Gluing machine for wafer processing

Abstract

The invention relates to a gluing machine for wafer processing, and relates to the technical field of gluing machines. The device comprises a gluing table, the surface of the gluing table is provided with a feeding position, a gluing position, a glue uniformizing position and a discharging position, arc-shaped feeding channels are arranged among the feeding position, the gluing position, the glue uniformizing position and the discharging position, the surface of the gluing table is provided with a material distributing mechanism, and the material distributing mechanism is used for driving a wafer to sequentially pass through the feeding position, the gluing position, the glue uniformizing position and the discharging position; a feeding belt is arranged on one side of the feeding position, a discharging belt is arranged on one side of the discharging position, a moving mechanism is arranged above the gluing table, a gluing barrel used for gluing wafers is arranged on the moving mechanism, a smearing mechanism used for evenly smearing glue on the surfaces of the wafers is arranged in the glue uniformizing position, and a control module is arranged on the side wall of the gluing table. The distributing mechanism, the feeding belt, the discharging belt, the moving mechanism and the smearing mechanism are all in communication connection with the control module. The wafer gluing method and the wafer gluing device have the effect of improving the gluing efficiency and the gluing uniformity of the wafer.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of a gluing machine, in particular to a wafer processing gluing machine. BACKGROUND

[0002] The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the raw material thereof is silicon. The silicon wafer is formed through the following steps: a large single crystal is made of high-purity polycrystalline silicon, a silicon ingot is obtained through crystal growth, and a wafer is formed through grinding, polishing and slicing. The wafer is a circular sheet and has certain conductivity and semiconductor characteristics, and is a substrate of a chip. Various circuit elements can be processed on the high-purity silicon wafer to make the silicon wafer into an IC product with specific electrical properties.

[0003] In the wafer processing process, in order to facilitate subsequent process operation, gluing is usually performed on the wafer surface. At present, the wafer surface gluing process is mostly performed manually, and problems such as low efficiency and uneven gluing exist, and thus need to be improved. SUMMARY

[0004] In order to improve the wafer gluing efficiency and uniformity, the application provides a wafer processing gluing machine.

[0005] The wafer processing gluing machine provided by the application adopts the following technical scheme: A wafer processing gluing machine comprises a gluing table, wherein the surface of the gluing table is provided with a feeding position, a gluing position, a uniform gluing position and a discharging position. The feeding position, the gluing position, the uniform gluing position and the discharging position are sequentially arranged along the circumferential direction. An arc-shaped feeding channel is arranged between the feeding position, the gluing position, the uniform gluing position and the discharging position. A material distribution mechanism is arranged on the surface of the gluing table. The material distribution mechanism is used to drive the wafer to move along the arc-shaped feeding channel and sequentially pass through the feeding position, the gluing position, the uniform gluing position and the discharging position. A feeding belt is arranged on one side of the feeding position. A discharging belt is arranged on one side of the discharging position. A moving mechanism is arranged above the gluing table. A gluing cylinder for gluing the wafer is arranged on the moving mechanism. A smearing mechanism for uniformly smearing the wafer surface glue is arranged in the uniform gluing position. A control module is arranged on the side wall of the gluing table. The material distribution mechanism, the feeding belt, the discharging belt, the moving mechanism and the smearing mechanism are in communication connection with the control module.

[0006] By adopting the above technical scheme, the feeding belt is used for feeding and conveying the wafer to the feeding position, under the action of the distributing mechanism, the wafer is moved from the feeding position to the gluing position, the gluing cylinder is driven by the moving mechanism to glue the wafer, after the gluing is completed, the wafer is conveyed to the glue uniformizing position by the distributing mechanism to uniformize the glue solution, the wafer after uniformizing is transported to the discharging position by the distributing mechanism, and finally is output through the discharging belt, under the working of the feeding position, the gluing position, the glue uniformizing position and the discharging position in turn, the gluing operation can be continuously carried out, so that the wafer gluing efficiency and the gluing uniformity can be effectively improved.

