Peep-proof device

Abstract

The invention discloses a peep-proof device. The peep-proof device comprises a first peep-proof substrate, a second peep-proof substrate, a peep-proof dielectric layer and a conductive adhesive layer, the first peep-proof substrate and the second peep-proof substrate are oppositely arranged, and the peep-proof dielectric layer and the conductive adhesive layer are arranged between the first peep-proof substrate and the second peep-proof substrate. The first peep-proof substrate comprises a first substrate, a first electrode and a first alignment layer, wherein the first electrode and the first alignment layer are arranged on the first substrate. The second peep-proof substrate comprises a second substrate, a second electrode and a second alignment layer, wherein the second electrode and the second alignment layer are arranged on the second substrate. One of the first alignment layer and the second alignment layer comprises a blocking part, and the blocking part is overlapped on the first electrode, the second electrode and the conductive adhesive layer in the normal direction of the first substrate.

Description

Technical Field

[0001] This invention relates to a privacy device, and more particularly to a privacy device that is low-cost and has a short manufacturing time. Background Technology

[0002] Electronic devices are indispensable products today, and those with display functions, such as screens, laptops, smartphones, wearable devices, smartwatches, and automotive displays, are widely used in many places. In recent years, based on users' needs for privacy when viewing displays, electronic devices with display functions can also be equipped with privacy devices, making it difficult to view the screen outside the designed viewing area, thus achieving a privacy protection effect. To reduce the manufacturing cost and shorten the production time of privacy devices, the industry is committed to adjusting the structure and manufacturing process of privacy devices. Summary of the Invention

[0003] The purpose of this invention is to provide a privacy device that achieves low cost and short manufacturing time through the design of the alignment layer.

[0004] To address the aforementioned technical problems, the present invention provides a privacy screen device, comprising a first privacy screen substrate, a second privacy screen substrate, a privacy screen dielectric layer, and a conductive adhesive layer. The first and second privacy screen substrates are disposed opposite to each other, with the privacy screen dielectric layer and the conductive adhesive layer disposed between them. The first privacy screen substrate includes a first substrate and a first electrode and a first alignment layer disposed on the first substrate. The second privacy screen substrate includes a second substrate and a second electrode and a second alignment layer disposed on the second substrate. One of the first and second alignment layers includes a blocking portion, and the blocking portion overlaps the first electrode, the second electrode, and the conductive adhesive layer in the normal direction of the first substrate. Attached Figure Description

[0005] Figure 1 The diagram shown is a top view of the privacy device according to the first embodiment of the present invention.

[0006] Figure 2 The diagram shown is a top view of the first conductive layer, second conductive layer, conductive adhesive layer, first alignment layer, and second alignment layer of the privacy device according to the first embodiment of the present invention.

[0007] Figure 3 The following is along Figure 1 A cross-sectional diagram of the A-A' section.

[0008] Figure 4 The following is along Figure 1 A cross-sectional diagram of the B-B' section.

[0009] Figure 5 The diagram shown is a top view of the first conductive layer, the second conductive layer, the conductive adhesive layer, the first alignment layer, and the second alignment layer of the privacy device according to the second embodiment of the present invention.

[0010] Figure 6 The diagram shown is a cross-sectional view of the privacy device according to a second embodiment of the present invention.

[0011] Figure 7 The diagram shown is a top view of the first conductive layer, second conductive layer, conductive adhesive layer, first alignment layer, and second alignment layer of the privacy device according to the third embodiment of the present invention.

[0012] Figure 8 The diagram shown is a cross-sectional view of the privacy device according to the third embodiment of the present invention.

[0013] Explanation of reference numerals in the attached drawings: 100, 200, 300 - privacy device; 110 - first substrate; 120 - first conductive layer; 122 - first electrode; 122a - main electrode; 122b - connection portion; 124 - third electrode; 130 - first alignment layer; 132 - first main portion; 134 - first barrier portion; 140 - privacy medium layer; 150 - second alignment layer; 152 - second main portion; 154 - second barrier portion; 160 - second conductive layer; 162 - second electrode; 170 - second substrate; 180 - conductive adhesive layer; 182 - colloid; 184 - conductive particles; AR - active area; P1, P2 - conductive paths; PD1, PD2, PD3, PD4 - connecting pads; PR - peripheral area; PS1 - first privacy substrate; PS2 - second privacy substrate; X, Y, Z - directions. Detailed Implementation

[0014] To enable those skilled in the art to further understand the present invention, preferred embodiments are described below, along with a detailed description of the invention's structure and desired effects in conjunction with the accompanying drawings. It should be noted that the drawings are simplified schematic diagrams; therefore, only elements and combinations related to the present invention are shown to provide a clearer description of the basic structure or implementation method of the invention. Actual elements and layouts may be more complex. Furthermore, for ease of explanation, the elements shown in the various drawings are not drawn to scale according to the actual number, shape, and size; the detailed scale can be adjusted according to design requirements.

[0015] In the specification and claims of this invention, the terms "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this invention, they specify the presence of the corresponding features, areas, steps, operations, and / or components, but do not exclude the presence of one or more of the corresponding features, areas, steps, operations, and / or components.

[0016] In the specification and claims of this invention, when “component A1 is formed by B1”, it means that the formation of component A1 includes or uses B1, and the formation of component A1 does not exclude the presence or use of one or more other features, areas, steps, operations and / or components.

[0017] In this specification and claims, the term "horizontal direction" refers to a direction parallel to a horizontal plane; the term "horizontal plane" refers to a plane parallel to directions X and Y in the drawings; and the term "vertical direction" refers to a direction parallel to direction Z in the drawings, where directions X, Y, and Z are perpendicular to each other (i.e., the horizontal direction is perpendicular to direction Z). In this specification and claims, the term "top view" refers to the result of viewing along the vertical direction. In this specification and claims, the term "section" refers to the result of viewing the structure cut along the vertical direction from a horizontal perspective.

