A power module

Abstract

The application discloses a power module, comprising power units, each power unit comprising: an upper bridge power unit and a lower bridge power unit; a power terminal comprising a direct current positive terminal, a direct current negative terminal and an alternating current terminal; a printed circuit board comprising at least N layers of conductive layers, N>=4; a power terminal comprising a direct current positive terminal, a direct current negative terminal and an alternating current terminal; the first end of the upper bridge power unit and the second end of the lower bridge power unit are electrically connected to the alternating current terminal; the second end of the upper bridge power unit is electrically connected to the direct current positive terminal; the first end of the lower bridge unit is electrically connected to the direct current negative terminal; the application adopts embedded packaging technology to directly integrate the power unit in the printed circuit board, and realizes ultra-low parasitic inductance and ultra-high power density through a high-density interconnection structure and an advanced packaging process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a power module. Background Technology

[0002] In the field of power electronics, traditional power modules (such as IGBT and MOSFET modules) typically use discrete components soldered onto the surface of a printed circuit board or achieve electrical connections through wire bonding.

[0003] This structure suffers from problems such as large parasitic parameters, high thermal resistance, and limited power density, making it unable to meet the demands of high-frequency, high-density applications. Meanwhile, the ever-increasing requirements of modern electronic systems for miniaturization, lightweight design, and high reliability further highlight the limitations of existing technologies.

[0004] In view of the above problems, the object of the present invention is to provide a power module that solves the above problems.

[0005] This invention provides a power module and its manufacturing method, comprising power units, each power unit including: Upper bridge power unit; Lower bridge power unit; A printed circuit board, comprising at least N conductive layers, where N≥4, with adjacent conductive layers separated, and the first to Nth conductive layers arranged sequentially from top to bottom. The power terminals include a DC positive terminal, a DC negative terminal, and an AC terminal. The first terminal of the upper bridge power unit and the second terminal of the lower bridge power unit are electrically connected to the AC terminal; the second terminal of the upper bridge power unit is electrically connected to the DC positive terminal; and the first terminal of the lower bridge unit is electrically connected to the DC negative terminal. The upper bridge power unit is located between the i-th conductive layer and the (i+1)-th conductive layer, where 2≤i≤N-1, i is a positive integer, and N is a positive integer; The DC positive terminal passes through the conductive structure from the first conductive layer to the j-th conductive layer, thereby electrically connecting to the second end of the upper bridge power unit. The first end of the upper bridge power unit passes through the conductive structure from the i-th conductive layer to the h-th conductive layer, and then through the conductive structure from the h-th conductive layer to the k-th conductive layer, thereby electrically connecting to the second end of the lower bridge power unit. The first end of the lower bridge power unit passes through the conductive structure from the i-th conductive layer to the g-th conductive layer, thereby electrically connecting to the DC negative terminal, i+1≤j≤N, 1≤h≤i, i+1≤k≤N, 1≤g≤i; Preferably, the DC positive terminal, DC negative terminal, and AC terminal are located in the first conductive layer, with the DC positive terminal located between the DC negative terminal and the AC terminal.

[0006] Preferably, each of the N conductive layers includes a third conductive region and a fourth conductive region, and each of the first conductive layer to the (N-2)th conductive layer includes a first conductive region and a second conductive region. The second end of the upper bridge power unit is located in the second conductive region of the (i+1)th conductive layer, the second end of the lower bridge power unit is located in the fourth conductive region of the (i+1)th conductive layer, the first end of the upper bridge power unit is located in the first conductive region of the i-th conductive layer, and the first end of the lower bridge power unit is located in the third conductive region of the i-th conductive layer.

[0007] Preferably, the projections of the first conductive regions on adjacent conductive layers from top to bottom at least partially overlap, the projections of the second conductive regions on adjacent conductive layers from top to bottom at least partially overlap, the projections of the third conductive regions on adjacent conductive layers from top to bottom at least partially overlap, and the projections of the fourth conductive regions on adjacent conductive layers from top to bottom at least partially overlap. The first conductive regions of adjacent conductive layers are electrically connected to the first end of the upper bridge power unit through a conductive structure, the second conductive regions of adjacent conductive layers are electrically connected to the first end of the lower bridge power unit through a conductive structure, the third conductive regions of adjacent conductive layers are electrically connected to the second end of the upper bridge power unit through a conductive structure, and the fourth conductive regions of adjacent conductive layers are electrically connected to the second end of the lower bridge power unit through a conductive structure.

[0008] Preferably, h equals g, j equals k, the first conductive region of the h-th conductive layer and the fourth conductive region of the h-th conductive layer are interconnected, or the first conductive region of the h-th conductive layer and the fourth conductive region of the h-th conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the h-th conductive layer electrically connected.

[0009] Preferably, during power module commutation, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the j-th conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the i-th conductive layer to the first conductive area of ​​the h-th conductive layer, from the fourth conductive area of ​​the h-th conductive layer to the fourth conductive area of ​​the j-th conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the i-th conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

[0010] Preferably, the first conductive region of the (i-1)th conductive layer and the fourth conductive region of the (i-1)th conductive layer are interconnected, or the first conductive region of the (i-1)th conductive layer and the fourth conductive region of the (i-1)th conductive layer are integral structures, thereby making the first conductive region and the fourth conductive region of the (i-1)th conductive layer electrically connected.

[0011] Preferably, during power module commutation, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the Nth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the i-th conductive layer to the first conductive area of ​​the (i-1)-th conductive layer, from the fourth conductive area of ​​the (i-1)-th conductive layer to the fourth conductive area of ​​the N-th conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the i-th conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

[0012] Preferably, N equals 5, and the first conductive region of the second conductive layer and the fourth conductive region of the second conductive layer are interconnected, or the first conductive region of the second conductive layer and the fourth conductive region of the second conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the second conductive layer electrically connected.

