Wafer chuck force threshold detection device

Abstract

The application belongs to the technical field of detection equipment and relates to a clamping force threshold detection device of a wafer clamp, comprising: a clamping mechanism; a detection mechanism comprising a rotating mechanism and an indicating mechanism, the indicating mechanism being fixedly connected with the clamping mechanism, the rotating mechanism being connected with the indicating mechanism through a first elastic member, and the rotating mechanism and the indicating mechanism being rotatably connected; the detection mechanism is configured to: when the clamping mechanism clamps a wafer, the rotating mechanism receives a force that rotates it, the force is conducted to the indicating mechanism, the clamping mechanism and the wafer through the first elastic member, and when the force makes the wafer start to slip relative to the wafer clamp, the indicating mechanism indicates the clamping force threshold of the wafer clamp through the relative position change amount of the indicating mechanism and the rotating mechanism in the circumferential direction. The clamping force threshold of the wafer clamp can be detected through a simple structure, the mechanism of the detection device is simple, operation is convenient, cost is saved, and the accuracy of detection can be ensured.

Description

Technical Field

[0001] This invention belongs to the field of testing equipment technology, and specifically relates to a device for detecting the clamping force threshold of a wafer jig. Background Technology

[0002] In disk processing, especially wafer processing, to ensure wafer quality, the relative position of the wafer and the wafer jig must remain constant. However, in actual processes, wafer slippage relative to the jig is frequently observed, making it difficult to guarantee wafer processing quality. Please refer to [link to relevant documentation] for details. Figure 1 , Figure 2 , Figure 1 This diagram illustrates a wafer clamping configuration. Figure 2 A schematic diagram of a wafer clamping fixture in two states is shown. Figure 1 As shown, mark A is made on wafer 700, and then wafer 700 is placed on wafer jig 600. At this time, mark A on wafer 700 corresponds to scale C on wafer jig 600. Then the process is performed. After the wafer process is completed, as shown... Figure 2 As shown, mark A on wafer 700 has moved to the position of mark B on wafer jig 600. This indicates that mark A moved relative to wafer jig 600 during the process, suggesting that wafer 700 slipped during the process.

[0003] Slippage is generally related to wafer inertia, vibration during fixture operation, cleaning fluid impact, or other process conditions. However, when the clamping force of the fixture is large enough, wafer slippage can be avoided. Therefore, it is necessary to quantify the magnitude of the external force that causes wafer slippage and to perform pre-process inspection on each set of wafer fixtures to ensure that the wafer fixtures have sufficient clamping force to stably hold the wafer during the process. To this end, this application proposes a clamping force threshold detection device for wafer fixtures. Summary of the Invention

[0004] In order to clearly understand the clamping force threshold of wafer jigs, this application proposes a wafer jig clamping force threshold detection device to perform preprocess wafer clamping force threshold detection on each set of wafer jigs, so as to adjust the clamping force of the wafer jigs and thus ensure that the wafer jigs can stably hold the wafers during the process.

[0005] This application discloses a wafer clamping force threshold detection device, comprising:

[0006] Clamping mechanism, used to clamp wafers;

[0007] The detection mechanism includes a rotating mechanism and an indicating mechanism. The indicating mechanism is fixedly connected to the clamping mechanism, and the rotating mechanism is connected to the indicating mechanism via a first elastic element. The rotating mechanism and the indicating mechanism are rotatably connected. The detection mechanism is configured such that when the clamping mechanism clamps the wafer, the rotating mechanism receives a force that causes it to rotate. The force is transmitted to the indicating mechanism, the clamping mechanism, and the wafer via the first elastic element. When the force causes the wafer to begin to slide relative to the wafer jig, the indicating mechanism indicates the clamping force threshold of the wafer jig by the amount of relative position change between the indicating mechanism and the rotating mechanism in the circumferential direction.