[0018] In this specification and claims, the term "overlap" means that two components overlap in the direction Z, and unless otherwise specified, the term "overlap" includes partial overlap or complete overlap, wherein the two components may be in direct contact with each other or there may be a spacer between the two components.

[0019] In this specification and claims, the term "approximately" is generally interpreted as being within ±10% of a given value, or within ±5%, ±3%, ±2%, ±1%, or ±0.5% of a given value.

[0020] The ordinal numbers used in the specification and claims of this invention, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing methods. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first component in the specification may be a second component in the claims.

[0021] It should be understood that the features described in the following embodiments can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of the invention. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0022] Please refer to Figures 1 to 4 , Figure 1 The image shown is a top view of the privacy device according to the first embodiment of the present invention. Figure 2 The diagram shown is a top view of the first conductive layer, second conductive layer, conductive adhesive layer, first alignment layer, and second alignment layer of the privacy device according to the first embodiment of the present invention. Figure 3 The following is along Figure 1 A cross-sectional diagram of the A-A' section. Figure 4 The following is along Figure 1 A schematic diagram of the cross-section along line B-B'. (See attached diagram.) Figures 1 to 4 As shown, the privacy device 100 may have an active area AR and a peripheral area PR disposed on at least one outer side of the active area AR, wherein the active area AR may have a privacy function, and elements for assisting the active area AR (e.g., connecting pads and / or connecting electrodes for electrically connecting the drive circuit) may be disposed in the peripheral area PR. For example, the peripheral area PR may surround the active area AR, but is not limited thereto.

[0023] The privacy device 100 may include a first substrate 110 and a second substrate 170, wherein the first substrate 110 and the second substrate 170 are disposed opposite to each other, and the overlapping area of ​​the first substrate 110 and the second substrate 170 covers the active area AR of the privacy device 100. The materials of the first substrate 110 and the second substrate 170 may be the same or different, and the first substrate 110 and the second substrate 170 may each be a rigid substrate or a flexible substrate, and may include, depending on their type, materials such as glass, plastic, quartz, sapphire, polymers (e.g., polyimide (PI), polyethylene terephthalate (PET)), other suitable materials, or combinations thereof, but are not limited thereto. Furthermore, the shape and size of the first substrate 110 and the second substrate 170 may be designed according to requirements. For example, in Figure 1 and Figure 2 In this process, the size of the first substrate 110 may be larger than the size of the second substrate 170, but is not limited thereto.

[0024] like Figure 3 and Figure 4As shown, the privacy device 100 may include a privacy medium layer 140 disposed between the first substrate 110 and the second substrate 170, and disposed in the active region AR. It should be noted that the normal direction of the surface of the first substrate 110 facing the privacy medium layer 140 and the normal direction of the surface of the second substrate 170 facing the privacy medium layer 140 may be parallel to direction Z. In this invention, the privacy medium layer 140 may include any suitable medium material. In this embodiment, the medium material contained in the privacy medium layer 140 can be adjusted in any suitable manner to achieve a privacy effect for the privacy device 100. In some embodiments, the privacy state of the privacy medium layer 140 can be controlled by an electric field and / or an electrical signal. For example, the privacy medium layer 140 may include liquid crystal material, but is not limited thereto. In this embodiment, the privacy medium layer 140 can switch between a first state (or privacy state) and a second state (or non-privacy state).

[0025] like Figures 1 to 4 As shown, the privacy device 100 includes an alignment layer disposed between a first substrate 110 and a second substrate 170 for aligning with the privacy media layer 140. In this invention, the number of alignment layers in the privacy device 100 can be designed according to requirements. In this embodiment, as... Figures 1 to 4 As shown, the privacy device 100 may include a first alignment layer 130 and a second alignment layer 150. The first alignment layer 130 may be disposed between the first substrate 110 and the privacy media layer 140, and the second alignment layer 150 may be disposed between the second substrate 170 and the privacy media layer 140. In this embodiment, the area of ​​the first alignment layer 130 and the area of ​​the second alignment layer 150 may be greater than or equal to the area of ​​the active region AR (e.g., in...). Figure 2 In this configuration, the areas of the first alignment layer 130 and the second alignment layer 150 are both larger than the area of ​​the active region AR, and at least a portion of the first alignment layer 130 and at least a portion of the second alignment layer 150 can completely overlap the entire active region AR. The first alignment layer 130 and the second alignment layer 150 may comprise any material suitable for alignment, for example, the first alignment layer 130 and the second alignment layer 150 may comprise polyimide (PI), but are not limited thereto.

[0026] In this invention, the alignment materials of the first alignment layer 130 and the second alignment layer 150 can be insulating materials, so that the first alignment layer 130 and the second alignment layer 150 serve as insulating layers and have appropriate resistivity. For example, the resistivity of the first alignment layer 130 and the resistivity of the second alignment layer 150 can be greater than or equal to 10. 8 The resistivity is ohm-cm (Ω·cm), but not limited thereto. The resistivity of the first alignment layer 130 and the resistivity of the second alignment layer 150 are preferably greater than or equal to 10 ohms-cm. 12The thickness of the first alignment layer 130 and the second alignment layer 150 can be adjusted to provide better insulation between them. However, this is not a limitation. Furthermore, the thicknesses of the first alignment layer 130 and the second alignment layer 150 can be designed as needed to achieve appropriate alignment effects and resistivity. For example, the thicknesses of the first alignment layer 130 and the second alignment layer 150 can be greater than or equal to 350 angstroms. And less than or equal to 2000 angstroms, but not limited to this.