[0007] Preferably, the distributing mechanism comprises a rotary motor, a center block, four distributing rods and four distributing cylinders, the distributing rods and the distributing cylinders are one-to-one corresponding; the gluing table surface is provided with a mounting groove, the mounting groove is located at the center of the feeding position, the gluing position, the glue uniformizing position and the discharging position, the rotary motor is arranged in the mounting groove, the output shaft of the rotary motor is arranged in the vertical direction, the center block is connected with the output shaft of the rotary motor, the four distributing rods are arranged on the peripheral wall of the center block, the distributing cylinder is arranged on the side end wall away from the center block, the distributing cylinder comprises a fixed ring and an inner ring, the inner ring is slidably connected to the inner wall of the fixed ring, the inner wall of the fixed ring is provided with a plurality of lifting pieces, the piston rod of the lifting piece is connected with the inner ring, so as to drive the inner ring to slide along the direction of the inner wall of the fixed ring.

[0008] By adopting the above technical scheme, when the distributing cylinder is located above the corresponding station, the lifting piece will drive the inner ring to move, so as to cover the wafer, the rotary motor is started to drive the center block and the distributing rod and the distributing cylinder to move, so that the wafer can move along the arc-shaped feeding channel, when the wafer comes to the next station, the inner ring is reset, and the movement and conveying of the wafer are realized.

[0009] Preferably, a light transmission film is arranged above the fixed ring, a positioning camera is arranged above the light transmission film, the positioning camera is in communication connection with the control module, and the control module controls the opening and closing of the rotary motor based on the image of the positioning camera.

[0010] By adopting the above technical scheme, the light transmission film and the positioning camera are arranged to realize the accurate grabbing of the wafer by the distributing cylinder, so as to ensure the structural safety of the wafer and improve the distributing efficiency.

[0011] Preferably, an annular adsorption groove is arranged in the inner ring, a plurality of adsorption holes are arranged in the inner wall of the inner ring, the plurality of adsorption holes are in communication with the adsorption groove, and a negative pressure fan is arranged on the inner wall of the fixed ring and in communication with the adsorption groove.

[0012] By adopting the above technical scheme, the negative pressure fan, the adsorption groove and the adsorption hole are arranged to realize the adsorption of the outer wall of the wafer, so as to improve the stability of the wafer in the distributing process.

[0013] Preferably, the glue uniformizing position is provided with a lifting groove, a lifting member is arranged in the lifting groove, a lifting platform is arranged at the end of the piston rod of the lifting member, the glue applying mechanism comprises two moving members, two fixed plates and a glue applying roller, the glue applying table is provided with a movable groove, the lifting groove is located in the center of the movable groove, the two moving members are arranged in the movable groove, the fixed plates are arranged at the end wall of the piston rod of the moving members, and the glue applying roller is rotatably connected between the two fixed plates.

[0014] By adopting the above technical scheme, when the wafer comes to the glue uniformizing position, the lifting member drives the lifting platform to descend, when the lifting platform descends to the bottom, the moving member is started to drive the glue applying roller to move above the lifting platform, so that the glue applying roller applies the glue to the surface of the wafer, and the glue applying uniformity is realized.

[0015] Preferably, the lifting platform comprises an inner block and an outer ring sleeve, the inner block is connected with the piston rod of the lifting member, the outer ring sleeve is slidably connected with the outer portion of the inner block, the outer wall of the inner block is provided with a first step portion, the inner wall of the outer ring sleeve is provided with a second step portion, the second step portion is located above the first step portion, the top wall of the first step portion is provided with a guide rod, the bottom wall of the second step portion is provided with a guide groove for inserting and sliding the guide rod, the circumferential wall of the guide rod is provided with a tension spring, the tension spring abuts between the first step portion and the second step portion, and the bottom wall of the lifting groove is provided with an abutting ring located below the outer ring sleeve.

[0016] By adopting the above technical scheme, when the lifting platform comes to the bottom, the abutting ring limits the outer ring sleeve to prevent it from continuing to descend, only the inner block descends, a height difference is generated between the outer ring sleeve and the inner block, the wafer is located in the height difference, and the wafer can be kept stable when the glue applying roller is applied to prevent the wafer from deviating, so that the subsequent material distributing mechanism can accurately distribute the wafer.

[0017] Preferably, the circumferential wall of the glue applying roller is provided with an anti-sticking film.

[0018] By adopting the above technical scheme, the anti-sticking film can prevent the glue from adhering to the outer wall of the glue applying roller, and the quality of the glue applying process is ensured.

