Photosensitive composition, cured product, display device, and method for producing cured product

Abstract

The photosensitive composition contains (A) a binder resin and (C) a photosensitizer, the photosensitizer (C) contains (C1) a naphthoquinone diazo compound, the photosensitive composition further contains methanol and / or ethanol, and the following condition (7) is satisfied. And (7) the total content of methanol and ethanol in the photosensitive composition is 0.00 to 30 ppm by mass, and the total content of ethanol and methanol in the photosensitive composition is 0.00 to 10,000 ppm by mass. The photosensitive composition according to the present invention can have excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability at the same time. In addition, the display device of the present invention, which is provided with a cured product obtained by curing the photosensitive composition, has excellent luminance.

Description

Technical Field

[0001] This invention relates to photosensitive compositions, cured products, display devices, and methods for manufacturing cured products. Background Technology

[0002] In recent years, technologies related to organic electroluminescent (hereinafter "organic EL") displays, quantum dot displays, or micro-light-emitting diode (hereinafter "LED") displays have been actively researched for use in thin displays such as smartphones. For example, the pixel segmentation layer of an organic EL display is formed by photolithography. To reduce the process time in the manufacture of organic EL displays, the materials used are required to have high sensitivity during exposure. Furthermore, it is also necessary to suppress development residues during the formation of positive or negative patterns via photolithography. In addition, for example, foreign matter sometimes forms after storing the photosensitive composition at room temperature, leaving residues at the openings of the pixel segmentation layer. Such foreign matter causes black spots in the pixel area and reduces the lifetime of the light-emitting element. Therefore, the materials used are also required to have excellent storage stability without generating foreign matter.

[0003] Furthermore, it is anticipated that micro-LED displays will not only expand into televisions and smartphones, but also into new applications such as signage systems, AR (Augmented Reality), VR (Virtual Reality), and transparent displays. Since micro-LED displays emit light from LEDs that act as light sources in all directions, light extraction efficiency decreases if light is absorbed by surrounding components such as insulating layers, protective layers, or spacers. Therefore, there is a need to improve brightness by optimizing the composition of insulating layers, protective layers, or spacers, as well as the properties of the materials used.

[0004] Examples of photosensitive compositions include, for example, positive photosensitive compositions containing polyimide as a resin (see, for example, Patent Document 1) and positive photosensitive compositions containing polysiloxane as a resin (see, Patent Document 2).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2002-091343

[0008] Patent Document 2: Japanese Patent Application Publication No. 2006-178436 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, the compositions described in Patent Document 1 or Patent Document 2 have limitations in achieving a balance between sensitivity during exposure, suppression of residues after development, storage stability, and luminescence brightness. Therefore, further improvements in the properties of the photosensitizing compositions are desired.

[0011] The objective of this invention is to provide a photosensitive composition that combines excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability; a cured product obtained by curing the photosensitive composition; a method for manufacturing the cured product; and a display device having the cured product and exhibiting excellent luminous brightness.

[0012] Methods for solving problems

[0013] In order to solve the above-mentioned problems, the present invention has the following [1] to

[17] configurations.

[0014] [1] A photosensitive composition comprising (A) an adhesive resin and (C) a photosensitizer,

[0015] The above-mentioned (C) photosensitizer contains a (C1) naphthoquinone diazo compound.

[0016] The photosensitive composition also contains methanol and / or ethanol.

[0017] And it meets the following condition (7).

[0018] (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0019] [2] The photosensitive composition according to [1] above further contains one or more selected from 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether and isoallyl ethyl ether.

[0020] And it meets the following condition (8).

[0021] (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0022] [3] The photosensitive composition according to [1] or [2] above further contains one or more selected from 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, allyl methyl ether, and allyl ethyl ether.

[0023] And it meets the following condition (9).

[0024] (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether and methylallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0025] [4] The photosensitive composition according to any one of [1] to [3] above further contains water and satisfies the following condition (3).

[0026] (3) The water content in the photosensitive composition is 0.010 to 3.0% by mass.

[0027] [5] The photosensitive composition according to any one of [1] to [4] above contains one or more selected from sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions and oxalate ions, and satisfies the following condition (4).

[0028] And / or,

[0029] It contains one or more selected from phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, hypophosphonic acid and hypophosphite esters, and meets the following condition (5).

[0030] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions and oxalate ions in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0031] (5) The total content of phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, hypophosphonic acid and hypophosphite esters in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0032] [6] The photosensitive composition according to any one of [1] to [5] above further contains a tertiary amine compound and / or a quaternary ammonium ion, and satisfies the condition (6) below.

[0033] (6) The total content of tertiary amine compounds and quaternary ammonium ions in all solid components of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

[0034] [7] According to any one of the above-mentioned [1] to [6], the above-mentioned (A) adhesive resin satisfies the following (P1a) condition.

[0035] (P1a) The fluorine content in the structure of the (A) adhesive resin is less than 10,000 ppm by mass.

[0036] [8] The photosensitive composition according to any one of [1] to [7] above satisfies the following condition (1a).

[0037] (1a) The fluorine content in all solid components of the photosensitive composition is less than 1,000 ppm by mass.

[0038] [9] According to any one of [1] to [8] above, the photosensitive composition, wherein the (A) adhesive resin comprises (A1) a resin containing a weakly acidic group,

[0039] The (A1) resin containing a weak acid group has one or more groups selected from phenolic hydroxyl, hydroxyimide, hydroxyamide, silanol, 1,1-bis(trifluoromethyl)hydroxymethyl and mercapto as the (WA) weak acid group.

[0040]

[10] According to the photosensitive composition described above [9], the resin containing a weak acid group in (A1) comprises (A1x-1) resin: polysiloxane.

[0041]

[11] According to the photosensitive composition described above

[10] , when the photosensitive composition is diluted with water to prepare a diluted solution and the concentration of the solid component in the diluted solution is 1 / 100 times that of the photosensitive composition, the hydrogen ion index of the diluted solution is 5.5 to 7.0.

[0042]

[12] According to the photosensitive composition described in

[10] or

[11] above, the above (A1x-1) resin has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10).

[0043]

[0044] In general formulas (9) and (10), R 61 Represents a hydrogen atom or a monovalent organic group. * 1 ~* 3 Each independently represents a bonding point in the resin.

[0045]

[13] In any one of the above-mentioned [1] to

[12] , the above-mentioned (C) photosensitizer further contains (C3) photoacid generator and / or (C4) photoalkali generator.

[0046]

[14] A cured product obtained by curing the photosensitive composition described in any one of [1] to

[13] above.

[0047]

[15] A display device comprising the cured material described in

[14] above.

[0048]

[16] A method for manufacturing a cured product includes the following steps: (1) forming a coating film of the photosensitive composition described in any one of [1] to

[13] on a substrate; (2) irradiating the coating film of the photosensitive composition with active chemical rays through a photomask; (3) developing the photosensitive composition using a developing solution to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition.

[0049]

[17] A display device having a substrate, a redistribution layer, an interlayer insulating layer of the redistribution layer, and a semiconductor chip, and further having a spacer layer and / or a planarization layer.

[0050] This semiconductor chip is a light-emitting element.

[0051] Viewed from above, the area of ​​the redistribution layer is larger than the area of ​​the semiconductor chip.

[0052] The spacer layer is formed between adjacent semiconductor chips.

[0053] The planarization layer is formed in such a way that it covers at least a portion of the semiconductor chip.

[0054] The spacer layer and / or the planarization layer contain methanol and / or ethanol, and satisfy the following conditions (X1a) and / or (X1b).

[0055] (X1a) The total content of methanol and ethanol in this spacer layer is 0.0010 to 30,000 ppm by mass.

[0056] (X1b) The total content of methanol and ethanol in the planarization layer is 0.0010 to 30,000 ppm by mass.

[0057] The effects of the invention

[0058] The photosensitive composition according to the present invention combines excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability. Furthermore, it provides a cured product suitable for display devices with excellent luminous brightness. Additionally, the display device according to the present invention provides a display device with excellent luminous brightness. Attached Figure Description

[0059] Figure 1 A schematic cross-sectional view of a microLED display with a spacer wall layer and a planarization layer.

[0060] Figure 2A schematic cross-sectional view of a microLED display with a spacer wall layer and a planarization layer, representing another type of microLED display.

[0061] Figure 3 A plan view of the manufacturing process of steps 1 to 4 in the substrate of the organic EL display used for evaluating the light emission characteristics. Detailed Implementation

[0062] The photosensitive composition of the present invention will be described in detail below along with the embodiments. However, the present invention is not limited to the following embodiments, and various modifications are of course possible without departing from the scope of the invention's purpose. It should be noted that, in the following description, the term "resin main chain" refers to the longest chain among the resin chains constituting the structural unit. The term "resin side chain" refers to a shorter chain than the main chain that branches off from or is bonded to the main chain among the resin chains constituting the structural unit. The term "resin end" refers to a structure that closes the main chain, such as a structure derived from an end-capping agent.

[0063] <Photosensitive Composition>

[0064] The photosensitive composition of the present invention has the structure described above [1]. With the structure described above [1], the photosensitive composition of the present invention can combine excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability. Furthermore, it can provide a cured product suitable for display devices with excellent luminous brightness. This can be considered as the excellent sensitivity during exposure and the suppression of residue after development achieved by including trace amounts of the aforementioned methanol and / or ethanol in the photosensitive composition, thereby promoting the dissolution of the developer due to the hydrophilicity of the compound. Furthermore, it can be considered as the surface modification of the substrate surface through the compound, thus preventing residue adhesion in openings and thereby suppressing residue after development.

[0065] Furthermore, it can be considered that by intentionally including trace amounts of the aforementioned methanol and / or ethanol, the polar groups of the resin in the photosensitive composition are stabilized through hydrogen bonding interactions brought about by the hydroxyl groups in the compound. In particular, when the photosensitive composition contains polysiloxane, stabilization of the silanol groups in the polysiloxane is suitable. Furthermore, it can be considered that the polarization structure and charge balance in the photosensitive composition are controlled through the hydroxyl groups in the compound. As a result, it is presumed that excellent storage stability is achieved. It is further presumed that when a pattern of the photosensitive composition is formed on wiring such as metal, the aforementioned compound in the photosensitive composition modifies the surface of the wiring that forms the opening or the surface of the wiring in contact with the pattern. Furthermore, it can be considered that the hydroxyl groups in the compound contained in the cured product capture trace amounts of metallic and ionic impurities in the cured product, which migrate to the wiring surface and act as charge carriers in the wiring. As a result, it can be considered that the conductivity of the wiring such as metal is controlled, enabling high luminous brightness through low-voltage driving.

[0066] <(A) Adhesive Resin>

[0067] The photosensitive composition of the present invention contains (A) a binder resin. The (A) binder resin is a heat-resistant resin that is at least partially present in the cured product obtained by curing the composition. Furthermore, the (A) binder resin in the composition may remain in the cured product obtained by curing the composition. The (A) binder resin is preferably a resin that is cured by forming a cross-linked structure through a reaction. The reaction is not particularly limited to a heating reaction, an irradiation reaction using energy rays, etc., and the cross-linked structure may also be formed by the cross-linking agent (F) described later. The (A) binder resin is preferably a thermosetting resin.

[0068] (A) The adhesive resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. (A) The adhesive resin is preferably a resin that imparts positive or negative photosensitivity to the composition by means of the photosensitizer described later (C), and has solubility capable of forming positive or negative patterns.

[0069] (A) The adhesive resin preferably has an acidic group in its structural unit. From the viewpoint of pattern processing with alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)hydroxymethyl group, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group. Furthermore, from the viewpoint of improving sensitivity during exposure and suppressing residue after development, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group is more preferred.

[0070] (A) The adhesive resin preferably has a free radical polymerizable group, more preferably a free radical polymerizable group in the structural unit of the resin. The free radical polymerizable group preferably has an olefinic unsaturated double bond group, more preferably a photoreactive group, an alkenyl group with 2 to 5 carbon atoms, or an alkynyl group with 2 to 5 carbon atoms. The photoreactive group is preferably styryl, cinnamyl, maleimide, nadimide, or (meth)acryloyl, and (meth)acryloyl is more preferably used from the viewpoint of improving the sensitivity during exposure. On the other hand, the alkenyl group with 2 to 5 carbon atoms or the alkynyl group with 2 to 5 carbon atoms is preferably vinyl, allyl, 2-methyl-2-propenyl, crotonyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl, or 2-propynyl, and vinyl or allyl is more preferably used from the viewpoint of improving the sensitivity during exposure.

[0071] <(A1) resin and (A2) resin>

[0072] (A) The adhesive resin preferably contains (A1) a resin containing a weak acidic group and / or (A2) a resin that does not have a weak acidic group.

[0073] From the viewpoint of improving sensitivity during exposure, the (A) binder resin preferably comprises a resin containing a weakly acidic group (A1), and the resin containing the weakly acidic group (A1) has one or more groups selected from phenolic hydroxyl, hydroxyimide, hydroxyamide, silanol, 1,1-bis(trifluoromethyl)hydroxymethyl, and mercapto as the (WA) weakly acidic group, more preferably having the (WA) weakly acidic group in the structural unit of the resin. These groups are sometimes collectively referred to as "(WA) weakly acidic group" below. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (WA) weakly acidic group is preferably a phenolic hydroxyl, silanol, or 1,1-bis(trifluoromethyl)hydroxymethyl (hereinafter, "specific (WA) weakly acidic group"). It should be noted that, when the (A) adhesive resin meets the conditions described below (P1a) and / or (P2a), or when the photosensitive composition of the present invention meets the conditions described below (1a) and / or (2a), the acidic group of the (A) adhesive resin is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group, and the (WA) weak acidic group is preferably one or more groups selected from phenolic hydroxyl groups, hydroxyimide groups, hydroxyamide groups, silanol groups, and mercapto groups. The resin containing the weak acidic group in (A1) above interacts with the photosensitizer in (C) below due to the appropriate acidity of the (WA) weak acidic group, thereby increasing the solubility of the exposed portion, thus significantly improving the sensitivity during exposure. Specific (WA) weak acidic groups among the (WA) weak acidic groups significantly suppress residue after development through alkali dissolution promotion. Furthermore, when the composition has positive photosensitivity, the specific (WA) weak acid group in the (WA) weak acid group can improve the dissolution contrast between the exposed and unexposed areas through strong interaction with the (C) photosensitizer, and the dissolution promotion effect in the exposed area is also improved. Therefore, the effect of improving the sensitivity during exposure and suppressing residue after development becomes significant.

[0074] From the viewpoint of suppressing residue after development, the (A) binder resin preferably includes a resin (A2) that does not have a weak acidic group. The resin (A2) that does not have a weak acidic group preferably has an acidic group different from the (WA) weak acidic group, and more preferably has an acidic group different from the (WA) weak acidic group in the structural unit of the resin. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the acidic group different from the (WA) weak acidic group is more preferably a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group.

[0075] From the viewpoint of improving sensitivity during exposure, the (A) adhesive resin preferably comprises a resin containing a weakly acidic group (A1), and the resin containing the weakly acidic group (A1) has a free radical polymerizable group. Examples and preferences related to the free radical polymerizable group are described as described in the above description of the (A) adhesive resin.

[0076] (A) The adhesive resin preferably contains (A1) a resin containing a weakly acidic group and / or (A2) a resin not containing a weakly acidic group, and the resin containing (A1) a weakly acidic group includes (A1x) resins: having in the structural units of the resin a structure selected from imide structure, amide structure, Resins with one or more of azole and siloxane structures (hereinafter, "imide structures, etc.") and / or (A1y) resins: resins having phenolic hydroxyl groups in the structural units of the resin, (A2) resins without weak acid groups including (A2x) resins: resins having free radical polymerizable groups and / or (A2y) resins: resins without free radical polymerizable groups.