[0027] In this invention, the electrodes used to control the privacy media layer 140 can be designed as needed. For example, multiple electrodes used to control the privacy media layer 140 can be disposed on opposite sides of the privacy media layer 140 (i.e., the privacy media layer 140 is disposed between two opposite electrodes).

[0028] like Figures 1 to 4 As shown, the privacy device 100 may include a first conductive layer 120 and a second conductive layer 160. The first conductive layer 120 is disposed between the first substrate 110 and the privacy medium layer 140, and the second conductive layer 160 is disposed between the second substrate 170 and the privacy medium layer 140, such that the privacy medium layer 140 is disposed between the first conductive layer 120 and the second conductive layer 160. Figure 3 and Figure 4 In this invention, the first conductive layer 120 is located between the first substrate 110 and the first alignment layer 130, and the second conductive layer 160 is located between the second substrate 170 and the second alignment layer 150. In this invention, the first conductive layer 120 and the second conductive layer 160 may be transparent conductive layers, comprising a transparent conductive material, allowing light to pass through them. For example, the materials of the first conductive layer 120 and the second conductive layer 160 may include indium tin oxide (ITO), indium zinc oxide (IZO), other suitable transparent conductive materials, or combinations thereof.

[0029] like Figures 2 to 4 As shown, the first conductive layer 120 includes a first electrode 122 for controlling the privacy shield layer 140, and the second conductive layer 160 includes a second electrode 162 for controlling the privacy shield layer 140, such that the privacy shield layer 140 is disposed between the first electrode 122 and the second electrode 162, and the privacy shield state of the privacy shield layer 140 can be controlled by the electric field generated by the first electrode 122 and the second electrode 162. Figures 2 to 4 In the process, the first electrode 122 and the second electrode 162 overlap in the Z direction.

[0030] In this invention, the number of the first electrode 122 and the second electrode 162 can be designed according to requirements. For example, in Figure 2In the privacy device 100, the number of first electrodes 122 and the number of second electrodes 162 can both be 1, and the area of ​​the first electrode 122 and the area of ​​the second electrode 162 can be greater than or equal to the area of ​​the active region AR (e.g., in...). Figure 2 In this configuration, the areas of the first electrode 122 and the second electrode 162 are both larger than the area of ​​the active region AR, and at least a portion of the first electrode 122 and at least a portion of the second electrode 162 can completely overlap the entire active region AR. This allows the first electrode 122 and the second electrode 162 to control the state of the privacy media layer 140 in the entire active region AR, thereby controlling the privacy device 100 to be in privacy mode (i.e., the privacy device 100 is in a privacy state) or sharing mode (i.e., the privacy device 100 is in a non-privacy state), but this is not a limitation. For example (not shown), the number of first electrodes 122 can be greater than one, so that the electric field generated by the first electrode 122 and the second electrode 162 can regionally control the state of the privacy media layer 140, enabling the privacy device 100 to provide zoned privacy, but this is not a limitation.

[0031] In this invention, the pattern of the first electrode 122 can be designed according to requirements. Figure 2 In this configuration, the number of first electrodes 122 can be one, and each first electrode 122 includes a main electrode 122a and at least one connecting portion 122b electrically connected to the main electrode 122a. The main electrode 122a is disposed in the active region AR to control the state of the privacy shield layer 140, and the connecting portion 122b is disposed in the peripheral region PR. For example, in Figure 2 In the process, the connecting part 122b may be a pattern protruding outward from the main electrode 122a, but is not limited thereto.

[0032] The first electrode 122 and the second electrode 162 can generate corresponding electric fields based on the received electrical signals, and the material in the privacy media layer 140 (e.g., liquid crystal molecules) will change accordingly (e.g., rotate) according to the electric field to adjust the state of the privacy media layer 140 (e.g., the privacy media layer 140 can switch between a first state and a second state). In this embodiment, when the privacy media layer 140 is in the first state, the privacy device 100 activates the privacy function (i.e., the privacy device 100 is in privacy mode), and when the privacy media layer 140 is in the second state, the privacy device 100 deactivates the privacy function (i.e., the privacy device 100 is in sharing mode). For example, when the absolute value of the voltage difference between the first electrode 122 and the second electrode 162 is greater than 0, the privacy device 100 activates the privacy function; when the voltage difference between the first electrode 122 and the second electrode 162 is equal to 0, the privacy device 100 deactivates the privacy function, but this is not a limitation. When the privacy media layer 140 is in its first state and the privacy function is activated, the path of light emitted from the privacy media layer 140 is restricted to a specific angular range. Therefore, when the angle between the user's line of sight and the normal direction (e.g., direction Z) of the light-emitting surface of the electronic device equipped with the privacy device 100 (e.g., a privacy display device including the privacy device 100 and the display panel arranged overlapping each other) is greater than a specific angle, the user cannot (has difficulty) see the display screen of the electronic device, or the display screen seen by the user is unclear. When the privacy media layer 140 is in its second state and the privacy function is deactivated, the angular range of the path of light emitted from the privacy media layer 140 is greater than the angular range of the path of light in the first state. Therefore, the viewing angle range in the second state is greater than the viewing angle range in the first state.

[0033] For example, when the privacy media layer 140 is in a first state, the light entering the privacy media layer 140 can be adjusted and / or filtered to limit the path of the light emitted from the privacy media layer 140 to a specific angular range; when the privacy media layer 140 is in a second state, the light entering the privacy media layer 140 may not be adjusted and / or filtered to maintain the light emitted from the privacy media layer 140 within a larger angular range, but this is not a limitation. For example, in embodiments where the angular range of the light entering the privacy media layer 140 is small (e.g., embodiments where the privacy display device includes collimated backlighting), when the privacy media layer 140 is in the first state, the light entering the privacy media layer 140 may not be adjusted and / or filtered; when the privacy media layer 140 is in the second state, the light entering the privacy media layer 140 may be scattered to increase the viewing angle range, but this is not a limitation.

