the glue supply tank to ensure smooth gas discharge. The third port is located at the bottom of the glue supply tank to ensure smooth glue discharge during glue supply.

[0062] By keeping the third pipe corresponding to the glue supply tank closed, glue is prevented from flowing out of the third pipe during the glue supply process, which would affect the glue supply effect. By opening the first and second pipes corresponding to the glue supply tank, the gas inside the glue supply tank is ensured to be smoothly discharged during the glue supply process. This prevents the gas inside the glue supply tank from occupying different volumes inside the glue supply tank, which could lead to glue supply failure or excessive internal pressure affecting the glue supply speed.

[0063] In one alternative approach, the method further includes:

[0064] Open the first and second pipes corresponding to the glue supply tank to be cleaned, and keep the third pipe closed; the first pipe is connected to the first interface of the glue supply tank to be cleaned, and the first interface is located at the top of the glue supply tank to be cleaned; the second pipe enters the glue supply tank to be cleaned from the second interface, and the second interface is located at the bottom of the glue supply tank to be cleaned; the third pipe is connected to the third interface, and the third interface is located at the bottom of the glue supply tank to be cleaned; the second pipe is used to inject cleaning fluid into the glue supply tank to be cleaned; the first pipe is used to discharge the mixture of cleaning fluid and glue in the glue supply tank to be cleaned when the second pipe injects cleaning fluid into the glue supply tank to be cleaned; the third pipe is the pipe for supplying glue from the glue supply tank to the outside; the glue supply tank to be cleaned is the first glue supply tank and / or the second glue supply tank and / or the third glue supply tank and / or the fourth glue supply tank.

[0065] Specifically, after the second pipe is opened for a preset time, it is closed, and after a preset time, the first and third pipes are closed.

[0066] See Figure 4 When cleaning the glue supply tank, the second pipe of the tank is opened to inject cleaning fluid. During the replenishment process, the third pipe is kept closed to prevent cleaning fluid from flowing out. When cleaning the glue supply tank, the cleaning fluid may be driven into it by gas or other means, and gas is also present in the tank. Therefore, the first pipe is opened to expel the gas during the cleaning process. As the cleaning fluid continues to clean the glue supply tank, the mixture of cleaning fluid and glue will fill it. At this point, the mixture will be continuously discharged from the second pipe. The first inlet is located at the top of the glue supply tank to ensure smooth gas discharge. After the tank is filled with cleaning fluid and glue, the mixture is gradually discharged as more cleaning fluid enters.

[0067] After the second pipe is opened for a preset time, the cleaning is considered complete. At this time, the second pipe is closed and the cleaning fluid supply to the glue supply tank to be cleaned is stopped. After the preset time, the first and third pipes are closed to allow the liquid in the glue supply tank to be cleaned to be discharged.

[0068] By keeping the third pipe corresponding to the glue supply tank to be cleaned closed, the cleaning solution is prevented from flowing out of the third pipe during the cleaning process, which would affect the cleaning effect. By opening the first and second pipes corresponding to the glue supply tank to be cleaned, the gas inside the glue supply tank to be cleaned is ensured to be smoothly discharged during the cleaning process. This avoids the problem that the gas inside the glue supply tank to be cleaned occupies the internal volume of the glue supply tank to be cleaned, and the cleaning solution cannot fully clean the inner wall of the glue supply tank to be cleaned.