[0077] From the viewpoint of improving sensitivity during exposure and suppressing residue after development, (A) the binder resin preferably contains (A1) a resin containing a weak acid group and (A2) a resin without a weak acid group.

[0078] It should be noted that when (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin each possess the structures and groups that constitute other resins, they are classified as any one of them using the classification method shown in Table 1-1 below. When a resin can be equivalent to two or more of (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin, this classification method is used to determine which resin it is equivalent to.

[0079] [Table 1-1]

[0080]

[0081] The adhesive resin (A) preferably contains (A1x) resin and / or (A1y) resin, more preferably (A1x) resin, and even more preferably (A1x) resin and (A1y) resin. Furthermore, the adhesive resin (A) preferably contains (A1x) resin and / or (A1y) resin, and also contains (A2x) resin, more preferably (A1x) resin, (A1y) resin, and (A2x) resin. Furthermore, the adhesive resin (A) also preferably contains (A1x) resin, (A1y) resin, or (A2x) resin, and also contains (A2y) resin. Moreover, from the viewpoint of improved properties brought about by each resin, the adhesive resin (A) preferably contains two or more resins selected from (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin.

[0082] <(A1x) resin>

[0083] When the (A) adhesive resin contains a resin with a weakly acidic group (A1), from the viewpoint of improving sensitivity during exposure, improving the reliability of the light-emitting element, and improving the luminous brightness, the resin with the weakly acidic group (A1) preferably contains a (A1x) resin. From the viewpoint of improving sensitivity during exposure, improving the reliability of the light-emitting element, and improving the luminous brightness, the (A1x) resin preferably contains a resin selected from (A1x-1) resin: polysiloxane, (A1x-2) resin: polyimide, (A1x-3) resin: polyimide precursor, and (A1x-4) resin: polybenzo[[...]]. Azole, (A1x-5) resin: polybenzo[a] Azole precursor, (A1x-6) resin: polyamide-imide, (A1x-7) resin: polyamide-imide precursor, (A1x-8) resin: polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide- The resin contains one or more of a azine resin and its copolymers, more preferably one or more of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, (A1x-7) resin, (A1x-8) resin and its copolymers, and even more preferably (A1x-1) resin. The (A1x) resin can be a single resin or a copolymer thereof.

[0084] In the case where the (A) adhesive resin contains a resin containing a weakly acidic group (A1), from the viewpoint of improving the sensitivity during exposure, improving the reliability of the light-emitting element and improving the luminous brightness, the resin containing the weakly acidic group (A1) preferably contains a polysiloxane as a (A1x-1) resin.

[0085] It is presumed that the above-mentioned (A1x) resin possesses an imide structure, an amide structure, and an imide structure in its structural units. The structures, such as azole or siloxane structures, capture metallic and ionic impurities that negatively impact electrical insulation, thus suppressing ion and electromigration and improving the reliability of the light-emitting element. Furthermore, it is presumed that these structures control the conductivity of the wiring, including metals, thereby increasing the luminous brightness.

[0086] On the other hand, from the viewpoint of improving sensitivity during exposure, suppressing residue after development, and improving the reliability of the light-emitting element, (A2x) resin and (A2y) resin preferably contain a mixture selected from polyimide, polyimide precursor, polyphenylene oxide, etc. azole, polybenzo[a] Zyrazole precursor, polyamide-imide, polyamide-imide precursor, polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide- One or more of azirmine resins and their copolymers.

[0087] From the viewpoint of improving sensitivity during exposure and enhancing the reliability of the light-emitting element, the (A1x) resin preferably has a free radical polymerizable group. Examples and preferences related to the free radical polymerizable group are described in the description of the (A) adhesive resin above. The free radical polymerizable group is preferably obtained by reacting a portion of the phenolic hydroxyl groups and / or carboxyl groups present in the resin with a compound having a free radical polymerizable group.

[0088] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving the reliability of the light-emitting element, and increasing luminous brightness, (A1x) resin preferably contains both (A1x) resin without free radical polymerizable groups and (A1x) resin with free radical polymerizable groups. It can be considered that, with the above configuration, the (A1x) resin without free radical polymerizable groups can suppress residue after development and the ability to capture metal impurities, ionic impurities, etc., and control the conductivity of wiring such as metals through its acidic groups or organic solvent-soluble structure. On the other hand, the (A1x) resin with free radical polymerizable groups improves the degree of cross-linking of the film by increasing sensitivity during exposure and promoting free radical polymerization. As a result, the effect of suppressing gas release and improving the reliability of the light-emitting element becomes significant. Through such functional separation in the (A1x) resin, the effect of improving multiple properties becomes significant.

[0089] From the viewpoint of improving sensitivity during exposure, the acid equivalent of the (Alx) resin is preferably 200 g / mol or more. On the other hand, from the viewpoint of suppressing residue after development, the acid equivalent of the (Alx) resin is preferably 600 g / mol or less. Here, "exposure" refers to irradiation by reactive chemical rays (radiation), such as visible light, ultraviolet light, electron beams, or X-rays. Hereinafter, "exposure" refers to irradiation by reactive chemical rays (radiation). From the viewpoint of suppressing residue after development, the double bond equivalent of the (Alx) resin is preferably 200 g / mol or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the double bond equivalent of the (Alx) resin is preferably 3,000 g / mol or less.

[0090] <Polysiloxane>

[0091] (A1x-1) resin: Polysiloxanes are (A1x) resins because they have silanol groups and contain siloxane structures in their structural units. Examples of (A1x-1) resins include resins obtained by hydrolyzing one or more of trifunctional organosilanes, tetrafunctional organosilanes, difunctional organosilanes, and monofunctional organosilanes to induce dehydration condensation.

[0092] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving the reliability of the light-emitting element, and improving the brightness of light emission, (A1x-1) resin preferably has a trifunctional organosilane unit as shown in general formula (9) and a tetrafunctional organosilane unit as shown in general formula (10).

[0093]

[0094] In general formulas (9) and (10), R 61 Represents a hydrogen atom or a monovalent organic group. * 1 ~* 3 Each independently represents a bonding point in the resin.

[0095] In general formulas (9) and (10), R 61 Preferably, the substituents are hydrogen atoms, alkyl groups having 1 to 10 carbon atoms, cycloalkyl groups having 4 to 10 carbon atoms, aryl groups having 6 to 15 carbon atoms, haloalkyl groups having 1 to 10 carbon atoms, halocycloalkyl groups having 4 to 10 carbon atoms, or haloaryl groups having 6 to 15 carbon atoms. The above substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0096] From the viewpoint of improving the sensitivity during exposure, the content ratio of the trifunctional organosilane unit of general formula (9) in the (A1x-1) resin is preferably 50 to 100 mol% in terms of Si atoms per mol, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0097] From the viewpoint of suppressing residues after development, the content ratio of the tetrafunctional organosilane unit represented by general formula (10) in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, based on the Si atomic molar ratio. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the content ratio of the tetrafunctional organosilane unit represented by general formula (10) is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on the Si atomic molar ratio.

[0098] From the viewpoints of improving storage stability, reducing the taper of the pattern shape, and improving mechanical properties, the content ratio of difunctional organosilane units in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, based on the Si atomic molar ratio. On the other hand, from the viewpoints of improving the reliability of the light-emitting element, the content ratio of difunctional organosilane units is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on the Si atomic molar ratio.

[0099] From the viewpoint of improving storage stability, the content ratio of a single functional organosilane unit in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, based on the molar ratio of Si atoms. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the content ratio of a single functional organosilane unit is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on the molar ratio of Si atoms.

[0100] From the viewpoint of pattern processing with alkaline developer, (A1x-1) resin preferably has organosilane units containing acidic groups, and from the viewpoint of improving sensitivity during exposure, organosilane units containing (WA) weakly acidic groups are more preferred. From the viewpoint of improving sensitivity during exposure, suppressing residue after development, improving chemical resistance, and improving the reliability of light-emitting elements, (A1x-1) resin preferably has organosilane units containing (WA) weakly acidic groups and containing fused polycyclic structures, fused polycyclic heterocyclic structures, or aromatic structures, and more preferably has organosilane units containing 1,1-bis(trifluoromethyl)-1-hydroxymethylphenyl or phenolic hydroxyl groups. Furthermore, from the viewpoint of improving sensitivity during exposure and suppressing residue after development, (A1x-1) resin also preferably has organosilane units containing carboxyl groups, carboxylic anhydride groups, or sulfonic acid groups. Examples and preferences related to acidic groups and (WA) weakly acidic groups are described as described in the above description of adhesive resin (A). From the viewpoint of improving the aforementioned properties, the content ratio of organosilane units containing acidic groups in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, based on the Si atomic molar ratio. On the other hand, from the viewpoint of pattern processing properties with alkaline developer, the content ratio of organosilane units containing acidic groups is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on the Si atomic molar ratio.

[0101] From the viewpoint of improving sensitivity during exposure, improving chemical resistance, and improving the reliability of the light-emitting element, the (A1x-1) resin preferably has organosilane units containing free radical polymerizable groups, and more preferably has organosilane units containing styrene, (meth)acryloyl, vinyl, or allyl groups. Examples and preferences related to free radical polymerizable groups are described as described in the above description of the (A) adhesive resin.

[0102] From the viewpoint of suppressing residues after development, improving chemical resistance, and enhancing the reliability of light-emitting elements, (A1x-1) resin preferably has an organosilane unit containing an epoxy group or an oxetyl group, and more preferably has an organosilane unit containing a cyclohexyl epoxy group, a glycidyl group, or an oxetyl group.

[0103] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving chemical resistance, and improving the reliability of light-emitting elements, (A1x-1) resin preferably has organosilane units containing fused polycyclic structures, fused polycyclic heterocyclic structures, or aromatic structures, more preferably has organosilane units containing naphthyl, anthracene, biphenyl, phenyl, tolyl, or methoxyphenyl, and even more preferably has organosilane units containing naphthyl or anthracene.

[0104] From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting element, and increasing luminous brightness, the (A1x-1) resin preferably has organosilane units bound to the inorganic particles described later (G). Hereinafter, (A1x-1) resins having these organosilane units are sometimes collectively referred to as "polysiloxanes containing inorganic particles." Polysiloxanes containing inorganic particles are preferably resins obtained by hydrolyzing one or more selected from trifunctional organosilanes, tetrafunctional organosilanes, difunctional organosilanes, and monofunctional organosilanes in the presence of the inorganic particles (G), thereby causing dehydration condensation. The inorganic particles (G) are preferably silica particles. Examples and preferences related to the inorganic particles (G) are as described later in the section on inorganic particles (G).

[0105] <Polyimide-based resins and other resins>

[0106] The following discusses polyimides, polyimide precursors, and polyphenylene oxides as (A1x) resins, (A2x) resins, or (A2y) resins. azole, polybenzo[a] Polyamide precursors, polyamide-imides, polyamide-imide precursors, polyamides, and their copolymers are collectively described. Sometimes these resins are also collectively referred to as polyimide-based resins. Examples of polyimide precursors include, for example, polyamic acid, polyamic acid ester, polyamic acid amide, or polyisoimide. Examples of polyimides include, for example, resins obtained by dehydrating and ring-closing a polyimide precursor. Examples of polybenzo[a] Azole precursors, for example, are polyhydroxyamides. As a polybenzo[a]azole precursor... azoles, for example, can be used to make polybenzo[a]azoles. A resin obtained by dehydrating and ring-closing a azole precursor. Examples of polyamide-imide precursors include resins obtained by reacting tricarboxylic anhydride or the like with a diamine or the like. Examples of polyamide-imides include resins obtained by dehydrating and ring-closing a polyamide-imide precursor. Examples of polyamides include resins obtained by reacting diformyl chloride or the like with a diamine or the like.

[0107] From the viewpoint of improving sensitivity during exposure, the polyimide precursor preferably has amamide ester structural units and / or amamide acid amide structural units. Furthermore, the polyimide precursor may have an imide ring-closed structural unit comprising a portion of an amamide acid structural unit, an amamide ester structural unit, or an amamide acid amide structural unit. The aforementioned polyimide, polyimide precursor, and polybenzo[…] azole, polybenzo[a] The azole precursor, polyamide imide, and polyamide imide precursor can be copolymers with polyamide.

[0108] From the viewpoint of improving sensitivity during exposure, polyimide-based resins preferably have carboxylic acid residues having fluorine atoms and / or amine residues having fluorine atoms. The combined content ratio of fluorine-containing carboxylic acid residues and fluorine-containing amine residues in all carboxylic acid residues and all amine residues of each resin is preferably 10–100 mol%, more preferably 30–100 mol%, and even more preferably 50–100 mol%. The preferred ranges related to the combined content ratio of fluorine-containing amine residues in all amine residues and the combined content ratio of fluorine-containing carboxylic acid residues in all carboxylic acid residues are also the same as described above.

[0109] From the viewpoint of improving storage stability, polyimide-based resins preferably have a structure in which the resin ends are blocked by monoamines, dicarboxylic anhydrides, or monocarboxylic acid derivatives. From the viewpoint of improving sensitivity during exposure and improving the reliability of light-emitting elements, polyimide-based resins preferably have free radical polymerizable groups or crosslinking groups at the resin ends that can react with the resin, etc., and more preferably have maleimide groups or nadicimide groups. Examples of acid monomers having these groups include, for example, maleic anhydride or nadic anhydride.

[0110] <(A) Fluorine content in the structure of adhesive resin>

[0111] From the viewpoint of suppressing residue after development, improving the reliability of the light-emitting element, and increasing the luminous brightness, the adhesive resin (A) preferably satisfies the condition described below (P1a). The adhesive resin (A) is more preferably further satisfied with the condition described below (P2a). Similarly, when the adhesive resin (A) is a polyimide-based resin, from the viewpoint of suppressing residue after development, improving the reliability of the light-emitting element, and increasing the luminous brightness, the condition described below (P1a) is preferred, and the condition described below (P2a) is more preferably further satisfied.

[0112] (P1a)(A) The fluorine content in the structure of the adhesive resin is less than 10,000 ppm by mass.

[0113] The fluoride ion content in the structure of the (P2a)(A) adhesive resin is less than 10,000 ppm by mass.

[0114] From the viewpoint of the effects of the above-described invention, the fluorine content in the structure of the adhesive resin (A) is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, further preferably 0.030 ppm by mass or more, further more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the above-described invention, the fluorine content is preferably 10,000 ppm by mass or less, more preferably 5,000 ppm by mass or less, further preferably 1,000 ppm by mass or less, further more preferably 500 ppm by mass or less, particularly preferably 300 ppm by mass or less, and most preferably 100 ppm by mass or less. Furthermore, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, further preferably 10 ppm by mass or less, further more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0115] The preferred range of fluoride ion content in the structure of the adhesive resin (A) is also the same as the preferred range of fluoride content in the structure of the adhesive resin (A) described above.

[0116] (A) The fluorine content in the structure of the adhesive resin can be 0 ppm by mass. (A) The fluoride ion content in the structure of the adhesive resin can also be 0 ppm by mass.

[0117] It is presumed that by using (A) adhesive resins in photosensitive compositions where the fluorine content is below a specific value, the content of fluorine, fluoride ions, or anions containing fluorine from these resins is below a specific value. Therefore, through interactions such as hydrogen bonds among the components in the photosensitive composition, protons in the photosensitive composition are locally activated. Thus, it is considered that the effect of suppressing residues after development becomes significant by promoting dissolution of the developer. Furthermore, it is considered that by intentionally reducing the content of the aforementioned components in the resin to below a specific value, the content of the aforementioned components in the cured photosensitive composition is also reduced, and the polarization structure and charge balance in the cured composition are controlled. As a result, it is presumed that by suppressing the ion migration and electromigration of metallic and ionic impurities that adversely affect luminescence properties or electrical insulation, the reliability and luminous brightness of the light-emitting element are improved. Furthermore, it is presumed that by suppressing the migration and aggregation of metals in the electrodes or metal wiring, the reliability of the display device is improved.