[0013] Preferably, during power module commutation, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the fifth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the third conductive layer to the first conductive area of ​​the second conductive layer, from the fourth conductive area of ​​the second conductive layer to the fourth conductive area of ​​the fifth conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the third conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

[0014] Preferably, N equals 4, and the first conductive region of the first conductive layer and the fourth conductive region of the first conductive layer are interconnected, or the first conductive region of the second conductive layer and the fourth conductive region of the second conductive layer are integral structures, thereby making the first conductive region and the fourth conductive region of the first conductive layer electrically connected.

[0015] Preferably, during power module commutation, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the fourth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the second conductive layer to the first conductive area of ​​the first conductive layer, from the fourth conductive area of ​​the first conductive layer to the fourth conductive area of ​​the fourth conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the second conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

[0016] Preferably, N is 5, and the first conductive layer includes: a first conductive region of the first conductive layer, a second conductive region of the first conductive layer, a third conductive region of the first conductive layer, and a fourth conductive region of the first conductive layer; The second conductive layer includes: a first conductive region of the second conductive layer, a second conductive region of the second conductive layer, a third conductive region of the second conductive layer, and a fourth conductive region of the second conductive layer. The third conductive layer includes: a first conductive region of the third conductive layer, a second conductive region of the third conductive layer, a third conductive region of the third conductive layer, and a fourth conductive region of the third conductive layer; The fourth conductive layer includes: a second conductive region of the fourth conductive layer and a fourth conductive region of the fourth conductive layer; The fifth conductive layer includes: the second conductive region of the fifth conductive layer and the fourth conductive region of the fifth conductive layer.

[0017] Preferably, the first conductive region and the fourth conductive region of the first conductive layer are an integral structure.

[0018] Preferably, N is 4, and the first conductive layer includes: a first conductive region of the first conductive layer, a second conductive region of the first conductive layer, a third conductive region of the first conductive layer, and a fourth conductive region layer of the first conductive layer; The second conductive layer includes: a first conductive region of the second conductive layer, a second conductive region layer of the second conductive layer, a third conductive region of the second conductive layer, and a fourth conductive region of the second conductive layer. The third conductive layer includes: a second conductive region and a fourth conductive region of the third conductive layer; The fourth conductive layer includes: a second conductive region of the fourth conductive layer and a fourth conductive region of the fourth conductive layer.

[0019] Preferably, the first, second, third, and fourth conductive regions of the second to Nth conductive layers have a symmetrical structure.

[0020] Preferably, the second conductive region of the first conductive layer serves as a DC positive terminal; the third conductive region of the first conductive layer serves as a DC negative terminal; and the first conductive region and the fourth conductive region of the first conductive layer are interconnected and serve as AC terminals.

[0021] Preferably, the power module further includes a first signal terminal, a second signal terminal, a third signal terminal, a fourth signal terminal, a fifth signal terminal, and a sixth signal terminal, wherein the first signal terminal, the second signal terminal, and the third signal terminal are upper bridge signal terminals, the fourth signal terminal, the fifth signal terminal, and the sixth signal terminal are lower bridge signal terminals, and the sixth signal terminal reuses the first signal terminal.

[0022] Preferably, the first conductive layer further includes a fifth conductive region, a sixth conductive region, a seventh conductive region, an eighth conductive region, and a ninth conductive region; The first end of the upper bridge power unit extends from the i-th conductive layer to the fifth conductive region of the first conductive layer and is electrically connected to the first signal terminal; the second end of the upper bridge power unit extends from the (i+1)-th conductive layer to the sixth conductive region of the first conductive layer and is electrically connected to the second signal terminal; the third end of the upper bridge power unit extends from the i-th conductive layer to the seventh conductive region of the first conductive layer and is electrically connected to the third signal terminal; the first end of the lower bridge power unit extends from the i-th conductive layer to the eighth conductive region of the first conductive layer and is electrically connected to the fourth signal terminal; the third end of the lower bridge power unit extends from the i-th conductive layer to the ninth conductive region of the first conductive layer and is electrically connected to the fifth signal terminal.

[0023] Preferably, the three power units form a full-bridge structure.

[0024] Preferably, the printed circuit boards of the three power units are independent of each other.

[0025] Preferably, the three power units share a single printed circuit board.

[0026] Preferably, the full-bridge structure consisting of three power units also includes a heat dissipation base plate at the bottom.

[0027] Preferably, the printed circuit board further includes an N+1th conductive layer, and the Nth conductive layer and the N+1th conductive layer are insulated from each other.

[0028] Preferably, the N+1th conductive layer and the heat dissipation base plate are interconnected by solder, sintering material, eutectic solder, or resin-containing composite material.

[0029] Preferably, the upper bridge signal terminal and the lower bridge signal terminal are perpendicular to the first conductive layer.

[0030] Preferably, the upper bridge signal terminals and the lower bridge signal terminals are arranged diagonally or on the same side.

[0031] Preferably, the power terminals, upper bridge signal terminals, lower bridge signal terminals and printed circuit boards are interconnected by solder, sintering materials, hot pressing of composite materials, ultrasonic welding or laser welding.

[0032] Preferably, the power terminals, upper bridge signal terminals, and lower bridge signal terminals are directly embedded in the printed circuit board and led out from the first conductive layer.

[0033] Preferably, the first signal terminal, the second signal terminal, the third signal terminal, the fourth signal terminal and the fifth signal terminal are led out from the first conductive layer to the corresponding first type of pads, the upper bridge signal terminal and the lower bridge signal terminal are located on the plug-in, the plug-in has a corresponding second type of pads, and the first pads and the second pads are soldered to the corresponding terminals.

[0034] Preferably, the printed circuit board has openings, and the first signal terminal, the second signal terminal, the third signal terminal, the fourth signal terminal and the fifth signal terminal are interference-connected by inserting into the openings.