[0008] The wafer jig clamping force threshold detection device of the present invention, through a simple mechanical structure design, can achieve accurate detection of the wafer jig clamping force threshold, avoiding the setting of high-cost components such as sensors, amplifiers, and controllers, thus reducing production costs. At the same time, the detection device of the present application embodiment does not require power supply, making it convenient to operate when detecting the clamping force threshold of the wafer jig.

[0009] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 A schematic diagram of a wafer clamping state according to an embodiment of the present invention is shown;

[0012] Figure 2 A schematic diagram of a wafer clamping fixture in two states according to an embodiment of the present invention is shown;

[0013] Figure 3 A schematic diagram of the clamping force threshold detection device for a wafer jig according to an embodiment of the present invention is shown;

[0014] Figure 4 A schematic diagram of the wafer release state structure of the clamping force threshold detection device of the wafer jig according to an embodiment of the present invention is shown;

[0015] Figure 5A schematic diagram of the wafer clamping force threshold detection device of the wafer jig according to an embodiment of the present invention is shown.

[0016] Figure 6 A partial structural schematic diagram of a clamping force threshold detection device for a wafer jig according to an embodiment of the present invention is shown;

[0017] Figure 7 A partial cross-sectional schematic diagram of a wafer jig clamping force threshold detection device according to an embodiment of the present invention is shown; and

[0018] Figure 8 A top-view schematic diagram of the clamping force threshold detection device for a wafer jig according to an embodiment of the present invention is shown during the detection process. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figures 1 to 2 As shown, during wafer fabrication, wafer 700 is placed on wafer jig 600 and held by the jig. Wafer jig 600 includes multiple locating pins 601, which work together to hold wafer 700 at its edge. If wafer 700 slips during fabrication, the quality of wafer fabrication will be difficult to guarantee, and may even be damaged. Therefore, before implementing the corresponding process on each wafer fabrication machine, the clamping force threshold of wafer jig 600 needs to be checked. If the clamping force threshold of wafer jig 600 is found to be too low and does not meet production requirements, the clamping force of wafer jig 600 needs to be adjusted until the clamping force threshold meets the requirements, thereby ensuring the fabrication quality of wafer 700. Specifically, as... Figure 1As shown, before the process begins, wafer 700 is placed on wafer jig 600, and all positioning pins 601 of wafer jig 600 are locked. If the clamping force of wafer jig 600 is large enough, wafer 700 remains stationary relative to wafer jig 600. That is, during the process, mark A corresponds to scale C on wafer jig 600 from before the process begins until after the process ends. Once the clamping force threshold of wafer jig 600 is less than the inertial force of wafer 700 during the process, wafer 700 will slip, and the marked position will shift compared to before the process begins. That is, during the process, mark A shifts from scale C on wafer jig 600 before the process begins until after the process ends. Figure 2 The position corresponding to scale B on the wafer fixture 600 will greatly reduce the yield of wafer processing.

[0021] To address the aforementioned issues, existing wafer jig clamping force threshold detection equipment almost always employs a combination of electronic components such as sensors, amplifiers, and controllers for measurement. This not only increases the detection cost but also requires powering on the detection device during the process, making operation cumbersome and increasing the cost of the device itself. This invention proposes a wafer jig clamping force threshold detection device, which achieves wafer jig clamping force threshold detection through a simple physical structure. Figure 3 , Figure 4 , Figure 5 As shown, the detection device includes a clamping mechanism 100 and a detection mechanism 300. The clamping mechanism 100 is used to clamp a wafer 700; the detection mechanism 300 includes a rotating mechanism and an indicating mechanism. The indicating mechanism is fixedly connected to the clamping mechanism 100, and the rotating mechanism and the indicating mechanism are connected through a first elastic element. The rotating mechanism and the indicating mechanism are rotatably connected. The detection mechanism 300 is configured such that when the clamping mechanism 100 clamps the wafer 700, the rotating mechanism receives a force that causes it to rotate. This force is transmitted to the indicating mechanism, the clamping mechanism 100, and the wafer 700 through the first elastic element. When the force causes the wafer 700 to begin to slide relative to the wafer jig 600, the indicating mechanism indicates the clamping force threshold of the wafer jig by the amount of relative position change between the indicating mechanism and the rotating mechanism in the circumferential direction. This application can achieve the detection of the clamping force threshold of the wafer jig through a simple structure. The detection device has a simple structure, is easy to operate, saves costs, and ensures the accuracy of the detection.