[0034] Additionally, the privacy device 100 also includes a third electrode 124 located in the peripheral area PR. The third electrode 124 is separate from and not connected to the first electrode 122 (i.e., the first electrode 122 and the third electrode 124 are not electrically connected). The third electrode 124 overlaps with the second electrode 162 in the Z direction, and the third electrode 124 is electrically connected to the second electrode 162 of the second conductive layer 160 (see the later description regarding the electrical connection of the third electrode 124 to the second electrode 162 of the second conductive layer 160 via the conductive adhesive layer 180). In this embodiment, the third electrode 124 belongs to the first conductive layer 120 (i.e., the first conductive layer 120 includes the first electrode 122 and the third electrode 124), but this is not a limitation. For example, in... Figure 2 In this process, the third electrode 124 may surround the active region AR and the first electrode 122 (e.g., the main electrode 122a of the first electrode 122), but is not limited thereto.

[0035] Additionally, in some embodiments, the privacy device 100 may also include a light-shielding layer (not shown) disposed in the peripheral area PR. For example, the light-shielding layer may be a black matrix layer, but is not limited thereto. Furthermore, in some embodiments, the privacy device 100 may also include a spacer (not shown) disposed between the first substrate 110 and the second substrate 170 to support the gap between the first substrate 110 and the second substrate 170.

[0036] In addition, Figures 1 to 4 In this embodiment, the privacy device 100 also includes multiple connecting pads PD1, PD2, PD3, and PD4 disposed in the peripheral area PR. In this embodiment, the connecting pads PD1, PD2, PD3, and PD4 may belong to the first conductive layer 120, that is, the first conductive layer 120 includes the first electrode 122, the third electrode 124, and the connecting pads PD1, PD2, PD3, and PD4, but is not limited thereto. Figures 1 to 3 In the first electrode 122, connecting pads PD1 and PD3 are electrically connected to the first electrode 122. A connecting portion 122b of the first electrode 122 is disposed between the connecting pads PD1 and PD3 and the main electrode 122a of the first electrode 122, such that the connecting pads PD1 and PD3 are electrically connected to the main electrode 122a of the first electrode 122 through the connecting portion 122b (i.e., in...). Figure 3 In the process, the connection between the connecting pad PD1, the connecting portion 122b of the first electrode 122, and the main electrode 122a of the first electrode 122 forms a conductive path P1. Figure 1 , Figure 2 and Figure 4 In the middle, connecting pads PD2 and PD4 are electrically connected to the third electrode 124, and the third electrode 124 is electrically connected to the second electrode 162 through conductive particles 184 of the conductive adhesive layer 180 (that is, in Figure 4 In the diagram, the connection between the connecting pad PD2, the third electrode 124, the conductive particles 184 of the conductive adhesive layer 180, and the second electrode 162 forms a conductive path P2. A detailed explanation of the electrical connection between the third electrode 124 and the second electrode 162 via the conductive particles 184 of the conductive adhesive layer 180 can be found in the subsequent description of the conductive adhesive layer 180. Figures 1 to 4 In this embodiment, the connecting pads PD1, PD2, PD3, and PD4 can be disposed in the peripheral area PR and in the area not covered by the second substrate 170, but are not limited thereto. In this embodiment, connecting pads PD1 and PD2 can be referred to as the first group of connecting pads, and connecting pads PD3 and PD4 can be referred to as the second group of connecting pads, wherein each group of connecting pads includes a connecting pad electrically connected to the first electrode 122 (e.g., connecting pad PD1 or connecting pad PD3) and a connecting pad electrically connected to the third electrode 124 (e.g., connecting pad PD2 or connecting pad PD4).

[0037] The privacy device 100 further includes at least one drive circuit (not shown), wherein the at least one drive circuit is electrically connected to at least one set of connection pads in a first set of connection pads (i.e., connection pads PD1, PD2) and a second set of connection pads (i.e., connection pads PD3, PD4), such that the drive circuit can provide corresponding signals to the first electrode 122 and the second electrode 162 through connection pads PD1, PD2 and / or through connection pads PD3, PD4 to control the state of the privacy media layer 140. In some embodiments, the drive circuit may be disposed on a circuit board, and the circuit board may be coupled to the connection pads PD1, PD2, PD3, PD4 through bonding elements, such that the drive circuit is electrically connected to the connection pads PD1, PD2, PD3, PD4. For example, the circuit board may be coupled to the connection pads PD1, PD2, PD3, PD4 through bonding elements. Figure 1 The connecting pads PD1 and PD2 on the left side of the middle are engaged or connected with... Figure 1 The connecting pads PD3 and PD4 on the right side are joined (for example, the driving circuit can be disposed on a flexible circuit board, and this flexible circuit board can be electrically connected to one of the first and second sets of connecting pads through anisotropic conductive film; or the driving circuit can be disposed on a rigid circuit board, and this rigid circuit board can be electrically connected to one of the first and second sets of connecting pads through a flexible circuit board and anisotropic conductive film), but it is not limited thereto. It should be noted that since the connecting pads PD1, PD2, PD3, and PD4 can be disposed in the peripheral area PR and in the area not covered by the second substrate 170, a portion of the circuit board can be located on the first substrate 110. Although Figure 1This example illustrates a privacy device 100 with two sets of connection pads, but is not limited thereto. In some embodiments, the privacy device 100 may have only one set of connection pads or more than two sets of connection pads. In embodiments where the privacy device 100 has two or more sets of connection pads, the privacy device 100 can be used with any of a variety of display panels of different specifications, and the manufacturer of the privacy display device can choose which set of connection pads to couple the driving circuit to based on the specifications of different display panels and the mechanical design of the privacy display device. Therefore, it is possible to avoid producing multiple privacy devices of different specifications to accommodate multiple display panels of different specifications, thereby reducing the production cost of the privacy device.