[0035] Preferably, the thickness of the printed circuit board is 1.5~3mm.

[0036] Preferably, the thickness of the printed circuit board is 2~2.5mm.

[0037] Preferably, the distance between the AC terminal and the DC negative terminal and the DC positive terminal is 5~60mm.

[0038] Preferably, the distance between the AC terminal and the DC negative terminal and the DC positive terminal is 15~45mm.

[0039] Preferably, the upper bridge power unit includes one upper bridge power device or multiple upper bridge power devices connected in parallel; the lower bridge power unit includes one lower bridge power device or multiple lower bridge power devices connected in parallel.

[0040] Preferably, the upper bridge power device and the lower bridge power device are either IGBTs or MOSFETs.

[0041] Preferably, the power module further includes a temperature-sensitive unit, which includes a first temperature-sensitive signal terminal and a second temperature-sensitive signal terminal.

[0042] Preferably, the first and second temperature-sensitive signal terminals are placed in the same connector as the fourth and fifth signal terminals.

[0043] Preferably, the temperature-sensitive unit is located in any conductive layer, upper bridge power unit, lower bridge power unit, or heat dissipation base plate.

[0044] The power module provided by this invention embeds power devices directly inside the printed circuit board. By utilizing high-density interconnection and advanced packaging technology, it achieves ultra-low impurity and high power density, while saving system costs. It can be widely used in power conversion systems in fields such as new energy vehicles, industrial automation, renewable energy and consumer electronics.

[0045] Furthermore, in the power module provided by this invention, the DC positive terminal in the first conductive layer is located between the AC terminal and the DC negative terminal. When the upper bridge power unit is turned on and the lower bridge power unit is turned on, the commutation current flows from the DC positive terminal downwards through the second conductive region of the first conductive layer to the second conductive region of the j-th conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive region of the i-th conductive layer to the first conductive region of the h-th conductive layer, from the fourth conductive region of the h-th conductive layer to the fourth conductive region of the j-th conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive region of the i-th conductive layer to the third conductive region of the first conductive layer, and finally to the DC negative terminal. Here, the i-th conductive layer is the conductive layer where the first end of the power unit is located, the h-th layer is any layer above the i-th conductive layer, and the j-th layer is any layer below the i-th conductive layer. This ensures that the current directions in the h-th and j-th conductive layers are opposite, resulting in canceling magnetic fields and reducing unwanted inductance.

[0046] Furthermore, the first conductive region and the fourth conductive region of the h-th conductive layer of the power module provided by the present invention are interconnected or form an integral structure, thereby enabling the first end of the upper bridge power unit and the second end of the lower bridge power unit to reuse the circuit, reducing the number of conductive regions, lowering the thermal resistance of the power module, and improving the power density of the power module.

[0047] Furthermore, the first, second, third, and fourth conductive regions of the second to Nth conductive layers have a symmetrical structure, making the circuit simpler, easier to implement in industry, and ensuring current sharing. Attached Figure Description

[0048] The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the invention with reference to the accompanying drawings, in which: Figure 1 A circuit diagram of the power module of the present invention is shown; Figure 2 A schematic diagram of the current flow direction in Embodiment 1 of the power unit of the present invention is shown; Figure 3a -f shows a schematic diagram of each layer structure of the power unit in Embodiment 1 of the present invention; Figure 4 The front view and rear view of the overall structure of the power unit according to Embodiment 1 of the present invention are shown; Figure 5 A schematic diagram of the structure of the first conductive layer in Embodiment 2 of the power unit of the present invention is shown; Figure 6 A schematic diagram of a power module according to a first embodiment of the present invention is shown; Figure 7 A schematic diagram of a second embodiment of the power module of the present invention is shown. Detailed Implementation

[0049] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application may be implemented in various forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0050] Various embodiments of the invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by the same or similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale.

[0051] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0052] Figure 1 The circuit diagram of the power module provided by the present invention is shown. Figure 4 The front view and rear view of a power unit embodiment 1 provided by the present invention are shown. Figure 6 and Figure 7 A schematic diagram of the power module structure shows that the power module includes three power units, each of which includes: Upper bridge power unit 201; Lower bridge power unit 202; like Figures 3a-3f As shown, the printed circuit board 200 includes at least N conductive layers, where N ≥ 4, adjacent conductive layers are separated, and the first conductive layer to the Nth conductive layer are arranged sequentially from top to bottom. The power terminals include a DC positive terminal DC+, a DC negative terminal DC-, and an AC terminal. The first end of the upper bridge power unit 201 and the second end of the lower bridge power unit 202 are electrically connected to the AC terminal. The second end of the upper bridge power unit 201 is electrically connected to the DC positive terminal DC+, and the first end of the lower bridge unit is electrically connected to the DC negative terminal DC-. like Figures 3a-3f As shown, the upper bridge power unit 201 is located between the i-th conductive layer and the (i+1)-th conductive layer, where 2≤i≤N-1, i is a positive integer, and N is a positive integer; like Figure 2 , Figures 3a-3fAs shown, the DC positive terminal DC+ passes through the conductive structure sequentially from the first conductive layer to the j-th conductive layer, thereby electrically connecting to the second terminal of the upper bridge power unit 201. The first terminal of the upper bridge power unit 201 passes through the conductive structure from the i-th conductive layer to the h-th conductive layer, and then through the conductive structure from the h-th layer to the k-th layer, thereby electrically connecting to the second terminal of the lower bridge power unit 202. The first terminal of the lower bridge power unit 202 passes through the conductive structure from the i-th conductive layer to the g-th layer, thereby electrically connecting to the DC negative terminal DC-, where i+1<j≤N, 1≤h<i, i+1<k≤N, and 1≤g<i.

[0053] like Figure 4 , Figure 6 , Figure 7 As shown, the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal AC are located in the first conductive layer, with the DC positive terminal DC+ located between the DC negative terminal DC- and the AC terminal AC.