[0118] Maleimide resin is a resin having at least two maleimide groups. Maleimide-styrene resin is a resin having maleimide groups and units derived from styrene derivatives. Maleimide-triazine resin is a resin having maleimide groups and units comprising a triazine structure. Azide resins are those containing maleimide groups and including Resins with azine-structured units. These are resins different from polyimide-based resins.

[0119] <(A1y) resin>

[0120] From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (A1) resin containing a weakly acidic group preferably includes the (A1y) resin. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (A1y) resin preferably contains one or more selected from phenolic resins, polyhydroxystyrene, epoxy resins containing phenolic groups, and acrylic resins containing phenolic groups. The (A1y) resin can be any single resin or copolymer thereof.

[0121] The phenolic resin is preferably a phenolic varnish resin, a methyl phenolic resin, or a phenolic alkyl resin. The phenolic resin preferably has a fused polycyclic structure, a fused polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0122] Polyhydroxystyrene preferably has units derived from (meth)acrylate derivatives comprising fused polycyclic structures, fused polycyclic heterocyclic structures or aromatic structures, or units derived from styrene derivatives.

[0123] Examples of phenol-containing epoxy resins include resins obtained by reacting a polyfunctional epoxy compound with a phenolic compound having epoxy reactive groups, preferably cardo-based resins containing phenolic groups or epoxy-modified resins containing phenolic groups. Epoxy-modified resins containing phenolic groups are preferably epoxy ester resins containing phenolic groups. Cardo-based resins containing phenolic groups preferably have a fused polycyclic structure or a fused polycyclic heterocyclic structure. Epoxy resins containing phenolic groups preferably have a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure.

[0124] Examples of phenol-containing acrylic resins include resins obtained by further reacting a phenolic compound having an addition-reactive group with the acrylic resin described below. Additionally, resins obtained by free-radical copolymerization of a copolymer component having phenolic hydroxyl groups with other copolymer components such as (meth)acrylic acid derivatives are also examples. It should be noted that phenol-containing acrylic resins are different from polyhydroxystyrene. Phenolic acrylic resins preferably have units derived from (meth)acrylic ester derivatives comprising fused polycyclic, fused polycyclic heterocyclic, or aromatic structures, or units derived from styrene derivatives.

[0125] The fused polycyclic structure, fused polycyclic heterocyclic structure, aromatic structure, or heterocyclic structure in these resins is preferably a fluorene structure, anthracene structure, naphthalene structure, or tricyclic [5.2.1.0]. 2,6 Decane structure, adamantane structure, xatonne structure, isoindolinetone structure, biphenyl structure, benzene structure, bisphenol A structure, bisphenol F structure, bisphenol AF structure, isocyanuric acid structure, or triazine structure.

[0126] <(A2x) resin and (A2y) resin>

[0127] From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (A2) resin without a weakly acidic group preferably includes (A2x) resin, and more preferably (A2y) resin. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (A2x) resin and / or (A2y) resin preferably contain one or more resins selected from resins containing polycyclic side chains, acid-modified epoxy resins, and acrylic resins. The (A2x) resin and (A2y) resin can be either a single resin or a copolymer thereof.

[0128] From the viewpoint of improving the reliability of light-emitting elements, resins containing polycyclic side chains are preferably cardo-based resins having a fused polycyclic structure or a fused polycyclic heterocyclic structure. From the viewpoint of improving the reliability of light-emitting elements, acid-modified epoxy resins are preferably epoxy (meth)acrylate resins having a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving the reliability of light-emitting elements, acrylic resins preferably have units derived from (meth)acrylate derivatives containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or units derived from styrene derivatives. Furthermore, units derived from (meth)acrylate derivatives having an epoxy group are also preferred. The fused polycyclic structure, fused polycyclic heterocyclic structure, or aromatic structure in these resins is preferably a fluorene structure, anthracene structure, naphthalene structure, or tricyclic [5.2.1.0]. 2,6 [Decane structure, adamantane structure, xatonne structure, isoindolineone structure, biphenyl structure, or benzene structure.]

[0129] From the viewpoints of improving exposure sensitivity, reducing the taper of the pattern shape, and improving the reliability of the light-emitting element, the total content of (A1x) resin in 100% by mass of the total binder resin is preferably 10% by mass or more, more preferably 30% by mass or more, further preferably 50% by mass or more, and particularly preferably 70% by mass or more. On the other hand, from the viewpoints of suppressing residue after development, the total content of (A1x) resin is preferably 100% by mass or less, more preferably 90% by mass or less, and further preferably 80% by mass or less. Furthermore, from the viewpoints of improving exposure sensitivity, suppressing residue after development, and reducing the taper of the pattern shape, the total content of (A1y) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoints of improving the reliability of the light-emitting element, the total content of (A1y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, and further preferably 50% by mass or less. Furthermore, from the viewpoint of improving sensitivity during exposure, suppressing residue after development, and minimizing the taper of the pattern shape, the total content ratio of (A2x) resin and (A2y) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the total content ratio of (A2x) resin and (A2y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0130] From the viewpoint of improving the properties brought about by each resin, the content ratio of (A) binder resin in the total solid components of the photosensitive composition of the present invention is preferably 10% by mass or more. On the other hand, from the viewpoint of improving the properties brought about by each resin, the content ratio of (A) binder resin is preferably 75% by mass or less. It should be noted that the term "total solid components of the composition" refers to the total mass of all components in the composition excluding the solvent. Furthermore, the solid component concentration can be calculated by heating 1g of the composition at 150°C for 30 minutes to evaporate it to dryness, measuring the mass remaining after heating, and calculating the solid component concentration from the mass before and after heating.

[0131] <(B) Free radical polymerizable compounds>

[0132] The photosensitive composition of the present invention preferably further contains (B) a free radical polymerizable compound (hereinafter, "(B) compound") and / or (F) a crosslinking agent. The term (B) compound refers to a compound having a free radical polymerizable group. Examples and preferences related to the free radical polymerizable group are as described in the description of the (A) adhesive resin above. From the viewpoint of promoting free radical polymerization, improving sensitivity during exposure, and improving the reliability of the light-emitting element, the free radical polymerizable group is preferably (meth)acryloyl. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting element, the (B) compound preferably has 2 or more free radical polymerizable groups, more preferably 3 or more, and even more preferably 4 or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the number of free radical polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less.

[0133] When the photosensitive composition of the present invention contains (A) a binder resin and (B) a compound, and the total amount of (A) a binder resin and (B) a compound is set to 100 parts by mass, from the viewpoint of reducing the taper of the pattern shape and improving the reliability of the light-emitting element, the content of (A) a binder resin is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more. On the other hand, from the viewpoint of improving the sensitivity during exposure and suppressing residue after development, the content of (A) a binder resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less. Furthermore, when the total amount of (A) a binder resin and (B) a compound is set to 100 parts by mass, from the viewpoint of improving the above-mentioned properties, the content of (B) a compound is preferably 15 parts by mass or more. On the other hand, from the viewpoint of improving the above-mentioned properties, the content of (B) a compound is preferably 75 parts by mass or less.

[0134] <(C) Photosensitive agent>

[0135] The photosensitive composition of the present invention contains (C) a photosensitizer.

[0136] The term (C) photosensitizer refers to a compound that, upon exposure, undergoes bond cleavage, reaction, or structural change to generate other compounds, thereby imparting positive or negative photosensitivity to the composition. Examples of (C) photosensitizers include (C1) naphthoquinone diazo compounds (hereinafter, "(C1) compounds"), (C2) photopolymerization initiators (hereinafter, "(C2) compounds"), (C3) photoacid generators (hereinafter, "(C3) compounds"), and (C4) photoalkalogen generators (hereinafter, "(C4) compounds"). When imparting positive photosensitivity to the composition, it is preferable to contain (C1) compounds and / or (C3) compounds, and it is also preferable to further contain (C2) compounds or (C4) compounds.

[0137] When imparting negative photosensitivity to the composition, it is preferable to contain a (C2) compound and / or a (C3) compound, and it is also preferable to contain a (C1) compound or a (C4) compound.

[0138] Furthermore, the photosensitive composition of the present invention contains a (C) photosensitizer, and the (C) photosensitizer contains a (C1) naphthoquinone diazo compound. Therefore, the photosensitive resin composition of the present invention excels in improving sensitivity during exposure and suppressing residue after development. Furthermore, from the same viewpoint, it is preferable to contain a (C1) naphthoquinone diazo compound, and also a (C3) photoacid generator and / or a (C4) photoalkali generator.

[0139] When the total amount of (A) binder resin and (B) compound is set to 100 parts by mass, from the viewpoint of improving sensitivity during exposure, the content of (C) photosensitizer is preferably 1.0 parts by mass or more. On the other hand, from the viewpoint of suppressing residue after development, the content of (C) photosensitizer is preferably 30 parts by mass or less.

[0140] <(C1)naphthoquinone diazo compound>

[0141] The term (C1) compound refers to a compound whose structure changes upon exposure, producing indica acid and / or sulfonated indica acid. (C1) compounds are suitable for positive pattern formation. During exposure, the acidic compound formed by the structural change of the (C1) compound selectively solubilizes the exposed portion of the film in the composition to the alkaline developer, thus significantly improving the resolution after development.

[0142] The (C1) compound is preferably a 1,2-naphthoquinone diazono-5-sulfonate (hereinafter, "5-ester") or a 1,2-naphthoquinone diazono-4-sulfonate (hereinafter, "4-ester"). From the viewpoint of improving resolution after development, the (C1) compound preferably contains a 5-ester, and from the viewpoint of improving sensitivity during exposure, it preferably contains a 4-ester. From the viewpoints of improving sensitivity during exposure, suppressing residue after development, and improving resolution after development, the (C1) compound more preferably contains both a 5-ester and a 4-ester.

[0143] From the viewpoint of improving image resolution after development, the total ratio of the content of 5-ester groups and 4-ester groups in the total number of phenolic hydroxyl groups, 1,2-naphthoquinone diazono-5-sulfonate groups (hereinafter, "5-ester group"), and 1,2-naphthoquinone diazono-4-sulfonate groups (hereinafter, "4-ester group") in the (C1) compound (hereinafter, "esterification rate") is preferably 50 mol% or more, more preferably 55 mol% or more, and even more preferably 60 mol% or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the esterification rate is preferably 100 mol% or less, more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less. It is also preferable that the (C1) compound is a mixture of two or more (C1) compounds with different esterification rates, and the above-mentioned esterification rate is achieved.

[0144] From the viewpoint of improving sensitivity during exposure, the total ratio of compounds having one 5-ester or 4-ester group and compounds having two 5-ester or 4-ester groups in a total of 100 mol% of (C1) compounds (hereinafter, "low ester substitution ratio") is preferably 60 mol% or more, more preferably 70 mol% or more, and even more preferably 80 mol% or more. On the other hand, from the viewpoint of improving resolution after development, the low ester substitution ratio is preferably 100 mol% or less, more preferably 95 mol% or less, and even more preferably 90 mol% or less.

[0145] Furthermore, from the viewpoint of improving sensitivity during exposure, the proportion of low-ester substituents in a total of 100 mol% of the (C1) compound is preferably 0 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more. On the other hand, from the viewpoint of suppressing residues after development, the proportion of low-ester substituents is preferably less than 60 mol%, more preferably 50 mol% or less, and even more preferably 40 mol% or less.

[0146] Examples of methods for manufacturing (C1) compounds include, for instance, esterification reactions of a compound having a phenolic hydroxyl group with naphthoquinone diazonosulfonic acid, and esterification reactions of a compound having a phenolic hydroxyl group with naphthoquinone diazonosulfonyl chloride. Naphthoquinone diazonosulfonyl chloride is preferably 1,2-naphthoquinone diazono-5-sulfonyl chloride or 1,2-naphthoquinone diazono-4-sulfonyl chloride.

[0147] <(C2) Photopolymerization Initiator>

[0148] The term (C2) compound refers to a compound that generates free radicals through bond cleavage and / or reaction upon exposure. Compounds containing (C2) compounds are suitable for negative pattern formation. During exposure, even in very small amounts of free radicals generated by the (C2) compound, the free radical polymerization of the aforementioned (B) compounds proceeds in a chain reaction, thus significantly improving the sensitivity during exposure.

[0149] (C2) The compound is preferably a benzoyl ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a dicene compound, a benzophenone compound, an acetophenone compound, an aromatic ketone ester compound, or a benzoic acid ester compound. From the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element, it is more preferably an α-hydroxy ketone compound, an α-amino ketone compound, a biimidazole compound, a phosphine oxide compound, or an oxime ester compound, and even more preferably an oxime ester compound.

[0150] The aforementioned α-hydroxy ketone compounds, α-amino ketone compounds, biimidazole compounds, phosphine oxide compounds, and oxime ester compounds generate free radicals upon heating and interact with each other due to the hydroxyl, amino, imidazole, phosphine oxide, or oxime ester structures, thereby increasing the crosslinking degree of the cured material and promoting the ring-closure reaction of the resin. Therefore, the effect of improving the reliability of the light-emitting element becomes significant.

[0151] <(C3) Photoacid Generator>

[0152] (C3) compounds are compounds that produce acids through bond cleavage and / or reaction upon exposure. From the viewpoint of promoting cationic polymerization, compounds containing (C3) compounds are suitable for negative patterning. On the other hand, in the case of resins or the like with acidic groups protected by acid-dissociable groups, they are suitable for positive patterning from the viewpoint of freeing the acidic groups through exposure, and the effect of improving the sensitivity during exposure becomes significant.

[0153] Examples of (C3) compounds include ionic and nonionic compounds. Ionic compounds are preferably triorganosulfonium salts. Nonionic compounds are preferably halogenated compounds, diazomethane compounds, sulfone compounds, sulfonate compounds, carboxylic acid ester compounds, sulfonylimide compounds, phosphate ester compounds, or sulfone benzotriazole compounds.

[0154] <(C4) Photoalkali-producing agent>

[0155] (C4) compounds are compounds that, through exposure, undergo bond cleavage and / or reaction to produce a base. From the viewpoint of promoting anionic polymerization, (C4) compounds are suitable for negative patterning. On the other hand, when resins or similar materials have acidic groups protected by base-dissociable groups, exposure allows these acidic groups to become free, making them suitable for positive patterning and significantly improving the sensitivity during exposure.

[0156] Examples of (C4) compounds include ionic and nonionic compounds. Ionic compounds are preferably diazabicyclic olefin salts, triazabicyclic olefin salts, α-keto quaternary ammonium salts, benzyl quaternary ammonium salts, guanidine salts, or biguanidine salts. Ionic compounds preferably have a ketoprofen structure, an oxazanone structure, a benzofuran structure, or a naphthalene structure. Nonionic compounds are preferably nitrobenzyl carbamates, anthraquinone carbamates, benzoin carbamates, anthraquinone carbamates, hydroxycinnamamides, or coumarin amides.

[0157] <(D) Colorant>

[0158] The photosensitive composition of the present invention preferably also contains a (D) colorant. A (D) colorant is a compound that colors light by absorbing light of wavelengths (380–780 nm) of visible light. The (D) colorant is preferably a pigment or dye. From the viewpoint of suppressing external light reflection, the (D) colorant preferably contains a black agent or a mixture of two or more colorants. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The so-called black in the (D) colorant is as described in paragraphs

[0284] to

[0285] of International Publication No. 2019 / 087985.