[0038] like Figures 1 to 4 As shown, the privacy device 100 further includes a conductive adhesive layer (also referred to as conductive frame adhesive) 180, disposed between the first substrate 110 and the second substrate 170, to bond the first substrate 110 and the second substrate 170 through the conductive adhesive layer 180, such that the first substrate 110 and the second substrate 170 are disposed opposite to each other. In this invention, the conductive adhesive layer 180 may comprise any suitable material. Figure 3 and Figure 4 In this structure, the conductive adhesive layer 180 includes a colloid 182 and a plurality of conductive particles 184 disposed within the colloid 182. For example, the conductive particles 184 may include gold balls, but are not limited thereto.

[0039] like Figures 1 to 4 As shown, the conductive adhesive layer 180 is disposed in the peripheral region PR and may be a frame adhesive surrounding the active region AR, thereby sealing the privacy shield layer 140 between the first substrate 110 and the second substrate 170. That is, the privacy shield layer 140 is disposed in the space formed by the first substrate 110, the second substrate 170, and the conductive adhesive layer 180. Furthermore, since the conductive adhesive layer 180 surrounds the active region AR, the conductive adhesive layer 180 surrounds the first electrode 122 (e.g., the main electrode 122a of the first electrode 122), but is not limited thereto.

[0040] like Figures 3 to 4 As shown, the conductive structures located between the first substrate 110 and the conductive adhesive layer 180 in the Z direction, and the conductive structures located between the second substrate 170 and the conductive adhesive layer 180, can be electrically connected to each other through conductive particles 184 in the conductive adhesive layer 180. In other words, the conductive adhesive layer 180 can provide an electrical connection path in the vertical direction (i.e., the Z direction). For example, in Figures 3 to 4 In this process, conductive particles 184 can electrically connect conductive structures located between the first substrate 110 and the conductive adhesive layer 180, as well as conductive structures located between the second substrate 170 and the conductive adhesive layer 180, to create an electrical connection effect of the conductive adhesive layer 180 in the Z direction.

[0041] like Figures 1 to 4 As shown, the conductive adhesive layer 180 overlaps the first electrode 122 (e.g., the connection portion 122b of the first electrode 122), the second electrode 162, and the third electrode 124 in the normal direction (i.e., direction Z) of the first substrate 110. Since the third electrode 124 overlaps the second electrode 162 in direction Z, and at least a portion of the conductive adhesive layer 180 is disposed between the third electrode 124 and the second electrode 162 (i.e., the third electrode 124, the conductive adhesive layer 180, and the second electrode 162 overlap each other in direction Z), the third electrode 124 can be electrically connected to the second electrode 162 through the conductive adhesive layer 180. In other words, the connecting pads PD2 and PD4 are electrically connected to the second electrode 162 through the third electrode 124 and the conductive particles 184 of the conductive adhesive layer 180 (i.e., in...). Figure 4 In the process, the connection between the connecting pad PD2, the third electrode 124, the conductive particles 184 of the conductive adhesive layer 180, and the second electrode 162 forms a conductive path P2.

[0042] Since the connection portion 122b of the first electrode 122 overlaps with the second electrode 162 in the Z direction, and a portion of the conductive adhesive layer 180 is located between the connection portion 122b of the first electrode 122 and the second electrode 162 (i.e., the connection portion 122b of the first electrode 122, the conductive adhesive layer 180, and the second electrode 162 overlap each other in the Z direction), in order to prevent the connection portion 122b of the first electrode 122 from being electrically connected to the second electrode 162 through the conductive particles 184 of the conductive adhesive layer 180, the alignment layer may include a barrier portion, wherein the barrier portion overlaps simultaneously with the connection portion 122b of the first electrode 122, the second electrode 162, and the conductive adhesive layer 180 in the Z direction (i.e., the normal direction of the first substrate 110). For example, the barrier portion may be located between the connection portion 122b of the first electrode 122 and the conductive adhesive layer 180 or between the second electrode 162 and the conductive adhesive layer 180. Since the alignment layer is an insulating layer, the presence of the barrier portion prevents the first electrode 122 from being electrically connected to the second electrode 162 (i.e., prevents the connection portion 122b of the first electrode 122 from being electrically connected to the second electrode 162 through the conductive particles 184 of the conductive adhesive layer 180).

[0043] In this embodiment, the first electrode 122 can be prevented from being electrically connected to the second electrode 162 by the barrier of the first alignment layer 130. For example... Figures 2 to 3As shown, the first alignment layer 130 may include a first main portion 132 and a first blocking portion 134. The first main portion 132 is disposed in the active region AR of the privacy device 100 to align with the privacy media layer 140. The first blocking portion 134 is disposed in the peripheral region PR (i.e., outside the active region AR) and connected to the first main portion 132. The first blocking portion 134 overlaps in the Z direction with the connection portion 122b of the first electrode 122, the second electrode 162, and the conductive adhesive layer 180. For example, in Figure 2 In this embodiment, the first blocking portion 134 may be a rectangle protruding outward from the first main portion 132, but the shape of the first blocking portion 134 is not limited thereto. In addition, in some other embodiments, the first blocking portion 134 overlaps the connection portion 122b of the first electrode 122, the second electrode 162 and the conductive adhesive layer 180 in the Z direction, and the first blocking portion 134 may not be coupled to the first main portion 132.