[0054] like Figures 3a-3f As shown, each of the N conductive layers contains a third conductive region and a fourth conductive region, and each of the first conductive layer to the (N-2)th conductive layer contains a first conductive region and a second conductive region. The second end of the upper bridge power unit 201 is located on the second conductive region of the (i+1)th conductive layer, the second end of the lower bridge power unit 202 is located on the fourth conductive region of the (i+1)th conductive layer, the first end of the upper bridge power unit 201 is located below the first conductive region of the i-th conductive layer, and the first end of the lower bridge power unit 202 is located below the third conductive region of the i-th conductive layer.

[0055] like Figures 3a-3f As shown, the projections of the first conductive region S1 on each conductive layer from top to bottom at least partially overlap, the projections of the second conductive region D1 on each conductive layer from top to bottom at least partially overlap, the projections of the third conductive region S2 on each conductive layer from top to bottom at least partially overlap, the projections of the fourth conductive region D2 on each conductive layer from top to bottom at least partially overlap, the first conductive region S1 of each conductive layer is electrically connected to the first terminal of the upper bridge power unit 201, the second metal D1 layer of each conductive layer is electrically connected to the second terminal of the upper bridge power unit 201, the third conductive region S2 of each conductive layer is electrically connected to the first terminal of the lower bridge power unit 201, and the fourth conductive region D2 of each conductive layer is electrically connected to the second terminal of the lower bridge power unit 202.

[0056] like Figure 3b As shown, h equals g, j equals k, the first conductive region S1 of the h-th conductive layer and the fourth conductive region D2 of the h-th conductive layer are interconnected, or the first conductive region S1 of the h-th conductive layer and the fourth conductive region D2 of the h-th conductive layer are an integral structure, thereby making the first conductive region S1 and the fourth conductive region D2 of the h-th conductive layer electrically connected.

[0057] like Figure 2 As shown, during power module commutation, the upper bridge power unit 201 is turned on, and the lower bridge power unit 202 is turned on. The commutation current flows from the DC positive terminal DC+ through the second conductive area M1-D1 of the first conductive layer to the second conductive area Mj-D1 of the j-th conductive layer, the second terminal of the upper bridge power unit 201, the first terminal of the upper bridge power unit 201, the first conductive area Mi-S1 of the i-th conductive layer to the first conductive area Mh-S1 of the h-th conductive layer, from the fourth conductive area Mh-D2 of the h-th conductive layer to the fourth conductive area Mj-D2 of the j-th conductive layer, the second terminal of the lower bridge power unit 202, the first terminal of the lower bridge power unit 202, the third conductive area Mi-S2 of the i-th conductive layer to the third conductive area M1-S2 of the first conductive layer, and the DC negative terminal DC-.

[0058] like Figure 3b As shown, the first conductive region Mi-1-S1 of the (i-1)th conductive layer and the fourth conductive region Mi-1-D2 of the (i-1)th conductive layer are interconnected, or the first conductive region Mi-1-S1 of the (i-1)th conductive layer and the fourth conductive region Mi-1-D2 of the (i-1)th conductive layer are integral structures, thereby making the first conductive region Mi-1-S1 and the fourth conductive region Mi-1-D2 of the (i-1)th conductive layer electrically connected.

[0059] like Figure 2 As shown, during power module commutation, the upper bridge power unit 201 is turned on, the lower bridge power unit 202 is turned on, and the commutation current flows from the DC positive terminal DC+ through the second conductive area M1-D1 of the first conductive layer to the second conductive area MN-D1 of the Nth conductive layer, the second terminal of the upper bridge power unit 201, the first terminal of the upper bridge power unit 201, the first conductive area Mi-S1 of the i-th conductive layer to the first conductive area Mi-1-S1 of the (i-1)-th conductive layer, from the fourth conductive area Mi-1-D2 of the (i-1)-th conductive layer to the fourth conductive area MN-D2 of the N-th conductive layer, the second terminal of the lower bridge power unit 202, the first terminal of the lower bridge power unit 202, the third conductive area Mi-S1 of the i-th conductive layer to the third conductive area M1-S1 of the first conductive layer, and the DC negative terminal DC-.

[0060] As shown in Figure 3 to Figure 7 As shown, the power unit also includes signal terminals: a first signal terminal S1, a second signal terminal D1, a third signal terminal G1, a fourth signal terminal S2, and a fifth signal terminal G2, wherein the first signal terminal S1, the second signal terminal D1, and the third signal terminal G1 are upper bridge signal terminals, and the fourth signal terminal S2, the fifth signal terminal G2, and the sixth signal terminal D2 are lower bridge signal terminals, wherein the sixth signal terminal D2 multiplexes the first signal terminal S1.

[0061] like Figure 3a As shown, the first conductive layer also includes a fifth conductive region M1-5, a sixth conductive region M1-6, a seventh conductive region M1-7, an eighth conductive region M1-8, and a ninth conductive region M1-9; like Figures 3a to 3f As shown, the first end of the upper bridge power unit 201 extends from the i-th conductive layer from bottom to top to the fifth conductive area M1-5 of the first conductive layer and is electrically connected to the first signal terminal S1; the second end of the upper bridge power unit 201 extends from the (i+1)-th conductive layer to the sixth conductive area M1-6 of the first conductive layer and is electrically connected to the second signal terminal D1; the third end of the upper bridge power unit 201 extends from the i-th conductive layer to the seventh conductive area M1-7 of the first conductive layer and is electrically connected to the third signal terminal G1; the first end of the lower bridge power unit 202 extends from the i-th conductive layer to the eighth conductive area M1-8 of the first conductive layer and is electrically connected to the fourth signal terminal S2; the third end of the lower bridge power unit 202 extends from the i-th conductive layer to the ninth conductive area M1-9 of the first conductive layer and is electrically connected to the fifth signal terminal G2.