[0019] Preferably, the arc-shaped feeding channel is made of PTFE material.

[0020] By adopting the above technical scheme, the PTFE material has very low static friction coefficient and dynamic friction coefficient, so that the wear of the wafer is reduced when the wafer moves on the surface of the arc-shaped feeding channel, and the structural quality of the wafer is ensured.

[0021] Preferably, a rotary glue applying pad is rotatably connected at the glue applying position, and the rotary glue applying pad is in communication connection with the control module.

[0022] By adopting the technical scheme, the rotation of the glue coating pad can further improve the flexibility of the glue coating position and the uniformity of glue coating.

[0023] Preferably, one end of the discharging belt away from the discharging position is provided with a reciprocating belt, the length direction of the reciprocating belt is perpendicular to the length direction of the discharging belt, the reciprocating belt is electrically connected with the control module, a detection camera is arranged above the reciprocating belt, the detection camera is communicatively connected with the control module, and the control module controls the running direction of the reciprocating belt based on the detection result of the detection camera.

[0024] By adopting the technical scheme, the detection camera detects the wafer after glue coating, and based on the detection result, the control module controls the running direction of the reciprocating belt to distinguish between finished products and defective products, thereby reducing the time for subsequent screening of the wafer and improving the glue coating efficiency.

[0025] To sum up, the present application has at least one of the following beneficial technical effects: 1. The glue coating machine of the present application can continuously perform glue coating operation under the sequential work of the feeding position, the glue coating position, the glue uniformizing position and the discharging position, thereby effectively improving the wafer glue coating efficiency and the glue coating uniformity. 2. The material distributing mechanism and the smearing mechanism of the present application can realize rapid material distribution of the wafer and uniform smearing of the glue, thereby improving the glue coating efficiency and the glue coating uniformity. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structural schematic view of a wafer processing glue coating machine according to an embodiment of the present application.

[0027] Figure 2 is a sectional view of a glue coating table according to an embodiment of the present application.

[0028] Figure 3 is Figure 2 a partial enlarged view of position A in FIG.

[0029] Figure 4 is Figure 2 a partial enlarged view of position B in FIG.

[0030] Explanation of reference signs: 1, gluing table; 11, feeding position; 12, gluing position; 13, glue spreading position; 14, discharging position; 15, placement groove; 16, lifting groove; 161, lifting piece; 162, lifting platform; 1621, inner block; 1622, outer ring; 1623, first step portion; 1624, second step portion; 1625, guide rod; 1626, guide groove; 1627, tension spring; 1628, abutting ring; 17, movable groove; 18, rotating gluing pad block; 19, detection camera; 2, arc-shaped feeding channel; 3, distributing mechanism; 31, rotating motor; 32, center block; 33, distributing rod; 34, distributing cylinder; 341, fixed ring; 342, inner ring; 343, lifting piece; 344, light-transmitting film; 345, positioning camera; 346, adsorption groove; 347, adsorption hole; 348, negative pressure fan; 4, feeding belt; 5, discharging belt; 6, moving mechanism; 7, gluing cylinder; 8, smearing mechanism; 81, moving piece; 82, fixed plate; 83, gluing roller; 84, anti-sticking film; 9, control module; 10, reciprocating belt. DETAILED DESCRIPTION

[0031] The following will be described in detail with reference to the accompanying drawings. Figures 1-4 The application is further described in detail.

[0032] The application discloses a wafer processing gluing machine. Referring to Figure 1 , the gluing table 1 is provided with a feeding position 11, a gluing position 12, a glue spreading position 13 and a discharging position 14 on the surface, the feeding position 11, the gluing position 12, the glue spreading position 13 and the discharging position 14 are uniformly arranged along the circumferential direction, the side wall of the gluing table 1 is provided with a control module 9, one side of the feeding position 11 is provided with a feeding belt 4, the control module 9 is in communication connection with the feeding belt 4, and the feeding of the wafer is realized under the driving of the control module 9 of the feeding belt 4; in the embodiment, the control module 9 adopts a PLC controller, and some electrical elements such as wires in the drawings that do not affect the specific implementation are not shown.