[0044] like Figures 2 to 3 As shown, since the first barrier portion 134 belongs to the first alignment layer 130, the first barrier portion 134 is disposed between the connection portion 122b of the first electrode 122 and the conductive adhesive layer 180, so that the connection portion 122b of the first electrode 122 is not electrically connected to the conductive adhesive layer 180. Figure 3 In the middle, the first barrier part 134 can directly contact the conductive adhesive layer 180, but is not limited thereto.

[0045] In this embodiment, the width of the first barrier portion 134 of the first alignment layer 130 can be greater than the width of the connection portion 122b of the first electrode 122, so as to avoid the connection portion 122b of the first electrode 122 not being covered by the first barrier portion 134 due to process alignment misalignment, which would result in the connection portion 122b of the first electrode 122 being electrically connected to the conductive adhesive layer 180. Furthermore, the width of the first barrier portion 134 can be designed considering the spacing between adjacent connection portions 122b of the first electrode 122 and the third electrode 124, as well as the size of the process alignment misalignment, to avoid the first barrier portion 134 overlapping a portion of the third electrode 124 adjacent to the connection portion 122b of the first electrode 122, thus affecting the electrical connection between the third electrode 124 and the second electrode 162.

[0046] In this invention, although a portion of the second electrode 162 overlaps both the first electrode 122 and the conductive adhesive layer 180, the first electrode 122 cannot be electrically connected to the second electrode 162 through the conductive adhesive layer 180 due to the presence of the blocking portion of the alignment layer (e.g., the first blocking portion 134 of the first alignment layer 130). Accordingly, in the design of the privacy device 100 of this invention, the second electrode 162 does not need to be hollowed out in the area where it overlaps both the first electrode 122 and the conductive adhesive layer 180 (i.e., after forming the second electrode 162 on the second substrate 170, no further patterning process is required for the second electrode 162). In other words, even if a portion of the second electrode 162 overlaps both the first electrode 122 and the conductive adhesive layer 180, the first electrode 122 will not be electrically connected to the second electrode 162, thus preventing the privacy device 100 from malfunctioning. In some embodiments (e.g.) Figure 2 As shown, the second electrode 162 can be fully disposed on the surface of the second substrate 170 without being patterned. In other words, the manufacturing of the second electrode 162 can be completed without etching the second conductive layer 160, thereby reducing the manufacturing cost and manufacturing time of the privacy device 100.

[0047] like Figures 1 to 4 As shown, the privacy device 100 includes a first privacy substrate PS1, a second privacy substrate PS2, a privacy dielectric layer 140, and a conductive adhesive layer 180. The first privacy substrate PS1 and the second privacy substrate PS2 are disposed opposite to each other. The privacy dielectric layer 140 and the conductive adhesive layer 180 are disposed between the first privacy substrate PS1 and the second privacy substrate PS2, and the privacy dielectric layer 140 is located in the space formed by the first privacy substrate PS1, the second privacy substrate PS2, and the conductive adhesive layer 180. The first privacy substrate PS1 includes a first substrate 110, a first conductive layer 120, and a first alignment layer 130, and the second privacy substrate PS2 includes a second substrate 170, a second conductive layer 160, and a second alignment layer 150. In this embodiment, the first conductive layer 120 includes a first electrode 122, a third electrode 124, and connecting pads PD1, PD2, PD3, and PD4, and the second conductive layer 160 includes a second electrode 162. In addition, in embodiments where the privacy device 100 further includes a light-shielding layer and / or spacers, the light-shielding layer may be disposed on the first substrate 110 or the second substrate 170 (i.e., one of the first privacy substrate PS1 and the second privacy substrate PS2 may also include a light-shielding layer), and the spacers may be disposed on the first substrate 110 or the second substrate 170 (i.e., one of the first privacy substrate PS1 and the second privacy substrate PS2 may also include spacers).

[0048] The manufacturing method of the privacy device 100 will be described below, but the manufacturing method of the privacy device 100 is not limited to the present invention. In this embodiment, the method of forming the first privacy substrate PS1 includes the following steps. A first conductive layer 120 is formed on a first substrate 110, and the first conductive layer 120 is patterned to include a first electrode 122, a third electrode 124, and connecting pads PD1, PD2, PD3, and PD4. Then, a first alignment layer 130 having a first main portion 132 and a first barrier portion 134 is formed on the first substrate 110 and covers the first electrode 122 of the first conductive layer 120. For example, an alignment material (e.g., PI) can be coated on an APR (Asahikasei Photosensitive Resin) plate with a raised structure, and then the alignment material can be transferred to the first conductive layer 120 by a printing process on the APR plate to form the first alignment layer 130, wherein the raised structure of the APR plate corresponds to the pattern of the formed first alignment layer 130.

[0049] Similarly, the method for forming the second privacy substrate PS2 includes the following steps: A second conductive layer 160 is formed on the second substrate 170, wherein the second conductive layer 160 may not be patterned, so that the second electrode 162 in the second conductive layer 160 can be fully disposed on the surface of the second substrate 170 without being patterned. Then, a second alignment layer 150 is formed on the second conductive layer 160. Specifically, in embodiments where the privacy device 100 further includes a light-shielding layer (e.g., a black matrix layer) and / or spacers, the method for manufacturing the privacy device 100 may further include forming a light-shielding layer and / or spacers on the second substrate 170 before forming the second alignment layer 150. Forming the light-shielding layer and spacers may, for example, involve forming a light-shielding material layer on the second substrate 170 and then patterning the light-shielding material layer using a photomask to form the light-shielding layer, and forming a spacer material layer on the second substrate 170 and then patterning the spacer material layer using another photomask to form the spacers, but is not limited thereto. In other embodiments, at least one of the light-shielding layer and the spacer may be formed on the first substrate 110.