[0062] like Figure 3f As shown, the printed circuit board also includes an N+1th conductive layer, and the Nth conductive layer and the N+1th conductive layer are insulated from each other; the N+1th conductive layer and the heat sink base plate 100 are interconnected by solder, sintering material, eutectic solder or resin-containing composite material.

[0063] like Figure 6 , Figure 7 As shown, the upper bridge signal terminal and the lower bridge signal terminal are perpendicular to the first conductive layer; the upper bridge signal terminal and the lower bridge signal terminal are arranged diagonally or on the same side (not shown in the figure); the power terminal and the signal terminal are interconnected with the printed circuit board 200 by solder, sintering material, composite material hot pressing, ultrasonic welding or laser welding.

[0064] like Figure 6 , Figure 7 As shown, power terminals and signal terminals are directly embedded in the printed circuit board 200 and led out from the first conductive layer. Specifically, the first signal terminal S1, the second signal terminal D1, the third signal terminal G1, the fourth signal terminal S2, and the fifth signal terminal G2 have first-type pads led out from the first conductive layer. The signal terminals are located on the plug-in, which has corresponding second-type pads. The first-type and second-type pads are soldered to their corresponding terminals. Alternatively, the printed circuit board 200 has openings, and the first signal terminal S1, the second signal terminal D1, the third signal terminal G1, the fourth signal terminal S2, and the fifth signal terminal G2 are interference-fitted through these openings.

[0065] Furthermore, the thickness of the printed circuit board 200 is 1.5~3mm; specifically, the thickness of the printed circuit board 200 is 2~2.5mm.

[0066] Furthermore, the distance between the AC terminal and the DC negative terminal DC- of the power module and the DC positive terminal DC+ is 5~60mm; specifically, the distance between the AC terminal and the DC negative terminal DC- and the DC positive terminal DC+ is 15~45mm.

[0067] Furthermore, the upper bridge power unit includes one upper bridge power device or multiple upper bridge power devices connected in parallel; the lower bridge power unit includes one lower bridge power device or multiple lower bridge power devices connected in parallel; the upper bridge power device and the lower bridge power device are either IGBTs or MOSFETs.

[0068] The power module also includes a temperature-sensitive unit 400, which includes a first temperature-sensitive signal terminal NTC1 and a second temperature-sensitive signal terminal NTC2, such as... Figure 6 , Figure 7 As shown.

[0069] The first temperature-sensitive signal terminal NTC1, the second temperature-sensitive signal terminal NTC2, the fourth signal terminal S2, and the fifth signal terminal G2 are placed in the same plug-in.

[0070] The temperature-sensitive unit 400 is located on any conductive layer, upper bridge power device 201, lower bridge power device 202, and heat dissipation base plate 100.

[0071] To further explain, Figure 2 Taking a five-layer conductive layer as an example, the power module includes five conductive layers. The first end of the upper bridge power unit 201 and the first end of the lower bridge power unit 202 are located below the third conductive layer, and the second end of the upper bridge power unit 201 and the second end of the lower bridge power unit 202 are located on the fourth conductive layer.

[0072] like Figure 3b As shown, the first conductive region M2-S1 of the second conductive layer and the fourth conductive region M2-D2 of the second conductive layer are interconnected, or the first conductive region M2-S1 of the second conductive layer and the fourth conductive region M2-D2 of the second conductive layer are an integral structure.

[0073] like Figure 2 As shown, during power module commutation, the upper bridge power unit 201 is turned on, the lower bridge power unit is turned on, and the commutation current flows vertically downward from the DC positive terminal (DC+) through the first conductive layer to the fifth conductive layer, the second end of the upper bridge power unit 201, the first end of the upper bridge power unit 202, and back to the second conductive layer; then it flows vertically downward from the second conductive layer to the fifth conductive layer, the second end of the lower bridge power unit 202, and the first end of the lower bridge power unit 202 through the first and second conductive layers to the DC negative terminal.

[0074] During commutation, the current in the upper bridge power unit 201 at the fifth conductive layer (such as...) Figure 2 The current in the fifth blue layer (as shown in the middle) and the current in the second conductive layer (as shown in the middle) Figure 2 The current flows in opposite directions in the second red layer (as shown in the middle), and the thickness of the printed circuit board 200 is 2~2.5mm, so that the magnetic field of the current between the two conductive layers can cancel each other out, thereby reducing stray inductance.

[0075] To further illustrate the present invention, Figures 3a-3f This is a schematic diagram of the structure of each layer of the five conductive layers in Embodiment 1 of the power unit of the present invention.

[0076] Figure 3a The first conductive layer of the printed circuit board 200 shown includes: a first conductive region M1-S1, a second conductive region M1-D1, a third conductive region M1-S2, and a fourth conductive region M1-D2. Figure 3b The printed circuit board 200 shown has a second conductive layer. The second conductive layer includes: a first conductive region M2-S1, a second conductive region M2-D1, a third conductive region M2-S2, and a fourth conductive region M2-D2. Figure 3c The printed circuit board 200 shown has a third conductive layer. The third conductive layer includes: a first conductive region M3-S1, a second conductive region M3-D1, a third conductive region M3-S2, and a fourth conductive region M3-D2. Figure 3d The fourth conductive layer of the printed circuit board 200 shown. The fourth conductive layer includes: a second conductive region M4-D1 and a fourth conductive region M4-D2 of the fourth conductive layer; Figure 3e The fourth conductive layer of the printed circuit board 200 shown. The fifth conductive layer includes: the second conductive region M5-D1 of the fifth conductive layer, and the fourth conductive region M5-D2 of the fifth conductive layer.

