Chip testing fixture and chip testing assembly

Abstract

The application discloses a chip testing clamp and a chip testing assembly, and relates to the technical field of chip testing.The chip testing clamp comprises a first needle plate and a second needle plate which are arranged in a stack and are connected in a sliding mode, the first needle plate is provided with a through hole, the second needle plate is provided with probes which are electrically connected with a load board, a chip to be tested is placed on the first needle plate, and the pins of the chip to be tested extend towards a side away from the first needle plate through the through hole, and the first needle plate is driven to slide relative to the second needle plate along a first direction so that the pins are in abutment with the probes.The chip testing clamp can not only ensure that the chip testing clamp is accurately connected with chips with different pin specifications, but also ensure the stability during contact.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip testing fixture and a chip testing assembly. Background Technology

[0002] Dual in-line package (DIP) has the following core advantages: First, high reliability and strong stability. DIP packaging uses through-hole soldering, which can firmly connect the pins to the circuit board, resist external vibration and mechanical shock, reduce the risk of poor contact or pin detachment, and adapt to complex operating environments. Second, mature DIP packaging technology can ensure long-term stable supply and convenient maintenance. Third, excellent high temperature resistance and heat dissipation capabilities. The pins of DIP packages are directly connected to the circuit board through through-holes, forming a more efficient heat dissipation path. Heat can be quickly conducted to the circuit board through the pins and dissipated, avoiding chip performance degradation due to high temperature accumulation. At the same time, some DIP packages use high temperature resistant materials such as ceramics, which can maintain structural stability in extreme high temperature environments (such as above 125°C) and will not crack or deform due to drastic temperature changes, ensuring stable operation of the chip under high temperature conditions.

[0003] However, the design of chip fixtures faces the following challenges in the testing process of DIP chips: DIP chips have pins arranged in a double-row configuration, and different chip models have varying pin counts and spacing. This necessitates that the pin contact structure of the chip fixture possesses good compatibility, ensuring both precise mating with chips of different pin specifications and stable contact to prevent test data distortion due to poor contact. Therefore, there is an urgent need to design a DIP chip test fixture that can guarantee both precise mating with chips of different pin specifications and stable contact. Summary of the Invention

[0004] The purpose of this application is to provide a chip test fixture and chip test assembly that can ensure accurate docking between the chip test fixture and chips with different pin specifications, and also ensure stability during contact.

[0005] The embodiments of this application are implemented as follows:

[0006] A first aspect of this application provides a chip testing fixture, including a first pin plate and a second pin plate stacked and slidably connected. The first pin plate has a through hole, and the second pin plate has probes electrically connected to a load plate. A chip under test is placed on the first pin plate, and the pins of the chip under test extend through the through hole toward a side away from the first pin plate. The first pin plate is driven to slide relative to the second pin plate in a first direction so that the pins abut against the probes. This chip testing fixture can ensure accurate docking with chips of different pin specifications and also ensure stability during contact.

[0007] As one possible implementation, a push rod with a force-receiving part and an action part is also included. The push rod is movably disposed on the second needle plate and located on one side of the first needle plate. The force-receiving part is driven to move the push rod relative to the second needle plate until the action part abuts against the first needle plate, so that the first needle plate slides relative to the second needle plate.

[0008] As one possible implementation, a top block is also included, which is fixedly disposed on the second needle plate and located on the other side of the first needle plate. The top block is used to limit the sliding of the first needle plate relative to the second needle plate driven by the push rod.

[0009] As one possible implementation, it also includes an elastic element, the two ends of which are respectively connected to the top block and the other side of the first needle plate. The push rod is driven to cause the first needle plate to slide relative to the second needle plate in a second direction so that the elastic element stores energy. When the chip under test is placed on the first needle plate and the pin passes through the through hole, the push rod is released to cause the elastic element to release energy so that the first needle plate slides relative to the second needle plate in the first direction, the first direction and the second direction being opposite.

[0010] As one possible implementation, it also includes a fastener. The first needle plate is provided with a waist-shaped hole, and the second needle plate is provided with an assembly hole. The fastener passes through the waist-shaped hole and the assembly hole. The opposite ends of the waist-shaped hole are distributed along the movement direction of the first needle plate. The opposite ends of the waist-shaped hole are respectively used to abut against the opposite sides of the fastener to limit the sliding stroke of the first needle plate relative to the second needle plate.

[0011] In one possible implementation, the push rod further includes a connecting part and a transition part. The connecting part, the acting part, the transition part, and the force-receiving part are connected in sequence. The first needle plate is provided with a mounting hole, and the second needle plate is provided with a limiting groove. The inner wall of the limiting groove, the bottom surface of the first needle plate, and the top surface of the second needle plate together form a limiting space. The connecting part and the transition part are disposed in the limiting space. The acting part passes through the mounting hole, and the force-receiving part extends toward the side away from the limiting space.

[0012] As one possible implementation, both the first needle plate and the second needle plate are made of ceramic material, and a protective component is provided on the inner wall of the mounting hole.

[0013] In one possible implementation, the second needle plate is provided with a rolling element, the surface of which protrudes from the top surface of the second needle plate and contacts the bottom surface of the first needle plate, so that the first needle plate and the second needle plate are stacked and spaced apart.