[0159] From the viewpoint of suppressing external light reflection and improving the reliability of the element, the content ratio of (D) colorant in all solid components of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure and suppressing residue after development, the content ratio of (D) colorant is preferably 70% by mass or less, more preferably 50% by mass or less.

[0160] From the viewpoints of suppressing residue after development, achieving low taper of the pattern shape, and improving the reliability of the light-emitting element, the organic black pigment preferably contains one or more selected from benzofuranone-based black pigments, perylene-based black pigments, and azomethyl alkali-based black pigments. Furthermore, from the viewpoint of improving sensitivity during exposure, it is more preferable to contain benzofuranone-based black pigments. The organic black pigment is also preferably anthraquinone-based black pigment, aniline-based black pigment, azo-based black pigment, or carbon black. The carbon black is preferably subjected to resin coating, dye coating, oxidation treatment, surface modification with an organic group having ionic groups, or surface treatment with sulfonic acid groups.

[0161] From the viewpoint of suppressing residue after development and minimizing the taper of the pattern shape, a mixture of two or more colors of colorant preferably contains a mixture of two or more coloring pigments and / or a mixture of two or more coloring dyes. More preferably, the two or more colors include blue and / or purple, and also include red and orange. The coloring pigments are anthraquinone pigments, diketopyrrolopyrrole pigments, perylene pigments, isodihydroindole pigments, isoindolinone pigments, imidazolide pigments, quinacridone pigments, pinantrone pigments, phthalocyanine pigments, indanone pigments, or dioxane pigments. Azide pigments, and the coloring dyes are squaric acid cyanine dyes, xanthan dyes, triarylmethane dyes or phthalocyanine dyes.

[0162] From the viewpoint of suppressing residue after development and reducing the taper of the pattern shape, the inorganic black pigment preferably contains one or more selected from nitrides containing metal elements, carbides containing metal elements, and oxynitrides containing metal elements, wherein the metal element is selected from one or more selected from zirconium, vanadium, niobium, hafnium, and tantalum. More preferably, it contains one or more selected from nitrides, carbides, and oxynitrides containing zirconium, vanadium, niobium, hafnium, or tantalum. From the viewpoint of improving the sensitivity during exposure, it is even more preferable that it contains one or more selected from zirconium nitrides, zirconium carbides, and zirconium oxynitrides.

[0163] <(E) Dispersant>

[0164] The photosensitive composition of the present invention preferably also contains an (E) dispersant. An (E) dispersant refers to a compound having a structure that interacts with the pigment surface and a structure that prevents pigments from approaching each other. From the viewpoint of improving the dispersion stability of the pigment, the (E) dispersant preferably has a basic group, an acidic group, or a salt thereof, and more preferably has a basic group or a salt thereof.

[0165] <(F) Crosslinking Agent>

[0166] The photosensitive composition of the present invention preferably further contains a (B) compound and / or a (F) crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinking group, a cationic polymerizable group, or an anionic polymerizable group capable of reacting with resins, etc. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting element, the (F) crosslinking agent preferably has one or more groups selected from alkoxyalkyl, hydroxyalkyl, epoxy, oxetyl, and blocked isocyanate groups (hereinafter, "specific crosslinking groups"). Alkoxyalkyl is preferably alkoxymethyl or alkoxyethyl, more preferably methoxymethyl or methoxyethyl. Hydroxyalkyl is preferably hydroxymethyl or hydroxyethyl. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting element, the specific crosslinking group number of the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the specific crosslinking group number is preferably 12 or less, more preferably 10 or less, and further preferably 8 or less.

[0167] When the total amount of (A) binder resin and (B) compound is set to 100 parts by mass, from the viewpoint of improving the sensitivity during exposure and the reliability of the light-emitting element, the content of (F) crosslinking agent is preferably 1.0 parts by mass or more. On the other hand, from the viewpoint of suppressing residue after development and improving the reliability of the light-emitting element, the content of (F) crosslinking agent is preferably 30 parts by mass or less.

[0168] From the viewpoint of suppressing residues after development and improving the reliability of the light-emitting element, the (F) crosslinking agent preferably contains (F1) compounds: compounds having at least two phenolic hydroxyl groups and at least two specific crosslinking groups and / or (F2) compounds: compounds having a structure including a heterocyclic structure and at least two specific crosslinking groups. The preferred contents of these (F) crosslinking agents are also the same as those described above.

[0169] From the viewpoint of improving the reliability of the light-emitting element, the (F1) compound preferably has a structure in which at least two phenolic hydroxyl groups and specific crosslinking groups are combined in one aromatic structure, and more preferably has a structure in which at least two phenolic hydroxyl groups and at least two specific crosslinking groups are combined in one aromatic structure. From the viewpoint of improving the reliability of the light-emitting element, the heterocyclic structure in the (F2) compound is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and even more preferably an isocyanuric acid structure, triazine structure, glycourea structure, imidazolium ketone structure, pyrazole structure, imidazolium structure, triazole structure, tetrazolium structure, or purine structure. The number of nitrogen atoms in the heterocyclic structure of the (F2) compound is preferably one or more, more preferably two or more, and even more preferably three or more. On the other hand, the number of nitrogen atoms is preferably six or less, more preferably four or less.

[0170] <(G)inorganic particles>

[0171] From the viewpoint of improving the reliability of the light-emitting element and increasing the brightness of the light emission, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. The embodiment of the photosensitive composition of the present invention containing (G) inorganic particles can be either a embodiment comprising the (G) inorganic particles in the aforementioned polysiloxane containing inorganic particles or a embodiment comprising (G) inorganic particles added to the photosensitive composition. The photosensitive composition of the present invention also preferably contains the aforementioned polysiloxane containing inorganic particles and further contains (G) inorganic particles, and also preferably does not contain the aforementioned polysiloxane containing inorganic particles but contains (G) inorganic particles. (G) inorganic particles refer to particles containing elements selected from metallic elements, metalloid elements, and semiconductor elements as main components. It should be noted that the term "main component" refers to the component that is most abundant in the composition based on mass. From the viewpoint of improving the reliability of the light-emitting element, the (G) inorganic particles preferably have hydroxyl and / or silanol groups on the particle surface.

[0172] From the viewpoint of improving the reliability of the light-emitting element and increasing the brightness of the light emission, (G) inorganic particles preferably contain one or more selected from silicon dioxide particles, aluminum oxide particles, titanium dioxide particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles and cerium oxide particles. From the viewpoint of suppressing external light reflection, it is more preferable to contain silicon dioxide particles.

[0173] It can be assumed that the silica particles, through the acidity and negative charge of the hydroxyl and / or silanol groups on their surface, capture metallic impurities and ionic impurities that adversely affect electrical insulation. Furthermore, it is presumed that the robust structure of the particles ensures that the captured impurities remain even after heat treatment or voltage application, thus improving the reliability of the light-emitting element. Additionally, it can be assumed that the silica particles biased onto the surface of the cured material reduce the reflection / scattering of incident external light. As a result, the interference of incident external light is suppressed, thus significantly improving the luminous brightness.

[0174] From the viewpoint of improving the reliability of the light-emitting element and increasing the brightness of the light emission, the content ratio of (G) inorganic particles in all solid components of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of suppressing residues after development, the content ratio of (G) inorganic particles is preferably 90% by mass or less, more preferably 70% by mass or less, further preferably 60% by mass or less, and particularly preferably 50% by mass or less. The content ratio of (G) inorganic particles refers to the total of (G) inorganic particles in the polysiloxane containing inorganic particles and (G) inorganic particles added to the photosensitive composition.

[0175] <Other Additives and Solvents>

[0176] The photosensitive composition of the present invention preferably further contains a thermal chromophore, an oxidative chromophore, a solubility promoter, an ink repellent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. These additives can be known substances. The photosensitive composition of the present invention preferably also contains a solvent. When the photosensitive composition of the present invention contains a pigment and also contains a dispersant, from the viewpoint of improving the dispersion stability of the pigment, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond.

[0177] <Content of chlorine, bromine, chloride ions, and bromide ions>

[0178] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the brightness of light emission, the photosensitive composition of the present invention preferably further contains one or more components selected from components containing chlorine, components containing bromine, components containing chloride ions, and components containing bromide ions (hereinafter, "specific halogen components"), and satisfies the following condition (1).

[0179] (1) The total content of chlorine and bromine in all solid components of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and / or the total content of chloride ions and bromide ions in all solid components of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0180] The components containing chlorine and bromine are preferably alkyl chloride compounds, cycloalkyl chloride compounds, aryl chloride compounds, alkyl bromides, cycloalkyl bromides, or aryl bromides. The components containing chloride ions and bromides preferably contain ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cations. The quaternary ammonium ions are preferably specific quaternary ammonium ions described later, and more preferably satisfy the conditions described later (6).

[0181] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of chlorine and bromine elements in all solid components of the photosensitive composition, and the total content of chloride ions and bromide ions in all solid components of the photosensitive composition, is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of chlorine and bromine elements, and the total content of chloride ions and bromide ions, is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Further, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0182] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the brightness of light emission, the photosensitive composition of the present invention preferably further satisfies the following condition (2).

[0183] (2) The total content of chlorine and bromine in all solid components of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and the total content of chloride ions and bromide ions in all solid components of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0184] Under the condition (2) above, the photosensitive composition of the present invention preferably contains a component containing chlorine and / or a component containing bromine, and also contains a component containing chloride ions and / or a component containing bromide ions.

[0185] By including trace amounts of the aforementioned specific halogen components in the photosensitive composition, protons are activated through these anions and anions derived from these components. This significantly improves the sensitivity during exposure and inhibits residue buildup after development by promoting the dissolution of the developer and preventing residue adhesion at the opening. It is further hypothesized that the control of polarization structure and charge balance in the cured material suppresses metal migration and aggregation, thereby improving the reliability of the light-emitting element. Furthermore, it is hypothesized that surface modification of the wiring surface controls conductivity, thereby increasing luminous brightness. Additionally, it is believed that the polar groups of the resin in the photosensitive composition are stabilized through interaction with the specific halogen components. In particular, when the photosensitive composition contains polysiloxane, the silanol groups in the polysiloxane are suitable for stabilization. Furthermore, it is believed that the polarization structure and charge balance in the photosensitive composition are controlled through the interaction of 3d orbitals (empty atomic orbitals) with the resin in the photosensitive composition via non-shared electron pairs. As a result, the effect of improved storage stability becomes significant.

[0186] <Fluorine content>

[0187] From the viewpoint of suppressing residue after development, improving the reliability of the light-emitting element, and increasing the brightness of the light emission, the photosensitive composition of the present invention preferably satisfies the condition (1a) below. The photosensitive composition of the present invention is more preferably further satisfied with the condition (2a) below.

[0188] (1a) The fluorine content in all solid components of the photosensitive composition is less than 1,000 ppm by mass.

[0189] (2a) The content of fluoride ions in all solid components of the photosensitive composition is less than 1,000 ppm by mass.

[0190] From the viewpoint of the effects of the above-described invention, the fluorine content in all solid components of the photosensitive composition is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, further preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the above-described invention, the fluorine content is preferably 1,000 ppm by mass or less, more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Further, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0191] The preferred range of fluoride ion content in all solid components of the photosensitive composition is the same as the preferred range of fluoride content in all solid components of the photosensitive composition described above.

[0192] The fluorine content in all solid components of the photosensitive composition can be 0 ppm by mass. The fluoride ion content in all solid components of the photosensitive composition can also be 0 ppm by mass. When the fluorine content and / or fluoride ion content in all solid components of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains (A) an adhesive resin, (C) a photosensitizer, (B) a compound, or (F) a crosslinking agent having fluorine atoms or fluoride ions in its structure, or further contains components containing fluorine and / or components containing fluoride ions.

[0193] The fluorine-containing component is preferably a phenolic compound, alkyl fluorine compound, cycloalkyl fluorine compound, or aryl fluorine compound having a substituent containing a fluorinated alkyl group. The fluoride-containing component preferably contains an ammonium ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, or quaternary ammonium ion as a cation. The quaternary ammonium ion preferably has a straight-chain or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group with 1 to 15 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 6 carbon atoms, or a hydroxyalkyl group with 1 to 6 carbon atoms, more preferably an alkyl group with 1 to 10 carbon atoms, and even more preferably an alkyl group with 1 to 6 carbon atoms.

[0194] It is presumed that by setting the content of compounds containing fluorine atoms in the structure and components containing fluorine elements in the photosensitive composition to a specific value or below, the content of fluorine elements, fluoride ions, or fluorine-containing anions derived from these components is set to a specific value or below. Therefore, through the interactions such as hydrogen bonds among the components in the photosensitive composition, protons in the photosensitive composition are locally activated. Thus, it is considered that the effect of suppressing residues after development becomes significant by promoting the dissolution of the developer. Furthermore, it is considered that by intentionally setting the content of the aforementioned components to a specific value or below, the polarization structure and charge balance in the cured product are controlled. As a result, it is presumed that by suppressing the ion migration and electromigration of metallic and ionic impurities that adversely affect luminescence properties or electrical insulation, the reliability and luminous brightness of the light-emitting element are improved. Furthermore, it is presumed that by suppressing the migration and aggregation of metals in the electrodes or metal wiring, the reliability of the display device is improved.

[0195] <Water content>

[0196] From the viewpoint of improving sensitivity during exposure, suppressing residue after development, improving storage stability and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably also contains water and satisfies the following condition (3).

[0197] (3) The water content in the photosensitive composition is 0.010 to 3.0% by mass.

[0198] From the viewpoint of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving the reliability of the light-emitting element, the water content in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving the reliability of the light-emitting element, the water content is preferably 2.5% by mass or less, more preferably 2.2% by mass or less, and further preferably 2.0% by mass or less. Further, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, further preferably 1.2% by mass or less, further more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0199] By maintaining the water content in the photosensitive composition within the aforementioned range, the stability of anions in the photosensitive composition is enhanced through hydrogen bonding of water molecules, thereby activating protons. This significantly improves the sensitivity during exposure and suppresses residue buildup after development by promoting the dissolution of the developer and preventing residue adhesion at the opening. Furthermore, it can be assumed that the polar groups of the resin in the photosensitive composition are stabilized through interactions such as the dipole moment and hydrogen bonding of water molecules. In particular, when the photosensitive composition contains polysiloxane, it is suitable for stabilizing the silanol groups in the polysiloxane. As a result, the effect of improving storage stability becomes significant. It is further hypothesized that the water, through interactions such as the dipole moment and hydrogen bonding of water molecules, captures metallic impurities and ionic impurities that adversely affect electrical insulation, thus suppressing ion migration and electromigration, and improving the reliability of the light-emitting element.

[0200] <Content of specific anions and specific phosphorus compounds>

[0201] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the photosensitive composition of the present invention preferably contains one or more selected from sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions (hereinafter, "specific anions"), and satisfies the condition of (4) below, and / or contains one or more selected from phosphate esters, phosphonic acids, phosphonate esters, phosphite esters, hypophosphonic acids, and hypophosphite esters (hereinafter, "specific phosphorus compounds") and satisfies the condition of (5) below.

[0202] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions and oxalate ions in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0203] (5) The total content of phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, hypophosphonic acid and hypophosphite esters in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0204] When condition (4) above is met, the photosensitive composition of the present invention preferably contains a component comprising a specific anion. The component comprising a specific anion preferably contains ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cations. Quaternary ammonium ions are preferably specific quaternary ammonium ions described later, and more preferably meet the condition (6) described later.