[0022] The specific structure and detection process of the detection device of this application are described below by way of example.

[0023] Please continue to refer to Figure 3 , Figure 4 , Figure 5 In this embodiment, the clamping mechanism 100 includes a support member 110 and a plurality of clamping members. The plurality of clamping members are connected to the support member 110 and are arranged radially around the support member 110. The clamping members are used to clamp the edge of the wafer 700. Specifically, the clamping members include a first clamping structure 120 and a second clamping structure 130. The first clamping structure 120 includes a connecting portion 121 and a clamping portion 122. One end of the connecting portion 121 is connected to the support member 110, and the other end of the connecting portion 121 is connected to the clamping portion 122. It should be noted that the connecting portion 121 can also be integrally designed with the clamping portion 122. When the connecting portion 121 and the clamping portion 122 are integrally designed, the clamping portion 122 is a structure formed by the connecting portion 121 extending away from the support member 110. The second clamping structure 130 includes a fitting portion 131 and a hook-shaped portion 132. The clamping portion 122 of the first clamping structure 120 is movably connected to the contact portion 131 of the second clamping structure 130. The hook-shaped portion 132 of the second clamping structure 130 is formed by extending a certain distance from the end of the contact portion 131 away from the clamping portion 122 toward the support member 110. The clamping member is configured such that by adjusting the position of the contact portion 131 of the second clamping structure 130, the hook-shaped portion 132 of the second clamping structure 130 approaches or moves away from the clamping portion 122 of the first clamping structure 120, so as to clamp or release the edge of the wafer 700 respectively.

[0024] In one embodiment, to stably clamp the wafer 700 and ensure that the wafer 700 is subjected to uniform force, a plurality of first clamping structures 120 are circumferentially equidistantly distributed on the outer side of the support member 110. In this embodiment, the support member 110 is a cylindrical structure; the plurality of first clamping structures 120 are arranged radially outward from the support member 110, and the included angle between two adjacent first clamping structures 120 is equal. When clamping the wafer 700, the contact portion 131 of the second clamping structure 130 is rotated inward, causing the hook-shaped portion 132 to approach the clamping portion 122 of the first clamping structure 120, so as to achieve the purpose of clamping the edge of the wafer 700; when it is necessary to release the wafer 700, the contact portion 131 of the second clamping structure 130 is rotated outward, causing the hook-shaped portion 132 to move away from the clamping portion 122 of the first clamping structure 120, so as to achieve the purpose of releasing the edge of the wafer 700. For example, the second clamping structure 130 can be connected to the clamping part 122 of the first clamping structure 120 via a torsion spring, damping, or other connecting member, so that the second clamping structure 130 can rotate inward or outward. It should be understood that other structures can be selected to achieve the rotation of the second clamping structure 130, and no specific limitation is made here.