[0077] like Figure 3b As shown, the first conductive region M2-S1 of the second conductive layer and the fourth conductive region M2-D2 of the second conductive layer are interconnected, or the first conductive region M2-S1 of the second conductive layer and the fourth conductive region M2-D2 of the second conductive layer are an integral structure; the first conductive region M1-S1 of the first conductive layer and the fourth conductive region M1-D2 of the first conductive layer are an integral structure.

[0078] like Figure 2As shown, during power module commutation, the upper bridge power unit 201 is turned on, and the lower bridge power unit 202 is turned on. The commutation current flows from the DC positive terminal DC+ through the second conductive area M1-D1 of the first conductive layer to the second conductive area M5-D1 of the fifth conductive layer, the second terminal of the upper bridge power unit 201, the first terminal of the upper bridge power unit 201, the first conductive area M3-S1 of the third conductive layer to the first conductive area M2-S1 of the second conductive layer, from the fourth conductive area M2-D2 of the second conductive layer to the fourth conductive area M5-D2 of the fifth conductive layer, the second terminal of the lower bridge power unit 202, the first terminal of the lower bridge power unit 202, the third metal layer M3-S2 of the third conductive layer to the third conductive area M1-S2 of the first conductive layer, and finally to the DC negative terminal DC-.

[0079] like Figures 3b to 3e As shown, the first, second, third, and fourth conductive regions of the second to fifth conductive layers have a symmetrical structure, making the circuit simpler, easier to implement in industry, and ensuring current sharing.

[0080] like Figure 3a As shown, the first conductive layer also includes a fifth conductive region M1-5, a sixth conductive region M1-6, a seventh conductive region M1-7, an eighth conductive region M1-8, and a ninth conductive region M1-9.

[0081] like Figure 3a As shown, the first end of the upper bridge power unit 201 extends from the third conductive layer to the fifth metal M1-5 layer of the first conductive layer and is electrically connected to the first signal terminal S1; the second end of the upper bridge power unit 201 extends from the fourth conductive layer to the sixth conductive area M1-6 of the first conductive layer and is electrically connected to the second signal terminal D1; the third end of the upper bridge power unit 201 extends from the third conductive layer to the seventh conductive area M1-7 of the first conductive layer and is electrically connected to the third signal terminal G1; the first end of the lower bridge power unit 202 extends from the third conductive layer to the eighth conductive area M1-8 of the first conductive layer and is electrically connected to the fourth signal terminal S2; the third end of the lower bridge power unit 202 extends from the third conductive layer to the ninth conductive area M1-9 of the first conductive layer and is electrically connected to the fifth signal terminal G2.

[0082] like Figure 3f As shown, the printed circuit board also includes a sixth conductive layer, and the fifth and sixth conductive layers are insulated from each other.

[0083] Figure 5 This is a schematic diagram of the first conductive layer structure of a power unit in Embodiment 2 of the present invention. This embodiment includes four conductive layers, wherein the first conductive layer is a combination of the first and second conductive layers of Embodiment 1, as shown below. Figure 5As shown, the second conductive layer of Embodiment 2 is consistent with the third conductive layer of Embodiment 1, the third conductive layer of Embodiment 2 is consistent with the fourth conductive layer of Embodiment 1, the fourth conductive layer of Embodiment 2 is consistent with the fifth conductive layer of Embodiment 1, and the fifth conductive layer of Embodiment 2 is consistent with the sixth conductive layer of Embodiment 1.

[0084] The first conductive layer in this embodiment includes a first conductive region M1-S1, a second conductive region M1-D1, a third conductive region M1-S2, a fourth conductive region M1-D2, a fifth conductive region M1-5, a sixth conductive region M1-6, a seventh conductive region M1-7, an eighth conductive region M1-8, and a ninth conductive region M1-9.

[0085] Furthermore, the first conductive region M1-S1 and the fourth conductive region M1-D2 of the first conductive layer are interconnected, or the first conductive region M1-S1 and the fourth conductive region M1-D2 of the first conductive layer are an integral structure.

[0086] Furthermore, the upper bridge power unit 201 is turned on, the lower bridge power unit 202 is turned on, and the commutation current flows from the DC positive terminal DC+ through the second conductive area M1-D2 of the first conductive layer to the second conductive area M4-D2 of the fourth conductive layer, the second terminal of the upper bridge power unit 201, the first terminal of the upper bridge power unit 201, the first conductive area M2-S1 of the second conductive layer to the first conductive area M1-S1 of the first conductive layer, from the fourth conductive area M1-D2 of the first conductive layer to the fourth conductive area M4-D2 of the fourth conductive layer, the second terminal of the lower bridge power unit 202, the first terminal of the lower bridge power unit 202, the third conductive area M2-S2 of the second conductive layer to the third conductive area M1-S2 of the first conductive layer, and the DC negative terminal DC-.

[0087] The three power units in Embodiments 1 and 2 of this invention form a full-bridge structure, and the printed circuit boards 200 of the three power units are independent of each other, as shown below. Figure 6 As shown, or three power units share a single printed circuit board, such as... Figure 7 As shown.

[0088] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to effectively utilize the invention and its modifications. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A power module, characterized in that, Includes power units, each of which includes: Upper bridge power unit; Lower bridge power unit; A printed circuit board, the printed circuit board comprising at least N conductive layers, wherein N≥4, adjacent conductive layers are separated, and the first conductive layer to the Nth conductive layer are arranged sequentially from top to bottom; The power terminals include a DC positive terminal, a DC negative terminal, and an AC terminal. The first end of the upper bridge power unit and the second end of the lower bridge power unit are electrically connected to the AC terminal, the second end of the upper bridge power unit is electrically connected to the DC positive terminal, and the first end of the lower bridge power unit is electrically connected to the DC negative terminal. The upper bridge power unit is located between the i-th conductive layer and the (i+1)-th conductive layer, where 2≤i≤N-1, i is a positive integer, and N is a positive integer; The DC positive terminal passes through the conductive structure sequentially from the first conductive layer to the j-th conductive layer, thereby electrically connecting to the second end of the upper bridge power unit. The first end of the upper bridge power unit passes through the conductive structure from the i-th conductive layer to the h-th conductive layer, and then through the conductive structure from the h-th conductive layer to the k-th conductive layer, thereby electrically connecting to the second end of the lower bridge power unit. The first end of the lower bridge power unit passes through the conductive structure from the i-th conductive layer to the g-th conductive layer, thereby electrically connecting to the DC negative terminal, i+1<j≤N, 1≤h<i, i+1<k≤N, 1≤g<i.