[0014] In one possible implementation, the second needle plate is provided with a mounting groove, the probe is movably disposed in the mounting groove, and the load plate is fixedly connected to the bottom surface of the second needle plate, so that the probe moves relative to the mounting groove along the line connecting the first needle plate and the second needle plate to store energy, and part of the probe protrudes from the bottom surface of the second needle plate so that the probe abuts against the pad of the load plate on the side closer to the second needle plate.

[0015] In one possible implementation, the probe includes a connecting section, a transition section, and a holding section connected in sequence. The transition section is movably disposed in the mounting groove along the line connecting the first pin plate and the second pin plate. The connecting section protrudes outside the mounting groove and abuts against the pin. The holding section protrudes outside the mounting groove and abuts against the pad.

[0016] In one possible implementation, the number of through holes is multiple sets, the multiple sets of through holes are spaced apart, the number of pins is two sets, and the two sets of pins pass through any two sets of the multiple sets of through holes one-to-one.

[0017] As one possible implementation, the first needle plate is provided with at least one set of heat dissipation holes, which are spaced apart between two sets of through holes.

[0018] A second aspect of this application provides a chip testing assembly, including a load board and at least one of the aforementioned chip testing fixtures. The chip testing fixture is disposed on the load board, and the load board is electrically connected to the chip testing fixture. This chip testing fixture ensures both accurate mating between the chip testing fixture and chips with different pin specifications, and also guarantees stability during contact.

[0019] The beneficial effects of the embodiments of this application include:

[0020] The chip test fixture includes a first pin plate and a second pin plate stacked and slidably connected. The first pin plate has a through hole, and the second pin plate has probes electrically connected to a load board. The chip under test (DUT) is placed on the first pin plate, with the pins of the DUT extending through the through hole towards the side away from the first pin plate. The first pin plate is driven to slide relative to the second pin plate in a first direction so that the pins abut against the probes. In actual testing, the first pin plate can slide in the first direction. Before the first pin plate slides relative to the second pin plate in the first direction, the pins, although passing through the through hole, do not contact the probes. After the first pin plate slides relative to the second pin plate in the first direction, the first pin plate drives the pins to move synchronously, so that the ends of the pins are precisely aligned with the tops of the probes, and continuous pressure is applied to the probes. The probes are compressed and undergo elastic deformation, which allows a stable electrical contact to be formed between the pins of the DUT and the probes of the chip test fixture. In summary, this chip test fixture, through its design of "through-hole compatible aperture + continuous contact between pins and probes," can solve the problems of poor versatility and unstable contact of traditional chip fixtures, while also taking into account ease of operation and component protection. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the chip under test provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the chip testing fixture provided in the first embodiment of this application;

[0024] Figure 3 This is a schematic diagram of the chip testing fixture provided in the second embodiment of this application;

[0025] Figure 4 This is an assembly diagram of the chip under test and the chip test fixture provided in the second embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the chip test fixture provided in the second embodiment of this application in its initial state;

[0027] Figure 6 This is a schematic diagram of the chip testing fixture provided in the second embodiment of this application after it has moved along the second direction;

[0028] Figure 7 for Figure 6 A magnified view of a portion of the image;

[0029] Figure 8 This is a schematic diagram of the chip testing fixture provided in the second embodiment of this application after it has moved along the first direction;

[0030] Figure 9 for Figure 8 A magnified view of a portion of the image;

[0031] Figure 10 One of the cross-sectional views of the chip testing assembly provided in the embodiments of this application;

[0032] Figure 11 A second cross-sectional view of the chip testing assembly provided in an embodiment of this application;

[0033] Figure 12 An exploded view of the chip testing assembly provided in an embodiment of this application;

[0034] Figure 13 This is a schematic diagram of the push rod provided in an embodiment of this application;

[0035] Figure 14 This is a schematic diagram of the probe structure provided in an embodiment of this application;

[0036] Figure 15 This is a schematic diagram of the electrical performance connection of the chip testing equipment provided in the embodiments of this application.

[0037] Icons: 100-Chip test fixture; 10-First pin plate; 11-Through hole; 12-Oval hole; 13-Mounting hole; 131-Protective component; 14-Heat dissipation hole; 15-Positioning groove; 20-Second pin plate; 21-Probe; 211-Connecting section; 212-Transition section; 213-Holding section; 22-Assembly hole; 23-Limiting groove; 24-Rolling component; 25-Mounting groove; 30-Push rod; 31-Force-bearing part; 32-Action part; 33-Connecting part; 34-Transition part; 40-Top block; 50-Elastic component; 60-Fastener; 200-Load plate; 201-Support plate; 202-Insulating layer; 210-Digital measurement board; 300-Chip under test; 310-Pin; a-First direction; b-Second direction. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0039] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] Please refer to the reference. Figures 1 to 15 This application provides a chip testing fixture 100, including a first pin plate 10 and a second pin plate 20 stacked and slidably connected. The first pin plate 10 has a through hole 11, and the second pin plate 20 has a probe 21 electrically connected to a load plate 200. A chip under test 300 is placed on the first pin plate 10, and the pins 310 of the chip under test 300 extend through the through hole 11 toward the side away from the first pin plate 10. The first pin plate 10 is driven to slide relative to the second pin plate 20 along a first direction a, so that the pins 310 abut against the probes 21. This chip testing fixture 100 can ensure accurate docking with chips with different pin 310 specifications, and also ensures stability during contact.