[0025] Specifically, please continue to refer to Figure 3In this embodiment, the connecting portion 121 of the first clamping structure 120 has a rod-shaped structure. One end of the connecting portion 121 is connected to the support member 110, and the end of the connecting portion 121 away from the support member 110 extends in a direction away from the support member 110 to form a clamping portion 122. The clamping portion 122 and the connecting portion 121 are set at an obtuse angle. The obtuse angle allows the clamping portion 122 to tilt outward and upward at a certain angle, which facilitates its cooperation with the second clamping structure 130 to clamp the edge of the wafer 700 during the testing process. The lower end surface of the clamping portion 122 is in contact with the upper end surface of the edge of the wafer 700 when clamping the wafer 700. At the same time, the outer side of the clamping portion 122 is in contact with the contact portion 131 of the second clamping structure 130. One end of the fitting portion 131 of the second clamping structure 130 is hinged to the end of the clamping portion 122 away from the connecting portion 121. The other end of the fitting portion 131 extends toward the support member 110 to form a hook-shaped portion 132. The hook-shaped portion 132 clamps or releases the wafer 700 by approaching or moving away from the lower end face of the clamping portion 122. When clamping the wafer 700, the inner side of the fitting portion 131 fits against the outer side of the clamping portion 122. The inclined clamping portion 122 can support the fitting portion 131 and also ensure that the hook-shaped portion 132 can be basically horizontal during the clamping process, so that the hook-shaped portion 132 fits against the lower end face of the edge of the wafer 700.

[0026] Furthermore, in order to ensure that the clamping force threshold detection is performed normally, the clamping force threshold of the clamping mechanism 100 is required to be greater than the clamping force threshold of the wafer jig 600. Therefore, in this embodiment, a rubber pad 140 is provided on the side of the hook-shaped part 132 near the lower end face of the clamping part 122, and a rubber pad (not shown) may also be provided on the lower end face of the clamping part 122 to ensure that sufficient friction can be provided when clamping the wafer 700, so as to ensure that the wafer 700 remains relatively stationary with the first clamping structure 120 and the second clamping structure 130 during the clamping process, thereby ensuring the accuracy of the detection.

[0027] Furthermore, to facilitate the clamping or releasing of the wafer 700 by the clamping mechanism 100, the detection device also includes an adjustment mechanism 200. Please refer to [link / reference needed]. Figure 3 , Figure 4 and Figure 5The adjusting mechanism 200 is connected to the contact portion 131 of the second clamping structure 130 and is used to adjust the position of the contact portion 131 of the second clamping structure 130, so that the contact portion 131 of the second clamping structure 130 drives the hook-shaped portion 132 to move closer to or away from the lower end face of the clamping portion 122 of the first clamping structure 120, so as to clamp or release the edge of the wafer 700 respectively. The end of the connecting rod 220 that is movably connected to the contact portion 131 of the second clamping structure 130 is the connecting end. Specifically, the adjusting mechanism 200 includes a connecting rod 220, one end of which is movably connected to the contact portion 131 of the second clamping structure 130. The connecting rod 220 is used to drive the contact portion 131 of the second clamping structure 130 to rotate, thereby driving the hook-shaped portion 132 to move closer to or away from the lower end face of the clamping portion 122 of the first clamping structure 120.

[0028] For example, the contact portion 131 of the second clamping structure 130 is hinged to the clamping portion 122 of the first clamping structure 120, and the connecting end 221 of the connecting rod 220 is hinged to the contact portion 131 of the second clamping structure 130. As the hook-shaped portion 132 of the second clamping structure 130 moves away from or towards the connecting portion 121 of the first clamping structure 120, the end of the connecting rod 220 moving away from the second clamping structure 130 rotates vertically around the connecting end 221, thereby causing the contact portion 131 of the second clamping structure 130 to move the hook-shaped portion 132 away from or towards the connecting portion 121 of the first clamping structure 120. It should be understood that because the length of the connecting rod 220 is much longer than the trajectory of its rotation around the connecting end 221, the trajectory of the connecting rod 220 moving away from the second clamping structure 130 around the connecting end 221 can be approximately understood as a vertical movement. When the first clamping structure 120 and the second clamping structure 130 clamp the wafer 700, the connecting rod 220 is parallel to the surface of the wafer 700, that is, the angle between the connecting rod 220 and the surface of the wafer 700 is 0. In other embodiments, this angle may not be 0. When the clamping mechanism 100 needs to release the wafer 700, as the connecting rod 220 rotates in the vertical direction, an angle is formed between the connecting rod 220 and the wafer 700. As the end of the connecting rod 220 away from the second clamping structure 130 moves upward, the angle continues to increase. The contact portion 131 of the second clamping structure 130 is driven to rotate outward, causing the hook-shaped portion 132 to move away from the clamping portion 122 of the first clamping structure 120, and the clamping mechanism 100 releases the wafer 700.