[0069] By adopting the technical solution of this application, in response to the glue replacement command, the first glue supply tank and the second glue supply tank are closed, and the third glue supply tank and / or the fourth glue supply tank are switched to supply glue externally, thereby realizing the free switching of the glue type supplied, and thus quickly meeting the glue requirements of different production. In response to the glue volume in the third glue supply tank being less than the preset glue volume, the glue supply is switched from the third glue supply tank to the fourth glue supply tank to supply glue externally, ensuring that the glue supply tank does not interrupt the glue supply process, thereby ensuring the continuous operation of the glue-using equipment and thus ensuring the continuous output of products. After switching from the third to the fourth glue supply tank for external glue supply, the third glue supply tank is replenished to ensure that the glue in the third glue supply tank can be quickly replenished. This ensures that the third glue supply tank can continuously supply glue when used again in the future, providing a basis for replenishing the glue in the fourth glue supply tank. In response to the glue level in the fourth glue supply tank falling below the preset glue level, the system switches back to the third glue supply tank for external glue supply. This ensures that the glue supply process is uninterrupted, allowing the glue-using equipment to operate continuously and guaranteeing continuous product output. Similarly, after switching from the fourth to the third glue supply tank for external glue supply, the fourth glue supply tank is replenished to ensure that the glue in the fourth glue supply tank can be quickly replenished. This ensures that the fourth glue supply tank can continuously supply glue when used again in the future, providing a basis for replenishing the glue in the third glue supply tank.

[0070] Example 3

[0071] Figure 5 This invention provides a structural block diagram of a glue supply device, applicable to situations where glue supply is interrupted during external supply. The glue supply device can be implemented in hardware and / or software and can be configured in an electronic device with data processing capabilities. Figure 5 As shown, the glue supply device of this embodiment may include: a first glue supply switching module 310 and a second glue supply switching module 320. Wherein:

[0072] The first glue supply switching module 310 is used to switch from the first glue supply tank to the second glue supply tank to supply glue externally when the glue quantity in the first glue supply tank is less than the preset glue quantity, and to replenish the glue in the first glue supply tank; the first glue supply tank and the second glue supply tank contain the same type of glue; the first glue supply tank is the glue supply tank that is currently supplying glue.

[0073] The second glue supply switching module 320 is used to switch from the second glue supply tank to the first glue supply tank to supply glue externally when the amount of glue in the second glue supply tank is less than the preset amount of glue, and to replenish the glue in the second glue supply tank.

[0074] Optionally, based on the above embodiments, after the second glue supply switching module 320, the following further component is included:

[0075] In response to the glue change command, the glue supply of the first glue supply tank and the second glue supply tank is stopped, and the third glue supply tank is opened. The glue type of the second glue supply tank is different from that of the third glue supply tank.

[0076] If the amount of glue in the third glue supply tank is less than the preset amount, the system switches from the third glue supply tank to the fourth glue supply tank and replenishes the glue in the third glue supply tank; the type of glue in the third glue supply tank and the fourth glue supply tank is the same.

[0077] If the amount of glue in the fourth glue supply tank is less than the preset amount, the system switches from the fourth glue supply tank to the third glue supply tank to supply glue externally, and replenishes the glue in the fourth glue supply tank.

[0078] Based on the above embodiments, optionally, replenishing the glue supply tank includes:

[0079] The first and second pipes corresponding to the glue supply tank to be repaired are opened, while the third pipe remains closed. The first pipe is connected to the first interface of the glue supply tank to be repaired, and the first interface is located at the top of the glue supply tank to be repaired. The second pipe enters the glue supply tank to be repaired from the second interface, and the second interface is located at the bottom of the glue supply tank to be repaired. The third pipe is connected to the third interface, and the third interface is located at the bottom of the glue supply tank to be repaired. The second pipe is used to supply glue to the glue supply tank to be repaired. The first pipe is used to discharge gas inside the glue supply tank to be repaired when the second pipe supplies glue to the glue supply tank to be repaired. The third pipe is the pipe for supplying glue from the glue supply tank to the outside. The glue supply tank to be repaired is the first glue supply tank and / or the second glue supply tank and / or the third glue supply tank and / or the fourth glue supply tank.