[0042] It should be noted that, as Figures 2 to 12 As shown, the chip test fixture 100 includes a first pin plate 10 and a second pin plate 20. The first pin plate 10 and the second pin plate 20 are stacked in a vertical direction (e.g., the first pin plate 10 is on top and the second pin plate 20 is on the bottom). The first pin plate 10 and the second pin plate 20 can be slidably connected in a first direction a (usually a horizontal direction, such as a left-right direction or a front-back direction) by means of slide rails, slide grooves, etc., so as to ensure that the first pin plate 10 does not shift when sliding relative to the second pin plate 20.

[0043] Specifically, the first pin plate 10 serves as a "chip positioning and pin 310 guiding layer." Its top surface is used to place the chip under test 300. A positioning groove 15 can also be provided to limit the horizontal displacement of the chip under test 300. Furthermore, the first pin plate 10 has through holes 11 machined on its body. The number, diameter, and spacing of the through holes 11 match the specifications of common chip pins 310. For example, the diameter of the through holes 11 is 0.1~0.2mm larger than the maximum diameter of common chip pins 310. After the chip under test 300 is placed on the first pin plate 10, the pins 310 on the bottom surface of the chip under test 300 will extend through the through holes 11 toward the side away from the first pin plate 10 (such as extending downwards). The through holes 11 can correct the slight misalignment of the pins 310, ensuring that the pins 310 are aligned vertically with the second pin plate 20.

[0044] The second pin plate 20 serves as a "probe 21 fixing and signal transmission layer". Probes 21 (i.e., metal elastic probes) are fixed on its top surface. The bottom of probe 21 (i.e. the side away from the first pin plate 10) can be electrically connected to the external load plate 200 through solder. The number and arrangement of probes 21 correspond one-to-one with the number and arrangement of through holes 11 in the first pin plate 10. The top of probe 21 (i.e. the side close to the first pin plate 10) does not contact pin 310 in the initial state. Only when the first pin plate 10 slides to the designated position can pin 310 abut against probe 21.

[0045] In actual testing, such as Figure 2 , Figure 8 and Figure 9 As shown, the first needle plate 10 can slide along the first direction a by manual, cylinder or motor drive. Before the first needle plate 10 slides relative to the second needle plate 20 along the first direction a, the pin 310 passes through the through hole 11 but does not contact the probe 21. After the first needle plate 10 slides relative to the second needle plate 20 along the first direction a, the first needle plate 10 drives the pin 310 to move synchronously, so that the end of the pin 310 (i.e. the end away from the chip under test 300) is accurately aligned with the top of the probe 21, and can continuously apply pressure to the probe 21. The probe 21 is squeezed and produces elastic deformation, which can make a stable electrical contact between the pin 310 of the chip under test 300 and the probe 21 of the chip test fixture 100.

[0046] Traditional chip fixtures require custom design for specific chip pin 310 specifications (such as the number of pins 310, hole diameter, and spacing), resulting in poor versatility. In this application, the through holes 11 of the first pin plate 10 adopt a "large hole diameter compatible with small hole diameter" design (e.g., a hole diameter of 1mm can be compatible with pins 310 of 0.8mm and 0.6mm diameter). Furthermore, the number of through holes 11 can be multiple sets, with multiple sets of through holes 11 spaced apart. The number of pins 310 is two sets, with each set of pins 310 corresponding to any two sets of through holes 11. In other words, multiple sets of through hole 11 arrays with different spacings can be preset on the board body of the first pin plate 10. During actual testing, the operator can select the corresponding through hole 11 hole group according to the pin 310 specifications of the chip under test 300.

[0047] Traditional chip fixtures require testing under conditions such as continuous vibration. If the contact between pin 310 and probe 21 becomes loose during testing, it can lead to interruption or error in the test signal. In this application, the first pin plate 10 moves the pin 310 synchronously, ensuring precise alignment between the pin 310 and probe 21, and continuously applies pressure to the probe 21. The probe 21 can be made of a flexible metal material, so that when the probe 21 contacts the pin 310, it will generate continuous contact pressure due to elastic deformation, thereby forming a stable electrical contact between the pin 310 of the chip under test 300 and the probe 21 of the chip test fixture 100. In addition, the probe 21 can also ensure stable contact through deformation compensation.

[0048] In some embodiments, the sliding structure such as the slide rail and slide groove between the first needle plate 10 and the second needle plate 20 can adopt a "double-sided parallel design" to avoid misalignment between the pin 310 and the probe 21 due to sliding misalignment (such as the pin 310 only contacting the probe 21 at the edge or even not contacting it at all); at the same time, the guiding effect of the through hole 11 on the pin 310 can correct the slight deviation when the chip under test 300 is placed, and ensure that the end of the pin 310 is vertically aligned with the probe 21.

[0049] In summary, the chip test fixture 100, through the design scheme of "through hole 11 with compatible aperture + continuous contact between pin 310 and probe 21", can solve the problems of poor versatility and unstable contact of traditional chip fixtures. At the same time, it also takes into account the ease of operation and component protection. It is suitable for chip R&D, mass production testing and other scenarios, and is especially suitable for laboratories or production lines that need to frequently switch between different specifications of chips for testing.