[0029] In one specific embodiment, the adjusting mechanism 200 further includes a slider 210, please refer to... Figure 3 , Figure 4 and Figure 5One end of the connecting rod 220 away from the second clamping structure 130 is movably connected to the slider 210. The vertical movement of the slider 210 causes the end of the connecting rod 220 away from the second clamping structure 130 to move vertically as well. That is, the connecting rod 220 rotates vertically around the connecting end 221, thereby causing the contact portion 131 of the second clamping structure 130 to rotate, and consequently causing the hook-shaped portion 132 to move away from or towards the lower end face of the clamping portion 122 of the first clamping structure 120, respectively for clamping or releasing the wafer 700. In this embodiment, to allow the slider 210 to slide more smoothly in the vertical direction, a guide member 230 matching the slider 210 is provided. Specifically, the guide member 230 can be optionally provided on the support member 110 to assist the slider 210 in moving vertically. The exemplary guide member 230 can be a slide rail, a columnar structure, a rod-like structure, etc. This document does not specifically limit the specific structure of the guide member that plays a guiding role. Other structures that can guide the slider 210 to move in the vertical direction are all within the protection scope of this embodiment.

[0030] To more clearly explain the operating principle of the detection device of this application, the guide member 230 is described by way of example. In this embodiment, the guide member 230 is a rod-shaped structure, and the guide member 230 passes through the slider 210. In specific implementation, there are three guide members 230, which are arranged in a circle; the slider 210 has sliding holes corresponding to the number of guide members 230, and each guide member 230 passes through the corresponding sliding hole of the slider 210, so that the slider 210 can slide along the guide member 230.

[0031] Furthermore, the adjustment mechanism 200 also includes a second elastic element 240, which is disposed between the slider 210 and the support member 110. When the elastic force provided by the second elastic element 240 is a force that causes the slider 210 to move downward, the slider 210 drives the end of the connecting rod 220 away from the second clamping structure 130 to move vertically downward, thereby causing the contact portion of the second clamping structure 130 to rotate inward, and then causing the hook-shaped portion 132 to move closer to the clamping portion 122 to clamp the edge of the wafer 700. When the elastic force provided by the second elastic element 240 is a force that causes the slider 210 to move upward, the slider 210 drives the end of the connecting rod 220 away from the second clamping structure 130 to move vertically upward, thereby causing the contact portion of the second clamping structure 130 to rotate outward, and then causing the hook-shaped portion 132 to move away from the clamping portion 122 to release the edge of the wafer 700. Exemplarily, in this embodiment, the second elastic element 240 is a spring. In this embodiment, when no force is applied, the second elastic member 240 is in a natural state or a compressed state, and at this time the clamping mechanism 100 is in the state of clamping the wafer 700. Before testing, an upward force is applied to the slider 210, causing it to move away from the support member 110 and causing the second elastic member 240 to change from a natural or compressed state to a stretched state. At this time, the second clamping structure 130 moves away from the first clamping structure 120, and the clamping mechanism 100 fails to clamp the wafer 700. When it is necessary to clamp the wafer 700, the force applied to the slider 210 is removed or a downward force is applied to the slider 210. The second elastic member 240 tends to return to its natural or compressed state from the stretched state. The second elastic member 240 then causes the slider 210 to move downward, causing the end of the connecting rod 220 away from the second clamping structure 130 to move vertically downward. The connecting rod 220 causes the second clamping structure 130 to rotate, and the second clamping structure 130 moves closer to the first clamping structure 120, thereby clamping the wafer 700. When the test is completed and the wafer 700 needs to be released, the force applied to the slider 210 is removed or an upward force is applied to the slider 210. The second elastic element 240 changes from a natural or compressed state to a stretched state. The upward force applied to the slider 210 causes the slider 210 to move upward. The connecting rod 220 drives the second clamping structure 130 to rotate. The second clamping structure 130 moves away from the first clamping structure 120, thereby releasing the wafer 700.