2. The power module according to claim 1, characterized in that, The DC positive terminal, DC negative terminal, and AC terminal are located in the first conductive layer, with the DC positive terminal located between the DC negative terminal and the AC terminal.

3. The power module according to claim 1, characterized in that, The N conductive layers each contain a third conductive region and a fourth conductive region, and the first conductive layer to the (N-2)th conductive layer each contain a first conductive region and a second conductive region. The second end of the upper bridge power unit is located on the second conductive region of the (i+1)th conductive layer, the second end of the lower bridge power unit is located on the fourth conductive region of the (i+1)th conductive layer, the first end of the upper bridge power unit is located below the first conductive region of the i-th conductive layer, and the first end of the lower bridge power unit is located below the third conductive region of the i-th conductive layer.

4. The power module according to claim 3, characterized in that, The projections of the first conductive regions on adjacent conductive layers from top to bottom at least partially overlap; the projections of the second conductive regions on adjacent conductive layers from top to bottom at least partially overlap; the projections of the third conductive regions on adjacent conductive layers from top to bottom at least partially overlap; the projections of the fourth conductive regions on adjacent conductive layers from top to bottom at least partially overlap; the first conductive regions of adjacent conductive layers are electrically connected to the first end of the upper bridge power unit through a conductive structure; the second conductive regions of adjacent conductive layers are electrically connected to the first end of the lower bridge power unit through a conductive structure; the third conductive regions of adjacent conductive layers are electrically connected to the second end of the upper bridge power unit through a conductive structure; and the fourth conductive regions of adjacent conductive layers are electrically connected to the second end of the lower bridge power unit through a conductive structure.

5. The power module according to claim 4, characterized in that, h equals g, j equals k, the first conductive region of the h-th conductive layer and the fourth conductive region of the h-th conductive layer are interconnected, or the first conductive region of the h-th conductive layer and the fourth conductive region of the h-th conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the h-th conductive layer electrically connected.

6. The power module according to claim 5, characterized in that, During the commutation of the power module, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the j-th conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the i-th conductive layer to the first conductive area of ​​the h-th conductive layer, from the fourth conductive area of ​​the h-th conductive layer to the fourth conductive area of ​​the j-th conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the i-th conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

7. The power module according to claim 4, characterized in that, The first conductive region of the (i-1)th conductive layer and the fourth conductive region of the (i-1)th conductive layer are interconnected, or the first conductive region of the (i-1)th conductive layer and the fourth conductive region of the (i-1)th conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the (i-1)th conductive layer electrically connected.

8. The power module according to claim 7, characterized in that, During the commutation of the power module, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the Nth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the i-th conductive layer to the first conductive area of ​​the (i-1)-th conductive layer, from the fourth conductive area of ​​the (i-1)-th conductive layer to the fourth conductive area of ​​the N-th conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the i-th conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

9. The power module according to claim 4, characterized in that, The N is equal to 5. The first conductive region of the second conductive layer and the fourth conductive region of the second conductive layer are interconnected, or the first conductive region of the second conductive layer and the fourth conductive region of the second conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the second conductive layer electrically connected.

10. The power module according to claim 9, characterized in that, During the commutation of the power module, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the fifth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the third conductive layer to the first conductive area of ​​the second conductive layer, from the fourth conductive area of ​​the second conductive layer to the fourth conductive area of ​​the fifth conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the third conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

11. The power module according to claim 4, characterized in that, The N is equal to 4, and the first conductive region of the first conductive layer is connected to the fourth conductive region of the first conductive layer, or the first conductive region of the first conductive layer and the fourth conductive region of the first conductive layer are an integral structure, thereby making the first conductive region and the fourth conductive region of the first conductive layer electrically connected.

12. The power module according to claim 11, characterized in that, During the commutation of the power module, the upper bridge power unit is turned on, the lower bridge power unit is turned on, and the commutation current flows from the DC positive terminal through the second conductive area of ​​the first conductive layer to the second conductive area of ​​the fourth conductive layer, the second end of the upper bridge power unit, the first end of the upper bridge power unit, the first conductive area of ​​the second conductive layer to the first conductive area of ​​the first conductive layer, from the fourth conductive area of ​​the first conductive layer to the fourth conductive area of ​​the fourth conductive layer, the second end of the lower bridge power unit, the first end of the lower bridge power unit, the third conductive area of ​​the second conductive layer to the third conductive area of ​​the first conductive layer, and the DC negative terminal.

13. The power module according to claim 10, characterized in that, The value of N is 5. The first conductive layer includes: a first conductive region of the first conductive layer, a second conductive region of the first conductive layer, a third conductive region of the first conductive layer, and a fourth conductive region layer of the first conductive layer; The second conductive layer includes: a first conductive region of the second conductive layer, a second conductive region of the second conductive layer, a third conductive region of the second conductive layer, and a fourth conductive region of the second conductive layer; The third conductive layer includes: a first conductive region of the third conductive layer, a second conductive region layer of the third conductive layer, a third conductive region of the third conductive layer, and a fourth conductive region of the third conductive layer; The fourth conductive layer includes: a second conductive region of the fourth conductive layer and a fourth conductive region of the fourth conductive layer; The fifth conductive layer includes: a second conductive region of the fifth conductive layer and a fourth conductive region of the fifth conductive layer.