[0080] Optionally, based on the above embodiments, the device further includes:

[0081] A cleaning module is used to open the first and second pipes corresponding to the glue supply tank to be cleaned, while keeping the third pipe closed. The first pipe is connected to a first interface of the glue supply tank to be cleaned, located at the top of the glue supply tank. The second pipe enters the glue supply tank to be cleaned from a second interface, located at the bottom of the glue supply tank. The third pipe is connected to a third interface, located at the bottom of the glue supply tank. The second pipe is used to inject cleaning fluid into the glue supply tank to be cleaned. The first pipe is used to discharge the mixture of cleaning fluid and glue in the glue supply tank to be cleaned when the second pipe injects cleaning fluid into the glue supply tank to be cleaned. The third pipe is a pipe for supplying glue from the glue supply tank to the outside. The glue supply tank to be cleaned is a first glue supply tank and / or a second glue supply tank and / or a third glue supply tank and / or a fourth glue supply tank.

[0082] Based on the above embodiments, optionally, after the second pipe is opened for a preset time, the second pipe is closed, and the first pipe and the third pipe are closed after the preset time.

[0083] Based on the above embodiments, optionally, determining the amount of adhesive in the adhesive supply tank includes:

[0084] Determine the glue level in the glue supply tank;

[0085] The amount of glue in the glue supply tank is determined based on the glue level in the supply tank, the volume of the supply tank, and the glue supply flow rate.

[0086] Based on the above embodiments, optionally, determining the glue level in the first glue supply tank includes:

[0087] The level of adhesive in the first adhesive supply tank is determined based on a liquid level sensor. The liquid level sensor is installed at a first position and a second position, which are located on the side of the adhesive supply tank. The first position is located at a first preset distance from the top of the adhesive supply tank, and the second position is located at a first preset distance from the bottom of the adhesive supply tank.

[0088] The glue supply device provided in this embodiment of the invention can execute the glue supply method provided in any embodiment of the invention. In response to the glue volume in the first glue supply tank being less than a preset glue volume, it switches from the first glue supply tank to the second glue supply tank for external glue supply. This ensures that the glue supply from the first glue supply tank is uninterrupted, thereby ensuring the continuous operation of the glue-using equipment and the continuous production of products. After switching from the first glue supply tank to the second glue supply tank, the first glue supply tank is replenished to ensure that the glue in the first glue supply tank can be quickly replenished. This ensures that the first glue supply tank can continuously supply glue when used again, providing a basis for replenishing the second glue supply tank. Similarly, in response to the glue volume in the second glue supply tank being less than a preset glue volume, it switches from the second glue supply tank to the first glue supply tank for external glue supply. This ensures that the glue supply from the first glue supply tank is uninterrupted, thereby ensuring the continuous operation of the glue-using equipment and the continuous production of products. After switching from the second glue supply tank to the first glue supply tank for external glue supply, the second glue supply tank is replenished to ensure that the glue in the second glue supply tank can be quickly replenished. This ensures that the second glue supply tank can continuously supply glue when used again in subsequent uses, providing a basis for replenishing the glue in the first glue supply tank. By adopting the above technical solution, glue is supplied externally through the circulation of the first and second glue supply tanks, and glue is replenished in the glue supply tank with low glue levels during the supply process, thereby achieving continuous glue supply. This allows the glue-using equipment to operate continuously, improving production efficiency.

[0089] Example 4

[0090] Figure 6 A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0091] like Figure 6 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0092] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0093] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as adhesive dispensing methods.

[0094] In some embodiments, the adhesive dispensing method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the adhesive dispensing method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the adhesive dispensing method by any other suitable means (e.g., by means of firmware).

[0095] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0096] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0097] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0098] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0099] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0100] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0101] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0102] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for supplying adhesive, characterized in that, include: In response to the glue level in the first glue supply tank being less than the preset glue level, the glue supply is switched from the first glue supply tank to the second glue supply tank, and the first glue supply tank is replenished with glue. The first glue supply tank and the second glue supply tank contain the same type of glue. The first glue supply tank is the glue supply tank that is currently supplying glue. If the amount of glue in the second glue supply tank is less than the preset amount of glue, the system switches from the second glue supply tank to the first glue supply tank to supply glue externally, and replenishes the glue in the second glue supply tank.