[0050] As one possible implementation method, such as Figures 2 to 12As shown, the chip testing fixture 100 also includes a push rod 30 having a force-receiving part 31 and an action part 32. The push rod 30 is movably disposed on the second needle plate 20 and located on one side of the first needle plate 10. The force-receiving part 31 is driven to move the push rod 30 relative to the second needle plate 20 until the action part 32 abuts against the first needle plate 10, so that the first needle plate 10 slides relative to the second needle plate 20.

[0051] It should be noted that the chip testing fixture 100 also includes a push rod 30, which is an integrated rigid structure with at least a force-receiving part 31 and an action part 32. The force-receiving part 31 is located at the power input end of the push rod 30 (such as a cylindrical knob, a plate-shaped boss, or an interface connected to a cylinder or motor), used to receive external driving force (such as manual pressing, rotation, or the thrust of automatic equipment). The action part 32 is located on the side of the push rod 30 near the first needle plate 10, and is typically designed with an arc-shaped or planar contact structure to avoid scratching the first needle plate 10. It is the part that directly contacts the first needle plate 10 and transmits the thrust. Furthermore, the push rod 30 may also include a middle part to allow for... The intermediate part connects the force-receiving part 31 and the action part 32. The intermediate part can be movably assembled on the second needle plate 20 through a rotating shaft and a sliding groove. For example, the second needle plate 20 is provided with a protruding rotating shaft, and the middle part of the push rod 30 is provided with an arc-shaped groove. The arc-shaped groove is fitted on the rotating shaft, so that the push rod 30 can rotate around the rotating shaft. Alternatively, the second needle plate 20 is provided with a straight sliding groove, and the middle part of the push rod 30 is provided with a slider. The slider is embedded in the sliding groove, so that the push rod 30 can slide along a straight line in the sliding groove, ensuring that the movement trajectory of the push rod 30 is unique and without deviation.

[0052] The push rod 30 is located on the edge of the second needle plate 20 (on the same side as one side of the first needle plate 10, such as the left or right side of the first needle plate 10). It will not occupy the installation space of the probe 21 below the first needle plate 10, nor will it interfere with the placement and removal of the chip under test 300. At the same time, it can ensure that the action part 32 can be accurately aligned with the side of the first needle plate 10. A positioning structure (such as a boss or mounting hole 13 mentioned below) can be provided on the side wall of the first needle plate 10. The positioning structure matches the action part 32 of the push rod 30 to avoid slippage or displacement when pushing.

[0053] In this embodiment, taking a manually driven, rotating push rod 30 as an example, the operator applies torque to the force-receiving part 31 by rotating it (e.g., counterclockwise), providing power for the movement of the push rod 30. After the force-receiving part 31 is subjected to force, the push rod 30 rotates synchronously around the axis of rotation on the second needle plate 20, with the axis of rotation as the center. The action part 32 moves closer to one side of the first needle plate 10 as the push rod 30 rotates. When the push rod 30 moves to the point where the action part 32 is completely in contact with the side wall of the first needle plate 10, the power for the push rod 30 to continue moving will be transmitted to the first needle plate 10 through the action part 32. Since the first needle plate 10 and the second needle plate 20 are slidably connected, the first needle plate 10 will move along the first direction a ( (e.g., in the left-right direction) Slide smoothly relative to the second pin plate 20; During the sliding process of the first pin plate 10, the chip under test 300 (including the chip body and the pins 310 set on the chip body) set on it will move synchronously. When the first pin plate 10 slides to the preset stroke (which can be controlled by the movement limit of the push rod 30 or the limiting structure of the second pin plate 20, such as the top block 40 in the following text, or the whole composed of the waist-shaped hole 12, the mounting hole 22 and the fastener 60), the end of the pin 310 will accurately abut against the probe 21 on the second pin plate 20 and can continuously apply pressure to the probe 21. The probe 21 is squeezed and produces elastic deformation, forming a stable electrical contact, thereby completing the docking preparation process before testing.

[0054] As one possible implementation method, such as Figures 2 to 12 As shown, the chip test fixture 100 also includes a top block 40, which is fixedly mounted on the second needle plate 20 and located on the other side of the first needle plate 10. The top block 40 is used to limit the sliding of the first needle plate 10 relative to the second needle plate 20 driven by the push rod 30.

[0055] It should be noted that the chip test fixture 100 also includes a top block 40. Through the coordinated action of the top block 40 and the push rod 30, the maximum sliding distance of the first pin plate 10 can be strictly limited, ensuring that the contact pressure between the pin 310 of the chip under test 300 and the probe 21 is always within a safe range, thus ensuring reliable contact between the pin 310 and the probe 21 and avoiding damage caused by excessive squeezing.

[0056] Specifically, the top block 40 is a rigid block structure with a flat limiting surface on its top or side to avoid scratching the first needle plate 10. Some top blocks 40 can integrate an "adjustable limiting" function (e.g., connected to the second needle plate 20 via threads, rotating the top block 40 can finely adjust the extension length to correspondingly change the maximum sliding distance of the first needle plate 10). The top block 40 is fixed on the second needle plate 20 and located on the other side of the first needle plate 10 (i.e., the side opposite to the push rod 30; for example, if the push rod 30 is on the right side of the first needle plate 10, the top block 40 is on the left side of the first needle plate 10), forming a "left-right opposing constraint". The height of the top block 40 can be flush with or slightly lower than the top surface of the first needle plate 10 to ensure that when the first needle plate 10 slides to its limit position, its side wall away from the push rod 30 can completely fit with the limiting surface of the top block 40, so that the top block 40 can form a rigid block against the first needle plate 10.