14. The power module according to claim 13, characterized in that, The first conductive region and the fourth conductive region of the first conductive layer are an integral structure.

15. The power module according to claim 12, characterized in that, The value of N is 4. The first conductive layer includes: a first conductive region of the first conductive layer, a second conductive region of the first conductive layer, a third conductive region of the first conductive layer, and a fourth conductive region layer of the first conductive layer; The second conductive layer includes: a first conductive region of the second conductive layer, a second conductive region layer of the second conductive layer, a third conductive region of the second conductive layer, and a fourth conductive region of the second conductive layer; The third conductive layer includes: a second conductive region and a fourth conductive region of the third conductive layer; The fourth conductive layer includes: a second conductive region of the fourth conductive layer, and a fourth conductive region of the fourth conductive layer.

16. The power module according to claim 3, characterized in that, The first, second, third, and fourth conductive regions of the second to Nth conductive layers have a symmetrical structure.

17. The power module according to claim 8, characterized in that, The power module further includes a first signal terminal, a second signal terminal, a third signal terminal, a fourth signal terminal, a fifth signal terminal, and a sixth signal terminal, wherein the first signal terminal, the second signal terminal, and the third signal terminal are upper bridge signal terminals, the fourth signal terminal, the fifth signal terminal, and the sixth signal terminal are lower bridge signal terminals, and the sixth signal terminal reuses the first signal terminal.

18. The power module according to claim 17, characterized in that, The first conductive layer further includes a fifth conductive region, a sixth conductive region, a seventh conductive region, an eighth conductive region, and a ninth conductive region; The first end of the upper bridge power unit extends from the i-th conductive layer from bottom to top to the fifth conductive area of ​​the first conductive layer and is electrically connected to the first signal terminal; the second end of the upper bridge power unit extends from the (i+1)-th conductive layer to the sixth conductive area of ​​the first conductive layer and is electrically connected to the second signal terminal; the third end of the upper bridge power unit extends from the i-th conductive layer to the seventh conductive area of ​​the first conductive layer and is electrically connected to the third signal terminal; the first end of the lower bridge power unit extends from the i-th conductive layer to the eighth conductive area of ​​the first conductive layer and is electrically connected to the fourth signal terminal; the third end of the lower bridge power unit extends from the i-th conductive layer to the ninth conductive area of ​​the first conductive layer and is electrically connected to the fifth signal terminal.

19. The power module according to claim 17 or 18, characterized in that, The three power units form a full-bridge structure.

20. The power module according to claim 19, characterized in that, The printed circuit boards of the three power units are independent of each other.

21. The power module according to claim 19, characterized in that, The three power units share a single printed circuit board.

22. The power module according to claim 19, characterized in that, The full-bridge structure, consisting of the three power units, also includes a bottom heat sink.

23. The power module according to claim 22, characterized in that, The printed circuit board further includes an N+1th conductive layer, and the Nth conductive layer and the N+1th conductive layer are insulated from each other.

24. The power module according to claim 23, characterized in that, The N+1th conductive layer and the heat dissipation base plate are interconnected by solder, sintering material, eutectic solder, or resin-containing composite material.

25. The power module according to claim 18, characterized in that, The upper bridge signal terminal and the lower bridge signal terminal are perpendicular to the first conductive layer.

26. The power module according to claim 18, characterized in that, The upper bridge signal terminal and the lower bridge signal terminal are arranged diagonally or on the same side.

27. The power module according to claim 17, characterized in that, The power terminals, the upper bridge signal terminals, and the lower bridge signal terminals are interconnected with the printed circuit board via solder, sintering materials, hot pressing of composite materials, ultrasonic welding, or laser welding.

28. The power module according to claim 17, characterized in that, The power terminal, the upper bridge signal terminal, and the lower bridge signal terminal are directly embedded in the printed circuit board and led out from the first conductive layer.

29. The power module according to claim 28, characterized in that, The first signal terminal, the second signal terminal, the third signal terminal, the fourth signal terminal and the fifth signal terminal are led out from the first conductive layer to the corresponding first type of pads. The upper bridge signal terminal and the lower bridge signal terminal are both located on the plug-in. The plug-in has a corresponding second type of pad. The first type of pad and the second type of pad are soldered to the corresponding terminals.

30. The power module according to claim 28, characterized in that, The printed circuit board has openings, and the first signal terminal, second signal terminal, third signal terminal, fourth signal terminal and fifth signal terminal are interference-connected by inserting into the openings.

31. The power module according to claim 1, characterized in that, The thickness of the printed circuit board is 1.5~3mm.

32. The power module according to claim 1, characterized in that, The thickness of the printed circuit board is 2~2.5mm.

33. The power module according to claim 1, characterized in that, The distance between the AC terminal and the DC negative terminal and the DC positive terminal is 5~60mm.

34. The power module according to claim 1, characterized in that, The distance between the AC terminal and the DC negative terminal and the DC positive terminal is 15~45mm.

35. The power module according to claim 1, characterized in that, The upper bridge power unit includes one upper bridge power device or multiple upper bridge power devices connected in parallel; the lower bridge power unit includes one lower bridge power device or multiple lower bridge power devices connected in parallel.

36. The power module according to claim 35, characterized in that, The upper-bridge power device and the lower-bridge power device are either IGBTs or MOSFETs.

37. The power module according to claim 22, characterized in that, The power module also includes a temperature-sensitive unit, which includes a first temperature-sensitive signal terminal and a second temperature-sensitive signal terminal.

38. The power module according to claim 37, characterized in that, The first temperature-sensitive signal terminal, the second temperature-sensitive signal terminal, the fourth signal terminal, and the fifth signal terminal are placed in the same connector.

39. The power module according to claim 37, characterized in that, The temperature-sensitive unit is located in any conductive layer, upper bridge power unit, lower bridge power unit, or heat dissipation base plate.

Images