[0205] The specific phosphorus compound is preferably a compound having a substituent containing a carbon element and an acidic group containing a phosphorus element. The substituent containing the carbon element preferably has a 1-18 carbon aliphatic group (1-2 valent), a 4-18 carbon alicyclic group (1-2 valent), a 6-15 carbon alivalent aromatic group (1-2 valent), a 1-18 carbon aliphatic group (1-2 valent), a 4-18 carbon alicyclic group (1-2 valent), or a 6-15 carbon alivalent aromatic group (1-2 valent). The specific phosphorus compound is preferably a phosphate monoester, phosphate diester, phosphonic acid, phosphonic acid monoester, phosphite monoester, phosphite diester, hypophosphonic acid, or hypophosphite monoester.

[0206] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of specific anions and the total content of specific phosphorus compounds in all solid components of the photosensitive composition are preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of specific anions and the total content of specific phosphorus compounds are preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less. Further, preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Further, from the viewpoint of improving the above-mentioned characteristics, preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Further, preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0207] By including trace amounts of the aforementioned specific anions or phosphorus compounds in the photosensitive composition, the sensitivity during exposure and the effect of suppressing residue after development are significantly improved, thereby promoting the dissolution of the developer and preventing residue adhesion in the opening. Furthermore, the storage stability is significantly improved by stabilizing the polar groups of the resin in the photosensitive composition and controlling the polarization structure and charge balance in the photosensitive composition. It is further hypothesized that controlling the polarization structure and charge balance in the cured product can suppress metal migration and aggregation, thereby improving the reliability of the light-emitting element. Additionally, it is hypothesized that surface modification of the wiring surface can control conductivity, thereby improving luminous brightness.

[0208] <Content of tertiary amine compounds and quaternary ammonium ions>

[0209] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the brightness of light emission, the photosensitive composition of the present invention preferably also contains a tertiary amine compound and / or quaternary ammonium ions, and satisfies the following condition (6).

[0210] (6) The total content of tertiary amine compounds and quaternary ammonium ions in all solid components of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

[0211] When the above condition (6) is met and the product contains quaternary ammonium ions, the photosensitive composition of the present invention preferably contains a component comprising quaternary ammonium ions. The component comprising quaternary ammonium ions preferably contains anionic species. The anionic species is preferably the above-mentioned chloride ion, the above-mentioned bromide ion, or the above-mentioned specific anion, and more preferably meets the above-mentioned conditions (1), (2), or (4).

[0212] The tertiary amine compound preferably contains a compound represented by general formula (18) (hereinafter, "specific tertiary amine compound"). The quaternary ammonium ion preferably contains a compound represented by general formula (19) (hereinafter, "specific quaternary ammonium ion").

[0213]

[0214] In general formulas (18) and (19), R 31 ~R 37 Each of these can independently represent an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. In general formulas (18) and (19), R 31 ~R 37Each of the substituents is preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The above substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0215] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of tertiary amine compounds and quaternary ammonium ions in all solid components of the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving luminous brightness, the total content of tertiary amine compounds and quaternary ammonium ions is preferably 30,000 ppm by mass or less, more preferably 25,000 ppm by mass or less, even more preferably 20,000 ppm by mass or less, and particularly preferably 15,000 ppm by mass or less. Further, preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Further, from the viewpoint of improving the above-mentioned characteristics, preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Further, preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0216] By including trace amounts of the aforementioned tertiary amine compound or quaternary ammonium ions in the photosensitive composition, the sensitivity during exposure and the effect of suppressing residue after development are significantly improved, similarly through promoting the dissolution of the developer and preventing residue adhesion in the opening. Furthermore, the storage stability is significantly improved by stabilizing the polar groups of the resin in the photosensitive composition and controlling the polarization structure and charge balance in the photosensitive composition. It is further hypothesized that controlling the polarization structure and charge balance in the cured product to suppress metal migration and aggregation will improve the reliability of the light-emitting element. Furthermore, it is hypothesized that surface modification of the wiring surface will control conductivity, thereby improving luminous brightness.

[0217] <Content of methanol and ethanol>

[0218] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability and increasing luminescence brightness, the photosensitive composition of the present invention also contains methanol and / or ethanol, and satisfies the following condition (7).

[0219] (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0220] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of methanol and ethanol in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of methanol and ethanol is preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less. Further, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferable to have a mass of 500 ppm or less, more preferably 300 ppm or less, and even more preferably 100 ppm or less. Further, it is preferable to have a mass of 50 ppm or less, more preferably 30 ppm or less, even more preferably 10 ppm or less, even more preferably 5 ppm or less, particularly preferably 3 ppm or less, and most preferably 1 ppm or less.

[0221] By including trace amounts of methanol or ethanol in the photosensitive composition, the hydrophilicity of the compound promotes dissolution of the developer, thereby significantly improving the sensitivity during exposure and inhibiting residue buildup after development. Furthermore, since the substrate surface is modified by the compound, the effect of preventing residue adhesion in openings and thus inhibiting residue buildup after development becomes significant.

[0222] Furthermore, it can be considered that by intentionally including trace amounts of the aforementioned compound, the polar groups of the resin in the photosensitive composition are stabilized through hydrogen bonding interactions arising from the hydroxyl groups in the compound. In particular, when the photosensitive composition contains polysiloxane, it is suitable for stabilizing the silanol groups in the polysiloxane. Furthermore, it can be considered that the polarization structure and charge balance in the photosensitive composition are controlled through the hydroxyl groups in the compound. As a result, the effect of improving storage stability becomes significant. Further, it is presumed that when a pattern of the photosensitive composition is formed on wiring such as metal, the aforementioned compound in the photosensitive composition modifies the surface of the wiring, which becomes an opening, or the wiring surface in contact with the pattern. Furthermore, it can be considered that the hydroxyl groups in the compound contained in the cured product capture trace amounts of metallic and ionic impurities in the cured product, which migrate to the wiring surface and thus act as charge carriers in the wiring. As a result, it is presumed that the conductivity of the wiring such as metal is controlled, enabling low-voltage driving and thus increasing luminous brightness.

[0223] <Content of the first specific compound (alcohol, ester, and ether compounds)>

[0224] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability and increasing luminescence brightness, the photosensitive composition of the present invention preferably contains one or more selected from 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether and isoallyl ethyl ether (hereinafter, "the first specific compound"), and satisfies the following condition (8).

[0225] (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0226] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the first specific compound in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the first specific compound is preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less. Further, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferable to have a mass of 500 ppm or less, more preferably 300 ppm or less, and even more preferably 100 ppm or less. Further, it is preferable to have a mass of 50 ppm or less, more preferably 30 ppm or less, even more preferably 10 ppm or less, even more preferably 5 ppm or less, particularly preferably 3 ppm or less, and most preferably 1 ppm or less.

[0227] By including trace amounts of the aforementioned first specific compound in the photosensitive composition, the sensitivity during exposure and the effect of suppressing residue after development are significantly improved, thereby promoting the dissolution of the developer and preventing the adhesion of residue in the opening. Furthermore, the storage stability is significantly improved by stabilizing the polar groups of the resin in the photosensitive composition and controlling the polarization structure and charge balance in the photosensitive composition. It is further hypothesized that conductivity is controlled through surface modification of the wiring surface and the migration of metallic and ionic impurities to the wiring surface, thereby increasing luminous brightness.

[0228] <Content of the second specific compound (alcohol, ester, and ether compounds)>

[0229] From the viewpoint of improving sensitivity during exposure, suppressing residue after development, improving storage stability and increasing luminescence brightness, the photosensitive composition of the present invention preferably further contains one or more selected from 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether and methylallyl ethyl ether (hereinafter, "the second specific compound"), and satisfies the following condition (9).

[0230] (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether and methylallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0231] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the second specific compound in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, further preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the second specific compound is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Further, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0232] By including the second specific compound in trace amounts in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness become significant, similar to those of the first specific compound.

[0233] <Specific ketone compounds>

[0234] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability and increasing luminescence brightness, the photosensitive composition of the present invention preferably further contains 4-methyl-3-penten-2-one and / or 4-methyl-4-penten-2-one (hereinafter, "specific ketone compound"), and satisfies the following condition (10).

[0235] (10) The total content of 4-methyl-3-penten-2-one and 4-methyl-4-penten-2-one in the photosensitive composition is 0.010 to 10.0% by mass.

[0236] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of specific ketone compounds in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of specific ketone compounds is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, further preferably 3.0% by mass or less, further more preferably 2.5% by mass or less, particularly preferably 2.2% by mass or less, and most preferably 2.0% by mass or less. Further, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, further preferably 1.2% by mass or less, further more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0237] By including trace amounts of the aforementioned specific ketone compound in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness become significant, similar to the first specific compound.

[0238] <Specific heterocyclic compounds>

[0239] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the photosensitive composition of the present invention preferably further contains a material selected from N-methylpyrrolidone, N-ethylpyrrolidone, and 1,4-dimethylpyrrolidone. It is one or more of an alkane and a tetrahydrofuran (hereinafter, “specific heterocyclic compound”) and satisfies the following condition (11).

[0240] (11) N-methylpyrrolidone, N-ethylpyrrolidone, and 1,4-dimethylpyrrolidone in the photosensitive composition The combined content of alkyl and tetrahydrofuran is 0.0010 to 1,000 ppm by mass.

[0241] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the specific heterocyclic compounds in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness, the total content of the second specific compound is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Further, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0242] By including trace amounts of the aforementioned specific heterocyclic compound in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and increasing luminescence brightness become significant, similar to the first specific compound.

[0243] <Hydrogen ion index of diluted solution>

[0244] When the photosensitive composition of the present invention is diluted with water to prepare a diluted solution, and the concentration of the solid component in the diluted solution is 1 / 100 times that of the photosensitive composition, from the viewpoint of improving sensitivity during exposure, suppressing residue after development, and improving storage stability, the hydrogen ion index of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, further preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more. On the other hand, from the viewpoint of improving sensitivity during exposure, suppressing residue after development, and improving storage stability, the hydrogen ion index of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less. When the photosensitive composition of the present invention contains (A1x-1) resin, when the photosensitive composition is diluted with water to prepare a diluted solution, and the concentration of the solid component in the diluted solution is 1 / 100 times that of the photosensitive composition, the hydrogen ion index of the diluted solution is also preferably 5.5 or more, more preferably 5.7 or more, even more preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more, from the viewpoint of the effects of the present invention. On the other hand, from the viewpoint of the effects of the invention described above, the hydrogen ion index of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less.

[0245] The hydrogen ion index of the diluted solution of the photosensitive composition can be determined using a commercially available pH meter. First, the photosensitive composition is diluted with water to prepare a diluted solution, with the concentration of the solid components in the diluted solution being 1 / 100th of the concentration of the solid components in the photosensitive composition. Next, to allow the components in the photosensitive composition to reach distribution equilibrium, the prepared diluted solution is stirred for at least 10 minutes. After stirring, the hydrogen ion index of the diluted solution is measured using a pH meter. It should be noted that if the diluted solution separates into an organic layer and an aqueous layer after stirring, the hydrogen ion index of the aqueous layer is measured.

[0246] <The photosensitive film of the present invention>

[0247] The photosensitive film of the present invention is a substance in a semi-cured state (stage B) where the photosensitive composition of the present invention has been film-formed. The term "semi-cured state" refers to a state in which no cross-linked structure is formed, or a state in which a cross-linked structure is formed through a partial reaction but the film remains fluid. Examples include a state in which the coating is dried under reduced pressure after being coated onto a substrate, thereby removing the solvent by distillation, or a state in which the coating is dried by heating at 40–150°C; and a state in which it is soluble in alkaline solutions or organic solvents. The term "photosensitive film" refers to a film having positive or negative photosensitivity and capable of forming a self-standing film from a single film. The term "capable of forming a self-standing film from a single film" means that a film with a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more can be formed without a support. The photosensitive film is preferably a laminate disposed on a support. The support is preferably a flexible substrate, but a rigid substrate may also be used.

[0248] <Curated product of the photosensitive composition of the present invention>

[0249] The cured product of the present invention is obtained by curing the photosensitive composition of the present invention. Curing refers to a situation or state in which the film loses its fluidity due to the formation of a cross-linked structure through a reaction. The reaction can be a heating reaction, a reaction irradiated with energy rays, etc., and is not particularly limited, but a heating reaction is preferred. The state in which the film loses its fluidity due to the formation of a cross-linked structure through heating is called thermal curing. Examples of heating conditions include heating at 150–500°C for 5–300 minutes. The cured product of the present invention can be a substance obtained by curing the photosensitive film of the present invention.

[0250] From the viewpoint of suppressing external light reflection and improving the reliability of the component, the optical density at the wavelength of visible light per 1 μm film thickness of the cured material of the present invention is preferably 0.20 or more, more preferably 0.50 or more, and even more preferably 1.0 or more. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the component, the above-mentioned optical density is preferably 3.0 or less, more preferably 2.0 or less, and even more preferably 1.5 or less. It should be noted that the optical density is preferably the optical density in the cured material in which the composition has been cured by heating. By having the optical density in the above range, incident external light can be blocked, thus the effect of suppressing external light reflection becomes significant. In addition, since the light degradation of the cured material itself and the layer located inside it is suppressed, the effect of improving the reliability of the component becomes significant.

[0251] <Components and items containing solidified material>

[0252] The elements of the present invention comprise the cured product of the present invention. Furthermore, the articles of the present invention comprise the cured product of the present invention. Examples of articles include, for example, electronic components, electronic devices, mobile bodies, buildings, or windows. Examples of electronic components include, for example, semiconductor devices, antennas, display devices, metal-clad laminates, wiring boards, semiconductor packages, active or passive components containing semiconductor devices. The photosensitive composition of the present invention is preferably used to form electronic components. Examples of semiconductor devices include, for example, semiconductor devices having fan-out wafer-level packaging structures, fan-out panel-level packaging structures, or packaged antenna structures. Examples of antennas include, for example, microstrip antennas or stripline antennas. Examples of display devices include, for example, organic EL displays, quantum dot displays, micro-LED displays, mini-LED displays, or liquid crystal displays. Examples of metal-clad laminates include, for example, printed circuit boards.

[0253] The electronic components of the present invention include the cured product of the present invention. Furthermore, the display device of the present invention includes the cured product of the present invention. The display device including the cured product of the present invention exhibits excellent high luminous brightness. Therefore, the photosensitive composition of the present invention is preferably used to form pixel partition layers, TFT planarization layers, TFT protective layers, TFT interlayer insulating layers, or gate insulating layers in organic EL displays, quantum dot displays, or micro-LED displays. Furthermore, the photosensitive composition of the present invention is also preferably used to form spacer layers or planarization layers in micro-LED displays or mini-LED displays. The spacer layers are formed between adjacent light-emitting elements, and the planarization layer is preferably formed in a manner covering at least a portion of the light-emitting elements. It should be noted that the light-emitting elements are preferably semiconductor chips. That is, the photosensitive composition of the present invention is particularly preferably used to form spacer layers formed between adjacent light-emitting elements or planarization layers formed in a manner covering at least a portion of the light-emitting elements.

[0254] <Hollow Structure>

[0255] The hollow structure of the present invention comprises the cured product of the present invention. The electronic component of the present invention preferably has the hollow structure of the present invention. The hollow structure of the present invention comprises a hollow structure support material and a hollow structure top material. The photosensitive film of the present invention is suitable for the formation of the hollow structure. Examples of electronic components having a hollow structure include, for example, MEMS (Micro Electro Mechanical Systems).

[0256] <Display Device>

[0257] The display device of the present invention will now be described. However, the present invention is not limited to the following embodiments, and various modifications are of course possible to achieve the purpose of the invention without departing from the scope of the invention.