[0033] Referring to Figure 1 , the rotating gluing pad block 18 is rotatably connected at the gluing position 12, so as to rotate the wafer on the surface of the gluing position 12, thereby improving the uniformity of gluing; the moving mechanism 6 is arranged above the gluing position 12, the moving mechanism 6 is in communication connection with the control module 9, in the embodiment, the moving mechanism 6 adopts a linear module in three directions of XYZ, the gluing cylinder 7 for gluing the wafer is arranged on the moving mechanism 6, thereby facilitating uniform gluing of the wafer.

[0034] Referring to Figure 1 , Figure 2 and Figure 3, the uniform glue site 13 is provided with a lifting groove 16, and a lifting piece 161 is arranged in the lifting groove 16. In the embodiment, the lifting piece 161 is a gas cylinder, a lifting platform 162 is arranged at the piston rod end of the lifting piece 161, the lifting platform 162 comprises an inner block 1621 and an outer ring sleeve 1622, the inner block 1621 is connected with the piston rod of the lifting piece 161, the outer ring sleeve 1622 is sleeved on the outer wall of the inner block 1621, a first step portion 1623 is formed on the outer wall of the inner block 1621, a second step portion 1624 is formed on the inner wall of the outer ring sleeve 1622, the second step portion 1624 is located above the first step portion 1623, a plurality of guide rods 1625 are arranged on the surface of the first step portion 1623, a guide groove 1626 is arranged on the bottom wall of the second step portion 1624, the guide rods 1625 are inserted and slide in the guide groove 1626, a tension spring 1627 is arranged on the peripheral wall of the guide rod 1625, and the tension spring 1627 abuts between the first step portion 1623 and the second step portion 1624. Under the action of the tension spring 1627, the inner block 1621 and the outer ring sleeve 1622 keep a movement trend of approaching each other. A abutting ring 1628 is arranged at the bottom of the lifting groove 16 and located below the outer ring sleeve 1622. When the lifting platform 162 is driven by the lifting piece 161 to reach the bottom of the lifting groove 16, the abutting ring 1628 can limit the movement of the outer ring sleeve 1622, so that a height difference is generated between the inner block 1621 and the outer ring sleeve 1622, so that the wafer enters and the stability of the wafer in the subsequent uniform glue process is improved.

[0035] With reference to Figure 1 , Figure 2 and Figure 3 , the glue coating table 1 is provided with a movable groove 17, the lifting groove 16 is located between the movable grooves 17, a smearing mechanism 8 is arranged in the movable groove 17, and the smearing mechanism 8 is used for uniformly smearing the glue liquid on the surface of the wafer. The smearing mechanism 8 is in communication connection with the control module 9. The smearing mechanism 8 comprises two moving pieces 81, two fixed plates 82 and a glue coating roller 83. In the embodiment, the two moving pieces 81 are both gas cylinders, the piston rod of the moving piece 81 is arranged along the length direction of the movable groove 17, the fixed plate 82 is arranged at the piston rod end of the moving piece 81, and the glue coating roller 83 is rotatably connected between the two fixed plates 82. The glue coating roller 83 is driven to move by the moving piece 81, and then the glue liquid on the surface of the wafer is uniformly smeared by the glue coating roller 83. In the embodiment, the glue coating roller 83 does not contact the surface of the wafer, so that the structure safety of the wafer can be ensured. The surface of the glue coating roller 83 is provided with an anti-sticking film 84 made of PET material.

[0036] With reference to Figure 1The side of the discharging position 14 is provided with a discharging belt 5, the discharging belt 5 is in communication connection with the communication module, the side, away from the discharging position 14, of the discharging belt 5 is provided with a reciprocating belt 10, the reciprocating belt 10 is in communication connection with the communication module, a detection motor is arranged above the reciprocating belt 10, so as to detect the glue coating quality of the wafer, the control module 9 controls the running direction of the reciprocating belt 10 based on the detection mechanism, so as to distinguish the finished products and the defective products, and reduce the subsequent screening time.