[0050] Subsequently, a conductive adhesive layer 180 is formed on one of the first privacy substrate PS1 and the second privacy substrate PS2, and the first privacy substrate PS1 and the second privacy substrate PS2 are assembled so that they face each other, wherein the privacy medium layer 140 is located in the space formed by the first privacy substrate PS1, the second privacy substrate PS2 and the conductive adhesive layer 180. Since the privacy device 100 of the present invention does not require patterning of the second conductive layer 160, the manufacturing method of the privacy device 100 only requires one photomask process (e.g., a photomask process for patterning the first conductive layer 120). Furthermore, in embodiments where the privacy device 100 also includes a light-shielding layer and / or spacers, the fabrication method of the privacy device 100 only requires a secondary photomask process (e.g., a photomask process for patterning the first conductive layer 120 and a photomask process for forming either the light-shielding layer or the spacers) or a tertiary photomask process (e.g., a photomask process for patterning the first conductive layer 120, a photomask process for forming the light-shielding layer, and a photomask process for forming the spacers). Therefore, the number of production steps for the privacy device 100 can be reduced, and costs can be lowered. It should be noted that a photomask process is a process that uses a photomask; for example, a photomask process can be a step in a photolithography process.

[0051] The privacy device and its manufacturing method of the present invention are not limited to the above embodiments. Other embodiments will be disclosed below. However, in order to simplify the description and highlight the differences between the embodiments and the above embodiments, the same reference numerals are used to mark the same elements in the present invention, and repeated parts will not be described again.

[0052] Please refer to Figure 5 and Figure 6 , Figure 5 The diagram shown is a top view of the first conductive layer, second conductive layer, conductive adhesive layer, first alignment layer, and second alignment layer of the privacy device according to a second embodiment of the present invention. Figure 6 The diagram shown is a cross-sectional view of the privacy device according to a second embodiment of the present invention, wherein... Figure 6 The cross-sectional structure shown corresponds to Figure 1 The A-A' section line. For example... Figure 5 and Figure 6 As shown, the difference between this embodiment and the first embodiment lies in the design of the barrier portion. Figure 5 and Figure 6 In the privacy device 200 shown, the first electrode 122 is prevented from being electrically connected to the second electrode 162 by the barrier of the second alignment layer 150. More specifically, as... Figure 5 and Figure 6As shown, the second alignment layer 150 may include a second main portion 152 and a second blocking portion 154. The second main portion 152 is disposed in the active region AR of the privacy device 200 to align with the privacy media layer 140. The second blocking portion 154 is disposed in the peripheral region PR (i.e., outside the active region AR) and connected to the second main portion 152. The second blocking portion 154 overlaps in the Z direction with the connection portion 122b of the first electrode 122, the second electrode 162, and the conductive adhesive layer 180. For example, in Figure 5 In this embodiment, the second blocking portion 154 may be a rectangle protruding outward from the second main portion 152, but the shape of the second blocking portion 154 is not limited thereto. Furthermore, in some other embodiments, the second blocking portion 154 overlaps the connection portion 122b of the first electrode 122, the second electrode 162 and the conductive adhesive layer 180 in the Z direction, and the second blocking portion 154 may not be coupled to the second main portion 152.

[0053] like Figure 5 and Figure 6 As shown, since the second barrier portion 154 belongs to the second alignment layer 150, the second barrier portion 154 is disposed between the second electrode 162 and the conductive adhesive layer 180, so that the second electrode 162 cannot be electrically connected to the portion of the conductive adhesive layer 180 that overlaps with the connection portion 122b of the first electrode 122. Figure 6 In the middle, the second barrier portion 154 can directly contact the conductive adhesive layer 180, but is not limited thereto.

[0054] Similarly, in this embodiment, the width of the second barrier portion 154 of the second alignment layer 150 can be greater than the width of the connection portion 122b of the first electrode 122, to avoid the connection portion 122b of the first electrode 122 not overlapping the second barrier portion 154 in the Z direction due to process alignment misalignment, thus preventing the connection portion 122b of the first electrode 122 from being electrically connected to the second electrode 162. Furthermore, the width of the second barrier portion 154 can be designed considering the spacing between adjacent connection portions 122b of the first electrode 122 and the third electrode 124, as well as the magnitude of process alignment misalignment, to prevent the second barrier portion 154 from overlapping a portion of the third electrode 124 adjacent to the connection portion 122b of the first electrode 122 in the Z direction, thereby affecting the electrical connection between the third electrode 124 and the second electrode 162.

[0055] The second alignment layer 150 is formed in a manner similar to that of the first alignment layer 130 in the first embodiment, and will not be described again here.

[0056] Please refer to Figure 7 and Figure 8 , Figure 7 The diagram shown is a top view of the first conductive layer, second conductive layer, conductive adhesive layer, first alignment layer, and second alignment layer of the privacy device according to the third embodiment of the present invention. Figure 8 The diagram shown is a cross-sectional view of the privacy device according to a third embodiment of the present invention, wherein... Figure 8 The cross-sectional structure shown corresponds to Figure 1 The A-A' section line. For example... Figure 7 and Figure 8 As shown, the difference between this embodiment and the first embodiment lies in the design of the barrier portion. Figure 7 and Figure 8 In the privacy device 300 shown, the first electrode 122 is not electrically connected to the second electrode 162 due to the barrier between the first alignment layer 130 and the second alignment layer 150. More specifically, as... Figure 7 and Figure 8 As shown, the first alignment layer 130 may include a first main portion 132 and a first blocking portion 134, and the second alignment layer 150 may include a second main portion 152 and a second blocking portion 154. The first main portion 132 and the second main portion 152 are disposed in the active area AR of the privacy device 300 to align the privacy medium layer 140. The first blocking portion 134 is disposed in the peripheral area PR and connected to the first main portion 132. The second blocking portion 154 is disposed in the peripheral area PR and connected to the second main portion 152. The first blocking portion 134 overlaps with the connection portion 122b of the first electrode 122, the second electrode 162, the conductive adhesive layer 180, and the second blocking portion 154 in the Z direction. In addition, in some other embodiments, the first barrier portion 134 overlaps the connection portion 122b of the first electrode 122, the second electrode 162, the conductive adhesive layer 180 and the second barrier portion 154 in the Z direction, wherein the first barrier portion 134 may not be coupled to the first main portion 132 and / or the second barrier portion 154 may not be coupled to the second main portion 152.