[0057] like Figure 2 As shown, when the actuating part 32 of the push rod 30 pushes the first needle plate 10 to slide along the first direction a (e.g., to the left), the first needle plate 10 moves smoothly relative to the second needle plate 20, and the pins 310 of the chip under test 300 move synchronously, gradually approaching the probes 21 on the second needle plate 20. When the first needle plate 10 slides to a preset distance (e.g., 5mm), its sidewall away from the push rod 30 will contact the limiting surface of the top block 40. Since the top block 40 is fixed on the second needle plate 20 and cannot move, it forms a rigid block on the first needle plate 10. The first needle plate 10 stops sliding under the "clamping action" of the top block 40 and the push rod 30. The installation position of the top block 40 should be precisely calculated according to the optimal compression amount (e.g., 0.3mm) required by the probe 21, so that the maximum stroke of the first needle plate 10 from the initial position to the top block 40 can just push the pins 310 to compress the probe 21 to the optimal state, ensuring reliable contact and avoiding damage caused by excessive compression.

[0058] As one possible implementation method, such as Figures 3 to 12 As shown, the chip test fixture 100 also includes an elastic element 50. The two ends of the elastic element 50 are respectively connected to the top block 40 and the other side of the first pin plate 10. The push rod 30 is driven to move the first pin plate 10 relative to the second pin plate 20 along the second direction b so that the elastic element 50 stores energy. When the chip under test 300 is placed on the first pin plate 10 and the pin 310 passes through the through hole 11, the push rod 30 is released so that the elastic element 50 releases energy so that the first pin plate 10 moves relative to the second pin plate 20 along the first direction a. The first direction a and the second direction b are opposite.

[0059] It should be noted that the chip test fixture 100 also includes an elastic element 50 (such as a compression spring). Through the mechanical principle of "energy storage-release", the active pushing force of the push rod 30 is converted into the automatic reset power of the first pin plate 10. This, together with the top block 40, optimizes the test process of "reverse sliding energy storage-release automatic docking", which simplifies the chip placement operation and ensures stable pressure when the pin 310 docks with the probe 21 (avoiding rigid impact). Specifically, one end of the elastic element 50 is fixed to the side wall of the top block 40 facing the first pin plate 10. A guide post can be set on the top block 40, and the elastic element 50 is sleeved on the guide post to avoid radial displacement of the elastic element 50. The other end of the elastic element 50 is connected to the other side of the first pin plate 10 (i.e., the side wall near the top block 40).

[0060] In the initial state, such as Figure 5 As shown, the vertical projections of the through hole 11 and the probe 21 may partially overlap, or the vertical projection of the through hole 11 may be located on the side of the vertical projection of the probe 21 closer to the push rod 30. The elastic element 50 is in its natural state. The operator drives the force-receiving part 31 of the push rod 30, causing the action part 32 of the push rod 30 to push the first needle plate 10 to slide along the second direction b (e.g., to the left, opposite to the first direction a). The through hole 11 and the probe 21 move away from each other, and the first needle plate 10 and the second needle plate 20 are completely misaligned. Figure 6 and Figure 7 As shown, when the first needle plate 10 slides along the second direction b, its side wall near the top block 40 will press against the elastic element 50. The elastic element 50 is compressed, converting the mechanical energy of the push rod 30 into the elastic potential energy of the spring. The chip to be tested 300 is placed into the positioning slot 15 of the first needle plate 10, ensuring that the pin 310 passes through the through hole 11. At this time, the first needle plate 10 is in a locked or energy-storing state, held by the push rod 30. The distance between the through hole 11 and the probe 21 reaches its maximum, and the pin 310 will not contact the probe 21. Figure 8 and Figure 9 As shown, when the temporary lock is released or the force-bearing part 31 of the push rod 30 is loosened, the elastic element 50 begins to release energy, pushing the first needle plate 10 along the first direction a (e.g., sliding to the right, opposite to the second direction b) through elastic force. The first needle plate 10 slides smoothly under the pushing force of the elastic element 50 and the guiding action of the slide rail until the pin 310 abuts against the probe 21 of the second needle plate 20. At this time, the probe 21 will form a reverse block, preventing the first needle plate 10 from continuing to slide. The elastic element 50 still maintains a small amount of compression, ensuring that the contact pressure between the pin 310 and the probe 21 is stable through continuous elastic force, avoiding loosening of the contact due to vibration, and at the same time ensuring that the first needle plate 10 does not slide excessively along the first direction a.

[0061] In some embodiments, when the first needle plate 10 slides to its limit position (i.e., the elastic element 50 is in its maximum energy storage state), the chip test fixture 100 temporarily locks the first needle plate 10 by means of a buckle, electromagnet, etc., without the need to continuously apply pushing force, which makes it convenient for operators to place the chip with both hands and avoids the inconvenience of pushing the push rod 30 with one hand and placing the chip with one hand.