[0258] The display device of the present invention has the configuration described above

[15] . With the above configuration, the display device of the present invention can provide a display device with excellent luminous brightness. It is presumed that by intentionally including trace amounts of the aforementioned methanol or ethanol in the spacer layer and / or planarization layer, the hydroxyl groups in the compound contained in the cured product capture trace amounts of metallic impurities and ionic impurities in the cured product. It is considered that these impurities migrate to the wiring surface and thus act as charge carriers in the wiring. As a result, it is considered that by controlling the conductivity of the wiring, such as metals, a low-voltage drive can achieve a high luminous brightness effect.

[0259] <Resins and compounds in the spacer layer and planarization layer>

[0260] The display device of the present invention comprises a spacer layer and / or a planarization layer. The spacer layer and planarization layer in the display device of the present invention are preferably cured products of a photosensitive composition, and more preferably contain a resin. The resin in the spacer layer and the planarization layer preferably contains (XA1) a resin containing a weakly acidic group and / or (XA2) a resin without a weakly acidic group. The (XA1) resin containing a weakly acidic group in the spacer layer and the planarization layer is preferably the aforementioned (A1) resin containing a weakly acidic group or a resin having a structure derived from that resin. The (XA2) resin without a weakly acidic group is preferably the aforementioned (A2) resin without a weakly acidic group or a resin having a structure derived from that resin. Examples and preferences relating to the resin in the spacer layer and the planarization layer are described as described above regarding the examples and preferences relating to the (A) adhesive resin. The resin in the spacer layer and the planarization layer can be either the (A) adhesive resin in the composition or a resin having a structure derived from that resin.

[0261] <Content of methanol and ethanol in the spacer layer and planarization layer>

[0262] The spacer wall layer and / or planarization layer of the display device of the present invention contain methanol and / or ethanol. From the viewpoint of improving luminous brightness, the display device of the present invention preferably further satisfies the following conditions (X1a) and / or (X1b).

[0263] (X1a) The total content of methanol and ethanol in this spacer layer is 0.0010 to 30,000 ppm by mass.

[0264] (X1b) The total content of methanol and ethanol in the planarization layer is 0.0010 to 30,000 ppm by mass.

[0265] The display device of the present invention is preferably a micro-LED display or a mini-LED display. It should be noted that, since the area of ​​the redistribution layer is larger than the area of ​​the light-emitting element (which is a semiconductor chip) in a top view, the display device of the present invention has a fan-out wafer-level packaging structure or a fan-out panel-level packaging structure. The substrate, redistribution layer, interlayer insulating layer of the redistribution layer, light-emitting element, semiconductor chip, spacer layer, and planarization layer can be made of known materials.

[0266] The display device of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a schematic cross-sectional view of a microLED display having a spacer layer and a planarization layer. The display device 1a has a plurality of light-emitting elements 2 and a plurality of spacer layers 15 on a substrate 5. A planarization layer 21 is provided on the light-emitting elements 2, and an interlayer insulating layer 3 is provided on the planarization layer 21. The light-emitting elements 2 are preferably semiconductor chips. The term "on the light-emitting elements 2" can refer not only to the surface of the light-emitting elements 2, but also to the support substrate and the upper side of the light-emitting elements 2. Figure 1 The illustrated scheme shows that the spacer layer 15 is disposed between a plurality of adjacent light-emitting elements 2, the planarization layer 21 is formed to cover the light-emitting elements 2, and a plurality of interlayer insulating layers 3 are stacked on the planarization layer 21, but the interlayer insulating layer 3 may also be a single layer.

[0267] The light-emitting element 2 has a pair of electrode terminals 6 on the side opposite to the surface in contact with the opposing substrate 5. Each electrode terminal 6 is electrically connected to a metal wire 4 extending in the planarization layer 21 and the interlayer insulating layer 3. It should be noted that if the multiple metal wires 4 are covered by the planarization layer 21 or the interlayer insulating layer 3, these layers function as insulating films, thus forming a structure that maintains electrical insulation. The term "metal wires forming a structure that maintains electrical insulation" refers to covering the portions of the metal wires requiring electrical insulation with a cured product obtained by curing a resin-containing composition. Furthermore, since the light-emitting element 2 and the driving element 8 of the light-emitting element driving substrate 7, which is positioned opposite the opposing substrate 5, are electrically connected via metal wires 4 and 4c, the light emission of the light-emitting element 2 can be controlled. In addition, the light-emitting element driving substrate 7 is electrically connected to the metal wires 4 via solder bumps 10. Furthermore, to prevent the diffusion of metal from the metal wires 4, a barrier metal 9 is provided. It should be noted that the metal wire 4c can penetrate the light-emitting element driving substrate 7 and be electrically connected to the driving element 8. The side of the light-emitting element 2 in the display device 1a that is in contact with the opposing substrate 5 ( Figure 1 The lower side is the light extraction side. Figure 1 The microLED display is preferably manufactured by placing a light-emitting element 2, which is a semiconductor chip, on a support substrate or the like, and then forming a chip-first (RDL (Redistribution layer)-last) structure with metal wiring 4 and an interlayer insulating layer 3. Then, preferably, a light-emitting element driving substrate is bonded, and then, after the support substrate or the like is peeled off, a counter substrate 5 is attached.

[0268] Figure 2 A schematic cross-sectional view of other forms of microLED displays having a spacer layer and a planarization layer. The side of the light-emitting element 2 in display device 1b that is in contact with the opposing substrate 5 ( Figure 2 The upper side is the light extraction side. Figure 2 The microLED display is preferably manufactured by forming a metal wiring 4 and an interlayer insulating layer 3 on a support substrate or the like, and then configuring the light-emitting element 2 as a semiconductor chip in an RDL-first (Chip-last) structure. Then, preferably after peeling off the support substrate or the like, a counter substrate 5 is attached, and then a light-emitting element driving substrate 7 is bonded.

[0269] The light-emitting element 2 is preferably a PN-junction diode that combines a P-type semiconductor and an N-type semiconductor. The length of one side of the light-emitting element 2 is preferably 5 to 700 μm, more preferably 5 to 100 μm. The interlayer insulating layer 3, the spacer layer 15, and the planarization layer 21 are preferably cured products of a patterned photosensitive composition. It should be noted that the thickness of the planarization layer 21 is also preferably greater than the thickness of the spacer layer 15. Furthermore, the planarization layer 21 is preferably configured to cover a portion of the side of the spacer layer 15 opposite to the side in contact with the opposing substrate 5, more preferably covering the entire side of the spacer layer 15 opposite to the side in contact with the opposing substrate 5. From the viewpoint of improving mechanical properties, the interlayer insulating layer 3 is more preferably composed of the aforementioned polyimide-based resin. By containing the aforementioned polyimide-based resin, warpage of the wafer and substrate is suppressed, significantly improving the accuracy of the exposure process and the wafer / substrate transport process, and increasing the yield. From the viewpoint of improving luminous brightness, the spacer layer 15 and the planarization layer 21 are preferably cured products of the present invention. From the viewpoint of improving the reliability and brightness of the light-emitting element, the spacer layer 15 preferably contains the aforementioned (G) inorganic particles. From the viewpoint of improving the reliability of the light-emitting element and suppressing external light reflection, the spacer layer 15 preferably contains the aforementioned (D) colorant. Figure 2 The meanings of the remaining symbols in the text are as follows: Figure 1 .

[0270] <Method for manufacturing solidified products>

[0271] The method for manufacturing the cured product of the present invention includes the following steps: (1) forming a coating of the photosensitive composition of the present invention on a substrate; (2) irradiating the coating of the photosensitive composition with active chemical rays through a photomask; (3) developing the coating using a developing solution to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition. It should be noted that the methods described in paragraphs

[0453] to

[0481] of International Publication No. 2019 / 087985 can be applied in these steps. The coating process is preferably performed by pre-baking after coating to form the film. The process of obtaining the cured pattern is preferably performed by heating the pattern to thermally cure it.

[0272] Example

[0273] The present invention is further illustrated by the following examples, reference examples, and comparative examples, but the invention is not limited to these scopes. It should be noted that for compounds using abbreviations among the compounds used in the following description or tables, the names corresponding to the abbreviations are summarized in Tables 1-2.

[0274] [Table 1-2]

[0275]

[0276] <Synthesis Examples of Various Resins>

[0277] The compositions of the resins obtained in Synthesis Examples 1 to 27 as (A) adhesive resins are summarized in Tables 1-3 to 1-5. Each resin was synthesized using known methods, with appropriate modifications to the monomer compounds and copolymerization ratios, based on methods described in known literature. The copolymerization ratios of the monomers are shown in Tables 1-3 to 1-5.

[0278] The hydroxyl-containing diamine (HA) used in Synthesis Example 16 was synthesized using a known method based on the synthesis method described in Synthesis Example 1 of International Publication No. 2016 / 056451, paragraphs

[0374] to

[0376] . It should be noted that the resin obtained in Synthesis Example 16 using the hydroxyl-containing diamine (HA) with the following structure is a polyimide precursor having an amide ester structural unit, an amide acid structural unit, and an imide closed-ring structure.

[0279]

[0280] In Synthesis Examples 16 and 17, DFA, as an esterifying agent, reacts with the amic acid structural units in the resin to transform their structure into amic acid ester structural units with methyl groups.

[0281] In Synthesis Example 23, GMA with epoxy groups reacted with carboxyl groups derived from MAA in the resin, resulting in the ring-opening addition of all epoxy groups in GMA.

[0282] In Synthesis Example 26, DHBA with a carboxyl group reacted with epoxy groups derived from GMA in the resin, causing all epoxy groups of GMA to undergo ring-opening addition.

[0283] In Synthesis Example 27, GMA with epoxy groups reacted with phenolic hydroxyl groups derived from HPMA in the resin, resulting in the complete ring-opening addition of all epoxy groups in the GMA.

[0284] [Table 1-3]

[0285]

[0286] [Table 1-4]

[0287]

[0288] [Table 1-5]

[0289]

[0290] Regarding the resins obtained in each synthesis example and the resins used in each example, reference example, and comparative example, the structural units and structures of each resin are summarized in Table 2-1. It should be noted that polysiloxane (PS-5), polyimide (PI-1), polyimide precursor (PIP-1), and polybenzo[…] azole (PB-1), polybenzoxazole The fluorine content in the resins of the azole precursor (PBP-1) and polyamide-imide (PAI-1) exceeds 10,000 ppm by mass. The fluorine content in the resins of polysiloxanes (PS-1) to (PS-4), (PS-6) to (PS-11), polyimides (PI-2) to (PI-4), polyimide precursor (PIP-2), and other synthetic examples is 0 ppm by mass.

[0291] [Table 2-1]

[0292]

[0293] <Examples of preparation of various pigment dispersions>

[0294] As pigment dispersions, the compositions of the dispersions obtained in Preparation Examples Bk-1 to Bk-3 are summarized in Table 2-2. Preparation Examples Bk-1 to Bk-3 were prepared using the method described below. Furthermore, a summary and description of the (D) colorant and (E) dispersant used in each example, reference example, and comparative example are shown in Table 2-2.

[0295] Preparation of formulations Bk-1 to Bk-3 and pigment dispersions (Bk-1) to (Bk-3)

[0296] Based on paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261, and the method described in Modification Example 1, a wet medium dispersion process was performed in a cyclic manner using the colorant described in Table 2-2 and ADP as a polyalkylene amine-polyoxyalkylene ether dispersant, with the average primary particle size of the pigment being the value described in Table 2-2. Then, using... The pigments were filtered through a filter to obtain pigment dispersions (Bk-1) to (Bk-3) with a solid content concentration of 15% by mass and a colorant / dispersant ratio of 100 / 35 (by mass). The average primary particle size of the pigments in the obtained pigment dispersions is shown in Table 2-2. In addition, the average primary particle size of the pigments in the cured film, the crystallite size of the pigments in the pigment dispersions, and the crystallite size of the pigments in the cured film are also shown in Table 2-2.

[0297] [Table 2-2]

[0298]

[0299] <Example of Synthesis of Silica Particle Dispersion>

[0300] Synthesis Example 28: Synthesis of a dispersion of silica particles (SP-1)

[0301] Based on the method described in paragraphs

[0132] to

[0134] of International Publication No. 2022 / 196261 and Synthesis Example 3, a dispersion of silica particles (SP-1) was obtained using MEK-ST-40 as a silica particle dispersion, KBM-503 as a surface modifier, and MOP as a polymerization inhibitor. The silica particles (SP-1), being inorganic particles, have a surface functional group of methacryloyl groups, a primary particle size distribution ranging from 10 to 16 nm, an average primary particle size of 12 nm, an aspect ratio ranging from 1.0 to 1.1, an average aspect ratio of 1.1, and a sodium content of 100 ppm by mass.

[0302] <Evaluation methods in various embodiments, reference examples and comparative examples>

[0303] The evaluation methods in each embodiment, reference example, and comparative example are shown below. It should be noted that a glass substrate (manufactured by Geomatics Co., Ltd.; hereinafter referred to as "ITO / Ag substrate") on which a 100nm APC film (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) was formed by sputtering on glass, and a 10nm ITO film was further formed on top of the APC layer by sputtering, was subjected to a 100-second UV-O3 washing process using a benchtop surface treatment apparatus (PL16-110; manufactured by Sen Special Light Source Co., Ltd.). Tenpax glass substrates (manufactured by AGC Technograss Co., Ltd.) and other substrates were used without pretreatment.

[0304] In addition, the film thickness was measured using a surface roughness / profile shape measuring machine (SURFCOM1400D; manufactured by Tokyo Seijinsha) under the conditions of a measurement magnification of 10,000x, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0305] (1) Weight-average molecular weight of resin

[0306] Regarding the aforementioned polyimides (PI-1) to (PI-4), polyimide precursors (PIP-1) and (PIP-2), and polybenzo[…]… azole (PB-1), polybenzoxazole A 0.10% by mass N-methyl-2-pyrrolidone solution was prepared for each resin using azole precursor (PBP-1) and polyamide-imide (PAI-1). The weight-average molecular weight (MAM) of polystyrene was determined using a GPC analyzer (Waters 2690; manufactured by Waters) with N-methyl-2-pyrrolidone dissolved in 0.050 mol / L of lithium chloride and phosphoric acid as the mobile phase. For other resins, the MAM was determined using a GPC analyzer (HLC-8220; manufactured by Higashi Soy Co.) with tetrahydrofuran or N-methyl-2-pyrrolidone as the mobile phase, based on JIS K7252-3 (2008), by determining the MAM at near room temperature.

[0307] (2) The content of chlorine, bromine and fluorine in the resin, composition or cured film

[0308] The contents of chlorine, bromine, and fluorine in the resin, composition, or cured film were determined by combustion ion chromatography under the following conditions. Each of the above resins was used after being separated by GPC preparation. It should be noted that when the resin is composed of resins with different structural units, it was also used after being separated by GPC preparation. Furthermore, when the composition contains a single resin or resins with different structural units, the composition was extracted with dichloromethane, and after ultracentrifugation, each resin was separated from the dichloromethane-insoluble matter by GPC preparation before use. The resin, composition, or cured film was combusted / decomposed in the combustion tube of the analytical apparatus, the generated gas was absorbed into the absorbent, and a portion of the absorbent was analyzed by ion chromatography. The absence of an element content indicates that the element was not detected. It should be noted that the content of all solid components in the composition was calculated from the obtained measured values ​​and the following formula.

[0309] (Content of chlorine and bromine in the total solid components of the composition) = (Content of chlorine and bromine in the composition) × 100 / (Concentration of solid components in the composition [mass %])

[0310] <Combustion / Absorption Conditions>

[0311] System: AQF-2100H, GA-210 (Made by Mitsubishi Chemical Co., Ltd.)