[0032] Please refer to Figure 4 , Figure 5 , Figure 6 and Figure 7The detection mechanism 300 includes a rotating mechanism and an indicating mechanism. The rotating mechanism includes an outer disk 360 with an indicating port 361. The indicating mechanism includes an inner disk 320 and a pointer 340. The outer disk 360 is fitted onto the inner disk 320 and can rotate around the inner disk 320. The pointer 340 is connected to the inner disk 320 and passes through the indicating port 361 to the outside of the outer disk 360. A scale corresponding to the pointer 340 is provided above the indicating port of the outer disk 360.

[0033] The testing mechanism 300 also includes a chassis 310, which is located below and fixedly connected to the inner chassis 320. The chassis 310 is connected to the support member 110 of the clamping mechanism via a guide member 230; that is, the chassis 310 is connected to the end of the guide member 230 away from the support member 110. The chassis 310 enables the connection between the testing mechanism and the clamping mechanism.

[0034] Furthermore, the detection mechanism 300 also includes a bearing 330 to allow the outer disk 360 and the inner disk 320 to rotate relative to each other. Specifically, the bearing 330 is sleeved on the outside of the inner disk 320, connecting the outer wall of the inner disk 320 to the inner wall of the bearing 330; the outer disk 360 is sleeved on the bearing 330, and the inner wall of the outer disk 360 is connected to the outer wall of the bearing 330. The outer disk 360 and the inner disk 320 are connected by a first elastic member 350. For example, the first elastic member 350 is a spring, with one end connected to the inner disk 320 and the other end connected to the inner wall of the outer disk 360. During the process of applying a force to rotate the outer disk 360, the force is transmitted through the outer disk 360 to the first elastic element 350. As the force increases, the first elastic element 350 undergoes elastic deformation. Simultaneously, the first elastic element 350 transmits the received force to the inner disk 320. Then, the force is transmitted sequentially through the inner disk 320 to the guide 230, support 110, first clamping structure 120, second clamping structure 130, and wafer 700, causing the wafer 700 to receive a force that causes it to slip. After the force is transmitted to the inner disk 320, the relative position of the inner disk 320 and the outer disk 360 changes. Since the pointer 340 is fixed on the inner disk 320, the change in the relative position of the indicating mechanism and the rotating mechanism in the circumferential direction is outwardly manifested as a change in the relative position of the pointer 340 and the outer disk 360. When the force applied to the outer disk 360 reaches the clamping force threshold of the wafer jig 600, i.e., when the wafer 700 slips, the clamping force threshold of the wafer jig 600 is calculated based on the deformation of the first elastic element 350. This threshold is indicated by the pointer 340 and the scale on the outer disk 360. The scale above the indicator on the outer disk 360 corresponds to the deformation of the first elastic element 350 under different forces. Then, the clamping force threshold of the wafer jig 600 is calculated using Hooke's law of elasticity. Furthermore, there can be multiple first elastic elements 350. When the number of first elastic elements 350 is greater than one, the multiple first elastic elements 350 are arranged symmetrically about the center of the rotating mechanism. In this embodiment, they can be arranged symmetrically about the center of the inner disk 320 or the outer disk 360 to maintain the stability of the detection device.