[0062] The aforementioned push rod 30 directly pushes the first needle plate 10 to move until the pin 310 abuts against the probe 21. This may result in deformation of the probe 21 and bending of the pin 310. To solve this problem, this application adds an elastic element 50. The push rod 30 drives the first needle plate 10 to move along the second direction b, causing the elastic element 50 to store energy. Then, the elastic element 50 releases energy, driving the first needle plate 10 to move along the first direction a. This allows the pin 310 and the probe 21 to make stable contact under the combined action of the pushing force of the elastic element 50 and the reverse blocking force of the probe 21. This ensures stable contact pressure between the pin 310 and the probe 21 and avoids damage to the probe 21 and the pin 310 that may be caused by the rigid docking scheme.

[0063] As one possible implementation method, such as Figures 2 to 12 As shown, the chip test fixture 100 also includes a fastener 60. The first needle plate 10 is provided with an oblong hole 12, and the second needle plate 20 is provided with an assembly hole 22. The fastener 60 passes through the oblong hole 12 and the assembly hole 22. The opposite ends of the oblong hole 12 are distributed along the movement direction of the first needle plate 10. The opposite ends of the oblong hole 12 are respectively used to abut against the opposite sides of the fastener 60 to limit the sliding stroke of the first needle plate 10 relative to the second needle plate 20.

[0064] It should be noted that the chip testing fixture 100 also includes fasteners 60 (such as screws). The first needle plate 10 is provided with a waist-shaped hole 12. The two ends of the waist-shaped hole 12 are distributed along the movement direction of the first needle plate 10. In other words, the length direction of the waist-shaped hole 12 is consistent with the movement direction of the first needle plate 10. The length of the waist-shaped hole 12 directly determines the maximum sliding stroke of the first needle plate 10. The second needle plate 20 is provided with an assembly hole 22. The fastener 60 passes through the waist-shaped hole 12 of the first needle plate 10 and the assembly hole 22 of the second needle plate 20 in sequence. The end is locked by a thread (but not completely tightened, leaving the gap required for the sliding of the first needle plate 10), forming a "loose fit connection". This achieves axial positioning of the first needle plate 10 and the second needle plate 20 to avoid vertical separation, and allows the first needle plate 10 to slide along the length direction of the waist-shaped hole 12. At the same time, the abutment between the two ends of the waist-shaped hole 12 and the fastener 60 achieves the stroke limitation of the first needle plate 10 along the first direction a and the second direction b, so as to avoid excessive compression that would cause the elastic element 50 to fail.

[0065] As one possible implementation method, such as Figure 13As shown, the push rod 30 also includes a connecting part 33 and a transition part 34. The connecting part 33, the action part 32, the transition part 34 and the force-receiving part 31 are connected in sequence. The first needle plate 10 is provided with a mounting hole 13, and the second needle plate 20 is provided with a limiting groove 23. The inner wall of the limiting groove 23, the bottom surface of the first needle plate 10 and the top surface of the second needle plate 20 together form a limiting space. The connecting part 33 and the transition part 34 are disposed in the limiting space. The action part 32 passes through the mounting hole 13, and the force-receiving part 31 extends toward the side away from the limiting space.

[0066] It should be noted that the push rod 30 also includes a connecting part 33 and a transition part 34. The connecting part 33, the actuating part 32, the transition part 34, and the force-receiving part 31 are connected in sequence and can be integrally molded. The first needle plate 10 is provided with a mounting hole 13, and the second needle plate 20 is provided with a limiting groove 23. The inner wall of the limiting groove 23, the bottom surface of the first needle plate 10, and the top surface of the second needle plate 20 together form a limiting space. The force-receiving part 31 extends toward the side away from the limiting space. The connecting part 33 and the transition part 34 are provided in... Within the limited space, the limiting space acts as a constraint, forcing the push rod 30 to move along a preset trajectory (such as linear sliding or fixed-axis rotation), preventing it from tilting (such as tilting up and down or shifting left and right); the action part 32 passes through the mounting hole 13 so that the mating part and the mounting hole 13 can act as guides, ensuring that the direction of the push force is strictly along the first direction a or the second direction b (i.e., the horizontal direction), avoiding the first needle plate 10 from being subjected to lateral force due to the deviation of the push force, so that the driving force can be accurately transmitted through the push rod 30.

[0067] As one possible implementation method, such as Figures 2 to 12 As shown, the first pin plate 10 and the second pin plate 20 are both made of high-temperature resistant ceramic material so that the chip testing device can be used in high-temperature testing environments. The inner wall of the mounting hole 13 is provided with a protective component 131, such as a metal plate or a plastic pad, to improve wear resistance and prevent the action part 32 of the push rod 30 from wearing the first pin plate 10, thereby improving the stability and reliability of the chip testing fixture 100.

[0068] As one possible implementation method, such as Figures 5 to 10 As shown, a rolling element 24 is provided on the second needle plate 20. The surface of the rolling element 24 protrudes from the top surface of the second needle plate 20 and contacts the bottom surface of the first needle plate 10, so that the first needle plate 10 and the second needle plate 20 are stacked and spaced apart.