[0057] like Figure 7 and Figure 8 As shown, a first barrier portion 134 is disposed between the connection portion 122b of the first electrode 122 and the conductive adhesive layer 180, and a second barrier portion 154 is disposed between the second electrode 162 and the conductive adhesive layer 180. This prevents the connection portion 122b of the first electrode 122 from being electrically connected to the conductive adhesive layer 180 due to the presence of the first barrier portion 134, and also prevents the second electrode 162 from being electrically connected to the portion of the conductive adhesive layer 180 that overlaps with the connection portion 122b of the first electrode 122 due to the presence of the second barrier portion 154. Figure 8 In this process, the first barrier portion 134 and the second barrier portion 154 can directly contact the conductive adhesive layer 180, but this is not a limitation.

[0058] Compared to the single-sided electrical isolation method of the first and second embodiments (i.e., a first barrier portion 134 for electrical isolation is provided on the lower side of the conductive adhesive layer 180 overlapping the connection portion 122b of the first electrode 122, or a second barrier portion 154 for electrical isolation is provided on the upper side of the conductive adhesive layer 180 overlapping the connection portion 122b of the first electrode 122), this embodiment adopts a double-sided electrical isolation method (i.e., a first barrier portion 134 for electrical isolation is provided on the lower side of the conductive adhesive layer 180 overlapping the connection portion 122b of the first electrode 122, and a second barrier portion 154 for electrical isolation is provided on the upper side of the conductive adhesive layer 180 overlapping the connection portion 122b of the first electrode 122), thus having better electrical isolation characteristics and reliability.

[0059] Similarly, in this embodiment, the width of the connection portion 122b of the first electrode 122 may be smaller than the width of the first barrier portion 134 and the width of the second barrier portion 154, so as to prevent the connection portion 122b of the first electrode 122 from being electrically connected to the second electrode 162.

[0060] In summary, through the alignment layer design of the present invention, even if a portion of the second electrode overlaps with both the first electrode and the conductive adhesive layer, the second electrode will not be electrically connected to the first electrode, causing a short circuit between them and resulting in the failure of the privacy device. Furthermore, there is no need to perform a patterning process on the second electrode. Therefore, the process of the privacy device can be simplified, thereby reducing the manufacturing cost and time of the privacy device.

[0061] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A privacy device, characterized in that, include: A first privacy shield substrate, comprising: A first substrate; and A first electrode and a first alignment layer are disposed on the first substrate; A second privacy shield substrate, opposite to the first privacy shield substrate, and the second privacy shield substrate includes: A second substrate; and A second electrode and a second alignment layer are disposed on the second substrate; A privacy shield layer is disposed between the first privacy shield substrate and the second privacy shield substrate; and A conductive adhesive layer is disposed between the first privacy substrate and the second privacy substrate; One of the first alignment layer and the second alignment layer includes a barrier portion, and the barrier portion overlaps the first electrode, the second electrode and the conductive adhesive layer in a normal direction of the first substrate.

2. The privacy device as described in claim 1, characterized in that, The second electrode is disposed entirely on one surface of the second substrate and is not patterned.

3. The privacy device as described in claim 1, characterized in that, The first privacy substrate further includes a third electrode, wherein the first electrode and the third electrode are separate from each other and not connected, the conductive adhesive layer overlaps the third electrode in the normal direction of the first substrate, and the third electrode is electrically connected to the second electrode through the conductive adhesive layer.

4. The privacy device as described in claim 1, characterized in that, The first alignment layer includes the barrier portion, and the barrier portion is disposed between the first electrode and the conductive adhesive layer.

5. The privacy device as described in claim 1, characterized in that, The second alignment layer includes the barrier portion, and the barrier portion is disposed between the second electrode and the conductive adhesive layer.

6. The privacy device as described in claim 1, characterized in that, The other of the first alignment layer and the second alignment layer includes another barrier portion, and the other barrier portion overlaps the first electrode, the second electrode and the conductive adhesive layer in the normal direction of the first substrate.

7. The privacy device as described in claim 6, characterized in that, The blocking portion and the other blocking portion overlap each other in the normal direction of the first substrate.

8. The privacy device as described in claim 1, characterized in that, The privacy device further includes a connecting pad. The first electrode includes a main electrode and a connecting portion. The main electrode is disposed in an active area of ​​the privacy device. The connecting portion is disposed outside the active area and electrically connects the main electrode and the connecting pad. The connecting portion overlaps the blocking portion in the normal direction of the first substrate.

9. The privacy device as described in claim 1, characterized in that, The first alignment layer and the second alignment layer each further include a main portion, and the main portion is disposed in an active area of ​​the privacy device.

10. The privacy device as described in claim 9, characterized in that, The barrier portion is disposed outside the active region and connects to the main portion of one of the first alignment layer and the second alignment layer, and the barrier portion protrudes outward from the main portion.

11. The privacy device as claimed in claim 1, characterized in that, The thickness of the barrier is greater than or equal to 350 angstroms. And less than or equal to 2000 angstroms.

12. The privacy device as claimed in claim 1, characterized in that, The resistivity of the barrier is greater than or equal to 10. 8 Ohms and centimeters.

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