[0035] In one embodiment, for ease of operation, the detection device further includes a first handle 400, please refer to... Figure 4 , Figure 7One end of the first handle 400 is connected to the slider 210. The first handle 400 moves sequentially through the base 310, inner plate 320, and outer plate 360, extending above the outer plate 360. By applying an upward or downward force to the first handle 400, the up and down movement of the slider 210 can be easily and quickly adjusted, thereby causing the connecting rod 220 and the hook-shaped part 132 of the second clamping structure 130 to move closer to or away from the first clamping structure 120, thus quickly achieving the purpose of clamping or releasing the wafer 700.

[0036] Furthermore, please refer to Figure 6 , Figure 8 The detection device also includes a second handle 500, which is connected to the outer disk 360 and is used to drive the outer disk 360 to rotate. When it is desired to rotate the outer disk 360, a rotational force can be applied directly to the second handle 500, which will then drive the outer disk 360 to rotate, making operation more convenient.

[0037] During testing, the wafer 700 is first placed on the wafer jig 600, which holds the wafer 700. Then, the testing device of this embodiment is used to test the clamping force threshold of the wafer jig 600. It is worth noting that when the wafer 700 is held by the clamping mechanism of the testing device of this application, the clamping position of the clamping mechanism and the clamping position of the wafer jig 600 should be staggered to ensure that even if the wafer slips during the process of rotating the testing mechanism to measure the clamping force threshold of the wafer jig 600, there will be no collision between the clamping mechanism and the wafer jig 600; and the clamping position of the clamping mechanism and the clamping position of the wafer jig 600 will not interfere with each other.

[0038] The detection device of this application embodiment, through a simple mechanical structure design, can achieve accurate detection of the wafer jig clamping force threshold, avoiding the setting of high-cost components such as sensors, amplifiers, and controllers, thus reducing production costs. At the same time, the detection device of this application embodiment does not require power supply, making it convenient to operate when detecting the wafer jig clamping force threshold.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for detecting the clamping force threshold of a wafer jig, characterized in that, include: Clamping mechanism, used to clamp wafers; The detection mechanism includes a rotating mechanism and an indicating mechanism. The indicating mechanism is fixedly connected to the clamping mechanism, and the rotating mechanism is connected to the indicating mechanism via a first elastic element. The rotating mechanism and the indicating mechanism are rotatably connected. The detection mechanism is configured such that when the clamping mechanism clamps the wafer, the rotating mechanism receives a force that causes it to rotate. The force is transmitted to the indicating mechanism, the clamping mechanism, and the wafer via the first elastic element. When the force causes the wafer to begin to slide relative to the wafer jig, the indicating mechanism indicates the clamping force threshold of the wafer jig by the amount of relative position change between the indicating mechanism and the rotating mechanism in the circumferential direction.

2. The clamping force threshold detection device for a wafer jig according to claim 1, characterized in that, The clamping mechanism includes a support member and a plurality of clamping members. The plurality of clamping members are connected to the support member and are arranged radially around the support member. The clamping members are used to clamp the edge of the wafer.

3. The wafer clamping force threshold detection device according to claim 2, characterized in that, The clamping member includes a first clamping structure and a second clamping structure. The first clamping structure includes a connecting part and a clamping part, one end of the connecting part is connected to the support member, and the other end of the connecting part is connected to the clamping part; The second clamping structure includes a fitting part and a hook-shaped part. The fitting part is movably connected to the clamping part of the first clamping structure. The hook-shaped part is a structure formed by extending a certain distance from the end of the fitting part away from the clamping part toward the support member. The clamping member is configured such that by adjusting the position of the contact portion of the second clamping structure, the contact portion of the second clamping structure causes the hook-shaped portion to move closer to or away from the clamping portion of the first clamping structure, so as to clamp or release the edge of the wafer respectively.

4. The clamping force threshold detection device for a wafer jig according to claim 3, characterized in that, The clamping part and the connecting part are set at an obtuse angle.

5. The clamping force threshold detection device for a wafer jig according to claim 3, characterized in that, When clamping the wafer, the fitting portion fits into the clamping portion, and the hook-shaped portion fits into the lower end face of the edge of the wafer.