[0037] With reference to Figure 1 , Figure 2 and Figure 4 , the arc-shaped feeding channels 2 are arranged between the feeding position 11, the glue coating position 12, the glue uniformizing position 13 and the discharging position 14, in the embodiment, the arc-shaped feeding channels 2 are made of PTFE material, so as to reduce the friction and ensure the structural safety of the wafer, the glue coating table 1 is provided with a distributing mechanism 3, so as to drive the wafer to move along the arc-shaped feeding channels 2 and pass through the feeding position 11, the glue coating position 12, the glue uniformizing position 13 and the discharging position 14 in sequence.

[0038] With reference to Figure 1 , Figure 2 and Figure 4 , the distributing mechanism 3 comprises a rotating motor 31, a center block 32, four distributing rods 33 and four distributing barrels 34, wherein, the distributing rod 33 and the distributing barrel 34 are arranged in one-to-one correspondence, the glue coating table 1 is provided with a placing groove 15 between the feeding position 11, the glue coating position 12, the glue uniformizing position 13 and the discharging position 14, the rotating motor 31 is arranged in the placing groove 15, the output shaft of the rotating motor 31 is arranged in the vertical direction, the center block 32 is connected with the output shaft of the rotating motor 31, the four distributing rods 33 are arranged on the side wall of the center block 32, and the distributing barrel 34 is arranged at the end, away from the center block 32, of the corresponding distributing rod 33.

[0039] With reference to Figure 1 , Figure 2 and Figure 4 , the distributing barrel 34 comprises a fixed ring 341 and an inner ring 342, the distributing rod 33 is connected with the outer wall of the fixed ring 341, and the inner ring 342 is movably connected with the inner wall of the fixed ring 341, the top of the fixed ring 341 is provided with a light-transmitting film 344, and a positioning camera 345 is arranged above the light-transmitting film 344, so as to detect the position of the wafer, in the embodiment, the positioning camera 345 is in communication connection with the control module 9, the control module 9 controls the opening and closing of the rotating motor 31 based on the image of the positioning camera 345, so as to accurately position the wafer; the inner wall of the fixed ring 341 is provided with a plurality of lifting pieces 343, in the embodiment, the lifting piece 343 adopts a pneumatic cylinder, and the lifting piece 343 is used to drive the inner ring 342 to move along the inner wall of the fixed ring 341, so as to cover the wafer and drive the wafer to move; in the embodiment, when the glue is coated, the distributing mechanism 3 will be reversed by a certain angle, so as to prevent interference with the moving mechanism 6.

[0040] With reference to Figure 1 , Figure 2 and Figure 4 , the inner ring 342 is provided with an annular adsorption groove 346, and the inner wall of the inner ring 342 is provided with a plurality of adsorption holes 347, the plurality of adsorption holes 347 are communicated with the adsorption groove 346, and the inner wall of the fixed ring 341 is provided with a negative pressure fan 348, the negative pressure fan 348 is communicated with the adsorption groove 346, and the negative pressure fan 348 and the adsorption groove 346 and the adsorption hole 347 can realize adsorption on the outer wall of the wafer, so as to improve the stability of the wafer in the material distribution process.

[0041] The implementation principle of the wafer processing glue coating machine is that the feeding belt 4 is used for feeding and conveying the wafer to the feeding position 11, under the action of the material distribution mechanism 3, the wafer is moved from the feeding position 11 to the glue coating position 12, the glue coating cylinder 7 is driven by the moving mechanism 6 to coat the wafer, after the glue coating is completed, the wafer is conveyed to the glue uniformizing position 13 by the material distribution mechanism 3 to uniformize the glue solution, the wafer after uniformizing is transported to the discharging position 14 by the material distribution mechanism 3, and finally output through the discharging belt 5, under the working of the feeding position 11, the glue coating position 12, the glue uniformizing position 13 and the discharging position 14 in turn, the glue coating operation can be continuously carried out, so that the wafer glue coating efficiency and the glue coating uniformity can be effectively improved.