[0312] Electric furnace temperature: inlet 900℃, outlet 1000℃

[0313] Gases: Ar / O2 200 mL / min, O2 400 mL / min

[0314] Absorbent: H2O2 0.1% by mass

[0315] Absorption liquid volume: 5 mL

[0316] <Ion Chromatography / Anion Analysis Conditions>

[0317] System: ICS1600 (DIONEX)

[0318] Mobile phase: 2.7 mmol / L Na₂CO₃, 0.3 mmol / L NaHCO₃

[0319] Flow rate: 1.50 mL / min

[0320] Detector: Conductivity detector

[0321] Injection volume: 100 μL.

[0322] (3) Content of anions and cations in the composition or cured film

[0323] The contents of chloride, bromide, fluoride, specific anions, and quaternary ammonium ions in the composition or cured membrane were determined by ion chromatography under the following conditions. The composition or cured membrane was added to ultrapure water, and the ionic components were extracted by shaking at room temperature. After treating the extract with a solid-phase extraction column, the cationic and anionic components were analyzed by ion chromatography. Regarding anionic components, if they could not be determined under ion chromatography analysis condition 1 below, they were determined under ion chromatography analysis condition 2 below. No ion content is recorded, indicating that the ion was not detected. It should be noted that the content of all solid components in the composition was calculated from the obtained measurements and the following formula.

[0324] (Content of anions or cations in the total solid components of the composition) = (Content of anions or cations in the composition) × 100 / (Concentration of solid components in the composition [mass %])

[0325] <Ion Chromatography Analysis Conditions 1 (Anionic Components)>

[0326] Device: IC-2010 (manufactured by Higashi Corporation)

[0327] Separation column: TSKgel Super IC-Anion HS

[0328] Eluent: Sodium bicarbonate

[0329] Column temperature: 40℃

[0330] Detector: Conductivity meter

[0331] Sample injection volume: 250 μL

[0332] <Ion Chromatography Analysis Conditions 2 (Anionic Components)>

[0333] Device: IC-2010 (manufactured by Higashi Corporation)

[0334] Separation column: TSKgel Super IC-Anion HS

[0335] Eluent: Sodium carbonate / Sodium bicarbonate

[0336] Column temperature: 40℃

[0337] Detector: Conductivity meter

[0338] Sample injection volume: 250 μL

[0339] <Ion Chromatography Analysis Conditions 3 (Cat Components)>

[0340] Apparatus: INTEGRION (Made by Thermo Fisher Scientific)

[0341] Separation column: IonPac CS19-4μm

[0342] Eluent: Mesylic acid

[0343] Detector: Conductivity meter

[0344] Sample injection volume: 100 μL.

[0345] (4) Content of specific compounds in the composition or cured film

[0346] The contents of specific phosphorus compounds, tertiary amine compounds, methanol, ethanol, first specific compound, second specific compound, specific ketone compounds, and specific heterocyclic compounds in the composition or cured film were determined by gas chromatography-mass spectrometry and liquid chromatography-mass spectrometry using standard curves obtained from standard substances. It should be noted that the contents of all solid components in the composition were calculated from the obtained measurements and the following formula.

[0347] (Content of a specific compound in the total solid components of the composition) = (Content of a specific compound in the composition) × 100 / (Concentration of solid components in the composition [mass %]).

[0348] (5) Water content in the composition

[0349] The water content in the composition was determined by volumetric titration using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electron Kogyo Co., Ltd.) and Karl Fischer reagent as the titrant, based on "JIS K0113 (2005)".

[0350] (6) Sensitivity

[0351] The image pattern of the developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Niconico). When using a composition with positive photosensitivity, the optimal exposure (i-ray lux meter value) was determined as the sensitivity indicator, allowing the formation of a gap pattern with a width of 20 μm corresponding to an opening within a 20 μm line-gap pattern. Conversely, when using a composition with negative photosensitivity, the sensitivity was defined as the exposure (i-ray lux meter value) allowing the formation of a gap pattern with a width of 18 μm corresponding to an opening within a 20 μm line-gap pattern. The sensitivity was determined as follows, and was set to 90 mJ / cm². 2 The following values ​​A+, A, B+, B, C+, and C are considered qualified.

[0352] A+: Sensitivity is 30mJ / cm 2 the following

[0353] A: Sensitivity exceeds 30mJ / cm 2 And it is 40 mJ / cm 2 the following

[0354] B+: Sensitivity exceeds 40 mJ / cm 2 And it is 50 mJ / cm 2 the following

[0355] B: Sensitivity exceeds 50mJ / cm 2 And it is 60 mJ / cm 2 the following

[0356] C+: Sensitivity exceeds 60 mJ / cm 2 And it is 75 mJ / cm 2 the following

[0357] C: Sensitivity exceeds 75mJ / cm 2 And it is 90 mJ / cm 2 the following

[0358] D: Sensitivity exceeds 90mJ / cm 2 And it is 150 mJ / cm 2 the following

[0359] E: Sensitivity exceeds 150 mJ / cm 2 .

[0360] (7) Developing residue

[0361] The image pattern of the developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Niconico). As an indicator of development residue, the presence of residue in the 20μm line and gap pattern was observed, and the area of ​​residue presence in the openings was calculated. As described below, A+, A, B+, B, C+, and C, where the area of ​​residue presence is 20% or less, were considered acceptable.

[0362] A+: No residue

[0363] A: The surface area of ​​the residue is less than 3%.

[0364] B+: The surface area of ​​residue exceeds 3% but is less than 6%.

[0365] B: The area of ​​residue present exceeds 6% but is less than 10%.

[0366] C+: The surface area of ​​residue exceeds 10% but is less than 15%.

[0367] C: The area of ​​residue present is more than 15% but less than 20%.

[0368] D: The area where the residue exists exceeds 20% but is less than 50%

[0369] E: The area where the residue is present exceeds 50% but is less than 100%.

[0370] (8) Light blocking property (optical density value (hereinafter, "OD value"))

[0371] A cured film of the composition was fabricated on a Tenpace glass substrate (manufactured by AGC Technograss Co., Ltd.) using the method described in Example 1 below. The incident light intensity (I0) and transmitted light intensity (I) at three in-plane locations of the fabricated cured film were measured using a transmission densitometer (X-Rite 361T(V); manufactured by X-Rite Co., Ltd.). As an indicator of light-shielding properties, the OD value per 1 μm film thickness was calculated using the following formula, and the average OD value at the three in-plane locations was calculated.

[0372] OD value = log 10 (I0 / I).

[0373] (9) Reliability of light-emitting elements

[0374] The organic EL display manufactured by the method described in Example 1 below is subjected to an amplitude of 10 mA / cm. 2 The light-emitting element was driven by DC to observe for non-emitting areas, uneven brightness, and other luminous defects. Additionally, as a durability test, the light-emitting element was heated to 80°C with the light extraction side facing upwards, and irradiated with a wavelength of 365nm and an illuminance of 0.6mW / cm². 2while being illuminated by light for 500 hours. After 500 hours, the organic EL display was driven to emit light with direct current to observe whether the light emission characteristics changed. As an index of the reliability of the light-emitting element, the area of the light-emitting region after the durability test was measured with the area of the light-emitting region before the durability test set to 100%. The determination was made as follows. A+, A, B+, B, C+, and C with the area of the light-emitting region being 80% or more were judged to be qualified. 2 The organic EL display was driven to emit light with direct current to observe whether the light emission characteristics changed. As an index of the reliability of the light-emitting element, the area of the light-emitting region after the durability test was measured with the area of the light-emitting region before the durability test set to 100%. The determination was made as follows. A+, A, B+, B, C+, and C with the area of the light-emitting region being 80% or more were judged to be qualified.

[0375] A+: The area of the light-emitting region is 100%

[0376] A: The area of the light-emitting region is 97% or more and less than 100%

[0377] B+: The area of the light-emitting region is 94% or more and less than 97%

[0378] B: The area of the light-emitting region is 90% or more and less than 94%

[0379] C+: The area of the light-emitting region is 85% or more and less than 90%

[0380] C: The area of the light-emitting region is 80% or more and less than 85%

[0381] D: The area of the light-emitting region is 60% or more and less than 80%

[0382] E: The area of the light-emitting region is less than 60%.

[0383] (10) Luminous brightness

[0384] The micro LED display fabricated by the method described in Example 1 below was made to emit light, and the light extraction efficiency was measured as an index of the luminous brightness using an external quantum efficiency measurement device (manufactured by Hamamatsu Photonics K.K.; C9920). Regarding the light extraction efficiency, the light extraction efficiency of the micro LED display described in Example 1 was set to 1.00, and the relative value with respect to this value was calculated. The determination was made as follows. A+, A, B+, B, C+, and C with the relative value of the light extraction efficiency being 1.00 were judged to be qualified.

[0385] A+: The relative value of the light extraction efficiency is 1.30 or more

[0386] A: The relative value of the light extraction efficiency is 1.20 or more and less than 1.30

[0387] B+: The relative value of the light extraction efficiency is 1.10 or more and less than 1.20

[0388] B: The relative value of the light extraction efficiency is 1.00 or more and less than 1.10

[0389] C+: The relative value of the light extraction efficiency is 0.95 or higher and less than 1.00.

[0390] C: The relative value of the light extraction efficiency is 0.90 or higher and less than 0.95.

[0391] D: The relative value of the light extraction efficiency is above 0.70 and less than 0.90.

[0392] E: The relative value of the light extraction efficiency is less than 0.70.

[0393] (11) Preservation stability

[0394] Each of the prepared compositions was stored at 25°C for one week. After storage, pre-baked films of each composition were formed on a 6-inch diameter Si wafer using the method described in Example 1 below. As an indicator of storage stability, the presence and number of foreign objects on the pre-baked films were visually observed. As determined below, A+, A, B+, B, C+, and C with a number of foreign objects of 20 or less were considered acceptable.

[0395] A+: No foreign objects

[0396] A: The number of foreign objects is 3 or less.

[0397] B+: The number of foreign objects is more than 3 but less than 6

[0398] B: The number of foreign objects is more than 6 but less than 10

[0399] C+: The number of foreign objects is more than 10 but less than 15.

[0400] C: The number of foreign objects is more than 15 but less than 20

[0401] D: The number of foreign objects is more than 20 but less than 50.

[0402] E: The number of foreign objects exceeds 50.

[0403] <Compounds used in the various embodiments, reference examples, and comparative examples>

[0404] The following shows the structures of the compounds used in the various embodiments, reference examples, and comparative examples.

[0405]

[0406] Furthermore, the compounds used in each embodiment, reference example, and comparative example that correspond to each of the following compounds are summarized in Tables 2-3: compounds containing chlorine, bromine, chloride ions, or bromide ions (hereinafter, "specific halogen compounds"); compounds containing specific anions; specific phosphorus compounds; tertiary amine compounds; compounds containing quaternary ammonium ions (hereinafter, "quaternary cation compounds"); specific heterocyclic compounds; first specific compounds; second specific compounds; specific ketone compounds; and compounds containing fluorine or fluoride ions (hereinafter, "specific fluorine compounds").

[0407] [Table 2-3]

[0408]

[0409] <Modulation of Photosensitive Compositions>

[0410] Compositions 1 to 120 were prepared using the compositions listed in Tables 3-1 to 3-10. The values ​​in parentheses in Tables 3-1 to 3-10 represent the mass parts of the solid components of each ingredient. It should be noted that the content of quaternary ammonium ions is listed as the content of quaternary cations in the tables. When the composition contains pigment, a blending solution without pigment dispersion was first prepared, and then the pigment dispersion was mixed with the blending solution to prepare the composition. Using PGMEA / EL / GBL = 50 / 40 / 10 (mass ratio) as a solvent, the composition was prepared to achieve a solid component concentration of 30% by mass. The resulting composition solution was... The filter was used for filtration. Furthermore, compositions S1 to S7 were prepared using the same method with the compositions described in Tables 2-4.

[0411] [Table 2-4]

[0412]

[0413] <Example 1>

[0414] After coating composition 1 onto an ITO / Ag substrate using a spin coater (MS-A100; manufactured by Mikasa Co.), a pre-baked film with a thickness of approximately 1.8 μm was prepared by pre-baking at 120°C for 120 seconds using a buzzer-heated plate (HPD-3000BZN; manufactured by Azuwan Co.). The prepared pre-baked film was then jet-developed using a small photolithography developing apparatus (AD-1200; manufactured by Takizawa Sangyo Co.) with 2.38% by mass TMAH aqueous solution or cyclopentanone, and the time for complete dissolution of the pre-baked film (unexposed portion) (Breaking Point; hereinafter, "BP") was measured.

[0415] The pre-baked film was fabricated using the same method. The pre-baked film was then exposed to a double-sided alignment, single-sided exposure apparatus (PEM-6M lithography machine; manufactured by Union Optics Co., Ltd.) using a grayscale mask for sensitivity measurement (MDRM MODEL4000-5-FS; manufactured by Opto-Line International Co., Ltd.) with i-rays (wavelength 365nm), h-rays (wavelength 405nm), and g-rays (wavelength 436nm) from an ultra-high pressure mercury lamp. After exposure, the film was developed using a small lithography developing apparatus (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) with a 2.38% (w / w) TMAH aqueous solution, followed by rinsing with water for 30 seconds to produce the developed film. The development time was set to 60 seconds, 90 seconds, or 120 seconds.

[0416] It should be noted that, in the case where pattern formation could not be achieved after development using a 2.38% (w / w) TMAH aqueous solution for development at development times of 60 seconds, 90 seconds, and 120 seconds, exposed films were prepared in the same manner as described above. After exposure, cyclopentanone was used for development using a small photolithography developing apparatus (AD-1200; manufactured by Takizawa Sangyosha), followed by rinsing with water for 30 seconds to produce the developed film. Similarly, development times were set to 60 seconds, 90 seconds, or 120 seconds. For all films with development times of 60 seconds, 90 seconds, and 120 seconds, the developed patterns were observed, and the optimal exposure (i-ray irradiance meter value) was determined for forming a gap pattern equivalent to an opening with a width of 20 μm within a 20 μm line and gap pattern. These results determined the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure at that development time. Using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Service), the pattern, after exposure at the optimal exposure level and development time, was heat-cured at 200°C for 60 minutes to produce a cured film with a thickness of approximately 1.2 μm. The heat curing conditions were as follows: under a nitrogen atmosphere with an oxygen concentration of less than 20 ppm by mass, the temperature was increased at a rate of 3.5°C / min until reaching 200°C, and then heat-treated at 200°C for 60 minutes, followed by cooling to 50°C.

[0417] The cured film was analyzed using nuclear magnetic resonance spectrometry, infrared spectroscopy, gas chromatography-mass spectrometry, liquid chromatography-mass spectrometry, and time-of-flight secondary ion mass spectrometry. The structural units of the resin and the structures of the compounds contained in the cured film were analyzed. The cured film of composition 1 contains the following resin and compounds, including resins having structures derived from the resins contained in composition 1 and compounds having structures derived from the compounds contained in composition 1.

[0418] (XA1) resin: a resin having a silanol group and a siloxane structure in the structural unit; a phenolic resin having a phenolic hydroxyl group in the structural unit.

[0419] <Fabrication of Organic EL Displays>

[0420] Next, the manufacturing method of organic EL displays will be described. Figure 3 The diagram shows a schematic of the substrate used. First, a 100nm APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) non-transparent conductive metal layer was sputtered onto a 38×46mm alkali-free glass substrate 47. The APC layer was then patterned by etching. Next, a 10nm amorphous ITO transparent conductive oxide film was sputtered onto the APC layer, and a reflective electrode was formed as the first electrode portion 48 by etching. Furthermore, an auxiliary electrode portion 49 was also formed simultaneously to facilitate the removal of the second electrode. Figure 3 (1)).