[0069] It should be noted that the addition of a rolling element 24 to the second needle plate 20 is the core supporting component for achieving the "layered spacing + smooth sliding" between the first needle plate 10 and the second needle plate 20. The surface of the rolling element 24 protrudes from the top surface of the second needle plate 20 and contacts the bottom surface of the first needle plate 10, thus forming a stable vertical gap between the first needle plate 10 and the second needle plate 20. This avoids direct friction between the two needle plates and also provides some space for heat dissipation of the chip under test 300. Furthermore, it transforms the "sliding friction" of the slide rails and grooves in the above scheme into the "rolling friction" of the rolling element 24, significantly reducing the resistance and wear of the first needle plate 10 during sliding.

[0070] As one possible implementation method, such as Figure 11 As shown, the second pin plate 20 is provided with a mounting groove 25, and the probe 21 is movably disposed in the mounting groove 25. The load plate 200 is fixedly connected to the bottom surface of the second pin plate 20, so that the probe 21 moves relative to the mounting groove 25 along the line connecting the first pin plate 10 and the second pin plate 20 to store energy, and part of the probe 21 protrudes from the bottom surface of the second pin plate 20 so that the probe 21 abuts against the pad of the load plate 200 on the side close to the second pin plate 20.

[0071] It should be noted that the "mounting slot 25" on the second pin plate 20 and the "movable setting" of the probe 21, together with the fixed connection of the load plate 200, constitute the "elastic extension and electrical connection" system of the probe 21. Through the movable design of the probe 21 within the mounting slot 25 along the line connecting the first pin plate 10 and the second pin plate 20 (i.e., the vertical direction, or the direction perpendicular to the surface of the first pin plate 10), both elastic contact between the probe 21 and the pin 310 of the chip under test 300 is achieved, and the test signal is transmitted through the load plate 200, forming a complete electrical path of "pin 310 of the chip under test 300 - probe 21 of the chip test fixture 100 - load plate 200 of the chip test assembly".

[0072] Specifically, before the load plate 200 is fixed, the probe 21 is in its natural state. At this time, part of the probe 21 (i.e., a portion of the probe 21) protrudes from the top surface of the second pin plate 20, waiting for the first pin plate 10 to slide along the first direction a and then abut against the pin 310. Part of the probe 21 protrudes from the bottom surface of the second pin plate 20, waiting for the load plate 200 to be fixedly connected to the second pin plate 20 in the vertical direction and then abut against the pad on the top surface of the load plate 200. When the load plate 200 is fixed, the top surface of the load plate 200 squeezes the probe 21. After the probe 21 moves along the mounting groove 25 toward the side closer to the first pin plate 10 to store energy, part of the probe 21 still protrudes from the bottom surface of the second pin plate 20. At this time, the probe 21, being in a compressed state, has a tendency to return to its natural state and will exert a pushing force on the load plate 200, so that the probe 21 and the pad can make stable and reliable contact under the action of the probe 21's own elasticity. Of course, in other embodiments, a spring may be provided between the probe 21 and the mounting groove 25, so that the two ends of the probe 21 can make stable and reliable contact with the pin 310 and the pad respectively under the action of the spring.

[0073] As one possible implementation method, such as Figure 11 and Figure 14 As shown, the probe 21 includes a connecting section 211, a transition section 212, and a holding section 213 connected in sequence. The transition section 212 is movably disposed in the mounting groove 25 along the line connecting the first pin plate 10 and the second pin plate 20 (i.e., the vertical direction, or the direction perpendicular to the surface of the first pin plate 10). The connecting section 211 protrudes outside the mounting groove 25 and can abut against the pin 310. The holding section 213 protrudes outside the mounting groove 25 and can abut against the pad.

[0074] It should be noted that the probe 21 adopts a three-section design of "connecting section 211 - transition section 212 - holding section 213". Combined with the movable setting of the transition section 212 within the mounting groove 25, a "bidirectional exposure, intermediate guidance" structural layout is formed. The two ends of the probe 21 (i.e., the connecting section 211 and the holding section 213) can extend horizontally (perpendicular to the movement direction of the first pin plate 10). This design ensures that the two ends of the probe 21 make reliable contact with the pins 310 of the chip under test 300 and the pads of the load plate 200, respectively, avoiding the breakage and poor soldering that are prone to occur with traditional probe tip contact. At the same time, the sliding constraint of the transition section 212 within the mounting groove 25 ensures the accuracy of the extension and retraction movement of the probe 21.

[0075] As one possible implementation method, such as Figure 3As shown, the first pin plate 10 is provided with at least one set of heat dissipation holes 14, which are spaced between two sets of through holes 11 to dissipate heat generated during testing of the chip under test 300. Combined with the vertical spacing between the first pin plate 10 and the second pin plate 20, the heat dissipation effect of the chip under test 300 can be further improved. In some embodiments, when multiple sets of through holes 11 are provided, the through holes 11 without pins 310 can function as heat dissipation holes 14, eliminating the need for additional heat dissipation holes 14.