[0042] The above are preferred embodiments of the present application, not limited to the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A coating machine for wafer processing, characterized in that: The device includes a coating station with a loading position, a coating position, a uniform coating position, and a unloading position on its surface. These positions are arranged sequentially along a circumferential direction. An arc-shaped feeding channel is provided between each of the loading, coating, uniform coating, and unloading positions. A distribution mechanism is provided on the surface of the coating station to move the wafer along the arc-shaped feeding channel, sequentially passing through the loading, coating, uniform coating, and unloading positions. A loading conveyor belt is provided on one side of the loading position, and a unloading conveyor belt is provided on the other side of the unloading position. A moving mechanism is located above the coating station, and a coating cylinder for coating the wafer is mounted on the moving mechanism. A coating mechanism for evenly spreading the adhesive on the wafer surface is provided within the uniform coating position. A control module is located on the side wall of the coating station, and the distribution mechanism, loading conveyor belt, unloading conveyor belt, moving mechanism, and coating mechanism are all communicatively connected to the control module.

2. The wafer processing coating machine according to claim 1, characterized in that: The material distribution mechanism includes a rotary motor, a central block, four material distribution rods, and four material distribution cylinders, with each material distribution rod and cylinder corresponding to the other. The surface of the glue application table has a mounting groove located at the center of the loading position, glue application position, glue even application position, and unloading position. The rotary motor is located within the mounting groove, with its output shaft positioned vertically. The central block is connected to the output shaft of the rotary motor. All four material distribution rods are mounted on the peripheral wall of the central block. Each material distribution cylinder is located on the end wall of one of the material distribution rods away from the central block. Each material distribution cylinder includes a fixed ring and an inner ring. The inner ring is slidably connected to the inner wall of the fixed ring. The inner wall of the fixed ring has several lifting components, with the piston rods of these lifting components connected to the inner ring to drive the inner ring to slide along the inner wall of the fixed ring.

3. The wafer processing coating machine according to claim 2, characterized in that: A light-transmitting film is provided above the fixed ring, and a positioning camera is provided above the light-transmitting film. The positioning camera is communicatively connected to the control module, and the control module controls the start and stop of the rotating motor based on the image of the positioning camera.

4. A coating machine for wafer processing according to claim 2, characterized in that: The inner ring is provided with an annular adsorption groove, and the inner wall of the inner ring is provided with a plurality of adsorption holes, all of which are connected to the adsorption groove. The inner wall of the fixed ring is provided with a negative pressure fan, which is connected to the adsorption groove.

5. A coating machine for wafer processing according to claim 1, characterized in that: The glue-spreading position is provided with a lifting groove, and a lifting component is provided in the lifting groove. The piston rod end of the lifting component is provided with a lifting platform. The coating mechanism includes two moving components, two fixed plates and a glue-spreading roller. The glue-spreading table is provided with a movable groove. The lifting groove is located in the center of the movable groove. Both moving components are provided in the movable groove. The fixed plates are provided on the piston rod end wall of the moving components. The glue-spreading roller is rotatably connected between the two fixed plates.

6. A coating machine for wafer processing according to claim 5, characterized in that: The lifting platform includes an inner block and an outer ring sleeve. The inner block is connected to the piston rod of the lifting component. The outer ring sleeve is slidably connected to the outside of the inner block. The outer wall of the inner block is provided with a first step portion, and the inner wall of the outer ring sleeve is provided with a second step portion. The second step portion is located above the first step portion. A guide rod is provided on the top wall of the first step portion, and a guide groove is provided on the bottom wall of the second step portion for the guide rod to be inserted and slid. A tension spring is provided on the peripheral wall of the guide rod, and the tension spring abuts against the first step portion and the second step portion. An abutment ring is provided on the bottom wall of the lifting groove, and the abutment ring is located below the outer ring sleeve.

7. A coating machine for wafer processing according to claim 5, characterized in that: The adhesive roller is provided with an anti-sticking film on its peripheral wall.

8. A coating machine for wafer processing according to claim 1, characterized in that: The arc-shaped feeding channel is made of PTFE material.

9. A coating machine for wafer processing according to claim 1, characterized in that: A rotating adhesive application pad is rotatably connected to the adhesive application position, and the rotating adhesive application pad is communicatively connected to the control module.

10. A coating machine for wafer processing according to claim 1, characterized in that: A reciprocating belt is provided at the end of the feeding conveyor away from the feeding position. The length direction of the reciprocating belt is perpendicular to the length direction of the feeding conveyor. The reciprocating belt is electrically connected to the control module. A detection camera is provided above the reciprocating belt. The detection camera is communicatively connected to the control module. The control module controls the running direction of the reciprocating belt based on the detection results of the detection camera.

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