6. The clamping force threshold detection device for a wafer jig according to claim 5, characterized in that, It also includes an adjustment mechanism connected to the fitting part of the second clamping structure, which is used to adjust the position of the fitting part of the second clamping structure so that the fitting part of the second clamping structure moves the hook-shaped part closer to or away from the lower end face of the clamping part of the first clamping structure, so as to clamp or release the edge of the wafer respectively.

7. The wafer clamping force threshold detection device according to claim 6, characterized in that, The adjustment mechanism includes a connecting rod, one end of which is movably connected to the fitting part of the second clamping structure. The connecting rod is used to drive the fitting part of the second clamping structure to rotate, thereby driving the hook-shaped part to move closer to or away from the lower end face of the clamping part of the first clamping structure, so as to clamp or release the edge of the wafer respectively. The end of the connecting rod that is movably connected to the fitting part of the second clamping structure is the connecting end.

8. The clamping force threshold detection device for a wafer jig according to claim 7, characterized in that, The connecting end is hinged to the fitting part of the second clamping structure, and the connecting rod is configured to rotate vertically about the connecting end to adjust the position of the second clamping structure, so that the fitting part of the second clamping structure drives the hook-shaped part to approach or move away from the lower end face of the clamping part of the first clamping structure, so as to clamp or release the edge of the wafer respectively.

9. The clamping force threshold detection device for a wafer jig according to claim 8, characterized in that, When the first clamping structure and the second clamping structure clamp the wafer, there is an angle between the connecting rod and the surface of the wafer. As the angle increases, the contact portion of the second clamping structure is driven to rotate outward, so that the hook-shaped portion moves away from the clamping portion of the first clamping structure, thereby releasing the edge of the wafer.

10. The clamping force threshold detection device for a wafer jig according to claim 8, characterized in that, The adjustment mechanism further includes a slider. The end of the connecting rod away from the second clamping structure is movably connected to the slider. The movement of the slider in the vertical direction causes the end of the connecting rod away from the second clamping structure to move in the vertical direction, thereby causing the contact part of the second clamping structure to rotate, and then causing the hook-shaped part to move closer to or away from the lower end face of the clamping part of the first clamping structure, so as to clamp or release the edge of the wafer respectively.

11. The clamping force threshold detection device for a wafer jig according to claim 10, characterized in that, It also includes a guide member, which is matched with the slider and is used to assist the slider in moving in the vertical direction.

12. The wafer clamping force threshold detection device according to claim 11, characterized in that, The guide member is a rod-shaped structure that passes through the slider.

13. The wafer clamping force threshold detection device according to claim 10, characterized in that, The adjustment mechanism further includes a second elastic element, which is disposed between the slider and the support member.

14. The clamping force threshold detection device for a wafer jig according to claim 1, characterized in that, The rotating mechanism includes an outer disk with an indicator opening. The indicator mechanism includes an inner disk and a pointer. The outer disk is fitted onto the inner disk and can rotate around the inner disk. The pointer is connected to the inner disk and passes through the indicator opening to the outside of the outer disk.

15. The clamping force threshold detection device for a wafer jig according to claim 14, characterized in that, The detection mechanism also includes a bearing, which is sleeved on the outer side of the inner disk, and the outer disk is sleeved on the bearing, with the inner wall of the outer disk being fixedly connected to the outer wall of the bearing.

16. The clamping force threshold detection device for a wafer jig according to claim 14, characterized in that, The first elastic element is a spring, one end of which is connected to the inner disk, and the other end of which is connected to the inner wall of the outer disk.

17. The wafer clamping force threshold detection device according to claim 1, characterized in that, The number of the first elastic element is greater than or equal to one. When the number of the first elastic element is greater than one, the multiple first elastic elements are arranged symmetrically about the center of the rotating mechanism.

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