[0421] The resulting substrate was ultrasonically cleaned for 10 minutes using "Semicoclean" (registered trademark) 56 (manufactured by Fulluchi Chemical Co., Ltd.), and then washed with ultrapure water. Next, Composition 1 was coated and pre-baked onto the substrate using the above method. After pattern formation exposure through a photomask with a predetermined pattern, development, and rinsing, it was thermally cured. It should be noted that the development time was set to 60 seconds, 90 seconds, or 120 seconds, and the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure amount at that development time were determined in advance. The pattern, after exposure at the optimal exposure amount and development at the optimal development time, was thermally cured at 200°C for 60 minutes. The thermal curing conditions were: heating at a rate of 3.5°C / min to 200°C under a nitrogen atmosphere with an oxygen concentration of less than 20 ppm, followed by heat treatment at 200°C for 60 minutes, and then cooling to 50°C. Using the above method, quadrilateral openings with a width of 70 μm and a length of 70 μm are arranged at a spacing of 175 μm along the width direction and at a spacing of 175 μm along the length direction, and a pixel segmentation layer 50 with each opening exposing the first electrode is defined and formed in the effective area of ​​the substrate. Figure 3 (2)). It should be noted that this opening eventually becomes the light-emitting pixel of the organic EL display. In addition, the effective area of ​​the substrate is 16 mm square, and the pixel segmentation layer 50 is formed with a thickness of about 1.5 μm.

[0422] Next, an organic EL display was fabricated using a substrate on which the first electrode portion 48, the auxiliary electrode portion 49, and the pixel segmentation layer portion 50 were formed. After performing nitrogen plasma treatment as a pretreatment, an organic EL layer portion 51 containing a light-emitting layer was formed by vacuum evaporation. Figure 3 (3)). It should be noted that the vacuum degree during vapor deposition is 1×10. -3 Below Pa, the substrate was rotated relative to the evaporation source during the evaporation process. First, compound (HT-1) was deposited for 10 nm as a hole injection layer, and compound (HT-2) was deposited for 50 nm as a hole transport layer. Next, in the light-emitting layer, compound (GH-1) as the host material and compound (GD-1) as the dopant material were deposited at a doping concentration of 10 vol% to a thickness of 40 nm. Then, compound (ET-1) as the electron transport material and compound (LiQ) were stacked at a volume ratio of 1:1 to a thickness of 40 nm. It should be noted that the compounds used in the organic EL layer (compounds (HT-1), (HT-2), (GH-1), (GD-1), (ET-1), and (LiQ)) are the same compounds described in paragraphs

[0599] to

[0600] of International Publication No. 2017 / 057281.

[0423] Next, after depositing 2 nm of compound (LiQ), 10 nm of MgAg (magnesium / silver = 10 / 1 (volume ratio)) was deposited to form the second electrode portion 52, thus forming a transparent electrode. Figure 3 (4) Then, under a low-humidity nitrogen atmosphere, the cap-shaped glass plate was bonded with an epoxy resin adhesive to seal it, thus fabricating four 5mm square top-emitting organic EL displays on a single substrate. It should be noted that the film thickness referred to here is the display value of a crystal oscillator film thickness monitor.

[0424] <Fabrication of Micro LED Displays>

[0425] Using an alkali-free glass substrate as a support substrate, a temporary adhesive material containing polyimide is disposed on the support substrate, and an LED as a light-emitting element is disposed on the support substrate. The LED has a thickness of 2 μm, a length of 10 μm on one side, and a length of 20 μm on the other side. Next, composition S1 is coated and pre-baked on the support substrate and the LED using the above method. Patterning exposure, development, and washing are performed through a photomask with a predetermined pattern to form a matrix pattern having multiple openings exposing the LED and its surroundings. The openings are rectangular in shape, with a length of 15 μm on one side and a length of 25 μm on the other side. The pattern size between openings with a length of 15 μm on one side and between openings with a length of 25 μm on the other side in the matrix pattern is also 5 μm. Then, it is thermally cured by heating to form a spacer layer with a film thickness of approximately 4 μm. The thermosetting conditions were as follows: under a nitrogen atmosphere with an oxygen concentration of less than 20 ppm by mass, the temperature was increased to 200°C at a rate of 3.5°C / min, and then the temperature was maintained at 200°C for 60 minutes before cooling to 50°C.

[0426] Next, composition 1 was coated and pre-baked on the support substrate and the LED using the method described above. Patterning was performed using a photomask with a predetermined pattern, followed by exposure, development, and washing to form multiple opening patterns extending through the thickness direction to the LED. The opening patterns were circular, with the smallest pattern having a bottom diameter of 2 μm. Then, the mixture was heated to thermally cure, forming a planarization layer with a film thickness of approximately 4 μm. The thermal curing conditions were as follows: heating at a rate of 3.5 °C / min to 200 °C under a nitrogen atmosphere with an oxygen concentration below 20 ppm, followed by a heat treatment at 200 °C for 60 minutes, and then cooling to 50 °C.

[0427] Next, a titanium barrier metal film is sputtered onto the planarization layer and the spacer layer, and a copper seed layer is further sputtered onto the barrier metal. Then, a photoresist layer is formed, and copper metal wiring for electrical connection to the LED is formed on the opening pattern portion of the planarization layer and a portion of the planarization layer surface using a plating method. The photoresist layer, seed layer, and barrier metal at locations where metal wiring was not formed are then removed. The thickness of the metal wiring formed on a portion of the planarization layer surface is 5 μm.

[0428] Next, on the planarization layer and the spacer layer, polyimide and polyphenylene oxide will be incorporated. The positive photosensitive composition of the azole precursor was coated and pre-baked using the above method. After patterning exposure, development, and washing via a photomask with a predetermined pattern, it was thermally cured to form an interlayer insulating layer with a thickness of approximately 10 μm. The thermal curing conditions were: heat treatment at 110°C for 30 minutes in a nitrogen atmosphere with an oxygen concentration of less than 100 ppm by mass, followed by further heat treatment at 230°C for 60 minutes. Next, a titanium barrier metal was sputtered onto the interlayer insulating layer, and a copper seed layer was sputtered onto the barrier metal. Next, a photoresist layer was formed, and copper metal wiring for electrical connection to the LED was formed on the opening pattern portion of the interlayer insulating layer and a portion of the surface of the interlayer insulating layer by plating. Then, the photoresist layer, seed layer, and barrier metal were removed from the locations where metal wiring was not formed. The thickness of the metal wiring formed on a portion of the surface of the interlayer insulating layer was 5 μm. Then, the formation of the interlayer insulation layer and the metal wiring were repeated twice to form a three-layer interlayer insulation layer. The total thickness of the three interlayer insulation layers is 30 μm.

[0429] Next, metal wiring in the opening pattern of the interlayer insulating layer is sputtered to form a film blocking metal, thus forming solder bumps. Then, the solder is reflowed by heating at 260°C for 1 minute, and electrically connected to the light-emitting element driving substrate having a driving IC as a driving element through the solder bumps. Next, the support substrate is peeled off, and the opposing substrate is bonded with an adhesive layer or the like, thereby fabricating a microLED display having multiple LEDs as light-emitting elements.

[0430] <Examples 2 to 122 and Comparative Examples 1 to 6>

[0431] The same operations and evaluations as in Example 1 were performed using the compositions shown in Tables 3-1 to 3-10. It should be noted that in Examples 1 to 116 and Comparative Examples 1 to 6, each composition was used as a composition for forming a pixel segmentation layer or a composition for forming a planarization layer; additionally, composition S1 was used as a composition for forming a spacer layer. On the other hand, in Examples 117 to 122, composition 1 was used as a composition for forming a pixel segmentation layer or a composition for forming a planarization layer; additionally, compositions S2 to S7 were used as compositions for forming spacer layers. These evaluation results are summarized in Tables 3-1 to 3-10. It should be noted that the fluorine content in all solid components of the pixel segmentation layer forming compositions in Examples 84, 90 to 94, 102, and 103 exceeded 1,000 ppm by mass. The fluorine content in all solid components of the pixel segmentation layer forming compositions in Examples 1-83, Examples 85-89, Examples 95-101, Examples 104-106, Examples 114-116, and Comparative Examples 1-6 is 0 ppm by mass. The fluorine content in all solid components of the spacer layer forming compositions in Compositions S1-S7 is 0 ppm by mass. The fluorine content in all solid components of the pixel segmentation layer forming compositions in Examples 107-113 is as described in Tables 3-7.

[0432] It should be noted that Tables 3-6 record the hydrogen ion index of each composition prepared in Examples 1 and 81-89. Furthermore, in each example, when a composition with positive photosensitivity was used, the development time was set to 60 seconds, 90 seconds, or 120 seconds. The optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure at that development time were determined from these results. Patterns exposed at the optimal exposure and developed at the optimal development time were then heat-cured at 200°C for 60 minutes. The heat-curing conditions were: heating to 200°C at a rate of 3.5°C / min under a nitrogen atmosphere with an oxygen concentration of less than 20 ppm by mass, performing a heat treatment at 200°C for 60 minutes, and then cooling to 50°C. On the other hand, when a composition with negative photosensitivity was used, a photomask with the light-transmitting and light-blocking portions reversed was used, and the development time was set to 1.3 times the measured BP. The pattern, after being exposed and developed at the optimal exposure level, was heat-cured at 220°C for 60 minutes. The heat-curing conditions were as follows: under a nitrogen atmosphere with an oxygen concentration of less than 20 ppm by mass, the temperature was increased at a rate of 3.5°C / min until it reached 220°C, and after heat treatment at 220°C for 60 minutes, it was cooled to 50°C.

[0433] [Table 3-1]

[0434]

[0435] [Table 3-2]

[0436]

[0437] [Table 3-3]

[0438]

[0439] [Table 3-4]

[0440]

[0441] [Table 3-5]

[0442]

[0443] [Table 3-6]

[0444]

[0445] [Table 3-7]

[0446]

[0447] [Table 3-8]

[0448]

[0449] [Table 3-9]

[0450]

[0451] [Table 3-10]

[0452]

[0453] Comparative Examples 1 and 2 do not contain methanol or ethanol. The methanol content of Comparative Example 3 does not meet the inventive specificity of this application. Comparative Example 4 contains only alcohol compounds other than methanol and ethanol. Therefore, the various properties of Comparative Examples 1 to 4 are poor. Furthermore, Comparative Example 5 does not contain methanol or ethanol, and the content of chlorine and chloride ions is higher than 1,000 ppm by mass. Comparative Example 6 does not contain methanol or ethanol, and the content of a specific anion is higher than 30,000 ppm by mass (=3.0% by mass), and the content of a quaternary cation is higher than 50,000 ppm by mass (=5.0% by mass). Therefore, the various properties of Comparative Examples 5 to 6 are poor.

[0454] Explanation of symbols

[0455] Display devices 1a and 1b

[0456] 2. Light-emitting element

[0457] 3 interlayer insulation layer

[0458] 4. 4C metal wiring

[0459] 5. Relative substrate

[0460] 6 electrode terminals

[0461] 7. Light-emitting element driving substrate

[0462] 8. Driving components

[0463] 9. Blocking metal

[0464] 10 Solder bumps

[0465] 15. Spacer wall layer

[0466] 21 Planarization layer

[0467] 47 Alkali-free glass substrate

[0468] 48 First Electrode Section

[0469] 49 Auxiliary electrode section

[0470] 50-pixel segmentation layer

[0471] 51 Organic EL layer containing a light-emitting layer

[0472] 52. Second electrode section.

Claims

1. A photosensitizing composition comprising (A) an adhesive resin and (C) a photosensitizer, The (C) photosensitizer contains a (C1) naphthoquinone diazo compound. The photosensitive composition also contains methanol and / or ethanol. And it meets the following condition (7), (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

2. The photosensitizing composition according to claim 1, further comprising one or more selected from 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether. And it meets the following condition (8), (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

3. The photosensitizing composition according to claim 1, further comprising one or more selected from 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, allyl methyl ether, and allyl ethyl ether. And it meets the following condition (9), (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether and methylallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

4. The photosensitive composition according to claim 1, further comprising water, and satisfying the condition described in (3) below, (3) The water content in the photosensitive composition is 0.010 to 3.0% by mass.

5. The photosensitive composition according to any one of claims 1 to 4, comprising one or more selected from sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfying the condition below (4), And / or, It contains one or more selected from phosphate esters, phosphonic acids, phosphonate esters, phosphites, hypophosphite, and hypophosphite, and meets the following condition (5). (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass. (5) The total content of phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, hypophosphonic acid and hypophosphite esters in all solid components of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

6. The photosensitive composition according to any one of claims 1 to 4, further comprising a tertiary amine compound and / or a quaternary ammonium ion, and satisfying the condition below (6), (6) The total content of tertiary amine compounds and quaternary ammonium ions in all solid components of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

7. The photosensitive composition according to any one of claims 1 to 4, wherein the (A) adhesive resin satisfies the following condition (P1a). (P1a) The fluorine content in the structure of the (A) adhesive resin is less than 10,000 ppm by mass.

8. The photosensitive composition according to any one of claims 1 to 4, wherein it satisfies the following condition (1a), (1a) The fluorine content in all solid components of the photosensitive composition is less than 1,000 ppm by mass.

9. The photosensitive composition according to any one of claims 1 to 4, wherein the (A) adhesive resin comprises (A1) a resin containing a weakly acidic group. The (A1) resin containing a weak acid group has one or more groups selected from phenolic hydroxyl, hydroxyimide, hydroxyamide, silanol, 1,1-bis(trifluoromethyl)hydroxymethyl and mercapto as the (WA) weak acid group.

10. The photosensitive composition according to claim 9, wherein the (A1) resin containing a weakly acidic group comprises (A1x-1) resin: polysiloxane.

11. The photosensitive composition according to claim 10, wherein when the photosensitive composition is diluted with water to prepare a diluted solution and the concentration of the solid component in the diluted solution is 1 / 100 times that of the photosensitive composition, the hydrogen ion index of the diluted solution is 5.5 to 7.

0.

12. The photosensitive composition according to claim 10, wherein the (A1x-1) resin has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10). In general formulas (9) and (10), R 61 Represents a hydrogen atom or a monovalent organic group; * 1 ~* 3 Each independently represents a bonding point in the resin.

13. The photosensitizing composition according to any one of claims 1 to 4, wherein the (C) photosensitizer further comprises (C3) a photoacid-producing agent and / or (C4) a photoalkali-producing agent.

14. A cured product obtained by curing the photosensitive composition according to any one of claims 1 to 4.

15. A display device comprising the cured material as claimed in claim 14.

16. A method for manufacturing a cured product, comprising the steps of: (1) forming a coating film of the photosensitive composition according to any one of claims 1 to 4 on a substrate; (2) irradiating the coating film of the photosensitive composition with active chemical rays through a photomask; (3) developing the photosensitive composition using a developing solution to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition.

17. A display device comprising a substrate, a redistribution layer, an interlayer insulating layer of the redistribution layer, and a semiconductor chip, and further comprising a spacer layer and / or a planarization layer. This semiconductor chip is a light-emitting element. Viewed from above, the area of ​​the redistribution layer is larger than the area of ​​the semiconductor chip. The spacer layer is formed between adjacent semiconductor chips. The planarization layer is formed in such a way that it covers at least a portion of the semiconductor chip. The spacer layer and / or the planarization layer contain methanol and / or ethanol, and satisfy the following conditions (X1a) and / or (X1b): (X1a) the total content of methanol and ethanol in the spacer layer is 0.0010 to 30,000 ppm by mass, and (X1b) the total content of methanol and ethanol in the planarization layer is 0.0010 to 30,000 ppm by mass.

Images