2. The method according to claim 1, characterized in that, After replenishing the second glue supply tank, the process also includes: In response to the glue replacement command, the glue supply of the first glue supply tank and the second glue supply tank is stopped, and the third glue supply tank is opened. The glue type of the second glue supply tank is different from that of the third glue supply tank. If the amount of glue in the third glue supply tank is less than the preset amount of glue, the system switches from the third glue supply tank to the fourth glue supply tank and replenishes the glue in the third glue supply tank; the type of glue in the third glue supply tank and the fourth glue supply tank is the same. If the amount of glue in the fourth glue supply tank is less than the preset amount of glue, the system switches from the fourth glue supply tank to the third glue supply tank to supply glue externally, and replenishes the glue in the fourth glue supply tank.

3. The method according to claim 2, characterized in that, Replenishing the glue supply tank includes: The first and second pipes corresponding to the glue supply tank to be repaired are opened, while the third pipe remains closed. The first pipe is connected to the first interface of the glue supply tank to be repaired, and the first interface is located at the top of the glue supply tank to be repaired. The second pipe enters the glue supply tank to be repaired from the second interface, and the second interface is located at the bottom of the glue supply tank to be repaired. The third pipe is connected to the third interface, and the third interface is located at the bottom of the glue supply tank to be repaired. The second pipe is used to supply glue to the glue supply tank to be repaired. The first pipe is used to discharge gas inside the glue supply tank to be repaired when the second pipe supplies glue to the glue supply tank to be repaired. The third pipe is the pipe for supplying glue from the glue supply tank to the outside. The glue supply tank to be repaired is the first glue supply tank and / or the second glue supply tank and / or the third glue supply tank and / or the fourth glue supply tank.

4. The method according to claim 2, characterized in that, The method further includes: The first and second pipes corresponding to the glue supply tank to be cleaned are opened, while the third pipe remains closed. The first pipe is connected to the first interface of the glue supply tank to be cleaned, which is located at the top of the glue supply tank. The second pipe enters the glue supply tank to be cleaned from the second interface, which is located at the bottom of the glue supply tank. The third pipe is connected to the third interface, which is located at the bottom of the glue supply tank. The second pipe is used to inject cleaning fluid into the glue supply tank to be cleaned. The first pipe is used to discharge the mixture of cleaning fluid and glue in the glue supply tank to be cleaned when the second pipe injects cleaning fluid into the glue supply tank to be cleaned. The third pipe is the pipe for supplying glue from the glue supply tank to the outside. The glue supply tank to be cleaned is the first glue supply tank and / or the second glue supply tank and / or the third glue supply tank and / or the fourth glue supply tank.

5. The method according to claim 4, characterized in that, After the second pipe is opened for a preset time, the second pipe is closed, and the first and third pipes are closed after the preset time.

6. The method according to claim 1, characterized in that, Determine the amount of glue in the glue supply tank, including: Determine the glue level in the glue supply tank; The amount of glue in the glue supply tank is determined based on the glue level in the supply tank, the volume of the supply tank, and the glue supply flow rate.

7. The method according to claim 6, characterized in that, Determining the glue level in the first glue supply tank includes: The level of adhesive in the first adhesive supply tank is determined based on a liquid level sensor. The liquid level sensor is installed at a first position and a second position, which are located on the side of the adhesive supply tank. The first position is located at a first preset distance from the top of the adhesive supply tank, and the second position is located at a first preset distance from the bottom of the adhesive supply tank.

8. A glue supply device, characterized in that, include: The first glue supply switching module is used to switch from the first glue supply tank to the second glue supply tank to supply glue externally when the glue quantity in the first glue supply tank is less than the preset glue quantity, and to replenish the glue in the first glue supply tank; the first glue supply tank and the second glue supply tank contain the same type of glue; the first glue supply tank is the glue supply tank that is currently supplying glue. The second glue supply switching module is used to switch from the second glue supply tank to the first glue supply tank to supply glue externally when the amount of glue in the second glue supply tank is less than the preset amount of glue, and to replenish the glue in the second glue supply tank.

9. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the glue supply method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the glue supply method according to any one of claims 1-7.

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