[0076] like Figures 10 to 12 As shown in the illustration, this application also provides a chip testing assembly, including a load board 200 and at least one of the aforementioned chip testing fixtures 100. The chip testing fixtures 100 are disposed on the load board 200. For example, multiple chip testing fixtures 100 are disposed on the top surface of the load board 200, or multiple chip testing fixtures 100 are disposed on the top and bottom surfaces of the load board 200, so that the chip under test 300 is loaded through the chip testing fixtures 100 and the chip testing fixtures 100 are supported by the load board 200. An insulating layer 202 and a support plate 201 can also be added to the bottom of the load board 200, so that the support plate 201 improves the support of the load board 200 for the chip under test 300 and the chip testing fixtures 100, and the insulating layer 202 ensures that the load board 200 is insulated from the support plate 201. Since the structure and beneficial effects of the chip testing fixture 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0077] like Figure 15 As shown in the illustration, this application also provides a chip testing device, including a chassis, a digital measurement board 210 disposed within the chassis, and the aforementioned chip testing components. A load board 200 is electrically connected to the digital measurement board 210. Since the load board 200 is electrically connected to the chip testing fixture 100 and the chip under test 300 placed on it, the test stimulus signal generated by the digital measurement board 210 can be accurately transmitted to the chip under test 300, and the response signal of the chip under test 300 can be fed back to the digital measurement board 210 to achieve the testing of the chip under test 300. Because the structure and beneficial effects of the chip testing components have been described in detail in the foregoing embodiments, they will not be repeated here.

[0078] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0079] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A chip testing fixture, characterized in that, The device includes a first pin plate and a second pin plate stacked and slidably connected. The first pin plate has a through hole, and the second pin plate has probes electrically connected to a load plate. A chip under test (DUT) is placed on the first pin plate, with the pins of the DUT extending through the through hole towards a side away from the first pin plate. The first pin plate is driven to slide relative to the second pin plate in a first direction so that the pins abut against the probes. The device also includes a push rod having a force-receiving part and an action part. The push rod is movably disposed on the second pin plate and located on one side of the first pin plate. The force-receiving part is driven to move the push rod relative to the second pin plate until the action part abuts against the first pin plate, allowing the first pin plate to slide relative to the second pin plate. Finally, the device includes a top block fixedly disposed on the second pin plate and located on the other side of the first pin plate. The top block is used to limit the sliding of the push rod relative to the second needle plate. It also includes an elastic element, with both ends connected to the top block and the other side of the first needle plate, respectively. The push rod is driven to slide the first needle plate relative to the second needle plate along a second direction, allowing the elastic element to store energy. When the chip under test is placed on the first needle plate and its pins pass through the through-hole, the push rod is released to release the energy of the elastic element, causing the first needle plate to slide relative to the second needle plate along the first direction, which is opposite to the second direction. The through-hole adopts a design that is compatible with both large and small apertures. There are multiple sets of through-holes, spaced apart. There are two sets of pins, each corresponding to any two sets of through-holes.

2. The chip testing fixture according to claim 1, characterized in that, It also includes fasteners. The first needle plate is provided with a waist-shaped hole, and the second needle plate is provided with an assembly hole. The fasteners are inserted into the waist-shaped hole and the assembly hole. The opposite ends of the waist-shaped hole are distributed along the movement direction of the first needle plate. The opposite ends of the waist-shaped hole are respectively used to abut against the opposite sides of the fastener to limit the sliding stroke of the first needle plate relative to the second needle plate.

3. The chip testing fixture according to claim 1, characterized in that, The push rod further includes a connecting part and a transition part. The connecting part, the acting part, the transition part, and the force-receiving part are connected in sequence. The first needle plate is provided with a mounting hole, and the second needle plate is provided with a limiting groove. The inner wall of the limiting groove, the bottom surface of the first needle plate, and the top surface of the second needle plate together form a limiting space. The connecting part and the transition part are disposed in the limiting space. The acting part passes through the mounting hole, and the force-receiving part extends toward the side away from the limiting space.

4. The chip testing fixture according to claim 3, characterized in that, Both the first needle plate and the second needle plate are made of ceramic material, and a protective component is provided on the inner wall of the mounting hole.

5. The chip testing fixture according to claim 1, characterized in that, The second needle plate is provided with a rolling element, the surface of which protrudes from the top surface of the second needle plate and contacts the bottom surface of the first needle plate, so that the first needle plate and the second needle plate are stacked and spaced apart.

6. The chip testing fixture according to claim 1, characterized in that, The second needle plate is provided with a mounting groove, and the probe is movably disposed in the mounting groove. The load plate is fixedly connected to the bottom surface of the second needle plate so that the probe moves relative to the mounting groove along the line connecting the first needle plate and the second needle plate to store energy, and part of the probe protrudes from the bottom surface of the second needle plate so that the probe abuts against the pad of the load plate on the side closer to the second needle plate.

7. The chip testing fixture according to claim 6, characterized in that, The probe includes a connecting section, a transition section, and a holding section connected in sequence. The transition section is movably disposed in the mounting groove along the line connecting the first pin plate and the second pin plate. The connecting section protrudes outside the mounting groove and abuts against the pin. The holding section protrudes outside the mounting groove and abuts against the pad.

8. The chip testing fixture according to claim 1, characterized in that, The first needle plate is provided with at least one set of heat dissipation holes, which are spaced apart between two sets of through holes.

9. A chip testing component, characterized in that, It includes a load board and at least one chip test fixture as described in any one of claims 1 to 8, wherein the chip test fixture is disposed on the load board and the load board is electrically connected to the chip test fixture.

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